WO2021246730A1

WO2021246730A1 - Electronic apparatus including interposer

Info

Publication number: WO2021246730A1
Application number: PCT/KR2021/006715
Authority: WO
Inventors: 김용연; 박성구; 임군; 홍현주
Original assignee: 삼성전자 주식회사
Priority date: 2020-06-03
Filing date: 2021-05-31
Publication date: 2021-12-09
Also published as: KR20210150178A

Abstract

An electronic apparatus according to an embodiment of the present disclosure may comprise: a housing which includes a first structure and a second structure connected to the first structure so as to slide within a designated range with respect to the first structure; a flexible display which is disposed on the second structure and includes a rolling portion, wherein the rolling portion is drawn into the first structure by the sliding of the second structure when the electronic apparatus is switched from an open state to a closed state, and is withdrawn from the inside of the first structure by the sliding of the second structure when the electronic apparatus is switched from the closed state to the open state; a printed circuit board structure positioned inside the housing; a conductive pattern disposed in a region that faces the rear surface inside the housing; and a wireless communication circuit electrically connected to the conductive pattern.

Description

Electronic device including interposer

Various embodiments of the present disclosure relate to an electronic device including an interposer.

As users' demands for miniaturized or slimmed electronic devices for improved portability and aesthetics increase, existing electronic devices have focused on methods for reducing the thickness of electronic devices.

However, as the functions of the electronic device are diversified, the electronic device including the display panel having a larger area is not limited to simply miniaturizing or slimming the electronic device, but also supporting various functions of the electronic device, such as a media function. The demand is gradually increasing.

In order to satisfy both the demand for miniaturization of electronic devices and the needs for display enlargement for user's portability improvement, recently, foldable electronic devices to which a display that can be folded during use is applied, or a foldable electronic device that can be dried in the process of use. Electronic devices of a rollable type (or "sliding type") to which a display is applied are being developed.

Among them, in the rollable type electronic device, when the electronic device is in a closed state, a portion of the flexible display is rolled in on a roller inside the electronic device, and the electronic device is opened when the electronic device is closed by a user's manipulation. When the state is changed, it refers to an electronic device in which the display area can be expanded while the display wound on the roller slides out of the electronic device.

The rollable type electronic device can provide a wide display area to the user when the electronic device is in an open state while securing portability when the electronic device is in a closed state through the above-described structure.

However, unlike a conventional bar type electronic device, a rollable type electronic device may have a roller for slidingly moving the flexible display inside the electronic device, so that an electronic device for performing various functions of the electronic device may be disposed. It may be difficult to secure space for components (eg, batteries) to be placed.

In addition, the rollable type electronic device may have to have a curvature of a certain size or more in order to prevent damage to the flexible display disposed while being wound on the roller. have.

As the types of electronic components disposed inside the electronic device increase and the thickness of the electronic device increases to prevent damage to the flexible display, an antenna contact structure (or “contact structure”) is formed inside the rollable type electronic device. It can be difficult to implement.

Various embodiments of the present disclosure provide an electronic device capable of securing a space in which various electronic components can be disposed inside the electronic device and implementing an antenna contact structure or an antenna contact structure.

In an electronic device according to an embodiment of the present disclosure, a first structure forming side and rear surfaces of the electronic device and a second structure connected to the first structure to be slidable within a specified range with respect to the first structure are provided. A housing comprising: a flexible display disposed on the second structure, wherein at least one region is visible to the outside of the electronic device through a front surface of the electronic device, wherein the flexible display includes an open state of the electronic device When the electronic device is switched from the closed state to the closed state, it is introduced into the first structure by sliding of the second structure, and when the electronic device is switched from the closed state to the open state, the first structure is moved by sliding of the second structure including a rolling region drawn out from the inside of the structure, a printed circuit board structure positioned inside the housing, a conductive pattern disposed in a region facing the rear inside the housing, and electrically connected to the conductive pattern a wireless communication circuit, wherein the printed circuit board structure comprises: a first printed circuit board; a second printed circuit board positioned between the first printed circuit board and the rear surface; and a third printed circuit board including one surface facing the rear, positioned between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board a first interposer including at least one first via to a second interposer including at least a second via, at least one electronic component disposed on the first printed circuit board, the second printed circuit board, or the third printed circuit board, and the one surface of the third printed circuit board At least one electrical connection member disposed on; Including, wherein the conductive pattern faces at least one region of the one surface of the third printed circuit board, and is electrically connected to the wireless communication circuit through the at least one electrical connection member, and is fed from the wireless communication circuit can be fed.

In an electronic device according to another embodiment of the present disclosure, a first structure forming side and rear surfaces of the electronic device and a second structure connected to the first structure to be slidable within a specified range with respect to the first structure are provided. A housing comprising: a flexible display disposed on the second structure, wherein at least one region is visible to the outside of the electronic device through a front surface of the electronic device, wherein the flexible display includes an open state of the electronic device When the electronic device is switched from the closed state to the closed state, it is introduced into the first structure by sliding of the second structure, and when the electronic device is switched from the closed state to the open state, the first structure is moved by sliding of the second structure including a rolling region drawn out from the inside of the structure, a printed circuit board structure positioned inside the housing, a conductive pattern disposed in a region facing the rear inside the housing, and electrically connected to the conductive pattern a wireless communication circuit, wherein the printed circuit board structure includes a first printed circuit board, a second printed circuit board positioned between the first printed circuit board and a rear surface of the electronic device, the first printed circuit board and the A third printed circuit board disposed to be spaced apart from the second printed circuit board between the rear surfaces of the electronic device, the third printed circuit board including one surface facing the rear surface, and located between the first printed circuit board and the second printed circuit board, wherein A first interposer including a first via for electrically connecting the first printed circuit board and the second printed circuit board, and located between the first printed circuit board and the third printed circuit board, the first printed circuit board and a second interposer including a second via for electrically connecting the circuit board and the third printed circuit board to the first printed circuit board, the second printed circuit board or the third printed circuit board. at least one electronic component disposed and the third printed circuit at least one electrical connection member disposed on the one surface of the furnace substrate, wherein the conductive pattern faces at least one region of the one surface of the third printed circuit board, and through the at least one electrical connection member It may be electrically connected to the wireless communication circuit to transmit or receive an RF signal of a frequency band designated with the wireless communication circuit.

An electronic device according to another embodiment of the present disclosure includes a first structure forming side surfaces and a rear surface of the electronic device, and a second structure connected to the first structure to be slidable within a designated range based on the first structure. A housing including a structure, wherein the first structure includes a conductive portion, a first non-conductive portion disposed at one end of the conductive portion, and a second non-conductive portion disposed at the other end of the conductive portion, in the second structure a flexible display disposed, wherein at least one region is visible to the outside of the electronic device through a front surface of the electronic device, wherein the flexible display includes: when the electronic device is switched from an open state to a closed state 2 A rolling region introduced into the first structure by sliding of the structure and drawn out from the inside of the first structure by sliding of the second structure when the electronic device is switched from a closed state to an open state region), comprising a printed circuit board structure and a wireless communication circuit located inside the housing, wherein the printed circuit board structure includes a first printed circuit board, a first printed circuit board, and a first printed circuit board located between the first printed circuit board and the rear surface. A second printed circuit board, a third printed circuit board positioned between the second printed circuit board and the rear surface, the third printed circuit board including one surface facing the rear surface, the first printed circuit board and the second printed circuit board, a first interposer including at least one first via electrically connecting the first printed circuit board and the second printed circuit board, the first interposer being located between the second printed circuit board and the third printed circuit board; A second interposer including at least a second via electrically connecting a second printed circuit board and the third printed circuit board, the first printed circuit board, the second printed circuit board, or the third printed circuit board. at least one electronic component disposed on the third printed circuit board an electrical connection member disposed on one surface of the group, wherein the conductive portion of the first structure is electrically connected to the wireless communication circuit at a first point through the electrical connection member, and a second portion through the electrical connection member It may be electrically connected to a ground of the third printed circuit board at a point.

The electronic device according to various embodiments of the present disclosure may be stacked on a printed circuit board using an interposer, thereby securing a space in which various electronic components may be disposed within the electronic device.

The electronic device according to various embodiments of the present disclosure may implement an antenna contact structure in a slide type electronic device by stacking it on a printed circuit board using an interposer.

The electronic device according to various embodiments of the present disclosure may facilitate separation of the printed circuit board adjacent to the antenna, and as a result, the convenience of debugging or a printed circuit board repair process may be improved.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;

2A is a perspective view illustrating an electronic device in a closed state according to an exemplary embodiment.

2B is a perspective view illustrating an electronic device in an open state according to an exemplary embodiment.

2C is a perspective view illustrating an electronic device in a closed state according to another exemplary embodiment.

2D is a perspective view illustrating an electronic device in an open state according to another exemplary embodiment.

3 is an exploded perspective view of an electronic device according to an exemplary embodiment.

4 is an exploded view of a display support structure and a driving assembly of an electronic device according to an exemplary embodiment.

5 is a perspective view illustrating a state in which the display support structure and the driving assembly of FIG. 4 are coupled.

6A is a diagram illustrating a cross-section of an electronic device in a closed state according to an exemplary embodiment.

6B is a diagram illustrating a cross-section of an electronic device in an open state according to an exemplary embodiment.

7 is a perspective view of an electronic device viewed from the rear according to an exemplary embodiment.

8 is an exploded perspective view of a printed circuit board structure of an electronic device according to an exemplary embodiment.

9 is a cross-sectional view of the printed circuit board structure of FIG. 8 taken in the A-A' direction.

10A is a diagram illustrating a first printed circuit board, a second printed circuit board, and a first interposer disposed between the first printed circuit board and the second printed circuit board of an electronic device according to an exemplary embodiment;

10B is a diagram illustrating a second printed circuit board, a third printed circuit board, and a second interposer disposed between the second printed circuit board and the third printed circuit board of an electronic device according to an exemplary embodiment.

11A is a diagram illustrating a partial area of a first printed circuit board of an electronic device according to an exemplary embodiment.

11B is a diagram illustrating a partial area of a second printed circuit board of an electronic device according to an exemplary embodiment.

12 is a diagram illustrating a second printed circuit board, a third printed circuit board, and a second interposer positioned between the second printed circuit board and the third printed circuit board of an electronic device according to another exemplary embodiment.

13A is a diagram illustrating a cross-section of an electronic device in a closed state according to another exemplary embodiment.

13B is a diagram illustrating a cross-section of an electronic device in an open state according to another exemplary embodiment.

14 is an exploded perspective view of a printed circuit board structure of an electronic device according to another exemplary embodiment.

FIG. 15 is a cross-sectional view of the printed circuit board structure of FIG. 14 taken in the B-B' direction.

16A is a diagram illustrating a cross-section of an electronic device in a closed state according to another exemplary embodiment.

16B is a diagram illustrating a cross-section of an electronic device in an open state according to another exemplary embodiment.

17 is an exploded view illustrating an electrical connection relationship between a conductive portion of a body frame and a printed circuit board structure according to an exemplary embodiment.

FIG. 18A is a perspective view of the rear surface of the body frame of FIG. 17 , according to an exemplary embodiment.

18B is a view of the body frame of FIG. 17 as viewed from one direction, according to an exemplary embodiment.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure. Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can operate independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, or It can communicate with an external electronic device through a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified and authenticated.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, RFIC) other than the radiator may be additionally formed as a part of the antenna module 197 .

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the

electronic devices

102 and 104 may be the same or a different type of device from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more of the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, a processor (eg, processor 120 ) of a device (eg, electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

2A is a perspective view illustrating an electronic device in a closed state according to an exemplary embodiment, and FIG. 2B is a perspective view illustrating an electronic device in an open state according to an exemplary embodiment.

2A and 2B , an electronic device 200a (eg, the electronic device 101 of FIG. 1 ) according to an embodiment includes a housing 210 and/or a flexible display 220 ( Hereinafter, "display" for short).

According to an embodiment, the housing 210 may include a first structure 211 and/or a second structure 212 that is movably assembled (or coupled) to the first structure 211 . In one example, the second structure 212 may slide within a specified range with respect to the first structure 211 . For example, the second structure 212 may move away from the first structure 211 by sliding in the first direction (eg, the +y direction of FIGS. 2A and 2B ) with respect to the first structure 211 . . As another example, the first structure 211 may be moved closer to the first structure 211 by sliding in a second direction opposite to the first direction (eg, the -y direction of FIGS. 2A and 2B ). In one example, when the second structure 212 moves away from the first structure 211 by sliding movement of the second structure 212 in the first direction, the housing 210 may be expanded. In another example, when the second structure 212 approaches the first structure 211 by sliding movement of the second structure 212 in the second direction, the housing 210 may be reduced.

In the present disclosure, a state in which the second structure 212 is maximally separated from the first structure 211 (or "spaced apart") is defined as an "open state" (or "open state"), and the second structure 212 ) is defined as a “closed state” (or “closed state”) as a state (or a state adjacent to) that is maximally close to the first structure 211, and the expressions “open state” and “closed state” are the same hereafter. can be used for meaning.

In one embodiment, the first structure 211 includes a first sidewall 211a, a second sidewall 211b, a third sidewall 211c, a fourth sidewall 211d, and/or a rear plate (not shown). and at least one area on the side surface and/or at least one area on the rear surface of the electronic device 200a may be formed.

In one example, the first sidewall 211a may form a side surface facing the second direction (eg, the -y direction of FIGS. 2A and 2B ) of the electronic device 200a. In another example, the second sidewall 211b forms a portion of a side surface of the electronic device 200a facing the third direction (eg, the +x direction of FIGS. 2A and 2B ), and the third sidewall 211c is the electronic device 200a. A portion of a side surface of the device 200a facing a fourth direction opposite to the third direction (eg, -x direction in FIGS. 2A and 2B ) may be formed. In another example, the fourth sidewall 211d may form at least one region of the side facing the first direction (eg, the +y direction of FIGS. 2A and 2B ) opposite to the second direction of the electronic device 200a. can For example, the first sidewall 211a may be disposed to face the fourth sidewall 211d, and the second sidewall 211b may be disposed to face the third sidewall 211c. As another example, the second sidewall 211b may include one end of the first sidewall 211a (eg, one end in the +x direction in FIGS. 2A and 2B ) and/or one end of the fourth sidewall 211d (eg, FIG. 2A , FIG. 2A , It is connected to one end in the +x direction of FIG. 2B ), and the third sidewall 211c is the other end of the first sidewall 211a (eg, one end in the -x direction in FIGS. 2A and 2B ) and/or a fourth sidewall ( 211d) (eg, one end in the -x direction of FIGS. 2A and 2B ).

In another example, the rear plate may form the rear surface of the electronic device 200a facing the sixth direction (eg, the -z direction of FIGS. 2A and 2B ). In one example, the first structure 211 is formed by the first sidewall 211a, the second sidewall 211b, the third sidewall 211c, the fourth sidewall 211d, and/or the rear plate of the first structure 211 . ) may have an internal space formed therein, and the second structure 212 may be accommodated in the aforementioned internal space. For example, the first sidewall 211a, the second sidewall 211b, the third sidewall 211c, the fourth sidewall 211d, and/or the rear plate of the first structure 211 may be integrally formed. , but is not limited thereto.

In one embodiment, the second structure 212 may include a fifth sidewall 212a , a sixth sidewall 212b , a seventh sidewall 212c and/or a support plate 213 .

In one example, the fifth sidewall 212a of the second structure 212 may form a portion of a side surface of the electronic device 200a facing the first direction (eg, the +y direction of FIGS. 2A and 2B ). . The fifth sidewall 212a may form, for example, a side surface facing the first direction of the electronic device 200a together with the fourth sidewall of the first structure 211 .

In another example, the sixth sidewall 212b forms a part of a side surface facing the third direction (eg, the +x direction of FIGS. 2A and 2B ) of the electronic device 200a, and the seventh sidewall 212c is the electronic device 200a. It may form a part of the side surface facing the fourth direction (eg, the -x direction of FIGS. 2A and 2B ) of the device 200a.

In another example, the support plate 213 may have a first surface 213a facing a fifth direction (eg, the +z direction in FIGS. 2A and 2B ) and/or a sixth direction facing the fifth direction opposite to the fifth direction. It may include two surfaces 213b. For example, at least a partial area of the display 220 may be disposed on the first surface 213a of the support plate 213 , and the second surface 213b of the support plate 213 is a part of the rear surface of the electronic device 200a . can form.

In one example, the second structure 212 is formed by a first sidewall 211a , a second sidewall 211b , a third sidewall 211c , a fourth sidewall and/or a back plate of the first structure 211 . As it is accommodated in the inner space of the second structure 212 , a portion of the sixth sidewall 212b and/or the seventh sidewall 212c of the second structure 212 is covered by the first structure 211 to prevent the electronic device 200a from being moved. It may not be recognized from the outside. In one example, the fifth sidewall 212a , the sixth sidewall 212b , the seventh sidewall 212c , and/or the support plate 213 of the second structure 212 may be integrally formed, but is limited thereto. it is not

In one example, the second structure 212 may slide based on the first structure 211 within a predetermined range. For example, the second structure 212 may slide in a first direction with respect to the first structure 211 , and the first structure 211 of the first structure 211 may be moved by the above-described sliding movement of the second structure 212 . The distance between the sidewall 211a and the fifth sidewall 212a of the second structure 212 may increase. As another example, the second structure 212 may slide in a second direction opposite to the first direction with respect to the first structure 211 , and by the above-described sliding movement of the second structure 212 , the first The distance between the first sidewall 211a of the structure 211 and the fifth sidewall 212a of the second structure 212 may be close.

In one example, when the electronic device 200a is in a closed state, the distance between the first sidewall 211a of the first structure 211 and the fifth sidewall 212a of the second structure 212 may be the shortest. In another example, when the electronic device 200a is in an open state, the distance between the first sidewall 211a and the fifth sidewall 212a of the second structure 212 may be the longest.

In the electronic device 200a according to an embodiment, the lengths of the first sidewall 211a and the fourth sidewall 211d of the first structure 211 are greater than the lengths of the second sidewall 211b and the third sidewall 211c. It may be formed into a long structure. For example, the electronic device 200a may have a structure in which the length of a side surface parallel to the +x direction or the -x direction is longer than the length of the side surface parallel to the +y direction or the -y direction. However, the structure of the electronic device 200a is not limited to the above-described embodiment.

According to an embodiment, the display 220 may have a flexible characteristic so that some shapes and structures may be deformed, and the front surface of the electronic device 200a (eg, the +z direction of FIGS. 2A and 2B ) It may form at least a part of the one surface facing toward In one example, the display 220 is disposed on at least one region of the outer peripheral surface of the second structure 212 , and when the second structure 212 slides with respect to the first structure 211 , the second structure 212 . You can slide and move with

In an embodiment, the display 220 may include a flat region 220a and/or a rolling region 220b. In one example, the flat area 220a of the display 220 is disposed on the first surface 213a of the support plate 213 of the second structure 212 , so that the electronic device 200a is in a state (eg, a closed state). Alternatively, it may refer to an area that is always visible to the outside of the electronic device 200a irrespective of an open state). In another example, the rolling area 220b of the display 220 may mean an area selectively viewed outside the electronic device 200a according to the state of the electronic device 200a. The flat area 220a of the display 220 is, for example, at least at one side edge portion (eg, an end in the +y direction of FIGS. 2A and 2B ) at a fourth side surface of the first structure 211 . It may include a curved portion that is curved toward (211d) and extends seamlessly. In one example, the rolling region 220b of the display 220 is accommodated in the inner space of the first structure 211 when the electronic device 200a is in a closed state, so that it is not visible from the outside of the electronic device 200a. can

In another example, when the electronic device 200a is switched from a closed state to an open state, the rolling area 220b of the display 220 is moved inside the first structure 211 by sliding movement of the second structure 212 . It may be withdrawn from space to the outside of the electronic device 200a. When the electronic device 200a is switched from the closed state to the open state, as the rolling region 220b is drawn out of the electronic device 200a, the entire display 220 viewed from the outside of the electronic device 200a is area can be increased. For example, when the electronic device 200a is in a closed state, the area of the display 220 viewed from the outside of the electronic device 200a may be _{the first area A 1 .} On the other hand, when the electronic device 200a is in an open state, the area of the display 220 viewed from the outside of the electronic device 200a may be a second area A _{2 that} _{is larger than the first area A 1 .}

In another example, when the electronic device 200a is switched from an open state to a closed state, the rolling area 220b of the display 220 is moved by the sliding movement of the second structure 212 of the first structure 211 . It may be introduced into the interior space. When the electronic device 200a is switched from an open state to a closed state, as the rolling region 220b enters the inner space of the first structure 211 , the display 220 viewed from the outside of the electronic device 200a The total area of can be reduced.

According to an embodiment, the electronic device 200a may provide a screen of the display 220 having a size corresponding to that of an externally viewed area of the electronic device 200a. For example, when the electronic device 200a is in a closed state, the electronic device 200a displays a screen having _{an area corresponding to the size of the flat area 220a of the display 220 (eg, A 1 in FIG. 2A ).} can provide As another example, when the electronic device 200a is in an open state, the electronic device 200a has an area corresponding to the sum of the partial regions of the flat region 220a and the rolling region 220b of the display 220 (eg, in FIG. A _{screen having A 2} ) of 2b may be provided.

According to an embodiment, the electronic device 200a may include one of a key input device (not shown), a sensor module 204 ,

audio modules

203 , 206 , 207 , a camera module 205 , and/or a connector hole 208 . It may further include at least one or more. In another embodiment, the electronic device 200a may omit at least one (eg, the key input device 230 ) from among the above-described components or may additionally include other components.

In an embodiment, the key input device may be disposed on at least one side of the housing 210 , and the electronic device 200a may detect a user input through the key input device. For example, the key input device may be disposed on at least one region of the second side surface 211b of the first structure 211, but is not limited thereto. In another embodiment, the electronic device 200a may not include some or all of the key input devices, and the not included key input devices may be implemented in another form such as a soft key on the display 220 .

In an embodiment, the electronic device 200a may include the sensor module 204 to generate an electrical signal or data value corresponding to an internal operating state or an external environmental state. For example, the sensor module 204 may include a distance sensor (eg, TOF sensor), a proximity sensor, a fingerprint sensor, and a biometric sensor (eg, a TOF sensor) for measuring a distance between the first structure 211 and the second structure 212 . HRM sensor), a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. However, the type of the sensor module is not limited to the above-described example.

In one embodiment, the

audio module

203 , 206 , 207 may include a microphone hole 203 and/or a

speaker hole

206 , 207 . In the microphone hole 203, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker holes 206 and 207 may include an external speaker hole 206 and/or a receiver hole 207 for a call. In some embodiments, the speaker holes 206 and 207 and the microphone hole 203 may be implemented as a single hole, or a speaker may be included without a speaker hole (eg, a piezo speaker).

In an embodiment, the camera module 205 may include at least one camera device 205 and/or a flash (not shown) disposed on the front and/or rear of the electronic device 200a. In one example, the at least one camera device 205 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. In another example, the flash may include a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200a (eg, the rear side of the electronic device 200a).

In one embodiment, the connector hole 208 may receive a connector for transmitting and receiving power and/or data to and from an external electronic device, and/or a connector for transmitting and receiving audio signals to and from an external electronic device. For example, the connector hole 208 may include a USB connector and/or an earphone jack disposed on at least one side of the electronic device 200a. In one embodiment, the USB connector and the earphone jack may be implemented as a single hole, and according to another embodiment, the electronic device 200a is an external electronic device (eg, the electronic device 102 of FIG. 1 , without a separate connector hole). 104)) and power and/or data, or an audio signal.

2C is a perspective view illustrating an electronic device in a closed state according to another embodiment, and FIG. 2D is a perspective view illustrating an electronic device in an open state according to another embodiment.

2C and 2D , an electronic device 200b (eg, the electronic device 101 of FIG. 1 ) according to another embodiment includes a housing 230 and/or a flexible display 240 ( Hereinafter, "display" for short).

According to an embodiment, the housing 230 may include a first structure 231 and/or a second structure 232 that is movably assembled (or coupled) to the first structure 231 . In one example, the second structure 232 may slide within a specified range with respect to the first structure 231 . For example, the second structure 232 may move away from the first structure 231 by sliding in the first direction (eg, the +y direction of FIGS. 2C and 2D ) with respect to the first structure 231 . . As another example, the first structure 231 may be moved closer to the first structure 231 by sliding in a second direction opposite to the first direction (eg, the -y direction of FIGS. 2C and 2D ). In one example, when the second structure 232 moves away from the first structure 231 by sliding movement of the second structure 232 in the first direction, the housing 230 may be expanded. In another example, when the second structure 232 approaches the first structure 231 by sliding movement of the second structure 232 in the second direction, the housing 230 may be reduced.

In the present disclosure, a state in which the second structure 232 is maximally separated from the first structure 231 (or "a separate state") is defined as an "open state" (or "open state"), and the second structure 232 ) is defined as a "closed state" (or "closed state") as a state (or adjacent state) that is maximally close to the first structure 231, and the expressions "open state" and "closed state" are the same hereafter. can be used for meaning.

In one embodiment, the first structure 231 includes a first sidewall 231a, a second sidewall 231b, a third sidewall 231c, and a fourth sidewall (not shown) (eg, the fourth sidewall 2A in FIG. 2A ). 211d)) and/or a rear plate (not shown), and may form at least one area on the side surface and/or at least one area on the rear surface of the electronic device 200b.

In one example, the first sidewall 231a may form a side surface facing the second direction (eg, the -y direction of FIGS. 2C and 2D ) of the electronic device 200b. In another example, the second sidewall 231b forms a part of a side surface facing the third direction (eg, the +x direction of FIGS. 2C and 2D ) of the electronic device 200b, and the third sidewall 231c is the electronic device 200b. A portion of a side surface of the device 200b facing a fourth direction opposite to the third direction (eg, the -x direction of FIGS. 2C and 2D ) may be formed. In another example, the fourth sidewall (not shown) forms at least one region of the side facing the first direction (eg, the +y direction of FIGS. 2C and 2D ) that is opposite to the second direction of the electronic device 200b. can do. For example, the first sidewall 231a may be disposed to face the fourth sidewall, and the second sidewall 231b may be disposed to face the third sidewall 231c. As another example, the second sidewall 231b may include one end of the first sidewall 231a (eg, one end in the +x direction in FIGS. 2C and 2D ) and/or one end of the fourth sidewall (eg, FIGS. 2C and 2D ). connected to one end in the +x direction), and the third sidewall 231c has the other end of the first sidewall 231a (eg, one end in the -x direction in FIGS. 2C and 2D ) and/or the other end of the fourth sidewall (eg, the other end of the fourth sidewall 231a). : one end in the -x direction of FIGS. 2C and 2D) may be connected.

In another example, the rear plate may form the rear surface of the electronic device 200b facing the sixth direction (eg, the -z direction of FIGS. 2C and 2D ). In one example, the first sidewall 231a, the second sidewall 231b, the third sidewall 231c, the fourth sidewall, and/or the rear plate of the first structure 231 provide the first structure 231 with an interior A space may be formed, and the second structure 232 may be accommodated in the above-described internal space. For example, the first sidewall 231a , the second sidewall 231b , the third sidewall 231c , the fourth sidewall and/or the rear plate of the first structure 231 may be integrally formed, but are limited thereto. it is not going to be

In one embodiment, the second structure 232 may include a fifth sidewall 232a , a sixth sidewall 232b , a seventh sidewall 232c , and/or a support plate 233 .

In one example, the fifth sidewall 232a of the second structure 232 may form a portion of a side surface of the electronic device 200b facing the first direction (eg, the +y direction of FIGS. 2C and 2D ). . The fifth sidewall 232a may form, for example, a side surface facing the first direction of the electronic device 200b together with the fourth sidewall of the first structure 231 .

In another example, the sixth sidewall 232b forms a portion of a side surface facing the third direction (eg, the +x direction of FIGS. 2C and 2D ) of the electronic device 200b, and the seventh sidewall 232c is the electronic device 200b. It may form a part of a side surface facing the fourth direction (eg, the -x direction in FIGS. 2C and 2D ) of the device 200b.

In another example, the support plate 233 includes a first surface 233a facing a fifth direction (eg, a +z direction in FIGS. 2C and 2D ) and/or a sixth direction facing the fifth direction opposite to the fifth direction. It may include two surfaces 233b. For example, at least a partial area of the display 240 may be disposed on the first surface 233a of the support plate 233 , and the second surface 233b of the support plate 233b is a part of the rear surface of the electronic device 200b . can form.

In one example, the second structure 232 is formed by a first sidewall 231a , a second sidewall 231b , a third sidewall 231c , a fourth sidewall and/or a back plate of the first structure 231 . As it is accommodated in the inner space of the second structure 232 , a partial region of the sixth sidewall 232b and/or the seventh sidewall 232c of the second structure 232 is covered by the first structure 231 to prevent the electronic device 200b from moving. It may not be recognized from the outside. In one example, the fifth sidewall 232a , the sixth sidewall 232b , the seventh sidewall 232c and/or the support plate 233 of the second structure 232 may be integrally formed, but are limited thereto. it is not

In one example, the second structure 232 may slide based on the first structure 231 within a predetermined range. For example, the second structure 232 may slide in a first direction with respect to the first structure 231 , and by the aforementioned sliding movement of the second structure 232 , the first structure 231 of the first structure 231 . A distance between the sidewall 231a and the fifth sidewall 232a of the second structure 232 may increase. As another example, the second structure 232 may slide in a second direction opposite to the first direction with respect to the first structure 231 , and by the above-described sliding movement of the second structure 232 , the first structure 232 . The distance between the first sidewall 231a of the structure 231 and the fifth sidewall 232a of the second structure 232 may be close.

In one example, when the electronic device 200b is in a closed state, the distance between the first sidewall 231a of the first structure 231 and the fifth sidewall 232a of the second structure 232 may be the shortest. In another example, when the electronic device 200b is in an open state, the distance between the first sidewall 231a and the fifth sidewall 232a of the second structure 232 may be the longest.

The electronic device 200b according to another embodiment has a structure in which the lengths of the second sidewall 231b and the third sidewall 231c of the first structure 231 are longer than the lengths of the first sidewall 231a and the fourth sidewall. can be formed. For example, the electronic device 200b may be formed to have a structure in which a length of a side surface parallel to the +y or -y direction is longer than a length of a side surface parallel to the +x direction or -x direction. According to another embodiment (not shown), the electronic device 200b has a structure in which the length of the side parallel to the +y direction or the -y direction is substantially the same as the length of the side surface parallel to the +x direction or the -x direction. may be formed.

According to an embodiment, the display 240 may have a flexible characteristic so that some shapes and structures can be deformed, and the front surface of the electronic device 200b (eg, the +z direction of FIGS. 2C and 2D ) It may form at least a part of the one surface facing toward In one example, the display 240 is disposed on at least one region of the outer circumferential surface of the second structure 232 , and when the second structure 232 slides with respect to the first structure 231 , the second structure 232 . You can slide and move with

In one embodiment, the display 240 may include a flat region 240a and/or a rolling region 240b. In one example, the flat area 240a of the display 240 is disposed on the first surface 233a of the support plate 233 of the second structure 232 , so that the electronic device 200b is in a state (eg, a closed state). Alternatively, it may refer to an area that is always visible to the outside of the electronic device 200b irrespective of an open state). In another example, the rolling area 240b of the display 240 may mean an area selectively viewed outside the electronic device 200b according to the state of the electronic device 200b. The flat area 240a of the display 240 is, for example, at least at a side edge portion (eg, an end in the +y direction of FIGS. 2C and 2D ) at a fourth side of the first structure 231 . It may include a curved portion that is curved toward (231d) and extends seamlessly. In one example, the rolling region 240b of the display 240 is accommodated in the inner space of the first structure 231 when the electronic device 200b is in a closed state, so that it is not visible from the outside of the electronic device 200b. can

In another example, when the electronic device 200b is switched from the closed state to the open state, the rolling area 240b of the display 240 is moved inside the first structure 231 by sliding movement of the second structure 232 . It may be withdrawn from space to the outside of the electronic device 200b. When the electronic device 200b is switched from the closed state to the open state, as the rolling region 240b is drawn out of the electronic device 200b, the entire display 240 viewed from the outside of the electronic device 200b is area can be increased. For example, when the electronic device 200b is in a closed state, the area of the display 240 viewed from the outside of the electronic device 200b may be _{the first area A 3 .} On the other hand, when the electronic device 200b is in an open state, the area of the display 240 viewed from the outside of the electronic device 200b may be a second area A _{4 that} _{is larger than the first area A 3 .}

In another example, when the electronic device 200b is switched from an open state to a closed state, the rolling area 240b of the display 240 is moved by the sliding movement of the second structure 232 of the first structure 231 . It may be introduced into the interior space. When the electronic device 200b is switched from an open state to a closed state, as the rolling region 240b enters the inner space of the first structure 231 , the display 240 viewed from the outside of the electronic device 200b The total area of can be reduced.

According to an embodiment, the electronic device 200b may provide a screen of the display 240 having a size corresponding to that of an externally viewed area of the electronic device 200b. For example, when the electronic device 200b is in a closed state, the electronic device 200b displays a screen having _{an area corresponding to the size of the flat area 240a of the display 240 (eg, A 3 in FIG. 2C ).} can provide As another example, when the electronic device 200b is in an open state, the electronic device 200b has an area corresponding to the sum of the partial areas of the flat area 240a and the rolling area 240b of the display 240 (eg, in the figure). A _{screen with A 4} ) of 2d may be provided.

According to an embodiment, the electronic device 200b includes a key input device 237 , a sensor module 234 (eg, the sensor module 204 of FIG. 2A ), and an audio module 238 (eg, the audio module of FIG. 2A ). (203, 206, 207)), a camera module 235 (eg, the camera module 205 of FIG. 2A ), and/or a connector hole (not shown) (eg, the connector hole 208 of FIG. 2A ). More may be included. In another embodiment, the electronic device 200b may omit at least one (eg, the key input device 237 ) from among the above-described components or may additionally include other components. At least one of the components of the electronic device 200b according to an embodiment may be the same as or similar to at least one of the components of the electronic device 200a of FIGS. 2A and/or 2B, and overlapping descriptions to be omitted.

Referring to FIG. 3 , an electronic device 300 (eg, the electronic device 200a of FIGS. 2A and 2B and/or the electronic device 200b of FIGS. 2C and 2D ) according to an embodiment includes a flexible display ( 310) (hereinafter, “display” for short), first structure 400 (eg, first structure 211 of FIGS. 2A, 2B ) and/or second structure 500 (eg, FIGS. 2A, 2B ). may include a second structure (eg, the second structure 220 of FIGS. 2A and 2B ). According to another embodiment, any one of the above-described components of the electronic device 300 is Other components that are omitted or not shown (eg, a rear case) may be added At least one of the components of the electronic device 300 according to an embodiment is the electronic device of FIGS. 2A and 2B . At least one of the components of the device 200a and/or the electronic device 200b of FIGS. 2C and 2D may be the same as or similar to those of the device 200a and/or overlapping descriptions will be omitted below.

According to an exemplary embodiment, the display 310 may be disposed on at least one area of the outer peripheral surface of the second structure 500 to be supported by the second structure 500 . For example, the display 310 may be disposed on an outer circumferential surface of the display support structure 510 of the second structure 500 to be supported by the display support structure 510 . In one example, the display 310 may be attached to the display support structure 510 to slide along with the display support structure 510 .

In one embodiment, the display 310 may include a planar area 310a (eg, planar area 220a in FIG. 2A ) and/or a rolling area 310b (eg, rolling area 220b in FIG. 2B ). can In one example, the flat area 310a of the display 310 may be disposed on at least one area of the first support plate 512 of the display support structure 510 , and the state of the electronic device 300 (eg, open state or closed state) may be recognized from the outside of the electronic device 300 . In another example, the flat area 310a of the display 310 is at least one side edge portion (eg, an end in the +y direction in FIG. 3 ) to one side facing the +y direction of the body frame 410 . It may include a curved portion (not shown) that is bent and extends seamlessly. In one example, the rolling area 310b of the display 310 may be disposed in a bent state on a plurality of bars 511 of the display support structure 510 , and depending on the state of the electronic device 300 , the electronic It may be selectively recognized from the outside of the device 300 . In another example, the rolling area 310b of the display 310 is at least one end (eg, an end in the +x direction or the -x direction in FIG. 3 ) in the +x direction and/or the -x direction of the body frame 410 . It may include a curved portion (not shown) that is bent toward one surface facing toward the seamless extension.

In one example, the shape of the rolling area 310b of the display 310 may be deformed according to the state of the electronic device 300 . For example, when the electronic device 300 is switched from a closed state to an open state, a portion of the curved rolling region 310b may be unfolded. As another example, when the electronic device 300 is switched from an open state to a closed state, a portion of the rolled area 310b that has been spread may be bent.

According to an embodiment, the first structure 400 may include a body frame 410 , a first cover 420 , a second cover 430 , and/or a rear plate 440 . In one example, the first cover 420 may be attached to one surface of the body frame 410 facing the third direction (eg, the +x direction in FIG. 3 ), opposite to the third direction of the body frame 410 . The second cover 430 may be attached to one surface facing the fourth direction (eg, the -x direction in FIG. 3 ). In another example, the body frame 410 may include a support portion 411 facing the sixth direction (eg, -z direction in FIG. 3 ). For example, the support portion 411 of the body frame 410 may be formed of a conductive material (eg, a metal) and/or a non-conductive material (eg, a polymer), and a lower end of the support portion 411 (eg: A rear plate 440 may be disposed in the -z direction of FIG. 3 .

In one example, the back plate 440 may include a transparent portion (not shown) in which at least one area is formed of a transparent material, and a partial area of the rolling area 310b of the display 310 is the back plate 440 . It may be visually exposed from one surface (eg, one surface in the -z direction of FIG. 3 ) of the electronic device 300 through the transparent portion of . For example, the transparent portion of the rear plate 440 may be formed of a window material, but is not limited thereto.

In one example, the side and/or side of the electronic device 300 by the body frame 410 , the first cover 420 , the second cover 430 and/or the rear plate 440 of the first structure 400 . A rear surface may be formed. In another example, the body frame 410 , the first cover 420 , the second cover 430 , and/or the space (eg, area A in FIG. 3 ) in the first structure 400 by the rear plate 440 . ) (hereinafter, “internal space”) may be formed.

According to an embodiment, at least one region of the second structure 500 may be accommodated in the inner space A of the first structure 400 , and the display supporting structure 510 and/or the driving assembly 520 may be mounted thereon. may include In an embodiment, the display support structure 510 may be disposed on at least one region of an outer peripheral surface of the driving assembly 520 . For example, the display support structure 510 may be disposed to surround the outer circumferential surface of the driving assembly 520 . In one embodiment, the drive assembly 520 may include at least one roller (not shown), and the display support structure 510 slides within a range specified by the at least one roller of the drive assembly 520 . can For example, when the electronic device 300 is switched from the closed state to the open state, the display support structure 510 slides in the first direction (eg, the +y direction in FIG. 3 ) by the driving assembly 520 . can As another example, when the electronic device 300 is switched from an open state to a closed state, the display support structure 510 is moved in a second direction opposite to the first direction by the driving assembly 520 (eg, in FIG. 3 - y-direction).

In an embodiment, a plurality of electronic components may be disposed inside the driving assembly 520 of the second structure 500 . For example, a printed circuit board structure (not shown) and/or a battery (not shown) may be disposed inside the driving assembly 520 . In one example, the printed circuit board structure may mean a structure in which a plurality of printed circuit boards are stacked through at least one interposer, and the printed circuit board structure includes a structure for performing various functions of the electronic device 300 . For parts can be arranged. For example, a plurality of printed circuit boards of a printed circuit board structure may include a processor (eg, processor 120 in FIG. 1 ), memory (eg, memory 130 in FIG. 1 ), and/or an interface (eg, FIG. 1 ). of the interface 177) may be disposed. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. Memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

In another example, a battery is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell. have. According to an embodiment, the battery may be disposed within the driving assembly 520 to be spaced apart from the printed circuit board structure by a predetermined distance. According to another embodiment, the battery may be disposed to partially overlap the printed circuit board structure.

4 is an exploded view of a display supporting structure and a driving assembly of an electronic device according to an exemplary embodiment, and FIG. 5 is a perspective view illustrating a state in which the display supporting structure and the driving assembly of FIG. 4 are combined. FIG. 4 is an exploded and assembled view of the display support structure 510 and/or the driving assembly 520 of the electronic device of FIG. 3 (eg, the electronic device 300 of FIG. 3 ), and FIG. 5 is the display support of FIG. 4 . It is a perspective view of the structure 510 and the driving assembly 520 ' viewed from the +y direction in a coupled state.

4 and 5 , a second structure 500 (eg, the second structure 212 of FIGS. 2A and 2B ) of an electronic device (eg, the electronic device 300 of FIG. 3 ) according to an embodiment. or second structure 500 of FIG. 3 ) may include display support structure 510 (eg, display support structure 510 of FIG. 3 ) and/or drive assembly 520 (eg, drive assembly 520 of FIG. 3 ). ) may be included.

According to an embodiment, the display support structure 510 may support a flexible display (eg, the flexible display 310 of FIG. 3 ) disposed on the outer peripheral surface of the display support structure 510 . In one embodiment, the display support structure 510 may include a plurality of bars 511 , a first support plate 512 , and/or a second support plate 513 .

In one example, a rolling area (eg, the rolling area 310b of FIG. 3 ) of the flexible display may be disposed on at least some of the plurality of bars 511 . For example, a rolling area of the flexible display may be disposed on at least some of the plurality of bars 511 in a bent state. As another example, as some regions of the plurality of bars 511 are bent, the plurality of bars 511 may be formed in a “⊂” shape when viewed from the side (eg, the +x direction in FIG. 3 ). Some areas of the plurality of bars 511 corresponding to the above-described rolling area may be bent in a shape corresponding to the rolling area, and accordingly, the plurality of bars 511 may support the rolling area in a bent state. For example, some areas of the plurality of bars 511 may be bent to have substantially the same or similar curvature to the bent portions of the rolling area.

In one example, the first support plate 512 is connected or coupled to one side of the plurality of bars 511 (eg, a side located in the +z direction of FIGS. 3 and 4 ) to support a partial area of the flexible display. can do. For example, the first support plate 512 is disposed at the lower end (eg, in the -z direction of FIGS. 4 and 5 ) of the flat area of the flexible display (eg, the flat area 310a of FIG. 3 ), the flexible display can support the planar area of

In one example, the first support plate 512 is formed in a rail structure, and the electronic device is converted from an open state to a closed state, or from a closed state to an open state, based on the driving assembly 520 . to slide in the +y direction or the -y direction. For example, the first support plate 512 may be positioned on the upper end of the driving assembly 520 and include a first protrusion 512a formed to protrude toward the frame 523 of the driving assembly 520 . . For example, the first protrusion 512a of the first support plate 512 may be inserted or coupled to the first guide groove 523a formed in the frame 523 . The above-described first protrusion 512a may slide along the first guide groove 523a while the electronic device is switched from an open state to a closed state or from a closed state to an open state.

In one example, the second support plate 513 may be connected to or coupled to another side of the plurality of bars 511 (eg, one side located in the -z direction of FIGS. 4 and 5 ). The second support plate 513 is disposed to surround a partial region of the drive assembly 520 disposed between the first support plate 512 and the second support plate 513 , for example. It can support a part of the area (eg, the lower bracket 522).

In one example, the second support plate 513 is formed in a rail structure, and is +y relative to the driving assembly 520 in the process of switching the electronic device from an open state to a closed state or from a closed state to an open state. It can slide in the direction or -y direction. For example, the second support plate 513 may be located at the lower end of the driving assembly 520 , and may include a second protrusion 513a protruding toward the frame 523 of the driving assembly 520 . can For example, the second protrusion 513a of the second support plate 513 may be inserted or coupled to the second guide groove 523b formed in the frame 523 . The above-described second protrusion 513a may slide along the second guide groove 523b while the electronic device is switched from an open state to a closed state or from a closed state to an open state.

According to one embodiment, the driving assembly 520 is a space B formed between the plurality of bars 511 of the display support structure 510 , the first support plate 512 and/or the second support plate 513 . ) can be placed in In one example, the driving assembly 520 may be positioned between the first supporting plate 512 and the second supporting plate 513 of the display supporting structure 510 , and an outer circumferential surface of the driving assembly 520 is the display supporting structure. may be surrounded by 510 .

In one embodiment, the driving assembly 520 may slide the display support structure 510 within a specified range. In one example, the drive assembly 520 moves the display support structure 510 in a first direction (eg, the +y direction of FIGS. 4 and 5 ) or a second direction (eg, the -y direction of FIGS. 4 and 5 ). can be moved by sliding. The driving assembly 520 may slide the display support structure 510 in the first direction when, for example, the electronic device is switched from a closed state to an open state. As another example, when the electronic device is switched from an open state to a closed state, the driving assembly 520 may slide the display support structure 510 in the second direction.

In one embodiment, the drive assembly 520 may include a top bracket 521 , a bottom bracket 522 , a frame 523 , a plurality of rollers 524 and/or a belt 525 . In one example, the upper bracket 521 is located at the lower end of the first support plate 512 , and the upper surface (eg, one surface in the +z direction of FIGS. 4 and 5 ) and/or the side surface of the driving assembly 520 . may form part of In another example, the lower bracket 522 is positioned on the upper end of the second support plate 513 , and the lower surface (eg, one surface in the -z direction of FIGS. 4 and 5 ) and/or the side surface of the driving assembly 520 . (eg, one surface in the +x direction and the -x direction in FIGS. 4 and 5 ) may be formed. In another example, the frame 523 is positioned between the upper bracket 521 and the lower bracket 522 , and is positioned on the side of the driving assembly 520 (eg, in the +x direction of FIGS. 4 and 5 , -x direction in the -x direction). one side) may form part of it. In another example, when the driving assembly 520 is viewed from the side (eg, in the +x direction of FIGS. 4 and 5 ), the upper region of the frame 523 may be disposed to partially overlap the first support plate 512 . and a lower region of the frame 523 may be disposed to partially overlap the second support plate 513 . In one example, a first guide groove 523a into which the first protrusion 512a of the first support plate 512 can be inserted is formed in an area overlapping the first support plate 512 of the frame 523 . can In another example, a second guide groove 523b into which the second protrusion 513a of the second support plate 513 can be inserted is formed in an area overlapping the second support plate 513 of the frame 523 . can The first guide groove 523a and/or the second guide groove 523b of the frame 523 described above may guide the sliding movement direction of the display support structure 510 . For example, the first guide groove 523a and/or the second guide groove 523b may slide in a direction in which the display support structure 510 is designated (eg, a +y direction or a -y direction in FIGS. 4 and 5 ). can guide you to move.

According to an embodiment, the plurality of rollers 524 are rotatably disposed in the inner space formed by the upper bracket 521 , the lower bracket 522 and/or the frame 523 , and the display support structure 510 . can be moved by sliding. In one embodiment, the plurality of rollers 524 may include a pair of first rollers 524a and a pair of second rollers 524b.

In one example, the first roller 524a may be disposed in an area adjacent to the plurality of bars 511 of the display support structure 510 inside the driving assembly 520 (eg, an area in the -y direction of FIG. 4 ). A portion of the first roller 524a may be exposed to the outside of the driving assembly 520 through the groove 5211 formed in the upper bracket 521 . The first roller 524a exposed to the outside of the driving assembly 520 may rotate in a designated direction to slide the display support structure 510 in the +y direction or the -y direction. For example, when the first roller 524a rotates clockwise, the display support structure 510 may slide in a first direction (eg, the +y direction of FIGS. 4 and 5 ). As another example, when the first roller 524a rotates counterclockwise, the display support structure 510 slides in a second direction opposite to the first direction (eg, -y direction in FIGS. 4 and 5 ). can move

In one example, the second roller 524b may be disposed to be spaced apart from the first roller 524a in the inner space formed by the upper bracket 521 , the lower bracket 522 and/or the frame 523 . . According to an embodiment, a belt 525 may be coupled to the second roller 524b, and the belt 525 is disposed in a state wound around the second roller 524b, so that the second roller 524b rotates. When you can rotate together.

In an embodiment, one end 525a and the other end 525b of the belt 525 may be fixed or combined with the flexible display to maintain flatness of the flexible display. In one example, one end 525a of the belt 525 passes through a hole 5121 formed in the first support plate 512 of the display support structure 510 and is flexible disposed on the outer circumferential surface of the display support structure 510 . It may be fixed or coupled to some areas of the display. For example, one end 525a of the belt 525 may be fixed or coupled to the flat area of the flexible display. In another example, the other end 525b of the belt 525 may be fixed or coupled to another partial area of the flexible display. For example, the other end 525b of the belt 525 may be fixed or coupled to the rolling area of the flexible display. In one embodiment, one end 525a of the belt 525 fixed to the flat area of the flexible display and the other end 525b of the belt 525 fixed to the rolling area of the flexible display are connected to the rotation of the second roller 524b. may be moved in opposite directions by means of a method, and the belt 525 may provide tension (or “tension”) to the flexible display to keep the flexible display flat through the above-described structure. The flexible display is disposed in close contact with the display support structure 510 , and as tension is provided to the flexible display by the belt 525 , the electronic device according to an embodiment is switched from a closed state to an open state or from an open state. The flatness of the flexible display can be maintained even in the process of switching to the closed state.

According to one embodiment, the battery 530 and/or the printed circuit board structure 600 in the inner space of the driving assembly 520 formed by the upper bracket 521 , the lower bracket 522 and/or the frame 523 . ) can be placed.

In one example, the battery 530 may be disposed at a position adjacent to the first roller 524a in the aforementioned internal space to supply power to at least one component of the electronic device.

In one example, the printed circuit board structure 600 may mean a structure in which a plurality of printed

circuit boards

610 , 630 , 650 are stacked through

interposers

620 and 640 , and the above-described battery 530 and They may be spaced apart. For example, the printed circuit board structure 600 may be spaced apart from the battery 530 and disposed adjacent to the second roller 524b. In one example, the printed circuit board structure 600 includes a first printed circuit board 610 , a first interposer 620 , a second printed circuit board 630 , a second interposer 640 and/or a third A printed circuit board 650 may be included. For example, the second interposer 640 and the second print on the upper end of the third printed circuit board 650 (eg, in the +z direction of FIGS. 4 and 5 ) with respect to the third printed circuit board 650 . The circuit board 630 , the first interposer 620 , and/or the first printed circuit board 610 may be sequentially stacked. In one example, the first interposer 620 is positioned between the first printed circuit board 610 and the second printed circuit board 630 , the first printed circuit board 610 and the second printed circuit board 630 . ) can be electrically connected. In another example, the second interposer 640 is positioned between the second printed circuit board 630 and the third printed circuit board 650 , the second printed circuit board 630 and the third printed circuit board 650 . ) can be electrically connected.

According to an embodiment, a hole 5221 may be formed in at least a partial area of the lower bracket 522 overlapping the printed circuit board structure 600 , and a part of the printed circuit board structure 600 may be formed in the above-described hole ( 5221 may be exposed to the outside of the display support structure 510 and/or the driving assembly 520 . For example, the third printed circuit board 650 of the printed circuit board structure 600 is external to the display support structure 510 and/or the drive assembly 520 through the hole 5221 formed in the bottom bracket 522 . can be exposed as

According to an embodiment, the electronic device is configured to use the first printed circuit board 610 , the second printed circuit board 630 and/or the third through the first interposer 620 and/or the second interposer 640 . By stacking the printed circuit board 650 , it is possible to secure a space in which a plurality of electronic components can be disposed in the inner space of the driving assembly 520 in which the plurality of rollers 524 are disposed.

6A is a cross-sectional view illustrating a closed state of an electronic device according to an exemplary embodiment, FIG. 6B is a cross-sectional view illustrating an open state of the electronic device according to an exemplary embodiment, and FIG. 7 is an electronic device according to an exemplary embodiment. This is a perspective view from the rear.

6A is a cross-sectional view of the electronic device 200a of FIG. 2A or the electronic device 200b of FIG. 2C taken in the II' direction, and FIG. 6B is the electronic device 200a of FIG. 2B or the electronic device 200b of FIG. 2D. is a cross-sectional view cut in the II-II' direction. 6A and/or 6B are cross-sectional views in which some components of the electronic device 300 are omitted in order to explain the sliding movement of the display support structure 510 in the closed state and the open state of the electronic device.

6A, 6B, and 7 , an electronic device 300 (eg, the electronic device 300 of FIG. 3 ) according to an embodiment includes a display 310 (eg, the display 310 of FIG. 3 ). ), a first structure 400 (eg, the first structure 400 of FIG. 3 ), a rear case 450 , a conductive pattern 460 , and a display support structure 510 (eg, FIG. 4 , The display support structure 510 of FIG. 5), the upper bracket 521 (eg, the upper bracket 521 of FIGS. 4 and 5), the lower bracket 522 (eg, the lower bracket 522 of FIGS. 4 and 5) )), a plurality of rollers 524 (eg, a plurality of rollers 524 of FIGS. 4 and 5 ), a battery 530 (eg, a battery 530 of FIGS. 4 and 5 ) and/or a printed circuit board. structure 600 (eg, printed circuit board structure 600 of FIGS. 4 and 5 ).

According to an embodiment, the first structure 400 may include a body frame 410 and/or a rear plate 440 . In one example, the body frame 410 and/or the rear plate 440 of the first structure 400 may form a part of the side surface and the rear surface of the electronic device 300 , and the body frame 410 and the rear plate A space (hereinafter, “internal space”) (eg, the internal space (A) of FIG. 3 ) may be formed in the first structure 400 by 440 .

According to one embodiment, the rear case 450 (or “carrier”) is positioned between the back plate 440 of the first structure 400 and the printed circuit board structure 600 , such that the printed circuit board structure (600) can be protected. In one example, a portion of the rear case 450 may be disposed to overlap the printed circuit board structure 600 . For example, one surface of the rear case 450 may be disposed to face the printed circuit board structure 600 , and the other surface of the rear case 450 may be disposed to face the rear plate 440 . In another example, the rear case 450 may be formed of a non-conductive material (eg, polymer or plastic), and a conductive pattern 460 may be formed on at least one region of the rear case 450 overlapping the printed circuit board structure 600 . ) can be placed. For example, the conductive pattern 460 may be formed in a manner in which a pattern is formed on the rear case 450 through a laser, and a metal (eg, copper, nickel) is plated on the formed pattern, but is not limited thereto. . According to another embodiment (not shown), the conductive pattern 460 may be formed in a non-conductive region of a region (eg, the support couple 411 of FIG. 3 ) facing the rear plate 440 of the body frame 410 . may be In one example, the conductive pattern 460 is electrically connected to a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) disposed on the printed circuit board structure 600 to transmit an RF signal of a designated frequency band. and/or may operate as a receiving antenna radiator.

According to an embodiment, the display support structure 510 may be accommodated in an internal space formed by the body frame 410 and/or the rear plate 440 , and the display 310 may be disposed on an outer circumferential surface of the display support structure 510 . ) can be placed. In one embodiment, the display support structure 510 includes a plurality of bars 511 (eg, a plurality of bars 511 in FIGS. 4 and 5 ), a first support plate 512 and/or a second support plate ( 513) may be included. In one example, a shape of some regions of the plurality of bars 511 may be deformed while a state (eg, an open state or a closed state) of the electronic device 300 is switched. For example, some regions of the plurality of bars 511 may be bent or unfolded to have a specified curvature while the electronic device 300 is switched from a closed state to an open state or is converted from an open state to a closed state. In another example, the first support plate 512 may be fixed or coupled to one end of the plurality of bars 511 in the upper direction (eg, the +z direction of FIGS. 6A and 6B ), and the first support plate 512 . ) (eg, in the +z direction of FIGS. 6A and 6B ), a portion of the flat area 310a of the display 310 may be disposed. In another example, the second support plate 513 may be fixed or coupled to one end of the plurality of bars 511 in the lower direction (eg, the -z direction of FIGS. 6A and 6B), and the second support plate ( 513), a lower bracket 522 may be disposed on the upper end (eg, in the +z direction of FIGS. 6A and 6B).

According to an embodiment, the interior of the space formed by the plurality of bars 511 , the first support plate 512 and/or the second support plate 513 of the display support structure 510 (eg, FIG. 4B ) region), an upper bracket 521 , a lower bracket 522 , and/or a plurality of rollers 524 constituting the driving assembly (eg, the driving assembly 520 of FIG. 4 ) may be disposed.

In one embodiment, the plurality of rollers 524 are positioned between the upper bracket 521 and the lower bracket 522 , and include a first roller 524a (eg, the first roller 524a in FIG. 4 ) and/or a second roller 524 . It may include a second roller 524b (eg, the second roller 524b of FIG. 4 ) spaced apart from the first roller 524a.

In one example, the first roller 524a may contact the plurality of bars 511 of the display support structure 510 through the groove 5211 formed in the upper bracket 521, and By rotation, the display support structure 510 may slide within a specified range. For example, in the process of switching the electronic device 300 from a closed state (eg, the electronic device 300 of FIG. 6A ) to an open state (eg, the electronic device 300 of FIG. 6B ), the first roller 524a When is rotated in the clockwise direction, some regions of the bent plurality of bars 511 are spread out and the display support structure 510 may slide in a first direction (eg, the +y direction of FIG. 6B ). As another example, when the first roller 524a rotates counterclockwise while the electronic device 300 is switched from an open state to a closed state, some areas of the plurality of spread bars 511 are bent to support the display. The structure 510 may slide in the second direction (eg, the -y direction of FIG. 6A ). In an embodiment, as the shape of some regions of the plurality of bars 511 is changed in the process of changing the state of the electronic device 300 , the rolling area of the display 310 supported by the plurality of bars 511 is changed. The shape of the 310a may also be deformed to correspond to the shape of the plurality of bars 511 .

In another example, the flat area 310a of the display 310 is fixed to one end (eg, one end 525a of FIG. 4 ) to the second roller 524b, and the other end (eg, the other end 525b of the belt of FIG. 4 ) is fixed to the second roller 524b. )) to which the rolling area 310b of the display 310 is fixed (not shown) (eg, the belt 525 of FIG. 4 ) may be coupled. The above-described belt may provide tension to the display 310 while moving its position in response to the rotation of the second roller 524b. For example, the belt may provide the display 310 with a tension that pulls the display 310 from both ends. Accordingly, the aforementioned belt may serve to maintain the flatness of the display 310 while the electronic device 300 is switched from an open state to a closed state or from a closed state to an open state.

According to an embodiment, the display 310 may be disposed on the outer peripheral surface of the display support structure 510 , and the above-described display 310 is rotated together with the display support structure 510 by the rotation of the first roller 524a. Can be moved by sliding. In one example, the display 310 includes a flat area 310a (eg, the flat area 310a of FIG. 3 ) and/or a rolling area 310b whose shape may be deformed according to the state of the electronic device 300 ( Example: rolling area 310a of FIG. 3) may be included.

In one embodiment, the flat area 310a of the display 310 is located on top of a partial area of the first support plate 512 and/or the plurality of bars 511 of the display support structure 510 so that the first It may be supported by the support plate 512 and/or the plurality of bars 511 . In one example, the flat area 310a of the display 310 may be viewed from the outside of the electronic device 300 regardless of a state (eg, an open state or a closed state) of the electronic device 300 .

In an embodiment, the rolling area 310b of the display 310 may be positioned on top of a partial area of the plurality of bars 511 of the display support structure 510 and supported by the plurality of bars 511 . In one example, the rolling area 310b of the display 310 may be selectively viewed from the outside of the electronic device 300 according to the state of the electronic device 300 .

For example, when the electronic device 300 is in a closed state, the rolling region 310b of the display 310 is wound around the plurality of bars 511 in the inner space A of the first structure 400 . may be accommodated, and as a result, the rolling region 310b may not be visually recognized from the outside of the electronic device 300 . As another example, when the electronic device 300 is switched from a closed state to an open state, a region adjacent to the flat region 310a among the rolling regions 310b of the display 310 may be drawn out from the first structure 400 . . As a partial area of the rolling area 310b adjacent to the planar area 310b is drawn out from the first structure 400 , the area of the display 310 that can be viewed from the outside of the electronic device 300 may be expanded. As another example, when the electronic device 300 is switched from an open state to a closed state, a region adjacent to the first structure 400 among the rolling regions 310b viewed from the outside of the electronic device 300 is the first structure ( 400) can be drawn inside. As a partial area of the rolling area 310b adjacent to the first structure 400 is drawn into the inside of the first structure 400 , the area of the display 310 that can be viewed from the outside of the electronic device 300 is reduced. can

According to an embodiment, the battery 530 may be positioned between the upper bracket 521 and the lower bracket 522 to supply power to components of the electronic device 300 . In one example, the battery 530 may be disposed in a position relatively adjacent to the first roller 524a compared to the printed circuit board structure 600 , but is not limited thereto.

According to an embodiment, the printed circuit board structure 600 may be disposed to be spaced apart from the battery 530 between the upper bracket 521 and the lower bracket 522 . In one example, the printed circuit board structure 600 may be disposed in a position adjacent to the second roller 524b relative to the battery 530 . In another example, a hole 5221 (eg, the hole 5221 of FIG. 4 ) may be formed in at least one region of the lower bracket 522 overlapping the printed circuit board structure 600 . A part of the printed circuit board structure 600 (eg, the third printed circuit board 550 ) may protrude to the outside of the lower bracket 522 through the aforementioned hole 5221 formed in the lower bracket 522 .

In one embodiment, the printed circuit board structure 600 includes a first printed circuit board 610 , a first interposer 620 , a second printed circuit board 630 , a second interposer 640 and/or a second 3 may include a printed circuit board 650 . The printed circuit board structure 600 may include, for example, a second interposer 640 , a second printed circuit board 630 , and a first interposer along a +z direction with respect to the third printed circuit board 650 . It may refer to a structure in which the 620 and/or the first printed circuit board 610 are sequentially stacked.

In one example, the first interposer 620 may be disposed between the first printed circuit board 610 and the second printed circuit board 630 . The first printed circuit board 610 may be stacked on the second printed circuit board 630 through the above-described first interposer 620 . In another example, the first interposer 620 is one surface (eg, one surface in the +z direction in FIGS. 6A and 6B ) and a second print of the first interposer 620 facing the first printed circuit board 610 . At least one first via (not shown) passing through one surface facing the circuit board 630 (eg, one surface in the -z direction of FIGS. 6A and 6B ) may be included. The first printed circuit board 610 may be electrically connected to the second printed circuit board 630 through the above-described at least one first via.

In one example, the second interposer 640 may be disposed between the second printed circuit board 630 and the third printed circuit board 650 . The second printed circuit board 630 may be stacked on the third printed circuit board 650 through the second interposer 640 . In another example, the second interposer 640 includes at least one surface of the second interposer 640 that passes through one side facing the second printed circuit board 630 and the other side facing the third printed circuit board 650 . A second via (not shown) may be included. The second printed circuit board 630 may be electrically connected to the third printed circuit board 650 through the above-described at least one second via.

In one example, electronic components for performing various functions (eg, wireless communication) of the electronic device 300 include a first printed circuit board 610 , a second printed circuit board 630 , or a third printed circuit board 650 . ) may be disposed in at least one of. For example, the wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may include at least one of a first printed circuit board 610 , a second printed circuit board 630 , or a third printed circuit board 650 . can be placed in In another example, the electronic components disposed on the first printed circuit board 610 , the electronic components disposed on the second printed circuit board 630 and/or the electronic components disposed on the third printed circuit board 650 are It may be electrically connected through the first interposer 620 and/or the second interposer 640 .

According to an embodiment, the third printed circuit board 650 may be positioned between the rear plate 440 and the second printed circuit board 630 , and at least one surface of the third printed circuit board 650 is a rear plate. It may be disposed to face 440 . In one example, at least one surface facing the rear plate 440 of the third printed circuit board 650 (eg, one surface facing the -z direction in FIGS. 6A and 6B) may be disposed to face the rear case 450 have. For example, when viewed in the -z direction, at least one region of the third printed circuit board 650 may be disposed to overlap the conductive pattern 460 formed on the rear case 450 .

According to an embodiment, at least one electrical connection member 660 may be disposed on one surface facing the rear case 450 of the third printed circuit board 650 , and At least one region may contact the conductive pattern 460 formed on the rear case 450 . In one example, the conductive pattern 460 is connected to at least one of the first printed circuit board 610 , the second printed circuit board 630 , or the third printed circuit board 650 through the at least one electrical connection member 660 . It may be electrically connected to a wireless communication circuit disposed in the. In another example, the wireless communication circuit may feed the electrically connected conductive pattern 460 , and the aforementioned conductive pattern 460 is an antenna radiator that transmits and/or receives RF signals of a specified frequency band. can operate as For example (eg, see FIG. 7 ), the conductive pattern 460 is _{fed from a wireless communication circuit at a first point P 1} and/or a second point P ₂ to transmit an RF signal in a designated frequency band. and/or may operate as a receiving antenna radiator. The at least one electrical connection member 660 may be, for example, a C-clip, but is not limited thereto. In another embodiment, the at least one electrical connection member 660 may include at least one of a conductive foam, a conductive sponge, an FPCB, or a conductive screw.

According to an embodiment, the electronic device 300 uses a plurality of printed circuit boards (eg, a first printed circuit board 610 ) through an interposer (eg, the first interposer 620 and the second interposer 640 ). ), the second printed circuit board 630 , and the third printed circuit board 650 ) are stacked using the above-described printed circuit board structure 600 , a thick slide type electronic device capable of including a flexible display Antenna contact structure can also be implemented.

8 is an exploded perspective view of a printed circuit board structure of an electronic device according to an exemplary embodiment, and FIG. 9 is a cross-sectional view of the printed circuit board structure of FIG. 8 taken in the A-A' direction. 8 and 9 show the printed circuit board structure 600 of FIGS. 5 or 6A, 6B.

10A is a diagram illustrating a first printed circuit board, a second printed circuit board, and a first interposer disposed between the first printed circuit board and the second printed circuit board of an electronic device according to an exemplary embodiment; is a diagram illustrating a second printed circuit board, a third printed circuit board, and a second interposer disposed between the second printed circuit board and the third printed circuit board of the electronic device according to an exemplary embodiment.

8 , 9 , 10A and/or 10B , a printed circuit board structure 600 (eg, an electronic device 300 of FIGS. 6A and 6B ) according to an embodiment. The printed circuit board structure 600 of FIGS. 6A and 6B ) includes a first printed circuit board 610 (eg, the first printed circuit board 610 of FIGS. 6A and 6B ), a first interposer 620 . (eg, the first interposer 620 of FIGS. 6A and 6B ), the second printed circuit board 630 (eg, the second printed circuit board 630 of FIGS. 6A and 6B ), the second interposer ( 640) (eg, the second interposer 640 of FIGS. 6A, 6B), a third printed circuit board 650 (eg, the third printed circuit board 650 of FIGS. 6A, 6B), at least one It may include an electrical connection member 660 (eg, at least one electrical connection member 660 of FIGS. 6A and 6B ), at least one electronic component 670 , and/or a shielding structure 680 .

In one embodiment, the first printed circuit board 610 has a first side 610a facing the +z direction and/or a direction opposite to the first side 610a (eg, -z direction in FIGS. 8 and 9 ). It may include a second surface 610b facing toward the. In one example, the second printed circuit board 630 may be disposed on the second surface 610b of the first printed circuit board 610 . For example, the second printed circuit board 630 may have a third surface 630a facing the second surface 610b of the first printed circuit board 610 and/or a direction opposite to the third surface 630a. It may include a facing fourth surface 630b. In another example, a third printed circuit board 650 may be disposed on the fourth surface 630b of the second printed circuit board 630 . For example, the third printed circuit board 650 may have a fifth surface 650a facing the fourth surface 630b of the second printed circuit board 630 and/or the fifth surface 650a in a direction opposite to that of the fifth surface 650a. It may include a sixth surface 650b facing the rear plate (eg, the rear plate 440 of FIGS. 6A and 6B ) and/or the rear case 450 .

In an embodiment, the first interposer 620 may be positioned between the first printed circuit board 610 and the second printed circuit board 630 . In one example, the first interposer 620 may be fixed between the first printed circuit board 610 and the second printed circuit board 630 . For example, one surface of the first interposer 620 facing the first printed circuit board 610 is disposed on the second surface 610b of the first printed circuit board 610 with a first solder pad (eg, in FIG. By _{soldering to S 1 of} 10a , the first interposer 620 may be fixed to the first printed circuit board 610 . As another example, one surface of the first interposer 620 facing the second printed circuit board 630 is disposed on the third surface 630a of the second printed circuit board 630 to the second solder pad S ₂ . By soldering, the first interposer 620 may be fixed to the second printed circuit board 630 .

According to an embodiment, the first interposer 620 includes a first sidewall 621 , at least one first via 623 , a first side plating member 625 , and a first solder resist (SR). ₁ ) and/or a second solder resist SR ₂ . In one example, the first sidewall 621 (or “insulating layer”) of the first interposer 620 may be formed of a non-conductive material, and the first sidewall 621 may be formed of a first printed circuit board ( 610) and/or may be formed in a band shape along the edge of the second printed circuit board 630 . For example, the first sidewall 621 may be formed in a rectangular band shape, but the shape of the first sidewall 621 is not limited to the above-described embodiment.

In one embodiment, the at least one first via 623 includes a first through hole 6231 , a first conductive pad 6232 , a first dielectric 6233 , a first pad 6234 , and/or a second pad. (6235). According to another embodiment (not shown), at least one of the above-described configurations of the at least one first via 623 may be omitted. For example, the first dielectric 6233 may be omitted from the at least one first via 623 , but the present invention is not limited thereto. In one example, the first through hole 6231 may be formed through at least one region of the first sidewall 621 . In another example, the first through hole 6231 may be formed in a circular shape, but the shape of the first through hole 6231 is not limited to the circular shape. For example, the first through hole 6231 may be formed in such a way that a partial area of the first sidewall 621 is penetrated through a drill or a partial area of the first sidewall 621 is removed through a laser, The present invention is not limited thereto.

In one example, the first conductive pad 6232 may be disposed to surround the outer circumferential surface of the first through hole 6231 . In another example, the first conductive pad 6232 may be formed of copper foil and/or gold foil by plating the inside of the first through hole 6231, and the first printed circuit board 610 and the second printed circuit board ( 630) can be electrically connected.

In one example, the first dielectric 6233 may be formed by filling the inside of the first through hole 6231 with a dielectric (eg, photo imageable solder resist mask ink (PSR ink)), and At least one region may be covered by the first conductive pad 6232 . In another example, the first pad 6234 is disposed on one end of the first dielectric 6233 facing the second surface 610b of the first printed circuit board 610 (eg, one end in the +z direction of FIG. 10A ). A second pad 6235 may be disposed on one end of the first dielectric 6233 facing the third surface 630a of the second printed circuit board 630 (eg, one end in the -z direction of FIG. 10A ). have. For example, the first pad 6234 and/or the second pad 6235 may be formed of copper, but is not limited thereto. As another example, at least a portion of the first pad 6234 is disposed on one end of the first conductive pad 6232 (eg, one end facing the +z direction in FIG. 10A ), and at least a portion of the second pad 6235 is 1 It may be disposed at the other end of the conductive pad 6232 (eg, one end facing the -z direction of FIG. 10A ).

In one example, solder cream (or “solder paste”) is applied between the first pad 6234 and the first solder pad of the first printed circuit board 610 (eg, S _{1 in FIG. 10A ).} " ) can be applied. As the solder cream applied between the first pad 6234 and the first solder pad S ₁ is soldered, the first interposer 620 is formed on the second surface of the first printed circuit board 610 ( 610b) may be fixed to one region. In another example, solder cream may be applied between the second pad 6235 and the second solder pad (eg, S _{2 of FIG. 10A ) of the second printed circuit board 630 .} As the solder cream applied between the second pad 6235 and the second solder pad S ₂ is soldered, the first interposer 620 is formed on the third surface 630a of the second printed circuit board 630 . It may be fixed to one area.

In one example, the first solder resist SR ₁ may be disposed in a region excluding the at least one first via 623 on one surface of the first sidewall 621 facing the +z direction. For example, the first solder resist SR ₁ may prevent lead from adhering to a region other than the first pad 6234 of the at least one first via 623 during a soldering process. In another example, the second solder resist SR ₂ may be disposed in a region excluding the at least one first via 623 on one surface of the first sidewall 621 facing the -z direction during the soldering process. For example, the second solder resist SR ₂ may prevent lead from adhering to a region other than the second pad 6235 of the at least one first via 623 .

In an example, a first-first solder resist layer SR ₁₁ may be disposed on a _{region excluding the first solder pad S 1} of the second surface 610b of the first printed circuit board 610 . For example, in the 1-1 solder resist layer SR ₁₁ , lead is applied to one area of the second surface 610b of the first printed circuit board 610 except for the first solder pad S _{1 in the soldering process.} sticking can be prevented. In another example, the 2-1 th solder resist layer SR ₂₁ may be disposed on the third surface 630a of the second printed circuit board 630 _{, except for the second solder pad S 2 .} For example, in the 2-1 solder resist layer SR ₂₁ , lead is applied to one area of the third surface 630a of the second printed circuit board 630 except for the second solder pad S _{2 in the soldering process.} sticking can be prevented.

In one example, the first side plating member 625 is attached to at least one area of the first sidewall 621 to electrically connect the first printed circuit board 610 and the second printed circuit board 630, or The first printed circuit board 610 and the second printed circuit board 630 may be structurally coupled. For example, the first side plating member 625 may be formed in a “C” shape when viewed from the side, but is not limited thereto. According to an embodiment (not shown), the first side plating member 625 in the first interposer 620 may be omitted.

In an embodiment, the second interposer 640 may be positioned between the second printed circuit board 630 and the third printed circuit board 650 . In one example, the second interposer 640 may be fixed between the second printed circuit board 630 and the third printed circuit board 650 . For example, one surface of the second interposer 640 facing the second printed circuit board 630 is disposed on the fourth surface 630b of the second printed circuit board 630 with a third solder pad (eg, FIG. By _{soldering to S 3 of} 10b , the second interposer 640 may be fixed to the second printed circuit board 630 . As another example, one surface of the second interposer 640 facing the third printed circuit board 650 is a fourth solder pad (eg, FIG. 10B ) disposed on the fifth surface 650a of the third printed circuit board 650 . By _{soldering to S 4} ), the second interposer 640 may be fixed to the third printed circuit board 650 .

According to an embodiment, the second interposer 640 includes a second sidewall 641 , at least one second via 643 , a second side plating member 645 , a third solder resist SR ₃ , and/or Alternatively, the fourth solder resist SR ₄ may be included. In one example, the second sidewall 641 (or “insulating layer”) of the second interposer 640 may be formed of a non-conductive material, and the second sidewall 641 may be formed of a second printed circuit board ( 630) and/or the third printed circuit board 650 may be formed in a band shape along the edge. For example, the second sidewall 641 may be formed in a rectangular band shape, but the shape of the second sidewall 641 is not limited to the above-described embodiment.

In one embodiment, the at least one second via 643 includes a second through hole 6431 , a second conductive pad 6432 , a second dielectric 6433 , a third pad 6434 and/or a fourth pad. (6435). According to another embodiment (not shown), at least one of the above-described configurations of the at least one second via 643 may be omitted. For example, the second dielectric 6433 may be omitted from the at least one second via 643 , but the present invention is not limited thereto. In one example, the second through hole 6431 may be formed through at least one region of the second sidewall 641 . In another example, the second through hole 6431 may be formed in a circular shape, but the shape of the second through hole 6431 is not limited to the circular shape. For example, the second through hole 6431 may be formed in such a way that a partial area of the second sidewall 641 is penetrated through a drill or a partial area of the second sidewall 641 is removed through a laser, The present invention is not limited thereto.

In one example, the second conductive pad 6432 may be disposed to surround the outer circumferential surface of the second through hole 6431 . In another example, the second conductive pad 6432 may be formed of copper foil and/or gold foil by plating the inside of the second through hole 6431 , and the second printed circuit board 630 and the third printed circuit board ( 650) can be electrically connected.

In one example, the second dielectric 6433 may be formed by filling the inside of the second through hole 6431 with a dielectric (eg, PSR ink), and at least one region of the second dielectric 6433 is a second conductive pad. may be wrapped by (6432). In another example, the third pad 6434 is disposed on one end of the second dielectric 6433 facing the fourth surface 630b of the second printed circuit board 630 (eg, one end in the +z direction in FIG. 10B ). A fourth pad 6435 may be disposed on one end of the second dielectric 6433 facing the fifth surface 650a of the third printed circuit board 650 (eg, one end in the -z direction of FIG. 10B ). have. For example, the third pad 6434 and/or the fourth pad 6435 may be formed of copper, but is not limited thereto. As another example, at least a portion of the third pad 6434 is disposed on one end of the second conductive pad 6432 (eg, one end facing the +z direction in FIG. 10B ), and at least a portion of the fourth pad 6435 is the second conductive pad 6432 . The second conductive pad 6432 may be disposed at the other end (eg, one end facing the -z direction of FIG. 10B ).

In one example, solder cream (or "solder paste") is applied between the third pad 6434 and the third solder pad of the second printed circuit board 630 (eg, S _{3 in FIG. 10B ).} ") can be applied. As the solder cream applied between the third pad 6434 and the third solder pad (eg, S _{3 in} FIG. 10B ) is soldered, the second interposer 640 forms the second printed circuit board 630 . It may be fixed to one area of the fourth surface 630b of the . In another example, solder cream may be applied between the fourth pad 6435 and the fourth solder pad (eg, S _{4 of FIG. 10B ) of the third printed circuit board 650 .} As the solder cream applied between the fourth pad 6435 and the fourth solder pad S ₄ is soldered, the second interposer 640 is formed on the fifth surface 650a of the third printed circuit board 650 . It may be fixed to one area.

In one example, the third solder resist SR ₃ may be disposed in a region excluding the at least one second via 643 on one surface of the second sidewall 641 facing the +z direction. For example, the third solder resist SR ₃ may prevent lead from adhering to a region other than the third pad 6434 of the at least one second via 643 during a soldering process. In another example, the fourth solder resist SR ₄ may be disposed in a region excluding the at least one second via 643 on one surface of the second sidewall 641 facing the -z direction. For example, the fourth solder resist SR ₄ may prevent solder from adhering to a region other than the fourth pad 6435 of the at least one second via 643 during a soldering process. 2 A 3 - 1 solder resist layer SR ₃₁ may be disposed in a _{region excluding the third solder pad S 3} of the fourth surface 630b of the printed circuit board 630 . For example, in the 3-1 solder resist layer SR ₃₁ , lead is applied to one area of the fourth surface 630b of the second printed circuit board 630 except for the third solder pad S _{3 in the soldering process.} sticking can be prevented. In another example, a 4-1 th solder resist layer SR ₄₁ may be disposed on a _{region excluding the fourth solder pad S 4} of the fifth surface 650a of the third printed circuit board 650 . For example, in the 4-1 solder resist layer SR ₄₁ , lead is applied to one area of the fifth surface 650a of the third printed circuit board 650 except for the fourth solder pad S _{4 in the soldering process.} sticking can be prevented.

In one example, the second side plating member 645 is attached to at least one area of the second sidewall 641 to electrically connect the second printed circuit board 630 and the third printed circuit board 650, or The second printed circuit board 630 and the third printed circuit board 650 may be structurally coupled. For example, the second side plating member 645 may be formed in a “C” shape when viewed from the side, but is not limited thereto. According to an embodiment (not shown), the second side plating member 645 in the second interposer 640 may be omitted.

According to an embodiment, the at least one electrical connection member 660 is disposed on the sixth surface 650b facing the rear case 450 of the third printed circuit board 650, and is patterned on the rear case 450 ( may be in contact with the patterned conductive pattern 460 . In one example, the at least one electrical connection member 660 is a wireless communication circuit ( (not shown) (eg, the wireless communication module 192 of FIG. 1 ) and the conductive pattern 460 operating as an antenna radiator may be electrically connected. For example, the wireless communication circuit may transmit an RF signal to the conductive pattern 460 or receive an RF signal from the conductive pattern 460 through the at least one electrical connection member 660 .

A printed circuit board (eg, the third printed circuit board 650 ) disposed in an area adjacent to the antenna (eg, the conductive pattern 460 ) may be frequently removed for debugging or repair reasons. According to an embodiment, in a structure in which a plurality of printed circuit boards are stacked using an interposer, when the antenna and the adjacent printed circuit board are separated, other printed circuit boards and/or peripheral components may also be separated, so that a specific printed circuit board may be separated. It could be difficult to separate only the circuit board.

The electronic device 300 according to an embodiment includes a fourth pad 6435 and/or a second interposer 640 that connects or fixes the second printed circuit board 630 and the third printed circuit board 650 . _{The size of the fourth solder pad S 4} of the third printed circuit board 650 is adjusted to another pad (eg, the first pad 6234 , the second pad 6235) and/or another solder pad (eg, the first By forming the solder pad (S ₁ ) smaller than the second solder pad (S ₂ )), it is possible to relatively easily separate the third printed circuit board 650 . In one example, the first pad 6234 and/or the second pad 6235 of the first interposer 620 may be formed _{in a first size (eg, D 1 of FIG. 10A ).} In another example, the fourth pad 6435 of the second interposer 640 and/or the fourth solder pad S ₄ of the third printed circuit board 650 may have a second size smaller than _{the first size D 1 .} It may be formed in a size (eg, D _{2 in FIG. 10B ).}

In one example, the size D ₂ of the third pad 6434 of the second interposer 640 and/or the fourth solder pad S ₄ of the third printed circuit board 650 is different and/or As the size of other solder pads (eg, D ₁ ) is formed smaller than the area where the second interposer 640 is soldered to the third printed circuit board 650 , the first interposer 620 is formed to be smaller than the first printed circuit board 650 . An area soldered to the substrate 610 and/or the second printed circuit board 630 or an area soldered to the second interposer 640 to the second printed circuit board 630 may be smaller. Due to the difference in the above-described soldering area, the coupling between the third printed circuit board 650 and the second interposer 640 is relatively higher than the coupling between the second printed circuit board 630 and the first interposer 620 . It may be weak, and thus, when the same heat is applied for separation, the third printed circuit board 650 may be separated relatively quickly and easily compared to other printed circuit boards.

According to an embodiment, the at least one electronic component 670 may be disposed on at least one of the first printed circuit board 610 , the second printed circuit board 630 , and the third printed circuit board 650 . In an example, the at least one electronic component 670 includes a first electronic component 671 , a second electronic component 672 , a third electronic component 673 , a fourth electronic component 674 , and/or a fifth electronic component component 675 . For example, the first electronic component 671 is disposed on the first surface 610a of the first printed circuit board 610 , and the second electronic component 672 is the second electronic component 672 of the first printed circuit board 610 . It may be disposed on the surface 610b. As another example, the third electronic component 673 is disposed on the fourth surface 630b of the second printed circuit board 630 , and the fourth electronic component 674 and/or the fifth electronic component 675 is disposed on the third It may be disposed on the sixth surface 650b of the printed circuit board 650 . However, in the arrangement structure described above, the first electronic component 671 , the second electronic component 672 , the third electronic component 673 , the fourth electronic component 674 , and/or the fifth electronic component 675 are arranged This is only an example of a structure, and according to an embodiment (not shown), the first electronic component 671 , the second electronic component 672 , the third electronic component 673 , the fourth electronic component 674 and/or The arrangement structure of the fifth electronic component 675 may be changed, or an additional electronic component may be disposed. As another example, the first electronic component 671 may be a processor (eg, the processor 120 of FIG. 1 ) for controlling the electronic device, and the second electronic component 672 may be a memory (eg, the memory ( 130)). As another example, the third electronic component 673 mixes a communication signal modulated by the processor with a frequency signal, or transmits a signal from an external electronic device (eg, the

electronic devices

102 and 104 of FIG. 1 ) to a frequency signal. It may be a transceiver that can be modulated separately from . As another example, the fourth electronic component 674 and/or the fifth electronic component 675 may be at least one of at least one sensor (eg, a grip sensor), an amplifier, a switch, and a filter.

According to an embodiment, the shielding structure 680 (or “shield can”) may electromagnetically shield at least one electronic component 670 disposed on the printed circuit board structure 600 . In an example, the shielding structure 680 may block noise generated from the at least one electronic component 670 from leaking out or from externally generated noise from being introduced into the at least one electronic component 670 . For example, the shielding structure 680 is disposed on the first surface 610a of the first printed circuit board 610 to electromagnetically shield the first electronic component 671 disposed on the first printed circuit board 610 . can be shielded with However, the arrangement position of the shielding structure 680 is not limited to the above-described embodiment, and the shielding structure 680 may be disposed on another printed circuit board (eg, the third printed circuit board 650 ) according to the exemplary embodiment. may be

11A is a diagram illustrating a partial area of a first printed circuit board of an electronic device according to an exemplary embodiment, and FIG. 11B is a diagram illustrating a partial area of a second printed circuit board of an electronic device according to an exemplary embodiment.

Referring to FIG. 11A , the first printed circuit board 610 according to an embodiment may include a first surface 610a (eg, the first surface 610a of FIGS. 8 and 9 ) and/or a first surface ( 610a) and a second surface 610b (eg, the second surface 610b of FIGS. 8 and 9 ) facing in the opposite direction may be included. _{In one example, the first printed circuit board 610 is a first solder plate (SP 1} ) to which a first interposer (eg, the first interposer 620 of FIGS. 8 and 9 ) can be soldered. ) and/or a first fill-cut area disposed to surround at least one area of the outer circumferential surface of _{the first solder plate SP 1 and penetrating the first surface 610a and the second surface 610b} (F ₁ ) may be included.

In one embodiment, the first fill-cut region F ₁ is formed to surround a portion of the outer circumferential surface of the first solder plate SP ₁ , so that at least one first via (eg, at least in FIG. 10A ) of the first interposer. _{One first via 623 ) may form a first solder plate SP 1} that may be soldered to the second surface 610b of the first printed circuit board 610 . For example, the first peel-cut region F ₁ may be formed of at least one of an epoxy resin (eg, FR4) or polycarbonate (PC). _{As the first solder plate SP 1} is formed on the second surface 610b of the first printed circuit board 610 by the first peel-cut region F ₁ , the application of the solder solution may be relatively easy, , as a result, a process of soldering between the first printed circuit board 610 and the first interposer may be facilitated. As another example, the first solder plate SP ₁ may be formed to have a larger area than at least one first via of the first interposer, but is not limited thereto.

In one example, the first pilkeot area formed in the periphery of the solder plate (SP ₁₎ (F ₁₎ a first solder plate (SP ₁₎ a first interposer to at least one of the first via the first being soldered to the It may be separated from the ground of the printed circuit board 610 . In another example, the first pilkeot area (F ₁₎ a first solder plate (SP ₁₎ is formed on only a part of the peripheral surface to connect the ground of the first solder plate (SP ₁₎ and the first printed circuit board (610) A first bridge structure (B ₁ ) may be formed. At least one first via of the first interposer may be grounded to the ground of the first printed circuit board 610 through the _{above-described first bridge structure B 1 .}

Referring to FIG. 11B , the second printed circuit board 630 according to an embodiment has a third surface 630a (eg, the third surface 630a of FIGS. 8 and 9 ) and/or a third surface ( 630a) and a fourth surface 630b (eg, the fourth surface 630b of FIGS. 8 and 9 ) facing in the opposite direction may be included. _{In one example, the second printed circuit board 630 is a second solder plate (SP 2} ) to which a second interposer (eg, the second interposer 640 of FIGS. 8 and 9 ) can be soldered. ) and/or a second fill-cut area disposed to surround at least one area of the outer circumferential surface of _{the second solder plate SP 2 and penetrating the third surface 630a and the fourth surface 630b.} (F ₂ ) may be included.

In one embodiment, the second fill-cut region F ₂ is formed to surround a portion of the outer circumferential surface of the second solder plate SP ₂ , so that at least one second via of the second interposer (eg, at least in FIG. 10A ) One second via 643 ) may form a second solder plate SP2 that may be soldered to the fourth surface 630b of the second printed circuit board 630 . For example, the second fill-cut region F ₂ may be formed of at least one of an epoxy resin (eg, FR4) or polycarbonate (PC). _{As the second solder plate SP 2} is formed on the fourth surface 630b of the second printed circuit board 630 by the second fill-cut region F ₂ , the application of the solder solution may be relatively easy, , as a result, the process of soldering between the second printed circuit board 630 and the second interposer may be facilitated. As another example, the second solder plate SP ₂ may be formed to have a larger area than at least one second via of the second interposer, but is not limited thereto. As another example, the second solder plate SP ₂ may be formed to have a relatively small area compared to the first solder plate SP _{1 .}

In one example, a second pilkeot area formed in the periphery of the solder plate (SP _₂₎ (F ₂₎ is the second interposer to the at least one second via being soldered to the second solder plate (SP _{2) 2} It can be separated from the ground of the printed circuit board 630 . In another example, the second fill-cut region F ₂ is formed only on a partial region of the outer peripheral surface of the second solder plate SP2 _{to connect the second solder plate SP 2} to the ground of the second printed circuit board 630 . A two-bridge structure (B ₂ ) may be formed. At least one second via of the second interposer may be grounded to the ground of the second printed circuit board 630 through the _{above-described second bridge structure B 2 .}

Referring to FIG. 12 , according to another embodiment, the at least one second via 643 of the second interposer 640 may include the at least one second via of FIG. 10B (eg, the at least one second via of FIG. 10B ). It may be formed in a structure different from that of the via 643 ).

In one embodiment, the second interposer 640 is positioned between the second printed circuit board 630 and/or the third printed circuit board 650 , the second sidewall 641 , the at least one second via 643 , a third solder resist SR ₃ and/or a fourth solder resist SR ₄ may be included. In one example, the second sidewall 641 (or “insulating layer”) of the second interposer 640 may be formed of a non-conductive material, and the second sidewall 641 may be formed of a second printed circuit board ( 630) and/or the third printed circuit board 650 may be formed in a band shape along the edge. For example, the second sidewall 641 may be formed in a rectangular band shape, but the shape of the second sidewall 641 is not limited to the above-described embodiment.

According to an embodiment, the at least one second via 643 includes a second through hole 6431 , a second conductive pad 6432 , a second dielectric 6433 , a third pad 6434 , and a fourth pad ( 6435 , a third through hole 6436 , a third conductive pad 6437 , a third dielectric 6438 , a fifth pad 6439a and/or a sixth pad 6439b . At least one second via 643 according to an embodiment may include a third through hole 6436 , a third conductive pad 6437 , and a third dielectric 6438 in the at least one second via 643 of FIG. 10B . , a fifth pad 6439a and/or a sixth pad 6439b may be added. According to another embodiment (not shown), at least a portion of the above-described configuration of the at least one second via 643 may be omitted. For example, the second dielectric 6433 and/or the third dielectric member 6438 may be omitted from the at least one second via 643 , but the present invention is not limited thereto.

In one example, the second through hole 6431 may be formed through at least one region of the second sidewall 641 . For example, the second through hole 6431 may be formed in a circular shape, but the shape of the second through hole 6431 is not limited to a circular shape.

In one example, the second conductive pad 6432 may be disposed to surround the outer peripheral surface of the second through hole 6431 . In another example, the second conductive pad 6432 may be formed of copper foil and/or gold foil by plating the inside of the second through hole 6431 , and the second printed circuit board 630 and the third printed circuit board ( 650) can be electrically connected.

In one example, the second dielectric 6433 may be formed by filling the inside of the second through hole 6431 with a dielectric (eg, PSR ink), and at least one region of the second dielectric 6433 is a second conductive pad. may be wrapped by (6432). In another example, the third pad 6434 is disposed on one end of the second dielectric 6433 facing the fourth surface 630b of the second printed circuit board 630 (eg, one end in the +z direction in FIG. 12 ). and one end (eg, in the -z direction of FIG. 12 ) facing the fifth surface 650a (eg, the fifth surface 650a of FIG. 10B ) of the third printed circuit board 650 of the second dielectric 6433 . one end), a fourth pad 6235 may be disposed. For example, the third pad 6434 and/or the fourth pad 6435 may be formed of copper, but is not limited thereto.

In one example, solder cream (or "solder paste") is applied between the third pad 6434 and the 3-1 solder pad S _{31 of the second printed circuit board 630 .} can be applied. As the solder cream applied between the third pad 6434 and the third-first solder pad S ₃₁ is soldered, the second interposer 640 is formed on the fourth part of the second printed circuit board 630 . It may be fixed to one area of the surface 630b. In another example, solder cream may be applied between the fourth pad 6435 and the fourth-first solder pad S _{41 of the third printed circuit board 650 .} As the solder cream applied between the fourth pad 6435 and the 4-1 solder pad S ₄₁ is soldered, the second interposer 640 is formed on the fifth surface 650a of the third printed circuit board 650 . ) can be fixed in one area.

In one example, the third through hole 6436 may be formed through the outer peripheral surface of the second conductive pad 6432 . For example, the third through hole 6436 may be formed in a circular shape having a larger diameter than that of the second through hole 6431 , but the shape of the third through hole 6436 is not limited to a circular shape.

In one example, the third conductive pad 6437 may be disposed to surround the outer circumferential surface of the third through hole 6436 formed in the outer circumferential surface of the second conductive pad 6432 . In another example, the third conductive pad 6437 may be formed of copper foil and/or gold foil by plating the inside of the third through hole 6436 , and may form the second printed circuit board 630 and the third printed circuit board together. It can be electrically connected.

In one example, the third dielectric 6438 may be formed by filling the inside of the third through hole 6436 with a dielectric material (eg, PSR ink), and at least one region of the third dielectric 6438 may have a third conductivity. It may be covered by the pad 6437 . In another example, the fifth pad 6439a is located in a region (eg, a region in the +z direction of FIG. 12 ) of the third conductive pad 6437 facing the fourth surface 630b of the second printed circuit board 630 . ) is disposed, and the sixth pad ( 6439b) can be deployed. For example, the fifth pad 6439a and/or the sixth pad 6439b may be formed of copper, but is not limited thereto. According to another embodiment (not shown), a partial region of the fifth pad 6439a is disposed on one end of the third dielectric 6438 in the +z direction, and a partial region of the sixth pad 6439b is It may be disposed in one region of one end of the third dielectric 6438 in the -z direction.

In one example, solder cream (or “solder paste”) is applied between the fifth pad 6439a and the third-second solder pad S _{32 of the second printed circuit board 630 .} can be applied. For example, the 3-2nd solder pad S ₃₂ may be disposed to surround the outer circumferential surface of the 3-1th solder pad _{S31 .} As the solder cream applied between the fifth pad 6439a and the third-second solder pad S ₃₂ is soldered, the second interposer 640 is formed on the fourth portion of the second printed circuit board 630 . It may be fixed to one area of the surface 630b. In another example, solder cream may be applied between the sixth pad 6439b and the fourth-second solder pad S _{42 of the third printed circuit board 650 .} For example, the 4-2nd solder pad S ₄₂ may be disposed to surround the outer circumferential surface of the 4-1th solder pad _{S41 .} As the solder cream applied between the sixth pad 6439b and the 4-2nd solder pad S ₄₂ is soldered, the second interposer 640 is formed on the fifth surface 650a of the third printed circuit board 650 . _{). In one example, the 3-1 solder pad S 31} and/or the 3-2 solder pad S 31 of the fourth surface 630b of the second printed circuit board 630 . A 3-1 th solder resist layer SR ₃₁ may be disposed in a region other than S _{32 .} For example, the 3-1 th solder resist layer SR ₃₁ is formed on the second printed circuit board ( excluding the 3-1 th solder pad S ₃₁ and/or the 3-2 th solder pad S _{32 ) during the soldering process.} It is possible to prevent lead from adhering to one region of the fourth surface 630b of the 630 . _{In another example, in an area other than the 4-1 solder pad S 41} and/or the 4-2 solder pad S _{42 on} the fifth surface 650a of the third printed circuit board 650, the 4-th One solder resist layer SR ₄₁ may be disposed. For example, the 4-1th solder resist layer (SR ₄₁ ) is a third printed circuit board ( excluding the _{4-1th solder pad ( S41} ) and/or the 4-2th solder pad ( _S42 ) during the soldering process. It is possible to prevent lead from adhering to one area of the fifth surface 650a of the 650 .

In one example, the second conductive pad 6432 is a first printed circuit board (eg, the first printed circuit board 610 of FIGS. 8 and 9 ), a second printed circuit board 630 , or a third printed circuit board It may be electrically connected to a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) disposed in at least one of the. In another example, the third conductive pad 6437 may be electrically connected to the ground of the second printed circuit board 630 and/or the ground of the third printed circuit board.

According to an embodiment, the second conductive pad 6432 is electrically connected to the wireless communication circuit to transmit an RF signal from the wireless communication circuit to the antenna radiator (eg, the conductive pattern 460 in FIG. 9 ) or the antenna radiator RF signals can be transmitted from the to the wireless communication circuit. According to another embodiment, the third conductive pad 6437 is grounded to the ground of the second printed circuit board 630 and/or to the ground of the third printed circuit board, and is disposed to surround the second conductive pad 6432 . Accordingly, it may serve to electromagnetically shield the second conductive pad 6432 .

According to one embodiment, the at least one second via 643 of the second interposer 640 is a second conductive pad 6432 and/or a second printed circuit board ( The third conductive pad 6437 electrically connected to the ground of the 630 and/or the ground of the third printed circuit board may perform a substantially identical or similar function to that of the coaxial cable. For example, the second conductive pad 6432 of the at least one second via 643 may serve as a signal wire of a coaxial cable through which an RF signal is transmitted, and the third conductive pad 6437 is a signal wire It is disposed so as to surround the signal wiring, and can serve as a conductor to electromagnetically shield the signal wiring.

13A is a diagram illustrating a cross-section of an electronic device in a closed state according to another embodiment, and FIG. 13B is a diagram illustrating a cross-section of an electronic device in an open state according to another embodiment. 13A is a cross-sectional view of the electronic device 200a of FIG. 2A or the electronic device 200b of FIG. 2C taken in the II' direction, and FIG. 13B is the electronic device 200a of FIG. 2B or the electronic device 200b of FIG. 2D . is a cross-sectional view cut in the II-II' direction. 13A and/or 13B are cross-sectional views in which some components of the electronic device 300 are omitted in order to explain the sliding movement of the display support structure 510 in the closed state and the open state of the electronic device.

13A and/or 13B , an electronic device 300 (eg, the electronic device 300 of FIG. 3 ) according to another embodiment includes a display 310 (eg, the display 310 of FIG. 3 ). , a first structure 400 (eg, the first structure 400 of FIG. 3 ), a rear case 450 , a conductive pattern 460 , and a display support structure 510 (eg, FIGS. 4 and 4 ). 5, the display support structure 510), the upper bracket 521 (eg, the upper bracket 521 of FIGS. 4 and 5), the lower bracket 522 (eg, the lower bracket 522 of FIGS. 4 and 5) ), plurality of rollers 524 (eg, plurality of rollers 524 of FIGS. 4 and 5 ), battery 530 (eg, battery 530 of FIGS. 4 and 5 ), and/or a printed circuit board structure. (700) may be included.

The electronic device 300 according to another embodiment may be an electronic device in which the structure of the printed circuit board structure 700 in the electronic device 300 of FIGS. 6A and 6B is modified, and repeated descriptions will be omitted below. .

According to an embodiment, the printed circuit board structure 700 may be disposed between the upper bracket 521 and the lower bracket 522 . In one example, the printed circuit board structure 700 may be disposed at a position adjacent to the second roller 524b relative to the battery 530 . In another example, a hole 5221 (eg, the hole 5221 of FIG. 4 ) may be formed in at least one region of the lower bracket 522 overlapping the printed circuit board structure 700 . A part of the printed circuit board structure 700 (eg, the third printed circuit board 550 ) may protrude to the outside of the lower bracket 522 through the aforementioned hole 5221 formed in the lower bracket 522 .

In one embodiment, the printed circuit board structure 700 includes a first printed circuit board 710 , a first interposer 720 , a second printed circuit board 730 , a second interposer 740 and/or a second 3 may include a printed circuit board 750 . In one example, the printed circuit board structure 700 includes a first interposer 720 and/or a second printed circuit board 730 in one area of one surface of the first printed circuit board 710 facing the -z direction. This may refer to a structure in which the second interposer 740 and/or the third printed circuit board 750 are stacked on another area of one surface of the first printed circuit board 710 facing the -z direction. have. For example, the second printed circuit board 730 and/or the third printed circuit board 750 may be spaced apart from each other in the -z direction of the first printed circuit board 710 . As another example, the first interposer 720 is disposed between the first printed circuit board 710 and the second printed circuit board 730 , and the first printed circuit board 710 and the third printed circuit board 750 . A second interposer 740 may be disposed therebetween.

In one example, the first interposer 720 may be disposed between the first printed circuit board 710 and the second printed circuit board 730 , and the above-described first interposer 720 is the first printed circuit board. It may be fixed to the board 710 and/or the second printed circuit board 730 . In another example, the first interposer 720 may include at least one first via (not shown) having conductivity (eg, at least one first via 623 of FIG. 10A ), and may include a first print. The circuit board 710 and the second printed circuit board 730 may be electrically connected to each other through at least one first via of the first interposer 720 .

In one example, the second interposer 740 may be disposed between the first printed circuit board 710 and the third printed circuit board 750 , and the above-described second interposer 740 is the first printed circuit board. It may be fixed to the board 710 and/or the third printed circuit board 750 . In another example, the second interposer 740 includes at least one second via (not shown) having conductivity (eg, at least one second via 643 in FIG. 10B or at least one second via in FIG. 12 ). 643 ), and the first printed circuit board 710 and the third printed circuit board 750 may be electrically connected through the above-described at least one second via.

In one example, electronic components for performing various functions (eg, wireless communication) of the electronic device 300 include a first printed circuit board 710 , a second printed circuit board 730 , or a third printed circuit board 750 . ) may be disposed in at least one of. For example, the wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may include at least one of the first printed circuit board 710 , the second printed circuit board 730 , or the third printed circuit board 750 . can be placed in In another example, the electronic components disposed on the first printed circuit board 710 , the electronic components disposed on the second printed circuit board 730 , and/or the electronic components disposed on the third printed circuit board 750 are It may be electrically connected through the first interposer 720 and/or the second interposer 740 .

According to an embodiment, at least one surface of the third printed circuit board 750 may be disposed to face the rear plate 440 . In one example, at least one surface facing the rear plate 440 of the third printed circuit board 750 (eg, one surface facing the -z direction in FIGS. 13A and 13B) may be disposed to face the rear case 450 have. For example, when viewed in the -z direction, at least one region of the third printed circuit board 750 may be disposed to overlap the conductive pattern 460 formed on the rear case 450 .

According to an embodiment, at least one electrical connection member 760 may be disposed on one surface facing the rear case 450 of the third printed circuit board 750 , and At least one region may contact the conductive pattern 460 formed on the rear case 450 . In one example, the conductive pattern 460 is connected to at least one of the first printed circuit board 710 , the second printed circuit board 730 , and the third printed circuit board 750 through the at least one electrical connection member 760 . It may be electrically connected to a wireless communication circuit disposed in the. In another example, the wireless communication circuit may feed the electrically connected conductive pattern 460 , and the aforementioned conductive pattern 460 is an antenna radiator that transmits and/or receives RF signals of a specified frequency band. can operate as The at least one electrical connection member 760 may be, for example, a C-clip, but is not limited thereto. In another embodiment, the at least one electrical connection member 760 may include at least one of a conductive foam, a conductive sponge, an FPCB, or a conductive screw.

According to an embodiment, the electronic device 300 includes a second printed circuit board 730 and a first printed circuit board 710 to the first printed circuit board 710 using the first interposer 720 and/or the second interposer 740 . Alternatively, an antenna contact structure may be implemented in a thick slide-type electronic device including a flexible display by using the above-described printed circuit board structure 700 on which the third printed circuit board 750 is stacked.

14 is an exploded perspective view of a printed circuit board structure of an electronic device according to another exemplary embodiment, and FIG. 15 is a cross-sectional view taken along the line B-B′ of the printed circuit board structure of FIG. 14 . 14 and/or 15 illustrate the printed circuit board structure 700 of FIGS. 13A and/or 13B.

14 and/or 15 , a printed circuit board structure 700 (eg, FIGS. 13A and 13B ) of an electronic device (eg, the electronic device 300 of FIGS. 13A and 13B ) according to an embodiment. The printed circuit board structure 700 ) includes a first printed circuit board 710 (eg, the first printed circuit board 710 in FIGS. 13A and 13B ), a first interposer 720 (eg, FIGS. 13A , 13B ). The first interposer 720 of FIG. 13B ), the second printed circuit board 730 (eg, the second printed circuit board 730 of FIGS. 13A and 13B ), the second interposer 740 (eg, FIG. 13B ) The second interposer 740 of FIGS. 13A and 13B ), the third printed circuit board 750 (eg, the third printed circuit board 750 of FIGS. 13A and 13B ), at least one electrical connection member 760 ) (eg, at least one electrical connection member 760 of FIGS. 13A and 13B ), at least one electronic component 770 , and/or a shielding structure 780 .

In an embodiment, the first printed circuit board 710 has a first side 710a facing the +z direction and/or a direction opposite to the first side 710a (eg, -z direction in FIGS. 8 and 9 ). It may include a second surface 710b facing toward the. In one example, the second printed circuit board 730 and/or the third printed circuit board 750 may be disposed on the second surface 710b of the first printed circuit board 710 . For example, the second printed circuit board 730 and the third printed circuit board 750 may be disposed to be spaced apart from each other by a specified distance on the second surface 710b of the first printed circuit board 710 .

In one example, the second printed circuit board 730 may have a third surface 730a and/or a second surface 730a facing one area (eg, a left area) of the second surface 710b of the first printed circuit board 710 . The third surface 730a may include a fourth surface 730b facing in the opposite direction.

In another example, the third printed circuit board 750 may have a fifth surface 750a and/or a fifth surface 750a facing one area (eg, a right area) of the second surface 710b of the first printed circuit board 710 . A sixth surface 750b facing in a direction opposite to the fifth surface 750a may be disposed. In one example, the sixth surface 750b of the third printed circuit board 750 may be disposed to face at least a partial area of the rear case 450 . For example, the sixth surface 750b of the third printed circuit board 750 may overlap at least a partial area of the rear case 450 .

In an embodiment, the first interposer 720 may be positioned between the first printed circuit board 710 and the second printed circuit board 730 . In one example, the first interposer 720 may be fixed between the first printed circuit board 710 and the second printed circuit board 730 . For example, one surface of the first interposer 720 facing the first printed circuit board 710 is a first solder pad S ₅ disposed on the second surface 710b of the first printed circuit board 710 ) By soldering to the , the first interposer 720 may be fixed to the first printed circuit board 710 . As another example, one surface of the first interposer 720 facing the second printed circuit board 730 is disposed on the third surface 730a of the second printed circuit board 730 to the second solder pad S ₆ . By soldering, the first interposer 720 may be fixed to the second printed circuit board 730 .

According to an embodiment, the first interposer 720 includes a first sidewall 721 , at least one first via 723 , a first side plating member 725 , a first solder resist SR ₅ , and/or Alternatively, the second solder resist SR ₆ may be included. In one example, the first sidewall 721 (or “insulating layer”) of the first interposer 720 may be formed of a non-conductive material, and the first sidewall 721 may be formed of a second printed circuit board ( 730) may be formed in a band shape formed along the edge. For example, the first sidewall 721 may be formed in a rectangular band shape, but the shape of the first sidewall 721 is not limited to the above-described embodiment.

In one embodiment, the at least one first via 723 includes a first through hole 7231 , a first conductive pad 7232 , a first dielectric 7233 , a first pad 7234 and/or a second pad. (7235). According to another embodiment (not shown), at least one of the above-described configurations of the at least one first via 723 may be omitted. For example, the first dielectric value 7233 may be omitted from the at least one first via 723 , but the present invention is not limited thereto. In one example, the first through hole 7231 may be formed through at least one region of the first sidewall 721 . In another example, the first through hole 7231 may be formed in a circular shape, but is not limited thereto. For example, the first through hole 7231 may be formed in such a way that a partial area of the first sidewall 721 is penetrated through a drill or a partial area of the first sidewall 721 is removed through a laser, The present invention is not limited thereto.

In one example, the first conductive pad 7232 may be disposed to surround the outer peripheral surface of the first through hole 7231 . In another example, the first conductive pad 7232 may be formed of copper foil and/or gold foil by plating the inside of the first through hole 7231 , and the first printed circuit board 710 and the second printed circuit board ( 730) may be electrically connected.

In one example, the first dielectric 7233 may be formed by filling the inside of the first through hole 7231 with a dielectric (eg, photo imageable solder resist mask ink (PSR ink)), and At least one region may be covered by the first conductive pad 7232 . In another example, the first pad 7234 is disposed on one end of the first dielectric 7233 facing the second surface 710b of the first printed circuit board 710 (eg, one end in the +z direction in FIG. 15 ). A second pad 7235 may be disposed on one end of the first dielectric 7233 facing the third surface 730a of the second printed circuit board 730 (eg, one end in the -z direction of FIG. 15 ). have. For example, the first pad 7234 and/or the second pad 7235 may be formed of copper, but is not limited thereto.

In one example, solder cream (or “solder paste”) is to be applied between the first pad 7234 and the first solder pad S _{5 of the first printed circuit board 710 .} can As the solder cream applied between the first pad 7234 and the first solder pad S ₅ is soldered, the first interposer 720 is formed on the second surface ( It may be fixed to one area of 710b). In another example, a solder cream may be applied between the second pad 7235 and the second solder pad S _{6 of the second printed circuit board 730 .} As the solder cream applied between the second pad 7235 and the second solder pad S ₆ is soldered, the first interposer 720 is the third surface 730a of the second printed circuit board 730 . It may be fixed to one area.

In one example, the first solder resist SR ₅ may be disposed in a region excluding the at least one first via 723 on one surface of the first sidewall 621 facing the +z direction. For example, the first solder resist SR ₅ may prevent lead from adhering to a region other than the first pad 7234 of the at least one first via 723 during a soldering process. In another example, the second solder resist SR ₆ may be disposed in a region other than the at least one first via 723 on one surface of the first sidewall 621 facing the -z direction during the soldering process. For example, the second solder resist SR ₆ may prevent lead from adhering to a region other than the second pad 7235 of the at least one first via 723 .

In one example, the first side plating member 725 is attached to at least one region of the first sidewall 721 to electrically connect the first printed circuit board 710 and the second printed circuit board 730, or The first printed circuit board 710 and the second printed circuit board 730 may be structurally coupled. For example, the first side plating member 725 may be formed in a “C” shape when viewed from the side, but is not limited thereto. According to an embodiment, the first side plating member 725 in the first interposer 720 may be omitted.

In an embodiment, the second interposer 740 may be positioned between the first printed circuit board 710 and the third printed circuit board 750 . In one example, the second interposer 740 may be fixed between the first printed circuit board 710 and the third printed circuit board 750 . For example, one surface of the second interposer 740 facing the first printed circuit board 710 is disposed on the second surface 710b of the first printed circuit board 710 and the third solder pad S ₇ ) By soldering to the , the second interposer 740 may be fixed to the first printed circuit board 710 . As another example, one surface of the second interposer 740 facing the third printed circuit board 750 is disposed on the fifth surface 750a of the third printed circuit board 750 to the fourth solder pad S ₈ . By soldering, the second interposer 740 may be fixed to the third printed circuit board 750 .

In an embodiment, the second interposer 740 includes a second sidewall 741 , at least one second via 743 , a second side plating member 745 , a third solder resist SR ₇ , and/or A fourth solder resist SR ₈ may be included. In one example, the second sidewall 741 (or “insulating layer”) of the second interposer 740 may be formed of a non-conductive material, and the second sidewall 741 may be formed of a third printed circuit board ( 750) may be formed in a band shape formed along the edge. For example, the second sidewall 741 may be formed in a rectangular band shape, but the shape of the second sidewall 741 is not limited to the above-described embodiment.

In one example, the at least one second via 743 includes a second through hole 7431 , a second conductive pad 7432 , a second dielectric 7433 , a third pad 7434 and/or a fourth pad ( 7435). According to another embodiment (not shown), at least one of the above-described configurations of the at least one second via 743 may be omitted. For example, the second dielectric 7433 may be omitted from the at least one second via 743 , but the present invention is not limited thereto.

In one example, the second through hole 7431 may be formed through at least one region of the second sidewall 741 . In another example, the second through hole 7431 may be formed in a circular shape, but the shape of the second through hole 7431 is not limited to the circular shape. For example, the second through hole 7431 may be formed in such a way that a partial area of the second sidewall 741 is penetrated through a drill or a partial area of the second sidewall 741 is removed through a laser, The present invention is not limited thereto.

In one example, the second conductive pad 7432 may be disposed to surround the outer peripheral surface of the second through hole 7431 . In another example, the second conductive pad 7432 may be formed of copper foil and/or gold foil by plating the inside of the second through hole 7431 , and the second printed circuit board 730 and the third printed circuit board ( 750) can be electrically connected.

In one example, the second dielectric 7433 may be formed by filling the inside of the second through hole 7431 with a dielectric material (eg, PSR ink), and at least one region of the second dielectric 7433 is a second conductive pad. (7432) may be wrapped. In another example, a third pad 7434 is disposed on one end of the second dielectric 7433 facing the fourth surface 730b of the first printed circuit board 710 (eg, one end in the -z direction in FIG. 15 ). A fourth pad 7435 may be disposed on one end of the second dielectric 7433 facing the fifth surface 750a of the third printed circuit board 750 (eg, one end in the +z direction of FIG. 15 ). have. For example, the third pad 7434 and/or the fourth pad 7435 may be formed of copper, but is not limited thereto.

In one example, solder cream (or “solder paste”) is to be applied between the third pad 7434 and the third solder pad S _{7 of the first printed circuit board 710 .} can As the solder cream applied between the third pad 7434 and the third solder pad S ₇ is soldered, the second interposer 740 is formed on the second surface ( It may be fixed to one area of 710b). In another example, a solder cream may be applied between the fourth pad 7435 and the fourth solder pad S _{8 of the third printed circuit board 750 .} As the solder cream applied between the fourth pad 7435 and the fourth solder pad S ₈ is soldered, the second interposer 740 is formed on the fifth surface 750a of the third printed circuit board 750 . It may be fixed to one area.

In one example, the third solder resist SR ₇ may be disposed in a region excluding the at least one second via 743 on one surface of the second sidewall 741 facing the +z direction. For example, the third solder resist SR ₇ may prevent lead from adhering to a region other than the third pad 7434 of the at least one second via 743 during a soldering process. In another example, the fourth solder resist SR ₈ may be disposed in a region excluding the at least one second via 743 on one surface of the second sidewall 741 facing the -z direction. For example, the fourth solder resist SR ₈ may prevent lead from adhering to a region other than the fourth pad 7435 of the at least one second via 743 during a soldering process.

In one example, in an area other than the first solder pad S ₅ and/or the third solder pad S ₇ of the second surface 710b of the first printed circuit board 710, the 1-1 solder resist layer (SR ₅₁ ) may be deployed. For example, the 1-1 solder resist layer SR ₅₁ is the first solder resist layer of the first printed circuit board 710 excluding the first _{solder pad S 5} and/or the third solder pad S ₇ during the soldering process. It is possible to prevent lead from adhering to one area of the second surface 710b. In another example, the 2-1 th solder resist layer SR ₆₁ may be disposed on the third surface 730a of the second printed circuit board 730 _{except for the second solder pad S 6 .} For example, in the 2-1 solder resist layer SR ₆₁ , lead is applied to one area of the third surface 730a of the second printed circuit board 730 except for the second solder pad S _{6 in the soldering process.} sticking can be prevented. In another example, a 3-1 th solder resist layer SR ₇₁ may be disposed on a _{region excluding the fourth solder pad S 8} of the fifth surface 750a of the third printed circuit board 750 . For example, in the 3-1 solder resist layer SR ₇₁ , lead is applied to one area of the fifth surface 750a of the third printed circuit board 750 except for the fourth solder pad S _{8 in the soldering process.} sticking can be prevented.

In one example, the second side plating member 745 is attached to at least one region of the second sidewall 741 to electrically connect the first printed circuit board 710 and the third printed circuit board 750, or The first printed circuit board 710 and the third printed circuit board 750 may be structurally coupled. For example, the second side plating member 745 may be formed in a “C” shape when viewed from the side, but is not limited thereto. According to an embodiment, the second side plating member 745 in the second interposer 740 may be omitted.

According to another embodiment, the at least one second via 743 of the second interposer 740 is the at least one second via of FIG. 12 (eg, the at least one second via 643 of FIG. 12 ). It may be formed in substantially the same or similar structure to

According to an embodiment, the at least one electrical connection member 760 is disposed on the sixth surface 750b facing the rear case 450 of the third printed circuit board 750 and is patterned on the rear case 450 ( may be in contact with the patterned conductive pattern 460 . In one example, the at least one electrical connection member 760 is a wireless communication circuit ( (not shown) (eg, the wireless communication module 192 of FIG. 1 ) and the conductive pattern 460 operating as an antenna radiator may be electrically connected. For example, the wireless communication circuit may transmit an RF signal to the conductive pattern 460 or receive an RF signal from the conductive pattern 460 through the at least one electrical connection member 760 .

A printed circuit board (eg, the third printed circuit board 750 ) disposed in an area adjacent to the antenna (eg, the conductive pattern 460 ) may be frequently removed for debugging or repair reasons. According to an embodiment, in a structure in which a plurality of printed circuit boards are stacked using an interposer, when the antenna and the adjacent printed circuit board are separated, other printed circuit boards and/or peripheral components may also be separated, so that a specific printed circuit board may be separated. It could be difficult to separate only the circuit board.

The electronic device 300 according to an embodiment includes a fourth pad 7435 and/or a second interposer 740 that connects or fixes the first printed circuit board 710 and the third printed circuit board 750 . The size D ₄ _{of the fourth solder pad S 8} of the third printed circuit board 750 is adjusted to another pad (eg, the first pad 7234 , the second pad 7235 ) and/or the other solder pad ( Example: By forming the first solder pad S ₅ and the second solder pad S ₆ ) smaller than the size D ₃ , the separation of the third printed circuit board 750 may be relatively easy.

In one example, the size of the fourth pad 7435 of the second interposer 740 and/or the fourth solder pad S ₈ of the third printed circuit board 750 is different from that of the pad and/or the other solder pad. As it is formed smaller than the size, the area where the second interposer 740 is soldered to the third printed circuit board 750 is reduced by the first interposer 720 to the first printed circuit board 710 and/or the second printed circuit board 750 . An area soldered to the circuit board 730 and/or an area soldered to the second interposer 740 to the first printed circuit board 710 may be smaller than that of the first printed circuit board 710 . Due to the difference in the above-described soldering area, the coupling between the third printed circuit board 750 and the second interposer 740 is relatively more than the coupling between the second printed circuit board 730 and the first interposer 720 . It may be weak, and thus, when the same heat is applied for separation, the third printed circuit board 750 may be separated relatively quickly and easily compared to the second printed circuit board 730 .

According to an embodiment, the at least one electronic component 770 may be disposed on at least one of the first printed circuit board 710 , the second printed circuit board 730 , and the third printed circuit board 750 . In one example, the at least one electronic component 770 includes a first electronic component 771 , a second electronic component 772 , a third electronic component 773 , a fourth electronic component 774 , and/or a fifth electronic component 771 . component 775 . For example, the first electronic component 771 is disposed on the first surface 710a of the first printed circuit board 710 , and the second electronic component 772 includes the first printed circuit board 710 and the second It may be disposed in a space created by the printed circuit board 730 and/or the first interposer 720 . As another example, the third electronic component 773 may be disposed in a space created by the first printed circuit board 710 , the third printed circuit board 750 , and/or the second interposer 740 . As another example, the fourth electronic component 774 and/or the fifth electronic component 775 may be disposed on the sixth surface 750b of the third printed circuit board 750 . However, in the arrangement structure described above, the first electronic component 771 , the second electronic component 772 , the third electronic component 773 , the fourth electronic component 774 , and/or the fifth electronic component 775 are arranged This is only an example of a structure, and according to an embodiment (not shown), the first electronic component 771 , the second electronic component 772 , the third electronic component 773 , the fourth electronic component 774 and/or The arrangement structure of the fifth electronic component 775 may be changed or an additional electronic component may be disposed. As another example, the first electronic component 771 may be a processor (eg, the processor 120 of FIG. 1 ) for controlling the electronic device, and the second electronic component 772 may be a memory (eg, the memory ( 130)). As another example, the third electronic component 773 mixes a communication signal modulated by the processor with a frequency signal, or transmits a signal from an external electronic device (eg, the

electronic devices

102 and 104 of FIG. 1 ) to a frequency signal. It may be a transceiver that can be modulated separately from . As another example, the fourth electronic component 774 and/or the fifth electronic component 775 may include at least one of at least one sensor (eg, a grip sensor), an amplifier, a switch, and a filter.

According to an embodiment, the shielding structure 780 (or “shield can”) may electromagnetically shield at least one electronic component 770 disposed on the printed circuit board structure 700 . In one example, the shielding structure 780 may block noise generated in the at least one electronic component 770 from leaking to the outside or noise generated from the outside being introduced into the at least one electronic component 770 . For example, the shielding structure 780 is disposed on the first surface 710a of the first printed circuit board 710 to electromagnetically shield the first electronic component 771 disposed on the first printed circuit board 710 . can be shielded with However, the arrangement position of the shielding structure 780 is not limited to the above-described embodiment, and the shielding structure 780 may be disposed on another printed circuit board (eg, the second printed circuit board 730 ) according to the exemplary embodiment. may be

16A is a diagram illustrating a cross-section of an electronic device in a closed state according to another embodiment, and FIG. 16B is a diagram illustrating a cross-section of an electronic device in an open state according to another embodiment. 17 is an exploded view illustrating an electrical connection relationship between a conductive part of a body frame and a printed circuit board structure according to an embodiment, and FIG. 18A is a rear view of the body frame of FIG. 17 , according to an embodiment. It is a perspective view, and FIG. 18B is a view of the body frame of FIG. 17 as viewed from one direction, according to an exemplary embodiment. FIG. 16A is the electronic device 200a of FIG. 2A or the electronic device 200b of FIG. 16B is a cross-sectional view taken along the II-II' direction of the electronic device 200a of FIG. 2B or the electronic device 200b of FIG. 2D . 16A and/or 16B are cross-sectional views in which some components of the electronic device 300 are omitted in order to explain the sliding movement of the display support structure 510 in the closed state and the open state of the electronic device.

16A, 16B, 17, 18A and/or 18B , an electronic device 300 (eg, the electronic device 300 of FIG. 3 ) according to an embodiment includes a display 310 (eg, an electronic device 300 ). : display 310 of FIG. 3 ), a first structure 400 (eg, the first structure 400 of FIG. 3 ), a display support structure 510 (eg, the display support structure 510 of FIGS. 4 and 5 ) )), upper bracket 521 (eg, upper bracket 521 in FIGS. 4 and 5), lower bracket 522 (eg, lower bracket 522 in FIGS. 4 and 5), a plurality of rollers 524 ) (eg, plurality of rollers 524 of FIGS. 4 and 5 ), battery 530 (eg, battery 530 of FIGS. 4 and 5 ) and/or printed circuit board structure 800 (eg, FIG. 4 and the printed circuit board structure 600 of FIG. 5 ).

According to an embodiment, the first structure 400 may include a body frame 410 and/or a rear plate 440 . In one example, the body frame 410 and/or the rear plate 440 of the first structure 400 may form a part of the side surface and the rear surface of the electronic device 300 , and the body frame 410 and the rear plate A space (hereinafter, “internal space”) (eg, the internal space (A) of FIG. 3 ) may be formed in the first structure 400 by 440 . In another example, the body frame 410 may include a support portion 411 overlapping at least one region of the rear plate 440 (eg, the support portion 411 of FIG. 3 ). For example, the support portion 411 of the body frame 410 may include a conductive region 4111 formed of a conductive material (eg, a metal) and/or a non-conductive region 4112 formed of a non-conductive material (eg, a polymer). ) may be included. As another example, the non-conductive region 4112 of the support portion 411 may be disposed adjacent to the conductive portion 4111 of the body frame 410 that forms one side of the electronic device 300 .

Referring to FIGS. 17, 18A and/or 18B , the body frame 410 includes at least a conductive portion 4101 forming at least one side of the electronic device 300 and/or at least insulating the conductive portion 4101 . may include one non-conductive portion 4102 (or “segmental portion”).

Referring to FIG. 18A , the non-conductive portion 4102 according to an embodiment may include a first non-conductive portion 4102a and/or a second non-conductive portion 4102b. For example, the first non-conductive portion 4102a is located at one end of the conductive portion 4101 (eg, one end in the -y direction of FIGS. 17 and 18A ), and the second non-conductive portion 4102b is the conductive portion ( 4101) (eg, one end in the +y direction of FIGS. 17 and 18A ). In one example, as the first non-conductive portion 4102a is disposed on one end of the conductive portion 4101 and the second non-conductive portion 4102b is disposed on the other end of the conductive portion 4101 , the conductive portion 4101 may be insulated.

Referring to FIG. 18B , the non-conductive portion 4102 according to another embodiment may include a third non-conductive portion 4102c, a fourth non-conductive portion 4102d, a fifth non-conductive portion 4102e and/or a sixth non-conductive portion 4102 . may include a malleable portion 4102f. For example, the third non-conductive portion 4102c may be disposed in a region of the conductive portion 4101 parallel to the +y direction or the -y direction so that the conductive portion 4101 may be moved in a horizontal direction (eg, FIG. 18B +y ). direction or -y direction). As another example, the fourth non-conductive portion 4102d , the fifth non-conductive portion 4102e , and/or the sixth non-conductive portion 4102f may have a direction substantially perpendicular to the third non-conductive portion 4102c (eg, conductive 18b in the +z direction or -z direction), the conductive portion 4101 may be segmented in the vertical direction (eg, the +z direction or -z direction of FIG. 18B ). According to another embodiment, the conductive portion 4102 may include the third non-conductive portion 4102c, the fourth non-conductive portion 4102d, the fifth non-conductive portion 4102e and/or the sixth non-conductive portion 4102f described above. ) may be segmented by a plurality of regions, and one region of the segmented conductive portion 4102 may operate as an antenna radiator.

In one example, the conductive portion 4101 is formed to protrude from one region of the conductive portion 4101 in the non-conductive region 4112 direction of the support portion 411 (eg, -x direction in FIGS. 17 and 18 ). It may include a first protrusion 4101a (or “flange”) and/or a second protrusion 4101b. According to one embodiment, the display support structure 510 includes a body frame 410 and/or Alternatively, it may be accommodated in an internal space formed by the rear plate 440 , and the display 310 may be disposed on an outer peripheral surface of the display support structure 510 . In one embodiment, the display support structure 510 includes a plurality of bars 511 (eg, a plurality of bars 511 in FIGS. 4 and 5 ), a first support plate 512 and/or a second support plate ( 513) may be included. In one example, a shape of some regions of the plurality of bars 511 may be deformed while a state (eg, an open state or a closed state) of the electronic device 300 is switched. For example, some regions of the plurality of bars 511 may be bent or unfolded to have a specified curvature while the electronic device 300 is switched from a closed state to an open state or is converted from an open state to a closed state. In another example, the first support plate 512 may be fixed or coupled to one end of the plurality of bars 511 in the upper direction (eg, the +z direction of FIGS. 16A and 16B ), and the first support plate 512 . ) (eg, in the +z direction of FIGS. 16A and 16B ), a portion of the flat area 310a of the display 310 may be disposed. In another example, the second support plate 513 may be fixed or coupled to one end of the plurality of bars 511 in the lower direction (eg, the -z direction of FIGS. 16A and 16B), and the second support plate ( 513), a lower bracket 522 may be disposed on the upper end (eg, in the +z direction of FIGS. 16A and 16B).

In one embodiment, the plurality of rollers 524 are positioned between the upper bracket 521 and the lower bracket 522 , and include a first roller 524a (eg, the first roller 524a in FIG. 4 ) and/or a second roller 524 . It may include a second roller 524b (eg, the second roller 524b of FIG. 4 ) disposed to be spaced apart from the first roller 524a.

In one example, the first roller 524a may contact the plurality of bars 511 of the display support structure 510 through the groove 5211 formed in the upper bracket 521, and By rotation, the display support structure 510 may slide within a specified range. For example, in a process in which the electronic device 300 is switched from a closed state (eg, the electronic device 300 of FIG. 16A ) to an open state (eg, the electronic device 300 of FIG. 16B ), the first roller 524a When is rotated in the clockwise direction, some areas of the bent plurality of bars 511 are spread and the display support structure 510 may slide in the first direction (eg, the +y direction of FIG. 16B ). As another example, when the first roller 524a rotates counterclockwise while the electronic device 300 is switched from an open state to a closed state, some areas of the plurality of spread bars 511 are bent to support the display. The structure 510 may slide in the second direction (eg, the -y direction of FIG. 16A ). In an embodiment, as the shape of some regions of the plurality of bars 511 is changed in the process of changing the state of the electronic device 300 , the rolling area of the display 310 supported by the plurality of bars 511 is changed. The shape of the 310a may also be deformed to correspond to the shape of the plurality of bars 511 .

In another example, the flat area 310a of the display 310 is fixed to one end (eg, one end 525a of FIG. 4 ) to the second roller 524b, and the other end (eg, the other end 525b of the belt of FIG. 4 ) is fixed to the second roller 524b. )) to which the rolling area 310b of the display 310 is fixed (not shown) (eg, the belt 525 of FIG. 4 ) may be coupled. The above-described belt may provide a tension for pulling the display 310 from both ends to the display 310 while moving in response to the rotation of the second roller 524b. Accordingly, the aforementioned belt may serve to maintain the flatness of the display 310 while the electronic device 300 is switched from an open state to a closed state or from a closed state to an open state.

For example, when the electronic device 300 is in a closed state, the rolling region 310b of the display 310 is wound around the plurality of bars 511 in the inner space A of the first structure 400 . may be accommodated, and as a result, the rolling region 310b may not be visually recognized from the outside of the electronic device 300 . As another example, when the electronic device 300 is switched from a closed state to an open state, a region adjacent to the flat region 310a among the rolling regions 310b of the display 310 may be drawn out from the first structure 400 . . As a partial area of the rolling area 310b adjacent to the planar area 310b is drawn out from the first structure 400 , the area of the display 310 that can be viewed from the outside of the electronic device 300 may be expanded. As another example, when the electronic device 300 is switched from an open state to a closed state, a region adjacent to the first structure 400 among the rolling regions 310b viewed from the outside of the electronic device 300 is the first structure ( 400) can be introduced into the interior. As a partial area of the rolling area 310b adjacent to the first structure 400 is drawn into the inside of the first structure 400 , the area of the display 310 that can be viewed from the outside of the electronic device 300 is reduced. can

According to an embodiment, the battery 530 may be positioned between the upper bracket 521 and the lower bracket 522 to supply power to components of the electronic device 300 . In one example, the battery 530 may be disposed in a position relatively adjacent to the first roller 524a compared to the printed circuit board structure 800 , but is not limited thereto.

According to an embodiment, the printed circuit board structure 800 may be disposed between the upper bracket 521 and the lower bracket 522 . For example, the printed circuit board structure 800 may be disposed to be spaced apart from the battery 530 . In one example, the printed circuit board structure 800 may be disposed in a position adjacent to the second roller 524b relative to the battery 530 . In another example, a hole 5221 (eg, the hole 5221 of FIG. 4 ) may be formed in at least one region of the lower bracket 522 overlapping the printed circuit board structure 800 . A part of the printed circuit board structure 800 (eg, the third printed circuit board 550 ) may protrude to the outside of the lower bracket 522 through the aforementioned hole 5221 formed in the lower bracket 522 .

In one embodiment, the printed circuit board structure 800 includes a first printed circuit board 810 , a first interposer 820 , a second printed circuit board 830 , a second interposer 840 and/or a second 3 may include a printed circuit board 850 . The printed circuit board structure 800 may include, for example, a second interposer 840 , a second printed circuit board 830 , and a first interposer along a +z direction with respect to the third printed circuit board 850 . It may refer to a structure in which the 820 and/or the first printed circuit board 810 are sequentially stacked. Although not shown in the drawings, according to another embodiment, the printed circuit board structure 800 includes the printed circuit board structure of FIGS. 14 and/or 15 (eg, the printed circuit board structure 700 of FIGS. 14 and 15 ) and It may be formed in substantially the same or similar structure.

In one example, the first interposer 820 may be disposed between the first printed circuit board 810 and the second printed circuit board 830 . The first printed circuit board 810 may be stacked on the second printed circuit board 830 through the above-described first interposer 820 . In another example, the first interposer 820 has one surface (eg, one surface in the +z direction in FIGS. 16A and 16B ) and a second print of the first interposer 820 facing the first printed circuit board 810 . At least one first via (not shown) passing through one surface facing the circuit board 830 (eg, one surface in the -z direction of FIGS. 16A and 16B ) (eg, at least one first via in FIG. 10A ) vias 623 ). The first printed circuit board 810 may be electrically connected to the second printed circuit board 830 through the above-described at least one first via.

In one example, the second interposer 840 may be disposed between the second printed circuit board 830 and the third printed circuit board 850 . The second printed circuit board 830 may be stacked on the third printed circuit board 850 through the second interposer 840 . In another example, the second interposer 840 includes at least one surface of the second interposer 840 that passes through one side facing the second printed circuit board 830 and the other side facing the third printed circuit board 850 . It may include a second via (not shown) (eg, at least one second via 643 of FIG. 10B or at least one second via 643 of FIG. 12 ). The second printed circuit board 830 may be electrically connected to the third printed circuit board 850 through the above-described at least one second via.

In one example, electronic components for performing various functions (eg, wireless communication) of the electronic device 300 include a first printed circuit board 810 , a second printed circuit board 830 , or a third printed circuit board 850 . ) may be disposed in at least one of. For example, the wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ) may include at least one of the first printed circuit board 810 , the second printed circuit board 830 , or the third printed circuit board 850 . can be placed in In another example, the electronic components disposed on the first printed circuit board 810 , the electronic components disposed on the second printed circuit board 830 , and/or the electronic components disposed on the third printed circuit board 850 are It may be electrically connected through the first interposer 820 and/or the second interposer 840 .

According to an embodiment, the third printed circuit board 850 may be positioned between the rear plate 440 and the second printed circuit board 830 , and at least one surface of the third printed circuit board 850 is a rear plate It may be disposed to face 440 . In one example, at least one surface facing the rear plate 440 of the third printed circuit board 850 (eg, one surface facing the -z direction in FIGS. 16A and 16B ) is a support portion 411 of the body frame 410 . It may be arranged to overlap with at least a part of. For example, at least one surface of the third printed circuit board 850 facing the back plate 440 may overlap a portion of the non-conductive region 4112 and/or the conductive region 4111 of the support portion 411 . have.

According to an embodiment, at least one electrical connection member 860 may be disposed on one surface of the third printed circuit board 850 facing the rear plate 440 , and the at least one electrical connection member 860 is conductive. It may contact the first protrusion 4101a and/or the second protrusion 4101b of the portion 4101 . In one example, the at least one electrical connection member 860 includes a first electrical connection member 860a in contact with the first projection 4101a of the conductive portion 4101 and/or a second projection 4101 of the conductive portion 4101 A second electrical connection member 860b in contact with 4102a may be included.

In one embodiment, the conductive portion 4101 is connected to the first printed circuit board 810 and the second printed circuit board _{at the first point P 1} of the first protrusion 4101a through the first electrical connection member 860a. It may be electrically connected to a wireless communication circuit disposed on at least one of the 830 or the third printed circuit board 850 . In another example, the conductive portion 4101 may be electrically connected to the ground of the third printed circuit board 850 at the _{second point P 2 of the second protrusion 4101b through the second electrical connection member 860b.} have. For example, the conductive portion 4101 may be fed an RF signal of a specified frequency band from the wireless communication circuit at _{the first point P 1} _{, and at the second point P 2} , the third printed circuit board It may be grounded to the ground of 850 . In an embodiment, the conductive portion 4101 may operate as an antenna radiator (eg, an IFA antenna) that transmits and/or receives an RF signal of a specified frequency band through the above-described electrical connection structure. That is, unlike the electronic device of FIGS. 6A and 6B or the electronic device of FIGS. 13A and 13B , the electronic device 300 according to an embodiment has a partial region (eg, a conductive portion 4101) of the first structure 400 . ) can be used as an antenna radiator.

In one example, the at least one electrical connection member 860 may be a C-clip, but is not limited thereto. In another embodiment, the at least one electrical connection member 860 may include at least one of a conductive foam, a conductive sponge, an FPCB, or a conductive screw.

According to an embodiment, the electronic device 300 uses a plurality of printed circuit boards (eg, the first printed circuit board 810 ) through an interposer (eg, the first interposer 820 and the second interposer 840 ). ), a second printed circuit board 830, and a third printed circuit board 850) are stacked using the above-described printed circuit board structure 800 to include a flexible display with a thick slide type electronic device. Antenna contact structure can also be implemented.

An electronic device (eg, the electronic device 200a of FIGS. 2A and 2B and/or the electronic device 200b of FIGS. 2C and 2D ) according to an embodiment of the present disclosure forms a side surface and a rear surface of the electronic device a first structure (eg, the first structure 211 of FIGS. 2A and 2B ) and a second structure (eg, FIG. 2A ) connected to the first structure so as to be slidable within a specified range based on the first structure , a housing (eg, the housing 210 of FIGS. 2A and 2B ) including the second structure 212 of FIG. 2B , disposed in the second structure, wherein at least one region extends through the front surface of the electronic device. A flexible display (eg, the flexible display 220 of FIGS. 2A and 2B ) viewed from the outside of the electronic device, the flexible display, when the electronic device is switched from an open state to a closed state, the first 2 A rolling region introduced into the first structure by sliding of the structure and drawn out from the inside of the first structure by sliding of the second structure when the electronic device is switched from a closed state to an open state region) (eg, rolling region 220b of FIG. 2B ), a printed circuit board structure positioned inside the housing (eg, printed circuit board structure 600 of FIGS. A conductive pattern (eg, the conductive pattern 460 of FIGS. 6A and 6B ) disposed in an area facing the rear surface and a wireless communication circuit electrically connected to the conductive pattern (eg, the wireless communication module 192 of FIG. 1 )) including, wherein the printed circuit board structure includes a first printed circuit board (eg, the first printed circuit board 610 of FIG. 9 ), and a second printed circuit board positioned between the first printed circuit board and the rear surface. (eg, the second printed circuit board 630 of FIG. 9 ), a third printed circuit board (eg, the third printed circuit board of FIG. 9 ) positioned between the second printed circuit board and the rear surface, and including one surface facing the rear surface sign printed circuit board 650), at least one first via positioned between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board ( Example: a first interposer (eg, first interposer 620 of FIG. 9 ) including at least one first via 623 of FIG. 9 , the second printed circuit board and the third printed circuit board A second interposer (eg, at least one second via 643 of FIG. 9 ) positioned between the second and third printed circuit boards and electrically connecting the second and third printed circuit boards. Example: at least one electronic component (eg, at least one of FIG. 9 ) disposed on the second interposer 640 of FIG. 9 , the first printed circuit board, the second printed circuit board, or the third printed circuit board of the electronic component 670) and at least one electrical connection member disposed on the one surface of the third printed circuit board (eg, at least one electrical connection member 660 in FIG. 9), wherein the conductive pattern includes , It faces at least one region of the one surface of the third printed circuit board, and is electrically connected to the wireless communication circuit through the at least one electrical connection member to be fed from the wireless communication circuit.

In an embodiment, the conductive pattern may operate as an antenna radiator that transmits or receives an RF signal of a specified frequency band.

In an embodiment, it is located inside the housing and further includes a rear case (eg, the rear case 450 of FIGS. 6A, 6B, and 9) including one surface facing the rear of the electronic device. and the conductive pattern may be disposed on the one surface of the rear case.

In an embodiment, the at least one first via includes a first through hole (eg, a first through hole 6231 of FIG. 10A ) formed through at least one region of the first interposer, the first A first conductive pad (eg, the first conductive pad 6232 of FIG. 10A ) disposed to surround at least one region of an outer circumferential surface of the through hole, and a first dielectric disposed inside the first through hole (eg, the first conductive pad of FIG. 10A ) 1 dielectric 6233), disposed at one end of the first dielectric facing the first printed circuit board, and a first solder pad of the first printed circuit board (eg, the first solder pad S ₁ of FIG. 10A ) ) to be soldered to a first pad (eg, the first pad 6234 in FIG. 10A ) and one end of the first dielectric facing the second printed circuit board, the second solder pad of the second printed circuit board A second pad (eg, the second pad 6235 of FIG. 10A ) that is soldered to (eg, the second solder pad S _{2 of FIG. 10A ) may be included.}

In an embodiment, the at least one second via includes a second through hole (eg, the second through hole 6431 of FIG. 10B ) formed through at least one region of the second interposer, the second A second conductive pad (eg, the second conductive pad 6432 of FIG. 10B ) disposed to surround at least one region of an outer circumferential surface of the through hole, and a second dielectric disposed inside the second through hole (eg, the second conductive pad of FIG. 10B ) 2 dielectric 6433), disposed at one end of the second dielectric facing the second printed circuit board, and a third solder pad of the second printed circuit board (eg, the third solder pad S ₃ of FIG. 10B ) ) to be soldered to a third pad (eg, the third pad 6434 of FIG. 10B ) and one end of the second dielectric facing the third printed circuit board, and a fourth solder pad of the third printed circuit board A fourth pad (eg, the fourth pad 6435 of FIG. 10B ) that is soldered to (eg, the fourth solder pad S _{3 of FIG. 10B ) may be included.}

In an embodiment, the fourth pad and the fourth solder pad may be formed to have _{a smaller area (eg, D 2 in FIG. 10B ) compared to other pads and other solder pads.}

In an embodiment, the first printed circuit board includes a first fill-cut area (eg, a first fill-cut area of FIG. 11A ) formed in an area overlapping the first via of the first interposer. (F ₁ )), and on one surface of the first printed circuit board facing the first interposer, a first bridge structure (eg, the first bridge structure ( B ₁ )) may be formed.

In an embodiment, the second printed circuit board includes a second fill-cut area (eg, the second fill-cut area F _{2 of FIG. 11B ) formed in an area overlapping the second via of the second interposer.} _{and a second bridge structure (eg, the second bridge structure F 2} of FIG. 11B ) may be formed on one surface of the second printed circuit board facing the second interposer by the second fill cut area. .

In an embodiment, the at least one second via includes a third through hole (eg, the third through hole 6436 of FIG. 12 ) formed along an outer circumferential surface of the second conductive pad, and an outer circumferential surface of the third through hole. A third conductive pad (eg, the third conductive pad 6437 of FIG. 12 ) disposed to surround at least one region of 6438)), a fifth pad (eg, the fifth pad 6439a in FIG. 12 ) disposed at one end of the third conductive pad facing the second printed circuit board, and the third printed circuit of the third conductive pad A sixth pad (eg, the sixth pad 6439b of FIG. 12 ) disposed at one end facing the substrate may be further included.

In an embodiment, the second conductive pad may be electrically connected to the wireless communication circuit, and the third conductive pad may be electrically connected to a ground of the second printed circuit board or a ground of the third printed circuit board. can

In an embodiment, the printed circuit board structure is located on the first printed circuit board and includes a shield structure that electromagnetically shields the at least one electronic component (eg, the shielding structure 680 of FIG. 9 ). ) may be further included.

In an embodiment, the second structure includes a display support structure supporting the flexible display (eg, the display support structure 510 of FIG. 4 ) and a driving assembly for sliding and moving the display support structure within the specified range. and a driver assembly (eg, the driving assembly 520 of FIG. 4 ), and the display support structure may be disposed to surround at least one region of an outer peripheral surface of the driving assembly.

In an embodiment, the display support structure includes a plurality of bars (eg, a plurality of bars 511 in FIG. 4 ) supporting the rolling area of the flexible display, and is located at one end of the plurality of bars. , a first support plate (eg, the first support plate 512 of FIG. 4 ) supporting at least one area of the flexible display and a first support plate positioned at the other end of the plurality of bars to support the remaining area of the flexible display 2 support plates (eg, the second support plate 513 of FIG. 4 ) may be included.

In an embodiment, the driving assembly includes an upper bracket (eg, the upper bracket 521 in FIG. 4 ) for supporting at least one region of the first support plate of the display support structure, and the second portion of the display support structure. A lower bracket (eg, the lower bracket 522 of FIG. 4 ) for supporting at least one region of the support plate, a second bracket that forms at least one region of a side surface of the driving assembly and is coupled to at least one region of the first support plate 1 guide groove (eg, the first guide groove 523a of FIG. 5 ) and a second guide groove coupled to at least one region of the second support plate (eg, the second guide groove 523b of FIG. 5 ) a plurality of frames (eg, the frame 523 of FIGS. 4 and 5 ), the upper bracket, the lower bracket, and a plurality of pieces disposed in an internal space formed by the at least one frame to slide the display support structure A roller (eg, a plurality of rollers 524 of FIG. 4 ) and the plurality of rollers are wound and rotated, and one end (eg, one end 525a of FIG. 4 ) is connected to one area of the flexible display, and the other end (eg, one end 525a of FIG. 4 ) : The other end 525b of FIG. 4 ) may include a belt (eg, the belt 525 of FIG. 4 ) connected to another region of the flexible display.

In one embodiment, the printed circuit board structure is disposed in the inner space, and a hole (eg, hole 5221 in FIG. 4 ) is formed in at least one region overlapping the printed circuit board structure of the lower bracket, At least one region of the printed circuit board structure may be exposed to the outside of the driving assembly through the hole.

In one embodiment, it may further include a battery (eg, the battery 530 of FIGS. 6A and 6B ) disposed in the inner space and disposed adjacent to the printed circuit board structure.

An electronic device (eg, the electronic device 300 of FIGS. 13A and 13B ) according to another embodiment of the present disclosure includes a first structure (eg, the first structure of FIGS. 2A and 2B ) forming side surfaces and rear surfaces of the electronic device. 1 structure 211) and a second structure (eg, the second structure 212 of FIGS. 2A and 2B) connected to the first structure to be slidable within a specified range based on the first structure. A housing (eg, the housing 210 of FIGS. 2A and 2B ), a flexible display that is disposed on the second structure and shows at least one area to the outside of the electronic device through the front surface of the electronic device ( Example: the flexible display 220 of FIGS. 2A and 2B ), the flexible display is introduced into the first structure by sliding of the second structure when the electronic device is switched from an open state to a closed state , a rolling region drawn out from the inside of the first structure by sliding of the second structure when the electronic device is switched from the closed state to the open state (eg, rolling region 220b in FIG. 2B ) including, a printed circuit board structure (eg, the printed circuit board structure 700 of FIGS. 13A and 13B ) located inside the housing, and a conductive pattern (eg: 13A, 13B, and 15) and a wireless communication circuit electrically connected to the conductive pattern (eg, the wireless communication module 192 of FIG. 1), the printed circuit board structure comprising: A first printed circuit board (eg, the first printed circuit board 710 of FIG. 15 ), and a second printed circuit board (eg, the second printed circuit board of FIG. 15 ) positioned between the first printed circuit board and the rear surface of the electronic device A printed circuit board 730), a third phosphor including one surface facing the rear surface, and disposed to be spaced apart from the second printed circuit board between the first printed circuit board and the rear surface of the electronic device A printed circuit board (eg, the third printed circuit board 750 of FIG. 15 ) is positioned between the first printed circuit board and the second printed circuit board, the first printed circuit board and the second printed circuit board A first interposer (eg, first interposer 720 of FIG. 15 ) including a first via (eg, at least one first via 723 of FIG. 15 ) for electrically connecting and the first print A second via (eg, at least one second via 743 of FIG. 15 ) positioned between the circuit board and the third printed circuit board and electrically connecting the first printed circuit board and the third printed circuit board ) including a second interposer (eg, the second interposer 740 of FIG. 15 ), the at least one disposed on the first printed circuit board, the second printed circuit board, or the third printed circuit board One electronic component (eg, at least one electronic component 770 of FIG. 15 ) and at least one electrical connection member disposed on the one surface of the third printed circuit board (eg, the electrical connection member 760 of FIG. 15 ) ), wherein the conductive pattern faces at least one region of the one surface of the third printed circuit board and is electrically connected to the wireless communication circuit through the at least one electrical connection member, the wireless communication circuit and can transmit or receive RF signals in the specified frequency band.

In an embodiment, the at least one first via includes a first through hole (eg, the first through hole 7231 of FIG. 15 ) formed through at least one region of the first interposer, the first A first conductive pad (eg, the first conductive pad 7232 of FIG. 15 ) disposed to surround at least one region of an outer circumferential surface of the through hole, and a first dielectric disposed inside the first through hole (eg, the first conductive pad of FIG. 15 ) 1 dielectric 7233), disposed at one end of the first dielectric facing the first printed circuit board, and a first solder pad of the first printed circuit board (eg, the first solder pad S _{5 in} FIG. 15 ) ) to be soldered to a first pad (eg, the first pad 7234 of FIG. 15 ) and one end of the first dielectric facing the second printed circuit board, the second solder pad of the second printed circuit board A second pad (eg, the second pad 7235 of FIG. 15 ) that is soldered to (eg, the second solder pad S _{6 of FIG. 15 ) may be included.}

In an embodiment, the at least one second via includes a second through hole (eg, the second through hole 7431 of FIG. 15 ) formed through at least one region of the second interposer, the second A second conductive pad (eg, the second conductive pad 7432 of FIG. 15 ) disposed to surround at least one region of an outer circumferential surface of the through hole, and a second dielectric disposed inside the second through hole (eg, as shown in FIG. 15 ) A second dielectric 7433 ) is disposed at one end of the second dielectric facing the first printed circuit board, and a third solder pad of the first printed circuit board (eg, the third solder pad S _{7 of FIG. 15 )} )) to be soldered to a third pad (eg, the third pad 7434 in FIG. 15 ) and one end of the second dielectric facing the third printed circuit board, and the fourth solder of the third printed circuit board A fourth pad (eg, the fourth pad 7435 of FIG. 15 ) that is soldered to the pad (eg, the fourth solder pad S _{8 of FIG. 15 ) may be included.}

An electronic device according to another embodiment of the present disclosure includes a first structure (eg, the first structure 211 of FIGS. 2A and 2B ) forming side surfaces and a rear surface of the electronic device and the first structure based on the first structure. A housing (eg, the housing 210 of FIGS. 2A and 2B ) including a second structure (eg, the second structure 212 of FIGS. 2A and 2B ) connected to the first structure to be slidable within a specified range. ), the first structure includes a conductive portion (eg, conductive portion 4101 in FIG. 17 ), a first non-conductive portion disposed at one end of the conductive portion (eg, first non-conductive portion 4102a in FIG. 17 ) and a second non-conductive portion (eg, the second non-conductive portion 4102b of FIG. 17 ) disposed at the other end of the conductive portion, disposed in the second structure, at least one way through the front surface of the electronic device A flexible display (eg, the flexible display 220 of FIGS. 2A and 2B ) in which an area is viewed outside of the electronic device, the flexible display, when the electronic device is switched from an open state to a closed state , Rolling that is drawn into the inside of the first structure by sliding of the second structure, and is drawn out from the inside of the first structure by sliding of the second structure when the electronic device is switched from a closed state to an open state a rolling region (eg, rolling region 220b of FIG. 2B ), a printed circuit board structure positioned within the housing, and a wireless communication circuit, wherein the printed circuit board structure (eg, FIG. 16A , of the printed circuit board structure 800 of FIG. 16B ), a first printed circuit board (eg, the first printed circuit board 810 of FIG. 17 ), a second printed circuit board positioned between the first printed circuit board and the rear surface. A printed circuit board (eg, the second printed circuit board 830 of FIG. 17 ), a third printed circuit board (eg, FIG. 17 of at least one printed circuit board 850), located between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board A first interposer including a first via (eg, the first interposer 820 of FIG. 17 ) is positioned between the second printed circuit board and the third printed circuit board, and the second printed circuit board and the a second interposer (eg, the second interposer 840 of FIG. 17 ) including at least a second via electrically connecting a third printed circuit board, the first printed circuit board, the second printed circuit board, or At least one electronic component disposed on the third printed circuit board and an electrical connection member disposed on the one surface of the third printed circuit board (eg, at least one electrical connection member 860 of FIG. 17 ); The conductive portion of the first structure is electrically connected _{to the wireless communication circuit at a first point (eg, a first point P 1 in} FIG. 17 ) through the electrical connection member, and is electrically connected to the wireless communication circuit through the electrical connection member It may be electrically connected to the ground of the third printed circuit board at a second point (eg, the second point P _{2 of FIG. 17 ).}

In the specific embodiments of the present disclosure described above, elements included in the disclosure are expressed in the singular or plural according to the specific embodiments presented. However, the singular or plural expression is appropriately selected for the context presented for convenience of description, and the present disclosure is not limited to the singular or plural component, and even if the component is expressed in plural, it is composed of the singular or singular. Even an expressed component may be composed of a plurality of components.

Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments and should be defined by the claims described below as well as the claims and equivalents.

Claims

In an electronic device,

a housing including a first structure forming side surfaces and a rear surface of the electronic device and a second structure connected to the first structure to be slidable within a specified range based on the first structure;

A flexible display that is disposed on the second structure and shows at least one region to the outside of the electronic device through a front surface of the electronic device, wherein the flexible display is switched from an open state to a closed state of the electronic device when the second structure slides into the first structure, and when the electronic device is switched from a closed state to an open state, it is drawn out from the inside of the first structure by sliding of the second structure. includes a rolling region that becomes;

a printed circuit board structure located inside the housing;

a conductive pattern disposed in a region facing the rear surface of the housing; and

Including; a wireless communication circuit electrically connected to the conductive pattern;

The printed circuit board structure comprises:

a first printed circuit board;

a second printed circuit board positioned between the first printed circuit board and the rear surface;

a third printed circuit board positioned between the second printed circuit board and the rear surface and including one surface facing the rear surface;

a first interposer positioned between the first printed circuit board and the second printed circuit board, the first interposer including at least one first via electrically connecting the first printed circuit board and the second printed circuit board;

a second interposer positioned between the second printed circuit board and the third printed circuit board, the second interposer including at least one second via electrically connecting the second printed circuit board and the third printed circuit board;

at least one electronic component disposed on the first printed circuit board, the second printed circuit board, or the third printed circuit board; and

at least one electrical connection member disposed on the one surface of the third printed circuit board;

The conductive pattern is

facing at least one region of the one surface of the third printed circuit board;

An electronic device electrically connected to the wireless communication circuit through the at least one electrical connection member to be fed from the wireless communication circuit.
The method according to claim 1,

The conductive pattern operates as an antenna radiator that transmits or receives an RF signal of a specified frequency band.
The method according to claim 1,

It is located inside the housing and includes a rear case (rear case) including one surface facing the rear surface of the electronic device;

The conductive pattern is disposed on the one surface of the rear case, the electronic device.
The method according to claim 1,

the at least one first via,

a first through hole formed through at least one region of the first interposer;

a first conductive pad disposed to surround at least one region of an outer peripheral surface of the first through hole;

a first dielectric disposed inside the first through hole;

a first pad disposed at one end of the first dielectric facing the first printed circuit board and soldered to the first solder pad of the first printed circuit board; and

and a second pad disposed at one end of the first dielectric facing the second printed circuit board and soldered to a second solder pad of the second printed circuit board.
5. The method according to claim 4,

the at least one second via,

a second through hole formed through at least one region of the second interposer;

a second conductive pad disposed to surround at least one region of an outer peripheral surface of the second through hole;

a second dielectric disposed inside the second through hole;

a third pad disposed at one end of the second dielectric facing the second printed circuit board and soldered to a third solder pad of the second printed circuit board; and

and a fourth pad disposed at one end of the second dielectric facing the third printed circuit board and soldered to a fourth solder pad of the third printed circuit board.
6. The method of claim 5,

and the fourth pad and the fourth solder pad are formed to have a smaller area than other pads and other solder pads.
The method according to claim 1,

the first printed circuit board includes a first fill-cut area formed in an area overlapping the first via of the first interposer;

A first bridge structure is formed by the first peel-cut region on one surface of the first printed circuit board facing the first interposer.
The method according to claim 1,

the second printed circuit board includes a second fill-cut region formed in a region overlapping the second via of the second interposer;

A second bridge structure is formed by the second fill cut region on one surface of the second printed circuit board facing the second interposer.
6. The method of claim 5,

the at least one second via,

a third through hole formed along an outer circumferential surface of the second conductive pad;

a third conductive pad disposed to surround at least one region of an outer peripheral surface of the third through hole;

a third dielectric disposed inside the third through hole;

a fifth pad disposed in an area of the third conductive pad facing the second printed circuit board; and

The electronic device of claim 1, further comprising: a sixth pad disposed in an area of the third conductive pad facing the third printed circuit board.
10. The method of claim 9,

The second conductive pad is electrically connected to the wireless communication circuit,

The third conductive pad is electrically connected to a ground of the second printed circuit board or a ground of the third printed circuit board.
The method according to claim 1,

The printed circuit board structure comprises:

The electronic device of claim 1, further comprising: a shield structure disposed on the first printed circuit board and configured to electromagnetically shield the at least one electronic component.
The method according to claim 1,

The second structure is

a display support structure supporting the flexible display; and

and a driver assembly for slidingly moving the display support structure within the specified range.

The display supporting structure is disposed to surround at least one area of an outer circumferential surface of the driving assembly.
13. The method of claim 12,

The display support structure,

a plurality of bars supporting the rolling area of the flexible display;

a first support plate positioned at one end of the plurality of bars to support at least one area of the flexible display; and

and a second support plate positioned at the other end of the plurality of bars to support the remaining area of the flexible display.
14. The method of claim 13,

the drive assembly,

an upper bracket supporting at least one region of the first supporting plate of the display supporting structure;

a lower bracket supporting at least one region of the second support plate of the display support structure;

A frame that forms at least one area of a side surface of the driving assembly and includes a first guide groove coupled to at least one area of the first support plate and a second guide groove coupled to at least one area of the second support plate ;

a plurality of rollers disposed in the inner space formed by the upper bracket, the lower bracket and the frame to slide the display support structure; and

and a belt wound around the plurality of rollers and rotating, one end connected to one area of the flexible display and the other end connected to another area of the flexible display.
15. The method of claim 14,

The printed circuit board structure is disposed in the inner space,

A hole is formed in at least one region overlapping the printed circuit board structure of the lower bracket,

At least one region of the printed circuit board structure is exposed to the outside of the driving assembly through the hole.