WO2021230657A1 - Capteur d'empreintes digitales et dispositif électronique comprenant un capteur d'empreintes digitales - Google Patents

Capteur d'empreintes digitales et dispositif électronique comprenant un capteur d'empreintes digitales Download PDF

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Publication number
WO2021230657A1
WO2021230657A1 PCT/KR2021/005953 KR2021005953W WO2021230657A1 WO 2021230657 A1 WO2021230657 A1 WO 2021230657A1 KR 2021005953 W KR2021005953 W KR 2021005953W WO 2021230657 A1 WO2021230657 A1 WO 2021230657A1
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WIPO (PCT)
Prior art keywords
fingerprint sensor
conductive pattern
circuit board
electronic device
digitizer
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PCT/KR2021/005953
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English (en)
Korean (ko)
Inventor
허지훈
김현우
박지훈
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021230657A1 publication Critical patent/WO2021230657A1/fr
Priority to US17/984,784 priority Critical patent/US11908230B2/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14678—Contact-type imagers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0441—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using active external devices, e.g. active pens, for receiving changes in electrical potential transmitted by the digitiser, e.g. tablet driving signals
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/046—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by electromagnetic means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds

Definitions

  • Embodiments disclosed in this document relate to a fingerprint sensor and an electronic device including the fingerprint sensor.
  • FoD Fingerprint on Display
  • the representative FoD methods are the ultrasonic method, which detects the minute air gap between the finger and the sensor contact surface, and the optical method, which obtains a fingerprint image reflected by light and compares it with the fingerprint information.
  • a hole in a plurality of layers eg, an emboss layer, a sponge layer, an adhesive layer, a shielding layer, and/or a digitizer
  • a plurality of layers eg, an emboss layer, a sponge layer, an adhesive layer, a shielding layer, and/or a digitizer
  • a hole is drilled in a plurality of layers (eg, an emboss layer, a sponge layer, an adhesive layer, a shielding layer, and/or a digitizer) of the back side of the display.
  • a plurality of layers eg, an emboss layer, a sponge layer, an adhesive layer, a shielding layer, and/or a digitizer.
  • the recognition performance of an input device may deteriorate in the hole.
  • An electronic device includes a display device, a battery, a digitizer positioned between the display device and the battery and including a first circuit board, and a fingerprint sensor including a second circuit board and a third circuit board and a processor electrically connected to the display device, the digitizer, and the fingerprint sensor, wherein the first circuit board includes a first conductive pattern for recognizing an input device, and the second circuit board includes the input device.
  • the first circuit board includes a first conductive pattern for recognizing an input device
  • the second circuit board includes the input device.
  • the third circuit board may include a third conductive pattern for recognizing a fingerprint
  • the first conductive pattern and the second conductive pattern may be electrically connected to each other.
  • a fingerprint sensor includes a photo sensor, a first circuit board, and a second circuit board, wherein the first circuit board includes a first conductive pattern for recognizing an input device, and The second circuit board may include a second conductive pattern for recognizing a fingerprint.
  • An electronic device includes a fingerprint sensor including a display device, a battery, a heat dissipation layer disposed between the display device and the battery, a circuit board, and electrically connected to the display device and the fingerprint sensor a processor, wherein the circuit board includes a conductive pattern for recognizing a fingerprint, the circuit board includes an opening exposing at least a portion of a metal layer included in the circuit board, and the metal layer exposed through the opening may be electrically connected to the heat dissipation layer.
  • An electronic device includes a display device, a battery, a digitizer positioned between the display device and the battery and including a first circuit board and a second circuit board, a fingerprint sensor including a photosensor, and a processor electrically connected to the display device, the digitizer, and the fingerprint sensor, the first circuit board includes a first conductive pattern for recognizing an input device, and the second circuit board for recognizing a fingerprint It includes a second conductive pattern, and the second conductive pattern and the photosensor may be electrically connected to each other.
  • a fingerprint sensor capable of embedding a fingerprint sensor in a rear surface of a display without affecting digitizer performance, and an electronic device including the fingerprint sensor.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.
  • FIG. 2 is a cross-sectional view of an electronic device, illustrating a part of a stacked structure of the electronic device according to an embodiment disclosed in this document.
  • FIG. 3 is a diagram schematically illustrating a fingerprint sensor of the electronic device of FIG. 2 .
  • 4A, 4B, and 5 are diagrams schematically illustrating a method of manufacturing a fingerprint sensor included in an electronic device according to an embodiment of the present disclosure.
  • FIG. 6 is a diagram for explaining a method of electrically connecting a fingerprint sensor to a digitizer of an electronic device according to an embodiment of the present disclosure.
  • FIGS. 7A, 7B, 8 and 9 are diagrams schematically illustrating a method of manufacturing a fingerprint sensor included in an electronic device according to an exemplary embodiment of the present disclosure.
  • FIG. 10 is a diagram schematically illustrating a fingerprint sensor included in an electronic device according to an embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of an electronic device illustrating a part of a stacked structure of the electronic device according to an embodiment of the present disclosure.
  • FIG. 12 is a cross-sectional view of an electronic device illustrating a part of a stacked structure of the electronic device according to an embodiment of the present disclosure.
  • FIG. 13 is a diagram schematically illustrating a digitizer included in an electronic device according to an embodiment of the present disclosure.
  • FIG. 14 is a cross-sectional view illustrating the digitizer of FIG. 13 taken along line I-I'.
  • 15 is a diagram schematically illustrating a digitizer included in an electronic device according to an embodiment of the present disclosure.
  • 16 is a cross-sectional view schematically illustrating a state in which a sensing unit is attached to a digitizer included in an electronic device according to an embodiment of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199
  • the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176 , interface 177 , haptic module 179 , camera module 180 , power management module 188 , battery 189 , communication module 190 , subscriber identification module 196 , or antenna module 197 . ) may be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the processor 120 executes software (eg, the program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the volatile memory 132 may be loaded into the volatile memory 132 , process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg, a graphic processing unit, an image signal processor) that can operate independently or together with the main processor 121 . , a sensor hub processor, or a communication processor). Additionally or alternatively, the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, an image signal processor
  • the auxiliary processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function.
  • the auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
  • the secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the coprocessor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display device 160 may visually provide information to the outside (eg, a user) of the electronic device 101 .
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch circuitry configured to sense a touch or a sensor circuit (eg, a pressure sensor) configured to measure the intensity of a force generated by the touch. have.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) connected directly or wirelessly with the electronic device 101 .
  • the electronic device 102) eg, a speaker or headphones
  • the electronic device 102 may output a sound.
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used for the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : It may include a local area network (LAN) communication module, or a power line communication module.
  • the corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (eg, a cellular network, the Internet, Alternatively, it may communicate with the external electronic device 104 through a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a computer network eg, a telecommunication network such as a LAN or WAN.
  • These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other.
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified and authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, RFIC
  • other than the radiator may be additionally formed as a part of the antenna module 197 .
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 and 104 may be the same as or different from the electronic device 101 .
  • all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • the one or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • a or B “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “A,
  • Each of the phrases “at least one of B, or C” may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases.
  • Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other components in question, and may refer to components in other aspects (e.g., importance or order) is not limited.
  • one (eg first) component is “coupled” or “connected” to another (eg, second) component with or without the terms “functionally” or “communicatively”
  • one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101).
  • a machine eg, electronic device 101
  • the processor eg, the processor 120
  • the device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory storage medium' is a tangible device and only means that it does not contain a signal (eg, electromagnetic wave). It does not distinguish the case where it is stored as
  • the 'non-transitory storage medium' may include a buffer in which data is temporarily stored.
  • the method according to various embodiments disclosed in this document may be provided in a computer program product (computer program product).
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play StoreTM) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones).
  • a portion of a computer program product eg, a downloadable app
  • a machine-readable storage medium such as a memory of a manufacturer's server, a server of an application store, or a relay server. It may be temporarily stored or temporarily created.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. , or one or more other operations may be added.
  • FIG. 2 is a cross-sectional view of the electronic device 200 illustrating a part of the stacked structure of the electronic device according to an embodiment disclosed in this document.
  • the electronic device 200 (eg, the electronic device 101 of FIG. 1 ) includes a display device 201 (eg, the display device 160 of FIG. 1 ), a protective layer 202 , and a digitizer ( digitizer) 203 , a fingerprint sensor 300 , a heat dissipation layer 205 , and a battery 206 (eg, the battery 189 of FIG. 1 ).
  • a plurality of wires and a plurality of pixels may be disposed on the display device 201 .
  • a plurality of gate lines and a plurality of data lines may be disposed on the display device 160 , and the gate lines and the data lines may cross each other.
  • the pixels may emit light based on signals supplied from the gate lines and the data lines.
  • the battery 206 may supply power to at least one component of the electronic device 200 .
  • the battery 206 may include at least one of a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • a digitizer 203 may be positioned between the display device 201 and the battery 206 .
  • the digitizer 203 may be a panel for detecting an input of an input device (not shown).
  • the digitizer 203 may include a first flexible printed circuit board 203 - 1 (FPCB, flexible printed circuit board) and a shielding sheet 203 - 2 .
  • the first flexible printed circuit board 203 - 1 may be a sheet (eg, a WACOM sheet) for recognizing an electrical signal generated by a user input device such as a stylus pen.
  • the shielding sheet 203 - 2 may prevent interference between the components by an electromagnetic field generated from the components (eg, a display device module, a printed circuit board, and an electromagnetic induction panel) included in the electronic device 200 . .
  • the shielding sheet 203 - 2 blocks electromagnetic fields generated from the components, so that an input signal from an input device can be accurately transmitted to the digitizer 203 .
  • the shielding sheet 203 - 2 may be a magnetic metal powder (MMP) sheet, a copper sheet (Cu sheet), or a metal plate (SUS).
  • a flexible printed circuit board disclosed in this document may be a printed circuit board (PCB).
  • the digitizer 203 may include a first printed circuit board 203 - 1 (PCB, printed circuit board) and a shielding sheet 203 - 2 .
  • a printed circuit board may be used synonymously with a circuit board.
  • the first printed circuit board, the second printed circuit board, and the third printed circuit board may be referred to as a first circuit board, a second circuit board, and a third circuit board, respectively.
  • the digitizer 203 may identify various pieces of information including coordinates corresponding to the position of the input device (not shown), the tilt of the input device, or pressure.
  • the digitizer 203 may receive an electromagnetic signal using the first conductive pattern included in the first FPCB 203 - 1 .
  • the electromagnetic signal may refer to an electromagnetic signal output from an input device.
  • the digitizer 203 may identify various information including a tilt of the input device, a pressure, or a position on the display 201 based on an electromagnetic signal output from the input device.
  • the first conductive pattern of the digitizer 203 may form a corresponding current (or voltage) according to a change in the strength of a magnetic field generated by an electromagnetic signal transmitted from an input device.
  • the first conductive pattern may be formed of a plurality of conductive layers.
  • the first conductive pattern may include a plurality of second conductive lines disposed perpendicular to the plurality of first conductive lines.
  • an input device may refer to a device that can be used to input information into an electronic device.
  • a separate resonance circuit may be built in the input device to interwork with the digitizer 203 included in the electronic device 200 .
  • the input device may include at least one of an electro-magnetic resonance (EMR) method, an active electrical stylus (AES) method, and an electric coupled resonance (ECR) method.
  • EMR electro-magnetic resonance
  • AES active electrical stylus
  • ECR electric coupled resonance
  • the digitizer 203 may detect the position of the image of the display device 201 of the input device by using a method of detecting an electromagnetic signal generated from the input device by the digitizer 203 .
  • the input device may receive the electromagnetic signal generated by the digitizer 203 , transform the received electromagnetic signal, and output it again. At this time, the digitizer 203 may sense the position on the display of the input device by receiving the modified electromagnetic signal.
  • the input device may be in the form of a digital pen, and may include an electrode in a pen tip.
  • the electronic device 200 may sense the input position based on a change in capacitance inside the touch panel due to an approach of an electrode positioned on the pen tip of the input device.
  • the input device may be inserted or detached by being guided into or detached from the housing through a hole formed in a side surface of the housing of the electronic device 200 , and may include a button for facilitating detachment.
  • the input device may be used separately from the electronic device 200 .
  • the input device may be attached to the outside of the electronic device 200 .
  • a first hole 204 may be located in the digitizer 203 at a position corresponding to the fingerprint sensor 300 . Since the first conductive pattern cannot be located in the region where the first hole 204 is located, the first conductive pattern of the digitizer 203 may be disposed avoiding the first hole 204 .
  • a passivation layer 202 may be positioned between the display device 201 and the digitizer 203 .
  • the protective layer 202 includes at least one of a buffer layer (eg, a cushion layer or a sponge layer) for absorbing an impact, or a light blocking layer (eg, a light blocking member layer of a black sheet or black printed layer) for blocking light can do.
  • the protective layer 202 may protect other components inside the electronic device 200 by absorbing an external impact.
  • the protective layer 202 may be configured as an integral body by integrating a buffer layer and a light blocking layer, or may be in a form in which a plurality of layers formed for each component are stacked.
  • the second hole 207 may be positioned at a position corresponding to the first hole 204 of the digitizer 203 .
  • a heat dissipation layer 205 may be positioned between the display device 201 and the battery 206 .
  • the heat dissipation layer 205 may include a component (eg, a copper layer) that performs a heat dissipation function.
  • the fingerprint sensor 300 may be positioned to correspond to the first hole 204 of the digitizer 203 . According to an embodiment, the fingerprint sensor 300 acquires fingerprint information input to the display device 201 through the second hole 207 of the protective layer 202 and the first hole 204 of the digitizer 203 . can do. According to an embodiment, the fingerprint sensor 300 may be an optical, capacitive, or ultrasonic fingerprint sensor. According to an embodiment, when the fingerprint sensor 300 is an optical fingerprint sensor, the fingerprint sensor 300 captures a fingerprint image of the surface of a finger using a photosensitive diode or acquires a fingerprint by the difference in light reflectance between the ridges and valleys of the fingerprint.
  • the fingerprint sensor 300 when the fingerprint sensor 300 is a capacitive fingerprint sensor, the fingerprint sensor 300 detects a fingerprint using a difference in capacitance between a portion where the fingerprint touches the electrode (floor) and a portion where it does not (valley). can be obtained According to an embodiment, when the fingerprint sensor 300 is an ultrasonic fingerprint sensor, the fingerprint sensor 300 may generate an ultrasonic wave using a piezo, and obtain a fingerprint by using the ultrasonic reflectance of valleys and Jungle of the fingerprint.
  • the fingerprint sensor 300 is an optical fingerprint sensor according to an exemplary embodiment.
  • the electronic device 200 may increase the brightness of pixels disposed on the display device 201 .
  • Light emitted from the pixel may be reflected from the finger and input to the fingerprint sensor 300 through the first hole 204 and the second hole 207 .
  • the fingerprint sensor 300 may acquire fingerprint information of a finger based on the input light.
  • the fingerprint sensor 300 may include a second FPCB 302 for the digitizer 203 and a third FPCB 303 for the fingerprint sensor 300 .
  • the second FPCB 302 may include a second conductive pattern for the digitizer 203 .
  • the third FPCB 303 may include a third conductive pattern for the fingerprint sensor 300 .
  • the second conductive pattern included in the fingerprint sensor 300 may be electrically connected to the first conductive pattern included in the digitizer 203 .
  • the second conductive pattern may form a corresponding current (or voltage) according to a change in the strength of a magnetic field generated by an electromagnetic signal transmitted from an input device.
  • the digitizer 203 may detect a position on the display of the input device by detecting a change in the strength of the magnetic field formed by the second conductive pattern.
  • the second conductive pattern may be positioned to correspond to the first hole 204 of the digitizer 203 .
  • the digitizer 203 may detect an input device located in an area on the display device 201 corresponding to the first hole 204 of the digitizer 203 using the second conductive pattern of the fingerprint sensor 300 . can That is, the second conductive pattern of the fingerprint sensor 300 may prevent performance degradation of the digitizer 203 due to the absence of the first conductive pattern in the first hole 204 .
  • the second conductive pattern may be formed of a plurality of conductive layers.
  • the second conductive pattern may include a plurality of fourth conductive lines disposed perpendicular to the plurality of third conductive lines.
  • An electronic device uses a second conductive pattern for a digitizer included in a fingerprint sensor to improve input device sensing performance of a digitizer, and provides an air gap greater than a predetermined value between a fingerprint sensor and a display device. gap) and maintaining an air gap greater than or equal to a certain value between the fingerprint sensor and the battery, and the fingerprint sensor can be mounted on the electronic device, thereby maintaining the performance of the fingerprint sensor.
  • FIG. 3 is a diagram schematically illustrating the fingerprint sensor 300 of the electronic device 200 of FIG. 2 .
  • the same components as those of the above-described embodiment may be referred to by the same reference numerals, and a description thereof may be omitted.
  • the fingerprint sensor 300 includes a sensing unit 301 , a second FPCB 302 for a digitizer (eg, the digitizer 203 of FIG. 2 ), and a third FPCB 303 for the fingerprint sensor.
  • a sensing unit 301 the sensing unit 301
  • a second FPCB 302 for a digitizer eg, the digitizer 203 of FIG. 2
  • a third FPCB 303 for the fingerprint sensor may include
  • the sensing unit 301 may include a photo sensor, and may acquire fingerprint information input on a display device (eg, the display device 201 of FIG. 2 ).
  • a display device eg, the display device 201 of FIG. 2
  • the fingerprint sensor 300 is an optical fingerprint sensor
  • the electronic device eg, the electronic device 200
  • the sensing unit 301 may acquire fingerprint information of the finger by detecting light emitted from the pixel and reflected from the finger and input to the sensing unit 301 .
  • the second FPCB 302 for the digitizer may include a second conductive pattern for the digitizer.
  • the second conductive pattern included in the fingerprint sensor 300 may be electrically connected to the first conductive pattern of a digitizer (eg, the digitizer 203 of FIG. 2 ).
  • the second conductive pattern may form a corresponding current (or voltage) according to a change in the strength of a magnetic field generated by an electromagnetic signal transmitted from an input device, and the digitizer may detect a position on the display of the input device by detecting a change in the strength of the magnetic field formed by the second conductive pattern.
  • the third FPCB 303 for the fingerprint sensor may include a third conductive pattern for the fingerprint sensor 300 .
  • the third conductive pattern may convert light input through the sensing unit 301 into a current (or voltage) signal and/or transmit it to a processor (eg, the processor 120 of FIG. 1 ).
  • the sensing unit 301 and the second FPCB 302 may be attached to each other with an adhesive 304 , and the sensing unit 301 and the third FPCB 303 may be bonded with a wire 305 .
  • a resin 306 for protecting the wire 305 may be positioned in the wire 305 portion.
  • FIGS. 3, 4A, 4B and 5 a method of manufacturing a fingerprint sensor included in an electronic device according to an embodiment of the present disclosure will be described with reference to FIGS. 3, 4A, 4B and 5 .
  • the same components as those of the above-described embodiment may be referred to by the same reference numerals, and a description thereof may be omitted.
  • 4A, 4B, and 5 are diagrams schematically illustrating a method of manufacturing a fingerprint sensor included in an electronic device according to an embodiment of the present disclosure.
  • a cross-sectional view 410 of FIG. 4A may represent a cross-sectional view of a component for manufacturing a fingerprint sensor (eg, the fingerprint sensor 300 of FIG. 2 ).
  • the part for manufacturing the fingerprint sensor is on the second FPCB 302 for the digitizer (eg, the digitizer 203 of FIG. 2 ) of the electronic device (eg, the electronic device 200 of FIG. 2 ) on the fingerprint sensor (eg: It may have a structure in which the third FPCB 303 for the fingerprint sensor 300 of FIG. 2 is disposed.
  • a plan view 420 of FIG. 4B may represent a plan view looking down the component for manufacturing the fingerprint sensor of FIG. 4A in the -y-axis direction.
  • the third FPCB 303 may have a structure including a third hole 421 . Descriptions of the second FPCB 302 for the digitizer and the third FPCB 303 for the fingerprint sensor are the same as those described above with reference to FIGS. 2 and 3, and thus will be omitted.
  • the sensing unit 301 may be attached to the second FPCB 302 and the third FPCB 303 with an adhesive 304 .
  • the adhesive 304 may include an epoxy-type resin.
  • the sensing unit 301 may be attached on the second FPCB 302 exposed through the third hole 421 of the third FPCB 303 .
  • the sensing unit 301 may be electrically connected to the third FPCB 303 .
  • the sensing unit 301 may be bonded to the third FPCB 303 with a wire 305 .
  • the resin 306 may be applied to the wire 305 to protect the wire 305 connecting the sensing unit 301 and the third FPCB 303 .
  • the fingerprint sensor 300 includes a first hole (eg, the first hole 204 of FIG. 2 ) of a digitizer (eg, the digitizer 203 of FIG. 2 ) of the electronic device (eg, the electronic device 200 of FIG. 2 ). It can be attached to the corresponding part.
  • the second conductive pattern of the second FPCB 302 of the fingerprint sensor 300 may be electrically connected to the first conductive pattern of the digitizer.
  • FIG. 6 is a diagram for explaining a method of electrically connecting a fingerprint sensor to a digitizer of an electronic device according to an embodiment of the present disclosure.
  • an electronic device may include a digitizer 203 .
  • the first hole 204 may be positioned in the digitizer 203 .
  • the digitizer 203 may include a first conductive pattern 615 .
  • a self-limited description of the digitizer 203 is the same as that described above with reference to FIGS. 2 and 3 , and thus will be omitted.
  • the digitizer 203 may include a first connection pad 611 and a second connection pad 622 .
  • the connection pad may refer to a portion in which the conductive pattern of the digitizer 203 is opened for connection with other components at a portion where the conductive pattern is cut off.
  • the fingerprint sensor 300 may be positioned in a portion corresponding to the first hole 204 of the digitizer 203 .
  • the second conductive pattern of the second FPCB of the fingerprint sensor 300 (eg, the second FPCB 302 of FIG. 3 ) is transmitted through the first connection pad 611 of the digitizer 203 to the digitizer ( It may be electrically connected to the first conductive pattern 615 of the 203 .
  • a solder ball 613 is applied to the first connection pad 611 by a low-temperature soldering (eg, jet soldering) method so as not to damage the display to prevent the fingerprint sensor 300 from being damaged. ) may be electrically connected to the first conductive pattern 615 of the digitizer 203 .
  • the first conductive pattern 615 may be connected to a processor of an electronic device (eg, the processor 120 of FIG. 1 ).
  • the third conductive pattern of the third FPCB of the fingerprint sensor 300 (eg, the third FPCB 303 of FIG. 3 ) is transmitted through the second connection pad 612 of the digitizer 203 to the digitizer ( It may be electrically connected to the first conductive pattern 615 of the 203 .
  • the third conductive pattern of the fingerprint sensor 300 is applied to the second connection pad 612 by a soldering (eg, jet soldering) method by applying a solder ball 614 to the first conductivity of the digitizer 203 . It may be electrically connected to the pattern 615 .
  • a second conductive pattern for a digitizer is integrally formed with the fingerprint sensor 300 , and the fingerprint sensor 300 is formed in a portion corresponding to the first hole 204 of the digitizer 203 .
  • the display device eg, the display device 201 in Fig. 2
  • the fingerprint sensor 300 An electronic device to which the fingerprint sensor 300 is attached may be implemented while maintaining a certain gap between the 300 and a certain gap also between batteries (eg, the battery 206 of FIG. 2 ).
  • the fingerprint sensor and the digitizer are electrically connected by soldering (eg, jet soldering), but this corresponds to an embodiment, and according to the embodiment, an anisotropic conductive film (ACF, anisotropic conductive film) and/or conductive epoxy may be used to electrically connect.
  • soldering eg, jet soldering
  • ACF anisotropic conductive film
  • conductive epoxy may be used to electrically connect.
  • FIGS. 7A, 7B, 8 and 9 a method of manufacturing a fingerprint sensor included in an electronic device according to an embodiment of the present disclosure will be described with reference to FIGS. 7A, 7B, 8 and 9 .
  • FIGS. 7A, 7B, 8 and 9 are diagrams schematically illustrating a method of manufacturing a fingerprint sensor included in an electronic device according to an exemplary embodiment of the present disclosure.
  • a cross-sectional view 710 of FIG. 7A may represent a cross-sectional view of a component for manufacturing a fingerprint sensor (eg, the fingerprint sensor 300 of FIG. 2 ).
  • a component for manufacturing the fingerprint sensor is on the second FPCB 712 for a digitizer (eg, digitizer 203 of FIG. 2 ) of an electronic device (eg, electronic device 200 of FIG. 2 ) on a fingerprint sensor (eg: It may have a structure in which the third FPCB 711 for the fingerprint sensor 300 of FIG. 2 is disposed.
  • the second FPCB 712 may be a circuit board (eg, a second circuit board) for recognizing an input of an input device (eg, a digitizer pen).
  • the second FPCB 712 may be a capacitive flexible printed circuit board (CAP-FPCB) or a capacitive printed circuit board (CAP-PCB) for sensing an input device.
  • CAP-FPCB capacitive flexible printed circuit board
  • CAP-PCB capacitive printed circuit board
  • a sensing unit for fingerprint recognition (eg, the sensing unit 301 of FIG. 3 ) may be attached to the third FPCB 711 .
  • a plan view 720 of FIG. 7B may represent a plan view looking down the component for manufacturing the fingerprint sensor of FIG. 7A in the -y-axis direction.
  • Descriptions of the second FPCB 712 for the digitizer and the third FPCB 711 for the fingerprint sensor are the same as those described above with reference to FIGS. 2 and 3, and thus will be omitted.
  • the sensing unit 714 may be attached to the third FPCB 711 with an adhesive 713 .
  • the adhesive 713 may include an epoxy-type resin.
  • the sensing unit 714 may be electrically connected to the third FPCB 711 .
  • the sensing unit 714 may be bonded to the third FPCB 711 with a wire 901 .
  • a resin 902 may be coated on the wire 901 to protect the wire 901 connecting the sensing unit 714 and the third FPCB 711 .
  • the fingerprint sensor 900 of FIG. 9 is a first hole (eg, the first hole ( 204))) and can be attached to the corresponding part.
  • the second conductive pattern of the second FPCB 712 of the fingerprint sensor 900 may be electrically connected to the first conductive pattern of the digitizer.
  • FIGS. 10 and 11 an electronic device according to an embodiment of the present disclosure will be described with reference to FIGS. 10 and 11 .
  • 10 is a diagram schematically illustrating a fingerprint sensor 1000 included in an electronic device according to an embodiment of the present disclosure.
  • 11 is a cross-sectional view of an electronic device 1100 illustrating a portion of a stacked structure of an electronic device according to an embodiment of the present disclosure.
  • the fingerprint sensor 1000 may include a sensing unit 1001 and a third FPCB 1002 for the fingerprint sensor.
  • the sensing unit 1001 may include a photo sensor and obtain fingerprint information input on the display device 1101 .
  • the fingerprint sensor 1000 is an optical fingerprint sensor
  • the electronic device 1100 eg, the electronic device 101 of FIG. 1
  • the sensing unit 1001 detects the light emitted from the pixel, reflected from the finger, and input to the sensing unit 1001 to obtain fingerprint information of the finger. can do.
  • the third FPCB 1002 for the fingerprint sensor 1000 may include a third conductive pattern for the fingerprint sensor 1000 .
  • the third conductive pattern may convert light input through the sensing unit 1001 into a current (or voltage) signal and/or transmit it to a processor (eg, the processor 120 of FIG. 1 ).
  • a processor eg, the processor 120 of FIG. 1
  • at least a portion of the metal layer 1003 of the third FPCB 1002 may be exposed through the opening.
  • an electronic device 1100 may include a display device 1101 (eg, the display device 160 of FIG. 1 ), a protective layer 1102 , and a heat dissipation layer 1103 .
  • a display device 1101 eg, the display device 160 of FIG. 1
  • a protective layer 1102 e.g., the display device 160 of FIG. 1
  • a heat dissipation layer 1103 e.g., the heat dissipation layer 1103 .
  • the first hole 1104 may be located in the heat dissipation layer 1103 at a position corresponding to the fingerprint sensor 1000 .
  • the second hole 1107 may be positioned at a position corresponding to the first hole 1104 of the heat dissipation layer 1103 .
  • the fingerprint sensor 1000 may be positioned to correspond to the first hole 1104 of the heat dissipation layer 1103 . According to an embodiment, the fingerprint sensor 1000 receives fingerprint information input to the display device 1101 through the second hole 1107 of the protective layer 1102 and the first hole 1104 of the heat dissipation layer 1103 . can be obtained
  • the exposed metal layer 1003 of the fingerprint sensor 1000 may be electrically connected to the heat dissipation layer 1103 . Since the heat dissipation layer 1103 cannot be located in the region where the first hole 1104 is located, heat dissipation performance may be deteriorated due to interruption in heat transfer, but heat transfer that was interrupted through the metal layer 1003 in the fingerprint sensor 1000 It is possible to secure heat dissipation performance by connecting
  • FIGS. 12, 13 and 14 an electronic device according to an embodiment of the present disclosure will be described with reference to FIGS. 12, 13 and 14 .
  • FIG. 12 is a cross-sectional view of the electronic device 1200 illustrating a portion of the stacked structure of the electronic device according to an embodiment of the present disclosure.
  • 13 is a diagram schematically illustrating a digitizer 1300 included in an electronic device according to an embodiment of the present disclosure.
  • 14 is a cross-sectional view 1400 illustrating a cross-section of the digitizer of FIG. 13 taken along line I-I'.
  • the electronic device 1200 may include a digitizer 1201 , a sensing unit 1202 , a protective layer 1203 , and a display device 1204 (eg, the display device 160 of FIG. 1 ).
  • a digitizer 1201 may include a digitizer 1201 , a sensing unit 1202 , a protective layer 1203 , and a display device 1204 (eg, the display device 160 of FIG. 1 ).
  • the digitizer 1201 of the electronic device 1200 may include a first FPCB 1201-1 for the digitizer.
  • the first FPCB 1201-1 may include a first conductive pattern. A description of the first conductive pattern is omitted because it is the same as that described with reference to FIGS. 2 and 3 above.
  • the digitizer 1201 may not include a hole, and thus the first conductive pattern may be disposed on the front surface of the digitizer 1201 regardless of the hole.
  • the digitizer 1201 of the electronic device 1200 may include a third FPCB 1201 - 2 for a fingerprint sensor.
  • the third FPCB 1201 - 2 may include a third conductive pattern.
  • the description of the third conductive pattern is the same as that described above with reference to FIGS. 2 and 3 , and thus will be omitted.
  • the third conductive pattern of the digitizer 1201 may be electrically connected to the sensing unit 1202 .
  • the sensing unit 1202 may include a photo sensor for an optical fingerprint sensor, and may be electrically connected to the third conductive pattern of the digitizer 1201 .
  • a photo sensor for an optical fingerprint sensor may be electrically connected to the third conductive pattern of the digitizer 1201 .
  • a detailed description of the electrical connection between the third conductive pattern of the digitizer 1201 and the sensing unit 1202 according to an exemplary embodiment will be described later with reference to FIGS. 13 and 14 .
  • the protective layer 1203 includes a buffer layer (eg, a cushion layer or a sponge layer) for absorbing an impact, a light blocking layer for blocking light (eg, a light blocking member layer of a black sheet or black printed layer), At least one of an adhesive layer for adhesion may be included.
  • the protective layer 1203 may be configured as an integral body by integrating a buffer layer, a light blocking layer, and an adhesive layer, or may be in a stacked form in which a plurality of layers formed for each component are stacked.
  • the description of the display device 1204 is the same as that described above with reference to FIG. 2 , and thus will be omitted.
  • a sensing unit 1202 may be attached to one surface of the digitizer 1201 with an adhesive 1401 .
  • the adhesive 1401 may include an epoxy-type resin.
  • the digitizer 1201 may include a connection pad 1301 for a fingerprint sensor.
  • the sensing unit 1202 and the connection pad 1301 may be electrically connected by bonding with a wire 1402 .
  • the digitizer 1201 may be affected.
  • Use and input devices eg stylus pen
  • wireless charging can be stopped to avoid mutual interference.
  • FIGS. 12, 15 and 16 an electronic device according to an embodiment of the present disclosure will be described with reference to FIGS. 12, 15 and 16 .
  • 15 is a diagram schematically illustrating a digitizer 1500 included in an electronic device according to an embodiment of the present disclosure.
  • 16 is a cross-sectional view schematically illustrating a state in which a sensing unit is attached to a digitizer included in an electronic device according to an embodiment of the present disclosure.
  • the electronic device 1200 may include a digitizer 1201 , a sensing unit 1202 , a protective layer 1203 , and a display device 1204 (eg, the display device 160 of FIG. 1 ).
  • a digitizer 1201 e.g., the digitizer 1201 , the sensing unit 1202 , the passivation layer 1203 , and the display device 1204 are the same as those described with reference to FIG. 12 , and thus will be omitted.
  • the digitizer 1201 of the electronic device 1200 may include a first FPCB for the digitizer.
  • the first FPCB may include a first conductive pattern.
  • the description of the first conductive pattern is the same as that described above with reference to FIGS. 2 and 3 , and thus will be omitted.
  • the digitizer 1201 may not include a hole, and thus the first conductive pattern may be disposed on the front surface of the digitizer 1201 regardless of the hole.
  • the digitizer 1201 of the electronic device 1200 may include a third FPCB for a fingerprint sensor.
  • the third FPCB may include a third conductive pattern.
  • the description of the third conductive pattern is the same as that described above with reference to FIGS. 2 and 3 , and thus will be omitted.
  • the digitizer 1201 of the electronic device 1200 may include a connection pad 1501 for a fingerprint sensor.
  • the sensing unit 1202 and the connection pad 1501 of the digitizer 1201 may be electrically connected.
  • the sensing unit 1202 and the third conductive pattern of the digitizer 1201 may be electrically connected by applying the solder ball 1601 to the connection pad 1501 by a soldering (eg, jet soldering) method.
  • An electronic device includes a display device, a battery, a digitizer positioned between the display device and the battery and including a first circuit board, and a fingerprint sensor including a second circuit board and a third circuit board and a processor electrically connected to the display device, the digitizer, and the fingerprint sensor, wherein the first circuit board includes a first conductive pattern for recognizing an input device, and the second circuit board includes the input device.
  • the first circuit board includes a first conductive pattern for recognizing an input device
  • the second circuit board includes the input device.
  • the third circuit board may include a third conductive pattern for recognizing a fingerprint
  • the first conductive pattern and the second conductive pattern may be electrically connected to each other.
  • the first conductive pattern of the digitizer and the second conductive pattern of the fingerprint sensor may be electrically connected through a connection pad of the digitizer.
  • connection pad and the second conductive pattern may be electrically connected through a solder ball.
  • the photo sensor of the fingerprint sensor may be electrically connected to the third conductive pattern of the fingerprint sensor through a wire.
  • the digitizer may further include a first hole without the first conductive pattern.
  • the fingerprint sensor may be located in an area corresponding to the first hole.
  • a fingerprint sensor includes a photo sensor, a first circuit board, and a second circuit board, wherein the first circuit board includes a first conductive pattern for recognizing an input device, and The second circuit board may include a second conductive pattern for recognizing a fingerprint.
  • the first circuit board may include the first conductive pattern for recognizing the input device, which is a digital pen.
  • the photosensor may be electrically connected to the second conductive pattern.
  • the photosensor may be electrically connected to the second conductive pattern through a wire.
  • the second circuit board may be positioned on one surface of the first circuit board.
  • the photosensor may be located on one surface of the first circuit board or the second circuit board.
  • An electronic device includes a fingerprint sensor including a display device, a battery, a heat dissipation layer disposed between the display device and the battery, a circuit board, and electrically connected to the display device and the fingerprint sensor a processor, wherein the circuit board includes a conductive pattern for recognizing a fingerprint, the circuit board includes an opening exposing at least a portion of a metal layer included in the circuit board, and the metal layer exposed through the opening may be electrically connected to the heat dissipation layer.
  • the photo sensor of the fingerprint sensor may be electrically connected to the conductive pattern of the fingerprint sensor through a wire.
  • the heat dissipation layer may further include a first hole.
  • the fingerprint sensor may be located in an area corresponding to the first hole.
  • An electronic device includes a display device, a battery, a digitizer positioned between the display device and the battery and including a first circuit board and a second circuit board, a fingerprint sensor including a photosensor, and a processor electrically connected to the display device, the digitizer, and the fingerprint sensor, the first circuit board includes a first conductive pattern for recognizing an input device, and the second circuit board for recognizing a fingerprint It includes a second conductive pattern, and the second conductive pattern and the photosensor may be electrically connected to each other.
  • the second conductive pattern of the digitizer and the photo sensor may be electrically connected through a connection pad of the digitizer.
  • connection pad and the photo sensor may be electrically connected through a solder ball.
  • connection pad and the photosensor may be electrically connected through a wire.

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Abstract

Un dispositif électronique selon un mode de réalisation de la présente invention comprend : un dispositif d'affichage ; une batterie ; un numériseur positionné entre le dispositif d'affichage et la batterie et comprenant une première carte de circuit imprimé ; un capteur d'empreintes digitales comprenant une deuxième carte de circuit imprimé et une troisième carte de circuit imprimé ; et un processeur connecté électriquement au dispositif d'affichage, au numériseur et au capteur d'empreintes digitales. La première carte de circuit imprimé comprend un premier motif conducteur pour reconnaître un dispositif d'entrée, la deuxième carte de circuit imprimé comprend un deuxième motif conducteur pour reconnaître le dispositif d'entrée, la troisième carte de circuit imprimé comprend un troisième motif conducteur pour reconnaître une empreinte digitale, et le premier motif conducteur et le deuxième motif conducteur peuvent être électriquement connectés. Divers autres modes de réalisation pouvant être reconnus grâce à la description sont également possibles.
PCT/KR2021/005953 2020-05-12 2021-05-12 Capteur d'empreintes digitales et dispositif électronique comprenant un capteur d'empreintes digitales WO2021230657A1 (fr)

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US17/984,784 US11908230B2 (en) 2020-05-12 2022-11-10 Fingerprint sensor and electronic device comprising fingerprint sensor

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KR1020200056738A KR20210138427A (ko) 2020-05-12 2020-05-12 지문 센서 및 지문 센서를 포함하는 전자 장치
KR10-2020-0056738 2020-05-12

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KR20210138427A (ko) 2021-11-19
US20230072248A1 (en) 2023-03-09

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