WO2021216051A1

WO2021216051A1 - Computing device enclosures with deployable covers

Info

Publication number: WO2021216051A1
Application number: PCT/US2020/029143
Authority: WO
Inventors: Hung-Chi Lin
Original assignee: Hewlett-Packard Development Company, L.P.
Priority date: 2020-04-21
Filing date: 2020-04-21
Publication date: 2021-10-28

Abstract

Examples disclosed herein provide an enclosure of a computing device. One example enclosure includes a cover deployable from a surface of the enclosure via a lever, wherein the cover is coupled to the lever at a first end of the lever. The enclosure includes an eccentric mechanism disposed within the enclosure at a second end of the lever, and a heat-generating component disposed within the enclosure, wherein a change in temperature of the heat-generating component is to rotate the eccentric mechanism, providing for deployment of the cover.

Description

COMPUTING DEVICE ENCLOSURES WITH DEPLOYABLE COVERS

BACKGROUND

[0001]The emergence and popularity of computing has made computing devices a staple in today’s marketplace. Examples of computing devices include desktop computers and notebook computers, which may have a compact design and lighter weight compared to desktop computers. Irrespective of the different form factors, the basic components of notebook computers may function identically to their desktop counterparts. Example components that may be housed in a computing device, for example, within an enclosure, include the motherboard, which may be a printed circuit board (PCB) with a microprocessor, such as the central processing unit (CPU), memory, bus, and other electronic components. In addition to the motherboard, other components housed within the enclosure may include the power supply and disk storage, which may include hard disk drives, solid state drives, and optical disc drives.

BRIEF DESCRIPTION OF THE DRAWINGS

[0002] FIGs. 1A-B illustrate an enclosure of a computing device with a cover retracted, according to an example; and

[0003] FIGs. 2A-B illustrate the enclosure of the computing device with the cover deployed, according to an example.

DETAILED DESCRIPTION

[0004] Examples disclosed herein provide a mechanism for computing devices, such as the notebook computer described above, for dynamically improving the thermal performance of the computing devices, as heat generating components, such as the CPU, generate heat. As will be further described, the mechanism for dynamically improving the thermal performance may include a cover deployable from a surface of an enclosure of the computing device, according to a temperature within the enclosure, for example, generated by the heat generating component. Once deployed, the cover may be used to channel air to flow between the computing device and environment, for example, via a fan disposed within the computing device, thereby, providing for improved thermal performance. As an example, the improved thermal performance keeps the computing device cool, and cooler devices have the potential to have higher performance. In addition, with CPU performance increasing, the requirement for computing devices such as notebook computers to remove thermal energy is important to keep the skin temperature of the device low enough for users to be comfortable.

[0005] With reference to the figures, FIG. 1A illustrates an enclosure 104 of a computing device 100, according to an example. As an example, the enclosure 104 may correspond to the base member of a notebook computer, rotatably connected to a display member 102. However, computing device 100 is not limited to notebook computers, and may correspond to other computing devices, such as desktop computers, with a cover 106 that is deployable, based on thermal conditions within the enclosure 104. As an example, the cover 106 may be deployable from a surface of the enclosure 104 (e.g., the top surface of the enclosure 104) via a lever 108. As illustrated, the cover 106 may be coupled to the lever 108 at a first end 110 of the lever 108. As will be further described, a mechanism (e.g., eccentric mechanism 112) may be disposed within the enclosure 104 at a second end of the lever 108. As an example, based on thermal conditions within the enclosure 104, rotation of the mechanism disposed within the enclosure 104 at a second end of the lever 108 may cause the cover 106 to either retract or deploy.

[0006] Referring to FIG. 1 B, the thermal conditions within the enclosure 104 may be determined by a heat generating component 116, such as a CPU, disposed within the enclosure 104, coupled to a printed circuit board (PCB) 118. With regards to a CPU, the current processing load of the CPU may determine the temperature of the heat generating component 116. For example, if the current processing load of the CPU is low, the temperature of the heat generating component 116 may fall below a threshold value. However, when the processing load of the CPU is high, the temperature of the heat generating component 116 may exceed the threshold value. In addition, rather than relying on a temperature threshold value to determine the processing load of the CPU, whether the temperature of the CPU falls within a lower range or higher range may provide an indication of whether the processing load of the CPU is low or high, respectively. [0007] As mentioned above, the cover 106 is deployable, based on thermal conditions within the enclosure 104. As an example, when the temperature of the heat generating component 116 is to exceed the threshold value, the mechanism at the second end of the lever 108 (e.g., eccentric mechanism 112) may rotate in a first direction and deploy the cover 106 via the lever 108. In addition, when the temperature of the heat generating component 116 is to fall back below the threshold value, may rotate in a second direction opposite from the first direction and retract the cover 106 via the lever 108. As an example, the eccentric mechanism 112 may include a temperature-sensitive material, wherein a density of the temperature- sensitive material may change according to a temperature of the heat-generating component 116, resulting in a corresponding rotation of the eccentric mechanism 112. As an example, when the temperature of the heat-generating component 116 goes up, for example, exceeding the threshold value mentioned above, the density of the temperature-sensitive material of the eccentric mechanism 112 may decrease, causing the eccentric mechanism 112 to rotate in the first direction. Similarly, when the temperature of the heat-generating component 116 goes down, for example, falling back below the threshold value, the density of the temperature-sensitive material of the eccentric mechanism 112 may increase, causing the eccentric mechanism 112 to rotate in the second direction. As an example, the temperature- sensitive material of the eccentric mechanism 112 may include liquid metal.

[0008] As an example, when the eccentric mechanism 112 rotates in either the first or second direction, the weight distribution of the eccentric mechanism 112 may either cause the cover 106 to deploy or retract, respectively. As illustrated, the axis 114 of the eccentric mechanism 112 may be off-center, resulting in a change of weight distribution on the second end of the lever 108 when the eccentric mechanism 112 rotates between the first and second directions. As a result, when the eccentric mechanism 112 rotates, for example, in the first direction, the distribution of weight on the second end of the lever 108 may cause the lever to pivot at 122, thereby deploying the cover 106. Similarly, when the eccentric mechanism 112 rotates, for example, in the second direction, the distribution of weight on the second end of the lever 108 may cause the lever to pivot at 122 in an opposite direction, thereby retracting the cover 106. [0009] FIG. 1 B illustrates the lever 108 disposed within the enclosure 104, with the cover 106 coupled to the lever 108 at a first end 110, and the eccentric mechanism 112 disposed within the enclosure 104 at a second end of the lever 108, according to an example. As illustrated, a rotation of the eccentric mechanism 112 in a particular direction (e.g., counter-clockwise) may cause the cover 106 to retract within the enclosure 104, via the lever 108, as illustrated. As an example, when the temperature of the heat generating component 116 is to fall below a threshold value, the density of the temperature-sensitive material of the eccentric mechanism 112 may increase, causing the eccentric mechanism 112 to rotate in the counter clockwise direction. With the axis of the eccentric mechanism off-center (at 114), upon rotating in the counter-clockwise direction, the distribution of weight on the second end of the lever 108 may cause the lever to pivot at 122 and retract the cover 106. As an example, upon rotating in the counter-clockwise direction, a majority of the weight of the eccentric mechanism 112 may be distributed away from the end of the second end of the lever 108, allowing for the cover 106 outweigh the weight distribution of the eccentric mechanism 112 and retract.

[0010]FIGs. 2A-B illustrate the enclosure 104 of the computing device 100 with the cover 106 deployed, according to an example. As described above, according to a temperature within the enclosure 104, for example, generated by the heat generating component 116, the cover 106 may be deployed to channel air to flow between the computing device 100 and environment, for example, via a fan disposed within the computing device 100, thereby, providing for improved thermal performance. As an example, the improved thermal performance keeps the computing device 100 cool, and cooler devices have the potential to have higher performance.

[0011] FIG. 2B illustrates the lever 108 disposed within the enclosure 104, with the cover 106 coupled to the lever 108 at the first end 110, and the eccentric mechanism 112 disposed within the enclosure 104 at the second end of the lever 108, according to an example. As illustrated, a rotation of the eccentric mechanism 112 in an opposite direction from what is illustrated in FIG. 1 B (e.g., clockwise) may cause the cover 106 to deploy from the enclosure 104, via the lever 108, as illustrated. As an example, when the temperature of the heat generating component 116 is to exceed a threshold value, the density of the temperature-sensitive material of the eccentric mechanism 112 may decrease, causing the eccentric mechanism 112 to rotate in the clockwise direction. With the axis of the eccentric mechanism off-center (at 114), upon rotating in the clockwise direction, the distribution of weight on the second end of the lever 108 may cause the lever to pivot at 122 and deploy the cover 106. As an example, upon rotating in the clockwise direction, a majority of the weight of the eccentric mechanism 112 may be distributed more towards the end of the second end of the lever 108, outweighing the cover 106 and causing it to deploy.

[0012] As an example, the enclosure 104 of the computing device 100 includes a thermally conductive component 120, such as a heat pipe, wherein heat generated by the heat generating component 116 may transfer to the eccentric mechanism 112 via the thermally conductive component 120, triggering the change in density of the temperature-sensitive material of the eccentric mechanism 112, as described above. For example, if the temperature of the heat generating component 116 is to fall below the threshold value (e.g., processing load of CPU is light), the density of the temperature-sensitive material of the eccentric mechanism 112 may increase, causing the eccentric mechanism 112 to rotate in a counter-clockwise direction and, thereby, cause the lever to pivot at 122 and retract the cover 106 (e.g., see FIG. 1 B). However, when the temperature of the heat generating component 116 exceeds the threshold value (e.g., processing load of CPU is high), once the heat generated by the heat generating component 116 is transferred to the eccentric mechanism 112 via the heat pipe 120, the density of the temperature-sensitive material of the eccentric mechanism 112 may decrease, causing the eccentric mechanism 112 to rotate in a clockwise direction and, thereby, cause the lever to pivot at 122 and deploy the cover 106 (e.g., see FIG. 2B).

[0013] It is appreciated that examples described may include various components and features. It is also appreciated that numerous specific details are set forth to provide a thorough understanding of the examples. However, it is appreciated that the examples may be practiced without limitations to these specific details. In other instances, well known methods and structures may not be described in detail to avoid unnecessarily obscuring the description of the examples. Also, the examples may be used in combination with each other. [0014] Reference in the specification to “an example” or similar language means that a particular feature, structure, or characteristic described in connection with the example is included in at least one example, but not necessarily in other examples. The various instances of the phrase “in one example” or similar phrases in various places in the specification are not necessarily all referring to the same example.

[0015] It is appreciated that the previous description of the disclosed examples is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these examples will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other examples without departing from the scope of the disclosure. Thus, the present disclosure is not intended to be limited to the examples shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

CLAIMS WHAT IS CLAIMED IS:

1. An enclosure of a computing device comprising: a cover deployable from a surface of the enclosure via a lever, wherein the cover is coupled to the lever at a first end of the lever; an eccentric mechanism disposed within the enclosure at a second end of the lever; and a heat-generating component disposed within the enclosure, wherein a change in temperature of the heat-generating component is to rotate the eccentric mechanism, providing for deployment of the cover.

2. The enclosure of claim 1 , wherein the eccentric mechanism comprises a temperature-sensitive material, wherein a density of the temperature-sensitive material changes according to a temperature of the heat-generating component.

3. The enclosure of claim 2, wherein when the temperature of the heat generating component is to exceed a threshold value, the density of the temperature-sensitive material is to decrease and cause the eccentric mechanism to rotate in a first direction and deploy the cover.

4. The enclosure of claim 3, wherein when the temperature of the heat generating component is to exceed the threshold value, the rotation of the eccentric mechanism in the first direction is to cause a weight distribution of the eccentric mechanism at the second end of the lever to outweigh the cover, thereby deploying the cover via the lever.

5. The enclosure of claim 3, wherein when the temperature of the heat generating component is to fall back below the threshold value, the density of the temperature-sensitive material is to increase and cause the eccentric mechanism to rotate in a second direction opposite from the first direction and retract the cover.

6. The enclosure of claim 5, wherein when the temperature of the heat generating component is to fall back below the threshold value, the rotation of the eccentric mechanism in the second direction is to cause the cover to outweigh a weight distribution of the eccentric mechanism at the second end of the lever, thereby retracting the cover via the lever.

7. The enclosure of claim 1 , comprising a thermally conductive component coupled to the heat generating component.

8. The enclosure of claim 7, wherein heat generated by the heat generating component is to transfer to the eccentric mechanism via the thermally conductive component.

9. An enclosure of a computing device comprising: a cover deployable from a surface of the enclosure via a lever, wherein the cover is coupled to the lever at a first end of the lever; an eccentric mechanism disposed within the enclosure at a second end of the lever, wherein the eccentric mechanism comprises a temperature-sensitive material, wherein a density of the temperature-sensitive material changes according to a temperature of a heat-generating component; and the heat-generating component disposed within the enclosure, wherein a change in temperature of the heat-generating component is to rotate the eccentric mechanism, providing for deployment of the cover.

10. The enclosure of claim 9, wherein when the temperature of the heat generating component is to exceed a threshold value, the density of the temperature-sensitive material is to decrease and cause the eccentric mechanism to rotate in a first direction and deploy the cover.

11. The enclosure of claim 10, wherein when the temperature of the heat generating component is to fall back below the threshold value, the density of the temperature-sensitive material is to increase and cause the eccentric mechanism to rotate in a second direction opposite from the first direction and retract the cover.

12. The enclosure of claim 9, comprising a thermally conductive component coupled to the heat generating component, wherein heat generated by the heat generating component is to transfer to the eccentric mechanism via the thermally conductive component.

13. An enclosure of a computing device comprising: a cover deployable from a surface of the enclosure via a lever, wherein the cover is coupled to the lever at a first end of the lever; an eccentric mechanism disposed within the enclosure at a second end of the lever; a heat-generating component disposed within the enclosure, wherein a change in temperature of the heat-generating component is to rotate the eccentric mechanism, providing for deployment of the cover; and a thermally conductive component coupled to the heat generating component, wherein heat generated by the heat generating component is to transfer to the eccentric mechanism via the thermally conductive component.

14. The enclosure of claim 13, wherein the eccentric mechanism comprises a temperature-sensitive material, wherein a density of the temperature-sensitive material changes according to a temperature of the heat-generating component.

15. The enclosure of claim 14, wherein when the temperature of the heat generating component is to exceed a threshold value, the density of the temperature-sensitive material is to decrease and cause the eccentric mechanism to rotate in a first direction and deploy the cover.