WO2021212979A1 - Image sensor, photographing apparatus, and electronic device - Google Patents

Abstract

An image sensor (10), a photographing apparatus (100), and an electronic device (1000). The image sensor comprises a bent substrate (11) and a bent chip (12) provided on the substrate (11). The substrate (11) comprises multiple sub-substrates (110). The adjacent sub-substrates (110) are obliquely connected and form an included angle. The chip (12) comprises multiple sensing areas (120). The multiple sensing areas (120) correspond to the multiple sub-substrates (110). The adjacent sensing areas (120) are obliquely connected and form an included angle.

Description

Image sensor, camera device and electronic equipment

Priority information

This application requests the priority and rights of the patent application with the patent application number 202010315365.9 filed with the State Intellectual Property Office of China on April 21, 2020, and the full text is incorporated herein by reference.

Technical field

This application relates to the field of imaging technology, and in particular to an image sensor, camera device and electronic equipment.

Background technique

In the image detection technology, with the continuous improvement of sensor pixels, the corresponding detector target surface area will also become larger and larger. Taking a 48M detector as an example, the effective image height of the detector is 8mm, while the effective image height of the 108M detector will reach 12mm, which means that more space is needed to accommodate the detector with a larger target surface area. After the target surface area of the detector increases, the lens matching the camera needs to be adapted to increase accordingly, and the volume of the entire camera module also increases.

Summary of the invention

The embodiments of the present application provide an image sensor, a camera device, and an electronic device.

This application provides an image sensor. The image sensor includes a bent substrate and a bent chip arranged on the substrate. The substrate includes a plurality of sub-substrates. The adjacent sub-substrates are connected obliquely and form an included angle. The chip includes a plurality of sensing areas. A plurality of the sensing regions correspond to a plurality of the sub-substrates. The adjacent sensing areas are connected obliquely and form an included angle.

The application also provides a camera device. The imaging device includes an image sensor and a lens assembly. The light is incident on the image sensor to form an image after passing through the imaging component. The image sensor includes a bent substrate and a bent chip arranged on the substrate. The substrate includes a plurality of sub-substrates. The adjacent sub-substrates are connected obliquely and form an included angle. The chip includes a plurality of sensing areas. A plurality of the sensing regions correspond to a plurality of the sub-substrates. The adjacent sensing areas are connected obliquely and form an included angle.

The application also provides an electronic device. The electronic equipment includes a housing and a camera. The camera device is combined with the housing. The camera device includes an image sensor and a lens assembly. The light is incident on the image sensor to form an image after passing through the imaging component. The image sensor includes a bent substrate and a bent chip arranged on the substrate. The substrate includes a plurality of sub-substrates. The adjacent sub-substrates are connected obliquely and form an included angle. The chip includes a plurality of sensing areas. A plurality of the sensing regions correspond to a plurality of the sub-substrates. The adjacent sensing areas are connected obliquely and form an included angle.

Description of the drawings

The above-mentioned and/or additional aspects and advantages of the present application will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:

FIG. 1 is a three-dimensional schematic diagram of an image sensor according to some embodiments of the present application;

Fig. 2 is a front view of an image sensor according to some embodiments of the present application;

FIG. 3 is a schematic cross-sectional view of an image sensor according to some embodiments of the present application;

Fig. 4 is a front view of an image sensor according to some embodiments of the present application;

FIG. 5 is a schematic cross-sectional view of an image sensor according to some embodiments of the present application;

Fig. 6 is a three-dimensional schematic diagram of an image sensor according to some embodiments of the present application;

Fig. 7 is a front view of an image sensor according to some embodiments of the present application;

FIG. 8 is a schematic cross-sectional view of an image sensor according to some embodiments of the present application;

FIG. 9 is a three-dimensional schematic diagram of an electronic device according to some embodiments of the present application;

10 is a schematic cross-sectional view of the imaging device of the electronic equipment in FIG. 9 along line X-X;

11 is a schematic cross-sectional view of an imaging device of an electronic device according to another embodiment taken by a cross-sectional line at the same position as the X-X line in FIG. 10;

FIG. 12 is a three-dimensional schematic diagram of an electronic device according to some embodiments of the present application;

13 is a schematic cross-sectional view of the imaging device of the electronic equipment in FIG. 12 along the line XIII-XIII;

14 is a schematic cross-sectional view of an imaging device of an electronic device of another embodiment taken by a cross-sectional line at the same position as the line XIII-XIII in FIG. 12;

FIG. 15 is a three-dimensional schematic diagram of an electronic device according to some embodiments of the present application;

16 is a schematic cross-sectional view of the imaging device of the electronic equipment in FIG. 15 along the line XVI-XVI;

Figure 17 is a perspective view of an electronic device according to some embodiments of the present application;

18 is a schematic cross-sectional view of the imaging device of the electronic device in FIG. 17 along the line XVIII-XVIII.

Detailed ways

The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, in which the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions. The following embodiments described with reference to the drawings are exemplary, and are only used to explain the present application, and cannot be understood as a limitation to the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " "Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise" and other directions or The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it cannot be understood as a restriction on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, "multiple" means two or more than two, unless otherwise specifically defined.

In the description of this application, it should be noted that the terms "installation", "connection", and "connection" should be understood in a broad sense, unless otherwise clearly specified and limited. For example, it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relation. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in this application can be understood according to specific circumstances.

Please refer to FIG. 1, the present application provides an image sensor 10 including a bent substrate 11 and a bent chip 12 disposed on the substrate 11. The substrate 11 includes a plurality of sub-substrates 110. Adjacent sub-substrates 110 are connected obliquely and have an included angle. The chip 12 includes a plurality of sensing regions 120. The plurality of sensing regions 120 correspond to the plurality of sub-substrates 110. Adjacent sensing areas 120 are connected obliquely and form an included angle.

Please refer to FIG. 2. In some embodiments, the image sensor 10 is symmetrical about the central axis of the image sensor 10.

3 and 5, in some embodiments, the substrate 11 includes a first surface 115 and a second surface 116 opposite to each other; wherein: the chip 12 is disposed on the first surface 115; or the chip 12 is disposed on the second surface. Surface 116.

Referring to FIGS. 6 to 8, in some embodiments, the included angle between adjacent sub-substrates 110 is the same as the included angle between the corresponding adjacent sensing regions 120.

In some embodiments, multiple groups of adjacent sub-substrates 110 form multiple included angles, and the multiple included angles are the same or partially the same as each other.

In some embodiments, each included angle is greater than or equal to 45 degrees and less than 180 degrees.

In some embodiments, the substrate 11 has an integrated structure, and the chip 12 has an integrated structure; or the substrate 11 has an integrated structure, and the plurality of sensing regions 120 have a split structure; or the multiple sub-substrates 110 have a split structure, and the chip 12 has an integrated structure. 12 is a monolithic structure; or the plurality of sub-substrates 110 are of a split structure, and the plurality of sensing regions 120 are of a split structure.

In some embodiments, the difference between the included angle between adjacent sub-substrates 110 and the radian of the imaging image plane of the lens is within ±10% of the radian.

Referring to FIGS. 9 and 10, the camera device of the embodiment of the present application includes a camera device 100 including an image sensor 10 and a lens assembly 20. After light passes through the lens assembly 20, it is incident on the image sensor 10 for imaging. The image sensor 10 includes a bent substrate 11 and a bent chip 12 disposed on the substrate 11. The substrate 11 includes a plurality of sub-substrates 110. Adjacent sub-substrates 110 are connected obliquely and have an included angle. The chip 12 includes a plurality of sensing regions 120. The plurality of sensing regions 120 correspond to the plurality of sub-substrates 110. Adjacent sensing areas 120 are connected obliquely and form an included angle.

In some embodiments, the lens assembly 20 includes a plurality of lens groups 21, and light transmitted from the outside along the first direction passes through the plurality of lens groups 21 and then enters the plurality of sensing regions 120 of the image sensor 10.

12 and 13, in some embodiments, the lens assembly 20 includes a reflective element 22 and a plurality of lens groups 21, the light transmitted from the outside along the first direction is reflected by the reflective element 22, along the second direction After entering the plurality of lens groups 21, it is incident on the plurality of sensing regions 120 of the image sensor 10, and the first direction is different from the second direction.

Please refer to FIGS. 15 and 16. In some embodiments, the lens assembly 20 includes a first reflective element 21, a second reflective element 22, a first lens structure 23, and a second lens structure 24. The plurality of sensing regions 120 include a first sensing region 121 and a second sensing region 122. The first reflective element 21 and the first lens structure 23 are located on the first side of the image sensor 10 and opposite to the first sensing region 121, and the second reflective element 22 and the second lens structure 24 are located on the second side of the image sensor 10 and opposite to the second sensing area 122, and the first side is opposite to the second side;

The light transmitted from the outside along the first direction is reflected by the first reflecting element 21, enters the first lens structure 23 along the second direction, and then is incident on the first sensing area 121. The light transmitted from the outside along the first direction passes through the first lens structure. After the two reflective elements 22 are reflected, they enter the second lens structure 24 along the opposite direction of the second direction and are incident on the second sensing area 122. The first direction is different from the second direction.

Please refer to FIG. 2. In some embodiments, the image sensor 10 is symmetrical about the central axis of the image sensor 10.

3 and 5, in some embodiments, the substrate 11 includes a first surface 115 and a second surface 116 opposite to each other; wherein: the chip 12 is disposed on the first surface 115; or the chip 12 is disposed on the second surface. Surface 116.

Referring to FIGS. 6 to 8, in some embodiments, the included angle between adjacent sub-substrates 110 is the same as the included angle between the corresponding adjacent sensing regions 120.

In some embodiments, multiple groups of adjacent sub-substrates 110 form multiple included angles, and the multiple included angles are the same or partially the same as each other.

In some embodiments, each included angle is greater than or equal to 45 degrees and less than 180 degrees.

In some embodiments, the substrate 11 has an integrated structure, and the chip 12 has an integrated structure; or the substrate 11 has an integrated structure, and the plurality of sensing regions 120 have a split structure; or the multiple sub-substrates 110 have a split structure, and the chip 12 has an integrated structure. 12 is a monolithic structure; or the plurality of sub-substrates 110 are of a split structure, and the plurality of sensing regions 120 are of a split structure.

In some embodiments, the difference between the included angle between adjacent sub-substrates 110 and the radian of the imaging image plane of the lens is within ±10% of the radian.

Please refer to FIG. 15 and FIG. 16, the electronic device 1000 of the embodiment of the present application includes the camera device 100 and the housing 200 of any of the above embodiments. The imaging device 100 is combined with the housing 200.

Referring to FIG. 9, FIG. 12, FIG. 15, and FIG. 17, in some embodiments, the electronic device 1000 further includes a processor 300. When the multiple sensing areas 120 are in a single structure, the processor 300 is used to process the total electrical signals of the multiple sensing areas 120 to output a target image; and/or, when the multiple sensing areas 120 are in a split structure, the processor 300 It is used to process the electrical signal of each sensing area 120 to output multiple intermediate images and to synthesize multiple intermediate images to obtain the target image.

Please refer to FIG. 1, this application provides an image sensor 10. The image sensor 10 includes a bent substrate 11 and a bent chip 12 disposed on the substrate 11. The substrate 11 includes a plurality of sub-substrates 110. Adjacent sub-substrates 110 are connected obliquely and have an included angle. The chip 12 includes a plurality of sensing regions 120. The plurality of sensing regions 120 correspond to the plurality of sub-substrates 110. Adjacent sensing areas 120 are connected obliquely and form an included angle.

For the periscope lens, as the area of the target surface of the detector increases, the body of the mobile phone will become thicker, and the impact on the increase in volume will be more serious.

In the image sensor 10 of the embodiment of the present application, the bent substrate 11 and the chip 12 are arranged so that the multiple sub-substrates 110 of the substrate 11 are at an angle, and the multiple sensing regions 120 of the chip 12 are all formed at an angle. An included angle enables the image sensor 10 of the embodiment of the present application to have a smaller projection area and occupy a smaller space under the condition that the photosensitive pixels and pixel sizes remain unchanged. 10) The volume size can also be reduced correspondingly, which is conducive to the miniaturization and thinning of the product. In contrast, the image sensor 10 of the embodiment of the present application can set a larger pixel size or a larger number of photosensitive pixels without increasing the projection area of the image sensor, thereby increasing the performance of the image sensor 10. The amount of light may increase the resolution of the image sensor 10, thereby helping to improve the image quality detected by the image sensor 10.

Referring to FIGS. 1, 2 and 3, the image sensor 10 includes a bent substrate 11 and a bent chip 12 disposed on the substrate 11. The substrate 11 includes a plurality of sub-substrates 110. In this embodiment, the substrate 11 includes two sub-substrates 110, which are a first sub-substrate 111 and a second sub-substrate 112, respectively. The two sub-substrates 110 are adjacent, inclined, connected, and have an included angle of 90 degrees. The chip 12 includes a plurality of sub-sensing regions 120. In this embodiment, the chip 12 includes two sensing regions 120, which are a first sensing region 121 and a second sensing region 122, respectively. The two sensing regions 120 correspond to the two sub-substrates 110. The two sensing areas 120 are adjacent, inclined, connected, and have an included angle of 90 degrees.

Referring to FIG. 2, in some embodiments, the image sensor 10 is symmetrical about the central axis O of the image sensor 10. Among them, the central axis O is the horizontal axis, which is parallel to the x direction. That is, the plurality of sub-substrates 110 in the image sensor 10 are symmetrical about the central axis O of the image sensor 10. The plurality of sensing regions 120 in the image sensor 10 are symmetrical about the central axis O of the image sensor 10. Specifically, as shown in FIG. 2, the first sub-substrate 111 and the second sub-substrate 112 are symmetrical about the horizontal axis O, and the first sensing area 121 and the second sensing area 122 are symmetrical about the horizontal axis O.

Please refer to FIG. 4, in other embodiments, the image sensor 10 is symmetrical about the central axis O'of the image sensor 10. Among them, the central axis O'is the vertical axis, which is parallel to the y direction. That is, the plurality of sub-substrates 110 in the image sensor 10 are symmetrical about the central axis O'of the image sensor 10. The plurality of sensing regions 120 in the image sensor 10 are symmetrical about the central axis O'of the image sensor 10. Specifically, as shown in FIG. 4, the first sub-substrate 111 and the second sub-substrate 112 are symmetrical about the vertical axis O, and the first sensing region 121 and the second sensing region 122 are symmetrical about the vertical axis O. Since the light incident surface and the light output surface of the commonly used lens assembly 20 (for example, as shown in FIG. 10) are generally axisymmetric circular shapes, the light refraction effect also has axisymmetric properties, so the image sensor 10 is set in an axisymmetric structure , It is beneficial to have a better matching imaging effect between the image sensor 10 and the lens assembly 20, and it is beneficial to improve the imaging quality of the image sensor 10.

In some embodiments, referring to FIGS. 2 and 4, the substrate 11 and the chip 12 of the image sensor 10 are bent along the longer side. The substrate 11 and the chip 12 of the image sensor 10 are bent along the longer side. Compared with the substrate 11 and the chip 12 of the image sensor 10 that are bent along the shorter side, the image can be reduced better. The effect of the projection area of the sensor 10 is thus more conducive to the miniaturization and thinning of the product.

Referring to FIGS. 2 and 4, in some embodiments, the image sensor 10 is rotationally symmetrical with respect to a certain point of the image sensor 10. That is, the plurality of sub-substrates 110 in the image sensor 10 are rotationally symmetrical with respect to a certain point P of the image sensor 10. The multiple sensing regions 120 in the image sensor 10 are rotationally symmetrical with respect to a certain point P of the image sensor 10. Further, the image sensor 10 may be symmetrical about the center of a certain point of the image sensor 10. Since the commonly used lens assembly 20 (for example, shown in FIG. 10) is generally rotationally symmetrical and has a centrally symmetrical circular or elliptical shape, the light refraction effect also has a rotationally symmetrical property, so the image sensor 10 is set to be rotationally symmetrical. The structure or the center-symmetric structure is beneficial to have a better matching imaging effect between the image sensor 10 and the lens assembly 20, and is beneficial to improve the imaging quality of the image sensor 10.

The substrate 11 includes a first surface 115 and a second surface 116 opposite to each other. In some embodiments, referring to FIG. 3, the chip 12 is disposed on the first surface 115 of the substrate 11. The substrate 11 is bent toward the inner side, and the first surface 115 may be the inner side surface of the substrate 11 after being bent. The chip 12 is arranged on the first surface 115 of the substrate 11, so that the position where the chip 12 is arranged is on the inner side of the substrate 11 after bending, so that the substrate 11 has a better protective effect on the chip 12, which is beneficial to upgrade the image sensor 10. The anti-fall ability.

In other embodiments, referring to FIG. 5, the chip 12 is disposed on the second surface 116 of the substrate 11. The substrate 11 is bent toward the inner side, and the second surface 116 may be the outer side surface of the substrate 11 after being bent.

In some embodiments, the image sensor 10 includes a bent substrate 11 and a bent chip 12 disposed on the substrate 11. The substrate 11 includes M sub-substrates 110. The adjacent sub-substrates 110 are connected obliquely and have an included angle, so there are a total of M-1 included angles. Wherein, M≥2, when M>2, the M-1 included angles may be completely the same, may be partially the same, or may be completely different. The chip 12 includes N sensing regions 120. The number of N can be the same as the number of M. The N sensing regions 120 correspond to the N sub-substrates 110. Adjacent sensing areas 120 are connected obliquely and form an included angle, so there are N-1 included angles in total. Wherein, N≥2, when N>2, the N-1 included angles may be completely the same, may be partially the same, or may be completely different. In an example, referring to FIGS. 6, 7 and 8, in the image sensor 10, the substrate 11 includes four sub-substrates 110, which are a first sub-substrate 111, a second sub-substrate 112, and a third sub-substrate 110, respectively. The substrate 113 and the fourth sub-substrate 114. The adjacent sub-substrates 110 are connected obliquely and have an included angle, so there are three included angles. In this example, the three included angles are all 90°. The chip 12 includes four sensing areas 120, which are a first sensing area 121, a second sensing area 122, a third sensing area 123, and a fourth sensing area 124, respectively. Adjacent sensing areas 120 are connected obliquely and form an included angle, so there are 3 included angles in total. In this example, the three included angles are also 90°

In an example, referring to FIGS. 6, 7 and 8, the included angle between adjacent sub-substrates 110 is the same as the included angle between the corresponding adjacent sensing regions 120, so that the substrate 11 can be 12 Fit installation, simple installation. In the examples of FIGS. 6, 7 and 8, that is, the angle between the first sub-substrate 111 and the second sub-substrate 112 and the angle between the first sensing area 121 and the second sensing area 122 The same; the angle between the second sub-substrate 112 and the third sub-substrate 113 is the same as the angle between the second sensing area 122 and the third sensing area 123; the third sub-substrate 113 and the fourth sub-substrate The included angle between the bottom 114 is the same as the included angle between the third sensing area 123 and the fourth sensing area 124.

In an example, the included angle between each adjacent sub-substrate 110 is greater than or equal to 45 degrees and less than 180 degrees, and the included angle between each adjacent sensing area 120 is greater than or equal to 45 degrees and less than 180 degrees. Spend. As shown in FIG. 5, the included angle between two adjacent sub-substrates 110 is 45 degrees, and the included angle between two adjacent sensing regions 120 is also 45 degrees. In the embodiment of the present application, each included angle between adjacent sub-substrates 110 of the image sensor 10 is greater than or equal to 45 degrees and less than 180 degrees, and each included angle between adjacent sensing regions 120 is also greater than or equal to 45 degrees. Degrees and less than 180 degrees, can prevent the image sensor 10 from insufficient light intensity caused by the folding angle is too small, is beneficial to improve the imaging effect, and can make the image sensor 10 insignificant increase in thickness (that is, the image sensor 10 in Figure 1 The z-direction length) has a smaller projection area (that is, the projection size of the xy plane in Figures 1 and 2), which occupies a smaller space, and the lens assembly 20 (for example, as shown in Figure 10) The size can also be reduced accordingly, which is conducive to the miniaturization and thinning of the product.

In some embodiments, further, the included angle between each adjacent sub-substrate 110 is greater than or equal to 60 degrees and less than or equal to 135 degrees, and the included angle between each adjacent sensing area 120 is equal to 60 degrees or more and less than 135 degrees. As shown in FIG. 3, the included angle between two adjacent sub-substrates 110 is 90 degrees, and the included angle between two adjacent sensing regions 120 is also 90 degrees. In the embodiment of the present application, each included angle between adjacent sub-substrates 110 of the image sensor 10 is greater than or equal to 60 degrees and less than or equal to 135 degrees, and each included angle between adjacent sensing regions 120 is greater than or equal to 60 degrees. Degree and less than or equal to 135 degrees, can further prevent the image sensor 10 from insufficient light intensity caused by too small folding angle, which is beneficial to improve the imaging effect, and the folding angle is neither close to 0° nor close to 180°, which can make the image sensor 10 not close to 0° or 180°. Obviously increase the thickness (that is, the length of the image sensor 10 in the z direction in FIG. 1) while having a smaller projection area (that is, the projection size of the xy plane in FIG. 1 and FIG. 2), thereby occupying a smaller space, The size of the lens assembly 20 (for example, as shown in FIG. 10) matched with it can also be reduced correspondingly, thereby facilitating the miniaturization and thinning of the product.

In some embodiments, the difference between the angle between adjacent sub-substrates 110 and the radian of the imaging image plane of the lens is within ±10% of the radian. Correspondingly, the angle between adjacent sensing regions 120 The difference between the arc and the image plane of the lens is within ±10% of the arc. For example, when the curvature of the imaging image plane of the lens is 100 degrees, the angle between adjacent sub-substrates 110 is between 90 degrees and 110 degrees, and the angle between adjacent sensing regions 120 is between 90 degrees and 110 degrees. between. The difference between the included angle between adjacent sub-substrates 110 and the radian of the imaging image plane of the lens is within ±10% of the radian, and the difference between the included angle between adjacent sensing regions 120 and the radian of the imaging image plane of the lens Within the range of ±10% of the radian, the multiple sensing regions 120 of the image sensor 10 can be better close to the image surface with a certain radian, thereby helping to reduce the negative effects of the curvature of field of the lens assembly 20 on the imaging effect. Influence, thereby improving the imaging quality of the image sensor 10.

On the chip 12, each sensing area 120 includes a pixel circuit and a pixel, and the pixel circuit of each sensing area 120 controls the pixels of each sensing area 120.

In some embodiments, the substrate 11 is an integral structure, and the chip 12 is an integral structure. The substrate 11 is an integrally formed structure, and the chip 12 with a plurality of sensing regions 120 is also an integrally formed structure. Among them, the pixels between every two adjacent sensing regions 120 are continuous, and the pixel circuits between every two adjacent sensing regions 120 are also continuous. For example, as shown in FIG. 1, the first sub-substrate 111 and the second sub-substrate 112 are integrally formed structures, and the first sensing area 121 and the second sensing area 122 of the chip 12 are also integrally formed structures. The pixels on the first sensing area 121 and the second sensing area 122 are continuous, and the pixel circuits on the first sensing area 121 and the second sensing area 122 are also continuous. When the image sensor 10 outputs an image, no other processing is required, and the continuous pixels on the chip 12 directly convert the light signal into an electrical signal to generate an image. In the embodiment of the present application, the substrate 11 of the image sensor 10 has an integrated structure, and the chip 12 has an integrated structure. The integrated structure has better stability, so that the structure of the image sensor 10 has better stability and is beneficial for improvement. The imaging quality of the image sensor 10.

In some other embodiments, the substrate 11 has an integral structure, and the plurality of sensing regions 120 have a separate structure. The substrate 11 is an integrally formed structure, and the chip 12 is formed by splicing a plurality of sensing regions 120. Specifically, in an example, the pixels between every two adjacent sensing regions 120 are continuous, and the pixel circuits between every two adjacent sensing regions 120 are also continuous. When the image sensor 10 outputs an image, no other processing is required, and the continuous pixels on the first sensing area 121 and the second sensing area 122 directly convert light signals into electrical signals to generate images. In another example, the pixels between every two adjacent sensing regions 120 are not continuous, and the pixel circuits between every two adjacent sensing regions 120 are also not continuous. When the image sensor 10 outputs an image, the pixels in the first sensing area 121 convert light signals into electrical signals to generate a first image, and the pixels in the second sensing area 122 convert light signals into electrical signals to generate a second image. The first image and the second image are combined into a target image for output through processing methods such as cropping and splicing, or the first image or the second image can be directly output. The substrate 11 of the image sensor 10 in the embodiment of the present application has an integrated structure, and the multiple sensing regions 120 of the chip 12 have a split structure. The integrated substrate 11 has better stability, and the split spliced chip 12 can avoid During the installation process, the substrate 11 and the chip 12 cannot be well bonded, which facilitates the installation during the production process, so that the structure of the image sensor 10 has better stability, which is conducive to improving the imaging quality of the image sensor 10. At the same time, it improves production efficiency and production yield. In addition, the split-spliced chip 12 has various ways of outputting images, which can adapt to more applications.

In still other embodiments, the plurality of sub-substrates 110 have a separate structure, and the chip 12 has an integrated structure. The substrate 11 is formed by splicing a plurality of sub-substrates 110, and the chip 12 with a plurality of sensing regions 120 is an integrally formed structure. The pixels between every two adjacent sensing regions 120 may be continuous, and the pixel circuits between every two adjacent sensing regions 120 may also be continuous. When the image sensor 10 outputs an image, no other processing is required, and the continuous pixels on the chip 12 directly convert the light signal into an electrical signal to generate an image. In the embodiment of the present application, the multiple sub-substrates 110 of the substrate 11 of the image sensor 10 have a split structure, and the chip 12 has an integrated structure. The integrated chip 12 has better stability, and the split-spliced substrate 11 can avoid During the installation process, the substrate 11 and the chip 12 cannot be well bonded, which facilitates the installation during the production process, so that the structure of the image sensor 10 has better stability, which is conducive to improving the imaging quality of the image sensor 10. At the same time, it improves production efficiency and production yield.

In still other embodiments, the plurality of sub-substrates 110 have a split structure, and the plurality of sensing regions 120 have a split structure. The substrate 11 is formed by splicing a plurality of sub-substrates 110, and the chip 12 is also formed by splicing a plurality of sensing regions 120. Specifically, in an example, the pixels between every two adjacent sensing regions 120 are continuous, and the pixel circuits between every two adjacent sensing regions 120 are also continuous. When the image sensor 10 outputs an image, no other processing is required, and the continuous pixels on the chip 12 directly convert the light signal into an electrical signal to generate an image. In another example, the pixels between every two adjacent sensing regions 120 are not continuous, and the pixel circuits between every two adjacent sensing regions 120 are also not continuous. When the image sensor 10 outputs an image, the pixels in the first sensing area 121 convert light signals into electrical signals to generate a first image, and the pixels in the second sensing area 122 convert light signals into electrical signals to generate a second image. The first image and the second image are combined into a target image for output through processing methods such as cropping and splicing, or the first image or the second image can be directly output. The multiple sub-substrates 110 of the substrate 11 of the image sensor 10 in the embodiment of the present application have a split structure, and the multiple sensing regions 120 of the chip 12 have a split structure. The splicing of the splits makes the design of the image sensor 10 in electronic products And the arrangement has better flexibility, and at the same time facilitates the installation during the production process, which is beneficial to reduce the cost of the product in the design and production process, while improving the research and development efficiency and production efficiency. Moreover, the split structure of the multiple sub-substrates 110 of the substrate 11 and the split structure of the multiple sensing regions 120 of the chip 12 have a flexible structure in electronic products to have better adaptability and be suitable for more applications. Scenes. In addition, the split-spliced chip 12 has various ways of outputting images, which can adapt to more applications.

Referring to FIG. 9 and FIG. 10, the present application also provides an electronic device 1000. The electronic device 1000 includes a camera device 100 and a housing 200. The imaging device 100 is combined with the housing 200. The imaging device 100 includes the image sensor 10 and the lens assembly 20 of any one of the above-mentioned embodiments, and the light is incident on the image sensor 10 after passing through the lens assembly 20 to form an image. In the imaging device 100, the lens assembly 20 includes a plurality of lens groups 21, and the lens group 21 may include at least one lens. District 120. In the embodiments of FIGS. 9 and 10, the first direction is the opposite direction of z. In other embodiments, the first direction may also be a direction along z. The embodiment of the application does not limit this. At this time, the camera device 100 may be a single front camera, a single rear camera, one of a front dual camera, or one of a rear dual camera of the electronic device 1000.

In the electronic device 1000 of the embodiment of the present application, the bent substrate 11 and the chip 12 are arranged, so that the plurality of sub-substrates 110 of the substrate 11 are at an angle, and the plurality of sensing regions 120 of the chip 12 are all formed at an angle. An included angle enables the image sensor 10 of the embodiment of the present application to have a smaller projection area (such as the xy plane projection in FIG. 9) under the condition that the photosensitive pixels and pixel sizes remain unchanged, thereby occupying a smaller space. , The size of the lens assembly 20 (as shown in FIG. 10) matched with it can also be reduced correspondingly, thereby facilitating the miniaturization and thinning of the product. In contrast, the image sensor 10 of the embodiment of the present application can set a larger pixel size or a larger number of photosensitive pixels without increasing the projection area of the image sensor, thereby increasing the performance of the image sensor 10. The amount of light may increase the resolution of the image sensor 10, thereby helping to improve the imaging quality of the electronic device 1000 in the embodiment of the present application.

In some embodiments, the positions of the plurality of lens groups 21 and the distance between the plurality of lens groups 21 may be fixed. In this case, the lens assembly 20 is a fixed-focus lens assembly. In another embodiment, the imaging device 100 may further include a focal length adjustment device (not shown), which can adjust the positions of the plurality of lens groups 21 and the distance between the plurality of lens groups 21, for example, adjust the first lens The distance between the group 211 and the second lens group 213. At this time, the lens assembly 20 is a zoom lens assembly. The focus adjustment device can be an electrostatic actuator device, an electromagnetic actuator device, a magnetostrictive actuator device, a piezoelectric actuator device, a piezoelectric motor, a stepping motor, and an electroactive polymer actuator device. one of them.

The description will be given below in conjunction with specific embodiments. 9 and 10, in one embodiment, the lens assembly 20 includes a first lens group 211 and a second lens group 213, the first lens group 211 includes two lenses, and the second lens group 213 includes two lenses. In the electronic device 1000, after external light enters the imaging device 100, it passes through the first lens group 211 and the second lens group 213 in the opposite direction of z, and then reaches the chip 12 of the image sensor 10 for imaging. The substrate 11 of the image sensor 10 includes a first sub-substrate 111 and a second sub-substrate 112. The chip 12 of the image sensor 10 includes a first sensing area 121 and a second sensing area 122. The included angle between the first sub-substrate 111 and the second sub-substrate 112 is 90°. The included angle between the first sensing area 121 and the second sensing area 122 is also 90°. The chip 12 is disposed on the first surface 115 of the substrate 11.

9 and 11, in another embodiment, the lens assembly 20 includes a first lens group 211 and a second lens group 213, the first lens group 211 includes two lenses, and the second lens group 213 includes two lenses . In the electronic device 1000, after external light enters the imaging device 100, it passes through the first lens group 211 and the second lens group 213 in the opposite direction of z, and then reaches the chip 12 of the image sensor 10 for imaging. The substrate 11 of the image sensor 10 includes a first sub-substrate 111 and a second sub-substrate 112. The chip 12 of the image sensor 10 includes a first sensing area 121 and a second sensing area 122. The included angle between the first sub-substrate 111 and the second sub-substrate 112 is 90°. The included angle between the first sensing area 121 and the second sensing area 122 is 90°. The chip 12 is disposed on the second surface 116 of the substrate 11. It can also be regarded that the first sub-substrate 111 and the second sub-substrate 112 form an angle of 270°. An angle of 270° is formed between the first sensing area 121 and the second sensing area 122.

Referring to FIG. 12 and FIG. 13, the present application also provides an electronic device 1000. The electronic device 1000 includes a camera device 100 and a housing 200. The imaging device 100 is combined with the housing 200. The imaging device 100 includes the image sensor 10 and the lens assembly 20 of any one of the above embodiments, and the light is incident on the image sensor 10 after passing through the lens assembly 20 to form an image. In the imaging device 100, the lens assembly 20 includes a plurality of lens groups 21 and a reflecting element 22. The light transmitted from the outside along the first direction is reflected by the reflecting element 22, enters the plurality of lens groups 21 in the second direction, and then enters the image. In the multiple sensing regions 120 of the sensor 10, the first direction is different from the second direction. In the embodiments of FIGS. 12 and 13, the first direction is the opposite direction of z, and the second direction is the opposite direction of x. In other embodiments, the first direction may also be a direction along z, and the second direction may also be a direction along x, which is not limited in the embodiment of the present application. The camera device 100 may be a single front camera, a single rear camera, one of a front dual camera, or one of a rear dual camera of the electronic device 1000.

In the electronic device 1000 of the embodiment of the present application, the bent substrate 11 and the chip 12 are arranged, so that the plurality of sub-substrates 110 of the substrate 11 are at an angle, and the plurality of sensing regions 120 of the chip 12 are all formed at an angle. An included angle enables the image sensor 10 of the embodiment of the present application to have a smaller projection area (for example, the zy plane projection in FIG. 12) under the condition that the photosensitive pixels and pixel sizes remain unchanged, thereby occupying a smaller space. , The projection (such as the zy plane projection in FIG. 12) area of the lens assembly 20 (such as shown in FIG. 13) that is matched with it can also be reduced correspondingly, which is beneficial to reduce the size of the electronic device 1000 in the z direction (ie, reduce The thickness of the small electronic device 1000) to realize the miniaturization and thinning of the product. In contrast, the image sensor 10 of the embodiment of the present application can set a larger pixel size or a larger number of photosensitive pixels without increasing the projection area of the image sensor, thereby increasing the performance of the image sensor 10. The amount of light may increase the resolution of the image sensor 10, thereby helping to improve the imaging quality of the electronic device 1000 in the embodiment of the present application.

The reflecting element 22 may be a reflecting prism or a reflecting mirror. The reflective prism may be one of a reflective triangular prism, a reflective quadrangular prism, and a reflective pentaprism. The provision of the reflective element 22 in the electronic device 1000 enables the lens assembly 20 (for example, as shown in FIG. 13) to be placed in the electronic device 1000 laterally (that is, in the x direction), which is beneficial to reduce the thickness of the electronic device 1000 (that is, the length in the z direction) , Which is more conducive to the thinning of electronic products. As shown in FIG. 13, the reflective element 22 is a total reflection prism. The total reflection prism has a small loss of light during the reflection process, which helps to improve the imaging quality of the electronic device 1000.

In some embodiments, the positions of the plurality of lens groups 21 and the distance between the plurality of lens groups 21 may be fixed. In this case, the lens assembly 20 is a fixed-focus lens assembly. In another embodiment, the imaging device 100 further includes a focal length adjustment device (not shown), the focal length adjustment device can adjust the position of the plurality of lens groups 21 and the distance between the plurality of lens groups 21, for example, adjust the first lens group The distance between 211 and the second lens group 213. At this time, the lens assembly 20 is a zoom lens assembly. The focus adjustment device can be an electrostatic actuator device, an electromagnetic actuator device, a magnetostrictive actuator device, a piezoelectric actuator device, a piezoelectric motor, a stepping motor, and an electroactive polymer actuator device. one of them.

The description will be given below in conjunction with specific embodiments. Referring to FIGS. 12 and 13, in one embodiment, the lens assembly 20 includes a first lens group 211, a second lens group 213, and a third lens group 215. The first lens group 211 includes three lenses, and the second lens group 213 includes two lenses, and the third lens group 215 includes two lenses. In the electronic device 1000, after external light enters the imaging device 100 in the opposite direction of z, and after being reflected by the reflective element 22, it passes through the first lens group 211, the second lens group 213, and the third lens group in the opposite direction of x. After the lens group 215, the chip 12 reaches the image sensor 10 for imaging. The substrate 11 of the image sensor 10 includes a first sub-substrate 111 and a second sub-substrate 112. The chip 12 of the image sensor 10 includes a first sensing area 121 and a second sensing area 122. The included angle between the first sub-substrate 111 and the second sub-substrate 112 is 45°. The included angle between the first sensing area 121 and the second sensing area 122 is also 45°. The chip 12 is disposed on the first surface 115 of the substrate 11.

Referring to FIGS. 12 and 14, in another embodiment, the lens assembly 20 includes a first lens group 211, a second lens group 213, and a third lens group 215. The first lens group 211 includes three lenses, and the second lens The group 213 includes two lenses, and the third lens group 215 includes two lenses. In the electronic device 1000, after external light enters the imaging device 100 in the opposite direction of z, and after being reflected by the reflective element 22, it passes through the first lens group 211, the second lens group 213, and the third lens group in the opposite direction of x. After the lens group 215, the chip 12 reaches the image sensor 10 for imaging. The substrate 11 of the image sensor 10 includes a first sub-substrate 111 and a second sub-substrate 112. The chip 12 of the image sensor 10 includes a first sensing area 121 and a second sensing area 122. The included angle between the first sub-substrate 111 and the second sub-substrate 112 is 45°. The included angle between the first sensing area 121 and the second sensing area 122 is also 45°. The chip 12 is disposed on the second surface 116 of the substrate 11. It can also be regarded as an angle of 315° between the first sub-substrate 111 and the second sub-substrate 112. An angle of 315° is formed between the first sensing area 121 and the second sensing area 122.

Please refer to FIG. 15 and FIG. 16. The present application also provides an electronic device 1000. The electronic device 1000 includes a camera device 100 and a housing 200. The imaging device 100 is combined with the housing 200. The imaging device 100 includes the image sensor 10 and the lens assembly 20 of any one of the above-mentioned embodiments, and the light is incident on the image sensor 10 after passing through the lens assembly 20 to form an image. In the imaging device 100, the lens assembly 20 includes a first reflective element 21, a second reflective element 22, a first lens structure 23, and a second lens structure 24. The first reflective element 21 and the first lens structure 23 are located on the first side of the image sensor 10 and opposite to the first sensing area 121, and the second reflective element 22 and the second lens structure 24 are located on the second side of the image sensor 10 and are opposite to the first sensing area. The two sensing regions 122 are opposite to each other, and the first side is opposite to the second side. The light transmitted from the outside along the first direction is reflected by the first reflecting element 21, enters the first lens structure 23 along the second direction, and then is incident on the first sensing area 121. The light transmitted from the outside along the first direction passes through the first lens structure. After the two reflective elements 22 are reflected, they enter the second lens structure 24 along the opposite direction of the second direction and are incident on the second sensing area 122. The first direction is different from the second direction. In the embodiment of FIGS. 15 and 16, the first direction is the opposite direction of z, and the second direction is the direction along x. In other embodiments, the first direction may also be a direction along z, and the second direction may also be the opposite direction of x, which is not limited in the embodiment of the present application. The camera device 100 may be a front dual-camera or a rear dual-camera of the electronic device 1000.

In the electronic device 1000 of the embodiment of the present application, the bent substrate 11 and the chip 12 are arranged, so that the plurality of sub-substrates 110 of the substrate 11 are at an angle, and the plurality of sensing regions 120 of the chip 12 are all formed at an angle. An included angle enables the image sensor 10 of the embodiment of the present application to have a smaller projection area (such as the zy plane projection in FIG. 15) under the condition that the photosensitive pixels and pixel sizes remain unchanged, thereby occupying a smaller space. , The projection (such as the zy plane projection in FIG. 15) area size of the lens assembly 20 (as shown in FIG. 16) matched with it can also be reduced accordingly, which is beneficial to reduce the thickness of the electronic device 1000 in the z direction and realize the product The miniaturization and thinning. In contrast, the image sensor 10 of the embodiment of the present application can set a larger pixel size or a larger number of photosensitive pixels without increasing the projection area of the image sensor, thereby increasing the performance of the image sensor 10. The amount of light may increase the resolution of the image sensor 10, thereby helping to improve the imaging quality of the electronic device 1000 in the embodiment of the present application.

The reflecting elements 21 and 22 may be reflecting prisms or reflecting mirrors. The reflecting prism may be one of a total reflection prism, a total reflection tetraprism, and a total reflection pentaprism. Providing the reflective elements 21 and 22 in the electronic device 1000 enables the lens assembly 20 (as shown in FIG. 16) to be placed in the electronic device 1000 laterally (that is, the x direction), which is beneficial to reduce the thickness of the electronic device 1000 (that is, the z direction). Length), which is conducive to the thinning of electronic products. As shown in FIG. 16, the first reflective element 21 and the second reflective element 22 are both total reflection triangular prisms. The total reflection prism has a small loss of light during the reflection process, which helps to improve the imaging quality of the electronic device 1000.

The first lens structure 23 may include a plurality of lens groups 230, and the lens group 230 may include at least one lens. The second lens structure 24 may include a plurality of lens groups 240, and the lens group 240 may include at least one lens. In some embodiments, the positions of the plurality of lens groups 230 and the distance between the plurality of lens groups 230 may be fixed, and the positions of the plurality of lens groups 240 and the distance between the plurality of lens groups 240 may be fixed. At this time, the lens assembly 20 is a fixed focus lens assembly. In another embodiment, the imaging device 100 may further include a focal length adjustment device (not shown), the focal length adjustment device can adjust the positions of the plurality of lens groups 230 and the positions of the plurality of lens groups 240, for example, the first lens group can be adjusted The distance between 231 and the second lens group 232, and the distance between the first lens group 241 and the second lens group 242 can be adjusted. At this time, the lens assembly 20 is a zoom lens assembly. In still other embodiments, the imaging device 100 may further include a focal length adjustment device (not shown). The focal length adjustment device can adjust the positions of the plurality of lens groups 230, the positions of the plurality of lens groups 240, and the distance between the plurality of lens groups 240. The distance can be fixed. In still other embodiments, the imaging device 100 may further include a focal length adjustment device (not shown). The focal length adjustment device can adjust the positions of the plurality of lens groups 240, the positions of the plurality of lens groups 230, and the distance between the plurality of lens groups 230. The distance can be fixed. The focus adjustment device can be an electrostatic actuator device, an electromagnetic actuator device, a magnetostrictive actuator device, a piezoelectric actuator device, a piezoelectric motor, a stepping motor, and an electroactive polymer actuator device. one of them.

The description will be given below in conjunction with specific embodiments. In one embodiment, referring to FIGS. 15 and 16, the first lens structure 23 includes a first lens group 231 and a second lens group 232. The first lens group 231 includes three lenses, and the second lens group 232 includes two lenses. The second lens structure 24 may include a first lens group 241 and a second lens group 242, the first lens group 241 includes three lenses, and the second lens group 242 includes two lenses. The light transmitted from the outside along the first direction (that is, the opposite direction of z) is reflected by the first reflective element 21, and then passes through the first lens group 231 and the first lens group 231 of the first lens structure 23 in the second direction (that is, the x direction). After the two lens groups 232 are incident on the first sensing area 121 of the image sensor 10 for imaging, the light transmitted from the outside along the first direction (that is, the opposite direction of z) is reflected by the second reflecting element 22, and the light along the second direction The reverse direction (that is, the reverse direction of x) passes through the first lens group 241 and the second lens group 242 of the second lens structure 24 in sequence, and then is incident on the second sensing area 122 of the image sensor 10 for imaging. The substrate 11 of the image sensor 10 includes a first sub-substrate 111 and a second sub-substrate 112. The chip 12 of the image sensor 10 includes a first sensing area 121 and a second sensing area 122. The included angle between the first sub-substrate 111 and the second sub-substrate 112 is 45°. The included angle between the first sensing area 121 and the second sensing area 122 is also 45°. The chip 12 is disposed on the first surface 115 of the substrate 11. It can also be regarded as an angle of 315° between the first sub-substrate 111 and the second sub-substrate 112. An angle of 315° is formed between the first sensing area 121 and the second sensing area 122.

In the electronic device 1000 of the embodiment of the present application, the bent substrate 11 and the chip 12 are arranged so that the two sub-substrates 110 of the substrate 11 form an angle, and the two sensing regions 120 of the chip 12 form an angle. The first lens structure 23 and the second lens structure 24 respectively correspond to the first sensing area 121 and the second sensing area 122. The first reflecting element 21, the first lens structure 23 and the first sensing area 121 cooperate with imaging, and The two reflective elements 22, the second lens structure 24, and the second sensing area 122 cooperate for imaging, so that the electronic device 1000 of the embodiment of the present application has the function of dual cameras on the same side when only one image sensor 10 is used. While realizing the miniaturization and thinning of the product, it is beneficial to reduce the power consumption of the electronic device 1000. Moreover, when the first lens structure 23 and the second lens structure 24 work at the same time, external light enters the light through the first reflective element 21 and the second reflective element 22, which enables the imaging device 100 and the electronic device 1000 to have a wider field of view. In addition, The difference in the field angle of the external light incident through the first reflective element 21 and the second reflective element 22 is beneficial for binocular ranging or 3D modeling of objects in the field of view of the imaging device 100.

In another embodiment, referring to FIGS. 17 and 18, the first lens structure 23 includes a first lens group 231 and a second lens group 232. The first lens group 231 includes three lenses, and the second lens group 232 includes two lenses. The second lens structure 24 may include a first lens group 241 and a second lens group 242, the first lens group 241 includes three lenses, and the second lens group 242 includes two lenses. The light transmitted from the outside along the first direction (that is, the opposite direction of z) is reflected by the first reflective element 21, and then passes through the first lens group 231 and the first lens group 231 of the first lens structure 23 in the second direction (that is, the x direction). After the two lens groups 232 are incident on the first sensing area 121 of the image sensor 10 for imaging, the light transmitted from the outside along the opposite direction of the first direction (ie the z direction) is reflected by the second reflecting element 22 and then travels along the second direction. The opposite direction (that is, the opposite direction of x) passes through the first lens group 241 and the second lens group 242 of the second lens structure 24 in turn, and then is incident on the second sensing area 122 of the image sensor 10 for imaging. The substrate 11 of the image sensor 10 includes a first sub-substrate 111 and a second sub-substrate 112. The chip 12 of the image sensor 10 includes a first sensing area 121 and a second sensing area 122. The included angle between the first sub-substrate 111 and the second sub-substrate 112 is 45°. The included angle between the first sensing area 121 and the second sensing area 122 is also 45°. The chip 12 is disposed on the first surface 115 of the substrate 11. It can also be regarded as an angle of 315° between the first sub-substrate 111 and the second sub-substrate 112. An angle of 315° is formed between the first sensing area 121 and the second sensing area 122.

In the electronic device 1000 of the embodiment of the present application, the bent substrate 11 and the chip 12 are arranged so that the two sub-substrates 110 of the substrate 11 form an angle, and the two sensing regions 120 of the chip 12 form an angle. The first lens structure 23 and the second lens structure 24 respectively correspond to the first sensing area 121 and the second sensing area 122. The first reflecting element 21, the first lens structure 23 and the first sensing area 121 cooperate with imaging, and The two reflective elements 22, the second lens structure 24, and the second sensing area 122 cooperate for imaging, so that the image sensor 10 of the embodiment of the present application can have both a front camera and a rear camera when only one image sensor 10 is used. The function is conducive to miniaturization and thinning of the product. In addition, when the first lens structure 23 and the second lens structure 24 work at the same time, external light enters the light through the first reflective element 21 and the second reflective element 22, which enables the camera device 100 and the electronic device 1000 to have both front and rear views. It is beneficial to broaden the application scenarios of the electronic device 1000. In some embodiments, the electronic device 1000 can independently control one of the sensing areas 120 of the chip 12 of the image sensor 10 to work, while the other sensing areas 120 do not work. The power consumption of the electronic device 1000 is reduced in the rear view of the electronic device 1000.

Referring to FIG. 9, FIG. 12, FIG. 15, and FIG. 17, in some embodiments, the electronic device 1000 further includes a processor 300. Among them, in some embodiments, when the multiple sensing areas 120 are integrated, the processor 300 is used to process the total electrical signals of the multiple sensing areas 120 to output the target image; and, when the multiple sensing areas 120 are divided into In the case of the body structure, the processor 300 is used to process the electrical signal of each sensing area 120, output multiple intermediate images and synthesize multiple intermediate images to obtain the target image. In another embodiment, when the plurality of sensing regions 120 are in a single structure, the processor 300 is used to process the total electrical signals of the plurality of sensing regions 120 to output the target image; or, when the plurality of sensing regions 120 are in a split structure At this time, the processor 300 is used to process the electrical signal of each sensing area 120, output multiple intermediate images and synthesize multiple intermediate images to obtain the target image.

In addition, when the multiple sensing areas 120 are in a split structure, the multiple sensing areas 120 can output electrical signals separately, and the processor 300 is used to process the electrical signals of each sensing area 120 to output multiple intermediate images. The intermediate images can be Directly output as the target image.

In some embodiments, the processor 300 may be integrated in the image sensor 10. In another embodiment, the processor 300 may be provided independently of the image sensor 10 in the electronic device 1000.

The image sensor 10, the imaging device 100, and the electronic device 1000 of the embodiment of the present application are provided with a bent substrate 11 and a chip 12, so that a plurality of sub-substrates 110 of the substrate 11 are at an angle, and the number of chips 12 Each sensing area 120 has an included angle, so that the image sensor 10, the imaging device 100, and the electronic device 1000 of the embodiment of the present application can have a smaller projection area under the condition that the photosensitive pixels and pixel sizes remain unchanged. As a result, it occupies a smaller space, and the size of the lens assembly 20 matched with it can be correspondingly reduced, thereby facilitating the miniaturization and thinning of the product. In contrast, the image sensor 10, the imaging device 100, and the electronic device 1000 of the embodiment of the present application can be provided with a larger pixel size or a larger number of photosensitive pixels without increasing the projection area of the image sensor. , Thereby increasing the amount of light entering the image sensor 10 or increasing the resolution of the image sensor 10, thereby helping to improve the imaging quality of the image sensor 10, the imaging device 100, and the electronic device 1000 in the embodiments of the present application.

Although the embodiments of the present application have been shown and described above, it can be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present application. A person of ordinary skill in the art can comment on the foregoing within the scope of the present application. The embodiment undergoes changes, modifications and replacements.

Claims (21)

1. An image sensor, characterized in that it comprises:

   A bent substrate, the substrate includes a plurality of sub-substrates, and the adjacent sub-substrates are connected obliquely and have an included angle; and

   A bent chip arranged on the substrate, the chip including a plurality of sensing regions, the plurality of sensing regions correspond to a plurality of the sub-substrates, and the adjacent sensing regions are connected obliquely and are in the same shape Angle.
2. The image sensor according to claim 1, wherein the image sensor is symmetrical about the central axis of the image sensor.
3. The image sensor according to claim 2, wherein the substrate comprises a first surface and a second surface opposite to each other; wherein:

   The chip is arranged on the first surface; or

   The chip is arranged on the second surface.
4. 3. The image sensor according to claim 2, wherein the included angle between the adjacent sub-substrates is the same as the included angle between the corresponding adjacent sensing regions.
5. 4. The image sensor according to claim 4, wherein multiple groups of adjacent sub-substrates form a plurality of included angles, and the plurality of included angles are the same or partly the same with each other.
6. The image sensor according to claim 5, wherein each of the included angles is greater than or equal to 45 degrees and less than 180 degrees.
7. The image sensor according to claim 1, wherein:

   The substrate is an integral structure, and the chip is an integral structure; or

   The substrate is a one-piece structure, and a plurality of the sensing regions are a split structure; or

   A plurality of the sub-substrates are in a split structure, and the chips are in an integrated structure; or

   A plurality of the sub-substrates have a split structure, and a plurality of the sensing regions have a split structure.
8. The image sensor according to claim 1, wherein the difference between the included angle between the adjacent sub-substrates and the curvature of the imaging image plane of the lens is within ±10% of the curvature.
9. A camera device, characterized in that it comprises:

   Image sensor; and

   Lens assembly, where light passes through the lens assembly and is incident on the image sensor for imaging;

   The image sensor includes:

   A bent substrate, the substrate includes a plurality of sub-substrates, and the adjacent sub-substrates are connected obliquely and have an included angle; and

   A bent chip arranged on the substrate, the chip including a plurality of sensing regions, the plurality of sensing regions correspond to a plurality of the sub-substrates, and the adjacent sensing regions are connected obliquely and are in the same shape Angle.
10. The imaging device according to claim 9, wherein the lens assembly comprises a plurality of lens groups, and light transmitted from the outside along the first direction passes through the plurality of lens groups and then enters the plurality of lens groups of the image sensor. The sensing area.
11. The imaging device according to claim 9, wherein the lens assembly includes a reflective element and a plurality of lens groups, and light transmitted from the outside along the first direction is reflected by the reflective element and enters along the second direction. After the plurality of lens groups are incident on the plurality of sensing regions of the image sensor, the first direction is different from the second direction.
12. 8. The imaging device according to claim 9, wherein the lens assembly includes a first reflective element, a second reflective element, a first lens structure, and a second lens structure, and the plurality of sensing regions include a first sensing element. Area and a second sensing area, the first reflecting element and the first lens structure are located on the first side of the image sensor and opposite to the first sensing area, the second reflecting element and the second lens structure Located on the second side of the image sensor and opposite to the second sensing area, and the first side is opposite to the second side;

    The light transmitted from the outside in the first direction is reflected by the first reflecting element, enters the first lens structure in the second direction, and is incident on the first sensing area, and the light transmitted from the outside in the first direction After the light is reflected by the second reflective element, it enters the second lens structure along a direction opposite to the second direction and is incident on the second sensing area. The first direction is different from the second direction.
13. 9. The imaging device according to claim 9, wherein the image sensor is symmetrical with respect to a central axis of the image sensor.
14. The imaging device according to claim 10, wherein the substrate comprises a first surface and a second surface opposite to each other; wherein:

    The chip is arranged on the first surface; or

    The chip is arranged on the second surface.
15. 10. The imaging device according to claim 10, wherein the included angle between the adjacent sub-substrates is the same as the included angle between the corresponding adjacent sensing regions.
16. The imaging device according to claim 12, wherein a plurality of groups of adjacent sub-substrates form a plurality of included angles, and the plurality of included angles are the same or partly the same with each other.
17. The imaging device according to claim 13, wherein each of the included angles is greater than or equal to 45 degrees and less than 180 degrees.
18. The imaging device according to claim 9, wherein:

    The substrate is an integral structure, and the chip is an integral structure; or

    The substrate is a one-piece structure, and a plurality of the sensing regions are a split structure; or

    A plurality of the sub-substrates are in a split structure, and the chips are in an integrated structure; or

    A plurality of the sub-substrates have a split structure, and a plurality of the sensing regions have a split structure.
19. 9. The imaging device according to claim 9, wherein the difference between the included angle between the adjacent sub-substrates and the curvature of the imaging image plane of the lens is within ±10% of the curvature.
20. An electronic device, characterized in that, the electronic device includes:

    Shell; and

    The imaging device according to any one of claims 9-19, wherein the imaging device is combined with the housing.
21. The electronic device according to claim 20, wherein the electronic device further comprises a processor, wherein:

    When multiple sensing areas are integrated, the processor is used to process the total electrical signals of the multiple sensing areas to output a target image; and/or

    When the multiple sensing areas are in a split structure, the processor is used to process the electrical signal of each of the sensing areas to output multiple intermediate images and to synthesize multiple intermediate images to obtain a target image.

Images