WO2021197713A1 - Workpiece carrier and mold for joining an electric circuit carrier - Google Patents

Workpiece carrier and mold for joining an electric circuit carrier Download PDF

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Publication number
WO2021197713A1
WO2021197713A1 PCT/EP2021/054360 EP2021054360W WO2021197713A1 WO 2021197713 A1 WO2021197713 A1 WO 2021197713A1 EP 2021054360 W EP2021054360 W EP 2021054360W WO 2021197713 A1 WO2021197713 A1 WO 2021197713A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
workpiece carrier
joining
designed
recess
Prior art date
Application number
PCT/EP2021/054360
Other languages
German (de)
French (fr)
Inventor
Dennis Sommerfeld
Ulrich Wittreich
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO2021197713A1 publication Critical patent/WO2021197713A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
    • H01L2224/2733—Manufacturing methods by local deposition of the material of the layer connector in solid form
    • H01L2224/27334—Manufacturing methods by local deposition of the material of the layer connector in solid form using preformed layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars

Definitions

  • the invention relates to a form for joining an electrical circuit carrier.
  • the invention also relates to a workpiece carrier for the mold and a system comprising a mold and workpiece carrier.
  • Such a shape is used for soldering, in particular for contact soldering electrical circuit carriers and their joining materials, in particular solder preforms.
  • the invention is based on the object of improving the heat input by means of a joining method and increasing the quality of the joint connections.
  • the mold for use to join an electrical circuit carrier has at least one first recess for receiving a joining material, in particular a preformed solder part.
  • the mold also has at least one second recess for receiving a substrate.
  • the recesses are arranged in such a way that the joining material and the substrate can be arranged in the mold in such a way that they can form a joint, in particular a soldered connection, by heating the mold and thus heating both the joining material and the substrate.
  • the mold is reusable and can be separated from the substrate with the joining material attached to the substrate.
  • the mold also has a contact surface which is formed for thermal contact with a heating plate. The contact surface can be a surface that is in particularly good thermal contact with the mold.
  • the contact surface is preferably designed monolithically with the shape of a metal with good thermal conductivity.
  • the mold has a delimiting element which is arranged with respect to the first recess and the second recess that the substrate only dips into the joining material up to the delimiting element during the joining process.
  • the joining material is therefore arranged under half of the substrate and in the unjoined state the substrate can rest on the joining material.
  • the delimiting element limits the immersion of the substrate into the joining material. This has the advantage that an optimal joining material thickness is always available.
  • the mold has a bearing element which is designed in such a way that the mold can be at least partially tiltable in a workpiece carrier.
  • the bearing element is designed in such a way that when the mold stands up with its contact surface, the mold can partially perform a tilting movement by a few degrees in order to compensate for any inequalities on a heating plate.
  • the mold has a bearing element which is designed such that the mold is movable in at least the Z direction. If the contact surface is now on the heating surface, the shape can adapt to the respective position on the heating surface. This continues to improve the heat input. If several shapes are arranged in a workpiece carrier, a relief-like structure can be compensated for by the shapes.
  • the Z-direction is the direction in which the mold can be removed from the workpiece carrier and must be distinguished from the dimensions in which the workpiece carrier spreads out. Movable in the Z direction means that a movement can be carried out at least in the positive or negative Z direction. The movement can be limited in both directions by the workpiece carrier.
  • the mold has a third recess which is formed to accommodate an electrical component. This third cutout is arranged in such a way that the electrical component can be joined to the substrate arranged in the second cutouts with the joining material arranged in the first cutouts. This can be designed, for example, in such a way that the electrical component is first positioned in the mold, followed by the joining material, then the substrate is placed on it and all joints are made in a single joining process.
  • the shape has at least one registration mark.
  • the registration mark is arranged in such a way that it can be detected by machine when the shape is arranged in the workpiece carrier.
  • the registration marks can be optical identification marks which both indicate the orientation of the shape or enable it to be recognized and, if necessary, enable the respective shape to be identified.
  • the task is also solved by a workpiece carrier, which is used to join an electrical circuit carrier.
  • the workpiece carrier has a frame and one or more receptacles.
  • the receptacles are each designed to receive a mold according to the invention. It is conceivable that several forms can be recorded per recording.
  • the receptacles are furthermore formed in such a way that the shapes in the receptacles can be moved and / or at least partially tilted in at least the Z direction.
  • the frame can consist of a cheap material, since it does not have to bear the thermal load of the joining process, but only has to provide a certain insulation. The thermal load is completely or at least almost completely borne by the individual shapes.
  • the thermal mass that has to be heated is also smaller, since only individual molds have to be heated and not the entire product carrier.
  • the receptacles have one or more holding elements which are designed in such a way that the mold is held during transport and / or that the mold rests on a heating plate during a joining process.
  • the mold stands with its contact surface on the heating plate.
  • the frame in connection with the Hal teiatan is designed so that the shape always represents the lowest point and thus always creates good thermal contact when the workpiece carrier is placed on a heating element. This can be done, for example, by gravity.
  • the recesses are designed in such a way that the shapes can tilt around at least the X-direction and / or the Y-direction by an angle of ⁇ 20 °.
  • This angle is preferably ⁇ 10 and / or ⁇ 5 °. This can be done especially in connection with Hal teiatan, which allow such tilting in connection with the Lagerelemen th of the forms.
  • the frame of the workpiece carrier consists at least partially of plastic. This allows a simple and cost-effective manufacture of the frame mens. Due to the shapes that absorb the thermal load, the frame can accordingly be configured more simply.
  • the recesses in particular the holding elements, are formed in connection with the storage elements of the molds for hanging the molds in the Aussparun conditions.
  • hanging in the Z direction has proven to be advantageous.
  • the recesses can be designed in such a way that the molds can be clicked in once, so that the molds are movably mounted, but can no longer be removed in the Z direction, but can be removed with a tool or gentle pressure, if necessary. This has particular advantages le, if the workpiece carrier is emptied by turning it around.
  • the object is also achieved by a workpiece carrier system which has at least one workpiece carrier according to one of the preceding embodiments and a shape according to the invention.
  • the carrier consists of an at least partially elastic material and / or has at least partially elastic elements, so that the workpiece carrier supports adaptation to a heating plate.
  • the workpiece carrier is formed from a material with a lower thermal conductivity compared to the molds.
  • the two-part design is particularly advantageous here, as it allows the heat to be directed into the molds in a targeted manner.
  • the shapes have a higher manufacturing accuracy compared to the workpiece carrier.
  • the frame of the workpiece carrier can be done by a simple process, for. B. plastic injection molding or plastic 3D printing, and does not have to have a particularly high manufacturing accuracy.
  • the shapes are adapted to the joining process or even the corresponding assembly and can have a very high manufacturing accuracy. As a system, there is thus an overall favorable possibility of achieving a high level of manufacturing accuracy and accuracy.
  • the system has a hold-down element which exerts a force on the elements to be joined in the mold.
  • the hold-down element can be designed as a weight that is always positioned last in the mold.
  • the hold-down element can also be an automatic controlled hold-down device, which affects a force defined by the joining process on the respective elements in the mold.
  • the elements in the mold can be electrical components, joining material and substrates.
  • FIG. 1 shows a workpiece carrier with an inserted therein
  • FIG. 4 shows a cross section through a workpiece carrier on a heating plate
  • FIG. 1 shows a workpiece carrier 100, having a frame 110 and several receptacles 150.
  • the receptacles 150 form the receptacles for, in this case, a mold 200, the workpiece carrier 100 having space for up to eight molds 200.
  • a coordinate system is included where the X and Y directions X, Y describe the plane of the workpiece carrier and the Z direction describe the direction emerging perpendicularly from the workpiece carrier or its plane.
  • the form 200 can be inserted into the receptacle 150 in the Z direction.
  • the frame 150 is designed so that the contact surface of the mold 200, not shown here, comes into direct contact with the heating plate when the workpiece carrier 100 is placed on a heating plate and enables the best possible heat transfer into the mold.
  • the form 200 has first recesses 210 for receiving rectangular joining materials 310, 320 and a round joining material than 330 on.
  • the restriction element 235 is arranged above the first recess 210 in such a way that the immersion of the substrate 300 is precisely defined.
  • the joining material 320 is already inserted in the recess provided, and it is advantageous if something protrudes from the recess below, an optimal contact to the substrate 300 can be made.
  • the mold 200 also has three registration marks 250, a fourth corner being free of a registration mark 250 in order to be able to determine the orientation of the mold 200.
  • a bearing element 205 is shown, which is arranged as a circumferential lip on the mold 200 and can thus rest on a counterpart of the workpiece carrier 100.
  • the bearing element 205 could have notches that engage in lugs of the workpiece carrier 100, which allows an inclination around the X or Y direction and / or a movement in the Z direction, but other degrees of freedom - that is, a movement in X and or prevent Y-direction.
  • the recesses 210, 220, 230 can be of the same depth.
  • the recesses 210, 220, 230 are adapted to architectures with different levels and have different depths. So that z. B. a substrate 300 later when joining (soldering) on circuit boards in the area of the chips can always be contacted over a large area z. B. the round solder contacts be slightly higher than the rectangular ones, so that they can only wet after the wetting and the associated sinking of the chips. Thus, the chip area is always connected advantageously with the largest possible solder material cross-section.
  • FIG 3 shows a workpiece carrier 100 in cross section.
  • the receptacles 150 are already filled with molds 200.
  • Wei terhin is the X, Y, Z coordinate system known from FIG drawn, where the XY plane denotes the plane of the goods carrier.
  • Holding elements 160 are used to hold and store the molds 200. In this case, the holding elements 160 are designed such that a movement in the Z direction and a tilting around the Y axis is possible. Limitations are provided in the positive and negative Z directions so that the mold 200 cannot tilt or move too far out of the receptacle 150. Tilting of the forms 200 can also be effectively prevented in this way.
  • the contact surface 203 which is located on the underside of the molds 200, is also shown, so that it can establish particularly good contact with a heating plate. It is particularly advantageous that different For men 200 can be combined in one soldering process so that, for. B. the substrates required for a complete inverter circuit can be joined in a soldering process under defined and traceable process conditions.
  • FIG. 4 shows the goods carrier known from FIG. 3 on a slightly curved heating plate 10. It is shown that the frame remains stiff, with the shapes being able to tilt in their receptacles by an angle cp and still being able to move up and down in the Z direction . In this case, the shapes 200 cannot be pushed out completely from the frame 110 in the Z direction, since the receptacles 150 have delimiting elements which prevent them from being pushed out. Although this limits the maximum height that can be compensated for, it contributes to the stability of the workpiece carrier 100.
  • FIG. 5 shows a workpiece carrier which does not have the present embodiment according to the invention and which likewise rests on a curved heating plate 10, which results in problematic heat transfer conditions.
  • the marking 55 it can be seen that the outer shape no longer touches the heating plate and is therefore only heated by convection, which would result in an unsatisfactory or defective joint.
  • the middle ren two forms are on the heating plate 10, but this results in a high level of rejects in this batch.
  • the invention relates to a mold (200) for joining an electrical circuit carrier.
  • the invention also relates to a workpiece carrier (100) for the mold (200) and a system comprising a mold (200) and workpiece carrier
  • a mold (200) for joining an electrical circuit carrier, have at least one first recess (210) for receiving a joining material (310, 320, 330), in particular a preformed solder part, and at least one second recess (220) for receiving a substrate (300).
  • the mold (200) also has a contact surface (203) which is designed for thermal contacting of a heating plate (10).

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

The invention relates to a mold (200) for joining an electric circuit carrier. The invention additionally relates to a workpiece carrier (100) for the mold (200) and to a system consisting of a mold (200) and a workpiece carrier (100). In order to improve the heat input produced by means of a joining process and increase the quality of the joint connections, a mold (200) is provided with at least one first recess (210) for receiving a joining material (310, 220, 330), in particular a solder preform, and at least one second recess (220) for receiving a substrate (300) in order to join an electric circuit carrier. The mold (200) additionally has a contact surface (203) which is designed to thermally contact a heating plate (10).

Description

Beschreibung description
Werkstückträger und Form zum Fügen eines elektrischen Schal tungsträgers Workpiece carrier and form for joining an electrical circuit carrier
Die Erfindung betrifft eine Form zum Fügen eines elektrischen Schaltungsträgers . Die Erfindung betrifft weiterhin einen Werkstückträger für die Form sowie ein System aus Form und Werkstückträger . The invention relates to a form for joining an electrical circuit carrier. The invention also relates to a workpiece carrier for the mold and a system comprising a mold and workpiece carrier.
Eine derartige Form kommt zum Löten, insbesondere zum Kon taktlöten von elektrischen Schaltungsträgern und deren Füge materialien, insbesondere von Lotpreforms, zum Einsatz. Such a shape is used for soldering, in particular for contact soldering electrical circuit carriers and their joining materials, in particular solder preforms.
Der Erfindung liegt die Aufgabe zugrunde, den Wärmeeintrag durch ein Fügeverfahren zu verbessern und die Qualität der Fügeverbindungen zu erhöhen. The invention is based on the object of improving the heat input by means of a joining method and increasing the quality of the joint connections.
Um diese Aufgabe zu lösen, weist die Form zur Verwendung zum Fügen eines elektrischen Schaltungsträgers zumindest eine erste Aussparung zur Aufnahme eines Fügematerials, insbeson dere eines Lotformteiles auf. Die Form weist weiterhin zumin dest eine zweite Aussparung zur Aufnahme eines Substrates auf. Die Aussparungen sind dabei derart angeordnet, dass das Fügematerial und das Substrat so in der Form angeordnet wer den können, dass sie durch Erwärmen der Form und damit Erwär men von sowohl dem Fügematerial und dem Substrat eine Füge verbindung, insbesondere eine Lötverbindung, eingehen können. Die Form ist dabei wiederverwendbar und kann dabei von dem Substrat mit dem an das Substrat gefügten Fügematerial ge trennt werden. Die Form weist weiterhin eine Kontaktfläche auf, die zur thermischen Kontaktierung einer Heizplatte aus gebildet ist. Die Kontaktfläche kann dabei eine Fläche sein, die in besonders gutem thermischem Kontakt mit der Form steht. Vorzugsweise ist die Kontaktfläche monolithisch mit der Form aus einem gut wärmeleitenden Metall ausgebildet. In einer weiteren Ausführungsform weist die Form ein Begren zungselement auf, das so bezüglich der ersten Aussparung und der zweiten Aussparung angeordnet ist, dass das Substrat wäh rend des Fügevorganges nur bis zu dem Begrenzungselement in das Fügematerial eintaucht. Das Fügematerial ist also unter halb des Substrats angeordnet und im ungefügten Zustand kann das Substrat auf dem Fügematerial aufliegen. Durch Wärmeein wirkung und Aufschmelzen des Fügematerials kann sich das Sub strat noch etwas weiter in die Form hineinbewegen, um aber eine ausreichende Fügematerialstärke zu gewährleisten, be grenzt das Begrenzungselement das Eintauchen des Substrates in das Fügematerial. Dies hat den Vorteil, dass immer eine optimale Fügematerialstärke zur Verfügung steht. In order to achieve this object, the mold for use to join an electrical circuit carrier has at least one first recess for receiving a joining material, in particular a preformed solder part. The mold also has at least one second recess for receiving a substrate. The recesses are arranged in such a way that the joining material and the substrate can be arranged in the mold in such a way that they can form a joint, in particular a soldered connection, by heating the mold and thus heating both the joining material and the substrate. The mold is reusable and can be separated from the substrate with the joining material attached to the substrate. The mold also has a contact surface which is formed for thermal contact with a heating plate. The contact surface can be a surface that is in particularly good thermal contact with the mold. The contact surface is preferably designed monolithically with the shape of a metal with good thermal conductivity. In a further embodiment, the mold has a delimiting element which is arranged with respect to the first recess and the second recess that the substrate only dips into the joining material up to the delimiting element during the joining process. The joining material is therefore arranged under half of the substrate and in the unjoined state the substrate can rest on the joining material. By the action of heat and melting of the joining material, the substrate can move a little further into the mold, but in order to ensure sufficient joining material strength, the delimiting element limits the immersion of the substrate into the joining material. This has the advantage that an optimal joining material thickness is always available.
In einer weiteren Ausführungsform weist die Form ein La gerelement auf, das so ausgestaltet ist, dass die Form zumin dest teilweise kippbar in einem Werkstückträger lagerbar ist. Das Lagerelement ist dabei so ausgebildet, dass, wenn die Form mit ihrer Kontaktfläche aufsteht, die Form teilweise ei ne Kippbewegung um wenige Grad ausführen kann, um ggf. Un gleichheiten auf einer Heizplatte auszugleichen. In a further embodiment, the mold has a bearing element which is designed in such a way that the mold can be at least partially tiltable in a workpiece carrier. The bearing element is designed in such a way that when the mold stands up with its contact surface, the mold can partially perform a tilting movement by a few degrees in order to compensate for any inequalities on a heating plate.
In einer weiteren Ausführungsform weist die Form ein La gerelement auf, das so ausgebildet ist, dass die Form in zu mindest der Z-Richtung beweglich ist. Wenn nun die Kontakt fläche auf der Heizfläche aufsteht, so kann sich die Form an die jeweilige Position auf der Heizfläche anpassen. Dies ver bessert den Wärmeeintrag weiterhin. Sind mehrere Formen in einem Werkstückträger angeordnet, so kann eine reliefartige Struktur durch die Formen ausgeglichen werden. In a further embodiment, the mold has a bearing element which is designed such that the mold is movable in at least the Z direction. If the contact surface is now on the heating surface, the shape can adapt to the respective position on the heating surface. This continues to improve the heat input. If several shapes are arranged in a workpiece carrier, a relief-like structure can be compensated for by the shapes.
Die Z-Richtung ist dabei die Richtung, in der die Form aus dem Werkstückträger entnommen werden kann, und ist dabei zu unterscheiden von den Dimensionen, in denen der Werkstückträ ger sich ausbreitet. In Z-Richtung beweglich heißt, dass zu mindest in positive oder in negative Z-Richtung eine Bewegung ausgeführt werden kann. Die Bewegung kann dabei durch den Werkstückträger in beide Richtungen begrenzt sein. In einer weiteren Ausführungsform weist die Form eine dritte Aussparung, die zur Aufnahme eines elektrischen Bauteils aus gebildet ist, auf. Diese dritte Aussparung ist dabei so ange ordnet, dass mit dem in den ersten Aussparungen angeordneten Fügematerial das elektrische Bauteil an das in den zweiten Aussparungen angeordnete Substrat gefügt werden kann. Dies kann beispielsweise so gestaltet sein, dass das elektrische Bauteil als Erstes in die Form positioniert wird, darauf das Fügematerial, um abschließend das Substrat darauf zu legen und in einem einzigen Fügevorgang alle Fügeverbindungen fer tigzustellen . The Z-direction is the direction in which the mold can be removed from the workpiece carrier and must be distinguished from the dimensions in which the workpiece carrier spreads out. Movable in the Z direction means that a movement can be carried out at least in the positive or negative Z direction. The movement can be limited in both directions by the workpiece carrier. In a further embodiment, the mold has a third recess which is formed to accommodate an electrical component. This third cutout is arranged in such a way that the electrical component can be joined to the substrate arranged in the second cutouts with the joining material arranged in the first cutouts. This can be designed, for example, in such a way that the electrical component is first positioned in the mold, followed by the joining material, then the substrate is placed on it and all joints are made in a single joining process.
In einer weiteren Ausführungsform weist die Form zumindest eine Passermarke auf. Die Passermarke ist dabei so angeord net, dass sie maschinell erfassbar ist, wenn die Form im Werkstückträger angeordnet ist. Die Passermarken können dabei optische Erkennungsmarken sein, die sowohl die Orientierung der Form anzeigen bzw. deren Erkennung ermöglichen als auch ggf. eine Identifizierung der jeweiligen Form ermöglichen. In a further embodiment, the shape has at least one registration mark. The registration mark is arranged in such a way that it can be detected by machine when the shape is arranged in the workpiece carrier. The registration marks can be optical identification marks which both indicate the orientation of the shape or enable it to be recognized and, if necessary, enable the respective shape to be identified.
Die Aufgabe wird weiterhin durch einen Werkstückträger ge löst, der zum Fügen eines elektrischen Schaltungsträgers dient. Der Werkstückträger weist dabei einen Rahmen und ein oder mehrere Aufnahmen auf. Die Aufnahmen sind dabei jeweils zur Aufnahme von einer erfindungsgemäßen Form ausgebildet. Es ist denkbar, dass pro Aufnahme auch mehrere Formen aufgenom men werden können. Die Aufnahmen sind dabei weiterhin so aus gebildet, dass die Formen in den Aufnahmen in zumindest Z- Richtung beweglich und/oder zumindest teilweise kippbar sind. Der Rahmen kann dabei aus einem günstigen Material bestehen, da dieses die thermische Last des Fügeverfahrens nicht tragen muss, sondern nur eine gewisse Isolierung bereitstellen muss. Die thermische Last wird dabei vollständig bzw. zumindest fast vollständig von den einzelnen Formen getragen. Besonders von Vorteil ist, dass auch die thermische Masse, die erwärmt werden muss, kleiner wird, da so nur noch einzelne Formen er wärmt werden müssen und nicht der ganze Warenträger. In einer weiteren Ausführungsform weisen die Aufnahmen ein oder mehrere Halteelemente auf, die so ausgebildet sind, dass die Form während eines Transportes gehalten wird und/oder dass die Form während eines Fügevorganges auf einer Heizplat te aufsteht. Die Form steht dabei mit ihrer Kontaktfläche auf der Heizplatte auf. Der Rahmen in Verbindung mit den Hal teelementen ist dabei so ausgestaltet, dass die Form immer den niedrigsten Punkt darstellt und somit bei einem Abstellen des Werkstückträgers auf einem Heizelement immer einen guten Wärmekontakt herstellt. Dies kann beispielsweise durch die Schwerkraft geschehen. The task is also solved by a workpiece carrier, which is used to join an electrical circuit carrier. The workpiece carrier has a frame and one or more receptacles. The receptacles are each designed to receive a mold according to the invention. It is conceivable that several forms can be recorded per recording. The receptacles are furthermore formed in such a way that the shapes in the receptacles can be moved and / or at least partially tilted in at least the Z direction. The frame can consist of a cheap material, since it does not have to bear the thermal load of the joining process, but only has to provide a certain insulation. The thermal load is completely or at least almost completely borne by the individual shapes. It is particularly advantageous that the thermal mass that has to be heated is also smaller, since only individual molds have to be heated and not the entire product carrier. In a further embodiment, the receptacles have one or more holding elements which are designed in such a way that the mold is held during transport and / or that the mold rests on a heating plate during a joining process. The mold stands with its contact surface on the heating plate. The frame in connection with the Hal teelementen is designed so that the shape always represents the lowest point and thus always creates good thermal contact when the workpiece carrier is placed on a heating element. This can be done, for example, by gravity.
In einer weiteren Ausführungsform sind die Aussparungen so ausgebildet, dass die Formen um zumindest die X-Richtung und/oder die Y-Richtung eine Kippung um einen Winkel von < 20° ausführen können. Vorzugsweise ist dieser Winkel < 10 und/oder < 5°. Dies kann vor allem in Verbindung mit Hal teelementen geschehen, die in Verbindung mit den Lagerelemen ten der Formen eine derartige Kippung ermöglichen. In a further embodiment, the recesses are designed in such a way that the shapes can tilt around at least the X-direction and / or the Y-direction by an angle of <20 °. This angle is preferably <10 and / or <5 °. This can be done especially in connection with Hal teelementen, which allow such tilting in connection with the Lagerelemen th of the forms.
In einer weiteren Ausführungsform besteht der Rahmen des Werkstückträgers zumindest teilweise aus Kunststoff. Dies er möglicht eine einfache und kosteneffektive Fertigung des Rah mens. Durch die Formen, die die thermische Last aufnehmen, kann der Rahmen dementsprechend einfacher ausgestaltet wer den. In a further embodiment, the frame of the workpiece carrier consists at least partially of plastic. This allows a simple and cost-effective manufacture of the frame mens. Due to the shapes that absorb the thermal load, the frame can accordingly be configured more simply.
In einer weiteren Ausführungsform sind die Aussparungen, ins besondere die Halteelemente, in Verbindung mit den Lagerele menten der Formen zum Einhängen der Formen in die Aussparun gen ausgebildet. Insbesondere hat sich das Einhängen in Z- Richtung als vorteilhaft herausgestellt. Die Aussparungen können dabei so ausgestaltet sein, dass die Formen einmalig Eingeklickt werden können, sodass die Formen zwar beweglich gelagert sind, aber nicht mehr in Z-Richtung herausgenommen werden können, sondern ggf. durch ein Werkzeug oder sanften Druck entfernt werden können. Dies hat besonders dann Vortei- le, wenn der Werkstückträger durch ein Umdrehen entleert wird. In a further embodiment, the recesses, in particular the holding elements, are formed in connection with the storage elements of the molds for hanging the molds in the Aussparun conditions. In particular, hanging in the Z direction has proven to be advantageous. The recesses can be designed in such a way that the molds can be clicked in once, so that the molds are movably mounted, but can no longer be removed in the Z direction, but can be removed with a tool or gentle pressure, if necessary. This has particular advantages le, if the workpiece carrier is emptied by turning it around.
Die Aufgabe wird weiterhin durch ein Werkstückträgersystem gelöst, das zumindest einen Werkstückträger gemäß einer der vorangehenden Ausführungsformen sowie eine erfindungsgemäße Form aufweist. The object is also achieved by a workpiece carrier system which has at least one workpiece carrier according to one of the preceding embodiments and a shape according to the invention.
In einer weiteren Ausführungsform besteht der Träger aus ei nem zumindest teilweise elastischen Material und/oder weist zumindest teilweise elastische Elemente auf, sodass der Werk stückträger eine Anpassung an eine Heizplatte unterstützt. In a further embodiment, the carrier consists of an at least partially elastic material and / or has at least partially elastic elements, so that the workpiece carrier supports adaptation to a heating plate.
In einer weiteren Ausführungsform ist der Werkstückträger im Vergleich zu den Formen aus einem Material mit einer niedri geren Wärmeleitfähigkeit ausgebildet. Die zweiteilige Ausge staltung ist hier besonders vorteilhaft, da so die Wärme ge zielt in die Formen geleitet werden kann. In a further embodiment, the workpiece carrier is formed from a material with a lower thermal conductivity compared to the molds. The two-part design is particularly advantageous here, as it allows the heat to be directed into the molds in a targeted manner.
In einer weiteren Ausführungsform weisen die Formen im Ver gleich zum Werkstückträger eine höhere Fertigungsgenauigkeit auf. Der Rahmen des Werkstückträgers kann dabei durch ein einfaches Verfahren, z. B. Kunststoff-Spritzguss oder Kunst stoff-3D-Druck, gefertigt werden und muss dabei keine beson ders hohe Fertigungsgenauigkeit haben. Die Formen sind dabei auf das Fügeverfahren bzw. sogar die entsprechende Baugruppe angepasst und können dabei eine sehr hohe Fertigungsgenauig keit aufweisen. Als System ergibt sich so eine insgesamt günstige Möglichkeit, eine hohe Fertigungsgenauigkeit und Fü gegenauigkeit zu erreichen. In a further embodiment, the shapes have a higher manufacturing accuracy compared to the workpiece carrier. The frame of the workpiece carrier can be done by a simple process, for. B. plastic injection molding or plastic 3D printing, and does not have to have a particularly high manufacturing accuracy. The shapes are adapted to the joining process or even the corresponding assembly and can have a very high manufacturing accuracy. As a system, there is thus an overall favorable possibility of achieving a high level of manufacturing accuracy and accuracy.
In einer weiteren Ausführungsform weist das System ein Nie- derhalteelement auf, das auf die in der Form zu fügenden Ele mente eine Kraft auswirkt. Dies bewirkt vorteilhaft, dass für den Fügevorgang eine gleichmäßige Kraftverteilung erreicht wird. Das Niederhalterelement kann als ein Gewicht, dass je weils als letztes in die Form positioniert wird ausgebildet seien. Das Niederhalterelement kann aber ebenso eine automa- tisiert gesteuerte Niederhaltevorrichtung sein, die eine vom Fügeprozess definierte Kraft auf die jeweiligen Elemente in der Form auswirkt. Die Elemente in der Form können elektri sche Bauteile, Fügematerial und Substrate sein. In a further embodiment, the system has a hold-down element which exerts a force on the elements to be joined in the mold. This has the advantageous effect that a uniform force distribution is achieved for the joining process. The hold-down element can be designed as a weight that is always positioned last in the mold. The hold-down element can also be an automatic controlled hold-down device, which affects a force defined by the joining process on the respective elements in the mold. The elements in the mold can be electrical components, joining material and substrates.
Im Folgenden wird die Erfindung anhand der in den Figuren dargestellten Ausführungsbeispiele näher beschrieben und er läutert. Es zeigen: In the following, the invention is described and explained in more detail using the exemplary embodiments shown in the figures. Show it:
FIG 1 einen Werkstückträger mit einer darin eingelegten1 shows a workpiece carrier with an inserted therein
Form, Shape,
FIG 2 eine Form mit Fügematerial und einem Substrat,2 shows a mold with joining material and a substrate,
FIG 3 einen Querschnitt durch einen Werkstückträger,3 shows a cross section through a workpiece carrier,
FIG 4 einen Querschnitt durch einen Werkstückträger auf einer Heizplatte und 4 shows a cross section through a workpiece carrier on a heating plate and
FIG 5 eine Darstellung von problematischen Wärmeübertra gungsverhältnissen durch einen nicht optimalen Werkstückträger 5 shows a representation of problematic heat transfer conditions through a non-optimal workpiece carrier
FIG 1 zeigt einen Werkstückträger 100, aufweisend einen Rah men 110 sowie mehrere Aufnahmen 150. Die Aufnahmen 150 bilden dabei die Aufnahmen für in diesem Fall eine Form 200, wobei der Werkstückträger 100 Platz für bis zu acht Formen 200 auf weist. Weiterhin ist ein Koordinatensystem eingerechnet, wo bei die X- und die Y-Richtung X, Y, die Ebene des Werkstück trägers beschreiben und die Z-Richtung die aus dem Werkstück träger bzw. dessen Ebene senkrecht heraustretende Richtung beschreiben. Die Form 200 ist dabei in Z-Richtung in die Auf nahme 150 einlegbar. Der Rahmen 150 ist dabei so gestaltet, dass die hier nicht gezeigte Kontaktfläche der Form 200 bei einem Ablegen des Werkstückträgers 100 auf eine Heizplatte direkt mit der Heizplatte in Kontakt kommt und eine bestmög liche Wärmeübertragung in die Form ermöglicht. 1 shows a workpiece carrier 100, having a frame 110 and several receptacles 150. The receptacles 150 form the receptacles for, in this case, a mold 200, the workpiece carrier 100 having space for up to eight molds 200. Furthermore, a coordinate system is included where the X and Y directions X, Y describe the plane of the workpiece carrier and the Z direction describe the direction emerging perpendicularly from the workpiece carrier or its plane. The form 200 can be inserted into the receptacle 150 in the Z direction. The frame 150 is designed so that the contact surface of the mold 200, not shown here, comes into direct contact with the heating plate when the workpiece carrier 100 is placed on a heating plate and enables the best possible heat transfer into the mold.
FIG 2 zeigt eine Ausführungsform einer Form 200. Die Form 200 weist dabei erste Aussparungen 210 zur Aufnahme von recht eckigen Fügematerialen 310, 320 und eines runden Fügemateri- als 330 auf. Eine Ebene darüber befindet sich eine zweite Aussparung 220, die zur Aufnahme des hier noch oberhalb der Form 200 dargestellten Substrates 300 ausgebildet ist. Damit das Substrat 300 nicht zu tief in die Form eintaucht und so eine ausreichende Fügematerialstärke gewährleistet, weist die Form 200 ein Beschränkungselement 235 auf. Das Beschränkungs element 235 ist dabei so oberhalb der ersten Vertiefung 210 angeordnet, dass das Eintauchen des Substrates 300 exakt festgelegt ist. Das Fügematerial 320 ist dabei bereits in der vorgesehenen Aussparung eingelegt, und steht vorteilhaft et was aus der darunterliegenden Aussparung heraus, ein optima ler Kontakt zum Substrat 300 hergestellt werden kann. Die Form 200 weist weiterhin drei Passermarken 250 auf, wobei ei ne vierte Ecke frei von einer Passermarke 250 ist, um die Orientierung der Form 200 feststellen zu können. Weiterhin ist ein Lagerelement 205 gezeigt, das als eine umlaufende Lippe an der Form 200 angeordnet ist und damit auf einem Ge genstück des Werkstückträgers 100 aufliegen kann. Das La gerelement 205 könnte dabei Kerben aufweisen, die in Nasen des Werkstückträgers 100 eingreifen, die zwar eine Neigung um X- oder Y-Richtung und/oder eine Bewegung in Z-Richtung er möglichen, aber andere Freiheitsgrade - also eine Bewegung in X und oder Y-Richtung verhindern. Die Aussparungen 210, 220, 230 können dabei gleich tief ausgestaltet sein. In den meis ten Anwendungsfällen aber sind die Aussparungen 210, 220, 230 angepasst auf Architekturen mit verschiedenen Ebenen und wei sen unterschiedliche Tiefen auf. Damit z. B. ein Substrat 300 später beim Fügen (Löten) auf Leiterplatten im Bereich der Chips immer großflächig kontaktiert werden können z. B. die runden Lotkontakte etwas höher sein, als die Rechteckigen, damit diese erst nach dem benetzen und dem damit verbundenen Absinken der Chips verzögert benetzen können. Somit ist die Chipfläche immer vorteilhaft mit dem größtmöglichen Lotmate rialquerschnitt angebunden. 2 shows an embodiment of a form 200. The form 200 has first recesses 210 for receiving rectangular joining materials 310, 320 and a round joining material than 330 on. One level above there is a second recess 220 which is designed to receive the substrate 300 shown here above the mold 200. So that the substrate 300 does not dip too deeply into the mold and thus ensure a sufficient joining material strength, the mold 200 has a restriction element 235. The restriction element 235 is arranged above the first recess 210 in such a way that the immersion of the substrate 300 is precisely defined. The joining material 320 is already inserted in the recess provided, and it is advantageous if something protrudes from the recess below, an optimal contact to the substrate 300 can be made. The mold 200 also has three registration marks 250, a fourth corner being free of a registration mark 250 in order to be able to determine the orientation of the mold 200. Furthermore, a bearing element 205 is shown, which is arranged as a circumferential lip on the mold 200 and can thus rest on a counterpart of the workpiece carrier 100. The bearing element 205 could have notches that engage in lugs of the workpiece carrier 100, which allows an inclination around the X or Y direction and / or a movement in the Z direction, but other degrees of freedom - that is, a movement in X and or prevent Y-direction. The recesses 210, 220, 230 can be of the same depth. In most applications, however, the recesses 210, 220, 230 are adapted to architectures with different levels and have different depths. So that z. B. a substrate 300 later when joining (soldering) on circuit boards in the area of the chips can always be contacted over a large area z. B. the round solder contacts be slightly higher than the rectangular ones, so that they can only wet after the wetting and the associated sinking of the chips. Thus, the chip area is always connected advantageously with the largest possible solder material cross-section.
FIG 3 zeigt einen Werkstückträger 100 im Querschnitt. Die Aufnahmen 150 sind dabei bereits mit Formen 200 gefüllt. Wei terhin ist das aus FIG 1 bekannte Koordinatensystem X, Y, Z eingezeichnet, wobei die X-Y-Ebene die Ebene des Warenträgers bezeichnet. Halteelemente 160 dienen zum Halten und Lagern der Formen 200. Die Halteelemente 160 sind in diesem Fall so ausgebildet, dass eine Bewegung in Z-Richtung und ein Kippen um die Y-Achse möglich ist. In positive und in negative Z- Richtung sind Begrenzungen vorgesehen, sodass die Form 200 nicht zu weit aus der Aufnahme 150 kippen oder bewegen kann. Auch ein Verkanten der Formen 200 kann so wirkungsvoll ver hindert werden. Weiterhin gezeigt ist die Kontaktfläche 203, die sich an der Unterseite der Formen 200 befindet, sodass diese einen besonders guten Kontakt zu einer Heizplatte auf bauen kann. Besonders vorteilhaft ist, dass verschiedene For men 200 in einem Lötvorgang kombiniert werden können, sodass z. B. die für eine komplette Inverterschaltung benötigten Substrate in einem Lötvorgang unter definierten und Nachver folgbaren Prozessbedingungen gefügt werden können. 3 shows a workpiece carrier 100 in cross section. The receptacles 150 are already filled with molds 200. Wei terhin is the X, Y, Z coordinate system known from FIG drawn, where the XY plane denotes the plane of the goods carrier. Holding elements 160 are used to hold and store the molds 200. In this case, the holding elements 160 are designed such that a movement in the Z direction and a tilting around the Y axis is possible. Limitations are provided in the positive and negative Z directions so that the mold 200 cannot tilt or move too far out of the receptacle 150. Tilting of the forms 200 can also be effectively prevented in this way. The contact surface 203, which is located on the underside of the molds 200, is also shown, so that it can establish particularly good contact with a heating plate. It is particularly advantageous that different For men 200 can be combined in one soldering process so that, for. B. the substrates required for a complete inverter circuit can be joined in a soldering process under defined and traceable process conditions.
FIG 4 zeigt den aus FIG 3 bekannten Warenträger auf einer leicht gewölbten Heizplatte 10. Es ist dargestellt, dass der Rahmen steif bleibt, wobei die Formen in ihren Aufnahmen um einen Winkel cp kippen können und weiterhin in Z-Richtung sich auf und ab bewegen können. Für diesen Fall können die Formen 200 nicht in Z-Richtung vollständig aus dem Rahmen 110 her ausgedrückt werden, da die Aufnahmen 150 Begrenzungselemente aufweisen, die ein Herausdrücken verhindern. Dies beschränkt zwar die maximal ausgleichbare Höhe, trägt aber zur Stabili tät des Werkstückträgers 100 bei. FIG. 4 shows the goods carrier known from FIG. 3 on a slightly curved heating plate 10. It is shown that the frame remains stiff, with the shapes being able to tilt in their receptacles by an angle cp and still being able to move up and down in the Z direction . In this case, the shapes 200 cannot be pushed out completely from the frame 110 in the Z direction, since the receptacles 150 have delimiting elements which prevent them from being pushed out. Although this limits the maximum height that can be compensated for, it contributes to the stability of the workpiece carrier 100.
FIG 5 zeigt einen Werkstückträger, der nicht die vorliegende erfindungsgemäße Ausführungsform aufweist und der ebenfalls auf einer gewölbten Heizplatte 10 aufliegt, wodurch sich problematische Wärmeübertragungsverhältnisse ergeben. Im der Markierung 55 ist zu sehen, dass die äußere Form die Heiz platte gar nicht mehr berührt und somit nur durch eine Kon vektion beheizt wird, was eine unbefriedigende oder mangel hafte Fügeverbindung zur Folge hätte. Zwar liegen die mittle ren beiden Formen auf der Heizplatte 10 auf, dies hat aber einen hohen Ausschuss in dieser Charge zur Folge. Zusammenfassend betrifft die Erfindung eine Form (200) zum Fügen eines elektrischen Schaltungsträgers. Die Erfindung be trifft weiterhin einen Werkstückträger (100) für die Form (200) sowie ein System aus Form (200) und WerkstückträgerFIG. 5 shows a workpiece carrier which does not have the present embodiment according to the invention and which likewise rests on a curved heating plate 10, which results in problematic heat transfer conditions. In the marking 55 it can be seen that the outer shape no longer touches the heating plate and is therefore only heated by convection, which would result in an unsatisfactory or defective joint. Although the middle ren two forms are on the heating plate 10, but this results in a high level of rejects in this batch. In summary, the invention relates to a mold (200) for joining an electrical circuit carrier. The invention also relates to a workpiece carrier (100) for the mold (200) and a system comprising a mold (200) and workpiece carrier
(100). Um den Wärmeeintrag durch ein Fügeverfahren zu verbes sern und die Qualität der Fügeverbindungen zu erhöhen wird vorgeschlagen, dass zum Fügen eines elektrischen Schaltungs trägers eine Form (200) zumindest eine erste Aussparung (210) zur Aufnahme eines Fügematerials (310, 320, 330), insbesonde re eines Lotformteils, und zumindest eine zweite Aussparung (220) zur Aufnahme eines Substrats (300) aufweist. Die Form (200) weist weiterhin eine Kontaktfläche (203), die zur ther mischen Kontaktierung einer Heizplatte (10) ausgebildet ist, auf. (100). In order to improve the heat input through a joining process and to increase the quality of the joining connections, it is proposed that, for joining an electrical circuit carrier, a mold (200) have at least one first recess (210) for receiving a joining material (310, 320, 330), in particular a preformed solder part, and at least one second recess (220) for receiving a substrate (300). The mold (200) also has a contact surface (203) which is designed for thermal contacting of a heating plate (10).
BezugsZeichen Reference character
10 Heizplatte 10 heating plate
100 Werkstückträger100 workpiece carriers
110 Rahmen 110 frames
150 Aufnahme 150 recording
160 Halteelement 160 retaining element
200 Form 200 shape
205 Lagerelement 205 bearing element
210 erste Aussparung210 first recess
220 zweite Aussparung 220 second recess
X X-Richtung X X direction
Y Y-Richtung Y Y direction
Z Z-Richtung Z Z direction
F Winkel F angle

Claims

Patentansprüche Claims
1. Form (200) zum Fügen eines elektrischen Schaltungsträ- gers, aufweisend zumindest eine erste Aussparung (210) zur Aufnahme eines Fügematerials (310, 320, 330), insbesondere eines Lotformteils, und zumindest eine zweite Aussparung (220) zur Aufnahme eines Substrats (300) sowie eine Kontakt fläche (203), die zur thermischen Kontaktierung einer Heiz platte (10) ausgebildet ist. 1. Mold (200) for joining an electrical circuit carrier, having at least one first recess (210) for receiving a joining material (310, 320, 330), in particular a preformed solder part, and at least one second recess (220) for receiving a substrate (300) and a contact surface (203) which is designed for thermal contacting of a heating plate (10).
2. Form nach Anspruch 1, aufweisend ein Begrenzungselement (235), dass so bzgl. der ersten Aussparung und der zweiten2. Mold according to claim 1, comprising a delimiting element (235) that so with respect to. The first recess and the second
Aussparung (220) angeordnet ist, dass das Substrat (300) wäh rend des Fügevorgangs nur bis zu dem Begrenzungselement (235) in das Fügematerial (310, 320, 330) eintaucht. Recess (220) is arranged so that the substrate (300) dips into the joining material (310, 320, 330) only up to the delimiting element (235) during the joining process.
3. Form (200) nach Anspruch 1 oder 2, wobei die Form (200) ein Lagerelement (205) aufweist, das so ausgestaltet ist, dass die Form (200) zumindest teilweise kippbar in einem Werkstückträger (100) lagerbar ist. 3. The mold (200) according to claim 1 or 2, wherein the mold (200) has a bearing element (205) which is designed such that the mold (200) can be at least partially tiltable in a workpiece carrier (100).
4. Form (200) nach einem der vorhergehenden Ansprüche, wo bei die Form (200) ein Lagerelement (205) aufweist, das so ausgestaltet ist, dass die Form (200) in zumindest Z-Richtung beweglich ist. 4. Form (200) according to one of the preceding claims, where in the form (200) has a bearing element (205) which is designed so that the form (200) is movable in at least the Z direction.
5. Form (200) nach einem der vorhergehenden Ansprüche, auf weisend eine dritte Aussparung, die zur Aufnahme eines elektrischen Bauteiles ausgebildet ist, wobei die dritte Aus sparung so angeordnet ist, dass das Fügematerial (310, 320, 330), das in den ersten Aussparungen (210) anordenbar ist, das elektrische Bauteil an das Substrat (300), das in der zweiten Aussparung (220) anordenbar ist, fügt. 5. Form (200) according to one of the preceding claims, having a third recess which is designed to receive an electrical component, wherein the third recess is arranged so that the joining material (310, 320, 330), which is in the first cutouts (210) can be arranged, the electrical component is attached to the substrate (300) which can be arranged in the second cutout (220).
6. Form (200) nach einem der vorhergehenden Ansprüche, auf weisend zumindest eine Passermarke (250), die so angeordnet ist, dass sie maschinell erfassbar ist, wenn die Form (200) im Werkstückträger (100) angeordnet ist. 6. Form (200) according to one of the preceding claims, having at least one registration mark (250) which is arranged such that it can be detected by machine when the form (200) is arranged in the workpiece carrier (100).
7. Werkstückträger (100) zum Fügen eines elektrischen Schaltungsträgers, aufweisend einen Rahmen (110) und ein oder mehrere Aufnahmen (150), die zur Aufnahme von jeweils zumin dest einer Form (200) nach einem der vorhergehenden Ansprüche ausgebildet sind, wobei die Aufnahmen (150) weiterhin so ausgebildet sind, dass die Formen (200) in den Aufnahmen in zumindest Z-Richtung be weglich und/oder zumindest teilweise kippbar sind. 7. Workpiece carrier (100) for joining an electrical circuit carrier, having a frame (110) and one or more receptacles (150) which are designed to receive at least one form (200) according to one of the preceding claims, the receptacles (150) are further designed so that the molds (200) are movable and / or at least partially tiltable in the receptacles in at least the Z direction.
8. Werkstückträger (100) nach Anspruch 7, wobei die Aufnah men (150), ein oder mehrere Halteelemente (160) aufweisen, die so ausgebildet sind, dass die Form (200) während eines Transports gehalten wird und/oder dass die Form (200) während eines Fügevorgangs auf einer Heizplatte (10) aufsteht. 8. workpiece carrier (100) according to claim 7, wherein the Aufnah men (150), one or more holding elements (160) which are designed so that the mold (200) is held during transport and / or that the mold ( 200) stands up on a heating plate (10) during a joining process.
9. Werkstückträger (100) nach Anspruch 7 oder 8, wobei die Aussparungen so ausgebildet sind, dass die Form (200) um zu mindest die X-Richtung (X) und/oder um die Y-Richtung eine Rippung um einen Winkel kleiner 20°, vorzugsweise kleiner 10° oder kleiner 5° ausführen kann. 9. workpiece carrier (100) according to claim 7 or 8, wherein the recesses are designed so that the shape (200) around at least the X-direction (X) and / or around the Y-direction a ribbing at an angle less than 20 °, preferably less than 10 ° or less than 5 °.
10. Werkstückträger (100) nach einem der Ansprüche 7 bis 9, wobei der Werkstückträger zumindest teilweise aus Kunststoff besteht. 10. workpiece carrier (100) according to any one of claims 7 to 9, wherein the workpiece carrier is at least partially made of plastic.
11. Werkstückträger (100) nach einem der Ansprüche 7 bis 10, wobei die Aussparungen zum Einhängen, insbesondere in Z- Richtung (Z) der Formen (200) ausgebildet ist. 11. workpiece carrier (100) according to one of claims 7 to 10, wherein the recesses for hanging, in particular in the Z direction (Z) of the molds (200) is formed.
12. Werkstückträger-System (1) aufweisend einen Werkstück träger (100) nach einem der einem der Ansprüche 7 bis 11 und zumindest eine Form (200) nach einem der Ansprüche 1 bis 6. 12. Workpiece carrier system (1) comprising a workpiece carrier (100) according to one of claims 7 to 11 and at least one mold (200) according to one of claims 1 to 6.
13. Werkstückträger-System (1) nach Anspruch 12, wobei der Rahmen zumindest teilweise aus einem elastischen Material be steht und/oder elastische Elemente aufweist, sodass der Werk stückträger eine Anpassung an eine Heizplatte unterstützt. 13. Workpiece carrier system (1) according to claim 12, wherein the frame is at least partially made of an elastic material and / or has elastic elements, so that the work piece carrier supports an adaptation to a heating plate.
14. Werkstückträger-System (1) nach einem der Ansprüche 12 oder 13, wobei der Werkstückträger (100) im Vergleich zu den Formen (200) aus einem Material mit einer niedrigeren Wärme leitfähigkeit ausgebildet ist. 14. workpiece carrier system (1) according to any one of claims 12 or 13, wherein the workpiece carrier (100) is formed from a material with a lower thermal conductivity compared to the molds (200).
15. Werkstückträger-System (1) nach einem der Ansprüche 12 bis 14, aufweisend ein Niederhalteelement, das auf die in der Form 200 zu fügenden Elemente (300, 310, 320, 330) eine Kraft auswirkt. 15. Workpiece carrier system (1) according to one of claims 12 to 14, having a hold-down element which acts a force on the elements (300, 310, 320, 330) to be joined in the mold 200.
PCT/EP2021/054360 2020-03-31 2021-02-23 Workpiece carrier and mold for joining an electric circuit carrier WO2021197713A1 (en)

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