WO2021196213A1 - An led lamp with improved lead - Google Patents

An led lamp with improved lead Download PDF

Info

Publication number
WO2021196213A1
WO2021196213A1 PCT/CN2020/083319 CN2020083319W WO2021196213A1 WO 2021196213 A1 WO2021196213 A1 WO 2021196213A1 CN 2020083319 W CN2020083319 W CN 2020083319W WO 2021196213 A1 WO2021196213 A1 WO 2021196213A1
Authority
WO
WIPO (PCT)
Prior art keywords
lead
case
outer edge
top part
cathode
Prior art date
Application number
PCT/CN2020/083319
Other languages
French (fr)
Inventor
Kuan-Wei CHANG
Original Assignee
Belgravia Wood Limited (Incorporated In Bvi)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Belgravia Wood Limited (Incorporated In Bvi) filed Critical Belgravia Wood Limited (Incorporated In Bvi)
Priority to PCT/CN2020/083319 priority Critical patent/WO2021196213A1/en
Publication of WO2021196213A1 publication Critical patent/WO2021196213A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/005Processes relating to semiconductor body packages relating to encapsulations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0066Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005Processes
    • H01L33/0095Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin

Definitions

  • the present disclosure relates generally to the field of a light-emitting diode (LED) lamp. More specifically, and without limitation, the present disclosure relates to an LED lamp with improved lead.
  • LED light-emitting diode
  • LED is a semiconductor electronic device that converts electrical energy into light energy.
  • LED lamps have many advantages, such as high brightness, low power consumption, long life, fast start-up, high luminous efficiency, no flickering, or low tendency to cause visual fatigue. Therefore, LED lamps are widely used in displays or lighting devices.
  • an exemplary LED lamp includes: an anode lead; a cathode lead; a LED chip placed on a top part of the cathode lead; and a case covering a top part of the anode lead, the top part of the cathode lead and the LED chip.
  • the case includes exits for the anode lead and the cathode lead.
  • At least one of the anode lead and the cathode lead includes a curved part which includes a concave outer edge.
  • an exemplary lead system includes a plurality of lead frames.
  • Each lead frame includes an anode lead and a cathode lead.
  • At least one of the anode lead and the cathode lead includes a curved part which includes a concave outer edge.
  • an exemplary method of manufacturing a LED lamp includes: forming a lead system, the lead system comprising a plurality of lead frames, each lead frame comprising an anode lead and a cathode lead, at least one of the anode lead and the cathode lead comprising a curved part which comprises a concave outer edge; provide a plurality of LED chips on a top part of the cathode leads; and forming a plurality of cases which covers the LED chips and a top part of the LED frames.
  • FIG. 1A is a schematic cross-section diagram of an exemplary LED lamp, according to some embodiments of the present disclosure.
  • FIG. 1B is a schematic cross-section diagram of another exemplary LED lamp, according to some embodiments of the present disclosure.
  • FIG. 1C is a schematic cross-section diagram of another exemplary LED lamp, according to some embodiments of the present disclosure.
  • FIG. 2 is a schematic cross-section diagram of further exemplary LED lamp, according to some embodiments of the present disclosure.
  • FIG. 3A is a schematic cross-section diagram of an exemplary lead system, according to some embodiments of the present disclosure.
  • FIG. 3B is a schematic cross-section diagram of an exemplary lead system with LED chips, according to some embodiments of the present disclosure.
  • FIG. 3C is a schematic cross-section diagram of an exemplary LED system, according to some embodiments of the present disclosure.
  • an epoxy case of a conventional LED lamp may be thin at an exit for the lead frame, through which the lead frame can extend out of the epoxy case.
  • the lead frame can include a plurality of electrode leads (e.g., an anode lead and a cathode lead) .
  • the epoxy case may crack at an area near the exit; thereby, potentially degrading the integrity of the lead frame and, in some circumstances, partially or completely comprising the LED lamp.
  • Some embodiments of the present disclosure provide an LED lamp with improved lead.
  • the LED lamp can, to some extent, enhance durability over conventional LED lamp designs by enabling the lead frame of the LED lamp to, among other things, better withstand forces applied to the LED lamp.
  • FIG. 1A is a schematic cross-section diagram of an exemplary LED lamp 100, according to some embodiments of the present disclosure.
  • LED lamp 100 can include a case 101, a lead frame 104 including a plurality of electrode leads (e.g., a cathode lead 103 and an anode lead 105) , and a LED chip 107.
  • the lead frame can include more electrode leads.
  • the electrode lead can be made of various electrical conductive materials, including, but not limited to, copper, iron, or the like.
  • Case 101 can cover a part of cathode lead 103, a part of anode lead 105, and LED chip 107, and can include an exit 102a for cathode lead 103, through which cathode lead 103 can extend out of case 101, and an exit 102b for anode lead 105, through which anode lead 105 can extend out of case 101.
  • Case 101 can be of any suitable shape.
  • case 101 can be a cylinder with various cross-section shapes, such as circle, ellipse, triangle, rectangle, polygon or the like.
  • case 101 can be a cube, an ellipsoid, a polyhedron, or the like.
  • case 101 can be formed as a single piece with a bulk material and contain inside the part of cathode lead 103, the part of anode lead 105, and LED chip 107. Case 101 can be transparent or semi-transparent to a light emitted from LED chip 107. In some embodiments, case 101 can have a color, such as red, green or blue. Case 101 can include various materials, such as resin or glass. The resin can include epoxy, polycarbonate, or other suitable materials.
  • case 101 can include a structure 101a on its top part.
  • the structure 101a can refract the light from LED chip 107 to outside.
  • case 101 can include a concave structure 101a on its top part.
  • concave structure 101a can have a shape of cone.
  • case 101 can include a convex structure 101a.
  • convex structure 101a can have a shape of convex cone or dome.
  • Cathode lead 103 can include a top part 103a, a bottom part 103b, and a curved part 103c.
  • Top part 103a can be placed, at least partially, within case 101, while bottom part 103b can be placed, at least partially, outside case 101.
  • Curved part 103c can be placed entirely or partially within case 101.
  • a part of curved part 103c can be placed within case 101, while bottom part 103b and the other part of curved part 103c can be placed outside case 101.
  • a concave structure 111 can be provided on top part 103a of cathode lead 103.
  • Concave structure 111 can form a reflective cavity for reflecting the light emitted from LED chip 107 forward.
  • Bottom part 103b can be connected to a cathode of an electric source.
  • the curved part 103c of cathode lead 103 can extend through and exit the bottom of case 101 at exit 102a of case 101.
  • Curved part 103c can include a concave outer edge.
  • the concave outer edge of curved part 103c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 1A, curved part 103c can bend towards inner of case 101 and away from the outer edge of case 101.
  • a distance D 3c near exit 102a for cathode lead 103 between the curved part 103c and the outer edge of case 101 is larger than a distance D 3a between top part 103a and the outer edge of case 101.
  • the distance from the outer edge of case 101 can also be larger than distance D 3a .
  • distance D 3a is the distance between the cathode lead 103 and the edge of case 101. Therefore, curved part 103c can provide extended distance from the outer edge of case 101. The extended distance can allow thicker material to be provided between cathode lead 103 and case 101, which can make LED lamp 100 more robust, for example, when subjected to an external force.
  • Anode lead 105 can include a top part 105a, a bottom part 105b, and a curved part 105c.
  • Top part 105a can be placed, at least partially, within case 101, while bottom part 105b can be placed, at least partially, outside case 101.
  • Curved part 105c can be placed entirely or partially within case 101.
  • a part of curved part 105c can be placed within case 101, while bottom part 105b and the other part of curved part 105c can be placed outside case 101.
  • a concave structure can be provided on top part 105a of anode lead 105.
  • Bottom part 105b can be connected to an anode of an electric source.
  • Curved part 105c of anode lead 105 can extend through and exit the bottom of case 101 at exit 102b.
  • Curved part 105c can include a concave outer edge.
  • the concave outer edge of curved part 105c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 1A, curved part 105c can bend towards inner of case 101 and away from the outer edge of case 101.
  • a distance D 5c near the exit 102b for anode lead 105 between the curved part 105c and the outer edge of case 101 is larger than a distance D 5a between top part 105a and the outer edge of case 101.
  • the distance from the outer edge of case 101 can also be larger than distance D 5a .
  • distance D 5a is the distance between the anode lead 105 and the outer edge of case 101. Therefore, curved part 105c can provide extended distance from the outer edge of case 101. The extended distance can allow thicker material to be provided between anode lead 105 and case 101, which can make LED lamp 100 more robust.
  • LED chip 107 can be provided on top part 103a of cathode lead 103.
  • LED chip 107 can be placed above concave structure 111.
  • LED chip 107 can include a semiconductor die that emits light of various wavelengths, e.g., red, green, blue, white, ultraviolet, infrared, or the like.
  • LED chip 107 can be placed inside case 101.
  • LED chip 107 can be connected to anode lead 105 with a wire 109.
  • Wire 109 can be a gold wire, a copper wire, or the like.
  • LED lamp 100 can include another LED chip (not shown) provided on top part 105a of the anode lead 105.
  • FIG. 1B is a schematic cross-section diagram of another exemplary LED lamp 120, according to some embodiments of the present disclosure.
  • LED lamp 120 is similar to LED lamp 100 of FIG. 1A.
  • LED lamp 120 can include a case 121, a lead frame 124 including a plurality of electrode leads (e.g., a cathode lead 123 and an anode lead 125) , and a LED chip 127.
  • case 121 can include a structure 121a on its top part.
  • LED chip 127 can be connected to anode lead 125 with a wire 129.
  • Case 121, structure 121a, LED chip 127 and wire 129 can be similar to case 101, structure 101a, LED chip 107, and wire 109 of FIG. 1A, respectively.
  • Cathode lead 123 can include a top part 123a, a bottom part 123b, and a curved part 123c. As shown in FIG. 1B, top part 123a can be placed within case 121, while bottom part 123b can be placed outside case 121. A part of curved part 123c can be placed within case 121, while the other part of curved part 123c can be placed outside case 121.
  • a concave structure 131 can be provided on top part 123a of cathode lead 123. Concave structure 131 can form a reflective cavity for reflecting the light emitted from LED chip 127 forward. Bottom part 123b can be connected to a cathode of an electric source.
  • Curved part 123c of cathode lead 123 can extend through and exit the bottom of case 121 at exit 122a.
  • Curved part 123c can include a concave outer edge.
  • the concave outer edge of curved part 123c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves.
  • curved part 123c can include a recess at outer edge away from the outer edge of case 121.
  • a distance (e.g., D 3c near exit 122a for cathode lead 123) between the curved part 123c (e.g., the recess) and the outer edge of case 121 is larger than a distance D 3a between top part 123a and the outer edge of case 121.
  • anode lead 125 can include a top part 125a, a bottom part 125b, and a curved part 125c.
  • a part of curved part 125c can be placed within case 121, while bottom part 125b and the other part of curved part 125c can be placed outside case 121.
  • curved part 125c can include a recess at outer edge.
  • the recess of curved part 125c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves.
  • a distance (e.g., D 5c near exit 122b for anode lead 125) between the curved part 125c and the outer edge of case 121 is larger than a distance D 5a between top part 125a and the outer edge of case 121.
  • FIG. 1C is a schematic cross-section diagram of another exemplary LED lamp 140, according to some embodiments of the present disclosure.
  • LED lamp 140 is similar to LED lamp 100 of FIG. 1A or LED lamp 120 of FIG. 1B.
  • LED lamp 140 can include a case 141, a lead frame 144 including a plurality of electrode leads (e.g., a cathode lead 143 and an anode lead 145) , and a LED chip 147.
  • case 141 can include a structure 141a on its top part.
  • LED chip 147 can be connected to anode lead 145 with a wire 149.
  • Case 141, structure 141a, LED chip 147 and wire 149 can be similar to case 101, structure 101a, LED chip 107, and wire 109 of FIG. 1A, or case 121, structure 121a, LED chip 127, and wire 129 of FIG. 1B, respectively.
  • Cathode lead 143 can include a top part 143a, a bottom part 143b, and a curved part 143c.
  • a concave structure 151 can be provided on top part 143a of cathode lead 143.
  • curved part 143c can be placed within case 141.
  • Curved part 143c can include a concave outer edge. The concave outer edge can bend away from the outer edge of case 141 and connected to the bottom part 143b.
  • the concave outer edge of curved part 143c can have a cross section of any suitable bend angles, such as rectangle and obtuse angle.
  • a distance D 3c between the curved part 143c or bottom part 143b and the outer edge of case 141 is larger than a distance D 3a between top part 143a and the outer edge of case 141.
  • anode lead 145 can include a top part 145a, a bottom part 145b, and a curved part 145c.
  • curved part 145c can be placed within case 141.
  • Curved part 145c can include a concave outer edge. The concave outer edge can bend away from the outer edge of case 141 and connected to the bottom part 145b.
  • the concave outer edge of curved part 145c can have a cross section of any suitable bend angles, such as rectangle and obtuse angle.
  • a distance D 5c between the curved part 145c or bottom part 145b and the outer edge of case 141 is larger than a distance D 5a between top part 145a and the outer edge of case 141.
  • FIG. 2 is a schematic cross-section diagram of another exemplary LED lamp 200, according to some embodiments of the present disclosure.
  • LED lamp 200 can include a case 201, a lead frame 204 including a plurality of electrode leads (e.g., a cathode lead 203, an anode lead 205) , and a LED chip 207.
  • a lead frame can include more electrode leads.
  • case 201 can cover a part of cathode lead 203, a part of anode lead 205, and LED chip 207, and include an exit 202a for cathode lead 203, through which cathode lead 203 can extend out of case 201, and an exit 202b for anode lead 205, through which anode lead 205 can extend out of case 201.
  • Case 201 can be of any suitable shape.
  • case 201 can be a cylinder with various cross-section shapes, such as circle, ellipse, triangle, rectangle, polygon or the like.
  • case 201 can be a cube, an ellipsoid, a polyhedron, or the like.
  • case 201 can be formed as one piece with a bulk material and contain inside the part of cathode lead 203, the part of anode lead 205, and LED chip 207. Case 201 can be transparent or semi-transparent to a light emitted from LED chip 207. In some embodiments, case 201 can have a color, such as red, green or blue. Case 201 can include various materials, such as resin (e.g., epoxy, polycarbonate, or the like) or glass.
  • resin e.g., epoxy, polycarbonate, or the like
  • case 201 can include a structure 201a on its top part.
  • case 101 can include a convex structure 201a.
  • convex structure 201a can have a shape of dome as shown in FIG. 2.
  • the convex structure 201a can function as a convex lens and refract the light from LED chip 207 to outside.
  • Cathode lead 203 can include a top part 203a, a bottom part 203b, and a curved part 203c.
  • Top part 203a can be placed, at least partially, within case 201, while bottom part 203b can be placed, at least partially, outside case 201.
  • Curved part 203c can be placed entirely or partially within case 201.
  • a part of curved part 203c can be placed within case 201, while bottom part 203b and the other part of curved part 203c can be placed outside case 201.
  • a concave structure 211 can be provided on top part 203a of cathode lead 203.
  • Concave structure 211 can form a reflective cavity for reflecting the light emitted from LED chip 207 forward.
  • Bottom part 203b can be connected to a cathode of an electric source.
  • Curved part 203c of cathode lead 203 can extend through and exit the bottom of case 201 at exit 202a.
  • Curved part 203c can include a concave outer edge away from the outer edge of case 201.
  • the concave outer edge of curved part 203c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG.
  • curved part 203c can bend towards inner of case 201 and away from the outer edge of case 201.
  • a distance D 3c near exit 202a for cathode lead 203 between the curved part 203c and the outer edge of case 201 is larger than a distance D 3a between top part 203a and the outer edge of case 201.
  • the distance from the outer edge of case 201 can also be larger than distance D 3a .
  • distance D 3a is the distance between the cathode lead 203 and the edge of case 201. Therefore, curved part 203c can provide extended distance from the outer edge of case 201. The extended distance can allow thicker material to be provided between cathode lead 203 and of case 201 which can make LED lamp 200 can be more robust, for example, when subjected to an external force.
  • anode lead 205 can include a top part 205a, a bottom part 205b, and a curved part 205c.
  • Top part 205a can be placed, at least partially, within case 201, while bottom part 205b can be placed, at least partially, outside case 201.
  • Curved part 205c can be placed entirely or partially within case 201.
  • a part of curved part 205c can be placed within case 201, while bottom part 205b and the other part of curved part 205c can be placed outside case 201.
  • Bottom part 205b can be connected to an anode of an electric source.
  • Curved part 205c of anode lead 205 can extend through and exit the bottom of case 201 at exit 202b.
  • Curved part 205c can include a concave outer edge away from the outer edge of case 201.
  • the concave outer edge of curved part 205c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 2, curved part 205c can bend towards inner of case 201 and away from the outer edge of case 201.
  • a distance D 5c near exit 202b for anode lead 205 between the curved part 205c and the outer edge of case 201 is larger than a distance D 5a between top part 205a and the outer edge of case 201.
  • the distance from the outer edge of case 201 can also be larger than distance D 5a .
  • distance D 3a is the distance between the anode lead 205 and the edge of case 201. Therefore, curved part 205c can provide extended distance from the outer edge of case 201. The extended distance can allow thicker material to be provided between anode lead 205 and case 201, which can make LED lamp 200 can be more robust.
  • curved parts 203c and 205c can be similar to curved parts 123c and 125c of FIG. 1B or curved parts 143c and 145c of FIG. 1C, respectively.
  • LED chip 207 can be provided on top part 203a of cathode lead 203.
  • LED chip 207 can be placed above concave structure 211.
  • LED chip 207 can include a semiconductor die that emits light of various wavelengths, e.g., red, green, blue, white, ultraviolet, infrared, or the like.
  • LED chip 207 can be placed inside case 201.
  • LED chip 207 can be connected to anode lead 205 with a wire 209. Wire 209 can be a gold wire.
  • FIG. 3A is a schematic cross-section diagram of an exemplary lead system 300, according to some embodiments of the present disclosure.
  • lead system 300 can be formed from a single piece of material, such as a copper sheet, an iron sheet, or the like.
  • lead system 300 can include a plurality of lead frames, e.g., lead frame 310-340.
  • Each lead frame can include a cathode lead and an anode lead, and in some embodiments, can be applied to LED lamp 100 of FIG. 1A.
  • lead frame 310 can include a cathode lead 313 and an anode lead 315.
  • Cathode lead 313 can include a top part 313a and a curved part 313c.
  • a concave structure can be provided to form a reflective cavity for reflecting the light emitted from LED chip forward. Curved part 313c can bend towards inner of lead frame 310.
  • Anode lead 315 can include a top part 315a and a curved part 315c. On top part 315a of cathode lead 315, a concave structure can also be provided. Curved part 315c can bend towards inner of lead frame 310. Although shown as similar to curved parts 103c and 105c of FIG. 1A, it is appreciated that curved parts 313c and 315c can be similar to curved parts 123c and 125c of FIG. 1B, curved parts 143c and 145c of FIG. 1C, or curved parts 203c and 205c of FIG. 2, respectively.
  • Lead system 300 can include one or more horizontal bars (e.g., bar 350 and bar 360) to connect the plurality of lead frames 310-340. Although four lead frames 310-340 are depicted in FIG. 3A, it is appreciated that, in some embodiments, lead system 300 can include another number of lead frames. Lead frames 310-340 can be separated by cutting the horizontal bars 350 and 360.
  • LED lamps can be manufactured from lead system 300.
  • FIG. 3B is a schematic cross-section diagram of an exemplary lead system 300 with LED chips, according to some embodiments of the present disclosure.
  • a LED chip is provided on the cathode lead of each lead frame (e.g., lead frame 310, 320, 330, or 340) , and connected to the anode lead by a wire.
  • a LED chip 317 is provided on top part 313a of cathode lead 313.
  • a wire 319 connects LED chip 317 to top part 315a of anode lead 315.
  • LED chips and wires can be provided to lead frame 320, 330 and 340.
  • FIG. 3C is a schematic cross-section diagram of an exemplary LED system 390, according to some embodiments of the present disclosure.
  • a case can be formed on each frame lead to cover the LED chip, the wire and top part of the lead frame.
  • a case 311 is formed on lead frame 310 and covers LED chip 317, wire 319, top part 313a of cathode 313, and top part 315a of anode 315.
  • Curved parts 313c and 315c each can include a concave outer edge.
  • the concave outer edge can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves.
  • curved parts 313c or 315c can provide extended distance from the corresponding edge of case 311.
  • the extended distance can allow thicker material to be provided between cathode lead 313 or anode lead 315 and case 311, which can make LED lamp 391 more robust, for example, when subjected to an external force.
  • a structure 311a can be formed on top part of case 311.
  • Structure 311a can be similar to structure 101a of FIG. 1A or structure 201a of FIG. 2.
  • a plurality of LED lamps are formed.
  • Horizontal bars 350 and 360 can be cut to form a plurality of separate LED lamps.
  • the term “or” encompasses all possible combinations, except where infeasible. For example, if it is stated that a component may include A or B, then, unless specifically stated otherwise or infeasible, the component may include A, or B, or A and B. As a second example, if it is stated that a component may include A, B, or C, then, unless specifically stated otherwise or infeasible, the component may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

An LED lamp (100, 120, 140, 200) with improved lead. In some embodiments, an exemplary LED lamp (100, 120, 140, 200) includes: an anode lead (105, 125, 145, 205); a cathode lead (103, 123, 143, 203); a LED chip (107, 127, 147, 207) placed on a top part of the cathode lead (103, 123, 143, 203); and a case (101, 121, 141, 201) covering a top part of the anode lead (105, 125, 145, 205), the top part of the cathode lead (103, 123, 143, 203) and the LED chip (107, 127, 147, 207), the case (101, 121, 141, 201) comprising exits (102a, 102b, 122a, 122b, 142a, 142b, 202a, 202b) for the anode lead (105, 125, 145, 205) and the cathode lead (103, 123, 143, 203), at least one of the anode lead (105, 125, 145, 205) and the cathode lead (103, 123, 143, 203) comprising a curved part (103c, 105c, 123c, 125c, 143c, 145c, 203c, 205c) which includes a concave outer edge.

Description

AN LED LAMP WITH IMPROVED LEAD TECHNICAL FIELD
The present disclosure relates generally to the field of a light-emitting diode (LED) lamp. More specifically, and without limitation, the present disclosure relates to an LED lamp with improved lead.
BACKGROUND
An LED is a semiconductor electronic device that converts electrical energy into light energy. Generally, LED lamps have many advantages, such as high brightness, low power consumption, long life, fast start-up, high luminous efficiency, no flickering, or low tendency to cause visual fatigue. Therefore, LED lamps are widely used in displays or lighting devices.
SUMMARY
In some embodiments, an exemplary LED lamp includes: an anode lead; a cathode lead; a LED chip placed on a top part of the cathode lead; and a case covering a top part of the anode lead, the top part of the cathode lead and the LED chip. The case includes exits for the anode lead and the cathode lead. At least one of the anode lead and the cathode lead includes a curved part which includes a concave outer edge.
In some embodiments, an exemplary lead system includes a plurality of lead frames. Each lead frame includes an anode lead and a cathode lead. At least one of the anode lead and the cathode lead includes a curved part which includes a concave outer edge.
In some embodiments, an exemplary method of manufacturing a LED lamp includes: forming a lead system, the lead system comprising a plurality of lead frames, each lead frame comprising an anode lead and a cathode lead, at least one of the anode lead and the cathode lead comprising a curved part which comprises a concave outer edge; provide a  plurality of LED chips on a top part of the cathode leads; and forming a plurality of cases which covers the LED chips and a top part of the LED frames.
Additional objects and advantages of the present disclosure will be set forth in part in the following detailed description, and in part will be obvious from the description, or may be learned by practice of the present disclosure. The objects and advantages of the present disclosure will be realized and attained by means of the elements and combinations particularly pointed out in the appended claims.
It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and are not restrictive of the disclosed embodiments.
BRIEF DESCRIPTION OF THE DRAWINGS
The accompanying drawings, which comprise a part of this specification, illustrate several embodiments and, together with the description, serve to explain the principles and features of the disclosed embodiments. In the drawings:
FIG. 1A is a schematic cross-section diagram of an exemplary LED lamp, according to some embodiments of the present disclosure.
FIG. 1B is a schematic cross-section diagram of another exemplary LED lamp, according to some embodiments of the present disclosure.
FIG. 1C is a schematic cross-section diagram of another exemplary LED lamp, according to some embodiments of the present disclosure.
FIG. 2 is a schematic cross-section diagram of further exemplary LED lamp, according to some embodiments of the present disclosure.
FIG. 3A is a schematic cross-section diagram of an exemplary lead system, according to some embodiments of the present disclosure.
FIG. 3B is a schematic cross-section diagram of an exemplary lead system with LED chips, according to some embodiments of the present disclosure.
FIG. 3C is a schematic cross-section diagram of an exemplary LED system, according to some embodiments of the present disclosure.
DETAILED DESCRIPTION
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. The following description refers to the accompanying drawings in which the same numbers in different drawings represent the same or similar elements unless otherwise represented. The implementations set forth in the following description of exemplary embodiments do not represent all implementations consistent with the invention. Instead, they are merely examples of apparatuses, systems and methods consistent with aspects related to the invention as recited in the appended claims.
Conventional LED lamp designs often meet durability problems. For example, an epoxy case of a conventional LED lamp may be thin at an exit for the lead frame, through which the lead frame can extend out of the epoxy case. The lead frame can include a plurality of electrode leads (e.g., an anode lead and a cathode lead) . When the lead frame is subjected to a force, especially a horizontal force, the epoxy case may crack at an area near the exit; thereby, potentially degrading the integrity of the lead frame and, in some circumstances, partially or completely comprising the LED lamp. Some embodiments of the present disclosure provide an LED lamp with improved lead. The LED lamp can, to some extent, enhance durability over conventional LED lamp designs by enabling the lead frame of the LED lamp to, among other things, better withstand forces applied to the LED lamp.
FIG. 1A is a schematic cross-section diagram of an exemplary LED lamp 100, according to some embodiments of the present disclosure. As shown in FIG. 1A, LED lamp 100 can include a case 101, a lead frame 104 including a plurality of electrode leads (e.g., a cathode lead 103 and an anode lead 105) , and a LED chip 107. Although shown as including cathode lead 103 and anode lead 105, it is appreciated that the lead frame can include more electrode leads. The electrode lead can be made of various electrical conductive materials, including, but not limited to, copper, iron, or the like.
Case 101 can cover a part of cathode lead 103, a part of anode lead 105, and LED chip 107, and can include an exit 102a for cathode lead 103, through which cathode lead 103 can extend out of case 101, and an exit 102b for anode lead 105, through which anode lead 105 can extend out of case 101. Case 101 can be of any suitable shape. For example,  case 101 can be a cylinder with various cross-section shapes, such as circle, ellipse, triangle, rectangle, polygon or the like. As another example, case 101 can be a cube, an ellipsoid, a polyhedron, or the like. In some embodiments, case 101 can be formed as a single piece with a bulk material and contain inside the part of cathode lead 103, the part of anode lead 105, and LED chip 107. Case 101 can be transparent or semi-transparent to a light emitted from LED chip 107. In some embodiments, case 101 can have a color, such as red, green or blue. Case 101 can include various materials, such as resin or glass. The resin can include epoxy, polycarbonate, or other suitable materials.
In some embodiments, case 101 can include a structure 101a on its top part. The structure 101a can refract the light from LED chip 107 to outside. In some embodiments, as shown in FIG. 1A, case 101 can include a concave structure 101a on its top part. For example, concave structure 101a can have a shape of cone. In some embodiments, case 101 can include a convex structure 101a. For example, convex structure 101a can have a shape of convex cone or dome.
Cathode lead 103 can include a top part 103a, a bottom part 103b, and a curved part 103c. Top part 103a can be placed, at least partially, within case 101, while bottom part 103b can be placed, at least partially, outside case 101. Curved part 103c can be placed entirely or partially within case 101. In some embodiments, as shown in FIG. 1A, a part of curved part 103c can be placed within case 101, while bottom part 103b and the other part of curved part 103c can be placed outside case 101. On top part 103a of cathode lead 103, a concave structure 111 can be provided. Concave structure 111 can form a reflective cavity for reflecting the light emitted from LED chip 107 forward. Bottom part 103b can be connected to a cathode of an electric source. The curved part 103c of cathode lead 103 can extend through and exit the bottom of case 101 at exit 102a of case 101. Curved part 103c can include a concave outer edge. The concave outer edge of curved part 103c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 1A, curved part 103c can bend towards inner of case 101 and away from the outer edge of case 101. A distance D 3c near exit 102a for cathode lead 103 between the curved part 103c and the outer edge of case 101 is larger than a distance D 3a between top part 103a and the outer edge of case 101. In addition,  at other portions of curved part 103c, the distance from the outer edge of case 101 can also be larger than distance D 3a. But in a conventional LED without curved part 103c, distance D 3a is the distance between the cathode lead 103 and the edge of case 101. Therefore, curved part 103c can provide extended distance from the outer edge of case 101. The extended distance can allow thicker material to be provided between cathode lead 103 and case 101, which can make LED lamp 100 more robust, for example, when subjected to an external force.
Anode lead 105 can include a top part 105a, a bottom part 105b, and a curved part 105c. Top part 105a can be placed, at least partially, within case 101, while bottom part 105b can be placed, at least partially, outside case 101. Curved part 105c can be placed entirely or partially within case 101. In some embodiments, as shown in FIG. 1A, a part of curved part 105c can be placed within case 101, while bottom part 105b and the other part of curved part 105c can be placed outside case 101. In some embodiments, on top part 105a of anode lead 105, a concave structure can be provided. Bottom part 105b can be connected to an anode of an electric source. Curved part 105c of anode lead 105 can extend through and exit the bottom of case 101 at exit 102b. Curved part 105c can include a concave outer edge. The concave outer edge of curved part 105c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 1A, curved part 105c can bend towards inner of case 101 and away from the outer edge of case 101. A distance D 5c near the exit 102b for anode lead 105 between the curved part 105c and the outer edge of case 101 is larger than a distance D 5a between top part 105a and the outer edge of case 101. In addition, at other portions of curved part 105c, the distance from the outer edge of case 101 can also be larger than distance D 5a. But in a conventional LED without curved part 105c, distance D 5a is the distance between the anode lead 105 and the outer edge of case 101. Therefore, curved part 105c can provide extended distance from the outer edge of case 101. The extended distance can allow thicker material to be provided between anode lead 105 and case 101, which can make LED lamp 100 more robust.
LED chip 107 can be provided on top part 103a of cathode lead 103. For example, LED chip 107 can be placed above concave structure 111. LED chip 107 can include a semiconductor die that emits light of various wavelengths, e.g., red, green, blue,  white, ultraviolet, infrared, or the like. LED chip 107 can be placed inside case 101. In some embodiments, LED chip 107 can be connected to anode lead 105 with a wire 109. Wire 109 can be a gold wire, a copper wire, or the like. In some embodiments, LED lamp 100 can include another LED chip (not shown) provided on top part 105a of the anode lead 105.
FIG. 1B is a schematic cross-section diagram of another exemplary LED lamp 120, according to some embodiments of the present disclosure. LED lamp 120 is similar to LED lamp 100 of FIG. 1A. As shown in FIG. 1B, LED lamp 120 can include a case 121, a lead frame 124 including a plurality of electrode leads (e.g., a cathode lead 123 and an anode lead 125) , and a LED chip 127. Although shown as including cathode lead 123 and anode lead 125, it is appreciated that the lead frame can include more electrode leads. In some embodiments, case 121 can include a structure 121a on its top part. LED chip 127 can be connected to anode lead 125 with a wire 129. Case 121, structure 121a, LED chip 127 and wire 129 can be similar to case 101, structure 101a, LED chip 107, and wire 109 of FIG. 1A, respectively.
Cathode lead 123 can include a top part 123a, a bottom part 123b, and a curved part 123c. As shown in FIG. 1B, top part 123a can be placed within case 121, while bottom part 123b can be placed outside case 121. A part of curved part 123c can be placed within case 121, while the other part of curved part 123c can be placed outside case 121. On top part 123a of cathode lead 123, a concave structure 131 can be provided. Concave structure 131 can form a reflective cavity for reflecting the light emitted from LED chip 127 forward. Bottom part 123b can be connected to a cathode of an electric source. Curved part 123c of cathode lead 123 can extend through and exit the bottom of case 121 at exit 122a. Curved part 123c can include a concave outer edge. The concave outer edge of curved part 123c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 1B, curved part 123c can include a recess at outer edge away from the outer edge of case 121. A distance (e.g., D 3c near exit 122a for cathode lead 123) between the curved part 123c (e.g., the recess) and the outer edge of case 121 is larger than a distance D 3a between top part 123a and the outer edge of case 121.
Similarly, anode lead 125 can include a top part 125a, a bottom part 125b, and a curved part 125c. As shown in FIG. 1B, a part of curved part 125c can be placed within case 121, while bottom part 125b and the other part of curved part 125c can be placed outside case 121. As shown in FIG. 1B, curved part 125c can include a recess at outer edge. The recess of curved part 125c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. A distance (e.g., D 5c near exit 122b for anode lead 125) between the curved part 125c and the outer edge of case 121 is larger than a distance D 5a between top part 125a and the outer edge of case 121.
FIG. 1C is a schematic cross-section diagram of another exemplary LED lamp 140, according to some embodiments of the present disclosure. LED lamp 140 is similar to LED lamp 100 of FIG. 1A or LED lamp 120 of FIG. 1B. As shown in FIG. 1C, LED lamp 140 can include a case 141, a lead frame 144 including a plurality of electrode leads (e.g., a cathode lead 143 and an anode lead 145) , and a LED chip 147. In some embodiments, case 141 can include a structure 141a on its top part. LED chip 147 can be connected to anode lead 145 with a wire 149. Case 141, structure 141a, LED chip 147 and wire 149 can be similar to case 101, structure 101a, LED chip 107, and wire 109 of FIG. 1A, or case 121, structure 121a, LED chip 127, and wire 129 of FIG. 1B, respectively.
Cathode lead 143 can include a top part 143a, a bottom part 143b, and a curved part 143c. On top part 143a of cathode lead 143, a concave structure 151 can be provided. As shown in FIG. 1C, curved part 143c can be placed within case 141. Curved part 143c can include a concave outer edge. The concave outer edge can bend away from the outer edge of case 141 and connected to the bottom part 143b. The concave outer edge of curved part 143c can have a cross section of any suitable bend angles, such as rectangle and obtuse angle. As shown in FIG. 1C, a distance D 3c between the curved part 143c or bottom part 143b and the outer edge of case 141 is larger than a distance D 3a between top part 143a and the outer edge of case 141.
Similarly, anode lead 145 can include a top part 145a, a bottom part 145b, and a curved part 145c. As shown in FIG. 1C, curved part 145c can be placed within case 141. Curved part 145c can include a concave outer edge. The concave outer edge can bend away from the outer edge of case 141 and connected to the bottom part 145b. The concave outer  edge of curved part 145c can have a cross section of any suitable bend angles, such as rectangle and obtuse angle. As shown in FIG. 1C, a distance D 5c between the curved part 145c or bottom part 145b and the outer edge of case 141 is larger than a distance D 5a between top part 145a and the outer edge of case 141.
FIG. 2 is a schematic cross-section diagram of another exemplary LED lamp 200, according to some embodiments of the present disclosure. As shown in FIG. 2, LED lamp 200 can include a case 201, a lead frame 204 including a plurality of electrode leads (e.g., a cathode lead 203, an anode lead 205) , and a LED chip 207. Although shown as including cathode lead 203 and anode lead 205, it is appreciated that the lead frame can include more electrode leads.
Similar to case 101 of FIG. 1A, case 201 can cover a part of cathode lead 203, a part of anode lead 205, and LED chip 207, and include an exit 202a for cathode lead 203, through which cathode lead 203 can extend out of case 201, and an exit 202b for anode lead 205, through which anode lead 205 can extend out of case 201. Case 201 can be of any suitable shape. For example, case 201 can be a cylinder with various cross-section shapes, such as circle, ellipse, triangle, rectangle, polygon or the like. As another example, case 201 can be a cube, an ellipsoid, a polyhedron, or the like. In some embodiments, case 201 can be formed as one piece with a bulk material and contain inside the part of cathode lead 203, the part of anode lead 205, and LED chip 207. Case 201 can be transparent or semi-transparent to a light emitted from LED chip 207. In some embodiments, case 201 can have a color, such as red, green or blue. Case 201 can include various materials, such as resin (e.g., epoxy, polycarbonate, or the like) or glass.
In some embodiments, case 201 can include a structure 201a on its top part. In some embodiments, case 101 can include a convex structure 201a. For example, convex structure 201a can have a shape of dome as shown in FIG. 2. The convex structure 201a can function as a convex lens and refract the light from LED chip 207 to outside.
Cathode lead 203 can include a top part 203a, a bottom part 203b, and a curved part 203c. Top part 203a can be placed, at least partially, within case 201, while bottom part 203b can be placed, at least partially, outside case 201. Curved part 203c can be placed entirely or partially within case 201. In some embodiments, as shown in FIG. 2, a part  of curved part 203c can be placed within case 201, while bottom part 203b and the other part of curved part 203c can be placed outside case 201. On top part 203a of cathode lead 203, a concave structure 211 can be provided. Concave structure 211 can form a reflective cavity for reflecting the light emitted from LED chip 207 forward. Bottom part 203b can be connected to a cathode of an electric source. Curved part 203c of cathode lead 203 can extend through and exit the bottom of case 201 at exit 202a. Curved part 203c can include a concave outer edge away from the outer edge of case 201. The concave outer edge of curved part 203c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 2, curved part 203c can bend towards inner of case 201 and away from the outer edge of case 201. A distance D 3c near exit 202a for cathode lead 203 between the curved part 203c and the outer edge of case 201 is larger than a distance D 3a between top part 203a and the outer edge of case 201. In addition, at other portions of curved part 203c, the distance from the outer edge of case 201 can also be larger than distance D 3a. But in a conventional LED without curved part 203c, distance D 3a is the distance between the cathode lead 203 and the edge of case 201. Therefore, curved part 203c can provide extended distance from the outer edge of case 201. The extended distance can allow thicker material to be provided between cathode lead 203 and of case 201 which can make LED lamp 200 can be more robust, for example, when subjected to an external force.
As shown in FIG. 2, anode lead 205 can include a top part 205a, a bottom part 205b, and a curved part 205c. Top part 205a can be placed, at least partially, within case 201, while bottom part 205b can be placed, at least partially, outside case 201. Curved part 205c can be placed entirely or partially within case 201. In some embodiments, as shown in FIG. 2, a part of curved part 205c can be placed within case 201, while bottom part 205b and the other part of curved part 205c can be placed outside case 201. Bottom part 205b can be connected to an anode of an electric source. Curved part 205c of anode lead 205 can extend through and exit the bottom of case 201 at exit 202b. Curved part 205c can include a concave outer edge away from the outer edge of case 201. The concave outer edge of curved part 205c can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. As shown in FIG. 2, curved part 205c can  bend towards inner of case 201 and away from the outer edge of case 201. A distance D 5c near exit 202b for anode lead 205 between the curved part 205c and the outer edge of case 201 is larger than a distance D 5a between top part 205a and the outer edge of case 201. In addition, at other portions of curved part 205c, the distance from the outer edge of case 201 can also be larger than distance D 5a. But in a conventional LED without curved part 205c, distance D 3a is the distance between the anode lead 205 and the edge of case 201. Therefore, curved part 205c can provide extended distance from the outer edge of case 201. The extended distance can allow thicker material to be provided between anode lead 205 and case 201, which can make LED lamp 200 can be more robust.
Although shown as similar to  curved parts  103c and 105c of FIG. 1A, it is appreciated that  curved parts  203c and 205c can be similar to  curved parts  123c and 125c of FIG. 1B or  curved parts  143c and 145c of FIG. 1C, respectively.
Similar to LED chip 107 of FIG. 1A, LED chip 207 can be provided on top part 203a of cathode lead 203. For example, LED chip 207 can be placed above concave structure 211. LED chip 207 can include a semiconductor die that emits light of various wavelengths, e.g., red, green, blue, white, ultraviolet, infrared, or the like. LED chip 207 can be placed inside case 201. In some embodiments, LED chip 207 can be connected to anode lead 205 with a wire 209. Wire 209 can be a gold wire.
FIG. 3A is a schematic cross-section diagram of an exemplary lead system 300, according to some embodiments of the present disclosure. In some embodiments, lead system 300 can be formed from a single piece of material, such as a copper sheet, an iron sheet, or the like.
As shown in FIG. 3A, lead system 300 can include a plurality of lead frames, e.g., lead frame 310-340. Each lead frame can include a cathode lead and an anode lead, and in some embodiments, can be applied to LED lamp 100 of FIG. 1A. For example, lead frame 310 can include a cathode lead 313 and an anode lead 315. Cathode lead 313 can include a top part 313a and a curved part 313c. On top part 313a of cathode lead 313, a concave structure can be provided to form a reflective cavity for reflecting the light emitted from LED chip forward. Curved part 313c can bend towards inner of lead frame 310. Anode lead 315 can include a top part 315a and a curved part 315c. On top part 315a of cathode lead 315, a  concave structure can also be provided. Curved part 315c can bend towards inner of lead frame 310. Although shown as similar to  curved parts  103c and 105c of FIG. 1A, it is appreciated that  curved parts  313c and 315c can be similar to  curved parts  123c and 125c of FIG. 1B,  curved parts  143c and 145c of FIG. 1C, or  curved parts  203c and 205c of FIG. 2, respectively.
Lead system 300 can include one or more horizontal bars (e.g., bar 350 and bar 360) to connect the plurality of lead frames 310-340. Although four lead frames 310-340 are depicted in FIG. 3A, it is appreciated that, in some embodiments, lead system 300 can include another number of lead frames. Lead frames 310-340 can be separated by cutting the  horizontal bars  350 and 360.
In some embodiments, LED lamps can be manufactured from lead system 300. FIG. 3B is a schematic cross-section diagram of an exemplary lead system 300 with LED chips, according to some embodiments of the present disclosure. As shown in FIG. 3B, a LED chip is provided on the cathode lead of each lead frame (e.g.,  lead frame  310, 320, 330, or 340) , and connected to the anode lead by a wire. For example, a LED chip 317 is provided on top part 313a of cathode lead 313. A wire 319 connects LED chip 317 to top part 315a of anode lead 315. Similarly, LED chips and wires can be provided to lead  frame  320, 330 and 340.
FIG. 3C is a schematic cross-section diagram of an exemplary LED system 390, according to some embodiments of the present disclosure. As shown in FIG. 3C, a case can be formed on each frame lead to cover the LED chip, the wire and top part of the lead frame. For example, a case 311 is formed on lead frame 310 and covers LED chip 317, wire 319, top part 313a of cathode 313, and top part 315a of anode 315.  Curved parts  313c and 315c each can include a concave outer edge. The concave outer edge can have a cross section of any suitable shapes, such as a L shape, a semicircle, a semiellipse, a rectangle, a trapezium, or other suitable curves. Therefore,  curved parts  313c or 315c can provide extended distance from the corresponding edge of case 311. The extended distance can allow thicker material to be provided between cathode lead 313 or anode lead 315 and case 311, which can make LED lamp 391 more robust, for example, when subjected to an external force.
In some embodiments, a structure 311a can be formed on top part of case 311. Structure 311a can be similar to structure 101a of FIG. 1A or structure 201a of FIG. 2.
As shown in FIG. 3C, a plurality of LED lamps (e.g.,  LED lamps  391, 392, 393, and 394) are formed.  Horizontal bars  350 and 360 can be cut to form a plurality of separate LED lamps.
The foregoing description has been presented for purposes of illustration. It is not exhaustive and is not limited to precise forms or embodiments disclosed. Modifications and adaptations of the embodiments will be apparent from consideration of the specification and practice of the disclosed embodiments.
Moreover, while illustrative embodiments have been described herein, the scope includes any and all embodiments having equivalent elements, modifications, omissions, combinations (e.g., of aspects across various embodiments) , adaptations or alterations based on the present disclosure. The elements in the claims are to be interpreted broadly based on the language employed in the claims and not limited to examples described in the present specification or during the prosecution of the application, which examples are to be construed as nonexclusive. Further, the steps of the disclosed methods can be modified in any manner, including reordering steps and/or inserting or deleting steps.
The features and advantages of the present disclosure are apparent from the detailed specification, and thus, it is intended that the appended claims cover all apparatus and systems falling within the true spirit and scope of the present disclosure. As used herein, the indefinite articles “a” and “an” mean “one or more. ” Similarly, the use of a plural term does not necessarily denote a plurality unless it is unambiguous in the given context. Words such as “and” or “or” mean “and/or” unless specifically directed otherwise. Further, since numerous modifications and variations will readily occur from studying the present disclosure, it is not desired to limit the present disclosure to the exact construction and operation illustrated and described, and accordingly, all suitable modifications and equivalents may be resorted to, falling within the scope of the present disclosure.
As used herein, unless specifically stated otherwise, the term “or” encompasses all possible combinations, except where infeasible. For example, if it is stated that a component may include A or B, then, unless specifically stated otherwise or infeasible,  the component may include A, or B, or A and B. As a second example, if it is stated that a component may include A, B, or C, then, unless specifically stated otherwise or infeasible, the component may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C.
Other embodiments will be apparent from consideration of the specification and practice of the embodiments disclosed herein. It is intended that the specification and examples be considered as example only, with a true scope and spirit of the disclosed embodiments being indicated by the following claims.

Claims (20)

  1. A light-emitting diode (LED) lamp, comprising:
    an anode lead;
    a cathode lead;
    a LED chip placed on a top part of the cathode lead; and
    a case covering a top part of the anode lead, the top part of the cathode lead and the LED chip, the case comprising exits for the anode lead and the cathode lead,
    at least one of the anode lead and the cathode lead comprising a curved part which comprises a concave outer edge.
  2. The LED lamp of claim 1, wherein the concave outer edge comprises a cross section of a L shape, a semicircle, a semiellipse, a rectangle, or a trapezium.
  3. The LED lamp of claim 1, wherein the concave outer edge comprises a bend away from an edge of the case.
  4. The LED lamp of claim 1, further comprising:
    a concave structure formed on the top part of the cathode lead or the top part of the anode lead.
  5. The LED lamp of claim 1, wherein the curved part comprises a concave inner edge.
  6. The LED lamp of claim 1, further comprising:
    a wire connecting the LED chip to the top part of the anode lead.
  7. The LED lamp of claim 1, wherein the case comprises a concave structure or a convex structure on its top part.
  8. The LED lamp of claim 1, wherein the case comprises epoxy, polycarbonate or glass.
  9. The LED lamp of claim 1, wherein the case has a shape of cylinder, cube, ellipsoid, or polyhedron.
  10. A lead system, comprising a plurality of lead frames, each lead frame comprising an anode lead and a cathode lead, at least one of the anode lead and the cathode lead comprising a curved part which comprises a concave outer edge.
  11. The lead system of claim 10, wherein the concave outer edge comprises a cross section of a L shape, a semicircle, a semiellipse, a rectangle, or a trapezium.
  12. The lead system of claim 10, wherein the concave outer edge comprises a bend away from an edge of the case.
  13. The lead system of claim 10, wherein the curved part comprises a concave inner edge.
  14. The lead system of claim 10, further comprising:
    one or more horizontal bars connecting the plurality of lead frame as a single piece.
  15. A method of manufacturing a LED lamp, comprising:
    forming a lead system, the lead system comprising a plurality of lead frames, each lead frame comprising an anode lead and a cathode lead, at least one of the anode lead and the cathode lead comprising a curved part which comprises a concave outer edge;
    provide a plurality of LED chips on a top part of the cathode leads; and
    forming a plurality of cases which covers the LED chips and a top part of the LED frames.
  16. The method of claim 15, wherein the lead system further comprises one or more horizontal bars connecting the plurality of lead frame as a single piece, and wherein the method further comprises cutting the one or more horizontal bars.
  17. The method of claim 15, wherein the concave outer edge comprises a cross section of a L shape, a semicircle, a semiellipse, a rectangle, or a trapezium.
  18. The method of claim 15, wherein the concave outer edge comprises a bend away from an edge of the case.
  19. The method of claim 15, further comprising:
    forming a concave structure on a top part of the anode lead or the cathode lead.
  20. The method of claim 15, further comprising:
    forming a wire connecting the LED chip to the top part of the anode lead.
PCT/CN2020/083319 2020-04-03 2020-04-03 An led lamp with improved lead WO2021196213A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/083319 WO2021196213A1 (en) 2020-04-03 2020-04-03 An led lamp with improved lead

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/083319 WO2021196213A1 (en) 2020-04-03 2020-04-03 An led lamp with improved lead

Publications (1)

Publication Number Publication Date
WO2021196213A1 true WO2021196213A1 (en) 2021-10-07

Family

ID=77930269

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/083319 WO2021196213A1 (en) 2020-04-03 2020-04-03 An led lamp with improved lead

Country Status (1)

Country Link
WO (1) WO2021196213A1 (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008274272A (en) * 2007-04-06 2008-11-13 Yokohama Rubber Co Ltd:The Composition for sealing optical semiconductor device, its cured product and sealed body of optical semiconductor device
CN201466058U (en) * 2009-07-20 2010-05-12 杭州华扬电子有限公司 Light emitting diode electrode bracket capable of convenient encapsulation
CN202120986U (en) * 2011-06-09 2012-01-18 四川柏狮光电技术有限公司 Improved light source structure of LED display screen
CN203445157U (en) * 2013-07-17 2014-02-19 邓青平 Directly-surface mounted type LED lamp bead
CN205542883U (en) * 2016-04-20 2016-08-31 格力电器(合肥)有限公司 Utmost point pipe and lighting equipment
CN207947312U (en) * 2018-04-04 2018-10-09 东莞市翰诠实业有限公司 A kind of ease of assembly, the LED support to save material
CN209981267U (en) * 2019-06-26 2020-01-21 深圳市汇大光电科技股份有限公司 Lamp packaging structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008274272A (en) * 2007-04-06 2008-11-13 Yokohama Rubber Co Ltd:The Composition for sealing optical semiconductor device, its cured product and sealed body of optical semiconductor device
CN201466058U (en) * 2009-07-20 2010-05-12 杭州华扬电子有限公司 Light emitting diode electrode bracket capable of convenient encapsulation
CN202120986U (en) * 2011-06-09 2012-01-18 四川柏狮光电技术有限公司 Improved light source structure of LED display screen
CN203445157U (en) * 2013-07-17 2014-02-19 邓青平 Directly-surface mounted type LED lamp bead
CN205542883U (en) * 2016-04-20 2016-08-31 格力电器(合肥)有限公司 Utmost point pipe and lighting equipment
CN207947312U (en) * 2018-04-04 2018-10-09 东莞市翰诠实业有限公司 A kind of ease of assembly, the LED support to save material
CN209981267U (en) * 2019-06-26 2020-01-21 深圳市汇大光电科技股份有限公司 Lamp packaging structure

Similar Documents

Publication Publication Date Title
KR101088910B1 (en) LED package and method of manufacturing the same
US8297799B2 (en) Omnidirectional LED lamp and complex, unitary lens
JP5999391B2 (en) Light emitting device, illumination light source, and illumination device
US20100148193A1 (en) Systems and methods for packaging light-emitting diode devices
JP2004265727A (en) Light-emitting device
US20060049475A1 (en) High power LED array
US20130249411A1 (en) Light Emitting Module and Lighting System
TW200425547A (en) Led lamp
KR20110121927A (en) Illumination apparatus employing the light emitting device package
JP2006310613A (en) Semiconductor light emitting device
EP2835837A1 (en) Led light emitting apparatus
JP2006253288A (en) Light emitting device and manufacturing method thereof
JP6583203B2 (en) LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
JP2007180430A (en) Light-emitting diode device
KR20170085084A (en) Efficient light emitting device and method for manufacturing such a device
WO2021196213A1 (en) An led lamp with improved lead
CN101339971B (en) Encapsulation construction of LED
JP3771144B2 (en) LED lamp
US20110108871A1 (en) Edge led package
JP2007081063A (en) Light-emitting device
US11346508B2 (en) LED filament
EP3963252A1 (en) Led filament lamp
TWI447328B (en) Led lighting device
CN108139034B (en) Light emitting diode module and method of forming a light emitting diode module
JP7464845B2 (en) Light-emitting device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20929414

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20929414

Country of ref document: EP

Kind code of ref document: A1