WO2021193738A1 - Cutting blade, cutting device, manufacturing method for ceramic green sheet and ceramic sintered body, and cutting method - Google Patents

Abstract

This cutting device has a pair of cutting blades, each having a circular disk shape with a cutting edge on an outer peripheral section thereof, and cuts a workpiece along a moving direction as the workpiece moves between rotational shafts of the pair of cutting blades while the pair of cutting blades rotate in mutually opposite directions. A workpiece W1 is cut when the cutting edges formed on the outer peripheral sections of the pair of cutting blades overlap each other as viewed along the axial direction of the rotational shafts. The cutting edge of one or both of the pair of cutting blades has a surface with an arithmetic average roughness Ra of 0.25 mm or smaller and a ten-point average roughness Rz of 1.5 mm or smaller.

Description

Cutting blades, cutting equipment, ceramic green sheet and ceramic sintered body manufacturing methods, and cutting methods

The present disclosure relates to a cutting blade, a cutting device, a method for manufacturing a ceramic green sheet and a ceramic sintered body, and a cutting method.

Goebel blades, gang blades, and the like are known as cutting blades used in cutting devices for cutting sheet materials such as resin films, magnetic tapes, paper, metal foils, and thin plates. In such a cutting device, the sheet material is cut by the upper blade arranged on the upper side and the lower blade arranged on the lower side with reference to the sheet material to be cut. In Patent Document 1, in the cross section passing through the rotation axis of the lower blade, the angle (θ1) formed by the inclined surface of the lower blade and the line parallel to the rotation axis of the lower blade is set within a predetermined range and is generated on the cut surface. It has been proposed to suppress deformation. Patent Document 2 proposes a technique for suppressing swelling of the end face of a cut film within a predetermined range of the cutting edge angle of the upper blade.

JP-A-2009-72900 Japanese Unexamined Patent Publication No. 2010-228023

Various sheets are cut by the cutting device. When cutting a sheet with a rotating cutting blade, chips generated during cutting may scatter. When such chips adhere to the sheet after cutting, there is a concern that it may affect the quality of the product or the operation of the downstream equipment. Therefore, the present disclosure provides a cutting blade capable of suppressing the generation of chips, and a cutting device including the cutting blade. The present disclosure also provides a manufacturing method capable of improving the quality and yield of the ceramic green sheet and the ceramic sintered body. The present disclosure also provides a cutting method capable of improving the quality and yield of the workpiece to be cut.

The cutting blade according to one aspect of the present disclosure is a disk-shaped cutting blade having a cutting blade on the outer peripheral portion and cutting a work while rotating, and the cutting blade has an arithmetic average roughness Ra and a ten-point average roughness. It has surfaces with Rz of 0.25 mm or less and 1.5 mm or less, respectively. The cutting edge of the cutting edge has a surface in which Ra and Rz are each set to a predetermined value or less. Since this surface is smoother than before, it is possible to prevent the work from entering the minute recesses on the surface of the cutting edge. In the case of a rotating cutting blade, chips are scattered by the centrifugal force of rotation. With the cutting blade, the amount of chips entering the recess is reduced, so that the amount of chips scattered by centrifugal force can be reduced. Therefore, the generation of chips can be suppressed.

The work may have a ceramic green sheet. Since the ceramic green sheet is formed by molding a slurry containing ceramic powder and a binder, chips are likely to scatter during cutting. With the above-mentioned cutting blade, even if the work having the ceramic green sheet is cut, the generation of chips can be suppressed. As a result, the adhesion of chips to the ceramic green sheet is suppressed, and the quality and yield of the ceramic green sheet can be improved.

The surface of the cutting edge may be polished and smoothed. By performing the smooth treatment, the tips of the convex portions on the surface can be aligned to some extent. As a result, the amount scraped by the convex portion when cutting the work is reduced, and the amount of chips generated can be reduced. Therefore, the generation of chips can be further suppressed.

The cutting device according to one aspect of the present disclosure includes a pair of disk-shaped cutting blades having cutting blades on the outer peripheral portion, and the pair of cutting blades rotate in opposite directions while moving between the rotation axes of the pair of cutting blades. A cutting device that cuts a moving work along the moving direction. In a side view, the work is cut when the cutting blades formed on the outer peripheral portions of the pair of cutting blades overlap each other, and the pair of cutting blades are cut. At least one is any of the cutting blades described above.

The cutting device cuts a workpiece moving between the rotation axes of a pair of cutting blades along the moving direction. In this cutting device, the work is cut when the cutting blades overlap each other when viewed along the axial direction of the rotating shaft, so that the surface of the cutting blade comes into contact with the cut surface of the work during cutting. Here, since at least one of the pair of cutting blades is any of the above-mentioned cutting blades, it is possible to prevent the work from entering the minute recesses on the surface of the cutting blades. Therefore, it is possible to suppress the generation of chips when cutting the work.

The method for manufacturing a ceramic green sheet according to one aspect of the present disclosure includes a step of cutting a work having a ceramic green sheet using a cutting device provided with any of the above-mentioned cutting blades. Since this manufacturing method uses a cutting device provided with any of the above-mentioned cutting blades, it is possible to suppress the generation of chips when cutting a work having a ceramic green sheet. As a result, the adhesion of chips to the ceramic green sheet is suppressed, and the quality and yield of the ceramic green sheet can be improved.

The method for producing a ceramic sintered body according to one aspect of the present disclosure includes a step of firing a ceramic green sheet produced by the above-mentioned manufacturing method to obtain a ceramic sintered body. According to this manufacturing method, since the adhesion of chips to the ceramic green sheet is suppressed, the quality and yield of the ceramic sintered body obtained by firing the ceramic green sheet can be improved.

The cutting method according to one aspect of the present disclosure includes a step of cutting a work using any of the above-mentioned cutting blades, and suppresses the generation of chips. Thereby, the quality and yield of the work to be cut can be improved.

The present disclosure can provide a cutting blade capable of suppressing the generation of chips and a cutting device including the cutting blade. Further, the present disclosure can provide a manufacturing method capable of improving the quality and yield of the ceramic green sheet and the ceramic sintered body. The present disclosure can also provide a cutting method capable of improving the quality and yield of the workpiece to be cut.

FIG. 1 is a side view of a cutting device including a cutting blade according to an embodiment. FIG. 2 is a perspective view of the cutting device according to the embodiment. FIG. 3 is a diagram for explaining smooth processing on the surface of the cutting edge. FIG. 4 is a plan view of the cutting blade used in the embodiment. FIG. 5 is a sectional view taken along line VV of the cutting blade of FIG. FIG. 6 is a plan view showing the vicinity of the cut portion of the laminated sheet in the cutting device used in the evaluation 1 of the embodiment. FIG. 7 is a plan view showing the vicinity of the cut portion of the laminated sheet in the cutting device used in the evaluation 2 of the embodiment.

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings in some cases. However, the following embodiments are examples for explaining the present disclosure, and are not intended to limit the present disclosure to the following contents. In the description, the same elements or elements having the same function are designated by the same reference numerals, and duplicate description will be omitted. Further, unless otherwise specified, the positional relationship such as up, down, left, and right used in the description is based on the orientation of the reference numerals shown in the drawings.

FIG. 1 is a side view showing a cutting device including a cutting blade according to an embodiment. The cutting device of FIG. 1 includes a pair of cutting blades 10 and 20. The cutting blades 10 and 20 have a disk shape, and have cutting blades 12 and 22 on the outer peripheral portion. The cutting blades 10 and 20 are provided in pairs as shown in FIG. 1, and the work W1 (object to be cut) is cut while rotating, respectively, to manufacture the work W2 (cut object). Examples of the workpieces W1 and W2 include sheet-like ones such as a resin film, a magnetic tape, paper, a metal foil, a thin plate, and a ceramic green sheet.

The cutting blade 10 of FIG. 1 cuts the work W1 while rotating clockwise along the circumferential direction with the rotation axis 14 as the center of rotation. The cutting blade 20 of FIG. 1 cuts the work W1 while rotating counterclockwise along the circumferential direction with the rotation axis 24 as the center of rotation. In this way, the cutting blade 10 and the cutting blade 20 cut the work W1 while rotating in opposite directions. The cutting blade 10 and the cutting blade 20 may be referred to as an upper blade and a lower blade, respectively, because of their positional relationship with each other. The cutting blade 10 and the cutting blade 20 may be Goebel blades. The rotating shafts 14 and 24 are rotationally driven by a rotating machine such as a motor (not shown).

As shown in FIG. 1, in the side view of the cutting device, a part of the peripheral edges of the cutting blades 12 and 22 formed on the outer peripheral portions of the cutting blades 10 and 20 overlap each other in the overlapping portion 15. The work W1 moves (runs) from the right side of FIG. 1 toward the overlapping portion 15 of the cutting blades 12 and 22, and is cut at the overlapping portion 15 along the moving direction (running direction). The cutting blades 12 and 22 may be in contact with each other at least in a part of the overlapping portion 15. The cut work W2 moves from the overlapping portion 15 toward the left side of FIG. In this way, the work W1 is cut, and a work W2 shorter than the work W1 is obtained.

There are fine irregularities on the surfaces of the cutting blades 12 and 22. When the work W1 is cut at the overlapping portion 15, the work W1 comes into contact with the surfaces of the cutting blades 12 and 22. Ra and Rz on the surfaces of the cutting blades 12 and 22 are 0.25 mm or less and 1.5 mm or less, respectively. Since Ra and Rz are small in this way, the amount of the work W1 that enters the recesses on the surfaces of the cutting blades 12 and 22 can be reduced. Therefore, it is possible to suppress chips scattered by the centrifugal force due to the rotation of the cutting blades 10 and 20.

Here, the surfaces in which Ra and Rz are in the above range may be included on the overlapping portion 15 side of the entire pair of surfaces of the cutting blades 12 and 22, respectively, and are included in the portion that becomes the overlapping portion 15. You may. On the side of the cutting blades 12 and 22 opposite to the overlapping portion 15 side, Ra and Rz may or may not have surfaces in the above range.

If the entire surfaces of the cutting blades 12 and 22 facing each other at the overlapping portion 15 are Ra and Rz described above, the generation of chips can be sufficiently suppressed. The area ratio of the surface where Ra and Rz are in the above range to the entire surface of the cutting blades 12 and 22 may be 50% or more, 70% or more, 90% or more, and 100%. May be. Here, the area ratio may be obtained by, for example, arbitrarily selecting 20 points from the entire surface of the cutting edges 12 and 22 and measuring Ra and Rz. At this time, the selection of 20 points may be performed at 10 points each on two straight lines extending in the radial direction of the cutting blades 10 and 20 and orthogonal to each other.

Ra on the surfaces of the cutting blades 12 and 22 may be 0.2 mm or less and 0.18 mm or less from the viewpoint of sufficiently suppressing chips. Ra may be 0.01 mm or more, or 0.02 mm or more, from the viewpoint of ease of manufacturing the cutting blades 10 and 20. The Rz on the surfaces of the cutting blades 12 and 22 may be 1.3 mm or less and 1.1 mm or less from the viewpoint of sufficiently suppressing chips. Rz may be 0.05 mm or more, or 0.1 mm or more, from the viewpoint of ease of manufacturing the cutting blades 10 and 20.

The Ry on the surfaces of the cutting blades 12 and 22 may be 2 mm or less, or 1.8 mm or less, from the viewpoint of sufficiently suppressing chips and smoothing the cut surface of the work W2. Ry may be 0.1 mm or more, or 0.2 mm or more, from the viewpoint of ease of manufacturing the cutting blades 10 and 20.

Each surface roughness Ra, Rz, Ry of the present disclosure is the surface roughness defined by JIS B 0601 (1994). Ra indicates the arithmetic mean roughness, Rz indicates the ten-point average roughness, and Ry indicates the maximum height. The reference length at the time of measurement is 3 mm. Further, the measurement is performed on both the front side and the back side of the cutting blade 12 (cutting blade 22), and both need to be in the above numerical range. Each surface roughness can be measured using a contact type surface roughness meter (for example, a small surface roughness measuring machine "SJ-210" (trade name) manufactured by Mitutoyo Co., Ltd.).

The width (length along the radial direction) of the cutting blades 12 and 22 of the cutting blades 10 and 20 may be, for example, 3 to 30 mm, or 10 to 20 mm. This width may be adjusted according to the thickness of the work W1. When cutting the work W1, the surface of the cutting edge 12 that comes into contact with the work W1 may have the above-mentioned surface roughness.

The peripheral edge of the cutting blade 12 of the cutting blade 10 may be warped toward the cutting blade 22 of the cutting blade 20. Further, the cutting edge of the cutting edge 12 may be tapered and sharpened. The peripheral edge of the cutting blade 22 of the cutting blade 20 may also be warped toward the cutting blade 12 of the cutting blade 10. Further, the cutting edge of the cutting edge 22 may be tapered and sharpened.

Both the cutting blades 12 and 22 of the cutting blades 10 and 20 of FIG. 1 may have surfaces having the above-mentioned surface roughness on both side surfaces. However, it is not limited to such an embodiment. For example, in the modified example, the surface of the cutting blade of only one of the cutting blade 10 and the cutting blade 20 may have the surface roughness in the above range. Even in such a modified example, the amount of the work W1 that enters the recess on the surface of either one of the cutting blades 12 and 22 can be reduced. Therefore, it is possible to suppress chips scattered by the centrifugal force due to the rotation of the cutting blades 10 and 20.

FIG. 2 is a perspective view of the cutting device according to the embodiment. The cutting device 100 cuts the work W1 along the moving direction (traveling direction) to manufacture a short roll 38 (roll body) around which the work W2 is wound. In the cutting device 100, for example, the work W1 drawn out from the long roll is introduced between the rotating shaft 14 of the cutting blade 10 and the rotating shaft 24 of the cutting blade 20. The tension at the time of cutting the work W1 is maintained by the tension roller 32.

The cutting device 100 includes three sets of a pair of cutting blades 10 and 20. The three sets of cutting blades 10 and 20 are arranged at substantially equal intervals along a direction orthogonal to the moving direction of the work W1 (longitudinal direction of the rollers 34 and 36). The three sets of cutting blades 10 and 20 are connected to common rotation shafts 14 and 24, respectively, and cut the work W1 into four along the moving direction while rotating by rotational driving by the rotation shafts 14 and 24.

The work W2 obtained by cutting the work W1 passes between the pressing rollers 34 and 36, then passes through the winding roller 37, and is wound in a roll shape. In this way, the short roll 38 is obtained. The short roll 38 may be, for example, one in which a resin release film and a laminated sheet of a ceramic green sheet are wound. The ceramic green sheet may be a sheet formed by a mixture containing a ceramic powder, a sintering aid and a binder. The binder may contain an organic component.

In each of the cutting blades 10 and 20 of each set, one ends of the cutting blades 12 and 22 formed on the outer peripheral portions of the cutting blades 10 and 20 overlap each other in the side view of the workpieces W1 and W2. At this overlapping portion, the work W1 is cut along the moving direction. The cutting device 100 has a total of 6 cutting blades. The surface roughness of the cutting blades formed on the outer peripheral portion of at least one of the six cutting blades may be within the above range. This prevents the work W1 from entering the recesses between the minute protrusions on the surface of the cutting edge. Therefore, it is possible to suppress the generation of chips when cutting the work W1.

On all both side surfaces of the six cutting blades, the cutting blades formed on the outer peripheral portion may have a surface having a surface roughness in the above range. Thereby, the generation of chips can be sufficiently suppressed. Further, of the three sets of cutting blades 10 and 20, only the cutting blades of the three cutting blades 10 (upper blades) may have surfaces having the above-mentioned surface roughness on both side surfaces. Further, one side surface may have a surface having the above-mentioned surface roughness.

The cutting blades 10 and 20 may be made of a cemented carbide containing carbides (WC, etc.) and metals (Co, Ni, etc.). The surface roughness of the cutting blade 12 (22) in the cutting blade 10 (20) can be adjusted by grinding such a cutting blade with a diamond grindstone or the like and then performing a smooth treatment using a polishing machine. can. The conditions for smooth processing may be appropriately adjusted according to the permissible range of the amount of chips generated. For example, when it is desired to reduce the amount of chips generated, smooth processing may be performed under stronger polishing conditions (conditions in which unevenness is reduced).

FIG. 3 is a diagram for explaining the smooth processing of the cutting edge. The left side of FIG. 3 shows the uneven structure 40 on the surface of the cutting edge. The uneven structure 40 is obtained by grinding the surface of the cutting edge with a diamond grindstone or the like. In the smooth treatment, the tips of some of the convex portions in the concave-convex structure 40 that are largely protruding can be cut out. As a result, the uneven structure 42 is obtained. The concave-convex structure 42 shown in FIG. 3 has aligned tips, but the tips may not be completely aligned in this way. If the cutting blade has a cutting blade that has been subjected to a smooth treatment, it is possible to prevent the work W1 from being scraped and turned into chips at the tip of the convex portion that protrudes more than the other convex portions. Therefore, the generation of chips can be sufficiently suppressed. If the surface of at least one of the cutting blades 10 and 20 is smoothed, the amount of chips generated can be reduced as compared with the case where the smoothing is not performed at all.

The method for manufacturing the ceramic green sheet according to the embodiment may be performed using the cutting device 100. In this manufacturing method, a raw material slurry containing a ceramic powder, a sintering aid, and a binder is applied to a mold release film to a predetermined thickness by a doctor blade method, a calendar method, an extrusion method, or the like, dried, and then dried to obtain a ceramic green sheet. Performs a molding process. The release film may be a polyester film such as PET. A laminated sheet of a ceramic green sheet and a release film may be wound in a roll shape and used as the work W1. A cutting step of cutting the laminated sheet along the moving direction of the laminated sheet is performed using the cutting device 100 based on the above description. The cut laminated sheet may be rolled again as the work W2 to form a short roll 38.

Since this manufacturing method uses the cutting device 100 provided with the cutting blades 10 and 20, it is possible to suppress the generation of chips when cutting the work W1 having the ceramic green sheet. Therefore, it is possible to prevent chips from adhering to the ceramic green sheet (work W2) after cutting. As a result, the quality and yield of the ceramic green sheet can be improved.

The method for producing a ceramic sintered body according to one embodiment is a firing step in which a laminated sheet is pulled out from a short roll, cut to a predetermined length, a release film is removed from the laminated sheet, and then the ceramic green sheet is fired. You may go to obtain a ceramic sintered body. According to this manufacturing method, since the adhesion of chips to the ceramic green sheet after cutting is suppressed, the quality and yield of the ceramic sintered body obtained by firing the ceramic green sheet can be improved.

Examples of ceramics include carbides, oxides and nitrides. Specific examples thereof include silicon nitride, silicon carbide, alumina, aluminum nitride and boron nitride. The ceramic sintered body may be, for example, a ceramic substrate.

The cutting method according to one embodiment includes a step of cutting the work W1 using the cutting blades 10 and 20. By having such a step, it is possible to suppress the generation of chips when cutting the work W1. As a result, it is possible to prevent chips from adhering to the work W2 after cutting, resulting in deterioration of the quality of the work W2 and a decrease in yield.

Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above embodiments. For example, the cutting blades 10 and 20 shown in FIG. 1 may be attached to a cutting device different from the cutting device 100. Further, the method for cutting the ceramic green sheet, the method for producing the ceramic sintered body, and the cutting method may be performed using the cutting device 100, or another cutting method including at least one of the cutting blade 10 and the cutting blade 20. It may be done using a device.

The contents of the present disclosure will be described in more detail with reference to the following examples, but the present disclosure is not limited to the following examples.

[Evaluation 1]
(Examples 1 to 3, Comparative Example 1)
A raw material slurry containing silicon nitride powder and a sintering aid (magnesium oxide powder, yttrium oxide powder and silicon dioxide powder) is applied onto a PET film and dried to form a ceramic green sheet on the PET film and laminated. Got This was rolled into a roll to obtain a long roll. The laminated sheet drawn from the long roll was cut using a commercially available slitter (cutting device) in the following manner.

The following cutting blades 60A, 60B, 10A, and 10B were prepared as cutting blades to be attached to the cutting device. The cutting blades 60A, 60B, 10A, and 10B are cutting blades made of a cemented carbide containing WC and Co. These cutting blades were produced by polishing the entire surface of a commercially available cutting blade with a diamond grindstone. Of these, the cutting blades 10A and 10B were polished with the diamond grindstone and then smoothly processed using a polishing machine. The cutting blades 60A, 60B, 10A, and 10B had the same configuration (shape, size, and material) except for the surface roughness of the entire surface of the cutting blade.

FIG. 4 is a plan view of the cutting blades 60A (60B, 10A, 10B). FIG. 5 is a sectional view taken along line VV of FIG. As shown in FIG. 5, the cutting blades 60A, 60B, 10A, and 10B were warped upward on the outer peripheral portion than on the inner peripheral portion. The surface roughness (Ra, Rz, Ry) of each cutting blade was measured using a small surface roughness measuring machine "SJ-210" (trade name) manufactured by Mitutoyo Co., Ltd. The measurement was performed at two measurement sites 52 and 54 on the side surfaces 12a and 12b of each cutting blade. At the measurement site 54, the surface roughness was measured along the radial direction of each cutting blade, and at the measurement site 52, the surface roughness was measured along the direction orthogonal to the radial direction of each cutting blade. The measurement results are as shown in Table 1.

As shown in Table 1, the Ra and Rz of the side surfaces 12a and 12b of the cutting blades 10A and 10B were 0.25 mm or less and 1.5 mm or less, respectively. The Ry of the side surfaces 12a and 12b of the cutting blades 10A and 10B was 2 mm or less. On the other hand, Ra and Rz of the side surface 12a of the cutting blade 60A were 0.25 mm or less and 1.5 mm or less, respectively, but Ra of the side surface 12b exceeded 0.25 mm. The Ra and Rz of the side surface 12a of the cutting blade 60B were 0.25 mm or less and 1.5 mm or less, respectively, but the Ra of a part of the side surface 12b exceeded 0.25 mm.

FIG. 6 is a plan view showing the vicinity of the cut portion of the laminated sheet (work W1) in the cutting device. This cutting device was equipped with eight sets of cutting blades, which was larger than that of the cutting device of FIG. The cutting blades of each set were arranged in pairs to cut the work W1 as shown in FIG. In this way, using a total of 8 sets x 2 = 16 cutting blades, the laminated sheet is divided into 9 along the moving direction (the direction from top to bottom based on the direction of the reference numerals in FIG. 6). It was cut so that it could be divided. As shown in FIG. 6, of the eight sets of cutting blades, the upper blades of the fourth, fifth, sixth, seventh and eighth sets from the left include the above-mentioned cutting blade 60A, cutting blade 60A and cutting blade. 60B, cutting blade 10A and cutting blade 10B were attached respectively. As shown in the cutting blade 10B of FIG. 6, the side surface orientation of each cutting blade is such that the right side is the side surface 12a and the left side is the side surface 12b. On the other hand, the lower blade used was the same for each group.

The number of chips generated was counted while cutting the laminated sheet using such a cutting device. Specifically, as shown in FIG. 6, the number of chips adhering to the surfaces of the cut laminated sheets C, D, E, and F was visually counted. The number of chips was counted on each of the ceramic green sheet side (front side) and the PET film side (back side) of the laminated sheets C, D, E, and F. The number of chips was counted at four locations on the front side and three locations on the back side from the time when the cutting blades were cut by the cutting blades 60A, 60B, 10A, and 10B until immediately before the cut laminated sheet was wound up. The number of chips generated on the front side and the back side and the total value thereof are as shown in Table 2.

As shown in Table 2, the most chips were generated in the laminated sheet C in which both sides were cut by the pair of cutting blades 60A. On the other hand, in the laminated sheet F in which both sides were cut by the cutting blades 10A and 10B, the number of chips generated was the smallest. The laminated sheet D located between the side surface 12a of the cutting blade 60A and the side surface 12b of the cutting blade 60B and cut by the cutting blade 60A and the cutting blade 60B generated less chips than the laminated sheet C. The laminated sheet E located between the side surface 12a of the cutting blade 60B and the side surface 12b of the cutting blade 10A and cut by the cutting blade 60B and the cutting blade 10A generated fewer chips than the laminated sheet D.

From these results, by cutting the laminated sheet with a cutting blade having a surface having an arithmetic average roughness (Ra) and a ten-point average roughness (Rz) of 0.25 mm or less and 1.5 mm or less, respectively, the chips are separated from each other. It was confirmed that the occurrence could be suppressed.

[Evaluation 2]
(Examples 4 to 6, Comparative Example 2)
The following cutting blades 80A, 80B, 70A, 70B were prepared. These cutting blades are cutting blades made of cemented carbide containing WC and Co, and the entire surface of the cutting blade is polished with a diamond grindstone. The cutting blades 80A, 80B, 70A, and 70B had the same configuration (shape, size, and material) except for the surface roughness of the entire surface of the cutting blade. The surface roughness of the cutting blades of each cutting blade was measured in the same manner as the cutting blades 60A, 60B, 10A, and 10B. The measurement results are as shown in Table 3.

As shown in Table 3, the Ra and Rz of the side surfaces 12a and 12b of the cutting blades 70A and 70B were 0.25 mm or less and 1.5 mm or less, respectively. The Ra and Rz of the side surfaces 12a of the cutting blades 80A and 80B were 0.25 mm or less and 1.5 mm or less, respectively. On the other hand, the Ra of the side surface 12b of the cutting blade 80A exceeded 0.25 mm. Ra of a part of the side surface 12b of the cutting blade 80B exceeded 0.25 mm.

In the same manner as in Evaluation 1, as shown in FIG. 7, among the eight sets of cutting blades, the upper blades of the fourth, fifth, sixth, seventh and eighth sets from the left have the above-mentioned cutting blade 80A. , Cutting blade 80A, cutting blade 80B, cutting blade 70A and cutting blade 70B, respectively. As shown in the cutting blade 70B of FIG. 7, the side surface orientation of each cutting blade is such that the right side is the side surface 12a and the left side is the side surface 12b. On the other hand, the lower blade used was the same for each group. The number of chips was counted in the same manner as in evaluation 1. The number of chips generated on the front side and the back side and the total value thereof are as shown in Table 4.

As shown in Table 4, the most chips were generated in the laminated sheet G in which both sides were cut by the pair of cutting blades 80A. On the other hand, the laminated sheet J cut by the cutting blades 70A and 70B, and the laminated sheet I located between the side surface 12a of the cutting blade 80B and the side surface 12b of the cutting blade 70A and cut by the cutting blade 80B and the cutting blade 70A. The number of chips generated was the smallest. The laminated sheet H located between the side surface 12a of the cutting blade 80A and the side surface 12b of the cutting blade 80B and cut by the cutting blade 80A and the cutting blade 80B generated less chips than the laminated sheet G.

From these results, by cutting the laminated sheet with a cutting blade having a surface having an arithmetic average roughness (Ra) and a ten-point average roughness (Rz) of 0.25 mm or less and 1.5 mm or less, respectively, the chips are separated from each other. It was confirmed that the occurrence could be suppressed.

According to the present disclosure, a cutting blade capable of suppressing the generation of chips and a cutting device provided with the cutting blade are provided. Further, a manufacturing method capable of improving the quality and yield of the ceramic green sheet and the ceramic sintered body is provided. Further, a cutting method capable of improving the quality and yield of the workpiece to be cut is provided.

10, 20, 10A, 10B, 60A, 60B ... Cutting blade, 12, 22 ... Cutting blade, 12a, 12b ... Side surface, 14, 24 ... Rotating shaft, 15 ... Overlapping part, 32 ... Tension roller, 34, 36 ... Presser Roller, 37 ... Winding roller, 38 ... Short roll, 40, 42 ... Concavo-convex structure, 52, 54 ... Measurement site, 100 ... Cutting device, C, D, E, F ... Laminated sheet, W1, W2 ... Work.

Claims (7)

1. A disk-shaped cutting blade that has a cutting blade on the outer circumference and cuts the workpiece while rotating.
   The cutting edge is a cutting edge having a surface having an arithmetic average roughness Ra and a ten-point average roughness Rz of 0.25 mm or less and 1.5 mm or less, respectively.
2. The cutting blade according to claim 1, wherein the work has a ceramic green sheet.
3. The cutting blade according to claim 1 or 2, wherein the surface of the cutting blade is smoothed.
4. A disk-shaped pair of cutting blades having cutting blades on the outer periphery is provided, and a workpiece that moves between the rotation axes of the pair of cutting blades while the pair of cutting blades rotate in opposite directions is moved along the moving direction. It is a cutting device that cuts
   In the side view, the work is cut when the cutting blades formed on the outer peripheral portions of the pair of cutting blades overlap each other.
   A cutting device in which at least one of the pair of cutting blades is the cutting blade according to any one of claims 1 to 3.
5. A method for manufacturing a ceramic green sheet, which comprises a step of cutting a work having a ceramic green sheet using a cutting device provided with the cutting blade according to any one of claims 1 to 3.
6. A method for producing a ceramic sintered body, which comprises a step of firing the ceramic green sheet produced in claim 5 to obtain a ceramic sintered body.
7. A cutting method for suppressing the generation of chips, which comprises a step of cutting the work using the cutting blade according to any one of claims 1 to 3.

Images