WO2021192142A1 - Pulse wave detection device - Google Patents

Pulse wave detection device Download PDF

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Publication number
WO2021192142A1
WO2021192142A1 PCT/JP2020/013676 JP2020013676W WO2021192142A1 WO 2021192142 A1 WO2021192142 A1 WO 2021192142A1 JP 2020013676 W JP2020013676 W JP 2020013676W WO 2021192142 A1 WO2021192142 A1 WO 2021192142A1
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WO
WIPO (PCT)
Prior art keywords
accommodating
band
pulse wave
accommodating portion
wrist
Prior art date
Application number
PCT/JP2020/013676
Other languages
French (fr)
Japanese (ja)
Inventor
渋谷隆夫
茂木孝之
松田勲
Original Assignee
太陽誘電株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 太陽誘電株式会社 filed Critical 太陽誘電株式会社
Priority to PCT/JP2020/013676 priority Critical patent/WO2021192142A1/en
Publication of WO2021192142A1 publication Critical patent/WO2021192142A1/en

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/02Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure

Definitions

  • the present invention relates to a pulse wave detection device.
  • a vibration sensor having a piezoelectric element for detecting a pulse wave of a human body and a pulse wave detecting device having the vibration sensor attached to a band wrapped around a finger or a wrist have been known.
  • This vibration sensor includes a substrate, a piezoelectric element arranged on the substrate, and a tubular member or a conductive spacer arranged on the substrate so as to surround the piezoelectric element and directly pressed against the human body ().
  • Patent Documents 1 and 2 See Patent Documents 1 and 2.
  • the band is provided with parts other than the vibration sensor.
  • the present invention has been made in view of the above problems, and provides a pulse wave detection device capable of accurately detecting a pulse wave of a wrist and avoiding damage to parts such as a communication unit or a power supply unit.
  • the purpose is.
  • the present invention includes a sensor that detects a pulse wave signal from the radial artery of the wrist, a communication unit that wirelessly communicates the pulse wave signal to an external device, a power supply unit that supplies power to the sensor and the communication unit, and the above.
  • a first accommodating unit accommodating a sensor, a second accommodating unit accommodating the communication unit, a third accommodating unit accommodating the power supply unit, and the first accommodating unit, the second accommodating unit, and the third accommodating unit.
  • a band having at least two connecting portions and fixing to the wrist is provided, and the band is fixed to the wrist so that the first accommodating portion is arranged at a position facing the radial artery of the wrist.
  • at least one of the second accommodating portion and the third accommodating portion is arranged so as to face the region between the radius and the ulnar bone on the dorsal or ventral side of the wrist. be.
  • the power supply unit may be arranged between the sensor and the communication unit.
  • the second accommodating portion may be arranged between the wrist and the communication portion and may include a first reinforcing member having a elastic modulus larger than that of the band.
  • the third accommodating portion may be arranged between the wrist and the power supply portion, and may include a second reinforcing member having a elastic modulus larger than that of the band.
  • the connecting portion is formed between the first accommodating portion, the second accommodating portion, and the third accommodating portion, and the first accommodating portion, the second accommodating portion, and the third accommodating portion.
  • a first connecting portion thinner than the thickness of the second accommodating portion and a second connecting portion formed between the second accommodating portion and the third accommodating portion and thinner than the thickness of the second accommodating portion and the third accommodating portion. Can be configured to include.
  • the connecting portion is formed between the first accommodating portion, the second accommodating portion, and the third accommodating portion, and the first accommodating portion, the second accommodating portion, and the third accommodating portion.
  • the first connecting portion which is thinner than the thickness of the above, may be provided, and the second accommodating portion and the third accommodating portion may be integrated without being separated.
  • the band is a band-shaped band, includes a first locking portion and a second locking portion that locks the first locking portion, and the sensor is the communication unit and the power supply. It can be configured to be arranged at a position closer to the second locking portion than the portion.
  • the band locks a first band member having a first attachment portion and a first locking portion to the watch, and a second attachment portion to the watch and the first locking portion.
  • a second band member having two locking portions is provided, and the sensor, the power supply unit, and the communication unit are arranged in the first band member, and the sensor is more than the communication unit and the power supply unit. 1 It can be configured to be arranged at a position close to the locking portion.
  • the band locks the first band member having the first attachment portion to the watch and the first locking portion, and the second attachment portion to the watch and the first locking portion.
  • a second band member having a second locking portion is provided, and the sensor, the power supply unit, and the communication unit are arranged in the second band member, and the sensor is more than the communication unit and the power supply unit. It can be configured to be arranged at a position close to the second mounting portion.
  • the senor has a second substrate having a first surface and a second surface on the opposite side of the first surface, and a protrusion fixed to the first surface at substantially the center of the second substrate.
  • a case is provided which covers two surfaces, faces the piezoelectric element through a space, and supports two opposing sides of the second surface of the second substrate, and the space is provided with a case based on the elastic modulus of the case. It can also be configured to be filled with a material having a low elastic modulus.
  • the senor is formed on one of an insulating portion provided on two opposing sides of the second surface of the second substrate and an inner wall, an inner wall, or an outer wall of the case, and the insulating portion and the insulating portion. It can be configured to include a conductive material that is electrically connected.
  • the band may be formed of either rubber, urethane or silicon.
  • the pulse wave of the wrist can be accurately detected, and damage to parts such as the communication unit or the power supply unit can be avoided.
  • FIG. 1A is a diagram showing a configuration of a pulse wave detection device according to the present embodiment.
  • FIG. 1B is a diagram showing a state in which the pulse wave detection device of FIG. 1A is wrapped around the wrist.
  • FIG. 2A is a diagram showing a configuration of a first modification of the pulse wave detection device.
  • FIG. 2B is a diagram showing a state in which the pulse wave detection device of FIG. 2A is wrapped around the wrist.
  • FIG. 3A is a diagram showing a configuration of a second modification of the pulse wave detection device.
  • FIG. 3B is a diagram showing a state in which the pulse wave detection device of FIG. 3A is wrapped around the wrist.
  • FIG. 4A is a diagram showing a configuration of a third modification of the pulse wave detection device.
  • FIG. 1A is a diagram showing a configuration of a pulse wave detection device according to the present embodiment.
  • FIG. 1B is a diagram showing a state in which the pulse wave detection device of FIG. 1A is wrapped
  • FIG. 4B is a diagram showing a state in which the pulse wave detection device of FIG. 4A is wrapped around the wrist.
  • FIG. 5A is a cross-sectional view showing the configuration of the vibration sensor.
  • 5 (b) and 5 (c) are cross-sectional views of a case included in the vibration sensor.
  • FIG. 6 is a plan view showing the configuration of the vibration sensor.
  • 7 (a) to 7 (d) are diagrams showing an example of a case.
  • FIG. 8 is a block diagram showing the configurations of the vibration sensor, the signal processing / communication unit, and the power supply unit.
  • FIG. 9A is a cross-sectional view of the first accommodating portion to the third accommodating portion of the band.
  • FIG. 9B is a cross-sectional view showing a first modification of the first accommodating portion to the third accommodating portion.
  • FIG. 10A is a cross-sectional view showing a second modification of the first accommodating portion to the third accommodating portion.
  • FIG. 10B is a cross-sectional view showing a third modified example of the first accommodating portion to the third accommodating portion.
  • FIG. 1A is a diagram showing a configuration of a pulse wave detection device according to the present embodiment.
  • FIG. 1B is a diagram showing a state in which the pulse wave detection device of FIG. 1A is wrapped around the wrist.
  • FIG. 2A is a diagram showing a configuration of a first modification of the pulse wave detection device.
  • FIG. 2B is a diagram showing a state in which the pulse wave detection device of FIG. 2A is wrapped around the wrist.
  • FIG. 3A is a diagram showing a configuration of a second modification of the pulse wave detection device.
  • FIG. 3B is a diagram showing a state in which the pulse wave detection device of FIG. 3A is wrapped around the wrist.
  • FIG. 4A is a diagram showing a configuration of a third modification of the pulse wave detection device.
  • FIG. 4B is a diagram showing a state in which the pulse wave detection device of FIG. 4A is wrapped around the wrist.
  • the pulse wave detection device 1 is, for example, a single tape-shaped band that can be wrapped around the wrist.
  • the pulse wave detection device 1 includes a band 2, a pin buckle (first locking portion) 3 formed at one end of the band 2, and a plurality of pin buckles 3 formed at the other end of the band 2 into which a pin of the pin buckle 3 can be inserted. It is provided with a through hole (second locking portion) 4 of the above.
  • the band 2 is made of rubber or a resin such as silicon or urethane, and the elastic modulus of the band 2 is, for example, 0.1 to 3000 Mpa. Since the band 2 is made of a flexible material, it easily fits on the wrist.
  • the pin buckle 3 and the through hole 4 function as locking portions. Since the band 2 only needs to have a member that locks one end of the band 2 with the other end, it is a magic tape (registered trademark) or another locking portion used for a watch band other than the pin buckle 3 and the through hole 4. Can be adopted. Further, the band 2 may be a band having a ring shape and a width like a rubber band having no locking portion.
  • the band 2 includes a vibration sensor 21 that detects a pulse wave signal from the radial artery, a signal processing / communication unit 22 that performs signal processing on the pulse wave signal and transmits the signal-processed pulse wave signal to an external device, and vibration. It includes a sensor 21 and a power supply unit 23 that supplies power to the signal processing / communication unit 22.
  • the signal line 71, the power line 72, and the ground (GND) line 73 are directly connected between the vibration sensor 21 and the signal processing / communication unit 22. Further, the power line 72 and the ground (GND) line 73 are directly connected between the signal processing / communication unit 22 and the power supply unit 23.
  • Band 2 is flexible by having at least one connecting portion that connects the two. Therefore, the fit of the pulse wave detection device 1 to the wrist is improved. Moreover, since the connecting portion has flexibility, the flexibility is increased while maintaining the flatness of the substrate, and the reliability of the module having the printed circuit board can be maintained. The details will be described later.
  • the total length L1 of the band 2 is, for example, 150 to 250 mm.
  • the length L2 from the end of the pin buckle 3 to the center of the signal processing / communication unit 22 is, for example, 10 to 110 mm.
  • the length L3 from the center of the signal processing / communication unit 22 to the center of the power supply unit 23 is, for example, 20 to 100 mm.
  • the length L4 from the center of the power supply unit 23 to the center of the vibration sensor 21 is, for example, 30 to 80 mm.
  • the band 2 includes a first accommodating unit 210 accommodating the vibration sensor 21, a second accommodating unit 220 accommodating the signal processing / communication unit 22, and a third accommodating unit 230 accommodating the power supply unit 23. Further, the band 2 includes a first connecting portion 81 and a second connecting portion 82. The positions and thicknesses of the first to third accommodating portions and the first to second connecting portions will be described below.
  • the first connecting portion 81 is formed between the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230, and the thickness of the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230. Thinner than.
  • the second connecting portion 82 is formed between the second accommodating portion 220 and the third accommodating portion 230, and is thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230.
  • the thickness of the first accommodating portion 210 to the third accommodating portion 230 is, for example, 1 to 15 mm, and the thickness of the first connecting portion 81 and the second accommodating portion 82 is, for example, 0.5 to 5 mm.
  • the signal line 71, the power line 72, and the ground (GND) line 73 pass through the first connecting portion 81 and the second connecting portion 82.
  • the convex member 38 of the vibration sensor 21 protrudes and is exposed from the surface of the band 2, but the other parts of the vibration sensor 21, the signal processing / communication unit 22 and the power supply unit 23 are embedded inside the band 2. .. Since the first connecting portion 81 and the second connecting portion 82 are made of a material thinner and more flexible than the thickness of the first accommodating portion 210, the second accommodating portion 220 and the third accommodating portion 230, the band 2 is attached to the wrist 10. When mounted, the first connecting portion 81 and the second connecting portion 82 are easily bent.
  • the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are arranged in the band 2 in the order of the signal processing / communication unit 22, the power supply unit 23, and the vibration sensor 21 along the direction from the pin buckle 3 to the through hole 4. Has been done.
  • the vibration sensor 21 is arranged at a position on the band 2 closer to the through hole 4 than the signal processing / communication unit 22 and the power supply unit 23.
  • FIG. 1B is a cross-sectional view of the band 2 of FIG. 1A wound around the left wrist 10.
  • FIG. 1B shows a state viewed from the fingertip side.
  • the wrist 10 includes a radius 11, an ulna 12, a radial artery 13, a palmaris longus muscle 14, and an extensor digitorum muscle 15.
  • the upper side of FIG. 1 (b) is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 1 (b) is the palm side or the ventral side of the wrist.
  • the third accommodating portion is formed.
  • the 230 and the power supply unit 23 are arranged so as to face the extensor digitorum muscle 15 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the dorsal side of the wrist is relatively less curved, that is, the region 15A facing the extensor digitorum muscle 15, damage to the power supply unit 23 can be prevented.
  • the region 15A facing the extensor digitorum muscle 15 corresponds to the region between the radius 11 and the ulna 12 on the dorsal side of the wrist, and the region 14A facing the palmaris longus 14 is the ventral side of the wrist. Corresponds to the area between the radius 11 and the ulna 12.
  • the pulse wave detection device 1A of FIG. 2A is different from the pulse wave detection device 1 of FIG. 1A in the positions of the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23.
  • Other configurations of the pulse wave detection device 1A are the same as the corresponding configurations of the pulse wave detection device 1.
  • the length L6 from the end of the pin buckle 3 to the center of the signal processing / communication unit 22 is, for example, 40 to 120 mm.
  • the length L7 from the center of the signal processing / communication unit 22 to the center of the power supply unit 23 is, for example, 10 to 50 mm.
  • the length L8 from the center of the power supply unit 23 to the center of the vibration sensor 21 is, for example, 10 to 50 mm.
  • FIG. 2B is a cross-sectional view of the band 2 of FIG. 2A wound around the left wrist 10.
  • FIG. 2B shows a state viewed from the fingertip side.
  • the upper side of FIG. 2B is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 2B is the palm side or the ventral side of the wrist.
  • the third accommodating portion 210 and the vibration sensor 21 are arranged.
  • the portion 230 and the power supply portion 23 are arranged so as to face the palmaris longus muscle 14 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A facing the palmaris longus muscle 14, damage to the power supply unit 23 can be prevented.
  • the positions of the third accommodating unit 230 and the power supply unit 23 may be exchanged with the positions of the second accommodating unit 220 and the signal processing / communication unit 22.
  • the second accommodating portion 220 and signal processing / communication are performed.
  • the portion 22 is arranged so as to face either the palmaris longus muscle 14 or the extensor digitorum muscle 15 of the wrist 10. Therefore, since the signal processing / communication unit 22 is arranged in the area 14A or 15A, damage to the signal processing / communication unit 22 can be prevented.
  • band 2 is a watch band, and a watch 5 is provided in the middle of the band 2.
  • the band 2 has a first band member 2A having a pin buckle 3 and a first attachment portion 6 to the watch 5, a second band member 2A having a through hole 4 for locking the pin buckle 3 and a second attachment portion 7 to the watch 5. It includes a band member 2B.
  • the first band member 2A and the second band member 2B are made of rubber or a resin such as urethane or silicon, and the elastic modulus of the band 2 is, for example, 0.1 to 3000 Mpa.
  • the first band member 2A includes a vibration sensor 21, a signal processing / communication unit 22, and a power supply unit 23. Further, the first band member 2A includes a first accommodating unit 210 accommodating the vibration sensor 21, a second accommodating unit 220 accommodating the signal processing / communication unit 22, and a third accommodating unit 230 accommodating the power supply unit 23. There is. Furthermore, the first band member 2A includes a first connecting portion 81 and a second connecting portion 82. The positions and thicknesses of the first to third accommodating portions and the first to second connecting portions will be described below.
  • the first connecting portion 81 is formed between the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230, and the thickness of the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230. Thinner than.
  • the second connecting portion 82 is formed between the second accommodating portion 220 and the third accommodating portion 230, and is thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230.
  • the thickness of the first accommodating portion 210 to the third accommodating portion 230 is, for example, 1 to 15 mm, and the thickness of the first connecting portion 81 and the second accommodating portion 82 is, for example, 0.5 to 5 mm.
  • a signal line 71, a power line 72, and a ground (GND) line 73 are connected between the vibration sensor 21 and the signal processing / communication unit 22.
  • a power line 72 and a ground (GND) line 73 are connected between the signal processing / communication unit 22 and the power supply unit 23. Therefore, the signal line 71, the power line 72, and the ground (GND) line 73 pass through the first connecting portion 81 and the second connecting portion 82.
  • the convex member 38 of the vibration sensor 21 protrudes and is exposed from the surface of the band 2, but the other parts of the vibration sensor 21, the signal processing / communication unit 22 and the power supply unit 23 are embedded inside the first band member 2A. It has been.
  • the first band member 2A is longer than the second band member 2B.
  • the total length L10 of the first band member 2A is, for example, 80 to 160 mm.
  • the total length L11 of the second band member 2B is, for example, 40 to 90 mm.
  • the length L12 from the end of the pin buckle 3 to the center of the vibration sensor 21 is, for example, 10 to 50 mm.
  • the length L13 from the center of the vibration sensor 21 to the center of the power supply unit 23 is, for example, 10 to 50 mm.
  • the length L14 from the center of the power supply unit 23 to the center of the signal processing / communication unit 22 is, for example, 10 to 50 mm.
  • the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are first arranged in the order of the vibration sensor 21, the power supply unit 23, and the signal processing / communication unit 22 along the direction from the pin buckle 3 to the first mounting unit 6. It is arranged on the band member 2A.
  • the vibration sensor 21 is arranged at a position closer to the pin buckle 3 than the power supply unit 23 and the signal processing / communication unit 22.
  • FIG. 3B is a cross-sectional view of the band 2 of FIG. 3A wound around the left wrist 10.
  • FIG. 3B shows a state viewed from the fingertip side.
  • the upper side of FIG. 3B is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 3B is the palm side or the ventral side of the wrist.
  • the third accommodating portion is formed.
  • the 230 and the power supply unit 23 are arranged so as to face the palmaris longus muscle 14 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A, the warpage of the power supply unit 23 can be suppressed and the power supply unit 23 can be prevented from being damaged. This is particularly effective when the power supply unit 23 is damaged and an excessive current may flow.
  • the second band member 2B includes a vibration sensor 21, a signal processing / communication unit 22, and a power supply unit 23. Further, the second band member 2B includes a first accommodating unit 210 accommodating the vibration sensor 21, a second accommodating unit 220 accommodating the signal processing / communication unit 22, and a third accommodating unit 230 accommodating the power supply unit 23. There is. Further, the second band member 2B includes a first connecting portion 81 and a second connecting portion 82. The positions and thicknesses of the first to third accommodating portions and the first to second connecting portions will be described below.
  • the first connecting portion 81 is formed between the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230, and the thickness of the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230. Thinner than.
  • the second connecting portion 82 is formed between the second accommodating portion 220 and the third accommodating portion 230, and is thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230.
  • the thickness of the first accommodating portion 210 to the third accommodating portion 230 is, for example, 1 to 15 mm, and the thickness of the first connecting portion 81 and the second accommodating portion 82 is, for example, 0.5 to 5 mm.
  • a signal line 71, a power line 72, and a ground (GND) line 73 are connected between the vibration sensor 21 and the signal processing / communication unit 22.
  • a power line 72 and a ground (GND) line 73 are connected between the signal processing / communication unit 22 and the power supply unit 23. Therefore, the signal line 71, the power line 72, and the ground (GND) line 73 pass through the first connecting portion 81 and the second connecting portion 82.
  • the convex member 38 of the vibration sensor 21 protrudes and is exposed from the surface of the band 2, but the other parts of the vibration sensor 21, the signal processing / communication unit 22 and the power supply unit 23 are embedded inside the second band member 2B. It has been.
  • the second band member 2B is longer than the first band member 2A.
  • the total length L15 of the first band member 2A is, for example, 60 to 110 mm.
  • the total length L16 of the second band member 2B is, for example, 80 to 130 mm.
  • the length L17 from the second mounting portion 7 to the center of the vibration sensor 21 is, for example, 20 to 60 mm.
  • the length L18 from the center of the vibration sensor 21 to the center of the power supply unit 23 is, for example, 10 to 50 mm.
  • the length L19 from the center of the power supply unit 23 to the center of the signal processing / communication unit 22 is, for example, 10 to 50 mm.
  • the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are second in the order of the vibration sensor 21, the power supply unit 23, and the signal processing / communication unit 22 along the direction from the second mounting unit 7 toward the through hole 4. It is arranged on the band member 2B.
  • the vibration sensor 21 is arranged at a position closer to the second mounting portion 7 than the signal processing / communication unit 22 and the power supply unit 23.
  • FIG. 4B is a cross-sectional view of the band 2 of FIG. 4A wound around the left wrist 10.
  • FIG. 4B shows a state viewed from the fingertip side.
  • the upper side of FIG. 4B is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 4B is the palm side or the ventral side of the wrist.
  • the third accommodating portion is formed.
  • the 230 and the power supply unit 23 are arranged so as to face the palmaris longus muscle 14 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A, the curvature of the power supply unit 23 can be suppressed and the power supply unit 23 can be prevented from being damaged.
  • the positions of the third accommodating unit 230 and the power supply unit 23 may be exchanged with the positions of the second accommodating unit 220 and the signal processing / communication unit 22.
  • the second accommodating portion 220 and signal processing / communication are performed.
  • the portion 22 is arranged so as to face the palmaris longus muscle 14 of the wrist 10. Therefore, since the signal processing / communication unit 22 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A, damage to the signal processing / communication unit 22 can be prevented.
  • the thicknesses of the first accommodating portion 210, the second accommodating portion 220 and the third accommodating portion 230 are the same. It may be different.
  • the thicknesses of the first connecting portion 81 and the second connecting portion 82 are the same, but may be different.
  • FIG. 5A is a cross-sectional view showing the configuration of the vibration sensor 21.
  • 5 (b) and 5 (c) are cross-sectional views of a case included in the vibration sensor 21.
  • FIG. 6 is a plan view showing the configuration of the vibration sensor 21.
  • the direction perpendicular to the surface of the substrate is the Z direction
  • the two directions orthogonal to each other in the plane perpendicular to the Z direction are the X direction (first direction) and the Y direction (second direction).
  • FIG. 6 is a plan view of the substrate as viewed from the + Z side of FIG. 5 (a).
  • 7 (a) to 7 (d) are diagrams showing an example of the case 40.
  • the vibration sensor 21 has a substrate 30 (second substrate), a piezoelectric element 33, an element 37, a convex member 38, and a case 40.
  • the space surrounded by the substrate 30 and the case 40 becomes the space 50.
  • the substrate 30 is substantially flat and has a front surface 30b as a first surface and a back surface 30a as a second surface opposite the front surface 30b.
  • the substrate 30 may be substantially rectangular or substantially square in XY plan view.
  • Each of both ends 31 of the substrate 30 in the X direction has a length in the Y direction and is arranged at opposite positions with the piezoelectric element 33 or the convex member 38 interposed therebetween, and the substrate 30 is supported by the case 40.
  • the substrate 30 may have a shape other than a rectangle as long as it has both ends 31.
  • the substrate has a shape such as an ellipse, a circle, or a polygon in which both ends are cut and a straight portion that can be supported in the Y direction is provided, the substrate can be applied as the substrate 30. Therefore, the substrate 30 may have a shape other than a substantially square shape or a substantially rectangular shape as long as each of both ends 31 in the X direction of the substrate 30 has a length in the Y direction supported by the band 2.
  • the substrate 30 has a size of, for example, 15 mm (x) ⁇ 15 mm (y) ⁇ 0.8 mm (z).
  • the substrate 30 has a pair of support side sides 30c facing each other and a pair of non-contact side sides 30d intersecting the support side sides 30c. When the substrate 30 is bent in the Z direction, the non-contact side 30d does not come into contact with the case 40. Both ends 31 of the substrate 30 in the X direction are provided on or near the pair of support side sides 30c.
  • the substrate 30 is made of an insulating material, for example, an insulating resin such as glass epoxy.
  • the substrate 30 may be formed of an insulating ceramic (for example, alumina), or the back surface 30a may be formed of a metal plate or an alloy plate whose back surface 30a is insulated with a resin film.
  • a conductive pattern 32 is formed on the resin film.
  • at least the back surface 30a of the substrate 30 is provided with a conductive pattern 32 connected to a pad electrode (not shown).
  • the piezoelectric element 33, and the element 37 (electrical component) constituting the circuit with the piezoelectric element 33, are electrically connected to the pad electrode via solder.
  • the substrate 30 has an elastic modulus of, for example, 10 GPa or more, which is higher than the elastic modulus of the band 2, the convex member 38, and the case 40.
  • the piezoelectric element 33 is arranged near the center of the back surface 30a of the substrate 30, and is fixed to the back surface 30a via a solder (not shown).
  • the piezoelectric element 33 has a size of, for example, 3.2 mm (x) ⁇ 1.6 mm (y) ⁇ 0.8 mm (z).
  • the piezoelectric element 33 is located in the region where the convex member 38 is fixed when viewed from the + Z direction. That is, the piezoelectric element 33 is located in the second region (inside the dotted line region in FIG. 6) of the back surface 30a facing the first region (dotted line region in FIG. 6) of the front surface 30b to which the convex member 38 is fixed. It is fixed.
  • the piezoelectric element 33 has a piezoelectric body 34, a terminal electrode 35, and a terminal electrode 36.
  • the piezoelectric body 34 is formed of, for example, a material containing PZT (lead zirconate titanate) as a main component.
  • the piezoelectric body 34 is provided with polarization terminals (not shown) so as to sandwich the piezoelectric body 34 vertically on the + Z direction side and the ⁇ Z direction side in advance, and a predetermined voltage is applied from the + Z direction and the ⁇ Z direction to perform polarization processing. Is performed, and the polarization direction of the piezoelectric body 34 is set to the Z direction.
  • the polarization terminal required for this polarization processing may be deleted or may be left.
  • the terminal electrode 35 and the terminal electrode 36 are arranged so as to face each other with the piezoelectric body 34 interposed therebetween.
  • the terminal electrode 35 is arranged on the ⁇ X side of the piezoelectric body 34
  • the terminal electrode 36 is arranged on the + X side of the piezoelectric body 34.
  • the substrate 30 bends up and down when viewed macroscopically, and the back surface 30a of the substrate 30 expands or contracts in the horizontal direction when viewed microscopically. doing.
  • the piezoelectric element 33 mounted on the substrate 30 also expands and contracts, so that an electric signal is generated between the terminal electrodes 35 and 36.
  • the polarization directions of the piezoelectric elements 33 are aligned in the vertical direction of the substrate 30.
  • the element 37 is, for example, a semiconductor element such as a FET (Field Effect Transistor) that amplifies the signal generated by the piezoelectric element 33, a passive component for adjusting the amplification factor, or the like, and is provided on the back surface 30a of the substrate 30. It is fixed to the pad electrode with solder or the like.
  • the element 37 is electrically connected to the piezoelectric element 33 via a wiring (not shown).
  • a shield metal (not shown) may be provided on the front surface 30b of the substrate 30. In this case, the shield metal is connected to the GND wiring and electrodes provided on the back surface 30a via vias.
  • the convex member 38 is fixed to the substantially center of the front surface 30b of the substrate 30 with an adhesive or an alloy joint, and protrudes from the front surface 30b of the substrate 30 in the ⁇ Z direction. As shown in FIG. 5A, the convex member 38 is provided at a position facing the piezoelectric element 33.
  • the convex member 38 has a size of, for example, a diameter of 9.5 mm and a height of 7.4 mm.
  • the convex member 38 is made of a resin such as silicon, polycarbonate or ABS, or a metal such as iron or nickel.
  • the convex member 38 When the convex member 38 is made of resin, it is fixed to the substrate 30 with the above-mentioned resin adhesive, and the elastic modulus of the convex member 38 is, for example, 0.1 to 3000 Mpa. When the convex member 38 is made of metal, it is fixed to the substrate 30 with the above-mentioned resin adhesive, brazing material or conductive paste, and the elastic modulus of the convex member 38 is on the order of Gpa.
  • the convex member 38 may have a hollow shape such as an air tube as long as it has the elastic modulus described above.
  • the convex member 38 projects and is exposed from the surface of the band 2, but the substrate 30 and the case 40 of the vibration sensor 21 are embedded inside the band 2.
  • the front surface 30b is entirely covered with a metal film, for example, copper or the like and shielded, it is appropriate to fix the convex member 38 to the front surface 30b with a brazing material or a conductive paste.
  • the metal film functions as a shield member and a fixing member of the convex member.
  • the case 40 is made of a resin such as silicon, polycarbonate or ABS.
  • the elastic modulus of the case 40 is, for example, 50 to 5000 Mpa, which is lower than the elastic modulus of the substrate 30.
  • both ends 31 of the substrate 30 in the X direction are fixed to the step 44 of the case 40 in a double-sided beam shape. That is, both ends 31 of the substrate 30 in the X direction function as fixed ends of vibration of the substrate 30.
  • the band 2 is wound around the wrist and the convex member 38 receives a force due to the vibration of the pulse wave from the wrist, the force is transmitted from the convex member 38 to the substrate 30, and the substrate 30 bends in the + Z direction. Even when the substrate 30 is bent in the + Z direction, the piezoelectric element 33 and the element 37 do not come into contact with the case 40.
  • the convex member 38 can efficiently bend the substrate 30. Further, since the convex member 38 is arranged at a position corresponding to the piezoelectric element 33 on the back surface 30a of the substrate 30, it is possible to efficiently bend the region of the front surface 30b of the substrate 30 near the piezoelectric element 33. can. As a result, the piezoelectric body 34 in the piezoelectric element 33 can be efficiently displaced, and the piezoelectric element 33 can detect the force due to the vibration of the pulse wave with high sensitivity.
  • the case 40 has a plurality of first wall portions 42 having steps 44 supporting both ends 31 in the X direction of the substrate 30, and a plurality of first wall portions.
  • a bottom portion 43 that connects the portions 42 and covers the back surface 30a of the substrate 30 is provided.
  • the bottom portion 43 is formed parallel to the XY plane, and the plurality of first wall portions 42 are provided at both ends of the bottom portion 43 in the X direction and are arranged parallel to the YZ plane.
  • one of the first wall portions 42 is formed with a recess 45 for drawing out the wiring from the substrate 30 to the outside.
  • the signal line 71, the power line 72, and the ground (GND) line 73 extending from the signal processing / communication unit 22 of FIGS. 1 (a), 2 (a), 3 (a), and 4 (a) are recessed 45. It is connected to the wiring pattern 32 on the back surface 30a of the substrate 30 via the above.
  • a conductive film 41 as a conductive material is formed so as to cover the inner wall of the case 40 (the surfaces of the plurality of first wall portions 42 and the bottom portion 43 in contact with the space 50).
  • the conductive film 41 may be formed so as to cover the outer wall of the case 40. Further, the conductive film 41 may be formed inside the case 40 as shown in FIG. 5 (c).
  • the substrate 30 and the plurality of first walls are formed by fixing the substrate 30 made of an insulating material to the conductive film 41 with an insulating adhesive.
  • the space 50 is sealed by the portion 42 and the bottom portion 43 to block electromagnetic waves from the outside.
  • the XZ surface side has no wall and may be opened.
  • the space 50 is filled with a material having an elastic modulus lower than that of the case 40.
  • the elastic modulus of the material filled in the space 50 is higher than the elastic modulus of the case 40, the vibration of the substrate 30 is suppressed. Therefore, the elastic modulus of the material filled in the space 50 is preferably set to 1/5 or less of the elastic modulus of the case 40.
  • the material filled in the space 50 is, for example, a gas such as air or gas, a gel, rubber, or a resin.
  • the elastic modulus of the material filled in the space 50 is, for example, 0 to 10 Mpa.
  • the space 50 in FIG. 5A is filled with, for example, air.
  • the two steps 44 are the two end portions 31 of the substrate 30 in the X direction, that is, the two opposite sides (a pair of support side sides 30c) of the back surface 30a of the substrate 30. ) Are supported respectively.
  • both ends 31 are fixed to the step 44 along the Y direction, the vibration of the substrate 30 in the X and Z directions is not suppressed, and the piezoelectric element 33 detects the vibration of the pulse wave. Can be done.
  • the step 44 included in one first wall portion 42 has a recess 46, and the two steps 44 support the four corners of the substrate 30.
  • the vibration of the substrate 30 in the X, Y, and Z directions is not suppressed, and the piezoelectric element 33 is shown in FIGS. 7 (a) and 7 (a) and 7.
  • the vibration of the pulse wave can be detected more accurately than in the case of (c).
  • the case 40 shown in FIGS. 7 (c) and 7 (d) has a plurality of second wall portions 47 connected to both ends of the plurality of first wall portions 42, erected from the bottom portion 43, and not in contact with the substrate 30. I have.
  • the space 50 is sealed by the substrate 30, the plurality of first wall portions 42, the bottom portion 43, and the plurality of second wall portions 47 to block electromagnetic waves from the outside. Therefore, as compared with the case 40 of FIGS. 7 (a) and 7 (b), electromagnetic waves from the outside can be blocked more.
  • the height of the second wall portion 47 may be lower than the height from the bottom portion 43 to the step 44. In this case, the effect of blocking electromagnetic waves from the outside is reduced, but since the second wall portion 47 acts as a beam, the case 40 itself is bent, that is, the bottom portion 43 is curved and the plurality of first wall portions 42 approach each other. The deflection can be reduced.
  • FIG. 8 is a block diagram showing an example of the configuration of the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23.
  • the positional relationship between the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 is the same as the positional relationship shown in FIGS. 1 (a), 2 (a), 3 (a), and 4 (a). ..
  • the signal line 71, the power line 72, and the ground (GND) line 73 are connected between the vibration sensor 21 and the signal processing / communication unit 22.
  • the power line 72 and the ground (GND) line 73 are connected between the signal processing / communication unit 22 and the power supply unit 23.
  • the vibration sensor 21 includes a piezoelectric element 33 and an amplifier 371 as the element 37.
  • the amplifier 371 is, for example, an instrumentation amplifier or a charge amplifier.
  • the amplifier 371 amplifies the signal (pulse wave signal) generated by the piezoelectric element 33, and outputs the signal (pulse wave signal) to the signal processing / communication unit 22 via the signal line 71.
  • the signal processing / communication unit 22 includes a programmable amplifier 221, an A / D converter 222, a communication module 223, and a microcomputer 224.
  • the communication module 223 includes an antenna 225.
  • the programmable amplifier 221 further amplifies the pulse wave signal received from the amplifier 371.
  • the A / D converter 222 converts the pulse wave signal amplified by the programmable amplifier 221 into a digital signal.
  • the microcomputer 224 converts the digital signal converted by the A / D converter 222 into communicable digital data.
  • the microcomputer 224 also controls the communication timing of the communication module.
  • the microcomputer 224 may remove a noise component from the digital signal converted by the A / D converter 222.
  • the communication module 223 performs wireless communication such as BLE (Bluetooth (registered trademark) Low Energy) or wireless LAN, and transmits digital data indicating a pulse wave signal to an external device (for example, a computer or a smartphone) (not shown). ..
  • BLE Bluetooth (registered trademark) Low Energy
  • wireless LAN wireless local area network
  • the power supply unit 23 includes a battery 231 such as a button battery or a rechargeable lithium-ion battery.
  • the battery 231 supplies electric power to each component included in the signal processing / communication unit 22 and the vibration sensor 21 via the power line 72.
  • FIG. 9A is a cross-sectional view of the first accommodating portion 210 to the third accommodating portion 230 of the band 2.
  • FIG. 9B is a cross-sectional view showing a first modification of the first accommodating portion 210 to the third accommodating portion 230.
  • FIG. 10A is a cross-sectional view showing a second modification of the first accommodating portion 210 to the third accommodating portion 230.
  • FIG. 10B is a cross-sectional view showing a third modification of the first accommodating portion 210 to the third accommodating portion 230.
  • the configurations and features of FIGS. 9A to 10B are also applicable to the first band member 2A and the second band member 2B. In FIGS. 9A to 10B, the upper side of the figure is the wrist 10 side.
  • the power supply unit 23 is arranged between the vibration sensor 21 and the signal processing / communication unit 22, and is a wiring that connects the vibration sensor 21 and the signal processing / communication unit 22. (That is, the signal line 71, the power line 72, and the ground (GND) line 73) are routed around the power supply unit 23.
  • the programmable amplifier 221 and the A / D converter 222, the communication module 223, and the microcomputer 224 are formed on the substrate 226 (first substrate).
  • the antenna 225 is arranged at the end 241 of the board 226, and the wiring (that is, the signal line 71, the power line 72 and the ground (GND) line 73) connecting to the vibration sensor 21 and the power supply 23 is the end of the board 226. It is extended from the terminal 242 on the substrate 226, which is closer to the vibration sensor 21 than the 241.
  • the GND line 73 is extended on the side opposite to the antenna 225 of the signal processing / communication unit 22, and the length of the GND line 73 facing the antenna 225 should secure at least 1/4 wavelength of the communication frequency.
  • the grounded ⁇ / 4 monopole type antenna used as the antenna 225 in the present embodiment is a grounded type antenna in which one side of the half wavelength dipole antenna is replaced by GND. Therefore, by setting the length of the GND line 73 facing the antenna 225 to 1/4 wavelength or more of the communication frequency, deterioration of the characteristics of the antenna 225 can be prevented.
  • the performance of the antenna 225 changes greatly depending on the size and shape of the GND, if the length of the GND line 73 is shorter than 1/4 wavelength of the communication frequency, the radiation efficiency of the antenna 225 will decrease, and the pulse wave detector and smartphone Alternatively, the communicable distance with an external device such as a PC becomes short, and stable communication may not be possible. Further, if the radiation efficiency of the antenna 225 is poor, the transmission output of the communication module 223 can be increased to improve the communication distance, but the power of the power supply unit 23 is consumed by that amount, and the power supply unit 23 is charged immediately. turn into.
  • the GND lines 73 from the vibration sensor 21 to the signal processing / communication unit 22 can be used, including the GND of the substrate 30 of the vibration sensor 21.
  • the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are arranged as described above. That is, by extending the GND line 73 to the opposite side from the signal processing / communication unit 22 in which the antenna 225 is installed, a sufficient length of the GND line 73 can be secured, so that the characteristics of the antenna 225 are improved and the communication performance is improved. Can be improved.
  • the second accommodating portion 220 and the third accommodating portion 230 may be integrated without being separated. That is, a region thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230 (for example, the second connecting portion 82) may not be formed between the second accommodating portion 220 and the third accommodating portion 230.
  • the signal processing / communication unit 22 and the power supply unit 23 have the same thickness. In this case, since both the signal processing / communication unit 22 and the power supply unit 23 are arranged in the area 14A or 15A, damage to both the signal processing / communication unit 22 and the power supply unit 23 can be prevented.
  • the battery 231 in FIG. 9B is smaller than the battery 231 in FIG. 9A.
  • the second accommodating portion 220 may include a first reinforcing member 227 arranged between the wrist 10 and the signal processing / communication unit 22.
  • the first reinforcing member 227 is made of a material harder than the band 2 such as resin or metal or a material having a large elastic modulus.
  • the elastic modulus of the first reinforcing member 227 is, for example, 1000 Mpa or more, which is five times or more the elastic modulus of the band 2.
  • the first reinforcing member 227 is, for example, a mold or a shield case that covers the programmable amplifier 221 and the A / D converter 222, the communication module 223, and the microcomputer 224. In this case, since the strength of the signal processing / communication unit 22 is improved by the first reinforcing member 227, damage to the signal processing / communication unit 22 can be prevented.
  • the third accommodating portion 230 may include a second reinforcing member 232 arranged between the wrist 10 and the power supply portion 23.
  • the second reinforcing member 232 is also made of a material that is harder than the band 2 such as resin or metal or has a high elastic modulus.
  • the elastic modulus of the second reinforcing member 232 is, for example, 1000 Mpa or more, which is five times or more the elastic modulus of the band 2.
  • the second reinforcing member 232 is, for example, a mold, a shield case, or a reinforcing plate that covers the battery 231. In this case, since the strength of the power supply unit 23 is improved by the second reinforcing member 232, damage to the power supply unit 23 can be prevented.
  • the flexibility of the first connecting part 81 and the second connecting part 82 remains. Since it is high, the first connecting portion 81 and the second connecting portion 82 are easily bent when the band 2 is attached to the wrist 10.
  • the integrated second accommodating portion 220 and the third accommodating portion 230 are integrated. May include at least one of a first reinforcing member 227 and a second reinforcing member 232. In this case, it is possible to prevent damage to at least one of the signal processing / communication unit 22 and the power supply unit 23.
  • the band 2 is fixed to the wrist 10 so that the first accommodating portion 210 accommodating the vibration sensor 21 is arranged at a position facing the radial artery 13 of the wrist 10.
  • at least one of the second accommodating unit 220 accommodating the signal processing / communication unit 22 and the third accommodating unit 230 accommodating the power supply unit 23 is a radius 11 and a ulna 12 on the dorsal or ventral side of the wrist 10. It is arranged so as to face the intervening region 14A or 15A. Therefore, the vibration sensor 21 can detect the pulse wave signal of the radial artery 13, and at the same time, it is possible to prevent damage to at least one of the signal processing / communication unit 22 and the power supply unit 23.
  • the vibration sensor 21 is used as the sensor for detecting the pulse wave of the radial artery 13, but an LED (Light Emitting Diode) sensor may be used instead of the vibration sensor 21.
  • an LED Light Emitting Diode

Abstract

A pulse wave detection device (1-1C) is provided with: a vibration sensor (21) for detecting a pulse wave signal from the radial artery of a wrist (10); a communication unit (22) for performing wireless communication of the pulse wave signal with an external device; a power supply unit (23) for supplying electric power to the vibration sensor and the communication unit; and a band (2) which has a first storage unit (210) for storing the vibration sensor, a second storage unit (220) for storing the communication unit, a third storage unit (230) for storing the power supply unit, and connection units (81, 82) for connecting at least two of the first storage unit, the second storage unit, and the third storage unit, and is fixed to the wrist. When the band is fixed to the wrist such that the first storage unit is placed at a position facing the radial artery (13) of the wrist, at least one of the second storage unit and the third storage unit is placed to face a region (14A or 15A) between the radius and the ulna on the dorsal side or the ventral side of the wrist.

Description

脈波検出装置Pulse wave detector
 本発明は、脈波検出装置に関する。 The present invention relates to a pulse wave detection device.
 近年、人体の脈波を検出する圧電素子を有する振動センサ及び該振動センサを指又は手首に巻き付けるバンドに取り付けた脈波検出装置が知られている。この振動センサは、基板と、基板上に配置された圧電素子と、当該圧電素子を囲むように基板上に配置され、人体に直接押し当てられる筒状部材又は導電性スペーサとを備えている(例えば、特許文献1、2参照)。 In recent years, a vibration sensor having a piezoelectric element for detecting a pulse wave of a human body and a pulse wave detecting device having the vibration sensor attached to a band wrapped around a finger or a wrist have been known. This vibration sensor includes a substrate, a piezoelectric element arranged on the substrate, and a tubular member or a conductive spacer arranged on the substrate so as to surround the piezoelectric element and directly pressed against the human body (). For example, see Patent Documents 1 and 2).
国際公開第2013/145352号International Publication No. 2013/145352 国際公開第2017/187710号International Publication No. 2017/187710
 例えば、脈波検出装置を手首に巻き付ける場合、振動センサで検出された脈波信号を外部装置に出力するための部品などが必要になる。このため、バンドには振動センサ以外の部品が設けられる。 For example, when the pulse wave detection device is wrapped around the wrist, a component for outputting the pulse wave signal detected by the vibration sensor to an external device is required. Therefore, the band is provided with parts other than the vibration sensor.
 しかし、振動センサ以外の部品が手首の湾曲の大きい領域に接触すると、手首の湾曲が大きい領域から当該部品に外力がかかり、当該部品が破損するおそれがある。 However, if a part other than the vibration sensor comes into contact with a region with a large wrist curvature, an external force is applied to the part from the region with a large wrist curvature, and the part may be damaged.
 本発明は上記課題に鑑みなされたものであり、手首の脈波を正確に検知することができ、且つ通信部又は電源部などの部品の破損を回避することができる脈波検出装置を提供することを目的とする。 The present invention has been made in view of the above problems, and provides a pulse wave detection device capable of accurately detecting a pulse wave of a wrist and avoiding damage to parts such as a communication unit or a power supply unit. The purpose is.
 本発明は、手首の橈骨動脈から脈波信号を検出するセンサと、前記脈波信号を無線で外部装置に通信する通信部と、前記センサ及び前記通信部に電力を供給する電源部と、前記センサを収容する第1収容部、前記通信部を収容する第2収容部、前記電源部を収容する第3収容部、並びに前記第1収容部、前記第2収容部及び前記第3収容部の少なくとも2つを繋ぐ連結部を有し、前記手首に固定するバンドと、を備え、前記第1収容部が前記手首の橈骨動脈に対向する位置に配置されるように前記バンドが前記手首に固定された場合に、前記第2収容部及び前記第3収容部の少なくとも一方が前記手首の背側又は腹側の橈骨と尺骨との間の領域に対向するように配置される脈波検出装置である。 The present invention includes a sensor that detects a pulse wave signal from the radial artery of the wrist, a communication unit that wirelessly communicates the pulse wave signal to an external device, a power supply unit that supplies power to the sensor and the communication unit, and the above. A first accommodating unit accommodating a sensor, a second accommodating unit accommodating the communication unit, a third accommodating unit accommodating the power supply unit, and the first accommodating unit, the second accommodating unit, and the third accommodating unit. A band having at least two connecting portions and fixing to the wrist is provided, and the band is fixed to the wrist so that the first accommodating portion is arranged at a position facing the radial artery of the wrist. In the pulse wave detection device, at least one of the second accommodating portion and the third accommodating portion is arranged so as to face the region between the radius and the ulnar bone on the dorsal or ventral side of the wrist. be.
 上記構成において、前記電源部は、前記センサと前記通信部との間に配置される構成とすることができる。 In the above configuration, the power supply unit may be arranged between the sensor and the communication unit.
 上記構成において、前記第2収容部は、前記手首と前記通信部との間に配置され、前記バンドよりも弾性率が大きい第1補強部材を備える構成とすることができる。 In the above configuration, the second accommodating portion may be arranged between the wrist and the communication portion and may include a first reinforcing member having a elastic modulus larger than that of the band.
 上記構成において、前記第3収容部は、前記手首と前記電源部との間に配置され、前記バンドよりも弾性率が大きい第2補強部材を備える構成とすることができる。 In the above configuration, the third accommodating portion may be arranged between the wrist and the power supply portion, and may include a second reinforcing member having a elastic modulus larger than that of the band.
 上記構成において、前記連結部は、前記第1収容部と前記第2収容部及び前記第3収容部との間に形成され、前記第1収容部、前記第2収容部及び前記第3収容部の厚みよりも薄い第1連結部と、前記第2収容部と前記第3収容部との間に形成され、前記第2収容部及び前記第3収容部の厚みよりも薄い第2連結部とを備える構成とすることができる。 In the above configuration, the connecting portion is formed between the first accommodating portion, the second accommodating portion, and the third accommodating portion, and the first accommodating portion, the second accommodating portion, and the third accommodating portion. A first connecting portion thinner than the thickness of the second accommodating portion and a second connecting portion formed between the second accommodating portion and the third accommodating portion and thinner than the thickness of the second accommodating portion and the third accommodating portion. Can be configured to include.
 上記構成において、前記連結部は、前記第1収容部と前記第2収容部及び前記第3収容部との間に形成され、前記第1収容部、前記第2収容部及び前記第3収容部の厚みよりも薄い第1連結部を備え、前記第2収容部及び前記第3収容部が分離されずに一体化されている構成とすることができる。 In the above configuration, the connecting portion is formed between the first accommodating portion, the second accommodating portion, and the third accommodating portion, and the first accommodating portion, the second accommodating portion, and the third accommodating portion. The first connecting portion, which is thinner than the thickness of the above, may be provided, and the second accommodating portion and the third accommodating portion may be integrated without being separated.
 上記構成において、前記バンドは、帯状のバンドであり、第1係止部と、前記第1係止部を係止する第2係止部とを備え、前記センサは、前記通信部及び前記電源部よりも前記第2係止部に近い位置に配置されている構成とすることができる。 In the above configuration, the band is a band-shaped band, includes a first locking portion and a second locking portion that locks the first locking portion, and the sensor is the communication unit and the power supply. It can be configured to be arranged at a position closer to the second locking portion than the portion.
 上記構成において、前記バンドは、時計への第1取付部と第1係止部とを有する第1バンド部材と、前記時計への第2取付部と前記第1係止部を係止する第2係止部とを有する第2バンド部材とを備え、前記センサ、前記電源部及び前記通信部は前記第1バンド部材に配置され、前記センサは、前記通信部及び前記電源部よりも前記第1係止部に近い位置に配置されている構成とすることができる。 In the above configuration, the band locks a first band member having a first attachment portion and a first locking portion to the watch, and a second attachment portion to the watch and the first locking portion. A second band member having two locking portions is provided, and the sensor, the power supply unit, and the communication unit are arranged in the first band member, and the sensor is more than the communication unit and the power supply unit. 1 It can be configured to be arranged at a position close to the locking portion.
 上記構成において、前記バンドは、時計への第1取付部と前記第1係止部とを有する第1バンド部材と、前記時計への第2取付部と前記第1係止部を係止する第2係止部とを有する第2バンド部材とを備え、前記センサ、前記電源部及び前記通信部は前記第2バンド部材に配置され、前記センサは、前記通信部及び前記電源部よりも前記第2取付部に近い位置に配置されている構成とすることができる。 In the above configuration, the band locks the first band member having the first attachment portion to the watch and the first locking portion, and the second attachment portion to the watch and the first locking portion. A second band member having a second locking portion is provided, and the sensor, the power supply unit, and the communication unit are arranged in the second band member, and the sensor is more than the communication unit and the power supply unit. It can be configured to be arranged at a position close to the second mounting portion.
 上記構成において、前記センサは、第1面と当該第1面の反対側にある第2面とを有する第2基板と、前記第2基板の略中央で、前記第1面に固定された凸状部材と、前記凸状部材が固定された前記第1面上の第1領域に対向する前記第2面の第2領域内に固定された圧電素子と、前記圧電素子が固定された前記第2面を覆い、空間を介して前記圧電素子に対向し、前記第2基板の前記第2面の対向する2辺を支持するケースと、を備え、前記空間には、前記ケースの弾性率よりも低い弾性率を有する素材が充填されている構成とすることができる。 In the above configuration, the sensor has a second substrate having a first surface and a second surface on the opposite side of the first surface, and a protrusion fixed to the first surface at substantially the center of the second substrate. The shape member, the piezoelectric element fixed in the second region of the second surface facing the first region on the first surface to which the convex member is fixed, and the first one to which the piezoelectric element is fixed. A case is provided which covers two surfaces, faces the piezoelectric element through a space, and supports two opposing sides of the second surface of the second substrate, and the space is provided with a case based on the elastic modulus of the case. It can also be configured to be filled with a material having a low elastic modulus.
 上記構成において、前記センサは、前記第2基板の第2面の対向する2辺に設けられた絶縁部と、前記ケースの内壁、内部又は外壁のいずれか1つに形成され、前記絶縁部と電気的に接続する導電材とを備える構成とすることができる。 In the above configuration, the sensor is formed on one of an insulating portion provided on two opposing sides of the second surface of the second substrate and an inner wall, an inner wall, or an outer wall of the case, and the insulating portion and the insulating portion. It can be configured to include a conductive material that is electrically connected.
 上記構成において、前記バンドは、ゴム、ウレタン又はシリコンのいずれかで形成されている構成とすることができる。 In the above configuration, the band may be formed of either rubber, urethane or silicon.
 本発明によれば、手首の脈波を正確に検知することができ、且つ通信部又は電源部などの部品の破損を回避することができる。 According to the present invention, the pulse wave of the wrist can be accurately detected, and damage to parts such as the communication unit or the power supply unit can be avoided.
図1(a)は、本実施の形態に係る脈波検出装置の構成を示す図である。図1(b)は、図1(a)の脈波検出装置が手首に巻かれた状態を示す図である。FIG. 1A is a diagram showing a configuration of a pulse wave detection device according to the present embodiment. FIG. 1B is a diagram showing a state in which the pulse wave detection device of FIG. 1A is wrapped around the wrist. 図2(a)は、脈波検出装置の第1変形例の構成を示す図である。図2(b)は、図2(a)の脈波検出装置が手首に巻かれた状態を示す図である。FIG. 2A is a diagram showing a configuration of a first modification of the pulse wave detection device. FIG. 2B is a diagram showing a state in which the pulse wave detection device of FIG. 2A is wrapped around the wrist. 図3(a)は、脈波検出装置の第2変形例の構成を示す図である。図3(b)は、図3(a)の脈波検出装置が手首に巻かれた状態を示す図である。FIG. 3A is a diagram showing a configuration of a second modification of the pulse wave detection device. FIG. 3B is a diagram showing a state in which the pulse wave detection device of FIG. 3A is wrapped around the wrist. 図4(a)は、脈波検出装置の第3変形例の構成を示す図である。図4(b)は、図4(a)の脈波検出装置が手首に巻かれた状態を示す図である。FIG. 4A is a diagram showing a configuration of a third modification of the pulse wave detection device. FIG. 4B is a diagram showing a state in which the pulse wave detection device of FIG. 4A is wrapped around the wrist. 図5(a)は、振動センサの構成を示す断面図である。図5(b),(c)は振動センサが備えるケースの断面図である。FIG. 5A is a cross-sectional view showing the configuration of the vibration sensor. 5 (b) and 5 (c) are cross-sectional views of a case included in the vibration sensor. 図6は、振動センサの構成を示す平面図である。FIG. 6 is a plan view showing the configuration of the vibration sensor. 図7(a)~(d)はケースの例を示す図である。7 (a) to 7 (d) are diagrams showing an example of a case. 図8は、振動センサ、信号処理・通信部及び電源部の構成を示すブロック図である。FIG. 8 is a block diagram showing the configurations of the vibration sensor, the signal processing / communication unit, and the power supply unit. 図9(a)は、バンドの第1収容部~第3収容部の断面図である。図9(b)は、第1収容部~第3収容部の第1変形例を示す断面図である。FIG. 9A is a cross-sectional view of the first accommodating portion to the third accommodating portion of the band. FIG. 9B is a cross-sectional view showing a first modification of the first accommodating portion to the third accommodating portion. 図10(a)は、第1収容部~第3収容部の第2変形例を示す断面図である。図10(b)は、第1収容部~第3収容部の第3変形例を示す断面図である。FIG. 10A is a cross-sectional view showing a second modification of the first accommodating portion to the third accommodating portion. FIG. 10B is a cross-sectional view showing a third modified example of the first accommodating portion to the third accommodating portion.
 以下、図面を参照し本発明の実施の形態について説明する。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
 図1(a)は、本実施の形態に係る脈波検出装置の構成を示す図である。図1(b)は、図1(a)の脈波検出装置が手首に巻かれた状態を示す図である。図2(a)は、脈波検出装置の第1変形例の構成を示す図である。図2(b)は、図2(a)の脈波検出装置が手首に巻かれた状態を示す図である。図3(a)は、脈波検出装置の第2変形例の構成を示す図である。図3(b)は、図3(a)の脈波検出装置が手首に巻かれた状態を示す図である。図4(a)は、脈波検出装置の第3変形例の構成を示す図である。図4(b)は、図4(a)の脈波検出装置が手首に巻かれた状態を示す図である。 FIG. 1A is a diagram showing a configuration of a pulse wave detection device according to the present embodiment. FIG. 1B is a diagram showing a state in which the pulse wave detection device of FIG. 1A is wrapped around the wrist. FIG. 2A is a diagram showing a configuration of a first modification of the pulse wave detection device. FIG. 2B is a diagram showing a state in which the pulse wave detection device of FIG. 2A is wrapped around the wrist. FIG. 3A is a diagram showing a configuration of a second modification of the pulse wave detection device. FIG. 3B is a diagram showing a state in which the pulse wave detection device of FIG. 3A is wrapped around the wrist. FIG. 4A is a diagram showing a configuration of a third modification of the pulse wave detection device. FIG. 4B is a diagram showing a state in which the pulse wave detection device of FIG. 4A is wrapped around the wrist.
 図1(a)に示すように、本実施の形態に係る脈波検出装置1は、例えば、一本のテープ状に形成されたバンドであり、手首に巻き付けることができる。脈波検出装置1は、バンド2と、バンド2の一端に形成されたピンバックル(第1係止部)3と、バンド2の他端に形成され、ピンバックル3のピンが挿入可能な複数の貫通孔(第2係止部)4とを備えている。バンド2は、ゴム、もしくはシリコン又はウレタンなどの樹脂で形成されており、バンド2の弾性率は、例えば0.1~3000Mpaである。バンド2は、フレキシブルな素材で構成されるため、手首にフィットしやすい。 As shown in FIG. 1A, the pulse wave detection device 1 according to the present embodiment is, for example, a single tape-shaped band that can be wrapped around the wrist. The pulse wave detection device 1 includes a band 2, a pin buckle (first locking portion) 3 formed at one end of the band 2, and a plurality of pin buckles 3 formed at the other end of the band 2 into which a pin of the pin buckle 3 can be inserted. It is provided with a through hole (second locking portion) 4 of the above. The band 2 is made of rubber or a resin such as silicon or urethane, and the elastic modulus of the band 2 is, for example, 0.1 to 3000 Mpa. Since the band 2 is made of a flexible material, it easily fits on the wrist.
 本実施の形態では、ピンバックル3および貫通孔4は、係止部として機能している。なお、バンド2はバンド2の一端を他端と係止する部材を持てば良いので、マジックテープ(登録商標)又は、ピンバックル3および貫通孔4以外の時計バンドに使われる他の係止部が採用できる。また、バンド2は、係止部を有さない輪ゴムのようにリング状で、かつ幅を持ってなるバンドでも良い。 In the present embodiment, the pin buckle 3 and the through hole 4 function as locking portions. Since the band 2 only needs to have a member that locks one end of the band 2 with the other end, it is a magic tape (registered trademark) or another locking portion used for a watch band other than the pin buckle 3 and the through hole 4. Can be adopted. Further, the band 2 may be a band having a ring shape and a width like a rubber band having no locking portion.
 バンド2は、橈骨動脈から脈波信号を検出する振動センサ21と、脈波信号に対し信号処理を施し、外部装置に信号処理された脈波信号を送信する信号処理・通信部22と、振動センサ21及び信号処理・通信部22に電力を供給する電源部23とを備えている。振動センサ21と信号処理・通信部22との間を直接、信号線71、電力線72及びグランド(GND)線73が接続している。また、信号処理・通信部22と電源部23との間を直接、電力線72及びグランド(GND)線73が接続している。 The band 2 includes a vibration sensor 21 that detects a pulse wave signal from the radial artery, a signal processing / communication unit 22 that performs signal processing on the pulse wave signal and transmits the signal-processed pulse wave signal to an external device, and vibration. It includes a sensor 21 and a power supply unit 23 that supplies power to the signal processing / communication unit 22. The signal line 71, the power line 72, and the ground (GND) line 73 are directly connected between the vibration sensor 21 and the signal processing / communication unit 22. Further, the power line 72 and the ground (GND) line 73 are directly connected between the signal processing / communication unit 22 and the power supply unit 23.
 よって、振動センサ21、信号処理・通信部22、電源部23をそれぞれプリント基板に実装したとき、それぞれのプリント基板は硬いが、振動センサ21、信号処理・通信部22及び電源部23のうちの2つを連結する少なくとも1つの連結部を有することで、バンド2はフレキシブル性を有する。よって、脈波検出装置1の手首へのフィット性が向上する。しかも、この連結部がフレキシブル性を有するため、基板の平坦性を維持しつつ屈曲性が上がり、プリント基板を有するモジュールの信頼性も維持できる。この詳細は後述する。 Therefore, when the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are mounted on the printed circuit boards, the printed circuit boards are hard, but the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are among the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23. Band 2 is flexible by having at least one connecting portion that connects the two. Therefore, the fit of the pulse wave detection device 1 to the wrist is improved. Moreover, since the connecting portion has flexibility, the flexibility is increased while maintaining the flatness of the substrate, and the reliability of the module having the printed circuit board can be maintained. The details will be described later.
 バンド2の全長L1は、例えば、150~250mmである。ピンバックル3の端部から信号処理・通信部22の中心までの長さL2は、例えば、10~110mmである。信号処理・通信部22の中心から電源部23の中心までの長さL3は、例えば、20~100mmである。電源部23の中心から振動センサ21の中心までの長さL4は、例えば、30~80mmである。 The total length L1 of the band 2 is, for example, 150 to 250 mm. The length L2 from the end of the pin buckle 3 to the center of the signal processing / communication unit 22 is, for example, 10 to 110 mm. The length L3 from the center of the signal processing / communication unit 22 to the center of the power supply unit 23 is, for example, 20 to 100 mm. The length L4 from the center of the power supply unit 23 to the center of the vibration sensor 21 is, for example, 30 to 80 mm.
 バンド2は、振動センサ21を収容する第1収容部210、信号処理・通信部22を収容する第2収容部220、及び電源部23を収容する第3収容部230を備えている。またさらにバンド2は、第1連結部81と第2連結部82とを備えている。以下に、第1~第3収容部および第1~第2連結部の位置や厚み等を説明する。 The band 2 includes a first accommodating unit 210 accommodating the vibration sensor 21, a second accommodating unit 220 accommodating the signal processing / communication unit 22, and a third accommodating unit 230 accommodating the power supply unit 23. Further, the band 2 includes a first connecting portion 81 and a second connecting portion 82. The positions and thicknesses of the first to third accommodating portions and the first to second connecting portions will be described below.
 第1連結部81は、第1収容部210と第2収容部220及び第3収容部230との間に形成され、第1収容部210、第2収容部220及び第3収容部230の厚みよりも薄い。第2連結部82は、第2収容部220と第3収容部230との間に形成され、第2収容部220及び第3収容部230の厚みよりも薄い。第1収容部210~第3収容部230の厚みは、例えば、1~15mmであり、第1連結部81及び第2連結部82の厚みは、例えば、0.5~5mmである。信号線71、電力線72及びグランド(GND)線73は第1連結部81及び第2連結部82内を通過する。振動センサ21の凸状部材38はバンド2の表面から突出し且つ露出されているが、振動センサ21の他の部品、信号処理・通信部22及び電源部23はバンド2の内部に埋め込まれている。第1連結部81及び第2連結部82は第1収容部210、第2収容部220及び第3収容部230の厚みよりも薄くフレキシブルな素材で構成されている為、バンド2が手首10に装着されたときに第1連結部81及び第2連結部82は曲げやすい。 The first connecting portion 81 is formed between the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230, and the thickness of the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230. Thinner than. The second connecting portion 82 is formed between the second accommodating portion 220 and the third accommodating portion 230, and is thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230. The thickness of the first accommodating portion 210 to the third accommodating portion 230 is, for example, 1 to 15 mm, and the thickness of the first connecting portion 81 and the second accommodating portion 82 is, for example, 0.5 to 5 mm. The signal line 71, the power line 72, and the ground (GND) line 73 pass through the first connecting portion 81 and the second connecting portion 82. The convex member 38 of the vibration sensor 21 protrudes and is exposed from the surface of the band 2, but the other parts of the vibration sensor 21, the signal processing / communication unit 22 and the power supply unit 23 are embedded inside the band 2. .. Since the first connecting portion 81 and the second connecting portion 82 are made of a material thinner and more flexible than the thickness of the first accommodating portion 210, the second accommodating portion 220 and the third accommodating portion 230, the band 2 is attached to the wrist 10. When mounted, the first connecting portion 81 and the second connecting portion 82 are easily bent.
 振動センサ21、信号処理・通信部22及び電源部23は、ピンバックル3から貫通孔4に向かう方向に沿って、信号処理・通信部22、電源部23、振動センサ21の順にバンド2に配置されている。振動センサ21は、信号処理・通信部22及び電源部23よりも貫通孔4に近いバンド2上の位置に配置されている。 The vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are arranged in the band 2 in the order of the signal processing / communication unit 22, the power supply unit 23, and the vibration sensor 21 along the direction from the pin buckle 3 to the through hole 4. Has been done. The vibration sensor 21 is arranged at a position on the band 2 closer to the through hole 4 than the signal processing / communication unit 22 and the power supply unit 23.
 図1(b)は、図1(a)のバンド2を左の手首10に巻いた状態の断面図である。図1(b)では、指先側から見た状態が示されている。手首10は、橈骨11、尺骨12、橈骨動脈13、長掌筋14、及び総指伸筋15を備えている。図1(b)の上側が手の甲側又は手首の背側であり、図1(b)の下側が手のひら側又は手首の腹側である。 FIG. 1B is a cross-sectional view of the band 2 of FIG. 1A wound around the left wrist 10. FIG. 1B shows a state viewed from the fingertip side. The wrist 10 includes a radius 11, an ulna 12, a radial artery 13, a palmaris longus muscle 14, and an extensor digitorum muscle 15. The upper side of FIG. 1 (b) is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 1 (b) is the palm side or the ventral side of the wrist.
 図1(b)に示すように、第1収容部210及び振動センサ21が手首10の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に巻かれると、第3収容部230及び電源部23が手首10の総指伸筋15に対向するように配置される。このように、電源部23が手首の背側の湾曲が相対的に少ない領域、すなわち総指伸筋15に対向する領域15Aに配置されるので、電源部23の破損を防ぐことができる。なお、以下の説明において、総指伸筋15に対向する領域15Aは手首の背側の橈骨11と尺骨12の間の領域に対応し、長掌筋14に対向する領域14Aは手首の腹側の橈骨11と尺骨12の間の領域に対応する。 As shown in FIG. 1 (b), when the band 2 is wound around the wrist 10 so that the first accommodating portion 210 and the vibration sensor 21 are arranged at positions facing the radial artery 13 of the wrist 10, the third accommodating portion is formed. The 230 and the power supply unit 23 are arranged so as to face the extensor digitorum muscle 15 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the dorsal side of the wrist is relatively less curved, that is, the region 15A facing the extensor digitorum muscle 15, damage to the power supply unit 23 can be prevented. In the following description, the region 15A facing the extensor digitorum muscle 15 corresponds to the region between the radius 11 and the ulna 12 on the dorsal side of the wrist, and the region 14A facing the palmaris longus 14 is the ventral side of the wrist. Corresponds to the area between the radius 11 and the ulna 12.
 図2(a)の脈波検出装置1Aは、振動センサ21、信号処理・通信部22及び電源部23の位置が図1(a)の脈波検出装置1と異なる。脈波検出装置1Aのその他の構成は、脈波検出装置1の対応する構成と同一である。 The pulse wave detection device 1A of FIG. 2A is different from the pulse wave detection device 1 of FIG. 1A in the positions of the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23. Other configurations of the pulse wave detection device 1A are the same as the corresponding configurations of the pulse wave detection device 1.
 ピンバックル3の端部から信号処理・通信部22の中心までの長さL6は、例えば、40~120mmである。信号処理・通信部22の中心から電源部23の中心までの長さL7は、例えば、10~50mmである。電源部23の中心から振動センサ21の中心までの長さL8は、例えば、10~50mmである。 The length L6 from the end of the pin buckle 3 to the center of the signal processing / communication unit 22 is, for example, 40 to 120 mm. The length L7 from the center of the signal processing / communication unit 22 to the center of the power supply unit 23 is, for example, 10 to 50 mm. The length L8 from the center of the power supply unit 23 to the center of the vibration sensor 21 is, for example, 10 to 50 mm.
 図2(b)は、図2(a)のバンド2を左の手首10に巻いた状態の断面図である。図2(b)では、指先側から見た状態が示されている。図2(b)の上側が手の甲側又は手首の背側であり、図2(b)の下側が手のひら側又は手首の腹側である。 FIG. 2B is a cross-sectional view of the band 2 of FIG. 2A wound around the left wrist 10. FIG. 2B shows a state viewed from the fingertip side. The upper side of FIG. 2B is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 2B is the palm side or the ventral side of the wrist.
 図2(b)に示すように、第1収容部210及び振動センサ21が被測定者の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に巻かれると、第3収容部230及び電源部23が手首10の長掌筋14に対向するように配置される。このように、電源部23が手首の腹側の湾曲が相対的に少ない領域、すなわち長掌筋14に対向する領域14Aに配置されるので、電源部23の破損を防ぐことができる。 As shown in FIG. 2B, when the band 2 is wound around the wrist 10 so that the first accommodating portion 210 and the vibration sensor 21 are arranged at positions facing the radial artery 13 of the subject, the third accommodating portion 210 and the vibration sensor 21 are arranged. The portion 230 and the power supply portion 23 are arranged so as to face the palmaris longus muscle 14 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A facing the palmaris longus muscle 14, damage to the power supply unit 23 can be prevented.
 尚、図1(a)及び図2(a)において、第3収容部230及び電源部23の位置を第2収容部220及び信号処理・通信部22の位置と交換してもよい。この場合、第1収容部210及び振動センサ21が被測定者の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に巻かれると、第2収容部220及び信号処理・通信部22が手首10の長掌筋14又は総指伸筋15のいずれか一方に対向するように配置される。従って、信号処理・通信部22が領域14A又は15Aに配置されるので、信号処理・通信部22の破損を防ぐことができる。 Note that, in FIGS. 1 (a) and 2 (a), the positions of the third accommodating unit 230 and the power supply unit 23 may be exchanged with the positions of the second accommodating unit 220 and the signal processing / communication unit 22. In this case, when the band 2 is wound around the wrist 10 so that the first accommodating portion 210 and the vibration sensor 21 are arranged at positions facing the radial artery 13 of the subject, the second accommodating portion 220 and signal processing / communication are performed. The portion 22 is arranged so as to face either the palmaris longus muscle 14 or the extensor digitorum muscle 15 of the wrist 10. Therefore, since the signal processing / communication unit 22 is arranged in the area 14A or 15A, damage to the signal processing / communication unit 22 can be prevented.
 図3(a)の脈波検出装置1B及び図4(a)の脈波検出装置1Cでは、バンド2が時計バンドであり、バンド2の中間には時計5が設けられている。なお、図3(a)及び図4(a)では、時計5の裏面側(つまり文字盤の裏側)が示されている。バンド2は、ピンバックル3及び時計5への第1取付部6を有する第1バンド部材2Aと、ピンバックル3を係止する貫通孔4及び時計5への第2取付部7を有する第2バンド部材2Bとを備えている。第1バンド部材2A及び第2バンド部材2Bは、ゴム、もしくはウレタン又はシリコンなどの樹脂で形成されており、バンド2の弾性率は、例えば0.1~3000Mpaである。 In the pulse wave detection device 1B of FIG. 3A and the pulse wave detection device 1C of FIG. 4A, band 2 is a watch band, and a watch 5 is provided in the middle of the band 2. Note that, in FIGS. 3A and 4A, the back side of the watch 5 (that is, the back side of the dial) is shown. The band 2 has a first band member 2A having a pin buckle 3 and a first attachment portion 6 to the watch 5, a second band member 2A having a through hole 4 for locking the pin buckle 3 and a second attachment portion 7 to the watch 5. It includes a band member 2B. The first band member 2A and the second band member 2B are made of rubber or a resin such as urethane or silicon, and the elastic modulus of the band 2 is, for example, 0.1 to 3000 Mpa.
 図3(a)では、第1バンド部材2Aが振動センサ21と、信号処理・通信部22と、電源部23とを備えている。また、第1バンド部材2Aが振動センサ21を収容する第1収容部210、信号処理・通信部22を収容する第2収容部220、及び電源部23を収容する第3収容部230を備えている。またさらに、第1バンド部材2Aは、第1連結部81と第2連結部82とを備えている。以下に、第1~第3収容部および第1~第2連結部の位置や厚み等を説明する。 In FIG. 3A, the first band member 2A includes a vibration sensor 21, a signal processing / communication unit 22, and a power supply unit 23. Further, the first band member 2A includes a first accommodating unit 210 accommodating the vibration sensor 21, a second accommodating unit 220 accommodating the signal processing / communication unit 22, and a third accommodating unit 230 accommodating the power supply unit 23. There is. Furthermore, the first band member 2A includes a first connecting portion 81 and a second connecting portion 82. The positions and thicknesses of the first to third accommodating portions and the first to second connecting portions will be described below.
 第1連結部81は、第1収容部210と第2収容部220及び第3収容部230との間に形成され、第1収容部210、第2収容部220及び第3収容部230の厚みよりも薄い。第2連結部82は、第2収容部220と第3収容部230との間に形成され、第2収容部220及び第3収容部230の厚みよりも薄い。第1収容部210~第3収容部230の厚みは、例えば、1~15mmであり、第1連結部81及び第2連結部82の厚みは、例えば、0.5~5mmである。振動センサ21と信号処理・通信部22との間には、信号線71、電力線72及びグランド(GND)線73が接続されている。信号処理・通信部22と電源部23との間には、電力線72及びグランド(GND)線73が接続されている。従って、信号線71、電力線72及びグランド(GND)線73は第1連結部81及び第2連結部82内を通過する。振動センサ21の凸状部材38はバンド2の表面から突出し且つ露出されているが、振動センサ21の他の部品、信号処理・通信部22及び電源部23は第1バンド部材2Aの内部に埋め込まれている。 The first connecting portion 81 is formed between the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230, and the thickness of the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230. Thinner than. The second connecting portion 82 is formed between the second accommodating portion 220 and the third accommodating portion 230, and is thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230. The thickness of the first accommodating portion 210 to the third accommodating portion 230 is, for example, 1 to 15 mm, and the thickness of the first connecting portion 81 and the second accommodating portion 82 is, for example, 0.5 to 5 mm. A signal line 71, a power line 72, and a ground (GND) line 73 are connected between the vibration sensor 21 and the signal processing / communication unit 22. A power line 72 and a ground (GND) line 73 are connected between the signal processing / communication unit 22 and the power supply unit 23. Therefore, the signal line 71, the power line 72, and the ground (GND) line 73 pass through the first connecting portion 81 and the second connecting portion 82. The convex member 38 of the vibration sensor 21 protrudes and is exposed from the surface of the band 2, but the other parts of the vibration sensor 21, the signal processing / communication unit 22 and the power supply unit 23 are embedded inside the first band member 2A. It has been.
 図3(a)では、第1バンド部材2Aが第2バンド部材2Bよりも長い。第1バンド部材2Aの全長L10は、例えば、80~160mmである。第2バンド部材2Bの全長L11は、例えば、40~90mmである。ピンバックル3の端部から振動センサ21の中心までの長さL12は、例えば、10~50mmである。振動センサ21の中心から電源部23の中心までの長さL13は、例えば、10~50mmである。電源部23の中心から信号処理・通信部22の中心までの長さL14は、例えば、10~50mmである。 In FIG. 3A, the first band member 2A is longer than the second band member 2B. The total length L10 of the first band member 2A is, for example, 80 to 160 mm. The total length L11 of the second band member 2B is, for example, 40 to 90 mm. The length L12 from the end of the pin buckle 3 to the center of the vibration sensor 21 is, for example, 10 to 50 mm. The length L13 from the center of the vibration sensor 21 to the center of the power supply unit 23 is, for example, 10 to 50 mm. The length L14 from the center of the power supply unit 23 to the center of the signal processing / communication unit 22 is, for example, 10 to 50 mm.
 振動センサ21、信号処理・通信部22及び電源部23は、ピンバックル3から第1取付部6に向かう方向に沿って、振動センサ21、電源部23、信号処理・通信部22の順に第1バンド部材2Aに配置されている。振動センサ21は、電源部23及び信号処理・通信部22よりもピンバックル3に近い位置に配置されている。 The vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are first arranged in the order of the vibration sensor 21, the power supply unit 23, and the signal processing / communication unit 22 along the direction from the pin buckle 3 to the first mounting unit 6. It is arranged on the band member 2A. The vibration sensor 21 is arranged at a position closer to the pin buckle 3 than the power supply unit 23 and the signal processing / communication unit 22.
 図3(b)は、図3(a)のバンド2を左の手首10に巻いた状態の断面図である。図3(b)では、指先側から見た状態が示されている。図3(b)の上側が手の甲側又は手首の背側であり、図3(b)の下側が手のひら側又は手首の腹側である。 FIG. 3B is a cross-sectional view of the band 2 of FIG. 3A wound around the left wrist 10. FIG. 3B shows a state viewed from the fingertip side. The upper side of FIG. 3B is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 3B is the palm side or the ventral side of the wrist.
 図3(b)に示すように、第1収容部210及び振動センサ21が手首10の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に巻かれると、第3収容部230及び電源部23が手首10の長掌筋14に対向するように配置される。このように、電源部23が手首の腹側の湾曲が相対的に少ない領域、すなわち領域14Aに配置されるので、電源部23の反りを抑止でき、電源部23の破損を防ぐことができる。特に電源部23が破損して過大電流が流れる可能性がある場合に有効である。 As shown in FIG. 3B, when the band 2 is wound around the wrist 10 so that the first accommodating portion 210 and the vibration sensor 21 are arranged at positions facing the radial artery 13 of the wrist 10, the third accommodating portion is formed. The 230 and the power supply unit 23 are arranged so as to face the palmaris longus muscle 14 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A, the warpage of the power supply unit 23 can be suppressed and the power supply unit 23 can be prevented from being damaged. This is particularly effective when the power supply unit 23 is damaged and an excessive current may flow.
 図4(a)では、第2バンド部材2Bが振動センサ21と、信号処理・通信部22と、電源部23とを備えている。また、第2バンド部材2Bが振動センサ21を収容する第1収容部210、信号処理・通信部22を収容する第2収容部220、及び電源部23を収容する第3収容部230を備えている。またさらに第2バンド部材2Bは、第1連結部81と第2連結部82とを備えている。以下に、第1~第3収容部および第1~第2連結部の位置や厚み等を説明する。 In FIG. 4A, the second band member 2B includes a vibration sensor 21, a signal processing / communication unit 22, and a power supply unit 23. Further, the second band member 2B includes a first accommodating unit 210 accommodating the vibration sensor 21, a second accommodating unit 220 accommodating the signal processing / communication unit 22, and a third accommodating unit 230 accommodating the power supply unit 23. There is. Further, the second band member 2B includes a first connecting portion 81 and a second connecting portion 82. The positions and thicknesses of the first to third accommodating portions and the first to second connecting portions will be described below.
 第1連結部81は、第1収容部210と第2収容部220及び第3収容部230との間に形成され、第1収容部210、第2収容部220及び第3収容部230の厚みよりも薄い。第2連結部82は、第2収容部220と第3収容部230との間に形成され、第2収容部220及び第3収容部230の厚みよりも薄い。第1収容部210~第3収容部230の厚みは、例えば、1~15mmであり、第1連結部81及び第2連結部82の厚みは、例えば、0.5~5mmである。振動センサ21と信号処理・通信部22との間には、信号線71、電力線72及びグランド(GND)線73が接続されている。信号処理・通信部22と電源部23との間には、電力線72及びグランド(GND)線73が接続されている。従って、信号線71、電力線72及びグランド(GND)線73は第1連結部81及び第2連結部82内を通過する。振動センサ21の凸状部材38はバンド2の表面から突出し且つ露出されているが、振動センサ21の他の部品、信号処理・通信部22及び電源部23は第2バンド部材2Bの内部に埋め込まれている。 The first connecting portion 81 is formed between the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230, and the thickness of the first accommodating portion 210, the second accommodating portion 220, and the third accommodating portion 230. Thinner than. The second connecting portion 82 is formed between the second accommodating portion 220 and the third accommodating portion 230, and is thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230. The thickness of the first accommodating portion 210 to the third accommodating portion 230 is, for example, 1 to 15 mm, and the thickness of the first connecting portion 81 and the second accommodating portion 82 is, for example, 0.5 to 5 mm. A signal line 71, a power line 72, and a ground (GND) line 73 are connected between the vibration sensor 21 and the signal processing / communication unit 22. A power line 72 and a ground (GND) line 73 are connected between the signal processing / communication unit 22 and the power supply unit 23. Therefore, the signal line 71, the power line 72, and the ground (GND) line 73 pass through the first connecting portion 81 and the second connecting portion 82. The convex member 38 of the vibration sensor 21 protrudes and is exposed from the surface of the band 2, but the other parts of the vibration sensor 21, the signal processing / communication unit 22 and the power supply unit 23 are embedded inside the second band member 2B. It has been.
 図4(a)では、第2バンド部材2Bが第1バンド部材2Aよりも長い。第1バンド部材2Aの全長L15は、例えば、60~110mmである。第2バンド部材2Bの全長L16は、例えば、80~130mmである。第2取付部7から振動センサ21の中心までの長さL17は、例えば、20~60mmである。振動センサ21の中心から電源部23の中心までの長さL18は、例えば、10~50mmである。電源部23の中心から信号処理・通信部22の中心までの長さL19は、例えば、10~50mmである。 In FIG. 4A, the second band member 2B is longer than the first band member 2A. The total length L15 of the first band member 2A is, for example, 60 to 110 mm. The total length L16 of the second band member 2B is, for example, 80 to 130 mm. The length L17 from the second mounting portion 7 to the center of the vibration sensor 21 is, for example, 20 to 60 mm. The length L18 from the center of the vibration sensor 21 to the center of the power supply unit 23 is, for example, 10 to 50 mm. The length L19 from the center of the power supply unit 23 to the center of the signal processing / communication unit 22 is, for example, 10 to 50 mm.
 振動センサ21、信号処理・通信部22及び電源部23は、第2取付部7から貫通孔4に向かう方向に沿って、振動センサ21、電源部23、信号処理・通信部22の順に第2バンド部材2Bに配置されている。振動センサ21は、信号処理・通信部22及び電源部23よりも第2取付部7に近い位置に配置されている。 The vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are second in the order of the vibration sensor 21, the power supply unit 23, and the signal processing / communication unit 22 along the direction from the second mounting unit 7 toward the through hole 4. It is arranged on the band member 2B. The vibration sensor 21 is arranged at a position closer to the second mounting portion 7 than the signal processing / communication unit 22 and the power supply unit 23.
 図4(b)は、図4(a)のバンド2を左の手首10に巻いた状態の断面図である。図4(b)では、指先側から見た状態が示されている。図4(b)の上側が手の甲側又は手首の背側であり、図4(b)の下側が手のひら側又は手首の腹側である。 FIG. 4B is a cross-sectional view of the band 2 of FIG. 4A wound around the left wrist 10. FIG. 4B shows a state viewed from the fingertip side. The upper side of FIG. 4B is the back side of the hand or the dorsal side of the wrist, and the lower side of FIG. 4B is the palm side or the ventral side of the wrist.
 図4(b)に示すように、第1収容部210及び振動センサ21が手首10の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に巻かれると、第3収容部230及び電源部23が手首10の長掌筋14に対向するように配置される。このように、電源部23が手首の腹側の湾曲が相対的に少ない領域、すなわち領域14Aに配置されるので、電源部23の湾曲を抑止でき、電源部23の破損を防ぐことができる。 As shown in FIG. 4B, when the band 2 is wound around the wrist 10 so that the first accommodating portion 210 and the vibration sensor 21 are arranged at positions facing the radial artery 13 of the wrist 10, the third accommodating portion is formed. The 230 and the power supply unit 23 are arranged so as to face the palmaris longus muscle 14 of the wrist 10. In this way, since the power supply unit 23 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A, the curvature of the power supply unit 23 can be suppressed and the power supply unit 23 can be prevented from being damaged.
 尚、図3(a)及び図4(a)において、第3収容部230及び電源部23の位置を第2収容部220及び信号処理・通信部22の位置と交換してもよい。この場合、第1収容部210及び振動センサ21が被測定者の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に巻かれると、第2収容部220及び信号処理・通信部22が手首10の長掌筋14に対向するように配置される。従って、信号処理・通信部22が手首の腹側の湾曲が相対的に少ない領域、すなわち領域14Aに配置されるので、信号処理・通信部22の破損を防ぐことができる。 Note that, in FIGS. 3 (a) and 4 (a), the positions of the third accommodating unit 230 and the power supply unit 23 may be exchanged with the positions of the second accommodating unit 220 and the signal processing / communication unit 22. In this case, when the band 2 is wound around the wrist 10 so that the first accommodating portion 210 and the vibration sensor 21 are arranged at positions facing the radial artery 13 of the person to be measured, the second accommodating portion 220 and signal processing / communication are performed. The portion 22 is arranged so as to face the palmaris longus muscle 14 of the wrist 10. Therefore, since the signal processing / communication unit 22 is arranged in the region where the curvature of the ventral side of the wrist is relatively small, that is, the region 14A, damage to the signal processing / communication unit 22 can be prevented.
 図1(a)、図2(a)、図3(a)及び図4(a)では、第1収容部210、第2収容部220及び第3収容部230の厚みは同じであるが、異なっていてもよい。第1連結部81及び第2連結部82の厚みは同じであるが、異なっていてもよい。 In FIGS. 1 (a), 2 (a), 3 (a) and 4 (a), the thicknesses of the first accommodating portion 210, the second accommodating portion 220 and the third accommodating portion 230 are the same. It may be different. The thicknesses of the first connecting portion 81 and the second connecting portion 82 are the same, but may be different.
 図5(a)は、振動センサ21の構成を示す断面図である。図5(b),(c)は振動センサ21が備えるケースの断面図である。図6は、振動センサ21の構成を示す平面図である。図5(a)において、基板の表面に垂直な方向をZ方向とし、Z方向に垂直な面内で互いに直交する2方向をX方向(第1方向)及びY方向(第2方向)とする。図6は、基板を図5(a)の+Z側から見た場合の平面図である。図7(a)~(d)はケース40の例を示す図である。 FIG. 5A is a cross-sectional view showing the configuration of the vibration sensor 21. 5 (b) and 5 (c) are cross-sectional views of a case included in the vibration sensor 21. FIG. 6 is a plan view showing the configuration of the vibration sensor 21. In FIG. 5A, the direction perpendicular to the surface of the substrate is the Z direction, and the two directions orthogonal to each other in the plane perpendicular to the Z direction are the X direction (first direction) and the Y direction (second direction). .. FIG. 6 is a plan view of the substrate as viewed from the + Z side of FIG. 5 (a). 7 (a) to 7 (d) are diagrams showing an example of the case 40.
 図5(a)において、振動センサ21は、基板30(第2基板)、圧電素子33、素子37、凸状部材38及びケース40を有する。基板30及びケース40で囲まれる空間が空間50になる。基板30は、略平板状であり、第1面としてのおもて面30bと、おもて面30bの反対側の第2面としての裏面30aとを有する。基板30は、XY平面視において、略長方形であってもよいし、略正方形であってもよい。尚、基板30のX方向の両端部31の各々が、Y方向に長さを持ち、圧電素子33または凸状部材38を挟んで対向位置に配置され、この基板30がケース40によって支持される両端部31を有するのであれば、基板30は矩形以外の形状でも良い。例えば、楕円、円、または多角形などの両端がカットされて、Y方向に支持可能な直線部がある形状の基板であれば、その基板を基板30として適用可能である。よって、基板30のX方向の両端部31の各々がバンド2に支持されるY方向の長さを有していれば、基板30は略正方形又は略長方形以外の形状でもよい。 In FIG. 5A, the vibration sensor 21 has a substrate 30 (second substrate), a piezoelectric element 33, an element 37, a convex member 38, and a case 40. The space surrounded by the substrate 30 and the case 40 becomes the space 50. The substrate 30 is substantially flat and has a front surface 30b as a first surface and a back surface 30a as a second surface opposite the front surface 30b. The substrate 30 may be substantially rectangular or substantially square in XY plan view. Each of both ends 31 of the substrate 30 in the X direction has a length in the Y direction and is arranged at opposite positions with the piezoelectric element 33 or the convex member 38 interposed therebetween, and the substrate 30 is supported by the case 40. The substrate 30 may have a shape other than a rectangle as long as it has both ends 31. For example, if the substrate has a shape such as an ellipse, a circle, or a polygon in which both ends are cut and a straight portion that can be supported in the Y direction is provided, the substrate can be applied as the substrate 30. Therefore, the substrate 30 may have a shape other than a substantially square shape or a substantially rectangular shape as long as each of both ends 31 in the X direction of the substrate 30 has a length in the Y direction supported by the band 2.
 基板30は、例えば、15mm(x)×15mm(y)×0.8mm(z)のサイズを有している。基板30は、対向する一対の支持側辺30cおよび支持側辺30cと交差する一対の非接触側辺30dを有する。基板30がZ方向に撓んだ場合に、非接触側辺30dはケース40と接触しない。基板30のX方向の両端部31は一対の支持側辺30cまたはその近傍に設けられている。基板30は、絶縁性を有する材料で形成されており、例えば、ガラスエポキシなどの絶縁性樹脂で形成されている。尚、基板30は、絶縁性セラミック(例えば、アルミナ)で形成されてもよいし、若しくは裏面30aが樹脂膜で絶縁処理された金属板または合金板で形成されてもよい。この樹脂膜の上に導電パターン32が形成される。例えば、基板30の少なくとも裏面30aには、不図示のパッド電極と接続される導電パターン32が設けられている。そして、圧電素子33、この圧電素子33と回路を構成する素子37(電気部品)は、パッド電極と半田を介して電気的に接続されている。従って、基板30の裏面30aにおいて、圧電素子33及び素子37が搭載されるパッド電極及び導電パターン32が配置されている領域以外の領域(例えば両端部31)は絶縁されている。なお、基板30の裏面30aの両端部31は絶縁部として機能する。また、基板30は、例えば、10GPa以上の弾性率を有し、バンド2、凸状部材38及びケース40の弾性率よりも高い。 The substrate 30 has a size of, for example, 15 mm (x) × 15 mm (y) × 0.8 mm (z). The substrate 30 has a pair of support side sides 30c facing each other and a pair of non-contact side sides 30d intersecting the support side sides 30c. When the substrate 30 is bent in the Z direction, the non-contact side 30d does not come into contact with the case 40. Both ends 31 of the substrate 30 in the X direction are provided on or near the pair of support side sides 30c. The substrate 30 is made of an insulating material, for example, an insulating resin such as glass epoxy. The substrate 30 may be formed of an insulating ceramic (for example, alumina), or the back surface 30a may be formed of a metal plate or an alloy plate whose back surface 30a is insulated with a resin film. A conductive pattern 32 is formed on the resin film. For example, at least the back surface 30a of the substrate 30 is provided with a conductive pattern 32 connected to a pad electrode (not shown). The piezoelectric element 33, and the element 37 (electrical component) constituting the circuit with the piezoelectric element 33, are electrically connected to the pad electrode via solder. Therefore, on the back surface 30a of the substrate 30, a region (for example, both ends 31) other than the region where the piezoelectric element 33 and the pad electrode on which the element 37 is mounted and the conductive pattern 32 are arranged is insulated. Both ends 31 of the back surface 30a of the substrate 30 function as insulating portions. Further, the substrate 30 has an elastic modulus of, for example, 10 GPa or more, which is higher than the elastic modulus of the band 2, the convex member 38, and the case 40.
 圧電素子33は、基板30の裏面30aの中心付近に配置され、不図示の半田を介して裏面30aに固定されている。圧電素子33は、例えば、3.2mm(x)×1.6mm(y)×0.8mm(z)のサイズを有している。図6に示すように、+Z方向から観た場合に、圧電素子33は、凸状部材38が固定されている領域内に位置する。つまり、圧電素子33は、凸状部材38が固定されたおもて面30bの第1領域(図6の点線領域)に対向する裏面30aの第2領域内(図6の点線領域内)に固定されている。 The piezoelectric element 33 is arranged near the center of the back surface 30a of the substrate 30, and is fixed to the back surface 30a via a solder (not shown). The piezoelectric element 33 has a size of, for example, 3.2 mm (x) × 1.6 mm (y) × 0.8 mm (z). As shown in FIG. 6, the piezoelectric element 33 is located in the region where the convex member 38 is fixed when viewed from the + Z direction. That is, the piezoelectric element 33 is located in the second region (inside the dotted line region in FIG. 6) of the back surface 30a facing the first region (dotted line region in FIG. 6) of the front surface 30b to which the convex member 38 is fixed. It is fixed.
 圧電素子33は、圧電体34、端子電極35及び端子電極36を有する。圧電体34は、例えば、PZT(チタン酸ジルコン酸鉛)を主成分とする材料で形成される。圧電体34には、予め+Z方向側および-Z方向側で圧電体34を上下で挟むように分極端子(不図示)が用意され、+Z方向および-Z方向から所定の電圧をかけて分極処理が行われ、圧電体34の分極方向をZ方向にしている。なお、この分極処理に必要である分極端子は削除されても良いし、残しておいても良い。端子電極35及び端子電極36は、圧電体34を挟んで互いに対向配置される。端子電極35は、圧電体34の-X側に配置され、端子電極36は、圧電体34の+X側に配置される。これにより、圧電体34が+Z方向および-Z方向に力を受けて変位すると、電荷が発生し、その結果、端子電極35、36の間には、その力に応じた電気信号が発生する。 The piezoelectric element 33 has a piezoelectric body 34, a terminal electrode 35, and a terminal electrode 36. The piezoelectric body 34 is formed of, for example, a material containing PZT (lead zirconate titanate) as a main component. The piezoelectric body 34 is provided with polarization terminals (not shown) so as to sandwich the piezoelectric body 34 vertically on the + Z direction side and the −Z direction side in advance, and a predetermined voltage is applied from the + Z direction and the −Z direction to perform polarization processing. Is performed, and the polarization direction of the piezoelectric body 34 is set to the Z direction. The polarization terminal required for this polarization processing may be deleted or may be left. The terminal electrode 35 and the terminal electrode 36 are arranged so as to face each other with the piezoelectric body 34 interposed therebetween. The terminal electrode 35 is arranged on the −X side of the piezoelectric body 34, and the terminal electrode 36 is arranged on the + X side of the piezoelectric body 34. As a result, when the piezoelectric body 34 receives a force in the + Z direction and the −Z direction and is displaced, an electric charge is generated, and as a result, an electric signal corresponding to the force is generated between the terminal electrodes 35 and 36.
 なお、本実施形態において、凸状部材38を通じて外力が加わることにより、巨視的に見ると基板30が上下に撓み、微視的に見ると、基板30の裏面30aは水平方向に伸びたり縮んだりしている。その結果、基板30の上に載せられた圧電素子33も伸びたり縮んだりするので、端子電極35と36の間に電気信号が発生する。ここでは、圧電素子33の分極方向は、基板30の垂直方向に整列されたものである。 In the present embodiment, when an external force is applied through the convex member 38, the substrate 30 bends up and down when viewed macroscopically, and the back surface 30a of the substrate 30 expands or contracts in the horizontal direction when viewed microscopically. doing. As a result, the piezoelectric element 33 mounted on the substrate 30 also expands and contracts, so that an electric signal is generated between the terminal electrodes 35 and 36. Here, the polarization directions of the piezoelectric elements 33 are aligned in the vertical direction of the substrate 30.
 素子37は、例えば、圧電素子33で発生した信号に対して増幅処理を施すFET(Field Effect Transistor)などの半導体素子や増幅率調整用パッシブ部品などであり、基板30の裏面30aに設けられたパッド電極に、半田等で固定されている。素子37は、不図示の配線を介して圧電素子33に電気的に接続されている。なお、基板30のおもて面30bに不図示のシールドメタルが設けられても良い。この場合、シールドメタルは裏面30aに設けられたGND用の配線や電極とビアを介して接続される。 The element 37 is, for example, a semiconductor element such as a FET (Field Effect Transistor) that amplifies the signal generated by the piezoelectric element 33, a passive component for adjusting the amplification factor, or the like, and is provided on the back surface 30a of the substrate 30. It is fixed to the pad electrode with solder or the like. The element 37 is electrically connected to the piezoelectric element 33 via a wiring (not shown). A shield metal (not shown) may be provided on the front surface 30b of the substrate 30. In this case, the shield metal is connected to the GND wiring and electrodes provided on the back surface 30a via vias.
 凸状部材38は、基板30のおもて面30bの略中央に接着剤又は合金接合などで固定されており、基板30のおもて面30bから-Z方向に突出している。凸状部材38は、図5(a)に示すように、圧電素子33に対向する位置に設けられている。凸状部材38は、例えば、径9.5mm、高さ7.4mmのサイズを有している。凸状部材38は、シリコン、ポリカーボネート又はABSなどの樹脂、又は鉄やニッケルなどの金属で形成されている。凸状部材38が樹脂である場合、前述の樹脂製接着剤で基板30に固定され、凸状部材38の弾性率は、例えば0.1~3000Mpaである。凸状部材38が金属である場合、前述の樹脂製接着剤、ロウ材または導電ペーストで基板30に固定され、凸状部材38の弾性率はGpaオーダーである。なお、凸状部材38は上述した弾性率を有する限り、エアーチューブのような中空形状でもよい。凸状部材38はバンド2の表面から突出し且つ露出されているが、振動センサ21の基板30及びケース40はバンド2の内部に埋め込まれている。 The convex member 38 is fixed to the substantially center of the front surface 30b of the substrate 30 with an adhesive or an alloy joint, and protrudes from the front surface 30b of the substrate 30 in the −Z direction. As shown in FIG. 5A, the convex member 38 is provided at a position facing the piezoelectric element 33. The convex member 38 has a size of, for example, a diameter of 9.5 mm and a height of 7.4 mm. The convex member 38 is made of a resin such as silicon, polycarbonate or ABS, or a metal such as iron or nickel. When the convex member 38 is made of resin, it is fixed to the substrate 30 with the above-mentioned resin adhesive, and the elastic modulus of the convex member 38 is, for example, 0.1 to 3000 Mpa. When the convex member 38 is made of metal, it is fixed to the substrate 30 with the above-mentioned resin adhesive, brazing material or conductive paste, and the elastic modulus of the convex member 38 is on the order of Gpa. The convex member 38 may have a hollow shape such as an air tube as long as it has the elastic modulus described above. The convex member 38 projects and is exposed from the surface of the band 2, but the substrate 30 and the case 40 of the vibration sensor 21 are embedded inside the band 2.
 また、おもて面30bが金属膜、例えば、銅などで全面被覆されて、シールドされている場合は、凸状部材38はロウ材や導電ペーストでおもて面30bに固定するのが適切である。この場合、金属膜は、シールド部材として及び凸状部材の固着部材として機能する。 Further, when the front surface 30b is entirely covered with a metal film, for example, copper or the like and shielded, it is appropriate to fix the convex member 38 to the front surface 30b with a brazing material or a conductive paste. Is. In this case, the metal film functions as a shield member and a fixing member of the convex member.
 ケース40は、シリコン、ポリカーボネート又はABSなどの樹脂で形成されている。ケース40の弾性率は、例えば、50~5000Mpaであり、基板30の弾性率よりも低い。 The case 40 is made of a resin such as silicon, polycarbonate or ABS. The elastic modulus of the case 40 is, for example, 50 to 5000 Mpa, which is lower than the elastic modulus of the substrate 30.
 図5(a)に示すように、基板30のX方向の両端部31は、ケース40の段差44に両持ち梁状に固定されている。つまり、基板30のX方向の両端部31は、基板30の振動の固定端として機能する。バンド2が手首に巻かれ、凸状部材38が手首から脈波の振動による力を受けると、その力が凸状部材38から基板30へ伝達され、基板30が+Z方向に撓む。なお、基板30が+Z方向に撓んだ場合でも、圧電素子33及び素子37は、ケース40に接触しない。凸状部材38のX方向の長さが基板30のX方向の長さよりも小さいので、凸状部材38が基板30を効率的に撓ませることができる。また、凸状部材38が基板30の裏面30aの圧電素子33に対応した位置に配置されているので、基板30のおもて面30bにおける圧電素子33付近の領域を効率的に撓ませることができる。これにより、圧電素子33内の圧電体34を効率的に変位させることができ、圧電素子33が脈波の振動による力を感度よく検知することができる。 As shown in FIG. 5A, both ends 31 of the substrate 30 in the X direction are fixed to the step 44 of the case 40 in a double-sided beam shape. That is, both ends 31 of the substrate 30 in the X direction function as fixed ends of vibration of the substrate 30. When the band 2 is wound around the wrist and the convex member 38 receives a force due to the vibration of the pulse wave from the wrist, the force is transmitted from the convex member 38 to the substrate 30, and the substrate 30 bends in the + Z direction. Even when the substrate 30 is bent in the + Z direction, the piezoelectric element 33 and the element 37 do not come into contact with the case 40. Since the length of the convex member 38 in the X direction is smaller than the length of the substrate 30 in the X direction, the convex member 38 can efficiently bend the substrate 30. Further, since the convex member 38 is arranged at a position corresponding to the piezoelectric element 33 on the back surface 30a of the substrate 30, it is possible to efficiently bend the region of the front surface 30b of the substrate 30 near the piezoelectric element 33. can. As a result, the piezoelectric body 34 in the piezoelectric element 33 can be efficiently displaced, and the piezoelectric element 33 can detect the force due to the vibration of the pulse wave with high sensitivity.
 図5(a)及び図7(a)に示すように、ケース40は、基板30のX方向の両端部31を支持する段差44を有する複数の第1壁部42と、複数の第1壁部42を連結し基板30の裏面30aを覆う底部43とを備える。底部43はXY平面と平行に形成され、複数の第1壁部42は底部43のX方向の両端に設けられ、YZ平面と平行に配置されている。また、図7(a)に示すように、第1壁部42の一つには、基板30から配線を外部に引き出すための凹部45が形成されている。例えば、図1(a)、図2(a)、図3(a)及び図4(a)の信号処理・通信部22から延びる信号線71、電力線72及びグランド(GND)線73が凹部45を介して基板30の裏面30aの配線パターン32に接続される。 As shown in FIGS. 5A and 7A, the case 40 has a plurality of first wall portions 42 having steps 44 supporting both ends 31 in the X direction of the substrate 30, and a plurality of first wall portions. A bottom portion 43 that connects the portions 42 and covers the back surface 30a of the substrate 30 is provided. The bottom portion 43 is formed parallel to the XY plane, and the plurality of first wall portions 42 are provided at both ends of the bottom portion 43 in the X direction and are arranged parallel to the YZ plane. Further, as shown in FIG. 7A, one of the first wall portions 42 is formed with a recess 45 for drawing out the wiring from the substrate 30 to the outside. For example, the signal line 71, the power line 72, and the ground (GND) line 73 extending from the signal processing / communication unit 22 of FIGS. 1 (a), 2 (a), 3 (a), and 4 (a) are recessed 45. It is connected to the wiring pattern 32 on the back surface 30a of the substrate 30 via the above.
 図5(a)に示すように、ケース40の内壁(空間50に接する複数の第1壁部42及び底部43の面)を覆うように導電材としての導電膜41が形成されている。導電膜41は、図5(b)に示すように、ケース40の外壁を覆うように形成されてもよい。また、導電膜41は、図5(c)に示すように、ケース40の内部に形成されてもよい。図5(a)~(c)のいずれの場合も、絶縁性を有する材料で形成されている基板30を導電膜41に絶縁性接着材で固定することで、基板30、複数の第1壁部42及び底部43で空間50を封止し、外部からの電磁波を遮断している。ただし、図7(a)に示すように、XZ面側は壁がなく、開放される場合がある。 As shown in FIG. 5A, a conductive film 41 as a conductive material is formed so as to cover the inner wall of the case 40 (the surfaces of the plurality of first wall portions 42 and the bottom portion 43 in contact with the space 50). As shown in FIG. 5B, the conductive film 41 may be formed so as to cover the outer wall of the case 40. Further, the conductive film 41 may be formed inside the case 40 as shown in FIG. 5 (c). In any of FIGS. 5A to 5C, the substrate 30 and the plurality of first walls are formed by fixing the substrate 30 made of an insulating material to the conductive film 41 with an insulating adhesive. The space 50 is sealed by the portion 42 and the bottom portion 43 to block electromagnetic waves from the outside. However, as shown in FIG. 7A, the XZ surface side has no wall and may be opened.
 また、空間50には、ケース40の弾性率よりも低い弾性率を有する素材が充填されるのが好ましい。空間50に充填される素材の弾性率がケース40の弾性率よりも高い場合には、基板30の振動が抑制されてしまう。このため、空間50に充填される素材の弾性率はケース40の弾性率の5分の1以下に設定されるのが好ましい。空間50に充填される素材は、例えば、空気・ガスなどの気体、ゲル、ゴム、又は樹脂などである。空間50に充填される素材の弾性率は、例えば0~10Mpaである。なお、図5(a)の空間50には、例えば、空気が充填されている。 Further, it is preferable that the space 50 is filled with a material having an elastic modulus lower than that of the case 40. When the elastic modulus of the material filled in the space 50 is higher than the elastic modulus of the case 40, the vibration of the substrate 30 is suppressed. Therefore, the elastic modulus of the material filled in the space 50 is preferably set to 1/5 or less of the elastic modulus of the case 40. The material filled in the space 50 is, for example, a gas such as air or gas, a gel, rubber, or a resin. The elastic modulus of the material filled in the space 50 is, for example, 0 to 10 Mpa. The space 50 in FIG. 5A is filled with, for example, air.
 図7(a)及び図7(c)に示すケース40では、2つの段差44が基板30のX方向の両端部31、即ち基板30の裏面30aの対向する2辺(一対の支持側辺30c)をそれぞれ支持する。この場合、両端部31がY方向に沿って段差44に固定されるため、X方向及びZ方向の基板30の振動が抑制されることがなく、圧電素子33は脈波の振動を検知することができる。 In the case 40 shown in FIGS. 7 (a) and 7 (c), the two steps 44 are the two end portions 31 of the substrate 30 in the X direction, that is, the two opposite sides (a pair of support side sides 30c) of the back surface 30a of the substrate 30. ) Are supported respectively. In this case, since both ends 31 are fixed to the step 44 along the Y direction, the vibration of the substrate 30 in the X and Z directions is not suppressed, and the piezoelectric element 33 detects the vibration of the pulse wave. Can be done.
 図7(b)及び図7(d)に示すケース40では、1つの第1壁部42に含まれる段差44は凹部46を有し、2つの段差44が基板30の4角を支持する。この場合、基板30の4角が段差44に固定されるため、X方向、Y方向及びZ方向の基板30の振動が抑制されることがなく、圧電素子33は図7(a)及び図7(c)の場合よりも脈波の振動をより正確に検知することができる。 In the case 40 shown in FIGS. 7 (b) and 7 (d), the step 44 included in one first wall portion 42 has a recess 46, and the two steps 44 support the four corners of the substrate 30. In this case, since the four corners of the substrate 30 are fixed to the step 44, the vibration of the substrate 30 in the X, Y, and Z directions is not suppressed, and the piezoelectric element 33 is shown in FIGS. 7 (a) and 7 (a) and 7. The vibration of the pulse wave can be detected more accurately than in the case of (c).
 図7(c)及び図7(d)に示すケース40は、複数の第1壁部42の両端に連結され、底部43から立設され、基板30と接触しない複数の第2壁部47を備えている。この場合、基板30、複数の第1壁部42、底部43及び複数の第2壁部47で空間50を封止し、外部からの電磁波を遮断する。従って、図7(a)及び図7(b)のケース40と比べて、外部からの電磁波をより遮断できる。 The case 40 shown in FIGS. 7 (c) and 7 (d) has a plurality of second wall portions 47 connected to both ends of the plurality of first wall portions 42, erected from the bottom portion 43, and not in contact with the substrate 30. I have. In this case, the space 50 is sealed by the substrate 30, the plurality of first wall portions 42, the bottom portion 43, and the plurality of second wall portions 47 to block electromagnetic waves from the outside. Therefore, as compared with the case 40 of FIGS. 7 (a) and 7 (b), electromagnetic waves from the outside can be blocked more.
 また、第2壁部47の高さは、底部43から段差44までの高さよりも低くてもよい。この場合、外部からの電磁波を遮断する効果は減少するが、第2壁部47が梁の役割を果たすため、ケース40自体の撓み、すなわち底部43が湾曲し複数の第1壁部42が近づく撓みを削減することができる。 Further, the height of the second wall portion 47 may be lower than the height from the bottom portion 43 to the step 44. In this case, the effect of blocking electromagnetic waves from the outside is reduced, but since the second wall portion 47 acts as a beam, the case 40 itself is bent, that is, the bottom portion 43 is curved and the plurality of first wall portions 42 approach each other. The deflection can be reduced.
 図8は、振動センサ21、信号処理・通信部22及び電源部23の構成の一例を示すブロック図である。振動センサ21、信号処理・通信部22及び電源部23の位置関係は図1(a)、図2(a)、図3(a)及び図4(a)に示す位置関係と同じにしてある。信号線71、電力線72及びグランド(GND)線73が振動センサ21と信号処理・通信部22との間に接続されている。電力線72及びグランド(GND)線73が信号処理・通信部22と電源部23との間に接続されている。振動センサ21は、圧電素子33と、素子37としてのアンプ371とを備えている。ここで、アンプ371は、例えば、インスツルメンテーションアンプやチャージアンプである。アンプ371は、圧電素子33で発生した信号(脈波信号)を増幅し、信号線71を介して信号処理・通信部22に出力する。 FIG. 8 is a block diagram showing an example of the configuration of the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23. The positional relationship between the vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 is the same as the positional relationship shown in FIGS. 1 (a), 2 (a), 3 (a), and 4 (a). .. The signal line 71, the power line 72, and the ground (GND) line 73 are connected between the vibration sensor 21 and the signal processing / communication unit 22. The power line 72 and the ground (GND) line 73 are connected between the signal processing / communication unit 22 and the power supply unit 23. The vibration sensor 21 includes a piezoelectric element 33 and an amplifier 371 as the element 37. Here, the amplifier 371 is, for example, an instrumentation amplifier or a charge amplifier. The amplifier 371 amplifies the signal (pulse wave signal) generated by the piezoelectric element 33, and outputs the signal (pulse wave signal) to the signal processing / communication unit 22 via the signal line 71.
 信号処理・通信部22は、プログラマブルアンプ221と、A/D変換器222と、通信モジュール223と、マイコン224とを備えている。通信モジュール223はアンテナ225を備えている。プログラマブルアンプ221はアンプ371から受信した脈波信号をさらに増幅する。A/D変換器222は、プログラマブルアンプ221によって増幅された脈波信号をデジタル信号に変換する。マイコン224はA/D変換器222で変換されたデジタル信号を通信可能なデジタルデータに変換する。また、マイコン224は通信モジュールの通信タイミングなども制御する。マイコン224はA/D変換器222で変換されたデジタル信号からノイズ成分を除去してもよい。通信モジュール223は、例えば、BLE(Bluetooth(登録商標) Low Energy)又は無線LANなどの無線通信を行い、脈波信号を示すデジタルデータを不図示の外部装置(例えばコンピュータやスマートフォンなど)に送信する。 The signal processing / communication unit 22 includes a programmable amplifier 221, an A / D converter 222, a communication module 223, and a microcomputer 224. The communication module 223 includes an antenna 225. The programmable amplifier 221 further amplifies the pulse wave signal received from the amplifier 371. The A / D converter 222 converts the pulse wave signal amplified by the programmable amplifier 221 into a digital signal. The microcomputer 224 converts the digital signal converted by the A / D converter 222 into communicable digital data. The microcomputer 224 also controls the communication timing of the communication module. The microcomputer 224 may remove a noise component from the digital signal converted by the A / D converter 222. The communication module 223 performs wireless communication such as BLE (Bluetooth (registered trademark) Low Energy) or wireless LAN, and transmits digital data indicating a pulse wave signal to an external device (for example, a computer or a smartphone) (not shown). ..
 電源部23は、ボタン電池又は充電可能なリチウムイオン電池のようなバッテリ231を備えている。バッテリ231は、電力線72を介して信号処理・通信部22及び振動センサ21に含まれる各構成要素に電力を供給する。 The power supply unit 23 includes a battery 231 such as a button battery or a rechargeable lithium-ion battery. The battery 231 supplies electric power to each component included in the signal processing / communication unit 22 and the vibration sensor 21 via the power line 72.
 図9(a)は、バンド2の第1収容部210~第3収容部230の断面図である。図9(b)は、第1収容部210~第3収容部230の第1変形例を示す断面図である。図10(a)は、第1収容部210~第3収容部230の第2変形例を示す断面図である。図10(b)は、第1収容部210~第3収容部230の第3変形例を示す断面図である。図9(a)~図10(b)の構成及び特徴は、第1バンド部材2A及び第2バンド部材2Bにも適用可能である。図9(a)~図10(b)では図の上側が手首10側である。 FIG. 9A is a cross-sectional view of the first accommodating portion 210 to the third accommodating portion 230 of the band 2. FIG. 9B is a cross-sectional view showing a first modification of the first accommodating portion 210 to the third accommodating portion 230. FIG. 10A is a cross-sectional view showing a second modification of the first accommodating portion 210 to the third accommodating portion 230. FIG. 10B is a cross-sectional view showing a third modification of the first accommodating portion 210 to the third accommodating portion 230. The configurations and features of FIGS. 9A to 10B are also applicable to the first band member 2A and the second band member 2B. In FIGS. 9A to 10B, the upper side of the figure is the wrist 10 side.
 図9(a)~図10(b)では、電源部23は、振動センサ21と信号処理・通信部22との間に配置され、振動センサ21と信号処理・通信部22とを接続する配線(即ち、信号線71、電力線72及びグランド(GND)線73)は電源部23の周辺を引き回されている。 In FIGS. 9A to 10B, the power supply unit 23 is arranged between the vibration sensor 21 and the signal processing / communication unit 22, and is a wiring that connects the vibration sensor 21 and the signal processing / communication unit 22. (That is, the signal line 71, the power line 72, and the ground (GND) line 73) are routed around the power supply unit 23.
 図9(a)~図10(b)の信号処理・通信部22では、プログラマブルアンプ221、A/D変換器222、通信モジュール223及びマイコン224が基板226(第1基板)上に形成されている。さらに、アンテナ225が、基板226の端部241に配置され、振動センサ21及び電源部23と接続する配線(即ち、信号線71、電力線72及びグランド(GND)線73)は基板226の端部241よりも振動センサ21に近い基板226上の端子242から引き延ばされている。 In the signal processing / communication unit 22 of FIGS. 9A to 10B, the programmable amplifier 221 and the A / D converter 222, the communication module 223, and the microcomputer 224 are formed on the substrate 226 (first substrate). There is. Further, the antenna 225 is arranged at the end 241 of the board 226, and the wiring (that is, the signal line 71, the power line 72 and the ground (GND) line 73) connecting to the vibration sensor 21 and the power supply 23 is the end of the board 226. It is extended from the terminal 242 on the substrate 226, which is closer to the vibration sensor 21 than the 241.
 この構成では、信号処理・通信部22のアンテナ225と反対側にGND線73を伸ばしており、アンテナ225と対向するGND線73の長さは、少なくとも通信周波数の1/4波長を確保することが好ましい。例えば、本実施形態でアンテナ225として使用される接地型λ/4モノポールタイプのアンテナは、半波長ダイポールアンテナの片側をGNDで代用する接地型のアンテナである。このため、アンテナ225と対向するGND線73の長さを通信周波数の1/4波長以上とすることでアンテナ225の特性の劣化を防ぐことができる。GNDの大きさや形状でアンテナ225の性能は大きく変化するため、仮にGND線73の長さが通信周波数の1/4波長より短い場合、アンテナ225の放射効率が下がり、脈波検出装置とスマートホン又はPCなどの外部機器との間の通信可能な距離が短くなり、安定した通信が出来なくなる可能性がある。また、アンテナ225の放射効率が悪ければ、通信モジュール223の送信出力を上げ通信距離を改善することもできるが、その分電源部23の電力を消耗し、すぐに電源部23を充電することになってしまう。 In this configuration, the GND line 73 is extended on the side opposite to the antenna 225 of the signal processing / communication unit 22, and the length of the GND line 73 facing the antenna 225 should secure at least 1/4 wavelength of the communication frequency. Is preferable. For example, the grounded λ / 4 monopole type antenna used as the antenna 225 in the present embodiment is a grounded type antenna in which one side of the half wavelength dipole antenna is replaced by GND. Therefore, by setting the length of the GND line 73 facing the antenna 225 to 1/4 wavelength or more of the communication frequency, deterioration of the characteristics of the antenna 225 can be prevented. Since the performance of the antenna 225 changes greatly depending on the size and shape of the GND, if the length of the GND line 73 is shorter than 1/4 wavelength of the communication frequency, the radiation efficiency of the antenna 225 will decrease, and the pulse wave detector and smartphone Alternatively, the communicable distance with an external device such as a PC becomes short, and stable communication may not be possible. Further, if the radiation efficiency of the antenna 225 is poor, the transmission output of the communication module 223 can be increased to improve the communication distance, but the power of the power supply unit 23 is consumed by that amount, and the power supply unit 23 is charged immediately. turn into.
 そこで、図1(a)~図4(a)のGND線73のように、振動センサ21の基板30のGNDも含め、振動センサ21から信号処理・通信部22までのGND線73を利用できるように振動センサ21、信号処理・通信部22及び電源部23が配置されている。つまり、アンテナ225が設置されている信号処理・通信部22から反対側にGND線73を伸ばすことで、GND線73の長さを十分に確保できるため、アンテナ225の特性を改善し通信性能を向上させることができる。 Therefore, as shown in the GND lines 73 of FIGS. 1A to 4A, the GND lines 73 from the vibration sensor 21 to the signal processing / communication unit 22 can be used, including the GND of the substrate 30 of the vibration sensor 21. The vibration sensor 21, the signal processing / communication unit 22, and the power supply unit 23 are arranged as described above. That is, by extending the GND line 73 to the opposite side from the signal processing / communication unit 22 in which the antenna 225 is installed, a sufficient length of the GND line 73 can be secured, so that the characteristics of the antenna 225 are improved and the communication performance is improved. Can be improved.
 また、図9(b)に示すように、第2収容部220及び第3収容部230が分離されずに一体化されていてもよい。つまり、第2収容部220及び第3収容部230の厚みよりも薄い領域(例えば第2連結部82)が第2収容部220と第3収容部230との間に形成されなくてもよい。信号処理・通信部22及び電源部23は同じ厚みである。この場合、信号処理・通信部22及び電源部23の両方が領域14A又は15Aに配置されるので、信号処理・通信部22及び電源部23の両方の破損を防ぐことができる。なお、図9(b)のバッテリ231は、図9(a)のバッテリ231よりも小さい。 Further, as shown in FIG. 9B, the second accommodating portion 220 and the third accommodating portion 230 may be integrated without being separated. That is, a region thinner than the thickness of the second accommodating portion 220 and the third accommodating portion 230 (for example, the second connecting portion 82) may not be formed between the second accommodating portion 220 and the third accommodating portion 230. The signal processing / communication unit 22 and the power supply unit 23 have the same thickness. In this case, since both the signal processing / communication unit 22 and the power supply unit 23 are arranged in the area 14A or 15A, damage to both the signal processing / communication unit 22 and the power supply unit 23 can be prevented. The battery 231 in FIG. 9B is smaller than the battery 231 in FIG. 9A.
 図10(a)に示すように、第2収容部220は、手首10と信号処理・通信部22との間に配置される第1補強部材227を備えていてもよい。第1補強部材227は、樹脂又は金属のようなバンド2よりも硬い材料又は弾性率が大きい材料で構成されている。第1補強部材227の弾性率は、例えば1000Mpa以上であり、バンド2の弾性率の5倍以上である。第1補強部材227は、例えば、プログラマブルアンプ221、A/D変換器222、通信モジュール223及びマイコン224を覆うモールド又はシールドケースである。この場合、第1補強部材227により信号処理・通信部22の強度が向上するので、信号処理・通信部22の破損を防止することができる。 As shown in FIG. 10A, the second accommodating portion 220 may include a first reinforcing member 227 arranged between the wrist 10 and the signal processing / communication unit 22. The first reinforcing member 227 is made of a material harder than the band 2 such as resin or metal or a material having a large elastic modulus. The elastic modulus of the first reinforcing member 227 is, for example, 1000 Mpa or more, which is five times or more the elastic modulus of the band 2. The first reinforcing member 227 is, for example, a mold or a shield case that covers the programmable amplifier 221 and the A / D converter 222, the communication module 223, and the microcomputer 224. In this case, since the strength of the signal processing / communication unit 22 is improved by the first reinforcing member 227, damage to the signal processing / communication unit 22 can be prevented.
 また、図10(a)に示すように、第3収容部230は、手首10と電源部23との間に配置される第2補強部材232を備えていてもよい。第2補強部材232も、樹脂又は金属のようなバンド2よりも硬い材料又は弾性率が大きい材料で構成されている。第2補強部材232の弾性率は、例えば1000Mpa以上であり、バンド2の弾性率の5倍以上である。第2補強部材232は、例えば、バッテリ231を覆うモールド、シールドケース又は補強板である。この場合、第2補強部材232により電源部23の強度が向上するので、電源部23の破損を防止することができる。 Further, as shown in FIG. 10A, the third accommodating portion 230 may include a second reinforcing member 232 arranged between the wrist 10 and the power supply portion 23. The second reinforcing member 232 is also made of a material that is harder than the band 2 such as resin or metal or has a high elastic modulus. The elastic modulus of the second reinforcing member 232 is, for example, 1000 Mpa or more, which is five times or more the elastic modulus of the band 2. The second reinforcing member 232 is, for example, a mold, a shield case, or a reinforcing plate that covers the battery 231. In this case, since the strength of the power supply unit 23 is improved by the second reinforcing member 232, damage to the power supply unit 23 can be prevented.
 なお、第1補強部材227により信号処理・通信部22が硬くなったり、又は第2補強部材232により電源部23が硬くなっても、第1連結部81及び第2連結部82のフレキシブル性が高いので、バンド2が手首10に装着されたときに第1連結部81及び第2連結部82は曲げやすい。 Even if the signal processing / communication unit 22 is hardened by the first reinforcing member 227 or the power supply unit 23 is hardened by the second reinforcing member 232, the flexibility of the first connecting part 81 and the second connecting part 82 remains. Since it is high, the first connecting portion 81 and the second connecting portion 82 are easily bent when the band 2 is attached to the wrist 10.
 図10(b)に示すように、第2収容部220及び第3収容部230が分離されずに一体化されている場合に、その一体化された第2収容部220及び第3収容部230が第1補強部材227及び第2補強部材232の少なくとも一方を備えていてもよい。この場合、信号処理・通信部22及び電源部23の少なくとも一方の破損を防止することができる。 As shown in FIG. 10B, when the second accommodating portion 220 and the third accommodating portion 230 are integrated without being separated, the integrated second accommodating portion 220 and the third accommodating portion 230 are integrated. May include at least one of a first reinforcing member 227 and a second reinforcing member 232. In this case, it is possible to prevent damage to at least one of the signal processing / communication unit 22 and the power supply unit 23.
 以上説明したように、本実施の形態によれば、振動センサ21を収容する第1収容部210が手首10の橈骨動脈13に対向する位置に配置されるようにバンド2が手首10に固定された場合に、信号処理・通信部22を収容する第2収容部220及び電源部23を収容する第3収容部230の少なくとも一方が手首10の背側又は腹側の橈骨11と尺骨12との間の領域14A又は15Aに対向するように配置される。従って、振動センサ21で橈骨動脈13の脈波信号を検出することができ、同時に信号処理・通信部22及び電源部23の少なくとも一方の破損を防ぐことができる。 As described above, according to the present embodiment, the band 2 is fixed to the wrist 10 so that the first accommodating portion 210 accommodating the vibration sensor 21 is arranged at a position facing the radial artery 13 of the wrist 10. In such a case, at least one of the second accommodating unit 220 accommodating the signal processing / communication unit 22 and the third accommodating unit 230 accommodating the power supply unit 23 is a radius 11 and a ulna 12 on the dorsal or ventral side of the wrist 10. It is arranged so as to face the intervening region 14A or 15A. Therefore, the vibration sensor 21 can detect the pulse wave signal of the radial artery 13, and at the same time, it is possible to prevent damage to at least one of the signal processing / communication unit 22 and the power supply unit 23.
 尚、本実施の形態では、橈骨動脈13の脈波を検出するセンサとして、振動センサ21が使用されているが、振動センサ21の代わりにLED(Light Emitting Diode)センサが使用されてもよい。 In the present embodiment, the vibration sensor 21 is used as the sensor for detecting the pulse wave of the radial artery 13, but an LED (Light Emitting Diode) sensor may be used instead of the vibration sensor 21.
 以上、本発明の実施の形態について詳述したが、本発明はかかる特定の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の要旨の範囲内において、種々の変形・変更が可能である。 Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications are made within the scope of the gist of the present invention described in the claims.・ Can be changed.
 1、1A、1B、1C 脈波検出装置
 2 バンド
 2A 第1バンド部材
 2B 第2バンド部材
 21 振動センサ
 22 信号処理・通信部
 23 電源部
 30 基板
 31 両端部
 33 圧電素子
 37 素子
 38 凸状部材
 40 ケース
 41 導電膜
 42 第1壁部
 43 底部
 44 段差
 47 第2壁部
 50 空間
 210 第1収容部
 220 第2収容部
 230 第3収容部
 
1, 1A, 1B, 1C Pulse wave detection device 2 band 2A 1st band member 2B 2nd band member 21 Vibration sensor 22 Signal processing / communication unit 23 Power supply unit 30 Board 31 Both ends 33 Piezoelectric element 37 Element 38 Convex member 40 Case 41 Conductive film 42 1st wall 43 Bottom 44 Step 47 2nd wall 50 Space 210 1st accommodating 220 2nd accommodating 230 3rd accommodating

Claims (12)

  1.  手首の橈骨動脈から脈波信号を検出するセンサと、
     前記脈波信号を無線で外部装置に通信する通信部と、
     前記センサ及び前記通信部に電力を供給する電源部と、
     前記センサを収容する第1収容部、前記通信部を収容する第2収容部、前記電源部を収容する第3収容部、並びに前記第1収容部、前記第2収容部及び前記第3収容部の少なくとも2つを繋ぐ連結部を有し、前記手首に固定するバンドと、を備え、
     前記第1収容部が前記手首の橈骨動脈に対向する位置に配置されるように前記バンドが前記手首に固定された場合に、前記第2収容部及び前記第3収容部の少なくとも一方が前記手首の背側又は腹側の橈骨と尺骨との間の領域に対向するように配置される脈波検出装置。
    A sensor that detects pulse wave signals from the radial artery of the wrist,
    A communication unit that wirelessly communicates the pulse wave signal to an external device,
    A power supply unit that supplies power to the sensor and the communication unit, and
    The first accommodating unit accommodating the sensor, the second accommodating unit accommodating the communication unit, the third accommodating unit accommodating the power supply unit, and the first accommodating unit, the second accommodating unit, and the third accommodating unit. It has a connecting portion that connects at least two of the above, and includes a band that is fixed to the wrist.
    When the band is fixed to the wrist so that the first accommodating portion is arranged at a position facing the radial artery of the wrist, at least one of the second accommodating portion and the third accommodating portion is the wrist. A pulse wave detector arranged to face the area between the radius and ulna on the dorsal or ventral side of the wrist.
  2.  前記電源部は、前記センサと前記通信部との間に配置される請求項1に記載の脈波検出装置。 The pulse wave detection device according to claim 1, wherein the power supply unit is arranged between the sensor and the communication unit.
  3.  前記第2収容部は、
     前記手首と前記通信部との間に配置され、前記バンドよりも弾性率が大きい第1補強部材を備える請求項1又は2に記載の脈波検出装置。
    The second accommodating part
    The pulse wave detection device according to claim 1 or 2, which is arranged between the wrist and the communication unit and includes a first reinforcing member having a elastic modulus larger than that of the band.
  4.  前記第3収容部は、
     前記手首と前記電源部との間に配置され、前記バンドよりも弾性率が大きい第2補強部材を備える請求項1乃至3のいずれか1項に記載の脈波検出装置。
    The third accommodating part is
    The pulse wave detection device according to any one of claims 1 to 3, which is arranged between the wrist and the power supply unit and includes a second reinforcing member having a elastic modulus larger than that of the band.
  5.  前記連結部は、
     前記第1収容部と前記第2収容部及び前記第3収容部との間に形成され、前記第1収容部、前記第2収容部及び前記第3収容部の厚みよりも薄い第1連結部と、
     前記第2収容部と前記第3収容部との間に形成され、前記第2収容部及び前記第3収容部の厚みよりも薄い第2連結部と
    を備える請求項1乃至4のいずれか1項に記載の脈波検出装置。
    The connecting portion
    A first connecting portion formed between the first accommodating portion, the second accommodating portion and the third accommodating portion, and thinner than the thickness of the first accommodating portion, the second accommodating portion and the third accommodating portion. When,
    Any one of claims 1 to 4, which is formed between the second accommodating portion and the third accommodating portion and includes the second accommodating portion and the second connecting portion thinner than the thickness of the third accommodating portion. The pulse wave detector according to the section.
  6.  前記連結部は、
     前記第1収容部と前記第2収容部及び前記第3収容部との間に形成され、前記第1収容部、前記第2収容部及び前記第3収容部の厚みよりも薄い第1連結部を備え、
     前記第2収容部及び前記第3収容部が分離されずに一体化されていることを特徴とする請求項1乃至4のいずれか1項に記載の脈波検出装置。
    The connecting portion
    A first connecting portion formed between the first accommodating portion, the second accommodating portion and the third accommodating portion, and thinner than the thickness of the first accommodating portion, the second accommodating portion and the third accommodating portion. With
    The pulse wave detection device according to any one of claims 1 to 4, wherein the second accommodating portion and the third accommodating portion are integrated without being separated.
  7.  前記バンドは、帯状のバンドであり、第1係止部と、前記第1係止部を係止する第2係止部とを備え、
     前記センサは、前記通信部及び前記電源部よりも前記第2係止部に近い位置に配置されている請求項1乃至6のいずれか1項に記載の脈波検出装置。
    The band is a band-shaped band, and includes a first locking portion and a second locking portion that locks the first locking portion.
    The pulse wave detection device according to any one of claims 1 to 6, wherein the sensor is arranged at a position closer to the second locking portion than the communication unit and the power supply unit.
  8.  前記バンドは、時計への第1取付部と第1係止部とを有する第1バンド部材と、前記時計への第2取付部と前記第1係止部を係止する第2係止部とを有する第2バンド部材とを備え、
     前記センサ、前記電源部及び前記通信部は前記第1バンド部材に配置され、
     前記センサは、前記通信部及び前記電源部よりも前記第1係止部に近い位置に配置されている請求項1乃至6のいずれか1項に記載の脈波検出装置。
    The band includes a first band member having a first attachment portion and a first locking portion to the watch, and a second locking portion that locks the second attachment portion to the watch and the first locking portion. With a second band member having
    The sensor, the power supply unit, and the communication unit are arranged in the first band member.
    The pulse wave detection device according to any one of claims 1 to 6, wherein the sensor is arranged at a position closer to the first locking portion than the communication unit and the power supply unit.
  9.  前記バンドは、時計への第1取付部と前記第1係止部とを有する第1バンド部材と、前記時計への第2取付部と前記第1係止部を係止する第2係止部とを有する第2バンド部材とを備え、
     前記センサ、前記電源部及び前記通信部は前記第2バンド部材に配置され、
     前記センサは、前記通信部及び前記電源部よりも前記第2取付部に近い位置に配置されている請求項1乃至6のいずれか1項に記載の脈波検出装置。
    The band is a first band member having a first attachment portion to the watch and the first locking portion, and a second locking portion for locking the second attachment portion to the watch and the first locking portion. With a second band member having a portion
    The sensor, the power supply unit, and the communication unit are arranged in the second band member.
    The pulse wave detection device according to any one of claims 1 to 6, wherein the sensor is arranged at a position closer to the second mounting portion than the communication unit and the power supply unit.
  10.  前記センサは、
     第1面と当該第1面の反対側にある第2面とを有する第2基板と、
     前記第2基板の略中央で、前記第1面に固定された凸状部材と、
     前記凸状部材が固定された前記第1面上の第1領域に対向する前記第2面の第2領域内に固定された圧電素子と、
     前記圧電素子が固定された前記第2面を覆い、空間を介して前記圧電素子に対向し、前記第2基板の前記第2面の対向する2辺を支持するケースと、を備え、
     前記空間には、前記ケースの弾性率よりも低い弾性率を有する素材が充填されている請求項1乃至8のいずれか1項に記載の脈波検出装置。
    The sensor is
    A second substrate having a first surface and a second surface on the opposite side of the first surface,
    A convex member fixed to the first surface at substantially the center of the second substrate,
    A piezoelectric element fixed in the second region of the second surface facing the first region on the first surface to which the convex member is fixed.
    A case is provided which covers the second surface to which the piezoelectric element is fixed, faces the piezoelectric element through a space, and supports two opposing sides of the second surface of the second substrate.
    The pulse wave detection device according to any one of claims 1 to 8, wherein the space is filled with a material having an elastic modulus lower than that of the case.
  11.  前記センサは、
     前記第2基板の第2面の対向する2辺に設けられた絶縁部と、
     前記ケースの内壁、内部又は外壁のいずれか1つに形成され、前記絶縁部と電気的に接続する導電材と
    を備える請求項10に記載の脈波検出装置。
    The sensor is
    Insulating portions provided on two opposite sides of the second surface of the second substrate, and
    The pulse wave detection device according to claim 10, further comprising a conductive material formed on any one of the inner wall, the inner wall, and the outer wall of the case and electrically connected to the insulating portion.
  12.  前記バンドは、ゴム、ウレタン又はシリコンのいずれかで形成されている請求項1乃至11のいずれか1項に記載の脈波検出装置。
     
    The pulse wave detection device according to any one of claims 1 to 11, wherein the band is made of any of rubber, urethane, or silicon.
PCT/JP2020/013676 2020-03-26 2020-03-26 Pulse wave detection device WO2021192142A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012120772A (en) * 2010-12-10 2012-06-28 Rohm Co Ltd Pulse wave sensor
US20140349257A1 (en) * 2013-05-23 2014-11-27 Robert A. Connor Smart Watch and Food Utensil for Monitoring Food Consumption
WO2015159692A1 (en) * 2014-04-14 2015-10-22 株式会社村田製作所 Pulse wave propagation time measurement device and biological state estimation device
JP2017514657A (en) * 2014-05-01 2017-06-08 ニューミトラ インク.Neumitra Inc. Wearable electronics
JP2018509943A (en) * 2014-12-16 2018-04-12 マイクロソフト テクノロジー ライセンシング,エルエルシー Optical communication with optical sensors

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012120772A (en) * 2010-12-10 2012-06-28 Rohm Co Ltd Pulse wave sensor
US20140349257A1 (en) * 2013-05-23 2014-11-27 Robert A. Connor Smart Watch and Food Utensil for Monitoring Food Consumption
WO2015159692A1 (en) * 2014-04-14 2015-10-22 株式会社村田製作所 Pulse wave propagation time measurement device and biological state estimation device
JP2017514657A (en) * 2014-05-01 2017-06-08 ニューミトラ インク.Neumitra Inc. Wearable electronics
JP2018509943A (en) * 2014-12-16 2018-04-12 マイクロソフト テクノロジー ライセンシング,エルエルシー Optical communication with optical sensors

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