WO2021189818A1 - 一种微通道内流动工质的测温装置及保温层厚度计算方法 - Google Patents

一种微通道内流动工质的测温装置及保温层厚度计算方法 Download PDF

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WO2021189818A1
WO2021189818A1 PCT/CN2020/120947 CN2020120947W WO2021189818A1 WO 2021189818 A1 WO2021189818 A1 WO 2021189818A1 CN 2020120947 W CN2020120947 W CN 2020120947W WO 2021189818 A1 WO2021189818 A1 WO 2021189818A1
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microchannel
insulation layer
temperature
thermocouple
thermal insulation
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French (fr)
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刘纳
孟祥丰
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Qingdao University of Technology
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Qingdao University of Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass

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  • the invention belongs to the field of physical measurement, and specifically relates to a temperature measuring device for a flowing working fluid in a microchannel and a method for calculating the thickness of an insulating layer.
  • Micro-channel heat exchanger refers to a heat exchanger with a channel equivalent diameter of 10-2000 ⁇ m.
  • micro-channel heat exchangers have a broad range of applications in the fields of chip heat dissipation, aerospace, HVAC, fuel cells, natural gas liquefaction, etc. due to their high heat exchange efficiency, compact structure, and easy modularization. Application prospects.
  • Non-contact temperature measurement methods such as infrared temperature measurement, whose measurement accuracy cannot meet the requirements
  • the purpose of the present invention is to provide a temperature measuring device for a flowing working fluid in a microchannel and a method for calculating the thickness of an insulating layer. problem.
  • the technical solution of the present invention provides a temperature measuring device for flowing working fluid in a microchannel, including:
  • the thermal insulation layer arranged on the outer side of the microchannel measurement section
  • the outer protective layer covering the outer side of the thermal insulation layer
  • Thermocouple used to measure the temperature of the measurement section of the microchannel
  • thermocouple the temperature display terminal connected to the thermocouple
  • thermocouple is arranged between the thermal insulation layer and the microchannel, and the thermocouple is attached to the surface of the temperature measurement section of the microchannel; the inner side of the thermal insulation layer is closely attached to the microchannel, and the thermocouple is completely wrapped in the thermal insulation Layer
  • the outer diameter d2 of the thermal insulation layer is greater than or equal to the length L of the temperature measuring section of the microchannel.
  • the thermal insulation layer is made of nano-silica aerogel; the thermal insulation layer is cylindrical.
  • thermocouple is welded to the microchannel temperature measuring section; the thermocouple is directly in contact with the thermal insulation layer.
  • thermocouple is fixed to the temperature measurement section of the microchannel through a thermocouple patch; the outer layer of the thermocouple is covered with a thermocouple patch; the outside of the thermocouple patch is covered with an insulation layer .
  • the technical solution of the present invention also provides a method for calculating the thickness of the insulation layer, which includes the following steps:
  • the thickness of the thermal insulation layer is determined according to the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel.
  • the heat dissipation per unit length is composed of the sum of the convective heat exchange and the radiative heat exchange between the outer surface of the outer protective layer and the environment.
  • the difference ⁇ t between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel is calculated to be less than 0.5°C.
  • the outer surface of the microchannel is also the outer surface of the thermal insulation layer.
  • an insulating layer is used to compensate for the temperature loss caused by the heat dissipation of the microchannel, and the temperature of the flowing working fluid in the microchannel can be indirectly measured by measuring the outside of the microchannel, which solves the problem of the traditional temperature measurement method. The problem that the temperature measuring element cannot extend into the microchannel.
  • thermocouple with high measurement accuracy is used. Compared with non-contact temperature measurement methods such as infrared temperature measurement, the temperature measurement accuracy is high, and the requirement for temperature measurement accuracy in the microchannel heat exchange test is solved. .
  • the adopted temperature measurement method has no requirement on the material of the microchannel, has a wide application range, has a simple overall structure, low cost, and reliable performance.
  • Figure 1 is a perspective view of the present invention according to one or more embodiments
  • Figure 2 is a radial cross-sectional view of the present invention according to one or more embodiments
  • Figure 3 is an axial cross-sectional view of the present invention according to one or more embodiments
  • Fig. 4 is a graph of operating conditions according to one or more embodiments of the present invention.
  • Fig. 5 is an error diagram under an 85mm thick insulation layer according to one or more embodiments of the present invention.
  • the purpose of the present invention is to provide a temperature measuring device for the flowing working fluid in the microchannel and a method for calculating the thickness of the insulation layer, which can solve the current problems in the channel.
  • the temperature measurement method has insufficient problems, which will be described below in conjunction with the embodiments and the drawings of the specification.
  • a temperature measuring device for a flowing working fluid in a microchannel includes a thermocouple 5, an insulation layer 2 and an outer protective layer 3.
  • the thermocouple 5 is used for pasting Attached to the surface of the microchannel temperature measuring section 1, the thermal insulation layer 2 is wrapped on the outside of the microchannel temperature measurement section and the thermocouple 5, and the outer sheath 3 is wound on the outside of the thermal insulation layer 2; wherein, the outer diameter d2 of the thermal insulation layer 2 is greater than or equal to The length L of the temperature measuring section 1 of the microchannel.
  • the temperature measurement device of this embodiment is applied to measure the temperature of the flowing medium in the microchannel.
  • the heat is forcibly blocked in the thermal insulation layer 2 of the microchannel measurement section for indirect measurement.
  • the temperature of the flowing working fluid in the microchannel due to the physical properties of the microchannel, it can conduct heat quickly, so the pipe wall of the microchannel can be used as a heat-conducting element to guide the heat of the flowing working fluid inside the microchannel to the outside of the microchannel for measurement.
  • the temperature obtained in this way is less likely to destroy the flow state of the internal flowing working fluid than in the prior art, and the temperature measurement of the thermocouple 5 is more accurate than the infrared temperature measurement.
  • the temperature measurement system of the present invention does not require any personnel to participate.
  • the temperature can be obtained and output by the temperature measuring device in real time, which improves the timeliness of temperature detection.
  • multiple devices described in this embodiment can be set on the microchannel to detect the temperature at different locations and record these temperatures; After the fluid working fluid inside is replaced, the temperature at each detection point can be continuously detected, and these temperatures can be compared with the above-mentioned temperatures.
  • the use method can be performed through the server without manual judgment.
  • Figures 1 to 3 show the positional relationship between the thermal insulation layer 2, the thermocouple 5 and the thermocouple 5 patch 4.
  • the position of the thermocouple 5 is fixed.
  • the thermal insulation in this embodiment Layer 2 is cylindrical.
  • the central axis of the thermal insulation layer 2 coincides with the central axis of the microchannel; when a section of microchannel is equipped with multiple temperature measuring devices, multiple temperature measuring devices They are independent of each other to comply with the principle of rapid heat exchange in microchannels.
  • detection points a and b can be set at two different positions of the microchannel, and the distance between detection points a and b is greater than L, so that the liquid working medium is For heat loss after a certain distance, the parameters of the temperature measuring devices set at detection points a and b are exactly the same, and the measured temperatures are recorded separately.
  • the detection points a and b can be set at two different positions of the microchannel, and the distance between the detection points a and b is greater than L, so that the liquid After a certain distance, the temperature measurement device parameters set at detection points a and b are exactly the same. After using the A mobile working fluid for testing, record the measured temperatures at points a and b respectively; Then replace the B flowing working fluid to perform a yes test, and record the measured temperatures at points a and b respectively.
  • the thermal insulation layer 2 in this embodiment is made of nano-silica aerogel and nano-silica aerogel.
  • the composition of nano-silica aerogel is Similar to glass, it begins to melt above 1200 degrees Celsius.
  • the thermal conductivity and refractive index are also very low, so the silica aerogel material used in this embodiment can ensure the heat preservation effect.
  • the aerogel material when used for heat preservation, it is necessary to customize the shape of the silica aerogel to be cylindrical.
  • silica aerogel when silica aerogel is used as a thermal insulation material, it essentially relies on its internal nano-grid-like cavities to prevent thermal insulation, so it maintains its original state and can ensure the physical properties of the internal voids. Shape to avoid affecting its thermal insulation performance.
  • the thermocouple 5 is welded or adhered to the surface of the temperature measuring section 1 of the microchannel.
  • the microchannel is made of non-metallic material.
  • the metal microchannel is attached by spot welding; regardless of the attachment method, in order to achieve measurement accuracy, it is required that the thermoelectrode must be firmly attached to the outer surface of the microchannel.
  • thermocouple 5 converts the temperature signal into a thermoelectromotive force signal, which is converted into the temperature of the measured medium through an electrical instrument (secondary instrument) or a server, so the thermocouple 5 in this embodiment is also connected to an electrical instrument or server , To visually display and record the temperature.
  • thermocouple 5 in this embodiment needs to be close to the surface of the microchannel, so it uses a fixtureless thermocouple 5 to be close to the surface of the microchannel.
  • the thermocouple 5 is connected to an electrical instrument or server through a lead wire.
  • thermocouple 5 is located between the insulation layer 2 and the microchannel. Therefore, the lead wires need to be led out from the end of the insulation layer 2 or pass through the insulation layer 2.
  • the outer protective layer 3 adopts aluminum foil tape, which can reflect the heat radiated by the thermal insulation layer 2.
  • thermocouple 5 adopts one or more of S, B, E, K, R, J, and T models.
  • This embodiment discloses a method for calculating the thickness of the thermal insulation layer 2, which includes the following steps:
  • the thickness of the thermal insulation layer 2 is determined according to the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel.
  • the heat dissipation per unit length is composed of the sum of the convective heat exchange and radiation heat exchange between the outer surface of the outer protective layer 3 and the environment.
  • the difference ⁇ t between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel is calculated to be less than 0.5°C.
  • the outer surface of the microchannel is also the outer surface of the thermal insulation layer 2.
  • the heat dissipation per unit length is composed of the sum of the convective heat exchange and radiation heat exchange between the outer surface of the outer protective layer 3 and the environment.
  • Q is the heat exchanged between the solid surface and the fluid per unit area in a unit time, called the heat flux density, in W/m 2 ;
  • t w and t fa are the temperature of solid surface and fluid, respectively, in K;
  • ⁇ d 3 is the wall surface area per unit length, in m 2 ;
  • Q is the heat transfer amount on area A per unit time, unit W;
  • h 0 is called the surface convective heat transfer coefficient, the unit is W/(m 2 ⁇ K).
  • C 0 is the mass specific heat of the flowing medium in the barrel
  • is the emissivity
  • d 1 is the outer diameter of the microchannel
  • d 2 is the outer diameter of the insulation layer 2
  • d 3 is the outer diameter of the outer sheath 3
  • h i is the convective heat transfer coefficient between the fluid in the microchannel and the wall
  • d i is the inner diameter of the microchannel
  • is the thermal conductivity of each layer of material.
  • the outer surface temperature t w1 of the microchannel can be calculated by the following formula.
  • the size of ⁇ t is mainly determined by the thickness of the insulation layer 2 ⁇ 2, and the thickness of the insulation layer 2 is calculated as follows:
  • ⁇ t By adjusting the thickness of the thermal insulation layer 2, ⁇ t can be reduced to an acceptable range.
  • the measurement error of the thermocouple 5 for temperature measurement is 0.5 °C, so reducing ⁇ t to below 0.5 °C can meet the accuracy requirements .
  • a micro-channel aluminum tube with an inner diameter of 0.5 mm is taken as an example, and the measurement errors of several typical working conditions as shown in Fig. 4 are calculated as a function of the insulation thickness, and under the insulation thickness of 85 mm, the different fluids shown in Fig. 5 Temperature measurement error. It can be seen that the temperature measurement method of the present invention can have higher measurement accuracy in a larger temperature measurement range.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analyzing Materials Using Thermal Means (AREA)

Abstract

一种微通道内流动工质的测温装置,包括设置于微通道测量段(1)外侧的保温层(2);包覆于保温层(2)外侧的外护层(3);用于测量微通道测量段(1)温度的热电偶(5);以及,连接于热电偶(5)的温度显示终端;其中,热电偶(5)设于保温层(2)和微通道之间,热电偶(5)贴附在微通道测温段(1)表面;保温层(2)的内侧与微通道紧密贴合,且热电偶(5)完全包裹于保温层(2)内;保温层(2)的外径d2大于等于微通道测温段(1)的长度L。可以解决目前对微通道内进行测温的方法存在不足的问题。还公开了保温层(2)厚度计算方法。

Description

一种微通道内流动工质的测温装置及保温层厚度计算方法 技术领域
本发明属于物理测量领域,具体的,涉及一种微通道内流动工质的测温装置及保温层厚度计算方法。
背景技术
这里的陈述仅提供与本发明相关的背景技术,而不必然地构成现有技术。
微通道换热器系指通道当量直径在10~2000μm的换热器。作为一种新兴的换热技术,微通道换热器凭借其换热高效、结构紧凑、便于实现模块化等优点,在芯片散热、航空航天、暖通空调、燃料电池、天然气液化等领域有广阔的应用前景。
但是,目前微通道换热器的研发和应用还存在诸多问题,尚需要进行大量的微通道流动、换热的基础性研究。在基础试验研究中,通道内工质温度参数测量的准确性是决定试验成败的关键。受通道尺寸的限制,传统的测温方式无法满足微通道内工质温度的测量,主要体现在以下几点:
(1)传统测温方式需要将测温元件伸入到流体中,这会对工质的流态产生扰动。
(2)红外测温等非接触测温方式,其测量精度无法满足需求;
(3)对于微通道试验,受通道直径限制,测温元件难以伸入到流体中。
发明内容
针对现有技术存在的不足,本发明的目的是提供一种微通道内流动工质的测温装置及保温层厚度计算方法,该装置可以解决目前对为通道内进行测温的方法存在不足的问题。
为了实现上述目的,本发明是通过如下的技术方案来实现:
第一方面,本发明的技术方案提供了一微通道内流动工质的测温装置,包括,
设置于微通道测量段外侧的保温层;
包覆于保温层外侧的外护层;
用于测量微通道测量段温度的热电偶;
以及,连接于热电偶的温度显示终端;
其中,热电偶设于保温层和微通道之间,热电偶贴附在微通道测温段表面;所述保温层的内侧与微通道紧密贴合,且所述热电偶完全包裹于所述保温层内;
所述保温层的外径d2大于等于微通道测温段的长度L。
作为进一步的技术方案,所述保温层采用纳米二氧化硅气凝胶材质;所述保温层呈圆柱形。
作为进一步的技术方案,所述热电偶焊接于所述微通道测温段;所述热电偶直接与所述保温层接触。
作为进一步的技术方案,所述热电偶通过热电偶贴片粘接固定于所述微通道测温段;所述热电偶的外层包覆热电偶贴片;热电偶贴片外侧包覆保温层。
第二方面,本发明的技术方案还提供了一种保温层厚度计算方法,包括以下步骤:
通过计算,确定微通道测温段的单位长度散热量;
通过测量,确定微通道外表面温度;
通过计算,确定微通道内表面温度;
根据微通道内流体温度与微通道外表面温度的差值确定保温层的厚度。
作为进一步的技术方案,在确定微通道测温段的单位长度散热量时,单位长度散热量由外护层外表面与环境的对流换热和辐射换热之和构成。
作为进一步的技术方案,计算微通道内流体温度与微通道外表面温度的差值Δt小于0.5℃。
作为进一步的技术方案,所述微通道外表面也即保温层外表面。
上述本发明的实施例的有益效果如下:
1)本发明提供的技术方案中,采用保温层弥补微通道散热造成的温度损失,通过对微通道外侧进行测量即可间接测量微通道内的流动工质的温度,解决了传统测温方法中测温元件无法伸入到微通道内的难题。
2)本发明提供的技术方案中,采用测量精度高的热电偶,与红外测温等非接触测温方法相比,测温精度高,解决了微通道换热试验中对测温精度的需求。
3)本发明提供的技术方案中,所采用的测温方法对微通道材质无要求,适用范围广,整体结构简单,成本低,性能可靠。
附图说明
构成本发明的一部分的说明书附图用来提供对本发明的进一步理解,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。
图1是本发明根据一个或多个实施方式的透视图,
图2是本发明根据一个或多个实施方式的径向剖面图,
图3是本发明根据一个或多个实施方式的轴向剖面图,
图4是本发明根据一个或多个实施方式的工况曲线图,
图5是本发明根据一个或多个实施方式的85mm厚保温层下的误差图。
图中:1-微通道测温段,2-保温层,3-外护层,4-热电偶贴片,5-热电偶。
为显示各部位位置而夸大了互相间间距或尺寸,示意图仅作示意使用。
具体实施方式
应该指出,以下详细说明都是例示性的,旨在对本发明提供进一步的说明。除非另有指明,本发明使用的所有技术和科学术语具有与本发明所属技术领域的普通技术人员通常理解的相同含义。
需要注意的是,这里所使用的术语仅是为了描述具体实施方式,而非意图限制根据本发明的示例性实施方式。如在这里所使用的,除非本发明另外明确指出,否则单数形式也意图包括复数形式,此外,还应当理解的是,当在本说明书中使用术语“包含”和/或“包括”时,其指明存在特征、步骤、操作、器件、组件和/或它们的组合;
为了方便叙述,本发明中如果出现“上”、“下”、“左”“右”字样,仅表示与附图本身的上、下、左、右方向一致,并不对结构起限定作用,仅仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的设备或元件必须具有特定的方位,以特定的方位构造和操作,因此不能理解为对本发明的限制。
术语解释部分:本发明中的术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或为一体;可以是机械连接,也可以是电连接,可以是直接连接,也可以是通过中间媒介间接相连,可以是两个元件内部连接,或者两个元件的相互作用关系,对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明的具体含义。
正如背景技术所介绍的,针对现有技术存在的不足,本发明的目的是提供一种微通道内流动工质的测温装置及保温层厚度计算方法,该装置可以解决目前对 为通道内进行测温的方法存在不足的问题,以下结合实施例和说明书附图进行说明。
实施例1
本发明的一种典型的实施方式中,如图1所示,一种微通道内流动工质的测温装置,包括热电偶5、保温层2和外护层3,热电偶5用于贴附在微通道测温段1表面,保温层2包裹在微通道测温段和热电偶5外侧,外护层3缠绕在保温层2外侧;其中,所述保温层2的外径d2大于等于微通道测温段1的长度L。
本实施例的温度测量装置应用于测量微通道内流动介质的温度,通过在微通道测量段上设置保温层2,强制将热量封堵在的微通道测量段的保温层2内,以间接测量微通道内的流动工质的温度;由于微通道的物理性质,其可以快速导热,因此微通道的管道壁可以作为导热元件,将其内部的流动工质的热量引到微通道外部进行测量,这样得到的温度要比现有技术不易破环其内部流动工质的流动状态,而且热电偶5测温相较于的红外线测温更为精确,此外,本发明温度测量系统无需任何人员参与,可实时由测温装置获取温度并输出,提高了温度检测的及时性。
本实施例在具体使用时,在微通道开始测量温度时,可通过在微通道上设置多个本实施例所述的装置,在不同的地点检测温度,并将这些温度记录;然后在微通道内的流动工质更换后,还可不断检测每个检测点处的温度,并将这些温度与上述温度相比较。所述的使用方法可以通过服务器进行,无需人工判断。
图1~图3示出了保温层2、热电偶5与热电偶5贴片4间的位置关系,为了便于保温,热电偶5的位置是固定不变的,另外,本实施例中的保温层2呈圆柱形,为了保证保温层2能够紧密贴合微通道,保温层2的中轴线与微通道的中轴线重合;当一段微通道安装多个的测温装置时,多个测温装置分别独立,以符合微通道快速换热的原理。
例如,为了判断同一微通道上不同位置的温度的不同,可在该微通道的两个不同位置设置检测点a和b,检测点a和b之间的距离大于L,以使液态工质在经过一定的距离之后的产生热量损耗,检测点a和b处设置的测温装置参数完全相同,对其测量的温度分别记录。
例如,为了判断同一微通道内不同流动工质的温度的不同,可在该微通道 的两个不同位置设置检测点a和b,检测点a和b之间的距离大于L,以使液态工质在经过一定的距离之后的产生热量损耗,检测点a和b处设置的测温装置参数完全相同,使用A流动工质进行测试后,对其测量的a、b两点的温度分别记录;然后更换B流动工质进行是测试,并对其测量的a、b两点的温度分别记录。
更加详细的是,本实施例中的保温层2采用纳米二氧化硅气凝胶材质,纳米二氧化硅气凝胶材质,本领域技术人员可以理解的是,纳米二氧化硅气凝胶的成分与玻璃相似,其在1200摄氏度以上开始融化。导热性和折射率也很低,因此本实施例中使用二氧化硅气凝胶材质能够的确保保温效果。
更进一步的,在使用气凝胶材料进行保温时,需要定制二氧化硅气凝胶的外形形状为圆柱形。本领域技术人员可以理解的是,二氧化硅气凝胶作为保温材料使用时,本质上依靠其内部纳米网格状空洞进阻隔热量,因此保持其原始状态,可以的保证其内部的空洞的物理形态,避免影响其保温性能。
根据微通道的不同材质,所述热电偶5焊接或粘接于微通道测温段1表面,本实施例中,微通道采用的是非金属材质微通道,可采用耐高温胶带粘贴方式,在其他实施例中,对于金属材质微通道,采用点焊方式贴附;无论何种贴附方式,为达到测量精度,都要求热电极必须牢固贴合在微通道外表面。
更进一步的,热电偶5把温度信号转换成热电动势信号,通过电气仪表(二次仪表)或者服务器转换成被测介质的温度,因此本实施例中的热电偶5还连接于电气仪表或者服务器,以直观显示、记录温度。
可以理解的是,本实施例中的热电偶5需要紧贴微通道的表面,因此其使用无固定装置式热电偶5紧贴于微通道表面。热电偶5通过引线连接电气仪表或服务器。
由于热电偶5位于保温层2和微通道之间。因此引线需要由保温层2的端部引出,或者穿过保温层2。
所述外护层3采用铝箔胶带,其可以反射的保温层2发散的热量。
所述热电偶5采用S、B、E、K、R、J、T型号中的一种或几种。
实施例2
本实施例公开了一种保温层2厚度计算方法,包括以下步骤:
通过计算,确定微通道测温段1的单位长度散热量;
通过测量,确定微通道外表面温度;
通过计算,确定微通道内表面温度;
根据微通道内流体温度与微通道外表面温度的差值确定保温层2的厚度。
在确定微通道测温段1的单位长度散热量时,单位长度散热量由外护层3外表面与环境的对流换热和辐射换热之和构成。
计算微通道内流体温度与微通道外表面温度的差值Δt小于0.5℃。
所述微通道外表面也即保温层2外表面。
下面以一个具体的计算过程阐述上述计算过程:
(1)对于如图1所示的圆筒形结构,其单位长度散热量由外护层3外表面与环境的对流换热和辐射换热之和构成。
Figure PCTCN2020120947-appb-000001
式中,Q为单位面积的固体表面与流体之间在单位时间内交换的热量,称作热流密度,单位W/m 2
t w、t fa分别为固体表面和流体的温度,单位K;
πd 3为单位长度壁面面积,单位m 2
Q为单位时间内面积A上的传热热量,单位W;
h 0称为表面对流传热系数,单位W/(m 2·K)。
C 0为桶内流动介质质量比热;
ε为发射率;
(2)对于实施例1中的圆筒结构,其传热量又可以由下式计算得到。
Figure PCTCN2020120947-appb-000002
d 1为微通道外径,d 2为保温层2外径,d 3为外护层3外径,h i为微通道内流体与壁面之间的对流换热系数,d i为微通道内径,λ为各层材料的导热系数。
(3)对于微通道外表面温度t w1,可由下式计算得到。
Figure PCTCN2020120947-appb-000003
(4)联立上述(1)、(2)、(3)式,可计算得到微通道内流体温度与微 通道外表面温度的差值:
Δt=t fi-t w1
(5)对于一个确定的实施例,Δt的大小主要由保温层2厚度δ2决定,保温层2厚度的计算如下:
Figure PCTCN2020120947-appb-000004
通过调整保温层2厚度,可使Δt减小至可接受范围内,对于常规的试验装置,测温用热电偶5测量误差为0.5℃,因此使Δt减小至0.5℃以下即可满足精度需求。
本实施例以内径0.5mm微通道铝管为例,计算得到如图4所示的几种典型工况测量误差随保温厚度的变化曲线,以及85mm保温厚度下,如图5所示的不同流体温度的测量误差。可以看出,本发明的测温方法可以在较大的测温范围内具有较高的测量精度。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。

Claims (10)

  1. 一种微通道内流动工质的测温装置,其特征在于,包括,
    设置于微通道测量段外侧的保温层;
    包覆于保温层外侧的外护层;
    用于测量微通道测量段温度的热电偶;
    以及,连接于热电偶的温度显示终端;
    其中,热电偶设于保温层和微通道之间,热电偶贴附在微通道测温段表面;所述保温层的内侧与微通道紧密贴合,且所述热电偶完全包裹于所述保温层内;
    所述保温层的外径d2大于等于微通道测温段的长度L。
  2. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述保温层采用纳米二氧化硅气凝胶材质;所述保温层呈圆柱形。
  3. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述热电偶焊接于所述微通道测温段;所述热电偶直接与所述保温层接触。
  4. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述热电偶通过热电偶贴片粘接固定于所述微通道测温段;所述热电偶的外侧包覆热电偶贴片,热电偶贴片外侧包覆保温层。
  5. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述热电偶包括多个,多个热电偶分布于微通道测温段表面。
  6. 根据权利要求5所述的一种微通道内流动工质的测温装置,其特征在于,所述保温层包括多个,每个热电偶的外侧均包覆一个保温层。
  7. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述外护层采用铝箔胶带。
  8. 一种保温层厚度计算方法,其特征在于,包括以下步骤:
    通过计算,确定微通道测温段的单位长度散热量;
    通过测量,确定微通道外表面温度;
    通过计算,确定微通道内表面温度;
    根据保温层外表面温度与微通道外表面温度的差值确定保温层的厚度。
  9. 如权利要求8所述的一种保温层厚度计算方法,其特征在于,在确定微通道测温段的单位长度散热量时,单位长度散热量由外护层外表面与环境的对流换热和辐射换热之和构成。
  10. 根据权利要求8所述的一种保温层厚度计算方法,其特征在于,所述保温层外表面温度与微通道外表面温度的差值Δt小于0.5℃。
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