WO2021186687A1 - Mobile terminal - Google Patents

Mobile terminal Download PDF

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Publication number
WO2021186687A1
WO2021186687A1 PCT/JP2020/012376 JP2020012376W WO2021186687A1 WO 2021186687 A1 WO2021186687 A1 WO 2021186687A1 JP 2020012376 W JP2020012376 W JP 2020012376W WO 2021186687 A1 WO2021186687 A1 WO 2021186687A1
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WO
WIPO (PCT)
Prior art keywords
patch antenna
antenna module
communication
mobile terminal
metal structure
Prior art date
Application number
PCT/JP2020/012376
Other languages
French (fr)
Japanese (ja)
Inventor
泰亮 渡邉
Original Assignee
Ｆｃｎｔ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｆｃｎｔ株式会社 filed Critical Ｆｃｎｔ株式会社
Priority to PCT/JP2020/012376 priority Critical patent/WO2021186687A1/en
Priority to JP2022507974A priority patent/JPWO2021186687A1/ja
Publication of WO2021186687A1 publication Critical patent/WO2021186687A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving

Definitions

  • the present invention relates to a mobile terminal.
  • Patent Document 1 describes an electronic device provided with a lightweight and highly rigid housing by covering at least a part of a joint portion between a metal frame main body and a reinforcing sheet metal with a resin material.
  • Patent Document 2 describes an electronic device that effectively utilizes a limited mounting space by using a peripheral conductive housing member provided on the outer peripheral portion of the housing as an antenna.
  • the amount of heat generated by the patch antenna module used for communication is extremely larger than before. Therefore, when a mobile terminal conforming to the 5G standard communicates, the patch antenna module generates heat within a limited mounting space, so that local heat generation tends to occur in the vicinity of the patch antenna module. Further, since the patch antenna module conforming to the 5G standard has high directivity, if the patch antenna module is provided in one place, the communication quality tends to deteriorate due to the positional relationship between the mobile terminal and the base station.
  • One aspect of the disclosed technology is to provide a mobile terminal capable of suppressing local heat generation while suppressing deterioration of communication quality due to the positional relationship with the base station.
  • the mobile terminal includes a side frame that surrounds the side surface of the mobile terminal, an internal plate-shaped metal structure in which wall portions facing the inner side surface of the side frame are erected at a plurality of locations, and the inner side surface and the wall portion.
  • the disclosed technology can suppress local heat generation while suppressing deterioration of communication quality due to the positional relationship with the base station.
  • FIG. 1 is a first diagram showing an example of a smartphone according to an embodiment.
  • FIG. 2 is a second diagram showing an example of a smartphone according to the embodiment.
  • FIG. 3 is a perspective view showing an example of an internal plate-shaped metal structure used in the smartphone according to the embodiment.
  • FIG. 4 is a perspective view of the patch antenna module used in the smartphone according to the embodiment.
  • FIG. 5 is an example of the end view of the line AA of FIG.
  • FIG. 6 is a diagram showing an example of the positional relationship between the patch antenna and the elastic member in the embodiment.
  • FIG. 7 is a diagram schematically showing the positional relationship between the patch antenna and the elastic member in the embodiment.
  • FIG. 8 is a diagram showing an example of the hardware configuration of the control board in the embodiment.
  • FIG. 9 is a first diagram schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment.
  • FIG. 10 is a second diagram schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment.
  • FIG. 11 is a third diagram schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment.
  • FIG. 12 is a diagram showing an example of a smartphone according to the first modification.
  • FIG. 13 is a first diagram illustrating a variation of the wall portion.
  • FIG. 14 is a second diagram illustrating variations of the wall portion.
  • FIG. 15 is a third diagram illustrating variations of the wall portion.
  • the configurations of the embodiments shown below are examples, and the disclosed technology is not limited to the configurations of the embodiments.
  • the mobile terminal according to the embodiment has, for example, the following configuration.
  • the mobile terminal according to this embodiment is The side frame that surrounds the side of the mobile terminal and An internal plate-shaped metal structure in which wall portions facing the inner side surface of the side frame are erected at a plurality of places, and A plurality of patch antenna modules that are arranged so as to be pressed against the wall portion by an elastic member at each of the inner surface surface and the wall portion and generate heat during communication.
  • a control unit for selecting a patch antenna module to be used for communication from the plurality of patch antenna modules is provided.
  • the mobile terminal according to the embodiment is a portable wireless communication device that can be carried by the user.
  • Examples of the portable wireless communication device include feature phones, smartphones, tablet computers, wearable computers, notebook computers and the like.
  • the mobile terminal according to the embodiment accommodates an internal plate-shaped metal structure in a housing.
  • the internal plate-shaped metal structure is, for example, a member formed of a material having high thermal conductivity such as metal in a plate shape.
  • the rigidity of the housing can be increased by supporting the housing from the inside by the internal plate-shaped metal structure housed in the housing.
  • the internal plate-shaped metal structure can also be used as a support member for an electronic circuit housed in the housing.
  • wall portions facing the inner side surface of the side frame are erected at a plurality of places.
  • the inner plate-shaped metal structure may be formed in a rectangular plate shape, and the wall portion may be arranged on each side of the inner plate-shaped metal structure forming a rectangle.
  • the patch antenna module includes a patch antenna and a control module that controls the transmission and reception of radio waves using the patch antenna.
  • the patch antenna module can execute communication conforming to 5G, for example.
  • the patch antenna module is arranged between the inner side surface and the wall portion with the patch antenna facing the inner side surface.
  • the patch antenna module arranged between the wall portion and the inner side surface of the housing is pressed against the wall portion by an elastic member.
  • the present mobile terminal can efficiently conduct the heat generated by the patch antenna module during communication to the internal plate-shaped metal structure via the wall portion.
  • the elastic member comes into contact with a portion of the patch antenna module in which the patch antenna is not provided. That is, it is preferable that no elastic member is interposed between the patch antenna and the inner surface surface. By not interposing the elastic member between the patch antenna and the inner surface, it is possible to prevent the communication performance of the patch antenna from deteriorating.
  • the control unit may switch, for example, the patch antenna module used for communication at predetermined intervals.
  • the mobile terminal is further equipped with a sensor for measuring the temperature of each of the plurality of patch antenna modules, and the control unit selects the patch antenna module to be used for communication based on the temperature of each of the plurality of patch antenna modules detected by the sensor. May be good.
  • FIG. 1 and 2 are diagrams showing an example of a smartphone according to the embodiment.
  • FIG. 1 is a plan view illustrating a state in which the rear cover 16 of the smartphone 1 is removed.
  • FIG. 2 is an exploded perspective view of the smartphone 1.
  • the smartphone 1 includes a front cover 11, an internal plate-shaped metal structure 12, three patch antenna modules 13a, 13b, 13c, an elastic member 14, a control board 15, and a rear cover 16.
  • the patch antenna modules 13a, 13b, and 13c are not distinguished, they are referred to as the patch antenna module 13.
  • the smartphone 1 is a wireless communication device having a housing formed in a plate shape as a whole.
  • the front cover 11 and the rear cover 16 are housings for the smartphone 1.
  • the front cover 11 includes a side cover 111 that covers the side surface of the smartphone 1.
  • a display, a speaker, and a microphone are arranged on the front cover 11.
  • the side cover 111 is an example of a “side frame”.
  • the internal plate-shaped metal structure 12 is a member formed of a metal having high thermal conductivity in a plate shape.
  • the inner plate-shaped metal structure 12 is housed in a housing formed by the front cover 11 and the rear cover 16. That is, the internal plate-shaped metal structure 12 is arranged between the front cover 11 and the rear cover 16 in the thickness direction of the smartphone 1.
  • FIG. 3 is a perspective view showing an example of an internal plate-shaped metal structure used in the smartphone according to the embodiment.
  • the internal plate-shaped metal structure 12 is formed in the shape of a rectangular plate. On three of the four sides forming the rectangle of the inner plate-shaped metal structure 12, the wall portion 121 is erected so as to face the inner wall surface 112 of the side cover 111.
  • the wall portions 121 erected in this way have different normal directions of the surfaces formed by the wall portions 121.
  • the wall portion 121 may be formed by bending a part of the internal plate-shaped metal structure 12.
  • the internal plate-shaped metal structure 12 is formed in a rectangular shape in FIG. 1, it may be formed in another shape such as a square or a pentagon.
  • the inner plate-shaped metal structure 12 is an example of the “inner plate-shaped metal structure”.
  • the inner wall surface 112 is an example of the “inner side surface of the side surface frame”.
  • the wall portion 121 is an example of a “wall portion”.
  • the patch antenna module 13 transmits and receives radio waves by the patch antenna.
  • FIG. 4 is a perspective view of the patch antenna module used in the smartphone according to the embodiment.
  • the patch antenna module 13 is a module in which an antenna module 131 and a control module 133 are laminated.
  • the control module 133 is an integrated circuit that controls the transmission and reception of radio waves using the patch antenna 132.
  • a plurality of patch antennas 132 are provided on the antenna mounting surface 131a of the antenna module 131.
  • the plurality of patch antennas 132 are provided apart from each other on the antenna mounting surface 131a.
  • the patch antenna module 13 is arranged between the wall portion 121 and the inner wall surface 112 with the antenna mounting surface 131a facing the inner wall surface 112 of the side cover 111.
  • the patch antenna module 13 is an example of a “patch antenna module”.
  • the region where the patch antenna 132 is mounted on the antenna mounting surface 131a is an example of the “first region”.
  • the region on the antenna mounting surface 131a where the patch antenna 132 is not mounted is an example of the “second region”.
  • the elastic member 14 is a member having an elastic force that presses the patch antenna module 13 against the wall portion 121.
  • the elastic member 14 preferably has radio wave transmission.
  • grade MS-40P of PORON (registered trademark) manufactured by Rogers INOAC Corporation can be adopted.
  • the elastic member 14 is an example of an “elastic member”.
  • FIG. 5 is an example of the end view of the AA line of FIG.
  • the elastic member 14 is provided between the inner wall surface 112 and the patch antenna module 13 in a crushed state.
  • the elastic member 14 can press the patch antenna module 13 toward the wall portion 121 by the elastic force.
  • the heat generated by the patch antenna module 13 can be efficiently conducted to the internal plate-shaped metal structure 12 via the wall portion 121.
  • FIG. 6 is a diagram showing an example of the positional relationship between the patch antenna and the elastic member in the embodiment.
  • FIG. 6 is a view seen from the side surface of the patch antenna module 13 provided with the patch antenna 132.
  • the elastic member 14 is preferably provided so as to press the portion of the patch antenna module 13 where the patch antenna 132 is not provided.
  • FIG. 7 is a diagram schematically showing the positional relationship between the patch antenna and the elastic member in the embodiment.
  • the position of the patch antenna 132 which is difficult to see visually in a plan view, is also shown by a dotted line.
  • the elastic member 14 is provided so as to press a portion where the patch antenna 132 is not provided.
  • the control board 15 is a board provided with a Central Processing Unit (CPU) and various memories.
  • FIG. 8 is a diagram showing an example of the hardware configuration of the control board in the embodiment.
  • the control board 15 includes a CPU 101, a main storage unit 102, an auxiliary storage unit 103, a communication unit 104, and a connection bus B1.
  • the CPU 101, the main storage unit 102, the auxiliary storage unit 103, and the communication unit 104 are connected to each other by the connection bus B1.
  • the CPU 101 is also called a microprocessor unit (MPU) or a processor. At least a part of the processing executed by the CPU 101 may be performed by a processor other than the CPU 101. Further, at least a part of the processing executed by the CPU 101 may be executed by an integrated circuit (IC) or another digital circuit.
  • the integrated circuit includes a Large Scale Integrated circuit (LSI), an Application Special Integrated Circuit (ASIC), and a programmable logic device (PLD). PLD includes, for example, Field-Programmable Gate Array (FPGA).
  • the CPU 101 may be a combination of a processor and an integrated circuit.
  • the combination is called, for example, a microcontroller unit (MCU), a system-on-a-chip (SoC), a system LSI, a chipset, or the like.
  • MCU microcontroller unit
  • SoC system-on-a-chip
  • LSI system LSI
  • chipset chipset
  • the CPU 101 expands the program stored in the auxiliary storage unit 103 into the work area of the main storage unit 102, and controls peripheral devices through the execution of the program. As a result, the smartphone 1 can execute a process that meets a predetermined purpose.
  • the main storage unit 102 and the auxiliary storage unit 103 are recording media that can be read by the smartphone 1.
  • the CPU 101 is an example of a “control unit”.
  • the main storage unit 102 is exemplified as a storage unit that is directly accessed from the CPU 101.
  • the main storage unit 102 includes a Random Access Memory (RAM) and a Read Only Memory (ROM).
  • RAM Random Access Memory
  • ROM Read Only Memory
  • the auxiliary storage unit 103 stores various programs and various data in a literacy recording medium.
  • the auxiliary storage unit 103 is also called an external storage device.
  • the auxiliary storage unit 103 stores an operating system (Operating System, OS), various programs, various tables, and the like.
  • the OS includes a communication interface program that exchanges data with an external device or the like connected via the communication unit 104.
  • the auxiliary storage unit 103 is, for example, an Erasable Programmable ROM (EPROM), a solid state drive (Solid State Drive, SSD), a hard disk drive (Hard Disk Drive, HDD), or the like.
  • EPROM Erasable Programmable ROM
  • SSD Solid State Drive
  • HDD Hard Disk Drive
  • the communication unit 104 uses, for example, the patch antenna module 13 to communicate with a base station and other mobile terminals.
  • the CPU 101 selects the patch antenna module 13 used for communication from the plurality of patch antenna modules 13.
  • the communication unit 104 communicates using the patch antenna module 13 selected by the CPU 101.
  • the CPU 101 may switch, for example, a plurality of patch antenna modules 13 at predetermined time intervals.
  • Information indicating a predetermined time may be stored in, for example, the auxiliary storage unit 103.
  • FIGS. 9 to 11 are diagrams schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment.
  • 9 to 11 show a state in which the control board 15 and the rear cover 16 of the smartphone 1 are removed.
  • the conduction of heat from the patch antenna module 13 to the internal plate-shaped metal structure 12 is schematically shown by arrows.
  • FIG. 11 illustrates a case where the CPU 101 selects the patch antenna module 13c as the patch antenna module 13 used for communication.
  • the CPU 101 selects the patch antenna module 13 used for communication in the order of the patch antenna module 13a, the patch antenna module 13b, and the patch antenna module 13c.
  • FIG. 9 illustrates a case where the CPU 101 selects the patch antenna module 13a as the patch antenna module 13 used for communication.
  • the patch antenna module 13a generates heat by executing communication, and the heat is conducted to the internal plate-shaped metal structure 12.
  • FIG. 10 illustrates a case where the CPU 101 selects the patch antenna module 13b as the patch antenna module 13 used for communication.
  • the CPU 101 selects the patch antenna module 13b as the patch antenna module 13 to be used for the communication next.
  • the CPU 101 starts the communication by the patch antenna module 13b and stops the communication by the patch antenna module 13a.
  • the patch antenna module 13b generates heat by executing communication, and the heat is conducted to the internal plate-shaped metal structure 12.
  • the patch antenna module 13a in which communication is stopped heat generation is suppressed, and the temperature of the internal plate-shaped metal structure 12 in the vicinity of the patch antenna module 13a is lowered.
  • the decrease in temperature is schematically indicated by a dotted arrow.
  • FIG. 11 illustrates a case where the CPU 101 selects the patch antenna module 13c as the patch antenna module 13 used for communication.
  • the CPU 101 selects the patch antenna module 13c as the patch antenna module 13 to be used for communication next.
  • the CPU 101 starts the communication by the patch antenna module 13c and stops the communication by the patch antenna module 13b.
  • the patch antenna module 13c generates heat by executing communication, and the heat is conducted to the internal plate-shaped metal structure 12.
  • the heat generated by the patch antenna module 13b that has stopped communication is reduced, and the temperature of the internal plate-shaped metal structure 12 in the vicinity of the patch antenna module 13b is lowered.
  • the lowered temperature is schematically indicated by a dotted arrow.
  • the patch antenna module 13 conforming to the 5G standard generates a larger amount of heat during communication than the antenna module conforming to the standard of the 4th generation mobile communication system (4G) or earlier. Therefore, when one patch antenna module 13 is continuously used for long-term communication, the temperature in the vicinity of the patch antenna module 13 rises locally. As a result, there is a risk of causing discomfort to the user who uses the smartphone 1. In the present embodiment, local heat generation can be suppressed by selecting the patch antenna module 13 used for communication from the plurality of patch antenna modules 13.
  • the patch antenna module 13 used for communication is switched at predetermined time intervals.
  • the first modification a configuration in which the temperature of the patch antenna module 13 is measured and the patch antenna module 13 having a low temperature is selected as the patch antenna module 13 used for communication will be described.
  • the components common to the embodiments are designated by the same reference numerals, and the description thereof will be omitted.
  • the first modification will be described with reference to the drawings.
  • FIG. 12 is a diagram showing an example of a smartphone according to the first modification.
  • FIG. 12 illustrates a state in which the rear cover 16 of the smartphone 1a is removed.
  • the temperature sensor 17a measures the temperature of the patch antenna module 13a and notifies the CPU 101 of the measured temperature.
  • the temperature sensor 17b measures the temperature of the patch antenna module 13b and notifies the CPU 101 of the measured temperature.
  • the temperature sensor 17c measures the temperature of the patch antenna module 13c and notifies the CPU 101 of the measured temperature.
  • the temperature sensor 17 is an example of a “sensor”.
  • the CPU 101 may select the patch antenna module 13 having the lowest temperature among the patch antenna modules 13 as the patch antenna module 13 used for communication. Then, when the CPU 101 detects that the temperature of the selected patch antenna module 13 has become higher than the threshold value, the CPU 101 may select another patch antenna module 13 as the patch antenna module 13 used for communication.
  • the threshold value may be determined at the time of design, for example, based on the operational stability of the patch antenna module 13 due to heat generation, the discomfort given to the user, and the like.
  • the determined threshold value may be stored in, for example, the auxiliary storage unit 103. Local heat generation can also be suppressed by the smartphone 1 according to the first modification.
  • the wall portion 121 is erected at a right angle from the internal plate-shaped metal structure 12.
  • the wall portion 121 may be erected diagonally from the internal plate-shaped metal structure 12.
  • the angle at which the wall portion 121 is erected from the internal plate-shaped metal structure 12 may be determined in consideration of, for example, the direction of the radio wave radiated by the patch antenna module 13.
  • the patch antenna module 13 is provided one by one on three of the four sides forming the inner plate-shaped metal structure 12 formed in the shape of a rectangular plate.
  • two or more patch antenna modules 13 may be provided on each side forming the internal plate-shaped metal structure 12, or may be provided on all four sides.
  • the internal plate-shaped metal structure 12 may have a shape other than a rectangle. The shape of the internal plate-shaped metal structure 12 may be appropriately determined according to the internal structure of the smartphone 1.
  • the wall portion 121 is formed in the shape of a rectangular plate.
  • the wall portion 121 is not limited to the rectangular plate shape, and may have other shapes.
  • 13 to 15 are views illustrating variations of the wall portion. 13 to 15 are views of the wall portion 121 viewed from the normal direction. As illustrated in FIG. 13, the upper end of the wall portion 121 may be formed in a concave shape.
  • the wall portion 121 may have a shape having a plurality of protrusions 1211.
  • the wall portion 121 may have a plurality of through holes 1212 penetrating the wall portion 121 in the thickness direction.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Waveguide Aerials (AREA)
  • Telephone Set Structure (AREA)
  • Support Of Aerials (AREA)

Abstract

A mobile terminal is provided which can suppress local heat generation while preventing decreases in communication quality due to the positional relation relative to a base station. This mobile terminal is provided with a side frame which surrounds the side surfaces of the mobile terminal, an internal plate-shape metal structure which causes walls of the side frame facing the inner surface to stand up in several places, multiple patch antenna modules which are arranged to be pressed against the aforementioned walls by means of elastic members between the inner surface and the walls and which emit heat during communication, and a control unit which, from the multiple patch antenna modules, selects a patch antenna module for use in communication.

Description

携帯端末Mobile terminal
　本発明は、携帯端末に関する。 The present invention relates to a mobile terminal.
　スマートフォンやウェアラブルコンピュータ等の携帯端末において、限られた実装スペース内に各種電子部品を実装する工夫が行われている。例えば、特許文献１には、金属フレーム本体と補強板金との接合部の少なくとも一部を樹脂材料で覆うことで、軽量かつ剛性の高い筐体を備えた電子機器が記載されている。特許文献２には、筐体の外周部に設けた周辺導電性ハウジング部材をアンテナとして利用することで、限られた実装スペースを有効に活用した電子機器が記載されている。 In mobile terminals such as smartphones and wearable computers, various electronic components are mounted in a limited mounting space. For example, Patent Document 1 describes an electronic device provided with a lightweight and highly rigid housing by covering at least a part of a joint portion between a metal frame main body and a reinforcing sheet metal with a resin material. Patent Document 2 describes an electronic device that effectively utilizes a limited mounting space by using a peripheral conductive housing member provided on the outer peripheral portion of the housing as an antenna.
国際公開２０１５／１５９５１８号International Publication 2015/159518 特表２０１４－５０８４４０号公報Special Table 2014-508440
　Ｔｈｉｒｄ　Ｇｅｎｅｒａｔｉｏｎ　Ｐａｒｔｎｅｒｓｈｉｐ　Ｐｒｏｊｅｃｔ（３ＧＰＰ）において次の通信規格として規定される第５世代移動通信システム（以下、５Ｇとも記載）では、通信に用いるパッチアンテナモジュールの発熱量が従来よりも極めて大きくなる。そのため、５Ｇの規格に適合する携帯端末が通信を行うと、限られた実装スペース内でパッチアンテナモジュールが発熱することで、パッチアンテナモジュール近傍において局所的な発熱が生じやすい。また、５Ｇの規格に適合するパッチアンテナモジュールは指向性が高いため、パッチアンテナモジュールを一か所に設けてしまうと、携帯端末と基地局との位置関係により通信品質が低下しやすい。 In the 5th generation mobile communication system (hereinafter, also referred to as 5G) defined as the next communication standard in the Third Generation Partnership Project (3GPP), the amount of heat generated by the patch antenna module used for communication is extremely larger than before. Therefore, when a mobile terminal conforming to the 5G standard communicates, the patch antenna module generates heat within a limited mounting space, so that local heat generation tends to occur in the vicinity of the patch antenna module. Further, since the patch antenna module conforming to the 5G standard has high directivity, if the patch antenna module is provided in one place, the communication quality tends to deteriorate due to the positional relationship between the mobile terminal and the base station.
　開示の技術の１つの側面は、基地局との位置関係による通信品質の低下を抑制しつつ局所的な発熱を抑制することができる携帯端末を提供することを目的とする。 One aspect of the disclosed technology is to provide a mobile terminal capable of suppressing local heat generation while suppressing deterioration of communication quality due to the positional relationship with the base station.
　開示の技術の１つの側面は、次のような携帯端末によって例示される。本携帯端末は、携帯端末の側面を囲む側面フレームと、前記側面フレームの内側面に面する壁部を複数個所に立設させた内部板状金属構造体と、前記内側面と前記壁部との間の夫々において弾性部材により前記壁部に押圧されるように配置され、通信時に発熱する複数のパッチアンテナモジュールと、前記複数のパッチアンテナモジュールの中から通信に用いるパッチアンテナモジュールを選択する制御部と、を備える。 One aspect of the disclosed technology is illustrated by the following mobile terminals. The mobile terminal includes a side frame that surrounds the side surface of the mobile terminal, an internal plate-shaped metal structure in which wall portions facing the inner side surface of the side frame are erected at a plurality of locations, and the inner side surface and the wall portion. Control to select a plurality of patch antenna modules which are arranged so as to be pressed against the wall portion by an elastic member in each of the spaces and generate heat during communication, and a patch antenna module to be used for communication from the plurality of patch antenna modules. It has a part and.
　開示の技術は、基地局との位置関係による通信品質の低下を抑制しつつ局所的な発熱を抑制することができる。 The disclosed technology can suppress local heat generation while suppressing deterioration of communication quality due to the positional relationship with the base station.
図１は、実施形態に係るスマートフォンの一例を示す第１の図である。FIG. 1 is a first diagram showing an example of a smartphone according to an embodiment. 図２は、実施形態に係るスマートフォンの一例を示す第２の図である。FIG. 2 is a second diagram showing an example of a smartphone according to the embodiment. 図３は、実施形態に係るスマートフォンで用いる内部板状金属構造体の一例を示す斜視図である。FIG. 3 is a perspective view showing an example of an internal plate-shaped metal structure used in the smartphone according to the embodiment. 図４は、実施形態に係るスマートフォンで用いるパッチアンテナモジュールの斜視図である。FIG. 4 is a perspective view of the patch antenna module used in the smartphone according to the embodiment. 図５は、図１のＡ－Ａ線端面図の一例である。FIG. 5 is an example of the end view of the line AA of FIG. 図６は、実施形態においてパッチアンテナと弾性部材との位置関係の一例を示す図である。FIG. 6 is a diagram showing an example of the positional relationship between the patch antenna and the elastic member in the embodiment. 図７は、実施形態におけるパッチアンテナ及び弾性部材の位置関係を模式的に示す図である。FIG. 7 is a diagram schematically showing the positional relationship between the patch antenna and the elastic member in the embodiment. 図８は、実施形態における制御基板のハードウェア構成の一例を示す図である。FIG. 8 is a diagram showing an example of the hardware configuration of the control board in the embodiment. 図９は、実施形態において、パッチアンテナモジュールから内部板状金属構造体への熱の伝導を模式的に示す第１の図である。FIG. 9 is a first diagram schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment. 図１０は、実施形態において、パッチアンテナモジュールから内部板状金属構造体への熱の伝導を模式的に示す第２の図である。FIG. 10 is a second diagram schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment. 図１１は、実施形態において、パッチアンテナモジュールから内部板状金属構造体への熱の伝導を模式的に示す第３の図である。FIG. 11 is a third diagram schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment. 図１２は、第１変形例に係るスマートフォンの一例を示す図である。FIG. 12 is a diagram showing an example of a smartphone according to the first modification. 図１３は、壁部のバリエーションを例示する第１の図である。FIG. 13 is a first diagram illustrating a variation of the wall portion. 図１４は、壁部のバリエーションを例示する第２の図である。FIG. 14 is a second diagram illustrating variations of the wall portion. 図１５は、壁部のバリエーションを例示する第３の図である。FIG. 15 is a third diagram illustrating variations of the wall portion.
　＜実施形態＞
　以下に示す実施形態の構成は例示であり、開示の技術は実施形態の構成に限定されない。実施形態に係る携帯端末は、例えば、以下の構成を備える。
　本実施形態に係る携帯端末は、
　携帯端末の側面を囲む側面フレームと、
　前記側面フレームの内側面に面する壁部を複数個所に立設させた内部板状金属構造体と、
　前記内側面と前記壁部との間の夫々において弾性部材により前記壁部に押圧されるように配置され、通信時に発熱する複数のパッチアンテナモジュールと、
　前記複数のパッチアンテナモジュールの中から通信に用いるパッチアンテナモジュールを選択する制御部と、を備える。 <Embodiment>
The configurations of the embodiments shown below are examples, and the disclosed technology is not limited to the configurations of the embodiments. The mobile terminal according to the embodiment has, for example, the following configuration.
The mobile terminal according to this embodiment is
The side frame that surrounds the side of the mobile terminal and
An internal plate-shaped metal structure in which wall portions facing the inner side surface of the side frame are erected at a plurality of places, and
A plurality of patch antenna modules that are arranged so as to be pressed against the wall portion by an elastic member at each of the inner surface surface and the wall portion and generate heat during communication.
A control unit for selecting a patch antenna module to be used for communication from the plurality of patch antenna modules is provided.
　実施形態に係る携帯端末は、使用者が携帯可能な可搬型の無線通信装置である。可搬型の無線通信装置としては、フィーチャーフォン、スマートフォン、タブレット型コンピュータ、ウェアラブルコンピュータ、ノートブック型コンピュータ等を挙げることができる。 The mobile terminal according to the embodiment is a portable wireless communication device that can be carried by the user. Examples of the portable wireless communication device include feature phones, smartphones, tablet computers, wearable computers, notebook computers and the like.
　実施形態に係る携帯端末は、筐体内に内部板状金属構造体を収容する。内部板状金属構造体は、例えば、金属のように熱伝導率の高い素材を板状に形成した部材である。筐体内に収容された内部板状金属構造体が筐体を内側から支持することで、筐体の剛性を高めることもできる。また、内部板状金属構造体は筐体内に収容される電子回路の支持部材として用いることもできる。本実施形態で用いる内部板状金属構造体は、側面フレームの内側面に面する壁部を複数個所に立設させる。内部板状金属構造体は矩形の板状に形成されていてもよく、前記壁部は、前記内部板状金属構造体の矩形を形成する各辺にそれぞれ配置されてもよい。 The mobile terminal according to the embodiment accommodates an internal plate-shaped metal structure in a housing. The internal plate-shaped metal structure is, for example, a member formed of a material having high thermal conductivity such as metal in a plate shape. The rigidity of the housing can be increased by supporting the housing from the inside by the internal plate-shaped metal structure housed in the housing. Further, the internal plate-shaped metal structure can also be used as a support member for an electronic circuit housed in the housing. In the inner plate-shaped metal structure used in the present embodiment, wall portions facing the inner side surface of the side frame are erected at a plurality of places. The inner plate-shaped metal structure may be formed in a rectangular plate shape, and the wall portion may be arranged on each side of the inner plate-shaped metal structure forming a rectangle.
　パッチアンテナモジュールは、パッチアンテナと、パッチアンテナを用いた電波の送受信を制御する制御モジュールと、を含む。パッチアンテナモジュールは、例えば、５Ｇに適合した通信を実行可能である。本携帯端末では、例えば、パッチアンテナを前記内側面に向けた状態で、パッチアンテナモジュールが内側面と壁部との間に配置される。 The patch antenna module includes a patch antenna and a control module that controls the transmission and reception of radio waves using the patch antenna. The patch antenna module can execute communication conforming to 5G, for example. In this mobile terminal, for example, the patch antenna module is arranged between the inner side surface and the wall portion with the patch antenna facing the inner side surface.
　壁部と筐体の前記内側面との間に配置されるパッチアンテナモジュールは、弾性部材によって壁部に押圧される。本携帯端末は、このような構成を採用することで、通信時においてパッチアンテナモジュールで生じた熱を、壁部を介して効率よく内部板状金属構造体に伝導させることができる。ここで、弾性部材は、パッチアンテナモジュールのうち、パッチアンテナが設けられていない部分と接触することが好ましい。すなわち、パッチアンテナと前記内側面との間には、弾性部材が介在しないことが好ましい。パッチアンテナと前記内側面との間に弾性部材が介在しないことで、パッチアンテナの通信性能が低下することが抑制される。 The patch antenna module arranged between the wall portion and the inner side surface of the housing is pressed against the wall portion by an elastic member. By adopting such a configuration, the present mobile terminal can efficiently conduct the heat generated by the patch antenna module during communication to the internal plate-shaped metal structure via the wall portion. Here, it is preferable that the elastic member comes into contact with a portion of the patch antenna module in which the patch antenna is not provided. That is, it is preferable that no elastic member is interposed between the patch antenna and the inner surface surface. By not interposing the elastic member between the patch antenna and the inner surface, it is possible to prevent the communication performance of the patch antenna from deteriorating.
　本携帯端末では、複数のパッチアンテナモジュールの中から通信に用いるパッチアンテナモジュールを選択することで、携帯端末と基地局との位置関係による通信品質の低下や局所的な発熱を抑制することができる。制御部は、例えば、通信に用いるパッチアンテナモジュールを所定間隔で切り替えてもよい。また、複数のパッチアンテナモジュール夫々の温度を測定するセンサを携帯端末がさらに備え、制御部はセンサが検出する複数のパッチアンテナモジュール夫々の温度を基に、通信に用いるパッチアンテナモジュールを選択してもよい。 In this mobile terminal, by selecting the patch antenna module used for communication from a plurality of patch antenna modules, it is possible to suppress deterioration of communication quality and local heat generation due to the positional relationship between the mobile terminal and the base station. .. The control unit may switch, for example, the patch antenna module used for communication at predetermined intervals. In addition, the mobile terminal is further equipped with a sensor for measuring the temperature of each of the plurality of patch antenna modules, and the control unit selects the patch antenna module to be used for communication based on the temperature of each of the plurality of patch antenna modules detected by the sensor. May be good.
　以下、図面を参照して上記携帯端末をスマートフォンに適用した実施形態についてさらに説明する。図１及び図２は、実施形態に係るスマートフォンの一例を示す図である。図１は、スマートフォン１のリアカバー１６を外した状態を例示する平面図である。図２は、スマートフォン１の分解斜視図である。スマートフォン１は、フロントカバー１１、内部板状金属構造体１２、３つのパッチアンテナモジュール１３ａ、１３ｂ、１３ｃ、弾性部材１４、制御基板１５及びリアカバー１６を備える。本明細書において、パッチアンテナモジュール１３ａ、１３ｂ、１３ｃを区別しないときは、パッチアンテナモジュール１３と称する。 Hereinafter, an embodiment in which the above mobile terminal is applied to a smartphone will be further described with reference to the drawings. 1 and 2 are diagrams showing an example of a smartphone according to the embodiment. FIG. 1 is a plan view illustrating a state in which the rear cover 16 of the smartphone 1 is removed. FIG. 2 is an exploded perspective view of the smartphone 1. The smartphone 1 includes a front cover 11, an internal plate-shaped metal structure 12, three patch antenna modules 13a, 13b, 13c, an elastic member 14, a control board 15, and a rear cover 16. In the present specification, when the patch antenna modules 13a, 13b, and 13c are not distinguished, they are referred to as the patch antenna module 13.
　スマートフォン１は、全体として板状に形成された筐体を有する無線通信装置である。フロントカバー１１及びリアカバー１６は、スマートフォン１の筐体である。フロントカバー１１は、スマートフォン１の側面を覆う側面カバー１１１を含む。フロントカバー１１には、例えば、ディスプレイ、スピーカー及びマイクロフォンが配置される。側面カバー１１１は、「側面フレーム」の一例である。 The smartphone 1 is a wireless communication device having a housing formed in a plate shape as a whole. The front cover 11 and the rear cover 16 are housings for the smartphone 1. The front cover 11 includes a side cover 111 that covers the side surface of the smartphone 1. For example, a display, a speaker, and a microphone are arranged on the front cover 11. The side cover 111 is an example of a “side frame”.
　内部板状金属構造体１２は、熱伝導性の高い金属を板状に形成した部材である。内部板状金属構造体１２は、フロントカバー１１とリアカバー１６が形成する筐体内に収容される。すなわち、内部板状金属構造体１２は、スマートフォン１の厚み方向において、フロントカバー１１とリアカバー１６との間に配置される。図３は、実施形態に係るスマートフォンで用いる内部板状金属構造体の一例を示す斜視図である。図１、図２及び図３では、内部板状金属構造体１２は、長方形の板状に形成される。内部板状金属構造体１２の長方形を形成する４辺のうち３辺において、壁部１２１が側面カバー１１１の内壁面１１２と面するように立設する。このように立設される壁部１２１は、壁部１２１が形成する面の法線方向が互いに異なる。壁部１２１は、内部板状金属構造体１２の一部を折り曲げることで形成してもよい。なお、内部板状金属構造体１２は、図１では長方形に形成されているが、正方形や五角形等の他の形状に形成されてもよい。内部板状金属構造体１２は、「内部板状金属構造体」の一例である。内壁面１１２は、「前記側面フレームの内側面」の一例である。壁部１２１は、「壁部」の一例である。 The internal plate-shaped metal structure 12 is a member formed of a metal having high thermal conductivity in a plate shape. The inner plate-shaped metal structure 12 is housed in a housing formed by the front cover 11 and the rear cover 16. That is, the internal plate-shaped metal structure 12 is arranged between the front cover 11 and the rear cover 16 in the thickness direction of the smartphone 1. FIG. 3 is a perspective view showing an example of an internal plate-shaped metal structure used in the smartphone according to the embodiment. In FIGS. 1, 2 and 3, the internal plate-shaped metal structure 12 is formed in the shape of a rectangular plate. On three of the four sides forming the rectangle of the inner plate-shaped metal structure 12, the wall portion 121 is erected so as to face the inner wall surface 112 of the side cover 111. The wall portions 121 erected in this way have different normal directions of the surfaces formed by the wall portions 121. The wall portion 121 may be formed by bending a part of the internal plate-shaped metal structure 12. Although the internal plate-shaped metal structure 12 is formed in a rectangular shape in FIG. 1, it may be formed in another shape such as a square or a pentagon. The inner plate-shaped metal structure 12 is an example of the “inner plate-shaped metal structure”. The inner wall surface 112 is an example of the “inner side surface of the side surface frame”. The wall portion 121 is an example of a “wall portion”.
　パッチアンテナモジュール１３は、パッチアンテナによる電波の送受信を行う。図４は、実施形態に係るスマートフォンで用いるパッチアンテナモジュールの斜視図である。パッチアンテナモジュール１３は、アンテナモジュール１３１と制御モジュール１３３とを積層したモジュールである。制御モジュール１３３は、パッチアンテナ１３２を用いた電波の送受信を制御する集積回路である。アンテナモジュール１３１のアンテナ実装面１３１ａには、複数のパッチアンテナ１３２が設けられる。複数のパッチアンテナ１３２は、アンテナ実装面１３１ａにおいて、互いに離れて設けられる。パッチアンテナモジュール１３は、アンテナ実装面１３１ａを側面カバー１１１の内壁面１１２に向けた状態で、壁部１２１と内壁面１１２の間に配置される。パッチアンテナモジュール１３は、「パッチアンテナモジュール」の一例である。アンテナ実装面１３１ａにおいてパッチアンテナ１３２を実装した領域は、「第１領域」の一例である。アンテナ実装面１３１ａにおいてパッチアンテナ１３２を実装していない領域は、「第２領域」の一例である。 The patch antenna module 13 transmits and receives radio waves by the patch antenna. FIG. 4 is a perspective view of the patch antenna module used in the smartphone according to the embodiment. The patch antenna module 13 is a module in which an antenna module 131 and a control module 133 are laminated. The control module 133 is an integrated circuit that controls the transmission and reception of radio waves using the patch antenna 132. A plurality of patch antennas 132 are provided on the antenna mounting surface 131a of the antenna module 131. The plurality of patch antennas 132 are provided apart from each other on the antenna mounting surface 131a. The patch antenna module 13 is arranged between the wall portion 121 and the inner wall surface 112 with the antenna mounting surface 131a facing the inner wall surface 112 of the side cover 111. The patch antenna module 13 is an example of a “patch antenna module”. The region where the patch antenna 132 is mounted on the antenna mounting surface 131a is an example of the “first region”. The region on the antenna mounting surface 131a where the patch antenna 132 is not mounted is an example of the “second region”.
　弾性部材１４は、パッチアンテナモジュール１３を壁部１２１に押圧する弾性力を有する部材である。弾性部材１４は、電波透過性を有するものであることが好ましい。このような弾性部材１４としては、例えば、株式会社ロジャースイノアック製ＰＯＲＯＮ（登録商標）のグレードＭＳ－４０Ｐを採用することができる。弾性部材１４は、「弾性部材」の一例である。 The elastic member 14 is a member having an elastic force that presses the patch antenna module 13 against the wall portion 121. The elastic member 14 preferably has radio wave transmission. As such an elastic member 14, for example, grade MS-40P of PORON (registered trademark) manufactured by Rogers INOAC Corporation can be adopted. The elastic member 14 is an example of an “elastic member”.
　図５は、図１のＡ－Ａ線端面図の一例である。弾性部材１４は、内壁面１１２とパッチアンテナモジュール１３との間に、押しつぶされた状態で設けられる。その結果、弾性部材１４は、弾性力によってパッチアンテナモジュール１３を壁部１２１に向けて押圧することができる。パッチアンテナモジュール１３が壁部１２１に押圧されることで、パッチアンテナモジュール１３で生じた熱を効率よく、壁部１２１を介して内部板状金属構造体１２に伝導させることができる。 FIG. 5 is an example of the end view of the AA line of FIG. The elastic member 14 is provided between the inner wall surface 112 and the patch antenna module 13 in a crushed state. As a result, the elastic member 14 can press the patch antenna module 13 toward the wall portion 121 by the elastic force. By pressing the patch antenna module 13 against the wall portion 121, the heat generated by the patch antenna module 13 can be efficiently conducted to the internal plate-shaped metal structure 12 via the wall portion 121.
　図６は、実施形態においてパッチアンテナと弾性部材との位置関係の一例を示す図である。図６は、パッチアンテナモジュール１３のパッチアンテナ１３２を設けた側面から見た図となっている。図６に例示するように、弾性部材１４は、パッチアンテナモジュール１３のパッチアンテナ１３２が設けられていない部分を押圧するように設けられることが好ましい。 FIG. 6 is a diagram showing an example of the positional relationship between the patch antenna and the elastic member in the embodiment. FIG. 6 is a view seen from the side surface of the patch antenna module 13 provided with the patch antenna 132. As illustrated in FIG. 6, the elastic member 14 is preferably provided so as to press the portion of the patch antenna module 13 where the patch antenna 132 is not provided.
　図７は、実施形態におけるパッチアンテナ及び弾性部材の位置関係を模式的に示す図である。図７では、平面視では目視で困難なパッチアンテナ１３２の位置も点線で示している。図７に例示するように、弾性部材１４は、パッチアンテナ１３２が設けられていない部分を押圧するように設けられる。このように弾性部材１４設けられることで、パッチアンテナ１３２による電波の送受信が弾性部材１４によって妨げられることが抑制される。そのため、例えば、パッチアンテナ１３２が発信する電波は、強い状態を維持してスマートフォン１外に送信される。 FIG. 7 is a diagram schematically showing the positional relationship between the patch antenna and the elastic member in the embodiment. In FIG. 7, the position of the patch antenna 132, which is difficult to see visually in a plan view, is also shown by a dotted line. As illustrated in FIG. 7, the elastic member 14 is provided so as to press a portion where the patch antenna 132 is not provided. By providing the elastic member 14 in this way, it is possible to prevent the elastic member 14 from interfering with the transmission and reception of radio waves by the patch antenna 132. Therefore, for example, the radio wave transmitted by the patch antenna 132 is transmitted to the outside of the smartphone 1 while maintaining a strong state.
　制御基板１５は、Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ（ＣＰＵ）や各種メモリが設けられた基板である。図８は、実施形態における制御基板のハードウェア構成の一例を示す図である。制御基板１５は、ＣＰＵ１０１、主記憶部１０２、補助記憶部１０３、通信部１０４および接続バスＢ１を含む。ＣＰＵ１０１、主記憶部１０２、補助記憶部１０３および通信部１０４は、接続バスＢ１によって相互に接続されている。 The control board 15 is a board provided with a Central Processing Unit (CPU) and various memories. FIG. 8 is a diagram showing an example of the hardware configuration of the control board in the embodiment. The control board 15 includes a CPU 101, a main storage unit 102, an auxiliary storage unit 103, a communication unit 104, and a connection bus B1. The CPU 101, the main storage unit 102, the auxiliary storage unit 103, and the communication unit 104 are connected to each other by the connection bus B1.
　ＣＰＵ１０１は、マイクロプロセッサユニット（ＭＰＵ）、プロセッサとも呼ばれる。ＣＰＵ１０１が実行する処理のうち少なくとも一部は、ＣＰＵ１０１以外のプロセッサで行われてもよい。また、ＣＰＵ１０１が実行する処理のうち少なくとも一部は、集積回路（ＩＣ）、その他のデジタル回路によって実行されてもよい。集積回路は、Ｌａｒｇｅ　Ｓｃａｌｅ　Ｉｎｔｅｇｒａｔｅｄ　ｃｉｒｃｕｉｔ（ＬＳＩ）、Ａｐｐｌｉｃａｔｉｏｎ　Ｓｐｅｃｉｆｉｃ　Ｉｎｔｅｇｒａｔｅｄ　Ｃｉｒｃｕｉｔ（ＡＳＩＣ）、プログラマブルロジックデバイス（ＰＬＤ）を含む。ＰＬＤは、例えば、Ｆｉｅｌｄ－Ｐｒｏｇｒａｍｍａｂｌｅ　Ｇａｔｅ　Ａｒｒａｙ（ＦＰＧＡ）を含む。ＣＰＵ１０１は、プロセッサと集積回路との組み合わせであってもよい。組み合わせは、例えば、マイクロコントローラユニット（ＭＣＵ）、Ｓｙｓｔｅｍ－ｏｎ－ａ－ｃｈｉｐ（ＳｏＣ）、システムＬＳＩ、チップセットなどと呼ばれる。スマートフォン１では、ＣＰＵ１０１が補助記憶部１０３に記憶されたプログラムを主記憶部１０２の作業領域に展開し、プログラムの実行を通じて周辺装置の制御を行う。これにより、スマートフォン１は、所定の目的に合致した処理を実行することができる。主記憶部１０２および補助記憶部１０３は、スマートフォン１が読み取り可能な記録媒体である。ＣＰＵ１０１は、「制御部」の一例である。 The CPU 101 is also called a microprocessor unit (MPU) or a processor. At least a part of the processing executed by the CPU 101 may be performed by a processor other than the CPU 101. Further, at least a part of the processing executed by the CPU 101 may be executed by an integrated circuit (IC) or another digital circuit. The integrated circuit includes a Large Scale Integrated circuit (LSI), an Application Special Integrated Circuit (ASIC), and a programmable logic device (PLD). PLD includes, for example, Field-Programmable Gate Array (FPGA). The CPU 101 may be a combination of a processor and an integrated circuit. The combination is called, for example, a microcontroller unit (MCU), a system-on-a-chip (SoC), a system LSI, a chipset, or the like. In the smartphone 1, the CPU 101 expands the program stored in the auxiliary storage unit 103 into the work area of the main storage unit 102, and controls peripheral devices through the execution of the program. As a result, the smartphone 1 can execute a process that meets a predetermined purpose. The main storage unit 102 and the auxiliary storage unit 103 are recording media that can be read by the smartphone 1. The CPU 101 is an example of a “control unit”.
　主記憶部１０２は、ＣＰＵ１０１から直接アクセスされる記憶部として例示される。主記憶部１０２は、Ｒａｎｄｏｍ　Ａｃｃｅｓｓ　Ｍｅｍｏｒｙ（ＲＡＭ）およびＲｅａｄ　Ｏｎｌｙ　Ｍｅｍｏｒｙ（ＲＯＭ）を含む。 The main storage unit 102 is exemplified as a storage unit that is directly accessed from the CPU 101. The main storage unit 102 includes a Random Access Memory (RAM) and a Read Only Memory (ROM).
　補助記憶部１０３は、各種のプログラムおよび各種のデータを読み書き自在に記録媒体に格納する。補助記憶部１０３は外部記憶装置とも呼ばれる。補助記憶部１０３には、オペレーティングシステム（Ｏｐｅｒａｔｉｎｇ　Ｓｙｓｔｅｍ、ＯＳ）、各種プログラム、各種テーブル等が格納される。ＯＳは、通信部１０４を介して接続される外部装置等とのデータの受け渡しを行う通信インターフェースプログラムを含む。 The auxiliary storage unit 103 stores various programs and various data in a literacy recording medium. The auxiliary storage unit 103 is also called an external storage device. The auxiliary storage unit 103 stores an operating system (Operating System, OS), various programs, various tables, and the like. The OS includes a communication interface program that exchanges data with an external device or the like connected via the communication unit 104.
　補助記憶部１０３は、例えば、Ｅｒａｓａｂｌｅ　Ｐｒｏｇｒａｍｍａｂｌｅ　ＲＯＭ（ＥＰＲＯＭ）、ソリッドステートドライブ（Ｓｏｌｉｄ　Ｓｔａｔｅ　Ｄｒｉｖｅ、ＳＳＤ）、ハードディスクドライブ（Ｈａｒｄ　Ｄｉｓｋ　Ｄｒｉｖｅ、ＨＤＤ）等である。 The auxiliary storage unit 103 is, for example, an Erasable Programmable ROM (EPROM), a solid state drive (Solid State Drive, SSD), a hard disk drive (Hard Disk Drive, HDD), or the like.
　通信部１０４は、例えば、パッチアンテナモジュール１３を用いて基地局や他の携帯端末との通信を行う。 The communication unit 104 uses, for example, the patch antenna module 13 to communicate with a base station and other mobile terminals.
　（パッチアンテナモジュール１３の選択）
　スマートフォン１では、ＣＰＵ１０１が、複数のパッチアンテナモジュール１３の中から通信に用いるパッチアンテナモジュール１３を選択する。通信部１０４は、ＣＰＵ１０１が選択したパッチアンテナモジュール１３を用いて通信を行う。ここで、ＣＰＵ１０１は、例えば、複数のパッチアンテナモジュール１３を所定時間毎に切り替えてもよい。所定時間を示す情報は、例えば、補助記憶部１０３に記憶させればよい。 (Selection of patch antenna module 13)
In the smartphone 1, the CPU 101 selects the patch antenna module 13 used for communication from the plurality of patch antenna modules 13. The communication unit 104 communicates using the patch antenna module 13 selected by the CPU 101. Here, the CPU 101 may switch, for example, a plurality of patch antenna modules 13 at predetermined time intervals. Information indicating a predetermined time may be stored in, for example, the auxiliary storage unit 103.
　図９から図１１は、実施形態において、パッチアンテナモジュールから内部板状金属構造体への熱の伝導を模式的に示す図である。図９から図１１では、スマートフォン１の制御基板１５及びリアカバー１６を外した状態を例示する。図９から図１１では、パッチアンテナモジュール１３から内部板状金属構造体１２への熱の伝導を矢印によって模式的に示す。図１１は、通信に用いるパッチアンテナモジュール１３としてパッチアンテナモジュール１３ｃをＣＰＵ１０１が選択した場合を例示する。ここでは、ＣＰＵ１０１は、パッチアンテナモジュール１３ａ、パッチアンテナモジュール１３ｂ、パッチアンテナモジュール１３ｃの順番で、通信に用いるパッチアンテナモジュール１３を選択したものとする。 9 to 11 are diagrams schematically showing heat conduction from the patch antenna module to the internal plate-shaped metal structure in the embodiment. 9 to 11 show a state in which the control board 15 and the rear cover 16 of the smartphone 1 are removed. In FIGS. 9 to 11, the conduction of heat from the patch antenna module 13 to the internal plate-shaped metal structure 12 is schematically shown by arrows. FIG. 11 illustrates a case where the CPU 101 selects the patch antenna module 13c as the patch antenna module 13 used for communication. Here, it is assumed that the CPU 101 selects the patch antenna module 13 used for communication in the order of the patch antenna module 13a, the patch antenna module 13b, and the patch antenna module 13c.
　図９は、通信に用いるパッチアンテナモジュール１３としてパッチアンテナモジュール１３ａをＣＰＵ１０１が選択した場合を例示する。パッチアンテナモジュール１３ａは通信実行によって発熱し、その熱が内部板状金属構造体１２に伝導する。 FIG. 9 illustrates a case where the CPU 101 selects the patch antenna module 13a as the patch antenna module 13 used for communication. The patch antenna module 13a generates heat by executing communication, and the heat is conducted to the internal plate-shaped metal structure 12.
　図１０は、通信に用いるパッチアンテナモジュール１３としてパッチアンテナモジュール１３ｂをＣＰＵ１０１が選択した場合を例示する。ＣＰＵ１０１は、パッチアンテナモジュール１３ａによる通信を開始してから補助記憶部１０３に記憶させた所定時間が経過すると、次に通信に用いるパッチアンテナモジュール１３としてパッチアンテナモジュール１３ｂを選択する。ＣＰＵ１０１は、パッチアンテナモジュール１３ｂによる通信を開始するとともに、パッチアンテナモジュール１３ａによる通信を停止する。パッチアンテナモジュール１３ｂは通信実行によって発熱し、その熱が内部板状金属構造体１２に伝導する。一方で、通信を停止したパッチアンテナモジュール１３ａでは発熱が収まり、パッチアンテナモジュール１３ａ近傍の内部板状金属構造体１２の温度が低下する。図１０では、温度の低下が点線の矢印で模式的に示される。 FIG. 10 illustrates a case where the CPU 101 selects the patch antenna module 13b as the patch antenna module 13 used for communication. When a predetermined time stored in the auxiliary storage unit 103 elapses after the communication by the patch antenna module 13a is started, the CPU 101 selects the patch antenna module 13b as the patch antenna module 13 to be used for the communication next. The CPU 101 starts the communication by the patch antenna module 13b and stops the communication by the patch antenna module 13a. The patch antenna module 13b generates heat by executing communication, and the heat is conducted to the internal plate-shaped metal structure 12. On the other hand, in the patch antenna module 13a in which communication is stopped, heat generation is suppressed, and the temperature of the internal plate-shaped metal structure 12 in the vicinity of the patch antenna module 13a is lowered. In FIG. 10, the decrease in temperature is schematically indicated by a dotted arrow.
　図１１は、通信に用いるパッチアンテナモジュール１３としてパッチアンテナモジュール１３ｃをＣＰＵ１０１が選択した場合を例示する。ＣＰＵ１０１は、パッチアンテナモジュール１３ｂによる通信を開始してから補助記憶部１０３に記憶させた所定時間が経過すると、次に通信に用いるパッチアンテナモジュール１３としてパッチアンテナモジュール１３ｃを選択する。ＣＰＵ１０１は、パッチアンテナモジュール１３ｃによる通信を開始するとともに、パッチアンテナモジュール１３ｂによる通信を停止する。パッチアンテナモジュール１３ｃは通信実行によって発熱し、その熱が内部板状金属構造体１２に伝導する。一方で、通信を停止したパッチアンテナモジュール１３ｂでは発熱が収まり、パッチアンテナモジュール１３ｂ近傍の内部板状金属構造体１２の温度が低下する。図１１では、図１０と同様に、低下した温度が点線の矢印で模式的に示される。 FIG. 11 illustrates a case where the CPU 101 selects the patch antenna module 13c as the patch antenna module 13 used for communication. When a predetermined time stored in the auxiliary storage unit 103 elapses after the communication by the patch antenna module 13b is started, the CPU 101 selects the patch antenna module 13c as the patch antenna module 13 to be used for communication next. The CPU 101 starts the communication by the patch antenna module 13c and stops the communication by the patch antenna module 13b. The patch antenna module 13c generates heat by executing communication, and the heat is conducted to the internal plate-shaped metal structure 12. On the other hand, the heat generated by the patch antenna module 13b that has stopped communication is reduced, and the temperature of the internal plate-shaped metal structure 12 in the vicinity of the patch antenna module 13b is lowered. In FIG. 11, as in FIG. 10, the lowered temperature is schematically indicated by a dotted arrow.
　５Ｇの規格に適合するパッチアンテナモジュール１３は、第４世代移動通信システム（４Ｇ）以前の規格に適合するアンテナモジュールよりも通信時における発熱量が大きい。そのため、ひとつのパッチアンテナモジュール１３を継続的に用いて通信を長時間行うと、当該パッチアンテナモジュール１３の近傍の温度が局所的に高くなる。その結果、スマートフォン１を利用するユーザに不快感を与える虞がある。本実施形態では、複数のパッチアンテナモジュール１３の中から通信に用いるパッチアンテナモジュール１３を選択することで、局所的な発熱を抑制することができる。 The patch antenna module 13 conforming to the 5G standard generates a larger amount of heat during communication than the antenna module conforming to the standard of the 4th generation mobile communication system (4G) or earlier. Therefore, when one patch antenna module 13 is continuously used for long-term communication, the temperature in the vicinity of the patch antenna module 13 rises locally. As a result, there is a risk of causing discomfort to the user who uses the smartphone 1. In the present embodiment, local heat generation can be suppressed by selecting the patch antenna module 13 used for communication from the plurality of patch antenna modules 13.
　＜第１変形例＞
　実施形態に係るスマートフォン１では、通信に用いるパッチアンテナモジュール１３を所定時間毎に切り替えた。第１変形例では、パッチアンテナモジュール１３の温度を測定し、温度の低いパッチアンテナモジュール１３を通信に用いるパッチアンテナモジュール１３として選択する構成について説明する。実施形態と共通の構成要素については同一の符号を付し、その説明は省略する。以下、図面を参照して、第１変形例について説明する。 <First modification>
In the smartphone 1 according to the embodiment, the patch antenna module 13 used for communication is switched at predetermined time intervals. In the first modification, a configuration in which the temperature of the patch antenna module 13 is measured and the patch antenna module 13 having a low temperature is selected as the patch antenna module 13 used for communication will be described. The components common to the embodiments are designated by the same reference numerals, and the description thereof will be omitted. Hereinafter, the first modification will be described with reference to the drawings.
　図１２は、第１変形例に係るスマートフォンの一例を示す図である。図１２は、スマートフォン１ａのリアカバー１６を外した状態を例示する。スマートフォン１ａでは、パッチアンテナモジュール１３夫々の近傍に温度センサ１７ａ、１７ｂ、１７ｃが設けられる。温度センサ１７ａは、パッチアンテナモジュール１３ａの温度を測定し、測定した温度をＣＰＵ１０１に通知する。温度センサ１７ｂは、パッチアンテナモジュール１３ｂの温度を測定し、測定した温度をＣＰＵ１０１に通知する。温度センサ１７ｃは、パッチアンテナモジュール１３ｃの温度を測定し、測定した温度をＣＰＵ１０１に通知する。以下、本明細書において、温度センサ１７ａ、１７ｂ、１７ｃを区別しないときは、温度センサ１７とも称する。温度センサ１７は、「センサ」の一例である。 FIG. 12 is a diagram showing an example of a smartphone according to the first modification. FIG. 12 illustrates a state in which the rear cover 16 of the smartphone 1a is removed. In the smartphone 1a, temperature sensors 17a, 17b, and 17c are provided in the vicinity of each of the patch antenna modules 13. The temperature sensor 17a measures the temperature of the patch antenna module 13a and notifies the CPU 101 of the measured temperature. The temperature sensor 17b measures the temperature of the patch antenna module 13b and notifies the CPU 101 of the measured temperature. The temperature sensor 17c measures the temperature of the patch antenna module 13c and notifies the CPU 101 of the measured temperature. Hereinafter, when the temperature sensors 17a, 17b, and 17c are not distinguished in the present specification, they are also referred to as the temperature sensor 17. The temperature sensor 17 is an example of a “sensor”.
　ＣＰＵ１０１は、温度センサ１７からパッチアンテナモジュール１３の温度を通知されると、パッチアンテナモジュール１３の中で最も温度の低いパッチアンテナモジュール１３を通信に使用するパッチアンテナモジュール１３として選択すればよい。そして、ＣＰＵ１０１は、選択したパッチアンテナモジュール１３の温度が閾値よりも高くなったことを検出した場合、他のパッチアンテナモジュール１３を通信に用いるパッチアンテナモジュール１３として選択すればよい。閾値は、例えば、発熱によるパッチアンテナモジュール１３の動作安定性やユーザにあたえる不快感等を基に、設計時に決定すればよい。決定した閾値は、例えば、補助記憶部１０３に記憶させておけばよい。このような第１変形例に係るスマートフォン１によっても、局所的な発熱を抑制することができる。 When the temperature sensor 17 notifies the temperature of the patch antenna module 13, the CPU 101 may select the patch antenna module 13 having the lowest temperature among the patch antenna modules 13 as the patch antenna module 13 used for communication. Then, when the CPU 101 detects that the temperature of the selected patch antenna module 13 has become higher than the threshold value, the CPU 101 may select another patch antenna module 13 as the patch antenna module 13 used for communication. The threshold value may be determined at the time of design, for example, based on the operational stability of the patch antenna module 13 due to heat generation, the discomfort given to the user, and the like. The determined threshold value may be stored in, for example, the auxiliary storage unit 103. Local heat generation can also be suppressed by the smartphone 1 according to the first modification.
　＜その他の変形＞
　以上説明した実施形態及び第１変形例では、壁部１２１は、内部板状金属構造体１２から直角に立設する。しかしながら、壁部１２１は、内部板状金属構造体１２から斜めに立設してもよい。壁部１２１が内部板状金属構造体１２から立設する角度は、例えば、パッチアンテナモジュール１３が放射する電波の方向を考慮して決定されてもよい。 <Other variants>
In the embodiment and the first modification described above, the wall portion 121 is erected at a right angle from the internal plate-shaped metal structure 12. However, the wall portion 121 may be erected diagonally from the internal plate-shaped metal structure 12. The angle at which the wall portion 121 is erected from the internal plate-shaped metal structure 12 may be determined in consideration of, for example, the direction of the radio wave radiated by the patch antenna module 13.
　以上説明した実施形態及び第１変形例では、長方形の板状に形成された内部板状金属構造体１２を形成する４辺のうちの３辺にひとつずつパッチアンテナモジュール１３が設けられた。しかしながら、パッチアンテナモジュール１３は、内部板状金属構造体１２を形成する各辺に２つ以上設けられてもよいし、４辺すべてに設けられてもよい。また、内部板状金属構造体１２は、長方形以外の形状であってもよい。内部板状金属構造体１２の形状は、スマートフォン１の内部構造に応じて適宜決定すればよい。 In the embodiment and the first modification described above, the patch antenna module 13 is provided one by one on three of the four sides forming the inner plate-shaped metal structure 12 formed in the shape of a rectangular plate. However, two or more patch antenna modules 13 may be provided on each side forming the internal plate-shaped metal structure 12, or may be provided on all four sides. Further, the internal plate-shaped metal structure 12 may have a shape other than a rectangle. The shape of the internal plate-shaped metal structure 12 may be appropriately determined according to the internal structure of the smartphone 1.
　以上説明した実施形態及び第１変形例では、壁部１２１は、長方形の板状に形成される。しかしながら、壁部１２１は、長方形の板状に限定されるわけではなく、他の形状であってもよい。図１３から図１５は、壁部のバリエーションを例示する図である。図１３から図１５は、法線方向から壁部１２１を見た図である。壁部１２１は、図１３に例示するように、上端部が凹形状に形成されていてもよい。壁部１２１は、図１４に例示するように、複数の突起１２１１を有する形状であってもよい。壁部１２１は、図１５に例示するように、壁部１２１を厚さ方向に貫通する貫通孔１２１２を複数有してもよい。なお、図１４における突起１２１１と突起１２１１の間の位置や、図１５における貫通孔１２１２の位置を、パッチアンテナモジュール１３が有するパッチアンテナ１３２の位置と壁部１２１の平面視において略一致させることで、パッチアンテナ１３２の電波の放射方向を壁部１２１に向けることも可能である。 In the embodiment and the first modification described above, the wall portion 121 is formed in the shape of a rectangular plate. However, the wall portion 121 is not limited to the rectangular plate shape, and may have other shapes. 13 to 15 are views illustrating variations of the wall portion. 13 to 15 are views of the wall portion 121 viewed from the normal direction. As illustrated in FIG. 13, the upper end of the wall portion 121 may be formed in a concave shape. As illustrated in FIG. 14, the wall portion 121 may have a shape having a plurality of protrusions 1211. As illustrated in FIG. 15, the wall portion 121 may have a plurality of through holes 1212 penetrating the wall portion 121 in the thickness direction. By making the position between the protrusions 1211 and 1211 in FIG. 14 and the position of the through hole 1212 in FIG. 15 substantially the same as the position of the patch antenna 132 of the patch antenna module 13 in the plan view of the wall portion 121. It is also possible to direct the radio wave emission direction of the patch antenna 132 toward the wall portion 121.
　以上で開示した実施形態や変形例はそれぞれ組み合わせることができる。 The embodiments and modifications disclosed above can be combined with each other.
　１、１ａ・・・スマートフォン
　１１・・・フロントカバー
　１１１・・・側面カバー
　１１２・・・内壁面
　１２・・・内部板状金属構造体
　１２１・・・壁部
　１２１１・・・突起
　１２１２・・・貫通孔
　１３、１３ａ、１３ｂ、１３ｃ・・・パッチアンテナモジュール
　１３１・・・アンテナモジュール
　１３１ａ・・・アンテナ実装面
　１３２・・・パッチアンテナ
　１３３・・・制御モジュール
　１４・・・弾性部材
　１５・・・制御基板
　１６・・・リアカバー
　１７、１７ａ、１７ｂ、１７ｃ・・・温度センサ
　１３・・・
　１０１・・・ＣＰＵ
　１０２・・・主記憶部
　１０３・・・補助記憶部
　１０４・・・通信部 1, 1a ... Smartphone 11 ... Front cover 111 ... Side cover 112 ... Inner wall surface 12 ... Internal plate-shaped metal structure 121 ... Wall 1211 ... Protrusion 1212 ... Through holes 13, 13a, 13b, 13c ... Patch antenna module 131 ... Antenna module 131a ... Antenna mounting surface 132 ... Patch antenna 133 ... Control module 14 ... Elastic member 15 ... Control board 16 ... Rear cover 17, 17a, 17b, 17c ... Temperature sensor 13 ...
101 ... CPU
102 ... Main storage unit 103 ... Auxiliary storage unit 104 ... Communication unit

Claims (5)

  1. 　携帯端末の側面を囲む側面フレームと、
    　前記側面フレームの内側面に面する壁部を複数個所に立設させた内部板状金属構造体と、
    　前記内側面と前記壁部との間の夫々において弾性部材により前記壁部に押圧されるように配置され、通信時に発熱する複数のパッチアンテナモジュールと、
    　前記複数のパッチアンテナモジュールの中から通信に用いるパッチアンテナモジュールを選択する制御部と、を備える、
    　携帯端末。     The side frame that surrounds the side of the mobile terminal and
    An internal plate-shaped metal structure in which wall portions facing the inner side surface of the side frame are erected at a plurality of places, and
    A plurality of patch antenna modules that are arranged so as to be pressed against the wall portion by an elastic member at each of the inner surface surface and the wall portion and generate heat during communication.
    A control unit for selecting a patch antenna module to be used for communication from the plurality of patch antenna modules is provided.
    Mobile terminal.
  2. 　前記内部板状金属構造体は矩形の板状に形成され、
    　前記壁部は、前記内部板状金属構造体の矩形を形成する各辺にそれぞれ配置される、
    　請求項１に記載の携帯端末。     The internal plate-shaped metal structure is formed in the shape of a rectangular plate.
    The wall portion is arranged on each side forming a rectangle of the internal plate-shaped metal structure.
    The mobile terminal according to claim 1.
  3. 　前記パッチアンテナモジュールの前記内側面に向かう面には、パッチアンテナが設けられた第１領域と、パッチアンテナが設けられていない第２領域が存在し、
    　前記弾性部材は、前記第２領域を押圧する、
    　請求項１または２に記載の携帯端末。     On the surface of the patch antenna module toward the inner surface, there is a first region provided with a patch antenna and a second region not provided with a patch antenna.
    The elastic member presses the second region.
    The mobile terminal according to claim 1 or 2.
  4. 　前記制御部は、通信に用いるパッチアンテナモジュールを所定間隔で切り替える、
    　請求項１から３のいずれか一項に記載の携帯端末。     The control unit switches the patch antenna module used for communication at predetermined intervals.
    The mobile terminal according to any one of claims 1 to 3.
  5. 　前記複数のパッチアンテナモジュール夫々の温度を測定するセンサをさらに備え、
    　前記制御部は、前記センサが検出する前記複数のパッチアンテナモジュール夫々の温度を基に、通信に用いるパッチアンテナモジュールを選択する、
    　請求項１から３のいずれか一項に記載の携帯端末。     Further equipped with a sensor for measuring the temperature of each of the plurality of patch antenna modules,
    The control unit selects a patch antenna module to be used for communication based on the temperature of each of the plurality of patch antenna modules detected by the sensor.
    The mobile terminal according to any one of claims 1 to 3.
PCT/JP2020/012376 2020-03-19 2020-03-19 Mobile terminal WO2021186687A1 (en)

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