WO2021184477A1 - Bipv photovoltaic module - Google Patents
Bipv photovoltaic module Download PDFInfo
- Publication number
- WO2021184477A1 WO2021184477A1 PCT/CN2020/085310 CN2020085310W WO2021184477A1 WO 2021184477 A1 WO2021184477 A1 WO 2021184477A1 CN 2020085310 W CN2020085310 W CN 2020085310W WO 2021184477 A1 WO2021184477 A1 WO 2021184477A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- power generation
- photovoltaic module
- layer
- bipv photovoltaic
- module according
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 75
- 238000010248 power generation Methods 0.000 claims abstract description 27
- 238000013084 building-integrated photovoltaic technology Methods 0.000 claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 claims abstract description 5
- 239000012790 adhesive layer Substances 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 8
- 238000010521 absorption reaction Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 6
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 claims description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 claims description 3
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 3
- QNWMNMIVDYETIG-UHFFFAOYSA-N gallium(ii) selenide Chemical compound [Se]=[Ga] QNWMNMIVDYETIG-UHFFFAOYSA-N 0.000 claims description 3
- 239000005341 toughened glass Substances 0.000 claims description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000002834 transmittance Methods 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract 1
- 239000005346 heat strengthened glass Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/60—Planning or developing urban green infrastructure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B10/00—Integration of renewable energy sources in buildings
- Y02B10/10—Photovoltaic [PV]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Definitions
- the present invention relates to the technical field of solar energy, in particular to BIPV photovoltaic modules.
- BIPV or BIPV
- Traditional thin-film power generation technology requires the preparation of a power generation layer on glass with a thickness of 3.2mm or less. According to the requirements of building safety standards, the minimum thickness of laminated glass is 5mm. Therefore, most traditional BIPV products use "5mm+3.2mm” +5mm” three-glass structure, but this structure has the problems of low light transmittance, high processing cost and heavy component weight.
- the purpose of the present invention is to solve at least one of the technical problems existing in the prior art, and to provide BIPV photovoltaic modules, which can break through the limitation of 3.2mm thickness glass, so as to achieve the effects of improving light transmittance, reducing processing costs, and reducing module weight.
- the solution adopted by the present invention is a BIPV photovoltaic module: it includes a front light-transmitting board, a power generation layer group, a bus wiring layer, and a supporting backboard that are sequentially stacked from top to bottom, and the front light-transmitting board is set to be super white heat enhanced Glass, the thickness of the front light-transmitting plate and the supporting back plate are both no less than 5 mm, and an encapsulating glue layer for encapsulating the bus wiring layer is provided between the power generation layer group and the supporting back plate.
- the above solution has at least one of the following technical effects: through the above structure, on the one hand, it meets the standard requirements of building safety, on the other hand, it achieves the effects of improving light transmittance, reducing processing costs, and reducing component weight.
- the power generation layer group includes a front electrode layer, a solar absorption layer, and a back electrode layer that are sequentially stacked from top to bottom, and the front electrode layer is attached to the front light-transmitting plate.
- the back electrode layer and the encapsulating adhesive layer jointly cover the bus wiring layer.
- the power generation layer group is provided with a light transmission gap.
- the ratio of the light transmission gap to the area of the power generation layer group is 5 to 80%.
- the solar absorption layer includes at least an amorphous silicon film, a cadmium telluride film, a copper indium gallium selenium film, a crystalline silicon cell, a perovskite film, a dye-sensitized film, and an arsenide film.
- amorphous silicon film a cadmium telluride film
- copper indium gallium selenium film a copper indium gallium selenium film
- a crystalline silicon cell a perovskite film
- a dye-sensitized film a dye-sensitized film
- arsenide film arsenide film.
- gallium thin films and heterojunction batteries One of gallium thin films and heterojunction batteries.
- the supporting back plate is tempered glass.
- the bus wiring layer includes a bus bar, and the bus bar is electrically connected to the power generation layer group.
- the thickness of the encapsulant layer is not less than 1.14 mm.
- FIG. 1 is a structural diagram of an embodiment of the BIPV photovoltaic module of the present invention.
- Figure 2 is a structural diagram of a power generation layer group in an embodiment of the BIPV photovoltaic module of the present invention
- Fig. 3 is a structural diagram of the power generation layer group and the bus wiring layer in the embodiment of the BIPV photovoltaic module of the present invention.
- terms such as “setup”, “installation”, and “connection” should be understood in a broad sense. For example, they may be directly connected or indirectly connected through an intermediate medium; they may be fixed or It can be a detachable connection, or it can be integrally formed; it can be a mechanical connection; it can be a communication between two components or an interaction relationship between two components. Those skilled in the art can reasonably determine the specific meaning of the above words in the present invention in combination with the specific content of the technical solution.
- the BIPV photovoltaic module of the embodiment of the present invention includes a front light-transmitting plate 100, a power generation layer group, a bus wiring layer 300, and a supporting back plate 500 that are sequentially stacked from top to bottom.
- the front light-transmitting plate 100 is set to super Incandescent heat-reinforced glass, the thickness of the front light-transmitting plate 100 and the supporting back plate 500 are both no less than 5mm, and an encapsulating glue layer 400 for encapsulating the bus wiring layer 300 is arranged between the power generation layer group and the supporting back plate 500.
- the encapsulating glue layer 400 is adhered between the power generation layer group and the support backplane 500, and the encapsulation glue layer 400 separates the power generation layer group and the support backplane 500 by a certain distance to accommodate the bus wiring layer 300, and the encapsulation glue layer 400 faces the bus wiring layer 300. Play a protective role.
- the supporting back plate 500 is preferably tempered glass, and the bus wiring layer 300 includes bus bars, and the bus bars are electrically connected to the power generation layer group.
- the power generation layer group includes a front electrode layer 210, a solar absorption layer 220, and a back electrode layer 230 that are sequentially stacked from top to bottom.
- the front electrode layer 210 is attached to the lower surface of the front light-transmitting plate 100, and the back electrode layer 230 is
- the packaging glue layer 400 collectively covers the bus wiring layer 300.
- the thickness of the front light-transmitting plate 100 and the supporting back plate 500 is set to no less than 5mm, which meets the requirements of building safety standards; and the front light-transmitting plate 100 is directly used to eliminate the glass reflection caused by the tape in the traditional structure.
- the structure also breaks through the limitation of 3.2mm glass, which greatly reduces the risk of component breakage and makes the component higher in strength.
- the power generation layer group is provided with a light transmission gap 240.
- the light transmission gap 240 is formed by laser etching on the power generation layer group.
- the ratio of the light transmission gap to the area of the power generation layer group is 5 to 80%.
- the solar absorption layer 220 includes at least an amorphous silicon film, a cadmium telluride film, a copper indium gallium selenium film, a crystalline silicon cell, a perovskite film, a dye-sensitized film, a gallium arsenide film, and a heterogeneous film.
- a kind of junction battery is not limited to an amorphous silicon film, a cadmium telluride film, a copper indium gallium selenium film, a crystalline silicon cell, a perovskite film, a dye-sensitized film, a gallium arsenide film, and a heterogeneous film.
- the thickness of the packaging adhesive layer 400 is not less than 1.14 mm, so that the bus wiring layer 300 can obtain a better sealing effect.
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
- Hybrid Cells (AREA)
Abstract
Description
Claims (8)
- BIPV光伏组件,其特征在于:包括BIPV photovoltaic modules are characterized by: including从上至下依次层叠设置的前透光板、发电层组、汇流布线层以及支撑背板,所述前透光板设置为超白热增强玻璃,所述前透光板和所述支撑背板的厚度均不少于5mm,所述发电层组与所述支撑背板之间设有用于封装所述汇流布线层的封装胶层。The front light-transmitting plate, the power generation layer group, the bus wiring layer, and the supporting back plate are stacked from top to bottom, the front light-transmitting plate is set as ultra-white heat reinforced glass, the front light-transmitting plate and the supporting back The thickness of the board is not less than 5 mm, and an encapsulating glue layer for encapsulating the bus wiring layer is provided between the power generation layer group and the supporting backplane.
- 根据权利要求1所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 1, characterized in that:所述发电层组包括从上至下依次层叠设置的前电极层、太阳能吸收层以及背电极层,所述前电极层附着在所述前透光板的下表面,所述背电极层与所述封装胶层共同包覆所述汇流布线层。The power generation layer group includes a front electrode layer, a solar absorption layer, and a back electrode layer that are sequentially stacked from top to bottom. The front electrode layer is attached to the lower surface of the front light-transmitting plate. The encapsulating glue layer collectively covers the bus wiring layer.
- 根据权利要求1所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 1, characterized in that:所述发电层组设有透光间隙。The power generation layer group is provided with light-transmitting gaps.
- 根据权利要求3所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 3, characterized in that:所述透光间隙占所述发电层组的面积的比例为5~80%。The ratio of the light transmission gap to the area of the power generation layer group is 5 to 80%.
- 根据权利要求2所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 2, characterized in that:所述太阳能吸收层至少包括非晶硅薄膜、碲化镉薄膜、铜铟镓硒薄膜、晶硅电池片、钙钛矿薄膜、染料敏化薄膜、砷化镓薄膜以及异质结电池中的一种。The solar absorption layer includes at least one of an amorphous silicon film, a cadmium telluride film, a copper indium gallium selenium film, a crystalline silicon cell, a perovskite film, a dye-sensitized film, a gallium arsenide film, and a heterojunction cell kind.
- 根据权利要求1所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 1, characterized in that:所述支撑背板为钢化玻璃。The supporting back plate is tempered glass.
- 根据权利要求1所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 1, characterized in that:所述汇流布线层包括汇流条,所述汇流条与所述发电层组电性连接。The bus wiring layer includes a bus bar, and the bus bar is electrically connected to the power generation layer group.
- 根据权利要求1所述的BIPV光伏组件,其特征在于:The BIPV photovoltaic module according to claim 1, characterized in that:所述封装胶层的厚度不少于1.14mm。The thickness of the packaging adhesive layer is not less than 1.14 mm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202020356468.5U CN211555903U (en) | 2020-03-19 | 2020-03-19 | BIPV photovoltaic module |
CN202020356468.5 | 2020-03-19 |
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Publication Number | Publication Date |
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WO2021184477A1 true WO2021184477A1 (en) | 2021-09-23 |
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PCT/CN2020/085310 WO2021184477A1 (en) | 2020-03-19 | 2020-04-17 | Bipv photovoltaic module |
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WO (1) | WO2021184477A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114482689A (en) * | 2022-02-23 | 2022-05-13 | 永臻科技股份有限公司 | High printing opacity full glass photovoltaic guardrail |
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US20120260971A1 (en) * | 2011-04-15 | 2012-10-18 | Everphoton Energy Corp. | Iii-v solar cell package and method of fabricating the same |
CN102956734A (en) * | 2012-11-26 | 2013-03-06 | 中山市创科科研技术服务有限公司 | Polycrystalline silicon battery component with adjustable light transmittance |
CN203983304U (en) * | 2014-06-09 | 2014-12-03 | 中节能太阳能科技股份有限公司 | The two glass assemblies of a kind of high performance solar batteries |
CN109192803A (en) * | 2018-09-06 | 2019-01-11 | 苏州钱正科技咨询有限公司 | A kind of high performance solar cells component |
CN208923165U (en) * | 2018-09-21 | 2019-05-31 | 中山瑞科新能源有限公司 | A kind of BIPV component to shine |
CN209042203U (en) * | 2018-09-21 | 2019-06-28 | 中山瑞科新能源有限公司 | A kind of BIPV side emitting lamp group |
CN209981246U (en) * | 2019-05-06 | 2020-01-21 | 中山瑞科新能源有限公司 | BIPV assembly |
-
2020
- 2020-03-19 CN CN202020356468.5U patent/CN211555903U/en active Active
- 2020-04-17 WO PCT/CN2020/085310 patent/WO2021184477A1/en active Application Filing
Patent Citations (7)
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US20120260971A1 (en) * | 2011-04-15 | 2012-10-18 | Everphoton Energy Corp. | Iii-v solar cell package and method of fabricating the same |
CN102956734A (en) * | 2012-11-26 | 2013-03-06 | 中山市创科科研技术服务有限公司 | Polycrystalline silicon battery component with adjustable light transmittance |
CN203983304U (en) * | 2014-06-09 | 2014-12-03 | 中节能太阳能科技股份有限公司 | The two glass assemblies of a kind of high performance solar batteries |
CN109192803A (en) * | 2018-09-06 | 2019-01-11 | 苏州钱正科技咨询有限公司 | A kind of high performance solar cells component |
CN208923165U (en) * | 2018-09-21 | 2019-05-31 | 中山瑞科新能源有限公司 | A kind of BIPV component to shine |
CN209042203U (en) * | 2018-09-21 | 2019-06-28 | 中山瑞科新能源有限公司 | A kind of BIPV side emitting lamp group |
CN209981246U (en) * | 2019-05-06 | 2020-01-21 | 中山瑞科新能源有限公司 | BIPV assembly |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114482689A (en) * | 2022-02-23 | 2022-05-13 | 永臻科技股份有限公司 | High printing opacity full glass photovoltaic guardrail |
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CN211555903U (en) | 2020-09-22 |
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