WO2021173693A1 - Electronic device - Google Patents
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- WO2021173693A1 WO2021173693A1 PCT/US2021/019443 US2021019443W WO2021173693A1 WO 2021173693 A1 WO2021173693 A1 WO 2021173693A1 US 2021019443 W US2021019443 W US 2021019443W WO 2021173693 A1 WO2021173693 A1 WO 2021173693A1
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- WIPO (PCT)
- Prior art keywords
- electronic device
- polymer
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- polymer composition
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- 229920000642 polymer Polymers 0.000 claims abstract description 92
- 239000000203 mixture Substances 0.000 claims abstract description 66
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 229920000106 Liquid crystal polymer Polymers 0.000 claims abstract description 17
- 239000012764 mineral filler Substances 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims description 25
- 125000003118 aryl group Chemical group 0.000 claims description 17
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- 230000008018 melting Effects 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 11
- 239000002245 particle Substances 0.000 claims description 10
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 8
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 6
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 6
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 6
- 239000011707 mineral Substances 0.000 claims description 6
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 claims description 5
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 claims description 4
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 4
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 claims description 4
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- 125000004429 atom Chemical group 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
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- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical class [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
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- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- YGANSGVIUGARFR-UHFFFAOYSA-N dipotassium dioxosilane oxo(oxoalumanyloxy)alumane oxygen(2-) Chemical compound [O--].[K+].[K+].O=[Si]=O.O=[Al]O[Al]=O YGANSGVIUGARFR-UHFFFAOYSA-N 0.000 description 2
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- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
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- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
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- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
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- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
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- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
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- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
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- XINVQTBVVRMNHZ-UHFFFAOYSA-N 3-[1-(3-carboxyphenyl)ethyl]benzoic acid Chemical compound C=1C=CC(C(O)=O)=CC=1C(C)C1=CC=CC(C(O)=O)=C1 XINVQTBVVRMNHZ-UHFFFAOYSA-N 0.000 description 1
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- OLZBOWFKDWDPKA-UHFFFAOYSA-N 4-[1-(4-carboxyphenyl)ethyl]benzoic acid Chemical compound C=1C=C(C(O)=O)C=CC=1C(C)C1=CC=C(C(O)=O)C=C1 OLZBOWFKDWDPKA-UHFFFAOYSA-N 0.000 description 1
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- JCJUKCIXTRWAQY-UHFFFAOYSA-N 6-hydroxynaphthalene-1-carboxylic acid Chemical compound OC1=CC=C2C(C(=O)O)=CC=CC2=C1 JCJUKCIXTRWAQY-UHFFFAOYSA-N 0.000 description 1
- XOCLMFGITXPIEJ-UHFFFAOYSA-N C(=O)(O)C1=CC=C(C=C1)C(C(C)C1=CC=C(C=C1)C(=O)O)C Chemical compound C(=O)(O)C1=CC=C(C=C1)C(C(C)C1=CC=C(C=C1)C(=O)O)C XOCLMFGITXPIEJ-UHFFFAOYSA-N 0.000 description 1
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- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
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- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
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- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
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- BPILDHPJSYVNAF-UHFFFAOYSA-M sodium;diiodomethanesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C(I)I BPILDHPJSYVNAF-UHFFFAOYSA-M 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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- 229910052606 sorosilicate Inorganic materials 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052889 tremolite Inorganic materials 0.000 description 1
- 125000005389 trialkylsiloxy group Chemical group 0.000 description 1
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- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
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Classifications
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- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08L67/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl- and the hydroxy groups directly linked to aromatic rings
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/06—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids
- C08G63/065—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from hydroxycarboxylic acids the hydroxy and carboxylic ester groups being bound to aromatic rings
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
- C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
- C08G63/60—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds
- C08G63/605—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from the reaction of a mixture of hydroxy carboxylic acids, polycarboxylic acids and polyhydroxy compounds the hydroxy and carboxylic groups being bound to aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K7/02—Fibres or whiskers
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
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- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/105—Ceramic fibres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
- B32B2264/1026—Mica
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
- B32B2264/1027—Clay
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0141—Liquid crystal polymer [LCP]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Definitions
- MIDs Molded interconnect devices
- a plastic substrate or housing is created and electrical circuits and devices are plated, layered or implanted upon the plastic substrate.
- MIDs typically have fewer parts than conventionally produced devices, which results in space and weight savings.
- Application Specific Electronics Packaging (“ASEP”).
- Such packaging systems enable the manufacture of products using reel-to-reel (continuous flow) manufacturing processes by relying upon the use of a plated plastic substrate that is molded onto a singulated carrier portion.
- a plated plastic substrate that is molded onto a singulated carrier portion.
- the polymeric materials used for the plastic substrate are not easily plated with conductive circuit traces and also do not typically possess the desired degree of thermal conductivity and mechanical strength.
- an electronic device comprising a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate.
- the substrate comprises a polymer composition that includes a thermotropic liquid crystalline polymer a mineral filler.
- the polymer composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E 1461 -13.
- FIG. 1 is a flow diagram of one embodiment of a manufacturing process that may be employed to form the electronic device of the present invention
- FIG. 2 is a perspective view of the manufacturing process shown in Fig. 1 in which a substrate is shown at various stages on a carrier during formation of the electronic device;
- FIG. 3 is a perspective view of the electronic device shown in Fig. 2 after separation from the carrier;
- FIG. 4 is a perspective view of one embodiment of a reel-to-reel carrier that may be used in the manufacturing process shown in Fig. 1 ;
- FIG. 5 is a schematic view of one embodiment for forming circuit traces on a substrate
- Fig. 6 is a flow diagram that shows additional steps that can be employed in the manufacturing process of Fig. 1;
- Fig. 7 is a perspective view of one embodiment of the electronic device of the present invention in the form of an automotive light; and [0013] Fig. 8 is an exploded perspective view of the electronic device shown in Fig. 7. Detailed Description
- the present invention is directed to an electronic device, such as a printed circuit board, flex circuit, connector, thermal management feature, EMI shielding, high current conductor, RFID apparatus, antenna, wireless power device, sensor, MEMS apparatus, LED device, microprocessor, memory device, ASIC, passive device, impedance control device, electro-mechanical apparatus, or a combination thereof.
- the electronic device contains a substrate that is molded onto a singulated carrier portion and has conductive traces disposed thereon.
- the substrate contains liquid crystalline polymer and a mineral filler.
- the present inventor has discovered that the resulting composition can achieve a high degree of thermal conductivity, which allows the substrate to be capable of creating a thermal pathway for heat transfer away from certain parts of the electronic device (e.g., LED module). In this manner, “hot spots” can be quickly eliminated and the overall temperature can be lowered during use.
- the composition may, for example, exhibit an in-plane thermal conductivity of about 1 W/m-K or more, in some embodiments about 1.2 W/m-K or more, in some embodiments about 1.5 W/m-K or more, in some embodiments about 1.8 W/m-K or more, and in some embodiments, from about 2 to about 5 W/m-K, as determined in accordance with ASTM E 1461-13.
- the composition may also exhibit a through-plane thermal conductivity of about 0.2 W/m-K or more, in some embodiments about 0.3 W/m-K or more, in some embodiments about 0.4 W/m-K or more, and in some embodiments, from about 0.5 to about 2 W/m-K, as determined in accordance with ASTM E 1461-13.
- the polymer composition may be generally free of fillers having an intrinsic thermal conductivity of 50 W/m-K or more, in some embodiments 100 W/m-K or more, and in some embodiments, 150 W/m-K or more.
- high intrinsic thermally conductive materials may include, for instance, boron nitride, aluminum nitride, magnesium silicon nitride, graphite (e.g., expanded graphite), silicon carbide, carbon nanotubes, zinc oxide, magnesium oxide, beryllium oxide, zirconium oxide, yttrium oxide, aluminum powder, and copper powder.
- compositions with a high thermal conductivity could not also possess sufficiently good mechanical properties. Contrary to conventional thought, however, the present inventor has discovered that through careful control over the particular materials employed
- the electronic device formed from the polymer composition can still possess excellent mechanical properties.
- the composition may exhibit a Charpy unnotched impact strength of about 10 kJ/m 2 , in some embodiments from about 15 to about 60 kJ/m 2 , and in some embodiments, from about 20 to about 50 kJ/m 2 , measured at 23°C according to ISO Test No. 179-
- the composition may also exhibit a tensile strength of from about 20 to about 500 MPa, in some embodiments from about 50 to about 400 MPa, and in some embodiments, from about 60 to about 350 MPa; tensile break strain of about
- the tensile properties may be determined in accordance with ISO
- the composition may also exhibit a flexural strength of from about 40 to about 500 MPa, in some embodiments from about 50 to about
- flexural break strain of about 0.5% or more, in some embodiments from about 0.8% to about 15%, and in some embodiments, from about 1% to about 10%
- flexural modulus of about 7,000 MPa or more, in some embodiments from about 9,000 MPa or more, in some embodiments, from about 10,000 MPa to about 30,000 MPa, and in some embodiments, from about 12,000 MPa to about 25,000 MPa.
- the flexural properties may be determined in accordance with ISO Test No. 178:2019 at 23°C.
- the composition may also exhibit a deflection temperature under load (DTUL) of about 180°C or more, and in some embodiments, from about 190°C to about 280°C, as measured according to ASTM D648-07 (technically equivalent to ISO Test No. 75-2:2013) at a specified load of 1.8 MPa.
- DTUL deflection temperature under load
- the polymer matrix typically contains one or more liquid crystalline polymers, generally in an amount of from about 30 wt.% to about 80 wt.%, in some embodiments from about 40 wt.% to about 75 wt.%, and in some embodiments, from about 50 wt.% to about 70 wt.% of the polymer composition.
- the liquid crystalline polymers are generally classified as “thermotropic” to the extent that they can possess a rod-like structure and exhibit a crystalline behavior in their molten state (e.g., thermotropic nematic state).
- the polymers have a relatively high melting temperature, such as from about 280°C to about 400°C, in some embodiments from about 290°C to about 390°C, and in some embodiments, from about 300°C to about 380°C.
- Such polymers may be formed from one or more types of repeating units as is known in the art.
- a liquid crystalline polymer may, for example, contain one or more aromatic ester repeating units generally represented by the following Formula (I): wherein, ring B is a substituted or unsubstituted 6-membered aryl group (e.g., 1 ,4- phenylene or 1 ,3-phenylene), a substituted or unsubstituted 6-membered aryl group fused to a substituted or unsubstituted 5- or 6-membered aryl group (e.g., 2,6-naphthalene), or a substituted or unsubstituted 6-membered aryl group linked to a substituted or unsubstituted 5- or 6-membered aryl group (e.g., 4,4- biphenylene); and
- Formula (I) wherein, ring B is a substituted or unsubstituted 6-membered aryl group (e.g., 1 ,4- phenylene or 1 ,3-phenylene
- Yi and Y2 are independently 0, C(O), NH, C(0)HN, or NHC(O).
- At least one of Yi and Y2 are C(O).
- aromatic ester repeating units may include, for instance, aromatic dicarboxylic repeating units (Yi and Y2 in Formula I are C(O)), aromatic hydroxycarboxylic repeating units (Yi is O and Y2 is C(O) in Formula I), as well as various combinations thereof.
- Aromatic hydroxycarboxylic repeating units may be employed that are derived from aromatic hydroxycarboxylic acids, such as, 4- hydroxybenzoic acid; 4-hydroxy-4'-biphenylcarboxylic acid; 2-hydroxy-6-naphthoic acid; 2-hydroxy-5-naphthoic acid; 3-hydroxy-2-naphthoic acid; 2-hydroxy-3- naphthoic acid; 4'-hydroxyphenyl-4-benzoic acid; 3'-hydroxyphenyl-4-benzoic acid; 4'-hydroxyphenyl-3-benzoic acid, etc., as well as alkyl, alkoxy, aryl and halogen substituents thereof, and combination thereof.
- aromatic hydroxycarboxylic acids such as, 4- hydroxybenzoic acid; 4-hydroxy-4'-biphenylcarboxylic acid; 2-hydroxy-6-naphthoic acid; 2-hydroxy-5-naphthoic acid; 3-hydroxy-2-naphthoic acid; 2-
- aromatic hydroxycarboxylic acids are 4-hydroxybenzoic acid (‘ ⁇ BA”) and 6-hydroxy-2- naphthoic acid (‘ ⁇ NA”).
- ⁇ BA 4-hydroxybenzoic acid
- ⁇ NA 6-hydroxy-2- naphthoic acid
- repeating units derived from hydroxycarboxylic acids typically constitute about 40 mol.% or more, in some embodiments about 45 mol.% or more, and in some embodiments, from about 50 mol.% to 100 mol.% of the polymer.
- repeating units derived from HBA may constitute from about 30 mol.% to about 90 mol.% of the polymer, in some embodiments from about 40 mol.% to about 85 mol.% of the polymer, and in some embodiments, from about 50 mol.% to about 80 mol.% of the polymer.
- Repeating units derived from HNA may likewise constitute from about 1 mol.% to about 30 mol.% of the polymer, in some embodiments from about 2 mol.% to about 25 mol.% of the polymer, and in some embodiments, from about 3 mol.% to about 15 mol.% of the polymer.
- Aromatic dicarboxylic repeating units may also be employed that are derived from aromatic dicarboxylic acids, such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, diphenyl ether-4, 4'-dicarboxylic acid, 1 ,6- naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4'- dicarboxybiphenyl, bis(4-carboxyphenyl)ether, bis(4-carboxyphenyl)butane, bis(4- carboxyphenyl)ethane, bis(3-carboxyphenyl)ether, bis(3-carboxyphenyl)ethane, etc., as well as alkyl, alkoxy, aryl and halogen substituents thereof, and combinations thereof.
- aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxy
- aromatic dicarboxylic acids may include, for instance, terephthalic acid (“TA”), isophthalic acid (“IA”), and 2,6- naphthalenedicarboxylic acid (“NDA”).
- TA terephthalic acid
- IA isophthalic acid
- NDA 2,6- naphthalenedicarboxylic acid
- repeating units derived from aromatic dicarboxylic acids typically constitute from about 1 mol.% to about 50 mol.%, in some embodiments from about 2 mol.% to about 40 mol.%, and in some embodiments, from about 5 mol.% to about 30% of the polymer.
- repeating units may also be employed in the polymer.
- repeating units may be employed that are derived from aromatic diols, such as hydroquinone, resorcinol, 2,6- dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1 ,6-dihydroxynaphthalene, 4,4'- dihydroxybiphenyl (or 4,4’-biphenol), 3,3'-dihydroxybiphenyl, 3,4'- dihydroxybiphenyl, 4,4'-dihydroxybiphenyl ether, bis(4-hydroxyphenyl)ethane, etc., as well as alkyl, alkoxy, aryl and halogen substituents thereof, and combinations thereof.
- aromatic diols such as hydroquinone, resorcinol, 2,6- dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1 ,6-dihydroxynaphthalene, 4,4'- dihydroxybipheny
- aromatic diols may include, for instance, hydroquinone (“HQ”) and 4,4’-biphenol (“BP”).
- HQ hydroquinone
- BP 4,4’-biphenol
- repeating units derived from aromatic diols typically constitute from about 1 mol.% to about 30 mol.%, in some embodiments from about 2 mol.% to about 25 mol.%, and in some embodiments, from about 5 mol.% to about 20% of the polymer.
- Repeating units may also be employed, such as those derived from aromatic amides (e.g., acetaminophen (“APAP”)) and/or aromatic amines (e.g., 4- aminophenol (“AP”), 3-aminophenol, 1 ,4-phenylenediamine, 1,3- phenylenediamine, etc.).
- aromatic amides e.g., APAP
- aromatic amines e.g., AP
- repeating units derived from aromatic amides (e.g., APAP) and/or aromatic amines (e.g., AP) typically constitute from about 0.1 mol.% to about 20 mol.%, in some embodiments from about 0.5 mol.% to about 15 mol.%, and in some embodiments, from about 1 mol.% to about 10% of the polymer.
- the polymer may contain one or more repeating units derived from non-aromatic monomers, such as aliphatic or cycloaliphatic hydroxycarboxylic acids, dicarboxylic acids, diols, amides, amines, etc.
- non-aromatic monomers such as aliphatic or cycloaliphatic hydroxycarboxylic acids, dicarboxylic acids, diols, amides, amines, etc.
- the polymer may be “wholly aromatic” in that it lacks repeating units derived from non-aromatic (e.g., aliphatic or cycloaliphatic) monomers.
- the liquid crystalline polymer may be a “low naphthenic” polymer to the extent that it contains a relatively low content of repeating units derived from naphthenic hydroxycarboxylic acids and naphthenic dicarboxylic acids, such as naphthalene-2, 6-dicarboxylic acid (“NDA”), 6-hydroxy- 2-naphthoic acid (“UNA”), or combinations thereof.
- naphthenic hydroxycarboxylic acids and naphthenic dicarboxylic acids such as naphthalene-2, 6-dicarboxylic acid (“NDA”), 6-hydroxy- 2-naphthoic acid (“UNA”), or combinations thereof.
- the total amount of repeating units derived from naphthenic hydroxycarboxylic and/or dicarboxylic acids is typically about 15 mol.% or less, in some embodiments about 10 mol.% or less, and in some embodiments, from about 1 mol.% to about 8 mol.% of the polymer.
- the polymer composition may also contain one or more mineral fillers distributed within the polymer matrix.
- mineral fillers typically constitute from about 10 to about 80 parts, in some embodiments from about 20 to about 70 parts, and in some embodiments, from about 30 to about 60 parts per 100 parts by weight of the polymer matrix.
- the mineral filler may, for instance, constitute from about 5 wt.% to about 60 wt.%, in some embodiments from about 10 wt.% to about 55 wt.%, and in some embodiments, from about 25 wt.% to about 40 wt.% of the polymer composition.
- the weight ratio of the mineral filler to the electrically conductive filler may range from about 2 to about
- 500 in some embodiments from about 3 to about 150, in some embodiments from about 4 to about 75, and in some embodiments, from about 5 to about 15.
- the present inventor has not only discovered that the mechanical properties can be improved, but also that the thermal conductivity can be increased without significantly impacting the overall electrical conductivity of the polymer composition. This allows the composition to be capable of creating a thermal pathway for heat transfer away from the resulting electronic device so that “hot spots” can be quickly eliminated and the overall temperature can be lowered during use.
- the composition may, for example, exhibit an in-plane thermal conductivity of about 0.2 W/m-K or more, in some embodiments about 0.5 W/m-K or more, in some embodiments about 0.6 W/m-K or more, in some embodiments about 0.8 W/m-K or more, and in some embodiments, from about 1 to about 3.5 W/m-K, as determined in accordance with ASTM E 1461-13.
- the composition may also exhibit a through-plane thermal conductivity of about 0.3 W/m-K or more, in some embodiments about 0.5 W/m-K or more, in some embodiments about 0.40 W/m-K or more, and in some embodiments, from about 0.7 to about 2 W/m-K, as determined in accordance with ASTM E 1461-13.
- Suitable mineral fibers may, for instance, include those that are derived from silicates, such as neosilicates, sorosilicates, inosilicates (e.g., calcium inosilicates, such as wollastonite; calcium magnesium inosilicates, such as tremolite; calcium magnesium iron inosilicates, such as actinolite; magnesium iron inosilicates, such as anthophyllite; etc.), phyllosilicates (e.g., aluminum phyllosilicates, such as palygorskite), tectosilicates, etc.; sulfates, such as calcium sulfates (e.g., dehydrated or anhydrous gypsum); mineral wools (e.g., rock or s
- the mineral fibers may have a median width
- the mineral fibers may also have a narrow size distribution. That is, at least about 60% by volume of the fibers, in some embodiments at least about
- the fibers may have a size within the ranges noted above. Without intending to be limited by theory, it is believed that mineral fibers having the size characteristics noted above can more readily move through molding equipment, which enhances the distribution within the polymer matrix and minimizes the creation of surface defects. In addition to possessing the size characteristics noted above, the mineral fibers may also have a relatively high aspect ratio
- the mineral fibers may have an aspect ratio of from about 1.1 to about 100, in some embodiments from about 1.2 to about 50, in some embodiments from about 1.5 to about 20, and in some embodiments, from about 2 to about 8.
- the volume average length of such mineral fibers may, for example, range from about 1 to about 200 micrometers, in some embodiments from about 2 to about 150 micrometers, in some embodiments from about 5 to about 100 micrometers, and in some embodiments, from about 10 to about 50 micrometers.
- suitable mineral fillers are mineral particles.
- the average diameter of the particles may, for example, range from about 5 micrometers to about 200 micrometers, in some embodiments from about 8 micrometers to about 150 micrometers, and in some embodiments, from about 10 micrometers to about 100 micrometers.
- the shape of the particles may vary as desired, such as granular, flake-shaped, etc. Flake-shaped particles, for instance, may be employed that have a relatively high aspect ratio (e.g., average diameter divided by average thickness), such as about 4 or more, in some embodiments about 8 or more, and in some embodiments, from about 10 to about 500.
- the average thickness of such flake-shaped particles may likewise be about 2 micrometers or less, in some embodiments from about 5 nanometers to about 1 micrometer, and in some embodiments, from about 20 nanometers to about 500 nanometers.
- the particles are typically formed from a natural and/or synthetic silicate mineral, such as talc, mica, halloysite, kaolinite, illite, montmorillonite, vermiculite, palygorskite, pyrophyllite, calcium silicate, aluminum silicate, wollastonite, etc. Talc and mica are particularly suitable.
- Any form of mica may generally be employed, including, for instance, muscovite (KAI 2 (AISi3)Oio(OH) 2 ), biotite (K(Mg,Fe) 3 (AISi3)Oio(OH) 2 ), phlogopite (KMg 3 (AISi3)Oio(OH) 2 ), lepidolite (K(Li,AI) 2 -3(AISi 3 )Oio(OH) 2 ), glauconite (K,Na)(AI,Mg,Fe) 2 (Si,AI)40io(OFI) 2 ), etc.
- Muscovite-based mica is particularly suitable for use in the polymer composition.
- a wide variety of additional additives can also be included in the polymer composition, such as glass fibers, impact modifiers, lubricants, pigments (e.g., carbon black), antioxidants, stabilizers, surfactants, waxes, flame retardants, anti- drip additives, nucleating agents (e.g., boron nitride), electrically conductive filler, and other materials added to enhance properties and processability.
- Lubricants for example, may be employed in the polymer composition in an amount from about 0.05 wt.% to about 1.5 wt.%, and in some embodiments, from about 0.1 wt.% to about 0.5 wt.% (by weight) of the polymer composition.
- lubricants examples include fatty acids esters, the salts thereof, esters, fatty acid amides, organic phosphate esters, and hydrocarbon waxes of the type commonly used as lubricants in the processing of engineering plastic materials, including mixtures thereof.
- Suitable fatty acids typically have a backbone carbon chain of from about 12 to about 60 carbon atoms, such as myristic acid, palmitic acid, stearic acid, arachic acid, montanic acid, octadecinic acid, parinric acid, and so forth.
- Suitable esters include fatty acid esters, fatty alcohol esters, wax esters, glycerol esters, glycol esters and complex esters.
- Fatty acid amides include fatty primary amides, fatty secondary amides, methylene and ethylene bisamides and alkanolamides such as, for example, palmitic acid amide, stearic acid amide, oleic acid amide, N,N'-ethylenebisstearamide and so forth.
- metal salts of fatty acids such as calcium stearate, zinc stearate, magnesium stearate, and so forth; hydrocarbon waxes, including paraffin waxes, polyolefin and oxidized polyolefin waxes, and microcrystalline waxes.
- Particularly suitable lubricants are acids, salts, or amides of stearic acid, such as pentaerythritol tetrastearate, calcium stearate, or N,N'-ethylenebisstearamide.
- another suitable lubricant may be a siloxane polymer that improves internal lubrication and that also helps to bolster the wear and friction properties of the composition encountering another surface.
- Such siloxane polymers typically constitute from about 0.2 to about 20 parts, in some embodiments from about 0.5 to about 10 parts, and in some embodiments, from about 0.8 to about 5 parts per 100 parts of the polymer matrix employed in the composition. Any of a variety of siloxane polymers may generally be employed.
- the siloxane polymer may, for instance, encompass any polymer, co-polymer or oligomer that includes siloxane units in the backbone having the formula:
- R is independently hydrogen or substituted or unsubstituted hydrocarbon radicals, and r is 0, 1, 2 or 3.
- radicals R include, for instance, alkyl, aryl, alkylaryl, alkenyl or alkynyl, or cycloalkyl groups, optionally substituted, and which may be interrupted by heteroatoms, i.e., may contain heteroatom(s) in the carbon chains or rings.
- Suitable alkyl radicals may include, for instance, methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, n-pentyl, isopentyl, neopentyl and tert-pentyl radicals, hexyl radicals (e.g., n-hexyl), heptyl radicals (e.g., n- heptyl), octyl radicals (e.g., n-octyl), isooctyl radicals (e.g., 2,2,4-trimethylpentyl radical), nonyl radicals (e.g., n-nonyl), decyl radicals (e.g., n-decyl), dodecyl radicals (e.g., n-dodecyl), octadecyl radical
- suitable cycloalkyl radicals may include cyclopentyl, cyclohexyl cycloheptyl radicals, methylcyclohexyl radicals, and so forth;
- suitable aryl radicals may include phenyl, biphenyl, naphthyl, anthryl, and phenanthryl radicals;
- suitable alkylaryl radicals may include o-, m- or p-tolyl radicals, xylyl radicals, ethylphenyl radicals, and so forth;
- suitable alkenyl or alkynyl radicals may include vinyl, 1- propenyl, 1-butenyl , 1-pentenyl, 5-hexenyl, butadienyl, hexadienyl, cyclopentenyl, cyclopentadienyl, cyclohexenyl, ethynyl, propargyl 1-propynyl, and so forth.
- substituted hydrocarbon radicals are halogenated alkyl radicals (e.g., 3-chloropropyl, 3,3,3-trifluoropropyl, and perfluorohexylethyl) and halogenated aryl radicals (e.g., p-chlorophenyl and p-chlorobenzyl).
- the siloxane polymer includes alkyl radicals (e.g., methyl radicals) bonded to at least 70 mol % of the Si atoms and optionally vinyl and/or phenyl radicals bonded to from 0.001 to 30 mol % of the Si atoms.
- the siloxane polymer is also preferably composed predominantly of diorganosiloxane units.
- the end groups of the polyorganosiloxanes may be trialkylsiloxy groups, in particular the trimethylsiloxy radical or the dimethylvinylsiloxy radical. However, it is also possible for one or more of these alkyl groups to have been replaced by hydroxy groups or alkoxy groups, such as methoxy or ethoxy radicals.
- Particularly suitable examples of the siloxane polymer include, for instance, dimethylpolysiloxane, phenylmethylpolysiloxane, vinylmethylpolysiloxane, and trifluoropropylpolysiloxane.
- the siloxane polymer may also include a reactive functionality on at least a portion of the siloxane monomer units of the polymer, such as one or more of vinyl groups, hydroxyl groups, hydrides, isocyanate groups, epoxy groups, acid groups, halogen atoms, alkoxy groups (e.g., methoxy, ethoxy and propoxy), acyloxy groups (e.g., acetoxy and octanoyloxy), ketoximate groups (e.g., dimethylketoxime, methylketoxime and methylethylketoxime), amino groups(e.g., dimethylamino, diethylamino and butylamino), amido groups (e.g., N- methylacetamide and N-ethylacetamide), acid amido groups, amino-oxy groups, mercapto groups, alkenyloxy groups (e.g., vinyloxy, isopropenyloxy, and 1 -ethy
- the siloxane polymer typically has a relatively high molecular weight, which reduces the likelihood that it migrates or diffuses to the surface of the polymer composition and thus further minimizes the likelihood of phase separation.
- the siloxane polymer typically has a weight average molecular weight of about 100,000 grams per mole or more, in some embodiments about 200,000 grams per mole or more, and in some embodiments, from about 500,000 grams per mole to about 2,000,000 grams per mole.
- the siloxane polymer may also have a relative high kinematic viscosity, such as about 10,000 centistokes or more, in some embodiments about 30,000 centistokes or more, and in some embodiments, from about 50,000 to about 500,000 centistokes.
- silica particles e.g., fumed silica
- silica particles may also be employed in combination with the siloxane polymer to help improve its ability to be dispersed within the composition.
- Such silica particles may, for instance, have a particle size of from about 5 nanometers to about 50 nanometers, a surface area of from about
- the silica particles typically constitute from about 1 to about 100 parts, and in some some embodiments, from about 20 to about 60 parts by weight based on 100 parts by weight of the siloxane polymer.
- the silica particles can be combined with the siloxane polymer prior to addition of this mixture to the polymer composition. For instance, a mixture including an ultrahigh molecular weight polydimethylsiloxane and fumed silica can be incorporated in the polymer composition. Such a pre-formed mixture is available as Genioplast ® Pellet S from Wacker Chemie, AG.
- An electrically conductive filler may also be employed in the polymer composition to ensure that the substrate is generally antistatic in nature such that a substantial amount of electrical current does not flow through the part.
- Such an antistatic behavior may be accomplished by selecting a single material for the filler having the desired resistivity, or by blending multiple materials together (e.g., insulative and electrically conductive) so that the resulting filler has the desired resistivity.
- an electrically conductive carbon material may be employed that has a volume resistivity of less than about 1 ohm-cm, in some embodiments about less than about 0.1 ohm-cm, and in some embodiments, from about 1 x 10- 8 to about 1 x 10 -2 ohm-cm, such as determined at a temperature of about 20°C.
- Suitable electrically conductive carbon materials may include, for instance, graphite, carbon black, carbon fibers, graphene, carbon nanotubes, etc.
- electrically conductive fillers may likewise include metals (e.g., metal particles, metal flakes, metal fibers, etc.), ionic liquids, and so forth.
- the electrically conductive filler typically constitutes from about 0.5 to about 20 parts, in some embodiments from about 1 to about 15 parts, and in some embodiments, from about 2 to about 8 parts by weight per 100 parts by weight of the polymer matrix.
- the electrically conductive filler may constitute from about 0.1 wt.% to about 10 wt.%, in some embodiments from about 0.2 wt.% to about 8 wt.%, and in some embodiments, from about 0.5 wt.% to about 6 wt.% of the polymer composition.
- the resulting antistatic polymer composition may exhibit a surface resistivity of about 1 x 10 18 ohms or less, in some embodiments about 1 x 10 17 ohms or less, in some embodiments about 1 x 10 16 ohms or less, in some embodiments about 1 x 10 15 ohms or less, and in some embodiments, about
- the composition need not be antistatic, particularly when it is desired to optimize the overall thermal conductivity of the composition.
- the composition may exhibit a surface resistivity of about 1 x 10 14 ohms or more, in some embodiments about 1 x 10 15 ohms or more, in some embodiments about 1 x 10 16 ohms or more, in some embodiments about 1 x 10 17 ohms or more, and in some embodiments, about 1 x 10 18 ohms or more and/or a volume resistivity of about 1 x 10 13 ohm-m or more, in some embodiments about 1 x 10 14 ohm-m or more, in some embodiments about 1 x 10 15 ohms or more, and in some embodiments, about 1 x 10 16 ohm-m or more, such as determined in accordance with IEC 62631- 3-1 :2016.
- the components of the polymer composition may be melt processed or blended together.
- the components may be supplied separately or in combination to an extruder that includes at least one screw rotatably mounted and received within a barrel (e.g., cylindrical barrel) and may define a feed section and a melting section located downstream from the feed section along the length of the screw.
- the extruder may be a single screw or twin screw extruder. The speed of the screw may be selected to achieve the desired residence time, shear rate, melt processing temperature, etc.
- the screw speed may range from about 50 to about 800 revolutions per minute (“rpm”), in some embodiments from about 70 to about 150 rpm, and in some embodiments, from about 80 to about 120 rpm.
- the apparent shear rate during melt blending may also range from about 100 seconds 1 to about 10,000 seconds 1 , in some embodiments from about 500 seconds 1 to about 5000 seconds 1 , and in some embodiments, from about 800 seconds 1 to about 1200 seconds 1 .
- the apparent shear rate is equal to 4Q/nR 3 , where Q is the volumetric flow rate (“m 3 /s”) of the polymer melt and R is the radius (“m”) of the capillary (e.g., extruder die) through which the melted polymer flows.
- the resulting polymer composition can possess excellent thermal properties.
- the melt viscosity of the polymer composition may be low enough so that it can readily flow into the cavity of a mold having small dimensions.
- the polymer composition may have a melt viscosity of from about 10 to about 250 Pa-s, in some embodiments from about 15 to about 200 Pa-s, in some embodiments from about 20 to about 150 Pa-s, and in some embodiments, from about 30 to about 100 Pa-s, determined at a shear rate of 1 ,000 seconds 1 .
- Melt viscosity may be determined in accordance with ISO Test No. 11443:2014 at a temperature that is 15°C higher than the melting temperature of the composition (e.g., about 340°C for a melting temperature of about 325°C).
- the polymer composition is employed in a substrate that is molded onto a “singulated” carrier portion and has conductive traces plated thereon.
- the term “singulated” generally means that the carrier portion has been separated from a larger carrier (e.g., conjoined or continuous).
- the substrate may be formed using a variety of different techniques. Suitable techniques may include, for instance, injection molding, low-pressure injection molding, extrusion compression molding, gas injection molding, foam injection molding, low-pressure gas injection molding, low- pressure foam injection molding, gas extrusion compression molding, foam extrusion compression molding, extrusion molding, foam extrusion molding, compression molding, foam compression molding, gas compression molding, etc.
- an injection molding system may be employed that includes a mold within which the polymer composition may be injected.
- the time inside the injector may be controlled and optimized so that polymer matrix is not pre solidified.
- a piston may be used to inject the composition to the mold cavity.
- Compression molding systems may also be employed.
- injection molding the shaping of the polymer composition into the desired article also occurs within a mold.
- the composition may be placed into the compression mold using any known technique, such as by being picked up by an automated robot arm.
- the temperature of the mold may be maintained at or above the solidification temperature of the polymer matrix for a desired time period to allow for solidification.
- the molded product may then be solidified by bringing it to a temperature below that of the melting temperature.
- the resulting product may be de-molded.
- the cycle time for each molding process may be adjusted to suit the polymer matrix, to achieve sufficient bonding, and to enhance overall process productivity.
- a carrier 40 is provided that contains an outer region from which arms 56 extend to form a leadframe 54.
- the carrier 40 may, for example, be unspooled from a bulk source reel 68a and then collected in a second reel 68b.
- the carrier 40 is typically formed from a metal (e.g., copper or copper alloy) or other suitable conductive material.
- the arms 56 may also contain apertures 58 provided therein.
- Carrier holes 52 may likewise located on the outer portions of the carrier 40 to allow it to traverse along a manufacturing line in a continuous manner.
- a substrate 42 which may be formed from the polymer composition of the present invention, may thereafter be molded (e.g., overmolded) over the leadframe 54.
- Apertures 60 may be provided in the substrate 42 that correspond to the apertures 58 in the fingers 56.
- conductive circuit traces may then be formed. Such traces may be formed through a variety of known metal deposition techniques, such as by plating (e.g., electroplating, electroless plating, etc.), printing (e.g., digital printing, aerosol jet printing, etc.), and so forth.
- a seed layer may initially be formed on the substrate to facilitate the metal deposition process.
- a seed layer 44 may initially be deposited on the surface of the substrate 42, which allows an internal bus bar 43 formed by the carrier 40 to be electrically connected to the seed layer 44.
- the seed layer 44 may then be deposited with a metal (e.g., copper, nickel, gold, silver, tin, lead, palladium, etc.) to form a part 46 containing electronic circuit traces 62 (Step 4).
- a metal e.g., copper, nickel, gold, silver, tin, lead, palladium, etc.
- electroplating may be performed by applying a voltage potential to the carrier 40 and thereafter placed in an an electroplating bath.
- Vias can also be optionally molded into the surface of the substrate to create an electrical path between the traces and the internal layers of the circuit. These traces create an “electrical bus bar” to the carrier portion, which enables the traces to be plated after the deposited conductive paste is applied.
- the surface of the substrate may be roughened prior to being plated using a variety of known techniques, such as laser ablation, plasma etching, ultraviolet light treatment, fluorination, etc. Among other things, such roughening helps facilitating plating in the desired interconnect pattern.
- a laser 70 may be initially employed to ablate the surface of the substrate 42 to create a channel 72 that forms an interconnect pattern 66.
- an electrically conductive paste 74 may then be disposed within the channel 72 via any known technique, such as by an inkjet process, aerosol process, or screening process.
- a plating process (e.g., electroless plating) may also be employed in lieu of and/or in addition to the use of a paste.
- the deposited paste 74 may optionally be sintered through a laser or flash heat 76 as illustrated in Step 11 to help ensure that the paste 74 sufficiently adheres to the substrate 42.
- the paste 74 is then plated (e.g., electroplated) as shown in Step 12 to form electronic circuit traces 62.
- an electrical device may be formed by connecting one or more electrical components 50 to the substrate 42 (Step 6) using any of a variety of techniques, such as soldering, wire bonding, etc.
- a solder mask 48 may optionally be applied (Step 5) prior to the connection of the components 50.
- the resulting electronic device may then be separated from the carrier 40.
- Figs. 2-3 illustrate one embodiment of an electronic device 22 during various stages of its formation.
- the carrier 40 is shown prior to molding.
- Step B shows the substrate 42 after it has been molded onto the carrier portion 40 and applied with electronic circuit traces 62.
- optional pin contacts and circuit metallization may be added to form the completed electronic device (Step E).
- the completed electronic device 22 may then be separated from the adjoined carrier 40 as illustrated in Fig. 3 to form an electronic device 22 containing a singulated carrier portion 40.
- the resulting electronic device may contain various types of electronic components, such as a housing for a light source (e.g., light emitting diode (“LED”)) for a light a tunnel light, headlamp, etc., or other electronic equipment, such as used in computers, phones, electronic control units, etc.
- a light source e.g., light emitting diode (“LED”)
- LED light emitting diode
- Such products may be particularly useful in vehicles (e.g., automobiles, buses, motorcycles, boats, etc.), such as an electric vehicle (EV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), or other type of vehicle using electric power for propulsion (collectively referred to as "electric vehicles”).
- EV electric vehicle
- HEV hybrid electric vehicle
- PHEV plug-in hybrid electric vehicle
- electric vehicles
- an electronic product is shown that is in the form of a light 20 for use in automotive products.
- the light 20 includes a housing 24, an electronic device 22 (see also Fig. 2), and a light pipe 28.
- the housing 24 may be formed in two parts 24a and 24b as shown in Fig. 8.
- the housing 24 has a wall 32 forming a passageway 34 therethrough and an aperture 36 that extends through the wall 32 and is in communication with the passageway 34.
- the aperture 36 may be transverse to the passageway 34.
- the electronic device 22 may be mounted within the passageway 34 of the housing 30.
- the light pipe 28 extends through the aperture 36 in the housing 30 and is mounted above a light emitting diode (LED) 38, which is formed as one or more of the electronic components 50 of the electronic device 22 as described herein.
- Fig. 6 provides a representative process for forming the light 20. Steps 7 and 8, for instance, show that the electronic device 22 is singulated from the other devices and assembled with the housing 24 and light pipe 28. After the device 22 is formed, it is mounted within the passageway 34 and the parts 24a and 24b of the housing 24 are assembled together. The pin contacts 64 remain exposed.
- the light pipe 28 is mounted through the aperture 36 in the housing 24 and is provided above the LED(s) 38.
- melt Viscosity The melt viscosity (Pa-s) may be determined in accordance with ISO Test No. 11443:2014 at a shear rate of 1,000 s 1 and temperature 15°C above the melting temperature using a Dynisco LCR7001 capillary rheometer.
- the rheometer orifice (die) had a diameter of 1 mm, length of
- the diameter of the barrel was 9.55 mm + 0.005 mm and the length of the rod was 233.4 mm.
- Tm The melting temperature (“Tm”) may be determined by differential scanning calorimetry (“DSC”) as is known in the art.
- the melting temperature is the differential scanning calorimetry (DSC) peak melt temperature as determined by ISO Test No. 11357-2:2018. Under the DSC procedure, samples were heated and cooled at 20°C per minute as stated in ISO Standard 10350 using DSC measurements conducted on a TA Q2000 Instrument.
- DSC differential scanning calorimetry
- Deflection Temperature Under Load The deflection under load temperature may be determined in accordance with ISO Test No. 75-2:2013 (technically equivalent to ASTM D648). More particularly, a test strip sample having a length of 80 mm, thickness of 10 mm, and width of 4 mm may be subjected to an edgewise three-point bending test in which the specified load (maximum outer fibers stress) was 1.8 Megapascals. The specimen may be lowered into a silicone oil bath where the temperature is raised at 2°C per minute until it deflects 0.25 mm (0.32 mm for ISO Test No. 75-2:2013).
- Tensile Modulus, Tensile Stress, and Tensile Elongation Tensile properties may be tested according to ISO Test No. 527:2019 (technically equivalent to ASTM D638). Modulus and strength measurements may be made on the same test strip sample having a length of 80 mm, thickness of 10 mm, and width of 4 mm. The testing temperature may be 23°C, and the testing speeds may be 1 or 5 mm/min.
- Flexural properties may be tested according to ISO Test No. 178:2019 (technically equivalent to ASTM D790). This test may be performed on a 64 mm support span. Tests may be run on the center portions of uncut ISO 3167 multi purpose bars. The testing temperature may be 23°C and the testing speed may be 2 mm/min.
- Unnotched and Notched Charpy Impact Strength Charpy properties may be tested according to ISO Test No. ISO 179-1:2010) (technically equivalent to ASTM D256-10, Method B). This test may be run using a Type 1 specimen size
- the notch may be a Type A notch (0.25 mm base radius).
- Specimens may be cut from the center of a multi-purpose bar using a single tooth milling machine.
- the testing temperature may be 23°C.
- volume resistivity is also determined as the ratio of the potential gradient parallel to the current in a material to the current density. In SI units, volume resistivity is numerically equal to the direct-current resistance between opposite faces of a one- meter cube of the material (ohm-m).
- a sample is formed for use in the substrate of an electronic device as described herein.
- the sample contains a liquid crystalline polymer (“LCP 1”), NyglosTM 8, carbon black pigment, and GlycolubeTM P.
- LCP 1 is formed from 60 mol.% HBA, 5 mol.% HNA, 12 mol.% BP, 17.5 mol.% TA, and 5 mol.% APAP.
- Compounding is performed using an 18-mm single screw extruder. Parts are injection molded the samples into plaques (60 mm x 60 mm).
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EP21760779.5A EP4110885A4 (en) | 2020-02-26 | 2021-02-24 | Electronic device |
KR1020227033171A KR20220147629A (en) | 2020-02-26 | 2021-02-24 | electronic device |
JP2022551594A JP2023515975A (en) | 2020-02-26 | 2021-02-24 | electronic device |
CN202180030448.6A CN115605560A (en) | 2020-02-26 | 2021-02-24 | Electronic device |
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US63/057,349 | 2020-07-28 | ||
US63/057,353 | 2020-07-28 | ||
US17/178,292 US11715579B2 (en) | 2020-02-26 | 2021-02-18 | Electronic device |
US17/178,295 US11702539B2 (en) | 2020-02-26 | 2021-02-18 | Polymer composition for an electronic device |
US17/178,295 | 2021-02-18 | ||
US17/178,292 | 2021-02-18 |
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WO2021173411A1 (en) * | 2020-02-26 | 2021-09-02 | Ticona Llc | Polymer composition for an electronic device |
KR20220146567A (en) | 2020-02-26 | 2022-11-01 | 티코나 엘엘씨 | electronic device |
US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
EP4163714A4 (en) | 2020-10-23 | 2023-11-22 | Samsung Electronics Co., Ltd. | Display device |
US11728559B2 (en) | 2021-02-18 | 2023-08-15 | Ticona Llc | Polymer composition for use in an antenna system |
WO2023136990A1 (en) * | 2022-01-13 | 2023-07-20 | Ticona Llc | High performance polymer composition containing carbon nanostructures |
WO2024016311A1 (en) * | 2022-07-22 | 2024-01-25 | Ticona Llc | Temperature sensor for battery module |
WO2024016312A1 (en) * | 2022-07-22 | 2024-01-25 | Ticona Llc | In-wheel motor |
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KR20220147629A (en) | 2022-11-03 |
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TW202202601A (en) | 2022-01-16 |
CN115605560A (en) | 2023-01-13 |
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EP4110885A4 (en) | 2024-04-24 |
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