WO2021169824A1 - 一种天线连接装置、天线组件和电子设备 - Google Patents

一种天线连接装置、天线组件和电子设备 Download PDF

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Publication number
WO2021169824A1
WO2021169824A1 PCT/CN2021/076678 CN2021076678W WO2021169824A1 WO 2021169824 A1 WO2021169824 A1 WO 2021169824A1 CN 2021076678 W CN2021076678 W CN 2021076678W WO 2021169824 A1 WO2021169824 A1 WO 2021169824A1
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WO
WIPO (PCT)
Prior art keywords
antenna
dielectric layer
connection device
layer
coupling
Prior art date
Application number
PCT/CN2021/076678
Other languages
English (en)
French (fr)
Inventor
孙乔
李堃
呼延思雷
杜伍魁
杨朝亮
王争苗
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to US17/801,613 priority Critical patent/US20230083590A1/en
Priority to EP21761298.5A priority patent/EP4071928B1/en
Publication of WO2021169824A1 publication Critical patent/WO2021169824A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H01Q1/244—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas extendable from a housing along a given path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/40—Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole

Definitions

  • This application relates to the field of antenna technology, and in particular to an antenna connection device, an antenna assembly and an electronic device.
  • Smart terminals such as mobile phones need to communicate through the mobile communication network provided by the operator. They can also realize the communication connection between smart devices through WIFI, Bluetooth, infrared and other methods.
  • communication signals are sent and received through antennas.
  • Each antenna needs at least one feed point and one ground point.
  • the antenna is electrically connected to the radio frequency module on the motherboard through the feed point.
  • the grounding point is electrically connected to the floor or the grounding point of the main board to achieve grounding.
  • the antenna when the antenna is connected to the feeding point or the grounding point, there are mainly two ways to connect.
  • One way is to weld the spring pin on the feeding point or the grounding point, the antenna is provided with a corresponding spring pad, and the other One is to use screws to electrically connect the metal surface of the antenna with the feed point or the ground point.
  • the antenna when the antenna is electrically connected to the feed point or the grounding point with a spring foot, the antenna needs to be equipped with a spring contact pad, and there are corresponding design specifications for the size of the spring contact surface.
  • the spring foot takes up a large space, and the antenna and the feed
  • flexible metal buffer materials need to be arranged on the antenna and the feeding point or the grounding point, which leads to higher costs.
  • the present application provides an antenna connection device, antenna assembly and electronic equipment, which realize the non-contact coupling and connection of the antenna and the feeding point or the grounding point, reducing the cost when the antenna is connected to the feeding point or the grounding point, and reducing
  • the antenna connection device occupies space in the electronic equipment, avoiding the provision of elastic contact pads on the antenna body.
  • the first aspect of the embodiments of the present application provides an antenna connection device for coupling and connecting an antenna to a feeding point or a ground point, and the antenna connection device includes a stacked arrangement:
  • the side of the pad facing away from the first dielectric layer is used to be electrically connected to the feed point or to the ground point;
  • the side of the second dielectric layer away from the coupling metal layer is connected to the antenna, so that the antenna is coupled to the coupling metal layer.
  • the side of the pad facing away from the first dielectric layer is electrically connected to the feed point or to the ground point, and the side of the second dielectric layer away from the coupling metal layer is connected to the antenna to achieve
  • the feed point or ground point is electrically connected to the antenna in a non-contact manner.
  • the antenna is connected to the feed point or ground point through the antenna connection device, but the metal surface of the antenna is not in direct contact with the metal surface in the antenna connection device, and the antenna is The coupling connection between the feeding point or the grounding point replaces the direct connection.
  • the metal surface of the antenna and the metal surface of the antenna connection device form a coupling capacitor.
  • the antenna connection device provided in the embodiments of the present application realizes the effect of non-contact electrical connection between the antenna and the feeding point or the grounding point, avoids setting elastic contact pads or flexible metal buffer materials on the antenna, and avoids feeding Spring feet and flexible metal buffer materials are provided on the electrical points or contacts, thereby reducing the cost of antenna connection, and there is no limit to the metal area of the antenna connection device and the antenna coupling, so the volume of the antenna connection device can be reduced, and the antenna connection device can be reduced in the mobile phone. Take up space in.
  • the hardness of the second dielectric layer is less than the hardness of the first dielectric layer.
  • the second dielectric layer can also reduce the gap tolerance between the coupling metal layer and the antenna, and reduce the fluctuation of the coupling capacitance.
  • the second dielectric layer is an insulating layer made of a flexible material
  • the first dielectric layer is an insulating layer made of an inflexible material.
  • the second dielectric layer is a foam layer.
  • the second dielectric layer can also reduce the gap tolerance between the coupling metal layer and the antenna, and reduce the fluctuation of the coupling capacitance.
  • the second dielectric layer and the first dielectric layer are hard insulating layers made of inflexible materials.
  • the distance between the coupling metal layer and the pad will not be reduced under the action of external force, and the vertical height of the coupling metal layer will not be reduced, which avoids increasing the distance between the antenna and the coupling metal layer and causing the antenna and coupling The problem of reduced coupling effect between metal layers.
  • the first dielectric layer is a dielectric layer made of resin material, ceramic or composite material.
  • the thickness of the second dielectric layer is not higher than 3 mm. This ensures that the coupling interval between the antenna and the coupling metal layer meets the requirements of capacitive coupling.
  • the thickness of the first dielectric layer is higher than 0.1 mm. This ensures the coupling effect.
  • the orthographic projection area of the antenna connection device toward the antenna is less than or equal to 1 mm 2 .
  • the orthographic projection of the second dielectric layer on the coupling metal layer completely covers the coupling metal layer
  • the orthographic projection of the second dielectric layer on the coupling metal layer partially covers the coupling metal layer.
  • a second aspect of the embodiments of the present application provides an antenna assembly, including: at least one antenna, a feed point, a feed source electrically connected to the feed point, and at least one antenna connection device as described above;
  • the pad in the antenna connection device is electrically connected to the feeding point, and the second dielectric layer in the antenna connection device is connected to the antenna.
  • it further includes: a ground point, the antenna connection device is multiple, and the antenna is electrically coupled to the feed point through one of the antenna connection device, and the antenna is The other antenna connection device is coupled and electrically connected to the ground point.
  • the pad in the antenna connection device is electrically connected to the feed point or the ground point through a surface mount technology SMT;
  • the second dielectric layer in the antenna connection device is connected to the antenna by bonding.
  • a third aspect of the embodiments of the present application provides an electronic device, including a display screen, a circuit board, and a housing, the circuit board is located in a space enclosed by the housing and the display screen, and further includes: any one of the foregoing In the antenna assembly, the feed point and the feed source in the antenna assembly are provided on the circuit board.
  • the high-frequency current fed from the feeding point is transmitted to the antenna through the coupling effect of the metal surface in the antenna connection device and the antenna, and the high-frequency current is emitted from the antenna in the form of electromagnetic waves to achieve The effect of the non-contact coupling and electrical connection between the antenna and the feeding point or grounding point, avoiding the setting of spring pads or flexible metal buffer materials on the antenna, and avoiding the setting of spring feet and flexible metal buffer materials on the feeding point or contact , Thereby reducing the cost of antenna connection, and there is no limit to the metal area of the antenna connection device and the antenna coupling, so the volume of the antenna connection device can be reduced, and the space occupied by the antenna connection device in the mobile phone can be reduced.
  • the non-contact electrical connection of the grounding point avoids the problem of harmonics caused by metal contact between the antenna and the feeding point or the grounding point.
  • At least part of the antennas in the antenna assembly are provided on the inner surface of the housing facing the display screen;
  • a third dielectric layer made of flexible material is arranged between the antenna and the inner surface of the housing.
  • the third dielectric layer can absorb the amount of deformation, so that the tolerance of the gap between the antenna and the battery cover is reduced, and the adhesion between the antenna and the coupling metal layer is ensured to be tighter.
  • the third dielectric layer is a dielectric layer made of non-conductive foam.
  • the antenna may be a flexible circuit board (FPC) antenna, a laser direct structuring (LDS) antenna, a pattern decoration antenna (MDA), or a metal frame antenna.
  • FPC flexible circuit board
  • LDS laser direct structuring
  • MDA pattern decoration antenna
  • the housing includes a metal frame, and at least a part of the metal frame serves as the antenna;
  • the inner side of the metal frame as the antenna has at least one metal extension, and the antenna is connected to the second dielectric layer in the antenna connection device through the metal extension. In this way, the function of the antenna connecting device for non-contact coupling and connection of the antenna with the feeding point or the grounding point is realized.
  • part of the inner side surface of the metal frame faces inward and extends along a horizontal direction to form a boss, and the boss serves as the metal extension.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of an electronic device provided by an embodiment of the application
  • 2A is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of this application.
  • 2B is a schematic diagram of another exploded structure of the electronic device provided by an embodiment of the application.
  • 3A is a schematic structural diagram of an antenna assembly in an electronic device provided by an embodiment of the application.
  • 3B is another schematic diagram of the structure of the antenna assembly in the electronic device provided by an embodiment of the application.
  • 4A is a schematic cross-sectional structure diagram of an antenna connection device in an electronic device provided by an embodiment of the application;
  • 4B is a schematic diagram of another cross-sectional structure of the antenna connection device in the electronic device provided by an embodiment of the application;
  • 4C is a schematic diagram of another cross-sectional structure of the antenna connection device in the electronic device provided by an embodiment of the application;
  • 5A is a schematic cross-sectional structure diagram of an antenna assembly and a battery cover in an electronic device provided by an embodiment of the application;
  • 5B is another schematic cross-sectional structure diagram of the antenna assembly and the battery cover in the electronic device provided by an embodiment of the application;
  • 6A is a schematic diagram of the structure of the frame when the frame in the electronic device is used as an antenna according to an embodiment of the application;
  • FIG. 6B is a schematic cross-sectional structure diagram of the electronic device along the direction C-C in FIG. 6A according to an embodiment of the application.
  • An electronic device provided by an embodiment of this application includes, but is not limited to, a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, and a personal digital Mobile or fixed terminals with antennas such as personal digital assistant (PDA), wearable devices, virtual reality devices, wireless USB flash drives, Bluetooth audio/headsets, or car front-mounted devices.
  • PDA personal digital assistant
  • the mobile phone is the above-mentioned electronic device as an example for description.
  • the mobile phone provided in the embodiment of the application may be a bar phone, a sliding phone or a folding mobile phone.
  • a bar phone is taken as an example in the embodiment of the application.
  • the display screen of the mobile phone provided in the embodiment of the present application may be a water drop screen, a notch screen, a hole-digging screen, or a full screen.
  • the following description takes the hole-digging screen as an example.
  • the mobile phone 100 may include: a display screen 10 and a housing 20.
  • the housing 20 may include a middle frame 20a and a battery.
  • Cover 20b, a middle frame 20a, a circuit board 30 and a battery 40 can be arranged between the display screen and the battery cover 20b.
  • the circuit board 30 and the battery cover 20b can be arranged on the middle frame 20a.
  • the circuit board 30 and the battery 40 can be arranged on the side of the middle frame 20a facing the battery cover 20b, or the circuit board 30 and the battery 40 can be arranged on the middle frame.
  • the side 20a faces the display screen.
  • the positions of the battery cover 20b and the circuit board 30 are not limited.
  • the battery 40 may be connected to the charging management module and the circuit board 30 through a power management module.
  • the power management module receives input from the battery 40 and/or the charging management module and is a processor, internal memory, and external memory. , Display screen, camera and communication module, etc.
  • the power management module can also be used to monitor the capacity of the battery 40, the number of cycles of the battery 40, and the health status (leakage, impedance) of the battery 40 and other parameters.
  • the power management module may also be provided in the processor of the circuit board 30.
  • the power management module and the charging management module may also be provided in the same device.
  • the display screen can be an Organic Light-Emitting Diode (OLED) display or a Liquid Crystal Display (LCD).
  • OLED Organic Light-Emitting Diode
  • LCD Liquid Crystal Display
  • the display screen is provided with an opening 11 corresponding to the front camera (not shown). It should be noted that the display screen generally includes a transparent protective cover, and the opening 11 is opened on the display module of the display screen.
  • the battery cover 20b may be a metal battery cover, a glass battery cover, a plastic battery cover, or a ceramic battery cover.
  • the material of the housing 20 is not limited.
  • the middle frame 20a may include a metal middle plate 22a and a frame 21a.
  • the frame 21a is arranged one round around the outer circumference of the metal middle plate 22a.
  • the frame 21a may include a top frame, a bottom frame, a left frame, and a right frame.
  • the top frame, the bottom frame, the left frame, and the right frame enclose the frame 21a in a square ring structure.
  • the metal middle plate 22a may be an aluminum plate, an aluminum alloy, or a magnesium alloy.
  • the frame 21a may be a metal frame 21a, a ceramic frame 21a or a glass frame 21a.
  • the metal middle frame 20a and the frame 21a can be clamped, welded, glued or integrally formed, or the metal middle frame 20a and the frame 21a are fixedly connected by injection molding.
  • the structure of the mobile phone 100 may also be as shown in FIG. 2B.
  • the mobile phone 100 may include: a display screen 10 and a housing 20.
  • the battery cover may include a frame 21c and a bottom cover 22c, and the frame 21c and the bottom cover 22c may be integrally formed by injection molding.
  • the frame 21a and the battery cover 20b in FIG. 2A can be integrally formed to form the housing 20 in FIG. 2B.
  • an antenna assembly 200 is also provided in the electronic device.
  • the antenna assembly 200 may include at least one antenna 60, a feeding point 31, and a feeding point electrically connected to the feeding point 31.
  • the source 33, the feeding point 31 and the feeding source 33 are arranged on the circuit board 30, and the feeding point 31 and the feeding source 33 can be electrically connected through the feeder 32.
  • the feeding source 33 can be a radio frequency module, and the feeding point 31 is a conductive point.
  • the feeding point 31 is used to feed the high-frequency current emitted by the feed source 33 into the antenna 60.
  • the multiple antennas 60 may include multiple-input multiple-output (MIMO) antennas, Bluetooth antennas, GPS antennas, WIFI antennas, main antennas, and diversity antennas.
  • MIMO multiple-input multiple-output
  • the working frequency band of the MIMO antenna can be (1.7-2.2GHz) and (2.3-2.6GHz)
  • the working frequency band of the Bluetooth antenna can be (2400-2500MHz)
  • the working frequency band of the GPS antenna can be (1575-1602MHz)
  • WIFI The working frequency band of the antenna can be (2400-2500MHz)
  • the working frequency band of the main antenna can be (824-960MHz), (1710-2170MHz) and (2500-2690MHz).
  • the multiple antennas 60 may also include 5G antennas.
  • the working frequency bands of the 5G antennas may be (3300-3600MHZ) and (4800-5000MHz). It should be noted that the above-mentioned working frequency bands It can also be adjusted according to the actual situation.
  • the antenna 60 in order to make the antenna 60 transmit or receive electrical signals outward, the antenna 60 often needs to be electrically connected to the feeding point 31 on the circuit board 30, wherein the circuit board 30 is provided with an electrical connection to the feeding point 31 through a feed line 32
  • the feed source 33 feeds the high-frequency current to the antenna 60 through the feed point 31, and the high-frequency current is emitted from the antenna 60 in the form of an induction cooker.
  • the antenna 60 also needs to be grounded.
  • the antenna assembly 200 further includes a ground point 34.
  • the ground point 34 may be located on the circuit board 30, or the ground point 34 may be located on the floor (such as metal).
  • the ground point 34 may be a contact point where the antenna is electrically connected to the ground layer on the circuit board 30, or the ground point 34 may be a contact point when the antenna 60 abuts against the floor.
  • the antenna 60 and the feeding point 31 or the grounding point 34 are electrically connected by using spring feet to contact the elastic contact pads on the antenna 60, or between the antenna 60 and the feeding point 31 or the grounding point 34
  • the spring foot screw is electrically connected.
  • the spring foot when the spring foot is used to contact and electrically connect the spring contact pad on the antenna 60, the spring contact pad needs to be provided on the antenna 60, and there are corresponding design specifications for the size of the spring contact surface.
  • the foot occupies a large space, and when assembling, when the spring foot is on the spring contact pad, when the antenna 60 is provided on the inner surface of the battery cover 20b, the force of the spring foot on the battery cover 20b increases, especially when the battery cover 20b When there are more antennas 60 on the inner surface of the, more spring legs need to be provided, so that the multiple spring legs put a greater pressure on the battery cover 20b.
  • the antenna 60 is electrically connected to the feeding point 31 or the grounding point 34 through direct contact.
  • the feeding point 31 or the grounding point 34 directly electrically contacts the screw, and the screw electrically contacts the antenna 60.
  • the feeding point 31 or the grounding point 34 directly electrically contacts the spring pins, and the spring pins are in direct point contact with the spring pads.
  • the screws, spring pins and spring pads are all hard materials, so it is easy to bring them in direct contact. The problem of harmonics.
  • a spring foot or flexible metal buffer material is set at the feeding point 31 or the grounding point 34, a step of laser engraving on the metal surface is also required, and the entire assembly steps are many, which affects the assembly efficiency.
  • the antenna assembly 200 further includes at least one antenna connection device 50.
  • the antenna connection device 60 Through the antenna connection device 60, the feed point 31 or the ground point 34 and the antenna 60 can be connected to each other.
  • Contact electrical connection For example, referring to FIG. 3B, the antenna 60 is connected to the feed point 31 or the ground point 34 through the antenna connection device 50, and the metal surface of the antenna 60 is not in direct contact with the metal surface of the antenna connection device 50, and the antenna 60 is connected to the feed point.
  • the electrical point 31 or the ground point 34 uses a coupling connection instead of a direct connection.
  • the metal surface of the antenna 60 and the middle metal surface of the antenna connection device 50 form a coupling capacitor, and the metal in the antenna 60 and the antenna connection device 50 is realized through the function of the capacitor.
  • the coupling connection between the surfaces so that the high-frequency current fed from the feeding point 31 is transmitted to the antenna 60 through the coupling effect of the metal surface of the antenna connection device 50 and the antenna 60, and the high-frequency current is electromagnetic wave on the antenna 60 Launch outwards.
  • the number of the antenna connection devices 50 is at least two, and one of the antenna connection devices 50 can connect the feed point 31 A coupling connection with the antenna 60 is realized, and another antenna connection device 50 can connect the antenna 60 with the ground point 34.
  • the antenna connection device 50 realizes the effect of non-contact electrical connection between the antenna 60 and the feed point 31 or the ground point 34, avoiding the provision of spring pads or flexible metal buffer materials on the antenna 60 and avoiding
  • the antenna connecting device 50 can be reduced.
  • the volume of the antenna connection device 50 in the mobile phone 100 is reduced.
  • the antenna connection device 50 may include a bonding pad 54, a first dielectric layer 51, a coupling metal layer 53, and a second dielectric layer 52.
  • the first dielectric layer 51 is located between the bonding pad 54 and the coupling metal layer 53.
  • the first dielectric layer 51 may be an insulating layer to separate the bonding pad 54 and the coupling metal layer 53.
  • the pad 54 and the coupling metal layer 53 are electrically connected through at least one via 511 provided in the first dielectric layer 51.
  • the first dielectric layer 51 is provided with four vias 511, and the pad 54
  • the electrical connection with the coupling metal layer 53 is achieved through four vias 511.
  • the number of vias 511 includes but is not limited to 4, and can also be 1 or 3 or more than 5.
  • the via 511 is a conductive hole formed by filling a conductive material in the hole.
  • the via 511 may be vertically provided in the first dielectric layer 51.
  • the via 511 may also be in the first dielectric.
  • the layer 51 is arranged obliquely.
  • the coupling metal layer 53 is located between the first dielectric layer 51 and the second dielectric layer 52.
  • the layer 52 is an insulating layer, so that the upper and lower end surfaces of the coupling metal layer 53 have insulating layers, so that the coupling contact layer and other metal surfaces (that is, the antenna 60 and the pad 54) cannot directly contact, thereby realizing the connection of the two metal layers. Coupled connection.
  • the side of the pad 54 away from the first dielectric layer 51 is used to be electrically connected to the feeding point 31 or to the grounding point 34.
  • the pad 54 and the feeding point 31 or the grounding point 34 can be surface-mounted Technology (Surface Mount Technology, SMT) realizes electrical connection.
  • SMT Surface Mount Technology
  • the pad 54 may also be electrically connected to the feed point 31 or the ground point 34 in other ways.
  • the high-frequency current emitted by the feed source 33 can be fed into the pad 54 through the feeding point 31, and the high-frequency current on the pad 54 is transmitted to the coupling metal layer 53 through the hole 511, and the coupling metal layer 53 and the antenna 60 coupling allows high-frequency current to pass to the antenna 60 and radiate outward.
  • the side of the second dielectric layer 52 away from the coupling metal layer 53 is connected to the antenna 60.
  • the top surface of the second dielectric layer 52 is connected to the antenna 60, so that the antenna 60 and the coupling metal layer 53 pass through the second medium.
  • the layers 52 are separated, and the antenna 60 is coupled to the coupling metal layer 53 to realize a non-contact connection between the antenna 60 and the coupling metal layer 53.
  • the second dielectric layer 52 and the antenna 60 in the antenna connection device 50 can be connected by bonding.
  • the second dielectric layer 52 and the antenna 60 are connected by adhesive.
  • the second dielectric layer 52 and the antenna 60 can also be connected. Connect through other means.
  • the first dielectric layer 51 can separate the pad 54 from the coupling metal layer 53 on the one hand, and can also support the coupling metal layer 53 on the other hand, so that the coupling metal layer 53 acts on external forces. It is not easy to move down close to the pad 54.
  • the second dielectric layer 52 separates the antenna 60 from the coupling metal layer 53.
  • the second dielectric layer 52 can also reduce the gap tolerance between the coupling metal layer 53 and the antenna 60 and reduce the fluctuation of the coupling capacitance.
  • the first dielectric layer 51 needs to support the coupling metal layer 53. If a flexible material is selected for the first dielectric layer 51, the coupling metal layer 53 and the pad 54 will be under the action of external force. The distance between the antenna 60 and the coupling metal layer 53 is reduced, and the vertical height of the coupling metal layer 53 is reduced. The coupling effect is reduced. Therefore, in the embodiment of the present application, the first dielectric layer 51 is a hard layer made of a non-flexible material.
  • the second dielectric layer 52 and the first dielectric layer 51 may be hard insulating layers made of inflexible materials, for example, the second dielectric layer 52 and the first dielectric layer
  • the dielectric layer 51 may be a hard dielectric layer made of resin material (for example, a resin material with a flame resistance rating of FR4), ceramics or composite materials.
  • the materials of the second dielectric layer 52 and the first dielectric layer 51 may be the same (for example, in FIG. 4A) or different.
  • the gap between the coupling metal layer 53 and the antenna 60 has a relatively large tolerance.
  • the gap between the coupling metal layer 53 and the antenna 60 is difficult to keep consistent with the second dielectric layer 52, which is harder.
  • the gap tolerance between the antennas 60 is large, which causes the coupling metal layer 53 and the antenna 60 to not be in a parallel state, and the coupling capacitance fluctuates greatly.
  • the second dielectric layer 52 and the first dielectric layer 51 are made of different materials, and the hardness of the second dielectric layer 52 is less than the hardness of the first dielectric layer 51, for example, the hardness of the first dielectric layer 51 is different from that of the first dielectric layer 51.
  • the hardness of the second dielectric layer 52 is different, and the hardness of the second dielectric layer 52 is relatively small.
  • the second dielectric layer 52 When the hardness of the second dielectric layer 52 is relatively small, so that when the second dielectric layer 52 is connected to the antenna 60 and the coupling metal layer 53, the second dielectric layer 52 The dielectric layer 52 can be tightly attached between the coupling metal layer 53 and the antenna 60 under pressure, thereby reducing the gap tolerance between the coupling metal layer 53 and the antenna 60, and ensuring that the coupling contact layer and the antenna 60 are two
  • the parallel metal layers reduce the fluctuation of the coupling capacitance.
  • the second dielectric layer 52 may be an insulating layer made of a flexible material.
  • the second dielectric layer 52 may be made of a flexible board.
  • the specific flexible material refer to the flexible material in the prior art.
  • the composition of the material is not limited.
  • the second dielectric layer 52 may be a foam layer, so that the foam layer can be compressed, so that the gap tolerance between the antenna 60 and the coupling metal layer 53 is smaller.
  • the second dielectric layer 52 may include but is not limited to be made of foam material. It should be noted that since the second dielectric layer 52 is an insulating layer, the second dielectric layer 52 is formed of a non-conductive foam material. It should be noted that when the second dielectric layer 52 is a foam layer, the foam layer may be formed of foam glue, so that the antenna 60 is glued to the second dielectric layer 52, or, in this embodiment, the second medium When the layer 52 is not sticky and cannot be glued to the antenna 60, a separate glue layer can also be provided to bond the second dielectric layer 52 and the antenna 60 together.
  • the coupling interval between the antenna 60 and the coupling metal layer 53 is related to the thickness of the second dielectric layer 52.
  • the thickness of the dielectric layer 52 is relatively large, it may easily occur that the coupling interval between the antenna 60 and the coupling metal layer 53 does not meet the requirements of capacitive coupling, so that the coupling between the antenna 60 and the coupling metal layer 53 cannot be achieved. Therefore, the implementation of this application In an example, the thickness of the second dielectric layer 52 is not higher than 3 mm.
  • the thickness of the second dielectric layer 52 may be 3 mm, or the thickness of the second dielectric layer 52 may be 2 mm.
  • the thickness of the first dielectric layer 51 is higher than 0.1 mm.
  • the thickness of the first dielectric layer 51 may be 1 mm, or the thickness of the first dielectric layer 51 may be 0.5 mm.
  • the thickness of the first dielectric layer 51 includes but is not limited to 1 mm or 0.5 mm, and other values are also possible.
  • the orthographic projection area of the antenna connection device 50 toward the antenna 60 is less than or equal to 1 mm 2 , for example, the orthographic projection area of the antenna connection device 50 toward the antenna 60 may be 0.81 mm 2 , or the antenna connection device 50 is facing The orthographic projection area of the antenna 60 may be 0.72 mm 2 .
  • the orthographic projection of the antenna connection device 50 toward the antenna 60 is a projection of the antenna connection device 50 perpendicular to the antenna 60.
  • the antenna connection device 50 provided by the embodiment of the present application is connected to the antenna 60, there is no limitation on the connection area, so the volume of the antenna connection device 50 can be reduced, so that the space occupied in the mobile phone 100 is reduced, and the saved volume can be reduced. For other components to set up.
  • the orthographic projection of the second dielectric layer 52 on the coupling metal layer 53 completely covers the coupling metal layer 53.
  • the second dielectric layer 52 completely covers the coupling metal layer 53.
  • the second dielectric layer 52 has an entire layer structure that can cover the coupling metal layer 53.
  • the orthographic projection of the second dielectric layer 52 on the coupling metal layer 53 partially covers the coupling metal layer 53.
  • the second dielectric layer 52 may be arranged on the coupling metal layer 53 at intervals, and the coupling metal layer 53 Part of the area is exposed, so that after the second dielectric layer 52 is connected to the antenna 60, there is a gap 521 between the coupling metal layer 53 and the antenna 60, thereby facilitating air flow to circulate in the gap 521, and achieving good heat dissipation of the antenna connection device 50 .
  • the antenna 60 may be a flexible printed circuit (FPC) antenna, or the antenna 60 may be a laser-direct-structuring (LDS) antenna, or the antenna 60 may also be a pattern decoration
  • the antenna (Mode decoration antenna, MDA), or the antenna 60 may also be a metal frame antenna (that is, the metal frame serves as an antenna).
  • the first application between the antenna connection device 50 and the FPC antenna is set to scene 1
  • the first application between the antenna connection device 50 and the FPC antenna is set to scenario two
  • the application of the antenna connection device 50 on the metal frame antenna is set to scenario three.
  • the antenna 60 is an FPC antenna as an example for description.
  • the FPC antenna is provided on the inner surface 21b of the battery cover 20b, and the second dielectric layer 52 of the antenna connection device 50 is connected to one side of the FPC antenna.
  • the pad 54 of the antenna connection device 50 is connected to the feed point 31 by SMT bonding.
  • the first dielectric layer 51 is made of resin with a flame resistance rating of FR4, and the second dielectric layer 52 may be a foam Cotton layer.
  • the second dielectric layer 52 is clamped between the antenna 60 and the coupling metal layer 53. Since the second dielectric layer 52 is foam, the second dielectric layer 52 absorbs the deformation, so that the antenna 60 and the coupling metal layer 53 The gap tolerance is reduced, and the fluctuation of the coupling capacitance is reduced.
  • a second dielectric layer 52 is provided between the antenna 60 and the coupling metal layer 53, and the second dielectric layer 52 is made of a flexible material. After assembly, the second dielectric layer 52 can be connected between the antenna 60 and the coupling metal layer 53.
  • the metal layers 53 play a buffering role, and the non-contact connection of the antenna 60 makes the pressure exerted by the antenna connection device 50 on the antenna 60 less than the pressure of the spring feet and screws on the antenna 60, thereby ensuring that the antenna 60 and the feeding point 31 After connection, the pressure of the antenna connection device 50 on the battery cover 20b is reduced, so that the battery cover 20b can bear more antennas 60 arrangements, so that the mobile phone 100 can cover more frequency bands.
  • the antenna 60 is an FPC antenna as an example for description.
  • the FPC antenna is provided on the inner surface 21b of the battery cover 20b, and the second dielectric layer 52 of the antenna connection device 50 is connected to one side of the FPC antenna.
  • the pad 54 of the antenna connection device 50 is connected to the feed point 31 by SMT bonding.
  • the first dielectric layer 51 and the second dielectric layer 52 are made of the same material and are made of non-flexible materials.
  • the hard film layer, for example, the first dielectric layer 51 and the second dielectric layer 52 are made of resin with a flame resistance rating of FR4.
  • a third dielectric layer 61 made of a flexible material is arranged between the antenna 60 and the inner surface of the battery cover 20b.
  • the third dielectric layer 61 can absorb the deformation, so that the antenna 60
  • the gap tolerance between the battery cover 20b and the battery cover 20b is reduced to ensure a tighter fit between the antenna 60 and the coupling metal layer 53.
  • the third dielectric layer 61 may be a film layer made of non-conductive foam.
  • the antenna 60 when the third dielectric layer 61 provided between the antenna 60 and the inner surface of the battery cover 20b is a foam glue layer, when the antenna 60 is torn off from the battery cover 20b, the antenna 60 can interact with the second dielectric layer 52 Tear off the battery cover 20b together or buffer the antenna 60 to avoid the problem that the antenna 60 is easily broken when the antenna 60 is torn off the battery cover 20b when the antenna 60 is directly connected to the inner surface of the battery cover 20b.
  • the second dielectric layer 52 may also be a foam layer, so that the materials of the second dielectric layer 52 and the third dielectric layer 61 may be the same.
  • the antenna 60 is a metal frame antenna as an example for description.
  • the frame 21a of the mobile phone 100 may be a metal frame, and the metal frame may be slit to form an antenna.
  • the metal frame is divided to form a plurality of metal frame antennas, such as a metal frame antenna 211a and a metal frame antenna 212a.
  • the pad 54 of the antenna connection device 50 is connected to the feed point 31 by SMT bonding, the first dielectric layer 51 is made of FR4 flame-resistant resin, and the second dielectric layer 52 is a foam layer.
  • the metal frame antenna 211a (or the metal frame antenna 212a) is connected to the circuit board 30.
  • the feeding point 31 or the grounding point 34 is coupled and connected.
  • the inner side of the metal frame antenna 211a has at least one metal extension 62.
  • a metal extension 62 extends inward in the direction of the inner side surface of the frame 21a, and the metal frame antenna 211a and the metal extension 62 both serve as the radiator of the antenna 60.
  • the metal extension 62 By providing the metal extension 62, the metal extension 62 can be aligned with the placement direction of the circuit board 30.
  • the second dielectric layer 52 of the antenna connection device 50 is connected to the metal extension 62, such as a metal frame antenna 211a
  • the antenna connection device 50 is connected to the antenna connection device 50 through the metal extension portion 62, and the antenna connection device 50 is located between the metal extension portion 62 and the feed point 31 or the ground point 34 in the longitudinal section.
  • one metal extension 62 is shown in FIG. 6A.
  • the metal frame antenna will be provided with one or two (one of which is grounded and the other is connected to a feed point) metal extension 62.
  • part of the inner side of the metal frame antenna 211a faces inward and extends along the horizontal direction to form a boss, and the boss serves as the metal extension 62, which ensures that the frame 21a and the metal extension 62 are integrally formed, and the frame 21a and the metal extension 62 are integrally formed. As an integral part, it is easier to assemble during assembly.
  • the metal frame antenna (for example, the metal frame antenna 211a) is coupled to the feed point 31 or the ground point 34 by providing the metal extension 62.
  • connection area between the antenna connection device 50 and the antenna 60 is not limited, the connection area between the antenna connection device 50 and the metal extension 62 can be reduced.
  • the cross-sectional area in the direction parallel to the display screen 10 can be reduced, so that the overlapping area of the metal extension 62 and the display screen 10 in the direction perpendicular to the screen is reduced, thereby reducing the metal layer in the display screen 10 (such as touch control).
  • the influence of the electrode layer, the gate metal layer or the pixel electrode layer) on the radiation performance of the antenna 60 is not limited, the connection area between the antenna connection device 50 and the metal extension 62 can be reduced.
  • the cross-sectional area in the direction parallel to the display screen 10 can be reduced, so that the overlapping area of the metal extension 62 and the display screen 10 in the direction perpendicular to the screen is reduced, thereby reducing the metal layer in the display screen 10 (such as touch control).
  • the influence of the electrode layer, the gate metal layer or the pixel electrode layer) on the radiation performance of the antenna 60 is not
  • the second dielectric layer 52 in the antenna connection device 50 is a foam layer
  • the metal extension 62 can move toward the coupling metal layer 53 with the compression of the second dielectric layer 52 under the action of an external force, so that the display screen 10 and the metal extension 62
  • the distance d is increased (see FIG. 6B), that is, the metal extension 62 of the metal frame antenna is far away from the display screen 10, so that the metal extension 62 of the metal frame antenna is far away from the metal layer in the display screen 10, so that the antenna can be enlarged.
  • the clearance between the metal extension 62 of the 60 and the metal layer in the display screen 10 makes the radiation performance of the antenna 60 better.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or Indirect connection through an intermediate medium can be the internal communication between two elements or the interaction between two elements.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or Indirect connection through an intermediate medium can be the internal communication between two elements or the interaction between two elements.

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Abstract

本申请实施例提供一种天线连接装置、天线组件和电子设备，电子设备可以为手机、平板电脑、笔记本电脑、超级移动个人计算机(UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(PDA)、可穿戴设备、虚拟现实设备、无线U盘、蓝牙音响/耳机、或车载前装等具有天线的移动或固定终端，通过天线连接装置实现了天线与馈电点或接地点非接触耦合连接，避免了在天线上设置弹接焊盘或柔性金属缓冲材料以及避免了在馈电点或接地点上设置弹脚和柔性金属缓冲材料，减低天线连接的成本，降低天线连接装置在手机中的占用空间。

Description

一种天线连接装置、天线组件和电子设备
本申请要求于2020年02月25日提交中国专利局、申请号为202010117356.9、申请名称为“一种天线连接装置、天线组件和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉天线技术领域，特别涉及一种天线连接装置、天线组件和电子设备。
背景技术
手机等智能终端需通过运营商提供的移动通信网络实现通信，其还能够通过WIFI、蓝牙、红外等多种方式实现智能设备之间的通信连接，对于手机而言，通信信号是通过天线实现收发，由于手机的通信方式多样，所以，在手机内部就需要设置比较多的天线，各个天线至少需要一个馈电点和一个接地点，天线通过馈电点与主板上的射频模块进行电连接，通过接地点与地板或主板接地点电连接实现接地。
目前，天线与馈电点或接地点连接时，主要采用两种方式进行连接，一种方式为在馈电点或接地点上焊接弹脚，天线上设有相应的弹接焊盘，另一种为采用螺钉将天线的金属面与馈电点或接地点进行电连接。
然后，天线与馈电点或接地点之间采用弹脚电连接时，天线上需设置弹接焊盘，且对弹接面的大小有相应的设计规范，弹脚占用空间大，天线与馈电点或接地点采用螺钉电连接时，需要在天线和馈电点或接地点上设置柔性金属缓冲材料，这样导致成本较高。
发明内容
本申请提供一种天线连接装置、天线组件和电子设备，实现了天线与馈电点或接地点非接触耦合连接的作用，降低了天线与馈电点或接地点连接时的成本，减小了天线连接装置在电子设备中的占用空间，避免了在天线本体上设置弹接焊盘。
本申请实施例第一方面提供一种天线连接装置，用于将天线与馈电点或接地点耦合连接，天线连接装置包括层叠设置的：
焊盘、第一介质层、耦合金属层和第二介质层，所述第一介质层位于所述焊盘和所述耦合金属层之间，所述耦合金属层位于所述第一介质层和所述第二介质层之间，且所述焊盘与所述耦合金属层之间通过所述第一介质层中设置的至少一个过孔电连接；
所述焊盘背离所述第一介质层的一面用于与所述馈电点或与所述接地点电连接；
所述第二介质层背离所述耦合金属层的一面与所述天线相连，以使所述天线与所述耦合金属层耦合连接。
通过所述焊盘背离所述第一介质层的一面与所述馈电点或与所述接地点电连接，所述第二介质层背离所述耦合金属层的一面与所述天线相连，实现了馈电点或接地点与天线非接触电连接，例如，天线通过该天线连接装置与馈电点或接地点相连，但是天线的金属表面与天线连接装置中的金属表面不直接接触，天线与馈电点或接地点之间用耦合连接代替 了直接连接，天线的金属表面与天线连接装置的中金属表面形成耦合电容，通过电容的作用连接天线与天线连接装置中的金属表面，这样从馈电点馈入的高频电流通过天线连接装置中的金属表面与天线的耦合作用传递到天线上，高频电流在天线上以电磁波方式向外发射。所以，本申请实施例中提供的天线连接装置，实现了天线与馈电点或接地点非接触电连接的作用，避免了在天线上设置弹接焊盘或柔性金属缓冲材料以及避免了在馈电点或接点上设置弹脚和柔性金属缓冲材料，从而减低天线连接的成本，而且天线连接装置与天线耦合的金属面积没有限制，所以可以减小天线连接装置的体积，降低天线连接装置在手机中的占用空间。
在一种可能的实现方式中，所述第二介质层的硬度小于所述第一介质层的硬度。这样第二介质层还可以降低耦合金属层和天线之间的缝隙公差，减小耦合电容的波动。
在一种可能的实现方式中，所述第二介质层为柔性材料制成的绝缘层，所述第一介质层为非柔性材料制成的绝缘层。这样第二介质层与天线和耦合金属层相连时，第二介质层可以在压力作用下与耦合金属层和天线之间贴合的更紧，从而可以降低耦合金属层与天线之间的缝隙公差，确保耦合接触层与天线为两个平行的金属层，减小耦合电容的波动。
在一种可能的实现方式中，所述第二介质层为泡棉层。这样第二介质层还可以降低耦合金属层和天线之间的缝隙公差，减小耦合电容的波动。
在一种可能的实现方式中，所述第二介质层和所述第一介质层为非柔性材料制成的硬质绝缘层。这样在外力作用下耦合金属层与焊盘之间的距离不会降低，耦合金属层在竖向上的高度不会降低，避免了将天线与耦合金属层之间的距离拉大而造成天线与耦合金属层之间的耦合效果降低的问题。
在一种可能的实现方式中，所述第一介质层为树脂材料、陶瓷或复合材料制成的介质层。
在一种可能的实现方式中，所述第二介质层的厚度不高于3mm。这样确保天线和耦合金属层之间耦合间隔满足电容耦合的要求。
在一种可能的实现方式中，所述第一介质层的厚度高于0.1mm。这样确保了耦合效果。
在一种可能的实现方式中，所述天线连接装置朝向所述天线的正投影面积小于等于1mm 2。
在一种可能的实现方式中，所述第二介质层在所述耦合金属层上的正投影完全覆盖所述耦合金属层，或者
所述第二介质层在所述耦合金属层上的正投影部分覆盖所述耦合金属层。
本申请实施例第二方面提供一种天线组件，包括：至少一个天线、馈电点、与所述馈电点电连接的馈源和至少一个上述任一所述的天线连接装置；
所述天线连接装置中的焊盘与所述馈电点电连接，所述天线连接装置中的第二介质层与所述天线相连。
在一种可能的实现方式中，还包括：接地点，所述天线连接装置为多个，且所述天线通过其中一个所述天线连接装置与所述馈电点耦合电连接，所述天线通过另一个所述天线连接装置与所述接地点耦合电连接。
在一种可能的实现方式中，所述天线连接装置中的所述焊盘通过表面贴装技术SMT与所述馈电点或所述接地点电连接；
所述天线连接装置中的所述第二介质层与所述天线通过粘合方式相连。
本申请实施例第三方面提供一种电子设备，包括显示屏、电路板和壳体，所述电路板位于所述壳体和所述显示屏围成的空间中，还包括：上述任一所述的天线组件，所述天线组件中的馈电点和馈源设在所述电路板。
通过包括上述天线连接装置，这样从馈电点馈入的高频电流通过天线连接装置中的金属表面与天线的耦合作用传递到天线上，高频电流在天线上以电磁波方式向外发射，实现了天线与馈电点或接地点非接触耦合电连接的作用，避免了在天线上设置弹接焊盘或柔性金属缓冲材料以及避免了在馈电点或接点上设置弹脚和柔性金属缓冲材料，从而减低天线连接的成本，而且天线连接装置与天线耦合的金属面积没有限制，所以可以减小天线连接装置的体积，降低天线连接装置在手机中的占用空间，另外，天线与馈电点或接地点非接触电连接，避免了天线与馈电点或接地点通过金属接触而产生谐波问题。
在一种可能的实现方式中，所述天线组件中的至少部分天线设在所述壳体朝向所述显示屏的内表面上；
且所述天线与所述壳体内表面之间设置由柔性材料制成的第三介质层。这样第三介质层可以吸收形变量，使得天线与电池盖之间的缝隙公差减小，确保天线与耦合金属层之间贴合的更紧。
在一种可能的实现方式中，所述第三介质层为非导电泡棉制成的介质层。
在一种可能的实现方式中，所述天线可以为柔性电路板(FPC)天线、激光直接成型(LDS)天线、模式装饰天线(MDA)或金属边框天线。
在一种可能的实现方式中，所述壳体包括金属边框，所述金属边框的至少部分区域作为所述天线；
且作为所述天线的所述金属边框的内侧面具有至少一个金属延伸部，所述天线通过所述金属延伸部与所述天线连接装置中的第二介质层相连。这样实现了天线连接装置将天线与馈电点或接地点非接触耦合连接的作用。
在一种可能的实现方式中，所述金属边框的部分内侧面朝内且沿着水平方向延伸形成凸台，所述凸台作为所述金属延伸部。
附图说明
图1为本申请一实施例提供的电子设备的立体结构示意图；
图2A为本申请一实施例提供的电子设备的爆炸结构示意图；
图2B为本申请一实施例提供的电子设备的又一爆炸结构示意图；
图3A为本申请一实施例提供的电子设备中天线组件的结构示意图；
图3B为本申请一实施例提供的电子设备中天线组件的另一结构示意图；
图4A为本申请一实施例提供的电子设备中天线连接装置的剖面结构示意图；
图4B为本申请一实施例提供的电子设备中天线连接装置的又一剖面结构示意图；
图4C为本申请一实施例提供的电子设备中天线连接装置的又一剖面结构示意图；
图5A为本申请一实施例提供的电子设备中天线组件与电池盖的剖面结构示意图；
图5B为本申请一实施例提供的电子设备中天线组件与电池盖的另一剖面结构示意图；
图6A为本申请一实施例提供的电子设备中边框作为天线时边框的结构示意图；
图6B为本申请一实施例提供的电子设备沿图6A中C-C方向的剖面结构示意图。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的具体实施例进行解释，而非旨在限定本申请，下面将结合附图对本申请实施例的实施方式进行详细描述。
本申请实施例提供的一种电子设备，包括但不限于为手机、平板电脑、笔记本电脑、超级移动个人计算机(ultra-mobile personal computer，UMPC)、手持计算机、对讲机、上网本、POS机、个人数字助理(personal digital assistant，PDA)、可穿戴设备、虚拟现实设备、无线U盘、蓝牙音响/耳机、或车载前装等具有天线的移动或固定终端。
其中，本申请实施例中，以手机为上述电子设备为例进行说明，本申请实施例提供的手机可以为直板手机、滑盖手机或折叠手机，具体本申请实施例中以直板手机为例进行说明，本申请实施例提供的手机的显示屏可以为水滴屏、刘海屏、挖孔屏或全面屏，下述描述以挖孔屏为例进行说明。
图1和图2A分别示出了一种手机结构，参见图1所示，手机100可以包括：显示屏10和壳体20，其中，如2A所示，壳体20可以包括中框20a和电池盖20b，显示屏与电池盖20b之间可以设置中框20a、电路板30和电池40。其中，电路板30和电池盖20b可以设置在中框20a上，例如，电路板30与电池40设置在中框20a朝向电池盖20b的一面上，或者电路板30与电池40可以设置在中框20a朝向显示屏的一面上，本实施例中，电池盖20b和电路板30的设置位置不做限定。
其中，本申请实施例中，电池40可以通过电源管理模块与充电管理模块和电路板30相连，电源管理模块接收电池40和/或充电管理模块的输入，并为处理器、内部存储器、外部存储器、显示屏、摄像头以及通信模块等供电。电源管理模块还可以用于监测电池40容量，电池40循环次数，电池40健康状态(漏电，阻抗)等参数。在其他一些实施例中，电源管理模块也可以设置于电路板30的处理器中。在另一些实施例中，电源管理模块和充电管理模块也可以设置于同一个器件中。
显示屏可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏，也可以为液晶显示屏(Liquid Crystal Display，LCD)。显示屏上开设与前置摄像头(未示出)对应的开孔11，需要说明的是，显示屏一般包括透明的保护盖板，开孔11开设在显示屏的显示模组上。
电池盖20b可以为金属电池盖，也可以为玻璃电池盖，还可以为塑料电池盖，或者，还可以为陶瓷电池盖，本申请实施例中，对壳体20材质不作限定。
参见图2A所示，中框20a可以包括金属中板22a和边框21a。边框21a围绕金属中板22a的外周设置一周。一般常说，边框21a可以包括顶边框、底边框、左侧边框和右侧边框，顶边框、底边框、左侧边框和右侧边框围成方环结构的边框21a。其中，金属中板22a可以为铝板，也可以为铝合金，还可以为镁合金。边框21a可以为金属边框21a，也可以为陶瓷边框21a或玻璃边框21a。金属中框20a和边框21a之间可以卡接、焊接、粘合或一体成型，或者金属中框20a与边框21a之间通过注塑固定相连。
需要说明的是，在一些其他示例中，手机100的结构还可以如图2B所示，例如手机100可以包括：显示屏10和壳体20，壳体20可以为具有边框21c的一体成型(Unibody) 的电池盖，例如，电池盖可以包括边框21c和底盖22c，边框21c和底盖22c可以通过注塑方式一体成型。本实施例中，图2A中的边框21a和电池盖20b可以一体成型形成图2B中的壳体20。
其中，为了确保电子设备的正常通信，电子设备内还设有天线组件200，如图3A所示，天线组件200可以包括至少一个天线60、馈电点31、与馈电点31电连接的馈源33，馈电点31和馈源33设在电路板30，馈电点31和馈源33之间可以通过馈线32电连接，馈源33可以为射频模块，馈电点31为导电点，馈电点31用于将馈源33发出的高频电流馈入天线60上。
天线60可以为多个，多个天线60可以包括多输入-多输出(Multiple-Input Multiple-Output，简称：MIMO)天线、蓝牙天线、GPS天线、WIFI天线、主天线和分集天线中的其中几种。其中，MIMO天线的工作频段可以为(1.7-2.2GHz)和(2.3-2.6GHz)，蓝牙天线的工作频段可以为(2400-2500MHz)，GPS天线的工作频段可以为(1575-1602MHz)，WIFI天线的工作频段可以为(2400-2500MHz)，其中主天线的工作频段可以为(824-960MHz)、(1710-2170MHz)和(2500-2690MHz)。
本申请实施例中，随着5G技术的发展，多个天线60还可以包括5G天线，5G天线的工作频段可以为(3300-3600MHZ)和(4800-5000MHz)，需要说明的是，上述工作频段也可以根据实际情况进行调整。
其中，为了使天线60向外发射或接收电信号，所以天线60往往需要与电路板30上的馈电点31电连接，其中，电路板30上设有与馈电点31通过馈线32电连接的馈源33，馈源33通过馈电点31向天线60馈入高频电流，高频电流在天线60上以电磁炉的方式向外发射。
此外，对于偶极子天线，天线60还需接地，参见图3B所示，天线组件200还包括接地点34，例如，接地点34可以位于电路板30上，或者接地点34位于地板(例如金属中板22a)上。需要说明的是，接地点34可以为天线与电路板30上接地层电连接的一个接触点，或者接地点34可以为天线60与地板抵接时的接触点。
现有技术中，天线60与馈电点31或接地点34之间采用弹脚与天线60上的弹接焊盘接触实现电连接，或者天线60与馈电点31或接地点34之间采用弹脚螺钉电连接，但是，当采用弹脚与天线60上的弹接焊盘接触电连接时，天线60上需设置弹接焊盘，且对弹接面的大小有相应的设计规范，弹脚占用空间大，而且装配时，弹脚抵在弹接焊盘上时，当天线60设在电池盖20b的内表面，这样弹脚对电池盖20b的作用力增大，尤其当电池盖20b的内表面上设置的天线60较多时，需设置弹脚较多，这样多个弹脚对电池盖20b的压力较大。
而当天线60与馈电点31或接地点34之间采用螺钉电连接时，需要在天线60和馈电点31或接地点34上设置柔性金属缓冲材料，这样导致成本较高。
另外，上述两种连接方式中，天线60与馈电点31或接地点34之间通过直接接触的方式电连接，例如馈电点31或接地点34直接电接触螺钉，螺钉电接触天线60，或者，馈电点31或接地点34直接电接触弹脚，弹脚与弹接焊盘直接点接触，同时螺钉、弹脚和弹接焊盘均为硬质材料，这样直接接触时容易带来谐波的问题。此外，在馈电点31或接地点34处设置弹脚或柔性金属缓冲材料时，还需进行金属表面镭雕的步骤，整个装配步骤 较多，影响组装效率。
为了解决上述问题，本申请实施例中，参见图3B所示，天线组件200还包括至少一个天线连接装置50，通过该天线连接装置60，可以实现馈电点31或接地点34与天线60非接触电连接。例如，参见图3B所示，天线60通过该天线连接装置50与馈电点31或接地点34相连，而天线60的金属表面与天线连接装置50中的金属表面不直接接触，天线60与馈电点31或接地点34之间用耦合连接代替了直接连接，天线60的金属表面与天线连接装置50的中金属表面形成耦合电容，通过电容的作用实现天线60与天线连接装置50中的金属表面之间的耦合连接，这样从馈电点31馈入的高频电流通过天线连接装置50中的金属表面与天线60的耦合作用传递到天线60上，高频电流在天线60上以电磁波方式向外发射。
本申请实施例中，参见图3B所示，当天线组件200包括馈电点31和接地点34时，天线连接装置50的数量为至少两个，其中一个天线连接装置50可以将馈电点31与天线60实现耦合连接，另一个天线连接装置50可以将天线60与接地点34连接。
本申请实施例中，通过天线连接装置50，实现了天线60与馈电点31或接地点34非接触电连接的作用，避免了在天线60上设置弹接焊盘或柔性金属缓冲材料以及避免了在馈电点31或接地点上设置弹脚和柔性金属缓冲材料，从而减低天线60连接的成本，而且天线连接装置50与天线60耦合的金属面积没有限制，所以可以减小天线连接装置50的体积，降低天线连接装置50在手机100中的占用空间。
在一种可能的实现方式中，如图4A所示，天线连接装置50可以包括层叠设置的：焊盘54、第一介质层51、耦合金属层53和第二介质层52，第一介质层51位于焊盘54和耦合金属层53之间，例如，第一介质层51可以为绝缘层，将焊盘54和耦合金属层53隔开。焊盘54与耦合金属层53之间通过第一介质层51中设置的至少一个过孔511电连接，例如如图4A所示，第一介质层51中设置4个过孔511，焊盘54与耦合金属层53之间通过4个过孔511实现电连接。当然，在其他一些示例中，过孔511的数量包括但不限于为4个，还可以为1个或3个或5个以上。
需要说明的是，过孔511为一种在孔内填充导电材料而形成的导电孔，过孔511可以以垂直方式设在第一介质层51中，当然，过孔511也可以在第一介质层51内倾斜设置。
其中，耦合金属层53位于第一介质层51和第二介质层52之间，例如图4A所示，第一介质层51和第二介质层52将耦合金属层53夹在中间，第二介质层52为绝缘层，这样耦合金属层53的上端面和下端面均有绝缘层，使得耦合接触层与其他金属表面(即天线60和焊盘54)无法直接接触，从而实现两个金属层的耦合连接。
本申请实施例中，焊盘54背离第一介质层51的一面用于与馈电点31或与接地点34电连接，例如焊盘54与馈电点31或接地点34可以通过表面贴装技术(Surface Mount Technology，SMT)实现电连接，当然，焊盘54还可以通过其他方式与馈电点31或接地点34电连接。
本申请实施例中，馈源33发出的高频电流可以经馈电点31馈入焊盘54，焊盘54上的高频电流经过孔511传递到耦合金属层53，耦合金属层53与天线60耦合使得高频电流传递到天线60上并向外发射。
本实施例中，第二介质层52背离耦合金属层53的一面与天线60相连，例如第二介 质层52的顶面与天线60相连，这样天线60与耦合金属层53之间通过第二介质层52隔开，天线60与耦合金属层53耦合连接，实现了天线60与耦合金属层53非接触连接。其中，天线连接装置50中的第二介质层52与天线60可以通过粘合方式相连，例如第二介质层52与天线60通过胶粘实现连接，当然，第二介质层52与天线60还可以通过其他方式实现相连。
本申请实施例中，第一介质层51一方面可以将焊盘54和耦合金属层53隔开，另一方面还可以起到对耦合金属层53支撑的作用，使得耦合金属层53在外力作用下不易靠近焊盘54移动。第二介质层52一方面将天线60与耦合金属层53隔开，另一方面第二介质层52还可以降低耦合金属层53和天线60之间的缝隙公差，减小耦合电容的波动。
在一种可能的实现方式中，第一介质层51需对耦合金属层53起到支撑作用，若第一介质层51选用柔性材料时，这样在外力作用下耦合金属层53与焊盘54之间的距离降低，耦合金属层53在竖向上的高度降低，例如耦合金属远离天线60移动，这样天线60与耦合金属层53之间的距离拉大，造成天线60与耦合金属层53之间的耦合效果降低，所以，本申请实施例中，第一介质层51为非柔性材料制成的硬质层。
在一种可能的实现方式中，参见图4A所示，第二介质层52和第一介质层51可以钧为非柔性材料制成的硬质绝缘层，例如，第二介质层52和第一介质层51可以为树脂材料(例如耐燃等级为FR4的树脂材料)、陶瓷或复合材料制成的硬质介质层。第二介质层52和第一介质层51的材料可以相同(例如图4A中)，也可以不相同。
在另一种可能的实现方式中，由于第二介质层52与天线60接触连接，当第二介质层52的硬度较大时，第二介质层52与天线60和耦合金属层53相连后，耦合金属层53与天线60之间的缝隙公差较大，例如，耦合金属层53与天线60之间的缝隙因为硬度较大的第二介质层52很难保持一致，所以导致耦合金属层53与天线60之间的缝隙公差大，造成耦合金属层53与天线60不能处于平行状态，耦合电容的波动较大。
所以，参见图4B所示，第二介质层52和第一介质层51为不同材料，且第二介质层52的硬度小于第一介质层51的硬度，例如，第一介质层51的硬度与第二介质层52的硬度不同，且第二介质层52的硬度较小，当第二介质层52的硬度较小时，这样第二介质层52与天线60和耦合金属层53相连时，第二介质层52可以在压力作用下与耦合金属层53和天线60之间贴合的更紧，从而可以降低耦合金属层53与天线60之间的缝隙公差，确保耦合接触层与天线60为两个平行的金属层，减小耦合电容的波动。
其中，第二介质层52可以为柔性材料制成的绝缘层，例如第二介质层52可以采用柔性板制成，柔性材料具体可以参考现有技术中的柔性材料，本实施例中，对柔性材料的组成不做限定。例如，本实施例中，第二介质层52可以泡棉层，这样泡棉层可以被压缩，从而实现天线60与耦合金属层53之间的缝隙公差更小。
当然，在其他一些示例中，第二介质层52可以包括但不限为泡棉材料制成。需要说明的是，由于第二介质层52为绝缘层，所以第二介质层52由非导电泡棉材料形成。需要说明的是，当第二介质层52为泡棉层时，该泡棉层可以由泡棉胶形成，这样天线60与第二介质层52胶接，或者，本实施例中，第二介质层52没有粘性无法实现与天线60胶接时，还可以单独设置一层胶层将第二介质层52与天线60粘合在一起。
在一种可能的实现方式中，由于第二介质层52与天线60和耦合金属层53相连，所 以天线60和耦合金属层53之间耦合间隔与第二介质层52的厚度相关，若第二介质层52的厚度相较大时，可能易出现天线60和耦合金属层53之间耦合间隔不满足电容耦合的要求，使得天线60与耦合金属层53之间不能实现耦合，所以，本申请实施例中，第二介质层52的厚度不高于3mm，例如，第二介质层52的厚度可以为3mm，或者第二介质层52的厚度可以为2mm。
在一种可能的实现方式中，焊盘54与天线60之间的距离为定值时，若第一介质层51的厚度减小，则耦合金属层53与天线60之间的距离增大，这样会影响耦合效果，所以本申请实施例中，第一介质层51的厚度高于0.1mm，例如，第一介质层51的厚度可以为1mm，或者第一介质层51的厚度可以0.5mm，当然一些其他示例中，第一介质层51的厚度包括但不限于为1mm或0.5mm，还可以其他数值。
在一种可能的实现方式中，天线连接装置50朝向天线60的正投影面积小于等于1mm 2，例如，天线连接装置50朝向天线60的正投影面积可以为0.81mm 2，或者天线连接装置50朝向天线60的正投影面积可以为0.72mm 2。
需要说明的是，天线连接装置50朝向天线60的正投影为天线连接装置50垂直朝向天线60的投影。本申请实施例提供的天线连接装置50与天线60连接时，对连接面积没有限制，所以天线连接装置50的体积可以减小，这样在手机100内的占用的空间减小，节省出的体积可供其他部件设置。
在一种可能的实现方式中，参见图4B所示，第二介质层52在耦合金属层53上的正投影完全覆盖耦合金属层53，例如，第二介质层52将耦合金属层53完全覆盖住，第二介质层52为可以覆盖耦合金属层53的整层结构。
或者，参见图4C所示，第二介质层52在耦合金属层53上的正投影部分覆盖耦合金属层53，例如，第二介质层52在耦合金属层53上可以间隔设置，耦合金属层53的部分区域裸露，这样第二介质层52与天线60相连后，耦合金属层53与天线60之间具有空隙521，从而利于气流在该空隙521中流通，实现对该天线连接装置50良好的散热。
本申请实施例中，天线60可以为柔性电路板(Flexible Printed Circuit，FPC)天线，或者天线60可以为激光直接成型(Laser-Direct-structuring，LDS)天线，或者，天线60还可以为模式装饰天线(Mode decoration antenna，MDA)，或者天线60还可以为金属边框天线(即金属边框作为天线)。
下面对天线连接装置50在不同天线60中的应用详细进行介绍，例如，天线连接装置50与FPC天线之间的第一种应用设置为场景一，天线连接装置50与FPC天线之间的第二种应用的场景设置为场景二，将天线连接装置50在金属边框天线上的应用设置为场景三。
下面，针对场景一、场景二和场景三，分别对天线连接装置50在不同天线60中应用时的结构进行描述。
场景一
本场景中，以天线60为FPC天线为例进行说明，参见图5A所示，FPC天线设在电池盖20b的内表面21b上，天线连接装置50的第二介质层52与FPC天线的一面相连，天线连接装置50的焊盘54与馈电点31通过SMT贴合相连，其中，本场景中，第一介质层51为采用耐燃等级为FR4的树脂制成，第二介质层52可以为泡棉层。
安装后，第二介质层52夹持在天线60和耦合金属层53之间，由于第二介质层52为 泡棉，所以第二介质层52吸收形变量，使得天线60与耦合金属层53之间的缝隙公差减小，降低耦合电容的波动。
其中，本实施例中，天线60与耦合金属层53之间设置第二介质层52，且第二介质层52为柔性材料制成，组装完后，第二介质层52可以在天线60与耦合金属层53之间起到缓冲作用，而且天线60的非接触连接，使得天线连接装置50对天线60施加的压力小于弹脚和螺钉对天线60的压力，从而确保了天线60与馈电点31连接后，天线连接装置50对电池盖20b的压力减小，这样电池盖20b上可承受更多天线60的布置，使得手机100可以覆盖更多的频段。
场景二
本场景中，以天线60为FPC天线为例进行说明，参见图5B所示，FPC天线设在电池盖20b的内表面21b上，天线连接装置50的第二介质层52与FPC天线的一面相连，天线连接装置50的焊盘54与馈电点31通过SMT贴合相连，其中，本场景中，第一介质层51与第二介质层52的材料相同，均为采用非柔性材料制成的硬质膜层，例如，第一介质层51与第二介质层52均采用耐燃等级为FR4的树脂制成。
其中，天线60与电池盖20b直接接触连接时，由于天线60与电池盖20b均为硬质材料，所以天线60与电池盖20b之间的缝隙公差较大，这样天线60与耦合金属层53之间的耦合电容波动较大，所以，本场景中，天线60与电池盖20b内表面之间设置由柔性材料制成的第三介质层61，第三介质层61可以吸收形变量，使得天线60与电池盖20b之间的缝隙公差减小，确保天线60与耦合金属层53之间贴合的更紧。
本申请实施例中，第三介质层61可以为非导电泡棉制成的膜层。本实施例中，当天线60与电池盖20b内表面之间设置的第三介质层61为泡棉胶层时，天线60从电池盖20b上撕下时，天线60可以与第二介质层52一起从电池盖20b上撕下或者对天线60起到缓冲作用，避免天线60与电池盖20b内表面直接连接时天线60从电池盖20b撕下时易出现断裂的问题。
当然，在其他场景中，也可以将第二介质层52设置为泡棉层，这样第二介质层52和第三介质层61的材料可以相同。
场景三
本场景中，以天线60为金属边框天线为例进行说明，手机100的边框21a可以为金属边框，金属边框可以经过断缝处理形成天线，例如金属边框的至少部分区域作为天线60，参见图6A所示，金属边框被划分并形成多个金属边框天线，例如金属边框天线211a和金属边框天线212a。
天线连接装置50的焊盘54与馈电点31通过SMT贴合相连，第一介质层51为采用耐燃等级为FR4的树脂制成，第二介质层52为泡棉层。
其中，金属边框作为天线60时，边框21a的内侧面与电路板30的上下两个往往垂直，所以，为了实现天线连接装置50将金属边框天线211a(或金属边框天线212a)与电路板30上的馈电点31或接地点34耦合连接，本实施例中，如图6A和图6B所示，金属边框天线211a的内侧面具有至少一个金属延伸部62，例如金属延伸部62可以沿着垂直于边框 21a内侧面的方向朝内延伸形成金属延伸部62，金属边框天线211a和金属延伸部62都作为天线60的辐射体。
通过设置金属延伸部62，这样金属延伸部62可以与电路板30的放置方向一致，如图6B所示，天线连接装置50的第二介质层52与金属延伸部62相连，例如金属边框天线211a通过金属延伸部62与天线连接装置50相连，天线连接装置50在纵向截面中位于金属延伸部62和馈电点31或接地点34之间。需要说明的时，图6A中示出一个金属延伸部62，在实际应用中，金属边框天线都会对应设置一个或两个(其中一个接地，另一个有馈电点连接)金属延伸部62。
其中，金属边框天线211a的部分内侧面朝内且沿着水平方向延伸形成凸台，凸台作为金属延伸部62，这样确保了边框21a与金属延伸部62一体成型，边框21a与金属延伸部62作为整体部件，组装时更易组装。
本实施例中，通过设置金属延伸部62，实现了金属边框天线(例如金属边框天线211a)与馈电点31或接地点34耦合连接的目的。
而且，本实施例中，由于天线连接装置50与天线60之间的连接面积没有限制，所以天线连接装置50与金属延伸部62之间的连接面积可以减小，设置时，金属延伸部62沿着与显示屏10平行的方向截面面积可以减小，这样金属延伸部62与显示屏10在垂直于屏幕的方向上的重合面积减小，从而减少了显示屏10中的金属层(例如触控电极层、栅极金属层或像素电极层)对天线60辐射性能的影响。
另外，本场景中，由于天线连接装置50中的第二介质层52为泡棉层，这样当电路板30的位置不变时，第二介质层52在外力作用下可以压缩，所以天线60的金属延伸部62与第二介质层52相连时，金属延伸部62在外力作用下可以随着第二介质层52的压缩而朝向耦合金属层53移动，这样使得显示屏10与金属延伸部62的距离d增大(参见图6B所示)，即金属边框天线的金属延伸部62远离显示屏10，从而使得金属边框天线的金属延伸部62远离显示屏10中的金属层，这样可以增大天线60的金属延伸部62与显示屏10中的金属层之间的净空，使得天线60的辐射性能更佳。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应作广义理解，例如，可以是固定连接，也可以是通过中间媒介间接相连，可以是两个元件内部的连通或者两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请实施例中的具体含义。
本申请实施例的说明书和权利要求书及上述附图中的术语“第一”、“第二”、“第三”、“第四”等(如果存在)是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
最后应说明的是：以上各实施例仅用以说明本申请实施例的技术方案，而非对其限制；尽管参照前述各实施例对本申请实施例进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请实施例各实施例技术方案的范围。

Claims (19)

  1. 一种天线连接装置，用于将天线与馈电点或接地点耦合连接，其特征在于，包括层叠设置的：
    焊盘、第一介质层、耦合金属层和第二介质层，所述第一介质层位于所述焊盘和所述耦合金属层之间，所述耦合金属层位于所述第一介质层和所述第二介质层之间，且所述焊盘与所述耦合金属层之间通过所述第一介质层中设置的至少一个过孔电连接；
    所述焊盘背离所述第一介质层的一面用于与所述馈电点或与所述接地点电连接；
    所述第二介质层背离所述耦合金属层的一面与所述天线相连，以使所述天线与所述耦合金属层耦合连接。
  2. 根据权利要求1所述的天线连接装置，其特征在于，所述第二介质层的硬度小于所述第一介质层的硬度。
  3. 根据权利要求2所述的天线连接装置，其特征在于，所述第二介质层为柔性材料制成的绝缘层，所述第一介质层为非柔性材料制成的绝缘层。
  4. 根据权利要求3所述的天线连接装置，其特征在于，所述第二介质层为泡棉层。
  5. 根据权利要求1所述的天线连接装置，其特征在于，所述第二介质层和所述第一介质层为非柔性材料制成的硬质绝缘层。
  6. 根据权利要求1-5任一所述的天线连接装置，其特征在于，所述第一介质层为树脂材料、陶瓷或复合材料制成的介质层。
  7. 根据权利要求1-6任一所述的天线连接装置，其特征在于，所述第二介质层的厚度不高于3mm。
  8. 根据权利要求1-7任一所述的天线连接装置，其特征在于，所述第一介质层的厚度高于0.1mm。
  9. 根据权利要求1-8任一所述的天线连接装置，其特征在于，所述天线连接装置朝向所述天线的正投影面积小于等于1mm 2。
  10. 根据权利要求1-9任一所述的天线连接装置，其特征在于，所述第二介质层在所述耦合金属层上的正投影完全覆盖所述耦合金属层，或者
    所述第二介质层在所述耦合金属层上的正投影部分覆盖所述耦合金属层。
  11. 一种天线组件，其特征在于，包括：至少一个天线、馈电点、与所述馈电点电连接的馈源和至少一个上述权利要求1-10任一所述的天线连接装置；
    所述天线连接装置中的焊盘与所述馈电点电连接，所述天线连接装置中的第二介质层与所述天线相连。
  12. 根据权利要求11所述的天线组件，其特征在于，还包括：接地点，所述天线连接装置为多个，且所述天线通过其中一个所述天线连接装置与所述馈电点耦合电连接，所述天线通过另一个所述天线连接装置与所述接地点耦合电连接。
  13. 根据权利要求12所述的天线组件，其特征在于，所述天线连接装置中的所述焊盘通过表面贴装技术SMT与所述馈电点或所述接地点电连接；
    所述天线连接装置中的所述第二介质层与所述天线通过粘合方式相连。
  14. 一种电子设备，包括显示屏、电路板和壳体，所述电路板位于所述壳体和所述显示屏围成的空间中，其特征在于，还包括：上述权利要求11-13任一所述的天线组件，所述 天线组件中的馈电点和馈源设在所述电路板。
  15. 根据权利要求14所述的电子设备，其特征在于，所述天线组件中的至少部分天线设在所述壳体朝向所述显示屏的内表面上；
    且所述天线与所述壳体内表面之间设置由柔性材料制成的第三介质层。
  16. 根据权利要求15所述的电子设备，其特征在于，所述第三介质层为非导电泡棉制成的介质层。
  17. 根据权利要求14-16任一所述的电子设备，其特征在于，所述天线为柔性电路板FPC天线、激光直接成型LDS天线、模式装饰天线MDA或金属边框天线。
  18. 根据权利要求17所述的电子设备，其特征在于，所述壳体包括金属边框，所述金属边框的至少部分区域作为所述天线；
    且作为所述天线的所述金属边框的内侧面具有至少一个金属延伸部，所述天线通过所述金属延伸部与所述天线连接装置中的第二介质层相连。
  19. 根据权利要求18所述的电子设备，其特征在于，所述金属边框的部分内侧面朝内且沿着水平方向延伸形成凸台，所述凸台作为所述金属延伸部。
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