WO2021168768A1 - Microfluidic chip, and microfluidic system - Google Patents

Microfluidic chip, and microfluidic system Download PDF

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Publication number
WO2021168768A1
WO2021168768A1 PCT/CN2020/077080 CN2020077080W WO2021168768A1 WO 2021168768 A1 WO2021168768 A1 WO 2021168768A1 CN 2020077080 W CN2020077080 W CN 2020077080W WO 2021168768 A1 WO2021168768 A1 WO 2021168768A1
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WIPO (PCT)
Prior art keywords
substrate
microfluidic chip
temperature
droplet
control unit
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PCT/CN2020/077080
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French (fr)
Chinese (zh)
Inventor
樊博麟
赵莹莹
姚文亮
古乐
廖辉
赵楠
高涌佳
李月
Original Assignee
京东方科技集团股份有限公司
北京京东方传感技术有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方传感技术有限公司 filed Critical 京东方科技集团股份有限公司
Priority to PCT/CN2020/077080 priority Critical patent/WO2021168768A1/en
Priority to CN202080000185.XA priority patent/CN113811389B/en
Publication of WO2021168768A1 publication Critical patent/WO2021168768A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers

Definitions

  • the invention belongs to the technical field of micro-droplets, and specifically relates to a microfluidic chip and a microfluidic system.
  • Microfluidics is a technology for precisely controlling micro-scale fluids. Through this technology, microfluidics technology is applied to various fields, such as microfluidic chips.
  • the microfluidic chip can divide the droplet into multiple sub-droplets for analysis and detection.
  • a typical microfluidic chip usually adopts a three-layer structure, that is, controlled droplets are sandwiched between the upper substrate and the lower substrate.
  • the lower substrate is composed of a base, a microelectrode array, a dielectric layer and a lyophobic layer from bottom to top.
  • the generation of sub-droplets is generally achieved by making electrodes of different sizes, and only using the dielectric wetting effect to achieve the generation of sub-droplets. If you want to improve the drive for dividing the controlled droplet into sub-droplets The force is usually used to increase the voltage of the electrode and increase the dielectric constant of the dielectric layer. When the voltage of the electrode is too large, it is easy to cause irreversible thermal breakdown of the dielectric layer. Moreover, if the dielectric constant of the dielectric layer is too large, the controlled droplets will be easily polarized during the movement process, thereby affecting the generation of sub-droplets. Therefore, the technical solutions in the microfluidic chip to increase the driving force of dividing the controlled droplet into sub-droplets all face technical bottlenecks.
  • the present invention aims to solve at least one of the technical problems existing in the prior art and provide a microfluidic chip and a microfluidic system.
  • an embodiment of the present invention provides a microfluidic chip, including:
  • the microfluidic chip includes a droplet splitting area for splitting droplets.
  • the first substrate and the second substrate There is a droplet accommodating space in between; wherein, the droplet accommodating space includes a working area for generating sub-droplets;
  • the first substrate includes:
  • a plurality of driving units are arranged at intervals on the side of the first substrate close to the second substrate, and are arranged in an area of the first substrate corresponding to the working area;
  • the second substrate includes:
  • the second substrate can deform as the temperature rises
  • the bottom deformation squeezes the droplet in the droplet accommodating space to split it into at least two sub-droplets.
  • the second substrate can be deformed as the temperature rises, and a plurality of temperature control units are provided in the second substrate, so that the droplet flows through the droplet accommodating space.
  • the temperature control unit heats the second substrate corresponding to the temperature control unit to increase its temperature and produce deformation, so that the deformation of the second substrate will squeeze the droplets in the droplet accommodating space to make The droplet splits into at least two sub-droplets.
  • the orthographic projection of the temperature control unit on the first substrate is limited to the corresponding orthographic projection of the driving unit on the first substrate.
  • the central area of the orthographic projection of the temperature control unit on the first substrate overlaps the central area of the orthographic projection of the driving unit on the first substrate.
  • the shape of the temperature control unit is a square with a side length of 0.12 mm; the shape of the driving unit is a square with a side length of 0.4 mm.
  • the first substrate further includes:
  • the dielectric layer is arranged on the side of the driving unit close to the second substrate;
  • the first liquid repellent layer is arranged on the side of the dielectric layer close to the second substrate;
  • the second substrate further includes:
  • the second lyophobic layer is arranged on the outermost side of the second substrate close to the droplet accommodating space.
  • the temperature control unit includes: a temperature rise device and a temperature measurement device;
  • the heating device is arranged on a side of the second substrate close to the first substrate, and is used to heat the position of the second substrate corresponding to the heating device;
  • the temperature measuring device is arranged on the side of the second substrate away from the first substrate, and is used to detect the temperature of the position of the second substrate corresponding to the heating device, so that the second substrate corresponds to The position of the heating device reaches a preset temperature.
  • the temperature increasing device includes a thermal resistance; the temperature measuring device includes a thermocouple.
  • the central area of the orthographic projection of the heating device on the second substrate overlaps with the central area of the orthographic projection of the temperature measuring device on the second substrate.
  • the area of the orthographic projection of the heating device on the second substrate is the same as the area of the orthographic projection of the temperature measuring device on the second substrate.
  • the driving unit includes a first electrode, which drives the droplet in the working area to move or split by a voltage.
  • the droplet accommodating space further includes a liquid storage area for storing the droplets
  • the first substrate further includes a plurality of second electrodes, which are provided on the same layer as the first electrode on the side of the first substrate close to the second substrate, and are provided on the first substrate corresponding to the liquid storage The area of the area, which drives the droplets in the liquid storage area to move to the working area by voltage.
  • the area of the orthographic projection of the second electrode on the first substrate is larger than the area of the orthographic projection of the first electrode on the first substrate.
  • the second substrate further includes a conductive layer disposed on a side of the second substrate close to the first substrate, and the conductive layer is connected to a common voltage terminal.
  • the material of the second substrate includes any one of polytetrafluoroethylene and polymethyl methacrylate.
  • an embodiment of the present invention provides a microfluidic system, including the above-mentioned microfluidic chip.
  • the above-mentioned microfluidic system further includes: a control unit connected to the driving unit in the microfluidic chip and configured to control the voltage of each driving unit in the microfluidic chip;
  • the control unit is also connected to the temperature control unit in the microfluidic chip, and is used to control the temperature control unit in the microfluidic chip to heat the second substrate at a position corresponding to the temperature control unit to The preset temperature.
  • the above-mentioned microfluidic system further includes: a cooling system connected to the control unit and configured to reduce the temperature of the second substrate in the microfluidic chip and eliminate the deformation of the second substrate.
  • a cooling system connected to the control unit and configured to reduce the temperature of the second substrate in the microfluidic chip and eliminate the deformation of the second substrate.
  • the cooling system includes: a cooling device and a stepping motor;
  • the stepping motor is connected to the cooling device and the control unit, and the stepping motor controls the cooling device to contact the second substrate to reduce the temperature of the second substrate.
  • the aforementioned microfluidic system further includes: a circuit control board connected to the control unit, the circuit control board having a plurality of interfaces, and the plurality of interfaces are connected to a plurality of drivers in the microfluidic chip
  • the units are connected one by one, and the control unit controls the voltage of each driving unit through the circuit control board.
  • control unit includes a programmable power supply and a programmable logic controller.
  • the aforementioned microfluidic system further includes:
  • the observation system is used to observe the generation state of the neutron droplets of the microfluidic chip.
  • the observation system includes a transparent platform, and the microfluidic chip is arranged on the transparent platform;
  • the observation system further includes: an image unit, a filter, and a focusing objective lens arranged on the side of the transparent platform away from the microfluidic chip in sequence, and arranged on the side of the microfluidic chip away from the transparent platform The backlight.
  • Fig. 1 is a schematic structural diagram of a microfluidic chip according to an embodiment of the present invention.
  • Fig. 2 is a schematic diagram of the principle of manipulating the movement of liquid droplets in an embodiment of the present invention.
  • Fig. 3 is a schematic structural diagram (top view) of a microfluidic chip according to an embodiment of the present invention.
  • Fig. 4 is a schematic diagram of the principle of the microfluidic chip producing sub-droplets in an embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the principle of manipulating the splitting of a droplet into sub-droplets in an embodiment of the present invention.
  • Fig. 6 is a cross-sectional view taken along the A-A' direction in Fig. 5;
  • Fig. 7 is a cross-sectional view taken along the B-B' direction in Fig. 5;
  • FIG. 8 is a schematic diagram of the positive dizziness relationship between the temperature control unit and the driving unit in the microfluidic chip of the embodiment of the present invention on the second substrate.
  • FIG. 9 is a schematic diagram of the central area of the temperature control unit and the central area of the driving unit in the microfluidic chip of the embodiment of the present invention.
  • Fig. 10 is a schematic diagram of another embodiment of the microfluidic chip in the embodiment of the present invention.
  • FIG. 11 is a schematic diagram of the simulation result of the thermal expansion effect of the second substrate in the microfluidic chip in the embodiment of the present invention.
  • FIG. 12 is a system structure diagram of a microfluidic system provided by an embodiment of the present invention.
  • an embodiment of the present invention provides a microfluidic chip, which includes a first substrate 1 and a second substrate 2 disposed oppositely.
  • the microfluidic chip includes multiple functional areas, such as a droplet splitting area for splitting droplets, a droplet detection area for detecting droplets, and a droplet mixing area for mixing liquids.
  • the droplet splitting area is used for description.
  • a droplet accommodating space 3 for accommodating droplets is defined between the first substrate 1 and the second substrate 2.
  • the droplet accommodating space 3 can be divided into a working area S1 and a liquid storage area S2.
  • the liquid storage area S2 is used to store the droplets of the sample to be generated, and the working area S1 is used to generate sub-droplets.
  • the droplet accommodating space 3 can contain any fluid that needs to generate sub-droplets, such as water (H 2 O) and blood.
  • the liquid droplet 31 in the liquid droplet receiving space 3 is taken as an example for description.
  • the first substrate 1 may include a first substrate 11 and a plurality of driving units 12.
  • a plurality of driving units 12 are arranged at intervals on the side of the first substrate 11 close to the second substrate 2, and the plurality of driving units 12 are arranged in an area of the first substrate 11 corresponding to the working area S1 of the droplet accommodating space 3.
  • Multiple driving units 12 can be connected to an external power supply, and the voltage of each driving unit 12 can be individually controlled by the external power supply. Based on the dielectric wetting effect, the driving unit 12 can drive the droplet 31 to move after being applied with a voltage by the external power supply.
  • the first substrate 1 may further include a dielectric layer 13, which is disposed on the side of the driving unit 12 close to the second substrate 2. If the dielectric layer 13 has With good liquid repellency, the droplet 31 is in contact with the dielectric layer 13. When the driving unit 12 is not pressurized, the liquid droplet 31 of the dielectric layer 13 has a relatively large surface tension due to its own lyophobic characteristics. The contact angle between the liquid droplet 31 and the dielectric layer 13 is the initial contact angle.
  • the driving unit 12 applies a voltage to cause the dielectric layer 13 to accumulate charges at the position of the driving unit 12 to which the voltage is applied, thereby changing the wetting characteristics between the dielectric layer 13 and the droplets 31 attached to the surface of the dielectric layer 13 , The contact angle between the droplet 31 and the dielectric layer 13 is changed, so that the droplet 31 is deformed, and a pressure difference is generated inside the droplet 31, thereby realizing the manipulation of the droplet 31.
  • the three driving units 12 are respectively a first driving unit 121, a second driving unit 122 and a third driving unit 133.
  • the shape of the droplet 31 is symmetrically distributed (as shown by the dotted line in FIG. 2), and the contact angle between the droplet 31 and the first substrate 1 is the first initial contact angle ⁇ 0 , and the droplet The contact angle between 31 and the second substrate 2 is the second initial contact angle ⁇ t .
  • the droplet needs to move to the right, a voltage is applied to the third driving unit 123 on the far right side, and the first driving unit 121 and the second driving unit 122 do not apply voltage or apply a voltage lower than the voltage of the third driving unit 123, Due to the dielectric wetting effect, the contact angle between the right side of the droplet 31 and the position of the third driving unit 123 and the first substrate 1 changes, and the first initial contact angle ⁇ 0 is reduced to the dielectric contact angle ⁇ .
  • FIG. 3 is a top view of the microfluidic chip in FIG.
  • the driving unit 12 a plurality of driving units 12 are connected to an external power source through a bonding area, and by applying a voltage to the corresponding driving unit 12, the droplet 31 can be moved in a corresponding direction.
  • the relationship between the contact angle between the droplet 31 and the dielectric layer 13 and the voltage of the driving unit 12 can be expressed as follows:
  • ⁇ 0 is the vacuum dielectric constant
  • ⁇ r is the relative dielectric constant of the dielectric layer 13
  • ⁇ lg is the surface tension coefficient of the liquid-gas interface
  • ⁇ V is the lower surface of the dielectric layer 13 close to the first substrate 11 and The potential difference between the upper surfaces close to the droplet accommodating space 3, D is the thickness of the dielectric layer 13.
  • the dielectric layer 13 can be made of a material with a relative permittivity within a preset range.
  • the preset range of the relative permittivity ⁇ r of the dielectric layer 13 is [2.9, 3.1].
  • a first liquid repellent layer 14 may be provided on the first substrate 1, and a second hydrophobic layer 14 may be provided on the second substrate 2.
  • the liquid layer 23, the first liquid-repellent layer 14 is provided on the side of the dielectric layer 13 close to the second substrate 2 and the second liquid-repellent layer 23 is provided on the outermost side of the second substrate 21 close to the droplet accommodating space 3.
  • the first liquid-repellent layer 14 and the second liquid-repellent layer 23 are in contact with the liquid droplets 31 in the liquid droplet accommodating space 3, so that the liquid droplets 31 have a relatively large surface tension.
  • the dielectric constant of the first liquid-repellent layer 14 and the second liquid-repellent layer 23 may be the same as or different from the dielectric layer 13, which is not limited here.
  • the second substrate 2 may further include a second substrate 21 and a plurality of temperature control units 22.
  • the second substrate 21 is made of a material with a high thermal expansion coefficient, so that the second substrate 21 can deform as the temperature rises.
  • a plurality of temperature control units 22 are provided in the second substrate 2, and the temperature control units 22 correspond to the driving units 12 in the first substrate 1 one-to-one.
  • the temperature control unit 22 can heat the temperature of the second substrate 21 corresponding to the temperature control unit 22 to a preset temperature, so that the second substrate 21 is deformed in the position corresponding to the temperature control unit 22, and the direction of the deformation is approximately vertical It extends to both sides of the second substrate 21 in the direction of the first substrate 1, so that the deformed portion of the second substrate 21 squeezes the droplet 31 in the droplet accommodating space 3 to split the droplet 31 into a plurality of sub-droplets.
  • a temperature control unit 22 on the second substrate 2 is taken as an example to describe the microfluidic chip.
  • the temperature control unit 22 and the corresponding driving unit 12 on the first substrate 1 are arranged oppositely.
  • the temperature control unit 22 is not working, as shown in Figure 4 (a), the second substrate 21 is not deformed and the liquid The surface tension distribution of the contact surface between the drop 31 and the second substrate 21 is relatively uniform.
  • the temperature control unit 22 heats the second substrate 21 corresponding to the temperature where the temperature control unit 22 is located to a preset temperature, because the material of the second substrate 21 has high expansion Therefore, as shown in Figure 4(b), the second substrate 21 is deformed at the corresponding part of the temperature control unit 22, and the direction of the deformation is approximately perpendicular to the first substrate 1 toward the second substrate 21. , So that the deformation of the second substrate 21 generates a pressure F 1 directed from the second substrate 21 to the direction of the first substrate 1 on the droplet 31, and the pressure F 1 acts on the droplet 31 corresponding to the second substrate The position of the deformation of 21. As shown in FIG.
  • the second substrate 21 can deform as the temperature rises, and the location of each temperature control unit 22 can be regarded as a splitting point that causes the droplets to split. . If the droplets flow through the working area of the droplet accommodating space 3, the temperature control unit 22 on the second substrate 21 is heated by the corresponding temperature control unit 22 to increase its temperature and deform, so that the second substrate is deformed. 21, where the deformation occurs, squeezes the droplet in the droplet accommodating space 3 to split the droplet into a plurality of sub-droplets.
  • the microfluidic chip provided by the embodiment of the present invention can stably generate the driving force for droplet splitting (that is, the pressure generated by the deformation of the second substrate 21 on the droplet), and the droplet has a uniform split point, so it can Improve the stability of sub-droplet generation, and the size of each sub-droplet is more consistent.
  • the microfluidic chip provided by the embodiment of the present invention, in addition to controlling the movement of the droplet 31 by applying a voltage to the driving unit 12, it can also be driven by The unit 12 applies a voltage to control the splitting of the droplet 31 into sub-droplets.
  • Figure 6 is a cross-sectional view taken along the AA' direction in Figure 5
  • Figure 7 is a cross-sectional view taken along the BB' direction in Figure 5
  • Figures 5-7 The black arrow in indicates the direction of the movement trend of the water droplets.
  • the three driving units 12 are respectively a first driving unit 121, a second driving unit 122 and a third driving unit 133.
  • the droplet 31 is in contact with the position of the dielectric layer 13 corresponding to the first drive unit 121, the second drive unit 122, and the third drive unit 133. If the droplet 31 is split into two droplets, three drives can be used. The voltage is applied to the first driving unit 121 and the third driving unit 123 on both sides of the unit, and no voltage is applied to the second driving unit 122 in the middle, or the second driving unit 122 is smaller than the other two driving units. If the voltage of the dielectric layer 13 is corresponding to the first driving unit 121 and the third driving unit 123 on both sides, the charges are accumulated, so that the dielectric layer 13 corresponds to the first driving unit 121 and the third driving unit 123 on both sides.
  • the second driving unit 122 located in the middle is not applied with a voltage or the applied voltage is small, and the volume of the droplet 31 is constant during the movement of the droplet, the two ends of the droplet 31 will pull the middle part toward the two sides. Moving sideways, the middle part of the droplet 31 gradually becomes thinner until it is pulled off, thereby splitting into two sub-droplets in the direction of the first driving unit 121 and the third driving unit 131 charged on both sides.
  • the first substrate 1 includes a plurality of driving units 12, by controlling the voltage of any three adjacent driving units 12, the voltage of the driving unit 12 in the middle is lower than the voltage of the driving units 12 on both sides. Sub-droplets are generated.
  • FIG. 8 is a schematic diagram of the orthographic projection of the temperature control unit 22 and the driving unit 12 in the second substrate 2 on the first substrate 1.
  • the temperature control unit 22 is on the first substrate 1.
  • the orthographic projection on a substrate 1 is limited to the orthographic projection of the corresponding drive unit 12 on the first substrate 1.
  • the area of the orthographic projection of a temperature control unit 22 on the first substrate 1 is smaller than that of the drive unit 12 on the first substrate 1.
  • the area of the orthographic projection on a substrate If the droplet is split into sub-droplets only by the voltage of the driving unit 12, the final splitting position of the droplet will be randomly distributed on the driving unit in the middle of the three driving units 12, and the splitting position of the droplet cannot be precisely controlled.
  • the second substrate 21 with a high thermal expansion coefficient is deformed by the temperature control unit 22 corresponding to the temperature control unit 22, so that the deformation of the second substrate 21 will squeeze the liquid droplet, and the liquid droplet and The contact surface of the deformed portion of the second substrate 21 forms a depression.
  • the droplet will split from the depression into sub-droplets. Therefore, by setting the temperature control unit 22 on the second substrate 21 at a position corresponding to the driving unit 12, the splitting points of the droplets can be accurately set, and the splitting points of the droplets are prevented from being randomly distributed on the driving electrodes, resulting in sub-droplets. The problem of different sizes.
  • the desired position of the droplet splitting can be adjusted, and the accuracy of sub-droplet generation can be improved.
  • only the voltage of the driving unit 12 may cause the driving force to drive the droplets to split, and the sub-droplets cannot be successfully generated.
  • the microfluidic chip provided by the embodiment of the present invention applies voltage to the driving unit 12 at the same time.
  • the use of the temperature control unit 22 to make the second substrate 21 squeeze droplets to split the droplets, which can increase the driving force for driving the droplets to split.
  • the central area of the orthographic projection of the temperature control unit 22 on the first substrate 1 overlaps with the central area of the orthographic projection of the drive unit 12 on the first substrate 1, and the
  • the deformation caused by the heating of the second substrate 12 by the temperature control unit 22 corresponds to the central area of the drive unit 12. Therefore, the split point of the droplet in the droplet accommodating space 3 is that of the droplet corresponding to the drive unit 12
  • the position of the central region can make the volume of the generated multiple sub-droplets approximately the same, thereby improving the accuracy of generating the sub-droplets.
  • the central area of the driving unit 12 is a circular area defined by a predetermined radius R t with the geometric center p of the orthographic projection of the driving unit 12 on the first substrate 1 as the center of the circle.
  • the central area of the temperature control unit 22 is a circular area defined by a predetermined radius Rd with the geometric center q of the orthographic projection of the temperature control unit 22 on the first substrate 1 as the center of the circle.
  • R t can be, for example, 1 um
  • R d can be, for example, 0.1 um.
  • the material of the second substrate 21 may include a variety of materials with high thermal expansion coefficients, such as polytetrafluoroethylene (Poly Tetra Fluoroethylene, PTFE), polymethyl methacrylate (Polymethyl Methacrylate, PMMA). Any kind. Of course, it can also be other materials, which is not limited here.
  • PTFE Poly Tetra Fluoroethylene
  • PMMA polymethyl methacrylate
  • ⁇ th is the thermal strain, which can be described by the following formula:
  • ⁇ th ⁇ ( ⁇ - ⁇ ref )
  • FIG. 11 it is a simulation analysis of the thermal expansion effect of the second substrate 21 in the microfluidic chip provided by the embodiment of the present invention by the finite element method, in which the heating device is taken as an example of a thermal resistance, and (a) in FIG. 11 is The top view of the simulation model, Figure 11 (b) is a three-dimensional view of the simulation model.
  • the second substrate is made of PTFE with an expansion coefficient of 12 ⁇ 10 -5
  • the area of the thermal resistance is 0.4mm ⁇ 0.4mm
  • the preset heating temperature is 50°C
  • the box thickness of the microfluidic chip It is 20um
  • the first substrate is a glass substrate.
  • the thermal expansion coefficient of the glass substrate is generally on the order of 10-6 , the deformation of the first substrate is ignored when calculating the thermal expansion effect.
  • the second substrate has a deformation M on the surface close to the droplet.
  • the deformation amount of M is about 5um.
  • the thickness of the box where the microfluidic chip corresponds to the thermal resistance changes, becoming 3/4 the thickness of the original box. Therefore, the deformation generated by the microfluidic chip of the embodiment of the present invention will undoubtedly generate pressure on the droplets, causing the droplets to split to generate sub-droplets.
  • the temperature control unit 22 may include a temperature-rising device 221 and a temperature-measuring device 222, and the temperature-raising device 221 and the temperature-measuring device 222 are in one-to-one correspondence.
  • the heating device 221 may be disposed on the side of the second substrate 21 close to the first substrate 1, and the heating device 221 is used to heat the position of the second substrate 21 corresponding to the heating device 221 to deform it.
  • the temperature measuring device 222 is arranged on the side of the second substrate 21 away from the first substrate 1, and the temperature measuring device 222 is used to detect the temperature of the position of the second substrate 21 corresponding to the heating device 221, so that the second substrate 21 corresponds to the heating device The position of 221 reaches the preset temperature.
  • the heating device 221 is used as a heat source and is arranged on the side of the second substrate 21 close to the droplet, so that the heat released by the heating device 221 can be concentrated on the side of the second substrate 21 close to the droplet, increasing the temperature of the second substrate 21.
  • the amount of deformation also increases the pressure on the droplets caused by the deformation of the second substrate 21, making it easier for the droplets to split.
  • the temperature measuring device 222 is used as a temperature feedback device to detect the temperature where the second substrate 21 corresponds to the temperature rising device 221 to ensure that the temperature of the second substrate 21 corresponding to the temperature rising device 221 can reach the preset temperature to ensure that the second substrate 21
  • the bottom 21 corresponds to the required deformation of the place where the heating device 221 is located.
  • the heating device 221 includes a thermal resistor
  • the temperature measuring device 222 includes a thermocouple.
  • the thermal resistance is a heat source for heating the second substrate 21 corresponding to the thermal resistance
  • the thermocouple is used to detect and feed back the temperature of the second substrate 21 corresponding to the thermal resistance.
  • the size and number of thermal resistors and thermocouples can be designed according to needs. The smaller the size of the thermal resistor, the closer the temperature field distribution of the thermal resistor is to the Gaussian distribution, so that a better heating effect can be achieved. The smaller the size of the thermocouple, the more accurate the temperature detected by the thermocouple.
  • the dimensions of the thermal resistance and thermocouple are both 0.12mm ⁇ 0.12mm. Since the size of the thermal resistance and thermocouple of the temperature control unit 22 is smaller than that of the drive unit, if the size of the resistance and the thermocouple are both 0.12mm ⁇ 0.12mm, the size of the drive unit 12 can be larger than 0.12mm ⁇ 0.12mm, for example, the size of the drive unit 12 It can be 0.4mm ⁇ 0.4mm.
  • the central area of the orthographic projection of the heating device 221 on the second substrate 2 overlaps with the central area of the orthographic projection of the temperature measuring device 222 on the second substrate 2, thereby enabling The temperature measured by the temperature measuring device 222 is more accurate, so as to ensure the accuracy of the deformation amount at the deformation of the second substrate 21.
  • the central area of the heating device 221 is a circular area defined by a predetermined radius R c with the geometric center of the orthographic projection of the heating device 221 on the second substrate 2 as the center of the circle.
  • the central area of the temperature measuring device 222 is a circular area defined by a predetermined radius R f with the geometric center of the orthographic projection of the temperature measuring device 222 on the second substrate 2 as the center of the circle.
  • R c can be, for example, 0.1 um
  • R f can be, for example, 0.1 um.
  • the heating device 221 and the temperature measuring device 222 can also be arranged in a staggered manner, as long as the orthographic projection of the heating device 221 on the second substrate 2 is the same as the temperature measuring device 222 on the second substrate 2. It suffices that there is an overlapping area on the orthographic projection.
  • the dashed frame in FIG. 10 is a top view of the heating device 221 and the temperature measuring device 222.
  • the orthographic projection of the heating device 221 on the second substrate 2 and the orthographic projection of the temperature measuring device 222 on the second substrate 2 have an overlapping area C Therefore, the temperature measuring device 222 can measure the temperature of the second substrate 21 corresponding to the temperature of the heating device 221.
  • the size of the overlapping area C can be set according to measurement needs, and is not limited here.
  • the area of the orthographic projection of the heating device 221 on the second substrate 2 is the same as the area of the orthographic projection of the temperature measuring device 222 on the second substrate 2, so that the temperature measuring device 222
  • the detection surface of ⁇ is consistent with the area of the heating device 221, so that the temperature of the second substrate 21 detected by the temperature measuring device 222 corresponding to the temperature of the heating device 221 can be more accurate.
  • the driving unit 21 may include a first electrode. After the first electrode is applied with a voltage, the voltage drives the droplets in the working area S1 of the droplet accommodating space 3 to move or split.
  • the first substrate 1 may further include a plurality of second electrodes 15, which are provided on the first substrate 11 in the same layer as the first electrodes serving as the driving unit 12 It is close to the side of the second substrate 2 and the second electrode 15 is arranged in the area of the first substrate 11 corresponding to the liquid storage area S2 of the droplet accommodating space 3. After the voltage is applied to the second electrode, the liquid storage area S2 is driven by the voltage The droplet moves to the working area S1, and the specific way of controlling the movement of the droplet by applying a voltage to the second electrode can refer to the description of the movement of the droplet controlled by the driving unit.
  • the dielectric layer 13 Since a plurality of second electrodes 15 are provided on the side of the younger brother substrate 11 close to the second substrate 2, so that after voltage is applied to the second electrode 15, the dielectric layer 13 accumulates charges corresponding to the second electrode 15, so that the droplets are gathered In the area of the droplet accommodating space 3 corresponding to the second electrode 15, that is, the droplets are gathered in the liquid storage area S2, so as to subsequently generate sub-droplets.
  • the area of the orthographic projection of the second electrode 15 on the first substrate 1 is larger than that of the first electrode of the driving unit 12 on the first substrate 1.
  • the size of the first electrode and the second electrode 15 corresponds to the size of the liquid droplets driven respectively
  • the second electrode 15 is arranged at the position of the first substrate 11 corresponding to the liquid storage area S2
  • the first electrode as the driving unit 12 is arranged at the first electrode
  • a substrate 11 corresponds to the position of the working area S1.
  • the liquid droplets accumulated in the liquid storage area S2 are the liquid droplets that have not yet been divided.
  • the volume of the liquid droplets is relatively large.
  • the contact surface of 1 is also larger and more difficult to be manipulated, so a larger area of electrode is required to drive the droplets in the liquid storage area S2.
  • the working area S1 is the area where the sub-droplets are generated, which is compared with that in the liquid storage area S2.
  • the volume of the droplet is small, and there is no need for a large-area electrode to drive it, so the area of the first electrode can be smaller than the area of the second electrode 15.
  • the size of the second electrode is 2 mm ⁇ 0.5 mm
  • the size of the first electrode is 0.4 mm ⁇ 0.4 mm.
  • the second substrate 2 may further include a conductive layer 24, which is disposed on the side of the second substrate 21 close to the first substrate 1.
  • the conductive layer 24 may be connected to a common voltage terminal to conduct electricity.
  • the layer 24 is equivalent to the zero potential surface, which can increase the potential difference between the upper and lower surfaces of the dielectric layer 13.
  • a plurality of hollow parts S may be provided on the conductive layer 24, the hollow parts S correspond to the temperature-rising device 221 one-to-one, the hollow parts S are used for accommodating the temperature-rising device 221, and each hollow part S is provided with a temperature-rising device 221, and
  • the area of the orthographic projection of the hollow portion S on the second substrate 2 is larger than the area of the orthographic projection of the heating device 221 on the second substrate 2, so that the heating device 221 is arranged in the hollow portion S, and has an edge with the hollow portion S A certain distance is required to prevent the heating device 221 from being interfered by the voltage on the conductive layer 24 and to prevent the conductive layer 24 from being squeezed by the deformation of the second substrate 21.
  • a fluid with a lubricating effect can also be added to the liquid droplet accommodating space 3 to reduce the damping of the liquid during movement.
  • silicone oil can be added, of course, it can also be other fluids, which is not limited here.
  • an embodiment of the present invention provides a microfluidic system, including the above-mentioned microfluidic chip.
  • the aforementioned microfluidic system may further include a control unit 001, which is connected to the drive unit 12 in the microfluidic chip, and the control unit 001 controls each drive in the microfluidic chip.
  • the voltage of the unit 12 to make the droplets move or split.
  • the control unit 001 is also connected to the temperature control unit 22 in the microfluidic chip, and the control unit 001 controls the temperature control unit 11 in the microfluidic chip to heat the position of the second substrate 1 corresponding to the temperature control unit 11 to a preset temperature .
  • the control unit 03 can control the heating of the corresponding temperature control unit 22 in various orders. For example, if the control unit 03 controls all the temperature control units 22 in the microfluidic chip to heat at the same time, a plurality of heating elements will be generated on the second substrate 21. The deformed place causes the droplet to split into multiple sub-droplets at the same time.
  • control unit includes a programmable power supply and a programmable logic controller, which can control the voltage of each drive unit 12 and the working state of each temperature control unit 22 respectively.
  • the above-mentioned microfluidic system may further include a circuit control board 08, the circuit control board 08 is connected to the control unit 001, the circuit control board 08 has multiple interfaces, and the multiple interfaces are connected to the microfluidic chip A plurality of driving units 12 are connected one by one, and the control unit 001 controls the voltage of each driving unit 12 through the circuit control board 08.
  • the control unit 001 can apply voltage to the driving unit 12 on the path through the circuit control board in the direction in which the droplet is required to move, so that the droplet is directed to the dielectric layer 13 under the dielectric wetting effect. This corresponds to the movement of the driving unit to which the voltage is applied.
  • the control unit can control the moving speed of the droplets by adjusting the voltage applied to the driving unit 12.
  • the above-mentioned microfluidic system may further include a temperature control table 09, the temperature control table 08 is connected to the control unit 03 and the temperature control unit 22 in the microfluidic chip, and the temperature control table 08 is preset If the temperature required for the deformation of the second substrate is determined, if the microfluidic chip is to generate sub-droplets, the control unit 03 controls the heating of the heating device 221 in the corresponding temperature control unit 22 in the microfluidic chip through the temperature control table 08
  • the second substrate 21, the temperature measuring device 222 detects the temperature of the second substrate 21 corresponding to the temperature control unit 22, and feeds back the detected temperature to the temperature control table 08, and the temperature control table 08 determines whether the detected temperature has reached If the preset temperature reaches the preset temperature, the heating device 221 stops heating; if it does not reach the preset temperature, the heating device 221 continues to heat, and the temperature measuring device 222 continues to feed back the detected temperature.
  • the microfluidic system may also include a cooling system 002, which is connected to the control unit 001.
  • the temperature of the second substrate 2 in the fluidic chip is used to eliminate the deformation of the second substrate 2 so that the microfluidic chip can repeatedly generate sub-droplets.
  • the cooling system 002 may include a cooling device 06 and a stepping motor 07.
  • the stepping motor 07 is connected to the cooling device 06 and the control unit 03, and the cooling system 002 is arranged on the side of the microfluidic chip close to the second substrate 2.
  • the second substrate in the second substrate 2 21 is deformed, and the stepping motor 07 controls the cooling device 06 to descend toward the second substrate 2 so that the cooling device 06 is in contact with the second substrate 2, so that the cooling device 06 reduces the temperature of the second substrate 2 and eliminates the second substrate 2. Deformation on the substrate 2.
  • the cooling device 06 may be a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet reduces the temperature of the second substrate 2 through heat transfer.
  • the microfluidic system may also include an observation system 003, which is used to observe the generation state of the neutron droplets of the microfluidic chip, so as to adjust the parameters of the droplet generation. .
  • the observation system 003 includes a transparent platform 04, and the microfluidic chip 05 is arranged on the transparent platform, so that the microfluidic chip 05 can be observed from both sides of the transparent platform 04.
  • the observation system 003 also includes a plurality of optical components, such as: an image unit 01, a filter 02, and a focusing lens 03 arranged on the side of the transparent platform 04 away from the microfluidic chip 05, and arranged on the microfluidic chip 05 away from the transparent The backlight 012 on the side of the platform 04.
  • the image unit 01, the filter 02, the focusing objective lens 03 and the backlight source 012 are all arranged on a rigid support 013 to ensure that these optical components are coaxially collimated, so that the generation of neutron droplets in the microfluidic chip 05 can be observed situation.

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Abstract

A microfluidic chip and a microfluidic system. The microfluidic chip comprises: a first substrate (1) and a second substrate (2) disposed oppositely, and a droplet accommodation space (3) located between the first substrate (1) and the second substrate (2), wherein the droplet accommodation space (3) comprises an operation region (S1) used to generate a sub-droplet. The first substrate (1) comprises a first base (11), and multiple drive units (12) spaced apart and disposed on a side of the first base (11) close to the second substrate (2) and in a region of the first base (11) corresponding to the operation region (S1). The second substrate (2) comprises a second base (21) capable of deforming along with a temperature increase, and multiple temperature control units (22) having a one-to-one correspondence with the drive units (12) and used to enable a temperature of the second substrate (21) to increase at a location corresponding to the temperature control units (22) and create deformation accordingly, such that a deformation location of the second substrate (21) squeezes a droplet in the droplet accommodation space (3) and divides the droplet into at least two sub-droplets. The microfluidic system comprises the microfluidic chip.

Description

一种微流控芯片和微流控系统Microfluidic chip and microfluidic system 技术领域Technical field
本发明属于微液滴技术领域,具体涉及一种微流控芯片和微流控系统。The invention belongs to the technical field of micro-droplets, and specifically relates to a microfluidic chip and a microfluidic system.
背景技术Background technique
微流控技术(Microfluidics)是一种精确控制微尺度流体的技术,通过此技术,微流控技术应用到各个领域中,例如微流控芯片。微流控芯片可以将液滴分割为多个子液滴,以供分析和检测。典型的微流控芯片通常采用三层结构,即受控液滴被夹在上基板和下基板之间。下基板自下而上由基底、微电极阵列、介质层以及疏液层构成。通过对微电极阵列中的电极加压,基于介电润湿原理,可以控制受控液滴在微电极阵列上移动,以及将受控分割为多个子液滴。Microfluidics is a technology for precisely controlling micro-scale fluids. Through this technology, microfluidics technology is applied to various fields, such as microfluidic chips. The microfluidic chip can divide the droplet into multiple sub-droplets for analysis and detection. A typical microfluidic chip usually adopts a three-layer structure, that is, controlled droplets are sandwiched between the upper substrate and the lower substrate. The lower substrate is composed of a base, a microelectrode array, a dielectric layer and a lyophobic layer from bottom to top. By pressing the electrodes in the microelectrode array, based on the principle of dielectric wetting, the controlled droplets can be controlled to move on the microelectrode array, and the controlled droplets can be divided into multiple sub-droplets.
在现有微流控技术中,子液滴的生成普遍通过制作不同尺寸电极,仅仅利用介电润湿效应实现子液滴的生成,若想提高使受控液滴分割为子液滴的驱动力,通常采用升高电极的电压,和增大介电层的介电常数的方式。而当电极的电压过大时,容易导致介电层出现不可逆的热击穿。并且,若介电层的介电常数过大,会使受控液滴在移动过程中容易被极化,从而影响子液滴的生成。因此,微流控芯片中提高受控液滴分割为子液滴的驱动力的技术方案均面临着技术瓶颈。In the existing microfluidic technology, the generation of sub-droplets is generally achieved by making electrodes of different sizes, and only using the dielectric wetting effect to achieve the generation of sub-droplets. If you want to improve the drive for dividing the controlled droplet into sub-droplets The force is usually used to increase the voltage of the electrode and increase the dielectric constant of the dielectric layer. When the voltage of the electrode is too large, it is easy to cause irreversible thermal breakdown of the dielectric layer. Moreover, if the dielectric constant of the dielectric layer is too large, the controlled droplets will be easily polarized during the movement process, thereby affecting the generation of sub-droplets. Therefore, the technical solutions in the microfluidic chip to increase the driving force of dividing the controlled droplet into sub-droplets all face technical bottlenecks.
发明内容Summary of the invention
本发明旨在至少解决现有技术中存在的技术问题之一,提供一种微流控芯片和微流控系统。The present invention aims to solve at least one of the technical problems existing in the prior art and provide a microfluidic chip and a microfluidic system.
第一方面,本发明实施例提供一种微流控芯片,包括:In the first aspect, an embodiment of the present invention provides a microfluidic chip, including:
相对设置的第一基板和第二基板,所述微流控芯片包括用于使液滴分裂的液滴分裂区,在所述液滴分裂区中,所述第一基板和所述第二基板之间包括液滴容纳空间;其中,所述液滴容纳空间包括用于生成子液滴的工作区;A first substrate and a second substrate are opposed to each other. The microfluidic chip includes a droplet splitting area for splitting droplets. In the droplet splitting area, the first substrate and the second substrate There is a droplet accommodating space in between; wherein, the droplet accommodating space includes a working area for generating sub-droplets;
所述第一基板包括:The first substrate includes:
第一衬底;First substrate
多个驱动单元,间隔设置在所述第一衬底靠近所述第二基板一侧,且设置在所述第一衬底对应所述工作区的区域;A plurality of driving units are arranged at intervals on the side of the first substrate close to the second substrate, and are arranged in an area of the first substrate corresponding to the working area;
所述第二基板包括:The second substrate includes:
第二衬底,能够随着温度的升高发生形变;The second substrate can deform as the temperature rises;
多个温控单元,其与所述驱动单元一一对应,所述温控单元用于使所述第二衬底对应所述温度单元所在处温度升高而产生形变,从而所述第二衬底形变处挤压所述液滴容纳空间中的液滴使其分裂为至少两个子液滴。A plurality of temperature control units corresponding to the driving unit one-to-one, and the temperature control unit is used to cause the second substrate to deform in response to an increase in temperature where the temperature unit is located, so that the second substrate The bottom deformation squeezes the droplet in the droplet accommodating space to split it into at least two sub-droplets.
本发明实施例提供的微流控芯片,由于第二衬底能够随温度升高而产生形变,且在第二衬底中设置了多个温控单元,从而在液滴流过液滴容纳空间的工作区时,温控单元加热第二衬底对应温控单元所在处,使其温度升高而产生形变,从而第二衬底产生形变处将挤压液滴容纳空间中的液滴,使液滴分裂为至少两个子液滴。In the microfluidic chip provided by the embodiment of the present invention, since the second substrate can be deformed as the temperature rises, and a plurality of temperature control units are provided in the second substrate, so that the droplet flows through the droplet accommodating space. In the working area of the second substrate, the temperature control unit heats the second substrate corresponding to the temperature control unit to increase its temperature and produce deformation, so that the deformation of the second substrate will squeeze the droplets in the droplet accommodating space to make The droplet splits into at least two sub-droplets.
可选地,所述温控单元在所述第一基板上的正投影被限定在与之对应的所述驱动单元在所述第一基板上的正投影内。Optionally, the orthographic projection of the temperature control unit on the first substrate is limited to the corresponding orthographic projection of the driving unit on the first substrate.
可选地,所述温控单元在所述第一基板上的正投影的中心区域,与所述驱动单元在第一基板上的正投影的中心区域重叠。Optionally, the central area of the orthographic projection of the temperature control unit on the first substrate overlaps the central area of the orthographic projection of the driving unit on the first substrate.
可选地,所述温控单元的形状为边长为0.12毫米的正方形;所述驱动单元的形状为边长为0.4毫米的正方形。Optionally, the shape of the temperature control unit is a square with a side length of 0.12 mm; the shape of the driving unit is a square with a side length of 0.4 mm.
可选地,所述第一基板还包括:Optionally, the first substrate further includes:
介电层,设置在所述驱动单元靠近所述第二基板一侧;The dielectric layer is arranged on the side of the driving unit close to the second substrate;
第一疏液层,设置在所述介电层靠近所述第二基板一侧;The first liquid repellent layer is arranged on the side of the dielectric layer close to the second substrate;
所述第二基板还包括:The second substrate further includes:
第二疏液层,设置在所述第二衬底靠近所述液滴容纳空间的最外侧。The second lyophobic layer is arranged on the outermost side of the second substrate close to the droplet accommodating space.
可选地,所述温控单元包括:升温器件和测温器件;Optionally, the temperature control unit includes: a temperature rise device and a temperature measurement device;
所述升温器件设置在所述第二衬底靠近所述第一基板一侧,用于加热所述第二衬底对应所述升温器件的位置;The heating device is arranged on a side of the second substrate close to the first substrate, and is used to heat the position of the second substrate corresponding to the heating device;
所述测温器件设置在所述第二衬底背离所述第一基板一侧,用于检测所述第二衬底对应所述升温器件的位置的温度,以使所述第二衬底对应所述升温器件的位置达到预设的温度。The temperature measuring device is arranged on the side of the second substrate away from the first substrate, and is used to detect the temperature of the position of the second substrate corresponding to the heating device, so that the second substrate corresponds to The position of the heating device reaches a preset temperature.
可选地,所述升温器件包括热电阻;所述测温器件包括热电偶。Optionally, the temperature increasing device includes a thermal resistance; the temperature measuring device includes a thermocouple.
可选地,所述升温器件在所述第二基板上的正投影的中心区域,与所述测温器件在所述第二基板上的正投影的中心区域重叠。Optionally, the central area of the orthographic projection of the heating device on the second substrate overlaps with the central area of the orthographic projection of the temperature measuring device on the second substrate.
可选地,所述升温器件在所述第二基板上的正投影的面积,与所述测温器件在所述第二基板上的正投影的面积相同。Optionally, the area of the orthographic projection of the heating device on the second substrate is the same as the area of the orthographic projection of the temperature measuring device on the second substrate.
可选地,所述驱动单元包括第一电极,其通过电压驱动所述工作区中的液滴移动或分裂。Optionally, the driving unit includes a first electrode, which drives the droplet in the working area to move or split by a voltage.
可选地,所述液滴容纳空间还包括用于储存所述液滴的储液区;Optionally, the droplet accommodating space further includes a liquid storage area for storing the droplets;
所述第一基板还包括多个第二电极,与所述第一电极同层设置在第一衬底靠近所述第二基板一侧,且设置在所述第一衬底对应所述储液区的区域,其通过电压驱动所述储液区中的液滴移动到所述工作区。The first substrate further includes a plurality of second electrodes, which are provided on the same layer as the first electrode on the side of the first substrate close to the second substrate, and are provided on the first substrate corresponding to the liquid storage The area of the area, which drives the droplets in the liquid storage area to move to the working area by voltage.
可选地,所述第二电极在所述第一基板上的正投影的面积,大于所述第一电极在所述第一基板上的正投影的面积。Optionally, the area of the orthographic projection of the second electrode on the first substrate is larger than the area of the orthographic projection of the first electrode on the first substrate.
可选地,所述第二基板还包括导电层,设置在所述第二衬底靠近所述第一基板一侧,所述导电层连接一公共电压端。Optionally, the second substrate further includes a conductive layer disposed on a side of the second substrate close to the first substrate, and the conductive layer is connected to a common voltage terminal.
可选地,所述第二衬底的材料包括聚四氟乙烯,聚甲基丙烯酸甲酯中的任一种。Optionally, the material of the second substrate includes any one of polytetrafluoroethylene and polymethyl methacrylate.
第二方面,本发明实施例提供一种微流控系统,包括上述的微流控芯片。In the second aspect, an embodiment of the present invention provides a microfluidic system, including the above-mentioned microfluidic chip.
可选地,上述微流控系统还包括:控制单元,其与所述微流控芯片中的驱动单元连接,用于控制所述微流控芯片中的每个所述驱动单元的电压;Optionally, the above-mentioned microfluidic system further includes: a control unit connected to the driving unit in the microfluidic chip and configured to control the voltage of each driving unit in the microfluidic chip;
所述控制单元还与所述微流控芯片中的温控单元相连,用于控制所述微流控芯片中的温控单元,将所述第二基板对应所述温控单元的位置加热至预设的温度。The control unit is also connected to the temperature control unit in the microfluidic chip, and is used to control the temperature control unit in the microfluidic chip to heat the second substrate at a position corresponding to the temperature control unit to The preset temperature.
可选地,上述微流控系统还包括:降温系统,与所述控制单元相连,用于降低所述微流控芯片中的第二基板的温度,消除所述第二基板的形变。Optionally, the above-mentioned microfluidic system further includes: a cooling system connected to the control unit and configured to reduce the temperature of the second substrate in the microfluidic chip and eliminate the deformation of the second substrate.
可选地,所述降温系统包括:降温器件和步进电机;Optionally, the cooling system includes: a cooling device and a stepping motor;
所述步进电机与所述降温器件以及所述控制单元相连,所述步进电机控制所述降温器件与所述第二基板相接触,以降低所述第二基板的温度。The stepping motor is connected to the cooling device and the control unit, and the stepping motor controls the cooling device to contact the second substrate to reduce the temperature of the second substrate.
可选地,上述微流控系统还包括:电路控制板,与所述控制单元相连,所述电路控制板具有多个接口,所述多个接口与所述微流控芯片中的多个驱动单元一一相连,所述控制单元通过所述电路控制板控制每个所述驱动单元的电压。Optionally, the aforementioned microfluidic system further includes: a circuit control board connected to the control unit, the circuit control board having a plurality of interfaces, and the plurality of interfaces are connected to a plurality of drivers in the microfluidic chip The units are connected one by one, and the control unit controls the voltage of each driving unit through the circuit control board.
可选地,所述控制单元包括可编程电源和可编程逻辑控制器。Optionally, the control unit includes a programmable power supply and a programmable logic controller.
可选地,上述微流控系统还包括:Optionally, the aforementioned microfluidic system further includes:
观测系统,其用于观测所述微流控芯片中子液滴的生成状态。The observation system is used to observe the generation state of the neutron droplets of the microfluidic chip.
可选地,所述观测系统包括透明平台,所述微流控芯片设置在所述透明平台上;Optionally, the observation system includes a transparent platform, and the microfluidic chip is arranged on the transparent platform;
所述观测系统还包括:依次设置在所述透明平台背离所述微流控芯片一侧的图像单元、滤光片、聚焦物镜,以及设置在所述微流控芯片背离所述透明平台一侧的背光源。The observation system further includes: an image unit, a filter, and a focusing objective lens arranged on the side of the transparent platform away from the microfluidic chip in sequence, and arranged on the side of the microfluidic chip away from the transparent platform The backlight.
附图说明Description of the drawings
图1为本发明实施例的一种微流控芯片的结构示意图。Fig. 1 is a schematic structural diagram of a microfluidic chip according to an embodiment of the present invention.
图2为本发明实施例中操控液滴移动的原理示意图。Fig. 2 is a schematic diagram of the principle of manipulating the movement of liquid droplets in an embodiment of the present invention.
图3为本发明实施例的一种微流控芯片的结构示意图(俯视图)。Fig. 3 is a schematic structural diagram (top view) of a microfluidic chip according to an embodiment of the present invention.
图4为本发明实施例中的微流控芯片生产子液滴的原理示意图。Fig. 4 is a schematic diagram of the principle of the microfluidic chip producing sub-droplets in an embodiment of the present invention.
图5为本发明实施例中操控液滴分裂为子液滴的原理示意图。FIG. 5 is a schematic diagram of the principle of manipulating the splitting of a droplet into sub-droplets in an embodiment of the present invention.
图6为图5中沿A-A′方向剖切的切面图。Fig. 6 is a cross-sectional view taken along the A-A' direction in Fig. 5;
图7为图5中沿B-B′方向剖切的切面图。Fig. 7 is a cross-sectional view taken along the B-B' direction in Fig. 5;
图8为本发明实施例的微流控芯片中温控单元和驱动单元在第二基板上的正头晕的关系示意图。8 is a schematic diagram of the positive dizziness relationship between the temperature control unit and the driving unit in the microfluidic chip of the embodiment of the present invention on the second substrate.
图9为本发明实施例的微流控芯片中温控单元的中心区域和驱动单元的中心区域的示意图。FIG. 9 is a schematic diagram of the central area of the temperature control unit and the central area of the driving unit in the microfluidic chip of the embodiment of the present invention.
图10为本发明实施例中微流控芯片的另一种实施例的示意图。Fig. 10 is a schematic diagram of another embodiment of the microfluidic chip in the embodiment of the present invention.
图11为本发明实施例中微流控芯片中第二衬底的热膨胀效应仿真结果示意图。FIG. 11 is a schematic diagram of the simulation result of the thermal expansion effect of the second substrate in the microfluidic chip in the embodiment of the present invention.
图12为本发明实施例提供的一种微流控系统的系统结构图。FIG. 12 is a system structure diagram of a microfluidic system provided by an embodiment of the present invention.
具体实施方式Detailed ways
为了使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明作进一步地详细描述,显然,所描述的实施例仅是本发明的部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本发明保护的范围。In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.
附图中各部件的形状和大小不反映真实比例,目的只是为了便于对本发明实施例的内容的理解。The shapes and sizes of the components in the drawings do not reflect the true proportions, and are only for the purpose of facilitating the understanding of the content of the embodiments of the present invention.
除非另外定义,本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。同样,“一个”、“一”或者“该”等类似词语也不表示数量限制,而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those with ordinary skills in the field to which this disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity, or importance, but are only used to distinguish different components. Similarly, similar words such as "a", "one" or "the" do not mean a quantity limit, but mean that there is at least one. "Include" or "include" and other similar words mean that the element or item appearing before the word covers the element or item listed after the word and their equivalents, but does not exclude other elements or items. Similar words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right", etc. are only used to indicate the relative position relationship. When the absolute position of the described object changes, the relative position relationship may also change accordingly.
第一方面,如图1所示,本发明实施例提供一种微流控芯片,其包括相对设置的第一基板1和第二基板2。微流控芯片包括多个功能区,例如用于使液滴分裂的液滴分裂区,用于检测液滴的液滴检测区,用于混合液体的液滴混合区等。以下发明实施例和附图中皆以液滴分裂区进行说明。在液滴分裂区中,第一基板1和第二基板2之间限定出用于容纳液滴的液滴容纳空间3。In the first aspect, as shown in FIG. 1, an embodiment of the present invention provides a microfluidic chip, which includes a first substrate 1 and a second substrate 2 disposed oppositely. The microfluidic chip includes multiple functional areas, such as a droplet splitting area for splitting droplets, a droplet detection area for detecting droplets, and a droplet mixing area for mixing liquids. In the following embodiments of the invention and the drawings, the droplet splitting area is used for description. In the droplet splitting area, a droplet accommodating space 3 for accommodating droplets is defined between the first substrate 1 and the second substrate 2.
其中,液滴容纳空间3可以分为工作区S1和储液区S2,储液区S2用于储存待生成样品的液滴,工作区S1用于生成子液滴。液滴容纳空间3内可以容纳任意需要生成子液滴的流体,例如:水(H 2O)、血液。为了方便描述,本发明实施例中以液滴容纳空间3中容纳液滴31为例进行说明。 Among them, the droplet accommodating space 3 can be divided into a working area S1 and a liquid storage area S2. The liquid storage area S2 is used to store the droplets of the sample to be generated, and the working area S1 is used to generate sub-droplets. The droplet accommodating space 3 can contain any fluid that needs to generate sub-droplets, such as water (H 2 O) and blood. For the convenience of description, in the embodiment of the present invention, the liquid droplet 31 in the liquid droplet receiving space 3 is taken as an example for description.
具体的,第一基板1可以包括第一衬底11和多个驱动单元12。其中,多个驱动单元12间隔设置在第一衬底11靠近第二基板2一侧,且多个驱动单元12设置在第一衬底11对应液滴容纳空间3的工作区S1的区域。多个驱动单元12可以分别连接外部电源,每个驱动单元12的电压可以被外部电源单独控制,基于介电润湿效应,驱动单元12被外部电源施加电压后可以驱动 液滴31进行移动。Specifically, the first substrate 1 may include a first substrate 11 and a plurality of driving units 12. Wherein, a plurality of driving units 12 are arranged at intervals on the side of the first substrate 11 close to the second substrate 2, and the plurality of driving units 12 are arranged in an area of the first substrate 11 corresponding to the working area S1 of the droplet accommodating space 3. Multiple driving units 12 can be connected to an external power supply, and the voltage of each driving unit 12 can be individually controlled by the external power supply. Based on the dielectric wetting effect, the driving unit 12 can drive the droplet 31 to move after being applied with a voltage by the external power supply.
在一些实施例中,如图1、图2所示,第一基板1还可以包括介电层13,介电层13设置在驱动单元12靠近第二基板2一侧,若介电层13具有良好的疏液性,则液滴31与介电层13相接触。在驱动单元12不加压时,介电层13由于自身的疏液特性使液滴31具有较大的表面张力,液滴31与介电层13的接触角为初始接触角,通过给对应的驱动单元12施加电压,使介电层13对应被施加电压的驱动单元12的位置处聚集电荷,从而可以改变介电层13与附着于介电层13表面的液滴31之间的润湿特性,使液滴31与介电层13之间的接触角发生变化,从而使得液滴31发生形变,促使液滴31内部产生压强差,进而实现对液滴31的操控。In some embodiments, as shown in FIGS. 1 and 2, the first substrate 1 may further include a dielectric layer 13, which is disposed on the side of the driving unit 12 close to the second substrate 2. If the dielectric layer 13 has With good liquid repellency, the droplet 31 is in contact with the dielectric layer 13. When the driving unit 12 is not pressurized, the liquid droplet 31 of the dielectric layer 13 has a relatively large surface tension due to its own lyophobic characteristics. The contact angle between the liquid droplet 31 and the dielectric layer 13 is the initial contact angle. The driving unit 12 applies a voltage to cause the dielectric layer 13 to accumulate charges at the position of the driving unit 12 to which the voltage is applied, thereby changing the wetting characteristics between the dielectric layer 13 and the droplets 31 attached to the surface of the dielectric layer 13 , The contact angle between the droplet 31 and the dielectric layer 13 is changed, so that the droplet 31 is deformed, and a pressure difference is generated inside the droplet 31, thereby realizing the manipulation of the droplet 31.
为了便于描述,如图2所示,以第一基板1中包括三个由左到右依次间隔设置的驱动单元12为例,对微流控芯片进行描述,当然,这并不构成对本发明实施例的限定。三个驱动单元12分别为第一驱动单元121,第二驱动单元122和第三驱动单元133。在驱动单元12没有被施加电压时,液滴31的形状呈对称分布(如图2中虚线所示),液滴31与第一基板1的接触角为第一初始接触角θ 0,液滴31与第二基板2的接触角为第二初始接触角θ t。若需要液滴向右移动,则给最右侧的第三驱动单元123施加电压,第一驱动单元121和第二驱动单元122不加电压或施加比第三驱动单元123的电压小的电压,由于介电润湿效应,液滴31与第三驱动单元123的位置相对应的右侧与第一基板1的接触角发生变化,由第一初始接触角θ 0减小为介电接触角θ V,又由于电压几乎只作用于液滴31与第一基板1的接触面,因此液滴31与第二基板2的接触角(也即第二初始接触角θ t)几乎没有发生变化,从而使液滴31产生不对称形变,并且液滴31内部产生压强差,从而使液滴31向靠近第三驱动单元123的位置移动。 For ease of description, as shown in FIG. 2, taking the first substrate 1 including three driving units 12 arranged at intervals from left to right as an example, the microfluidic chip is described. Of course, this does not constitute an implementation of the present invention. Limitations of examples. The three driving units 12 are respectively a first driving unit 121, a second driving unit 122 and a third driving unit 133. When no voltage is applied to the driving unit 12, the shape of the droplet 31 is symmetrically distributed (as shown by the dotted line in FIG. 2), and the contact angle between the droplet 31 and the first substrate 1 is the first initial contact angle θ 0 , and the droplet The contact angle between 31 and the second substrate 2 is the second initial contact angle θ t . If the droplet needs to move to the right, a voltage is applied to the third driving unit 123 on the far right side, and the first driving unit 121 and the second driving unit 122 do not apply voltage or apply a voltage lower than the voltage of the third driving unit 123, Due to the dielectric wetting effect, the contact angle between the right side of the droplet 31 and the position of the third driving unit 123 and the first substrate 1 changes, and the first initial contact angle θ 0 is reduced to the dielectric contact angle θ. V , since the voltage almost only acts on the contact surface between the droplet 31 and the first substrate 1, the contact angle between the droplet 31 and the second substrate 2 (that is, the second initial contact angle θ t ) hardly changes, so The droplet 31 is deformed asymmetrically, and a pressure difference is generated inside the droplet 31, so that the droplet 31 moves to a position close to the third driving unit 123.
同理,如图3所示,图3为图1中的微流控芯片的俯视图,图中未示出 第二基板1中除温控22以外的结构,第一基板1上可以包括任意个驱动单元12,多个驱动单元12通过绑定区(bonding area)与外部电源相连,通过给对应的驱动单元12施加电压,可以使液滴31向相应的方向移动。Similarly, as shown in FIG. 3, FIG. 3 is a top view of the microfluidic chip in FIG. The driving unit 12, a plurality of driving units 12 are connected to an external power source through a bonding area, and by applying a voltage to the corresponding driving unit 12, the droplet 31 can be moved in a corresponding direction.
具体的,液滴31与介电层13的接触角与驱动单元12的电压的关系可以按照下式表示:Specifically, the relationship between the contact angle between the droplet 31 and the dielectric layer 13 and the voltage of the driving unit 12 can be expressed as follows:
Figure PCTCN2020077080-appb-000001
Figure PCTCN2020077080-appb-000001
其中,ε 0为真空介电常数,ε r为介电层13的相对介电常数,γ lg为液气界面的表面张力系数,ΔV为介电层13靠近第一衬底11的下表面和靠近液滴容纳空间3的上表面之间的电势差,D为介电层13的厚度。 Among them, ε 0 is the vacuum dielectric constant, ε r is the relative dielectric constant of the dielectric layer 13, γ lg is the surface tension coefficient of the liquid-gas interface, and ΔV is the lower surface of the dielectric layer 13 close to the first substrate 11 and The potential difference between the upper surfaces close to the droplet accommodating space 3, D is the thickness of the dielectric layer 13.
可选地,由上式可知,若介电层13的相对介电常数ε r增大,则在驱动单元2被施加相同电压V的情况下,液滴31的介电接触角θ V会增大,从而液滴31更容易被操控,但若介电层13的相对介电常数ε r过大,则液滴在移动过程中容易被极化,从而使微流控芯片对液滴31的操控失效,因此本发明实施例中介电层13可以选取相对介电常数在预设范围内的材料制作,例如介电层13的相对介电常数ε r的预设范围为[2.9,3.1]。 Alternatively, it can be seen from the above formula that if the relative permittivity ε r of the dielectric layer 13 increases, the dielectric contact angle θ V of the droplet 31 will increase when the same voltage V is applied to the driving unit 2 If the relative permittivity ε r of the dielectric layer 13 is too large, the droplet will be easily polarized during the movement process, so that the microfluidic chip can easily control the droplet 31. The manipulation is invalid. Therefore, in the embodiment of the present invention, the dielectric layer 13 can be made of a material with a relative permittivity within a preset range. For example , the preset range of the relative permittivity ε r of the dielectric layer 13 is [2.9, 3.1].
在一些实施例中,如图1所示,若介电层13采用不具有疏液性的材料制作,可以在第一基板1设置第一疏液层14,在第二基板2设置第二疏液层23,第一疏液层14设置在介电层13靠近第二基板2一侧,第二疏液层23设置在第二衬底21靠近液滴容纳空间3的最外侧。第一疏液层14和第二疏液层23与液滴容纳空间3中的液滴31相接触,使液滴31具有较大的表面张力。第一疏液层14和第二疏液层23的介电常数可以与介电层13一致,也可以不同,在此不做限定。In some embodiments, as shown in FIG. 1, if the dielectric layer 13 is made of a material that does not have liquid repellency, a first liquid repellent layer 14 may be provided on the first substrate 1, and a second hydrophobic layer 14 may be provided on the second substrate 2. The liquid layer 23, the first liquid-repellent layer 14 is provided on the side of the dielectric layer 13 close to the second substrate 2 and the second liquid-repellent layer 23 is provided on the outermost side of the second substrate 21 close to the droplet accommodating space 3. The first liquid-repellent layer 14 and the second liquid-repellent layer 23 are in contact with the liquid droplets 31 in the liquid droplet accommodating space 3, so that the liquid droplets 31 have a relatively large surface tension. The dielectric constant of the first liquid-repellent layer 14 and the second liquid-repellent layer 23 may be the same as or different from the dielectric layer 13, which is not limited here.
进一步地,如图1、图4所示,第二基板2还可以包括第二衬底21和多个温控单元22。其中,第二衬底21采用高热膨胀系数的材料制作,从而第二衬底21能够随着温度的升高发生形变。多个温控单元22设置在第二基板 2中,温控单元22与第一基板1中的驱动单元12一一对应。温控单元22能够将第二衬底21对应该温控单元22所在处的温度加热至预设温度,使第二衬底21对应该温控单元22所在处发生形变,形变的方向沿近似垂直于第一基板1的方向上向第二衬底21的两侧延伸,从而第二衬底21形变处挤压液滴容纳空间3中的液滴31使液滴31分裂为多个子液滴。Further, as shown in FIGS. 1 and 4, the second substrate 2 may further include a second substrate 21 and a plurality of temperature control units 22. Wherein, the second substrate 21 is made of a material with a high thermal expansion coefficient, so that the second substrate 21 can deform as the temperature rises. A plurality of temperature control units 22 are provided in the second substrate 2, and the temperature control units 22 correspond to the driving units 12 in the first substrate 1 one-to-one. The temperature control unit 22 can heat the temperature of the second substrate 21 corresponding to the temperature control unit 22 to a preset temperature, so that the second substrate 21 is deformed in the position corresponding to the temperature control unit 22, and the direction of the deformation is approximately vertical It extends to both sides of the second substrate 21 in the direction of the first substrate 1, so that the deformed portion of the second substrate 21 squeezes the droplet 31 in the droplet accommodating space 3 to split the droplet 31 into a plurality of sub-droplets.
为了便于描述,如图4所示,以第二基板2上的一个温控单元22为例,对微流控芯片进行描述,当然,这并不构成对本发明实施例的限定。温控单元22和与之对应的第一基板1上的驱动单元12相对设置,在温控单元22未工作时,如图4中(a)所示,第二衬底21未发生形变,液滴31与第二衬底21相接触面的表面张力分布较均匀。若需要将液滴31生成2个子液滴,则温控单元22将第二衬底21对应该温控单元22所在处的温度加热至预设温度,由于第二衬底21的材料具有高膨胀系数,因此如图4中(b)所示,第二衬底21上与该温控单元22对应处发生形变,形变的方向沿近似垂直于第一基板1的方向上向第二衬底21的两侧延伸,从而第二衬底21形变处对液滴31产生一个由第二衬底21指向第一基板1方向的压力F 1,且压力F 1作用在液滴31对应第二衬底21的形变处的位置。如图4中(c)所示,液滴31在压力F 1的作用下,使液滴31对应第二衬底21的形变处的位置产生凹陷,根据界面能最小原理,液滴31便会以凹陷处为分裂点,分裂为第一子液滴311和第二子液滴312。之后如图4中(d)所示,温控单元22停止加热,第二衬底21发生形变处在一段后随着温度下降而消除形变。重复上述(a)到(d)的过程,即可生成多个子液滴。同理,若第二衬底21上设置了多个温控单元22,通过控制每个温控单元22,即可完成子液滴的生成。 For ease of description, as shown in FIG. 4, a temperature control unit 22 on the second substrate 2 is taken as an example to describe the microfluidic chip. Of course, this does not constitute a limitation to the embodiment of the present invention. The temperature control unit 22 and the corresponding driving unit 12 on the first substrate 1 are arranged oppositely. When the temperature control unit 22 is not working, as shown in Figure 4 (a), the second substrate 21 is not deformed and the liquid The surface tension distribution of the contact surface between the drop 31 and the second substrate 21 is relatively uniform. If it is necessary to generate two sub-droplets from the droplet 31, the temperature control unit 22 heats the second substrate 21 corresponding to the temperature where the temperature control unit 22 is located to a preset temperature, because the material of the second substrate 21 has high expansion Therefore, as shown in Figure 4(b), the second substrate 21 is deformed at the corresponding part of the temperature control unit 22, and the direction of the deformation is approximately perpendicular to the first substrate 1 toward the second substrate 21. , So that the deformation of the second substrate 21 generates a pressure F 1 directed from the second substrate 21 to the direction of the first substrate 1 on the droplet 31, and the pressure F 1 acts on the droplet 31 corresponding to the second substrate The position of the deformation of 21. As shown in FIG. 4 (c), the liquid droplet 31 F 1 under pressure, the deformation of the droplets 31 at a position corresponding to the recess of the second substrate 21 is generated, in accordance with the principles of interfacial energy minimization, a droplet 31 will Taking the depression as the split point, split into the first sub-droplet 311 and the second sub-droplet 312. Then, as shown in (d) of FIG. 4, the temperature control unit 22 stops heating, and the deformation of the second substrate 21 is eliminated after a certain period of time as the temperature drops. Repeat the process from (a) to (d) above to generate multiple sub-droplets. Similarly, if multiple temperature control units 22 are provided on the second substrate 21, by controlling each temperature control unit 22, the generation of sub-droplets can be completed.
由于在第二衬底21上设置了多个温控单元22,第二衬底21能够随温度升高而产生形变,每个温控单元22所在处可以视作一个使液滴分裂的分裂点。若液滴流过液滴容纳空间3的工作区,通过对应的温控单元22加热第二 衬底21上该温控单元22所在处,使其温度升高而产生形变,从而第二衬底21产生形变处将挤压液滴容纳空间3中的液滴,使液滴分裂为多个子液滴。本发明实施例提供的微流控芯片,能够稳定的产生液滴分裂的驱动力(即第二衬底21的形变处对液滴产生的压力),且液滴具有一致的分裂点,因此能够提高子液滴生成的稳定性,且每个子液滴的尺寸较为一致。Since a plurality of temperature control units 22 are provided on the second substrate 21, the second substrate 21 can deform as the temperature rises, and the location of each temperature control unit 22 can be regarded as a splitting point that causes the droplets to split. . If the droplets flow through the working area of the droplet accommodating space 3, the temperature control unit 22 on the second substrate 21 is heated by the corresponding temperature control unit 22 to increase its temperature and deform, so that the second substrate is deformed. 21, where the deformation occurs, squeezes the droplet in the droplet accommodating space 3 to split the droplet into a plurality of sub-droplets. The microfluidic chip provided by the embodiment of the present invention can stably generate the driving force for droplet splitting (that is, the pressure generated by the deformation of the second substrate 21 on the droplet), and the droplet has a uniform split point, so it can Improve the stability of sub-droplet generation, and the size of each sub-droplet is more consistent.
在此需要说明的是,参考上述,基于介电润湿效应,本发明实施例提供的微流控芯片中,通过给驱动单元12施加电压可以控制液滴31进行移动以外,还可以通过给驱动单元12施加电压控制液滴31分裂为子液滴。It should be noted here that, referring to the above, based on the dielectric wetting effect, in the microfluidic chip provided by the embodiment of the present invention, in addition to controlling the movement of the droplet 31 by applying a voltage to the driving unit 12, it can also be driven by The unit 12 applies a voltage to control the splitting of the droplet 31 into sub-droplets.
为了便于描述,如图5-图7所示,图6为沿图5中A-A′方向剖切的切面图,图7为沿图5中B-B′方向剖切的切面图,图5-图7中的黑色箭头表示水滴的运动趋势的方向,以第一基板1中包括三个由左到右依次间隔设置的驱动单元为例,对微流控芯片进行描述,当然,这并不构成对本发明实施例的限定。三个驱动单元12分别为第一驱动单元121,第二驱动单元122和第三驱动单元133。液滴31与介电层13对应第一驱动单元121、第二驱动单元122和第三驱动单元133的位置相接触,若要使液滴31分裂为2个液滴,则可以给三个驱动单元中位于两侧的第一驱动单元121和第三驱动单元123施加电压,而不给位于中间的第二驱动单元122施加电压,或给第二驱动单元122施加比给其他两个驱动单元小的电压,则介电层13与两侧的第一驱动单元121和第三驱动单元123相对应处的电荷聚集,使介电层13对应两侧的第一驱动单元121和第三驱动单元123处的亲水性增加,吸引着液滴31向两侧移动,导致液滴31与第一基板1的接触角θ b2减小,液滴31曲率半径r 2增大。由于位于中间的第二驱动单元122没有被施加电压或施加的电压较小,且在整个液滴的运动过程中液滴31的体积是常数,因此液滴31两端将拉扯着中间部分向两侧移动,液滴31的中间部分逐渐变细,直到被拉断,从而向两侧带电的第一驱动单元121和第三驱动单元131的方向分裂为2个子液滴。 同理,若第一基板1中包括多个驱动单元12,通过控制任意三个相邻的驱动单元12的电压,使中间的驱动单元12的电压小于两侧的驱动单元12的电压,即可生成子液滴。 For ease of description, as shown in Figures 5-7, Figure 6 is a cross-sectional view taken along the AA' direction in Figure 5, Figure 7 is a cross-sectional view taken along the BB' direction in Figure 5, and Figures 5-7 The black arrow in indicates the direction of the movement trend of the water droplets. Taking the first substrate 1 including three driving units arranged at intervals from left to right as an example, the microfluidic chip is described. Of course, this does not constitute the present invention. Limitations of the embodiment. The three driving units 12 are respectively a first driving unit 121, a second driving unit 122 and a third driving unit 133. The droplet 31 is in contact with the position of the dielectric layer 13 corresponding to the first drive unit 121, the second drive unit 122, and the third drive unit 133. If the droplet 31 is split into two droplets, three drives can be used. The voltage is applied to the first driving unit 121 and the third driving unit 123 on both sides of the unit, and no voltage is applied to the second driving unit 122 in the middle, or the second driving unit 122 is smaller than the other two driving units. If the voltage of the dielectric layer 13 is corresponding to the first driving unit 121 and the third driving unit 123 on both sides, the charges are accumulated, so that the dielectric layer 13 corresponds to the first driving unit 121 and the third driving unit 123 on both sides. The increase in hydrophilicity at the position attracts the droplet 31 to move to both sides, resulting in a decrease in the contact angle θ b2 of the droplet 31 with the first substrate 1 and an increase in the radius of curvature r 2 of the droplet 31. Since the second driving unit 122 located in the middle is not applied with a voltage or the applied voltage is small, and the volume of the droplet 31 is constant during the movement of the droplet, the two ends of the droplet 31 will pull the middle part toward the two sides. Moving sideways, the middle part of the droplet 31 gradually becomes thinner until it is pulled off, thereby splitting into two sub-droplets in the direction of the first driving unit 121 and the third driving unit 131 charged on both sides. Similarly, if the first substrate 1 includes a plurality of driving units 12, by controlling the voltage of any three adjacent driving units 12, the voltage of the driving unit 12 in the middle is lower than the voltage of the driving units 12 on both sides. Sub-droplets are generated.
在一些实施例中,如图1、图8所示,图8为第二基板2中的温控单元22与驱动单元12在第一基板1上的正投影的示意图,温控单元22在第一基板1上的正投影被限定在与之对应的驱动单元12在第一基板1上的正投影内,一温控单元22在第一基板1上的正投影的面积小于驱动单元12在第一基板上的正投影的面积。若仅通过驱动单元12的电压使液滴分裂为子液滴,液滴最终分裂的位置会随机分布在三个驱动单元12中位于中间的驱动单元上,而无法精确控制液滴的分裂位置。而本发明实施例通过温控单元22使具有高热膨胀系数的第二衬底21对应温控单元22所在处发生形变,从而第二衬底21的形变处会挤压液滴,在液滴与第二衬底21的形变处的接触面形成一个凹陷,根据界面能最小原理,液滴会从凹陷处分裂为子液滴。从而将温控单元22设置在第二衬底21上与驱动单元12对应的位置,即可精确地设置液滴的分裂点,避免液滴的分裂点随机分布在驱动电极上,造成子液滴尺寸大小不一的问题。且调整温控单元22相对应驱动单元12的位置,可以调整所需的液滴分裂的位置,提高了子液滴生成的精确性。并且,仅通过驱动单元12的电压可能会使驱动液滴分裂的驱动力较小,而无法成功生成子液滴,本发明实施例提供的微流控芯片,在给驱动单元12施加电压的同时,利用温控单元22使第二衬底21产生形挤压液滴以使液滴分裂,可以增大驱动液滴分裂的驱动力。In some embodiments, as shown in FIG. 1 and FIG. 8, FIG. 8 is a schematic diagram of the orthographic projection of the temperature control unit 22 and the driving unit 12 in the second substrate 2 on the first substrate 1. The temperature control unit 22 is on the first substrate 1. The orthographic projection on a substrate 1 is limited to the orthographic projection of the corresponding drive unit 12 on the first substrate 1. The area of the orthographic projection of a temperature control unit 22 on the first substrate 1 is smaller than that of the drive unit 12 on the first substrate 1. The area of the orthographic projection on a substrate. If the droplet is split into sub-droplets only by the voltage of the driving unit 12, the final splitting position of the droplet will be randomly distributed on the driving unit in the middle of the three driving units 12, and the splitting position of the droplet cannot be precisely controlled. However, in the embodiment of the present invention, the second substrate 21 with a high thermal expansion coefficient is deformed by the temperature control unit 22 corresponding to the temperature control unit 22, so that the deformation of the second substrate 21 will squeeze the liquid droplet, and the liquid droplet and The contact surface of the deformed portion of the second substrate 21 forms a depression. According to the principle of minimum interface energy, the droplet will split from the depression into sub-droplets. Therefore, by setting the temperature control unit 22 on the second substrate 21 at a position corresponding to the driving unit 12, the splitting points of the droplets can be accurately set, and the splitting points of the droplets are prevented from being randomly distributed on the driving electrodes, resulting in sub-droplets. The problem of different sizes. Moreover, by adjusting the position of the temperature control unit 22 corresponding to the driving unit 12, the desired position of the droplet splitting can be adjusted, and the accuracy of sub-droplet generation can be improved. In addition, only the voltage of the driving unit 12 may cause the driving force to drive the droplets to split, and the sub-droplets cannot be successfully generated. The microfluidic chip provided by the embodiment of the present invention applies voltage to the driving unit 12 at the same time. , The use of the temperature control unit 22 to make the second substrate 21 squeeze droplets to split the droplets, which can increase the driving force for driving the droplets to split.
在一些实施例中,如图9所示,温控单元22在第一基板1上的正投影的中心区域,与驱动单元12在第一基板1上的正投影的中心区域重叠,则在生成子液滴时,通过温控单元22加热第二衬底12所产生的形变处对应于驱动单元12的中心区域,因此液滴容纳空间3的液滴的分裂点为液滴对应驱动单 元12的中心区域的位置,从而可以使生成的多个子液滴的体积近似相同,进而可以提高生成子液滴的精确性。驱动单元12的中心区域为以驱动单元12在第一基板1上的正投影的几何中心p为圆心,预设半径R t所限定出的圆形区域。温控单元22的中心区域为以温控单元22在第一基板1上的正投影的几何中心q为圆心,预设半径R d所限定出的圆形区域。R t例如可以为1um,R d例如可以为0.1um,作为一种优选的方式,R t=R d=0um。R t和R d越小,则温控单元22在第一基板1上的正投影的几何中心与驱动单元12在第一基板1上的正投影的几何中心重叠度越高,则微流控芯片所生成的子液滴的精确性越高。 In some embodiments, as shown in FIG. 9, the central area of the orthographic projection of the temperature control unit 22 on the first substrate 1 overlaps with the central area of the orthographic projection of the drive unit 12 on the first substrate 1, and the When a sub-droplet is generated, the deformation caused by the heating of the second substrate 12 by the temperature control unit 22 corresponds to the central area of the drive unit 12. Therefore, the split point of the droplet in the droplet accommodating space 3 is that of the droplet corresponding to the drive unit 12 The position of the central region can make the volume of the generated multiple sub-droplets approximately the same, thereby improving the accuracy of generating the sub-droplets. The central area of the driving unit 12 is a circular area defined by a predetermined radius R t with the geometric center p of the orthographic projection of the driving unit 12 on the first substrate 1 as the center of the circle. The central area of the temperature control unit 22 is a circular area defined by a predetermined radius Rd with the geometric center q of the orthographic projection of the temperature control unit 22 on the first substrate 1 as the center of the circle. R t can be, for example, 1 um, and R d can be, for example, 0.1 um. As a preferred way, R t =R d =0 um. The smaller the R t and R d , the higher the degree of overlap between the geometric center of the orthographic projection of the temperature control unit 22 on the first substrate 1 and the geometric center of the orthographic projection of the driving unit 12 on the first substrate 1, the higher the degree of overlap of the microfluidic control The more accurate the sub-droplets generated by the chip are.
可选地,第二衬底21的材料可以包括多种具有高热膨胀系数的材料,例如:聚四氟乙烯(Poly Tetra Fluoroethylene,PTFE),聚甲基丙烯酸甲酯(Polymethyl Methacrylate,PMMA)中的任一种。当然,也可以是其他材料,在此不做限定。Optionally, the material of the second substrate 21 may include a variety of materials with high thermal expansion coefficients, such as polytetrafluoroethylene (Poly Tetra Fluoroethylene, PTFE), polymethyl methacrylate (Polymethyl Methacrylate, PMMA). Any kind. Of course, it can also be other materials, which is not limited here.
具体的,第二衬底21随着温度升高所产生的形变可以根据下式固体的运动方程进行描述:0=▽.S;Specifically, the deformation of the second substrate 21 as the temperature increases can be described according to the motion equation of the solid: 0=▽.S;
其中S为应力张量:S=C/ε elWhere S is the stress tensor: S=C/ε el ;
其中C为四阶弹性张量:C=C(ε,υ);Where C is the fourth-order elastic tensor: C=C(ε,υ);
其中υ为泊松比,ε为总应变,可通过下式进行描述:Where υ is Poisson's ratio and ε is the total strain, which can be described by the following formula:
Figure PCTCN2020077080-appb-000002
Figure PCTCN2020077080-appb-000002
其中u为位移矢量,Τ为温度,ε el可通过下式进行描述: Where u is the displacement vector, Τ is the temperature, and ε el can be described by the following formula:
ε el=ε‐ε th ε el =ε-ε th
其中ε th为热应变,可通过下式进行描述: Where ε th is the thermal strain, which can be described by the following formula:
ε th=α(Τ-Τ ref) ε th =α(Τ-Τ ref )
其中α为膨胀系数,Τ ref为环境温度。通过以上公式便可以得出不同温度下,采用不同材料制作的第二衬底21随温度升高所产生的形变。 Where α is the expansion coefficient, and T ref is the ambient temperature. According to the above formula, the deformation of the second substrate 21 made of different materials with increasing temperature can be obtained at different temperatures.
如图11所示,为通过有限元方法对本发明实施例提供的微流控芯片中第二衬底21的热膨胀效应仿真分析,其中以升温器件为热电阻为例,图11中(a)为仿真模型的俯视图,图11中(b)为仿真模型的立体图。在此模型中,第二衬底采用膨胀系数为12×10 -5的PTFE材料,热电阻的面积为0.4mm×0.4mm,预设要加热的温度为50℃,微流控芯片的盒厚为20um,第一衬底为玻璃基板,由于玻璃基板的热膨胀系数普遍在10 -6量级,因此在计算热膨胀效应时忽略了第一衬底所产生的形变。如图11所示,通过计算,第二衬底在靠近液滴的表面产生了形变M,M的形变量约为5um,微流控芯片对应热电阻所在位置的盒厚发生了变化,变为原盒厚的3/4。因此,本发明实施例的微流控芯片所产生的形变无疑会对液滴的产生压力,使得液滴分裂生成子液滴。 As shown in FIG. 11, it is a simulation analysis of the thermal expansion effect of the second substrate 21 in the microfluidic chip provided by the embodiment of the present invention by the finite element method, in which the heating device is taken as an example of a thermal resistance, and (a) in FIG. 11 is The top view of the simulation model, Figure 11 (b) is a three-dimensional view of the simulation model. In this model, the second substrate is made of PTFE with an expansion coefficient of 12×10 -5 , the area of the thermal resistance is 0.4mm×0.4mm, the preset heating temperature is 50°C, and the box thickness of the microfluidic chip It is 20um, and the first substrate is a glass substrate. Since the thermal expansion coefficient of the glass substrate is generally on the order of 10-6 , the deformation of the first substrate is ignored when calculating the thermal expansion effect. As shown in Figure 11, through calculation, the second substrate has a deformation M on the surface close to the droplet. The deformation amount of M is about 5um. The thickness of the box where the microfluidic chip corresponds to the thermal resistance changes, becoming 3/4 the thickness of the original box. Therefore, the deformation generated by the microfluidic chip of the embodiment of the present invention will undoubtedly generate pressure on the droplets, causing the droplets to split to generate sub-droplets.
可选地,如图1所示,在本发明实施例中的微流控芯片,温控单元22可以包括升温器件221和测温器件222,升温器件221与测温器件222一一对应。升温器件221可以设置在第二衬底21靠近第一基板1一侧,升温器件221用于加热第二衬底21对应升温器件221的位置,使其发生形变。测温器件222设置在第二衬底21背离第一基板1一侧,测温器件222用于检测第二衬底21对应升温器件221的位置的温度,以使第二衬底21对应升温器件221的位置达到预设的温度。升温器件221作为热源,设置在第二衬底21靠近液滴的一侧,从而可以将升温器件221释放的热量集中在第二衬底21靠近液滴一侧,增大第二衬底21的形变量,从而也增大了第二衬底21的形变处对液滴造成的压力,使液滴更容易完成分裂。测温器件222作为温度反馈器件,检测第二衬底21对应升温器件221所在处的温度,以保证第二衬底21对应升温器件221所在处的温度可以达到预设温度,以保证第二衬底21对应升温器件221所在处发生所需的形变。Optionally, as shown in FIG. 1, in the microfluidic chip in the embodiment of the present invention, the temperature control unit 22 may include a temperature-rising device 221 and a temperature-measuring device 222, and the temperature-raising device 221 and the temperature-measuring device 222 are in one-to-one correspondence. The heating device 221 may be disposed on the side of the second substrate 21 close to the first substrate 1, and the heating device 221 is used to heat the position of the second substrate 21 corresponding to the heating device 221 to deform it. The temperature measuring device 222 is arranged on the side of the second substrate 21 away from the first substrate 1, and the temperature measuring device 222 is used to detect the temperature of the position of the second substrate 21 corresponding to the heating device 221, so that the second substrate 21 corresponds to the heating device The position of 221 reaches the preset temperature. The heating device 221 is used as a heat source and is arranged on the side of the second substrate 21 close to the droplet, so that the heat released by the heating device 221 can be concentrated on the side of the second substrate 21 close to the droplet, increasing the temperature of the second substrate 21. The amount of deformation also increases the pressure on the droplets caused by the deformation of the second substrate 21, making it easier for the droplets to split. The temperature measuring device 222 is used as a temperature feedback device to detect the temperature where the second substrate 21 corresponds to the temperature rising device 221 to ensure that the temperature of the second substrate 21 corresponding to the temperature rising device 221 can reach the preset temperature to ensure that the second substrate 21 The bottom 21 corresponds to the required deformation of the place where the heating device 221 is located.
在一些实施例中,升温器件221包括热电阻,测温器件222包括热电偶,当然,升温器件221和测温器件222还可以是其他类型的器件,在此不做限 定。热电阻为加热第二衬底21对应热电阻所在处的热源,热电偶用于检测并反馈第二衬底21对应热电阻处的温度。热电阻和热电偶尺寸与个数可根据需要进行设计,热电阻的尺寸越小,热电阻的温度场分布越接近高斯分布,从而能达到更好的加热效果。热电偶的尺寸越小,热电偶所检测到的温度越精准。例如,热电阻及热电偶尺寸均为0.12mm×0.12mm。由于温控单元22的热电阻和热电偶的尺寸小于驱动单元,若电阻及热电偶尺寸均为0.12mm×0.12mm,驱动单元12的尺寸可以大于0.12mm×0.12mm,例如驱动单元12的尺寸可以为0.4mm×0.4mm。In some embodiments, the heating device 221 includes a thermal resistor, and the temperature measuring device 222 includes a thermocouple. Of course, the heating device 221 and the temperature measuring device 222 may also be other types of devices, which are not limited herein. The thermal resistance is a heat source for heating the second substrate 21 corresponding to the thermal resistance, and the thermocouple is used to detect and feed back the temperature of the second substrate 21 corresponding to the thermal resistance. The size and number of thermal resistors and thermocouples can be designed according to needs. The smaller the size of the thermal resistor, the closer the temperature field distribution of the thermal resistor is to the Gaussian distribution, so that a better heating effect can be achieved. The smaller the size of the thermocouple, the more accurate the temperature detected by the thermocouple. For example, the dimensions of the thermal resistance and thermocouple are both 0.12mm×0.12mm. Since the size of the thermal resistance and thermocouple of the temperature control unit 22 is smaller than that of the drive unit, if the size of the resistance and the thermocouple are both 0.12mm×0.12mm, the size of the drive unit 12 can be larger than 0.12mm×0.12mm, for example, the size of the drive unit 12 It can be 0.4mm×0.4mm.
在一些实施例中,如图1所示,升温器件221在第二基板2上的正投影的中心区域,与测温器件222在第二基板2上的正投影的中心区域重叠,从而能使测温器件222测到的温度更准确,进而能够保证第二衬底21形变处的形变量的精确性。升温器件221的中心区域为以升温器件221在第二基板2上的正投影的几何中心为圆心,预设半径R c所限定出的圆形区域。测温器件222的中心区域为以测温器件222在第二基板2上的正投影的几何中心为圆心,预设半径R f所限定出的圆形区域。R c例如可以为0.1um,R f例如可以为0.1um,作为一种优选的方式,R c=R f=0um。R c和R f越小,则测温器件222在第二基板2上的正投影的几何中心与升温器件221在第二基板2上的正投影的几何中心重叠度越高,则测温器件222所测到的温度更准确。 In some embodiments, as shown in FIG. 1, the central area of the orthographic projection of the heating device 221 on the second substrate 2 overlaps with the central area of the orthographic projection of the temperature measuring device 222 on the second substrate 2, thereby enabling The temperature measured by the temperature measuring device 222 is more accurate, so as to ensure the accuracy of the deformation amount at the deformation of the second substrate 21. The central area of the heating device 221 is a circular area defined by a predetermined radius R c with the geometric center of the orthographic projection of the heating device 221 on the second substrate 2 as the center of the circle. The central area of the temperature measuring device 222 is a circular area defined by a predetermined radius R f with the geometric center of the orthographic projection of the temperature measuring device 222 on the second substrate 2 as the center of the circle. R c can be, for example, 0.1 um, and R f can be, for example, 0.1 um. As a preferred way, R c =R f =0 um. The smaller R c and R f are , the higher the degree of overlap between the geometric center of the orthographic projection of the temperature measuring device 222 on the second substrate 2 and the geometric center of the orthographic projection of the heating device 221 on the second substrate 2 is, the higher the degree of overlap of the temperature measuring device The temperature measured by 222 is more accurate.
在另一些实施例中,如图10所示,升温器件221和测温器件222也可以交错设置,只要升温器件221在第二基板2上的正投影,与测温器件222在第二基板2上的正投影存在重叠区域即可。图10中虚线框内即为升温器件221与测温器件222的俯视图,升温器件221在第二基板2上的正投影,与测温器件222在第二基板2上的正投影存在重叠区域C,从而测温器件222可以测量第二衬底21对应该升温器件221所在处的温度。重叠区域C的大小可以根据测量需要设置,在此不做限定。In other embodiments, as shown in FIG. 10, the heating device 221 and the temperature measuring device 222 can also be arranged in a staggered manner, as long as the orthographic projection of the heating device 221 on the second substrate 2 is the same as the temperature measuring device 222 on the second substrate 2. It suffices that there is an overlapping area on the orthographic projection. The dashed frame in FIG. 10 is a top view of the heating device 221 and the temperature measuring device 222. The orthographic projection of the heating device 221 on the second substrate 2 and the orthographic projection of the temperature measuring device 222 on the second substrate 2 have an overlapping area C Therefore, the temperature measuring device 222 can measure the temperature of the second substrate 21 corresponding to the temperature of the heating device 221. The size of the overlapping area C can be set according to measurement needs, and is not limited here.
在一些实施例中,如图1所示,升温器件221在第二基板2上的正投影的面积,与测温器件222在第二基板2上的正投影的面积相同,从而测温器件222的检测面与升温器件221的面积一致,从而能够使测温器件222所检测的第二衬底21对应升温器件221所在处的温度更准确。在一些实施例中,驱动单元21可以包括第一电极,第一电极被施加电压后,通过电压驱动液滴容纳空间3的工作区S1中的液滴移动或分裂。In some embodiments, as shown in FIG. 1, the area of the orthographic projection of the heating device 221 on the second substrate 2 is the same as the area of the orthographic projection of the temperature measuring device 222 on the second substrate 2, so that the temperature measuring device 222 The detection surface of φ is consistent with the area of the heating device 221, so that the temperature of the second substrate 21 detected by the temperature measuring device 222 corresponding to the temperature of the heating device 221 can be more accurate. In some embodiments, the driving unit 21 may include a first electrode. After the first electrode is applied with a voltage, the voltage drives the droplets in the working area S1 of the droplet accommodating space 3 to move or split.
在一些实施例中,如图1、图3、图8所示,第一基板1还可以包括多个第二电极15,与作为驱动单元12的第一电极同层设置在第一衬底11靠近第二基板2一侧,且第二电极15设置在第一衬底11对应液滴容纳空间3的储液区S2的区域,第二电极被施加电压后,通过电压驱动储液区S2中的液滴移动到工作区S1,具体的通过给第二电极施加电压操控液滴移动的方式,可以参考上述驱动单元操控液滴移动的描述。由于在弟弟衬底11靠近第二基板2一侧设置了多个第二电极15,从而给第二电极15施加电压后,介电层13对应第二电极15处聚集电荷,从而使液滴聚集在液滴容纳空间3对应第二电极15的区域,也即将液滴聚集在储液区S2中,以便后续生成子液滴。In some embodiments, as shown in FIG. 1, FIG. 3, and FIG. 8, the first substrate 1 may further include a plurality of second electrodes 15, which are provided on the first substrate 11 in the same layer as the first electrodes serving as the driving unit 12 It is close to the side of the second substrate 2 and the second electrode 15 is arranged in the area of the first substrate 11 corresponding to the liquid storage area S2 of the droplet accommodating space 3. After the voltage is applied to the second electrode, the liquid storage area S2 is driven by the voltage The droplet moves to the working area S1, and the specific way of controlling the movement of the droplet by applying a voltage to the second electrode can refer to the description of the movement of the droplet controlled by the driving unit. Since a plurality of second electrodes 15 are provided on the side of the younger brother substrate 11 close to the second substrate 2, so that after voltage is applied to the second electrode 15, the dielectric layer 13 accumulates charges corresponding to the second electrode 15, so that the droplets are gathered In the area of the droplet accommodating space 3 corresponding to the second electrode 15, that is, the droplets are gathered in the liquid storage area S2, so as to subsequently generate sub-droplets.
在一些实施例中,如图1、图3、图8所示,第二电极15在第一基板1上的正投影的面积,大于作为驱动单元12的第一电极在第一基板1上的正投影的面积。第一电极和第二电极15的尺寸对应于各自驱动的液滴的尺寸,第二电极15设置在第一衬底11对应储液区S2的位置,作为驱动单元12的第一电极设置在第一衬底11对应工作区S1的位置,储液区S2中聚集的液滴为还未进行液滴分割的液滴,液滴体积较大,因此储液区S2中的液滴与第一基板1的接触面也较大,且更难被操控,因此需要较大面积的电极驱动储液区S2中的液滴。在第一电极15与第二电极相配合,让液滴由储液区S2向工作区S1流动后,工作区S1为生成子液滴的区域,子液滴的相较于储液区S2中的液滴的体积较小,无需大面积的电极对其进行驱动,因此第一电极的面 积可以小于第二电极15的面积。例如,第二电极的尺寸为2mm×0.5mm,第一电极的尺寸为0.4mm×0.4mm。In some embodiments, as shown in FIGS. 1, 3, and 8, the area of the orthographic projection of the second electrode 15 on the first substrate 1 is larger than that of the first electrode of the driving unit 12 on the first substrate 1. The area of the orthographic projection. The size of the first electrode and the second electrode 15 corresponds to the size of the liquid droplets driven respectively, the second electrode 15 is arranged at the position of the first substrate 11 corresponding to the liquid storage area S2, and the first electrode as the driving unit 12 is arranged at the first electrode A substrate 11 corresponds to the position of the working area S1. The liquid droplets accumulated in the liquid storage area S2 are the liquid droplets that have not yet been divided. The volume of the liquid droplets is relatively large. The contact surface of 1 is also larger and more difficult to be manipulated, so a larger area of electrode is required to drive the droplets in the liquid storage area S2. After the first electrode 15 cooperates with the second electrode to allow the liquid droplets to flow from the liquid storage area S2 to the working area S1, the working area S1 is the area where the sub-droplets are generated, which is compared with that in the liquid storage area S2. The volume of the droplet is small, and there is no need for a large-area electrode to drive it, so the area of the first electrode can be smaller than the area of the second electrode 15. For example, the size of the second electrode is 2 mm×0.5 mm, and the size of the first electrode is 0.4 mm×0.4 mm.
在一些实施例中,如图1所示,第二基板2还可以包括导电层24,设置在第二衬底21靠近第一基板1一侧,导电层24可以连接一公共电压端,从而导电层24相当于零电势面,可以提高介电层13上下表面的电势差。In some embodiments, as shown in FIG. 1, the second substrate 2 may further include a conductive layer 24, which is disposed on the side of the second substrate 21 close to the first substrate 1. The conductive layer 24 may be connected to a common voltage terminal to conduct electricity. The layer 24 is equivalent to the zero potential surface, which can increase the potential difference between the upper and lower surfaces of the dielectric layer 13.
进一步地,导电层24上可以设置多个镂空部S,镂空部S与升温器件221一一对应,镂空部S用于容纳升温器件221,每个镂空部S中设置有一个升温器件221,且镂空部S在第二基板2上的正投影的面积,大于升温器件221在第二基板2上的正投影的面积,从而升温器件221设置在镂空部S中,且与镂空部S的边缘具有一定距离,以避免升温器件221受到导电层24上的电压的干扰,且避免导电层24受到第二衬底21形变处的挤压。Further, a plurality of hollow parts S may be provided on the conductive layer 24, the hollow parts S correspond to the temperature-rising device 221 one-to-one, the hollow parts S are used for accommodating the temperature-rising device 221, and each hollow part S is provided with a temperature-rising device 221, and The area of the orthographic projection of the hollow portion S on the second substrate 2 is larger than the area of the orthographic projection of the heating device 221 on the second substrate 2, so that the heating device 221 is arranged in the hollow portion S, and has an edge with the hollow portion S A certain distance is required to prevent the heating device 221 from being interfered by the voltage on the conductive layer 24 and to prevent the conductive layer 24 from being squeezed by the deformation of the second substrate 21.
在一些实施例中,如图1所示,液滴容纳空间3中还可以加入具有润滑作用的流体,以减少液体在运动过程中的阻尼。例如可以加入硅油,当然,也可以是其他流体,在此不做限定。In some embodiments, as shown in FIG. 1, a fluid with a lubricating effect can also be added to the liquid droplet accommodating space 3 to reduce the damping of the liquid during movement. For example, silicone oil can be added, of course, it can also be other fluids, which is not limited here.
第二方面,如图12所示,本发明实施例提供一种微流控系统,包括上述的微流控芯片。In the second aspect, as shown in FIG. 12, an embodiment of the present invention provides a microfluidic system, including the above-mentioned microfluidic chip.
可选地,如图12所示,上述微流控系统还可以包括控制单元001,控制单元001与微流控芯片中的驱动单元12连接,控制单元001控制微流控芯片中的每个驱动单元12的电压,以使液滴进行移动或分裂。Optionally, as shown in FIG. 12, the aforementioned microfluidic system may further include a control unit 001, which is connected to the drive unit 12 in the microfluidic chip, and the control unit 001 controls each drive in the microfluidic chip. The voltage of the unit 12 to make the droplets move or split.
控制单元001还与微流控芯片中的温控单元22相连,控制单元001控制微流控芯片中的温控单元11,将第二基板1对应温控单元11的位置加热至预设的温度。根据需要,控制单元03可以按照各种次序控制对应温控单元22加热,例如,控制单元03控制微流控芯片中的所有温控单元22同时加热,则第二衬底21上会产生多个形变处,使液滴同时分裂为多个子液滴。当然,也可以控制液滴所流经的温控单元依次加热,使液滴在不同时间生成多个子 液滴。具体的可以根据需要设定,在此不做限定。The control unit 001 is also connected to the temperature control unit 22 in the microfluidic chip, and the control unit 001 controls the temperature control unit 11 in the microfluidic chip to heat the position of the second substrate 1 corresponding to the temperature control unit 11 to a preset temperature . According to needs, the control unit 03 can control the heating of the corresponding temperature control unit 22 in various orders. For example, if the control unit 03 controls all the temperature control units 22 in the microfluidic chip to heat at the same time, a plurality of heating elements will be generated on the second substrate 21. The deformed place causes the droplet to split into multiple sub-droplets at the same time. Of course, it is also possible to control the temperature control unit through which the droplet flows to be heated sequentially, so that the droplet generates multiple sub-droplets at different times. The details can be set according to needs, and there is no limitation here.
可选地,如图12所示,控制单元包括可编程电源和可编程逻辑控制器,可以分别对每个驱动单元12的电压和每个温控单元22的工作状态进行控制。Optionally, as shown in FIG. 12, the control unit includes a programmable power supply and a programmable logic controller, which can control the voltage of each drive unit 12 and the working state of each temperature control unit 22 respectively.
可选地,如图12所示,上述微流控系统还可以包括电路控制板08,电路控制板08与控制单元001相连,电路控制板08具有多个接口,多个接口与微流控芯片中的多个驱动单元12一一相连,控制单元001通过电路控制板08控制每个驱动单元12的电压。例如,若要控制液滴移动,控制单元001可以通过电路控制板沿需要液滴移动的方向依次给路径上的驱动单元12施加电压,从而液滴在介电润湿效应下向介电层13对应于被施加电压的驱动单元处移动。并且,控制单元可以通过调整施加给驱动单元12的电压来控制液滴的移动速度。Optionally, as shown in FIG. 12, the above-mentioned microfluidic system may further include a circuit control board 08, the circuit control board 08 is connected to the control unit 001, the circuit control board 08 has multiple interfaces, and the multiple interfaces are connected to the microfluidic chip A plurality of driving units 12 are connected one by one, and the control unit 001 controls the voltage of each driving unit 12 through the circuit control board 08. For example, to control the movement of the droplet, the control unit 001 can apply voltage to the driving unit 12 on the path through the circuit control board in the direction in which the droplet is required to move, so that the droplet is directed to the dielectric layer 13 under the dielectric wetting effect. This corresponds to the movement of the driving unit to which the voltage is applied. Also, the control unit can control the moving speed of the droplets by adjusting the voltage applied to the driving unit 12.
可选地,如图12所示,上述微流控系统还可以包括温控表09,温控表08连接控制单元03与微流控芯片中的温控单元22,温控表08中预设了第二衬底发生形变所需的温度,若微流控芯片要生成子液滴,则控制单元03通过温控表08控制微流控芯片中对应的温控单元22中的升温器件221加热第二衬底21,测温器件222检测第二衬底21对应温控单元22所在处的温度,并将检测到的温度反馈给温控表08,温控表08判断检测到的温度是否达到预设的温度,若达到预设温度,则使升温器件221停止加热,若没有达到预设温度,则使升温器件221继续加热,测温器件222继续反馈所检测的温度。Optionally, as shown in FIG. 12, the above-mentioned microfluidic system may further include a temperature control table 09, the temperature control table 08 is connected to the control unit 03 and the temperature control unit 22 in the microfluidic chip, and the temperature control table 08 is preset If the temperature required for the deformation of the second substrate is determined, if the microfluidic chip is to generate sub-droplets, the control unit 03 controls the heating of the heating device 221 in the corresponding temperature control unit 22 in the microfluidic chip through the temperature control table 08 The second substrate 21, the temperature measuring device 222 detects the temperature of the second substrate 21 corresponding to the temperature control unit 22, and feeds back the detected temperature to the temperature control table 08, and the temperature control table 08 determines whether the detected temperature has reached If the preset temperature reaches the preset temperature, the heating device 221 stops heating; if it does not reach the preset temperature, the heating device 221 continues to heat, and the temperature measuring device 222 continues to feed back the detected temperature.
可选地,上如图12所示,述微流控系统还可以包括降温系统002,降温系统002与控制单元001相连,降温系统002在微流控芯片中温控单元22工作后,降低微流控芯片中第二基板2的温度,以消除第二基板2的形变,从而微流控芯片才能重复生成子液滴。Optionally, as shown in Figure 12 above, the microfluidic system may also include a cooling system 002, which is connected to the control unit 001. The temperature of the second substrate 2 in the fluidic chip is used to eliminate the deformation of the second substrate 2 so that the microfluidic chip can repeatedly generate sub-droplets.
可选地,如图12所示,降温系统002可以包括降温器件06和步进电机07。步进电机07与降温器件06以及控制单元03相连,降温系统002设置在 微流控芯片靠近第二基板2一侧,在温控单元22完成加热后,第二基板2中的第二衬底21发生形变,步进电机07控制降温器件06向靠近第二基板2的方向下降,让降温器件06与第二基板2相接触,以让降温器件06降低第二基板2的温度,消除第二基板2上的形变。Optionally, as shown in FIG. 12, the cooling system 002 may include a cooling device 06 and a stepping motor 07. The stepping motor 07 is connected to the cooling device 06 and the control unit 03, and the cooling system 002 is arranged on the side of the microfluidic chip close to the second substrate 2. After the temperature control unit 22 finishes heating, the second substrate in the second substrate 2 21 is deformed, and the stepping motor 07 controls the cooling device 06 to descend toward the second substrate 2 so that the cooling device 06 is in contact with the second substrate 2, so that the cooling device 06 reduces the temperature of the second substrate 2 and eliminates the second substrate 2. Deformation on the substrate 2.
可选地,降温器件06可以是半导体制冷片,半导体制冷片通过热传递降低第二基板2的温度。Optionally, the cooling device 06 may be a semiconductor refrigeration sheet, and the semiconductor refrigeration sheet reduces the temperature of the second substrate 2 through heat transfer.
可选地,上如图12所示,述微流控系统还可以包括观测系统003,观测系统003用于观测微流控芯片中子液滴的生成状态,以便对液滴生成的参数进行调整。Optionally, as shown in Figure 12 above, the microfluidic system may also include an observation system 003, which is used to observe the generation state of the neutron droplets of the microfluidic chip, so as to adjust the parameters of the droplet generation. .
可选地,如图12所示,观测系统003包括一透明平台04,微流控芯片05设置在透明平台上,从而从透明平台04的两侧都可以观察到微流控芯片05。观测系统003还包括多个光学组件,例如:依次设置在透明平台04背离微流控芯片05一侧的图像单元01、滤光片02、聚焦物镜03,以及设置在微流控芯片05背离透明平台04一侧的背光源012。图像单元01、滤光片02、聚焦物镜03以及背光源012都按照在一刚性支架013上,以保证这些光学组件同轴准直,从而可以观测到微流控芯片05中子液滴的生成状况。Optionally, as shown in FIG. 12, the observation system 003 includes a transparent platform 04, and the microfluidic chip 05 is arranged on the transparent platform, so that the microfluidic chip 05 can be observed from both sides of the transparent platform 04. The observation system 003 also includes a plurality of optical components, such as: an image unit 01, a filter 02, and a focusing lens 03 arranged on the side of the transparent platform 04 away from the microfluidic chip 05, and arranged on the microfluidic chip 05 away from the transparent The backlight 012 on the side of the platform 04. The image unit 01, the filter 02, the focusing objective lens 03 and the backlight source 012 are all arranged on a rigid support 013 to ensure that these optical components are coaxially collimated, so that the generation of neutron droplets in the microfluidic chip 05 can be observed situation.
可以理解的是,以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式,然而本发明并不局限于此。对于本领域内的普通技术人员而言,在不脱离本发明的精神和实质的情况下,可以做出各种变型和改进,这些变型和改进也视为本发明的保护范围。It can be understood that the above implementations are merely exemplary implementations used to illustrate the principle of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also deemed to be within the protection scope of the present invention.

Claims (22)

  1. 一种微流控芯片,其包括:相对设置的第一基板和第二基板;所述微流控芯片包括用于使液滴分裂的液滴分裂区,在所述液滴分裂区中,所述第一基板和所述第二基板之间包括液滴容纳空间;其中,所述液滴容纳空间包括用于生成子液滴的工作区;A microfluidic chip includes: a first substrate and a second substrate that are arranged oppositely; the microfluidic chip includes a droplet splitting area for splitting droplets, in the droplet splitting area, A droplet accommodating space is included between the first substrate and the second substrate; wherein the droplet accommodating space includes a working area for generating sub-droplets;
    所述第一基板包括:The first substrate includes:
    第一衬底;First substrate
    多个驱动单元,间隔设置在所述第一衬底靠近所述第二基板一侧,且设置在所述第一衬底对应所述工作区的区域;A plurality of driving units are arranged at intervals on the side of the first substrate close to the second substrate, and are arranged in an area of the first substrate corresponding to the working area;
    所述第二基板包括:The second substrate includes:
    第二衬底,能够随着温度的升高发生形变;The second substrate can deform as the temperature rises;
    多个温控单元,其与所述驱动单元一一对应,所述温控单元用于使所述第二衬底对应所述温度单元所在处温度升高而产生形变,从而所述第二衬底形变处挤压所述液滴容纳空间中的液滴使其分裂为至少两个子液滴。A plurality of temperature control units corresponding to the driving unit one-to-one, and the temperature control unit is used to cause the second substrate to deform in response to an increase in temperature where the temperature unit is located, so that the second substrate The bottom deformation squeezes the droplet in the droplet accommodating space to split it into at least two sub-droplets.
  2. 根据权利要求1所述的微流控芯片,其中,所述温控单元在所述第一基板上的正投影被限定在与之对应的所述驱动单元在所述第一基板上的正投影内。The microfluidic chip according to claim 1, wherein the orthographic projection of the temperature control unit on the first substrate is limited to the corresponding orthographic projection of the driving unit on the first substrate Inside.
  3. 根据权利要求2所述的微流控芯片,其中,所述温控单元在所述第一基板上的正投影的中心区域,与所述驱动单元在第一基板上的正投影的中心区域重叠。The microfluidic chip according to claim 2, wherein the central area of the orthographic projection of the temperature control unit on the first substrate overlaps with the central area of the orthographic projection of the driving unit on the first substrate .
  4. 根据权利要求2所述的微流控芯片,其中,所述温控单元的形状为边长为0.12毫米的正方形;所述驱动单元的形状为边长为0.4毫米的正方形。The microfluidic chip according to claim 2, wherein the shape of the temperature control unit is a square with a side length of 0.12 mm; the shape of the driving unit is a square with a side length of 0.4 mm.
  5. 根据权利要求1所述的微流控芯片,其中,所述第一基板还包括:The microfluidic chip according to claim 1, wherein the first substrate further comprises:
    介电层,设置在所述驱动单元靠近所述第二基板一侧;The dielectric layer is arranged on the side of the driving unit close to the second substrate;
    第一疏液层,设置在所述介电层靠近所述第二基板一侧;The first liquid repellent layer is arranged on the side of the dielectric layer close to the second substrate;
    所述第二基板还包括:The second substrate further includes:
    第二疏液层,设置在所述第二衬底靠近所述液滴容纳空间的最外侧。The second lyophobic layer is arranged on the outermost side of the second substrate close to the droplet accommodating space.
  6. 根据权利要求1所述的微流控芯片,其中,所述温控单元包括:升温器件和测温器件;The microfluidic chip according to claim 1, wherein the temperature control unit comprises: a temperature rising device and a temperature measuring device;
    所述升温器件设置在所述第二衬底靠近所述第一基板一侧,用于加热所述第二衬底对应所述升温器件的位置;The heating device is arranged on a side of the second substrate close to the first substrate, and is used to heat the position of the second substrate corresponding to the heating device;
    所述测温器件设置在所述第二衬底背离所述第一基板一侧,用于检测所述第二衬底对应所述升温器件的位置的温度,以使所述第二衬底对应所述升温器件的位置达到预设的温度。The temperature measuring device is arranged on the side of the second substrate away from the first substrate, and is used to detect the temperature of the position of the second substrate corresponding to the heating device, so that the second substrate corresponds to The position of the heating device reaches a preset temperature.
  7. 根据权利要求6所述的微流控芯片,其中,所述升温器件包括热电阻;所述测温器件包括热电偶。7. The microfluidic chip according to claim 6, wherein the heating device comprises a thermal resistor; and the temperature measuring device comprises a thermocouple.
  8. 根据权利要求6所述的微流控芯片,其中,所述升温器件在所述第二基板上的正投影的中心区域,与所述测温器件在所述第二基板上的正投影的中心区域重叠。The microfluidic chip according to claim 6, wherein the central area of the orthographic projection of the heating device on the second substrate is the same as the center of the orthographic projection of the temperature measuring device on the second substrate Area overlap.
  9. 根据权利要求8所述的微流控芯片,其中,所述升温器件在所述第二基板上的正投影的面积,与所述测温器件在所述第二基板上的正投影的面积相同。8. The microfluidic chip according to claim 8, wherein the area of the orthographic projection of the heating device on the second substrate is the same as the area of the orthographic projection of the temperature measuring device on the second substrate .
  10. 根据权利要求1所述的微流控芯片,其中,所述驱动单元包括第一电极,其通过电压驱动所述工作区中的液滴移动或分裂。The microfluidic chip according to claim 1, wherein the driving unit comprises a first electrode that drives the droplet in the working area to move or split by a voltage.
  11. 根据权利要求10所述的微流控芯片,其中,所述液滴容纳空间还包括用于储存所述液滴的储液区;10. The microfluidic chip according to claim 10, wherein the droplet accommodating space further comprises a liquid storage area for storing the droplets;
    所述第一基板还包括多个第二电极,与所述第一电极同层设置在第一衬底靠近所述第二基板一侧,且设置在所述第一衬底对应所述储液区的区域,其通过电压驱动所述储液区中的液滴移动到所述工作区。The first substrate further includes a plurality of second electrodes, which are provided on the same layer as the first electrode on the side of the first substrate close to the second substrate, and are provided on the first substrate corresponding to the liquid storage The area of the area, which drives the droplets in the liquid storage area to move to the working area by voltage.
  12. 根据权利要求11所述的微流控芯片,其中,所述第二电极在所述第一基板上的正投影的面积,大于所述第一电极在所述第一基板上的正投影的面积。The microfluidic chip according to claim 11, wherein the area of the orthographic projection of the second electrode on the first substrate is larger than the area of the orthographic projection of the first electrode on the first substrate .
  13. 根据权利要求1所述的微流控芯片,其中,所述第二基板还包括导电层,设置在所述第二衬底靠近所述第一基板一侧,所述导电层连接一公共电压端。The microfluidic chip according to claim 1, wherein the second substrate further comprises a conductive layer disposed on the side of the second substrate close to the first substrate, and the conductive layer is connected to a common voltage terminal .
  14. 根据权利要求1所述的微流控芯片,其中,所述第二衬底的材料包括聚四氟乙烯,聚甲基丙烯酸甲酯中的任一种。The microfluidic chip according to claim 1, wherein the material of the second substrate includes any one of polytetrafluoroethylene and polymethyl methacrylate.
  15. 一种微流控系统,其包括权利要求1-14任一所述的微流控芯片。A microfluidic system, comprising the microfluidic chip according to any one of claims 1-14.
  16. 根据权利要求15所述的微流控系统,其中,还包括:控制单元,其与所述微流控芯片中的驱动单元连接,用于控制所述微流控芯片中的每个所述驱动单元的电压;The microfluidic system according to claim 15, further comprising: a control unit connected to the driving unit in the microfluidic chip and configured to control each of the driving units in the microfluidic chip The voltage of the unit;
    所述控制单元还与所述微流控芯片中的温控单元相连,用于控制所述微 流控芯片中的温控单元,将所述第二基板对应所述温控单元的位置加热至预设的温度。The control unit is also connected to the temperature control unit in the microfluidic chip, and is used to control the temperature control unit in the microfluidic chip to heat the second substrate at a position corresponding to the temperature control unit to The preset temperature.
  17. 根据权利要求16所述的微流控系统,其中,还包括:降温系统,与所述控制单元相连,用于降低所述微流控芯片中的第二基板的温度,消除所述第二基板的形变。The microfluidic system according to claim 16, further comprising: a cooling system connected to the control unit for reducing the temperature of the second substrate in the microfluidic chip and eliminating the second substrate The deformation.
  18. 根据权利要求17所述的微流控系统,其中,所述降温系统包括:降温器件和步进电机;The microfluidic system according to claim 17, wherein the cooling system comprises: a cooling device and a stepping motor;
    所述步进电机与所述降温器件以及所述控制单元相连,所述步进电机控制所述降温器件与所述第二基板相接触,以降低所述第二基板的温度。The stepping motor is connected to the cooling device and the control unit, and the stepping motor controls the cooling device to contact the second substrate to reduce the temperature of the second substrate.
  19. 根据权利要求16所述的微流控系统,其中,还包括:电路控制板,与所述控制单元相连,所述电路控制板具有多个接口,所述多个接口与所述微流控芯片中的多个驱动单元一一相连,所述控制单元通过所述电路控制板控制每个所述驱动单元的电压。The microfluidic system according to claim 16, further comprising: a circuit control board connected to the control unit, the circuit control board having a plurality of interfaces, and the plurality of interfaces are connected to the microfluidic chip A plurality of driving units are connected one by one, and the control unit controls the voltage of each driving unit through the circuit control board.
  20. 根据权利要求16所述的微流控系统,其中,所述控制单元包括可编程电源和可编程逻辑控制器。The microfluidic system according to claim 16, wherein the control unit includes a programmable power supply and a programmable logic controller.
  21. 根据权利要求15所述的微流控系统,其中,还包括:The microfluidic system according to claim 15, further comprising:
    观测系统,其用于观测所述微流控芯片中子液滴的生成状态。The observation system is used to observe the generation state of the neutron droplets of the microfluidic chip.
  22. 根据权利要求21所述的微流控系统,其中,所述观测系统包括透明平台,所述微流控芯片设置在所述透明平台上;The microfluidic system according to claim 21, wherein the observation system comprises a transparent platform, and the microfluidic chip is arranged on the transparent platform;
    所述观测系统还包括:依次设置在所述透明平台背离所述微流控芯片一 侧的图像单元、滤光片、聚焦物镜,以及设置在所述微流控芯片背离所述透明平台一侧的背光源。。The observation system further includes: an image unit, a filter, and a focusing objective lens arranged on the side of the transparent platform away from the microfluidic chip in sequence, and arranged on the side of the microfluidic chip away from the transparent platform The backlight. .
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