WO2021167221A1 - Electronic device - Google Patents

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Publication number
WO2021167221A1
WO2021167221A1 PCT/KR2020/018652 KR2020018652W WO2021167221A1 WO 2021167221 A1 WO2021167221 A1 WO 2021167221A1 KR 2020018652 W KR2020018652 W KR 2020018652W WO 2021167221 A1 WO2021167221 A1 WO 2021167221A1
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WO
WIPO (PCT)
Prior art keywords
housing
thermoelectric element
electronic device
disposed
air
Prior art date
Application number
PCT/KR2020/018652
Other languages
French (fr)
Korean (ko)
Inventor
서지호
고관철
김경목
김재환
김주혁
권용찬
이서호
천동현
Original Assignee
삼성전자주식회사
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Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2021167221A1 publication Critical patent/WO2021167221A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • AHUMAN NECESSITIES
    • A01AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01KANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K1/00Housing animals; Equipment therefor
    • A01K1/02Pigsties; Dog-kennels; Rabbit-hutches or the like
    • A01K1/03Housing for domestic or laboratory animals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D15/00Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/04Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
    • F25D17/06Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00General constructional features
    • F25D23/02Doors; Covers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00General constructional features
    • F25D23/02Doors; Covers
    • F25D23/028Details
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • F25D29/005Mounting of control devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

  • the present disclosure relates to an electronic device, and more particularly, to an electronic device capable of uniformly managing a temperature inside a housing using a thermoelectric element and a flow guide.
  • thermoelectric element uses the Peltier effect, and according to the amount and direction of current, one side of the thermoelectric element is heated by generating heat, and the other surface is cooled by absorbing heat, and has a function to control the ambient temperature.
  • thermoelectric elements are mainly small refrigerators, water heaters, air conditioners, etc. Recently, they are also used in pet houses, and are used in various products that require temperature control.
  • the method using a thermoelectric element has the advantage of being suitable for small home appliances and having a long and stable lifespan because the size of the temperature control unit is small compared to the method using a refrigerant or a hot wire.
  • thermoelectric element with a large area
  • the price increases and power efficiency is low.
  • maintaining the temperature there was a problem in that it was difficult to maintain the temperature uniformly due to the occurrence of a temperature difference inside.
  • the present disclosure provides an electronic device capable of uniformly managing the temperature inside a housing using a thermoelectric element and a flow guide.
  • An electronic device provides a housing having an opening disposed on its front surface, a thermoelectric element whose one surface is selectively cooled or heated according to a current direction, and air inside the housing to the thermoelectric element, and the thermoelectric element A flow guide for discharging the air in a predetermined direction inside the housing so that the air heat-exchanged in the device circulates inside the housing, a fan for providing the air inside the housing to the flow guide, and a current direction of power supplied to the thermoelectric device It includes a control circuit that controls it.
  • the electric device may further include a ventilation passage for discharging the air heat-exchanged on the other surface of the thermoelectric element that is not in contact with the flow guide to the outside of the housing.
  • the exhaust direction of the ventilation passage and the exhaust direction of the flow guide may be different from each other in the horizontal direction.
  • thermoelectric element may be disposed on the housing.
  • the electronic device includes a first heat sink disposed on one surface of the thermoelectric element, a second heat sink disposed on the other surface of the thermoelectric element, and a region in which the thermoelectric element is not disposed between the first heat sink and the second heat sink. It may further include an insulating material positioned.
  • the flow guide may include an intake port disposed under the thermoelectric element and an exhaust port disposed on a side surface of the thermoelectric element.
  • the exhaust port may be disposed adjacent to a side surface of the housing.
  • the exhaust port may be disposed between the center of the housing and the opening in a horizontal direction.
  • the flow guide may have a plurality of exhaust ports for discharging the air heat-exchanged in the thermoelectric element.
  • the flow guide may have a first exhaust port disposed in a left area and a second exhaust port disposed in a right area with respect to the opening.
  • the opening may be spaced apart from the inner lower end of the housing.
  • the distance between the openings may be 1/10 to 1/8 times the vertical height of the inside of the housing.
  • the electronic device may further include a door capable of selectively opening and closing the opening.
  • the electronic device may further include a hinge connecting the door and the housing.
  • the hinge may be disposed on the upper end of the door, and the door may be opened and closed in an inner direction and an outer direction of the housing based on the hinge.
  • the electronic device of the present disclosure may uniformly manage the temperature inside the housing by using the thermoelectric element and the flow guide.
  • FIG. 1 is a diagram illustrating an example of a shape of a housing of an electronic device according to an embodiment of the present disclosure.
  • FIG. 2 is a cross-sectional view of a front of an electronic device according to an embodiment of the present disclosure.
  • FIG 3 is a view for explaining the structure of the flow path guide and the ventilation flow path according to an embodiment of the present disclosure.
  • FIG. 4 is a view for explaining the structure of the flow path guide and the ventilation flow path according to an embodiment of the present disclosure.
  • FIG. 5 is a view for explaining a structure of spaced apart openings according to an embodiment of the present disclosure.
  • 6A and 6B are views schematically illustrating an air flow of an internal exhaust port related to a structure of an opening according to an embodiment of the present disclosure
  • FIGS. 7A to 7C are diagrams schematically illustrating an air flow related to positions of an intake port and an exhaust port of a flow guide according to an embodiment of the present disclosure
  • FIGS. 7A to 7C are temperature analysis tables of the electronic device of FIGS. 7A to 7C .
  • FIG 9 is a view for explaining a door according to an embodiment of the present disclosure.
  • ordinal number such as “first” and “second” may be used to distinguish between elements. This ordinal number is used to distinguish the same or similar elements from each other, and the meaning of the term should not be construed as limited due to the use of the ordinal number. As an example, the use order or arrangement order of the components combined with the ordinal number should not be limited by the number. If necessary, each ordinal number may be used interchangeably.
  • FIG. 1 is a diagram illustrating an example of a shape of a housing of an electronic device according to an embodiment of the present disclosure.
  • the electronic device 10 may include a housing 100 , a thermoelectric element 110 , a flow guide 120 , a fan 140 , and a control circuit 150 .
  • the electronic device 10 can uniformly control the temperature inside the housing 100 as will be described later, an object, food, or plant that needs to maintain a specific temperature is stored inside the housing 100, or a companion animal prefers it. It may be a companion animal house by maintaining the temperature, but is not limited thereto.
  • the housing 100 is a frame surrounding the electronic device 10 .
  • the housing 100 includes a floor, a wall surrounding it, and a top plate, and a cover may exist on the top plate.
  • the housing 100 has an opening 101 disposed on the front side. Through the opening 101 , a user may place an object, food, plant, or the like in the housing 100 , or an animal may enter and exit the housing 100 .
  • the direction in which the opening 101 of the housing 100 exists is referred to as the front side.
  • the housing 100 may have various three-dimensional shapes such as a tetrahedron, a rectangular parallelepiped, a cone, and a cylindrical shape.
  • the bottom of the housing 100 may be a triangle, a square, or a circle.
  • the shape of the housing 100 viewed from the front may be a triangle, a square, a pentagon, or a circle.
  • the cover 106 on the top plate of the housing 100 may be removable, or may be partially fixed to the housing. Between the upper plate of the housing 100 and the cover 106 , there may be a separate space distinguished from the inside of the housing 100 . Components included in an embodiment of the present disclosure and the like may be arranged in a separate space.
  • At least one ventilation hole 107 communicating with the outside is present in the cover 106, and the ventilation hole 107 may be disposed on the side surface or the rear surface. A portion of the air heat-exchanged in the thermoelectric element 110 to be described later may be ventilated to the outside through the ventilation hole 107 .
  • the housing 100 may include a handle 108 .
  • a handle 108 may be present over the lid 106 .
  • a plurality of handles 108 may be present on the side surface of the housing 100 .
  • the handle 108 may have an extended structure, or may have a concave structure into the housing 100 .
  • the thermoelectric element 110 is an element using the Peltier effect, in which one surface is selectively cooled or heated according to the direction in which current flows, and may be referred to as a Peltier element.
  • the thermoelectric element 110 may have a rectangular shape, and the size may be 4 cm to 5 cm in width and length, but it is not stable.
  • thermoelectric element 110 may be disposed on the upper portion of the housing 100 , or may be disposed on the rear surface of the housing 100 .
  • a plurality of thermoelectric elements 110 may be disposed in the electronic device 10 .
  • thermoelectric element 110 when the current inside the thermoelectric element 110 flows in an arbitrarily set (+) direction, one surface of the thermoelectric element 110 is cooled and the other surface can be heated at the same time. , if it flows in an arbitrarily set (-) direction, one side that was cooled in the (+) direction is heated and the other side that was heated at the same time can be cooled.
  • the flow guide 120 guides the flow of air in a predetermined direction.
  • the flow guide 120 of the present electronic device provides air inside the housing 100 to the thermoelectric element 110 , and the air heat-exchanged in the thermoelectric element 110 circulates in the housing 100 inside the housing 100 . discharge in a predetermined direction of
  • the flow guide 120 may include an intake port 121 through which internal air enters and exhaust ports 122 and 123 through which air is discharged.
  • the fan 140 is a blower [Fan] that causes the flow of air.
  • the fan 140 may control the air circulation direction inside the housing 100 according to the arrangement position, and the arrangement position of the fan 140 is not limited.
  • the fan 140 may be disposed inside the flow guide 120 or around the intake port 121 of the flow guide.
  • the fan 140 may transfer the air inside the housing 100 into the flow guide 120 in one direction. Also, the fan 140 may have a rotational intensity or rotational direction adjusted by a control circuit 150 to be described later. A plurality of fans 140 may be disposed, and each may be independently operated or controlled.
  • the control circuit 150 controls the current direction of the power supplied to the thermoelectric element 110 .
  • the control circuit 150 may be connected to a temperature sensor 151 capable of measuring a temperature inside the housing 100 , and may control the thermoelectric element 110 based on the sensed value. According to the value of the temperature sensor 151 , the control circuit 150 is supplied to the thermoelectric element 110 . The degree to which the thermoelectric element 110 is cooled or heated may be controlled by adjusting the current.
  • control circuit 150 may control the thermoelectric element 110 in a pulse width modulation (PWM) method.
  • PWM pulse width modulation
  • the control circuit 150 may calculate an operating duty based on a difference between the sensed temperature and the target temperature, and may supply power to the thermoelectric element 110 in a section corresponding to the calculated operating duty.
  • control circuit 150 may control the rotation of the fan 140 .
  • the control circuit 150 may operate the fan 140 , and when the thermoelectric element 110 does not operate, the control circuit 150 may stop the start of the fan 140 . have.
  • the thermoelectric element 110 may not operate and only the fan 140 may operate.
  • the control circuit 150 may be connected to the object detection sensor 152 .
  • the object detection sensor 152 may detect the entrance or exit of an object inside the housing 100 or the position of the object.
  • the control circuit 150 may operate or stop the thermoelectric element 110 and the fan when an object enters and exits according to the sensed value.
  • control circuit 150 operates the thermoelectric element 110 and the fan 140 even if the user does not individually control it. can be controlled to maintain an appropriate temperature.
  • the electronic device 10 may include a power supply 155 .
  • the power supply device 155 may receive external power and may have a built-in battery.
  • the arrangement and shape of the power supply device 155 are not limited, and may be directly connected to the control circuit 150 to supply power.
  • the control circuit 150 may cool one surface of the thermoelectric element 110 by adjusting the current. And the air inside the housing 100 may be guided to the flow guide 120 by the fan 140 .
  • the induced air inside the housing 100 may exchange heat with one surface of the cooled thermoelectric element 110 .
  • the heat-exchanged air is discharged back into the housing 100 at a lowered temperature, so that the temperature of the air inside the housing 100 may be maintained at A.
  • the control circuit 150 may heat one surface of the thermoelectric element 110 by adjusting the current. And the air inside the housing 100 may be guided to the flow guide 120 by the fan 140 .
  • the induced air inside the housing 100 may exchange heat with one surface of the heated thermoelectric element 110 .
  • the heat-exchanged air is discharged back into the housing 100 at an elevated temperature, so that the temperature of the air inside the housing 100 may be maintained at A.
  • the electronic device 10 may further include a ventilation flow path 130 .
  • the ventilation flow path 130 is a flow path for discharging the air heat-exchanged on the other surface of the thermoelectric element 110 not in contact with the flow guide 120 to the outside of the housing 100 .
  • the ventilation flow path 130 may be disposed on the upper portion or the rear portion of the housing 100 .
  • the ventilation flow path 130 may have a communication structure, and may include one or more ventilation holes 132 and 133 .
  • the ventilation flow path 130 may include a separate ventilation inlet 131 , and a separate ventilation fan 145 may be attached thereto.
  • the ventilation fan 145 may introduce external air in a predetermined direction and may also exhaust it.
  • the exhaust direction F b of the ventilation flow path 130 and the exhaust direction F of the flow path guide 120 with respect to the horizontal direction of the electronic device 10 . a ) may be the same or different.
  • the electronic device 10 can efficiently discharge the air heat-exchanged from the other surface of the thermoelectric element 110 to the outside of the housing 100 through the ventilation flow path 130 .
  • the electronic device 10 controls the flow guide 12 and the fan 14 to circulate the air inside the housing 100 in a desired shape according to the purpose of use. Also, it is possible to maintain a uniform temperature throughout the interior of the housing 100 .
  • thermoelectric element 110 As described above, although the electronic device 10 according to the present disclosure is shown in the form of a small house in the drawings, the present disclosure is not limited thereto, and may be applied to various products using the thermoelectric element 110 .
  • FIG. 2 is a cross-sectional view of a front of an electronic device according to an embodiment of the present disclosure.
  • the electronic device 10 may further include a first heat sink 111 disposed on one surface of the thermoelectric element 110 and a second heat sink 112 disposed on the other surface of the thermoelectric element 110 . have.
  • the heat sinks 111 and 112 are plates that emit or absorb heat, and one surface may be formed in the form of a fin.
  • the heat sinks 111 and 112 may be advantageous for heat exchange by increasing a surface area in contact with air during heat exchange.
  • the heat sinks 111 and 112 may be made of a material having high thermal conductivity.
  • the inside of the heat sinks 111 and 112 may be filled with a liquid such as coolant.
  • the heat sinks 111 and 112 are disposed in contact with or close to one surface and the other surface of the thermoelectric element 110 to be heated or cooled by the thermoelectric element 110 , and heat exchange with the air of the flow path guide 120 or the ventilation flow path 130 .
  • the first heat sink Since a temperature difference occurs between the first heat sink 111 and the second heat sink 112 as they are cooled or heated, respectively, in order to minimize unnecessary heat exchange between the first heat sink 111 and the second heat sink 112, the first heat sink The heat insulating material 113 may be disposed between the 111 and the second heat dissipation plate 112 in a region where the thermoelectric element 110 is not disposed.
  • the heat insulating material 113 can prevent unnecessary heat exchange, it may be made of a material such as asbestos, cork, or glass wool having low thermal conductivity.
  • the air circulation direction inside the housing 100 is may vary.
  • the flow guide 120 may include an intake port 121 disposed under the thermoelectric element 110 and exhaust ports 122 and 123 disposed on a side surface of the thermoelectric element 110 . At this time, the intake port 121 of the flow guide 120 is present under the thermoelectric element 110 , so that the air inside the housing 100 can directly exchange heat with the thermoelectric element 110 .
  • the exhaust ports 122 and 123 may be disposed adjacent to the side surface of the housing 100 , and as shown in FIG. 7C , which will be described later, the exhaust ports 122 and 123 are located at the center and opening of the housing 100 in a horizontal direction. It may be disposed between 101 .
  • the flow guide 120 may have a plurality of exhaust ports 122 and 123 for discharging the air heat-exchanged in the thermoelectric element 110 , and further, the flow guide 120 is disposed on the left side with respect to the opening 101 . It may have a first exhaust port 122 that is formed, and a second exhaust port 123 that is disposed in the right area.
  • the air discharged from the exhaust ports 122 and 123 moves to the lower end of the housing 100 along the side wall inside the housing 100 . comes right down Therefore, even if the thermoelectric element 110 and the exhaust ports 122 and 123 are disposed at the upper end of the housing 100 , the temperature can be uniformly adjusted up to the lower end of the housing 100 .
  • 3 and 4 are views for explaining the structures of the flow path guide 120 and the ventilation flow path 130 according to an embodiment of the present disclosure, respectively.
  • the flow guide 120 may have a structure in which one intake port 121 is disposed at a lower end, and two exhaust ports 122 and 123 are disposed opposite to each other in a linear direction.
  • the two exhaust ports may be disposed opposite to each other in a linear direction, and a separate intake port may be disposed at an upper end thereof.
  • the air traveling direction of the flow path guide 120 may be referred to as F a
  • the air traveling direction of the ventilation flow path may be referred to as F b with respect to the horizontal direction.
  • the cooled or heated air heat-exchanged on the other surface of the thermoelectric element 110 is discharged through the ventilation flow path 130 . Since it is discharged, the air of the flow path guide 120 in this embodiment is different from the air temperature of the adjacent ventilation flow path 130 . Therefore, unnecessary secondary heat exchange may occur between the flow path guide 120 and the ventilation flow path 130 .
  • Embodiment of Figure 3 the exhaust because the direction (F a) are equal in the exhaust direction (F b) and the flow guide 120 in the electronic apparatus 10, the ventilation passage 130, based on the horizontal direction, the flow guide ( 120) and the ventilation flow path 130 are horizontal, so unnecessary secondary heat exchange may occur.
  • FIG 5 is a view for explaining the structure of the spaced apart opening 101 according to an embodiment of the present disclosure.
  • the opening 101 may be spaced apart from the inner lower end of the housing 100 .
  • the lower end of the opening 101 may have a structure concave in the inner direction of the housing 100 as shown in FIG. 5 .
  • the opening 101 may be disposed to be spaced apart from the inner top or side of the housing 100 .
  • the separation distance h 2 of the opening is 1/10 of the vertical height h 1 inside the housing. to 1/8 times. The difference according to the presence or absence of the separation distance of the opening will be described later with reference to FIGS. 6A and 6B.
  • FIGS. 6A and 6B are diagrams schematically illustrating the air flow of the internal exhaust ports 122 and 123 associated with the structure of the opening 101 according to an embodiment of the present disclosure.
  • the intake port 121 of the flow guide 120 is located at the upper center of the housing 100 , and the first exhaust port 122 is adjacent to the left side of the housing 100 with respect to the opening 101 , the second 2 It is assumed that the exhaust port 123 is disposed adjacent to the right side of the housing 100 with respect to the opening 101 .
  • the opening 101 is disposed to be spaced apart from the top, bottom, left, and right ends of the inside of the housing 100 , it is possible to reduce the amount of air flowing inside the housing 100 to the outside, so that the housing 100 ) can keep the air inside efficiently and uniformly.
  • the housing interior of the vertical height (h 1) 400mm to 500mm and the spacing of the openings (h 2) is the air to the lower direction from the top to the case of about 50mm, an exhaust port (122, 123), the housing 100 Assume an embodiment that emits .
  • FIG. 6A schematically illustrates an air flow when the lower ends of the opening 101 are not spaced apart. Since the exhaust ports 122 and 123 discharge the open air from the top to the bottom, the heat-exchanged air is scattered from the bottom. At this time, some heat-exchanged air may flow out through the lower end of the opening 101 .
  • FIG. 6B schematically illustrates an air flow when the opening 101 is spaced apart from the lower end of the housing 100 by 1/10 to 1/8 times the vertical height of the inside of the housing. Since the exhaust ports 122 and 123 discharge the open air from the top to the bottom, the heat-exchanged air is scattered from the bottom. However, since the lower ends of the opening 101 are spaced apart, the amount of air discharged in the lower direction directly flowing out can be reduced.
  • the opening 101 may be spaced apart from the lower end. Through this, the amount of heat-exchanged air directly outflow can be controlled.
  • FIGS. 7A to 7C are diagrams schematically illustrating an air flow related to positions of an intake port and an exhaust port of a flow guide according to an embodiment of the present disclosure
  • the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be disposed at the center of the upper end of the housing 100 .
  • the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be rearwardly disposed between the center of the housing 100 and a wall surface opposite to the opening 101 in a horizontal direction.
  • the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be disposed forward between the center of the housing 100 and the opening 101 in a horizontal direction.
  • FIGS. 7A to 7C are a temperature analysis table of the electronic device 10 according to the arrangement of FIGS. 7A to 7C.
  • the inside of the housing 100 may be 400*600*500mm, and the opening 101 may have a height of 50mm spaced apart from each other.
  • the numerical value of FIG. 8 is a situation in which the temperature inside the housing 100 is higher than the temperature of the outside by setting the front and rear displacement of the intake port 121 and the exhaust ports 122 and 123 to 116 mm with reference to FIGS. 7b and 7c. is assumed.
  • the amount of air generated by the fan 140 is 0.28 m ⁇ 3/min
  • the external temperature of the housing 100 is 35°C
  • the air temperature difference between the intake port 121 and the exhaust ports 122 and 123 is equal to 3°C. It is assumed that the endothermic amounts are matched.
  • the lowest internal temperature was measured in the example of the front arrangement as shown in FIG. 7C in the above experiment.
  • the exhaust ports 122 and 123 may be disposed between the center of the housing 100 and the opening 101 .
  • the heat loss to the outside of the housing 100 was the lowest, and the temperature inside the housing 100 could be efficiently controlled.
  • the electronic device 10 may change the positions of the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 to adjust the internal air circulation direction.
  • the electronic device 10 may set an optimal air circulation direction for temperature control inside the housing 100 using the flow guide 120 , and may efficiently control the temperature inside the housing 100 .
  • FIG. 9 is a view for explaining the door 102 according to an embodiment of the present disclosure.
  • the electronic device 10 may further include a door.
  • the door 102 may selectively open and close the opening 101 .
  • the door 102 may be of various types, such as a sliding door, an opening door, a detachable type, and the like.
  • the door 102 may have an effect of reducing heat exchange and movement of air inside and outside the housing 100 , and may minimize power consumption by maintaining a constant temperature inside the electronic device 10 . Furthermore, by attaching a hermetic door capable of completely blocking the opening 101 , the inflow of air through the opening 101 may be minimized.
  • the method may further include a hinge 103 connecting the upper end of the door 102 and the housing 100 , and the inner and outer directions of the housing 100 with respect to the hinge 103 . It may be possible to open and close in the direction. Since the hinge 103 is attached to the upper end, the door 102 can be opened and closed only by a pushing operation. In particular, when an animal enters the housing 100 directly, access is easier than when the hinge 103 is on the side. can do.
  • the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be movable.
  • a moving frame 125 supporting the flow guide 120 may be disposed on the upper plate of the housing 100 .
  • the moving frame 125 may be automatically moved by the control circuit 150 .
  • the electronic device 10 can arrange the positions of the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 by the moving frame 125 according to the situation, and control the air circulation direction to efficiently You can adjust the temperature.
  • thermoelectric element 110 may be disposed at the lower end of the housing 100 .
  • the electronic device 10 heats or cools the lower end of the housing 100 in a heat conduction manner by the thermoelectric element 110 disposed at the lower portion, and at the same time discharges the heat-exchanged air into the housing 100 using the flow guide 120 . can do.
  • thermoelectric element 110 may heat or cool the lower end and adjust the temperature inside the housing 100 . Therefore, there is a problem that a temperature difference occurs inside, and it takes a long time to reach a desired temperature.
  • thermoelectric element 110 when the thermoelectric element 110 is disposed at the lower end and the flow guide 120 is used, the electronic device 10 transfers the heat-exchanged air through the flow guide 120 to the inside of the housing 100 in a desired direction. can be cycled.
  • thermoelectric element 110 even when the thermoelectric element 110 is disposed at the lower end, the temperature inside the housing 100 can be uniformly and quickly controlled using the flow path guide 120 , and unnecessary heat exchange with the outside can control the above-described air circulation direction. can be prevented in this way.

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Abstract

An electronic device capable of controlling internal temperature is disclosed. The present electronic device comprises: a housing having an opening arranged at the front thereof; a thermoelectric element having one surface that is selectively cooled or heated in the current direction; a flow path guide which provides the air inside the housing to the thermoelectric element, and which discharges the air heat-exchanged in the thermoelectric element in the preset direction inside the housing so as to circulate same inside the housing; a fan for providing the air inside the housing to the flow path guide; and a control circuit for controlling the current direction of the power supplied to the thermoelectric element.

Description

전자 기기Electronics
본 개시는 전자 기기에 관한 것으로, 상세하게는 열전소자와 유로 가이드를 이용하여 하우징 내부의 온도를 균일하게 관리할 수 있는 전자 기기에 관한 것이다. The present disclosure relates to an electronic device, and more particularly, to an electronic device capable of uniformly managing a temperature inside a housing using a thermoelectric element and a flow guide.
열전소자는 펠티에(Peltier) 효과를 이용하여, 전류량과 전류 방향에 따라 열전소자의 일면은 열을 발생하며 가열되고, 타면은 열을 흡수하며 냉각되어, 주변 온도를 조절할 수 있는 기능을 갖추고 있다. The thermoelectric element uses the Peltier effect, and according to the amount and direction of current, one side of the thermoelectric element is heated by generating heat, and the other surface is cooled by absorbing heat, and has a function to control the ambient temperature.
열전소자를 이용한 가전제품은 주로 소형 냉장고, 냉온수기, 에어컨 등이 있고 최근에는 반려동물 하우스까지 이용되며, 온도 조절이 필요한 다양한 제품에서 사용되고 있다. 열전소자를 이용하는 방식은 냉매 또는 열선을 이용하는 방식에 비해, 온도 조절부의 크기가 작기에 소형 가전에 적합하고 수명이 길고 안정적이라는 장점을 가지고 있다.Home appliances using thermoelectric elements are mainly small refrigerators, water heaters, air conditioners, etc. Recently, they are also used in pet houses, and are used in various products that require temperature control. The method using a thermoelectric element has the advantage of being suitable for small home appliances and having a long and stable lifespan because the size of the temperature control unit is small compared to the method using a refrigerant or a hot wire.
다만, 종래의 열전소자를 직접 이용하여 온도를 조절하는 기기의 경우, 큰 면적의 열전소자를 이용하는 경우 가격이 상승하게 되고 전력 효율이 낮다는 문제점이 있고, 작은 열전소자를 이용하여 전도방식으로 온도를 유지하는 경우에는 내부에서 온도차가 발생하여 균일하게 온도를 유지하기 어렵다는 문제점이 있었다.However, in the case of a conventional device that directly uses a thermoelectric element to control the temperature, if a thermoelectric element with a large area is used, the price increases and power efficiency is low. In the case of maintaining the temperature, there was a problem in that it was difficult to maintain the temperature uniformly due to the occurrence of a temperature difference inside.
상술한 바와 같은 문제점을 해결하기 위하여, 본 개시는 열전소자와 유로 가이드를 이용하여 하우징 내부의 온도를 균일하게 관리할 수 있는 전자 기기를 제공하는 데 있다. In order to solve the above problems, the present disclosure provides an electronic device capable of uniformly managing the temperature inside a housing using a thermoelectric element and a flow guide.
본 개시의 일 실시 예에 따른 전자 기기는, 전면에 개구가 배치된 하우징, 전류 방향에 따라 일면이 선택적으로 냉각되거나 가열되는 열전소자, 상기 하우징 내부의 공기를 상기 열전소자에 제공하고, 상기 열전소자에서 열교환된 공기가 상기 하우징 내부에서 순환하도록 상기 하우징 내부의 기설정된 방향으로 배출하는 유로 가이드, 상기 하우징 내부의 공기를 상기 유로 가이드로 제공하는 팬 및 상기 열전 소자에 공급되는 전원의 전류 방향을 제어하는 제어 회로를 포함한다.An electronic device according to an embodiment of the present disclosure provides a housing having an opening disposed on its front surface, a thermoelectric element whose one surface is selectively cooled or heated according to a current direction, and air inside the housing to the thermoelectric element, and the thermoelectric element A flow guide for discharging the air in a predetermined direction inside the housing so that the air heat-exchanged in the device circulates inside the housing, a fan for providing the air inside the housing to the flow guide, and a current direction of power supplied to the thermoelectric device It includes a control circuit that controls it.
이 경우, 상기 전가 기기는 상기 유로 가이드가 접하지 않는 상기 열전 소자의 타 면에서 열교환된 공기를 하우징 외부로 배출하는 환기 유로를 더 포함할 수 있다. In this case, the electric device may further include a ventilation passage for discharging the air heat-exchanged on the other surface of the thermoelectric element that is not in contact with the flow guide to the outside of the housing.
이 경우, 수평 방향을 기준으로 상기 환기 유로의 배기 방향과 상기 유로 가이드의 배기 방향은 상이할 수 있다.In this case, the exhaust direction of the ventilation passage and the exhaust direction of the flow guide may be different from each other in the horizontal direction.
한편, 상기 열전 소자는 상기 하우징의 상부에 배치될 수 있다.Meanwhile, the thermoelectric element may be disposed on the housing.
한편, 상기 전자 기기는 상기 열전 소자의 일면에 배치되는 제1 방열판, 상기 열전 소자의 타면에 배치되는 제2 방열판 및 상기 제1 방열판과 상기 제2 방열판 사이 중 상기 열전 소자가 배치되지 않는 영역에 위치하는 단열재를 더 포함할 수 있다.On the other hand, the electronic device includes a first heat sink disposed on one surface of the thermoelectric element, a second heat sink disposed on the other surface of the thermoelectric element, and a region in which the thermoelectric element is not disposed between the first heat sink and the second heat sink. It may further include an insulating material positioned.
한편, 상기 유로 가이드는 상기 열전 소자의 하부에 배치되는 흡기구와 상기 열전 소자의 측면에 배치되는 배기구를 포함할 수 있다.Meanwhile, the flow guide may include an intake port disposed under the thermoelectric element and an exhaust port disposed on a side surface of the thermoelectric element.
이 경우, 상기 배기구는 상기 하우징의 측면에 인접하게 배치될 수 있다.In this case, the exhaust port may be disposed adjacent to a side surface of the housing.
한편, 상기 배기구는 수평 방향을 기준으로 상기 하우징의 중심과 상기 개구 사이에 배치될 수 있다.Meanwhile, the exhaust port may be disposed between the center of the housing and the opening in a horizontal direction.
한편, 상기 유로 가이드는 상기 열전소자에서 열교환된 공기를 방출하는 복수의 배기구를 가질 수 있다.Meanwhile, the flow guide may have a plurality of exhaust ports for discharging the air heat-exchanged in the thermoelectric element.
이 경우, 상기 유로 가이드는 상기 개구를 기준으로 좌측 영역에 배치되는 제1 배기구 및 우측 영역에 배치되는 제2 배기구를 가질 수 있다. In this case, the flow guide may have a first exhaust port disposed in a left area and a second exhaust port disposed in a right area with respect to the opening.
한편, 상기 개구는 상기 하우징 내부 하단으로부터 이격 배치될 수 있다.On the other hand, the opening may be spaced apart from the inner lower end of the housing.
이 경우, 상기 개구의 이격 거리는 상기 하우징 내부의 수직 높이의 1/10 내지 1/8 배일 수 있다.In this case, the distance between the openings may be 1/10 to 1/8 times the vertical height of the inside of the housing.
한편, 상기 전자 기기는 상기 개구를 선택적으로 개폐 가능한 도어를 더 포함할 수 있다.Meanwhile, the electronic device may further include a door capable of selectively opening and closing the opening.
이 경우, 상기 전자 기기는 상기 도어와 상기 하우징을 연결하는 힌지를 더 포함할 수 있다.In this case, the electronic device may further include a hinge connecting the door and the housing.
이 경우, 상기 힌지는 상기 도어 상단에 배치되고, 상기 도어는 상기 힌지를 기준으로 상기 하우징의 내부 방향과 외부 방향으로 개폐 가능할 수 있다. In this case, the hinge may be disposed on the upper end of the door, and the door may be opened and closed in an inner direction and an outer direction of the housing based on the hinge.
본 개시의 전자 기기는 열전소자와 유로 가이드를 이용하여 하우징 내부의 온도를 균일하게 관리할 수 있다.The electronic device of the present disclosure may uniformly manage the temperature inside the housing by using the thermoelectric element and the flow guide.
도 1은 본 개시의 일 실시예에 따른 전자 기기의 하우징의 형태 예를 도시한 도면이다. 1 is a diagram illustrating an example of a shape of a housing of an electronic device according to an embodiment of the present disclosure.
도 2는 본 개시의 일 실시예에 따른 전자 기기의 정면의 단면도이다. 2 is a cross-sectional view of a front of an electronic device according to an embodiment of the present disclosure.
도 3은 본 개시의 일 실시예에 따른 유로 가이드와 환기 유로의 구조를 설명하기 위한 도면이다.3 is a view for explaining the structure of the flow path guide and the ventilation flow path according to an embodiment of the present disclosure.
도 4는 본 개시의 일 실시예에 따른 유로 가이드와 환기 유로의 구조를 설명하기 위한 도면이다.4 is a view for explaining the structure of the flow path guide and the ventilation flow path according to an embodiment of the present disclosure.
도 5는 본 개시의 일 실시예에 따른 이격 배치된 개구의 구조를 설명하기 위한 도면이다.5 is a view for explaining a structure of spaced apart openings according to an embodiment of the present disclosure.
도 6a, 6b는 본 개시의 일 실시예에 따른 개구의 구조와 관련된 내부 배기구의 공기 흐름을 개략적으로 나타낸 도면이다.6A and 6B are views schematically illustrating an air flow of an internal exhaust port related to a structure of an opening according to an embodiment of the present disclosure;
도 7a 내지 7c는 본 개시의 일 실시예에 따른 유로 가이드의 흡기구와 배기구의 위치와 관련된 공기 흐름을 개략적으로 나타낸 도면이다.7A to 7C are diagrams schematically illustrating an air flow related to positions of an intake port and an exhaust port of a flow guide according to an embodiment of the present disclosure;
도 8은 도 7a 내지 7c 의 전자 기기의 온도분석 표이다.8 is a temperature analysis table of the electronic device of FIGS. 7A to 7C .
도 9는 본 개시의 일 실시예에 따른 도어를 설명하기 위한 도면이다.9 is a view for explaining a door according to an embodiment of the present disclosure.
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본 개시에 대하여 구체적으로 설명하기에 앞서, 본 명세서 및 도면의 기재 방법에 대하여 설명한다.Before describing the present disclosure in detail, a description will be given of the description of the present specification and drawings.
먼저, 본 명세서 및 청구범위에서 사용되는 용어는 본 개시의 다양한 실시 예들에서의 기능을 고려하여 일반적인 용어들을 선택하였다 하지만, 이러한 용어들은 당해 기술 분야에 종사하는 기술자의 의도나 법률적 또는 기술적 해석 및 새로운 기술의 출현 등에 따라 달라질 수 있다. 또한, 일부 용어는 출원인이 임의로 선정한 용어도 있다. 이러한 용어에 대해서는 본 명세서에서 정의된 의미로 해석될 수 있으며, 구체적인 용어 정의가 없으면 본 명세서의 전반적인 내용 및 당해 기술 분야의 통상적인 기술 상식을 토대로 해석될 수도 있다. First, the terms used in the present specification and claims are general terms selected in consideration of the functions in various embodiments of the present disclosure, but these terms are not intended to be used in terms of the intention or legal or technical interpretation of those of ordinary skill in the art; It may vary depending on the emergence of new technologies, etc. Also, some terms are arbitrarily selected by the applicant. These terms may be interpreted in the meaning defined in the present specification, and if there is no specific term definition, it may be interpreted based on the general content of the present specification and common technical common sense in the art.
또한, 본 명세서에 첨부된 각 도면에 기재된 동일한 참조번호 또는 부호는 실질적으로 동일한 기능을 수행하는 부품 또는 구성요소를 나타낸다. 설명 및 이해의 편의를 위해서 서로 다른 실시 예들에서도 동일한 참조번호 또는 부호를 사용하여 설명한다. 즉, 복수의 도면에서 동일한 참조 번호를 가지는 구성요소를 모두 도시되어 있다고 하더라도, 복수의 도면들이 하나의 실시 예를 의미하는 것은 아니다. Also, the same reference numerals or reference numerals in each drawing attached to this specification indicate parts or components that perform substantially the same functions. For convenience of description and understanding, the same reference numerals or reference numerals are used in different embodiments. That is, even though all components having the same reference number are illustrated in a plurality of drawings, the plurality of drawings do not mean one embodiment.
또한, 본 명세서 및 청구범위에서는 구성요소들 간의 구별을 위하여 "제1", "제2" 등과 같이 서수를 포함하는 용어가 사용될 수 있다. 이러한 서수는 동일 또는 유사한 구성요소들을 서로 구별하기 위하여 사용하는 것이며 이러한 서수 사용으로 인하여 용어의 의미가 한정 해석되어서는 안 된다. 일 예로, 이러한 서수와 결합된 구성요소는 그 숫자에 의해 사용 순서나 배치 순서 등이 제한되어서는 안 된다. 필요에 따라서는, 각 서수들은 서로 교체되어 사용될 수도 있다. In addition, in this specification and claims, terms including an ordinal number such as “first” and “second” may be used to distinguish between elements. This ordinal number is used to distinguish the same or similar elements from each other, and the meaning of the term should not be construed as limited due to the use of the ordinal number. As an example, the use order or arrangement order of the components combined with the ordinal number should not be limited by the number. If necessary, each ordinal number may be used interchangeably.
본 명세서에서 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 출원에서, "포함하다" 또는 "구성되다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.In this specification, the singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as "comprises" or "consisting of" are intended to designate that the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification exist, and are intended to indicate that one or more other It is to be understood that this does not preclude the possibility of addition or presence of features or numbers, steps, operations, components, parts, or combinations thereof.
이하에서는 도면을 참조하여 본 개시에 대해 더욱 상세히 설명하기로 한다.Hereinafter, the present disclosure will be described in more detail with reference to the drawings.
도 1은 본 개시의 일 실시예에 따른 전자 기기의 하우징의 형태 예를 도시한 도면이다.1 is a diagram illustrating an example of a shape of a housing of an electronic device according to an embodiment of the present disclosure.
본 전자 기기(10)는 하우징(100), 열전소자(110), 유로 가이드(120), 팬(140), 제어 회로(150)를 포함할 수 있다.The electronic device 10 may include a housing 100 , a thermoelectric element 110 , a flow guide 120 , a fan 140 , and a control circuit 150 .
전자 기기(10)는 후술할 바와 같이 하우징(100) 내부의 온도를 균일하게 조절할 수 있으므로, 하우징(100) 내부에는 특정한 온도 유지가 필요한 물건, 음식 또는 식물 등이 보관되거나, 반려동물이 선호하는 온도로 유지하여 반려동물 하우스 등이 될 수 있으며, 이에 한정되지 아니한다.Since the electronic device 10 can uniformly control the temperature inside the housing 100 as will be described later, an object, food, or plant that needs to maintain a specific temperature is stored inside the housing 100, or a companion animal prefers it. It may be a companion animal house by maintaining the temperature, but is not limited thereto.
하우징(100)은 전자 기기(10)를 둘러싸고 있는 프레임이다. 하우징(100)은 바닥과 이를 둘러싼 벽면, 그리고 상판으로 이루어지며, 상판 위에는 덮개가 존재할 수 있다. The housing 100 is a frame surrounding the electronic device 10 . The housing 100 includes a floor, a wall surrounding it, and a top plate, and a cover may exist on the top plate.
하우징(100)은 전면에 개구(101)가 배치된다. 개구(101)를 통하여 사용자가 하우징(100) 내부에 물건, 음식 또는 식물 등을 두거나, 동물 등이 드나들 수 있다. 이하에서, 하우징(100)의 개구(101)가 존재하는 방향을 전면으로 지칭한다.The housing 100 has an opening 101 disposed on the front side. Through the opening 101 , a user may place an object, food, plant, or the like in the housing 100 , or an animal may enter and exit the housing 100 . Hereinafter, the direction in which the opening 101 of the housing 100 exists is referred to as the front side.
하우징(100)은 사면체, 직육면체, 원뿔, 원기둥 형태 등의 다양한 입체 형태를 가질 수 있다. 하우징(100)의 바닥은 삼각형, 사각형 또는 원형일 수 있다. 그리고 정면에서 바라본 하우징(100)의 형태는 삼각형, 사각형, 오각형 또는 원형일 수도 있다. The housing 100 may have various three-dimensional shapes such as a tetrahedron, a rectangular parallelepiped, a cone, and a cylindrical shape. The bottom of the housing 100 may be a triangle, a square, or a circle. In addition, the shape of the housing 100 viewed from the front may be a triangle, a square, a pentagon, or a circle.
하우징(100)의 상판 위의 덮개(106)는 탈착식일 수 있고, 혹은 하우징에 일부 고정될 수도 있다. 하우징(100) 상판과 덮개(106) 사이는 하우징(100) 내부와 구별되는 별도 공간이 있을 수 있다. 별도 공간에 본 개시의 일 실시예에서 포함하는 구성 등이 배치될 수 있다. The cover 106 on the top plate of the housing 100 may be removable, or may be partially fixed to the housing. Between the upper plate of the housing 100 and the cover 106 , there may be a separate space distinguished from the inside of the housing 100 . Components included in an embodiment of the present disclosure and the like may be arranged in a separate space.
덮개(106)에는 외부와 연통되는 하나 이상의 통풍구(107)가 존재하여, 통풍구(107)는 측면 또는 후면부 등에 배치될 수 있다. 통풍구(107)를 통해 후술할 열전소자(110)에서 열교환된 공기 일부가 외부로 외기될 수 있다.At least one ventilation hole 107 communicating with the outside is present in the cover 106, and the ventilation hole 107 may be disposed on the side surface or the rear surface. A portion of the air heat-exchanged in the thermoelectric element 110 to be described later may be ventilated to the outside through the ventilation hole 107 .
하우징(100)은 손잡이(108)를 포함할 수 있다. 손잡이(108)는 덮개(106) 상부에 존재할 수 있다. 또한, 손잡이(108)는 하우징(100)의 측면에 복수개 존재할 수 있다. 손잡이(108)는 연장되는 구조일 수 있고, 하우징(100) 내부로 오목한 구조일 수 있다.The housing 100 may include a handle 108 . A handle 108 may be present over the lid 106 . In addition, a plurality of handles 108 may be present on the side surface of the housing 100 . The handle 108 may have an extended structure, or may have a concave structure into the housing 100 .
열전소자(110)는 전류가 흐르는 방향에 따라 일면이 선택적으로 냉각되거나 가열되는 펠티에(Peltier) 효과를 이용한 소자로, 펠티에 소자로 지칭될 수 있다. 열전소자(110)는 사각형일 수 있고, 크기는 가로와 세로 길이가 4cm 내지 5cm일 수 있으나 이에 안정되지 아니하다. The thermoelectric element 110 is an element using the Peltier effect, in which one surface is selectively cooled or heated according to the direction in which current flows, and may be referred to as a Peltier element. The thermoelectric element 110 may have a rectangular shape, and the size may be 4 cm to 5 cm in width and length, but it is not stable.
열전소자(110)는 하우징(100) 상부에 배치될 수 있고, 하우징(100) 후면에 배치될 수도 있다. 전자 기기(10)에는 복수의 열전소자(110)가 배치될 수도 있다. The thermoelectric element 110 may be disposed on the upper portion of the housing 100 , or may be disposed on the rear surface of the housing 100 . A plurality of thermoelectric elements 110 may be disposed in the electronic device 10 .
전류 방향에 따른 열전소자(110)의 작동을 설명하자면, 열전소자(110) 내부의 전류가 임의로 설정된 (+)방향으로 흐를 때 열전소자(110)의 일면은 냉각되고 동시에 타면은 가열될 수 있고, 임의로 설정된 (-)방향으로 흐른다면, (+)방향일 때 냉각되던 일면은 가열되고 동시에 가열되던 타면은 냉각될 수 있다. To explain the operation of the thermoelectric element 110 according to the current direction, when the current inside the thermoelectric element 110 flows in an arbitrarily set (+) direction, one surface of the thermoelectric element 110 is cooled and the other surface can be heated at the same time. , if it flows in an arbitrarily set (-) direction, one side that was cooled in the (+) direction is heated and the other side that was heated at the same time can be cooled.
유로 가이드(120)는 공기의 흐름을 기설정된 방향으로 유도한다. 본 전자 기기의 유로 가이드(120)는 하우징(100) 내부의 공기를 열전소자(110)에 제공하고, 열전소자(110)에서 열교환된 공기가 하우징(100) 내부에서 순환하도록 하우징(100) 내부의 기설정된 방향으로 배출한다. 유로 가이드(120)는 내부 공기가 들어오는 흡기구(121)와 공기를 방출하는 배기구(122, 123)가 존재할 수 있다.The flow guide 120 guides the flow of air in a predetermined direction. The flow guide 120 of the present electronic device provides air inside the housing 100 to the thermoelectric element 110 , and the air heat-exchanged in the thermoelectric element 110 circulates in the housing 100 inside the housing 100 . discharge in a predetermined direction of The flow guide 120 may include an intake port 121 through which internal air enters and exhaust ports 122 and 123 through which air is discharged.
유로 가이드(120)의 실시 가능한 형태와 배치는 도 3과 도 4에서 후술한다.A possible form and arrangement of the flow guide 120 will be described later with reference to FIGS. 3 and 4 .
팬(140)은 공기의 유동을 일으키는 송풍기[Fan]이다. 팬(140)은 배치 위치에 따라 하우징(100) 내부의 공기 순환 방향을 제어할 수 있으며, 팬(140)의 배치 위치는 제한이 없다. 팬(140)은 유로 가이드(120)의 내부 또는 유로 가이드의 흡기구(121) 주변에 배치될 수도 있다.The fan 140 is a blower [Fan] that causes the flow of air. The fan 140 may control the air circulation direction inside the housing 100 according to the arrangement position, and the arrangement position of the fan 140 is not limited. The fan 140 may be disposed inside the flow guide 120 or around the intake port 121 of the flow guide.
팬(140)은 하우징(100) 내부의 공기를 유로 가이드(120) 내부로 일방향 전달할 수 있다. 또한, 팬(140)은 후술할 제어 회로(150)에 의하여 회전 강도 또는 회전 방향이 조절될 수 있다. 복수의 팬(140)이 배치될 수도 있으며, 각각 독립적으로 작동하거나 제어될 수 있다.The fan 140 may transfer the air inside the housing 100 into the flow guide 120 in one direction. Also, the fan 140 may have a rotational intensity or rotational direction adjusted by a control circuit 150 to be described later. A plurality of fans 140 may be disposed, and each may be independently operated or controlled.
제어 회로(150)는 열전소자(110)에 공급되는 전원의 전류 방향을 제어한다.The control circuit 150 controls the current direction of the power supplied to the thermoelectric element 110 .
제어 회로(150)는 하우징(100) 내부의 온도를 측정할 수 있는 온도감지센서(151)와 연결되고, 감지된 값에 기초하여 열전소자(110)를 제어할 수 있다. 온도감지센서(151) 값에 따라, 제어 회로(150)는 열전소자(110)에 공급되는 전류를 조절하여 열전소자(110)가 냉각 또는 가열되는 정도를 제어할 수도 있다.The control circuit 150 may be connected to a temperature sensor 151 capable of measuring a temperature inside the housing 100 , and may control the thermoelectric element 110 based on the sensed value. According to the value of the temperature sensor 151 , the control circuit 150 is supplied to the thermoelectric element 110 . The degree to which the thermoelectric element 110 is cooled or heated may be controlled by adjusting the current.
이때, 제어 회로(150)는 PWM(Pulse Width Modulation) 방식으로 열전소자(110)를 제어할 수 있다. 예를 들어, 제어 회로(150)는 감지된 온도와 목표 온도와의 차이에 기초하여 동작 듀티를 계산하고, 계산된 동작 듀티에 대응되는 구간에서는 열전소자(110)에 전원을 공급할 수 있다. In this case, the control circuit 150 may control the thermoelectric element 110 in a pulse width modulation (PWM) method. For example, the control circuit 150 may calculate an operating duty based on a difference between the sensed temperature and the target temperature, and may supply power to the thermoelectric element 110 in a section corresponding to the calculated operating duty.
또한, 제어 회로(150)는 팬(140)의 회전을 제어할 수도 있다. 예를 들어, 열전소자(110)가 동작하는 경우, 제어 회로(150)는 팬(140)을 가동할 수 있으며, 열전소자(110)가 동작하지 않은 경우 팬(140)의 기동을 중지할 수 있다. 또는, 열전소자(110)는 동작하지 않고 팬(140)만이 동작할 수 있다.Also, the control circuit 150 may control the rotation of the fan 140 . For example, when the thermoelectric element 110 operates, the control circuit 150 may operate the fan 140 , and when the thermoelectric element 110 does not operate, the control circuit 150 may stop the start of the fan 140 . have. Alternatively, the thermoelectric element 110 may not operate and only the fan 140 may operate.
제어 회로(150)는 물체감지센서(152)에 연결될 수 있다. 물체감지센서(152)는 하우징(100) 내부의 물체의 출입 또는 물체 위치를 감지할 수 있다. 제어 회로(150)는 감지된 값에 따라 물체가 출입하는 경우 열전소자(110)와 팬의 가동시키거나 가동을 중단시킬 수 있다.The control circuit 150 may be connected to the object detection sensor 152 . The object detection sensor 152 may detect the entrance or exit of an object inside the housing 100 or the position of the object. The control circuit 150 may operate or stop the thermoelectric element 110 and the fan when an object enters and exits according to the sensed value.
일 실시예로서 동물용 하우스를 예로 들면, 물체감지센서(152)를 통하여 동물의 출입이 감지되는 경우, 사용자가 개별적으로 컨트롤하지 않아도 제어 회로(150)는 열전소자(110)와 팬(140)을 제어하여 적정 온도를 유지시킬 수 있다.Taking the animal house as an example as an example, when the entry of the animal is detected through the object detection sensor 152 , the control circuit 150 operates the thermoelectric element 110 and the fan 140 even if the user does not individually control it. can be controlled to maintain an appropriate temperature.
전자 기기(10)는 전원장치(155)를 포함할 수 있다. 전원장치(155)는 외부에서 전원을 공급받을 수 있고, 배터리를 내장할 수 있다. 전원장치(155)의 배치 및 형태는 제약이 없으며, 제어 회로(150)에 직접 연결되어, 전력을 공급할 수 있다. The electronic device 10 may include a power supply 155 . The power supply device 155 may receive external power and may have a built-in battery. The arrangement and shape of the power supply device 155 are not limited, and may be directly connected to the control circuit 150 to supply power.
그러므로, 전자 기기(10)가 내부 온도를 조절하는 방식을 예로 들면, 하우징(100) 내부에서 유지하고자 하는 온도가 A라는 가정하에, 온도감지센서(151)에 의해 감지되는 하우징(100) 내부의 온도가 A보다 높다면, 제어 회로(150)는 전류를 조절하여 열전소자(110)의 일면을 냉각할 수 있다. 그리고 하우징(100) 내부 공기는 팬(140)에 의하여 유로 가이드(120)로 유도될 수 있다. Therefore, taking the method of controlling the internal temperature of the electronic device 10 as an example, on the assumption that the temperature to be maintained inside the housing 100 is A, the temperature inside the housing 100 sensed by the temperature sensor 151 is If the temperature is higher than A, the control circuit 150 may cool one surface of the thermoelectric element 110 by adjusting the current. And the air inside the housing 100 may be guided to the flow guide 120 by the fan 140 .
유도되는 하우징(100) 내부 공기는 냉각된 열전소자(110) 일면과 열교환할 수 있다. 열교환된 공기는 낮춰진 온도로 다시 하우징(100) 내부로 배출되어, 하우징(100) 내부 공기의 온도를 A로 유지할 수 있다. The induced air inside the housing 100 may exchange heat with one surface of the cooled thermoelectric element 110 . The heat-exchanged air is discharged back into the housing 100 at a lowered temperature, so that the temperature of the air inside the housing 100 may be maintained at A.
또한, 온도감지센서(151)에 의해 감지되는 하우징(100) 내부의 온도가 A보다 높다면, 제어 회로(150)는 전류를 조절하여 열전소자(110)의 일면을 가열할 수 있다. 그리고 하우징(100) 내부 공기는 팬(140)에 의하여 유로 가이드(120)로 유도될 수 있다. In addition, if the temperature inside the housing 100 sensed by the temperature sensor 151 is higher than A, the control circuit 150 may heat one surface of the thermoelectric element 110 by adjusting the current. And the air inside the housing 100 may be guided to the flow guide 120 by the fan 140 .
유도되는 하우징(100) 내부 공기는 가열된 열전소자(110) 일면과 열교환할 수 있다. 열교환된 공기는 높아진 온도로 다시 하우징(100) 내부로 배출되어, 하우징(100) 내부 공기의 온도를 A로 유지할 수 있다. The induced air inside the housing 100 may exchange heat with one surface of the heated thermoelectric element 110 . The heat-exchanged air is discharged back into the housing 100 at an elevated temperature, so that the temperature of the air inside the housing 100 may be maintained at A.
한편, 전자 기기(10)는 환기 유로(130)를 더 포함할 수 있다. Meanwhile, the electronic device 10 may further include a ventilation flow path 130 .
환기 유로(130)는 유로 가이드(120)가 접하지 않는 열전소자(110)의 타 면에서 열교환된 공기를 하우징(100) 외부로 배출하는 유로이다. 환기 유로(130)는 하우징(100) 상부 또는 후면부에서 배치될 수 있다.The ventilation flow path 130 is a flow path for discharging the air heat-exchanged on the other surface of the thermoelectric element 110 not in contact with the flow guide 120 to the outside of the housing 100 . The ventilation flow path 130 may be disposed on the upper portion or the rear portion of the housing 100 .
환기 유로(130)는 연통 구조일 수 있으며, 하나 이상의 환기구(132, 133)를 포함할 수 있다. 환기 유로(130)는 별도의 환기 흡기구(131)를 포함할 수 있으며, 별도의 환기 팬(145)이 부착될 수도 있다. 환기 팬(145)은 기설정된 방향으로 외부 공기를 유입시키고, 또한 배출시킬 수 있다.The ventilation flow path 130 may have a communication structure, and may include one or more ventilation holes 132 and 133 . The ventilation flow path 130 may include a separate ventilation inlet 131 , and a separate ventilation fan 145 may be attached thereto. The ventilation fan 145 may introduce external air in a predetermined direction and may also exhaust it.
한편, 후술할 도3과 도 4의 일 실시예와 같이, 전자 기기(10)의 수평 방향을 기준으로 환기 유로(130)의 배기 방향(F b)과 유로 가이드(120)의 배기 방향(F a)은 동일하거나, 상이할 수 있다.Meanwhile, as in an embodiment of FIGS. 3 and 4 to be described later, the exhaust direction F b of the ventilation flow path 130 and the exhaust direction F of the flow path guide 120 with respect to the horizontal direction of the electronic device 10 . a ) may be the same or different.
그러므로, 열전소자(110)의 타면에서 열교환된 공기가 제대로 배출되지 않는다면, 열전소자(110)의 성능을 저하시킬 수 있다. 그러므로, 전자 기기(10)는 환기 유로(130)를 통하여 열전소자(110)의 타면에서 열교환된 공기를 효율적으로 하우징(100) 외부로 배출시킬 수 있다. Therefore, if the heat-exchanged air from the other surface of the thermoelectric element 110 is not properly discharged, the performance of the thermoelectric element 110 may be deteriorated. Therefore, the electronic device 10 can efficiently discharge the air heat-exchanged from the other surface of the thermoelectric element 110 to the outside of the housing 100 through the ventilation flow path 130 .
이상과 같은 본 실시 예에 따른 전자 기기(10)는 전자 기기(10)는 유로 가이드(12)와 팬(14)을 제어함으로써, 사용 목적에 따라 원하는 방형으로 하우징(100) 내부 공기를 순환시킬 수 있고, 또한 하우징(100) 내부 전반의 온도를 균일하게 유지시킬 수 있다.As described above, in the electronic device 10 according to the present embodiment, the electronic device 10 controls the flow guide 12 and the fan 14 to circulate the air inside the housing 100 in a desired shape according to the purpose of use. Also, it is possible to maintain a uniform temperature throughout the interior of the housing 100 .
이상과 같이 본 개시에 따른 전자 기기(10)는 도면에서는 소형 하우스 형태로 도시되었으나 이에 한정되지 아니하며, 열전소자(110)를 이용하는 다양한 제품에 적용될 수 있다. As described above, although the electronic device 10 according to the present disclosure is shown in the form of a small house in the drawings, the present disclosure is not limited thereto, and may be applied to various products using the thermoelectric element 110 .
또한, 개구(101)를 포함하는 구조에서의 냉난방 시스템은 개구(101)를 통한 외부 공기와의 열교환 및 공기 유출입이 불가피하다. 그러나 본 개시에 따른 전자 기기(10)는 공기 순환 방향을 제어할 수 있기에, 열교환된 공기를 효율적으로 하우징(100) 내부에서 순환 시킬 수 있다.In addition, in the heating/cooling system in a structure including the opening 101 , heat exchange with external air and air inflow and outflow through the opening 101 are unavoidable. However, since the electronic device 10 according to the present disclosure can control the air circulation direction, the heat-exchanged air can be efficiently circulated inside the housing 100 .
도 2는 본 개시의 일 실시예에 따른 전자 기기의 정면의 단면도이다. 2 is a cross-sectional view of a front of an electronic device according to an embodiment of the present disclosure.
도 2을 참조하면, 전자 기기(10)는 열전소자(110)의 일면에 배치되는 제1 방열판(111)과 열전소자(110)의 타면에 배치되는 제2 방열판(112)을 더 포함할 수 있다. Referring to FIG. 2 , the electronic device 10 may further include a first heat sink 111 disposed on one surface of the thermoelectric element 110 and a second heat sink 112 disposed on the other surface of the thermoelectric element 110 . have.
방열판(111, 112)은 열을 방출하거나 흡수하는 판으로서, 일면이 핀 형태로 이루어질 수 있다. 방열판(111, 112)은 열교환 시 공기와 닿는 표면적을 늘려 주어 열교환에 유리할 수 있다. 방열판(111, 112)은 열전도율이 높은 재질로 이루어질 수 있다. 방열판(111, 112) 내부는 냉각수와 같은 액체로 채워질 수도 있다.The heat sinks 111 and 112 are plates that emit or absorb heat, and one surface may be formed in the form of a fin. The heat sinks 111 and 112 may be advantageous for heat exchange by increasing a surface area in contact with air during heat exchange. The heat sinks 111 and 112 may be made of a material having high thermal conductivity. The inside of the heat sinks 111 and 112 may be filled with a liquid such as coolant.
방열판(111, 112)은 열전소자(110)의 일면과 타면에 접하거나 근접하게 배치되어 열전소자(110)에 의해 가열 또는 냉각되고, 유로 가이드(120) 또는 환기 유로(130)의 공기와 열교환을 한다.The heat sinks 111 and 112 are disposed in contact with or close to one surface and the other surface of the thermoelectric element 110 to be heated or cooled by the thermoelectric element 110 , and heat exchange with the air of the flow path guide 120 or the ventilation flow path 130 . do
제1 방열판(111)과 제2 방열판(112)은 각각 냉각 또는 가열되기에 온도 차가 발생하게 되므로, 제1 방열판(111)과 제2 방열판(112) 간의 불필요한 열교환을 최소화하기 위해, 제1 방열판(111)과 제2 방열판(112)의 사이 중 열전소자(110)가 배치되지 않는 영역에 단열재(113)가 배치될 수 있다.Since a temperature difference occurs between the first heat sink 111 and the second heat sink 112 as they are cooled or heated, respectively, in order to minimize unnecessary heat exchange between the first heat sink 111 and the second heat sink 112, the first heat sink The heat insulating material 113 may be disposed between the 111 and the second heat dissipation plate 112 in a region where the thermoelectric element 110 is not disposed.
단열재(113)는 불필요한 열교환을 방지할 수 있으므로, 열전도율이 낮은 석면, 코르크, 유리 솜 등의 재질일 수 있다.Since the heat insulating material 113 can prevent unnecessary heat exchange, it may be made of a material such as asbestos, cork, or glass wool having low thermal conductivity.
한편, 전자 기기(10)가 갖는 유로 가이드(120)의 흡기구(121)과 배기구(122, 123)의 배치 방식에 따라 하우징(100) 내부에서의 공기 순환 방향이 달라질 수 있다. On the other hand, depending on the arrangement method of the intake port 121 and the exhaust port 122, 123 of the flow guide 120 of the electronic device 10, the air circulation direction inside the housing 100 is may vary.
일례로, 유로 가이드(120)는 열전소자(110)의 하부에 배치되는 흡기구(121)와 열전소자(110)의 측면에 배치되는 배기구(122, 123)를 포함할 수 있다. 이때, 유로 가이드(120)의 흡기구(121)가 열전소자(110) 하부에 존재하여 하우징(100) 내부의 공기가 곧바로 열전소자(110) 하부와 열교환을 할 수 있다.For example, the flow guide 120 may include an intake port 121 disposed under the thermoelectric element 110 and exhaust ports 122 and 123 disposed on a side surface of the thermoelectric element 110 . At this time, the intake port 121 of the flow guide 120 is present under the thermoelectric element 110 , so that the air inside the housing 100 can directly exchange heat with the thermoelectric element 110 .
또한, 배기구(122, 123)는 하우징(100)의 측면에 인접하게 배치될 수도 있으며, 후술할 도 7c와 같이, 배기구(122, 123)는 수평 방향을 기준으로 하우징(100)의 중심과 개구(101) 사이에 배치될 수도 있다. In addition, the exhaust ports 122 and 123 may be disposed adjacent to the side surface of the housing 100 , and as shown in FIG. 7C , which will be described later, the exhaust ports 122 and 123 are located at the center and opening of the housing 100 in a horizontal direction. It may be disposed between 101 .
유로 가이드(120)는 열전소자(110)에서 열교환된 공기를 방출하는 복수의 배기구(122, 123)를 가질 수 있고, 나아가, 유로 가이드(120)는 개구(101)를 기준으로 좌측 영역에 배치되는 제1 배기구(122) 및 우측 영역에 배치되는 제2 배기구(123)를 가질 수 있다.The flow guide 120 may have a plurality of exhaust ports 122 and 123 for discharging the air heat-exchanged in the thermoelectric element 110 , and further, the flow guide 120 is disposed on the left side with respect to the opening 101 . It may have a first exhaust port 122 that is formed, and a second exhaust port 123 that is disposed in the right area.
복수의 배기구(122, 123)를 하우징(100)의 측면에 인접하여 배치하게 되면 배기구(122, 123)에서 배출된 공기가 하우징(100) 내부의 측면 벽을 따라 하우징(100) 내부의 하단으로 곧바로 내려오게 된다. 그러므로, 열전소자(110)와 배기구(122, 123)가 하우징(100)의 상단에 배치되더라도 하우징(100) 하단까지 균일하게 온도를 조절할 수 있다.When the plurality of exhaust ports 122 and 123 are disposed adjacent to the side surface of the housing 100 , the air discharged from the exhaust ports 122 and 123 moves to the lower end of the housing 100 along the side wall inside the housing 100 . comes right down Therefore, even if the thermoelectric element 110 and the exhaust ports 122 and 123 are disposed at the upper end of the housing 100 , the temperature can be uniformly adjusted up to the lower end of the housing 100 .
도 3 및 도 4는 각각 본 개시의 일 실시예에 따른 유로 가이드(120)와 환기 유로(130)의 구조를 설명하기 위한 도면이다. 3 and 4 are views for explaining the structures of the flow path guide 120 and the ventilation flow path 130 according to an embodiment of the present disclosure, respectively.
유로 가이드(120)는 1개의 흡기구(121)가 하단에 배치되고, 2개의 배기구(122, 123)는 직선 방향으로 서로 반대쪽으로 배치되는 구조일 수 있다. 환기 유로(130)는 2개의 배기구는 직선 방향으로 서로 반대쪽으로 배치되고, 상단에 별도의 흡기구가 배치될 수도 있다. 이때, 수평방향을 기준으로 유로 가이드(120)의 공기 진행 방향을 F a, 환기 유로의 공기 진행 방향을 F b라 지칭할 수 있다.The flow guide 120 may have a structure in which one intake port 121 is disposed at a lower end, and two exhaust ports 122 and 123 are disposed opposite to each other in a linear direction. In the ventilation passage 130 , the two exhaust ports may be disposed opposite to each other in a linear direction, and a separate intake port may be disposed at an upper end thereof. In this case, the air traveling direction of the flow path guide 120 may be referred to as F a , and the air traveling direction of the ventilation flow path may be referred to as F b with respect to the horizontal direction.
열전소자(110)의 일면에서 열교환한 가열 또는 냉각된 공기가 유로 가이드(120)를 통해 배출될 때, 열전소자(110)의 타면에서 열교환한 냉각 또는 가열된 공기가 환기 유로(130)를 통해 배출되므로, 이러한 실시예에서의 유로 가이드(120)의 공기는 인접한 환기 유로(130)의 공기 온도와 차이가 발생하게 된다. 그러므로, 유로 가이드(120)와 환기 유로(130)간의 불필요한 2차 열교환이 일어날 수 있다. When the heated or cooled air heat-exchanged on one surface of the thermoelectric element 110 is discharged through the flow path guide 120 , the cooled or heated air heat-exchanged on the other surface of the thermoelectric element 110 is discharged through the ventilation flow path 130 . Since it is discharged, the air of the flow path guide 120 in this embodiment is different from the air temperature of the adjacent ventilation flow path 130 . Therefore, unnecessary secondary heat exchange may occur between the flow path guide 120 and the ventilation flow path 130 .
도 3의 실시예는, 전자 기기(10)의 수평 방향을 기준으로 환기 유로(130)의 배기 방향(F b)과 유로 가이드(120)의 배기 방향(F a)이 동일하므로, 유로 가이드(120)와 환기 유로(130)가 진행하는 방향이 수평하여 불필요한 2차 열교환이 발생할 수 있다.Embodiment of Figure 3, the exhaust because the direction (F a) are equal in the exhaust direction (F b) and the flow guide 120 in the electronic apparatus 10, the ventilation passage 130, based on the horizontal direction, the flow guide ( 120) and the ventilation flow path 130 are horizontal, so unnecessary secondary heat exchange may occur.
그에 반하여, 도 4의 실시예는, 전자 기기(10)의 수평 방향을 기준으로 환기 유로(130)의 배기 방향(F b)과 유로 가이드(120)의 배기 방향(F a)은 상이하므로, 유로 가이드(120)와 환기 유로(130)가 진행하는 방향이 직교하여 불필요한 2차 열교환을 최소화할 수 있다.Since it contrast, the embodiment of Figure 4, the exhaust direction of the exhaust direction (F b) and the flow guide 120 in the electronic apparatus 10, the ventilation passage 130, based on the horizontal direction (F a) are different, Since the direction in which the flow path guide 120 and the ventilation flow path 130 proceed is orthogonal, unnecessary secondary heat exchange can be minimized.
도 5은 본 개시의 일 실시예에 따른 이격 배치된 개구(101)의 구조를 설명하기 위한 도면이다. 5 is a view for explaining the structure of the spaced apart opening 101 according to an embodiment of the present disclosure.
도 5를 참조하면, 개구(101)는 하우징(100) 내부 하단으로부터 이격 배치될 수 있다. 이격 배치되는 구조에 있어서, 개구(101)의 하단부는 도 5와 같이 하우징(100) 내부 방향으로 오목한 구조일 수 있다. 또한, 개구(101)는 하우징(100) 내부 상단 또는 측면으로부터 이격 배치될 수 있다. Referring to FIG. 5 , the opening 101 may be spaced apart from the inner lower end of the housing 100 . In the spaced apart structure, the lower end of the opening 101 may have a structure concave in the inner direction of the housing 100 as shown in FIG. 5 . In addition, the opening 101 may be disposed to be spaced apart from the inner top or side of the housing 100 .
하우징(100) 내부의 수직 높이를 h 1, 개구(101)의 하단 이격 거리를 h 2라고 지칭하면, 이때 개구의 이격 거리(h 2)는 하우징 내부의 수직 높이(h 1)의 1/10 내지 1/8 배를 가질 수 있다. 개구의 이격 거리 유무에 따른 차이점은 하기 도 6a와 도 6b에서 후술한다.If the vertical height inside the housing 100 is h 1 , and the bottom separation distance of the opening 101 is referred to as h 2 , then the separation distance h 2 of the opening is 1/10 of the vertical height h 1 inside the housing. to 1/8 times. The difference according to the presence or absence of the separation distance of the opening will be described later with reference to FIGS. 6A and 6B.
도 6a, 6b는 본 개시의 일 실시예에 따른 개구(101)의 구조와 관련된 내부 배기구(122, 123)의 공기 흐름을 개략적으로 나타낸 도면이다. 6A and 6B are diagrams schematically illustrating the air flow of the internal exhaust ports 122 and 123 associated with the structure of the opening 101 according to an embodiment of the present disclosure.
일 실시예에 따라 유로 가이드(120)의 흡기구(121)가 하우징(100) 상단 중심부에, 그리고 제1 배기구(122)는 개구(101)를 기준으로 하우징(100) 좌측면에 인접하게, 제2 배기구(123)는 개구(101)를 기준으로 하우징(100) 우측면에 인접하게 배치된 상황을 가정한다. According to an embodiment, the intake port 121 of the flow guide 120 is located at the upper center of the housing 100 , and the first exhaust port 122 is adjacent to the left side of the housing 100 with respect to the opening 101 , the second 2 It is assumed that the exhaust port 123 is disposed adjacent to the right side of the housing 100 with respect to the opening 101 .
도 6a와 같이, 배기구(122, 123)를 통하여 열교환된 공기가 배출되면 열교환된 공기는 개구(101)를 통하여 하우징(100) 외부로 유출되게 되며, 동시에 하우징(100)으로 외부 공기가 유입될 수 있다.As shown in FIG. 6A , when the heat-exchanged air is discharged through the exhaust ports 122 and 123 , the heat-exchanged air flows out to the outside of the housing 100 through the opening 101 , and at the same time external air is introduced into the housing 100 . can
도 6b와 같이, 개구(101)가 하우징(100) 내부의 상단, 하단, 좌단, 우단으로부터 이격되어 배치된다면, 하우징(100) 내부의 공기가 외부로 유출되는 양을 줄일 수 있어, 하우징(100) 내부의 공기를 효율적으로 균일하게 유지할 수 있다. As shown in FIG. 6B , if the opening 101 is disposed to be spaced apart from the top, bottom, left, and right ends of the inside of the housing 100 , it is possible to reduce the amount of air flowing inside the housing 100 to the outside, so that the housing 100 ) can keep the air inside efficiently and uniformly.
예를 들면, 하우징 내부의 수직 높이(h 1)가 400mm 내지 500mm이고 개구의 이격 거리(h 2)는 50mm정도인 경우로, 배기구(122, 123)가 하우징(100) 상단에서 하단 방향으로 공기를 배출하는 실시예를 가정한다.For example, the housing interior of the vertical height (h 1) 400mm to 500mm and the spacing of the openings (h 2) is the air to the lower direction from the top to the case of about 50mm, an exhaust port (122, 123), the housing 100 Assume an embodiment that emits .
도 6a는 개구(101)의 하단이 이격 배치 되지 않은 경우의 공기 흐름을 개략적으로 도시하였다. 배기구(122, 123)가 상단에서 하단 방향으로 공개를 배출하므로, 열교환된 공기는 하단에서 흩어지게 된다. 이 때, 개구(101)의 하단을 통하여 일부 열교환된 공기가 외부로 유출될 수 있다. 6A schematically illustrates an air flow when the lower ends of the opening 101 are not spaced apart. Since the exhaust ports 122 and 123 discharge the open air from the top to the bottom, the heat-exchanged air is scattered from the bottom. At this time, some heat-exchanged air may flow out through the lower end of the opening 101 .
도 6b는 개구(101)를 하우징(100) 내부 하단으로부터 하우징의 내부의 수직 높이의 1/10 내지 1/8 배로 이격 배치된 경우의 공기 흐름을 개략적으로 도시하였다. 배기구(122, 123)가 상단에서 하단 방향으로 공개를 배출하므로, 열교환된 공기는 하단에서 흩어지게 된다. 그런데, 개구(101)의 하단부가 이격 배치되어 있기에, 하단 방향으로 배출된 공기가 곧바로 외부로 유출되는 양을 줄일 수 있다.6B schematically illustrates an air flow when the opening 101 is spaced apart from the lower end of the housing 100 by 1/10 to 1/8 times the vertical height of the inside of the housing. Since the exhaust ports 122 and 123 discharge the open air from the top to the bottom, the heat-exchanged air is scattered from the bottom. However, since the lower ends of the opening 101 are spaced apart, the amount of air discharged in the lower direction directly flowing out can be reduced.
즉, 도어가 없는 개구(101)가 존재하는 전자 기기(10)의 온도 조절에 있어서, 개구(101)는 하단으로부터 이격 배치될 수 있다. 이를 통하여, 열교환된 공기가 곧바로 외부로 유출되는 양이 조절될 수 있다.That is, in the temperature control of the electronic device 10 having the opening 101 without a door, the opening 101 may be spaced apart from the lower end. Through this, the amount of heat-exchanged air directly outflow can be controlled.
도 7a 내지 7c는 본 개시의 일 실시예에 따른 유로 가이드의 흡기구와 배기구의 위치와 관련된 공기 흐름을 개략적으로 나타낸 도면이다.7A to 7C are diagrams schematically illustrating an air flow related to positions of an intake port and an exhaust port of a flow guide according to an embodiment of the present disclosure;
도 7a를 참조하면, 유로 가이드(120)의 흡기구(121)와 배기구(122, 123)가 하우징(100) 상단 중심에 배치될 수 있다. Referring to FIG. 7A , the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be disposed at the center of the upper end of the housing 100 .
도 7b를 참조하면, 유로 가이드(120)의 흡기구(121)와 배기구(122, 123)가 수평 방향을 기준으로 하우징(100)의 중심과 개구(101) 반대 측 벽면 사이로 후방 배치될 수 있다. Referring to FIG. 7B , the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be rearwardly disposed between the center of the housing 100 and a wall surface opposite to the opening 101 in a horizontal direction.
도 7c를 참조하면, 유로 가이드(120)의 흡기구(121)와 배기구(122, 123)가 수평 방향을 기준으로 하우징(100)의 중심과 개구(101) 사이로 전방 배치될 수 있다. Referring to FIG. 7C , the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be disposed forward between the center of the housing 100 and the opening 101 in a horizontal direction.
이러한 각 실시예에 있어서, 내부 온도를 비교한 결과는 도 8과 함께 후술한다.In each of these examples, a result of comparing the internal temperature will be described later with FIG. 8 .
도 8는 도 7a내지 7c의 배치에 따른 전자 기기(10)의 온도분석 표이다. 8 is a temperature analysis table of the electronic device 10 according to the arrangement of FIGS. 7A to 7C.
하우징(100) 내부는 400*600*500mm이고, 개구(101)가 이격 배치된 높이가 50mm일 수 있다. 그리고, 도 8의 수치 값은 도 7b와 도 7c을 참조하여 흡기구(121)과 배기구(122, 123)의 전후방 배치 변위를 116mm로 하여, 하우징(100) 내부의 온도가 외부의 온도보다 높은 상황을 가정한 것이다. 또한, 팬(140)에 의하여 발생하는 풍량은 0.28m^3/min이며 하우징(100) 외부 온도는 35℃이고, 흡기구(121)와 배기구(122, 123)의 공기 온도 차를 3℃로 동일하게 하여 흡열량을 일치시킨 것을 가정한다. The inside of the housing 100 may be 400*600*500mm, and the opening 101 may have a height of 50mm spaced apart from each other. And, the numerical value of FIG. 8 is a situation in which the temperature inside the housing 100 is higher than the temperature of the outside by setting the front and rear displacement of the intake port 121 and the exhaust ports 122 and 123 to 116 mm with reference to FIGS. 7b and 7c. is assumed. In addition, the amount of air generated by the fan 140 is 0.28 m^3/min, the external temperature of the housing 100 is 35°C, and the air temperature difference between the intake port 121 and the exhaust ports 122 and 123 is equal to 3°C. It is assumed that the endothermic amounts are matched.
도 8을 참조하면, 위 실험에서 도 7c와 같은 전방 배치의 실시예에서 내부 온도가 가장 낮게 측정되었다.Referring to FIG. 8 , the lowest internal temperature was measured in the example of the front arrangement as shown in FIG. 7C in the above experiment.
즉, 도 7a 내지 도 7c의 실시예와 같이 유로 가이드(120)를 배치하는 경우에, 배기구(122, 123)는 하우징(100)의 중심과 개구(101) 사이에 배치시킬 수 있다. 이 경우에, 하우징(100) 외부로의 열손실이 가장 낮았고, 하우징(100) 내부의 온도를 효율적으로 조절할 수 있었다.That is, when the flow guide 120 is disposed as in the embodiment of FIGS. 7A to 7C , the exhaust ports 122 and 123 may be disposed between the center of the housing 100 and the opening 101 . In this case, the heat loss to the outside of the housing 100 was the lowest, and the temperature inside the housing 100 could be efficiently controlled.
또한, 하우징(100) 외부의 온도가 내부의 온도보다 낮은 상황도 고려할 수 있다. 이 때에도, 본 개시에 따른 전자 기기(10)는 유로 가이드(120)의 흡기구(121)와 배기구(122, 123)의 위치를 달리하며 내부의 공기 순환 방향을 조절할 수 있다. In addition, a situation in which the temperature outside the housing 100 is lower than the temperature inside may be considered. Even at this time, the electronic device 10 according to the present disclosure may change the positions of the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 to adjust the internal air circulation direction.
즉, 전자 기기(10)는 유로 가이드(120)를 이용하여 하우징(100) 내부의 온도 조절의 최적의 공기 순환 방향을 설정할 수 있고, 하우징(100) 내부의 온도를 효율적으로 조절할 수 있다.That is, the electronic device 10 may set an optimal air circulation direction for temperature control inside the housing 100 using the flow guide 120 , and may efficiently control the temperature inside the housing 100 .
도 9은 본 개시의 일 실시예에 따른 도어(102)를 설명하기 위한 도면이다. 9 is a view for explaining the door 102 according to an embodiment of the present disclosure.
도 9를 참조하면, 전자 기기(10)는 도어를 더 포함할 수 있다. Referring to FIG. 9 , the electronic device 10 may further include a door.
도어(102)는 개구(101)를 선택적으로 개폐 할 수 있다. 도어(102)는 미닫이, 여닫이, 탈착 형식 등 다양한 방식일 수 있다.The door 102 may selectively open and close the opening 101 . The door 102 may be of various types, such as a sliding door, an opening door, a detachable type, and the like.
도어(102)는 하우징(100) 내부와 외부의 공기의 이동과 열교환을 감소시키는 효과가 있을 수 있고, 전자 기기(10) 내부의 온도를 일정하게 유지하여 소비되는 전력을 최소화할 수도 있다. 나아가, 개구(101)를 완전히 막을 수 있는 밀폐식 도어를 부착하여, 개구(101)를 통한 공기 유입을 최소화할 수도 있다.The door 102 may have an effect of reducing heat exchange and movement of air inside and outside the housing 100 , and may minimize power consumption by maintaining a constant temperature inside the electronic device 10 . Furthermore, by attaching a hermetic door capable of completely blocking the opening 101 , the inflow of air through the opening 101 may be minimized.
또한, 도 9과 같이 도어(102)의 상단과 하우징(100)을 연결하는 힌지(103)를 더 포함하는 방식을 취할 수도 있으며, 힌지(103)를 기준으로 하우징(100)의 내부 방향과 외부 방향으로 개폐 가능할 수도 있다. 힌지(103)를 상단에 부착되어, 미는 동작만으로 도어(102)를 열고 닫을 수 있고, 특히, 하우징(100) 내부로 동물이 직접 출입하는 경우 힌지(103)가 측면에 있는 경우보다 출입이 용이할 수 있다.In addition, as shown in FIG. 9 , the method may further include a hinge 103 connecting the upper end of the door 102 and the housing 100 , and the inner and outer directions of the housing 100 with respect to the hinge 103 . It may be possible to open and close in the direction. Since the hinge 103 is attached to the upper end, the door 102 can be opened and closed only by a pushing operation. In particular, when an animal enters the housing 100 directly, access is easier than when the hinge 103 is on the side. can do.
본 개시의 일 실시예로, 유로 가이드(120)의 흡기구(121)와 배기구(122, 123)는 이동 가능할 수 있다. In an embodiment of the present disclosure, the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 may be movable.
하우징(100)의 상판에는 유로 가이드(120)를 지지하는 이동 프레임(125)이 배치될 수 있다. 이동 프레임(125)은 제어 회로(150)에 의하여 자동으로 이동될 수 있다. A moving frame 125 supporting the flow guide 120 may be disposed on the upper plate of the housing 100 . The moving frame 125 may be automatically moved by the control circuit 150 .
전자 기기(10)는 이동 프레임(125)에 의하여 유로 가이드(120)의 흡기구(121)와 배기구(122, 123)의 위치를 상황에 따라 배치할 수 있고, 공기 순환 방향을 제어하여 효율적으로 내부 온도를 조절할 수 있다.The electronic device 10 can arrange the positions of the intake port 121 and the exhaust ports 122 and 123 of the flow guide 120 by the moving frame 125 according to the situation, and control the air circulation direction to efficiently You can adjust the temperature.
본 개시의 일 실시예로, 열전소자(110)가 하우징(100)의 하단에 배치될 수 있다. In an embodiment of the present disclosure, the thermoelectric element 110 may be disposed at the lower end of the housing 100 .
전자 기기(10)는 하부에 배치된 열전소자(110)에 의하여 하우징(100) 하단을 열전도 방식으로 데우거나 식히면서, 동시에 유로 가이드(120)를 이용하여 열교환된 공기를 하우징(100) 내부로 배출할 수 있다.The electronic device 10 heats or cools the lower end of the housing 100 in a heat conduction manner by the thermoelectric element 110 disposed at the lower portion, and at the same time discharges the heat-exchanged air into the housing 100 using the flow guide 120 . can do.
유로 가이드(120)를 이용하지 않는 경우를 고려하면, 열전소자(110)는 하단을 가열하거나 냉각하며 하우징(100) 내부의 온도를 조절할 수 있다. 그러므로 내부에서의 온도차가 발생하게 되고, 원하는 온도에 도달하기 위하여는 긴 시간이 소요되는 문제가 있다.Considering the case where the flow guide 120 is not used, the thermoelectric element 110 may heat or cool the lower end and adjust the temperature inside the housing 100 . Therefore, there is a problem that a temperature difference occurs inside, and it takes a long time to reach a desired temperature.
그러나, 하단에 열전소자(110)를 배치하고 유로 가이드(120)를 이용하는 경우에는, 전자 기기(10)는 유로 가이드(120)를 통하여 열교환된 공기를 하우징(100) 내부에 원하는 방향으로 공기를 순환시킬 수 있다. However, when the thermoelectric element 110 is disposed at the lower end and the flow guide 120 is used, the electronic device 10 transfers the heat-exchanged air through the flow guide 120 to the inside of the housing 100 in a desired direction. can be cycled.
그러므로, 열전소자(110)를 하단에 배치하는 경우에도 유로 가이드(120)를 이용하여 하우징(100) 내부를 균일하고 빠르게 온도를 조절할 수 있고, 외부와의 불필요한 열교환은 상술한 공기 순환 방향을 조절하는 방식으로 방지될 수 있다.Therefore, even when the thermoelectric element 110 is disposed at the lower end, the temperature inside the housing 100 can be uniformly and quickly controlled using the flow path guide 120 , and unnecessary heat exchange with the outside can control the above-described air circulation direction. can be prevented in this way.
또한, 이상에서는 본 개시의 바람직한 실시예에 대하여 도시하고 설명하였지만, 본 개시는 상술한 특정의 실시예에 한정되지 아니하며, 청구범위에서 청구하는 본 개시의 요지를 벗어남이 없이 당해 개시가 속하는 기술분야에서 통상의 지식을 가진 자에 의해 다양한 변형실시가 가능한 것은 물론이고, 이러한 변형실시들은 본 개시의 기술적 사상이나 전망으로부터 개별적으로 이해돼서는 안 될 것이다.In addition, although preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and the technical field to which the disclosure belongs without departing from the gist of the present disclosure as claimed in the claims Various modifications are possible by those of ordinary skill in the art, and these modifications should not be individually understood from the technical spirit or prospect of the present disclosure.

Claims (15)

  1. 전면에 개구가 배치된 하우징;a housing having an opening disposed on the front side;
    전류 방향에 따라 일면이 선택적으로 냉각되거나 가열되는 열전소자;a thermoelectric element whose one surface is selectively cooled or heated according to the direction of current;
    상기 하우징 내부의 공기를 상기 열전소자에 제공하고, 상기 열전소자에서 열교환된 공기가 상기 하우징 내부에서 순환하도록 상기 하우징 내부의 기설정된 방향으로 배출하는 유로 가이드;a flow guide for supplying the air inside the housing to the thermoelectric element and discharging the air heat-exchanged by the thermoelectric element in a predetermined direction inside the housing to circulate in the housing;
    상기 하우징 내부의 공기를 상기 유로 가이드로 제공하는 팬; 및a fan for providing air inside the housing to the flow path guide; and
    상기 열전 소자에 공급되는 전원의 전류 방향을 제어하는 제어 회로;를 포함하는 전자 기기. and a control circuit for controlling a current direction of power supplied to the thermoelectric element.
  2. 제1항에 있어서, According to claim 1,
    상기 유로 가이드가 접하지 않는 상기 열전 소자의 타 면에서 열교환된 공기를 하우징 외부로 배출하는 환기 유로;를 더 포함하는 전자 기기. The electronic device further comprising a; ventilation passage for discharging the heat-exchanged air from the other surface of the thermoelectric element that is not in contact with the flow guide to the outside of the housing.
  3. 제2항에 있어서, 3. The method of claim 2,
    수평 방향을 기준으로 상기 환기 유로의 배기 방향과 상기 유로 가이드의 배기 방향은 상이한 전자 기기. An exhaust direction of the ventilation passage and an exhaust direction of the flow guide are different from each other in a horizontal direction.
  4. 제1항에 있어서, According to claim 1,
    상기 열전 소자는, The thermoelectric element is
    상기 하우징의 상부에 배치되는 전자 기기. An electronic device disposed on the upper portion of the housing.
  5. 제1항에 있어서, According to claim 1,
    상기 열전 소자의 일면에 배치되는 제1 방열판;a first heat sink disposed on one surface of the thermoelectric element;
    상기 열전 소자의 타면에 배치되는 제2 방열판; 및a second heat sink disposed on the other surface of the thermoelectric element; and
    상기 제1 방열판과 상기 제2 방열판 사이 중 상기 열전 소자가 배치되지 않는 영역에 위치하는 단열재;를 더 포함하는 전자 기기. The electronic device further comprising: a heat insulating material positioned between the first heat sink and the second heat sink in a region where the thermoelectric element is not disposed.
  6. 제1항에 있어서, According to claim 1,
    상기 유로 가이드는, The flow guide is
    상기 열전 소자의 하부에 배치되는 흡기구와 상기 열전 소자의 측면에 배치되는 배기구를 포함하는 전자 기기. An electronic device comprising an intake port disposed under the thermoelectric element and an exhaust port disposed on a side surface of the thermoelectric element.
  7. 제6항에 있어서, 7. The method of claim 6,
    상기 배기구는 상기 하우징의 측면에 인접하게 배치되는 전자 기기.The exhaust port is disposed adjacent to a side surface of the housing.
  8. 제6항에 있어서, 7. The method of claim 6,
    상기 배기구는 the exhaust port
    수평 방향을 기준으로 상기 하우징의 중심과 상기 개구 사이에 배치되는 전자 기기.An electronic device disposed between the center of the housing and the opening in a horizontal direction.
  9. 제1항에 있어서, According to claim 1,
    상기 유로 가이드는, The flow guide is
    상기 열전소자에서 열교환된 공기를 방출하는 복수의 배기구를 갖는 전자 기기. An electronic device having a plurality of exhaust ports for discharging the air heat-exchanged in the thermoelectric element.
  10. 제9항에 있어서, 10. The method of claim 9,
    상기 유로 가이드는, The flow guide is
    상기 개구를 기준으로 좌측 영역에 배치되는 제1 배기구 및 우측 영역에 배치되는 제2 배기구를 갖는 전자 기기. An electronic device having a first exhaust port disposed in a left area with respect to the opening and a second exhaust port disposed in a right area.
  11. 제1항에 있어서, According to claim 1,
    상기 개구는, The opening is
    상기 하우징 내부 하단으로부터 이격 배치된 전자 기기. An electronic device spaced apart from the inner lower end of the housing.
  12. 제11항에 있어서, 12. The method of claim 11,
    상기 개구의 이격 거리는,The distance between the openings is,
    상기 하우징의 내부의 수직 높이의 1/10 내지 1/8 배를 갖는 전자 기기. An electronic device having 1/10 to 1/8 times the vertical height of the interior of the housing.
  13. 제1항에 있어서, According to claim 1,
    상기 개구를 선택적으로 개폐 가능한 도어;를 더 포함하는 전자 기기. The electronic device further comprising; a door capable of selectively opening and closing the opening.
  14. 제13항에 있어서, 14. The method of claim 13,
    상기 도어와 상기 하우징을 연결하는 힌지;를 더 포함하는 전자 기기. and a hinge connecting the door and the housing.
  15. 제14항에 있어서, 15. The method of claim 14,
    상기 힌지는 상기 도어 상단에 배치되고,The hinge is disposed on the top of the door,
    상기 도어는 상기 힌지를 기준으로 상기 하우징의 내부 방향과 외부 방향으로 개폐 가능한 전자 기기. The door may be opened and closed in an inner direction and an outer direction of the housing based on the hinge.
PCT/KR2020/018652 2020-02-20 2020-12-18 Electronic device WO2021167221A1 (en)

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KR102413410B1 (en) * 2021-12-15 2022-06-29 (주) 대상키우미시스템 Large artificial incubator
KR102645828B1 (en) * 2023-01-10 2024-03-08 주식회사 리제로 Pet house

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Publication number Priority date Publication date Assignee Title
US5003923A (en) * 1989-06-23 1991-04-02 Morgan Sonny D Heated pet house
JPH1014429A (en) * 1996-07-05 1998-01-20 Tokyo Menitsukusu:Kk Box for housing animal
KR200227898Y1 (en) * 2000-11-21 2001-06-15 송정곤 apparatus of thermostatic control for pet house
JP3136351U (en) * 2006-07-27 2007-10-25 グラハム・シー(ホンコン)・リミテッド Pet shelter
KR20180000785U (en) * 2016-09-08 2018-03-16 김태현 Bag for carrying pet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5003923A (en) * 1989-06-23 1991-04-02 Morgan Sonny D Heated pet house
JPH1014429A (en) * 1996-07-05 1998-01-20 Tokyo Menitsukusu:Kk Box for housing animal
KR200227898Y1 (en) * 2000-11-21 2001-06-15 송정곤 apparatus of thermostatic control for pet house
JP3136351U (en) * 2006-07-27 2007-10-25 グラハム・シー(ホンコン)・リミテッド Pet shelter
KR20180000785U (en) * 2016-09-08 2018-03-16 김태현 Bag for carrying pet

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