WO2021159881A1 - Method for adjusting fbar parasitic component, filter, multiplexer, and communication device - Google Patents

Method for adjusting fbar parasitic component, filter, multiplexer, and communication device Download PDF

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WO2021159881A1
WO2021159881A1 PCT/CN2020/141267 CN2020141267W WO2021159881A1 WO 2021159881 A1 WO2021159881 A1 WO 2021159881A1 CN 2020141267 W CN2020141267 W CN 2020141267W WO 2021159881 A1 WO2021159881 A1 WO 2021159881A1
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series
filter
fbar
resonator
frequency
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PCT/CN2020/141267
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French (fr)
Chinese (zh)
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庞慰
柴竹青
郑云卓
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诺思(天津)微系统有限责任公司
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • H03H9/02125Means for compensation or elimination of undesirable effects of parasitic elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02157Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/13Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/131Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials consisting of a multilayered structure
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/13Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/133Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials for electromechanical delay lines or filters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezoelectric or electrostrictive material
    • H03H9/547Notch filters, e.g. notch BAW or thin film resonator filters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/703Networks using bulk acoustic wave devices
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H2009/02165Tuning
    • H03H2009/02173Tuning of film bulk acoustic resonators [FBAR]

Definitions

  • the invention relates to the technical field of radio frequency communication, in particular to a method for adjusting FBAR parasitic components, a filter, a multiplexer, and a communication device.
  • the film bulk acoustic resonator (FBAR) has parasitic components in the frequency band below the series resonance frequency, that is, the starting frequency of the parasitic component and the series resonance frequency of the FBAR resonator basically coincide, so the filter is formed Parasitic components also exist in the passband of the filter, duplexer, and multiplexer. This parasitic component causes the filter, duplexer and multiplexer's insertion loss, fluctuation, ripple, group delay fluctuation and other passband indicators. Negative Effects.
  • the present invention provides a method, filter, multiplexer, and communication device for adjusting the parasitic component of FBAR to change the position of the parasitic component in the frequency domain, thereby improving the passband performance.
  • a method for adjusting the parasitic component of a thin film bulk acoustic wave resonator FBAR is proposed.
  • a capacitor is connected in series with the FBAR to form a series body, so that in the amplitude-frequency curve of the series body, the starting position of the parasitic component is moved to the series resonance frequency point The following frequency bands.
  • the method further includes: adjusting the thickness of one or more of the upper electrode, the lower electrode, and the piezoelectric layer of the FBAR, and/or adjusting the capacitance value of the capacitor so that the The series resonance frequency and the parallel resonance frequency of the series body are respectively located in the neighborhood of the preset width of the series resonance frequency and the parallel resonance frequency of the FBAR.
  • the upper electrode is composed of an electrode material and a passivation layer above the electrode material; the thickness of the upper electrode is the sum of the thickness of the electrode material and the thickness of the equivalent electrode material, which is equivalent
  • the acoustic impedance of the electrode material is equal to the acoustic impedance of the passivation layer.
  • the method further includes: for using the FBRA to form a filter, replacing part or all of the FBAR in the filter with the series body, so that the parasitic component in the amplitude-frequency curve of the filter is outside the passband.
  • the series branch resonator adopts the resonator structure of the invention, the starting position of the parasitic ripple is far below Fs, so the first-order filter will not be affected by the parasitic ripple of the series branch resonator, thus Improve the passband performance indicators of the first-order filter such as insertion loss, ripple, ripple, and group delay ripple.
  • all series FBARs and at least one parallel FBAR in the filter are replaced with the series body.
  • the associated FBAR is also replaced with the above-mentioned series body, it helps to further reduce the ripple of the transition band.
  • a filter including a film bulk acoustic wave resonator FBAR, and each series FBAR of the filter is connected in series with a capacitor.
  • one or more parallel FBARs of the filter are connected in series with capacitors.
  • a multiplexer which includes the filter according to the present invention.
  • a communication device which includes the filter according to the present invention.
  • the new resonant unit structure provided by the present invention is obtained by connecting a capacitor and FBAR in series.
  • the starting position of the parasitic component in the new resonant unit will move to a frequency band below the series resonance frequency, and the new resonant unit will form a filter
  • the parasitic components will be moved outside the passband, thereby improving the insertion loss, ripple, ripple, group delay fluctuations, etc. of the filter, duplexer, and multiplexer index;
  • the filter composed of the new resonant unit in the present invention will not be affected by the parasitic ripple of the series branch resonator, thereby improving the insertion loss, fluctuation, ripple, group delay fluctuation, etc. of the filter. Band performance.
  • duplexers and multiplexers composed of new filters will not be affected by the parasitic ripple of the series branch resonator, its insertion loss, fluctuation, ripple, group delay fluctuation, etc.
  • the passband performance is also improved.
  • Figure 1 is a topological structure diagram of an existing FBAR resonator
  • FIG. 2 is a schematic diagram of the structure of an existing FBAR resonator
  • Fig. 3 is a graph of an existing FBAR resonator
  • Fig. 4 is a topological structure diagram of a new resonant unit involved in the first embodiment
  • Fig. 5 is a graph of a new resonant unit involved in the first embodiment
  • Fig. 6 is a topological structure diagram of an existing first-order filter
  • Fig. 7 is a curve diagram of an existing first-order filter
  • Fig. 8 is a frequency response curve diagram of a new resonant unit involved in the first embodiment
  • FIG. 9 is a topological structure diagram of the first-order filter involved in the second embodiment.
  • FIG. 11 is a topological structure diagram of a band pass filter composed of an existing FBAR resonator
  • 15 and 16 are the passband frequency response curve diagrams of the bandpass filter composed of the new resonant unit proposed by the embodiment of the present invention.
  • Figure 17 is a comparison diagram of the curves of two bandpass filters
  • FIG. 18 is a structural diagram of a capacitor in a novel resonant unit involved in the first embodiment
  • FIG. 19 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading the interdigital capacitor and the existing FBAR resonator;
  • FIG. 20 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading a plate capacitor and an existing FBAR resonator;
  • 21 is a topological structure diagram 1 of a band pass filter composed of the new resonant unit proposed in the first embodiment
  • FIG. 22 is a topological structure diagram of a band pass filter composed of the new resonant unit proposed in the first embodiment
  • FIG. 23 is a topological structure diagram 1 of a band-pass filter in which the series branch adopts the new resonant unit proposed in the first embodiment and the existing FBAR resonator is used in the three parallel branches;
  • FIG. 25 and FIG. 26 are frequency response curves of the band pass filter shown in FIG. 23.
  • Figure 1 is a topological structure diagram of an existing FBAR resonator. As shown in FIG. 1, one end of the FBAR resonator 11 is connected to the signal input port 12, and the other end is grounded. The Z parameter is measured from the signal input port 12, and the corresponding relationship curve between the Z parameter amplitude value and the frequency of the FBAR resonator 11 is obtained, as shown in FIG. 3.
  • the vertical axis represents the magnitude of the Z parameter
  • the horizontal axis represents the frequency
  • Fs represents the series resonance frequency
  • Fp represents the parallel resonance frequency. Due to the inherent parasitic effects of the FBAR resonator, parasitic ripples will appear in the frequency range below Fs (that is, the starting position of the parasitic ripple starts from Fs, there are parasitic ripples below Fs, and none above Fs).
  • Fig. 2 is a schematic diagram of the structure of a conventional FBAR resonator.
  • the typical FBAR resonator structure is composed of three stacked layers of a lower electrode 21, a piezoelectric layer 22 and an upper electrode 23.
  • the FBAR resonator is located on a silicon substrate 24, and air is provided on the silicon substrate.
  • Slot 25, the air slot 25 is used to pass in air, so that the upper electrode of the FBAR resonator and the lower electrode of the FBAR resonator are air.
  • a passivation layer is usually formed above the upper electrode.
  • Its material can be a relatively stable non-metallic material, such as silicon dioxide. It is even possible to use the same material as the piezoelectric layer, such as aluminum nitride.
  • the acoustic impedance of this layer of material is different from that of the electrode material, but it can be converted to an equal thickness with the same acoustic impedance as the upper electrode material and superimposed on the thickness of the upper electrode.
  • Fig. 4 is a topological structure diagram of a new resonant unit involved in the first embodiment.
  • the resonance unit 4 as a series body includes a series capacitor 42 and an FBAR resonator 41.
  • One end of the series capacitor 42 and the FBAR resonator 41 is connected to the signal input port 43, and the other end is grounded.
  • the Z parameter is measured from the signal input port 43, and the corresponding relationship curve between the Z parameter amplitude value and the frequency of the new resonant unit 4 is obtained.
  • the vertical axis represents the amplitude value of the Z parameter, and the horizontal axis represents the frequency; Fs represents the series connection.
  • the resonance frequency, Fp represents the parallel resonance frequency.
  • the frequency of Fp does not change much, and the frequency of Fs moves to high frequency.
  • the starting position of the parasitic ripple has not changed much, and is still near 3650MHz. It can be seen from the figure that the new resonance unit 4 proposed in this embodiment can separate the starting position of the parasitic ripple from the position of Fs.
  • the starting position of the parasitic component of the resonator is the series resonance frequency Fs.
  • the parallel resonance frequency Fp of the resonator does not move, and the starting position of the parasitic component is also Fs, which does not move.
  • the Fs of the series body is moved, which is equivalent to becoming a resonator with a smaller Kt2.
  • the kt2 becomes smaller, the bandwidth of the filter will become smaller. Therefore, if necessary, re Take relevant measures to adjust kt2 back to the value required by the original design, and the location of the resonant frequency should also meet the requirements of the filter design.
  • the resonant frequency of the resonator is related to the thickness of the layers (passivation layer, upper electrode, piezoelectric layer, and lower electrode) that make up the resonator. Under the condition that the thickness of other layers remains unchanged, a certain layer The thicker the thickness, the lower the resonance frequency, and the thinner the thickness, the higher the resonance frequency.
  • the Kt2 of the resonator is related to the thickness of the piezoelectric layer. Increase the thickness of the piezoelectric layer (in order to keep the resonance frequency basically unchanged, the thickness of the other layers needs to be adjusted accordingly), the Kt2 of the resonator becomes larger.
  • reduce the thickness of the piezoelectric layer in order to keep the resonant frequency basically unchanged, the thickness of the other layers needs to be adjusted accordingly), the Kt2 of the resonator becomes smaller.
  • a preferred design method of the filter can be carried out as follows: initial design is carried out according to the frequency and bandwidth of the original filter, the resonant frequency and Kt2 of each resonator are determined, and then some of the resonators ( Mainly a series resonator) add a series capacitor (can also be understood as replacing the resonator with the aforementioned series body). According to the above description, the Kt2 of the series body becomes smaller at this time, and the filter performance changes. In this case, the thickness of each layer of the resonator and the capacitance value can be further adjusted so that the resonant frequency Fs and Kt2 of the series body after replacement are the same as the resonator before replacement.
  • the parasitic ripple is already at a position below Fs, that is, at Outside the passband.
  • the design here can be completed with related software. Therefore, the above-mentioned "adjusting the thickness of each layer of the resonator and the capacitance value" mainly refers to the parameter adjustment during computer-aided design, although samples can also be made by trial production. The above method is illustrated below with examples.
  • Fig. 6 is a topological structure diagram of an existing first-order filter.
  • the first-order filter 6 includes a series branch resonator 61 and a parallel branch resonator 62.
  • One end of the series branch resonator 61 is connected to the signal input port 63, and the other end is connected to the signal output port 64.
  • the parallel branch resonator 62 is connected between the output port 64 and the ground terminal, and the thickness of the upper electrode of the parallel branch resonator is greater than the thickness of the upper electrode of the series branch resonator 61.
  • FIG. 7 is a graph of the filter 6.
  • 71 is the series branch resonator curve
  • 72 is the parallel branch resonator curve
  • 73 is the first-order filter curve.
  • Ripple is generated on the left side of the passband of the first-order filter 7, resulting in deterioration of the passband performance indicators of the first-order filter 7, such as insertion loss, ripple, ripple, and group delay fluctuation.
  • the insertion loss of the duplexer and multiplexer, Pass-band performance indicators such as fluctuations, ripples, and group delay fluctuations will also deteriorate.
  • the new resonant unit 4 proposed in the first embodiment can be used to form the first-order filter.
  • the frequency response curve of the resonator By adjusting the laminated thickness of the FBAR resonator 41 of the new resonance unit 4 in FIG. 4 and the capacitance value of the capacitor 42, the frequency response curve of the new resonance unit 4 similar to the curve in FIG. 3 can be obtained.
  • FIG. 8 the Fs and Fp of the new resonant unit 4 are the same as the Fs and Fp of the resonator 11 in FIG.
  • the starting position of the parasitic ripple of the resonator 11 in 3 starts from 3650MHz.
  • FIG. 9 is a topological structure diagram of the first-order filter involved in the second embodiment.
  • the first-order filter includes a series resonant unit 95 and a parallel resonant unit 96.
  • One end of the series resonant unit 95 is connected to the signal input port 97, the other end is connected to the signal output port 98, and the signal output port 98 is connected to the ground terminal.
  • Parallel resonance unit 96 is connected in parallel,
  • the structure of the series resonant unit 95 is completely the same as the topology and composition of the resonant unit 4 proposed in the first embodiment.
  • the series resonant unit 95 includes a capacitor 92 and an FBAR resonator 91 connected in series. One end of the capacitor 92 and the FBAR resonator 91 connected in series is connected to the signal input port 97 and the other end is connected to the signal output port 98.
  • the structure of the parallel resonant unit 96 is the same as the topological structure of the resonant unit 4 proposed in the first embodiment.
  • the capacitor 94 and the FBAR resonator 93 connected in series are included.
  • One end of the capacitor 94 and the FBAR resonator 93 connected in series is connected to the signal output port 98, and the other end is grounded.
  • the thickness of the upper electrode of the FBAR resonator 93 is greater than the thickness of the upper electrode of the FBAR resonator 91.
  • FIG. 10 is a graph of the first-order filter involved in the second embodiment. It can be seen from Fig. 10 that since the series branch resonator adopts the resonant unit structure proposed in the first embodiment, the starting position of the parasitic ripple is far below Fs, so the first-order filter will not be subject to series branch resonance. The influence of parasitic ripple of the first-order filter, thereby improving the passband performance indicators such as insertion loss, ripple, ripple, and group delay fluctuation of the first-order filter. Similarly, the insertion loss, ripple, and ripple of the duplexer and multiplexer Pass-band performance indicators such as wave and group delay fluctuations will also be improved.
  • the series resonant unit 95 and the parallel resonant unit 96 of this embodiment respectively adopt the new resonant unit proposed in the first embodiment, and the transition band (3590 ⁇ 3610 MHz) has no ripple, and the ripple will appear in the stop band.
  • the series resonant unit 95 can adopt the new resonant unit proposed in the first embodiment; the parallel resonant unit 96 can adopt the existing Some parallel branch resonators have ripples in the transition.
  • FIG. 11 is a topological structure diagram of a band pass filter composed of an existing FBAR resonator.
  • the band-pass filter includes four series-connected FBAR resonators 111-114 connected between the signal input port and the signal output port; parallel FBAR resonators 115-117 connected in multiple series Between the connection point of the FBAR resonator and the ground terminal. An inductance is connected between each parallel FBAR resonator and the ground terminal.
  • Figures 12 and 13 are the passband frequency response curves of the bandpass filter composed of the existing FBAR resonator. From Figure 12 and Figure 13, we can see that there is a significant ripple on the left side of the passband.
  • FIG. 14 is a topological structure diagram of the band pass filter involved in the third embodiment.
  • the band-pass filter includes: four series resonant units 141-144 connected between the signal input port and the signal output port; parallel resonant units 145-147 connected to multiple series FBAR resonance Between the connection point of the device and the ground terminal. An inductance is connected between each of the parallel resonance units 145-147 and the ground terminal.
  • the structures of the series-connected resonant units 141 to 144 and the parallel-connected resonant units 145 to 147 are the same as the structure of the resonant unit 4 proposed in the first embodiment, and will not be repeated.
  • Figures 15 and 16 are the passband frequency response curves of the bandpass filter composed of the new resonant unit proposed in this embodiment. It can be seen from Figure 15 and Figure 16 that the curve on the left side of the passband is very smooth, no ripple appears, and there is no ripple in the transition band (between 3600MHz and 3630MHz), and the ripple appears around 3580MHz.
  • Figure 17 is a comparison diagram of the two curves.
  • the dotted line is the passband frequency response curve of the bandpass filter composed of the new resonant unit proposed in this embodiment, and the solid line is the passband frequency response curve of the bandpass filter composed of the existing FBAR resonator. It can be seen from FIG. 17 that the left side of the passband of the curve of this embodiment is relatively full and smooth, and there is no ripple jitter, thereby improving the passband performance such as insertion loss, ripple, ripple, and group delay fluctuation.
  • FIG. 18 is a structural diagram of the capacitor in the new resonant unit involved in the first embodiment.
  • Figure 18 is a type of capacitor called an interdigital capacitor, where 182 and 183 are metal electrodes, and 181 and 184 are the external connection terminals of the interdigital capacitor.
  • FIG. 19 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading the interdigital capacitor and the existing FBAR resonator.
  • the resonance unit includes a series-connected interdigital capacitor 192 and an FBAR resonator 193.
  • One end of the series-connected interdigital capacitor 192 and FBAR resonator 193 is connected to the signal input port 191, and the other end is connected to the signal output port 194.
  • FIG. 20 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading a plate capacitor and an existing FBAR resonator.
  • the resonance unit includes a plate capacitor 202 and an FBAR resonator 203 connected in series.
  • One end of the plate capacitor 202 and the FBAR resonator 203 connected in series is connected to the signal input port 201 and the other end is connected to the signal output port 204.
  • the FBAR resonator is composed of upper and lower electrodes and a piezoelectric film in the middle.
  • the FBAR resonator is above the upper electrode and below the lower electrode is air. If there is no air groove under the lower electrode of the FBAR resonator, the FBAR resonator becomes a plate capacitor.
  • the plate capacitor 202 can be realized in the above-mentioned manner. Adjusting the area of the plate capacitor or the thickness of the piezoelectric film can change the capacitance of the capacitor.
  • FIG. 21 is a topological structure diagram of a band pass filter composed of the new resonant unit proposed in this embodiment. As shown in FIG. 21, the series branch and three parallel branches of the band-pass filter adopt the new resonant unit shown in FIG. 19.
  • FIG. 22 is a topological structure diagram of a band pass filter composed of the new resonant unit proposed in this embodiment. As shown in Fig. 22, the series branch and three parallel branches of the band-pass filter adopt the new resonant unit shown in Fig. 20.
  • the series branch of the band-pass filter uses the new resonant unit shown in Figure 19, and the three parallel branch resonators use the existing FBAR resonator; as shown in Figure 24,
  • the series branch of the band-pass filter uses the new resonant unit shown in FIG. 20, and the three parallel branch resonators use the existing FBAR resonator.
  • Figure 25 and Figure 26 are the frequency response curves of the band-pass filter produced by the design structure shown in Figure 23. There will be ripples in the transition band (between 3600MHz and 3630MHz), but there is no ripple in the passband.
  • a new band-pass filter is used to form a multiplexer (including a duplexer), so that the multiplexer will not be affected by the parasitic ripple of the series branch resonator, thereby improving the performance of the multiplexer.
  • Pass-band performance indicators such as insertion loss, fluctuation, ripple, and group delay fluctuation.

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Abstract

A method for adjusting an FBAR parasitic component, a filter, a multiplexer, and a communication device. A position where a parasitic component appears in a frequency domain is changed, so that the passband performance is improved. In the method, a capacitor (42) and an FBAR (41) are connected in series to form a series connection (4), and in an amplitude-frequency curve of the series connection (4), a starting position of the parasitic component is moved to a frequency band below a series resonant frequency point.

Description

调整FBAR寄生分量的方法和滤波器、多工器、通信设备Method and filter, multiplexer and communication equipment for adjusting FBAR parasitic components 技术领域Technical field
本发明涉及射频通信技术领域,具体涉及一种调整FBAR寄生分量的方法和滤波器、多工器、通信设备。The invention relates to the technical field of radio frequency communication, in particular to a method for adjusting FBAR parasitic components, a filter, a multiplexer, and a communication device.
背景技术Background technique
在射频通信前端中,对滤波器和双工器以及多工器的性能有着越来越高的要求,其中通带性能尤为重要,如在5G时代对插损、波动、纹波、回波等通带指标的要求越来越严苛。In the radio frequency communication front-end, there are increasingly higher requirements for the performance of filters, duplexers and multiplexers, of which passband performance is particularly important, such as insertion loss, fluctuation, ripple, echo, etc. in the 5G era The requirements for passband indicators are becoming more and more stringent.
由于薄膜体声波谐振器(Film Bulk Acoustic Resonator,简称FBAR)在串联谐振频点以下频段存在寄生分量,即寄生分量的起始频点与FBAR谐振器的串联谐振频点基本重合,所以构成的滤波器、双工器以及多工器在通带也存在寄生分量,该寄生分量对滤波器和双工器以及多工器的插损、波动、纹波、群时延波动等通带指标造成了不利影响。Since the film bulk acoustic resonator (FBAR) has parasitic components in the frequency band below the series resonance frequency, that is, the starting frequency of the parasitic component and the series resonance frequency of the FBAR resonator basically coincide, so the filter is formed Parasitic components also exist in the passband of the filter, duplexer, and multiplexer. This parasitic component causes the filter, duplexer and multiplexer's insertion loss, fluctuation, ripple, group delay fluctuation and other passband indicators. Negative Effects.
发明内容Summary of the invention
有鉴于此,本发明提供一种调整FBAR寄生分量的方法和滤波器、多工器、通信设备,改变寄生分量在频域出现的位置,从而改善通带性能。In view of this, the present invention provides a method, filter, multiplexer, and communication device for adjusting the parasitic component of FBAR to change the position of the parasitic component in the frequency domain, thereby improving the passband performance.
为实现上述目的,根据本发明的一个方面,提出了一种调整薄膜体声波谐振器FBAR寄生分量的方法。In order to achieve the above objective, according to one aspect of the present invention, a method for adjusting the parasitic component of a thin film bulk acoustic wave resonator FBAR is proposed.
本发明的调整薄膜体声波谐振器FBAR寄生分量的方法方法中,将电容与所述FBAR串联形成串联体,使该串联体的幅频曲线中,寄生分量的起始位置移动到串联谐振频点以下的频段。In the method for adjusting the parasitic component of the film bulk acoustic wave resonator FBAR of the present invention, a capacitor is connected in series with the FBAR to form a series body, so that in the amplitude-frequency curve of the series body, the starting position of the parasitic component is moved to the series resonance frequency point The following frequency bands.
可选地,还包括:对所述FBAR的上电极、下电极、压电层中的一者或多者的厚度进行调整,并且/或者,对所述电容的电容值进行调整,使所述串联体的串联谐振频率和并联谐振频率,分别位于所述FBAR的串联谐振频率和并联谐振频率的预设宽度的邻域内。Optionally, the method further includes: adjusting the thickness of one or more of the upper electrode, the lower electrode, and the piezoelectric layer of the FBAR, and/or adjusting the capacitance value of the capacitor so that the The series resonance frequency and the parallel resonance frequency of the series body are respectively located in the neighborhood of the preset width of the series resonance frequency and the parallel resonance frequency of the FBAR.
可选地,还包括:所述上电极由电极材料与该电极材料上方的钝化层构成;所述上电极的厚度为所述电极材料的厚度与等效电极材料厚度之和,该等效电极材料的声阻抗等于所述钝化层的声阻抗。Optionally, it further includes: the upper electrode is composed of an electrode material and a passivation layer above the electrode material; the thickness of the upper electrode is the sum of the thickness of the electrode material and the thickness of the equivalent electrode material, which is equivalent The acoustic impedance of the electrode material is equal to the acoustic impedance of the passivation layer.
可选地,还包括:对于使用所述FBRA构成滤波器,该滤波器中的部分或全部FBAR替换为所述串联体,使该滤波器的幅频曲线中,寄生分量位于通带之外。Optionally, the method further includes: for using the FBRA to form a filter, replacing part or all of the FBAR in the filter with the series body, so that the parasitic component in the amplitude-frequency curve of the filter is outside the passband.
可选地,所述滤波器中的所有串联FBAR替换为所述串联体。由于串联支路谐振器采用本专利发明的谐振器结构,寄生纹波的起始位置在Fs以下较远处,所以一阶滤波器不会受到串联支路谐振器的寄生纹波的影响,从而改善了一阶滤波器的插损、波动、纹波、群时延波动等通带性能指标。Optionally, all series FBARs in the filter are replaced with the series body. Since the series branch resonator adopts the resonator structure of the invention, the starting position of the parasitic ripple is far below Fs, so the first-order filter will not be affected by the parasitic ripple of the series branch resonator, thus Improve the passband performance indicators of the first-order filter such as insertion loss, ripple, ripple, and group delay ripple.
可选地,所述滤波器中的所有串联FBAR以及至少1个并联FBAR,替换为所述串联体。在关联FBAR也替换为上述串联体的情况下,有助于进一步减少过渡带的纹波。Optionally, all series FBARs and at least one parallel FBAR in the filter are replaced with the series body. When the associated FBAR is also replaced with the above-mentioned series body, it helps to further reduce the ripple of the transition band.
根据本发明的另一方面,提供了一种滤波器,其包含薄膜体声波谐振器FBAR,所述滤波器的每个串联FBAR串联有电容。According to another aspect of the present invention, there is provided a filter including a film bulk acoustic wave resonator FBAR, and each series FBAR of the filter is connected in series with a capacitor.
可选地,所述滤波器的一个或多个并联FBAR串联有电容。Optionally, one or more parallel FBARs of the filter are connected in series with capacitors.
根据本发明的又一方面,提供了一种多工器,其包含本发明所述的滤波器。According to another aspect of the present invention, a multiplexer is provided, which includes the filter according to the present invention.
根据本发明的又一方面,提供了一种通信设备,其包含本发明所述的滤波器。According to another aspect of the present invention, a communication device is provided, which includes the filter according to the present invention.
与现有技术相比,本发明的有益效果是:Compared with the prior art, the beneficial effects of the present invention are:
(1)本发明提供的新的谐振单元结构是将电容与FBAR进行串联得到的,新的谐振单元中寄生分量的起始位置会移动到串联谐振频点以下的频段,在新谐振单元构成滤波器、双工器以及多工器时,寄生分量就会被移动到通带之外,从而改善了滤波器和双工器以及多工器的插损、波动、纹波、群时延波动等指标;(1) The new resonant unit structure provided by the present invention is obtained by connecting a capacitor and FBAR in series. The starting position of the parasitic component in the new resonant unit will move to a frequency band below the series resonance frequency, and the new resonant unit will form a filter In the case of filters, duplexers, and multiplexers, the parasitic components will be moved outside the passband, thereby improving the insertion loss, ripple, ripple, group delay fluctuations, etc. of the filter, duplexer, and multiplexer index;
(2)本发明采用新的谐振单元组成的滤波器,不会受到串联支路谐振器的寄生纹波的影响,从而改善了滤波器的插损、波动、纹波、群时延波动等通带性能,同理采用新的滤波器组成的双工器以及多工器,也不会受到串联支路谐振器的寄生纹波的影响,其插损、波动、纹波、群时延波动等通带性能也得到改善。(2) The filter composed of the new resonant unit in the present invention will not be affected by the parasitic ripple of the series branch resonator, thereby improving the insertion loss, fluctuation, ripple, group delay fluctuation, etc. of the filter. Band performance. Similarly, the use of duplexers and multiplexers composed of new filters will not be affected by the parasitic ripple of the series branch resonator, its insertion loss, fluctuation, ripple, group delay fluctuation, etc. The passband performance is also improved.
附图说明Description of the drawings
附图用于更好地理解本发明,不构成对本发明的不当限定。其中:The drawings are used to better understand the present invention, and do not constitute an improper limitation of the present invention. in:
图1是现有的FBAR谐振器的拓扑结构图;Figure 1 is a topological structure diagram of an existing FBAR resonator;
图2是现有的FBAR谐振器的结构示意图;FIG. 2 is a schematic diagram of the structure of an existing FBAR resonator;
图3是现有的FBAR谐振器的曲线图;Fig. 3 is a graph of an existing FBAR resonator;
图4是实施例一涉及的新的谐振单元的拓扑结构图;Fig. 4 is a topological structure diagram of a new resonant unit involved in the first embodiment;
图5是实施例一涉及的新的谐振单元的曲线图;Fig. 5 is a graph of a new resonant unit involved in the first embodiment;
图6是现有的一阶滤波器的拓扑结构图;Fig. 6 is a topological structure diagram of an existing first-order filter;
图7是现有的一阶滤波器的曲线图;Fig. 7 is a curve diagram of an existing first-order filter;
图8是实施例一涉及的新的谐振单元的频响曲线图;Fig. 8 is a frequency response curve diagram of a new resonant unit involved in the first embodiment;
图9是实施例二涉及的一阶滤波器的拓扑结构图;9 is a topological structure diagram of the first-order filter involved in the second embodiment;
图10是实施例二涉及的一阶滤波器的曲线图;10 is a graph of the first-order filter involved in the second embodiment;
图11是现有的FBAR谐振器组成的带通滤波器的拓扑结构图;FIG. 11 is a topological structure diagram of a band pass filter composed of an existing FBAR resonator;
图12和图13是现有的FBAR谐振器组成的带通滤波器的通带频响曲线图;12 and 13 are the passband frequency response curve diagrams of the bandpass filter composed of the existing FBAR resonator;
图14是实施例三涉及的带通滤波器的拓扑结构图;14 is a topological structure diagram of the band pass filter involved in the third embodiment;
图15和图16是由本发明实施例提出的新型谐振单元组成的带通滤波器的通带频响曲线图;15 and 16 are the passband frequency response curve diagrams of the bandpass filter composed of the new resonant unit proposed by the embodiment of the present invention;
图17是两种带通滤波器的曲线的对比图;Figure 17 is a comparison diagram of the curves of two bandpass filters;
图18是实施例一涉及的新型谐振单元中电容器的结构图;FIG. 18 is a structural diagram of a capacitor in a novel resonant unit involved in the first embodiment;
图19是叉指电容与现有的FBAR谐振器级联后形成的实施例一所提出的新型谐振单元的拓扑结构图;19 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading the interdigital capacitor and the existing FBAR resonator;
图20是平板电容与现有的FBAR谐振器级联后形成的实施例一所提出的新型谐振单元的拓扑结构图;20 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading a plate capacitor and an existing FBAR resonator;
图21是由实施例一提出的新型谐振单元组成的带通滤波器的拓扑结构图一;21 is a topological structure diagram 1 of a band pass filter composed of the new resonant unit proposed in the first embodiment;
图22是由实施例一提出的新型谐振单元组成的带通滤波器的拓扑结构图二;22 is a topological structure diagram of a band pass filter composed of the new resonant unit proposed in the first embodiment;
图23是串联支路采用实施例一提出的新型谐振单元,在三个并联支路采用现有的FBAR谐振器的带通滤波器的拓扑结构图一;FIG. 23 is a topological structure diagram 1 of a band-pass filter in which the series branch adopts the new resonant unit proposed in the first embodiment and the existing FBAR resonator is used in the three parallel branches;
图24是串联支路采用实施例一提出的新型谐振单元,在三个并联支路采用现有的FBAR谐振器的带通滤波器的拓扑结构图二;24 is the topological structure diagram of the bandpass filter with the new resonant unit proposed in the first embodiment in the series branch and the existing FBAR resonator in the three parallel branches;
图25和图26是图23所示的带通滤波器的频响曲线图。25 and FIG. 26 are frequency response curves of the band pass filter shown in FIG. 23.
具体实施方式Detailed ways
下面结合附图与实施例对本发明作进一步说明。The present invention will be further described below in conjunction with the drawings and embodiments.
图1是现有的FBAR谐振器的拓扑结构图。如图1所示,FBAR谐振器11的一端与信号输入端口12连接,另一端接地。从信号输入端口12测量Z参数,得到FBAR谐振器11的Z参数幅度值与频率的对应关系曲线,如图3所示。图3中,纵轴代表Z参数的幅度值,横 轴代表频率,Fs代表串联谐振频率,Fp代表并联谐振频率。由于FBAR谐振器固有的寄生效应的影响,Fs以下频率范围会出现寄生纹波(即寄生纹波的起始位置从Fs开始,Fs以下有寄生纹波,Fs以上没有)。Figure 1 is a topological structure diagram of an existing FBAR resonator. As shown in FIG. 1, one end of the FBAR resonator 11 is connected to the signal input port 12, and the other end is grounded. The Z parameter is measured from the signal input port 12, and the corresponding relationship curve between the Z parameter amplitude value and the frequency of the FBAR resonator 11 is obtained, as shown in FIG. 3. In Figure 3, the vertical axis represents the magnitude of the Z parameter, the horizontal axis represents the frequency, Fs represents the series resonance frequency, and Fp represents the parallel resonance frequency. Due to the inherent parasitic effects of the FBAR resonator, parasitic ripples will appear in the frequency range below Fs (that is, the starting position of the parasitic ripple starts from Fs, there are parasitic ripples below Fs, and none above Fs).
图2是现有的FBAR谐振器的结构示意图。图2中,所述典型的FBAR谐振器结构由下电极21、压电层22和上电极23这三个叠层组成,所述FBAR谐振器位于硅基24上,在硅基上开设有空气槽25,所述空气槽25用于通入空气,使得FBAR谐振器上电极的上方和下电极的下方是空气。通过调整下电极21、压电层22和上电极23的厚度,可以控制串联谐振频率Fs、并联谐振频率Fp的位置。需要说明的是,为了保护谐振器不受环境影响而发生氧化,通常在上电极上方,还会制作一层钝化层,它的材料可以是性能相对稳定的非金属材料,如二氧化硅,甚至也可以与压电层采用相同的材料,如氮化铝。这层材料与电极材料的声阻抗不同,但是可以换算为与上电极材料相同声阻抗的等厚度,叠加到上电极的厚度上,用这个叠加后的上电极厚度去等效上电极与钝化层的共同作用,为了简化,图中将钝化层略去,但是在通过调节谐振器各层厚度来调节寄生分量位置时,也应该考虑钝化层的厚度影响。Fig. 2 is a schematic diagram of the structure of a conventional FBAR resonator. In FIG. 2, the typical FBAR resonator structure is composed of three stacked layers of a lower electrode 21, a piezoelectric layer 22 and an upper electrode 23. The FBAR resonator is located on a silicon substrate 24, and air is provided on the silicon substrate. Slot 25, the air slot 25 is used to pass in air, so that the upper electrode of the FBAR resonator and the lower electrode of the FBAR resonator are air. By adjusting the thickness of the lower electrode 21, the piezoelectric layer 22 and the upper electrode 23, the positions of the series resonance frequency Fs and the parallel resonance frequency Fp can be controlled. It should be noted that in order to protect the resonator from oxidation due to environmental influences, a passivation layer is usually formed above the upper electrode. Its material can be a relatively stable non-metallic material, such as silicon dioxide. It is even possible to use the same material as the piezoelectric layer, such as aluminum nitride. The acoustic impedance of this layer of material is different from that of the electrode material, but it can be converted to an equal thickness with the same acoustic impedance as the upper electrode material and superimposed on the thickness of the upper electrode. Use this superimposed upper electrode thickness to be equivalent to the upper electrode and passivation The interaction of the layers, for simplicity, the passivation layer is omitted in the figure, but when adjusting the position of the parasitic component by adjusting the thickness of each layer of the resonator, the thickness of the passivation layer should also be considered.
图4是本实施例一涉及的新的谐振单元的拓扑结构图。如图4所示,谐振单元4作为一个串联体,包括串联的电容42和FBAR谐振器41,串联的电容42和FBAR谐振器41的一端连接信号输入端口43,另一端接地。Fig. 4 is a topological structure diagram of a new resonant unit involved in the first embodiment. As shown in FIG. 4, the resonance unit 4 as a series body includes a series capacitor 42 and an FBAR resonator 41. One end of the series capacitor 42 and the FBAR resonator 41 is connected to the signal input port 43, and the other end is grounded.
从信号输入端口43测量Z参数,得到新的谐振单元4的Z参数幅度值与频率的对应关系曲线,如图5所示,纵轴代表Z参数的幅度值,横轴代表频率;Fs代表串联谐振频率,Fp代表并联谐振频率。The Z parameter is measured from the signal input port 43, and the corresponding relationship curve between the Z parameter amplitude value and the frequency of the new resonant unit 4 is obtained. As shown in Figure 5, the vertical axis represents the amplitude value of the Z parameter, and the horizontal axis represents the frequency; Fs represents the series connection. The resonance frequency, Fp represents the parallel resonance frequency.
与传统的FBAR谐振器11相比,Fp的频率没有太大变化,Fs的频率向高频移动。而寄生纹波的起始位置没有太大变化,仍位于3650MHz附近。从图中可以看出,本实施例提出的新的谐振单元4可以将寄生纹波的起始位置与Fs的位置分离。Compared with the conventional FBAR resonator 11, the frequency of Fp does not change much, and the frequency of Fs moves to high frequency. The starting position of the parasitic ripple has not changed much, and is still near 3650MHz. It can be seen from the figure that the new resonance unit 4 proposed in this embodiment can separate the starting position of the parasitic ripple from the position of Fs.
对于一个各层厚度固定的FBAR,在没加电容的时候,谐振器的寄 生分量起始位置,即是串联谐振频率Fs。加了串联电容之后,谐振器的并联谐振频率Fp没有移动,寄生分量起始的位置也是Fs,没有移动。实际上移动的是串联体的Fs,相当于变成了一个Kt2更小的谐振器,但是这样kt2变小的谐振器,做出滤波器的带宽会变小,因此在需要的情况下,再采取相关的措施把kt2调整回原始设计需要的数值,并且谐振频率的位置也要符合滤波器设计的要求。For an FBAR with a fixed thickness of each layer, when no capacitor is added, the starting position of the parasitic component of the resonator is the series resonance frequency Fs. After adding the series capacitor, the parallel resonance frequency Fp of the resonator does not move, and the starting position of the parasitic component is also Fs, which does not move. In fact, the Fs of the series body is moved, which is equivalent to becoming a resonator with a smaller Kt2. However, if the kt2 becomes smaller, the bandwidth of the filter will become smaller. Therefore, if necessary, re Take relevant measures to adjust kt2 back to the value required by the original design, and the location of the resonant frequency should also meet the requirements of the filter design.
上述措施主要考虑:一方面,谐振器的谐振频率与组成谐振器的各层(钝化层,上电极,压电层,下电极)厚度相关,在其它层厚度不变的条件下,某层厚度越厚,谐振频率越低,厚度越薄,谐振频率越高。另一方面,而当谐振频率固定时,谐振器的Kt2与压电层厚度相关。增大压电层的厚度(为保持谐振频率基本不变,需要相应调小其它各层的厚度),谐振器的Kt2变大。反之,减少压电层的厚度(为保持谐振频率基本不变,需要相应调大其它各层的厚度),谐振器的Kt2变小。The above measures are mainly considered: On the one hand, the resonant frequency of the resonator is related to the thickness of the layers (passivation layer, upper electrode, piezoelectric layer, and lower electrode) that make up the resonator. Under the condition that the thickness of other layers remains unchanged, a certain layer The thicker the thickness, the lower the resonance frequency, and the thinner the thickness, the higher the resonance frequency. On the other hand, when the resonant frequency is fixed, the Kt2 of the resonator is related to the thickness of the piezoelectric layer. Increase the thickness of the piezoelectric layer (in order to keep the resonance frequency basically unchanged, the thickness of the other layers needs to be adjusted accordingly), the Kt2 of the resonator becomes larger. On the contrary, reduce the thickness of the piezoelectric layer (in order to keep the resonant frequency basically unchanged, the thickness of the other layers needs to be adjusted accordingly), the Kt2 of the resonator becomes smaller.
本发明实施方式中,滤波器的一种优选的设计方法可按如下方式进行:按原始滤波器的频率和带宽进行初始设计,确定各谐振器的谐振频率和Kt2,然后向其中部分谐振器(主要是串联谐振器)添加串联电容(也可以理解为,将谐振器替换为前述的串联体),根据上文的说明,此时串联体的Kt2变小,滤波器性能发生变化,在这种情况下,可进一步调节谐振器的各层厚度,以及电容值,使替换后串联体的谐振频率Fs以及Kt2与替换前的谐振器相同,此时寄生纹波已经位于Fs以下的位置,即位于通带外。这里的设计可采用相关的软件完成,因此上述的“调节谐振器的各层厚度,以及电容值”主要是指在计算机辅助设计时的参数调节,虽然也可采用试生产的方式制作样品。以下对上述方法举例加以说明。In the embodiment of the present invention, a preferred design method of the filter can be carried out as follows: initial design is carried out according to the frequency and bandwidth of the original filter, the resonant frequency and Kt2 of each resonator are determined, and then some of the resonators ( Mainly a series resonator) add a series capacitor (can also be understood as replacing the resonator with the aforementioned series body). According to the above description, the Kt2 of the series body becomes smaller at this time, and the filter performance changes. In this case, the thickness of each layer of the resonator and the capacitance value can be further adjusted so that the resonant frequency Fs and Kt2 of the series body after replacement are the same as the resonator before replacement. At this time, the parasitic ripple is already at a position below Fs, that is, at Outside the passband. The design here can be completed with related software. Therefore, the above-mentioned "adjusting the thickness of each layer of the resonator and the capacitance value" mainly refers to the parameter adjustment during computer-aided design, although samples can also be made by trial production. The above method is illustrated below with examples.
图6是现有的一阶滤波器的拓扑结构图。如图6所示,该一阶滤波器6包括串联支路谐振器61和并联支路谐振器62,串联支路谐振器61的一端连接信号输入端口63,另一端连接信号输出端口64,信号输出端口64与接地端之间连接有所述并联支路谐振器62,并联支路谐振 器的上电极厚度大于串联支路谐振器61的上电极厚度。Fig. 6 is a topological structure diagram of an existing first-order filter. As shown in FIG. 6, the first-order filter 6 includes a series branch resonator 61 and a parallel branch resonator 62. One end of the series branch resonator 61 is connected to the signal input port 63, and the other end is connected to the signal output port 64. The parallel branch resonator 62 is connected between the output port 64 and the ground terminal, and the thickness of the upper electrode of the parallel branch resonator is greater than the thickness of the upper electrode of the series branch resonator 61.
图7是滤波器6的曲线图。图7中,71是串联支路谐振器曲线,72是并联支路谐振器曲线,73是一阶滤波器曲线。从图7中可以看出,由于串联支路谐振器71受寄生效应的影响,串联支路谐振器71在Fs以下会产生寄生纹波,从而导致在组成一阶滤波器7时,一阶滤波器7的通带左侧产生纹波,导致一阶滤波器7的插损、波动、纹波、群时延波动等通带性能指标恶化,同理双工器以及多工器的插损、波动、纹波、群时延波动等通带性能指标也会恶化。FIG. 7 is a graph of the filter 6. In Figure 7, 71 is the series branch resonator curve, 72 is the parallel branch resonator curve, and 73 is the first-order filter curve. It can be seen from FIG. 7 that because the series branch resonator 71 is affected by parasitic effects, the series branch resonator 71 will produce parasitic ripples below Fs, which leads to the formation of the first-order filter 7. Ripple is generated on the left side of the passband of the first-order filter 7, resulting in deterioration of the passband performance indicators of the first-order filter 7, such as insertion loss, ripple, ripple, and group delay fluctuation. Similarly, the insertion loss of the duplexer and multiplexer, Pass-band performance indicators such as fluctuations, ripples, and group delay fluctuations will also deteriorate.
为了改善寄生纹波对一阶滤波器6的影响,可以采用本实施例一提出的新的谐振单元4来组成一阶滤波器。为了得到与一阶滤波器6相同的性能,需要得到与图3中近似形状的谐振器的频响曲线。通过调节图4中新的谐振单元4的FBAR谐振器41的叠层厚度以及电容42的电容值,可以得到与图3中曲线相近的新的谐振单元4的频响曲线。从图8中可以看出,新的谐振单元4的Fs和Fp与图3中谐振器11的Fs和Fp相同,而新的谐振单元4的寄生纹波的起始位置从3580MHz开始,而图3中谐振器11的寄生纹波的起始位置从3650MHz开始。In order to improve the influence of the parasitic ripple on the first-order filter 6, the new resonant unit 4 proposed in the first embodiment can be used to form the first-order filter. In order to obtain the same performance as the first-order filter 6, it is necessary to obtain the frequency response curve of the resonator with a shape similar to that in FIG. 3. By adjusting the laminated thickness of the FBAR resonator 41 of the new resonance unit 4 in FIG. 4 and the capacitance value of the capacitor 42, the frequency response curve of the new resonance unit 4 similar to the curve in FIG. 3 can be obtained. It can be seen from FIG. 8 that the Fs and Fp of the new resonant unit 4 are the same as the Fs and Fp of the resonator 11 in FIG. The starting position of the parasitic ripple of the resonator 11 in 3 starts from 3650MHz.
图9是本实施例二涉及的一阶滤波器的拓扑结构图。如图9所示,一阶滤波器包括串联谐振单元95和并联谐振单元96,串联谐振单元95的一端连接信号输入端口97,另一端连接信号输出端口98,信号输出端口98与接地端之间并联有并联谐振单元96,FIG. 9 is a topological structure diagram of the first-order filter involved in the second embodiment. As shown in FIG. 9, the first-order filter includes a series resonant unit 95 and a parallel resonant unit 96. One end of the series resonant unit 95 is connected to the signal input port 97, the other end is connected to the signal output port 98, and the signal output port 98 is connected to the ground terminal. Parallel resonance unit 96 is connected in parallel,
在本实施例中,串联谐振单元95的结构与实施例一提出的谐振单元4的拓扑结构和组成结构完全相同。串联谐振单元95包括串联的电容92和FBAR谐振器91,串联的电容92和FBAR谐振器91的一端连接信号输入端口97,另一端连接信号输出端口98。In this embodiment, the structure of the series resonant unit 95 is completely the same as the topology and composition of the resonant unit 4 proposed in the first embodiment. The series resonant unit 95 includes a capacitor 92 and an FBAR resonator 91 connected in series. One end of the capacitor 92 and the FBAR resonator 91 connected in series is connected to the signal input port 97 and the other end is connected to the signal output port 98.
并联谐振单元96的结构与实施例一提出的谐振单元4的拓扑结构相同。包括串联的电容94和FBAR谐振器93,串联的电容94和FBAR谐振器93的一端连接信号输出端口98,另一端接地。The structure of the parallel resonant unit 96 is the same as the topological structure of the resonant unit 4 proposed in the first embodiment. The capacitor 94 and the FBAR resonator 93 connected in series are included. One end of the capacitor 94 and the FBAR resonator 93 connected in series is connected to the signal output port 98, and the other end is grounded.
在本实施例中,FBAR谐振器93的上电极厚度大于FBAR谐振器91的上电极厚度。In this embodiment, the thickness of the upper electrode of the FBAR resonator 93 is greater than the thickness of the upper electrode of the FBAR resonator 91.
图10是本实施例二涉及的一阶滤波器的曲线图。由图10可以看出,由于串联支路谐振器采用本实施例一提出的谐振单元结构,寄生纹波的起始位置在Fs以下较远处,所以一阶滤波器不会受到串联支路谐振器的寄生纹波的影响,从而改善了一阶滤波器的插损、波动、纹波、群时延波动等通带性能指标,同理双工器以及多工器的插损、波动、纹波、群时延波动等通带性能指标也会得到改善。FIG. 10 is a graph of the first-order filter involved in the second embodiment. It can be seen from Fig. 10 that since the series branch resonator adopts the resonant unit structure proposed in the first embodiment, the starting position of the parasitic ripple is far below Fs, so the first-order filter will not be subject to series branch resonance. The influence of parasitic ripple of the first-order filter, thereby improving the passband performance indicators such as insertion loss, ripple, ripple, and group delay fluctuation of the first-order filter. Similarly, the insertion loss, ripple, and ripple of the duplexer and multiplexer Pass-band performance indicators such as wave and group delay fluctuations will also be improved.
本实施例的串联谐振单元95和并联谐振单元96分别采用本实施例一提出的新的谐振单元,过渡带(3590~3610MHz)无纹波,纹波会出现在阻带。The series resonant unit 95 and the parallel resonant unit 96 of this embodiment respectively adopt the new resonant unit proposed in the first embodiment, and the transition band (3590~3610 MHz) has no ripple, and the ripple will appear in the stop band.
需要说明的是,如果新的谐振单元的寄生纹波对过渡带性能的影响是可以接受的,那么串联谐振单元95可采用本实施例一提出的新的谐振单元;并联谐振单元96可采用现有的并联支路谐振器,则过渡带有纹波。It should be noted that if the influence of the parasitic ripple of the new resonant unit on the performance of the transition band is acceptable, then the series resonant unit 95 can adopt the new resonant unit proposed in the first embodiment; the parallel resonant unit 96 can adopt the existing Some parallel branch resonators have ripples in the transition.
图11是现有的FBAR谐振器组成的带通滤波器的拓扑结构图。如图11所示,带通滤波器包括:四个串联的FBAR谐振器111~114,连接在信号输入端口与信号输出端口之间;并联的FBAR谐振器115~117,连接在多个串联的FBAR谐振器的连接点与接地端的之间。每个并联的FBAR谐振器与接地端之间连接有电感。FIG. 11 is a topological structure diagram of a band pass filter composed of an existing FBAR resonator. As shown in Figure 11, the band-pass filter includes four series-connected FBAR resonators 111-114 connected between the signal input port and the signal output port; parallel FBAR resonators 115-117 connected in multiple series Between the connection point of the FBAR resonator and the ground terminal. An inductance is connected between each parallel FBAR resonator and the ground terminal.
图12和图13是现有的FBAR谐振器组成的带通滤波器的通带频响曲线。从图12和图13中,可以看出通带左侧出现明显的纹波。Figures 12 and 13 are the passband frequency response curves of the bandpass filter composed of the existing FBAR resonator. From Figure 12 and Figure 13, we can see that there is a significant ripple on the left side of the passband.
图14是本实施例三涉及的带通滤波器的拓扑结构图。如图14所示,带通滤波器包括:四个串联的谐振单元141~144,连接在信号输入端口与信号输出端口之间;并联的谐振单元145~147,连接在多个串联的FBAR谐振器的连接点与接地端的之间。每个并联的谐振单元145~147与接地端之间连接有电感。FIG. 14 is a topological structure diagram of the band pass filter involved in the third embodiment. As shown in Fig. 14, the band-pass filter includes: four series resonant units 141-144 connected between the signal input port and the signal output port; parallel resonant units 145-147 connected to multiple series FBAR resonance Between the connection point of the device and the ground terminal. An inductance is connected between each of the parallel resonance units 145-147 and the ground terminal.
在本实施例中,串联的谐振单元141~144、并联的谐振单元145~147的结构与实施例一提出的谐振单元4的结构相同,不再赘述。In this embodiment, the structures of the series-connected resonant units 141 to 144 and the parallel-connected resonant units 145 to 147 are the same as the structure of the resonant unit 4 proposed in the first embodiment, and will not be repeated.
图15和图16是由本实施例提出的新型谐振单元组成的带通滤波器的通带频响曲线。从图15和图16中可以看出,通带左侧曲线非常 平滑,无纹波出现,且过渡带(3600MHz到3630MHz之间)内也无纹波出现,纹波在3580MHz附近出现。Figures 15 and 16 are the passband frequency response curves of the bandpass filter composed of the new resonant unit proposed in this embodiment. It can be seen from Figure 15 and Figure 16 that the curve on the left side of the passband is very smooth, no ripple appears, and there is no ripple in the transition band (between 3600MHz and 3630MHz), and the ripple appears around 3580MHz.
图17是两种曲线的对比图。点状线是本实施例提出的新型谐振单元组成的带通滤波器的通带频响曲线,实线是现有的FBAR谐振器组成的带通滤波器的通带频响曲线。从图17中可以看出,本实施例的曲线的通带左侧较为饱满平滑,没有纹波抖动,从而改善了插损、波动、纹波、群时延波动等通带性能。Figure 17 is a comparison diagram of the two curves. The dotted line is the passband frequency response curve of the bandpass filter composed of the new resonant unit proposed in this embodiment, and the solid line is the passband frequency response curve of the bandpass filter composed of the existing FBAR resonator. It can be seen from FIG. 17 that the left side of the passband of the curve of this embodiment is relatively full and smooth, and there is no ripple jitter, thereby improving the passband performance such as insertion loss, ripple, ripple, and group delay fluctuation.
图18是本实施例一涉及的新型谐振单元中电容器的结构图。图18是电容器的一种,叫做叉指电容,其中182和183是金属电极,181和184是叉指电容的对外连接端。FIG. 18 is a structural diagram of the capacitor in the new resonant unit involved in the first embodiment. Figure 18 is a type of capacitor called an interdigital capacitor, where 182 and 183 are metal electrodes, and 181 and 184 are the external connection terminals of the interdigital capacitor.
图19是叉指电容与现有的FBAR谐振器级联后形成的实施例一所提出的新型谐振单元的拓扑结构图。该谐振单元包括串联的叉指电容192和FBAR谐振器193,串联的叉指电容192和FBAR谐振器193的一端连接信号输入端口191,另一端连接信号输出端口194。19 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading the interdigital capacitor and the existing FBAR resonator. The resonance unit includes a series-connected interdigital capacitor 192 and an FBAR resonator 193. One end of the series-connected interdigital capacitor 192 and FBAR resonator 193 is connected to the signal input port 191, and the other end is connected to the signal output port 194.
电容器的另一种形式,叫做平板电容。图20是平板电容与现有的FBAR谐振器级联后形成的实施例一所提出的新型谐振单元的拓扑结构图。该谐振单元包括串联的平板电容202和FBAR谐振器203,串联的平板电容202和FBAR谐振器203的一端连接信号输入端口201,另一端连接信号输出端口204。Another form of capacitor is called plate capacitor. 20 is a topological structure diagram of the novel resonant unit proposed in Embodiment 1 formed by cascading a plate capacitor and an existing FBAR resonator. The resonance unit includes a plate capacitor 202 and an FBAR resonator 203 connected in series. One end of the plate capacitor 202 and the FBAR resonator 203 connected in series is connected to the signal input port 201 and the other end is connected to the signal output port 204.
FBAR谐振器由上、下电极及中间的压电薄膜组成。FBAR谐振器上电极的上方和下电极的下方是空气。FBAR谐振器的下电极的下方如果没有空气槽,那么该FBAR谐振器就变成了一个平板电容器。平板电容202可由上述方式实现。调节该平板电容器的面积或压电薄膜的厚度,可以改变电容的容值。The FBAR resonator is composed of upper and lower electrodes and a piezoelectric film in the middle. The FBAR resonator is above the upper electrode and below the lower electrode is air. If there is no air groove under the lower electrode of the FBAR resonator, the FBAR resonator becomes a plate capacitor. The plate capacitor 202 can be realized in the above-mentioned manner. Adjusting the area of the plate capacitor or the thickness of the piezoelectric film can change the capacitance of the capacitor.
图21是由本实施例提出的新型谐振单元组成的带通滤波器的拓扑结构图。如图21所示,所述带通滤波器的串联支路和三个并联支路采用图19所示的新型谐振单元。FIG. 21 is a topological structure diagram of a band pass filter composed of the new resonant unit proposed in this embodiment. As shown in FIG. 21, the series branch and three parallel branches of the band-pass filter adopt the new resonant unit shown in FIG. 19.
图22是由本实施例提出的新型谐振单元组成的带通滤波器的拓扑结构图。如图22所示,所述带通滤波器的串联支路和三个并联支路采 用图20所示的新型谐振单元。FIG. 22 is a topological structure diagram of a band pass filter composed of the new resonant unit proposed in this embodiment. As shown in Fig. 22, the series branch and three parallel branches of the band-pass filter adopt the new resonant unit shown in Fig. 20.
如图23所示,所述带通滤波器的串联支路采用图19所示的新型谐振单元,而三个并联支路谐振器采用的是现有FBAR谐振器;如图24所示,所述带通滤波器的串联支路采用图20所示的新型谐振单元,而三个并联支路谐振器采用的是现有FBAR谐振器。As shown in Figure 23, the series branch of the band-pass filter uses the new resonant unit shown in Figure 19, and the three parallel branch resonators use the existing FBAR resonator; as shown in Figure 24, The series branch of the band-pass filter uses the new resonant unit shown in FIG. 20, and the three parallel branch resonators use the existing FBAR resonator.
图25和图26是采用图23设计结构所产生的带通滤波器频响曲线。在过渡带(3600MHz到3630MHz之间)区域会产生纹波,但是在通带之内没有纹波。Figure 25 and Figure 26 are the frequency response curves of the band-pass filter produced by the design structure shown in Figure 23. There will be ripples in the transition band (between 3600MHz and 3630MHz), but there is no ripple in the passband.
本发明实施方式中,采用新的带通滤波器组成多工器(包括双工器),使得多工器不会受到串联支路谐振器的寄生纹波的影响,从而改善了多工器的插损、波动、纹波、群时延波动等通带性能指标。In the embodiment of the present invention, a new band-pass filter is used to form a multiplexer (including a duplexer), so that the multiplexer will not be affected by the parasitic ripple of the series branch resonator, thereby improving the performance of the multiplexer. Pass-band performance indicators such as insertion loss, fluctuation, ripple, and group delay fluctuation.
上述虽然结合附图对本发明的具体实施方式进行了描述,但并非对本发明保护范围的限制,所属领域技术人员应该明白,在本发明的技术方案的基础上,本领域技术人员不需要付出创造性劳动即可做出的各种修改或变形仍在本发明的保护范围以内。Although the specific embodiments of the present invention are described above in conjunction with the accompanying drawings, they do not limit the scope of protection of the present invention. Those skilled in the art should understand that on the basis of the technical solutions of the present invention, those skilled in the art do not need to make creative efforts. Various modifications or variations that can be made are still within the protection scope of the present invention.

Claims (10)

  1. 调整薄膜体声波谐振器FBAR寄生分量的方法,其特征在于,The method for adjusting the parasitic component of the film bulk acoustic wave resonator FBAR is characterized by:
    将电容与所述FBAR串联形成串联体,使该串联体的幅频曲线中,寄生分量的起始位置移动到串联谐振频点以下的频段。A capacitor is connected in series with the FBAR to form a series body, so that in the amplitude-frequency curve of the series body, the starting position of the parasitic component is moved to a frequency band below the series resonance frequency.
  2. 根据权利要求1所述的方法,其特征在于,还包括:The method according to claim 1, further comprising:
    对所述FBAR的上电极、下电极、压电层中的一者或多者的厚度进行调整,并且/或者,对所述电容的电容值进行调整,使所述串联体的串联谐振频率和并联谐振频率,分别位于所述FBAR的串联谐振频率和并联谐振频率的预设宽度的邻域内。The thickness of one or more of the upper electrode, lower electrode, and piezoelectric layer of the FBAR is adjusted, and/or the capacitance value of the capacitor is adjusted so that the series resonance frequency of the series body is equal to The parallel resonant frequencies are respectively located in the neighborhood of the preset width of the series resonant frequency and the parallel resonant frequency of the FBAR.
  3. 根据权利要求2所述的方法,其特征在于,The method of claim 2, wherein:
    所述上电极由电极材料与该电极材料上方的钝化层构成;The upper electrode is composed of an electrode material and a passivation layer above the electrode material;
    所述上电极的厚度为所述电极材料的厚度与等效电极材料厚度之和,该等效电极材料的声阻抗等于所述钝化层的声阻抗。The thickness of the upper electrode is the sum of the thickness of the electrode material and the thickness of the equivalent electrode material, and the acoustic impedance of the equivalent electrode material is equal to the acoustic impedance of the passivation layer.
  4. 根据权利要求2所述的方法,其特征在于,还包括:The method according to claim 2, further comprising:
    对于使用所述FBRA构成滤波器,该滤波器中的部分或全部FBAR替换为所述串联体,使该滤波器的幅频曲线中,寄生分量位于通带之外。For using the FBRA to form a filter, part or all of the FBAR in the filter is replaced with the series body, so that the parasitic component in the amplitude-frequency curve of the filter is outside the passband.
  5. 根据权利要求4所述的方法,其特征在于,所述滤波器中的所有串联FBAR替换为所述串联体。The method according to claim 4, wherein all series FBARs in the filter are replaced with the series body.
  6. 根据权利要求4所述的方法,其特征在于,所述滤波器中的所有串联FBAR以及至少1个并联FBAR,替换为所述串联体。The method according to claim 4, wherein all series FBARs and at least one parallel FBAR in the filter are replaced with the series body.
  7. 一种滤波器,包含薄膜体声波谐振器FBAR,其特征在于,所 述滤波器的每个串联FBAR串联有电容。A filter includes a thin film bulk acoustic wave resonator FBAR, which is characterized in that each series FBAR of the filter is connected in series with a capacitor.
  8. 根据权利要求7所述的滤波器,其特征在于,所述滤波器的一个或多个并联FBAR串联有电容。The filter according to claim 7, wherein one or more parallel FBARs of the filter are connected in series with capacitors.
  9. 一种多工器,其特征在于,包含权利要求6或7所述的滤波器。A multiplexer characterized by comprising the filter according to claim 6 or 7.
  10. 一种通信设备,其特征在于,包含权利要求6或7所述的滤波器。A communication device, characterized by comprising the filter according to claim 6 or 7.
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