WO2021147895A1 - Électrode pour un dispositif électronique, procédé de fabrication d'une électrode pour un dispositif électronique et appareil de film intelligent pixelisé - Google Patents

Électrode pour un dispositif électronique, procédé de fabrication d'une électrode pour un dispositif électronique et appareil de film intelligent pixelisé Download PDF

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Publication number
WO2021147895A1
WO2021147895A1 PCT/CN2021/072865 CN2021072865W WO2021147895A1 WO 2021147895 A1 WO2021147895 A1 WO 2021147895A1 CN 2021072865 W CN2021072865 W CN 2021072865W WO 2021147895 A1 WO2021147895 A1 WO 2021147895A1
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Prior art keywords
electrode
substrate
traces
electrical
pixels
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PCT/CN2021/072865
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English (en)
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Tak Ching SO
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So Tak Ching
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Publication of WO2021147895A1 publication Critical patent/WO2021147895A1/fr

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/13439Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1334Constructional arrangements; Manufacturing methods based on polymer dispersed liquid crystals, e.g. microencapsulated liquid crystals

Definitions

  • the present invention relates to an electrode for an electronic device and a method for fabricating an electrode for an electronic device, and particularly, although not exclusively, to a method for fabricating an electrode for use in a pixelated smartfilm apparatus.
  • a smartfilm display apparatus such as a smartfilm display panel is able to operate between two states, a non-opaque state when power is supplied to the panel and an opaque state when the power is cut off.
  • a smartfilm display apparatus may be used in shop windows to maximise the advertising effect, and parts of the conference room serving as a privacy protection. Lately, smartfilm display panels may be used for image projection where images or text are imprinted thereon, allowing different visual contents to be displayed to a user for various purposes.
  • a method for fabricating an electrode for an electronic device comprising the steps of: providing a substrate having a layer of conductive material predefined with a plurality of electrical conductive feature formed on the substrate; and providing an electrical connection including a plurality of traces each connects at least two of the electrical conductive feature on the substrate.
  • the plurality of traces are arranged in parallel.
  • the plurality of traces combine to define a grid pattern.
  • the plurality of electrical conductive feature include a plurality of electrical contacts and/or electrode pixels.
  • the step of providing a substrate further comprising the steps of depositing and patterning the layer of conductive material on the substrate to define electrical conductive feature including an array of pixels of electrode on the substrate.
  • the step of providing a substrate further comprising the steps of connecting each of the pixels of electrode and a respective electrical contact with one or more of the plurality of traces.
  • the plurality of electrical conductive features are formed by depositing the layer of conductive material onto the substrate through a shadow mask having a plurality of apertures.
  • the method further comprises a step of fabricating the shadow mask with the plurality of apertures.
  • the layer of conductive material is deposited on the substrate using physical vapour deposition.
  • the electrical connection is formed by inkjet printing the plurality of traces on the substrate.
  • the electrical connection is formed by electroplating.
  • the method of providing the electrical connection further comprises the steps of: electroplating a plurality of metal traces onto a plating electrode defined with a template pattern of the plurality of traces on the substrate; and transferring the plurality of metal traces onto the substrate.
  • the plating electrode includes a mesh.
  • the step of transferring the plurality of metal traces further comprising the steps of: attaching the plurality of metal traces formed on the plating electrode onto the substrate via an adhesive applied between the plating electrode and the substrate; and detaching the plating electrode from the substrate.
  • the step of transferring the plurality of metal traces further comprising the steps of aligning the plurality of metal traces with respect to the plurality of electrical conductive feature formed on the substrate.
  • an electrode for an electronic device comprising: a substrate having a layer of conductive material defined with a plurality of electrical conductive feature formed on the substrate; and an electrical connection including a plurality of traces each connects at least two of the electrical conductive feature on the substrate.
  • the plurality of traces are arranged in parallel.
  • the plurality of traces combine to define a grid pattern.
  • the plurality of electrical conductive feature include a plurality of electrical contacts and/or electrode pixels.
  • the plurality of electrical conductive feature include an array of pixels of electrode on the substrate.
  • the plurality of traces are provided on the substrate, and wherein each of the pixels connects to a respective electrical contact formed on the substrate via one or more of the plurality of traces.
  • the electrical connection and the electrical contacts are arranged to connect the array of pixels of electrode to an external controller for controlling the array of pixels of the electronic device.
  • the conductive material is deposited through a shadow mask thereby simultaneously patterned to form the electrical conductive feature on the substrate.
  • each of the electrical contacts or the electrode pixels has dimensions of 12.5 mm ⁇ 12.5 mm.
  • the electrical connections is inkjet printed on the substrate.
  • each of the plurality of traces has a width of 20 –30 ⁇ m.
  • the electrical connections is electroplated on the substrate.
  • each of the plurality of traces has a width of 200 nm.
  • the conductive material includes indium-tin-oxide (ITO) .
  • the electrical connection include copper.
  • the substrate includes a flexible polyethylene terephthalate (PET) substrate.
  • PET polyethylene terephthalate
  • the electronic device includes a smartfilm display apparatus.
  • the smartfilm display apparatus is defined with a plurality of individually controllable display pixels.
  • a method for fabricating a pixelated smartfilm apparatus comprising the steps of: fabricating a shadow mask with a plurality of apertures corresponding to a plurality of individually controllable pixels of the pixelated smartfilm apparatus; depositing a layer of conductive material on a PET substrate through the shadow mask to define an array of pixels of conductive material on the PET substrate; providing a plurality of electrical contacts formed on the PET substrate; printing a plurality of copper wires on the PET substrate to connect each of the pixels of conductive material with a respective electrical contact; combining the PET substrate with a PET/ITO substrate and a layer of polymer dispersed liquid crystals (PDLC) material to form a smartfilm with the plurality of individually controllable pixels, wherein the layer of conductive material on the PET substrate and an ITO layer of the PET/ITO substrate connect to opposite sides of the layer of PDLC material.
  • PDLC polymer dispersed liquid crystals
  • a pixelated smartfilm apparatus comprising: an electrode in accordance with the second aspect, and a layer of polymer dispersed liquid crystals (PDLC) material defining an array of PDLC pixels each being individually controllable by a respective pixel of electrode.
  • PDLC polymer dispersed liquid crystals
  • Figure 1 is a top view of an electrode for a smartfilm display apparatus in accordance with one embodiment of the present invention
  • Figure 2 is a top view of a shadow mask for use in fabricating the electrode of Figure 1, and a substrate of the electrode is placed behind the shadow mask;
  • Figure 3 is a flow chart illustrating a method of fabricating the electrode of Figure 1;
  • Figure 4 is a cross-sectional view of a pixelated smartfilm apparatus including the electrode of Figure 1 in accordance with one embodiment of the present invention
  • Figures 5A is an optical image showing a series of copper traces fabricated using a plating and transfer method in accordance with one embodiment of the present invention
  • Figure 5B is a plot showing a surface profile of two traces in Figure 5A;
  • Figures 5C and 5D are SEM images showing other regions of the substrate in Figure 5A;
  • Figure 6 is an image showing another substrate with electroplated metal layer transferred from a template using the method in accordance with one embodiment of the present invention.
  • Figure 7 is an example copper mesh fabricated using the method in accordance with one embodiment of the present invention.
  • Figure 8 is a plot showing an optical transmittance of the copper mesh in Figure 7 with different parameters
  • Figures 9A and 9B are plots showing a comparison of change of electrical resistivity of ITO/PEF substrate and copper mesh of Figure 7 in a bending test;
  • FIGS. 10A and 10B illustrate an alternative application of the copper mesh as a heater device
  • FIGS 11A to 11C illustrate an alternative application of the copper mesh as a touch panel device
  • Figures 12A and 12B illustrates an alternative application of the copper mesh as an electrode layer in a flexible OLED device.
  • an electrode 100 for an electronic device comprising a substrate 102 having a layer of conductive material 104 defined with a plurality of electrical conductive feature formed on the substrate 102; and an electrical connection including a plurality of traces 106 each connects at least two of the electrical conductive feature on the substrate 102.
  • the electronic device may be a smartfilm display apparatus defined with a plurality of individually controllable display pixels 104, each of the pixels 104 connects to a respective electrical contact 108 formed on the substrate 102 via the respective electrical traces 106, each of the pixels connects to a respective electrical contact formed on the substrate via one or more of the plurality of traces 106.
  • the electrode includes a substrate 102 with a layer of conductive material 104 deposited thereon, and the conductive material layer is defined with a plurality of individual square-shaped patterns.
  • the conductive material 104 includes a transparent material which allows light or optical signal passing through, and are electrically conductive.
  • the conductive material 104 may include transparent conducting oxides such as indium-tin-oxide (ITO) , fluorine doped tin oxide (FTO) or doped zinc oxide such as Indium-Gallium doped Z inc Oxide (IGZO) and Aluminum Zinc Oxide (AZO) .
  • the conductive material 104 may include a thin layer of metal which is at least partially transparent.
  • the plurality of electrical conductive feature include a plurality of electrical contacts 108 and/or electrode pixels 104, which are connected by electrical traces therebetween.
  • the electrode pixels 104 are arrange in an array and combine to form an array of display pixels if the electrode is used in a pixelated display panel.
  • the plurality of traces are arranged in parallel, along at least one axis of the electrode.
  • the plurality of traces may also combine to define a grid pattern as shown in the Figure.
  • an external controller may be used for controlling the array of pixels of the electronic device, by providing voltage biasing signals to the electrode pixels via the contacts 108 and the respective one of the traces 106 of the electrical connection.
  • the substrate 102 may be a flexible substrate which is optically transparent, such that the combination of the substrate 102 and the conductive material 104 are also optically transparent.
  • the substrate 102 may include polymers such as polyethylene terephthalate (PET) , polyethylene naphthalate (PEN) or polyvinyl chloride (PVC) .
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PVC polyvinyl chloride
  • glass or quartz substrates may be used.
  • the substrate 102 is square-shape with having a dimension of 200 mm ⁇ 200 mm, however it will be appreciated that, the substrate 102 may be in other shape and dimensions such as a round shape with a predetermined diameter. Alternatively, the size and shape of the substrate 102 may depend on the overall assembly of the smartfilm display apparatus.
  • the illustrated 5 ⁇ 5 array of pixels of conductive material 104 is regularly distributed in the centre of the substrate 102, with each pixel 104 in a square shape with dimensions of 12.5 mm ⁇ 12.5 mm, the invention can be practiced with another array of pixels 104 irregularly distributed over a surface of the substrate 102, having different shapes.
  • the size of the array may be different depending on different applications of the smartfilm.
  • the electrode 100 further comprises electrical connections 106 which connect each of the pixels 104 to an electrical contact 108.
  • each of the electrical connections 106 has a width of 20 –30 ⁇ m, therefore is not substantially observable when the smartfilm apparatus is observed from a distance.
  • the width of the electrical connections may be wider or narrower according to the overall electrical resistance of such connection between the ITO pixels 104 and the electrical contacts 108.
  • the electrical connections 106 may include low-resistance electrical conductors e.g. metals such as copper silver or gold, or transparent conductive oxides as discussed earlier.
  • the electrical connections 106 and the electrical contacts 108 are arranged to connect the array of pixels of conductive material 104 to an external controller (not shown) for controlling the array of pixels 104 of the display apparatus.
  • an external controller not shown
  • Each of the pixels of ITO 104 is electrically isolated from each other, therefore the pixels of the display apparatus may be individually controlled. Operation of the display apparatus will be discussed in more detail below.
  • the shadow mask 110 for use in fabricating the electrode 100.
  • the shadow mask 110 is a silicon wafer with a diameter of 200 mm.
  • a 5 ⁇ 5 array of square shaped apertures 112 is defined on the silicon substrate 114, which therefore define the pattern of the deposited ITO layer 104 on the substrate 102 after ITO deposition through the shadow mask 110.
  • a method 200 for fabricating an electrode for a smartfilm display apparatus.
  • the method 200 will be discussed hereinafter using the electrode 100 as an example embodiment.
  • a shadow mask 110 with a plurality of apertures 112 is fabricated. Each aperture defines a pixel of conductive material 104 on the finalised electrode 100 for the display apparatus. Each of these pixels of conductive material 104 combined together in turn defines a visual content on the display apparatus.
  • the arrangement and si ze of the plurality of apertures in the shadow mask may therefore be selected depending on the pattern or matrix that is desired to be displayed in the display apparatus.
  • the shadow mask comprises a semiconductor material such as si licon (Si) in the form of a mask substrate.
  • the thickness of the mask substrate is preferably in the range of 100 mm to 300 mm.
  • An insulating layer e.g. including silicon dioxide (SiO 2 )
  • SiO 2 silicon dioxide
  • the thickness of the insulating layer is preferably in the range of 1 ⁇ m to 5 ⁇ m.
  • the plurality of apertures is then formed in the insulating layer by standard photolithography using an etchant.
  • the insulating layer serves as an etching mask for the silicon mask substrate.
  • a 3 ⁇ m SiO 2 layer is deposited on a 200 mm Si substrate using chemical vapour deposition at 300 °C. Lithography is then performed to form a plurality of apertures on the Si/SiO 2 layer.
  • HMDS is first applied to the Si/SiO 2 layer in gas form in the process known as the vapour prime at 150 °C.
  • a thin layer of photoresist having a thickness of 1.2 ⁇ m is then spun coat on the Si/SiO 2 layer. After an exposure of the photoresist through an optical mask of the ITO pattern, the Si/SiO 2 /resists layer is then developed. After etching and removal of resists, a finalised and desired shadow mask with Si and SiO 2 is obtained.
  • the shadow mask 110 may be made of a different material such as steel, copper or any rigid material which may be used in physical/chemical vapour deposition technology. Therefore,
  • the fabricated shadow mask 110 with a plurality of apertures 112 is used as a shadow mask when depositing a layer of conductive material onto a substrate, as discussed in the following paragraphs.
  • step 240 a layer of conductive material on a substrate 102 is deposited and patterned to define an array of pixels of conductive material 104 on the substrate 102.
  • step 240 includes depositing the layer of conductive material onto the substrate 102 through the abovementioned shadow mask 110 using physical vapour deposition, such as sputter deposition, evaporative deposition and pulsed laser deposition or using chemical vapour deposition methods. After removing the shadow mask 110, the patterned array of pixels of conductive material 104 is deposited on the substrate 102.
  • physical vapour deposition such as sputter deposition, evaporative deposition and pulsed laser deposition or using chemical vapour deposition methods.
  • a 300 mm ⁇ 300 mm ⁇ 0.25 mm PET substrate 102 is cut into 200 mm ⁇ 200 mm using laser cutting.
  • a shadow mask 110 covers the PET substrate 102, followed by a sputter deposition of a 0.1 ⁇ m ITO layer on the PET substrate 102 through the shadow mask 110 such that arrays of pixelated ITO patterns may be simultaneous ly deposited and patterned on the PET substrate 102 after removing the shadow mask 110.
  • a plurality of electrical contacts 108 is formed on the substrate 102.
  • the electrical contacts 108 may be in a form of an electrical contact pad which may be configured to be electrically connected to the array of pixels 104 on the electrode 100 so that a voltage applied to the electrode 100 may in turn change the electrode 100 from an opaque state to a transparent state, or vice versa.
  • the electrical contacts 108 may be made of copper foil strip. Each electrical contact 108 may be placed in different areas on the electrode 100 and configured into different sizes, configurations, and/or shapes.
  • each of the pixels of conductive material 104 is provided with an electrical connection 106 to connect each of the pixels 104 with a respective electrical contact 108 formed on the substrate 102.
  • the electrical connections 106 are inkjet printed on the substrate 102.
  • high resolution inkjet printer such as a “Dimatix Materials Printer” (DMP-2850) may be used to print the traces 106 with a width of as narrow as 20 ⁇ m or another patterns with such minimum feature size.
  • DMP-2850 Dynamicon Materials Printer
  • the resolution of inkjet printed pattern may be optimized by using metal ink with different ink formula and/or viscosity, as well as by using other printing parameters.
  • each of the electrical connections 106 has a width of 20 to 30 ⁇ m.
  • a pixelated smartfilm apparatus 300 comprising a protective and transparent layer of polymer dispersed liquid crystals (PDLC) material 350, a PET/ITO substrate 370, and a PET substrate 320 including a layer of conductive material ITO 340 with a plurality of isolations 310, wherein the ITO layer 340 and an ITO layer of the PET/ITO substrate 370 connect to opposite sides of the layer of PDLC material 350.
  • the electrode 100 shown in Figure 1 may be utilised in the PET substrate 320 including the ITO layer 340 with a plurality of isolations 310 shown in Figure 3.
  • the PET/ITO substrate 370 may operate as a command anode and the PET substrate 320 with the pixelated ITO patterns 340 may operate as a cathode, or vice versa.
  • the fabrication of the PET substrate 320 including the ITO layer 340 with a plurality of isolations 310 in the pixelated smartfilm apparatus 300 is similar to the abovementioned method 200.
  • a shadow mask with a plurality of apertures corresponding to a plurality of individually controllable pixels 340 of the pixelated smartfilm apparatus 300 is first fabricated using a method similar to step 220. Similar to step 240, the ITO layer is then deposited on the PET substrate 320 through the shadow mask, in particular through the plurality of apertures, to define an array of pixels of ITO 340 on the PET substrate 320.
  • a plurality of electrical contacts (not shown) is then provided on the PET substrate 320, where a respective electrical contact is connected to each of the pixels of conductive material 340 via a plurality of copper wires (not shown) printed on the PET substrate 320.
  • the illustrated pixelated smartfilm apparatus 300 provides various applications.
  • the term “smartfilm” refers to a layer of material that is configured to alternate between an opaque state and a non-opaque state in response to receiving an electrical signal. It may be used in a projection screen for image projection, or it may be used in windows of rooms where privacy is occasionally needed. For example, it may be used in an interactive display system where a transparent glass or windows may be selectively switched to operate as a project screen. In this example, names, decorations or images which describe the room owner’s availability or status may be provided on a pixelated smartfilm screen so as to allow another person getting information of the room owner without entering the room.
  • the pixelated smartfilm apparatus is particularly useful for advertising a business company when a logo is or when dynamic images of certain product are imprinted in front of the office window to increase clients’ or consumer’s interest.
  • the operation of the pixelated smartfilm apparatus 300 between an opaque state and a non-opaque state is achieved by manipulating an electric field across the sandwiched PDLC layer 350, which in turns allows light to pass through the PDLC layer 350, or blocks off the light.
  • the PDLC layer 350 contains crystals immersed in polymer such that they can change their orientation in response to an electric field across the layer 350, aligning the PDLC layer 350 in a way which light can pass through freely, leading to a transparent effect.
  • Graphics such as text, dot matrix and logos may be marked onto the ITO layer in the form of an array of pixels of ITO 340, which may be displayed upon applying an AC voltage, which is controlled using a chip driven with LCD driver IC or software.
  • the user may send a signal, using an external controller, to the electrical contacts connected to the pixels of ITO 340 via the copper wires printed on the PET substrate 320, in order to operate the pixelated smartfilm apparatus 300 between the two states.
  • each point on the smartfilm apparatus 300 is powered with pulses at different time, therefore creating an uneven yet programmable electric field between the PDLC layer 350 and the ITO layer according to the dot pattern (the array of pixels 340) to display various images (opaque pattern in contrast to the transparent portions on the smartfilm apparatus) .
  • the user sends a signal to disable the pixelated smartfilm apparatus 300 thus reducing or removing the voltage from the apparatus 300, the electric field across the PDLC layer 350 is no long uneven, leading to a transparent pattern on the smartfilm apparatus 300.
  • the traces 106 or the copper wires may be deposited and patterned using methods other than inkjet printing.
  • the electrical connection may be formed by electroplating, including the steps of electroplating a plurality of metal traces onto a plating electrode defined with a template pattern of the plurality of traces on the substrate; and transferring the plurality of metal traces onto the substrate.
  • the plating process may be performed by electroplating a layer of metal on a “template” , such as a mesh, to form the plurality of traces on the template.
  • a metal mesh with a predetermined grid size may be used as the template or the plating electrode.
  • a copper-ion-based solution may be used as an electrolyte in the electroplating process to form the required Cu mesh.
  • the method further comprises the steps of attaching the plurality of metal traces formed on the plating electrode onto the substrate via an adhesive applied between the plating electrode and the substrate, and detaching the plating electrode from the substrate, so as to completely transfer the prepared Cu mesh onto the substrate.
  • the metal traces may be aligned with respect to the plurality of electrical conductive feature formed on the substrate, e.g. the copper wires may be aligned with the ITO pixel edge such that the ITO electrode pixel, the copper traces and the electrical contact pads are electrically connected.
  • an adhesive such as NOA63 may be used to secure the copper traces onto the ITO substrate.
  • other adhesives such as conductive adhesives may be applied to minimize the electrical contact resistance between the ITO patterns and the copper traces.
  • FIG. 5A there is shown an optical image of a series of parallel copper traces formed on a PET substrate.
  • the surface profile was measured and the illustrated in Figure 5B, in which the copper traces has a height or thickness of 10 nm with a width of 500 nm on the surface of the PET substrate.
  • the thickness of the copper traces may be as thin as 200 nm with a gap as small as 50 nm between adj acent traces.
  • the height of the traces were found to be optimal in the range of 10 nm to 100 nm.
  • the deposition method according to embodiments of the present invention allows patterning of electroplated metal film to have an extremely fine resolution, the template may be reusable, and it does not require the formation and stripping of plating/etching resist.
  • the plating and transferring process is a rapid process with a processing rate of 0.1 –100 m 2 /h, which allow fabrication process on a wafer-size substrate being completed within several minutes.
  • FIG 7 there is shown an example copper mesh having a grid size of around 100 ⁇ m ⁇ 100 ⁇ m, which may be applied as conductive elements in other types of electronic devices.
  • the optical performance of this copper mesh is illustrated in Figure 8, in which the optical transparency of the Cu mesh in the visible spectrum was found to be 78%–98%when the copper line width changed from 12 ⁇ m –1.6 ⁇ m.
  • a copper mesh with a dimension of 6.5 ⁇ 4 cm 2 may heat up a surface to over 100 °C with a power density of 0.3 W/cm 2 , under a variable bias of 0.7 –1.6 V across the copper mesh.
  • the copper mesh may be used as an electrode in to touch panel.
  • the copper mesh may also be used in flexible OLED devices or other organic electronic devices, in which the copper mesh may be used an electrode disposed adj acent to the electron transport layer (PEDOT: PSS in the example) .
  • PEDOT electron transport layer
  • connection lines may be advantageous in that, by separating the process of deposition of relatively large TCO pattern from the deposition of fine connection traces, it allows the deposition and patterning of the connection lines using different conductive material, such as but not limited to a high conductance ink consisting of metal (e.g. Cu/Ag) nanoparticles, which may be deposited using inkjet printing according to the embodiments of the invention, or the metal traces may be formed using high precision electroplating process.
  • a high conductance ink consisting of metal (e.g. Cu/Ag) nanoparticles, which may be deposited using inkjet printing according to the embodiments of the invention, or the metal traces may be formed using high precision electroplating process.
  • the electrical connections formed by inkjet printing or plating are provided with fine morphology with high accuracy, smooth surface and high electrical conductivity. Because of the extreme fineness, the conductive lines are unobservable when observed from a certain distance, providing the apparatus with an aesthetic appeal.
  • the two-step fabrication method also allows engineering of material used in defining each of the pixels and the conductive lines, thus improving the cost effectiveness and technical requirements of fabricating the transparent electrode with these features.
  • the layer of conductive materials is designed in a way such that upon applying a voltage, an uneven electric field according to the patterned array will be formed in between the layers of the display apparatus.
  • Each electrical connection is connected to each pixel of the array and the substrate, resulting in an array of electrically isolated pixels.
  • Each pixel can be controlled and powered with pulses at different time, thereby creating an uneven and programmable electric field across the apparatus such that an opaque pattern will be displayed in contrast to the transparent portions.
  • the patterned array of pixels of conductive material allows graphics such as logos, icons, characters, dot matrix (dynamic graphic) or any text to be imprinted and shown on the smartfilm display apparatus.
  • the smartfilm display apparatus maybe marked with names, decorations, or images with describes a person's availability or status, providing both informative and aesthetic values.
  • Smartfilm display apparatus being fabricated using the novel method is versatile. For example, it may be used for advertising a business company such as imprinting a logo in front of the office window or with dynamic images which promotes certain products. It may also be used in public places such as hospitals and airports for dynamically providing information to the public.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Dispersion Chemistry (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne une électrode pour un dispositif électronique, un procédé de fabrication d'une électrode pour un dispositif électronique et un appareil de film intelligent pixelisé. Le procédé comprend les étapes consistant à fournir un substrat ayant une couche de matériau conducteur prédéfinie avec une pluralité de caractéristiques conductrices électriques formées sur le substrat ; et fournir une connexion électrique comprenant une pluralité de traces qui connectent chacune au moins deux des caractéristiques conductrices électriques sur le substrat.
PCT/CN2021/072865 2020-01-20 2021-01-20 Électrode pour un dispositif électronique, procédé de fabrication d'une électrode pour un dispositif électronique et appareil de film intelligent pixelisé WO2021147895A1 (fr)

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090102990A1 (en) * 2005-05-21 2009-04-23 Sharp Kabushiki Kaisha Display
CN105044963A (zh) * 2015-08-11 2015-11-11 深圳市华星光电技术有限公司 显示面板及其制作方法
CN106019664A (zh) * 2015-03-24 2016-10-12 株式会社半导体能源研究所 触摸面板
CN107817617A (zh) * 2017-09-19 2018-03-20 苏州威尔德工贸有限公司 一种可电控变换图案的调光膜
JP2019049674A (ja) * 2017-09-12 2019-03-28 凸版印刷株式会社 ディスプレイ
CN109946868A (zh) * 2017-11-29 2019-06-28 天马日本株式会社 光线方向控制装置及显示装置
CN110471206A (zh) * 2019-07-23 2019-11-19 珠海兴业新材料科技有限公司 一种激光直接刻蚀制备有图案和/或文字的pdlc液晶调光膜的方法
US10497322B2 (en) * 2017-01-23 2019-12-03 Japan Display Inc. Display device

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090102990A1 (en) * 2005-05-21 2009-04-23 Sharp Kabushiki Kaisha Display
CN106019664A (zh) * 2015-03-24 2016-10-12 株式会社半导体能源研究所 触摸面板
CN105044963A (zh) * 2015-08-11 2015-11-11 深圳市华星光电技术有限公司 显示面板及其制作方法
US10497322B2 (en) * 2017-01-23 2019-12-03 Japan Display Inc. Display device
JP2019049674A (ja) * 2017-09-12 2019-03-28 凸版印刷株式会社 ディスプレイ
CN107817617A (zh) * 2017-09-19 2018-03-20 苏州威尔德工贸有限公司 一种可电控变换图案的调光膜
CN109946868A (zh) * 2017-11-29 2019-06-28 天马日本株式会社 光线方向控制装置及显示装置
CN110471206A (zh) * 2019-07-23 2019-11-19 珠海兴业新材料科技有限公司 一种激光直接刻蚀制备有图案和/或文字的pdlc液晶调光膜的方法

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