WO2021147633A1 - Filter, duplexer, high-frequency front-end circuit, and communication apparatus - Google Patents

Filter, duplexer, high-frequency front-end circuit, and communication apparatus Download PDF

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Publication number
WO2021147633A1
WO2021147633A1 PCT/CN2020/141264 CN2020141264W WO2021147633A1 WO 2021147633 A1 WO2021147633 A1 WO 2021147633A1 CN 2020141264 W CN2020141264 W CN 2020141264W WO 2021147633 A1 WO2021147633 A1 WO 2021147633A1
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resonator
temperature
parallel
fsp
fpp
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PCT/CN2020/141264
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French (fr)
Chinese (zh)
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庞慰
边子鹏
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诺思(天津)微系统有限责任公司
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/703Networks using bulk acoustic wave devices
    • H03H9/706Duplexers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46Filters
    • H03H9/54Filters comprising resonators of piezo-electric or electrostrictive material

Definitions

  • the present invention relates to the technical field of filters, in particular to a filter, a duplexer, a high-frequency front-end circuit and a communication device.
  • the radio frequency filter plays a vital role. It can filter out the out-of-band interference and noise to meet the requirements of the radio frequency system and The requirements of the communication protocol for the signal to noise ratio.
  • Radio frequency filters are mainly used in wireless communication systems, such as radio frequency front-ends of base stations, mobile phones, computers, satellite communications, radars, electronic countermeasures systems, and so on.
  • the main performance indicators of radio frequency filters are insertion loss, out-of-band suppression, power capacity, linearity, device size and temperature drift characteristics.
  • Good filter performance can improve the data transmission rate, life and reliability of the communication system to a certain extent. Therefore, the design of high-performance and simplified filters for wireless communication systems is very important.
  • the small-size filter devices that can meet the needs of communication terminals are mainly piezoelectric acoustic wave filters.
  • the resonators that constitute this type of acoustic wave filter mainly include: FBAR (Film Bulk Acoustic Resonator), SMR (Solidly Mounted Resonator, solid-state assembly resonator) and SAW (Surface Acoustic Wave, surface acoustic wave resonator).
  • FBAR Flexible Bulk Acoustic Resonator
  • SMR Solidly Mounted Resonator, solid-state assembly resonator
  • SAW Surface Acoustic Wave, surface acoustic wave resonator
  • the filters manufactured based on the principle of bulk acoustic wave FBAR and SMR collectively referred to as BAW, bulk acoustic wave resonator
  • BAW bulk acoustic wave resonator
  • the piezoelectric materials and metal materials that constitute the acoustic wave resonator both have the characteristics of negative temperature coefficient, that is, when the temperature increases, the resonant frequency of the resonator will move in a certain proportion to the low-frequency direction (temperature drift).
  • the temperature coefficient of SAW is -35ppm/°C ⁇ -50ppm/°C
  • the temperature coefficient of BAW is -25ppm/°C ⁇ -30ppm/°C.
  • this temperature compensation material is usually silicon dioxide, because silicon dioxide has a positive temperature coefficient and can be made through general technological processes. At the same time, it has a low price and is suitable for mass production applications;
  • the material of the compensation layer can also be a positive temperature coefficient material such as polysilicon, borophosphate glass (BSG), chromium (Cr) or tellurium oxide (TeO(x)); the thickness of the temperature compensation layer is generally in the range (Angstrom) to between.
  • This type of resonator with temperature-compensated materials is also called a temperature coefficient of frequency (Temperature Coefficient of Frequency, TCF) resonator, which is a component unit of the temperature compensation filter.
  • the performance of the resonator deteriorates, which is mainly reflected in the increase of the loss of the resonator and the decrease of the electromechanical coupling coefficient (Kt 2 ).
  • the loss of the resonator directly affects the passband insertion loss characteristics of the filter, thereby increasing the loss in the RF link and deteriorating the transceiver performance of the RF front-end.
  • the electromechanical coupling coefficient becomes smaller. Under certain frequency conditions, the frequency difference between the series resonance frequency and the parallel resonance frequency of the resonator is reduced.
  • the roll-off characteristics of the filter may be improved, but at the same time the bandwidth of the filter will also be narrowed. In most communication systems, the bandwidth of the filter is proposed according to the system requirements, and the bandwidth cannot be narrowed indefinitely.
  • the main purpose of the present invention is to provide a filter, a duplexer, a high-frequency front-end circuit, and a communication device that can achieve the high roll-off requirements and requirements of the filter under the premise of certain bandwidth requirements and insertion loss requirements. Good temperature characteristics.
  • a filter which includes a plurality of series resonators and a plurality of parallel resonators, and the partial series resonators and/or the partial parallel resonators are temperature-compensated resonators.
  • the temperature compensated resonator includes a temperature compensation layer.
  • the series branch includes a multi-stage series circuit, and all or part of the series resonators in the at least one-stage series circuit are temperature-compensated resonators; and/or, the parallel branch includes a multi-stage parallel circuit, wherein at least one stage is connected in parallel All or part of the parallel resonators in the circuit are temperature-compensated resonators.
  • the number of temperature-compensated resonators in the series branch is 1, and the relationship between its frequency and the frequencies of other series resonators is as follows:
  • fsp_11 is the parallel resonant frequency of series resonator S11
  • fsp_12 is the parallel resonant frequency of series resonator S12
  • fsp_13 is the parallel resonant frequency of series resonator S13
  • fsp_tcf is temperature Complement the parallel resonant frequency of the resonator TCF
  • delta_FR is the frequency change of the corresponding frequency at -20dB on the right side of the filter passband under high and normal temperature conditions.
  • the number of temperature-compensated resonators in the series branch is greater than or equal to 2.
  • the relationship between its frequency and the frequencies of other series resonators is as follows:
  • fsp_11 is the parallel resonant frequency of series resonator S11
  • fsp_12 is the parallel resonant frequency of series resonator S12
  • fsp_13 is the parallel resonant frequency of series resonator S13
  • fsp_1n is the parallel resonant frequency of series resonator S1n
  • fsp_tcf1 is temperature
  • fsp_tcf2 is the parallel resonant frequency of the temperature-compensated resonator TCF2
  • fsp_tcfn is the parallel resonant frequency of the temperature-compensated resonator TCFn
  • delta_FR is the corresponding frequency at -20dB on the right side of the filter passband at high temperature and The amount of frequency change under normal temperature conditions.
  • the number of temperature-compensated resonators is 1.
  • the relationship between its frequency and the parallel resonance frequency is as follows:
  • fpp_11 is the parallel resonant frequency of the parallel resonator P11
  • fpp_12 is the parallel resonant frequency of the parallel resonator P12
  • fpp_13 is the parallel resonant frequency of the parallel resonator P13
  • fpp_1n is the parallel resonant frequency of the parallel resonator P1n
  • fpp_tcf is the temperature Compensate the parallel resonant frequency of the resonator TCF
  • delta_FL is the frequency change of the corresponding frequency at -20dB on the left side of the filter passband under high and normal temperature conditions.
  • the number of temperature-compensated resonators in the parallel branch circuit is greater than or equal to 2.
  • the relationship between their frequency and the parallel resonance frequency is as follows;
  • fpp_11 is the parallel resonant frequency of the parallel resonator P11
  • fpp_12 is the parallel resonant frequency of the parallel resonator S12
  • fpp_13 is the parallel resonant frequency of the parallel resonator P13
  • fpp_1n is the parallel resonant frequency of the parallel resonator P1n
  • fpp_tcf1 is the temperature
  • fpp_tcf2 is the parallel resonant frequency of the temperature-compensated resonator TCF2
  • fpp_tcfn is the parallel resonant frequency of the temperature-compensated resonator TCFn
  • delta_FL is the corresponding frequency at the left -20dB of the filter passband at high temperature and The amount of frequency change under normal temperature conditions.
  • the temperature compensation resonator has a positive temperature drift coefficient, and the magnitude of the positive temperature drift coefficient is 0 to 0.5 times the magnitude of the temperature drift coefficient of the resonator without a temperature compensation layer.
  • the effective electromechanical coupling coefficient of the temperature-compensated resonator is smaller than the effective electromechanical coupling coefficient of the resonator without a temperature-compensated layer.
  • Another aspect of the present invention provides a duplexer including the above-mentioned filter.
  • a high-frequency front-end circuit including the above-mentioned filter.
  • a communication device including the above-mentioned filter.
  • some of the resonators include a temperature compensation layer, so that the series resonator and/or the parallel resonator become a temperature-compensated resonance with a certain temperature drift coefficient Device.
  • Figure 1 is a circuit diagram of a filter in the prior art
  • Fig. 2 is a comparative example, that is, a curve diagram of the insertion loss characteristic of the filter in the prior art and the impedance characteristic of the resonator;
  • Fig. 3 is a comparative example, that is, the corresponding insertion loss characteristic curve diagram of the filter in the prior art under different temperature environments;
  • FIG. 4 is a circuit diagram of the filter of the first embodiment in the embodiment of the present invention.
  • FIG. 5 is a schematic diagram of an FBAR resonator with a temperature compensation layer added in an embodiment of the present invention
  • Figure 6 is a comparison diagram of impedance characteristic curves of the resonator before and after adding a temperature compensation layer
  • FIG. 7 is a graph of the insertion loss characteristic of the filter and the impedance characteristic of the resonator according to the first embodiment of the present invention.
  • FIG. 8 is a comparison diagram of the insertion loss characteristics of the filters of the first embodiment of the present invention and the comparative example under normal temperature conditions;
  • FIG. 9 is a comparison diagram of the corresponding three-temperature characteristic curve diagram of the TCF resonator under the condition of zero temperature drift in the first embodiment of the present invention and the three-temperature characteristic curve of the comparative example;
  • Fig. 10 is an enlarged view of the circled area in Fig. 9;
  • FIG. 11 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention under the condition of zero temperature drift and the comparative example under the conditions of normal temperature and high temperature;
  • FIG. 12 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention with a positive 1MHz temperature drift and a comparative example under normal temperature and high temperature conditions;
  • Fig. 13 is a circuit diagram of a filter according to a second embodiment of the present invention.
  • 15 is a comparison diagram of the insertion loss characteristics of the second embodiment of the present invention and the comparative example under normal temperature conditions;
  • FIG. 17 is a graph of the insertion loss characteristic of the filter and the impedance characteristic of the resonator according to the third embodiment of the present invention.
  • 19 is a comparison diagram of the insertion loss characteristics under normal temperature conditions between the comparative example and the embodiment 1, the embodiment 2, and the embodiment 3 of the present invention.
  • FIG. 20 is a circuit diagram of the filter of the fourth embodiment in the embodiment of the present invention.
  • FIG. 21 is a circuit diagram of the filter of the fifth embodiment in the embodiment of the present invention.
  • FIG. 22 is a circuit diagram of the filter of the sixth example in the implementation manner of the present invention.
  • FIG. 23 is a circuit diagram of the filter of the seventh embodiment in the embodiment of the present invention.
  • Fig. 24 is a circuit diagram of the filter of the eighth example in the embodiment of the present invention.
  • FIG. 1 is a circuit diagram of a filter in the prior art, where T1 is the input terminal of the filter 100, T2 is the output terminal of the filter, and the input terminal T1 and the output terminal T2 are ports connected to the external signal of the filter .
  • T1 and the output terminal T2 there are a series of series-connected first resonators S11, S12, S13, and S14 at the position of the series path, which are connected in series with each other.
  • a series inductor L1 is connected in series; between the input terminal T2 and the series resonator S14, a series inductor L2 is connected in series.
  • One end of the parallel resonator P11 is connected to the node between the series resonators S11 and S12
  • one end of the parallel resonator P12 is connected to the node between the series resonators S12 and S13
  • the other ends of the parallel resonators P11 and P12 are connected to each other.
  • One end of the parallel inductor L3 is connected, and the other end of the parallel inductor L3 is grounded; one end of the parallel resonator P13 is connected to the node between the series resonators S13 and S14, and one end of the parallel resonator P14 is connected to the series resonator S14 and the series inductor L2
  • the nodes between are connected, the other ends of the parallel resonators P13 and P14 are connected to each other and connected to one end of the shunt inductor L4, and the other end of the shunt inductor L4 is grounded.
  • the series resonator frequencies of the series resonators S11, S12, S13, and S14 are fss1, fss2, fss3, and fss4, respectively, and the parallel resonance frequencies are fsp1, fsp2, fsp3, and fsp4; the series resonances of the parallel resonators P11, P12, P13, and P14
  • the frequency of the device is fps1, fps2, fps3, and fps4, and the parallel resonance frequency is fpp1, fpp2, fpp3, and fpp4.
  • the series resonator and the parallel resonator realize that the series resonant frequency is different from each other through different designs of the mass load (adjusting the area and thickness of the mass load, etc.).
  • Fig. 2 is a comparative example, that is, a curve diagram of the insertion loss characteristic of the filter in the prior art and the impedance characteristic of the resonator.
  • the series resonator and the parallel resonator work together to form the passband characteristic of the filter.
  • Filters using small Kt 2 resonators are easy to achieve good roll-off characteristics, but once the design indicators (bandwidth, insertion loss, out-of-band rejection, etc.) determine the Kt 2 of the resonator, the Kt 2 of the resonator is basically determined, so the filter bandwidth and filter Good roll-off characteristics are contradictory. It is difficult to achieve good roll-off characteristics in the design of wide-bandwidth filters under conventional architectures, and under the conditions that the resonator stack in common filters has been determined, the resonator structure can be changed , The Kt 2 change of the 50 Ohm resonator is only about ⁇ 0.5%, and the improvement of the filter roll-off characteristics is limited.
  • Fig. 3 is a comparative example, that is, the corresponding insertion loss characteristic curve diagram of the filter in the prior art under different temperature environments, where the curve with a triangle label is the insertion loss characteristic curve under an environment of 95 degrees Celsius, and the curve with a square label It is the insertion loss characteristic curve under a normal temperature of 25 degrees Celsius, and the curve with a circular label is the insertion loss characteristic curve under a -45 degrees Celsius environment.
  • the piezoelectric dielectric material and electrode material of the filter are all negative temperature coefficient materials (-25ppm/°C ⁇ -30ppm/°C), and the heat loss of the filter electrode increases under high temperature conditions, the insertion loss characteristic curve under high temperature conditions Compared with the normal temperature characteristic curve, the insertion loss will also drop when it moves to the low frequency direction. Compared with the normal temperature curve, the amplitude-frequency curve of the filter moves to the high frequency direction at low temperature, and the insertion loss becomes better.
  • the filter During operation, most of the energy of the passband signal is transmitted from the input port T1 to the output port T2 through the series resonator. The temperature of the series resonator will be higher than that of the parallel resonator. Therefore, under the same external environment, the frequency drift on the right side of the passband is greater than The amount of frequency drift on the left side of the passband.
  • FIG. 4 is a circuit diagram of the filter of the first embodiment of the embodiment of the present invention.
  • a series resonator in the filter 600 of this embodiment is replaced with a TCF resonance with a temperature compensation layer Resonator (temperature-compensated resonator); in this embodiment, the existing series resonator S12 is replaced with TCF.
  • the temperature compensation layer Resonator (temperature-compensated resonator)
  • the existing series resonator S12 is replaced with TCF.
  • FIG. 5 is a schematic diagram of an FBAR resonator with a temperature compensation layer added in an embodiment of the present invention.
  • 51 is a semiconductor substrate material
  • 56 is an air cavity obtained by etching
  • 52 is a piezoelectric film material
  • 54 is a top electrode
  • 55 is a temperature compensation layer.
  • the area selected by the dashed line is the overlapping area of the air cavity 56, the top electrode 34, the bottom electrode 33, the temperature compensation layer 55, and the piezoelectric layer 32 as the effective resonance area.
  • the material of the temperature compensation layer can be polysilicon, borophosphate glass (BSG), silicon dioxide (SiO2), chromium (Cr) or tellurium oxide (TeO(x)) and other materials.
  • BSG borophosphate glass
  • SiO2 silicon dioxide
  • Cr chromium
  • TeO(x) tellurium oxide
  • the bottom electrode pattern that was originally made once is made twice.
  • the material of the temperature compensation layer is generally silicon dioxide, and its pattern is smaller than that of the bottom electrode pattern. .
  • This manufacturing method can make the temperature compensation layer completely wrapped by the bottom electrode, thereby effectively protecting it from other manufacturing processes. Destroy;
  • the performance (loss characteristics) of the resonator is greatly deteriorated due to the parasitic capacitance composed of the three.
  • Fig. 6 is a comparison diagram of impedance characteristic curves of the resonator before and after adding a temperature compensation layer.
  • the Kt 2 of the resonator is reduced from 6.0% to 3.0%, Rs is increased from 0.8 ohms to 1.6 ohms, and Rp is reduced from 2800 ohms to 1500 ohms.
  • it resonates
  • the temperature coefficient of the device has changed from -25ppm/°C ⁇ -30ppm/°C to about 0ppm/°C ⁇ 25ppm/°C. It can be seen that with the addition of the temperature compensation layer, Kt 2 will be about half of the original, Rs will be increased to about 2 times, and Rp will be reduced to about half.
  • the increase in the loss of the resonator will also lead to a certain extent. Decrease in Q value.
  • Fig. 7 is a graph of the insertion loss characteristic and the impedance characteristic of the resonator of the first embodiment of the present invention.
  • the series resonant frequency and parallel resonant frequency of the TCF resonator are fss_tcf and fsp_tcf, respectively, and the series resonant frequency and parallel resonant frequency of the S11 resonator
  • the resonant frequencies are fss_11, fsp_11
  • the series resonant frequency and parallel resonant frequency of the S13 resonator are fss_13, fsp_13
  • the series resonant frequency and parallel resonant frequency of the S14 resonator are fss_14 and fsp_14.
  • the parallel resonance frequency fsp_tcf has the following relationship with the parallel resonance frequencies fsp_11, fsp_13 and fsp_14 of ordinary resonators S11, S13 and S14:
  • delta_FR is the frequency change of the corresponding frequency at -20dB on the right side of the filter passband under high and normal temperature conditions.
  • the relationship among fss_tcf, fss_11, fss_13, and fss_14 is not limited.
  • Fig. 8 is a comparison diagram of the insertion loss characteristics of the filters of the first embodiment of the present invention and the comparative example under normal temperature conditions.
  • a series resonator in the first embodiment is a TCF resonator with a temperature compensation layer added.
  • the thickness of the temperature compensation layer satisfies the following conditions: the positive temperature drift effect produced by the temperature compensation layer can fully or partially offset the negative temperature drift effects of all other layers, so that the TCF resonator becomes a temperature compensation resonance with a temperature drift coefficient equal to 0ppm/°C
  • the positive temperature drift effect of the temperature compensation layer is greater than the negative temperature drift effect of all other layers, so that the TCF resonator becomes a temperature compensation resonator with a positive temperature drift coefficient; because the TCF resonator is added in the first embodiment ,
  • the TCF resonator has a small Kt 2 characteristic, and the first embodiment can achieve a large improvement in the roll-off characteristic on the right side of the passband without affecting the bandwidth of
  • Fig. 9 is a comparison diagram of the three-temperature characteristic curve corresponding to the TCF resonator under the zero temperature drift condition of the first embodiment of the present invention and the three-temperature characteristic curve of the comparative example.
  • the TCF resonator corresponds under the zero temperature drift condition
  • the three-temperature characteristic curve (low temperature: -45 degrees Celsius, normal temperature: 25 degrees Celsius, high temperature: 95 degrees Celsius) is a solid line
  • the three-temperature characteristic curve of the comparative example is a dashed line.
  • the comparison between the two shows that the right side of the pass band of the first embodiment The temperature drift characteristics have been greatly improved.
  • Figure 10 is an enlarged view of the circled area in Figure 9.
  • the temperature drift on the right side of the passband of the first embodiment is 0.5MHz under high temperature conditions, which is greatly improved compared to the 2MHz temperature drift of the comparative example. At the same time, the temperature drift is at 2150MHz under high temperature conditions. Compared with the comparative example, the insertion loss of the first embodiment is increased by about 3dB.
  • FIG. 11 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention under the condition of zero temperature drift and the comparative example under the conditions of normal temperature and high temperature.
  • FIG. 12 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention with a positive 1MHz temperature drift and a comparative example under normal temperature and high temperature conditions. It can be seen from the figure that the first embodiment achieves the zero temperature drift characteristic on the right side of the filter passband. That is, the reasonable design of the thickness of the temperature compensation layer of the TCF resonator realizes the zero temperature drift characteristic of the filter.
  • FIG. 13 is a circuit diagram of the filter of the second embodiment of the present invention.
  • one of the series resonators in the filter 700 in the second embodiment is replaced with a TCF resonator with a temperature compensation layer (Temperature Compensated Resonator):
  • the existing series resonator S13 is replaced with TCF.
  • the series resonance frequency and parallel resonance frequency of the TCF resonator are fss_tcf and fsp_tcf respectively, and the series resonance frequency and parallel resonance frequency of the S11 resonator are The resonant frequencies are fss_11, fsp_11, the series resonant frequency and parallel resonant frequency of the S12 resonator are fss_12, fsp_12, and the series resonant frequency and parallel resonant frequency of the S14 resonator are fss_14 and fsp_14, respectively.
  • the parallel resonance frequency fsp_tcf has the following relationship with the parallel resonance frequencies fsp_11, fsp_12 and fsp_14 of ordinary resonators S11, S12 and S14:
  • fss_tcf fss_11, fss_13, and fss_14 is not limited.
  • FIG. 15 is a comparison diagram of the insertion loss characteristics of the second embodiment of the present invention and the comparative example under normal temperature conditions. As shown in FIG. 15, the same as the first embodiment, because the TCF resonator is added in the second embodiment, the TCF resonates The filter has a small Kt 2 characteristic, and the second embodiment can achieve a greater improvement in the roll-off characteristic on the right side of the passband without affecting the bandwidth of the filter.
  • TCF1 resonator and TCF2 resonator are replaced with the series resonators S12 and S13 in the comparative example, and the TCF1 resonator and TCF2 resonance are realized through different designs of the temperature compensation layer thickness. Change of temperature drift characteristics of the device.
  • FIG. 17 is a graph of the insertion loss characteristic and the impedance characteristic of the resonator of the third embodiment of the present invention. As shown in FIG. 17, the series resonance frequency and parallel resonance frequency of the TCF1 resonator are fss_tcf1, fsp_tcf1, and TCF2 resonators, respectively.
  • the series resonant frequency and parallel resonant frequency are fss_tcf2, fsp_tcf2, the series resonant frequency and parallel resonant frequency of S11 resonator are fss_11, fsp_11, and the series resonant frequency and parallel resonant frequency of S14 resonator are fss_14 and fsp_14, respectively.
  • the parallel resonance frequencies fsp_tcf1 and fsp_tcf2 of TCF1 and TCF2 resonators have the following relationship with the parallel resonance frequencies fsp_11 and fsp_14 of ordinary series resonators S11 and S14:
  • fss_tcf1, fss_tcf2, fss_11, and fss_14 is not limited.
  • Figure 18 is a comparison diagram of the insertion loss characteristics of the third embodiment of the present invention and the comparative example under normal temperature conditions. As shown in Figure 18, the same as the first and second embodiments, two are added to the series branch. The TCF resonator and the TCF resonator have a small Kt2 characteristic. Therefore, the third embodiment can achieve a large improvement in the roll-off characteristic on the right side of the passband without affecting the bandwidth of the filter.
  • FIG. 19 is a comparison diagram of the insertion loss characteristics of the comparative example and the first embodiment, the second embodiment, and the third embodiment of the present invention under normal temperature conditions.
  • One of the series resonators is a TCF resonator, and two of the series resonators in the third embodiment are TCF resonators.
  • the Kt 2 of the TCF resonator is reduced compared with the ordinary resonator, Rs is about twice that of the ordinary resonator, and Rp is reduced to about half of the ordinary resonator.
  • the loss of the resonator The increase leads to a decrease in the Q value, so the more TCF resonators included in the filter, the worse the passband insertion loss characteristics, but the better the temperature drift characteristics and roll-off characteristics, so the design process should be based on the design indicators It is required to balance the temperature drift characteristics, roll-off characteristics and passband insertion loss characteristics.
  • FIG. 20 is a circuit diagram of the filter of the fourth embodiment of the embodiment of the present invention.
  • the first-stage series circuit of the filter 900 of this embodiment includes two resonators, which are the existing ones.
  • one of the two resonators in the series circuit of the same stage is set as an ordinary series resonator, and the other is set as a temperature-compensated resonator.
  • the structure is not limited to this.
  • the two resonators are temperature-compensated resonators; by setting the temperature-compensated resonator, and by designing the thickness of the temperature-compensating layer, different temperature drift characteristics of the TCF resonator can be realized.
  • FIG. 21 is a circuit diagram of the filter of the fifth embodiment of the embodiment of the present invention.
  • one of the parallel resonators in the filter 110 of this embodiment is replaced with a temperature-compensated resonator TCF;
  • the temperature compensation resonator, and through the different design of the temperature compensation layer thickness, realizes the different temperature drift characteristics of the TCF resonator.
  • the series resonance frequency and parallel resonance frequency of the P11 resonator are fps_11 and fpp_11, respectively, the series resonance frequency and parallel resonance frequency of the P13 resonator are fps_13, fpp_13, respectively, and the series resonance frequency and parallel resonance frequency of the P14 resonator are fps_14, fpp_14, respectively.
  • the series resonance frequency and parallel resonance frequency of the TCF resonator are fps_tcf and fpp_tcf respectively.
  • the parallel resonance frequency fpp_tcf of the TCF resonator and the parallel resonance frequencies fpp_11, fpp_13 and fpp_14 of the ordinary resonators P11, P13 and P14 exist as follows relation:
  • delta_FL is the frequency change of the corresponding frequency at -20dB on the right and left side of the filter passband under high and normal temperature conditions.
  • the relationship between fps_11, fps_12, fps_tcf, and fps_14 is not limited.
  • FIG. 22 is a circuit diagram of the filter of the sixth embodiment of the embodiment of the present invention.
  • the two parallel resonators in the filter 120 of this embodiment are replaced with temperature-compensated resonators, respectively TCF1 and TCF2;
  • TCF1 and TCF2 temperature-compensated resonators
  • the series resonance frequency and parallel resonance frequency of the P11 resonator are fps_11 and fpp_11, respectively.
  • the series resonance frequency and parallel resonance frequency of the P14 resonator are fps_14 and fpp_14, respectively.
  • the series resonance frequency and parallel resonance frequency of the TCF1 resonator are fps_tcf1, fpp_tcf1, respectively.
  • the series resonance frequency and parallel resonance frequency of the TCF2 resonator are fps_tcf2 and fpp_tcf2, respectively.
  • the parallel resonance frequencies fpp_tcf1 and fpp_tcf2 of the TCF resonators have the following relationship with the parallel resonance frequencies fpp_11 and fpp_14 of the ordinary resonators P11 and P14:
  • delta_FL is the frequency change of the corresponding frequency at -20dB on the right and left side of the filter passband under high and normal temperature conditions.
  • the relationship between fps_11, fps_tcf1, fps_tcf2, and fps_14 is not limited.
  • FIG. 23 is a circuit diagram of the filter of the seventh embodiment in the embodiment of the present invention.
  • the one-stage parallel circuit of the filter 900 of this embodiment includes two resonators, each of which is temperature compensated.
  • one of the two resonators in the parallel circuit of the same level is set as an ordinary parallel resonator, and the other is set as a temperature-compensated resonator.
  • the structure is not limited to this, but can also
  • the two resonators are both set as temperature-compensated resonators; by setting the temperature-compensated resonator, and through different designs of the thickness of the temperature-compensated layer, different temperature drift characteristics of the TCF resonator are realized.
  • Fig. 24 is a circuit diagram of the filter of the eighth embodiment of the embodiment of the present invention.
  • a temperature-compensated resonator TCF1 is provided in the series branch, which is connected in parallel
  • a temperature-compensated resonator TCF2 is set in the branch, that is, a temperature-compensated resonator is set in both the series branch and the parallel branch; in this embodiment, the temperature-compensated resonator is set, and the thickness of the temperature-compensated layer is designed differently. , To achieve different temperature drift characteristics of the TCF resonator.

Abstract

Disclosed are a filter (600), a duplexer, a high-frequency front-end circuit, and a communication apparatus. The filter (600) comprises a plurality of resonators connected in series (S11, S12, S13, S14) and a plurality of resonators connected in parallel (P11, P12, P13, P14), wherein some of the resonators connected in series (S11, S12, S13, S14) and/or some of the resonators connected in parallel (P11, P12, P13, P14) are temperature compensation resonators (TCF); and the temperature compensation resonators (TCF) each comprise a temperature compensation layer (55). A high roll-off requirement and a good temperature characteristic of the filter (600) are realized without affecting the bandwidth of the filter (600), and the minimum degradation of the insertion loss of the filter (600) is achieved while the temperature drift characteristic of the filter (600) is improved.

Description

一种滤波器、双工器、高频前端电路及通信装置Filter, duplexer, high-frequency front-end circuit and communication device 技术领域Technical field
本发明涉及滤波器技术领域,特别地涉及一种滤波器、双工器、高频前端电路及通信装置。The present invention relates to the technical field of filters, in particular to a filter, a duplexer, a high-frequency front-end circuit and a communication device.
背景技术Background technique
随着无线通讯应用的发展,人们对于数据传输速率的要求越来越高,与数据传输速率相对应的是频谱资源的高利用率和频谱的复杂化。通信协议的复杂化对于射频系统的各种性能提出了严格的要求,在射频前端模块,射频滤波器起着至关重要的作用,它可以将带外干扰和噪声滤除掉以满足射频系统和通信协议对于信噪比的要求。With the development of wireless communication applications, people have higher and higher requirements for data transmission rates. Corresponding to the data transmission rate is the high utilization of spectrum resources and the complexity of the spectrum. The complexity of the communication protocol puts forward strict requirements on the various performance of the radio frequency system. In the radio frequency front-end module, the radio frequency filter plays a vital role. It can filter out the out-of-band interference and noise to meet the requirements of the radio frequency system and The requirements of the communication protocol for the signal to noise ratio.
射频滤波器主要应用于无线通信系统,例如,基站的射频前端,移动电话,电脑,卫星通讯,雷达,电子对抗系统等等。射频滤波器的主要性能指标为插损、带外抑制、功率容量、线性度、器件尺寸和温漂特性。良好的滤波器性能可以在一定程度上提高通信系统的数据传输速率、寿命及可靠性。所以对于无线通信系统高性能、简单化滤波器的设计是至关重要的。目前,能够满足通讯终端使用的小尺寸滤波类器件主要是压电声波滤波器,构成此类声波滤波器的谐振器主要包括:FBAR(Film Bulk Acoustic Resonator,薄膜体声波谐振器),SMR(Solidly Mounted Resonator,固态装配谐振器)和SAW(Surface Acoustic Wave,表面声波谐振器)。其中基于体声波原理FBAR和SMR制造的滤波器(统称为BAW,体声波谐振器),相比基于表面声波原理SAW制造的滤波器,具有更低的插入损耗,更快的滚降特性等优势。Radio frequency filters are mainly used in wireless communication systems, such as radio frequency front-ends of base stations, mobile phones, computers, satellite communications, radars, electronic countermeasures systems, and so on. The main performance indicators of radio frequency filters are insertion loss, out-of-band suppression, power capacity, linearity, device size and temperature drift characteristics. Good filter performance can improve the data transmission rate, life and reliability of the communication system to a certain extent. Therefore, the design of high-performance and simplified filters for wireless communication systems is very important. At present, the small-size filter devices that can meet the needs of communication terminals are mainly piezoelectric acoustic wave filters. The resonators that constitute this type of acoustic wave filter mainly include: FBAR (Film Bulk Acoustic Resonator), SMR (Solidly Mounted Resonator, solid-state assembly resonator) and SAW (Surface Acoustic Wave, surface acoustic wave resonator). Among them, the filters manufactured based on the principle of bulk acoustic wave FBAR and SMR (collectively referred to as BAW, bulk acoustic wave resonator) have the advantages of lower insertion loss and faster roll-off characteristics compared to filters manufactured based on the principle of surface acoustic wave SAW. .
由于构成声波谐振器的压电材料和金属材料,都具有负温度系数的特点,即当温度增加时,谐振器的谐振频率均会以一定比例向低频 方向移动(温度漂移)。一般情况下,SAW的温度系数为-35ppm/℃~-50ppm/℃,BAW的温度系数为-25ppm/℃~-30ppm/℃。虽然BAW相比SAW具有明显的温度漂移方面的性能优势,但是在一些特殊的应用场景下,这样的温度系数,仍然会对应用了滤波器的射频收发系统的性能产生不利影响,例如一个滤波器定义了从通带边缘到带外抑制的频率可变范围,那么温度系数的存在,就使得在考虑了温度漂移频率之后,这个可变范围变小,从而大大增加了滤波器的设计难度。Because the piezoelectric materials and metal materials that constitute the acoustic wave resonator both have the characteristics of negative temperature coefficient, that is, when the temperature increases, the resonant frequency of the resonator will move in a certain proportion to the low-frequency direction (temperature drift). In general, the temperature coefficient of SAW is -35ppm/℃~-50ppm/℃, and the temperature coefficient of BAW is -25ppm/℃~-30ppm/℃. Although BAW has obvious performance advantages in terms of temperature drift compared to SAW, in some special application scenarios, such a temperature coefficient will still have an adverse effect on the performance of the RF transceiver system with a filter, such as a filter The variable frequency range from the edge of the passband to the out-of-band suppression is defined, so the existence of the temperature coefficient makes this variable range smaller after considering the temperature drift frequency, which greatly increases the difficulty of filter design.
为了解决滤波器普遍存在的温度漂移问题,一个常见的解决方法是在谐振器中加入可以实现温度补偿效果的材料。对于声波谐振器,这种温度补偿材料通常为二氧化硅,因为二氧化硅具有正温度系数,并且可以通过一般的工艺制程制作,也同时具备低廉的价格,适合产品大批量生产的应用;温度补偿层的材料也可以为多晶硅、硼磷酸盐玻璃(BSG)、铬(Cr)或碲氧化物(TeO(x))等正温度系数材料;温度补偿层的厚度范围一般在
Figure PCTCN2020141264-appb-000001
(埃)至
Figure PCTCN2020141264-appb-000002
之间。这类加了温度补偿的材料的谐振器,也被称为频率温度系数(Temperature Coefficient of Frequency,TCF)谐振器,是温度补偿滤波器的组成单元。
In order to solve the common temperature drift problem of the filter, a common solution is to add a material that can realize the temperature compensation effect in the resonator. For acoustic wave resonators, this temperature compensation material is usually silicon dioxide, because silicon dioxide has a positive temperature coefficient and can be made through general technological processes. At the same time, it has a low price and is suitable for mass production applications; The material of the compensation layer can also be a positive temperature coefficient material such as polysilicon, borophosphate glass (BSG), chromium (Cr) or tellurium oxide (TeO(x)); the thickness of the temperature compensation layer is generally in the range
Figure PCTCN2020141264-appb-000001
(Angstrom) to
Figure PCTCN2020141264-appb-000002
between. This type of resonator with temperature-compensated materials is also called a temperature coefficient of frequency (Temperature Coefficient of Frequency, TCF) resonator, which is a component unit of the temperature compensation filter.
但是,在谐振器引入上述温度补偿层后,谐振器的性能变差,主要体现在谐振器损耗的增大,以及机电耦合系数(Kt 2)的变小。谐振器的损耗直接影响滤波器的通带插损特性,从而增大射频链路中的损耗,恶化射频前端的收发性能。机电耦合系数变小,在一定频率条件下谐振器的串联谐振频率和并联谐振频率之间的频率差减小,滤波器的滚降特性有可能改善,但同时滤波器的带宽也会变窄,大多数通信系统中,滤波器的带宽是根据系统要求提出的,带宽并不能无限制的缩窄。 However, after the above-mentioned temperature compensation layer is introduced into the resonator, the performance of the resonator deteriorates, which is mainly reflected in the increase of the loss of the resonator and the decrease of the electromechanical coupling coefficient (Kt 2 ). The loss of the resonator directly affects the passband insertion loss characteristics of the filter, thereby increasing the loss in the RF link and deteriorating the transceiver performance of the RF front-end. The electromechanical coupling coefficient becomes smaller. Under certain frequency conditions, the frequency difference between the series resonance frequency and the parallel resonance frequency of the resonator is reduced. The roll-off characteristics of the filter may be improved, but at the same time the bandwidth of the filter will also be narrowed. In most communication systems, the bandwidth of the filter is proposed according to the system requirements, and the bandwidth cannot be narrowed indefinitely.
发明内容Summary of the invention
有鉴于此,本发明的主要目的是提供一种滤波器、双工器、高频 前端电路及通信装置,在具备一定带宽要求和插损要求的前提下,实现滤波器的高滚降要求和良好的温度特性。In view of this, the main purpose of the present invention is to provide a filter, a duplexer, a high-frequency front-end circuit, and a communication device that can achieve the high roll-off requirements and requirements of the filter under the premise of certain bandwidth requirements and insertion loss requirements. Good temperature characteristics.
为实现上述目的,根据本发明的一个方面,提供了一种滤波器,包括多个串联谐振器和多个并联谐振器,部分串联谐振器和/或部分并联谐振器为温补谐振器,该温补谐振器包括温度补偿层。In order to achieve the above objective, according to one aspect of the present invention, a filter is provided, which includes a plurality of series resonators and a plurality of parallel resonators, and the partial series resonators and/or the partial parallel resonators are temperature-compensated resonators. The temperature compensated resonator includes a temperature compensation layer.
可选地,串联支路包括多级串联电路,至少一级串联电路中全部或部分串联谐振器为温补谐振器;并且/或者,并联支路包括多级并联电路,其中,至少一级并联电路中全部或部分并联谐振器为温补谐振器。Optionally, the series branch includes a multi-stage series circuit, and all or part of the series resonators in the at least one-stage series circuit are temperature-compensated resonators; and/or, the parallel branch includes a multi-stage parallel circuit, wherein at least one stage is connected in parallel All or part of the parallel resonators in the circuit are temperature-compensated resonators.
可选地,串联支路中温补谐振器的数量为1,其频率与其他串联谐振器频率关系如下:Optionally, the number of temperature-compensated resonators in the series branch is 1, and the relationship between its frequency and the frequencies of other series resonators is as follows:
Min(fsp_11、fsp_12、fsp_13……fsp_1n)-fsp_tcf≥delta_FRMin(fsp_11, fsp_12, fsp_13……fsp_1n)-fsp_tcf≥delta_FR
其中,fsp_11为串联谐振器S11的并联谐振频率,fsp_12为串联谐振器S12的并联谐振频率,fsp_13为串联谐振器S13的并联谐振频率……fsp_1n为串联谐振器S1n的并联谐振频率,fsp_tcf为温补谐振器TCF的并联谐振频率;delta_FR为滤波器通带右侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fsp_11 is the parallel resonant frequency of series resonator S11, fsp_12 is the parallel resonant frequency of series resonator S12, fsp_13 is the parallel resonant frequency of series resonator S13...fsp_1n is the parallel resonant frequency of series resonator S1n, fsp_tcf is temperature Complement the parallel resonant frequency of the resonator TCF; delta_FR is the frequency change of the corresponding frequency at -20dB on the right side of the filter passband under high and normal temperature conditions.
可选地,串联支路中温补谐振器的数量大于等于2,常温情况下,其频率与其他串联谐振器频率关系如下:Optionally, the number of temperature-compensated resonators in the series branch is greater than or equal to 2. Under normal temperature conditions, the relationship between its frequency and the frequencies of other series resonators is as follows:
Min(fsp_11、fsp_12、fsp_13……fsp_1n)-Max(fsp_tcf1、fsp_tcf2……fsp_tcfn)≥delta_FRMin(fsp_11, fsp_12, fsp_13……fsp_1n)-Max(fsp_tcf1, fsp_tcf2……fsp_tcfn)≥delta_FR
其中,fsp_11为串联谐振器S11的并联谐振频率,fsp_12为串联谐振器S12的并联谐振频率,fsp_13为串联谐振器S13的并联谐振频率……fsp_1n为串联谐振器S1n的并联谐振频率;fsp_tcf1为温补谐振器TCF1的并联谐振频率,fsp_tcf2为温补谐振器TCF2的并联谐振频率……fsp_tcfn为温补谐振器TCFn的并联谐振频率;delta_FR为滤波 器通带右侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fsp_11 is the parallel resonant frequency of series resonator S11, fsp_12 is the parallel resonant frequency of series resonator S12, fsp_13 is the parallel resonant frequency of series resonator S13...fsp_1n is the parallel resonant frequency of series resonator S1n; fsp_tcf1 is temperature The parallel resonant frequency of the compensation resonator TCF1, fsp_tcf2 is the parallel resonant frequency of the temperature-compensated resonator TCF2...fsp_tcfn is the parallel resonant frequency of the temperature-compensated resonator TCFn; delta_FR is the corresponding frequency at -20dB on the right side of the filter passband at high temperature and The amount of frequency change under normal temperature conditions.
可选地,并联支路中,温补谐振器的数量为1,常温情况下,其频率与并联谐振频率关系如下:Optionally, in the parallel branch, the number of temperature-compensated resonators is 1. Under normal temperature, the relationship between its frequency and the parallel resonance frequency is as follows:
Min(fpp_11、fpp_12、fpp_13……fpp_1n)-fpp_tcf≥delta_FL;Min(fpp_11, fpp_12, fpp_13……fpp_1n)-fpp_tcf≥delta_FL;
其中,fpp_11为并联谐振器P11的并联谐振频率,fpp_12为并联谐振器P12的并联谐振频率;fpp_13为并联谐振器P13的并联谐振频率……fpp_1n为并联谐振器P1n的并联谐振频率,fpp_tcf为温补谐振器TCF的并联谐振频率;delta_FL为滤波器通带左侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fpp_11 is the parallel resonant frequency of the parallel resonator P11, fpp_12 is the parallel resonant frequency of the parallel resonator P12; fpp_13 is the parallel resonant frequency of the parallel resonator P13...fpp_1n is the parallel resonant frequency of the parallel resonator P1n, fpp_tcf is the temperature Compensate the parallel resonant frequency of the resonator TCF; delta_FL is the frequency change of the corresponding frequency at -20dB on the left side of the filter passband under high and normal temperature conditions.
可选地,并联支路中温补谐振器数量大于等于2,常温情况下,其频率与并联谐振频率关系如下;Optionally, the number of temperature-compensated resonators in the parallel branch circuit is greater than or equal to 2. Under normal temperature conditions, the relationship between their frequency and the parallel resonance frequency is as follows;
Min(fpp_11、fpp_12、fpp_13……fpp_1n)-Max(fpp_tcf1、fpp_tcf2……fpp_tcfn)≥delta_FLMin(fpp_11, fpp_12, fpp_13……fpp_1n)-Max(fpp_tcf1, fpp_tcf2……fpp_tcfn)≥delta_FL
其中,fpp_11为并联谐振器P11的并联谐振频率,fpp_12为并联谐振器S12的并联谐振频率,fpp_13为并联谐振器P13的并联谐振频率……fpp_1n为并联谐振器P1n的并联谐振频率;fpp_tcf1为温补谐振器TCF1的并联谐振频率,fpp_tcf2为温补谐振器TCF2的并联谐振频率……fpp_tcfn为温补谐振器TCFn的并联谐振频率;delta_FL为滤波器通带左侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fpp_11 is the parallel resonant frequency of the parallel resonator P11, fpp_12 is the parallel resonant frequency of the parallel resonator S12, fpp_13 is the parallel resonant frequency of the parallel resonator P13...fpp_1n is the parallel resonant frequency of the parallel resonator P1n; fpp_tcf1 is the temperature The parallel resonant frequency of the compensation resonator TCF1, fpp_tcf2 is the parallel resonant frequency of the temperature-compensated resonator TCF2...fpp_tcfn is the parallel resonant frequency of the temperature-compensated resonator TCFn; delta_FL is the corresponding frequency at the left -20dB of the filter passband at high temperature and The amount of frequency change under normal temperature conditions.
可选地,所述温补谐振器具有正温漂系数,且其正温漂系数大小为未具有温补层的谐振器的温漂系数的大小的0至0.5倍。Optionally, the temperature compensation resonator has a positive temperature drift coefficient, and the magnitude of the positive temperature drift coefficient is 0 to 0.5 times the magnitude of the temperature drift coefficient of the resonator without a temperature compensation layer.
可选地,所述温补谐振器的有效机电耦合系数小于未具有温补层的谐振器的有效机电耦合系数。Optionally, the effective electromechanical coupling coefficient of the temperature-compensated resonator is smaller than the effective electromechanical coupling coefficient of the resonator without a temperature-compensated layer.
本发明的另一个方面,提供了一种双工器,包括上述滤波器。Another aspect of the present invention provides a duplexer including the above-mentioned filter.
本发明的又一个方面,提供了一种高频前端电路,包括上述滤波器。In yet another aspect of the present invention, a high-frequency front-end circuit is provided, including the above-mentioned filter.
本发明的再一个方面,提供了一种通信装置,包括上述滤波器。In yet another aspect of the present invention, there is provided a communication device including the above-mentioned filter.
根据本发明的技术方案,多个串联谐振器和多个并联谐振器中,部分谐振器中包括温度补偿层,使得该串联谐振器和/或并联谐振器成为具有一定温漂系数的温补谐振器。According to the technical solution of the present invention, among the plurality of series resonators and the plurality of parallel resonators, some of the resonators include a temperature compensation layer, so that the series resonator and/or the parallel resonator become a temperature-compensated resonance with a certain temperature drift coefficient Device.
与现有的普通滤波器或谐振器全部为温补谐振器的滤波器相比,具有以下优点:1、不影响滤波器的带宽;2、温补谐振器的小Kt 2特性可以有效改善滤波器通带两侧的滚降特性;3、通过对温补谐振器的温补层厚度的设计,可以极大的改善滤波器的温漂特性甚至可以实现滤波器的零温漂;4、由于温补谐振器的损耗相对于普通谐振器的损耗更大,滤波器中引入温补谐振器的数量越多,滤波器的插损就会越差,通过滤波器中局部温补谐振器的设计,在改善滤波器温漂特性的同时,实现了滤波器插损的最小恶化。 Compared with the existing ordinary filters or filters in which all resonators are temperature-compensated resonators, it has the following advantages: 1. Does not affect the bandwidth of the filter; 2. The small Kt 2 characteristic of the temperature-compensated resonator can effectively improve the filtering The roll-off characteristics on both sides of the pass band of the filter; 3. By designing the thickness of the temperature compensation layer of the temperature compensation resonator, the temperature drift characteristics of the filter can be greatly improved and even the zero temperature drift of the filter can be realized; 4. The loss of temperature-compensated resonators is greater than that of ordinary resonators. The more temperature-compensated resonators are introduced into the filter, the worse the insertion loss of the filter will be. Through the design of local temperature-compensated resonators in the filter , While improving the temperature drift characteristics of the filter, the minimum deterioration of the filter insertion loss is realized.
附图说明Description of the drawings
为了说明而非限制的目的,现在将根据本发明的优选实施例、特别是参考附图来描述本发明,其中:For purposes of illustration and not limitation, the present invention will now be described according to preferred embodiments of the present invention, particularly with reference to the accompanying drawings, in which:
图1为现有技术中的滤波器的电路图;Figure 1 is a circuit diagram of a filter in the prior art;
图2为对比例即现有技术中的滤波器的插损特性及谐振器的阻抗特性曲线图;Fig. 2 is a comparative example, that is, a curve diagram of the insertion loss characteristic of the filter in the prior art and the impedance characteristic of the resonator;
图3为对比例即现有技术中的滤波器在不同温度环境下对应的插损特性曲线图;Fig. 3 is a comparative example, that is, the corresponding insertion loss characteristic curve diagram of the filter in the prior art under different temperature environments;
图4为本发明实施方式中第一实施例的滤波器的电路图;FIG. 4 is a circuit diagram of the filter of the first embodiment in the embodiment of the present invention;
图5为本发明实施方式中添加了温度补偿层的FBAR谐振器的示意图;5 is a schematic diagram of an FBAR resonator with a temperature compensation layer added in an embodiment of the present invention;
图6是加温度补偿层前后的谐振器阻抗特性曲线对比图;Figure 6 is a comparison diagram of impedance characteristic curves of the resonator before and after adding a temperature compensation layer;
图7为本发明第一实施例的滤波器插损特性及谐振器阻抗特性的曲线图;FIG. 7 is a graph of the insertion loss characteristic of the filter and the impedance characteristic of the resonator according to the first embodiment of the present invention;
图8为本发明第一实施例与对比例的滤波器在常温条件下的插损特性对比图;8 is a comparison diagram of the insertion loss characteristics of the filters of the first embodiment of the present invention and the comparative example under normal temperature conditions;
图9为本发明第一实施例中TCF谐振器0温漂条件下对应的三温特性曲线图与对比例三温特性曲线对比图;FIG. 9 is a comparison diagram of the corresponding three-temperature characteristic curve diagram of the TCF resonator under the condition of zero temperature drift in the first embodiment of the present invention and the three-temperature characteristic curve of the comparative example;
图10为图9画圈区域的放大图;Fig. 10 is an enlarged view of the circled area in Fig. 9;
图11为本发明第一实施例中TCF谐振器0温漂条件下与对比例在常温和高温条件下的插损特性对比图;11 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention under the condition of zero temperature drift and the comparative example under the conditions of normal temperature and high temperature;
图12为本发明第一实施例中TCF谐振器正1MHz温漂与对比例在常温和高温条件下的插损特性对比图;12 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention with a positive 1MHz temperature drift and a comparative example under normal temperature and high temperature conditions;
图13为本发明第二实施例的滤波器的电路图;Fig. 13 is a circuit diagram of a filter according to a second embodiment of the present invention;
图14为本发明第二实施例的滤波器插损特性及谐振器阻抗特性的曲线图;14 is a graph of the insertion loss characteristic of the filter and the impedance characteristic of the resonator according to the second embodiment of the present invention;
图15为本发明第二实施例与对比例在常温条件下的插损特性对比图;15 is a comparison diagram of the insertion loss characteristics of the second embodiment of the present invention and the comparative example under normal temperature conditions;
图16为本发明第三实施例对应的电路图;16 is a circuit diagram corresponding to the third embodiment of the present invention;
图17为本发明第三实施例的滤波器插损特性及谐振器阻抗特性的曲线图;FIG. 17 is a graph of the insertion loss characteristic of the filter and the impedance characteristic of the resonator according to the third embodiment of the present invention;
图18为本发明第三实施例与对比例在常温条件下的插损特性对比图;18 is a comparison diagram of the insertion loss characteristics of the third embodiment of the present invention and the comparative example under normal temperature conditions;
图19为对比例与本发明实施例1、实施例2、实施例3的常温条件下的插损特性对比图;19 is a comparison diagram of the insertion loss characteristics under normal temperature conditions between the comparative example and the embodiment 1, the embodiment 2, and the embodiment 3 of the present invention;
图20为本发明实施方式中第四实施例的滤波器的电路图;FIG. 20 is a circuit diagram of the filter of the fourth embodiment in the embodiment of the present invention;
图21为本发明实施方式中第五实施例的滤波器的电路图;FIG. 21 is a circuit diagram of the filter of the fifth embodiment in the embodiment of the present invention;
图22为本发明实施方式中第六实施例的滤波器的电路图;FIG. 22 is a circuit diagram of the filter of the sixth example in the implementation manner of the present invention; FIG.
图23为本发明实施方式中第七实施例的滤波器的电路图;FIG. 23 is a circuit diagram of the filter of the seventh embodiment in the embodiment of the present invention;
图24为本发明实施方式中第八实施例的滤波器的电路图。Fig. 24 is a circuit diagram of the filter of the eighth example in the embodiment of the present invention.
具体实施方式Detailed ways
图1为现有技术中的滤波器的电路图,其中,T1为滤波器100的输入端子,T2为滤波器的输出端子,该输入端子T1和输出端子T2为连接至滤波器的外部信号的端口。在输入端子T1和输出端子T2之间,有一系列位于串联通路位置上的串联第一谐振器S11、S12、S13和S14彼此串联相接。在输入端子T1和串联谐振器S11之间,串联连接一串联电感L1;在输入端子T2和串联谐振器S14之间,串联连接一串联电感L2。并联谐振器P11的一端与串联谐振器S11与S12之间的节点相连,并联谐振器P12的一端与串联谐振器S12与S13之间的节点相连,并联谐振器P11及P12的另一端彼此相连并与并联电感L3的一端相连,并联电感L3的另一端接地;并联谐振器P13的一端与串联谐振器S13与S14之间的节点相连,并联谐振器P14的一端与串联谐振器S14与串联电感L2之间的节点相连,并联谐振器P13及P14的另一端彼此相连并与并联电感L4的一端相连,并联电感L4的另一端接地。FIG. 1 is a circuit diagram of a filter in the prior art, where T1 is the input terminal of the filter 100, T2 is the output terminal of the filter, and the input terminal T1 and the output terminal T2 are ports connected to the external signal of the filter . Between the input terminal T1 and the output terminal T2, there are a series of series-connected first resonators S11, S12, S13, and S14 at the position of the series path, which are connected in series with each other. Between the input terminal T1 and the series resonator S11, a series inductor L1 is connected in series; between the input terminal T2 and the series resonator S14, a series inductor L2 is connected in series. One end of the parallel resonator P11 is connected to the node between the series resonators S11 and S12, one end of the parallel resonator P12 is connected to the node between the series resonators S12 and S13, and the other ends of the parallel resonators P11 and P12 are connected to each other. One end of the parallel inductor L3 is connected, and the other end of the parallel inductor L3 is grounded; one end of the parallel resonator P13 is connected to the node between the series resonators S13 and S14, and one end of the parallel resonator P14 is connected to the series resonator S14 and the series inductor L2 The nodes between are connected, the other ends of the parallel resonators P13 and P14 are connected to each other and connected to one end of the shunt inductor L4, and the other end of the shunt inductor L4 is grounded.
串联谐振器S11、S12、S13及S14的串联谐振器频率分别为fss1、fss2、fss3及fss4,并联谐振频率为fsp1、fsp2、fsp3及fsp4;并联谐振器P11、P12、P13及P14的串联谐振器频率分别为fps1、fps2、fps3及fps4,并联谐振频率为fpp1、fpp2、fpp3及fpp4。串联谐振器和并联谐振器通过质量负载的不同设计(调节质量负载的面积、厚度等方式)实现串联谐振频率彼此不同。The series resonator frequencies of the series resonators S11, S12, S13, and S14 are fss1, fss2, fss3, and fss4, respectively, and the parallel resonance frequencies are fsp1, fsp2, fsp3, and fsp4; the series resonances of the parallel resonators P11, P12, P13, and P14 The frequency of the device is fps1, fps2, fps3, and fps4, and the parallel resonance frequency is fpp1, fpp2, fpp3, and fpp4. The series resonator and the parallel resonator realize that the series resonant frequency is different from each other through different designs of the mass load (adjusting the area and thickness of the mass load, etc.).
图2为对比例即现有技术中的滤波器的插损特性及谐振器的阻抗特性曲线图,串联谐振器和并联谐振器共同作用形成滤波器通带特性。通过设置串联谐振器的串联谐振频率彼此不同以及串联谐振器的Kt 2的变化,可以有效改善滤波器通带右侧的滚降特性。滤波器应用小Kt 2谐振器容易实现良好的滚降特性,但是一旦设计指标(带宽、插损、带外抑制等)确定谐振器的Kt 2也就基本确定了,这样滤波器带宽和滤波器良好的滚降特性是相互矛盾的,常规架构下宽带宽滤波器设计很难实现良好的滚降特性,且对于普通滤波器中的谐振器层叠已确定的条件下,通过对谐振器结构的改变,50Ohm谐振器Kt 2变化只有±0.5% 左右,对滤波器滚降特性的改善有限。 Fig. 2 is a comparative example, that is, a curve diagram of the insertion loss characteristic of the filter in the prior art and the impedance characteristic of the resonator. The series resonator and the parallel resonator work together to form the passband characteristic of the filter. By setting the series resonant frequencies of the series resonators to be different from each other and the change of Kt 2 of the series resonators, the roll-off characteristics on the right side of the passband of the filter can be effectively improved. Filters using small Kt 2 resonators are easy to achieve good roll-off characteristics, but once the design indicators (bandwidth, insertion loss, out-of-band rejection, etc.) determine the Kt 2 of the resonator, the Kt 2 of the resonator is basically determined, so the filter bandwidth and filter Good roll-off characteristics are contradictory. It is difficult to achieve good roll-off characteristics in the design of wide-bandwidth filters under conventional architectures, and under the conditions that the resonator stack in common filters has been determined, the resonator structure can be changed , The Kt 2 change of the 50 Ohm resonator is only about ±0.5%, and the improvement of the filter roll-off characteristics is limited.
图3为对比例即现有技术中的滤波器在不同温度环境下对应的插损特性曲线图,其中带有三角形标签的曲线为95摄氏度环境下的插损特性曲线,带有正方形标签的曲线为常温25摄氏度环境下的插损特性曲线,带有圆形标签的曲线为-45摄氏度环境下的插损特性曲线。由于滤波器的压电介质材料以及电极材料均为负温度系数材料(-25ppm/℃~-30ppm/℃),而且高温条件下滤波器电极的热损耗增加,所以高温条件下的插损特性曲线相对于常温特性曲线向低频方向移动的同时插损也会掉落;与常温曲线相比,滤波器在低温下幅频曲线向高频方向移动,同时插入损耗变好,且一般情况下滤波器工作时通带信号大部分能量通过串联谐振器由输入端口T1传输到输出端口T2,串联谐振器温度会高于并联谐振器温度,故在同一外部环境下,通带右侧的频率漂移量大于通带左侧的频率漂移量。Fig. 3 is a comparative example, that is, the corresponding insertion loss characteristic curve diagram of the filter in the prior art under different temperature environments, where the curve with a triangle label is the insertion loss characteristic curve under an environment of 95 degrees Celsius, and the curve with a square label It is the insertion loss characteristic curve under a normal temperature of 25 degrees Celsius, and the curve with a circular label is the insertion loss characteristic curve under a -45 degrees Celsius environment. Since the piezoelectric dielectric material and electrode material of the filter are all negative temperature coefficient materials (-25ppm/℃~-30ppm/℃), and the heat loss of the filter electrode increases under high temperature conditions, the insertion loss characteristic curve under high temperature conditions Compared with the normal temperature characteristic curve, the insertion loss will also drop when it moves to the low frequency direction. Compared with the normal temperature curve, the amplitude-frequency curve of the filter moves to the high frequency direction at low temperature, and the insertion loss becomes better. In general, the filter During operation, most of the energy of the passband signal is transmitted from the input port T1 to the output port T2 through the series resonator. The temperature of the series resonator will be higher than that of the parallel resonator. Therefore, under the same external environment, the frequency drift on the right side of the passband is greater than The amount of frequency drift on the left side of the passband.
图4为本发明实施方式中第一实施例的滤波器的电路图,与现有的滤波器相比,本实施例的滤波器600中的一个串联谐振器替换为带有温补层的TCF谐振器(温补谐振器);本实施例中,将现有的串联谐振器S12替换为TCF。通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。4 is a circuit diagram of the filter of the first embodiment of the embodiment of the present invention. Compared with the existing filter, a series resonator in the filter 600 of this embodiment is replaced with a TCF resonance with a temperature compensation layer Resonator (temperature-compensated resonator); in this embodiment, the existing series resonator S12 is replaced with TCF. Through the different design of the thickness of the temperature compensation layer, the different temperature drift characteristics of the TCF resonator are realized.
图5为本发明实施方式中添加了温度补偿层的FBAR谐振器的示意图,图5中,51是半导体衬底材料,56是通过刻蚀得到的空气腔,薄膜体声波谐振器的底电极53淀积于半导体衬底51之上,52为压电薄膜材料,54为顶电极,55为温度补偿层。虚线框选区域为空气腔56、顶电极34、底电极33、温度补偿层55和压电层32的重叠区域为有效谐振区。温度补偿层的材料可以为多晶硅、硼磷酸盐玻璃(BSG)、二氧化硅(SiO2)、铬(Cr)或碲氧化物(TeO(x))等材料。其中,原本一次制作的下电极图形,分两次制作,在两次制作下电极图形之间,制作一层温度补偿层,温度补偿层的材料一般为二氧化硅,并且其图 形小于下电极图形。这样,当下电极图形完全制作完成后,温度补偿层就被完全包裹于下电极材料中,这样的制作方法可以使温度补偿层完全被下电极包裹,从而有效的保护它不受其他工艺制作过程的破坏;另外,因为温度补偿层上面和下面的电极材料在边缘处连接在一起,避免了由于三者组成的寄生电容而使谐振器性能(损耗特性)大幅度恶化。5 is a schematic diagram of an FBAR resonator with a temperature compensation layer added in an embodiment of the present invention. In FIG. 5, 51 is a semiconductor substrate material, 56 is an air cavity obtained by etching, and the bottom electrode 53 of the thin film bulk acoustic wave resonator Deposited on the semiconductor substrate 51, 52 is a piezoelectric film material, 54 is a top electrode, and 55 is a temperature compensation layer. The area selected by the dashed line is the overlapping area of the air cavity 56, the top electrode 34, the bottom electrode 33, the temperature compensation layer 55, and the piezoelectric layer 32 as the effective resonance area. The material of the temperature compensation layer can be polysilicon, borophosphate glass (BSG), silicon dioxide (SiO2), chromium (Cr) or tellurium oxide (TeO(x)) and other materials. Among them, the bottom electrode pattern that was originally made once is made twice. Between the two bottom electrode patterns, a temperature compensation layer is made. The material of the temperature compensation layer is generally silicon dioxide, and its pattern is smaller than that of the bottom electrode pattern. . In this way, when the bottom electrode pattern is completely fabricated, the temperature compensation layer is completely wrapped in the bottom electrode material. This manufacturing method can make the temperature compensation layer completely wrapped by the bottom electrode, thereby effectively protecting it from other manufacturing processes. Destroy; In addition, because the electrode materials above and below the temperature compensation layer are connected together at the edges, the performance (loss characteristics) of the resonator is greatly deteriorated due to the parasitic capacitance composed of the three.
图6是加温度补偿层前后的谐振器阻抗特性曲线对比图。添加了温度补偿层后,谐振器的Kt 2由原来的6.0%减少为3.0%,Rs由原来的0.8欧姆增大到1.6欧姆,而Rp则由原来的2800欧姆减小到1500欧姆,同时谐振器的温度系数由原来的-25ppm/℃~-30ppm/℃变为约0ppm/℃~25ppm/℃。可以看到,添加了温补层,Kt 2会变比原来大约一半,Rs大约增大到原来的2倍,而Rp则大约减少到原来的一半,谐振器的损耗增加也一定程度上导致了Q值的降低。 Fig. 6 is a comparison diagram of impedance characteristic curves of the resonator before and after adding a temperature compensation layer. After adding the temperature compensation layer, the Kt 2 of the resonator is reduced from 6.0% to 3.0%, Rs is increased from 0.8 ohms to 1.6 ohms, and Rp is reduced from 2800 ohms to 1500 ohms. At the same time, it resonates The temperature coefficient of the device has changed from -25ppm/℃~-30ppm/℃ to about 0ppm/℃~25ppm/℃. It can be seen that with the addition of the temperature compensation layer, Kt 2 will be about half of the original, Rs will be increased to about 2 times, and Rp will be reduced to about half. The increase in the loss of the resonator will also lead to a certain extent. Decrease in Q value.
图7为本发明第一实施例的滤波器插损特性及谐振器阻抗特性的曲线图,TCF谐振器的串联谐振频率和并联谐振频率分别为fss_tcf、fsp_tcf,S11谐振器的串联谐振频率和并联谐振频率分别为fss_11、fsp_11,S13谐振器的串联谐振频率和并联谐振频率分别为fss_13、fsp_13,S14谐振器的串联谐振频率和并联谐振频率分别为fss_14、fsp_14,常温条件下,TCF谐振器的并联谐振频率fsp_tcf与普通谐振器S11、S13及S14的并联谐振频率fsp_11、fsp_13及fsp_14存在如下关系:Fig. 7 is a graph of the insertion loss characteristic and the impedance characteristic of the resonator of the first embodiment of the present invention. The series resonant frequency and parallel resonant frequency of the TCF resonator are fss_tcf and fsp_tcf, respectively, and the series resonant frequency and parallel resonant frequency of the S11 resonator The resonant frequencies are fss_11, fsp_11, the series resonant frequency and parallel resonant frequency of the S13 resonator are fss_13, fsp_13, and the series resonant frequency and parallel resonant frequency of the S14 resonator are fss_14 and fsp_14. Under normal temperature conditions, the TCF resonator’s The parallel resonance frequency fsp_tcf has the following relationship with the parallel resonance frequencies fsp_11, fsp_13 and fsp_14 of ordinary resonators S11, S13 and S14:
Min(fsp_11、fsp_13、fsp_14)-fsp_tcf≥delta_FRMin(fsp_11, fsp_13, fsp_14)-fsp_tcf≥delta_FR
其中,delta_FR为滤波器通带右侧-20dB处对应频率在高温和常温条件下的频率变化量。fss_tcf、fss_11、fss_13、fss_14之间的关系不做限定。Among them, delta_FR is the frequency change of the corresponding frequency at -20dB on the right side of the filter passband under high and normal temperature conditions. The relationship among fss_tcf, fss_11, fss_13, and fss_14 is not limited.
图8为本发明第一实施例与对比例的滤波器在常温条件下的插损特性对比图,第一实施例中的一个串联谐振器为添加了温补层的TCF 谐振器,所添加的温度补偿层厚度满足如下条件:该温补层产生的正温漂效应可以全部或部分抵消所有其他层的负温漂效应,从而使得TCF谐振器成为具有温漂系数等于0ppm/℃的温补谐振器,或者该温补层产生的正温漂效应大于所有其他层的负温漂效应,从而使得TCF谐振器成为具有正温漂系数的温补谐振器;由于第一实施例中加入TCF谐振器,TCF谐振器具有小Kt 2特性,第一实施例可以在不影响滤波器带宽的前提下实现了通带右侧滚降特性的较大提升。 Fig. 8 is a comparison diagram of the insertion loss characteristics of the filters of the first embodiment of the present invention and the comparative example under normal temperature conditions. A series resonator in the first embodiment is a TCF resonator with a temperature compensation layer added. The thickness of the temperature compensation layer satisfies the following conditions: the positive temperature drift effect produced by the temperature compensation layer can fully or partially offset the negative temperature drift effects of all other layers, so that the TCF resonator becomes a temperature compensation resonance with a temperature drift coefficient equal to 0ppm/℃ The positive temperature drift effect of the temperature compensation layer is greater than the negative temperature drift effect of all other layers, so that the TCF resonator becomes a temperature compensation resonator with a positive temperature drift coefficient; because the TCF resonator is added in the first embodiment , The TCF resonator has a small Kt 2 characteristic, and the first embodiment can achieve a large improvement in the roll-off characteristic on the right side of the passband without affecting the bandwidth of the filter.
图9为本发明第一实施例中TCF谐振器0温漂条件下对应的三温特性曲线图与对比例三温特性曲线对比图,如图9所示,TCF谐振器0温漂条件下对应的三温特性曲线(低温:-45摄氏度、常温:25摄氏度、高温:95摄氏度)为实线,对比例三温特性曲线为虚线,二者对比可知,第一实施例的通带右侧的温漂特性得到较大改善。图10为图9画圈区域的放大图,第一实施例高温条件下通带右侧温漂0.5MHz,相比于对比例的2MHz温漂得到较大改善,同时,高温条件下在2150MHz处第一实施例的插损相对于对比例提升3dB左右。Fig. 9 is a comparison diagram of the three-temperature characteristic curve corresponding to the TCF resonator under the zero temperature drift condition of the first embodiment of the present invention and the three-temperature characteristic curve of the comparative example. As shown in Fig. 9, the TCF resonator corresponds under the zero temperature drift condition The three-temperature characteristic curve (low temperature: -45 degrees Celsius, normal temperature: 25 degrees Celsius, high temperature: 95 degrees Celsius) is a solid line, and the three-temperature characteristic curve of the comparative example is a dashed line. The comparison between the two shows that the right side of the pass band of the first embodiment The temperature drift characteristics have been greatly improved. Figure 10 is an enlarged view of the circled area in Figure 9. The temperature drift on the right side of the passband of the first embodiment is 0.5MHz under high temperature conditions, which is greatly improved compared to the 2MHz temperature drift of the comparative example. At the same time, the temperature drift is at 2150MHz under high temperature conditions. Compared with the comparative example, the insertion loss of the first embodiment is increased by about 3dB.
图11为本发明第一实施例中TCF谐振器0温漂条件下与对比例在常温和高温条件下的插损特性对比图。图12为本发明第一实施例中TCF谐振器正1MHz温漂与对比例在常温和高温条件下的插损特性对比图。从图中可以看出,第一实施例实现了滤波器通带右侧的零温漂特性。即通过TCF谐振器的温补层厚度的合理设计实现了滤波器的零温漂特性。FIG. 11 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention under the condition of zero temperature drift and the comparative example under the conditions of normal temperature and high temperature. FIG. 12 is a comparison diagram of the insertion loss characteristics of the TCF resonator in the first embodiment of the present invention with a positive 1MHz temperature drift and a comparative example under normal temperature and high temperature conditions. It can be seen from the figure that the first embodiment achieves the zero temperature drift characteristic on the right side of the filter passband. That is, the reasonable design of the thickness of the temperature compensation layer of the TCF resonator realizes the zero temperature drift characteristic of the filter.
图13为本发明第二实施例的滤波器的电路图,与现有的滤波器相比,第二实施例中的滤波器700中的一个串联谐振器替换为带有温补层的TCF谐振器(温补谐振器);本实施例中,将现有的串联谐振器S13替换为TCF。通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。FIG. 13 is a circuit diagram of the filter of the second embodiment of the present invention. Compared with the existing filter, one of the series resonators in the filter 700 in the second embodiment is replaced with a TCF resonator with a temperature compensation layer (Temperature Compensated Resonator): In this embodiment, the existing series resonator S13 is replaced with TCF. Through the different design of the thickness of the temperature compensation layer, the different temperature drift characteristics of the TCF resonator are realized.
图14为本发明第二实施例的滤波器插损特性及谐振器阻抗特性的曲线图,TCF谐振器的串联谐振频率和并联谐振频率分别为fss_tcf、fsp_tcf,S11谐振器的串联谐振频率和并联谐振频率分别为fss_11、fsp_11,S12谐振器的串联谐振频率和并联谐振频率分别为fss_12、fsp_12,S14谐振器的串联谐振频率和并联谐振频率分别为fss_14、fsp_14,常温条件下,TCF谐振器的并联谐振频率fsp_tcf与普通谐振器S11、S12及S14的并联谐振频率fsp_11、fsp_12及fsp_14存在如下关系:14 is a graph of the filter insertion loss characteristic and the resonator impedance characteristic of the second embodiment of the present invention. The series resonance frequency and parallel resonance frequency of the TCF resonator are fss_tcf and fsp_tcf respectively, and the series resonance frequency and parallel resonance frequency of the S11 resonator are The resonant frequencies are fss_11, fsp_11, the series resonant frequency and parallel resonant frequency of the S12 resonator are fss_12, fsp_12, and the series resonant frequency and parallel resonant frequency of the S14 resonator are fss_14 and fsp_14, respectively. Under normal temperature conditions, the TCF resonator's The parallel resonance frequency fsp_tcf has the following relationship with the parallel resonance frequencies fsp_11, fsp_12 and fsp_14 of ordinary resonators S11, S12 and S14:
Min(fsp_11、fsp_12、fsp_14)-fsp_tcf≥delta_FRMin(fsp_11, fsp_12, fsp_14)-fsp_tcf≥delta_FR
其中,fss_tcf、fss_11、fss_13、fss_14之间的关系不做限定。Among them, the relationship among fss_tcf, fss_11, fss_13, and fss_14 is not limited.
图15为本发明第二实施例与对比例在常温条件下的插损特性对比图,如图15所示,与第一实施例同理,由于第二实施例中加入TCF谐振器,TCF谐振器具有小Kt 2特性,第二实施例可以在不影响滤波器带宽的前提下实现了通带右侧滚降特性的较大提升。 15 is a comparison diagram of the insertion loss characteristics of the second embodiment of the present invention and the comparative example under normal temperature conditions. As shown in FIG. 15, the same as the first embodiment, because the TCF resonator is added in the second embodiment, the TCF resonates The filter has a small Kt 2 characteristic, and the second embodiment can achieve a greater improvement in the roll-off characteristic on the right side of the passband without affecting the bandwidth of the filter.
图16为本发明第三实施例对应的电路图,与现有的滤波器相比,第三实施例的滤波器800中的两个串联谐振器替换为带有温补层的TCF谐振器(温补谐振器),分别为TCF1和TCF2;本实施例中将TCF1谐振器和TCF2谐振器替换对比例中的串联谐振器S12和S13,通过温补层厚度的不同设计实现TCF1谐振器和TCF2谐振器温漂特性的改变。16 is a circuit diagram corresponding to the third embodiment of the present invention. Compared with the existing filter, the two series resonators in the filter 800 of the third embodiment are replaced with TCF resonators with a temperature compensation layer (temperature compensation layer). Compensation resonator), respectively TCF1 and TCF2; in this embodiment, the TCF1 resonator and TCF2 resonator are replaced with the series resonators S12 and S13 in the comparative example, and the TCF1 resonator and TCF2 resonance are realized through different designs of the temperature compensation layer thickness. Change of temperature drift characteristics of the device.
图17为本发明第三实施例的滤波器插损特性及谐振器阻抗特性的曲线图,如图17所示,TCF1谐振器的串联谐振频率和并联谐振频率分别为fss_tcf1、fsp_tcf1,TCF2谐振器的串联谐振频率和并联谐振频率分别为fss_tcf2、fsp_tcf2,S11谐振器的串联谐振频率和并联谐振频率分别为fss_11、fsp_11,S14谐振器的串联谐振频率和并联谐振频率分别为fss_14、fsp_14,常温条件下,TCF1和TCF2谐振器的并联谐振频率fsp_tcf1、fsp_tcf2与普通串联谐振器S11和S14的并联谐振 频率fsp_11、fsp_14存在如下关系:FIG. 17 is a graph of the insertion loss characteristic and the impedance characteristic of the resonator of the third embodiment of the present invention. As shown in FIG. 17, the series resonance frequency and parallel resonance frequency of the TCF1 resonator are fss_tcf1, fsp_tcf1, and TCF2 resonators, respectively. The series resonant frequency and parallel resonant frequency are fss_tcf2, fsp_tcf2, the series resonant frequency and parallel resonant frequency of S11 resonator are fss_11, fsp_11, and the series resonant frequency and parallel resonant frequency of S14 resonator are fss_14 and fsp_14, respectively. Normal temperature conditions Below, the parallel resonance frequencies fsp_tcf1 and fsp_tcf2 of TCF1 and TCF2 resonators have the following relationship with the parallel resonance frequencies fsp_11 and fsp_14 of ordinary series resonators S11 and S14:
Min(fsp_11、fsp_14)-Max(fsp_tcf1、fsp_tcf2)≥delta_FRMin(fsp_11, fsp_14)-Max(fsp_tcf1, fsp_tcf2)≥delta_FR
其中,fss_tcf1、fss_tcf2、fss_11、fss_14之间的关系不做限定。Among them, the relationship between fss_tcf1, fss_tcf2, fss_11, and fss_14 is not limited.
图18为本发明第三实施例与对比例在常温条件下的插损特性对比图,如图18所示,与第一实施例和第二实施例同理,在串联支路中加入2个TCF谐振器,TCF谐振器具有小Kt2特性,因此,第三实施例可以在不影响滤波器带宽的前提下实现了通带右侧滚降特性的较大提升。Figure 18 is a comparison diagram of the insertion loss characteristics of the third embodiment of the present invention and the comparative example under normal temperature conditions. As shown in Figure 18, the same as the first and second embodiments, two are added to the series branch. The TCF resonator and the TCF resonator have a small Kt2 characteristic. Therefore, the third embodiment can achieve a large improvement in the roll-off characteristic on the right side of the passband without affecting the bandwidth of the filter.
图19为对比例与本发明第一实施例、第二实施例、第三实施例的常温条件下的插损特性对比图,对比例中没有TCF谐振器,第一实施例和第二实施例的串联谐振器中有一个谐振器为TCF谐振器,第三实施例中的串联谐振器有两个谐振器为TCF谐振器。如前所述,TCF谐振器与普通谐振器相比,其Kt 2会减小,Rs大约增大为普通谐振器的2倍,而Rp则大约减少到普通谐振器的一半,谐振器的损耗增加导致了Q值的降低,所以滤波器中包含的TCF谐振器越多,其通带插损特性越差,但是其温漂特性及滚降特性越好,故在设计过程中要根据设计指标要求对温漂特性、滚降特性和通带插损特性做权衡。 19 is a comparison diagram of the insertion loss characteristics of the comparative example and the first embodiment, the second embodiment, and the third embodiment of the present invention under normal temperature conditions. There is no TCF resonator in the comparative example, the first embodiment and the second embodiment One of the series resonators is a TCF resonator, and two of the series resonators in the third embodiment are TCF resonators. As mentioned earlier, the Kt 2 of the TCF resonator is reduced compared with the ordinary resonator, Rs is about twice that of the ordinary resonator, and Rp is reduced to about half of the ordinary resonator. The loss of the resonator The increase leads to a decrease in the Q value, so the more TCF resonators included in the filter, the worse the passband insertion loss characteristics, but the better the temperature drift characteristics and roll-off characteristics, so the design process should be based on the design indicators It is required to balance the temperature drift characteristics, roll-off characteristics and passband insertion loss characteristics.
图20为本发明实施方式中第四实施例的滤波器的电路图,与现有的滤波器相比,本实施例的滤波器900其中的一级串联电路包括两个谐振器,分别为现有串联谐振器S12和温补谐振器TCF,本实施例中同一级串联电路中的两谐振器一个设为普通的串联谐振器,一个设为温补谐振器,其结构上并不局限于此,还可以将该两个谐振器均设为温补谐振器;通过设置温补谐振器,以及通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。FIG. 20 is a circuit diagram of the filter of the fourth embodiment of the embodiment of the present invention. Compared with the existing filter, the first-stage series circuit of the filter 900 of this embodiment includes two resonators, which are the existing ones. The series resonator S12 and the temperature-compensated resonator TCF. In this embodiment, one of the two resonators in the series circuit of the same stage is set as an ordinary series resonator, and the other is set as a temperature-compensated resonator. The structure is not limited to this. It is also possible to set the two resonators as temperature-compensated resonators; by setting the temperature-compensated resonator, and by designing the thickness of the temperature-compensating layer, different temperature drift characteristics of the TCF resonator can be realized.
图21为本发明实施方式中第五实施例的滤波器的电路图,与现有的滤波器相比,本实施例的滤波器110中的一个并联谐振器替换为了 温补谐振器TCF;通过设置温补谐振器,以及通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。FIG. 21 is a circuit diagram of the filter of the fifth embodiment of the embodiment of the present invention. Compared with the existing filter, one of the parallel resonators in the filter 110 of this embodiment is replaced with a temperature-compensated resonator TCF; The temperature compensation resonator, and through the different design of the temperature compensation layer thickness, realizes the different temperature drift characteristics of the TCF resonator.
P11谐振器的串联谐振频率和并联谐振频率分别为fps_11、fpp_11,P13谐振器的串联谐振频率和并联谐振频率分别为fps_13、fpp_13,P14谐振器的串联谐振频率和并联谐振频率分别为fps_14、fpp_14,TCF谐振器的串联谐振频率和并联谐振频率分别为fps_tcf、fpp_tcf,常温条件下,TCF谐振器的并联谐振频率fpp_tcf与普通谐振器P11、P13及P14的并联谐振频率fpp_11、fpp_13及fpp_14存在如下关系:The series resonance frequency and parallel resonance frequency of the P11 resonator are fps_11 and fpp_11, respectively, the series resonance frequency and parallel resonance frequency of the P13 resonator are fps_13, fpp_13, respectively, and the series resonance frequency and parallel resonance frequency of the P14 resonator are fps_14, fpp_14, respectively The series resonance frequency and parallel resonance frequency of the TCF resonator are fps_tcf and fpp_tcf respectively. Under normal temperature conditions, the parallel resonance frequency fpp_tcf of the TCF resonator and the parallel resonance frequencies fpp_11, fpp_13 and fpp_14 of the ordinary resonators P11, P13 and P14 exist as follows relation:
Min(fpp_11、fpp_12、fpp_14)-fpp_tcf≥delta_FLMin(fpp_11, fpp_12, fpp_14)-fpp_tcf≥delta_FL
其中,delta_FL为滤波器通带右左侧-20dB处对应频率在高温和常温条件下的频率变化量,fps_11、fps_12、fps_tcf、fps_14之间的关系不做限定。Among them, delta_FL is the frequency change of the corresponding frequency at -20dB on the right and left side of the filter passband under high and normal temperature conditions. The relationship between fps_11, fps_12, fps_tcf, and fps_14 is not limited.
图22为本发明实施方式中第六实施例的滤波器的电路图,与现有的滤波器相比,本实施例的滤波器120中的两个并联谐振器替换为了温补谐振器,分别为TCF1和TCF2;通过设置温补谐振器,以及通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。22 is a circuit diagram of the filter of the sixth embodiment of the embodiment of the present invention. Compared with the existing filter, the two parallel resonators in the filter 120 of this embodiment are replaced with temperature-compensated resonators, respectively TCF1 and TCF2; By setting the temperature compensation resonator, and through the different design of the temperature compensation layer thickness, the different temperature drift characteristics of the TCF resonator are realized.
P11谐振器的串联谐振频率和并联谐振频率分别为fps_11、fpp_11,P14谐振器的串联谐振频率和并联谐振频率分别为fps_14、fpp_14,TCF1谐振器的串联谐振频率和并联谐振频率分别为fps_tcf1、fpp_tcf1,TCF2谐振器的串联谐振频率和并联谐振频率分别为fps_tcf2、fpp_tcf2,常温条件下,TCF谐振器的并联谐振频率fpp_tcf1及fpp_tcf2与普通谐振器P11及P14的并联谐振频率fpp_11及fpp_14存在如下关系:The series resonance frequency and parallel resonance frequency of the P11 resonator are fps_11 and fpp_11, respectively. The series resonance frequency and parallel resonance frequency of the P14 resonator are fps_14 and fpp_14, respectively. The series resonance frequency and parallel resonance frequency of the TCF1 resonator are fps_tcf1, fpp_tcf1, respectively. The series resonance frequency and parallel resonance frequency of the TCF2 resonator are fps_tcf2 and fpp_tcf2, respectively. Under normal temperature conditions, the parallel resonance frequencies fpp_tcf1 and fpp_tcf2 of the TCF resonators have the following relationship with the parallel resonance frequencies fpp_11 and fpp_14 of the ordinary resonators P11 and P14:
Min(fpp_11、fpp_14)-Max(fpp_tcf1、fpp_tcf2)≥delta_FLMin(fpp_11, fpp_14)-Max(fpp_tcf1, fpp_tcf2)≥delta_FL
其中,delta_FL为滤波器通带右左侧-20dB处对应频率在高温和常温条件下的频率变化量,fps_11、fps_tcf1、fps_tcf2、fps_14之间的关系不做限定。Among them, delta_FL is the frequency change of the corresponding frequency at -20dB on the right and left side of the filter passband under high and normal temperature conditions. The relationship between fps_11, fps_tcf1, fps_tcf2, and fps_14 is not limited.
图23为本发明实施方式中第七实施例的滤波器的电路图,与现有的滤波器相比,本实施例的滤波器900其中的一级并联电路包括两个谐振器,分别为温补谐振器TCF和并联谐振器P12,本实施例中同一级并联电路中的两谐振器一个设为普通的并联谐振器,一个设为温补谐振器,其结构上并不局限于此,还可以将该两个谐振器均设为温补谐振器;通过设置温补谐振器,以及通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。FIG. 23 is a circuit diagram of the filter of the seventh embodiment in the embodiment of the present invention. Compared with the existing filter, the one-stage parallel circuit of the filter 900 of this embodiment includes two resonators, each of which is temperature compensated. The resonator TCF and the parallel resonator P12. In this embodiment, one of the two resonators in the parallel circuit of the same level is set as an ordinary parallel resonator, and the other is set as a temperature-compensated resonator. The structure is not limited to this, but can also The two resonators are both set as temperature-compensated resonators; by setting the temperature-compensated resonator, and through different designs of the thickness of the temperature-compensated layer, different temperature drift characteristics of the TCF resonator are realized.
图24本发明实施方式中的第八实施例的滤波器的电路图,与现有的滤波器相比,本实施例的滤波器140中,串联支路中的设置一个温补谐振器TCF1,并联支路中设置一个温补谐振器TCF2,即在串联支路和并联支路中均设有温补谐振器;本实施例中,通过设置温补谐振器,以及通过温补层厚度的不同设计,实现TCF谐振器不同的温漂特性。Fig. 24 is a circuit diagram of the filter of the eighth embodiment of the embodiment of the present invention. Compared with the existing filter, in the filter 140 of this embodiment, a temperature-compensated resonator TCF1 is provided in the series branch, which is connected in parallel A temperature-compensated resonator TCF2 is set in the branch, that is, a temperature-compensated resonator is set in both the series branch and the parallel branch; in this embodiment, the temperature-compensated resonator is set, and the thickness of the temperature-compensated layer is designed differently. , To achieve different temperature drift characteristics of the TCF resonator.
综上,采用本发明的技术方案,无论是相比全部为普通FBAR谐振器的滤波器,还是全部为温补谐振器的滤波器,均在性能上具有明显优势,兼顾了滤波器带宽、通带两侧滚降以及通带插入损耗特性。In summary, using the technical solution of the present invention, whether it is a filter that is all ordinary FBAR resonators or a filter that is all temperature-compensated resonators, it has obvious advantages in performance, and takes into account the bandwidth and pass of the filter. With roll-off on both sides and passband insertion loss characteristics.
上述具体实施方式,并不构成对本发明保护范围的限制。本领域技术人员应该明白的是,取决于设计要求和其他因素,可以发生各种各样的修改、组合、子组合和替代。任何在本发明的精神和原则之内所作的修改、等同替换和改进等,均应包含在本发明保护范围之内。The foregoing specific implementations do not constitute a limitation on the protection scope of the present invention. Those skilled in the art should understand that, depending on design requirements and other factors, various modifications, combinations, sub-combinations, and substitutions can occur. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

  1. 一种滤波器,包括多个串联谐振器和多个并联谐振器,其特征在于,A filter comprising a plurality of series resonators and a plurality of parallel resonators, characterized in that:
    部分串联谐振器和/或部分并联谐振器为温补谐振器,该温补谐振器包括温度补偿层。Part of the series resonator and/or part of the parallel resonator is a temperature-compensated resonator, and the temperature-compensated resonator includes a temperature compensation layer.
  2. 根据权利要求1所述的滤波器,其特征在于,串联支路包括多级串联电路,至少一级串联电路中全部或部分串联谐振器为温补谐振器;The filter according to claim 1, wherein the series branch comprises a multi-stage series circuit, and all or part of the series resonators in the at least one-stage series circuit are temperature-compensated resonators;
    并且/或者,And/or,
    并联支路包括多级并联电路,其中,至少一级并联电路中全部或部分并联谐振器为温补谐振器。The parallel branch includes a multi-stage parallel circuit, wherein all or part of the parallel resonators in the at least one-stage parallel circuit are temperature-compensated resonators.
  3. 根据权利要求1所述的滤波器,其特征在于,串联支路中温补谐振器的数量为1,其频率与其他串联谐振器频率关系如下:The filter according to claim 1, wherein the number of temperature-compensated resonators in the series branch is 1, and the relationship between its frequency and the frequencies of other series resonators is as follows:
    Min(fsp_11、fsp_12、fsp_13……fsp_1n)-fsp_tcf≥delta_FRMin(fsp_11, fsp_12, fsp_13……fsp_1n)-fsp_tcf≥delta_FR
    其中,fsp_11为串联谐振器S11的并联谐振频率,fsp_12为串联谐振器S12的并联谐振频率,fsp_13为串联谐振器S13的并联谐振频率……fsp_1n为串联谐振器S1n的并联谐振频率,fsp_tcf为温补谐振器TCF的并联谐振频率;delta_FR为滤波器通带右侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fsp_11 is the parallel resonant frequency of series resonator S11, fsp_12 is the parallel resonant frequency of series resonator S12, fsp_13 is the parallel resonant frequency of series resonator S13...fsp_1n is the parallel resonant frequency of series resonator S1n, fsp_tcf is temperature Complement the parallel resonant frequency of the resonator TCF; delta_FR is the frequency change of the corresponding frequency at -20dB on the right side of the filter passband under high and normal temperature conditions.
  4. 根据权利要求1所述的滤波器,其特征在于,串联支路中温补谐振器的数量大于等于2,常温情况下,其频率与其他串联谐振器频率关系如下:The filter according to claim 1, wherein the number of temperature-compensated resonators in the series branch is greater than or equal to 2, and the relationship between its frequency and the frequencies of other series resonators at room temperature is as follows:
    Min(fsp_11、fsp_12、fsp_13……fsp_1n)-Max(fsp_tcf1、fsp_tcf2……fsp_tcfn)≥delta_FRMin(fsp_11, fsp_12, fsp_13……fsp_1n)-Max(fsp_tcf1, fsp_tcf2……fsp_tcfn)≥delta_FR
    其中,fsp_11为串联谐振器S11的并联谐振频率,fsp_12为串联谐振器S12的并联谐振频率,fsp_13为串联谐振器S13的并联谐振频 率……fsp_1n为串联谐振器S1n的并联谐振频率;fsp_tcf1为温补谐振器TCF1的并联谐振频率,fsp_tcf2为温补谐振器TCF2的并联谐振频率……fsp_tcfn为温补谐振器TCFn的并联谐振频率;delta_FR为滤波器通带右侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fsp_11 is the parallel resonant frequency of series resonator S11, fsp_12 is the parallel resonant frequency of series resonator S12, fsp_13 is the parallel resonant frequency of series resonator S13... fsp_1n is the parallel resonant frequency of series resonator S1n; fsp_tcf1 is temperature The parallel resonant frequency of the compensation resonator TCF1, fsp_tcf2 is the parallel resonant frequency of the temperature-compensated resonator TCF2...fsp_tcfn is the parallel resonant frequency of the temperature-compensated resonator TCFn; delta_FR is the corresponding frequency at -20dB on the right side of the filter passband at high temperature and The amount of frequency change under normal temperature conditions.
  5. 根据权利要求1所述的滤波器,其特征在于,并联支路中,温补谐振器的数量为1,常温情况下,其频率与并联谐振频率关系如下:The filter according to claim 1, characterized in that, in the parallel branch, the number of temperature-compensated resonators is 1, and the relationship between its frequency and the parallel resonance frequency at normal temperature is as follows:
    Min(fpp_11、fpp_12、fpp_13……fpp_1n)-fpp_tcf≥delta_FL;Min(fpp_11, fpp_12, fpp_13……fpp_1n)-fpp_tcf≥delta_FL;
    其中,fpp_11为并联谐振器P11的并联谐振频率,fpp_12为并联谐振器P12的并联谐振频率;fpp_13为并联谐振器P13的并联谐振频率……fpp_1n为并联谐振器P1n的并联谐振频率,fpp_tcf为温补谐振器TCF的并联谐振频率;delta_FL为滤波器通带左侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fpp_11 is the parallel resonant frequency of the parallel resonator P11, fpp_12 is the parallel resonant frequency of the parallel resonator P12; fpp_13 is the parallel resonant frequency of the parallel resonator P13...fpp_1n is the parallel resonant frequency of the parallel resonator P1n, fpp_tcf is the temperature Compensate the parallel resonant frequency of the resonator TCF; delta_FL is the frequency change of the corresponding frequency at -20dB on the left side of the filter passband under high and normal temperature conditions.
  6. 根据权利要求1所述的滤波器,其特征在于,并联支路中温补谐振器数量大于等于2,常温情况下,其频率与并联谐振频率关系如下;The filter according to claim 1, wherein the number of temperature-compensated resonators in the parallel branch is greater than or equal to 2, and the relationship between its frequency and the parallel resonance frequency at normal temperature is as follows;
    Min(fpp_11、fpp_12、fpp_13……fpp_1n)-Max(fpp_tcf1、fpp_tcf2……fpp_tcfn)≥delta_FLMin(fpp_11, fpp_12, fpp_13……fpp_1n)-Max(fpp_tcf1, fpp_tcf2……fpp_tcfn)≥delta_FL
    其中,fpp_11为并联谐振器P11的并联谐振频率,fpp_12为并联谐振器S12的并联谐振频率,fpp_13为并联谐振器P13的并联谐振频率……fpp_1n为并联谐振器P1n的并联谐振频率;fpp_tcf1为温补谐振器TCF1的并联谐振频率,fpp_tcf2为温补谐振器TCF2的并联谐振频率……fpp_tcfn为温补谐振器TCFn的并联谐振频率;delta_FL为滤波器通带左侧-20dB处对应频率在高温和常温条件下的频率变化量。Among them, fpp_11 is the parallel resonant frequency of the parallel resonator P11, fpp_12 is the parallel resonant frequency of the parallel resonator S12, fpp_13 is the parallel resonant frequency of the parallel resonator P13...fpp_1n is the parallel resonant frequency of the parallel resonator P1n; fpp_tcf1 is the temperature The parallel resonant frequency of the compensation resonator TCF1, fpp_tcf2 is the parallel resonant frequency of the temperature-compensated resonator TCF2...fpp_tcfn is the parallel resonant frequency of the temperature-compensated resonator TCFn; delta_FL is the corresponding frequency at the left -20dB of the filter passband at high temperature and The amount of frequency change under normal temperature conditions.
  7. 根据权利要求1所述的滤波器,其特征在于:所述温补谐振器具有正温漂系数,且其正温漂系数大小为未具有温补层的谐振器的温漂系数的大小的0至0.5倍。The filter according to claim 1, wherein the temperature compensation resonator has a positive temperature drift coefficient, and the magnitude of the positive temperature drift coefficient is 0 of the value of the temperature drift coefficient of the resonator without a temperature compensation layer. To 0.5 times.
  8. 根据权利要求1所述的滤波器,其特征在于,所述温补谐振器 的有效机电耦合系数小于未具有温补层的谐振器的有效机电耦合系数。The filter according to claim 1, wherein the effective electromechanical coupling coefficient of the temperature-compensated resonator is smaller than the effective electromechanical coupling coefficient of the resonator without a temperature-compensated layer.
  9. 一种双工器,其特征在于,包括权利要求1至8中任一项所述滤波器。A duplexer, characterized by comprising the filter according to any one of claims 1 to 8.
  10. 一种高频前端电路,其特征在于,包括权利要求1至8中任一项所述滤波器。A high-frequency front-end circuit, characterized by comprising the filter according to any one of claims 1 to 8.
  11. 一种通信装置,其特征在于,包括权利要求1至8中任一项所述滤波器。A communication device, characterized by comprising the filter according to any one of claims 1 to 8.
PCT/CN2020/141264 2020-01-22 2020-12-30 Filter, duplexer, high-frequency front-end circuit, and communication apparatus WO2021147633A1 (en)

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