WO2021141284A1 - Module thermoélectrique - Google Patents

Module thermoélectrique Download PDF

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Publication number
WO2021141284A1
WO2021141284A1 PCT/KR2020/018792 KR2020018792W WO2021141284A1 WO 2021141284 A1 WO2021141284 A1 WO 2021141284A1 KR 2020018792 W KR2020018792 W KR 2020018792W WO 2021141284 A1 WO2021141284 A1 WO 2021141284A1
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WIPO (PCT)
Prior art keywords
case
thermoelectric
heat exchange
disposed
cover
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PCT/KR2020/018792
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English (en)
Korean (ko)
Inventor
원부운
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to CN202080091981.9A priority Critical patent/CN114930552A/zh
Priority to US17/791,150 priority patent/US12108673B2/en
Publication of WO2021141284A1 publication Critical patent/WO2021141284A1/fr

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings

Definitions

  • the present invention relates to a thermoelectric module, and more particularly, to a structure of a heat exchange unit included in the thermoelectric module.
  • thermoelectric phenomenon is a phenomenon that occurs by the movement of electrons and holes inside a material, and refers to direct energy conversion between heat and electricity.
  • thermoelectric element is a generic term for a device using a thermoelectric phenomenon, and has a structure in which a P-type thermoelectric material and an N-type thermoelectric material are bonded between metal electrodes to form a PN junction pair.
  • Thermoelectric devices can be divided into devices using a temperature change in electrical resistance, devices using the Seebeck effect, which is a phenomenon in which electromotive force is generated by a temperature difference, and devices using the Peltier effect, which is a phenomenon in which heat absorption or heat is generated by current. .
  • Thermoelectric devices are widely applied to home appliances, electronic parts, and communication parts.
  • the thermoelectric element may be applied to an apparatus for cooling, an apparatus for heating, an apparatus for power generation, and the like. Accordingly, the demand for the thermoelectric performance of the thermoelectric element is increasing.
  • the thermoelectric element includes a substrate, an electrode, and a thermoelectric leg, a plurality of thermoelectric legs are disposed between the upper substrate and the lower substrate in an array form, a plurality of upper electrodes are disposed between the plurality of thermoelectric legs and the upper substrate, and a plurality of A plurality of lower electrodes are disposed between the thermoelectric leg and the lower substrate.
  • one of the upper substrate and the lower substrate may be a low-temperature portion, and the other may be a high-temperature portion.
  • thermoelectric element when the thermoelectric element is applied to a cooling device, a heating device, a power generation device, etc., a heat exchange part may be disposed on one surface of the thermoelectric element, and the thermoelectric performance of the thermoelectric element is decreased according to the heat exchange efficiency between the thermoelectric element and the heat exchange part. may vary.
  • An object of the present invention is to provide a thermoelectric module with improved heat exchange efficiency.
  • thermoelectric module includes a heat exchange unit and a thermoelectric element disposed on the heat exchange unit, wherein the heat exchange unit includes a case for accommodating a material for heat exchange and a cover covering the case, A thermoelectric element is disposed on the cover, and the thermal conductivity of the cover is higher than that of the case.
  • the cover is disposed to face the outside of the case, and includes a first surface on which the thermoelectric element is disposed and a second surface on which the thermoelectric element is disposed and a second surface disposed to face the inside of the case, and a plurality of heat dissipation fins are formed on the second surface.
  • the case may include a first area accommodating the plurality of heat dissipation fins, and a second area surrounding the first area and having a coupling member for fastening to the cover.
  • the coupling member may be a plurality of holes, and the case and the cover may be coupled through a plurality of coupling members in the second region.
  • the case and the cover may be watertight in the second area.
  • the coupling member is a ring-shaped groove, and an O-ring may be disposed in the groove.
  • the case may further include a third area that surrounds the second area and is higher than the second area.
  • the bottom surface of the first region and the plurality of heat dissipation fins may be spaced apart from each other by a predetermined distance.
  • At least one guide protruding from a bottom surface may be disposed in the first region, and one end of the guide may be spaced apart from the wall surface of the case.
  • the case may be formed with a fluid inlet and a fluid outlet.
  • the temperature of the fluid introduced through the fluid inlet may be higher than the temperature of the fluid discharged through the fluid outlet.
  • a temperature of the fluid introduced through the fluid inlet may be lower than a temperature of the fluid discharged through the fluid outlet.
  • the cover may include a metal, and the case may include an insulating material.
  • thermoelectric element having improved heat exchange efficiency between the heat exchange unit and the thermoelectric element.
  • heat loss of the heat exchange unit can be prevented without a separate heat insulating material, thereby reducing the manufacturing cost, simplifying the manufacturing process, and reducing the area occupied by the thermoelectric module.
  • thermoelectric element 1 is a cross-sectional view of a thermoelectric element.
  • thermoelectric element 2 is a perspective view of a thermoelectric element.
  • thermoelectric element 3 is a perspective view of a thermoelectric element including a sealing member.
  • thermoelectric element 4 is an exploded perspective view of a thermoelectric element including a sealing member.
  • thermoelectric module 5 is a perspective view of a thermoelectric module according to an embodiment of the present invention.
  • thermoelectric module 6 is a perspective view of a heat exchange unit included in a thermoelectric module according to an embodiment of the present invention.
  • thermoelectric module 7 is an exploded perspective view of a heat exchange unit included in the thermoelectric module according to an embodiment of the present invention.
  • FIG. 8 is a perspective view of a cover included in the heat exchange unit of FIG. 7 .
  • thermoelectric module 9 is a cross-sectional view of a heat exchange unit included in the thermoelectric module according to an embodiment of the present invention.
  • FIG. 10 is a guide disposed in a case of a heat exchange unit according to an embodiment of the present invention.
  • thermoelectric module 11 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention.
  • the singular form may also include the plural form unless otherwise specified in the phrase, and when it is described as "at least one (or one or more) of A and (and) B, C", it is combined with A, B, C It may include one or more of all possible combinations.
  • a component when it is described that a component is 'connected', 'coupled' or 'connected' to another component, the component is not only directly connected, coupled or connected to the other component, but also with the component It may also include a case of 'connected', 'coupled' or 'connected' due to another element between the other elements.
  • FIG. 1 is a cross-sectional view of a thermoelectric element
  • FIG. 2 is a perspective view of the thermoelectric element
  • 3 is a perspective view of a thermoelectric element including a sealing member
  • FIG. 4 is an exploded perspective view of the thermoelectric element including a sealing member.
  • the thermoelectric element 100 includes a lower substrate 110 , a lower electrode 120 , a P-type thermoelectric leg 130 , an N-type thermoelectric leg 140 , an upper electrode 150 , and an upper substrate. (160).
  • the lower electrode 120 is disposed between the lower substrate 110 and the lower bottom surfaces of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140
  • the upper electrode 150 is formed between the upper substrate 160 and the P-type thermoelectric leg 140 . It is disposed between the thermoelectric leg 130 and the upper bottom surface of the N-type thermoelectric leg 140 . Accordingly, the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 are electrically connected by the lower electrode 120 and the upper electrode 150 .
  • a pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 disposed between the lower electrode 120 and the upper electrode 150 and electrically connected may form a unit cell.
  • thermoelectric leg 130 when a voltage is applied to the lower electrode 120 and the upper electrode 150 through the lead wires 181 and 182 , a current flows from the P-type thermoelectric leg 130 to the N-type thermoelectric leg 140 due to the Peltier effect.
  • the substrate through which flows absorbs heat to act as a cooling unit, and the substrate through which current flows from the N-type thermoelectric leg 140 to the P-type thermoelectric leg 130 may be heated and act as a heating unit.
  • a temperature difference between the lower electrode 120 and the upper electrode 150 when a temperature difference between the lower electrode 120 and the upper electrode 150 is applied, the charges in the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 move due to the Seebeck effect, and electricity may be generated. .
  • the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be bismuth telluride (Bi-Te)-based thermoelectric legs including bismuth (Bi) and tellurium (Te) as main raw materials.
  • P-type thermoelectric leg 130 is antimony (Sb), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium It may be a bismuthtelluride (Bi-Te)-based thermoelectric leg including at least one of (Te), bismuth (Bi), and indium (In).
  • the P-type thermoelectric leg 130 contains 99 to 99.999 wt% of Bi-Sb-Te, which is a main raw material, based on 100 wt% of the total weight, and nickel (Ni), aluminum (Al), copper (Cu) , at least one of silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) may be included in an amount of 0.001 to 1 wt%.
  • N-type thermoelectric leg 140 is selenium (Se), nickel (Ni), aluminum (Al), copper (Cu), silver (Ag), lead (Pb), boron (B), gallium (Ga), tellurium It may be a bismuthtelluride (Bi-Te)-based thermoelectric leg including at least one of (Te), bismuth (Bi), and indium (In).
  • the N-type thermoelectric leg 140 contains 99 to 99.999 wt% of Bi-Se-Te, a main raw material, based on 100 wt% of the total weight, and nickel (Ni), aluminum (Al), copper (Cu) , at least one of silver (Ag), lead (Pb), boron (B), gallium (Ga), and indium (In) may be included in an amount of 0.001 to 1 wt%.
  • thermoelectric leg may be referred to as a semiconductor structure, a semiconductor device, a semiconductor material layer, a semiconductor material layer, a semiconductor material layer, a conductive semiconductor structure, a thermoelectric structure, a thermoelectric material layer, a thermoelectric material layer, a thermoelectric material layer, etc. have.
  • the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be formed in a bulk type or a stack type.
  • the bulk-type P-type thermoelectric leg 130 or the bulk-type N-type thermoelectric leg 140 heat-treats a thermoelectric material to manufacture an ingot, grinds the ingot and sieves to obtain a powder for the thermoelectric leg, and then It can be obtained through the process of sintering and cutting the sintered body.
  • the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be polycrystalline thermoelectric legs. For polycrystalline thermoelectric legs, when sintering powder for thermoelectric legs, it can be compressed to 100 MPa to 200 MPa.
  • the thermoelectric leg powder when the P-type thermoelectric leg 130 is sintered, the thermoelectric leg powder may be sintered at 100 to 150 MPa, preferably 110 to 140 MPa, more preferably 120 to 130 MPa.
  • the powder for the thermoelectric leg when the N-type thermoelectric leg 130 is sintered, the powder for the thermoelectric leg may be sintered at 150 to 200 MPa, preferably 160 to 195 MPa, more preferably 170 to 190 MPa.
  • the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 are polycrystalline thermoelectric legs, the strength of the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 may be increased.
  • the laminated P-type thermoelectric leg 130 or the laminated N-type thermoelectric leg 140 is formed by applying a paste containing a thermoelectric material on a sheet-shaped substrate to form a unit member, and then stacking and cutting the unit member. can be obtained
  • the pair of P-type thermoelectric legs 130 and N-type thermoelectric legs 140 may have the same shape and volume, or may have different shapes and volumes.
  • the height or cross-sectional area of the N-type thermoelectric leg 140 is calculated as the height or cross-sectional area of the P-type thermoelectric leg 130 . may be formed differently.
  • the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have a cylindrical shape, a polygonal column shape, an elliptical column shape, or the like.
  • the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may have a stacked structure.
  • the P-type thermoelectric leg or the N-type thermoelectric leg may be formed by stacking a plurality of structures coated with a semiconductor material on a sheet-shaped substrate and then cutting them. Accordingly, it is possible to prevent material loss and improve electrical conductivity properties.
  • Each structure may further include a conductive layer having an opening pattern, thereby increasing adhesion between the structures, decreasing thermal conductivity, and increasing electrical conductivity.
  • the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 may be formed to have different cross-sectional areas within one thermoelectric leg.
  • the cross-sectional area of both ends arranged to face the electrode in one thermoelectric leg may be formed to be larger than the cross-sectional area between the two ends. According to this, since the temperature difference between both ends can be formed large, thermoelectric efficiency can be increased.
  • thermoelectric figure of merit ZT
  • Equation (1) The performance of the thermoelectric element according to an embodiment of the present invention may be expressed as a figure of merit (ZT).
  • ZT The thermoelectric figure of merit (ZT) may be expressed as in Equation (1).
  • ⁇ is the Seebeck coefficient [V/K]
  • ⁇ is the electrical conductivity [S/m]
  • ⁇ 2 ⁇ is the power factor (Power Factor, [W/mK 2 ]).
  • T is the temperature
  • k is the thermal conductivity [W/mK].
  • k can be expressed as a ⁇ cp ⁇ , a is the thermal diffusivity [cm 2 /S], cp is the specific heat [J/gK], ⁇ is the density [g/cm 3 ].
  • thermoelectric figure of merit of the thermoelectric element In order to obtain the thermoelectric figure of merit of the thermoelectric element, a Z value (V/K) is measured using a Z meter, and a thermoelectric figure of merit (ZT) can be calculated using the measured Z value.
  • the lower electrode 120 is disposed between the lower substrate 110 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 140 , and the upper substrate 160 and the P-type thermoelectric leg 130 and the N-type thermoelectric leg 130 .
  • the upper electrode 150 disposed between the thermoelectric legs 140 includes at least one of copper (Cu), silver (Ag), aluminum (Al), and nickel (Ni), and has a thickness of 0.01 mm to 0.3 mm. can When the thickness of the lower electrode 120 or the upper electrode 150 is less than 0.01 mm, the function as an electrode may deteriorate and the electrical conduction performance may be lowered, and if it exceeds 0.3 mm, the conduction efficiency may be lowered due to an increase in resistance. .
  • the lower substrate 110 and the upper substrate 160 facing each other may be a metal substrate, and the thickness thereof may be 0.1 mm to 1.5 mm.
  • the thickness of the metal substrate is less than 0.1 mm or exceeds 1.5 mm, heat dissipation characteristics or thermal conductivity may be excessively high, and thus reliability of the thermoelectric element may be deteriorated.
  • the insulating layer 170 is disposed between the lower substrate 110 and the lower electrode 120 and between the upper substrate 160 and the upper electrode 150 , respectively. ) may be further formed.
  • the insulating layer 170 may include a material having a thermal conductivity of 1 to 20 W/mK.
  • the sizes of the lower substrate 110 and the upper substrate 160 may be different.
  • the volume, thickness, or area of one of the lower substrate 110 and the upper substrate 160 may be larger than the volume, thickness, or area of the other. Accordingly, heat absorbing performance or heat dissipation performance of the thermoelectric element may be improved.
  • the volume, thickness, or area of the lower substrate 110 may be larger than at least one of the volume, thickness, or area of the upper substrate 160 .
  • At least one of a volume, a thickness, or an area may be larger than that of the upper substrate 160 when it is disposed on the .
  • the area of the lower substrate 110 may be formed in a range of 1.2 to 5 times the area of the upper substrate 160 .
  • the effect on the improvement of heat transfer efficiency is not high, and when it exceeds 5 times, the heat transfer efficiency is rather significantly reduced, and the thermoelectric module It can be difficult to maintain the basic shape of
  • a heat dissipation pattern for example, a concave-convex pattern
  • a concave-convex pattern may be formed on the surface of at least one of the lower substrate 110 and the upper substrate 160 . Accordingly, the heat dissipation performance of the thermoelectric element may be improved.
  • the concave-convex pattern is formed on a surface in contact with the P-type thermoelectric leg 130 or the N-type thermoelectric leg 140 , bonding characteristics between the thermoelectric leg and the substrate may also be improved.
  • the thermoelectric element 100 includes a lower substrate 110 , a lower electrode 120 , a P-type thermoelectric leg 130 , an N-type thermoelectric leg 140 , an upper electrode 150 , and an upper substrate 160 .
  • a sealing member 190 may be further disposed between the lower substrate 110 and the upper substrate 160 .
  • the sealing member may be disposed between the lower substrate 110 and the upper substrate 160 on the side surfaces of the lower electrode 120 , the P-type thermoelectric leg 130 , the N-type thermoelectric leg 140 , and the upper electrode 150 .
  • the lower electrode 120 , the P-type thermoelectric leg 130 , the N-type thermoelectric leg 140 , and the upper electrode 150 may be sealed from external moisture, heat, contamination, and the like.
  • the sealing member 190 includes the outermost portions of the plurality of lower electrodes 120 , the outermost portions of the plurality of P-type thermoelectric legs 130 and the plurality of N-type thermoelectric legs 140 , and the plurality of upper electrodes 150 .
  • the sealing case 192, the sealing case 192 and the lower substrate 110, the sealing material 194, and the sealing case 192 and the upper substrate 160 are disposed spaced apart from the outermost side of the It may include a sealing material 196 disposed on the.
  • the sealing case 192 may contact the lower substrate 110 and the upper substrate 160 via the sealing materials 194 and 196 .
  • the sealing materials 194 and 196 may include at least one of an epoxy resin and a silicone resin, or a tape in which at least one of an epoxy resin and a silicone resin is applied to both surfaces.
  • the sealing materials 194 and 194 serve to seal between the sealing case 192 and the lower substrate 110 and between the sealing case 192 and the upper substrate 160, and the lower electrode 120, the P-type thermoelectric leg ( 130), the sealing effect of the N-type thermoelectric leg 140 and the upper electrode 150 may be increased, and may be mixed with a finishing material, a finishing layer, a waterproofing material, a waterproofing layer, and the like.
  • the sealing material 194 for sealing between the sealing case 192 and the lower substrate 110 is disposed on the upper surface of the lower substrate 110, and the sealing material for sealing between the sealing case 192 and the upper substrate 160 ( 196 may be disposed on the side of the upper substrate 160 .
  • the area of the lower substrate 110 may be larger than the area of the upper substrate 160 .
  • a guide groove G for drawing out the lead wires 181 and 182 connected to the electrode may be formed in the sealing case 192 .
  • the sealing case 192 may be an injection-molded product made of plastic or the like, and may be mixed with a sealing cover.
  • the above description of the sealing member is merely an example, and the sealing member may be modified in various forms.
  • an insulating material may be further included to surround the sealing member.
  • the sealing member may include a heat insulating component.
  • lower substrate 110 lower electrode 120 , upper electrode 150 , and upper substrate 160 are used, but these are arbitrarily referred to as upper and lower for ease of understanding and convenience of description. However, the positions may be reversed so that the lower substrate 110 and the lower electrode 120 are disposed on the upper portion, and the upper electrode 150 and the upper substrate 160 are disposed on the lower portion.
  • FIG. 5 is a perspective view of a thermoelectric module according to an embodiment of the present invention
  • FIG. 6 is a perspective view of a heat exchange unit included in the thermoelectric module according to an embodiment of the present invention
  • FIG. 7 is a thermoelectric module according to an embodiment of the present invention.
  • An exploded perspective view of the heat exchange unit included in the module FIG. 8 is a perspective view of the cover included in the heat exchange unit of FIG. 7
  • FIG. 9 is a cross-sectional view of the heat exchange unit included in the thermoelectric module according to an embodiment of the present invention
  • FIG. 10 is A guide disposed in a case of a heat exchange unit according to an embodiment of the present invention
  • FIG. 11 is a cross-sectional view of a thermoelectric module according to an embodiment of the present invention.
  • thermoelectric module according to an embodiment of the present invention includes a heat exchange unit 200 and a thermoelectric element 100 disposed on the heat exchange unit 200 .
  • the thermoelectric element 100 may be the thermoelectric element of FIGS. 1 to 4 .
  • the heat exchange unit 200 is a low-temperature part of the thermoelectric element 100 . In contact with the side, it can serve to lower the temperature of the low-temperature side. To this end, cooling water for lowering the temperature of the low temperature part of the thermoelectric element 100 may flow through the heat exchange unit 200 .
  • the heat exchange unit 200 is the thermoelectric element 100 . It may be in contact with the high-temperature side of the , and may serve to increase the temperature of the high-temperature side. To this end, hot water for increasing the temperature of the high temperature part of the thermoelectric element 100 may flow through the heat exchange part 200 .
  • thermoelectric element 100 included in the thermoelectric module according to the embodiment of the present invention is a Peltier element
  • the heat exchange unit 200 is cooled by contacting the heat absorbing surface of the thermoelectric element 100, or the thermoelectric element 100 generates heat. It can be heated by contact with the surface.
  • thermoelectric module may vary depending on the heat transfer efficiency between the heat exchange unit 200 and the thermoelectric element 100 .
  • the heat exchange unit 200 includes a case 210 for accommodating a material for heat exchange and a cover 220 covering the case 210 .
  • the heat exchange material may be a cooling fluid or a heating fluid.
  • the heat exchange unit 200 may be disposed on the low temperature side of the thermoelectric element 100 , and accordingly, the heat exchange material may be a cooling fluid.
  • the cooling fluid may be introduced through the fluid inlet (I) of the case 210 , accommodated in the case 210 , and discharged through the fluid outlet (O) of the case 210 . At this time, the temperature of the fluid introduced through the fluid inlet (I) may be lower than the temperature of the fluid discharged through the fluid outlet (O).
  • the heat exchange unit 200 may be disposed on the high temperature side of the thermoelectric element 100 , and accordingly, the heat exchange material may be a high temperature fluid.
  • the fluid may be introduced through the fluid inlet I of the case 210 , accommodated in the case 210 , and discharged through the fluid outlet O of the case 210 .
  • the temperature of the fluid introduced through the fluid inlet (I) may be higher than the temperature of the fluid discharged through the fluid outlet (O).
  • the heat exchange unit 200 may be disposed on the heat absorbing surface of the thermoelectric element 100 , and thus the heat exchange material may be cooled.
  • the heat exchange material is a fluid
  • the fluid may be introduced through the fluid inlet I of the case 210 , accommodated in the case 210 , and discharged through the fluid outlet O of the case 210 .
  • the temperature of the fluid introduced through the fluid inlet (I) may be higher than the temperature of the fluid discharged through the fluid outlet (O).
  • the thermoelectric element 100 is a Peltier element
  • the heat exchange unit 200 may be disposed on the heating surface of the thermoelectric element 100 , and thus the heat exchange material may be heated.
  • the fluid When the heat exchange material is a fluid, the fluid may be introduced through the fluid inlet I of the case 210 , accommodated in the case 210 , and discharged through the fluid outlet O of the case 210 . At this time, the temperature of the fluid introduced through the fluid inlet (I) may be lower than the temperature of the fluid discharged through the fluid outlet (O).
  • the fluid is not limited to a liquid, and may refer to an object having fluidity.
  • the thermoelectric element 100 is disposed on the cover 220 of the heat exchange unit 200 , and the thermal conductivity of the cover 220 may be higher than that of the case 210 .
  • the cover 220 may include a metal, and the metal may be copper, aluminum, a copper-aluminum alloy, or the like.
  • the case 210 may include a heat insulating material, and the heat insulating material may include polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), poly phenylene sulfide (PPS), and the like.
  • the cover 220 on which the thermoelectric element 100 is disposed includes a metal having high thermal conductivity
  • the case 210 for accommodating the heat exchange material includes a heat insulating material with low thermal conductivity
  • the cover 220 can be a medium for efficient heat transfer between the heat exchange material accommodated in the case 210 and the thermoelectric element 100
  • the case 210 accommodating the heat exchange material can insulate the heat exchange material from the outside, so heat exchange Heat loss of the molten material can be prevented, and heat transfer performance between the thermoelectric element 100 and the heat exchange unit 200 can be improved.
  • a fluid inlet (I) and a fluid outlet (O) may be formed in the case 210 .
  • the fluid inlet (I) and the fluid outlet (O) contain a heat insulating material with low thermal conductivity like the case 210, heat loss of the heat exchange material through the process in which the fluid is introduced or discharged is prevented. can do.
  • the case 210 of the heat exchange unit 200 is made of a plastic material such as PC, ABS, PPS,
  • the material cost of the heat exchange unit 200 can be reduced, and the weight can be reduced.
  • the cover 220 is disposed to face the outside of the case 210 , and the first surface 222 on which the thermoelectric element 100 is disposed and the inside of the case 210 . It may include a second surface 224 disposed to face.
  • a plurality of heat dissipation fins 230 may be formed on the second surface 224 of the cover 220 .
  • the plurality of heat dissipation fins 230 may be made of the same material as the cover 220 , and may be integrally formed with the cover 220 .
  • the heat exchange unit ( The heat transfer efficiency between the 200 ) and the thermoelectric element 100 may be further increased.
  • a first area 212 in which a plurality of heat dissipation fins 230 are disposed and a second area ( 214) may be included.
  • a material for heat exchange may be accommodated in the first region 212 .
  • the plurality of heat dissipation fins 230 may be spaced apart from each other, and the bottom surface 212-1 of the first region 212 and the plurality of heat dissipation fins 230 may also be spaced apart from each other by a predetermined interval. Accordingly, the heat exchange material may flow between the plurality of heat dissipation fins 230 and between the bottom surface 212-1 of the first region 212 and the plurality of heat dissipation fins 230 .
  • the height H2 of the second region 214 may be higher than the height H1 of the first region 212 .
  • the second surface 224 of the cover 220 may contact the second region 214 of the case 210 .
  • the case 210 and the cover 220 may be coupled through a plurality of coupling members 240 in the second region 214 of the case 210 .
  • a plurality of holes h1 and h2 are formed in the second region 214 of the cover 220 and the case 210 to correspond to each other, and a plurality of coupling members 240 . may pass through the plurality of holes h1 and h2 and the case 210 and the cover 220 may be fastened. Accordingly, the cover 220 of the heat exchange unit 200 may be stably fixed on the case 210 .
  • a predetermined distance d between the bottom surface 212-1 of the first region 212 and the plurality of heat dissipation fins 230 is the height H2 of the second region 214 and the height H2 of the first region 212 . It may be 0.1 to 0.7 times the difference between the heights H1, preferably 0.2 to 0.6 times, and more preferably 0.3 to 0.5 times. Accordingly, while the contact area between the plurality of heat dissipation fins 230 and the material for heat exchange is sufficiently guaranteed, the plurality of heat radiation fins 230 may not interfere with the flow of the material for heat exchange.
  • the case 210 of the heat exchange unit 200 may further include a third region 216 surrounding the second region 214 .
  • the case 210 further includes a third region 216 that extends outwardly more than the second region 214
  • the heat exchange material accommodated in the first region 212 may be insulated from the outside.
  • the width w3 of the third region 216 may be 0.5 to 2 times the width w2 of the second region 214 . Accordingly, the heat insulating performance of the heat exchange material accommodated in the first region 212 may be further increased.
  • the height H3 of the third region 216 may be higher than the height H2 of the second region 214 .
  • a difference between the height H3 of the third region 216 and the height H2 of the second region 214 may be greater than or equal to the thickness D of the cover 220 .
  • a difference between the height H3 of the third region 216 and the height H2 of the second region 214 may be 1 to 1.2 times the thickness D of the cover 220 .
  • the third region 216 of the case 210 including the heat insulating material is disposed on the side surface of the cover 220, the problem of heat loss of the heat exchange material through the side surface of the cover 220 can be prevented. Accordingly, heat transfer efficiency between the cover 220 and the thermoelectric element 100 may be further improved.
  • the case 210 and the cover 220 of the heat exchange unit 200 may be watertight in the second region 214 .
  • the case 210 and the cover 220 of the heat exchange unit 200 may be watertight by an O-ring.
  • a ring-shaped groove 214-1 may be formed in the second region 214 of the case 210, and an O-ring 250 may be disposed in the groove 214-1. Accordingly, heat exchange It is possible to prevent a problem that the heat exchange material accommodated in the unit 200 leaks out of the heat exchange unit 200 .
  • At least one guide 260 protruding from the bottom surface 212-1 may be disposed in the first region 212 of the case 210 .
  • the guide 260 may guide the flow of a fluid, which is a material for heat exchange.
  • one end of the guide 260 may be spaced apart from the wall surface of the case 210 . Accordingly, the fluid may pass through a space between one end of the guide 260 and the wall surface of the case 210 .
  • the guide 260 is positioned between the fluid inlet (I) and the fluid outlet (O) between the fluid inlet (I) and the fluid outlet (O) It may extend from the surface S1 on which (O) is formed toward the surface S2 opposite to it. Accordingly, the fluid introduced into the fluid inlet (I) may be discharged through the fluid outlet (O) after circulating inside the first region (212) of the case (210).
  • the plurality of heat dissipation fins 230 may be arranged to extend in a direction parallel to the direction in which the guide 260 extends. Accordingly, the plurality of heat dissipation fins 230 may not interfere with the flow of the fluid.
  • a plurality of guides 260 may be disposed, and may be disposed in various shapes to form a flow path in the first region 212 .
  • 10 is a guide disposed in a case of a heat exchange unit according to an embodiment of the present invention.
  • the guide 260 is formed between the fluid inlet (I) and the fluid outlet (O) from the surface S1 where the fluid inlet (I) and the fluid outlet (O) are formed to the opposite surface (S2) ) is extended to face, and may be spaced apart from the surface (S2).
  • some of the plurality of guides 262 and 264 are formed from the surface S1 where the fluid inlet I and the fluid outlet O are formed between the fluid inlet I and the fluid outlet O from the surface ( It extends toward S2 and may be spaced apart from the surface S2 , and the other portion 266 extends from the surface S2 toward the surface S1 and may be spaced apart from the surface S1 .
  • the fluid introduced into the heat exchange unit 200 may be evenly circulated inside the heat exchange unit 200 and then discharged.
  • the thermoelectric element 100 may be disposed on the heat exchange unit 200 according to an embodiment of the present invention.
  • the width of the substrate 110 of the thermoelectric element 100 may be smaller than the width of the cover 220 of the heat exchange unit 200 .
  • the thermoelectric element 100 may be disposed in an area in which the plurality of coupling members 240 are disposed. Accordingly, since the space between the thermoelectric element 100 and the heat exchange unit 200 can be minimized, heat transfer performance between the thermoelectric element 100 and the heat exchange unit 200 can be improved.
  • a heat sink 300 may be further disposed on the thermoelectric element 100 . That is, the heat exchange unit 200 is disposed on one side of the thermoelectric element 100 and the heat sink 300 is disposed on the other side, and accordingly, the temperature difference between the high temperature part and the low temperature part of the thermoelectric element 100 may increase.

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Un module thermoélectrique selon un mode de réalisation de la présente invention comprend : une unité d'échange de chaleur; et un élément thermoélectrique disposé sur l'unité d'échange de chaleur, l'unité d'échange de chaleur comprenant un boîtier destiné à recevoir un matériau pour un échange de chaleur et un couvercle recouvrant le boîtier, l'élément thermoélectrique étant disposé sur le couvercle, et la conductivité thermique du couvercle étant supérieure à la conductivité thermique du boîtier.
PCT/KR2020/018792 2020-01-07 2020-12-21 Module thermoélectrique WO2021141284A1 (fr)

Priority Applications (2)

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CN202080091981.9A CN114930552A (zh) 2020-01-07 2020-12-21 热电模块
US17/791,150 US12108673B2 (en) 2020-01-07 2020-12-21 Thermoelectric module

Applications Claiming Priority (2)

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KR1020200002123A KR20210088978A (ko) 2020-01-07 2020-01-07 열전모듈
KR10-2020-0002123 2020-01-07

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KR (1) KR20210088978A (fr)
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JP2008021931A (ja) * 2006-07-14 2008-01-31 Denso Corp 熱電変換装置
KR20120079277A (ko) * 2011-01-04 2012-07-12 주식회사 제이에스티 냉각 모듈 및 이를 포함하는 냉각 시스템
KR20130013195A (ko) * 2011-07-27 2013-02-06 주식회사 글로벌스탠다드테크놀로지 공정냉각시스템용 열교환기
JP2013239477A (ja) * 2012-05-11 2013-11-28 Toyota Industries Corp 温度調節装置
KR20190038101A (ko) * 2017-09-29 2019-04-08 엘지이노텍 주식회사 열변환 장치

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KR20210088978A (ko) 2021-07-15
US20230027983A1 (en) 2023-01-26
CN114930552A (zh) 2022-08-19
US12108673B2 (en) 2024-10-01

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