WO2021120594A1 - 旋转光路光束装置及其使用方法及旋转光路光束系统 - Google Patents

旋转光路光束装置及其使用方法及旋转光路光束系统 Download PDF

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WO2021120594A1
WO2021120594A1 PCT/CN2020/100228 CN2020100228W WO2021120594A1 WO 2021120594 A1 WO2021120594 A1 WO 2021120594A1 CN 2020100228 W CN2020100228 W CN 2020100228W WO 2021120594 A1 WO2021120594 A1 WO 2021120594A1
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Prior art keywords
lens group
focusing
optical path
rotating
beam device
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PCT/CN2020/100228
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English (en)
French (fr)
Inventor
王雪辉
温彬
喻浩
王建刚
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武汉华工激光工程有限责任公司
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Publication of WO2021120594A1 publication Critical patent/WO2021120594A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/06—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems

Definitions

  • This application relates to the technical field of laser precision deep hole processing, in particular to a rotating optical path beam device and its use method and a rotating optical path beam system.
  • micro-hole processing With the development of industry and science and technology, there are currently three methods for micro-hole processing: mechanical drilling, electric spark drilling, and laser drilling. Among them, mechanical methods have low processing efficiency and rough hole walls, which cannot guarantee the shape of the holes. The processing results of brittle materials and soft materials are not ideal, and some precision micro-holes cannot be processed. EDM is used to burn through the material with an instantaneous high-energy current. The diameter of the hole is determined by the intensity of the current. Therefore, the sidewall and the shape of the hole cannot be well controlled, and a remelted layer is easily formed, which leads to a rough section. ⁇ Poor degree.
  • Laser perforation is a non-contact perforation method.
  • the laser perforation method in the prior art has a prism that will affect the polarization state of the laser when the angle of light increases, and the change in the polarization state of the laser will affect the actual The shape of the processed hole makes it impossible to freely control the roundness of the hole during the drilling process.
  • the present application provides a rotating optical path beam device, a method of use thereof, and a rotating optical path beam system, so as to achieve at least one of the technical effects of reducing the polarization state of the laser during the drilling process and ensuring the roundness of the processed hole.
  • the embodiment of the present application provides a rotating optical path beam device, including: a wave plate rotating mechanism, a two-dimensional scanning mechanism, a first adjusting mirror group, a second adjusting mirror group, a reflecting mirror, and a focusing lens group that are sequentially distributed along an optical axis;
  • the wave plate rotation mechanism is configured to rotate the incident laser beam at a high speed to form uniform polarization states in all directions, and to maintain the polarization state of the laser beam in a radial distribution;
  • the two-dimensional scanning mechanism is configured to scan the XY plane of the laser beam to form a processing site
  • the ring that rotates around the optical axis is needed; the first adjusting lens group, the second adjusting lens group, the reflecting mirror and the focusing lens group are configured to control the size of the ring and the angle of the light beam.
  • the wave plate rotating mechanism includes a wave plate and a rotating electric machine; wherein, the rotating electric machine controls the wave plate to rotate at a high speed with the optical axis as the rotating axis.
  • the polarization state of the external laser remains radial, and the laser beam passing through the wave plate is configured to form a polarization state that is consistent in all directions, so that the polarization state is synchronized with the laser processing route.
  • the positions of the first adjusting lens group and the second adjusting lens group are not fixed.
  • the first adjusting lens group includes at least two focusing components, each focusing component includes at least one focusing lens, and the distance between the focusing components is not fixed;
  • the second adjusting lens group includes at least two focusing components, each Each focusing component includes at least one focusing lens, and the distance between the focusing components is not fixed;
  • the focusing component of the first adjusting lens group and the focusing component of the second adjusting lens group move at the same time and are configured to be the size of the adjusting ring.
  • the focal length ratio range of the first adjusting lens group and the second adjusting lens group is 0.5-2.
  • the mirror is also configured to rotate the optical axis by 90°.
  • the position between the second adjusting mirror group and the reflecting mirror is not fixed.
  • the focusing lens group includes at least three lenses, which are configured to adjust the angle of the laser beam.
  • the distance between the reflecting mirror and the focusing lens group is fixed.
  • the rotating light path beam device further includes a perforation detection unit configured to detect whether the aperture is opened in real time.
  • the rotating optical path beam device further includes: a position detection unit configured to detect the position of the laser beam in real time.
  • the first adjusting lens group includes a first focusing component and a second focusing component, and the position between the first focusing component and the second focusing component can be relatively adjusted to be configured to obtain different focal lengths and ranges of focal lengths It is 500mm-1000mm.
  • the second adjusting lens group includes a third focusing assembly and a fourth focusing assembly, the position between the third focusing assembly and the fourth focusing assembly can be adjusted relatively, and the third focusing assembly The adjustment amount with the fourth focusing assembly moves synchronously with the adjustment of the first adjustment lens group.
  • the focusing lens group includes a first lens, a second lens, and a third lens, the distance between the first lens and the second lens ranges from 20mm to 75mm, and the second lens and the second lens The distance between the three lenses is 20mm-75mm.
  • This application provides a method for using the beam device based on the rotating optical path, which includes the following steps:
  • the laser beam with the polarization state is incident on the wave plate rotating mechanism, and the high-speed rotation of the wave plate through the wave plate rotating mechanism around the optical axis forms light with the same polarization state in all directions, keeping the polarization state of the light always distributed in the radial direction;
  • the first adjusting lens group After the light beam passes through the first adjusting lens group, the second adjusting lens group, the reflecting mirror, and the focusing lens group, it is configured to form the required light beams of different angles and different diameters.
  • the laser passes through a two-dimensional scanning mechanism, the beam is deflected by 90°, and the optical axis is rotated by 90°.
  • the step of passing the light beam through the first adjusting lens group, the second adjusting lens group, the reflecting mirror, and the focusing lens group further includes:
  • the relative positions of the first adjusting lens group and the second adjusting lens group are adjusted to be configured to change the requirements of different apertures and different angles.
  • the embodiment of the application provides a rotating optical path beam system.
  • the system includes the rotating optical path beam device, and further includes a laser and a remote terminal.
  • the remote terminal includes a coordinated control card; the remote terminal is configured to send a signal to the coordinated control card; coordinated control The card is configured to send the received signal to the wave plate rotating mechanism and the two-dimensional scanning mechanism of the laser and the rotating light beam device, and to receive the feedback signal sent by the laser, the wave plate rotating mechanism and the two-dimensional scanning mechanism, so that the laser processing path Synchronize with the radial direction of the polarization state.
  • the embodiments of the application provide a rotating optical path beam device and a rotating optical path beam system, which can make the laser beam incident on the wave plate rotating mechanism form a uniform polarization state in all directions after high-speed rotation, and can maintain the polarization state of the laser beam as Radial distribution, and then scan the XY plane of the laser beam through a two-dimensional scanning mechanism to form a ring that rotates around the optical axis required for processing.
  • the above-mentioned rotating optical path beam device can be rotated at a high speed by the wave plate rotating mechanism, so that the polarization state of the laser beam is always radial, forming the same polarization state in all directions, and through the continuous wave plate rotating mechanism and the two-dimensional scanning mechanism.
  • the adjustment makes the polarization state of the laser beam synchronized with the laser processing path, thereby reducing the influence of the laser polarization state during the drilling process, freely controlling the roundness of the hole, and thus ensuring the roundness of the processing hole.
  • FIG. 1 is a schematic structural diagram of a rotating optical path beam device provided by an embodiment of the application
  • FIG. 2 is a schematic diagram of rotation of different polarized light rays provided by an embodiment of the application
  • FIG. 3 is a schematic structural diagram of another rotating optical path beam device provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of a specific rotating optical path beam device provided by an embodiment of the application.
  • FIG. 5 is a light ray diagram when the angle ⁇ satisfies 0° ⁇ 90° according to an embodiment of the application
  • Fig. 7 provides a light ray diagram when the angle ⁇ satisfies ⁇ >90° according to the embodiment of the present application
  • FIG. 8 is a schematic structural diagram of a rotating optical path beam system provided by an embodiment of the present application.
  • Icon 10-wave plate rotating mechanism; 20-two-dimensional scanning mechanism; 30-first adjusting lens group; 40-second adjusting lens group; 50-reflector; 60-focusing lens group; 70-perforation detection unit; 80 -Position detection unit; 100-rotating optical path beam device; 101-wave plate; 200-laser; 300-remote terminal; 400-cooperative control card; 301-first focusing assembly; 302-second focusing assembly; 401-third Focusing component; 402-fourth focusing component; 601-first lens; 602-second lens; 603-third lens.
  • laser drilling is a non-contact drilling method. Compared with traditional drilling methods, it has more prominent advantages and wider applicability.
  • laser drilling methods include impact drilling and Rotate hole punch.
  • the impact drilling method requires particularly high beam quality of the laser. Due to the problem of poor repetition stability, in order to reduce the impact of the laser beam quality, an aperture is added at a certain position of the optical path to obtain the expected desired results. The profile of the obtained laser beam can enhance the utilization of light, but the above operation requires very tedious calculations and cannot guarantee the processing of micro holes.
  • the rotary drilling is also called the roundabout contour method
  • the commonly used processing methods include the rotating prism method, the off-axis rotating lens method and the rotating prism method.
  • the commonly used method of rotary drilling is composed of a rotating prism and an aberration optical component.
  • the laser beam is rotated around the optical axis through a Dove prism installed in a high-speed hollow shaft motor, and the emitted laser beam takes a circular path relative to the surface of the workpiece. movement.
  • the laser beam will form a micro-hole with a certain taper on the workpiece. Therefore, it needs to be realized through complex calculations using specially developed control software and functional expressions.
  • the above two laser processing methods have another problem at the same time: when the angle of the light increases, the prism has a great influence on the polarization state, and the change of the laser polarization state will directly affect the material's light absorption rate.
  • the different light absorption rate of different positions will affect the shape of the actual processed hole, including the roundness and the size of the light inlet and the light outlet.
  • the polarization state if the incident laser beam is linearly polarized, the processed elliptical hole will be obtained.
  • someone in the prior art proposes to put a wave plate in a static mode to convert linearly polarized light into circularly polarized light.
  • the rotating optical path beam device and its use method and the rotating optical path beam system provided by the embodiments of the present application can reduce the influence of the laser polarization state during the drilling process and ensure the roundness of the processed hole.
  • the rotating optical path beam device includes: The wave plate rotating mechanism 10, the two-dimensional scanning mechanism 20, the first adjusting lens group 30, the second adjusting lens group 40, the reflecting mirror 50 and the focusing lens group 60 are sequentially distributed along the optical axis.
  • the wave plate rotating mechanism 10 is configured to rotate the incident laser beam at a high speed to form uniform polarization states in all directions, so as to maintain the polarization state of the laser beam in a radial distribution.
  • the wave plate rotating mechanism 10 includes: a wave plate and a rotating motor.
  • the rotating motor controls the wave plate to rotate at a high speed with the optical axis as the rotation axis to maintain the polarization state of the laser until it is radial, so that the pass wave
  • the laser beam of the sheet forms a uniform polarization state in all directions, and the polarization state is synchronized with the laser processing path, so that the influence of the polarization state during the drilling process can be solved, and the roundness of the hole can be controlled.
  • the two-dimensional scanning mechanism 20 is configured to scan the X-Y plane of the laser beam to form a ring that rotates around the optical axis required for processing.
  • the first adjusting lens group 30, the second adjusting lens group 40, the reflecting mirror 50 and the focusing lens group 60 are configured to control the size of the ring and the angle of the light beam.
  • the first adjusting lens group 30 and the second adjusting lens group 40 are relatively movable, and the size of the ring can be controlled by adjusting the distance between the first adjusting lens group 30 and the second adjusting lens group 40, where ,
  • the focal length ratio range of the first adjusting lens group and the second adjusting lens group may be 0.5-2.
  • the size of the final laser beam forming ring can be controlled by adjusting the distance between the first adjusting lens group 30 and the second adjusting lens group 40.
  • the first adjusting lens group 30 includes at least two focusing components, each focusing component includes at least one focusing lens, and the distance between the focusing components is not fixed.
  • the second adjusting lens group 40 includes at least two focusing components, each focusing component includes at least one focusing lens, and the distance between the focusing components is not fixed.
  • the focusing component of the first adjusting lens group 30 and the focusing component of the second adjusting lens group 40 can be moved at the same time, using the moving configuration of the focusing component of the first adjusting lens group 30 and the focusing component of the second adjusting lens group 40 To adjust the size of the laser beam forming ring, that is, to determine the size of the largest processing aperture and the smallest processing aperture under the currently available configuration.
  • the reflector 50 can be configured to rotate the optical axis by 90°, and the angle of the laser beam can be further adjusted by using the reflector to ensure that the required beams of rings with different angles and different diameters are formed.
  • the second adjusting lens group 40 can move synchronously with the first adjusting lens group 30, the position of the second adjusting lens group 40 can be moved. Therefore, the second adjusting lens group 40 will cause the second adjusting lens group 40 to move in the process of moving.
  • the distance between the second adjusting mirror group 40 and the reflecting mirror 50 is also not fixed, that is, it changes as the position of the second adjusting mirror group 40 changes.
  • the focusing lens group 60 may include at least three lenses.
  • the laser beam passes through three or more lenses in sequence, and is adjusted by multiple lenses to be configured to obtain laser beam angles that meet the requirements of different processing apertures.
  • the distance between the reflecting mirror 50 and the focusing lens group 60 can be fixed, and the specific value can be set according to the actual situation, which is not limited here.
  • the above-mentioned rotating optical path beam device can make the laser beam incident on the wave plate rotating mechanism form a uniform polarization state in all directions after high-speed rotation, and can maintain the polarization state of the laser beam to be radially distributed, and then pass
  • the two-dimensional scanning mechanism scans the XY plane of the laser beam to form a ring that rotates around the optical axis required for processing.
  • the above-mentioned rotating optical path beam device can be rotated at a high speed by the wave plate rotating mechanism, so that the polarization state of the laser beam is always radial, forming the same polarization state in all directions, and through the continuous wave plate rotating mechanism and the two-dimensional scanning mechanism.
  • the adjustment makes the polarization state of the laser beam synchronized with the laser processing path, thereby reducing the influence of the laser polarization state during the drilling process, freely controlling the roundness of the hole, and thus ensuring the roundness of the processing hole.
  • the polarization state of the laser may have many forms, such as linear polarization, elliptical polarization, and radial polarization.
  • the polarization state of the ring finally formed after the light of different polarization states passes through the above-mentioned device is also different.
  • the embodiment of the present application provides a schematic diagram of the rotation of light of different polarizations, as shown in FIG. 2.
  • part (a) of Figure 2 shows that the ring formed by the rotation of linearly polarized light remains linearly polarized in all directions; part (b) of Figure 2 shows that the ring formed by the rotation of elliptically polarized light remains in all directions Elliptical polarization; part (c) of Figure 2 illustrates that the ring formed by the rotation of radially polarized light rays maintains radial polarization in all directions.
  • the embodiment of the present application also provides another rotating optical path beam device.
  • FIG. 3 which shows that the device is in On the basis of FIG. 1, it also includes: a perforation detection unit 70 and a position detection unit 80.
  • the perforation detection unit 70 can detect whether the hole is open in real time, and the position detection unit 80 can detect the position of the laser beam in real time.
  • the relative distance of the second adjusting lens group 40, or the focusing component of the first adjusting lens group 30 and the focusing component of the second adjusting lens group 40 can be moved at the same time to adjust the angle of the light beam to ensure the shape and size of the hole.
  • the rotating optical path beam device includes: a wave plate rotating mechanism 10, a two-dimensional scanning mechanism 20, a first adjusting lens group 30, a second adjusting lens group 40, a reflecting mirror 50, and a focusing lens group.
  • Puncture detection unit 70 and position detection unit 80 The laser beam emitted by the laser passes through the wave plate rotating mechanism 10 to keep the polarization state of the laser always in the radial direction.
  • the laser beam After the laser beam passes through the high-speed rotation of the wave plate rotating mechanism 10, a circle with the same polarization state in all directions is formed, and the polarization state and The laser processing path is synchronized; after passing through the two-dimensional scanning mechanism 20, the laser beam is deflected by 90° and the optical axis is rotated by 90°.
  • the two-dimensional scanning mechanism 20 can realize the rotation of the laser beam around the rotated optical axis;
  • the light beam sequentially passes through the first adjusting lens group 30, the second adjusting lens group 40, the reflecting mirror 50, and the focusing lens group 60 to form the required light beams of rings with different angles and different diameters.
  • the adjustment of the different intervals of the respective focusing components of the first adjusting lens group 30 and the second adjusting lens group 40 can change the requirements of different apertures that can be achieved by actual processing, and the difference between the first adjusting lens group 30 and the second adjusting lens group 40 The relative movement can meet the angle requirements of the light beams passing through the focusing lens group 60 under different apertures.
  • the above device is not limited by the laser wavelength, and only needs to apply different film systems according to different wavelengths; among them, the above device has the ability to process different apertures, and the processing aperture range can be 20um-1.5mm , Such as: the diameter of the machining hole can be 70um, 100um, 1mm and so on. Therefore, the rotating light beam device provided by this embodiment can meet the processing requirements of small holes and large depth-to-diameter ratios. It can not only improve the roundness of the holes, but also freely control the shape of the processing and the incident angle of the beam.
  • This application provides a method for using the beam device based on the rotating optical path, which includes the following steps: incident laser light with a polarization state into the wave plate rotating mechanism 10, and passing through the high-speed rotation of the wave plate 101 of the wave plate rotating mechanism 10 around the optical axis Rotation is similar to light with the same polarization state in all directions, keeping the polarization state of the light always in a radial distribution; passing the laser beam through the two-dimensional scanning mechanism 20 around the rotated optical axis; passing the beam through the first adjusting mirror group 30.
  • the second adjusting lens group 40, the reflecting mirror 50, and the focusing lens group 60 they are configured to form the required light beams with different angles and different diameters.
  • the laser passes through the two-dimensional scanning mechanism 20, the beam is deflected by 90°, and the optical axis is rotated by 90°.
  • the step of passing the light beam through the first adjusting lens group 30, the second adjusting lens group 40, the reflecting mirror 50, and the focusing lens group 60 further includes: adjusting the first focusing assembly 301 and the second focusing assembly 301 and the second focusing assembly in the first adjusting lens group 30.
  • the relative position of the focusing assembly 302 is configured to change the requirements of different limit apertures; the relative positions of the first adjusting lens group 30 and the second adjusting lens group 40 are adjusted to change the requirements of different apertures and different angles.
  • adjusting the relative positions of the first focusing assembly 301 and the second focusing assembly 302 inside the first adjusting lens group 30 can change the requirements of different limit apertures; changing the first adjusting lens group 30 and the second adjusting lens group 40
  • the relative position of different apertures can be changed to the requirements of different angles.
  • the perforation detection unit 70 can be used to detect whether the hole is open in real time; the position detection unit 80 can detect the position of the light in real time to facilitate timely debugging and finding problems.
  • the rotating optical path beam device includes: a wave plate rotating mechanism 10, The two-dimensional scanning mechanism 20, the first adjusting lens group 30, the second adjusting lens group 40, the reflecting mirror 50, the focusing lens group 60, the perforation detecting unit 70 and the position detecting unit 80.
  • the wave plate rotating mechanism 10 includes a wave plate 101;
  • the first adjusting lens group 30 includes a first focusing assembly 301 and a second focusing assembly 302, and the position between the first focusing assembly 301 and the second focusing assembly 302 can be adjusted , Adjusting the distance between the first focusing component 301 and the second focusing component 302 will result in different focal lengths, where the focal length can range from 500mm to 1000mm;
  • the second adjusting lens group 40 includes a third focusing component 401 and a fourth focusing component 402, the position between the third focusing assembly 401 and the fourth focusing assembly 402 is also adjustable, and the adjustment amount between the third focusing assembly 401 and the fourth focusing assembly 402 is related to the adjustment of the first adjusting lens group 30;
  • the adjustment between the first focusing assembly 301 and the second focusing assembly 302 and between the third focusing assembly 401 and the fourth focusing assembly 402 can make the focal length of the first adjusting lens group 30 and the focal length of the second adjusting lens group 40 proportional to each
  • the range can be 0.5-2; the focusing lens group 60 includes a first lens 601, a second lens 602, and a third lens 603, and the distance between the focusing lens group 60 can be between 20mm-75mm, that is, the first lens 601 and the second lens
  • the distance between 602 is in the range of 20mm-75mm
  • the distance between the second lens 602 and the third lens 603 is in the range of 20mm-75mm.
  • the embodiment of the present application also exemplifies the situation of holes with different diameters and depths formed by the above-mentioned rotating light path beam device under different light rays:
  • an embodiment of the present application provides a rotating optical path beam system.
  • the system includes the system provided by the foregoing embodiment.
  • the rotating light beam device 100 further includes a laser 200 and a remote terminal 300.
  • the remote terminal 300 includes a cooperative control card 400; the remote terminal 300 is configured to send a signal to the cooperative control card 400; the cooperative control card 400 is configured to send the received signal to The wave plate rotating mechanism and the two-dimensional scanning mechanism of the laser 200 and the rotating optical path beam device 100, and receive the feedback signal sent by the laser 200, the wave plate rotating mechanism and the two-dimensional scanning mechanism, so that the laser processing path is maintained in the radial direction of the polarization state Synchronize.
  • the specific remote terminal 300 may be a computer, a mobile phone, a tablet computer, and the like.
  • the rotating optical path beam system can control the laser and the rotating optical path beam device through the cooperative control card in the remote terminal.
  • the rotating optical path beam device enables the laser to emit through the built-in wave plate rotating mechanism and the two-dimensional scanning mechanism.
  • the laser beam causes the incident laser beam to form a uniform polarization state in all directions after high-speed rotation.
  • the feedback signal is sent to the cooperative control card, and the polarization state of the laser beam is maintained in a radial distribution, which can reduce the rotation of the optical path beam device
  • the influence of the laser polarization state during the drilling process can freely control the roundness of the hole, thereby ensuring the roundness of the processed hole.
  • the terms “installed”, “connected”, and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection. , Or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection. , Or integrally connected; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication between two components.
  • the embodiment of the present application provides a rotating optical path beam device, a method of use thereof, and a rotating optical path beam system.
  • the polarization state of the laser beam is synchronized with the laser processing path through the continuous adjustment of the wave plate rotation mechanism and the two-dimensional scanning mechanism. It can reduce the influence of the laser polarization state during the drilling process and ensure the roundness of the processed hole.

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  • Optics & Photonics (AREA)
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Abstract

一种旋转光路光束装置（100）及其使用方法及旋转光路光束系统，旋转光路光束装置（100）包括：沿光轴依次分布的波片旋转机构（10）、二维扫描机构（20）、第一调节镜组（30）、第二调节镜组（40）、反射镜（50）和聚焦镜组（60）；波片旋转机构（10）配置成将入射的激光光束通过高速旋转形成各个方向一致的偏振态，保持激光光束的偏振态为径向分布；二维扫描机构（20）配置成对激光光束X-Y平面进行扫描，形成加工所需的绕光轴旋转的环；第一调节镜组（30）、第二调节镜组（40）、反射镜（50）和聚焦镜组（60）配置成控制环的大小和光束的角度。

Description

旋转光路光束装置及其使用方法及旋转光路光束系统
相关申请的交叉引用
本申请要求于2019年12月20日提交中国专利局的申请号为201911334962.X、名称为“旋转光路光束装置及旋转光路光束系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及激光精密深孔加工技术领域，尤其是涉及一种旋转光路光束装置及其使用方法及旋转光路光束系统。
背景技术
随着工业以及科学技术的发展，微孔加工目前有三种方法：机械打孔、电火花打孔、激光打孔，其中机械方法加工效率低，孔壁粗糙，对打孔形状不能保证，对一些脆性材料和软材料加工结果并不理想，对一些精密微孔更是无法加工。电火花打是用瞬间高能量的电流将材料烧穿，孔的直径是由电流的强度决定的，因此不能很好的控制孔侧壁和孔的形状，容易形成重熔层，从而导致断面粗糙度差。
激光打孔是一种非接触式的打孔方式，现有技术中的激光打孔方式存在棱镜在光的角度加大时会影响激光的偏振态，而且激光的偏振态的变化又会影响实际加工的孔的形状，使得打孔过程中不能自由控制孔的圆度的缺陷。
申请内容
有鉴于此，本申请提供一种旋转光路光束装置及其使用方法及旋转光路光束系统，以能够实现减少打孔过程中激光偏振态的影响，保证加工孔 圆度的技术效果中的至少一个。
本申请实施例提供了一种旋转光路光束装置，包括：沿光轴依次分布的波片旋转机构、二维扫描机构、第一调节镜组、第二调节镜组、反射镜和聚焦镜组；波片旋转机构配置成将入射的激光光束通过高速旋转形成各个方向一致的偏振态，保持激光光束的偏振态为径向分布；二维扫描机构配置成对激光光束X-Y平面进行扫描，形成加工所需的绕光轴旋转的环；第一调节镜组、第二调节镜组、反射镜和聚焦镜组配置成控制环的大小和光束的角度。
可选地，波片旋转机构包括波片和旋转电机；其中，旋转电机控制波片以光轴为旋转轴高速旋转。
可选地，外部激光器的偏振态保持径向，通过所述波片的激光光束配置成形成各个方向一致的偏振态，以使偏振态与激光加工路线呈同步状态。
可选地，第一调节镜组和第二调节镜组的位置是不固定的。
可选地，第一调节镜组包括至少两个聚焦组件，每个聚焦组件包括至少一片聚焦镜片，聚焦组件之间的间距是不固定的；第二调节镜组包括至少两个聚焦组件，每个聚焦组件包括至少一片聚焦镜片，聚焦组件之间的间距是不固定的；第一调节镜组的聚焦组件和第二调节镜组的聚焦组件同时移动，配置成调节环的大小。
可选地，第一调节镜组和第二调节镜组的焦距比例范围为0.5-2。
可选地，反射镜还配置成将光轴旋转90°。
可选地，所述第二调节镜组与所述反射镜之间的位置是不固定的。
可选地，聚焦镜组包括至少三个镜片，配置成调节激光光束的角度。
可选地，所述反射镜和所述聚焦镜组之间的间距是固定的。
可选地，旋转光路光束装置还包括：穿孔检测单元，配置成实时检测 孔是否打通。
可选地，旋转光路光束装置还包括：位置检测单元，配置成实时检测激光光束的位置。
所述第一调节镜组包括第一聚焦组件和第二聚焦组件，所述第一聚焦组件和所述第二聚焦组件之间的位置能够相对调节，以配置成得到不同的焦距，焦距的范围为500mm-1000mm。
可选地，所述第二调节镜组包括第三聚焦组件和第四聚焦组件，所述第三聚焦组件和所述第四聚焦组件之间的位置能够相对调节，且所述第三聚焦组件和所述第四聚焦组件之间的调节量与随着所述第一调节镜组的调节同步运动。
可选地，所述聚焦镜组包括第一镜片、第二镜片和第三镜片，所述第一镜片与第二镜片之间的间距范围为20mm-75mm，和，所述第二镜片与第三镜片之间的间距范围为20mm-75mm。
本申请提供一种基于所述的旋转光路光束装置的使用方法，包括以下步骤：
将具有偏振态的激光入射到波片旋转机构，经过波片旋转机构的波片的高速绕光轴旋转形成类似各个方向偏振态一致的光，保持光的偏振态一直是径向的分布；
将激光的光束经过二维扫描机构绕旋转后的光轴的旋转；
将光束经过第一调节镜组、第二调节镜组、反射镜、聚焦镜组后，配置成形成所需的不同角度不同直径的环的光束。
可选地，保持光的偏振态一直是径向的分布的步骤还包括：波片的旋转角度β与偏振态方向的转动角γ之间的关系是γ＝2β。
可选地，激光经过二维扫描机构，光束偏折90°，光轴旋转90°。
可选地，将光束经过第一调节镜组、第二调节镜组、反射镜、聚焦镜组的步骤还包括：
调节第一调节镜组内部第一聚焦组件和第二聚焦组件的相对位置，配置成改变不同极限孔径的需求；
调节第一调节镜组和第二调节镜组的相对位置，配置成改变不同孔径不同角度的需求。
本申请实施例提供了一种旋转光路光束系统，系统包括所述的旋转光路光束装置，还包括激光器和远程终端，远程终端包括协同控制卡；远程终端配置成向协同控制卡发送信号；协同控制卡配置成将接收到的信号发送至激光器和旋转光路光束装置的波片旋转机构和二维扫描机构，并接收激光器、波片旋转机构和二维扫描机构发送的反馈信号，以使激光加工路径与偏振态的径向保持同步。
本申请实施例提供了一种旋转光路光束装置及旋转光路光束系统，能够使得入射到波片旋转机构的激光光束经过高速旋转后形成各个方向一致的偏振态，并能够保持激光光束的偏振态为径向分布，之后通过二维扫描机构对激光光束X-Y平面进行扫描，形成加工所需的绕光轴旋转的环。上述旋转光路光束装置能够通过波片旋转机构的高速旋转，使得激光光束的偏振态保持一直是径向的，形成各个方向一致的偏振态，并且通过波片旋转机构与二维扫面机构的不断调整使得激光光束的偏振态与激光加工路径是同步的，从而减少打孔过程中激光偏振态的影响，自由控制孔的圆度，进而保证加工孔的圆度。
本申请的其他特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
为使本申请的上述目的、特征和优点能更明显易懂，下文特举较佳实施例，并配合所附附图，作详细说明如下。
附图说明
为了更清楚地说明本申请具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种旋转光路光束装置的结构示意图；
图2为本申请实施例提供的一种不同偏振光光线旋转示意图；
图3为本申请实施例提供的另一种旋转光路光束装置的结构示意图；
图4为本申请实施例提供的一种具体的旋转光路光束装置的结构示意图；
图5为本申请实施例提供的一种角度α满足0°＜α＜90°时的光线图；
图6本申请实施例提供的一种角度α满足α＝0°时的光线图；
图7本申请实施例提供的一种角度α满足α＞90°时的光线图；
图8本申请实施例提供的一种旋转光路光束系统的结构示意图。
图标：10-波片旋转机构；20-二维扫描机构；30-第一调节镜组；40-第二调节镜组；50-反射镜；60-聚焦镜组；70-穿孔检测单元；80-位置检测单元；100-旋转光路光束装置；101-波片；200-激光器；300-远程终端；400-协同控制卡；301-第一聚焦组件；302-第二聚焦组件；401-第三聚焦组件；402-第四聚焦组件；601-第一镜片；602-第二镜片；603-第三镜片。
具体实施方式
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合附图对本申请的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，激光打孔是一种非接触式的打孔方式，与传统打孔方式相比优势更突出，适用性也更广泛，现有技术中，激光打孔方式包括冲击打孔以及旋转打孔。其中，冲击打孔的方式对激光器的光束质量要求特别高，由于存在重复稳定性差的问题，为了降低激光器光束质量的影响通过采用在光路的某个位置加入光阑的方式，来得到预期想要得到的激光束的轮廓，从而可以强化光的利用率，但是上述操作需要非常繁琐的计算，对于微小孔的加工无法保证。
其中，旋转打孔也叫做迂回轮廓法，常用的加工方法包括旋转棱镜法、离轴旋转透镜法和旋转棱镜法。目前旋转打孔的常用的方法是由旋转棱镜以及消差光学组件构成，激光束通过安装于高速空心轴电机中的道威棱镜绕光轴旋转，出射的激光束相对于工件表面以圆形路径运动。但是，如果出射激光束与光轴有一定偏移时，激光束会在工件上形成带有一定锥度的微孔，因此需要通过专门开发的控制软件，运用函数表达式经过复杂的计算来实现，对于复杂的图形是很难找到规律或者运用函数表达式来实现，因此此时激光打孔的形状将无法保证，同时，旋转棱镜和运用函数表达式存在速度慢，加工效率不高的缺陷。另外，有人提出了利用两个光楔加旋转聚焦镜的方式，这种方式存在问题是调节两个光楔的角度的时候，聚焦镜的尺寸同时需要变化，而且光楔本身的制造误差将会产生非常大的影响，所以需要保证聚焦镜是倾斜的，但是上述操作存在较大的难度，并且同时 调节两个光楔的角度需要额外的传动装置，笨重又不实用，还会增加额外的成本。
此外，以上两种激光加工方法同时存在另外一个问题：当棱镜在光的角度加大的时候对偏振态的影响非常大，而且激光的偏振态的变化会直接影响材料对光的吸收率，材料不同位置对光的吸收率不同会影响实际加工的孔的形状，包括圆度以及进光口和出光口的尺寸。对于偏振态，如果入射的激光光束是线偏振，那么加工得到的将是椭圆孔。现有技术中有人提出在静态的模式下放入波片，将线偏振光转为圆偏振光，此时由于器件的限制将得不到一个正圆的偏振态，因此加工出的孔仍然是椭圆的，仅比线偏振下打出来的孔的圆度提高一点；还有利用旋转的线偏振光，此时受到旋转速度、器件质量等的因素的影响，虽然可以进一步的提高孔的圆度，但是还是不能自由控制孔的圆度。
基于此，本申请实施例提供的一种旋转光路光束装置及其使用方法及旋转光路光束系统，可以减少打孔过程中激光偏振态的影响，保证加工孔的圆度。
为便于对本实施例进行理解，首先对本申请实施例所公开的一种旋转光路光束装置进行详细介绍，参见图1所示的一种旋转光路光束装置的结构示意图，示意出旋转光路光束装置包括：沿光轴依次分布的波片旋转机构10、二维扫描机构20、第一调节镜组30、第二调节镜组40、反射镜50和聚焦镜组60。
波片旋转机构10配置成将入射的激光光束通过高速旋转形成各个方向一致的偏振态，以保持激光光束的偏振态为径向分布。在具体应用中，波片旋转机构10包括：波片和旋转电机，旋转电机通过控制波片以光轴为旋转轴高速旋转，以将激光器的偏振态保持到一直是径向的，使得通过波片 的激光光束形成各个方向一致的偏振态，并且使得偏振态与激光加工路径是同步的，从而能够解决打孔过程中的偏振态的影响，进而可以控制孔的圆度。
二维扫描机构20配置成对激光光束X-Y平面进行扫描，形成加工所需的绕光轴旋转的环。
其中，利用第一调节镜组30、第二调节镜组40、反射镜50和聚焦镜组60配置成控制环的大小和光束的角度。
具体的，第一调节镜组30和第二调节镜组40之间是可以相对移动的，通过调节第一调节镜组30和第二调节镜组40之间的间距可以控制环的大小，其中，第一调节镜组和第二调节镜组的焦距比例范围可以为0.5-2。举例说明：当同一个环的激光光束需要打不同方向不同角度的孔时，可以通过调节第一调节镜组30和第二调节镜组40之间的间距来控制最终激光光束形成环的大小。
可选地，第一调节镜组30包括至少两个聚焦组件，每个聚焦组件包括至少一片聚焦镜片，聚焦组件之间的间距是不固定的。第二调节镜组40包括至少两个聚焦组件，每个聚焦组件包括至少一片聚焦镜片，聚焦组件之间的间距是不固定的。可选地，第一调节镜组30的聚焦组件和第二调节镜组40的聚焦组件可以同时移动，利用第一调节镜组30的聚焦组件和第二调节镜组40的聚焦组件的移动配置成调节激光光束形成环的大小，也就是确定当前可以使用的配置下的最大的加工孔径以及最小加工孔径的大小。
可选地，反射镜50可以配置成将光轴旋转90°，利用反射镜能够进一步调整激光光束的角度，以保证形成所需要的不同角度不同直径的环的光束。此外，由于第二调节镜组40能够和第一调节镜组30进行同步运动，因此第二调节镜组40的位置是可以移动的，因此在第二调节镜组40移动 的过程中会使得第二调节镜组40与反射镜50之间的间距也是不固定的，即随着第二调节镜组40位置的变化而变化。
可选地，聚焦镜组60可以包括至少三个镜片，激光光束依次经过三个或更多的镜片，经过多个镜片的调节，配置成得到满足不同加工孔径需求的激光光束的角度。为了增加该装置的同轴监测功能，反射镜50和聚焦镜组60之间的间距可以是固定，具体数值可以根据实际情况进行设定，在此不做限定。
本申请实施例提供的上述旋转光路光束装置，能够使得入射到波片旋转机构的激光光束经过高速旋转后形成各个方向一致的偏振态，并能够保持激光光束的偏振态为径向分布，之后通过二维扫描机构对激光光束X-Y平面进行扫描，形成加工所需的绕光轴旋转的环。上述旋转光路光束装置能够通过波片旋转机构的高速旋转，使得激光光束的偏振态保持一直是径向的，形成各个方向一致的偏振态，并且通过波片旋转机构与二维扫面机构的不断调整使得激光光束的偏振态与激光加工路径是同步的，从而减少打孔过程中激光偏振态的影响，自由控制孔的圆度，进而保证加工孔的圆度。
需要说明的是，激光器的偏振态可能存在多种形式，诸如线偏振、椭圆偏振、径向偏振等。不同的偏振态的光经过上述装置后最终形成的环的偏振态也不同，为了更好的理解，本申请实施例提供了一种不同偏振光光线旋转示意图，参见图2所示。其中，图2的(a)部分示意出线偏振光光线旋转后形成的环各个方向上都保持线偏振；图2的(b)部分示意出椭圆偏振光光线旋转后形成的环各个方向上都保持椭圆偏振；图2的(c)部分示意出径向偏振光光线旋转后形成的环各个方向上都保持径向偏振。
此外，为了保证加工过程的安全性和准确性，本申请实施例还提供了 另一种旋转光路光束装置，参见图3所示的另一种旋转光路光束装置的结构示意图，示意出该装置在图1的基础上还包括：穿孔检测单元70和位置检测单元80。
具体的，穿孔检测单元70可以实时检测孔是否打通，位置检测单元80可以实时检测激光光束的位置，举例说明，比如检测到激光光束位置发生了偏移，可以通过调节第一调节镜组30和第二调节镜组40的相对距离，或者同时移动第一调节镜组30的聚焦组件和第二调节镜组40的聚焦组件来调节光束的角度，以保证打孔的形状和大小。
综上所述，本申请实施例提供的旋转光路光束装置包括：波片旋转机构10、二维扫描机构20、第一调节镜组30、第二调节镜组40、反射镜50、聚焦镜组60、穿孔检测单元70和位置检测单元80。激光器发射的激光光束经过波片旋转机构10将激光器的偏振态保持一直是径向，激光光束经过波片旋转机构10的高速旋转后会形成一个各个方向偏振态一致的圆，并且使得偏振态和激光加工路径是同步的；之后经过二维扫描机构20，激光光束偏折90°，光轴旋转90°，二维扫描机构20可以实现激光光束的绕旋转后的光轴的旋转；之后，激光光束依次经过第一调节镜组30、第二调节镜组40、反射镜50、聚焦镜组60形成所需要的不同角度不同直径的环的光束。其中，第一调节镜组30和第二调节镜组40各自的聚焦组件不同间隔的调节可以改变实际加工可达到的不同孔径的需求，第一调节镜组30和第二调节镜组40之间会相对的移动，可以满足不同孔径下经过聚焦镜组60的光束的角度需求。
此外，需要说明的是，上述装置不受激光波长的限制，仅需要根据不同的波长应用不同的膜系即可；其中，上述装置具备加工不同孔径的能力，加工孔径范围可以是20um-1.5mm，诸如：加工孔的直径可以是70um、100um、 1mm等。因此，本实施例提供的旋转光路光束装置可以满足微小孔以及大深径比的加工需求，不仅可以提高孔的圆度，还可以自由控制加工的形状以及光束的入射角度。
本申请提供一种基于所述的旋转光路光束装置的使用方法，包括以下步骤：将具有偏振态的激光入射到波片旋转机构10，经过波片旋转机构10的波片101的高速绕光轴旋转形成类似各个方向偏振态一致的光，保持光的偏振态一直是径向的分布；将激光的光束经过二维扫描机构20绕旋转后的光轴的旋转；将光束经过第一调节镜组30、第二调节镜组40、反射镜50、聚焦镜组60后，配置成形成所需的不同角度不同直径的环的光束。
可选地，保持光的偏振态一直是径向的分布的步骤还包括：波片101的旋转角度β与偏振态方向的转动角γ之间的关系是γ＝2β。可选地，激光经过二维扫描机构20，光束偏折90°，光轴旋转90°。可选地，将光束经过第一调节镜组30、第二调节镜组40、反射镜50、聚焦镜组60的步骤还包括：调节第一调节镜组30内部第一聚焦组件301和第二聚焦组件302的相对位置，配置成改变不同极限孔径的需求；调节第一调节镜组30和第二调节镜组40的相对位置，配置成改变不同孔径不同角度的需求。
本实施例中，调节第一调节镜组30内部第一聚焦组件301和第二聚焦组件302的相对位置，可以改变不同极限孔径的需求；更改第一调节镜组30和第二调节镜组40的相对位置，可以改变不同孔径不同角度的需求。穿孔检测单元70，可以用来实时的检测孔是否打通；位置检测单元80，可以实时的检测光的位置，以方便于及时的调试与发现问题。
为了更好的理解上述装置的结构及作用，本申请实施例还提供一种具体的旋转光路光束装置的结构示意图，参见图4所示，示意出旋转光路光束装置包括：波片旋转机构10、二维扫描机构20、第一调节镜组30、第二 调节镜组40、反射镜50、聚焦镜组60、穿孔检测单元70和位置检测单元80。其中，波片旋转机构10包括波片101；第一调节镜组30包括第一聚焦组件301和第二聚焦组件302，第一聚焦组件301和第二聚焦组件302之间的位置是可以调节的，调节第一聚焦组件301和第二聚焦组件302之间的间距会得到不同的焦距，其中，焦距范围可以是500mm-1000mm；第二调节镜组40包括第三聚焦组件401和第四聚焦组件402，第三聚焦组件401和第四聚焦组件402之间的位置也是可以调节的，第三聚焦组件401和第四聚焦组件402之间的调节量与第一调节镜组30的调节有关；利用第一聚焦组件301和第二聚焦组件302之间以及第三聚焦组件401和第四聚焦组件402之间的调节，能够使得第一调节镜组30的焦距与第二调节镜组40的焦距比例范围可以是0.5-2；聚焦镜组60包括第一镜片601、第二镜片602和第三镜片603，聚焦镜组60的间距可以在20mm-75mm之间，即第一镜片601与第二镜片602之间的间距范围为20mm-75mm，和，第二镜片602与第三镜片603之间的间距范围为20mm-75mm。
需要说明的是，图4所示的旋转光路光束装置中各部件的相对摆放位置仅为示意性的，聚焦组件和镜片的数量也仅为示意，在实际应用中可以与图4不同，在此不做限定。
进一步，本申请实施例还对上述旋转光路光束装置在不同光线下形成的不同直径和深度的孔的情况进行了举例说明：
(1)参见图5所示的一种角度α满足0°＜α＜90°时的光线图，当形成的环的直径d满足：d＞t(t为激光光束最细位置的宽度)，角度α(即边缘光线与光轴的夹角)满足0°＜α＜90°时，形成的孔的直径d与h1(加工孔的最大深度)的比可以达到1:14。
(2)参见图6所示的一种角度α满足α＝0°时的光线图，当形成的环 的直径d满足：d＝t，角度α满足α＝0°时，形成的孔的直径d和深度h的比例可以达到1:10。
(3)参见图7所示的一种角度α满足α＞90°时的光线图，当形成的环的直径d满足：d＜t，角度α满足α＞90°时，形成的孔的直径d和深度h的比例无限(也就是形成孔的深度值很大)。
对于上述实施例提供的旋转光路光束装置，本申请实施例提供了一种旋转光路光束系统，参见图8所示的一种旋转光路光束系统的结构示意图，示意出该系统包括上述实施例提供的旋转光路光束装置100，还包括激光器200和远程终端300，远程终端300包括协同控制卡400；远程终端300配置成向协同控制卡400发送信号；协同控制卡400配置成将接收到的信号发送至激光器200和旋转光路光束装置100的波片旋转机构和二维扫描机构，并接收激光器200、波片旋转机构和二维扫描机构发送的反馈信号，以使激光加工路径与偏振态的径向保持同步。具体的远程终端300可以是计算机、手机、平板电脑等。
本申请实施例提供的旋转光路光束系统，能够通过远程终端内的协同控制卡对激光器和旋转光路光束装置进行控制，旋转光路光束装置通过内设的波片旋转机构和二维扫描机构使得激光器发射的激光光束使得入射到的激光光束经过高速旋转后形成各个方向一致的偏振态，同时将反馈信号发送至协同控制卡，并保持激光光束的偏振态为径向分布，从而可以减少旋转光路光束装置打孔过程中激光偏振态的影响，自由控制孔的圆度，进而保证加工孔的圆度。
本实施例所提供的系统中，旋转光路光束装置的实现原理及产生的技术效果和前述实施例相同，为简要描述，本实施例部分未提及之处，可参考前述实施例中相应内容。
需要注意的是，在这里示出和描述的所有示例中，任何具体值应被解释为仅仅是示例性的，而不是作为限制，因此，示例性实施例的其他示例可以具有不同的值。
相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步定义和解释。
另外，在本申请实施例的描述中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本申请的描述中，需要说明的是，术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。
最后应说明的是：以上所述实施例，仅为本申请的具体实施方式，用以说明本申请的技术方案，而非对其限制，本申请的保护范围并不局限于此，尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，其依然可以对前述实施例所记载的技术方案进行修改或可轻易想到变化，或者对其中部分技术特征进行等同替换；而这些修改、变化或者替换， 并不使相应技术方案的本质脱离本申请实施例技术方案的精神和范围，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应所述以权利要求的保护范围为准。
工业实用性
本申请实施例提供的一种旋转光路光束装置及其使用方法及旋转光路光束系统，通过波片旋转机构与二维扫面机构的不断调整使得激光光束的偏振态与激光加工路径是同步的，能够减少打孔过程中激光偏振态的影响，保证加工孔的圆度。

Claims (20)

  1. 一种旋转光路光束装置，其特征在于，包括：沿光轴依次分布的波片旋转机构、二维扫描机构、第一调节镜组、第二调节镜组、反射镜和聚焦镜组；
    所述波片旋转机构配置成将入射的激光光束通过高速旋转形成各个方向一致的偏振态，保持所述激光光束的偏振态为径向分布；
    所述二维扫描机构配置成对所述激光光束的X-Y平面进行扫描，形成加工所需的绕所述光轴旋转的环；
    所述第一调节镜组、所述第二调节镜组、所述反射镜和所述聚焦镜组配置成控制所述环的大小和光束的角度。
  2. 根据权利要求1所述的旋转光路光束装置，其特征在于，所述波片旋转机构包括波片和旋转电机；其中，所述旋转电机控制所述波片以所述光轴为旋转轴高速旋转。
  3. 根据权利要求2所述的旋转光路光束装置，其特征在于，外部激光器的偏振态保持径向，通过所述波片的激光光束配置成形成各个方向一致的偏振态，以使偏振态与激光加工路线呈同步状态。
  4. 根据权利要求1-3任一项所述的旋转光路光束装置，其特征在于，所述第一调节镜组和所述第二调节镜组的位置是不固定的。
  5. 根据权利要求1-4任一项所述的旋转光路光束装置，其特征在于，所述第一调节镜组包括至少两个聚焦组件，每个所述聚焦组件包括至少一片聚焦镜片，所述聚焦组件之间的间距是不固定的；
    所述第二调节镜组包括至少两个聚焦组件，每个所述聚焦组件包括至少一片聚焦镜片，所述聚焦组件之间的间距是不固定的；
    所述第一调节镜组的所述聚焦组件和所述第二调节镜组的所述聚焦组 件同时移动，配置成调节所述环的大小。
  6. 根据权利要求1-5任一项所述的旋转光路光束装置，其特征在于，所述第一调节镜组和所述第二调节镜组的焦距比例范围为0.5-2。
  7. 根据权利要求1-6任一项所述的旋转光路光束装置，其特征在于，所述反射镜还配置成将所述光轴旋转90°。
  8. 根据权利要求1-7任一项所述的旋转光路光束装置，其特征在于，所述第二调节镜组与所述反射镜之间的位置是不固定的。
  9. 根据权利要求1-8任一项所述的旋转光路光束装置，其特征在于，所述聚焦镜组包括至少三个镜片，配置成调节所述激光光束的角度。
  10. 根据权利要求1-9任一项所述的旋转光路光束装置，其特征在于，所述反射镜和所述聚焦镜组之间的间距是固定的。
  11. 根据权利要求1-10任一项所述的旋转光路光束装置，其特征在于，所述旋转光路光束装置还包括：
    穿孔检测单元，配置成实时检测孔是否打通。
  12. 根据权利要求1-11任一项所述的旋转光路光束装置，其特征在于，所述旋转光路光束装置还包括：
    位置检测单元，配置成实时检测所述激光光束的位置。
  13. 根据权利要求1-12任一项所述的旋转光路光束装置，其特征在于，所述第一调节镜组包括第一聚焦组件和第二聚焦组件，所述第一聚焦组件和所述第二聚焦组件之间的位置能够相对调节，以配置成得到不同的焦距，焦距的范围为500mm-1000mm。
  14. 根据权利要求13所述的旋转光路光束装置，其特征在于，所述第二调节镜组包括第三聚焦组件和第四聚焦组件，所述第三聚焦组件和所述第四聚焦组件之间的位置能够相对调节，且所述第三聚焦组件和所述第四 聚焦组件之间的调节量与随着所述第一调节镜组的调节同步运动。
  15. 根据权利要求1-14任一项所述的旋转光路光束装置，其特征在于，所述聚焦镜组包括第一镜片、第二镜片和第三镜片，所述第一镜片与第二镜片之间的间距范围为20mm-75mm，和，所述第二镜片与第三镜片之间的间距范围为20mm-75mm。
  16. 一种基于如权利要求1-15任一项所述的旋转光路光束装置的使用方法，其特征在于，包括以下步骤：
    将具有偏振态的激光入射到波片旋转机构，经过波片旋转机构的波片的高速绕光轴旋转形成类似各个方向偏振态一致的光，保持光的偏振态一直是径向的分布；
    将激光的光束经过二维扫描机构绕旋转后的光轴的旋转；
    将光束经过第一调节镜组、第二调节镜组、反射镜、聚焦镜组后，配置成形成所需的不同角度不同直径的环的光束。
  17. 根据权利要求16所述的旋转光路光束装置的使用方法，其特征在于，保持光的偏振态一直是径向的分布的步骤还包括：波片的旋转角度β与偏振态方向的转动角γ之间的关系是γ＝2β。
  18. 根据权利要求16或17所述的旋转光路光束装置的使用方法，其特征在于，激光经过二维扫描机构，光束偏折90°，光轴旋转90°。
  19. 根据权利要求16-18任一项所述的旋转光路光束装置的使用方法，其特征在于，将光束经过第一调节镜组、第二调节镜组、反射镜、聚焦镜组的步骤还包括：
    调节第一调节镜组内部第一聚焦组件和第二聚焦组件的相对位置，配置成改变不同极限孔径的需求；
    调节第一调节镜组和第二调节镜组的相对位置，配置成改变不同孔径 不同角度的需求。
  20. 一种旋转光路光束系统，其特征在于，所述系统包括权利要求1至15任一项所述的旋转光路光束装置，还包括激光器和远程终端，所述远程终端包括协同控制卡；
    所述远程终端配置成向所述协同控制卡发送信号；
    所述协同控制卡配置成将接收到的所述信号发送至所述激光器和所述旋转光路光束装置的波片旋转机构和二维扫描机构，并接收所述激光器、所述波片旋转机构和所述二维扫描机构发送的反馈信号，以使激光加工路径与偏振态的径向保持同步。
PCT/CN2020/100228 2019-12-20 2020-07-03 旋转光路光束装置及其使用方法及旋转光路光束系统 WO2021120594A1 (zh)

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CN110919174B (zh) * 2019-12-20 2021-06-25 武汉华工激光工程有限责任公司 旋转光路光束装置及旋转光路光束系统
CN111774721A (zh) * 2020-05-27 2020-10-16 杭州奥创光子技术有限公司 一种波片的光轴角度调节装置及其调节方法
CN113231750B (zh) * 2021-03-18 2022-07-19 武汉大学 一种脉冲激光打孔系统及打孔方法
CN114888458B (zh) * 2021-08-17 2023-12-15 武汉华工激光工程有限责任公司 一种并行旋切加工装置及方法
CN116275475A (zh) * 2021-12-20 2023-06-23 上海名古屋精密工具股份有限公司 激光指向改变时校正路径偏离的方法及其装置和机床
CN116372360B (zh) * 2023-02-21 2024-01-12 中国工程物理研究院激光聚变研究中心 一种微孔旋切扫描加工光学系统

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090194516A1 (en) * 2005-02-03 2009-08-06 Laserfacturing Inc. Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
JP2015213927A (ja) * 2014-05-08 2015-12-03 株式会社ディスコ レーザー加工装置
CN105436703A (zh) * 2015-12-30 2016-03-30 常州英诺激光科技有限公司 一种适用于硬脆基板的激光钻微孔设备及方法
CN106312335A (zh) * 2016-09-14 2017-01-11 张立国 一种激光钻孔与钻孔填充系统及方法
CN108581182A (zh) * 2018-04-28 2018-09-28 大族激光科技产业集团股份有限公司 激光加工装置及方法
CN110919174A (zh) * 2019-12-20 2020-03-27 武汉华工激光工程有限责任公司 旋转光路光束装置及旋转光路光束系统

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19744368A1 (de) * 1997-10-08 1999-05-20 Lzh Laserzentrum Hannover Ev Verfahren und Vorrichtung zur Mikrobearbeitung von Werkstücken mittels Laserstrahlung, insbesondere zum Bilden von im wesentlichen rotationssymmetrischen Ausnehmungen in Werkstücken
CN105033470B (zh) * 2015-05-08 2017-05-24 英诺激光科技股份有限公司 一种锥度可控的高质量钻孔加工设备及方法
CN209424743U (zh) * 2018-12-28 2019-09-24 武汉华工激光工程有限责任公司 一种激光加工装置
CN109909602B (zh) * 2019-04-08 2020-07-28 西安交通大学 一种超快激光加工装备光机电协同控制系统

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090194516A1 (en) * 2005-02-03 2009-08-06 Laserfacturing Inc. Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
JP2015213927A (ja) * 2014-05-08 2015-12-03 株式会社ディスコ レーザー加工装置
CN105436703A (zh) * 2015-12-30 2016-03-30 常州英诺激光科技有限公司 一种适用于硬脆基板的激光钻微孔设备及方法
CN106312335A (zh) * 2016-09-14 2017-01-11 张立国 一种激光钻孔与钻孔填充系统及方法
CN108581182A (zh) * 2018-04-28 2018-09-28 大族激光科技产业集团股份有限公司 激光加工装置及方法
CN110919174A (zh) * 2019-12-20 2020-03-27 武汉华工激光工程有限责任公司 旋转光路光束装置及旋转光路光束系统

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