WO2021120429A1 - 背板及显示面板 - Google Patents

背板及显示面板 Download PDF

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Publication number
WO2021120429A1
WO2021120429A1 PCT/CN2020/079712 CN2020079712W WO2021120429A1 WO 2021120429 A1 WO2021120429 A1 WO 2021120429A1 CN 2020079712 W CN2020079712 W CN 2020079712W WO 2021120429 A1 WO2021120429 A1 WO 2021120429A1
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Prior art keywords
layer
display panel
backplane
nano
substrate layer
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PCT/CN2020/079712
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English (en)
French (fr)
Inventor
李武
Original Assignee
武汉华星光电半导体显示技术有限公司
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Priority to US16/966,043 priority Critical patent/US20230157141A1/en
Publication of WO2021120429A1 publication Critical patent/WO2021120429A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B32B2264/1025—Zinc oxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B32B2264/1051—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/105—Metal
    • B32B2264/1055—Copper or nickel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/737—Dimensions, e.g. volume or area
    • B32B2307/7375—Linear, e.g. length, distance or width
    • B32B2307/7376—Thickness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/41—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the carrier layer

Definitions

  • the present invention relates to the field of display technology, and in particular to a backplane and a display panel with the backplane.
  • Flexible OLED display panels are a hot development direction in the display industry due to their low power consumption, high resolution, fast response, and bendable characteristics. The thinner the thickness, the greater the market competitiveness.
  • PI material is often used as a substrate, and various functional film layers are sequentially prepared on the top, and then a back plate made of PET material is attached to the bottom to protect and support the substrate.
  • a layer of heat sink is usually attached to the back of the backplane. Its structure is generally composed of two or three combinations of copper foil, graphite sheet, and foam. In this way, the thickness of the display panel will eventually increase, which is not conducive to the thinning of the display panel.
  • the present invention provides a backplane and a display panel, which increase the heat dissipation capability of the backplane, thereby improving the heat dissipation capability of the display panel, without radiating fins, reducing the thickness of the display panel, and realizing the lightness and thinness of the display panel.
  • the present invention provides a backplane and a display panel.
  • the heat dissipation capacity of the backplane is improved, thereby solving the technical problem that the display panel increases the thickness of the panel due to the increase of heat sinks.
  • the present invention provides a backplane, which includes a substrate layer and a protective layer and an adhesive layer attached to both sides of the substrate layer, and the adhesive layer faces away from the substrate layer.
  • the side is provided with a peeling layer;
  • the material of the substrate layer includes a doping material, and the doping material includes thermally conductive particles.
  • the thermally conductive particles include at least one of carbon nanotubes, metal nanoparticles, and metal oxide nanoparticles.
  • the metal nano-particles include nano-silver particles or nano-nickel particles.
  • the metal oxide nanoparticles include nano-magnesium oxide particles or nano-zinc oxide particles.
  • the content of the dopant material in the substrate layer is 0.01% to 5%.
  • the thickness of the substrate layer is 50 to 150 microns.
  • the adhesion layer includes a pressure-sensitive adhesive, and the thickness of the pressure-sensitive adhesive is 13-50 microns.
  • the thickness of the back plate is 50 to 300 microns.
  • a display panel including a backplane, and an array substrate, an OLED light-emitting layer, and a thin-film encapsulation layer sequentially disposed on the backplane, and the backplane includes a substrate Layer and an adhesive layer attached to one side of the substrate layer;
  • the material of the substrate layer includes a doping material, and the doping material includes thermally conductive particles.
  • the adhesive layer is attached to the side of the back plate facing the array substrate.
  • the thermally conductive particles include at least one of carbon nanotubes, metal nanoparticles, and metal oxide nanoparticles.
  • the metal nano-particles include nano-silver particles or nano-nickel particles.
  • the metal oxide nanoparticles include nano-magnesium oxide particles or nano-zinc oxide particles.
  • the content of the dopant material in the substrate layer is 0.01% to 5%.
  • the thickness of the substrate layer is 50 to 150 microns.
  • the adhesion layer includes a pressure-sensitive adhesive, and the thickness of the pressure-sensitive adhesive is 13-50 microns.
  • the thickness of the back plate is 50 to 300 microns.
  • the present invention improves the heat dissipation capacity of the backplane by adding dopant materials with excellent thermal conductivity to the backplane, thereby achieving thinner heat dissipation composite materials, thinning products, and reducing heat dissipation composite materials.
  • the purpose of the cost is a simple process of forming a heat dissipation composite material.
  • FIG. 1 is a schematic diagram of the structure of a substrate layer provided by an embodiment of the present invention.
  • Fig. 2 is a schematic diagram of a backplane structure provided by an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the structure of a display panel provided by an embodiment of the present invention.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present invention, “plurality” means two or more than two, unless otherwise specifically defined.
  • the "above” or “below” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the present invention is directed to the existing display panel. Since the backplane does not have heat dissipation properties, the display panel needs to be provided with other heat dissipation devices, which leads to the technical problem of increase in the thickness of the display panel. This embodiment can solve this defect.
  • the embodiment of the present invention provides a backplane, the backplane includes a substrate layer and a protective layer and an adhesive layer attached to both sides of the substrate layer, and the adhesive layer faces away from the substrate A peeling layer is provided on one side of the layer;
  • the material of the substrate layer includes a doping material, and the doping material includes thermally conductive particles.
  • the backplane 101 provided in this embodiment includes a substrate layer 102, a protective layer 107, an adhesive layer 105, and a peeling layer 106, and the protective layer 107 and the adhesive layer 105 are respectively Is disposed on both sides of the base layer 102, the release layer 106 is disposed on the side of the adhesion layer 105 facing away from the base layer 102, wherein the material of the base layer 102 includes doped Material 103, and the dopant material 103 includes thermally conductive particles.
  • the current passing through the TFT circuit will generate heat.
  • a layer of heat sink is usually attached to the back of the backplane.
  • the structure is generally composed of two or three of copper foil, graphite sheet, and foam. This combination will eventually lead to an increase in the thickness of the display panel, which is not conducive to the lightness and thinness of the display panel.
  • a dopant material with excellent thermal conductivity is added to the backplane to increase the heat dissipation performance of the backplane.
  • Speeding up the heat dissipation effect of the display panel can reduce the thickness of the heat dissipation composite material, thin the product, and reduce the cost of the heat dissipation composite material.
  • the doped material can fill the gaps between the macromolecules in the backplane material, thereby reducing the insulation of the backplane. Thermal capacity.
  • the thermally conductive particles include at least one of carbon nanotubes, metal nanoparticles, and metal oxide nanoparticles, that is, the doping material 101 may be the carbon nanotubes, the metal nanoparticles, and the Any one, a combination of any two, or a combination of any three of the metal oxide nanoparticles.
  • carbon nanotubes have good heat transfer performance, and carbon nanotubes have a very large aspect ratio, so their heat exchange performance along the length direction is very high, and their heat exchange performance in the vertical direction is relatively low.
  • carbon nanotubes can be synthesized into highly anisotropic thermal conductive materials.
  • carbon nanotubes have higher thermal conductivity.
  • the thermal conductivity of the composite material The efficiency will be greatly improved, and in the embodiment of the present invention, carbon nanotubes can be incorporated into the substrate layer 102 to improve the heat dissipation capability of the back plate 101.
  • Carbon nanotube preparation methods mainly include: arc discharge method, laser ablation method, chemical vapor deposition method (hydrocarbon gas pyrolysis method), solid phase pyrolysis method, glow discharge method, gas combustion method and polymerization synthesis method, etc. .
  • the metal nanoparticles include nano silver particles or nano nickel particles.
  • the two types of particles are taken as examples, and other metal nanoparticles are not limited.
  • Nano-silver particles and nano-nickel particles both have excellent thermal conductivity.
  • Nano-silver particles are simply metallic silver with a diameter of less than 100 nanometers, generally between 20 and 50 nanometers.
  • Nano-silver particles are silver particles composed of atomic structures instead of Silver ions, nano-silver particles have no charge and are solid powders. They are processed by physical and chemical methods into metallic silver with a particle diameter of less than 100 nanometers. Nano-nickel particles are not easy to produce compared to nano-silver particles. No explanation.
  • the metal oxide nano-particles include nano-magnesium oxide particles or nano-zinc oxide particles. Here, only these two kinds of nanoparticles are taken as examples, and other metal oxide nanoparticles are not limited.
  • Nano-zinc oxide particles are prepared by wet chemical method.
  • Various zinc-containing materials can be used as raw materials, and zinc can be leached by acid leaching.
  • acid leaching After many times of purification to remove impurities in the raw materials, then precipitation to obtain basic zinc carbonate, and finally roasting to obtain nanometer zinc oxide.
  • the content of the doping material 103 in the base layer 102 is 0.01% to 5%.
  • the material of the substrate layer 102 also includes a PET material 104.
  • the PET material 104 is polyethylene terephthalate, and the PET material 104 is a milky white or light yellow highly crystalline polymer with a smooth and shiny surface, creep resistance, fatigue resistance, Good abrasion resistance and dimensional stability, low abrasion and high hardness, with the greatest toughness among thermoplastics, good electrical insulation performance, and low temperature influence.
  • the PET material 104 has poor thermal conductivity, which results in poor thermal conductivity of the back plate 101.
  • the dopant material 103 is incorporated into the substrate layer 102 to improve the thermal conductivity. The heat dissipation capability of the backplane 101 is described.
  • the doping material 103 can be added to the PET material 104 by melt blending, and the mixed material can be prepared into a film-shaped PET, and then the film-shaped PET can be die-cut to obtain The substrate layer 102.
  • the thickness of the back plate 101 is 50 to 300 ⁇ m, and the thickness of the substrate layer 102 is 50 to 150 ⁇ m.
  • the thickness of the substrate layer 102 may be 75 to 100 microns.
  • the adhesive layer 105 may be a pressure-sensitive adhesive, and the adhesive layer 105 is attached to one side of the substrate layer 102, wherein the thickness of the adhesive layer 105 is 13 to 50 microns.
  • the thickness of the adhesion layer 105 may be 13-25 microns.
  • the substrate layer 102 and the adhesion layer 105 are both thinner, so that the thickness of the backplane 101 is also thinner, which is beneficial to the lightness and thinness of the display panel.
  • the back sheet 101 further includes a protective layer 107 and a peeling layer 106, wherein the peeling layer 106 is attached to the side of the adhesive layer 105 facing away from the substrate layer 102, and the protective layer 107 The attachment is arranged on the side of the substrate layer 102 facing away from the adhesion layer 105.
  • the protective layer 107 can be a protective film, and the protective film can play a protective role. It can be used for scratch-resistant protection of glass panels, acrylic panels, PC boards, screen displays, etc., depending on the viscosity. It is divided into high-viscosity PET protective film, medium-viscosity PET protective film and low-viscosity PET protective film. The products used for these three different viscosity protective films will also be different. PET protective films can also be divided into different layers according to the number of layers. Different protective films can be divided into single-layer PET protective film, double-layer PET protective film, and three-layer PET protective film according to the number of layers. There is little difference between these different types of films, but the number of layers is different. The protective layer 107 can be selected according to actual conditions, and is not limited here.
  • the release layer 106 can be a release film, which is coated with a release agent on the PET material.
  • the release film is used for die cutting during the lamination process of some protective films, that is, the PET release film plays a role. Just an auxiliary role.
  • the protective layer 107 and the peeling layer 106 will be removed in different manufacturing processes of the display panel.
  • FIG. 3 it is a display panel provided by this embodiment.
  • the display panel includes the backplane 101 as described in the foregoing embodiment, and the protective layer 107 and the peeling All layers 106 have been removed.
  • the display panel includes a substrate layer 102, an adhesion layer 105 disposed on the substrate layer 102, an array substrate 108 disposed on the adhesion layer 105, and an OLED disposed on the array substrate 108
  • the light-emitting layer 109 and the thin-film encapsulation layer 110 disposed on the OLED light-emitting layer 109.
  • the backplane 101 is provided with the adhesive layer 105 facing the array substrate 108 to facilitate bonding between the backplane 101 and the array substrate 108.
  • the display panel provided by the embodiment of the present invention can be used in various mobile terminals and displays, including flexible display screens, rigid display screens, and various industrial displays and commercial displays.
  • the dopant material with excellent thermal conductivity is added to the backplane, which improves the heat dissipation capability of the backplane, and the dopant material can fill the gaps between macromolecules in the backplane, reducing the The heat insulation capability of the backplane improves the heat dissipation capability of the display panel, so that the display panel can thin the heat dissipation composite material, thin products, and reduce the cost of the heat dissipation composite material, and the backplane has the heat dissipation capability, so that The display panel does not require an additional heat dissipation device, thereby facilitating the thinning of the display panel.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
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  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
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Abstract

一种背板及显示面板，所述背板（101）包括基材层（102），其中，所述基材层（102）的材质包括掺杂材料（103），所述掺杂材料（103）包括导热粒子。

Description

背板及显示面板 技术领域
本发明涉及显示技术领域，尤其涉及一种背板及具有该背板的显示面板。
 背景技术
柔性OLED显示面板由于具有低功耗、高分辨率、快速响应、可弯折等特性，是显示行业热门的发展方向，其厚度越薄则市场竞争力越大。
目前常采用PI材料作为基板，在其上方依次制备各功能膜层，然后在下方贴合PET材质的背板（back plate）保护并支撑基板。
但是显示面板工作时，电流通过TFT电路会发热，为了方便散热通常在背板背面贴附一层散热片，其结构一般由铜箔，石墨片，泡棉中的两种或三种组合而成，这样最终将导致显示面板的厚度增加，不利于显示面板的轻薄化。
 技术问题
本发明提供一种背板及显示面板，增加了背板的散热能力，从而提高了显示面板的散热能力，无需设置散热片，减薄了显示面板的厚度，实现了显示面板的轻薄化。
 技术解决方案
本发明提供一种背板及显示面板，通过在背板中加入掺杂材料，提高了背板的散热能力，从而解决了显示面板因增加散热片而增加面板厚度的技术问题。
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种背板，所述背板包括基材层以及贴附设置于所述基材层两侧的保护层和粘附层，且所述粘附层背向所述基材层一侧设置有剥离层；
其中，所述基材层的材质包括掺杂材料，所述掺杂材料包括导热粒子。
在本发明的一种实施例中，所述导热粒子包括碳纳米管、金属纳米粒子和金属氧化物纳米粒子中的至少一种。
在本发明的一种实施例中，所述金属纳米粒子包括纳米银粒子或纳米镍粒子。
在本发明的一种实施例中，所述金属氧化物纳米粒子包括纳米氧化镁粒子或纳米氧化锌粒子。
在本发明的一种实施例中，所述掺杂材料在所述基材层中的含量为0.01%至5%。
在本发明的一种实施例中，所述基材层的厚度为50至150微米。
在本发明的一种实施例中，所述粘附层包括压敏胶，且所述压敏胶的厚度为13至50微米。
在本发明的一种实施例中，所述背板的厚度为50至300微米。
根据本发明的上述目的，提供一种显示面板，所述显示面板包括背板，以及依次设置于所述背板上的阵列基板、OLED发光层以及薄膜封装层，且所述背板包括基材层以及贴附设置于所述基材层一侧的粘附层；
其中，所述基材层的材质包括掺杂材料，所述掺杂材料包括导热粒子。
在本发明的一种实施例中，所述背板朝向所述阵列基板的一侧贴附设置有所述粘附层。
在本发明的一种实施例中，所述导热粒子包括碳纳米管、金属纳米粒子和金属氧化物纳米粒子中的至少一种。
在本发明的一种实施例中，所述金属纳米粒子包括纳米银粒子或纳米镍粒子。
在本发明的一种实施例中，所述金属氧化物纳米粒子包括纳米氧化镁粒子或纳米氧化锌粒子。
在本发明的一种实施例中，所述掺杂材料在所述基材层中的含量为0.01%至5%。
在本发明的一种实施例中，所述基材层的厚度为50至150微米。
在本发明的一种实施例中，所述粘附层包括压敏胶，且所述压敏胶的厚度为13至50微米。
在本发明的一种实施例中，所述背板的厚度为50至300微米。
 有益效果
相较于现有技术，本发明通过在背板中加入具有优良热导性能的掺杂材料，提高了背板的散热能力，从而达到了减薄散热复合材料，减薄产品，降低散热复合材料成本的目的。
 附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的基材层结构示意图。
图2为本发明实施例提供的背板结构示意图。
图3为本发明实施例提供的显示面板结构示意图。
 本发明的实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本发明中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本发明的不同结构。为了简化本发明的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本发明。此外，本发明可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
本发明针对现有的显示面板，由于背板不具备散热性，使得显示面板需要设置其他的散热装置，从而导致显示面板厚度增加的技术问题，本实施例能够解决该缺陷。
本发明实施例提供一种背板，所述背板包括基材层以及贴附设置于所述基材层两侧的保护层和粘附层，且所述粘附层背向所述基材层一侧设置有剥离层；
其中，所述基材层的材质包括掺杂材料，所述掺杂材料包括导热粒子。
如图1和图2所示，本实施例提供的背板101包括基材层102、保护层107、粘附层105以及剥离层106，且所述保护层107和所述粘附层105分别设置于所述基材层102的两侧，所述剥离层106设置于所述粘附层105背向所述基材层102的一侧，其中，所述基材层102的材质包括掺杂材料103，且所述掺杂材料103包括导热粒子。
在实施应用中，显示面板工作时，电流通过TFT电路会发热，为了方便散热通常在背板背面贴附一层散热片，其结构一般由铜箔、石墨片、泡棉中的两种或三种组合而成，这样最终将导致显示面板的厚度增加，不利于显示面板的轻薄化，而本实施例在背板中加入具有优良导热性能的掺杂材料，增加了背板的散热性能，从而加快显示面板的散热效果，可以减薄散热复合材料，减薄产品，降低散热复合材料成本，另一方面，掺杂材料可以填充背板材质中大分子间的空隙，从而降低了背板的隔热能力。
进一步地，所述导热粒子包括碳纳米管、金属纳米粒子和金属氧化物纳米粒子中的至少一种，即所述掺杂材料101可为所述碳纳米管、所述金属纳米粒子和所述金属氧化物纳米粒子中的任意一种、任意两种的组合或任意三种的组合。
具体地，碳纳米管具有良好的传热性能，且碳纳米管具有非常大的长径比，因而其沿着长度方向的热交换性能很高，相对的其垂直方向的热交换性能较低，通过合适的取向，碳纳米管可以合成高各向异性的热传导材料，另外，碳纳米管有着较高的热导率，只要在复合材料中掺杂微量的碳纳米管，该复合材料的热导率将会得到很大的改善，且本发明实施例可以通过在所述基材层102中掺入碳纳米管，以提高所述背板101的散热能力。
碳纳米管制备方法主要有：电弧放电法、激光烧蚀法、化学气相沉积法（碳氢气体热解法）、固相热解法、辉光放电法、气体燃烧法以及聚合反应合成法等。
所述金属纳米粒子包括纳米银粒子或纳米镍粒子，在此以此两种粒子为例，其他的金属纳米粒子不做限定。
其中，纳米银粒子和纳米镍粒子均具有优良的导热性能，纳米银粒子就是直径小于100纳米的金属银单质，一般在20～50纳米，纳米银粒子是以原子结构组成的银粒子，而不是银离子，纳米银粒子不带电荷，是固体粉末，是通过物理化学方法将金属银单质加工成颗粒直径小于100纳米的金属银单质，而纳米镍粒子相对于纳米银粒子不易制得，在此不做说明。
所述金属氧化物纳米粒子包括纳米氧化镁粒子或纳米氧化锌粒子，在此仅以此两种纳米粒子为例，其他金属氧化物纳米粒子不做限定。
其中，纳米氧化镁粒子的制备方法主要有三种，即固相法、气相法和液相法，而纳米氧化锌粒子采用湿化学法制备，可用各种含锌物料为原料，采用酸浸浸出锌，经过多次净化除去原料中的杂质，然后沉淀获得碱式碳酸锌，最后焙解等获得纳米氧化锌。
在本实施例中，所述掺杂材料103在所述基材层102中的含量为0.01%至5%。
另外，所述基材层102的材料还包括PET材料104。
其中，所述PET材料104为聚对苯二甲酸乙二醇酯，所述PET材料104是乳白色或浅黄色高度结晶性的聚合物，表面平滑而有光泽，耐蠕变、耐抗疲劳性、耐磨擦和尺寸稳定性好，磨耗小而硬度高，具有热塑性塑料中最大的韧性，电绝缘性能好，受温度影响小。
但是所述PET材料104的导热性较差，从而导致所述背板101的导热性较差，通过本实施例在所述基材层102中掺入所述掺杂材料103，以此提高所述背板101的散热能力。
在本实施例中，可在所述PET材料104中通过熔融共混的方法加入所述掺杂材料103，并将该混合材料制备为膜状PET，再将该膜状PET模切，即得到所述基材层102。
在本实施例中，如图2所示，所述背板101的厚度为50到300微米，且所述基材层102的厚度为50到150微米。
在本发明的另一种实施例中，所述基材层102的厚度可以为75到100微米。
在本实施例中，所述粘附层105可以为压敏胶，且所述粘附层105贴附设置于所述基材层102的一侧，其中，所述粘附层105的厚度为13至50微米。
在本发明的另一种实施例中，所述粘附层105的厚度可以为13到25微米。
在本实施例中，所述基材层102以及所述粘附层105均采用较薄的厚度，从而使得所述背板101的厚度也较薄，有利于显示面板的轻薄化。
另外，所述背板101还包括保护层107以及剥离层106，其中，所述剥离层106贴附设置于所述粘附层105背向所述基材层102的一面，所述保护层107贴附设置于所述基材层102背向所述粘附层105的一面。
其中，所述保护层107可以为保护膜，且所述保护膜可起到保护作用，可用于玻璃面板、亚克力面板、PC板、屏幕显示器等的防刮花保护作用，根据粘度的不同又可分为高粘PET保护膜、中粘PET保护膜和低粘PET保护膜，这三种不同粘度的保护膜所应用的产品也会有所不同，PET保护膜还可以根据层数的不同分为不同的保护膜，根据层数又可以分为单层PET保护膜、双层PET保护膜、三层PET保护膜，这几种不同的膜区别不大，只是层数有所不同，则所述保护层107可根据实际情况进行选择，在此不做限定。
而所述剥离层106可以为离型膜，是在PET材质上涂以离型剂，所述离型膜是用于一些保护膜贴合过程中的模切，即PET离型膜起到的只是一个辅助的作用。
且所述保护层107和所述剥离层106在显示面板的不同制程中将被去除。
如图3所示，为本实施例提供的一种显示面板，所述显示面板包括如上述实施例所述的背板101，且所述背板101中的所述保护层107以及所述剥离层106均已去除。
则所述显示面板包括基材层102，设置于所述基材层102上的粘附层105，设置于所述粘附层105上的阵列基板108，设置于所述阵列基板108上的OLED发光层109以及设置于所述OLED发光层109上的薄膜封装层110。
所述背板101设置有所述粘附层105的一面朝向所述阵列基板108，以便于所述背板101与所述阵列基板108之间的贴合。
本发明实施例所提供的显示面板可用于各种移动终端和显示器，包括柔性显示屏、刚性显示屏、以及各种工业显示和商业显示中。
综上，所述背板中加入了具有优良导热性能的掺杂材料，提高了背板的散热能力，且所述掺杂材料可以填充所述背板中大分子间的间隙，降低了所述背板的隔热能力，从而提高了所述显示面板的散热能力，使得所述显示面板可以减薄散热复合材料，减薄产品，降低散热复合材料成本，且所述背板具有散热能力，使得所述显示面板不需要额外增加散热装置，从而有利于所述显示面板的轻薄化。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
以上对本发明实施例所提供的一种背板及显示面板进行了详细介绍，本文中应用了具体个例对本发明的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本发明的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例的技术方案的范围。

Claims (17)

  1. 一种背板，所述背板包括基材层以及贴附设置于所述基材层两侧的保护层和粘附层，且所述粘附层背向所述基材层一侧设置有剥离层；
    其中，所述基材层的材质包括掺杂材料，所述掺杂材料包括导热粒子。
  2. 根据权利要求1所述的背板，其中，所述导热粒子包括碳纳米管、金属纳米粒子和金属氧化物纳米粒子中的至少一种。
  3. 根据权利要求2所述的背板，其中，所述金属纳米粒子包括纳米银粒子或纳米镍粒子。
  4. 根据权利要求2所述的背板，其中，所述金属氧化物纳米粒子包括纳米氧化镁粒子或纳米氧化锌粒子。
  5. 根据权利要求1所述的背板，其中，所述掺杂材料在所述基材层中的含量为0.01%至5%。
  6. 根据权利要求1所述的背板，其中，所述基材层的厚度为50至150微米。
  7. 根据权利要求1所述的背板，其中，所述粘附层包括压敏胶，且所述压敏胶的厚度为13至50微米。
  8. 根据权利要求1所述的背板，其中，所述背板的厚度为50至300微米。
  9. 一种显示面板，所述显示面板包括背板，以及依次设置于所述背板上的阵列基板、OLED发光层以及薄膜封装层，且所述背板包括基材层以及贴附设置于所述基材层一侧的粘附层；
    其中，所述基材层的材质包括掺杂材料，所述掺杂材料包括导热粒子。
  10. 根据权利要求9所述的显示面板，其中，所述背板朝向所述阵列基板的一侧贴附设置有所述粘附层。
  11. 根据权利要求9所述的显示面板，其中，所述导热粒子包括碳纳米管、金属纳米粒子和金属氧化物纳米粒子中的至少一种。
  12. 根据权利要求11所述的显示面板，其中，所述金属纳米粒子包括纳米银粒子或纳米镍粒子。
  13. 根据权利要求11所述的显示面板，其中，所述金属氧化物纳米粒子包括纳米氧化镁粒子或纳米氧化锌粒子。
  14. 根据权利要求9所述的显示面板，其中，所述掺杂材料在所述基材层中的含量为0.01%至5%。
  15. 根据权利要求9所述的显示面板，其中，所述基材层的厚度为50至150微米。
  16. 根据权利要求9所述的显示面板，其中，所述粘附层包括压敏胶，且所述压敏胶的厚度为13至50微米。
  17. 根据权利要求9所述的显示面板，其中，所述背板的厚度为50至300微米。
PCT/CN2020/079712 2019-12-17 2020-03-17 背板及显示面板 WO2021120429A1 (zh)

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CN114078942B (zh) * 2021-11-01 2023-05-02 武汉华星光电半导体显示技术有限公司 Oled显示模组和oled显示装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042121A (ja) * 2006-08-10 2008-02-21 Matsushita Electric Ind Co Ltd 熱伝導基板とその製造方法及びこれを用いた電子機器
CN108767127A (zh) * 2018-05-28 2018-11-06 武汉华星光电半导体显示技术有限公司 一种显示面板的制作方法、显示面板及显示装置
CN109285462A (zh) * 2018-12-12 2019-01-29 武汉天马微电子有限公司 柔性显示面板及其制作方法、柔性显示装置
CN109817674A (zh) * 2019-01-30 2019-05-28 武汉华星光电半导体显示技术有限公司 一种背板及其显示面板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7147966B2 (en) * 2001-11-30 2006-12-12 The Trustees Of Boston College Coated carbon nanotube array electrodes
DE102012200485A1 (de) * 2012-01-13 2013-07-18 Osram Opto Semiconductors Gmbh Organische lichtemittierende Vorrichtung und Verfahren zum Prozessieren einer organischen lichtemittierenden Vorrichtung
CN206116384U (zh) * 2016-11-11 2017-04-19 上海天马有机发光显示技术有限公司 一种散热涂层、oled阵列基板、oled显示面板和显示装置
CN108630829B (zh) * 2017-03-17 2019-11-08 京东方科技集团股份有限公司 显示面板的制作方法、显示面板及显示装置
CN106972113B (zh) * 2017-05-25 2018-09-11 深圳市华星光电技术有限公司 Oled器件的封装组件及封装方法、显示装置
WO2019202556A1 (en) * 2018-04-19 2019-10-24 Gentex Corporation Plastic coatings for improved solvent resistance

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008042121A (ja) * 2006-08-10 2008-02-21 Matsushita Electric Ind Co Ltd 熱伝導基板とその製造方法及びこれを用いた電子機器
CN108767127A (zh) * 2018-05-28 2018-11-06 武汉华星光电半导体显示技术有限公司 一种显示面板的制作方法、显示面板及显示装置
CN109285462A (zh) * 2018-12-12 2019-01-29 武汉天马微电子有限公司 柔性显示面板及其制作方法、柔性显示装置
CN109817674A (zh) * 2019-01-30 2019-05-28 武汉华星光电半导体显示技术有限公司 一种背板及其显示面板

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