WO2021114146A1 - Caloduc et dispositif de haut-parleur - Google Patents

Caloduc et dispositif de haut-parleur Download PDF

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Publication number
WO2021114146A1
WO2021114146A1 PCT/CN2019/124629 CN2019124629W WO2021114146A1 WO 2021114146 A1 WO2021114146 A1 WO 2021114146A1 CN 2019124629 W CN2019124629 W CN 2019124629W WO 2021114146 A1 WO2021114146 A1 WO 2021114146A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat pipe
layer
heat
flow channel
upper layer
Prior art date
Application number
PCT/CN2019/124629
Other languages
English (en)
Chinese (zh)
Inventor
刘鹏辉
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/124629 priority Critical patent/WO2021114146A1/fr
Publication of WO2021114146A1 publication Critical patent/WO2021114146A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the utility model relates to the field of sound and electricity, in particular to a heat pipe and a loudspeaker device.
  • heat pipe heat exchangers (referred to as heat pipes) have high heat exchange efficiency and are widely used in the heat transfer of electronic products.
  • the flow path of the heat pipe is very important for fluid distribution. To a certain extent, it can improve the flow state of the fluid and improve the unevenness of thermal resistance, which greatly improves the heat dissipation performance of electronic products with increasing heat flow density.
  • the speaker is the only component that exchanges airflow with the outer space of the cabinet.
  • the heat inside the casing can be dissipated into the outside atmosphere through the air.
  • the condensing end of the heat pipe heat exchanger is designed here, and the temperature difference between the outside air and the processor can be used to promote the heat exchange in a direction that is beneficial to improve its performance. .
  • the heat pipe built into the speaker component has a smaller volume and a smaller heat exchange area. It is even more necessary to set up a flow channel for reasonable distribution of its internal fluid.
  • the complex flow channel has a smaller processing range, a longer cycle, and a higher price than a speaker.
  • the purpose of the utility model is to provide a heat pipe and loudspeaker device with simple manufacturing process, good manufacturing quality and high efficiency.
  • the present invention provides a heat pipe comprising an upper layer of the heat pipe, a lower layer of the heat pipe arranged opposite to the upper layer of the heat pipe and enclosing a containing space, and a flow channel layer contained in the containing space, the flow channel
  • the layer includes a plurality of pipe walls spaced apart from each other, each of the pipe walls is sandwiched between the upper layer of the heat pipe and the lower layer of the heat pipe, and the upper layer of the heat pipe and the lower layer of the heat pipe are attached to and fixed to the pipe wall respectively And two adjacent pipe walls are enclosed with the upper layer of the heat pipe and the lower layer of the heat pipe to form a flow channel for the flow of the heat exchange working medium, and the upper layer of the heat pipe and the lower layer of the heat pipe are both steel sheets.
  • the flow channel layer is an array of etched steel sheets.
  • the flow channel layer is a graphite sticker array.
  • the flow channel layer is an injection-molded tube wall array.
  • opposite sides of the flow channel layer are respectively brazed and fixed to the upper layer of the heat pipe and the lower layer of the heat pipe.
  • opposite sides of the flow channel layer are respectively bonded and fixed to the upper layer of the heat pipe and the lower layer of the heat pipe.
  • a plurality of the flow channels are evenly arranged.
  • the utility model also provides a loudspeaker device.
  • the loudspeaker device includes a heat pipe, a loudspeaker box, and a heat source device spaced from the loudspeaker box,
  • the heat pipe includes a condensing end, a conduction part extending from the condensing end, an evaporating end and a heat exchange working fluid that extend away from the condensing end from the conduction part, and the flow channel is sequentially arranged at the condensing end,
  • the conduction part and the evaporation end form a closed loop, and the heat exchange working fluid is filled in the heat pipe and circulates in the flow channel;
  • the speaker box includes a housing having a first accommodating space, a sounding unit accommodated in the first accommodating space, and a sound guide channel formed in the housing;
  • the sounding unit includes a vibration-producing unit A diaphragm, the diaphragm divides the first housing space into a front acoustic cavity and a rear cavity, and the sound guide channel connects the front acoustic cavity with the outside and forms a front cavity together with the front acoustic cavity;
  • the condensation end Embedded in the housing, and opposite sides of the condensation end are respectively connected to the outside and the front acoustic cavity;
  • the heat source device is connected to the evaporation end.
  • the condensing end and the housing are integrally injection molded.
  • the heat source device is any one of a processor and a battery.
  • the manufacturing process is simple, and the heat pipe and speaker device with good quality and high efficiency are manufactured.
  • the heat pipe and loudspeaker device of the present invention are respectively arranged in a three-layer structure of the upper layer of the heat pipe composed of steel sheets, the flow channel layer composed of a plurality of mutually spaced pipe walls, and the lower layer of the heat pipe composed of steel sheets.
  • the upper layer of the heat pipe and the lower layer of the heat pipe are respectively attached and fixed to the pipe wall, so that two adjacent pipe walls, the upper layer of the heat pipe and the lower layer of the heat pipe are enclosed to form a flow channel for the flow of the heat exchange working medium.
  • the heat pipe and the loudspeaker device of the utility model have a simple manufacturing process. When the loudspeaker device is small in size, the heat pipe with a complicated structure is arranged in the loudspeaker device, and the manufacturing quality is good and the efficiency is high.
  • Figure 1 is a schematic diagram of the three-dimensional structure of the heat pipe of the utility model
  • Figure 2 is a partial three-dimensional structure diagram of the heat pipe of the utility model
  • Figure 3 is an enlarged view of part A in Figure 1;
  • Figure 4 is a schematic diagram of the three-dimensional structure of the speaker device of the present invention.
  • Figure 5 is a partial three-dimensional structure diagram of the speaker device of the present invention.
  • Figure 6 is a schematic diagram of the structure of the speaker device of the present invention when it is applied to a mobile terminal.
  • the present invention provides a heat pipe 100.
  • the heat pipe 100 has a heat pipe upper layer 101, a heat pipe lower layer 102 and a runner layer 103.
  • the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe enclose a receiving space 10.
  • the lower layer 102 of the heat pipe is arranged opposite to the upper layer 101 of the heat pipe.
  • the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe are both steel sheets.
  • the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe are both stamped and made of sheet steel.
  • the flow channel layer 103 is contained in the containing space 10.
  • the flow channel layer 103 includes a plurality of pipe walls 31 spaced apart from each other. Wherein, each of the tube walls 31 is sandwiched between the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe, respectively.
  • the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe are attached and fixed respectively, and the two adjacent pipe walls 31 are enclosed with the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe to form a heat exchange working medium (not shown)
  • Flowing runner 30 In this embodiment, the flow channel 30 is tubular. A plurality of the flow channels 30 are evenly arranged.
  • the flow channel layer 103 can be constructed in a variety of ways. The following four embodiments are described separately:
  • the runner layer 103 is an array of etched steel sheets.
  • the two opposite sides of the flow channel layer 103 are respectively bonded and fixed to the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe.
  • the structure of the runner layer 103, the upper layer 101 of the heat pipe, and the lower layer 102 of the heat pipe will be described in detail below by manufacturing the heat pipe 100.
  • the manufacturing of the heat pipe 100 includes the following steps:
  • Step 1 two steel sheets are punched into the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe respectively. According to the design specifications, a plurality of the flow channels 30 are etched from a steel sheet to form the flow channel layer 103.
  • Step 2 the upper layer 101 of the heat pipe, the flow channel layer 103 and the lower layer 102 of the heat pipe are bonded and fixed to form a whole.
  • the heat pipe upper layer 101, the runner layer 103, and the heat pipe lower layer 102 are fixed by glue to form the heat pipe 100.
  • the runner layer 103 is an array of etched steel sheets. The two opposite sides of the runner layer 103 are respectively brazed and fixed to the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe.
  • the structure of the runner layer 103, the upper layer 101 of the heat pipe, and the lower layer 102 of the heat pipe will be described in detail below by manufacturing the heat pipe 100.
  • the manufacturing of the heat pipe 100 includes the following steps:
  • Step 1 Press two steel sheets to form the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe respectively according to the design specifications. According to the design specifications, one steel sheet is etched into a plurality of the flow channels 30 to form the flow channel layer 103.
  • Step 2 The upper layer 101 of the heat pipe is located on the surface of the accommodating space 10, the flow channel layer 103 is located on the surface of the accommodating space 10, and the surface of the lower heat pipe 102 is located on the surface of the accommodating space 10.
  • the solder is used to braze and fix the upper layer 101 of the heat pipe, the flow channel layer 103 and the lower layer 102 of the heat pipe that have been plated with solder to form the heat pipe 100.
  • the flow channel layer 103 is a graphite sticker.
  • the two opposite sides of the flow channel layer 103 are respectively bonded and fixed to the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe.
  • the structure of the runner layer 103, the upper layer 101 of the heat pipe, and the lower layer 102 of the heat pipe will be described in detail below by manufacturing the heat pipe 100.
  • the manufacturing of the heat pipe 100 includes the following steps:
  • Step 1 According to the design specifications, two steel sheets are punched into the upper heat pipe 101 and the lower heat pipe 102 respectively. According to the design specifications, graphite stickers are made into the runner layer 103 according to the shapes of the multiple runners 30 .
  • Step 2 According to the design specifications, the upper layer 101 of the heat pipe, the flow channel layer 103 and the lower layer 102 of the heat pipe are bonded and fixed to form the heat pipe 100.
  • the runner layer 103 is an injection-molded tube wall array.
  • the two opposite sides of the flow channel layer 103 are respectively bonded and fixed to the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe.
  • the structure of the runner layer 103, the upper layer 101 of the heat pipe, and the lower layer 102 of the heat pipe will be described in detail below by manufacturing the heat pipe 100.
  • the manufacturing of the heat pipe 100 includes the following steps:
  • Step 1 two steel sheets are punched into the upper heat pipe 101 and the lower heat pipe 102 respectively, and a plurality of the runners 30 are injection molded to form the runner layer 103 according to the design specifications.
  • Step 2 According to the design specifications, the upper layer 101 of the heat pipe, the flow channel layer 103 and the lower layer 102 of the heat pipe are bonded and fixed to form the heat pipe 100. Wherein, the heat pipe upper layer 101, the runner layer 103, and the heat pipe lower layer 102 are fixed by glue to form the heat pipe 100.
  • the structure of the heat pipe 100 is described below according to the function of the heat pipe 100. Specifically,
  • the heat pipe 100 includes a condensing end 1, a conducting portion 2 extending from the condensing end 1, and an evaporating end 3 extending away from the condensing end 1 from the conducting portion 2 and a heat exchange working medium (not shown),
  • the flow channel 30 is sequentially arranged at the condensing end 1, the conducting portion 2 and the evaporating end 3 and forms a closed ring shape.
  • the heat exchange working medium is filled in the heat pipe 100 and flows in the Circulates in the channel 30.
  • the present invention provides a speaker device 200.
  • the speaker device 200 includes the heat pipe 100, a speaker box 300, and a heat source device 400 spaced from the speaker box 300.
  • the speaker box 300 has a front cavity 310 for sound.
  • the condensing end 1 is connected to the front cavity 310.
  • the heat source device 400 is connected to the evaporation end 3.
  • the evaporating end 3 transfers the heat of the heat source device 400 through the conducting part 2 to the condensing end 1.
  • the condensing end 1 is connected to the front cavity 310.
  • an active airflow exchange is formed, so that the heat of the condensing end 1 passes through the airflow. The exchange quickly dissipated.
  • the speaker box 300 includes a housing 301 having a first accommodating space, a sound emitting unit 302 accommodated in the first accommodating space 305, and a sound guide channel 303 formed in the housing 301.
  • the sound unit 302 includes a diaphragm 3021 for vibrating and sounding.
  • the diaphragm 3021 divides the first housing space 305 into a front sound cavity 304 and a rear cavity (not shown).
  • the sound guide channel 303 divides The front acoustic cavity 304 communicates with the outside and forms the front cavity 310 together with the front acoustic cavity 304.
  • the condensing end 1 is embedded in the housing 301, and opposite sides of the condensing end 1 are respectively connected to the outside and the front cavity 310.
  • the condensing end 1 and the housing 301 are integrally injection molded. This arrangement makes one side of the condensing end 1 directly contact the air in the front cavity 310, and the other side directly contacts the air outside the speaker box 300 or the housing of the mobile terminal. One side heat conduction and heat radiation combine to dissipate heat, and the other Side heat radiation to dissipate heat.
  • the evaporating end 3 is connected to the heat source device 400, and transfers the heat of the heat source device 400 to the heat exchange working fluid inside the heat pipe 100, and conducts it to the condensing end 1.
  • the heat exchange working fluid evaporates and condenses inside the heat pipe 100 for heat transfer and transfer to achieve The purpose of heat dissipation.
  • the condensing end 1 conducts heat into the front acoustic cavity 304 (which may be a sound guide channel 303), and the vibration diaphragm 3021 vibrates to push the air in the front acoustic cavity 304 to circulate with the outside through the sound guide channel 303.
  • the volume change of the front acoustic cavity 304 when the diaphragm 121 vibrates the volume of the front acoustic cavity 304 becomes smaller, and the diaphragm 3021 passes through the sound guide channel 303 to reduce the volume of the front acoustic cavity 304
  • the diaphragm 3021 sucks the external space into the front acoustic cavity 304 through the sound guide channel 303; the above process makes the front acoustic cavity 304
  • the air is convective with the outside air.
  • the vibration of the diaphragm 3021 causes the heat in the front acoustic cavity 304 to radiate to the outside of the housing 301 along with the air circulation, thereby realizing the heat dissipation of the heat source device 400, so that the speaker device 200 has a good heat dissipation effect. .
  • the heat source device 400 is any one of a processor and a battery, and is not limited thereto.
  • the vibration of the diaphragm 3021 may be in a vocalized or non-voiced manner, and both may dissipate the heat conducted into the front acoustic cavity 304 to the outside along with air circulation.
  • the speaker box 300 can specifically perform heat dissipation work.
  • a lower-frequency pulse signal is input to the speaker box 300, and the low-frequency sound generated by the signal in the speaker box 300 will not be heard by human ears.
  • the input lower frequency is lower than 1000 Hz.
  • the speaker box 300 can play the pulse signal alone when it is not performing a music playback task; the speaker box 300 can also superimpose the pulse signal into the music signal when it performs a music playback task. Because the signal is an ultra-low frequency pulse signal, it will not be heard by the human ear and will not affect the normal listening effect.
  • the mobile terminal 500 when the speaker device 200 is applied to a mobile terminal 500, the mobile terminal 500 includes a housing 502 having a second housing space 501 and the speaker device 200, and the speaker device 200 is installed in the Inside the second containing space 501.
  • the housing 502 is provided with a sound channel 503 passing through it, and the sound channel 503 is in air communication with the front acoustic cavity 304 through the sound guide channel 303 to conduct the heat source device 400 through the heat pipe 100
  • the heat to the front acoustic cavity 304 is radiated to the outside of the housing 502.
  • the heat pipe 100 of the present invention is to stamp two steel sheets into the upper layer 101 of the heat pipe and the lower layer 102 of the heat pipe respectively, and the runner layer 103 is manufactured through different processes.
  • the manufacturing method of the heat pipe 100 corresponds to the selection of different fixing methods in the above step 2 to form a whole of the heat pipe 100, and it is fixed in the speaker device 200 by injection molding.
  • the heat pipe 100 with a complicated structure is arranged in the speaker device 200, and the manufacturing quality is good and the efficiency is high.
  • the heat pipe and loudspeaker device of the present invention are respectively arranged in a three-layer structure of the upper layer of the heat pipe composed of steel sheets, the flow channel layer composed of a plurality of mutually spaced pipe walls, and the lower layer of the heat pipe composed of steel sheets.
  • the upper layer of the heat pipe and the lower layer of the heat pipe are respectively attached and fixed to the pipe wall, so that two adjacent pipe walls, the upper layer of the heat pipe and the lower layer of the heat pipe are enclosed to form a flow channel for the flow of the heat exchange working medium.
  • the heat pipe and the loudspeaker device of the utility model have a simple manufacturing process. When the loudspeaker device is small in size, the heat pipe with a complicated structure is arranged in the loudspeaker device, and the manufacturing quality is good and the efficiency is high.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention fournit un caloduc, comprenant une couche supérieure de caloduc, une couche inférieure de caloduc disposée à l'opposé de la couche supérieure de caloduc pour définir un espace de logement, et une couche de canal d'écoulement logée dans l'espace de logement. La couche de canaux d'écoulement comprend une pluralité de parois de tuyaux espacées les unes des autres. Chacune des parois du tube est serrée séparément entre la couche supérieure du caloduc et la couche inférieure du caloduc. La couche supérieure de caloduc et la couche inférieure de caloduc sont respectivement attachées et fixées aux parois du tuyau, et deux parois adjacentes du tuyau, la couche supérieure de caloduc et la couche inférieure de caloduc enferment un canal d'écoulement permettant à un fluide d'échange de chaleur de s'écouler. La couche supérieure du caloduc et la couche inférieure du caloduc sont toutes deux des feuilles d'acier. La présente invention concerne également un dispositif de haut-parleur utilisant le caloduc.
PCT/CN2019/124629 2019-12-11 2019-12-11 Caloduc et dispositif de haut-parleur WO2021114146A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/124629 WO2021114146A1 (fr) 2019-12-11 2019-12-11 Caloduc et dispositif de haut-parleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/124629 WO2021114146A1 (fr) 2019-12-11 2019-12-11 Caloduc et dispositif de haut-parleur

Publications (1)

Publication Number Publication Date
WO2021114146A1 true WO2021114146A1 (fr) 2021-06-17

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104457354A (zh) * 2013-09-18 2015-03-25 东芝家电技术股份有限公司 片型热管体和搭载该片型热管体的移动终端
CN104735949A (zh) * 2013-12-19 2015-06-24 中兴通讯股份有限公司 喇叭振膜线圈的驱动装置、散热装置、方法及移动终端
CN106162391A (zh) * 2016-08-09 2016-11-23 青岛海信移动通信技术股份有限公司 移动终端
CN106470538A (zh) * 2015-08-19 2017-03-01 株式会社藤仓 便携式电子设备用散热板
CN108702858A (zh) * 2016-02-18 2018-10-23 三星电子株式会社 具有集热/散热结构的电子设备
CN109631636A (zh) * 2018-12-13 2019-04-16 华为技术有限公司 一种薄型热管、薄型热管的制作方法及电子设备
WO2019158805A1 (fr) * 2018-02-13 2019-08-22 Nokia Technologies Oy Appareil de haut-parleur ayant une structure de dissipation de chaleur

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104457354A (zh) * 2013-09-18 2015-03-25 东芝家电技术股份有限公司 片型热管体和搭载该片型热管体的移动终端
CN104735949A (zh) * 2013-12-19 2015-06-24 中兴通讯股份有限公司 喇叭振膜线圈的驱动装置、散热装置、方法及移动终端
CN106470538A (zh) * 2015-08-19 2017-03-01 株式会社藤仓 便携式电子设备用散热板
CN108702858A (zh) * 2016-02-18 2018-10-23 三星电子株式会社 具有集热/散热结构的电子设备
CN106162391A (zh) * 2016-08-09 2016-11-23 青岛海信移动通信技术股份有限公司 移动终端
WO2019158805A1 (fr) * 2018-02-13 2019-08-22 Nokia Technologies Oy Appareil de haut-parleur ayant une structure de dissipation de chaleur
CN109631636A (zh) * 2018-12-13 2019-04-16 华为技术有限公司 一种薄型热管、薄型热管的制作方法及电子设备

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