WO2021105144A1

WO2021105144A1 - Circuit carrier for an electronics module, and power electronics module having a circuit carrier

Info

Publication number: WO2021105144A1
Application number: PCT/EP2020/083251
Authority: WO
Inventors: Johannes Fetzer; Ralf Hoch; Rohit Katkar
Original assignee: Vitesco Technologies Germany Gmbh
Priority date: 2019-11-28
Filing date: 2020-11-24
Publication date: 2021-06-03
Also published as: DE112020005830A5

Abstract

The invention relates to a circuit carrier (ST1) for an electronics module (LM1), comprising: a first circuit board (LP11) for the arranging of an electrical or electronic component (BE1), which first circuit board has a first conducting track (LB11) for establishing a current connection for transferring an operating current to the component (BE1); a second circuit board (LP12), which is designed exclusively to establish a signal connection for transferring a signal to the component (BE1) and has a second conducting track (LB12) for establishing the signal connection for transferring the signal; wherein the second circuit board (LP12) lies on a component-mounting surface (OF11) of the first circuit board (LP11) and is physically and thermally connected thereto. The invention further relates to a power electronics module (LM1) having a circuit carrier (ST1) of this type.

Description

description

Circuit carrier for an electronic module, power electronics module with a circuit carrier

Technical area:

The present invention relates to circuit carriers for electronic modules and power electronics modules with a circuit carrier mentioned.

State of the art and object of the invention:

(Power) electrical devices with (power) electronic modules are known and are used, among other things, as part of inverters, rectifiers or DC voltage converters in electrical drive systems for electrically powered vehicles. Such devices or electronic modules have electrical circuit carriers which, due to their function and compact design, have a higher conductor track density, which leads to a complex layout of the circuit boards of the electronic modules and thus to high manufacturing costs for the (power) electrical devices. In addition, it is becoming increasingly difficult to maintain the required impedances in the circuit carriers, which also leads to high layout costs and the associated high production costs for the (power) electrical devices.

The object of the present application is therefore to provide a possibility with which a (power) electronics module or a (power) electrical device with a (power) electronics module can be produced more simply and inexpensively.

Description of the invention:

This object is achieved by the subjects of the independent claims. Advantageous refinements are the subject of the subclaims.

According to a first aspect of the invention, a first circuit carrier for a (power) electronics module of a (power) electrical device, in particular for an electrically driven vehicle, especially an inverter, is a Rectifier or a DC / DC converter, generally a converter, provided.

The first circuit carrier has (especially only) a first printed circuit board on which one or more electrical or electronic components, especially including one or more power electrical components, can be arranged and electrically connected to one another and to external electrical or electronic components.

The first printed circuit board has one or more first (current-carrying) conductor tracks which (in particular. Exclusively) for the production of current connections for the transmission of operating currents, such as. B. supply currents, rated currents, charging / discharging currents, intermediate circuit currents or phase currents, to or from one or more of the components mentioned.

The first circuit carrier also has one or more second printed circuit boards that are designed exclusively for establishing signal connections, in particular only one signal connection in each case, for transmitting signals (in particular control signals or data signals) to or from one or more of the above-mentioned components . The second printed circuit boards each have (only) one second (signal-carrying) conductor track for establishing (only) one of the above-mentioned signal connections. Furthermore, the second circuit boards rest on a mounting surface of the (same, single) first circuit board and are physically and thermally connected to this first circuit board.

The second circuit board (or the second circuit boards) is not a further layer (or laminate layer) of the first circuit board, but just like the first circuit board (from the beginning or the beginning), self-sufficient, separate circuit board after the manufacturing or lamination process of the first circuit board is placed on the first circuit board and physically connected to it. The second circuit board (or the second circuit boards) is produced in a separate manufacturing or lamination process (in particular in a separate production line as the first circuit board) independently of the first circuit board. In particular, the first and second printed circuit boards (or the second printed circuit boards) are printed circuit boards that are equivalent to one another.

The first conductor tracks are (predominantly or exclusively) as power connections for power transmission, i.e. for the transmission of Operating currents or rated currents, (positive) supply currents, phase currents, intermediate circuit currents and / or charging / discharging currents, designed and accordingly dimensioned / layouted comparatively wide and / or thick. Typically, the first conductor tracks each transmit a current with a nominal current of well over 100 milliamps or from 1 amp up to a few hundred amps, at a nominal voltage of 48 volts or well over 48 volts, such as. B. 400 volts or 800 volts.

The second conductor track is (or the second conductor tracks are) designed as a signal connection exclusively for signal or data transmission and accordingly dimensioned / laid out comparatively narrow and / or thin. Typically, the second conductor track transmits control or data signals at a nominal voltage of, for example, 5 volts or 12 volts or well below 48 volts and with a nominal current strength of well below 1 ampere or below 100 milliamps, especially from a few to a few tens of milliamps.

The fact that the second conductor track for signal or data transmission is (exclusively) on the separate, second circuit board and is arranged via the second circuit board on the first circuit board (especially intended for power transmission) and at the same time (through the second circuit board or by their electrically insulating base material) is electrically isolated from the first printed circuit board and thus from the first printed conductors and is spatially spaced apart, the first printed conductors for power transmission on the first printed circuit board, which are free of or with comparatively few printed conductors for the signal - or data transfer is easier to dimension or layout. Accordingly, the first printed circuit board can also be designed with a comparatively low creepage resistance. For the first circuit board, simple and inexpensive circuit boards, such as. B. Inexpensive four-layer printed circuit boards can be used.

This increases the design flexibility of the entire electronic module and thus of the entire electrical device and accordingly also lowers its production costs.

In addition, the separate design of the second, signal / data-transmitted conductor track on the separate, second printed circuit board enables the second conductor track to be dimensioned according to requirements without being restricted by the first conductor tracks on the first printed circuit board. Thereby, that the electrical and spatial insulation between the second conductor track and the first conductor track (or between the second conductor track on the one hand and the first conductor tracks on the other hand) is automatically provided by the second, electrically and spatially insulating circuit board, no additional spatial separation of the first and the second conductor track from each other and no additional electrical insulation or no insulation to reduce electromagnetic interactions between the first conductor tracks on the one hand and the second conductor track on the other. Correspondingly, the required impedances in the conductor tracks and thus in the entire first circuit carrier can be maintained more easily.

This provides a possibility of producing a (power) electronics module or a (power) electrical device with a (power) electronics module in a simpler and more cost-effective manner.

According to a second aspect of the invention, a second circuit carrier for a (power) electronics module of a (power) electrical device, in particular for an electrically driven vehicle, specifically an inverter, a rectifier or a DC / DC converter, generally a power converter, is provided.

The second circuit carrier also has (especially only) a first printed circuit board on which one or more electrical or electronic components, especially including one or more power electrical components, can be arranged and electrically connected to one another and to external electrical or electronic components. The first circuit board has one or more first (signal-carrying) conductor tracks which (unlike the first circuit carrier described above) (especially exclusively) for establishing signal connections for the transmission of signals (especially control signals or data signals) to or from or serve between the components.

The second circuit carrier also has one or more second circuit boards which (unlike the first circuit carrier described above) are used exclusively for the production of power connections, in particular of only one power connection each, for the transmission of operating currents, such as. B. a supply current, a nominal current, a charging / discharging current, an intermediate circuit current or a phase current, to or from one or several of the above components are executed. The second circuit boards each have (only) a second (current-carrying) conductor track for producing (only) one of the above-mentioned current connections. Furthermore, the second circuit boards rest on a mounting surface of the (same, single) first circuit board and are physically and thermally connected to it.

The second circuit board (or the second circuit boards) (as with the first circuit carrier described above) is not a further layer (or laminate layer) of the first circuit board, but one just like the first circuit board (from the beginning or the beginning) self-sufficient separate circuit board which is subsequently and especially after the manufacturing or lamination process of the first circuit board placed on the first circuit board and physically connected to it. The second circuit board (or the second circuit boards) is produced in a separate manufacturing or lamination process (in particular in a separate production line as the first circuit board) independently of the first circuit board. In particular, the first and second printed circuit boards (or the second printed circuit boards) are printed circuit boards that are equivalent to one another.

The first conductor tracks are designed (predominantly or exclusively) as signal connections for signal or data transmission and are accordingly dimensioned / laid out comparatively narrow and / or thin. The first conductor tracks typically transmit control or data signals at a nominal voltage of, for example, 5 volts or 12 volts or well below 48 volts and with a nominal current strength of well below 1 amp or below 100 milliamps, especially from a few to a few tens of milliamps.

The second conductor track is (or the second conductor tracks are) as a power connection exclusively for power transmission, i.e. for the transmission of an operating current or nominal current, a (positive) supply current, a phase current, an intermediate circuit current and / or a charge / discharge current, and accordingly relatively wide and / or thick dimensioned / layouted. Typically, the second conductor track transmits a current with a nominal current of well over 100 milliamps or from 1 amp up to a few hundred amps, at a nominal voltage of 48 volts or well over 48 volts, such as. B. 400 volts or 800 volts.

Because the second conductor track for current transmission of the operating current is (exclusively) carried out on the separate, second circuit board and via the second printed circuit board is arranged on the first printed circuit board (especially intended for signal transmission) and at the same time (by the second printed circuit board or its electrically insulating base material) is electrically isolated and spatially separated from the first printed circuit board and thus from the first conductor tracks , the first conductor tracks for signal transmission on the first circuit board, which is free of or with comparatively few conductor tracks for power transmission, can be dimensioned or laid out more easily. Correspondingly, the first printed circuit board can also be designed with a comparatively low resistance to leakage current. For the first circuit board, simple and inexpensive circuit boards, such as. B. Inexpensive four-layer printed circuit boards can be used.

In addition, the separate execution of the second,

(operating) current-transmitted conductor track on the separate, second printed circuit board, a corresponding dimensioning of the second conductor track adapted to requirements without being restricted by the first conductor tracks on the first circuit board. Because the electrical and spatial insulation between the second conductor track and the first conductor track (or between the second conductor track on the one hand and the first conductor tracks on the other hand) is automatically provided by the second, electrically and spatially insulating circuit board, no additional spatial separation is required first and second conductor tracks from one another and no additional electrical insulation or no insulation to reduce electromagnetic interactions between the first conductor tracks on the one hand and the second conductor track on the other.

For example, the second circuit board is glued to the mounting surface of the first circuit board, in particular by means of a precured adhesive or a cold laminate. For example, and especially in the event that the second conductor track is designed as a current-carrying conductor track, this has a layer thickness of over 1 millimeter or over 1.5 millimeters or over 2 millimeters. In particular, the second conductor track is designed as a current-carrying conductor track at least five times or ten times or fifty times or a hundred times or five hundred times or a thousand times or more thicker than the first conductor track.

For example, the second conductor track is glued to a surface of the second circuit board facing away from the first circuit board. In particular, the second conductor track covers at least 70% or at least 80% or at least 90% or at least 95% of the surface of the second circuit board facing away from the first circuit board.

For example, the first and / or the second conductor track are each punched or cut or laser-cut from a metal sheet or a metal alloy sheet or a copper sheet or a copper alloy sheet, or forged or pressed from a metal part or a metal alloy part or a copper sheet or a copper alloy sheet.

For example, the first conductor track is embedded or laminated into the first circuit board (as an intermediate layer).

For example, the first and / or the second printed circuit board are made with Teflon, aluminum oxide, ceramic and / or glass fiber mats (FR4) impregnated with epoxy resin as the base material. In other words: the circuit boards have the generally known circuit board materials such as Teflon, aluminum oxide, ceramic and / or glass fiber mats (FR4) impregnated with epoxy resin as the base material. In particular, the first and the second circuit board consist of one and the same base material.

According to a third aspect of the invention, a first power electronics module for a power electrical device, in particular for an electrically driven vehicle, specifically an inverter, a rectifier or a DC / DC converter, generally a power converter, is provided.

The first power electronics module has at least one power electrical component which has at least one signal connection for transmitting a (Above) signal and at least one power connection for transmitting an (above) operating current.

The first power electronics module also has at least one previously described first circuit carrier, the component being electrically connected to the second conductor track of the second circuit board of the circuit carrier via the signal connection for signal transmission and to the first conductor track of the first circuit board of the circuit carrier via the power connection for transmitting the operating current is electrically connected.

For example, the component rests on the mounting surface of the first printed circuit board. In this case, the signal connection of the component is electrically connected to the second conductor track, for example via a bond connection of the first power electronics module.

For example, the component is designed as a housing-less component (bare chip) and has an extensive electrical contact surface that forms the power connection of the component. Via the contact surface, the component rests on the mounting surface of the first printed circuit board (or on the first (surface) conductor track of the first printed circuit board) and is electrically and thermally connected to the first conductor track over a large area. In particular, the contact surface of the component is soldered, sintered, welded or glued onto the surface of the first conductor track.

According to a fourth aspect of the invention, a second power electronics module for a power electrical device, in particular for an electrically driven vehicle, specifically an inverter, a rectifier or a DC / DC converter, generally a power converter, is provided.

The second power electronics module has at least one power electrical component which has at least one power connection for transmitting an (above) operating current and at least one signal connection for transmitting a (above) signal.

The power electronics module also has at least one circuit carrier described above, the component via the power connection for transmitting the operating current with the second conductor track of the second Circuit board of the circuit carrier is electrically connected and is electrically connected to the first conductor track of the first circuit board of the circuit carrier via the signal connection for signal transmission.

For example, the component rests on the mounting surface of the first printed circuit board. In this case, the power connection of the component is electrically connected to the second conductor track via a bond connection of the second power electronics module.

For example, the component is designed as a housing-free component (bare chip) and has an extensive electrical contact surface that forms the signal connection of the component. Via the contact surface, the component rests on the mounting surface of the first printed circuit board (or on the first (surface) conductor track of the first printed circuit board) and is electrically and thermally connected to the first conductor track over a large area. In particular, the contact surface of the component is soldered, sintered, welded or glued onto the surface of the first conductor track.

For example, the first or the second power electronics module has a cooler body. The first printed circuit board of the respective power electronics module rests on a two-dimensional cooling surface of the first printed circuit board facing away from the second printed circuit board on the cooler body or on a likewise two-dimensional surface of the heat sink and is thermally contacted with it.

Brief description of the drawings:

In the following, exemplary embodiments of the invention are explained in more detail with reference to the accompanying drawings. Show:

FIG. 1 shows, in a first schematic representation, a section of a power electronics module according to a first exemplary embodiment of the invention; and

FIG. 2 shows, in a second schematic illustration, a section of a power electronics module according to a second exemplary embodiment of the invention. Detailed description of the drawings;

In a first schematic illustration, FIG. 1 shows a section of a first power electronics module LM1 with a first circuit carrier ST1 according to a first exemplary embodiment of the invention. The power electronics module LM1 is designed as part of an inverter of an electric drive of an electrically driven vehicle.

In addition to the aforementioned first circuit carrier ST1, the power electronics module LM1 has further conventional printed circuit boards LP on which, for example, control or logic electronics circuits of the power electronics module LM1 are formed.

The power electronics module LM1 also has a heat sink KK made of aluminum or a comparable material and a thermally conductive and at the same time electrically insulating insulating layer IS of a known type. In this case, the insulating layer IS rests on a two-dimensionally extended cooling surface of the cooling body KK and is physically and thermally connected to it.

The circuit carrier ST1 and the further printed circuit boards LP in turn lie next to one another on a flat, extended surface of the insulating layer IS facing away from the cooling body KK and are physically and thermally connected to the cooling body KK via the insulating layer IS.

The circuit carrier ST1 has a first printed circuit board LP11 as a carrier for electrical components or electrical components, including (at least) one power semiconductor switch BE1, the power electronics module LM1, which is also used for mechanical fastening and also for the production of mainly power connections for the transmission of operating currents or rated currents such as B. supply currents or phase currents, from, to or between the components, in particular to or from the power semiconductor switch BE1 described above. The circuit carrier ST1 rests on the cooling surface of the heat sink KK via the first printed circuit board LP11, the first printed circuit board LP11 being physically and thermally connected to the heat sink KK via the insulating layer IS.

The first printed circuit board LP11 is an ordinary printed circuit board with a composite material made of epoxy resin and glass fiber fabric (FR4) as the base material formed and has first conductor tracks LB11, which are mainly designed to produce the aforementioned power connections. The first conductor tracks LB11 are partly or predominantly embedded or laminated between the FR4 layers of the first circuit board LP1 and have a specific layer thickness of over 1 millimeter, typically about 1.5 millimeters or approx. 2 millimeters. The first conductor tracks LB11 can be produced by means of a manufacturing process generally used for circuit board technology, such as, for. B. etching or electrodeposition. Alternatively, the first conductor tracks LB11 can be punched or laser-cut from a correspondingly thick copper sheet or a copper alloy sheet in corresponding predetermined shapes and laminated between the FR4 layers of the first circuit board LP1 or on an assembly surface OF11 of the first circuit board LP11 facing away from the heat sink KK by means of a thermally conductive Adhesive be stuck on.

On the mounting surface OF11 of the first printed circuit board LP11, the electrical components or the electrical components, including the power semiconductor switch BE1, of the power electronics module LM1 are arranged and via the first conductor tracks LB11 with each other and with external electrical components of the power electronics module LM1, such. B. an operating power source or an electrical machine, electrically connected. In this case, the power semiconductor switch BE1 is designed, for example, as a bipolar transistor with an insulated gate electrode (IGBT) and has a power connection on its underside facing the mounting surface OF11, such as. B. a collector connection in the case of the IGBT, which is electrically connected to one of the first conductor tracks LB11 via a soldered, welded or sintered connection (and optionally also via a through-hole plating).

The circuit carrier ST1 also has (at least) one second circuit board LP12, which rests on the mounting surface OF11 of the first circuit board LP11 (and thus next to the above-mentioned electrical components or electrical components, including the power semiconductor switch BE1) and physically and on the mounting surface OF11 is thermally connected. The second printed circuit board LP12 rests on an area of the mounting surface OF11 on which no other electrical components are mounted. The second printed circuit board LP12 is in this case on the by means of a pre-cured thermally conductive adhesive or a thermally conductive cold laminate Assembly surface OF11 glued on and thus thermally connected to the first printed circuit board LP11.

The second printed circuit board LP12 is used exclusively to produce a (in particular a single) signal connection for the transmission of control signals to or from the above-mentioned power semiconductor switch BE1. Like the first circuit board LP11, the second circuit board LP12 is also designed as a self-sufficient circuit board with the composite material of epoxy resin and fiberglass fabric (FR4) as the base material.

The second circuit board LP12 has only one (single) second conductor track LB12, which is implemented on a surface of the second circuit board LP12 facing away from the first circuit board LP11 and which establishes the above-mentioned signal connection to the power semiconductor switch BE. The second conductor track LB2 covers the surface of the second circuit board LP2 almost completely (or over 90%). Accordingly, the second printed circuit board LP2 has one and the same U-shaped profile as the second printed conductor LB2. The second conductor track LB2 also has a layer thickness of approximately 35 micrometers or less than 35 micrometers, which is specific for its function of the signal connection. The second conductor track LB2 is punched or laser-cut from a correspondingly thick copper foil (or a correspondingly thick copper sheet) or a copper alloy foil (or a copper alloy sheet) and glued to the surface of the second circuit board LP2 by means of a thermally conductive adhesive. Apart from the single, second conductor track LB2, the second circuit board LP2 has no further conductor tracks, in particular no conductor tracks that are embedded or laminated into the second circuit board LP2 or between composite layers of the second circuit board LP2. The second conductor track LB2 is spatially and electrically isolated from the first conductor track LB1 or is not electrically connected.

The power semiconductor switch BE1 described above also has a control signal connection SA1, such as, for. B. a gate connection in the case of the IGBT. The control signal connection SA is electrically connected to the second conductor track LB2 via a bond connection BV1 of the power electronics module LM1. In an alternative embodiment, the power semiconductor switch BE1 (or the IGBT) is designed as a bare chip without a housing and has an extensive contact surface on its underside, which forms the power connection of the power semiconductor switch BE1 (or the collector connection in the case of the IGBT). In this case, the power semiconductor switch BE1 rests on a first conductor track LB11 (implemented on the top) via the contact surface and is physically, thermally and electrically connected to it over a large area. In this case, the power semiconductor switch BE1 is, for example, soldered, welded or sintered onto the first conductor track LB1.

In a second schematic illustration, FIG. 2 shows a section of a second power electronics module LM2 with a second circuit carrier ST2 according to a second exemplary embodiment of the invention. The power electronics module LM2 is also designed as part of an inverter of an electric drive of an electrically driven vehicle.

The second power electronics module LM2 differs from the first power electronics module LM1 shown in FIG. 1 primarily in that the functions of its first circuit board LP21 and its second circuit board LP22 in terms of power or signal transmission are largely exchanged for the second circuit carrier ST2 is the case with the first circuit carrier ST1 of the first power electronics module LM1.

The first printed circuit board LP21 of the second circuit carrier ST2 is used, inter alia, mainly to produce signal connections from, to or between the components, including from or to a power semiconductor switch BE2 of the second power electronics module LM2.

The first printed circuit board LP21 has first conductor tracks LB21 which are predominantly, especially exclusively, designed to produce signal or data connections for the transmission of control signals or data signals to, from or between the components including the power semiconductor switch BE2. The first conductor tracks LB21 are partly or predominantly embedded or laminated between FR4 layers of the first circuit board LP21 and have a layer thickness of approximately 35 micrometers or less than 35 micrometers specific for their function of signal or data transmission. The first conductor tracks are accordingly LB21 also by means of a manufacturing process generally used for printed circuit board technology, such as e.g. B. etching or electrodeposition.

The electrical components or the electrical components, including the power semiconductor switch BE2, of the second power electronics module LM2 are arranged on an assembly surface OF21 of the first printed circuit board LP21 and are electrically connected to one another and to external electrical components of the inverter via the first conductor tracks LB21. In this case, the power semiconductor switch BE2 is designed, for example, as a bipolar transistor with an insulated gate electrode (IGBT) and has a signal connection on its underside facing the mounting surface OF21, such as e.g. B. a gate connection in the case of the IGBT, which is electrically connected to one of the first conductor tracks LB21 via a soldered, welded or sintered connection (and possibly also via a through-hole contact).

The second printed circuit board LP22 rests next to the above-mentioned electrical components or electrical components on the mounting surface OF21 of the first printed circuit board LP21 and is physically and thermally connected to it. The second printed circuit board LP22 is used exclusively to produce a (especially. Single) power connection for the transmission of an operating current, such as. B. a supply current or a phase current to or from the power semiconductor switch BE described above.

The second circuit board LP22 accordingly has only one (single) second conductor track LB22, which is implemented on a surface of the second circuit board LP22 facing away from the first circuit board LP21 and which establishes the above-mentioned power connection to the power semiconductor switch BE2. The second conductor track LB22 has a layer thickness of over 1 millimeter, typically about 1.5 millimeters or about 2 millimeters, which is specific for its function of current transmission. The second conductor track LB22 is punched or laser-cut from a correspondingly thick copper sheet or a copper alloy sheet and glued to the surface of the second circuit board LP22 by means of a thermally conductive adhesive. Apart from the single, second conductor track LB22, the second circuit board LP22 has no further conductor tracks, in particular no conductor tracks that are embedded or laminated into the second circuit board LP22 or between composite layers of the second circuit board LP22. The second conductor track LB22 is also spatially and electrically isolated from the first conductor track LB21 or is not electrically connected. The power semiconductor switch BE described above also has a power connection SA2, such as, for. B. a collector connection in the case of the IGBT. The power connection SA2 is the second via a bond connection BV2

Power electronics module LM2 electrically connected to the second conductor track LB22.

Claims

1. Circuit carrier (ST 1) for an electronic module (LM1), comprising: a first printed circuit board (LP11) for arranging an electrical or electronic component (BE1), which has a first conductor track (LB11) for establishing a power connection for transmitting an operating current to the Having component (BE1); a second printed circuit board (LP12) which is designed exclusively for establishing a signal connection for transmitting a signal to the component (BE1) and has a second conductor track (LB12) for establishing the signal connection for transmitting the signal; wherein the second printed circuit board (LP12) rests on a mounting surface (OF11) of the first printed circuit board (LP11) and is physically and thermally connected to it.

2. Circuit carrier (ST2) for an electronic module (LM2), comprising: a first printed circuit board (LP21) for arranging an electrical or electronic component (BE2), which has a first conductor track (LB21) for establishing a signal connection for transmitting a signal to the component (BE2); a second printed circuit board (LP22) which is designed exclusively for establishing a power connection for transmitting an operating current to the component (BE2) and has a second conductor track (LB22) for establishing the power connection for transmitting the operating current; wherein the second printed circuit board (LP22) rests on a mounting surface (OF21) of the first printed circuit board (LP21) and is physically and thermally connected to it.

3. circuit carrier (ST1, ST2) according to claim 1 or 2, wherein the second circuit board (LP12, LP22) is glued to the mounting surface (OF11, OF21) of the first circuit board (LP11, LP21).

4. circuit carrier (ST 1, ST2) according to one of the preceding claims, wherein the second conductor track (LB12, LB22) has a layer thickness of over 1 millimeter or over 1, 5 millimeters or over 2 millimeters.

5. circuit carrier (ST 1, ST2) according to any one of the preceding claims, wherein the second conductor track (LB12, LB22) is glued to a surface of the second circuit board (LP12, LP22) facing away from the first circuit board (LP11, LP21).

6. circuit carrier (ST 1, ST2) according to any one of the preceding claims, wherein the second conductor track (LB12, LB22) at least 70% or at least 80% or at least 90% or at least 95% of the first printed circuit board (LP11, LP21) facing away Surface of the second printed circuit board (LP12, LP22) covered.

7. circuit carrier (ST 1, ST2) according to any one of the preceding claims, wherein the first conductor track (LB11, LB21) and / or the second conductor track (LB12, LB22) each punched from a metal sheet or a metal alloy sheet or a copper sheet or a copper alloy sheet cut or laser beam cut, or forged or pressed from a metal part or a metal alloy part or a copper sheet or a copper alloy sheet.

8. circuit carrier (ST 1, ST2) according to one of the preceding claims, wherein the first printed circuit board (LP11, LP21) and / or the second printed circuit board (LP12, LP22) with Teflon, aluminum oxide, ceramic and / or glass fiber mats impregnated with epoxy resin as the base material are trained.

9. Power electronics module (LM1), comprising: at least one power electrical component (BE1) which has at least one signal connection (SA1) for transmitting a signal and at least one power connection for transmitting an operating current; at least one circuit carrier (ST 1) according to claim 1, or according to claim 1 and one of claims 3 to 8; wherein the component (BE1) is electrically connected to the second conductor track (LB12) of the circuit carrier (ST1) via the signal connection (SA1) and is electrically connected to the first conductor track (LB11) of the circuit carrier (ST1) via the power connection.

10. Power electronics module (LM1) according to claim 9, wherein the component (BE1) rests on the mounting surface (OF11) of the first printed circuit board (LP11); wherein the power electronics module (LM1) furthermore has a bond connection (BV1) which electrically connects the signal connection (SA1) to the second conductor track (LB12).

11. Power electronics module (LM1) according to one of claims 9 to 10, wherein the component (BE1) is designed as a housing-less component and has an extensive electrical contact surface which forms the power connection of the component (BE1), the component (BE1) rests on the mounting surface (OF11) of the first circuit board (LP11) via the contact surface and is electrically and thermally connected to the first conductor track (LB11).

12. Power electronics module (LM2), comprising: at least one power electrical component (BE2) which has at least one power connection (SA2) for transmitting an operating current and at least one signal connection for transmitting a signal; at least one circuit carrier (ST2) according to claim 2, or according to claim 2 and one of claims 3 to 8; wherein the component (BE2) is electrically connected to the second conductor track (LB22) of the circuit carrier (ST2) via the power connection (SA2) and is electrically connected to the first conductor track (LB21) of the circuit carrier (ST2) via the signal connection.

13. Power electronics module (LM2) according to claim 12, wherein the component (BE2) rests on the mounting surface (OF21) of the first printed circuit board (LP21); wherein the power electronics module (LM2) furthermore has a bond connection (BV2) which electrically connects the power connection (SA2) to the second conductor track (LB22).

14. Power electronics module (LM2) according to one of claims 12 to 13, wherein the component (BE2) is designed as a housing-less component and has an extensive electrical contact surface which forms the signal connection of the component (BE2), the component (BE2) via the contact area on the mounting surface (OF21) of the first printed circuit board (LP21) rests and is electrically and thermally connected to the first conductor track (LB21).

15. Power electronics module (LM1, LM2) according to one of claims 9 to 14, further comprising: a cooler body (KK) for cooling the power electronics module (LM1, LM2); wherein the first printed circuit board (LP11, LP21) rests on the cooler body (KK) via a flat, extensive cooling surface facing away from the second printed circuit board (LP12, LP22) and is connected to the

Cooler body (KK) is thermally contacted.