WO2021100969A1

WO2021100969A1 - Superconducting layer exfoliation method and exfoliation apparatus therefor

Info

Publication number: WO2021100969A1
Application number: PCT/KR2019/018456
Authority: WO
Inventors: 김영순; 이정훈; 민병진; 이재훈; 이헌주; 문승현
Original assignee: 주식회사 서남
Priority date: 2019-11-20
Filing date: 2019-12-26
Publication date: 2021-05-27

Abstract

A superconducting layer exfoliation method and an exfoliation apparatus therefor are disclosed. The exfoliation method comprises the steps of: releasing a superconducting wire; separating, from a substrate of the superconducting wire and a buffer layer on the substrate, a superconducting layer and a lamination layer on the superconducting layer; coiling the substrate and the buffer layer; and coiling the superconducting layer and the lamination layer, wherein the separation step comprises a step of bending the superconducting layer and the lamination layer with respect to the substrate and the buffer layer.

Description

Superconducting layer peeling method and peeling device thereof

The present invention relates to a method for manufacturing a ceramic wire and an apparatus for manufacturing the same, and more particularly, to a method for peeling a superconducting layer and an apparatus for removing the same.

A superconductor can pass a large amount of current because its electrical resistance approaches '0' at a low temperature. In recent years, research on a second-generation high-temperature superconducting wire (Coated Conductor) which forms a superconducting layer on a thin buffer layer or a metal substrate having a biaxially oriented texture has been actively conducted. The second-generation high-temperature superconducting wire has a current transport capability per unit area far superior to that of a general metal wire. The second-generation high-temperature superconducting wire may be used in a power field with low power loss, MRI, a superconducting maglev train, and a superconducting propulsion ship.

A problem to be solved by the present invention is to provide a method of peeling a superconducting layer capable of removing fragments of a buffer layer, and a peeling apparatus thereof.

The present invention discloses a method of peeling a superconducting layer. Its peeling method includes the steps of releasing a superconducting wire; Separating a superconducting layer and a lamination layer on the superconducting layer from the substrate of the superconducting wire and the buffer layer on the substrate; Coiling the substrate and the buffer layer; And coiling the superconducting layer and the lamination layer. Here, separating the superconducting layer and the lamination layer from the substrate and the buffer layer may include bending the superconducting layer and the lamination layer with respect to the substrate and the buffer layer.

For example, the superconducting layer may be bent with a band radius of 4.6 mm or more.

For example, the superconducting layer may be bent with a band radius of 6.1 mm or more.

For example, the superconducting layer may be bent with a band radius of 25.1 mm or less.

For example, separating the superconducting layer and the lamination layer from the substrate and the buffer layer may further include determining whether there are first fragments on the superconducting layer.

For example, separating the superconducting layer and the lamination layer from the substrate and the buffer layer may further include reducing the band radius when the first fragments are present on the superconducting layer.

For example, separating the superconducting layer and the lamination layer from the substrate and the buffer layer may further include determining whether there are second fragments on the buffer layer.

For example, separating the superconducting layer and the lamination layer from the substrate and the buffer layer may further include increasing the band radius when the second fragments are present on the buffer layer.

For example, separating the superconducting layer and the lamination layer from the substrate and the buffer layer may further include moving the substrate and the buffer layer flat.

An apparatus for peeling a superconducting layer according to an embodiment of the present invention includes: a releasing reel for releasing a superconducting wire; A first coiling reel for coiling the substrate of the superconducting wire and the buffer layer on the substrate; A second coiling reel disposed between the first coiling reel and the releasing reel and coiling a superconducting layer and a lamination layer separated from the substrate and the buffer layer; And a band roller having a roller radius of 6mm to 25mm and bending the superconducting layer and the lamination layer with respect to the substrate in contact with the lamination layer.

For example, a first support pulley disposed between the releasing reel and the band roller to support the superconducting wire; And a second support pulley disposed between the band roller and the first coiling reel to support the substrate.

As described above, in the method of peeling the superconducting layer according to the exemplary embodiment of the present invention, debris of the buffer layer may be removed by bending the superconducting layer to a substrate with a band radius of 6.1 mm to 25.1 mm.

1 is a cross-sectional view showing an example of a superconducting layer peeling apparatus according to the concept of the present invention.

2 is a cross-sectional view showing an example of the superconducting wire of FIG. 1

3 is a flow chart showing a method of peeling a superconducting layer according to the present invention.

4 is a flowchart illustrating an example of separating a lamination layer and a superconducting layer from the substrate of FIG. 3.

5 is a graph showing the number of first fragments and the number of second fragments generated according to the band radius of FIG. 2.

6 and 7 are plan views illustrating an example of the superconducting layer of FIG. 2.

8 and 9 are plan views illustrating an example of the buffer layer of FIG. 2.

10 is a graph showing the resistance of the superconducting layer according to the band radius of FIG. 2.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in different forms. Rather, the embodiments introduced herein are provided so that the disclosed content may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art, and the present invention is only defined by the scope of the claims. The same reference numerals refer to the same constituent elements throughout the entire specification.

The terms used in the present specification are for describing exemplary embodiments and are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated in the phrase. As used in the specification,'comprises' and/or'comprising' refers to the presence of one or more other elements, steps, actions and/or elements in the referenced elements, steps, actions and/or elements. Or does not preclude additions. Further, since it is according to a preferred embodiment, reference numerals presented in the order of description are not necessarily limited to the order.

Further, the embodiments described in the present specification will be described with reference to sectional views and/or plan views, which are ideal exemplary diagrams of the present invention. In the drawings, the thickness of the plate and the size of the flow path are exaggerated for effective explanation of the technical content. Accordingly, the shape of the exemplary diagram may be modified due to manufacturing techniques and/or tolerances. It is intended to illustrate specific types of domains and is not intended to limit the scope of the invention.

1 shows an example of a superconducting layer peeling apparatus 100 according to the concept of the present invention.

Referring to FIG. 1, the superconducting layer peeling apparatus 100 of the present invention may be a reel-to-reel device or a roll-to-roll device. For example, a releasing reel 10, a first coiling reel 20, a second coiling reel 30, a first support roller 40, a second support roller 50, a band roller 60, and It may include image sensors 70.

The releasing reel 10 may release the superconducting wire 80 into the first coiling reel 20 and the second coiling reel 30. The superconducting wire 80 may be unwound in the first direction. The superconducting wire 80 may be coiled on the releasing reel 10 to be stored and transported.

2 shows an example of the superconducting wire 80 of FIG. 1.

Referring to FIG. 2, the superconducting wire 80 may include a substrate 82, a buffer layer 84, a superconducting layer 86, and a lamination layer 88. The substrate 82 may include a cubic metal such as rolled heat-treated Ni, a Ni-based alloy (Ni-W, Ni-Cr, Ni-Cr-W, etc.), stainless steel, silver, silver alloy, and Ni-silver composite. have. The substrate 82 may have a first thickness T ₁ of about 100 μm.

The buffer layer 84 may be disposed on the substrate 82. The buffer layer 84 may contact the substrate 82. Buffer layer 84 may comprise a LaMnO _{_3,} LaAlO _3, or SrTiO _3. The buffer layer 84 may have a second thickness T ₂ of about 10 μm to about 50 μm.

The superconducting layer 86 may be disposed on the buffer layer 84. The superconducting layer 86 may contact the buffer layer 84. The superconducting layer 86 may include a metal oxide. For example, the superconducting layer 86 may include at least one of rare earth elements RE, copper (Cu), and barium (Ba). The rare earth element (RE) may be understood to be yttrium (Y) and a lanthanum group element or a combination thereof. Lanthanum group elements, as well known, include La, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and the like. The superconducting layer 86 may have a third thickness T ₃ of about 1 μm to about 20 μm.

The lamination layer 88 may be disposed on the superconducting layer 86. The lamination layer 88 may contact the superconducting layer 86. The lamination layer 88 may include copper. Alternatively, the lamination layer 88 may include stainless metal, and the present invention is not limited thereto. For example, the lamination layer 88 may have a fourth thickness T ₄ of about 100 μm to about 150 μm.

Although not shown, the superconducting wire 80 may further include a stabilization layer between the superconducting layer 86 and the lamination layer 88.

Referring back to FIG. 1, the first coiling reel 20 may be disposed to be spaced apart from the releasing reel 10. The first coiling reel 20 may coil the substrate 82 and the buffer layer 84 of the superconducting wire 80. The first coiling reel 20 may be disposed in the first direction x from the releasing reel 10.

The second coiling reel 30 may be disposed between the first coiling reel 20 and the releasing reel 10. The second coiling reel 30 may coil the superconducting layer 86 and the lamination layer 88 of the superconducting wire 80. The superconducting layer 86 and the lamination layer 88 may be peeled from the substrate 82 and the buffer layer 84. The peeled superconducting layer 86 and the lamination layer 88 may reduce the size and/or volume of a magnetic field induction device (eg, a nuclear magnetic resonance device (NMR)) and increase the strength of the magnetic field.

The first support roller 40 may be disposed between the releasing reel 10 and the band roller 60. The first support roller 40 may be an idle roller. The first support roller 40 may support the substrate 82, the buffer layer 84, the superconducting layer 86, and the lamination layer 88 of the superconducting wire 80. Between the first support roller 40 and the second support roller 50, the superconducting layer 86 and the lamination layer 88 may be peeled from the substrate 82 and the buffer layer 84.

The second support roller 50 may be disposed between the band roller 60 and the first coiling reel 20. The second support roller 50 may be an idle roller. The second support roller 50 may support the substrate 82 and the buffer layer 84. The first support roller 40 and the second support roller 50 may be disposed in the first direction (x). The first support roller 40 and the second support roller 50 may move the substrate 82 and the buffer layer 84 in the first direction x.

The band roller 60 may be disposed between the first support roller 40 and the second support roller 50. The band roller 60 may be disposed between the first support roller 40 and the second coiling reel 30. The band roller 60 may be disposed in the second direction (y) direction with respect to the first support roller 40 and the second support roller 50. The band roller 60 may be an idle roller. The band roller 60 may separate the superconducting layer 86 and the lamination layer 88 from the substrate 82 and the buffer layer 84.

Referring to FIG. 2, the band roller 60 may selectively bend the superconducting layer 86 and the lamination layer 88 from the substrate 82 and the buffer layer 84. The lamination layer 88 may contact the band roller 60. That is, the lamination layer 88 and the superconducting layer 86 may be bent along the band roller 60 and separated from the buffer layer 84 and the substrate 82.

On the other hand, the buffer layer 84 is mainly bonded to the flat surface and can be separated from the bending surface.

When the substrate 82 is bent, the buffer layer 84 may be bonded to the superconducting layer 86 and separated from the substrate 82. When the buffer layer 84 is bonded to the superconducting layer 86, the size of the magnetic field induction device may increase and the induction efficiency of the magnetic field may decrease.

When the lamination layer 88 and the superconducting layer 86 are bent, the buffer layer 84 may be bonded to the substrate 82 and separated from the superconducting layer 86. The separation efficiency of the buffer layer 84 may be determined according to the roller radius R1 of the band roller 60. For example, the band roller 60 may have a radius R1 of about 6mm to about 25.mm. The superconducting layer 86 may be bent with a band radius R2. The band radius R2 may correspond to the sum of the roller radius R1 and the fourth thickness T _{4 of the band roller 60.} Accordingly, the band radius R2 of the superconducting layer 86 may be about 6.1 mm to about 25.1 mm.

Again, referring to FIG. 1, the image sensors 70 may be disposed adjacent to the first coiling reel 20 and the second coiling reel 30. For example, the image sensors 70 may include CMOS or CCD. For example, the image sensors 70 may include a first image sensor 72 and a second image sensor 74. The first image sensor 72 may be disposed between the band roller 60 and the second coiling reel 30. The first image sensor 72 may detect a first fragment (85 in FIG. 6) on the superconducting layer 86. The second image sensor 74 may be disposed between the second support roller 50 and the first coiling reel 20. The second image sensor 74 can detect the second fragment (83 in FIG. 8) on the buffer layer 84.

A method of peeling the superconducting layer 86 using the apparatus 100 for peeling the superconducting layer 86 of the present invention configured as described above will be described as follows.

3 shows a method of peeling a superconducting layer according to the present invention.

3, the releasing reel 10 releases the superconducting wire 80 (S10). The superconducting wire 80 may be unwound in the first direction (x). The first superconducting wire 80 may be provided on the first support roller 40 and the band roller 60.

Next, the band roller 60 separates the lamination layer 88 and the superconducting layer 86 from the substrate 82 and the buffer layer 84 (S20). The substrate 82 and the buffer layer 84 may be provided on the second support roller 50 and the first coiling reel 20. The superconducting layer 86 and the lamination layer 88 may be provided on the second coiling reel 30. The substrate 82 and the buffer layer 84 may be moved in the first direction (x), and the lamination layer 88 and the superconducting layer 86 may be moved in the second direction (y).

4 shows an example of a step S20 of separating the lamination layer 88 and the superconducting layer 86 from the substrate 82 of FIG. 3.

Referring to FIG. 4, the first support roller 40 and the second support roller 50 move the substrate 82 and the buffer layer 84 flatly in the first direction x (S22). The substrate 82 and the buffer layer 84 may extend to the first coiling reel 20, and the superconducting layer 86 and the lamination layer 88 may extend to the second coiling reel 30.

Next, the band roller 60 bends the superconducting layer 86 and the lamination layer 88 with respect to the substrate 82 and the buffer layer 84 (S24). The superconducting layer 86 and the lamination layer 88 may be separated from the substrate 82 and buffer layer 84.

5 shows the number of first fragments 85 and the number of second fragments 83 generated according to the band radius R2 of FIG. 2.

Referring to FIG. 5, when the band radius R2 is about 4.6 mm to about 25.1 mm, the first fragment (85 in FIG. 6) and the second fragment (83 in FIG. 8) may not be generated. That is, the superconducting layer 86 can be separated from the buffer layer 84 without defects. When the band radius R2 is greater than about 25.6 mm (92), the first fragment 85 may be generated on the superconducting layer 86. The first fragment 85 may be a particle defect of the buffer layer 84. When the band radius R2 is less than about 4.6 mm (94), the second fragment 83 may be generated on the buffer layer 84. The second fragment 83 may be a damage defect of the superconducting layer 86. Accordingly, the band roller 60 may remove the first fragment 85 and the second fragment 83 by bending the superconducting layer 86 with a band radius R2 of about 4.6 mm to about 25.1 mm.

6 and 7 show an example of the superconducting layer 86 of FIG. 2.

6 and 7, the controller (not shown) determines whether or not the first fragment 85 is present on the superconducting layer 86 by using the detection signal of the first image sensor 72 (S26).

Referring to FIG. 6, when the first fragment 85 is on the superconducting layer 86, the controller outputs a first signal to reduce the roller radius R1 (S27). The first signal may be a reduction alarm signal of the band radius R2. When the first signal is output, the operator or the robot may exchange the band roller 60 having the reduced roller radius R1. I can.

When the roller radius R1 is reduced to about 25 mm or less with reference to FIG. 7, the superconducting layer 86 may be separated from the buffer layer 84 without the first fragment 85. The band radius R2 may be reduced to about 25.1 mm or less.

8 and 9 show an example of the buffer layer 84 of FIG. 2.

8 and 9, when the first fragment 85 is not on the superconducting layer 86, the control unit uses the detection signal from the second image sensor 74 to the superconducting layer 86 on the buffer layer 84. It is determined whether there is no second fragment 83 of) (S28).

Referring to FIG. 8, when the second fragment 83 is on the buffer layer 84, the controller outputs a second signal to increase the roller radius R1 (S29). The second signal may be an alarm signal for increasing the roller radius R1. When the second signal is output, the operator or the robot may exchange the band roller 60 having the increased roller radius R1.

Referring to FIG. 9, when the roller radius R1 increases to about 4.5 or more, the buffer layer 84 may be separated from the superconducting layer 86 without the second fragment 83. The band radius R2 of the superconducting layer 86 may increase to about 4.6 mm or more.

_{10 shows the critical resistance R C} of the superconducting layer 86 according to the band radius R2 of FIG. 2.

Referring to FIG. 10, when the band radius R2 is less than or equal to about 6.1 mm, the current I of the superconducting layer 86 may decrease to less than or equal to the _{critical current I C.} For example, the superconducting layer 86 may have a current I less than or equal _{to the threshold current I C due to its fine crack defects.} The critical current I _C may be about 800A/cm. When the current I of the superconducting layer 86 _{decreases below the threshold current I C} , the resistance of the superconducting layer 86 may be greater than “0”. When the band radius R2 is greater than about 6.1 mm, the current I of the superconducting layer 86 may increase.

When the band radius R2 is about 6.1 mm or more, the current I of the superconducting layer 86 may be greater than or equal to the _{critical current I C.} When the current I is _{greater than or equal to the critical current I C} , the resistance of the superconducting layer 86 may be approximately “0”, and the roller radius R1 may be approximately 6 mm or more.

Referring back to FIG. 3, the first coiling reel 20 coils the substrate 82 and the buffer layer 84 (S30). The second coiling reel 30 coils the superconducting layer 86 and the lamination layer 88 (S40). The first coiling reel 20, the second coiling reel 30, and the releasing reel 10 may rotate at the same speed. The first coiling reel 20 and the second coiling reel 30 may coil the substrate 82, the buffer layer 84, the superconducting layer 86, and the lamination layer 88 at the same speed.

As described above, embodiments of the present invention have been described with reference to the accompanying drawings, but those of ordinary skill in the art to which the present invention pertains can be implemented in other specific forms without changing the technical spirit or essential features. You can understand that there is. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects.

Claims

Releasing the superconducting wire;

Separating a superconducting layer and a lamination layer on the superconducting layer from the substrate of the superconducting wire and the buffer layer on the substrate;

Coiling the substrate and the buffer layer; And

Including the step of coiling the superconducting layer and the lamination layer,

Separating the superconducting layer and the lamination layer from the substrate and the buffer layer comprises bending the superconducting layer and the lamination layer with respect to the substrate and the buffer layer.
The method of claim 1,

The superconducting layer is a method of peeling a superconducting layer that is bent with a band radius of 4.6 mm or more.
The method of claim 2,

The superconducting layer is a method of peeling a superconducting layer that is bent with a band radius of 6.1 mm or more.
The method of claim 2,

The superconducting layer is a method of peeling off a superconducting layer in which the superconducting layer is bent with a band radius of 25.1 mm or less.
The method of claim 1,

Separating the superconducting layer and the lamination layer from the substrate and the buffer layer further comprises determining whether there are first fragments on the superconducting layer.
The method of claim 5,

Separating the superconducting layer and the lamination layer from the substrate and the buffer layer further comprises reducing the band radius when the first fragments are present on the superconducting layer.
The method of claim 1,

Separating the superconducting layer and the lamination layer from the substrate and the buffer layer further comprises determining whether there are second fragments on the buffer layer.
The method of claim 7,

Separating the superconducting layer and the lamination layer from the substrate and the buffer layer further comprises increasing the band radius when the second fragments are present on the buffer layer.
The method of claim 1,

Separating the superconducting layer and the lamination layer from the substrate and the buffer layer further comprises moving the substrate and the buffer layer flatly.
A releasing reel for releasing a superconducting wire;

A first coiling reel for coiling the substrate of the superconducting wire and the buffer layer on the substrate;

A second coiling reel disposed between the first coiling reel and the releasing reel and coiling a superconducting layer and a lamination layer separated from the substrate and the buffer layer; And

A superconducting layer peeling apparatus comprising a band roller having a roller radius of 6mm to 25mm and bending the superconducting layer and the lamination layer with respect to the substrate in contact with the lamination layer.
The method of claim 10,

A first support pulley disposed between the releasing reel and the band roller to support the superconducting wire; And

A superconducting layer peeling apparatus further comprising a second support pulley disposed between the band roller and the first coiling reel to support the substrate.