WO2021100162A1 - Prepreg, layered sheet, electronic device, and mounting device - Google Patents

Prepreg, layered sheet, electronic device, and mounting device Download PDF

Info

Publication number
WO2021100162A1
WO2021100162A1 PCT/JP2019/045531 JP2019045531W WO2021100162A1 WO 2021100162 A1 WO2021100162 A1 WO 2021100162A1 JP 2019045531 W JP2019045531 W JP 2019045531W WO 2021100162 A1 WO2021100162 A1 WO 2021100162A1
Authority
WO
WIPO (PCT)
Prior art keywords
fiber layer
layer
resin
prepreg
fiber
Prior art date
Application number
PCT/JP2019/045531
Other languages
French (fr)
Japanese (ja)
Inventor
ベジ 佐々木
Original Assignee
ベジ 佐々木
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ベジ 佐々木 filed Critical ベジ 佐々木
Priority to PCT/JP2019/045531 priority Critical patent/WO2021100162A1/en
Priority to JP2021558109A priority patent/JPWO2021100162A1/ja
Publication of WO2021100162A1 publication Critical patent/WO2021100162A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/14—Making preforms characterised by structure or composition
    • B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed

Definitions

  • the present invention relates to a prepreg having a fiber layer and a resin material, and a laminated board having such a prepreg, an electronic device, and a mounting device.
  • a prepreg having a fiber layer and a resin material provided on the fiber layer has been known.
  • a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a first resin layer formed on one surface of the fiber base material layer are formed on the other surface of the fiber base material layer.
  • a prepreg having a second resin layer and a second resin layer is disclosed.
  • the prepreg may not be able to enter the recesses (patterning recesses) between the conductor layers made of a metal layer or the like.
  • the present invention provides a prepreg containing a sufficient amount of resin.
  • the prepreg according to the present invention First fiber layer and A second fiber layer provided apart from the first fiber layer and With A resin material is provided on the second fiber layer side of the first fiber layer and on the side of the first fiber layer opposite to the second fiber layer.
  • the resin material may be contained in 70% by weight or more of the prepreg.
  • the amount of the resin material on the side of the first fiber layer on the second fiber layer side may be larger than that of the resin material on the side of the first fiber layer opposite to the second fiber layer.
  • the thickness of the resin layer formed by the resin material on the second fiber layer side of the first fiber layer is the thickness of the resin layer formed by the resin material on the side opposite to the second fiber layer of the first fiber layer. It may be larger than the thickness.
  • the second fiber layer may be more plastic than the first fiber layer.
  • Concept 5 In a prepreg according to any one of the concepts 1 to 4 of the present invention.
  • the mesh of the second fiber layer may be larger than the network of the first fiber layer.
  • the fibers of the second fiber layer may be finer than the fibers of the first fiber layer.
  • a third fiber layer provided apart from the first fiber layer may be provided on the side opposite to the second fiber layer with respect to the first fiber layer.
  • the third fiber layer may be more plastic than the first fiber layer.
  • n is an integer of 4 or more
  • Any one of the resin layers may be thicker than any one of the resin layers located on the inner surface side of the resin layer.
  • nth fiber layer (“n” is an integer of 4 or more) provided apart from the first fiber layer, the second fiber layer, and the third fiber layer in the thickness direction is provided.
  • the m-th fiber layer (“m” is an integer of 4 or more and n or less) may be more plastic than the fiber layer located on the inner surface side of the m-th fiber layer.
  • the resin material that forms the resin layer provided on the first fiber layer may be different from the resin material that forms the resin layer provided on the second fiber layer.
  • the laminated board according to the present invention A substrate having an insulating layer and a patterned metal layer provided on the insulating layer, The prepreg according to any one of claims 1 to 11 provided on the metal layer. With The recess formed by the metal layer may have a depth of 70 ⁇ m or more.
  • the laminated board according to the present invention A plurality of substrates having an insulating layer and a patterned metal layer provided on both sides of the insulating layer, and a plurality of substrates.
  • An internal prepreg provided between the substrates and An external prepreg provided only on one side or the other side of the substrate, With The inner prepreg is opposite to the inner first fiber layer, the inner second fiber layer provided apart from the inner first fiber layer, and the inner first fiber layer. It has an inner third fiber layer provided on the side, and is inside between the inner first fiber layer and the inner second fiber layer and between the inner first fiber layer and the inner third fiber layer.
  • a resin layer is provided, and the internal resin material constituting the internal resin layer is contained in 70% by weight or more of the internal prepreg.
  • the outer prepreg has an outer first fiber layer and an outer second fiber layer provided apart from the outer first fiber layer, and the outer first fiber layer and the outer second fiber layer
  • An outer resin layer is provided between the spaces and on the side of the outer first fiber layer opposite to the outer second fiber layer, and the outer resin material constituting the outer resin layer is contained in 70% by weight or more of the outer side prepreg. May be done.
  • the mounting device according to the present invention is The electronic device according to the concept 14 may be provided.
  • the resin material can be contained in an amount of 70% by weight or more of the prepreg, and for example, the recesses between the metal layers can be easily filled with the resin.
  • FIG. 1 is a side sectional view of a prepreg according to an example of the first embodiment of the present invention.
  • FIG. 2 is a side sectional view of a prepreg according to another example of the first embodiment of the present invention.
  • FIG. 3A is a plan view showing an example of a first fiber layer that can be used in the first embodiment of the present invention, and FIG. 3B is used in the first embodiment of the present invention. It is a top view which showed an example of the possible 2nd fiber layer.
  • FIG. 4A is a plan view showing an example of a first fiber layer that can be used in the first embodiment of the present invention, and FIG. 4B is used in the first embodiment of the present invention.
  • FIG. 5 is a plan view showing another example of a possible second fiber layer.
  • FIG. 5 is a side sectional view showing an example of a substrate, a prepreg, and an external metal layer that can be used in the first embodiment of the present invention.
  • FIG. 6 is a side sectional view showing another example of the substrate, prepreg and external metal layer that can be used in the first embodiment of the present invention.
  • FIG. 7 is a side sectional view showing still another example of the substrate, prepreg and external metal layer that can be used in the first embodiment of the present invention.
  • FIG. 8 is a side sectional view showing an example of a prepreg manufacturing process according to the first embodiment of the present invention, and FIG. 8A shows an embodiment in which resin layers are provided on both sides of the first fiber layer.
  • FIG. 8 (b) is a side sectional view shown, FIG.
  • FIG. 8 (b) is a lateral sectional view showing an aspect in which a resin layer is provided on one surface of the second fiber layer
  • FIG. 8 (c) is a second. It is a side sectional view which showed the aspect which inverted the resin layer provided in the fiber layer and brought it into contact with the resin layer on one side of the first fiber layer.
  • FIG. 9 is a side sectional view of the prepreg according to an example of the second embodiment of the present invention.
  • FIG. 10 is a side sectional view of a prepreg according to another example of the second embodiment of the present invention.
  • FIG. 11 (a) is a plan view showing an example of the first fiber layer that can be used in the second embodiment of the present invention, and FIG. 11 (b) is used in the second embodiment of the present invention.
  • FIG. 11 (c) is a plan view showing an example of a possible third fiber layer
  • FIG. 11 (c) is a plan view showing another example of the third fiber layer that can be used in the third embodiment of the present invention.
  • FIG. 12 is a side sectional view showing an example of a prepreg manufacturing process according to the second embodiment of the present invention
  • FIG. 12A shows an embodiment in which resin layers are provided on both sides of the first fiber layer.
  • FIG. 12 (b) is a side sectional view shown
  • FIG. 12 (b) is a lateral sectional view showing an aspect in which a resin layer is provided on one surface of the second fiber layer
  • FIG. 12 (c) is a third.
  • FIG. 12 is a side sectional view showing an example of a prepreg manufacturing process according to the second embodiment of the present invention
  • FIG. 12A shows an embodiment in which resin layers are provided on both sides of the first fiber layer.
  • FIG. 12 (b) is a side sectional view shown
  • FIG. 12 (d) is a side sectional view showing a mode in which a resin layer is provided on one surface of the fiber layer, and FIG. 12 (d) shows the first fiber layer by inverting the resin layer provided on the second fiber layer. It is a side sectional view which showed the aspect which brought into contact with the resin layer on one side, and brought into contact with the resin layer on the other side of the 1st fiber layer.
  • FIG. 13 is a side sectional view showing a modified example of the first embodiment and the second embodiment of the present invention.
  • FIG. 14 is a side sectional view showing an example of a substrate, a prepreg, and an external metal layer that can be used in the third embodiment of the present invention.
  • FIG. 15 (a) is a side sectional view showing an external prepreg that can be used in the third embodiment of the present invention
  • FIG. 15 (b) is used in the third embodiment of the present invention. It is a side sectional view which showed the inner side prepreg.
  • FIG. 16 is a side sectional view showing an embodiment in which the redox layer is provided on the metal layer in the embodiment of the present invention.
  • FIG. 17 is a side sectional view showing another aspect in which the redox layer is provided on the metal layer in the embodiment of the present invention.
  • the prepreg 100 of the present embodiment is separated from the first fiber layer 10 formed by the first fiber 11 (see FIGS. 3 and 4) in the thickness direction from the first fiber layer 10.
  • the second fiber layer 20 may be provided and formed by the second fiber 21 (see FIGS. 3 and 4).
  • a resin material is provided on the second fiber layer 20 side of the first fiber layer 10 (upper side in FIG. 1) and on the opposite side of the first fiber layer 10 from the second fiber layer 20 (lower side in FIG. 1).
  • Layer 60 may be formed. This resin material may be contained in 70% by weight or more of the total prepreg.
  • the resin material may be contained in an amount of 80% by weight or more of the entire prepreg, or may be contained in an amount of 85% by weight or more.
  • the upper limit of the ratio of the resin material to the entire prepreg may be, for example, 95% by weight or 90% by weight.
  • the resin layer 60 may be provided on the side of the second fiber layer 20 opposite to the first fiber layer 10 (upper side in FIG. 1).
  • the first fiber layer 10 and the second fiber layer 20 may be separated by a thickness of 1 times or more that of the first fiber layer 10 or may be separated by a thickness of twice or more that of the first fiber layer 10. Alternatively, they may be separated by a thickness of 3 times or more of the first fiber layer 10, may be separated by a thickness of 5 times or more of the first fiber layer 10, or may be separated by 10 times or more of the first fiber layer 10. It may be separated by the thickness of.
  • the distance between the first fiber layer 10 and the second fiber layer 20 may be 50 times or less that of the first fiber layer 10.
  • the first fiber layer 10 may be formed by knitting the first fiber 11 (see FIGS. 3 and 4).
  • the second fiber layer 20 may be formed by knitting the second fiber 21.
  • glass fiber for example, glass fiber, liquid crystal polyester fiber, aromatic polyamide fiber, PBO (polyparaphenylene benzobis oxazole) fiber, PPS (polyphenylene sulfide) fiber, carbon fiber and the like can be used.
  • PBO polyparaphenylene benzobis oxazole
  • PPS polyphenylene sulfide
  • carbon fiber and the like can be used.
  • glass material of the glass fiber T glass, S glass, D glass, E glass, NE glass, C glass, H glass, ARG glass, quartz glass and the like can be used.
  • the resin material on the second fiber layer 20 side of the first fiber layer 10 may be larger than the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10 (see FIG. 1).
  • the resin material on the second fiber layer 20 side of the first fiber layer 10 may be 1.5 times or more, or twice or more, the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10. It may be 2.5 times or more.
  • the resin material on the second fiber layer 20 side of the first fiber layer 10 may be five times or less the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10.
  • the thickness D1 of the resin layer 60 formed by the resin material on the second fiber layer 20 side of the first fiber layer 10 is a resin formed by the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10. It may be larger than the thickness D2 of the layer 60.
  • the thickness D1 of the resin layer 60 formed by the resin material on the second fiber layer 20 side of the first fiber layer 10 is a resin formed by the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10.
  • the thickness D2 of the layer 60 may be 1.5 times or more, 2 times or more, or 2.5 times or more.
  • the thickness D1 of the resin layer 60 on the second fiber layer 20 side of the first fiber layer 10 is 5 times or less the thickness D2 of the resin layer 60 on the side opposite to the second fiber layer 20 of the first fiber layer 10. May be good.
  • the resin material may be in a semi-cured state in the prepreg state, or may be in a semi-cured state when the prepreg is placed on the substrate 200 (see FIG. 7) described later.
  • the semi-cured resin is dipped on both sides of the first fiber layer 10 (see FIG. 8A), and the semi-cured surface of the second fiber layer 20 facing the first fiber layer 10 By immersing the resin (see FIGS. 8B and 8C), a thick resin layer 60 may be formed between the first fiber layer 10 and the second fiber layer 20.
  • the resin material for example, an epoxy resin may be used.
  • the resin material is not limited to this, and examples of the resin material include unsaturated polyester resin, vinyl ester resin, bismaleimide resin, benzoxazine resin, triazine resin, phenol resin, urea resin, melamine resin, polyimide resin, polyolefin resin, and aliphatic.
  • Polyamitone resin, semi-aromatic polyamide resin, aromatic polyester resin, polycarbonate resin, polystyrene resin and the like may be used.
  • the fibers constituting the fiber layer are impregnated with the resin material and impregnated with the fibers, and the resin layer 60 may be formed on the surface of the fiber layer by the resin material provided on the surface of the fibers.
  • first resin layer 61 made of the first resin material provided on both sides of the first fiber layer 10 and the second resin layer 62 made of the second resin material provided on the second fiber layer 20 are made of the same resin material.
  • the present invention is not limited to this, and may be made of different resin materials (see FIG. 2).
  • the conductivity of the second resin material may be lower than that of the first resin material.
  • the second fiber layer 20 may be more plastic than the first fiber layer 10.
  • the mesh of the second fiber layer 20 may be larger than the mesh of the first fiber layer 10.
  • the fibers of the second fiber layer 20 may be thinner than the fibers of the first fiber layer 10.
  • the fibers used in the first fiber layer 10 and the second fiber layer 20 may be made of different fiber materials.
  • a material having higher plasticity than the fiber material used in the first fiber layer 10 may be used.
  • the fiber used in the first fiber layer 10 and the second fiber layer 20 may be composed of the same fiber material without being limited to such an embodiment.
  • the substrate 200 may have an insulating layer 210 and an internal metal layer 250 provided on the insulating layer 210, for example, having a pattern.
  • the prepreg 100 may be provided on such an internal metal layer 250.
  • the prepreg 100 may be provided with an external metal layer 400 such as a copper foil.
  • An external metal layer 400 such as a copper foil may be integrated with the prepreg 100 in advance.
  • patterned internal metal layers 250 may be provided on both sides of the insulating layer 210.
  • prepregs 100 may be provided on both sides of the insulating layer 210, and external metal layers 400 may be provided on both prepregs 100. These prepregs 100 may also be preliminarily integrated with the outer metal layer 400.
  • a redox layer (oxide layer) 500 may be provided on the surface of the outer metal layer 400 and / or the inner metal layer 250 (see FIGS. 16 and 17).
  • the redox layer (oxide layer) 500 may be provided on one surface of the metal layers 250 and 400, the other surface of the metal layers 250 and 400, or both surfaces of the metal layers 250 and 400.
  • the redox layer may be made of cuprous oxide (Cu 2 O), cupric oxide (Cu O) or a combination thereof.
  • a plurality of substrates 200 may be laminated and an outer metal layer 400 may be provided on the outermost surface.
  • the insulating layer 210 may be in a semi-cured state, and the internal metal layer 250 or the like may be pushed into the insulating layer 210.
  • a resin material is provided on both sides of the first fiber layer 10 to form the resin layer 60 (see FIG. 8A).
  • a resin material is provided on one side of the second fiber layer 20 (upper surface in FIG. 8B) to form the resin layer 60 (see FIG. 8B).
  • the present invention is not limited to this, and the resin layer 60 may be formed by providing resin materials on both sides of the second fiber layer 20.
  • the resin layer 60 provided on one side surface of the second fiber layer 20 is positioned on the other side by inverting the second fiber layer 20, and is provided on one surface of the resin layer 60 and the first fiber layer 10.
  • the resin layer 60 is brought into contact with the resin layer 60.
  • the resin layer 60 provided on one side of the first fiber layer 10 and the resin layer 60 located on the other side of the second fiber layer 20 are bonded to each other, which is shown in FIG. A prepreg like this is generated.
  • the resin material is contained in an amount of 70% by weight or more of the prepreg 100, it becomes easy to fill the recesses between the metal layers 250 made of, for example, copper or the like with the resin.
  • the depth of the recess is deep (for example, when it is 70 ⁇ m or more)
  • the fiber layer may interfere and the resin may not be filled in the recess.
  • the content of the prepreg 100 is increased as in this embodiment, it becomes easy to fill the deep recesses with the resin.
  • the metal layer 250 is copper and its thickness is 70 ⁇ m or more, it is called “thick copper”.
  • the second fiber The resin content can be increased on the layer 20 side. Therefore, by positioning the second fiber layer 20 side on the metal layer 250 side, for example, the recesses between the metal layers 250 described above can be easily filled with the resin.
  • the second fiber layer 20 side is positioned on the metal layer 250 side because of the effect of the thickening, for example, between the metal layers 250 described above. It becomes easier to fill the recesses of the resin with resin.
  • the second fiber layer 20 side is positioned on the metal layer 250 side, for example, of the metal layer 250 described above. It can be easily pushed into the recess between them. As a result, it becomes easy to fill the recess with the prepreg 100. From the viewpoint of pushing the prepreg 100 into the recess in this way, it is preferable that the resin of the prepreg 100 is in a semi-cured state.
  • the plasticity of the second fiber layer 20 is made higher than that of the first fiber layer 10 only by adjusting the mesh. be able to.
  • the resin can be removed through the mesh of the second fiber layer 20 by locating the second fiber layer 20 side, for example, on the large recess side formed on the surface of the substrate 200. It can be easily flowed into the above-mentioned recess. Therefore, it becomes easier to fill the recess with the prepreg 100.
  • the plasticity of the second fiber layer 20 can be improved by simply adjusting the thickness of the fibers used. Can be higher than.
  • the third fiber layer is provided on the opposite side of the first fiber layer 10 from the second fiber layer 20 and separated from the first fiber layer 10 in the thickness direction. 30 is provided.
  • Other configurations are the same as those in the first embodiment, and any aspect described in the first embodiment can be adopted.
  • the members described in the first embodiment will be described using the same reference numerals.
  • the resin content can be increased on both sides of the first fiber layer 10. Therefore, even when the patterned internal metal layer 250 is provided so as to sandwich both sides of the prepreg 100 as shown in FIG. 7, the resin is reliably positioned in the recess formed by the internal metal layer 250. be able to. As described above, especially when the depth of the recess is 70 ⁇ m or more, there is a large difference in effect between the case of using the prepreg 100 as in the present embodiment and the case of using the conventional prepreg 100.
  • the amount of resin material provided on both sides of the first fiber layer 10 may be substantially the same. “Approximately the same” means that the difference between the two is within 5% by weight of the larger amount.
  • the content of the one-side resin material provided on one surface side of the first fiber layer 10 was defined as W1, and the content of the other-side resin material provided on the other surface side of the second fiber layer 20 was defined as W2. In this case, it means that when W1 ⁇ W2, W1-W2 ⁇ W1 ⁇ 0.05, and when W2> W1, W2-W1 ⁇ W2 ⁇ 0.05.
  • the thickness D1 of the resin layer 60 on the second fiber layer 20 side of the first fiber layer 10 may be substantially the same as the thickness D2 of the resin layer 60 on the third fiber layer 30 side of the first fiber layer 10.
  • the present invention is not limited to this, and may be made of different resin materials (see FIG. 10).
  • the conductivity of the third resin material may be lower than that of the first resin material.
  • the second resin layer 62 provided in the second fiber layer 20 and the third resin layer 63 provided in the third fiber layer 30 may be made of the same resin material, but the present invention is not limited to this, and the third resin layer 63 is different. It may be made of a resin material (see FIG. 10).
  • the third fiber layer 30 may be more plastic than the first fiber layer 10, and both the second fiber layer 20 and the third fiber layer 30 may be more plastic than the first fiber layer 10.
  • the mesh of the third fiber layer 30 may be larger than the mesh of the first fiber layer 10 (see FIGS. 11A and 11B). Further, the third fiber 31 constituting the third fiber layer 30 may be thinner than the first fiber 11 constituting the first fiber layer 10 (see FIGS. 11A and 11C).
  • the second fiber layer 20 and the third fiber layer 30 may have the same degree of plasticity. However, the present invention is not limited to this, and the plasticity of the third fiber layer 30 may be lower than the plasticity of the second fiber layer 20.
  • the mesh of the third fiber layer 30 may be larger than the mesh of the first fiber layer 10 and smaller than the mesh of the second fiber layer 20.
  • the third fiber 31 of the third fiber layer 30 may be thinner than the first fiber 11 of the first fiber layer 10 and may be thicker than the second fiber 21 of the second fiber layer 20. These may be combined, and the third fiber 31 of the third fiber layer 30 is thinner than the first fiber 11 of the first fiber layer 10, and the mesh of the third fiber layer 30 is smaller than the mesh of the first fiber layer 10. May also grow. Further, even if the third fiber 31 of the third fiber layer 30 is thicker than the second fiber 21 of the second fiber layer 20, and the mesh of the third fiber layer 30 is smaller than the mesh of the second fiber layer 20. Good.
  • the first fiber layer 10 and the third fiber layer 30 may be separated by a thickness of 1 times or more that of the first fiber layer 10 or may be separated by a thickness of twice or more that of the first fiber layer 10. Alternatively, they may be separated by a thickness of 3 times or more of the first fiber layer 10, may be separated by a thickness of 5 times or more of the first fiber layer 10, or may be separated by 10 times or more of the first fiber layer 10. It may be separated by the thickness of.
  • the distance between the first fiber layer 10 and the third fiber layer 30 may be 50 times or less that of the first fiber layer 10.
  • a resin material is provided on both sides of the first fiber layer 10 to form the resin layer 60 (see FIG. 12A).
  • a resin material is provided on one side of the second fiber layer 20 (upper surface in FIG. 12B) to form the resin layer 60 (see FIG. 12B).
  • the present invention is not limited to this, and the resin layer 60 may be formed by providing resin materials on both sides of the second fiber layer 20.
  • a resin material is provided on one side of the third fiber layer 30 (upper surface in FIG. 12 (c)) to form the resin layer 60 (see FIG. 12 (c)).
  • the present invention is not limited to this, and the resin layer 60 may be formed by providing resin materials on both sides of the second fiber layer 20.
  • the resin layer 60 provided on one side surface of the second fiber layer 20 is positioned on the other side (lower side in FIG. 12) by inverting the second fiber layer 20, and the resin layer 60 and the first fiber layer 10
  • the resin layer 60 provided on one side (upper side in FIG. 12) is brought into contact with the resin layer 60.
  • the resin layer 60 provided on one side (upper side in FIG. 12) of the third fiber layer 30 is provided on the other side (lower side in FIG. 12) of the first fiber layer 10. Abut on 60.
  • the resin layer 60 provided on one surface of the first fiber layer 10 and the resin layer 60 located on the other side of the second fiber layer 20 are bonded to each other, and the other side of the first fiber layer 10 is bonded.
  • the resin layer 60 provided on the surface of the third fiber layer 30 and the resin layer 60 located on one side of the third fiber layer 30 are combined to generate a prepreg as shown in FIG.
  • the nth fiber layer 10, the second fiber layer 20, and the third fiber layer 30 are provided apart from each other in the thickness direction.
  • a fiber layer (“n” is an integer of 4 or more) may be provided (see FIG. 13).
  • the first fiber layer 10, the second fiber layer 20, the third fiber layer 30, and the fourth fiber layer which are separated from each other in the thickness direction may be provided, or the first fiber layer which is separated from each other in the thickness direction. 10.
  • the second fiber layer 20, the third fiber layer 30, the fourth fiber layer 40, the fifth fiber layer 50, the sixth fiber layer, and the seventh fiber layer may be provided.
  • the resin layer 60 on the outer surface side may be thicker than any one of the resin layers 60 located on the inner surface side of the resin layer 60 on the outer surface side. More specifically, even if the resin layer 60 on the outer surface side is thicker than any one or all of the resin layers 60 provided between the resin layer 60 on the outer surface side and the first fiber layer 10. Good.
  • the amount of resin can be increased on the outer surface side, and for example, the recesses of the substrate 200 can be easily filled with the prepreg 100. Further, the thickness of the resin layer 60 may be increased toward the outer surface side.
  • the fiber layer on the outer surface side may be more plastic than the fiber layer located on the inner surface side of the fiber layer on the outer surface side. That is, the m-th fiber layer (“m” is an integer of 4 or more and n or less) may be more plastic than the fiber layer located on the inner surface side of the m-th fiber layer. More specifically, the m-th fiber layer is more plastic than the first fiber layer 10 and any one or all of the fiber layers provided between the m-th fiber layer and the first fiber layer 10. You may become. When such an aspect is adopted, the plasticity can be enhanced on the outer surface side, and for example, the recesses of the substrate 200 can be easily filled with the prepreg 100. Further, the plasticity of the fiber layer may be increased toward the outer surface side.
  • the present embodiment provides a technical idea of using different prepregs 100 depending on the arrangement position of the prepregs 100 in a laminated plate such as a copper-clad laminate.
  • a laminated plate such as a copper-clad laminate.
  • any aspect described in the first embodiment and the second embodiment can be adopted.
  • the members described in the first embodiment or the second embodiment will be described with reference to the same reference numerals.
  • the amount of resin on one side of the first fiber layer 10 described in the first embodiment is the other.
  • the amount of resin is increased on both sides of the first fiber layer 10 as in the second embodiment. (See FIG. 14).
  • the laminated board is a plurality of substrates 200 having an insulating layer 210 and a patterned internal metal layer 250 provided on both sides of the insulating layer 210, and an internal prepreg provided between the substrates 200. It may have 100b and an external prepreg 100a provided only on one side or the other side of the substrate 200.
  • the inner prepreg 100b includes an inner first fiber layer 10b, an inner second fiber layer 20b provided apart from the inner first fiber layer 10b, and an inner first fiber layer. It has an inner third fiber layer 30b provided on the opposite side of the inner second fiber layer 20b with respect to 10b, and is between the inner first fiber layer 10b and the inner second fiber layer 20b and the inner first fiber layer.
  • An internal resin layer 60b may be provided between the 10b and the internal third fiber layer 30b.
  • the internal resin material constituting the internal resin layer 60b may be contained in an amount of 70% by weight or more, 80% by weight or more, or 85% by weight or more of the internal prepreg 100b.
  • the internal resin material constituting the internal resin layer 60b may be, for example, 95% by weight or less of the internal prepreg 100b, or 90% by weight or less.
  • the outer prepreg 100a has an outer first fiber layer 10a and an outer second fiber layer 20a provided apart from the outer first fiber layer 10a, and has an outer first fiber layer 20a.
  • the outer resin layer 60a may be provided between the one fiber layer 10a and the outer second fiber layer 20a and on the side of the outer first fiber layer 10a opposite to the outer second fiber layer 20a.
  • the external resin material constituting the external resin layer 60a may be contained in an amount of 70% by weight or more, 80% by weight or more, or 85% by weight or more of the external prepreg 100a.
  • the external resin material constituting the external resin layer 60a may be, for example, 95% by weight or less of the external prepreg 100a, or 90% by weight or less.
  • An electronic device is provided by mounting electronic components such as a semiconductor element, a capacitor, and a resistor on the laminated plate in the above-described embodiment and enclosing the electronic components with a sealing resin.
  • electronic devices may be incorporated into any mounting device such as automobiles, airplanes, ships, helicopters, personal computers, home appliances and the like.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

A prepreg 100 has a first fiber layer 10 and a second fiber layer 20 that is disposed so as to be separated from the first fiber layer 10. A resin material is disposed: on the second fiber layer 20-side of the first fiber layer 10; and on the side opposite the second fiber layer 20-side of the first fiber layer 10. The resin material content is at least 70 wt% of the prepreg 100.

Description

プリプレグ、積層板、電子装置及び実装装置Prepregs, laminates, electronic devices and mounting devices
　本発明は、繊維層と樹脂材料を有するプリプレグと、このようなプリプレグを有する積層板、電子装置及び実装装置に関する。 The present invention relates to a prepreg having a fiber layer and a resin material, and a laminated board having such a prepreg, an electronic device, and a mounting device.
　従来から、繊維層と、繊維層に設けられる樹脂材料とを有するプリプレグが知られている。一例として、特許文献１では、繊維基材を含有する繊維基材層と、繊維基材層の一方の面に形成された第１の樹脂層と、繊維基材層の他方の面に形成された第２の樹脂層と、を有するプリプレグが開示されている。 Conventionally, a prepreg having a fiber layer and a resin material provided on the fiber layer has been known. As an example, in Patent Document 1, a fiber base material layer containing a fiber base material, a first resin layer formed on one surface of the fiber base material layer, and a first resin layer formed on one surface of the fiber base material layer are formed on the other surface of the fiber base material layer. A prepreg having a second resin layer and a second resin layer is disclosed.
特開２０１８－１３０９３８号JP-A-2018-130938
　従来のプリプレグでは十分な樹脂量が含有されていないことから、金属層等からなる導体層の間の凹部（パターニングの凹部）内にプリプレグが入り込むことができていないことがある。 Since the conventional prepreg does not contain a sufficient amount of resin, the prepreg may not be able to enter the recesses (patterning recesses) between the conductor layers made of a metal layer or the like.
　本発明は、十分な樹脂量を含有するプリプレグを提供する。 The present invention provides a prepreg containing a sufficient amount of resin.
［概念１］
　本発明によるプリプレグは、
　第一繊維層と、
　前記第一繊維層と離間して設けられた第二繊維層と、
　を備え、
　前記第一繊維層の前記第二繊維層側及び前記第一繊維層の前記第二繊維層とは反対側に樹脂材料が設けられ、
　前記樹脂材料が前記プリプレグの７０重量％以上で含有されてもよい。 [Concept 1]
The prepreg according to the present invention
First fiber layer and
A second fiber layer provided apart from the first fiber layer and
With
A resin material is provided on the second fiber layer side of the first fiber layer and on the side of the first fiber layer opposite to the second fiber layer.
The resin material may be contained in 70% by weight or more of the prepreg.
［概念２］
　本発明の概念１によるプリプレグにおいて、
　前記第一繊維層の前記第二繊維層側における樹脂材料は、前記第一繊維層の前記第二繊維層とは反対側における樹脂材料よりも多くてもよい。 [Concept 2]
In the prepreg according to the concept 1 of the present invention,
The amount of the resin material on the side of the first fiber layer on the second fiber layer side may be larger than that of the resin material on the side of the first fiber layer opposite to the second fiber layer.
［概念３］
　本発明の概念１又は２のいずれかによるプリプレグにおいて、
　前記第一繊維層の前記第二繊維層側における樹脂材料によって形成される樹脂層の厚みは、前記第一繊維層の前記第二繊維層とは反対側における樹脂材料によって形成される樹脂層の厚みよりも大きくてもよい。 [Concept 3]
In a prepreg according to either concept 1 or 2 of the present invention.
The thickness of the resin layer formed by the resin material on the second fiber layer side of the first fiber layer is the thickness of the resin layer formed by the resin material on the side opposite to the second fiber layer of the first fiber layer. It may be larger than the thickness.
［概念４］
　本発明の概念１乃至３のいずれか１つによるプリプレグにおいて、
　前記第二繊維層は前記第一繊維層よりも可塑性が高くてもよい。 [Concept 4]
In a prepreg according to any one of the concepts 1 to 3 of the present invention.
The second fiber layer may be more plastic than the first fiber layer.
［概念５］
　本発明の概念１乃至４のいずれか１つによるプリプレグにおいて、
　前記第二繊維層の網目は前記第一繊維層の網目よりも大きくてもよい。 [Concept 5]
In a prepreg according to any one of the concepts 1 to 4 of the present invention.
The mesh of the second fiber layer may be larger than the network of the first fiber layer.
［概念６］
　本発明の概念１乃至５のいずれか１つによるプリプレグにおいて、
　前記第二繊維層の繊維は前記第一繊維層の繊維よりも細くてもよい。 [Concept 6]
In a prepreg according to any one of the concepts 1 to 5 of the present invention.
The fibers of the second fiber layer may be finer than the fibers of the first fiber layer.
［概念７］
　本発明の概念１乃至６のいずれか１つによるプリプレグにおいて、
　前記第一繊維層に対して前記第二繊維層と反対側に、前記第一繊維層と離間して設けられた第三繊維層を備えてもよい。 [Concept 7]
In a prepreg according to any one of the concepts 1 to 6 of the present invention.
A third fiber layer provided apart from the first fiber layer may be provided on the side opposite to the second fiber layer with respect to the first fiber layer.
［概念８］
　本発明の概念７によるプリプレグにおいて、
　前記第三繊維層は前記第一繊維層よりは可塑性が高くてもよい。 [Concept 8]
In the prepreg according to the concept 7 of the present invention,
The third fiber layer may be more plastic than the first fiber layer.
［概念９］
　本発明の概念７又は８によるプリプレグにおいて、
　前記第一繊維層、前記第二繊維層及び前記第三繊維層と厚み方向で離間して設けられた第ｎ繊維層（「ｎ」は４以上の整数である。）が設けられ、
　樹脂層のいずれか一つは、当該樹脂層よりも内面側に位置する樹脂層のいずれか一つよりも厚くなるようになってもよい。 [Concept 9]
In the prepreg according to the concept 7 or 8 of the present invention
An nth fiber layer (“n” is an integer of 4 or more) provided apart from the first fiber layer, the second fiber layer, and the third fiber layer in the thickness direction is provided.
Any one of the resin layers may be thicker than any one of the resin layers located on the inner surface side of the resin layer.
［概念１０］
　本発明の概念７乃至９のいずれか１つによるプリプレグにおいて、
　前記第一繊維層、前記第二繊維層及び前記第三繊維層と厚み方向で離間して設けられた第ｎ繊維層（「ｎ」は４以上の整数である。）が設けられ、
　第ｍ繊維層（「ｍ」は４以上かつｎ以下の整数である。）は、当該第ｍ繊維層よりも内面側に位置する繊維層よりも可塑性が高くてもよい。 [Concept 10]
In a prepreg according to any one of the concepts 7 to 9 of the present invention.
An nth fiber layer (“n” is an integer of 4 or more) provided apart from the first fiber layer, the second fiber layer, and the third fiber layer in the thickness direction is provided.
The m-th fiber layer (“m” is an integer of 4 or more and n or less) may be more plastic than the fiber layer located on the inner surface side of the m-th fiber layer.
［概念１１］
　本発明の概念１乃至１０のいずれか１つによるプリプレグにおいて、
　前記第一繊維層に設けられた樹脂層を形成する樹脂材料と、前記第二繊維層に設けられた樹脂層を形成する樹脂材料とは異なってもよい。 [Concept 11]
In a prepreg according to any one of the concepts 1 to 10 of the present invention.
The resin material that forms the resin layer provided on the first fiber layer may be different from the resin material that forms the resin layer provided on the second fiber layer.
［概念１２］
　本発明による積層板は、
　絶縁層と、前記絶縁層に設けられたパターン状の金属層とを有する基板と、
　前記金属層に設けられた請求項１乃至１１のいずれか１項に記載のプリプレグと、
　を備え、
　前記金属層によって形成される凹部が７０μｍ以上の深みを有してもよい。 [Concept 12]
The laminated board according to the present invention
A substrate having an insulating layer and a patterned metal layer provided on the insulating layer,
The prepreg according to any one of claims 1 to 11 provided on the metal layer.
With
The recess formed by the metal layer may have a depth of 70 μm or more.
［概念１３］
　本発明による積層板は、
　絶縁層と、前記絶縁層の両面に設けられたパターン状の金属層とを有する複数の基板と、
　前記基板の間に設けられる内部側プリプレグと、
　前記基板の一方側又は他方側にだけ設けられる外部側プリプレグと、
　を備え、
　前記内部側プリプレグは、内部第一繊維層と、前記内部第一繊維層に離間して設けられた内部第二繊維層と、前記内部第一繊維層に対して前記内部第二繊維層と反対側に設けられた内部第三繊維層とを有し、前記内部第一繊維層と前記内部第二繊維層との間及び前記内部第一繊維層と前記内部第三繊維層との間に内部樹脂層が設けられ、当該内部樹脂層を構成する内部樹脂材料が前記内部側プリプレグの７０重量％以上で含有され、
　前記外部側プリプレグは、外部第一繊維層と、前記外部第一繊維層に離間して設けられた外部第二繊維層とを有し、前記外部第一繊維層と前記外部第二繊維層との間及び前記外部第一繊維層の前記外部第二繊維層とは反対側に外部樹脂層が設けられ、当該外部樹脂層を構成する外部樹脂材料が前記外部側プリプレグの７０重量％以上で含有されてもよい。 [Concept 13]
The laminated board according to the present invention
A plurality of substrates having an insulating layer and a patterned metal layer provided on both sides of the insulating layer, and a plurality of substrates.
An internal prepreg provided between the substrates and
An external prepreg provided only on one side or the other side of the substrate,
With
The inner prepreg is opposite to the inner first fiber layer, the inner second fiber layer provided apart from the inner first fiber layer, and the inner first fiber layer. It has an inner third fiber layer provided on the side, and is inside between the inner first fiber layer and the inner second fiber layer and between the inner first fiber layer and the inner third fiber layer. A resin layer is provided, and the internal resin material constituting the internal resin layer is contained in 70% by weight or more of the internal prepreg.
The outer prepreg has an outer first fiber layer and an outer second fiber layer provided apart from the outer first fiber layer, and the outer first fiber layer and the outer second fiber layer An outer resin layer is provided between the spaces and on the side of the outer first fiber layer opposite to the outer second fiber layer, and the outer resin material constituting the outer resin layer is contained in 70% by weight or more of the outer side prepreg. May be done.
［概念１４］
　本発明による電子装置は、
　概念１２又は１３に記載の積層板を備えてもよい。 [Concept 14]
The electronic device according to the present invention
The laminated board according to the concept 12 or 13 may be provided.
［概念１５］
　本発明による実装装置は、
　概念１４に記載の電子装置を備えてもよい。 [Concept 15]
The mounting device according to the present invention is
The electronic device according to the concept 14 may be provided.
　本発明において第一繊維層と離間して第二繊維層を設ける態様を採用した場合には、第一繊維層と第二繊維層との間でより多くの樹脂を設けることができる。その結果として、樹脂材料がプリプレグの７０重量％以上で含有させることも可能となり、例えば金属層の間の凹部内に樹脂を充填させやすくなる。 When the embodiment in which the second fiber layer is provided apart from the first fiber layer is adopted in the present invention, more resin can be provided between the first fiber layer and the second fiber layer. As a result, the resin material can be contained in an amount of 70% by weight or more of the prepreg, and for example, the recesses between the metal layers can be easily filled with the resin.
図１は、本発明の第１の実施の形態の一例によるプリプレグの側方断面図である。FIG. 1 is a side sectional view of a prepreg according to an example of the first embodiment of the present invention. 図２は、本発明の第１の実施の形態の別の例によるプリプレグの側方断面図である。FIG. 2 is a side sectional view of a prepreg according to another example of the first embodiment of the present invention. 図３（ａ）は本発明の第１の実施の形態で用いられうる第一繊維層の一例を示した平面図であり、図３（ｂ）は本発明の第１の実施の形態で用いられうる第二繊維層の一例を示した平面図である。FIG. 3A is a plan view showing an example of a first fiber layer that can be used in the first embodiment of the present invention, and FIG. 3B is used in the first embodiment of the present invention. It is a top view which showed an example of the possible 2nd fiber layer. 図４（ａ）は本発明の第１の実施の形態で用いられうる第一繊維層の一例を示した平面図であり、図４（ｂ）は本発明の第１の実施の形態で用いられうる第二繊維層の別の例を示した平面図である。FIG. 4A is a plan view showing an example of a first fiber layer that can be used in the first embodiment of the present invention, and FIG. 4B is used in the first embodiment of the present invention. FIG. 5 is a plan view showing another example of a possible second fiber layer. 図５は、本発明の第１の実施の形態で用いられうる基板、プリプレグ及び外部金属層の一例を示した側方断面図である。FIG. 5 is a side sectional view showing an example of a substrate, a prepreg, and an external metal layer that can be used in the first embodiment of the present invention. 図６は、本発明の第１の実施の形態で用いられうる基板、プリプレグ及び外部金属層の別の例を示した側方断面図である。FIG. 6 is a side sectional view showing another example of the substrate, prepreg and external metal layer that can be used in the first embodiment of the present invention. 図７は、本発明の第１の実施の形態で用いられうる基板、プリプレグ及び外部金属層のさらに別の例を示した側方断面図である。FIG. 7 is a side sectional view showing still another example of the substrate, prepreg and external metal layer that can be used in the first embodiment of the present invention. 図８は本発明の第１の実施の形態によるプリプレグの製造工程の一例を示した側方断面図であり、図８（ａ）は第一繊維層の両面に樹脂層が設けられた態様を示した側方断面図であり、図８（ｂ）は第二繊維層の一方側の面に樹脂層が設けられた態様を示した側方断面図であり、図８（ｃ）は第二繊維層に設けられた樹脂層を反転させ、第一繊維層の一方側の樹脂層に当接させる態様を示した側方断面図である。FIG. 8 is a side sectional view showing an example of a prepreg manufacturing process according to the first embodiment of the present invention, and FIG. 8A shows an embodiment in which resin layers are provided on both sides of the first fiber layer. FIG. 8 (b) is a side sectional view shown, FIG. 8 (b) is a lateral sectional view showing an aspect in which a resin layer is provided on one surface of the second fiber layer, and FIG. 8 (c) is a second. It is a side sectional view which showed the aspect which inverted the resin layer provided in the fiber layer and brought it into contact with the resin layer on one side of the first fiber layer. 図９は、本発明の第２の実施の形態の一例によるプリプレグの側方断面図である。FIG. 9 is a side sectional view of the prepreg according to an example of the second embodiment of the present invention. 図１０は、本発明の第２の実施の形態の別の例によるプリプレグの側方断面図である。FIG. 10 is a side sectional view of a prepreg according to another example of the second embodiment of the present invention. 図１１（ａ）は本発明の第２の実施の形態で用いられうる第一繊維層の一例を示した平面図であり、図１１（ｂ）は本発明の第２の実施の形態で用いられうる第三繊維層の一例を示した平面図であり、図１１（ｃ）は本発明の第３の実施の形態で用いられうる第三繊維層の別の例を示した平面図である。FIG. 11 (a) is a plan view showing an example of the first fiber layer that can be used in the second embodiment of the present invention, and FIG. 11 (b) is used in the second embodiment of the present invention. FIG. 11 (c) is a plan view showing an example of a possible third fiber layer, and FIG. 11 (c) is a plan view showing another example of the third fiber layer that can be used in the third embodiment of the present invention. .. 図１２は本発明の第２の実施の形態によるプリプレグの製造工程の一例を示した側方断面図であり、図１２（ａ）は第一繊維層の両面に樹脂層が設けられた態様を示した側方断面図であり、図１２（ｂ）は第二繊維層の一方側の面に樹脂層が設けられた態様を示した側方断面図であり、図１２（ｃ）は第三繊維層の一方側の面に樹脂層が設けられた態様を示した側方断面図であり、図１２（ｄ）は第二繊維層に設けられた樹脂層を反転させて第一繊維層の一方側の樹脂層に当接させ、第三繊維層に設けられた樹脂層を第一繊維層の他方側の樹脂層に当接させる態様を示した側方断面図である。FIG. 12 is a side sectional view showing an example of a prepreg manufacturing process according to the second embodiment of the present invention, and FIG. 12A shows an embodiment in which resin layers are provided on both sides of the first fiber layer. FIG. 12 (b) is a side sectional view shown, FIG. 12 (b) is a lateral sectional view showing an aspect in which a resin layer is provided on one surface of the second fiber layer, and FIG. 12 (c) is a third. FIG. 12 (d) is a side sectional view showing a mode in which a resin layer is provided on one surface of the fiber layer, and FIG. 12 (d) shows the first fiber layer by inverting the resin layer provided on the second fiber layer. It is a side sectional view which showed the aspect which brought into contact with the resin layer on one side, and brought into contact with the resin layer on the other side of the 1st fiber layer. 図１３は、本発明の第１の実施の形態及び第２の実施の形態の変形例を示した側方断面図である。FIG. 13 is a side sectional view showing a modified example of the first embodiment and the second embodiment of the present invention. 図１４は、本発明の第３の実施の形態で用いられうる基板、プリプレグ及び外部金属層の一例を示した側方断面図である。FIG. 14 is a side sectional view showing an example of a substrate, a prepreg, and an external metal layer that can be used in the third embodiment of the present invention. 図１５（ａ）は本発明の第３の実施の形態で用いられうる外部側プリプレグを示した側方断面図であり、図１５（ｂ）は本発明の第３の実施の形態で用いられうる内部側プリプレグを示した側方断面図である。FIG. 15 (a) is a side sectional view showing an external prepreg that can be used in the third embodiment of the present invention, and FIG. 15 (b) is used in the third embodiment of the present invention. It is a side sectional view which showed the inner side prepreg. 図１６は、本発明の実施の形態において酸化還元層が金属層に設けられた態様を示した側方断面図である。FIG. 16 is a side sectional view showing an embodiment in which the redox layer is provided on the metal layer in the embodiment of the present invention. 図１７は、本発明の実施の形態において酸化還元層が金属層に設けられた別の態様を示した側方断面図である。FIG. 17 is a side sectional view showing another aspect in which the redox layer is provided on the metal layer in the embodiment of the present invention.
第１の実施の形態
《構成》
　図１に示すように、本実施の形態のプリプレグ１００は、第一繊維１１（図３及び図４参照）によって形成される第一繊維層１０と、第一繊維層１０と厚み方向で離間して設けられ、第二繊維２１（図３及び図４参照）によって形成される第二繊維層２０と、を有してもよい。第一繊維層１０の第二繊維層２０側（図１の上方側）及び第一繊維層１０の第二繊維層２０とは反対側（図１の下方側）に樹脂材料が設けられて樹脂層６０が形成されてもよい。この樹脂材料はプリプレグ全体の７０重量％以上で含有されてもよい。樹脂材料はプリプレグ全体の８０重量％以上で含有されてもよいし、８５重量％以上で含有されてもよい。樹脂材料のプリプレグ全体に占める割合の上限値としては例えば９５重量％であってもよいし、９０重量％であってもよい。図１に示す態様とは異なり、第二繊維層２０の第一繊維層１０とは反対側（図１の上方側）に樹脂層６０が設けられてもよい。 First Embodiment << Configuration >>
As shown in FIG. 1, the prepreg 100 of the present embodiment is separated from the first fiber layer 10 formed by the first fiber 11 (see FIGS. 3 and 4) in the thickness direction from the first fiber layer 10. The second fiber layer 20 may be provided and formed by the second fiber 21 (see FIGS. 3 and 4). A resin material is provided on the second fiber layer 20 side of the first fiber layer 10 (upper side in FIG. 1) and on the opposite side of the first fiber layer 10 from the second fiber layer 20 (lower side in FIG. 1). Layer 60 may be formed. This resin material may be contained in 70% by weight or more of the total prepreg. The resin material may be contained in an amount of 80% by weight or more of the entire prepreg, or may be contained in an amount of 85% by weight or more. The upper limit of the ratio of the resin material to the entire prepreg may be, for example, 95% by weight or 90% by weight. Unlike the embodiment shown in FIG. 1, the resin layer 60 may be provided on the side of the second fiber layer 20 opposite to the first fiber layer 10 (upper side in FIG. 1).
　第一繊維層１０と第二繊維層２０との間は第一繊維層１０の１倍以上の厚みで離間してもよいし、第一繊維層１０の２倍以上の厚みで離間してもよいし、第一繊維層１０の３倍以上の厚みで離間してもよいし、第一繊維層１０の５倍以上の厚みで離間してもよいし、第一繊維層１０の１０倍以上の厚みで離間してもよい。第一繊維層１０と第二繊維層２０との間は第一繊維層１０の５０倍以下となってもよい。 The first fiber layer 10 and the second fiber layer 20 may be separated by a thickness of 1 times or more that of the first fiber layer 10 or may be separated by a thickness of twice or more that of the first fiber layer 10. Alternatively, they may be separated by a thickness of 3 times or more of the first fiber layer 10, may be separated by a thickness of 5 times or more of the first fiber layer 10, or may be separated by 10 times or more of the first fiber layer 10. It may be separated by the thickness of. The distance between the first fiber layer 10 and the second fiber layer 20 may be 50 times or less that of the first fiber layer 10.
　第一繊維層１０は第一繊維１１を編み込むことで形成されてもよい（図３及び図４参照）。同様に、第二繊維層２０は第二繊維２１を編み込むことで形成されてもよい。 The first fiber layer 10 may be formed by knitting the first fiber 11 (see FIGS. 3 and 4). Similarly, the second fiber layer 20 may be formed by knitting the second fiber 21.
　繊維としては、例えば、ガラス繊維、液晶ポリエステル繊維、芳香族ポリアミド繊維、ＰＢＯ（ポリパラフェニレン・ベンゾビス・オキサゾール）繊維、ＰＰＳ（ポリフェニレンサルファイド）繊維、カーボン繊維等を用いることができる。ガラス繊維のガラス材料としては、Ｔガラス、Ｓガラス、Ｄガラス、Ｅガラス、ＮＥガラス、Ｃガラス、Ｈガラス、ＡＲＧガラス、石英ガラス等を用いることができる。 As the fiber, for example, glass fiber, liquid crystal polyester fiber, aromatic polyamide fiber, PBO (polyparaphenylene benzobis oxazole) fiber, PPS (polyphenylene sulfide) fiber, carbon fiber and the like can be used. As the glass material of the glass fiber, T glass, S glass, D glass, E glass, NE glass, C glass, H glass, ARG glass, quartz glass and the like can be used.
　第一繊維層１０の第二繊維層２０側における樹脂材料は第一繊維層１０の第二繊維層２０とは反対側における樹脂材料よりも多くなってもよい（図１参照）。第一繊維層１０の第二繊維層２０側における樹脂材料は第一繊維層１０の第二繊維層２０とは反対側における樹脂材料の１．５倍以上であってもよいし、２倍以上であってもよいし、２．５倍以上であってもよい。第一繊維層１０の第二繊維層２０側における樹脂材料は第一繊維層１０の第二繊維層２０とは反対側における樹脂材料の５倍以下であってもよい。 The resin material on the second fiber layer 20 side of the first fiber layer 10 may be larger than the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10 (see FIG. 1). The resin material on the second fiber layer 20 side of the first fiber layer 10 may be 1.5 times or more, or twice or more, the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10. It may be 2.5 times or more. The resin material on the second fiber layer 20 side of the first fiber layer 10 may be five times or less the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10.
　第一繊維層１０の第二繊維層２０側における樹脂材料によって形成される樹脂層６０の厚みＤ１は、第一繊維層１０の第二繊維層２０とは反対側における樹脂材料によって形成される樹脂層６０の厚みＤ２よりも大きくなってもよい。第一繊維層１０の第二繊維層２０側における樹脂材料によって形成される樹脂層６０の厚みＤ１は、第一繊維層１０の第二繊維層２０とは反対側における樹脂材料によって形成される樹脂層６０の厚みＤ２の１．５倍以上であってもよいし、２倍以上であってもよいし、２．５倍以上であってもよい。第一繊維層１０の第二繊維層２０側における樹脂層６０の厚みＤ１は、第一繊維層１０の第二繊維層２０とは反対側における樹脂層６０の厚みＤ２の５倍以下であってもよい。 The thickness D1 of the resin layer 60 formed by the resin material on the second fiber layer 20 side of the first fiber layer 10 is a resin formed by the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10. It may be larger than the thickness D2 of the layer 60. The thickness D1 of the resin layer 60 formed by the resin material on the second fiber layer 20 side of the first fiber layer 10 is a resin formed by the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10. The thickness D2 of the layer 60 may be 1.5 times or more, 2 times or more, or 2.5 times or more. The thickness D1 of the resin layer 60 on the second fiber layer 20 side of the first fiber layer 10 is 5 times or less the thickness D2 of the resin layer 60 on the side opposite to the second fiber layer 20 of the first fiber layer 10. May be good.
　プリプレグの状態で樹脂材料は半硬化状態であってもよく、後述する基板２００（図７参照）にプリプレグを載置する際に半硬化状態であってもよい。後述するように、第一繊維層１０の両面に半硬化状態の樹脂が浸けられ（図８（ａ）参照）、第二繊維層２０の第一繊維層１０に対向する面に半硬化状態の樹脂が浸けられることで（図８（ｂ）（ｃ）参照）、第一繊維層１０と第二繊維層２０との間で厚みの厚い樹脂層６０が形成されてもよい。樹脂材料としては例えばエポキシ樹脂を用いてもよい。これに限られることはなく、樹脂材料として、不飽和ポリエステル樹脂、ビニルエステル樹脂、ビスマレイミド樹脂、ベンゾオキサジン樹脂、トリアジン樹脂、フェノール樹脂、尿素樹脂、メラミン樹脂、ポリイミド樹脂、ポリオレフィン系樹脂、脂肪族ポリアミド系樹脂、半芳香族ポリアミド系樹脂、芳香族ポリエステル系樹脂、ポリカーボネート系樹脂、ポリスチレン系樹脂等を用いてもよい。 The resin material may be in a semi-cured state in the prepreg state, or may be in a semi-cured state when the prepreg is placed on the substrate 200 (see FIG. 7) described later. As will be described later, the semi-cured resin is dipped on both sides of the first fiber layer 10 (see FIG. 8A), and the semi-cured surface of the second fiber layer 20 facing the first fiber layer 10 By immersing the resin (see FIGS. 8B and 8C), a thick resin layer 60 may be formed between the first fiber layer 10 and the second fiber layer 20. As the resin material, for example, an epoxy resin may be used. The resin material is not limited to this, and examples of the resin material include unsaturated polyester resin, vinyl ester resin, bismaleimide resin, benzoxazine resin, triazine resin, phenol resin, urea resin, melamine resin, polyimide resin, polyolefin resin, and aliphatic. Polyamitone resin, semi-aromatic polyamide resin, aromatic polyester resin, polycarbonate resin, polystyrene resin and the like may be used.
　なお、繊維層を構成する繊維に対して樹脂材料が含浸され、繊維に含浸される他、繊維の表面に設けられた樹脂材料によって繊維層の表面において樹脂層６０が形成されてもよい。 The fibers constituting the fiber layer are impregnated with the resin material and impregnated with the fibers, and the resin layer 60 may be formed on the surface of the fiber layer by the resin material provided on the surface of the fibers.
　第一繊維層１０の両面に設けられる第一樹脂材料からなる第一樹脂層６１と第二繊維層２０に設けられる第二樹脂材料からなる第二樹脂層６２とは同じ樹脂材料からなってもよいが、これに限られることはなく、異なる樹脂材料からなってもよい（図２参照）。一例として、第二樹脂材料の導電率は第一樹脂材料の導電率と比較して低くなってもよい。このような樹脂を採用することで、基板２００に設けられた銅等からなる金属層といった導体層等に対する樹脂の絶縁性を高く保つことができる。 Even if the first resin layer 61 made of the first resin material provided on both sides of the first fiber layer 10 and the second resin layer 62 made of the second resin material provided on the second fiber layer 20 are made of the same resin material. However, the present invention is not limited to this, and may be made of different resin materials (see FIG. 2). As an example, the conductivity of the second resin material may be lower than that of the first resin material. By adopting such a resin, it is possible to maintain high insulation of the resin with respect to a conductor layer such as a metal layer made of copper or the like provided on the substrate 200.
　第二繊維層２０は第一繊維層１０よりも可塑性が高くなってもよい。第二繊維層２０の可塑性を高くするために、図３に示すように、第二繊維層２０の網目は第一繊維層１０の網目よりも大きくなってもよい。また、図４に示すように、第二繊維層２０の繊維は第一繊維層１０の繊維よりも細くなってもよい。これらを組み合わせてもよく、第二繊維層２０の第二繊維２１は第一繊維層１０の第一繊維１１よりも細くなり、かつ第二繊維層２０の網目は第一繊維層１０の網目よりも大きくなってもよい。 The second fiber layer 20 may be more plastic than the first fiber layer 10. In order to increase the plasticity of the second fiber layer 20, as shown in FIG. 3, the mesh of the second fiber layer 20 may be larger than the mesh of the first fiber layer 10. Further, as shown in FIG. 4, the fibers of the second fiber layer 20 may be thinner than the fibers of the first fiber layer 10. These may be combined, the second fiber 21 of the second fiber layer 20 is thinner than the first fiber 11 of the first fiber layer 10, and the mesh of the second fiber layer 20 is smaller than the mesh of the first fiber layer 10. May also grow.
　また、第一繊維層１０と第二繊維層２０で用いられる繊維は異なる繊維材料からなってもよい。この場合には、第二繊維層２０で用いられる繊維材料としては、第一繊維層１０で用いられる繊維材料と比較して可塑性の高いものを用いてもよい。このような態様に限られることはなく、第一繊維層１０と第二繊維層２０で用いられる繊維は同じ繊維材料から構成されてもよい。 Further, the fibers used in the first fiber layer 10 and the second fiber layer 20 may be made of different fiber materials. In this case, as the fiber material used in the second fiber layer 20, a material having higher plasticity than the fiber material used in the first fiber layer 10 may be used. The fiber used in the first fiber layer 10 and the second fiber layer 20 may be composed of the same fiber material without being limited to such an embodiment.
　図５に示すように、基板２００は、絶縁層２１０と、絶縁層２１０に設けられた例えばパターン状からなる内部金属層２５０とを有いてもよい。プリプレグ１００はこのような内部金属層２５０に設けられてもよい。そして、プリプレグ１００に銅箔等の外部金属層４００が設けられてもよい。なお、プリプレグ１００に銅箔等の外部金属層４００が予め一体化されてもよい。 As shown in FIG. 5, the substrate 200 may have an insulating layer 210 and an internal metal layer 250 provided on the insulating layer 210, for example, having a pattern. The prepreg 100 may be provided on such an internal metal layer 250. Then, the prepreg 100 may be provided with an external metal layer 400 such as a copper foil. An external metal layer 400 such as a copper foil may be integrated with the prepreg 100 in advance.
　図６に示すように、絶縁層２１０の両面にパターン状の内部金属層２５０が設けられてもよい。この場合には、絶縁層２１０の両面にプリプレグ１００が設けられ、両方のプリプレグ１００に外部金属層４００が設けられてもよい。これらプリプレグ１００も外部金属層４００に予め一体化されてもよい。 As shown in FIG. 6, patterned internal metal layers 250 may be provided on both sides of the insulating layer 210. In this case, prepregs 100 may be provided on both sides of the insulating layer 210, and external metal layers 400 may be provided on both prepregs 100. These prepregs 100 may also be preliminarily integrated with the outer metal layer 400.
　外部金属層４００及び／又は内部金属層２５０の表面には酸化還元層（酸化層）５００が設けられてもよい（図１６及び図１７参照）。金属層２５０，４００の一方側の面、金属層２５０，４００の他方側の面、又は金属層２５０，４００の両面に酸化還元層（酸化層）５００が設けられてもよい。金属層２５０，４００が銅からなる場合には、酸化還元層は酸化第一銅（Cu2O）、酸化第二銅（CuO）又はこれらの組み合わせからなってもよい。 A redox layer (oxide layer) 500 may be provided on the surface of the outer metal layer 400 and / or the inner metal layer 250 (see FIGS. 16 and 17). The redox layer (oxide layer) 500 may be provided on one surface of the metal layers 250 and 400, the other surface of the metal layers 250 and 400, or both surfaces of the metal layers 250 and 400. When the metal layers 250 and 400 are made of copper, the redox layer may be made of cuprous oxide (Cu 2 O), cupric oxide (Cu O) or a combination thereof.
　図７に示すように、絶縁層２１０、内部金属層２５０及びプリプレグ１００の各々が複数積層され、プリプレグ１００を挟むようにして、絶縁層２１０の両面にパターン状の内部金属層２５０が設けられた基板２００が設けられてもよい。この場合には、複数の基板２００が積層され、最外面において外部金属層４００が設けられてもよい。絶縁層２１０は半硬化状態となり、内部金属層２５０等が押し込まれる態様となってもよい。 As shown in FIG. 7, a substrate 200 in which a plurality of each of the insulating layer 210, the internal metal layer 250, and the prepreg 100 are laminated, and the patterned internal metal layers 250 are provided on both sides of the insulating layer 210 so as to sandwich the prepreg 100. May be provided. In this case, a plurality of substrates 200 may be laminated and an outer metal layer 400 may be provided on the outermost surface. The insulating layer 210 may be in a semi-cured state, and the internal metal layer 250 or the like may be pushed into the insulating layer 210.
≪製造工程≫
　本実施の形態によるプリプレグの製造工程の一例について図８を用いて説明する。 ≪Manufacturing process≫
An example of the manufacturing process of the prepreg according to the present embodiment will be described with reference to FIG.
　第一繊維層１０の両面に樹脂材料を設けて樹脂層６０を形成する（図８（ａ）参照）。 A resin material is provided on both sides of the first fiber layer 10 to form the resin layer 60 (see FIG. 8A).
　また、第二繊維層２０の片面（図８（ｂ）では上面）に樹脂材料を設けて樹脂層６０を形成する（図８（ｂ）参照）。ただし、これに限られることはなく、第二繊維層２０の両面に樹脂材料を設けて樹脂層６０を形成してもよい。 Further, a resin material is provided on one side of the second fiber layer 20 (upper surface in FIG. 8B) to form the resin layer 60 (see FIG. 8B). However, the present invention is not limited to this, and the resin layer 60 may be formed by providing resin materials on both sides of the second fiber layer 20.
　第二繊維層２０を反転させて第二繊維層２０の一方側の面に設けられた樹脂層６０を他方側に位置づけ、当該樹脂層６０と第一繊維層１０の一方側の面に設けられた樹脂層６０とを当接させる。この結果、第一繊維層１０の一方側の面に設けられた樹脂層６０と、第二繊維層２０の他方側に位置づけられた樹脂層６０とが結合されることになり、図１に示すようなプリプレグが生成される。 The resin layer 60 provided on one side surface of the second fiber layer 20 is positioned on the other side by inverting the second fiber layer 20, and is provided on one surface of the resin layer 60 and the first fiber layer 10. The resin layer 60 is brought into contact with the resin layer 60. As a result, the resin layer 60 provided on one side of the first fiber layer 10 and the resin layer 60 located on the other side of the second fiber layer 20 are bonded to each other, which is shown in FIG. A prepreg like this is generated.
《効果》
　次に、上述した構成からなる本実施の形態による効果であって、未だ説明していないものを中心に説明する。 "effect"
Next, the effects of the present embodiment having the above-described configuration, which have not been described yet, will be mainly described.
　第一繊維層１０と離間して第二繊維層２０を設ける態様を採用した場合には、第一繊維層１０と第二繊維層２０との間でより多くの樹脂を設けることができる。その結果として、樹脂材料がプリプレグ１００の７０重量％以上で含有される場合には、例えば銅等からなる金属層２５０の間の凹部内に樹脂を充填させやすくなる。特に凹部の深みが深い場合（例えば７０μｍ以上の場合）には、繊維層が邪魔をして当該凹部内に樹脂を充填できないことがある。これに対して本態様のようにプリプレグ１００の含有量を高めた場合には、深みの深い凹部に対しても樹脂を充填しやすくなる。なお、金属層２５０が銅である場合、その厚みが７０μｍ以上の場合には「厚銅」と言われる。 When the embodiment in which the second fiber layer 20 is provided at a distance from the first fiber layer 10 is adopted, more resin can be provided between the first fiber layer 10 and the second fiber layer 20. As a result, when the resin material is contained in an amount of 70% by weight or more of the prepreg 100, it becomes easy to fill the recesses between the metal layers 250 made of, for example, copper or the like with the resin. In particular, when the depth of the recess is deep (for example, when it is 70 μm or more), the fiber layer may interfere and the resin may not be filled in the recess. On the other hand, when the content of the prepreg 100 is increased as in this embodiment, it becomes easy to fill the deep recesses with the resin. When the metal layer 250 is copper and its thickness is 70 μm or more, it is called “thick copper”.
　第一繊維層１０の第二繊維層２０側における樹脂材料が第一繊維層１０の第二繊維層２０とは反対側における樹脂材料よりも多くなる態様を採用する場合には、特に第二繊維層２０側で樹脂の含有量を多くすることができる。このため、第二繊維層２０側を金属層２５０側に位置付けることで、例えば前述した金属層２５０の間の凹部内に樹脂を充填させやすくなる。 Especially when the resin material on the second fiber layer 20 side of the first fiber layer 10 is larger than the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10, the second fiber The resin content can be increased on the layer 20 side. Therefore, by positioning the second fiber layer 20 side on the metal layer 250 side, for example, the recesses between the metal layers 250 described above can be easily filled with the resin.
　第一繊維層１０の第二繊維層２０側における樹脂材料によって形成される樹脂層６０の厚みＤ１が、第一繊維層１０の第二繊維層２０とは反対側における樹脂材料によって形成される樹脂層６０の厚みＤ２よりも大きくなる態様を採用した場合には、厚みが厚くなっている効果から、第二繊維層２０側を金属層２５０側に位置付けることで、例えば前述した金属層２５０の間の凹部内に樹脂を充填させやすくなる。 A resin in which the thickness D1 of the resin layer 60 formed by the resin material on the second fiber layer 20 side of the first fiber layer 10 is formed by the resin material on the side opposite to the second fiber layer 20 of the first fiber layer 10. When an embodiment larger than the thickness D2 of the layer 60 is adopted, the second fiber layer 20 side is positioned on the metal layer 250 side because of the effect of the thickening, for example, between the metal layers 250 described above. It becomes easier to fill the recesses of the resin with resin.
　第二繊維層２０が第一繊維層１０よりも可塑性が高くなっている態様を採用した場合には、第二繊維層２０側を金属層２５０側に位置付けることで、例えば前述した金属層２５０の間の凹部内に押し込みやすくすることができる。その結果、当該凹部内にプリプレグ１００を充填させやすくなる。このようにプリプレグ１００を凹部内に押し込むという観点からすると、プリプレグ１００の樹脂は半硬化状態となっていることが好ましい。 When the second fiber layer 20 has a higher plasticity than the first fiber layer 10, the second fiber layer 20 side is positioned on the metal layer 250 side, for example, of the metal layer 250 described above. It can be easily pushed into the recess between them. As a result, it becomes easy to fill the recess with the prepreg 100. From the viewpoint of pushing the prepreg 100 into the recess in this way, it is preferable that the resin of the prepreg 100 is in a semi-cured state.
　第二繊維層２０の網目が第一繊維層１０の網目よりも大きくなる態様を採用した場合には、網目を調整するだけで第二繊維層２０の可塑性を第一繊維層１０よりも高くすることができる。また、樹脂が半効果状態となっている場合には、第二繊維層２０側を例えば基板２００表面に形成された大きな凹部側に位置付けることで、第二繊維層２０の網目を介して樹脂が前述した凹部内に流れ込みやすくすることができる。このため、当該凹部内にプリプレグ１００をより充填させやすくなる。 When the mesh of the second fiber layer 20 is larger than the mesh of the first fiber layer 10, the plasticity of the second fiber layer 20 is made higher than that of the first fiber layer 10 only by adjusting the mesh. be able to. When the resin is in a semi-effect state, the resin can be removed through the mesh of the second fiber layer 20 by locating the second fiber layer 20 side, for example, on the large recess side formed on the surface of the substrate 200. It can be easily flowed into the above-mentioned recess. Therefore, it becomes easier to fill the recess with the prepreg 100.
　第二繊維層２０の繊維が第一繊維層１０の繊維よりも細くなる態様を採用した場合には、用いる繊維の太さを調整するだけで第二繊維層２０の可塑性を第一繊維層１０よりも高くすることができる。 When the mode in which the fibers of the second fiber layer 20 are thinner than the fibers of the first fiber layer 10 is adopted, the plasticity of the second fiber layer 20 can be improved by simply adjusting the thickness of the fibers used. Can be higher than.
第２の実施の形態
　次に、本発明の第２の実施の形態について説明する。 Second Embodiment Next, a second embodiment of the present invention will be described.
　図９に示すように、本実施の形態では、第一繊維層１０に対して第二繊維層２０と反対側に、第一繊維層１０と厚み方向で離間して設けられた第三繊維層３０が設けられている。その他の構成については、第１の実施の形態と同様であり、第１の実施の形態で説明したあらゆる態様を採用することができる。第１の実施の形態で説明した部材については同じ符号を用いて説明する。 As shown in FIG. 9, in the present embodiment, the third fiber layer is provided on the opposite side of the first fiber layer 10 from the second fiber layer 20 and separated from the first fiber layer 10 in the thickness direction. 30 is provided. Other configurations are the same as those in the first embodiment, and any aspect described in the first embodiment can be adopted. The members described in the first embodiment will be described using the same reference numerals.
　このように第三繊維層３０を設けることで、第一繊維層１０の両面において樹脂の含有量を増加させることができる。このため、図７で示すようにプリプレグ１００の両面を挟むようにしてパターン状の内部金属層２５０が設けられるような場合であっても、内部金属層２５０によって形成される凹部内に樹脂を確実に位置付けることができる。前述したように、特に凹部の深みが７０μｍ以上となっている場合には、本実施の形態のようなプリプレグ１００を用いる場合と従来からあるプリプレグ１００を用いる場合の効果の差が大きい。 By providing the third fiber layer 30 in this way, the resin content can be increased on both sides of the first fiber layer 10. Therefore, even when the patterned internal metal layer 250 is provided so as to sandwich both sides of the prepreg 100 as shown in FIG. 7, the resin is reliably positioned in the recess formed by the internal metal layer 250. be able to. As described above, especially when the depth of the recess is 70 μm or more, there is a large difference in effect between the case of using the prepreg 100 as in the present embodiment and the case of using the conventional prepreg 100.
　第一繊維層１０の両面側に設けられる樹脂材料の量は略同一となってもよい。「略同一」とは、両者の差が多い方の量の５重量％以内であることを意味している。第一繊維層１０の一方の面側に設けられた一方側樹脂材料の含有量をＷ１とし、第二繊維層２０の他方の面側に設けられた他方側樹脂材料の含有量をＷ２とした場合、Ｗ１≧Ｗ２のときにはＷ１－Ｗ２≦Ｗ１×０．０５となり、Ｗ２＞Ｗ１のときにはＷ２－Ｗ１≦Ｗ２×０．０５となることを意味している。第一繊維層１０の第二繊維層２０側における樹脂層６０の厚みＤ１は、第一繊維層１０の第三繊維層３０側における樹脂層６０の厚みＤ２と略同一となってもよい。 The amount of resin material provided on both sides of the first fiber layer 10 may be substantially the same. "Approximately the same" means that the difference between the two is within 5% by weight of the larger amount. The content of the one-side resin material provided on one surface side of the first fiber layer 10 was defined as W1, and the content of the other-side resin material provided on the other surface side of the second fiber layer 20 was defined as W2. In this case, it means that when W1 ≧ W2, W1-W2 ≦ W1 × 0.05, and when W2> W1, W2-W1 ≦ W2 × 0.05. The thickness D1 of the resin layer 60 on the second fiber layer 20 side of the first fiber layer 10 may be substantially the same as the thickness D2 of the resin layer 60 on the third fiber layer 30 side of the first fiber layer 10.
　第一繊維層１０の両面に設けられる第一樹脂材料からなる第一樹脂層６１と第三繊維層３０に設けられる第三樹脂材料からなる第三樹脂層６３とは同じ樹脂材料からなってもよいが、これに限られることはなく、異なる樹脂材料からなってもよい（図１０参照）。一例として、第三樹脂材料の導電率は第一樹脂材料の導電率と比較して低くなってもよい。このような樹脂を採用することで、基板２００に設けられた銅等の金属層からなる導体層等に対する樹脂の絶縁性を高く保つことができる。 Even if the first resin layer 61 made of the first resin material provided on both sides of the first fiber layer 10 and the third resin layer 63 made of the third resin material provided on the third fiber layer 30 are made of the same resin material. However, the present invention is not limited to this, and may be made of different resin materials (see FIG. 10). As an example, the conductivity of the third resin material may be lower than that of the first resin material. By adopting such a resin, it is possible to maintain high insulation of the resin with respect to a conductor layer made of a metal layer such as copper provided on the substrate 200.
　また、第二繊維層２０に設けられる第二樹脂層６２と第三繊維層３０に設けられる第三樹脂層６３とは同じ樹脂材料からなってもよいが、これに限られることはなく、異なる樹脂材料からなってもよい（図１０参照）。 Further, the second resin layer 62 provided in the second fiber layer 20 and the third resin layer 63 provided in the third fiber layer 30 may be made of the same resin material, but the present invention is not limited to this, and the third resin layer 63 is different. It may be made of a resin material (see FIG. 10).
　第三繊維層３０は第一繊維層１０よりも可塑性が高くなってもよく、第二繊維層２０及び第三繊維層３０の両方が第一繊維層１０よりも可塑性が高くなってもよい。 The third fiber layer 30 may be more plastic than the first fiber layer 10, and both the second fiber layer 20 and the third fiber layer 30 may be more plastic than the first fiber layer 10.
　第三繊維層３０の可塑性を高くするために、第三繊維層３０の網目は第一繊維層１０の網目よりも大きくなってもよい（図１１（ａ）（ｂ）参照）。また、第三繊維層３０を構成する第三繊維３１は第一繊維層１０を構成する第一繊維１１よりも細くなってもよい（図１１（ａ）（ｃ）参照）。 In order to increase the plasticity of the third fiber layer 30, the mesh of the third fiber layer 30 may be larger than the mesh of the first fiber layer 10 (see FIGS. 11A and 11B). Further, the third fiber 31 constituting the third fiber layer 30 may be thinner than the first fiber 11 constituting the first fiber layer 10 (see FIGS. 11A and 11C).
　第二繊維層２０及び第三繊維層３０は同程度の可塑性となってもよい。但し、これに限られることはなく、第三繊維層３０の可塑性は第二繊維層２０の可塑性よりも低くなってもよい。第三繊維層３０の網目は第一繊維層１０の網目よりも大きく、第二繊維層２０の網目よりも小さくなってもよい。また、第三繊維層３０の第三繊維３１は第一繊維層１０の第一繊維１１よりも細く、第二繊維層２０の第二繊維２１よりも太くなってもよい。これらを組み合わせてもよく、第三繊維層３０の第三繊維３１は第一繊維層１０の第一繊維１１よりも細くなり、かつ第三繊維層３０の網目は第一繊維層１０の網目よりも大きくなってもよい。また、第三繊維層３０の第三繊維３１は第二繊維層２０の第二繊維２１よりも太くなり、かつ第三繊維層３０の網目は第二繊維層２０の網目よりも小さくなってもよい。 The second fiber layer 20 and the third fiber layer 30 may have the same degree of plasticity. However, the present invention is not limited to this, and the plasticity of the third fiber layer 30 may be lower than the plasticity of the second fiber layer 20. The mesh of the third fiber layer 30 may be larger than the mesh of the first fiber layer 10 and smaller than the mesh of the second fiber layer 20. Further, the third fiber 31 of the third fiber layer 30 may be thinner than the first fiber 11 of the first fiber layer 10 and may be thicker than the second fiber 21 of the second fiber layer 20. These may be combined, and the third fiber 31 of the third fiber layer 30 is thinner than the first fiber 11 of the first fiber layer 10, and the mesh of the third fiber layer 30 is smaller than the mesh of the first fiber layer 10. May also grow. Further, even if the third fiber 31 of the third fiber layer 30 is thicker than the second fiber 21 of the second fiber layer 20, and the mesh of the third fiber layer 30 is smaller than the mesh of the second fiber layer 20. Good.
　第一繊維層１０と第三繊維層３０との間は第一繊維層１０の１倍以上の厚みで離間してもよいし、第一繊維層１０の２倍以上の厚みで離間してもよいし、第一繊維層１０の３倍以上の厚みで離間してもよいし、第一繊維層１０の５倍以上の厚みで離間してもよいし、第一繊維層１０の１０倍以上の厚みで離間してもよい。第一繊維層１０と第三繊維層３０との間は第一繊維層１０の５０倍以下となってもよい。 The first fiber layer 10 and the third fiber layer 30 may be separated by a thickness of 1 times or more that of the first fiber layer 10 or may be separated by a thickness of twice or more that of the first fiber layer 10. Alternatively, they may be separated by a thickness of 3 times or more of the first fiber layer 10, may be separated by a thickness of 5 times or more of the first fiber layer 10, or may be separated by 10 times or more of the first fiber layer 10. It may be separated by the thickness of. The distance between the first fiber layer 10 and the third fiber layer 30 may be 50 times or less that of the first fiber layer 10.
≪製造工程≫
　本実施の形態によるプリプレグの製造工程の一例について図１２を用いて説明する。 ≪Manufacturing process≫
An example of the manufacturing process of the prepreg according to the present embodiment will be described with reference to FIG.
　第一繊維層１０の両面に樹脂材料を設けて樹脂層６０を形成する（図１２（ａ）参照）。 A resin material is provided on both sides of the first fiber layer 10 to form the resin layer 60 (see FIG. 12A).
　また、第二繊維層２０の片面（図１２（ｂ）では上面）に樹脂材料を設けて樹脂層６０を形成する（図１２（ｂ）参照）。ただし、これに限られることはなく、第二繊維層２０の両面に樹脂材料を設けて樹脂層６０を形成してもよい。 Further, a resin material is provided on one side of the second fiber layer 20 (upper surface in FIG. 12B) to form the resin layer 60 (see FIG. 12B). However, the present invention is not limited to this, and the resin layer 60 may be formed by providing resin materials on both sides of the second fiber layer 20.
　また、第三繊維層３０の片面（図１２（ｃ）では上面）に樹脂材料を設けて樹脂層６０を形成する（図１２（ｃ）参照）。ただし、これに限られることはなく、第二繊維層２０の両面に樹脂材料を設けて樹脂層６０を形成してもよい。 Further, a resin material is provided on one side of the third fiber layer 30 (upper surface in FIG. 12 (c)) to form the resin layer 60 (see FIG. 12 (c)). However, the present invention is not limited to this, and the resin layer 60 may be formed by providing resin materials on both sides of the second fiber layer 20.
　第二繊維層２０を反転させて第二繊維層２０の一方側の面に設けられた樹脂層６０を他方側（図１２の下方側）に位置づけ、当該樹脂層６０と第一繊維層１０の一方側（図１２の上方側）の面に設けられた樹脂層６０とを当接させる。また、第三繊維層３０の一方側（図１２の上方側）の面に設けられた樹脂層６０を第一繊維層１０の他方側（図１２の下方側）の面に設けられた樹脂層６０に当接させる。 The resin layer 60 provided on one side surface of the second fiber layer 20 is positioned on the other side (lower side in FIG. 12) by inverting the second fiber layer 20, and the resin layer 60 and the first fiber layer 10 The resin layer 60 provided on one side (upper side in FIG. 12) is brought into contact with the resin layer 60. Further, the resin layer 60 provided on one side (upper side in FIG. 12) of the third fiber layer 30 is provided on the other side (lower side in FIG. 12) of the first fiber layer 10. Abut on 60.
　この結果、第一繊維層１０の一方側の面に設けられた樹脂層６０と、第二繊維層２０の他方側に位置づけられた樹脂層６０とが結合され、第一繊維層１０の他方側の面に設けられた樹脂層６０と、第三繊維層３０の一方側に位置づけられた樹脂層６０とが結合され、図９に示すようなプリプレグが生成される。 As a result, the resin layer 60 provided on one surface of the first fiber layer 10 and the resin layer 60 located on the other side of the second fiber layer 20 are bonded to each other, and the other side of the first fiber layer 10 is bonded. The resin layer 60 provided on the surface of the third fiber layer 30 and the resin layer 60 located on one side of the third fiber layer 30 are combined to generate a prepreg as shown in FIG.
変形例
　第１の実施の形態及び第２の実施の形態の変形例としては、第一繊維層１０、第二繊維層２０及び第三繊維層３０と厚み方向で離間して設けられた第ｎ繊維層（「ｎ」は４以上の整数である。）が設けられてもよい（図１３参照）。一例としては、互いに厚み方向で離間する第一繊維層１０、第二繊維層２０、第三繊維層３０及び第四繊維層が設けられてもよいし、互いに厚み方向で離間する第一繊維層１０、第二繊維層２０、第三繊維層３０、第四繊維層４０、第五繊維層５０、第六繊維層及び第七繊維層が設けられてもよい。 Modification Example As a modification of the first embodiment and the second embodiment, the nth fiber layer 10, the second fiber layer 20, and the third fiber layer 30 are provided apart from each other in the thickness direction. A fiber layer (“n” is an integer of 4 or more) may be provided (see FIG. 13). As an example, the first fiber layer 10, the second fiber layer 20, the third fiber layer 30, and the fourth fiber layer which are separated from each other in the thickness direction may be provided, or the first fiber layer which is separated from each other in the thickness direction. 10. The second fiber layer 20, the third fiber layer 30, the fourth fiber layer 40, the fifth fiber layer 50, the sixth fiber layer, and the seventh fiber layer may be provided.
　また、外面側の樹脂層６０は、当該外面側の樹脂層６０よりも内面側に位置する樹脂層６０のいずれか一つよりも厚くなるようになってもよい。より具体的には、外面側の樹脂層６０は当該外面側の樹脂層６０と第一繊維層１０との間に設けられている樹脂層６０のいずれか一つ又は全てよりも厚くなってもよい。このような態様を採用した場合には、外面側で樹脂量を増やすことができ、例えば基板２００の凹部等にプリプレグ１００を充填しやすくなる。また、外面側に向かうにつれて樹脂層６０の厚みが厚くなるようにしてもよい。 Further, the resin layer 60 on the outer surface side may be thicker than any one of the resin layers 60 located on the inner surface side of the resin layer 60 on the outer surface side. More specifically, even if the resin layer 60 on the outer surface side is thicker than any one or all of the resin layers 60 provided between the resin layer 60 on the outer surface side and the first fiber layer 10. Good. When such an embodiment is adopted, the amount of resin can be increased on the outer surface side, and for example, the recesses of the substrate 200 can be easily filled with the prepreg 100. Further, the thickness of the resin layer 60 may be increased toward the outer surface side.
　また、外面側の繊維層は、当該外面側の繊維層よりも内面側に位置する繊維層よりも可塑性が高くなってもよい。すなわち、第ｍ繊維層（「ｍ」は４以上かつｎ以下の整数である。）は、当該第ｍ繊維層よりも内面側に位置する繊維層よりも可塑性が高くなってもよい。より具体的には、第ｍ繊維層は第一繊維層１０並びに当該第ｍ繊維層と第一繊維層１０との間に設けられている繊維層のいずれか一つ又は全てよりも可塑性が高くなってもよい。このような態様を採用した場合には、外面側で可塑性を高めることができ、例えば基板２００の凹部等にプリプレグ１００を充填しやすくなる。また、外面側に向かうにつれて繊維層の可塑性が高くなるようにしてもよい。 Further, the fiber layer on the outer surface side may be more plastic than the fiber layer located on the inner surface side of the fiber layer on the outer surface side. That is, the m-th fiber layer (“m” is an integer of 4 or more and n or less) may be more plastic than the fiber layer located on the inner surface side of the m-th fiber layer. More specifically, the m-th fiber layer is more plastic than the first fiber layer 10 and any one or all of the fiber layers provided between the m-th fiber layer and the first fiber layer 10. You may become. When such an aspect is adopted, the plasticity can be enhanced on the outer surface side, and for example, the recesses of the substrate 200 can be easily filled with the prepreg 100. Further, the plasticity of the fiber layer may be increased toward the outer surface side.
第３の実施の形態
　次に、本発明の第３の実施の形態について説明する。 Third Embodiment Next, a third embodiment of the present invention will be described.
　本実施の形態では、銅張積層板のような積層板においてプリプレグ１００の配置位置に応じて異なるプリプレグ１００を用いる技術的思想を提供する。本実施の形態では、第１の実施の形態及び第２の実施の形態で説明したあらゆる態様を採用することができる。第１の実施の形態又は第２実施の形態で説明した部材については同じ符号を用いて説明する。 The present embodiment provides a technical idea of using different prepregs 100 depending on the arrangement position of the prepregs 100 in a laminated plate such as a copper-clad laminate. In this embodiment, any aspect described in the first embodiment and the second embodiment can be adopted. The members described in the first embodiment or the second embodiment will be described with reference to the same reference numerals.
　最外面に位置し、一方の面側にだけパターン状の内部金属層２５０が設けられるプリプレグ１００に関しては第１の実施の形態で説明した第一繊維層１０に対して一方側の樹脂量が他方側の樹脂量よりも多いものを用い、両面にパターン状の内部金属層２５０が設けられるプリプレグ１００に関しては第２の実施の形態のように第一繊維層１０の両面において樹脂量が多くなっている態様を採用するようにしてもよい（図１４参照）。 Regarding the prepreg 100 which is located on the outermost surface and has the patterned internal metal layer 250 provided only on one surface side, the amount of resin on one side of the first fiber layer 10 described in the first embodiment is the other. Regarding the prepreg 100 in which a larger amount of resin than the amount of resin on the side is provided and the internal metal layer 250 having a pattern on both sides is provided, the amount of resin is increased on both sides of the first fiber layer 10 as in the second embodiment. (See FIG. 14).
　より具体的には、積層板は、絶縁層２１０と、絶縁層２１０の両面に設けられたパターン状の内部金属層２５０とを有する複数の基板２００と、基板２００の間に設けられる内部側プリプレグ１００ｂと、基板２００の一方側又は他方側にだけ設けられる外部側プリプレグ１００ａと、を有してもよい。 More specifically, the laminated board is a plurality of substrates 200 having an insulating layer 210 and a patterned internal metal layer 250 provided on both sides of the insulating layer 210, and an internal prepreg provided between the substrates 200. It may have 100b and an external prepreg 100a provided only on one side or the other side of the substrate 200.
　図１５（ｂ）に示すように、内部側プリプレグ１００ｂは、内部第一繊維層１０ｂと、内部第一繊維層１０ｂに離間して設けられた内部第二繊維層２０ｂと、内部第一繊維層１０ｂに対して内部第二繊維層２０ｂと反対側に設けられた内部第三繊維層３０ｂとを有し、内部第一繊維層１０ｂと内部第二繊維層２０ｂとの間及び内部第一繊維層１０ｂと内部第三繊維層３０ｂとの間に内部樹脂層６０ｂが設けられてもよい。この際、当該内部樹脂層６０ｂを構成する内部樹脂材料が内部側プリプレグ１００ｂの７０重量％以上、８０重量％以上、又は８５重量％以上で含有されてもよい。内部樹脂層６０ｂを構成する内部樹脂材料が内部側プリプレグ１００ｂの例えば９５重量％以下であってもよいし、９０重量％以下であってもよい。 As shown in FIG. 15B, the inner prepreg 100b includes an inner first fiber layer 10b, an inner second fiber layer 20b provided apart from the inner first fiber layer 10b, and an inner first fiber layer. It has an inner third fiber layer 30b provided on the opposite side of the inner second fiber layer 20b with respect to 10b, and is between the inner first fiber layer 10b and the inner second fiber layer 20b and the inner first fiber layer. An internal resin layer 60b may be provided between the 10b and the internal third fiber layer 30b. At this time, the internal resin material constituting the internal resin layer 60b may be contained in an amount of 70% by weight or more, 80% by weight or more, or 85% by weight or more of the internal prepreg 100b. The internal resin material constituting the internal resin layer 60b may be, for example, 95% by weight or less of the internal prepreg 100b, or 90% by weight or less.
　図１５（ａ）に示すように、外部側プリプレグ１００ａは、外部第一繊維層１０ａと、外部第一繊維層１０ａに離間して設けられた外部第二繊維層２０ａとを有し、外部第一繊維層１０ａと外部第二繊維層２０ａとの間及び外部第一繊維層１０ａの外部第二繊維層２０ａとは反対側に外部樹脂層６０ａが設けられてもよい。この際、当該外部樹脂層６０ａを構成する外部樹脂材料が外部側プリプレグ１００ａの７０重量％以上、８０重量％以上、又は８５重量％以上で含有されてもよい。外部樹脂層６０ａを構成する外部樹脂材料が外部側プリプレグ１００ａの例えば９５重量％以下であってもよいし、９０重量％以下であってもよい。 As shown in FIG. 15A, the outer prepreg 100a has an outer first fiber layer 10a and an outer second fiber layer 20a provided apart from the outer first fiber layer 10a, and has an outer first fiber layer 20a. The outer resin layer 60a may be provided between the one fiber layer 10a and the outer second fiber layer 20a and on the side of the outer first fiber layer 10a opposite to the outer second fiber layer 20a. At this time, the external resin material constituting the external resin layer 60a may be contained in an amount of 70% by weight or more, 80% by weight or more, or 85% by weight or more of the external prepreg 100a. The external resin material constituting the external resin layer 60a may be, for example, 95% by weight or less of the external prepreg 100a, or 90% by weight or less.
　上述した各実施の形態の記載、変形例及び図面の開示は、特許請求の範囲に記載された発明を説明するための一例に過ぎず、上述した実施の形態の記載又は図面の開示によって特許請求の範囲に記載された発明が限定されることはない。 The description of each embodiment described above, the modification and the disclosure of the drawings are merely examples for explaining the invention described in the claims, and the patent claim is made by the description of the above-described embodiments or the disclosure of the drawings. The inventions described in the scope of are not limited.
　上述した実施の形態における積層板に半導体素子、コンデンサ、抵抗等の電子部品が載置され、当該電子部品が封止樹脂で封入されることで電子装置が提供される。このような電子装置は、自動車、飛行機、船舶、ヘリコプター、パソコン、家電等のあらゆる実装装置に組み込まれてもよい。 An electronic device is provided by mounting electronic components such as a semiconductor element, a capacitor, and a resistor on the laminated plate in the above-described embodiment and enclosing the electronic components with a sealing resin. Such electronic devices may be incorporated into any mounting device such as automobiles, airplanes, ships, helicopters, personal computers, home appliances and the like.
１０　　　　第一繊維層
１０ａ　　　外部第一繊維層
１０ｂ　　　内部第一繊維層
２０　　　　第二繊維層
２０ａ　　　外部第二繊維層
２０ｂ　　　内部第二繊維層
３０　　　　第三繊維層
３０ｂ　　　内部第三繊維層
１００　　　プリプレグ
１００ａ　　　外部側プリプレグ
１００ｂ　　　内部側プリプレグ
２００　　　　基板
２１０　　　　絶縁層
２５０　　　　内部金属層（金属層） 10 First fiber layer 10a Outer first fiber layer 10b Inner first fiber layer 20 Second fiber layer 20a Outer second fiber layer 20b Inner second fiber layer 30 Third fiber layer 30b Inner third fiber layer 100 Prepreg 100a Outer side Prepreg 100b Internal side Prepreg 200 Substrate 210 Insulation layer 250 Internal metal layer (metal layer)

Claims (15)

  1. 　プリプレグにおいて、
    　第一繊維層と、
    　前記第一繊維層と離間して設けられた第二繊維層と、
    　を備え、
    　前記第一繊維層の前記第二繊維層側及び前記第一繊維層の前記第二繊維層とは反対側に樹脂材料が設けられ、
    　前記樹脂材料が前記プリプレグの７０重量％以上で含有されるプリプレグ。     In prepreg
    First fiber layer and
    A second fiber layer provided apart from the first fiber layer and
    With
    A resin material is provided on the second fiber layer side of the first fiber layer and on the side of the first fiber layer opposite to the second fiber layer.
    A prepreg containing the resin material in an amount of 70% by weight or more of the prepreg.
  2. 　前記第一繊維層の前記第二繊維層側における樹脂材料は、前記第一繊維層の前記第二繊維層とは反対側における樹脂材料よりも多い、請求項１に記載のプリプレグ。 The prepreg according to claim 1, wherein the resin material on the second fiber layer side of the first fiber layer is larger than the resin material on the side opposite to the second fiber layer of the first fiber layer.
  3. 　前記第一繊維層の前記第二繊維層側における樹脂材料によって形成される樹脂層の厚みは、前記第一繊維層の前記第二繊維層とは反対側における樹脂材料によって形成される樹脂層の厚みよりも大きい、請求項２に記載のプリプレグ。 The thickness of the resin layer formed by the resin material on the second fiber layer side of the first fiber layer is the thickness of the resin layer formed by the resin material on the side opposite to the second fiber layer of the first fiber layer. The prepreg according to claim 2, which is larger than the thickness.
  4. 　前記第二繊維層は前記第一繊維層よりも可塑性が高い、請求項１乃至３のいずれか１項に記載のプリプレグ。 The prepreg according to any one of claims 1 to 3, wherein the second fiber layer has higher plasticity than the first fiber layer.
  5. 　前記第二繊維層の網目は前記第一繊維層の網目よりも大きい、請求項１乃至４のいずれか１項に記載のプリプレグ。 The prepreg according to any one of claims 1 to 4, wherein the mesh of the second fiber layer is larger than the mesh of the first fiber layer.
  6. 　前記第二繊維層の繊維は前記第一繊維層の繊維よりも細い、請求項１乃至５のいずれか１項に記載のプリプレグ。 The prepreg according to any one of claims 1 to 5, wherein the fibers of the second fiber layer are thinner than the fibers of the first fiber layer.
  7. 　前記第一繊維層に対して前記第二繊維層と反対側に、前記第一繊維層と離間して設けられた第三繊維層を備える、請求項１乃至６のいずれか１項に記載のプリプレグ。 The first item according to any one of claims 1 to 6, wherein a third fiber layer provided on the opposite side of the first fiber layer from the first fiber layer is provided. Prepreg.
  8. 　前記第三繊維層は前記第一繊維層よりは可塑性が高い、請求項７に記載のプリプレグ。 The prepreg according to claim 7, wherein the third fiber layer has higher plasticity than the first fiber layer.
  9. 　前記第一繊維層、前記第二繊維層及び前記第三繊維層と厚み方向で離間して設けられた第ｎ繊維層（「ｎ」は４以上の整数である。）が設けられ、
    　樹脂層のいずれか一つは、当該樹脂層よりも内面側に位置する樹脂層のいずれか一つよりも厚くなるようになっている、請求項７又は８のいずれかに記載のプリプレグ。     An nth fiber layer (“n” is an integer of 4 or more) provided apart from the first fiber layer, the second fiber layer, and the third fiber layer in the thickness direction is provided.
    The prepreg according to claim 7 or 8, wherein any one of the resin layers is thicker than any one of the resin layers located on the inner surface side of the resin layer.
  10. 　前記第一繊維層、前記第二繊維層及び前記第三繊維層と厚み方向で離間して設けられた第ｎ繊維層（「ｎ」は４以上の整数である。）が設けられ、
    　第ｍ繊維層（「ｍ」は４以上かつｎ以下の整数である。）は、当該第ｍ繊維層よりも内面側に位置する繊維層よりも可塑性が高い、請求項７乃至９のいずれか１項に記載のプリプレグ。     An nth fiber layer (“n” is an integer of 4 or more) provided apart from the first fiber layer, the second fiber layer, and the third fiber layer in the thickness direction is provided.
    Any of claims 7 to 9, wherein the m-th fiber layer (“m” is an integer of 4 or more and n or less) has higher plasticity than the fiber layer located on the inner surface side of the m-th fiber layer. The prepreg according to item 1.
  11. 　前記第一繊維層に設けられた樹脂層を形成する樹脂材料と、前記第二繊維層に設けられた樹脂層を形成する樹脂材料とは異なる、請求項１乃至１０のいずれか１項に記載のプリプレグ。 The invention according to any one of claims 1 to 10, wherein the resin material that forms the resin layer provided on the first fiber layer and the resin material that forms the resin layer provided on the second fiber layer are different from each other. Prepreg.
  12. 　絶縁層と、前記絶縁層に設けられたパターン状の金属層とを有する基板と、
    　前記金属層に設けられた請求項１乃至１１のいずれか１項に記載のプリプレグと、
    　を備え、
    　前記金属層によって形成される凹部が７０μｍ以上の深みを有する積層板。     A substrate having an insulating layer and a patterned metal layer provided on the insulating layer,
    The prepreg according to any one of claims 1 to 11 provided on the metal layer.
    With
    A laminated plate in which the recess formed by the metal layer has a depth of 70 μm or more.
  13. 　絶縁層と、前記絶縁層の両面に設けられたパターン状の金属層とを有する複数の基板と、
    　前記基板の間に設けられる内部側プリプレグと、
    　前記基板の一方側又は他方側にだけ設けられる外部側プリプレグと、
    　を備え、
    　前記内部側プリプレグは、内部第一繊維層と、前記内部第一繊維層に離間して設けられた内部第二繊維層と、前記内部第一繊維層に対して前記内部第二繊維層と反対側に設けられた内部第三繊維層とを有し、前記内部第一繊維層と前記内部第二繊維層との間及び前記内部第一繊維層と前記内部第三繊維層との間に内部樹脂層が設けられ、当該内部樹脂層を構成する内部樹脂材料が前記内部側プリプレグの７０重量％以上で含有され、
    　前記外部側プリプレグは、外部第一繊維層と、前記外部第一繊維層に離間して設けられた外部第二繊維層とを有し、前記外部第一繊維層と前記外部第二繊維層との間及び前記外部第一繊維層の前記外部第二繊維層とは反対側に外部樹脂層が設けられ、当該外部樹脂層を構成する外部樹脂材料が前記外部側プリプレグの７０重量％以上で含有される、積層板。     A plurality of substrates having an insulating layer and a patterned metal layer provided on both sides of the insulating layer, and a plurality of substrates.
    An internal prepreg provided between the substrates and
    An external prepreg provided only on one side or the other side of the substrate,
    With
    The inner prepreg is opposite to the inner first fiber layer, the inner second fiber layer provided apart from the inner first fiber layer, and the inner first fiber layer. It has an inner third fiber layer provided on the side, and is inside between the inner first fiber layer and the inner second fiber layer and between the inner first fiber layer and the inner third fiber layer. A resin layer is provided, and the internal resin material constituting the internal resin layer is contained in 70% by weight or more of the internal prepreg.
    The outer prepreg has an outer first fiber layer and an outer second fiber layer provided apart from the outer first fiber layer, and the outer first fiber layer and the outer second fiber layer An outer resin layer is provided between the spaces and on the side of the outer first fiber layer opposite to the outer second fiber layer, and the outer resin material constituting the outer resin layer is contained in 70% by weight or more of the outer side prepreg. Laminated board.
  14. 　請求項１２又は１３に記載の積層板を備えた電子装置。 An electronic device provided with the laminated board according to claim 12 or 13.
  15. 　請求項１４に記載の電子装置を備えた実装装置。 A mounting device including the electronic device according to claim 14.
PCT/JP2019/045531 2019-11-21 2019-11-21 Prepreg, layered sheet, electronic device, and mounting device WO2021100162A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/045531 WO2021100162A1 (en) 2019-11-21 2019-11-21 Prepreg, layered sheet, electronic device, and mounting device
JP2021558109A JPWO2021100162A1 (en) 2019-11-21 2019-11-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/045531 WO2021100162A1 (en) 2019-11-21 2019-11-21 Prepreg, layered sheet, electronic device, and mounting device

Publications (1)

Publication Number Publication Date
WO2021100162A1 true WO2021100162A1 (en) 2021-05-27

Family

ID=75980459

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/045531 WO2021100162A1 (en) 2019-11-21 2019-11-21 Prepreg, layered sheet, electronic device, and mounting device

Country Status (2)

Country Link
JP (1) JPWO2021100162A1 (en)
WO (1) WO2021100162A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099104A (en) * 2005-12-01 2011-05-19 Sumitomo Bakelite Co Ltd Prepreg, substrate and semiconductor device
WO2012011487A1 (en) * 2010-07-21 2012-01-26 東レ株式会社 Prepreg, fiber-reinforced composite material, and process for producing prepreg
WO2017122819A1 (en) * 2016-01-15 2017-07-20 日立化成株式会社 Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011099104A (en) * 2005-12-01 2011-05-19 Sumitomo Bakelite Co Ltd Prepreg, substrate and semiconductor device
WO2012011487A1 (en) * 2010-07-21 2012-01-26 東レ株式会社 Prepreg, fiber-reinforced composite material, and process for producing prepreg
WO2017122819A1 (en) * 2016-01-15 2017-07-20 日立化成株式会社 Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board

Also Published As

Publication number Publication date
JPWO2021100162A1 (en) 2021-05-27

Similar Documents

Publication Publication Date Title
US9538642B2 (en) Wiring board and method for manufacturing the same
JP5151265B2 (en) Multilayer wiring board and method for manufacturing multilayer wiring board
CN102159021A (en) Flex-rigid wiring board and method for manufacturing the same
JP2012146983A (en) Wiring board and method of manufacturing the same
JP2006286934A (en) Common mode choke coil
TWI378755B (en)
CN100558222C (en) Multiwiring board and manufacture method thereof
JP2016532577A (en) Flexible composite material, its production method and use of said flexible composite material
US7956293B2 (en) Multilayer printed wiring board and manufacturing method thereof
KR102545033B1 (en) Coil Electronic Component
WO2021100162A1 (en) Prepreg, layered sheet, electronic device, and mounting device
US20160360609A1 (en) Circuit substrate and electronic equipment including the same
US9095082B2 (en) Method for manufacturing multilayer printed circuit board
KR102442389B1 (en) Printed circuit board and method of manufacturing the same
KR20190023297A (en) Insulating film and circuit board having the same
KR102064079B1 (en) Inductor
JP2007280996A (en) Multilayer printed-wiring board
US20150101846A1 (en) Printed circuit board and method of manufacturing the same
KR101456943B1 (en) Printed circuit board having cirtcuit pattern of multi-layer structure using conductive ink
JP2020092138A (en) High frequency circuit printed wiring board and manufacturing method thereof
KR20210030733A (en) The method for manufacturing the printed circuit board
KR102561936B1 (en) Printed circuit board
JP4961945B2 (en) Multilayer printed wiring board and manufacturing method thereof
JP2015005717A (en) Rigid-flexible printed circuit board and method of manufacturing the same
WO2010125858A1 (en) Multilayered resin circuit board, and manufacturing method of multilayered resin circuit board

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19953043

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2021558109

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19953043

Country of ref document: EP

Kind code of ref document: A1