WO2021093339A1 - Miniature sound production device and electronic product - Google Patents

Miniature sound production device and electronic product Download PDF

Info

Publication number
WO2021093339A1
WO2021093339A1 PCT/CN2020/099489 CN2020099489W WO2021093339A1 WO 2021093339 A1 WO2021093339 A1 WO 2021093339A1 CN 2020099489 W CN2020099489 W CN 2020099489W WO 2021093339 A1 WO2021093339 A1 WO 2021093339A1
Authority
WO
WIPO (PCT)
Prior art keywords
backing ring
diaphragm
ring
melting
micro
Prior art date
Application number
PCT/CN2020/099489
Other languages
French (fr)
Chinese (zh)
Inventor
葛连山
王兴龙
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021093339A1 publication Critical patent/WO2021093339A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details

Definitions

  • the present invention belongs to the technical field of electroacoustic energy conversion. Specifically, the present invention relates to a miniature sound generating device.
  • Micro-sounding devices are important components in consumer electronic products. They are used to convert electrical signals into sound. They are indispensable components in consumer electronic products such as mobile phones and earphones. In order to use complex application environments, waterproof performance has become an important indicator of micro-sounding devices.
  • the diaphragm In the existing miniature sounding device, the diaphragm is often fixedly connected with the housing or the bearing part of the sounding device by means of glue coating.
  • adhesive bonding cannot meet the requirements of waterproof performance.
  • An object of the present invention is to provide an improved miniature sound generating device.
  • a miniature sound emitting device including:
  • a vibrating component comprising a diaphragm, the diaphragm having a folded ring portion and a fixed portion, the folded ring portion extends in a ring shape, and the fixed portion is formed around the periphery of the folded ring portion;
  • a housing assembly the housing assembly includes a main housing and a backing ring, the backing ring is sealingly connected to the main housing, the diaphragm is arranged on the backing ring, and the fixing part is connected to the backing ring.
  • the backing ring is fused and fixedly connected to form a melting band, and the difference between the melting temperature of the backing ring and the melting temperature of the diaphragm is less than 60 degrees Celsius.
  • the fixing portion and the backing ring are fused and fixedly connected by laser hot melting.
  • the temperature range of laser melting is 120 degrees Celsius-450 degrees Celsius.
  • the material of the backing ring is at least one of polycarbonate plastic, polyphthalamide plastic, and polyether plastic with a thiophenyl group.
  • the material of the diaphragm is at least one of polyether ether ketone plastic, polyarylate plastic, and thermoplastic polyester rubber.
  • the melting temperature of the main housing is greater than the melting temperature of the diaphragm and the backing ring by 60 degrees Celsius.
  • the backing ring and the main housing are integrally formed by an integral injection molding process.
  • the fixing portion includes a flat portion extending laterally outward from the folding ring portion, and the flat portion is fixedly connected to the backing ring.
  • the fixing portion includes a flange extending longitudinally from the plane portion, and the flange is fused and fixedly connected to the side surface of the backing ring.
  • Another aspect of the present invention also provides an electronic product, which includes:
  • the main body of electronic products The main body of electronic products
  • the micro-sounding device is arranged in the main body of the electronic product, and the micro-sounding device is electrically connected with the signal connector in the main body of the electronic product.
  • the technical effect of the present invention is that the waterproof performance between the diaphragm and the housing assembly in the micro-sound device is significantly improved.
  • FIG. 1 is a schematic diagram of a three-dimensional structure of a miniature sound emitting device provided by the present invention
  • Figure 2 is an exploded schematic diagram of some parts of the miniature sounding device provided by the present invention.
  • Figure 3 is a partial side cross-sectional view of the micro-sounding device provided by the present invention.
  • FIG. 4 is a side cross-sectional view of a micro-sounding device according to another embodiment of the present invention.
  • Fig. 5 is a side cross-sectional view of a micro-sounding device according to another embodiment of the present invention.
  • the present invention provides an improved miniature sound emitting device, which comprises a vibration component and a shell component.
  • the vibration component includes a diaphragm.
  • the vibration component is a component capable of vibrating and realizing the sound production function in the miniature sound generating device, and the vibration component may also include components such as a voice coil, which is not limited by the present invention.
  • the diaphragm can drive the air to vibrate and generate sound during the vibration process.
  • the diaphragm 1 has a folding ring portion 11 and a fixing portion 12.
  • the folding ring portion 11 has a bent structure, which extends into an annular structure.
  • the folded ring portion 11 and the area surrounded by the folded ring portion 11 are parts that can vibrate up and down.
  • the fixing portion 12 is formed around the periphery of the folding ring portion 11, and the fixing portion 12 is a part that is fixedly connected to other components of the micro-sound device and cannot be vibrated.
  • the housing assembly 2 is used to carry the vibration assembly and other components in the miniature sound generating device.
  • the housing assembly 2 includes a main housing and a backing ring 21.
  • the main casing constitutes the main frame of the micro-sound device, and its interior can accommodate components such as voice coils and magnets.
  • the backing ring 21 is fixed on the main housing, and is used to form a fixed connection with the diaphragm 1 for supporting the diaphragm 1.
  • the diaphragm 1 is arranged on the backing ring 21, and the fixing portion 12 and the backing ring 21 are fused and fixedly connected in the form of hot fusion, thereby forming a melting band 10.
  • the fixing portion 12 and the backing ring 21 are melted and fixed to form an integral structure, and the two have a good connection tightness and airtightness.
  • the backing ring uses a material that has a melting temperature similar to that of the diaphragm, and it is preferable that the difference between the melting temperature of the backing ring and the melting temperature of the diaphragm is less than 60 degrees Celsius.
  • the diaphragm and the backing ring are hot-melt fixedly connected, it is easy to control the hot-melt temperature, and there is no need to raise the melting temperature to an excessively high temperature, avoiding damage to other components of the micro-sounding device.
  • the hot melt temperature is raised to an appropriate temperature, the backing ring and the fixing part can be melted at the same time.
  • the waterproof effect of the diaphragm and the housing assembly is significantly improved, the space occupied by the waterproof process is relatively small, and the use of waterproof glue is also greatly reduced, thereby reducing the production of micro-sounding devices cost.
  • the structural reliability of the micro-sounding device has also been improved. In the later life test, problems such as cracking between the diaphragm and the housing assembly are not easy to occur, and the two realize a tight and reliable fixed connection.
  • the housing assembly includes two structures: a main housing and a backing ring.
  • the backing ring is mainly used to realize a fusion and fixed connection with the diaphragm
  • the main shell is mainly used to provide a bearing and support for the miniature sounding device.
  • the main shell and the backing ring can be made of different materials to meet the different performance requirements of the two.
  • the material of the backing ring can be a material that is easy to form a fusion connection with the diaphragm, such as a material with a low melting point and low strength; the material of the main housing can be a material with higher structural strength, hardness, and higher melting point.
  • the fixing portion and the backing ring are fixedly connected by laser melting.
  • the local and instantaneous high temperature generated by the laser can melt the surface of the backing ring and the fixed part of the diaphragm, and fuse the two together.
  • the fusion belt can be quickly cooled and the fixed part and the surface of the backing ring form an integral adhesion structure to achieve a good fixed connection and waterproof sealing effect.
  • the laser melting process has the characteristics of short heating time, accurate heating temperature, and concentrated heating area, which can not only meet the requirements of melting and connecting the fixed part and the backing ring, but also effectively reduce the risk of heating damage to other parts of the micro sound device.
  • the temperature of the high-temperature durability test is much lower than the temperature of the laser melting process, and the fixing part and the backing ring will not melt, which avoids the diaphragm and shell assembly The problem of cracking and detachment.
  • the temperature range of the laser melting is between 120 degrees Celsius and 450 degrees Celsius.
  • a material whose melting temperature is within the above-mentioned temperature range can be selected. In this way, when a laser is used to irradiate the area where the fixing part and the backing ring overlap, the temperature of the area rises to this area, and the fixing part and the backing ring can be melted.
  • the above-mentioned preferred temperature range can protect the other components of the micro-sound device and reduce the risk of being damaged by high temperature; on the other hand, it can ensure that the fixing part and the backing ring are melted and cooled as soon as possible, shortening the processing time, and fixing The part and the backing ring form a clear and neat melting zone.
  • the material of the backing ring may be at least one of polycarbonate plastic, polyphthalamide plastic, and polyether plastic with a thiophenyl group.
  • these materials have a proper melting temperature. When the backing ring is heated to the melting temperature of the above-mentioned materials used, other parts of the micro-sounding device are not easily affected by the temperature and cause problems such as damage and failure.
  • these materials have relatively excellent melting connectivity and relatively close melting temperatures with the diaphragm. Since the diaphragm needs to have good elastic deformation and vibration and sound performance, the material used for the diaphragm is limited by its acoustic performance.
  • the above-mentioned material preferably used for the backing ring can achieve a good fusion connection with the material of the diaphragm, and has a melting temperature similar to the material of the diaphragm.
  • the fusion fixing connection process Easier to implement and higher reliability.
  • the material of the diaphragm may be at least one of polyether ether ketone plastic, polyarylate plastic, and thermoplastic polyester rubber.
  • the diaphragm made of the above-mentioned materials can exhibit good acoustic performance, and the elastic deformation ability can meet the sound demand of the miniature sound emitting device. Further, the above-mentioned materials are easier to form a fusion fixed connection with other plastic materials, and the compatibility is higher.
  • the melting temperature of the two is controlled within 60 degrees Celsius, so that the optimal melting temperature can be selected.
  • the two can be melted at the same time, and there is no need to increase the temperature too high. While ensuring the reliability of the fusion connection, avoid the diaphragm, other areas of the housing assembly or other micro-sounding devices. Parts are affected by high temperature.
  • the material of the diaphragm can be selected as a light-transmitting material
  • the material of the backing ring can be selected as a light-absorbing material.
  • the laser needs to pass through the fixing part to apply heat radiation to the backing ring.
  • the material of the diaphragm is selected as a light-transmitting material, the laser light can pass through the fixing portion and directly hit the backing ring, which better heats up and melts the surface of the backing ring quickly.
  • the main housing located under the backing ring will not be irradiated by the laser, and the direct heat radiation received is greatly reduced.
  • This design method can provide temperature protection for structures other than the fixed part of the diaphragm and the backing ring, and reduce the possibility of direct laser heat radiation for other structures.
  • the fixing part and the backing ring covered by the fixing part can be rapidly heated and melted together to achieve the effect of rapid melting, and then rapidly cooled to form a fusion fixed connection.
  • the melting temperature of the main housing is at least 60 degrees Celsius higher than the melting temperature of the diaphragm and the backing ring.
  • the main housing is used to provide a stable and reliable structural support function for the micro sounding device, and it needs to have good structural stability.
  • the main casing needs to maintain good structural strength to avoid problems such as melting, softening and deformation of the main casing.
  • the material of the main housing can be selected as a material whose melting temperature is at least 60 degrees higher than the melting temperature of the diaphragm and backing ring to reduce the high temperature of the main housing. Impact.
  • the main housing can be made of metal material, and the backing ring is made of plastic material.
  • the main casing and the backing ring can be made by an integral injection molding process, so as to improve the reliability and sealing of the connection between the main casing and the backing ring.
  • the two materials can be injected into different areas of the injection mold through the injection molding process, so that the two materials are in contact and integrated at the butting surface, thereby achieving
  • the integral injection molding between the main shell and the backing ring effectively improves the reliability and sealing of the connection between the two.
  • the backing ring can be directly injection-molded on the surface of the main shell, thereby realizing the integral injection molding of the two and improving the gap between the two. Connection reliability and tightness.
  • main housing and the backing ring can also be fixedly connected by ultrasonic welding or the like.
  • the area where the fixing portion 12 and the backing ring 21 are fused and fixedly connected forms a melting band 10, where the fixing portion 12 and the backing ring 21 are integrated.
  • the melting belt 10 has a belt-like structure, and its width is the melting width.
  • the melting width ranges from 0.1 mm to 1.0 mm. If the melting width is less than 0.1mm, on the one hand, it will increase the difficulty of the melting and fixing connection process, and it is difficult for the processing technology to achieve smaller size heating. Waterproof reliability is reduced. On the contrary, if the melting width is greater than 1.0mm, on the one hand, when the fusion fixing connection process is performed, the heating range is too large, which may damage other areas in the micro-sound device.
  • the fusion fixing connection method is less than 1.0mm In this case, it can already meet the requirements of good waterproof performance, and there is no need to design the melting width too wide. Reducing the melting width can save space and reduce the volume of the micro-sounding device.
  • the melting width ranges from 0.15mm to 0.7mm.
  • the fixing portion 12 includes a flat portion 121 extending laterally outward from the folding ring portion.
  • the flat portion 121 forms a fixed connection with the backing ring 21 to meet the requirement that the diaphragm 1 can be fixedly connected to the backing ring 21.
  • the fixing portion 12 may also include other types of structures, which are not limited in the present invention.
  • the flat portion 121 and the backing ring 21 are fused and fixedly connected to form the fusion belt 10.
  • the flat portion 121 can be fused to the upper surface of the backing ring 21, and this connection form has a simple structure and high sealing reliability.
  • the melting width of the melting zone 10 formed by the flat portion 121 ranges from 0.1 mm to 0.7 mm.
  • the melting width refers to the width extending in the transverse direction.
  • the fixing portion 12 may further include a flange 122.
  • the fixing part includes a flat part 121 and a flange 122.
  • the flange 122 is a structure formed by extending longitudinally from the edge of the planar portion 121.
  • the flat portion 122 can be fused and fixedly connected with the upper surface of the backing ring 21. It can also adopt other forms of fixed connection such as bonding, which is not limited by the present invention.
  • the flange 122 extends to the side surface of the backing ring 21 and forms a fusion fixed connection with the side surface of the backing ring 21. In the embodiment shown in FIG.
  • the flat part 121 and the flange 122 can form a semi-enclosed wrapping connection relationship with the backing ring 21, the flat part 121 is fixed on the upper surface of the backing ring 21, and the folding The edge 122 is fixed on the side surface of the backing ring 21.
  • the fusion width refers to the width of the fusion belt 10 in the longitudinal direction.
  • the melting width ranges from 0.2 mm to 1.0 mm. If the fusion zone 10 formed by the flange 122 is too narrow, on the one hand, it will be difficult to effectively improve the waterproof performance of the micro-sound device. On the other hand, when the diaphragm is assembled on the housing assembly, it will be turned over. The edge 122 is prone to wrinkles and other problems, and it is difficult to lay flat on the side wall of the housing assembly.
  • the fusion zone 10 formed by the flanging 122 is too wide, on the one hand, it will increase the difficulty of forming the diaphragm. On the other hand, the flanging will occupy too much space.
  • the high temperature radiation The area is large, which may cause high-temperature damage to other parts of the micro-sounding device.
  • both the flat portion 121 and the flange 122 can be fused and fixedly connected with the housing assembly 2 to form an integral fusion belt 10.
  • the fusion zone may have an L-shaped cross section.
  • the melting width includes a transversely extending part and a longitudinally extending part, and the melting width is preferably 0.2mm-1.0mm.
  • the flange 122 can also be fused and fixedly connected with the backing ring 21 by means of laser melting. While performing the laser melting process on the fixing portion 12 and the backing ring 21, a laser can also be applied to the position of the flanging 122, so as to heat and melt the flanging 122 and the backing ring 21 covered by it.
  • the flange 122 and the backing ring 21 form a fusion fixed connection.
  • the advantage of this embodiment is that the flanging can be melted and fixed while the flat portion is melted and fixed, and the processing process is simple, and the required processing steps will not increase.
  • the fusion and fixed connection can be quickly realized by one-time laser melting, which can reduce the possibility of sound softening and deformation of the housing assembly and prevent abnormal structural stability.
  • the fixing portion 12 may only include a longitudinally extending flange 122, and the flange 122 is directly connected to the folding ring portion 11 and extends along the longitudinal direction.
  • the flange 122 is fused and fixedly connected with the side surface of the housing assembly 2 to form the fusion belt 10.
  • the fixing portion 12 occupies less lateral space of the micro-sounding device.
  • the backing ring 21 may have an inner edge, and the flange 122 extends downward to form a fusion fixed connection with the inner edge of the backing ring 21. This design can completely prevent the fixing part from extending to the outer edge of the micro-sounding device.
  • the flange 122 may also extend to the outer side wall of the backing ring 21, similar to the embodiment shown in FIG. 4, except that the plane portion 121 shown in FIG. 4 is eliminated.
  • the miniature sound generating device may also include components such as a voice coil 3, a centering support piece 4, and a magnetic circuit system, as shown in Figs. 3 and 4.
  • the magnetic circuit system is arranged in the housing assembly and is used to generate a magnetic field.
  • the voice coil 3 may be connected to the diaphragm or centering support piece 4.
  • the voice coil 3 is located inside the housing assembly, and is suspended in the magnetic field generated by the magnetic circuit system. When there is a sound signal in the voice coil, the voice coil can vibrate under the action of the magnetic field. Further, the voice coil can drive the voice coil and the centering piece to vibrate, and the voice coil vibrates to generate sound.
  • a part of the structure of the centering support piece may form a fixed connection with the fixing part, and the other part may form a connection with the inside of the area surrounded by the folding ring part through a cantilever.
  • a part of the structure of the centering brace is fixed in the miniature sounding device, and the other part can vibrate with the diaphragm and the voice coil.
  • the centering support piece can restrain the polarization and stabilize the vibration of the voice coil and the vibration of the diaphragm.
  • the present invention also provides an electronic product.
  • the electronic product may be a mobile phone, a computer, a headset, a VR headset, a smart watch, etc., which is not limited by the present invention.
  • the electronic product includes the main body of the electronic product and the above-mentioned micro-sounding device.
  • the micro-sounding device is arranged in the main body of the electronic product.
  • the micro-sounding device is electrically connected with the signal connector in the main body of the electronic product to conduct the sound signal into the micro-sounding device to realize vibration and sound.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)

Abstract

Disclosed are a miniature sound production device and an electronic product. The miniature sound production device comprises: a vibration assembly, comprising a diaphragm which has a surround portion and a fixing portion, with the surround portion extending in a ring shape, and the fixing portion being formed at the periphery of the surround portion in a surrounding manner; and a housing assembly, comprising a main housing and a backing ring, with the backing ring being connected to the main housing in a sealed manner, the diaphragm being arranged on the backing ring, the fixing portion being fixedly connected to the backing ring in a molten manner to form a molten zone, and the difference between the melting temperature of the backing ring and the melting temperature of the diaphragm being lower than 60°C. One technical effect of the present invention is to improve the waterproof performance between the diaphragm and the housing assembly.

Description

一种微型发声装置和电子产品A miniature sounding device and electronic product 技术领域Technical field
本发明属于电声换能技术领域,具体地,本发明涉及一种微型发声装置。The present invention belongs to the technical field of electroacoustic energy conversion. Specifically, the present invention relates to a miniature sound generating device.
背景技术Background technique
近年来,消费类电子产品的技术发展迅速,手机、平板电脑、无线耳机等电子产品广泛应用于消费者的生活中。相应地,生产厂商也对电子产品的性能进行了多方面的改进,以满足消费类电子产品在实际应用中所面临的越来越严苛的性能要求。In recent years, the technology of consumer electronic products has developed rapidly, and electronic products such as mobile phones, tablet computers, and wireless headsets are widely used in consumers' lives. Correspondingly, manufacturers have also improved the performance of electronic products in many ways to meet the increasingly stringent performance requirements faced by consumer electronic products in practical applications.
微型发声装置是消费类电子产品中的重要零部件,其用于将电信号转换成声音,在手机、耳机等消费类电子产品中是不可或缺的部件。为了使用复杂的应用环境,防水性能成为微型发声装置的一项重要指标。Micro-sounding devices are important components in consumer electronic products. They are used to convert electrical signals into sound. They are indispensable components in consumer electronic products such as mobile phones and earphones. In order to use complex application environments, waterproof performance has become an important indicator of micro-sounding devices.
现有的微型发声装置中,振膜往往通过涂胶粘接的方式与发声装置中的壳体或承载部件形成固定连接。但是,涂胶粘接并不能够满足防水性能的要求。一旦微型发声装置的振膜处渗漏液体,液体浸入微型发声装置的内部,其功能可靠性将受到极大的影响。In the existing miniature sounding device, the diaphragm is often fixedly connected with the housing or the bearing part of the sounding device by means of glue coating. However, adhesive bonding cannot meet the requirements of waterproof performance. Once the diaphragm of the micro sound device leaks liquid and the liquid is immersed in the inside of the micro sound device, its functional reliability will be greatly affected.
为了使微型发声装置能够达到防水性能的要求,有必要对微型发声装置进行改进。In order to make the micro sound device meet the requirements of waterproof performance, it is necessary to improve the micro sound device.
发明内容Summary of the invention
本发明的一个目的是提供一种改进的微型发声装置。An object of the present invention is to provide an improved miniature sound generating device.
根据本发明的第一方面,提供了一种微型发声装置,包括:According to the first aspect of the present invention, there is provided a miniature sound emitting device, including:
振动组件,所述振动组件包括振膜,所述振膜具有折环部和固定部,所述折环部呈环形延伸,所述固定部环绕形成于所述折环部的外围;A vibrating component, the vibrating component comprising a diaphragm, the diaphragm having a folded ring portion and a fixed portion, the folded ring portion extends in a ring shape, and the fixed portion is formed around the periphery of the folded ring portion;
壳体组件,所述壳体组件包括主壳体和垫环,所述垫环密封连接在所 述主壳体上,所述振膜设置在所述垫环上,所述固定部与所述垫环熔融固定连接以形熔融带,所述垫环的融化温度与所述振膜的融化温度的差小于60摄氏度。A housing assembly, the housing assembly includes a main housing and a backing ring, the backing ring is sealingly connected to the main housing, the diaphragm is arranged on the backing ring, and the fixing part is connected to the backing ring. The backing ring is fused and fixedly connected to form a melting band, and the difference between the melting temperature of the backing ring and the melting temperature of the diaphragm is less than 60 degrees Celsius.
可选地,所述固定部与所述垫环采用激光热熔的方式熔融固定连接。Optionally, the fixing portion and the backing ring are fused and fixedly connected by laser hot melting.
可选地,激光热熔的温度范围为120摄氏度-450摄氏度。Optionally, the temperature range of laser melting is 120 degrees Celsius-450 degrees Celsius.
可选地,所述垫环的材料为聚碳酸酯塑料、聚邻苯二甲酰胺塑料、具有苯硫基的聚醚塑料中的至少一种。Optionally, the material of the backing ring is at least one of polycarbonate plastic, polyphthalamide plastic, and polyether plastic with a thiophenyl group.
可选地,所述振膜的材料为聚醚醚酮塑料、聚芳酯塑料、热塑性聚酯橡胶中的至少一种。Optionally, the material of the diaphragm is at least one of polyether ether ketone plastic, polyarylate plastic, and thermoplastic polyester rubber.
可选地,所述主壳体的融化温度大于所述振膜和垫环的融化温度60摄氏度。Optionally, the melting temperature of the main housing is greater than the melting temperature of the diaphragm and the backing ring by 60 degrees Celsius.
可选地,所述垫环与所述主壳体经一体注塑工艺整体成型。Optionally, the backing ring and the main housing are integrally formed by an integral injection molding process.
可选地,所述固定部包括从所述折环部沿横向向外延伸的平面部,所述平面部与所述垫环固定连接。Optionally, the fixing portion includes a flat portion extending laterally outward from the folding ring portion, and the flat portion is fixedly connected to the backing ring.
可选地,所述固定部包括从所述平面部沿纵向延伸的翻边,所述翻边与所述垫环的侧面熔融固定连接。Optionally, the fixing portion includes a flange extending longitudinally from the plane portion, and the flange is fused and fixedly connected to the side surface of the backing ring.
本发明的另一方面还提供了一种电子产品,所述电子产品包括:Another aspect of the present invention also provides an electronic product, which includes:
电子产品主体;The main body of electronic products;
上述微型发声装置,所述微型发声装置设置在所述电子产品主体内,所述微型发声装置与所述电子产品主体内的信号连接件形成电连接。In the above-mentioned micro-sounding device, the micro-sounding device is arranged in the main body of the electronic product, and the micro-sounding device is electrically connected with the signal connector in the main body of the electronic product.
本发明的技术效果在于,微型发声装置中振膜与壳体组件之间的防水性能显著提高。The technical effect of the present invention is that the waterproof performance between the diaphragm and the housing assembly in the micro-sound device is significantly improved.
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.
附图说明Description of the drawings
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例,并且连同其说明一起用于解释本发明的原理。The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description are used to explain the principle of the present invention.
图1是本发明提供的微型发声装置的立体结构示意图;FIG. 1 is a schematic diagram of a three-dimensional structure of a miniature sound emitting device provided by the present invention;
图2是本发明提供的微型发声装置的部分部件爆炸示意图;Figure 2 is an exploded schematic diagram of some parts of the miniature sounding device provided by the present invention;
图3是本发明提供的微型发声装置的局部侧面剖视图;Figure 3 is a partial side cross-sectional view of the micro-sounding device provided by the present invention;
图4是本发明提供的另一种实施方式的微型发声装置的侧面剖视图;FIG. 4 is a side cross-sectional view of a micro-sounding device according to another embodiment of the present invention;
图5是本发明提供的另一种实施方式的微型发声装置的侧面剖视图。Fig. 5 is a side cross-sectional view of a micro-sounding device according to another embodiment of the present invention.
具体实施方式Detailed ways
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论,但在适当情况下,所述技术、方法和设备应当被视为说明书的一部分。The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
本发明提供了一种改进的微型发声装置,该微型发声装置包括振动组件和壳体组件。振动组件包括了振膜。所述振动组件为微型发声装置中能够振动、实现发声功能的部件,振动组件还可以包括音圈等部件,本发明不对此进行限制。The present invention provides an improved miniature sound emitting device, which comprises a vibration component and a shell component. The vibration component includes a diaphragm. The vibration component is a component capable of vibrating and realizing the sound production function in the miniature sound generating device, and the vibration component may also include components such as a voice coil, which is not limited by the present invention.
其中,振膜在振动过程中能够带动空气振动进而产生声音。如图1、2所示,所述振膜1具有折环部11和固定部12。所述折环部11呈弯折结构,其延伸成一环形结构。折环部11以及折环部11所环绕的区域是能够上下振动的部分。所述固定部12则环绕形成在所述折环部11的外围,所述固定部12是与微型发声装置的其它部件固定连接的部分,不能够振动。Among them, the diaphragm can drive the air to vibrate and generate sound during the vibration process. As shown in FIGS. 1 and 2, the diaphragm 1 has a folding ring portion 11 and a fixing portion 12. The folding ring portion 11 has a bent structure, which extends into an annular structure. The folded ring portion 11 and the area surrounded by the folded ring portion 11 are parts that can vibrate up and down. The fixing portion 12 is formed around the periphery of the folding ring portion 11, and the fixing portion 12 is a part that is fixedly connected to other components of the micro-sound device and cannot be vibrated.
所述壳体组件2用于承载所述振动组件以及微型发声装置中的其它部 件,所述壳体组件2包括了主壳体和垫环21。所述主壳体构成微型发声装置的主体框架,其内部可以容纳音圈、磁铁等部件。所述垫环21则固定在所述主壳体上,其用于与所述振膜1形成固定连接,用于承载振膜1。The housing assembly 2 is used to carry the vibration assembly and other components in the miniature sound generating device. The housing assembly 2 includes a main housing and a backing ring 21. The main casing constitutes the main frame of the micro-sound device, and its interior can accommodate components such as voice coils and magnets. The backing ring 21 is fixed on the main housing, and is used to form a fixed connection with the diaphragm 1 for supporting the diaphragm 1.
如图3所示,所述振膜1设置在所述垫环21上,其固定部12与垫环21以热熔的形式,熔融固定连接,进而形成熔融带10。固定部12与垫环21熔融固定呈一体结构,两者之间具有良好的连接紧密性、密封性。特别地,所述垫环采用了与振膜具有相近融化温度的材料,优选使得垫环的融化温度与振膜的融化温度之差小于60摄氏度。这样,在对振膜和垫环进行热熔固定连接时,容易对热熔温度进行控制,而且,无需将熔融温度提升至过高温度,避免对微型发声装置的其它部件造成损害。在将热熔温度上升到适当的温度时,垫环和固定部能够同时融化。As shown in FIG. 3, the diaphragm 1 is arranged on the backing ring 21, and the fixing portion 12 and the backing ring 21 are fused and fixedly connected in the form of hot fusion, thereby forming a melting band 10. The fixing portion 12 and the backing ring 21 are melted and fixed to form an integral structure, and the two have a good connection tightness and airtightness. In particular, the backing ring uses a material that has a melting temperature similar to that of the diaphragm, and it is preferable that the difference between the melting temperature of the backing ring and the melting temperature of the diaphragm is less than 60 degrees Celsius. In this way, when the diaphragm and the backing ring are hot-melt fixedly connected, it is easy to control the hot-melt temperature, and there is no need to raise the melting temperature to an excessively high temperature, avoiding damage to other components of the micro-sounding device. When the hot melt temperature is raised to an appropriate temperature, the backing ring and the fixing part can be melted at the same time.
通过熔融固定连接的密封连接工艺,振膜与壳体组件的防水效果得到显著提升,防水工艺所占用的空间相对较小,对防水胶的使用量也大幅下降,进而降低了微型发声装置的生产成本。另一方面,微型发声装置的结构可靠性也得到了提升,在后期的寿命实验中,振膜与壳体组件之间也不易出现开裂等问题,两者实现紧密、可靠的固定连接。Through the sealing connection process of fusion fixed connection, the waterproof effect of the diaphragm and the housing assembly is significantly improved, the space occupied by the waterproof process is relatively small, and the use of waterproof glue is also greatly reduced, thereby reducing the production of micro-sounding devices cost. On the other hand, the structural reliability of the micro-sounding device has also been improved. In the later life test, problems such as cracking between the diaphragm and the housing assembly are not easy to occur, and the two realize a tight and reliable fixed connection.
在本发明的技术方案中,所述壳体组件包括了主壳体和垫环两个结构。垫环主要用于与振膜实现熔融固定连接,主壳体则主要用于提供对微型发声装置的承载、支撑作用。主壳体和垫环可以采用不同的材料,进而满足两者不同的性能要求。垫环的材料可以选择易于与振膜形成熔融连接的材料,例如熔点低、强度低的材质;主壳体的材料可以选择具有较高结构强度、硬度、熔点较高的材料。In the technical solution of the present invention, the housing assembly includes two structures: a main housing and a backing ring. The backing ring is mainly used to realize a fusion and fixed connection with the diaphragm, and the main shell is mainly used to provide a bearing and support for the miniature sounding device. The main shell and the backing ring can be made of different materials to meet the different performance requirements of the two. The material of the backing ring can be a material that is easy to form a fusion connection with the diaphragm, such as a material with a low melting point and low strength; the material of the main housing can be a material with higher structural strength, hardness, and higher melting point.
可选地,所述固定部与所述垫环采用激光熔融的方式固定连接。利用激光产生的局部、瞬时的高温,能够将所述垫环的表面和振膜的固定部融化,使两者熔融在一起。取消激光照射后,熔融带能够快速冷却后固定部与垫环的表面形成一体粘连结构,实现良好的固定连接和防水密封效果。激光熔融工艺具有加热时间短、加热温度准确、升温区域集中的特点,既能够满足将固定部与垫环熔融连接,又能够有效降低微型发声装置的其它部件受到加热损坏的风险。另一方面,在对微型发声装置进行可靠性、寿 命测试时,高温耐久测试的温度远低于激光熔融工艺的温度,固定部和垫环不会发生熔融现象,避免了振膜与壳体组件开裂、脱离的问题。Optionally, the fixing portion and the backing ring are fixedly connected by laser melting. The local and instantaneous high temperature generated by the laser can melt the surface of the backing ring and the fixed part of the diaphragm, and fuse the two together. After the laser irradiation is canceled, the fusion belt can be quickly cooled and the fixed part and the surface of the backing ring form an integral adhesion structure to achieve a good fixed connection and waterproof sealing effect. The laser melting process has the characteristics of short heating time, accurate heating temperature, and concentrated heating area, which can not only meet the requirements of melting and connecting the fixed part and the backing ring, but also effectively reduce the risk of heating damage to other parts of the micro sound device. On the other hand, when testing the reliability and life of the micro-sound device, the temperature of the high-temperature durability test is much lower than the temperature of the laser melting process, and the fixing part and the backing ring will not melt, which avoids the diaphragm and shell assembly The problem of cracking and detachment.
可选地,所述激光熔融的温度范围为120摄氏度-450摄氏度之间。对于振膜以及垫环的材料,可以选取融化温度在上述温度范围区间内的材料。这样,在采用激光对固定部与垫环重叠的区域进行照射时,该区域温度上升到该区域后,固定部和垫环就能够融化。上述优选的温度范围一方面能够对微型发声装置的其它部件起到保护作用,降低被高温损坏的风险;另一方面可以保证固定部和垫环两者尽快熔融、冷却,缩短加工时间,使固定部与垫环形成边界清晰、整洁的熔融带。Optionally, the temperature range of the laser melting is between 120 degrees Celsius and 450 degrees Celsius. For the materials of the diaphragm and the backing ring, a material whose melting temperature is within the above-mentioned temperature range can be selected. In this way, when a laser is used to irradiate the area where the fixing part and the backing ring overlap, the temperature of the area rises to this area, and the fixing part and the backing ring can be melted. On the one hand, the above-mentioned preferred temperature range can protect the other components of the micro-sound device and reduce the risk of being damaged by high temperature; on the other hand, it can ensure that the fixing part and the backing ring are melted and cooled as soon as possible, shortening the processing time, and fixing The part and the backing ring form a clear and neat melting zone.
可选地,所述垫环的材料可以是聚碳酸酯塑料、聚邻苯二甲酰胺塑料、具有苯硫基的聚醚塑料中的至少一种。首先,这些材料具有适当的融化温度,在将垫环加热到所采用的上述材料的融化温度时,微型发声装置的其它部件不易受到温度影响发生损坏、失效等问题。第二,这些材料与振膜之间具有相对优秀的熔融连接性和相对接近的融化温度。由于振膜需要具有良好的弹性形变、振动发声的性能,因此振膜所采用的材料受到声学性能的限制。而上述优选用于垫环的材料能够与振膜的材料实现良好的熔融连接,与振膜的材料具有相近的融化温度,在采用上述材料制成所述垫环的情况下,熔融固定连接工艺更容易实现,可靠性更高。Optionally, the material of the backing ring may be at least one of polycarbonate plastic, polyphthalamide plastic, and polyether plastic with a thiophenyl group. First of all, these materials have a proper melting temperature. When the backing ring is heated to the melting temperature of the above-mentioned materials used, other parts of the micro-sounding device are not easily affected by the temperature and cause problems such as damage and failure. Second, these materials have relatively excellent melting connectivity and relatively close melting temperatures with the diaphragm. Since the diaphragm needs to have good elastic deformation and vibration and sound performance, the material used for the diaphragm is limited by its acoustic performance. The above-mentioned material preferably used for the backing ring can achieve a good fusion connection with the material of the diaphragm, and has a melting temperature similar to the material of the diaphragm. When the backing ring is made of the above-mentioned materials, the fusion fixing connection process Easier to implement and higher reliability.
可选地,所述振膜的材料可以是聚醚醚酮塑料、聚芳酯塑料、热塑性聚酯橡胶中的至少一种。上述材料所制成的振膜能够表现出良好的声学性能,弹性形变能力可以满足微型发声装置的发声需求。进一步地,上述材料更容易与其它塑料材料形成熔融固定连接,相容性更高。Optionally, the material of the diaphragm may be at least one of polyether ether ketone plastic, polyarylate plastic, and thermoplastic polyester rubber. The diaphragm made of the above-mentioned materials can exhibit good acoustic performance, and the elastic deformation ability can meet the sound demand of the miniature sound emitting device. Further, the above-mentioned materials are easier to form a fusion fixed connection with other plastic materials, and the compatibility is higher.
通过对垫环和振膜的材料进行选择,将两者的融化温度控制在60摄氏度范围以内,从而可以选择优化的熔融温度。在进行熔融连接工艺时,使两者可以同时融化,并且无需将温度过高的提升,在保证熔融连接的可靠性的同时,避免振膜、壳体组件的其它区域或微型发声装置中的其它部件受到高温影响。By selecting the materials of the backing ring and the diaphragm, the melting temperature of the two is controlled within 60 degrees Celsius, so that the optimal melting temperature can be selected. During the fusion connection process, the two can be melted at the same time, and there is no need to increase the temperature too high. While ensuring the reliability of the fusion connection, avoid the diaphragm, other areas of the housing assembly or other micro-sounding devices. Parts are affected by high temperature.
优选地,所述振膜的材料可以选择为透光材料,而所述垫环的材料则可以选择为吸光材料。在对固定部和垫环进行激光熔融固定连接工艺时, 由于固定部覆盖在垫环上,因此,激光需要透过所述固定部对所述垫环施加热辐射。而如果将振膜的材料选为透光材料,则激光能够透过所述固定部直射至所述垫环上,更好的使垫环的表面快速升温融化。进一步地,如果将垫环的材料选择为吸光材料,则位于垫环下方的主壳体就不会被激光照射,受到的直接热辐射大幅减小。这种设计方式能够对除了振膜的固定部和垫环之外的结构提供温度保护作用,降低其它结构受到直接激光热辐射的可能性。而且,通过设计透光的振膜,所述固定部和固定部所覆盖的垫环,能够一同快速升温融化,实现快速熔融的效果,进而快速冷却形成熔融固定连接。Preferably, the material of the diaphragm can be selected as a light-transmitting material, and the material of the backing ring can be selected as a light-absorbing material. When performing a laser fusion fixing connection process on the fixing part and the backing ring, since the fixing part is covered on the backing ring, the laser needs to pass through the fixing part to apply heat radiation to the backing ring. However, if the material of the diaphragm is selected as a light-transmitting material, the laser light can pass through the fixing portion and directly hit the backing ring, which better heats up and melts the surface of the backing ring quickly. Further, if the material of the backing ring is selected as a light-absorbing material, the main housing located under the backing ring will not be irradiated by the laser, and the direct heat radiation received is greatly reduced. This design method can provide temperature protection for structures other than the fixed part of the diaphragm and the backing ring, and reduce the possibility of direct laser heat radiation for other structures. Moreover, by designing a light-transmitting diaphragm, the fixing part and the backing ring covered by the fixing part can be rapidly heated and melted together to achieve the effect of rapid melting, and then rapidly cooled to form a fusion fixed connection.
优选地,所述主壳体的融化温度比所述振膜和垫环的融化温度至少高60摄氏度。所述主壳体用于为微型发声装置提供稳定、可靠的结构支撑作用,其需要具有良好的结构稳定性。优选地,在对振膜和垫环进行熔融固定连接加工工艺时,所述主壳体需要保持良好的结构强度,避免主壳体出现融化、软化变形等问题。通过对垫环、振膜以及主壳体的材料的选择,可以将主壳体的材料选为融化温度至少高于振膜和垫环的融化温度60度的材料,以减少主壳体受到高温的影响。Preferably, the melting temperature of the main housing is at least 60 degrees Celsius higher than the melting temperature of the diaphragm and the backing ring. The main housing is used to provide a stable and reliable structural support function for the micro sounding device, and it needs to have good structural stability. Preferably, when the diaphragm and the backing ring are fused, fixed and connected, the main casing needs to maintain good structural strength to avoid problems such as melting, softening and deformation of the main casing. Through the selection of the materials of the backing ring, the diaphragm and the main housing, the material of the main housing can be selected as a material whose melting temperature is at least 60 degrees higher than the melting temperature of the diaphragm and backing ring to reduce the high temperature of the main housing. Impact.
优选地,所述主壳体可以采用金属材料制成,所述垫环则采用塑料材料制成。Preferably, the main housing can be made of metal material, and the backing ring is made of plastic material.
可选地,所述主壳体和垫环可以采用一体注塑工艺整体成型的工艺制成,从而提高主壳体与垫环之间的连接可靠性和密封性。在主壳体和垫环均采用塑料材料制成的情况下,可以通过注射成型工艺,将两种材料分别注入注射模具的不同区域,使两种材料在对接面处接触融为一体,从而实现主壳体与垫环之间的一体注塑成型,有效提高两者之间的连接可靠性和密封性。在主壳体采用金属、垫环采用塑料材料的情况下,可以将所述垫环直接注塑成型在所述主壳体的表面上,从而实现两者的一体注塑成型,提高两者之间的连接可靠性和密封性。Optionally, the main casing and the backing ring can be made by an integral injection molding process, so as to improve the reliability and sealing of the connection between the main casing and the backing ring. In the case that both the main shell and the backing ring are made of plastic materials, the two materials can be injected into different areas of the injection mold through the injection molding process, so that the two materials are in contact and integrated at the butting surface, thereby achieving The integral injection molding between the main shell and the backing ring effectively improves the reliability and sealing of the connection between the two. When the main shell is made of metal and the backing ring is made of plastic material, the backing ring can be directly injection-molded on the surface of the main shell, thereby realizing the integral injection molding of the two and improving the gap between the two. Connection reliability and tightness.
除此之外,所述主壳体与垫环之间也可以采用超声焊接等方式实现固定连接。In addition, the main housing and the backing ring can also be fixedly connected by ultrasonic welding or the like.
如图3所示,所述固定部12与所述垫环21熔融固定连接的区域形成 熔融带10,在所述熔融带10处,固定部12与垫环21融为一体。所述熔融带10呈带状结构,其宽度为熔融宽度。优选地,所述熔融宽度的范围为0.1mm-1.0mm。熔融宽度若小于0.1mm,一方面会给熔融固定连接工艺提高难度,加工工艺难以实现更小尺寸的加热,另一方面,熔融宽度过小也会造成振膜1与壳体组件2之间的防水可靠性下降。相反的,如果熔融宽度大于1.0mm,一方面,进行熔融固定连接工艺时,需要加热的范围过大,有可能损伤微型发声装置中的其它区域,另一方面,熔融固定连接方式在小于1.0mm的情况下就已经能够达到良好的防水性能要求,无需将熔融宽度设计的过宽。减小熔融宽度能够节省空间、缩小微型发声装置的体积。优选地,熔融宽度的范围为0.15mm-0.7mm。As shown in Fig. 3, the area where the fixing portion 12 and the backing ring 21 are fused and fixedly connected forms a melting band 10, where the fixing portion 12 and the backing ring 21 are integrated. The melting belt 10 has a belt-like structure, and its width is the melting width. Preferably, the melting width ranges from 0.1 mm to 1.0 mm. If the melting width is less than 0.1mm, on the one hand, it will increase the difficulty of the melting and fixing connection process, and it is difficult for the processing technology to achieve smaller size heating. Waterproof reliability is reduced. On the contrary, if the melting width is greater than 1.0mm, on the one hand, when the fusion fixing connection process is performed, the heating range is too large, which may damage other areas in the micro-sound device. On the other hand, the fusion fixing connection method is less than 1.0mm In this case, it can already meet the requirements of good waterproof performance, and there is no need to design the melting width too wide. Reducing the melting width can save space and reduce the volume of the micro-sounding device. Preferably, the melting width ranges from 0.15mm to 0.7mm.
可选地,如图3所述,所述固定部12包括从所述折环部沿横向向外延伸的平面部121。所述平面部121与所述垫环21形成固定连接,以满足振膜1能够固定连接在垫环21上的需求。所述固定部12还可以包括其它形式的结构,本发明不对此进行限制。Optionally, as shown in FIG. 3, the fixing portion 12 includes a flat portion 121 extending laterally outward from the folding ring portion. The flat portion 121 forms a fixed connection with the backing ring 21 to meet the requirement that the diaphragm 1 can be fixedly connected to the backing ring 21. The fixing portion 12 may also include other types of structures, which are not limited in the present invention.
进一步可选地,在如图3所示的实施方式中,所述平面部121与所述垫环21熔融固定连接,以形成所述熔融带10。平面部121可以与垫环21的上表面熔融连接,这种连接形式结构简洁、密封可靠性高。优选地,平面部121所形成的熔融带10的熔融宽度的范围为0.1mm-0.7mm。该熔融宽度指的是沿横向延伸的宽度。采用图3所示的连接形式,熔融宽度在小于或等于0.7mm的情况下,就能够满足较高的防水、密封需求。Further optionally, in the embodiment shown in FIG. 3, the flat portion 121 and the backing ring 21 are fused and fixedly connected to form the fusion belt 10. The flat portion 121 can be fused to the upper surface of the backing ring 21, and this connection form has a simple structure and high sealing reliability. Preferably, the melting width of the melting zone 10 formed by the flat portion 121 ranges from 0.1 mm to 0.7 mm. The melting width refers to the width extending in the transverse direction. Using the connection form shown in Fig. 3, when the melting width is less than or equal to 0.7mm, higher waterproof and sealing requirements can be met.
可选地,所述固定部12还可以包括翻边122。在如图4所示的实施方式中,所述固定部包括了平面部121和翻边122。所述翻边122是从所述平面部121的边缘沿纵向延伸形成的结构。所述平面部122可以与所述垫环21的上表面实现熔融固定连接。其也可以采用粘接等其它固定连接的形式,本发明不对此进行限制。所述翻边122则向所述垫环21的侧面延伸,其与所述垫环21的侧面形成熔融固定连接。在图4所示的实施方式中,所述平面部121和翻边122能够对所述垫环21形成半包围式的包裹连接关系,平面部121固定在垫环21的上表面,所述翻边122固定在垫环21的侧表面。通过这种结构设计,振膜与壳体组件之间的连接可靠性和防水性 能得到显著提升。防水性能能够满足绝大多数微型发声装置的防水性能等级要求。Optionally, the fixing portion 12 may further include a flange 122. In the embodiment shown in FIG. 4, the fixing part includes a flat part 121 and a flange 122. The flange 122 is a structure formed by extending longitudinally from the edge of the planar portion 121. The flat portion 122 can be fused and fixedly connected with the upper surface of the backing ring 21. It can also adopt other forms of fixed connection such as bonding, which is not limited by the present invention. The flange 122 extends to the side surface of the backing ring 21 and forms a fusion fixed connection with the side surface of the backing ring 21. In the embodiment shown in FIG. 4, the flat part 121 and the flange 122 can form a semi-enclosed wrapping connection relationship with the backing ring 21, the flat part 121 is fixed on the upper surface of the backing ring 21, and the folding The edge 122 is fixed on the side surface of the backing ring 21. Through this structural design, the connection reliability and waterproof performance between the diaphragm and the housing assembly have been significantly improved. The waterproof performance can meet the waterproof performance level requirements of most miniature sound generating devices.
在仅以所述翻边122与所述垫环21形成所述熔融带10的实施方式中,所述熔融宽度指熔融带10沿纵向的宽度。优选地,所述熔融宽度的范围为0.2mm-1.0mm。如果翻边122所形成的熔融带10的过窄,一方面难以有效的对微型发声装置的防水性能起到实质性的提高,另一方面,在将振膜装配于壳体组件上时,翻边122容易出现褶皱等问题,难以平铺与壳体组件的侧壁上。相反的,如果翻边122所形成的熔融带10的过宽,一方面会增加振膜的成型难度,另一方面,翻边占用的空间过大,在进行熔融固定连接的工艺时,高温辐射的面积较大,有可能对微型发声装置的其它零部件造成高温损伤。In the embodiment in which the fusion belt 10 is formed only by the flange 122 and the backing ring 21, the fusion width refers to the width of the fusion belt 10 in the longitudinal direction. Preferably, the melting width ranges from 0.2 mm to 1.0 mm. If the fusion zone 10 formed by the flange 122 is too narrow, on the one hand, it will be difficult to effectively improve the waterproof performance of the micro-sound device. On the other hand, when the diaphragm is assembled on the housing assembly, it will be turned over. The edge 122 is prone to wrinkles and other problems, and it is difficult to lay flat on the side wall of the housing assembly. On the contrary, if the fusion zone 10 formed by the flanging 122 is too wide, on the one hand, it will increase the difficulty of forming the diaphragm. On the other hand, the flanging will occupy too much space. During the process of fusing and fixing the connection, the high temperature radiation The area is large, which may cause high-temperature damage to other parts of the micro-sounding device.
优选地,在如图4所示的实施方式中,所述平面部121和翻边122均可以与所述壳体组件2熔融固定连接,形成一个整体的熔融带10。在这种实施方式中,所述熔融带的截面可以呈L型。所述熔融宽度包括了横向延伸的部分和纵向延伸的部分,熔融宽度优选为0.2mm-1.0mm。Preferably, in the embodiment shown in FIG. 4, both the flat portion 121 and the flange 122 can be fused and fixedly connected with the housing assembly 2 to form an integral fusion belt 10. In this embodiment, the fusion zone may have an L-shaped cross section. The melting width includes a transversely extending part and a longitudinally extending part, and the melting width is preferably 0.2mm-1.0mm.
优选地,所述翻边122也可以通过激光熔融的方式与所述垫环21形成熔融固定连接。在对所述固定部12和垫环21进行激光熔融工艺的同时,也可以对所述翻边122的位置处施加激光,从而将翻边122以及其所覆盖的垫环21加热融化,进而使翻边122与垫环21形成熔融固定连接。这种实施方式的优点在于能够在对平面部进行熔融固定的同时实现翻边的熔融固定,加工工艺的过程简单,所需的加工步骤不会增加。而且,由于平面部和翻边是包围在垫环的边角位置,通过一次激光熔融快速实现熔融固定连接,能够降低壳体组件发声软化、变形的可能性,防止结构稳定性出现异常。Preferably, the flange 122 can also be fused and fixedly connected with the backing ring 21 by means of laser melting. While performing the laser melting process on the fixing portion 12 and the backing ring 21, a laser can also be applied to the position of the flanging 122, so as to heat and melt the flanging 122 and the backing ring 21 covered by it. The flange 122 and the backing ring 21 form a fusion fixed connection. The advantage of this embodiment is that the flanging can be melted and fixed while the flat portion is melted and fixed, and the processing process is simple, and the required processing steps will not increase. Moreover, since the flat portion and the flange are surrounded by the corners of the backing ring, the fusion and fixed connection can be quickly realized by one-time laser melting, which can reduce the possibility of sound softening and deformation of the housing assembly and prevent abnormal structural stability.
在另一种实施方式中,如图5所示,所述固定部12可以只包括纵向延伸的翻边122,翻边122直接连接在所述折环部11上,并沿着纵向延伸。翻边122与所述壳体组件2的侧面熔融固定连接,以形成所述熔融带10。这种实施方式的优点在于,所述固定部12占用的微型发声装置的横向空间更少。可选地,如图5所示,垫环21可以具有内侧沿,所述翻边122向下 延伸,与垫环21的内侧沿形成熔融固定连接。这样设计可以完全使固定部不延伸至微型发声装置的外侧边缘。可选地,在另一种实施方式中,翻边122也可以延伸至垫环21的外侧壁处,类似于图4所示的实施方式,取消图4所示的平面部121。In another embodiment, as shown in FIG. 5, the fixing portion 12 may only include a longitudinally extending flange 122, and the flange 122 is directly connected to the folding ring portion 11 and extends along the longitudinal direction. The flange 122 is fused and fixedly connected with the side surface of the housing assembly 2 to form the fusion belt 10. The advantage of this embodiment is that the fixed portion 12 occupies less lateral space of the micro-sounding device. Optionally, as shown in FIG. 5, the backing ring 21 may have an inner edge, and the flange 122 extends downward to form a fusion fixed connection with the inner edge of the backing ring 21. This design can completely prevent the fixing part from extending to the outer edge of the micro-sounding device. Optionally, in another embodiment, the flange 122 may also extend to the outer side wall of the backing ring 21, similar to the embodiment shown in FIG. 4, except that the plane portion 121 shown in FIG. 4 is eliminated.
所述微型发声装置中还可以包括音圈3、定心支片4、磁路系统等部件,如图3、4所示。所述磁路系统设置在所述壳体组件内,其用于产生磁场。所述音圈3可以连接在所述振膜或定心支片4上。音圈3位于壳体组件内部,其悬于所述磁路系统产生的磁场内。当音圈内通入有声音信号时,音圈在磁场的作用下能够产生振动。进一步地,音圈能够带动音圈和定心支片产生振动,音圈振动产生声音。所述定心支片的一部分结构可以与所述固定部形成固定连接,另一部分通过悬臂与所述折环部所环绕的区域内部形成连接。这样,定心支片的一部分结构固定在微型发声装置中,另一部分能够随着振膜、音圈发生振动。定心支片能够对音圈、振膜的振动起到抑制偏振、稳定振动的作用。The miniature sound generating device may also include components such as a voice coil 3, a centering support piece 4, and a magnetic circuit system, as shown in Figs. 3 and 4. The magnetic circuit system is arranged in the housing assembly and is used to generate a magnetic field. The voice coil 3 may be connected to the diaphragm or centering support piece 4. The voice coil 3 is located inside the housing assembly, and is suspended in the magnetic field generated by the magnetic circuit system. When there is a sound signal in the voice coil, the voice coil can vibrate under the action of the magnetic field. Further, the voice coil can drive the voice coil and the centering piece to vibrate, and the voice coil vibrates to generate sound. A part of the structure of the centering support piece may form a fixed connection with the fixing part, and the other part may form a connection with the inside of the area surrounded by the folding ring part through a cantilever. In this way, a part of the structure of the centering brace is fixed in the miniature sounding device, and the other part can vibrate with the diaphragm and the voice coil. The centering support piece can restrain the polarization and stabilize the vibration of the voice coil and the vibration of the diaphragm.
本发明还提供了一种电子产品,该电子产品,可以是手机、电脑、耳机、VR头戴设备、智能手表等,本发明不对此进行限制。电子产品包括了电子产品主体和上述微型发声装置。所述微型发声装置设置所述电子产品主体内。微型发声装置与所述电子产品主体内的信号连接件形成电连接,以将声音信号导通到微型发声装置内,实现振动发声。The present invention also provides an electronic product. The electronic product may be a mobile phone, a computer, a headset, a VR headset, a smart watch, etc., which is not limited by the present invention. The electronic product includes the main body of the electronic product and the above-mentioned micro-sounding device. The micro-sounding device is arranged in the main body of the electronic product. The micro-sounding device is electrically connected with the signal connector in the main body of the electronic product to conduct the sound signal into the micro-sounding device to realize vibration and sound.
虽然已经通过例子对本发明的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上例子仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (10)

  1. 一种微型发声装置,其特征在于,包括:A miniature sounding device, characterized in that it comprises:
    振动组件,所述振动组件包括振膜,所述振膜具有折环部和固定部,所述折环部呈环形延伸,所述固定部环绕形成于所述折环部的外围;A vibrating component, the vibrating component comprising a diaphragm, the diaphragm having a folded ring portion and a fixed portion, the folded ring portion extends in a ring shape, and the fixed portion is formed around the periphery of the folded ring portion;
    壳体组件,所述壳体组件包括主壳体和垫环,所述垫环密封连接在所述主壳体上,所述振膜设置在所述垫环上,所述固定部与所述垫环熔融固定连接以形熔融带,所述垫环的融化温度与所述振膜的融化温度的差小于60摄氏度。A housing assembly, the housing assembly includes a main housing and a backing ring, the backing ring is sealingly connected to the main housing, the diaphragm is arranged on the backing ring, and the fixing part is connected to the backing ring. The backing ring is fused and fixedly connected to form a melting band, and the difference between the melting temperature of the backing ring and the melting temperature of the diaphragm is less than 60 degrees Celsius.
  2. 根据权利要求1所述的微型发声装置,其特征在于,所述固定部与所述垫环采用激光热熔的方式熔融固定连接。The miniature sounding device according to claim 1, wherein the fixing part and the backing ring are fused and fixedly connected by laser hot melting.
  3. 根据权利要求2所述的微型发声装置,其特征在于,激光热熔的温度范围为120摄氏度-450摄氏度。The miniature sound emitting device of claim 2, wherein the temperature range of the laser melting is 120 degrees Celsius to 450 degrees Celsius.
  4. 根据权利要求1所述的微型发声装置,其特征在于,所述垫环的材料为聚碳酸酯塑料、聚邻苯二甲酰胺塑料、具有苯硫基的聚醚塑料中的至少一种。The miniature sound emitting device according to claim 1, wherein the material of the backing ring is at least one of polycarbonate plastic, polyphthalamide plastic, and polyether plastic with phenylsulfide groups.
  5. 根据权利要求1所述的微型发声装置,其特征在于,所述振膜的材料为聚醚醚酮塑料、聚芳酯塑料、热塑性聚酯橡胶中的至少一种。The miniature sound emitting device according to claim 1, wherein the material of the diaphragm is at least one of polyether ether ketone plastic, polyarylate plastic, and thermoplastic polyester rubber.
  6. 根据权利要求1所述的微型发声装置,其特征在于,所述主壳体的融化温度大于所述振膜和垫环的融化温度60摄氏度。The miniature sound emitting device of claim 1, wherein the melting temperature of the main housing is greater than the melting temperature of the diaphragm and the backing ring by 60 degrees Celsius.
  7. 根据权利要求1所述的微型发声装置,其特征在于,所述垫环与所述主壳体经一体注塑工艺整体成型。The miniature sound emitting device of claim 1, wherein the backing ring and the main housing are integrally formed by an integral injection molding process.
  8. 根据权利要求1所述的微型发声装置,其特征在于,所述固定部包括从所述折环部沿横向向外延伸的平面部,所述平面部与所述垫环固定连接。The miniature sound emitting device according to claim 1, wherein the fixing part comprises a flat part extending outwardly from the folding ring part in a lateral direction, and the flat part is fixedly connected to the backing ring.
  9. 根据权利要求8所述的微型发声装置,其特征在于,所述固定部包括从所述平面部沿纵向延伸的翻边,所述翻边与所述垫环的侧面熔融固定连接。8. The miniature sound emitting device according to claim 8, wherein the fixing part comprises a flange extending longitudinally from the plane part, and the flange is fused and fixedly connected to the side surface of the backing ring.
  10. 一种电子产品,其特征在于,包括:An electronic product, characterized in that it includes:
    电子产品主体;The main body of electronic products;
    权利要求1-9任意之一所述的微型发声装置,所述微型发声装置设置在所述电子产品主体内,所述微型发声装置与所述电子产品主体内的信号连接件形成电连接。The micro-sounding device according to any one of claims 1-9, the micro-sounding device is arranged in the main body of the electronic product, and the micro-sounding device forms an electrical connection with the signal connector in the main body of the electronic product.
PCT/CN2020/099489 2019-11-12 2020-06-30 Miniature sound production device and electronic product WO2021093339A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911102101.9A CN112866884A (en) 2019-11-12 2019-11-12 Miniature sound generating device and electronic product
CN201911102101.9 2019-11-12

Publications (1)

Publication Number Publication Date
WO2021093339A1 true WO2021093339A1 (en) 2021-05-20

Family

ID=75911846

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/099489 WO2021093339A1 (en) 2019-11-12 2020-06-30 Miniature sound production device and electronic product

Country Status (2)

Country Link
CN (1) CN112866884A (en)
WO (1) WO2021093339A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108806A1 (en) * 2001-02-09 2002-08-15 Meiloon Industrial Co., Ltd. Vibrating diaphragm of false speaker structure
CN102905203A (en) * 2012-09-28 2013-01-30 歌尔声学股份有限公司 Loudspeaker device
CN203761580U (en) * 2014-03-05 2014-08-06 美特科技(苏州)有限公司 Loudspeaker
CN206413186U (en) * 2016-12-29 2017-08-15 歌尔科技有限公司 Sound-producing device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3891414B2 (en) * 2002-07-05 2007-03-14 シチズン電子株式会社 Electroacoustic transducer manufacturing method
JP5363944B2 (en) * 2009-10-28 2013-12-11 スタンレー電気株式会社 Manufacturing method of resin molded products
JP5436937B2 (en) * 2009-05-29 2014-03-05 スタンレー電気株式会社 Manufacturing method of resin molded products
JP5022416B2 (en) * 2009-08-31 2012-09-12 パナソニック株式会社 Electronics
JP5471435B2 (en) * 2009-12-28 2014-04-16 パナソニック株式会社 Speaker diaphragm, speaker using the same, and portable terminal device
CN204498359U (en) * 2015-03-21 2015-07-22 歌尔声学股份有限公司 Vibrating diaphragm assembly and be provided with the loud speaker of this vibrating diaphragm assembly
CN205726379U (en) * 2016-03-09 2016-11-23 歌尔股份有限公司 Loudspeaker monomer
JP6783548B2 (en) * 2016-05-18 2020-11-11 西遠ゴム工業株式会社 Grommets and their manufacturing methods, wire harnesses with grommets and their manufacturing methods, and grommet assembly parts sets
CN206042358U (en) * 2016-09-30 2017-03-22 歌尔股份有限公司 Miniature sounder
CN106911988B (en) * 2017-03-31 2023-09-29 歌尔股份有限公司 Vibrating diaphragm, loudspeaker and assembling method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020108806A1 (en) * 2001-02-09 2002-08-15 Meiloon Industrial Co., Ltd. Vibrating diaphragm of false speaker structure
CN102905203A (en) * 2012-09-28 2013-01-30 歌尔声学股份有限公司 Loudspeaker device
CN203761580U (en) * 2014-03-05 2014-08-06 美特科技(苏州)有限公司 Loudspeaker
CN206413186U (en) * 2016-12-29 2017-08-15 歌尔科技有限公司 Sound-producing device

Also Published As

Publication number Publication date
CN112866884A (en) 2021-05-28

Similar Documents

Publication Publication Date Title
TWI548261B (en) Speaker magnet assembly with included spider
CN105611463B (en) A kind of manufacturing method of vibrating diaphragm and vibrating diaphragm
CN207665190U (en) Loud speaker module and electronic equipment
KR101748344B1 (en) Loudspeaker module
CN205726379U (en) Loudspeaker monomer
JP6486014B2 (en) Gas permeable member and manufacturing method thereof
WO2016206328A1 (en) Mini loudspeaker
JP2015131424A (en) Resin joined body, and method for joining resin member
CN206413186U (en) Sound-producing device
WO2016033912A1 (en) Shielding case using moving iron unit and used for speaker
WO2021093339A1 (en) Miniature sound production device and electronic product
WO2021093338A1 (en) Miniature sound-generating device and electronic product
GB2521918A (en) Apparatus and method for providing a seal around a perimeter of a bi-material enclosure
JPS5996636A (en) Electron tube and method of producing same
CN204615781U (en) A kind of quartz-crystal resonator
CN211089950U (en) Miniature sound generating device and electronic product
JP2010251286A (en) Modularized keyboard and method of manufacturing the same
CN204559873U (en) A kind of loadspeaker structure
CN209314068U (en) A kind of assembly connecting structure of loudspeaker
CN110248295B (en) Sound production device and electronic equipment
CN110996232B (en) Sound generating device monomer and electronic equipment
CN109040925B (en) Speaker and earphone
CN109218941B (en) Sound generating device and electronic equipment
CN206100435U (en) Speaker module casing, speaker module and sound generating mechanism
WO2015159518A1 (en) Electronic device and manufacturing method for case therefor

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20886630

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 20886630

Country of ref document: EP

Kind code of ref document: A1