WO2021085164A1

WO2021085164A1 - Light source device and lighting device

Info

Publication number: WO2021085164A1
Application number: PCT/JP2020/038971
Authority: WO
Inventors: 雅洋村山; 秀和川西; 簗嶋　克典
Original assignee: ソニー株式会社
Priority date: 2019-10-31
Filing date: 2020-10-15
Publication date: 2021-05-06

Abstract

A light source device according to an embodiment of the present disclosure comprises: a substrate; a fluorescent member that has a bottom section joined to the substrate; a semiconductor light emitting element that is mounted on the substrate and emits excitation light to a side surface of the fluorescent member; and a package member that seals the fluorescent member and the semiconductor light emitting element and has, in an upper surface thereof, an opening that exposes the fluorescent member.

Description

Light source device and lighting device

The present technology relates to, for example, a light source device using a semiconductor laser element and a phosphor, and a lighting device equipped with the light source device.

For example, Patent Document 1 discloses a light source device that easily removes heat generated by a semiconductor laser by surface-contacting the semiconductor laser and a base portion on a substrate made of a material having excellent thermal conductivity.

Japanese Unexamined Patent Publication No. 2013-254889

By the way, in a light source device such as the above light source device, which irradiates a phosphor with light incident from a semiconductor laser and extracts fluorescence of different wavelengths, improvement in power light conversion efficiency is required.

It is desirable to provide a light source device and a lighting device that can improve the power-light conversion efficiency.

The light source device according to the embodiment of the present disclosure includes a substrate, a fluorescent member whose bottom is bonded to the substrate, a semiconductor light emitting element mounted on the substrate and irradiating excitation light on the side surface of the fluorescent member, a fluorescent member, and a semiconductor. It is provided with a package member that seals the light emitting element and has an opening on the upper surface where the fluorescent member is exposed.

The lighting device according to the embodiment of the present disclosure includes the light source device of the above-described embodiment.

In the light source device according to the embodiment and the lighting device according to the embodiment of the present disclosure, the heat exhaust efficiency of the heat generated inside the fluorescent member due to the irradiation of the excitation light is improved by joining the bottom surface of the fluorescent member to the substrate. To do.

It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on embodiment of this disclosure. It is a plane schematic diagram of the light source apparatus shown in FIG. FIG. 5 is a schematic cross-sectional view showing an example of a schematic configuration of a lighting device including the light source device shown in FIG. It is an exploded perspective view which shows the typical structure of the lighting apparatus shown in FIG. It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on the modification 1 of this disclosure. It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on the modification 2 of this disclosure. It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on the modification 3 of this disclosure. It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on the modification 4 of this disclosure. It is sectional drawing which shows the other example of the structure of the light source apparatus which concerns on the modification 4 of this disclosure. It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on the modification 5 of this disclosure. It is sectional drawing which shows an example of the structure of the light source apparatus which concerns on the modification 6 of this disclosure. It is a schematic diagram which shows an example of the planar shape of the fluorescent member and the arrangement of the semiconductor laser as the modification 7 of this disclosure. It is a schematic diagram which shows another example of the planar shape of the fluorescent member and the arrangement of the semiconductor laser as the modification 7 of this disclosure. It is a schematic diagram which shows another example of the planar shape of the fluorescent member and the arrangement of the semiconductor laser as the modification 7 of this disclosure. It is an exploded perspective view which shows an example of the structure of the lighting apparatus which concerns on the modification 8 of this disclosure. It is a figure which shows an example of the structure of the projection type display device to which the light source device shown in FIG.

Hereinafter, one embodiment in the present disclosure will be described in detail with reference to the drawings. The following description is a specific example of the present disclosure, and the present disclosure is not limited to the following aspects. Further, the present disclosure is not limited to the arrangement, dimensions, dimensional ratio, etc. of each component shown in each figure. The order of explanation is as follows.
1. 1. Embodiment (Example of a light source device in which the bottom surface of a fluorescent member is joined to a substrate and the upper surface is exposed from a package member)
1-1. Configuration of light source device 1-2. Configuration of lighting equipment 1-3. Action / effect 2. Modification example 2-1. Modification 1 (Example in which a mirror that reflects fluorescence and excitation light is provided on the side surface of the fluorescent member)
2-2. Modification 2 (Example in which a diffusion mechanism is provided on the side surface of the fluorescent member)
2-3. Modification 3 (Example in which a mirror is further provided on the bottom surface of the fluorescent member)
2-4. Deformation example 4 (Example in which a part of the side surface of the fluorescent member is an inclined surface)
2-5. Modification 5 (Example in which the fluorescent member is formed by using two different types of phosphors)
2-6. Modification 6 (Example in which a light confining member is arranged between the semiconductor laser element and the fluorescent member)
2-7. Deformation example 7 (another example of the planar shape of the fluorescent member)
2-8. Modification 8 (another example of a lighting device)
3. 3. Application example (example of projection type display device)

<1. Embodiment>
FIG. 1 schematically shows an example of a cross-sectional configuration of a light source device (light source device 1) according to an embodiment of the present disclosure. FIG. 2 schematically shows an example of the planar configuration of the light source device 1 shown in FIG. Note that FIG. 1 shows a cross section taken along the line II shown in FIG. The light source device 1 is a packaged surface mount device (SMD). The light source device 1 includes a semiconductor laser element 11, a fluorescent member 12, a substrate 21, and a package member 22. The semiconductor laser element 11 and the fluorescent member 12 are mounted on the substrate 21, for example, and covered with the package member 22. The substrate 21 and the package member 22 are joined to each other via, for example, solder, whereby the semiconductor laser element 11 and the fluorescent member 12 are hermetically sealed.

(1-1. Configuration of light source device)
The light source device 1 of the present embodiment has a semiconductor laser element 11 and a fluorescent member 12, and is sealed in a package 20. The semiconductor laser element 11 is mounted on the substrate 21 via, for example, a submount 13. The fluorescent member 12 has, for example, a columnar shape, at least a part of the side surface thereof is covered with a mirror 14, and the bottom surface thereof is joined to the substrate 21. The package 20 includes a substrate 21 and a package member 22. The package member 22 has a recess 22C that opens downward. The package 20 has an airtight storage space X by joining the upper surface 21S1 of the substrate 21 and the frame-shaped lower surface 22S2 surrounding the recess 22C of the package member 22 with, for example, solder. The semiconductor laser element 11, the fluorescent member 12, and the submount 13 are housed in the accommodation space X. The package member 22 further has an opening 22H on the upper surface 22S1. At least a part of the side surface of the opening 22H is in contact with the fluorescent member 12 (more precisely, the mirror 14 provided on the side surface of the fluorescent member 12), and the upper surface of the fluorescent member 12 is exposed in the opening 22H. There is. Hereinafter, each component constituting the light source device 1 will be described in detail.

The semiconductor laser device 11 is a specific example of the "semiconductor light emitting device" of the present disclosure, and includes, for example, a gallium nitride (GaN) -based semiconductor material, such as light in the blue wavelength region, specifically, 430 nm. It emits light having a wavelength of 480 nm or less. The semiconductor laser device 11 may include, for example, a semiconductor material such as gallium arsenide (GaAs). The semiconductor laser element 11 is arranged so that the emission surface faces the side surface of the fluorescent member 12, which will be described later.

The fluorescent member 12 absorbs the light emitted from the semiconductor laser element 11 as the excitation light EL, and emits a fluorescent FL having a wavelength different from that of the excitation light EL. The fluorescent member 12 can be formed by using, for example, a single crystal phosphor. The fluorescent member 12 is arranged on the optical path of the excitation light EL emitted from the semiconductor laser element 11. The fluorescent member 12 is, for example, a columnar structure having a rectangular planar shape (cross-sectional shape in the XY planar direction), and is arranged to face the emission surface of the semiconductor laser element 11 so that the side surface is irradiated with the excitation light EL. ing. The bottom surface of the fluorescent member 12 is joined to the substrate 21 as described above. The fluorescent member 12 and the substrate 21 are joined by using, for example, silver (Ag) paste or solder. In addition, the fluorescent member 12 and the substrate 21 may be adhered to each other by using a resin. In that case, it is preferable to disperse fine particles having excellent thermal conductivity such as _{aluminum oxide (Al 2} O _{3) in the resin.} As a result, the heat generated inside the fluorescent member 12 due to the irradiation of the excitation light EL is easily dissipated through the substrate 21.

The fluorescent member 12 is, for example, a phosphor that is excited by a blue laser beam having a wavelength in the blue wavelength region (for example, 430 nm to 480 nm) and emits yellow fluorescence (light in the wavelength band between the red wavelength region and the green wavelength region). Is used. Examples of such a phosphor include a YAG (yttrium aluminum garnet) -based material and a LAG (lutetium aluminum garnet) -based material.

The submount 13 is for mounting the semiconductor laser element 11 on the substrate 21, and is provided between the semiconductor laser element 11 and the substrate 21. The submount 13 is, for example, a plate-shaped member, and the incident position (height) of the excitation light EL with respect to the side surface of the fluorescent member 12 is adjusted according to the thickness of the submount 13 (the size in the Z direction in FIG. 1). Can be done. As a result, the incident light rate of the excitation light EL with respect to the fluorescent member 12 is improved. The submount 13 is preferably formed using a material having excellent thermal conductivity such as aluminum nitride (AlN), silicon carbide (SiC), silicon (Si) or copper (Cu). This makes it possible to easily remove the heat generated in the semiconductor laser element 11.

The semiconductor laser device 11 is eutectic bonded to the submount 13 by, for example, AuSn (gold-tin), and the submount 13 is eutectic bonded to the substrate 21 by, for example, AuSn. The submount 13 may be bonded to the substrate 21 with, for example, silver (Ag) paste, sintered gold (Au), sintered silver (Ag), or the like.

The mirror 14 is provided on the side surface of the fluorescent member 12 to reflect the fluorescent FL emitted by the fluorescent member 12 and confine it inside the fluorescent member 12, and is the "first reflective member" of the present disclosure. Corresponds to a specific example. The mirror 14 can be formed, for example, by using a reflective film such as a dielectric multilayer film designed to efficiently reflect the fluorescent FL. In addition, it may be formed by using a metal film having light reflectivity. When the metal film is used, it is formed on the entire side surface excluding the irradiation region irradiated with the excitation light EL so as not to interfere with the incident of the excitation light EL.

The substrate 21 is, for example, a plate-shaped member having a rectangular planar shape. The substrate 21 is preferably constructed using a material having excellent thermal conductivity. As a result, the heat generated in the semiconductor laser element 11 and the fluorescent member 12 can be efficiently exhausted. The substrate 21 is made of, for example, aluminum nitride (AlN), silicon carbide (SiC), silicon (Si) or copper (Cu).

The package member 22 is, for example, a rectangular parallelepiped having an upper surface 22S1 facing the surface and a lower surface 22S2 joined to the substrate 21 and having a recess 22C opening in the lower surface 22S2. The package member 22 forms an airtight storage space X by joining the frame-shaped lower surface 22S2 surrounding the recess 22C and the upper surface 21S1 of the substrate 21 via, for example, solder. An opening 22H is formed on the upper surface 22S1 of the package member 22 at a position facing the fluorescent member 12. The opening 22H has substantially the same shape as the cross-sectional shape of the fluorescent member 12 in the XY plane direction, for example. As described above, the side surface of the fluorescent member 12 (to be exact, the mirror 14) is in contact with at least a part of the side surface of the opening 22H. That is, the upper surface of the fluorescent member 12 is exposed in the opening 22H, and forms the same surface as the upper surface 22S1 of the package member 22, for example. The inside of the accommodation space X is _{replaced by, for example, nitrogen (N 2} ) or dry air.

The package member 22 is made of, for example, glass or ceramic, and contains, for example, a sintered body such as aluminum nitride (AlN), aluminum oxide (alumina), or silicon carbide (SiC).

As described above, the substrate 21 and the package member 22 are joined by using, for example, solder. Specifically, a base layer is formed on each of the joint portion of the upper surface 21S1 of the substrate 21 with the package member 22 and the joint portion of the lower surface 22S2 of the package member 22 with the substrate 21, and these base layers are formed. The substrate 21 and the package member 22 are joined to each other via solder. The base layer can be formed by using, for example, chromium (Cr), titanium (Ti), gold (Au), or the like. As the solder, for example, SnAgCu (tin-silver-copper) -based solder or (gold-tin) -based, Sn (tin) -based or In (indium) -based solder can be used.

In the light source device 1, for example, light is extracted as follows. The light emitted from the semiconductor laser device 11 (for example, light in the blue wavelength region, excitation light EL) is incident on the side surface of the fluorescent member 12. The excitation light EL incident on the side surface of the fluorescent member 12 excites the phosphor constituting the fluorescent member 12. The phosphor excited by the excitation light EL emits light having a wavelength band different from that of the excitation light EL (for example, light in the yellow band, fluorescent FL). The fluorescent FL is reflected upward by the mirror 14 formed on the side surface of the fluorescent member 12, and together with the excitation light EL that does not contribute to the excitation of the phosphor, moves upward (for example, in the Z-axis direction) in the fluorescent member 12. Propagate. As a result, in the light source device 1, white light in which the fluorescent FL and the excitation light EL are combined is taken out from the upper surface of the fluorescent member 12.

(1-2. Configuration of lighting equipment)
FIG. 3 shows an example of a schematic side configuration of the lighting device (lighting device 100A) provided with the light source device 1 shown in FIG. 1, and FIG. 3 shows the lighting device 100A shown in FIG. It is an exploded perspective view of. The illumination device 100A includes a light source device 1, a base plate 31, a lens holding member 32, and an array lens 33. The array lens 33 has a lens 331 corresponding to each light source device 1.

The base plate 31 is a member on which the light source device 1 is placed. The base plate 31 is, for example, a flat plate-shaped member, and has a front surface 31A and a back surface 31B facing each other. A plurality of light source devices 1 are provided on the front surface 31A, and the back surface 31B is thermally connected to, for example, a heat sink or the like (not shown).

The base plate 31 is made of, for example, a ceramic material or a metal material. The base plate 31 made of a metal material can improve heat dissipation. Examples of the metal material include iron (Fe), iron alloy, copper (Cu), aluminum (Al), and copper alloy. Examples of the copper alloy include copper-tungsten (CuW) and the like. Examples of the ceramic material include aluminum nitride (AlN) and the like. The base plate 31 may be provided with a cooling water channel.

The base plate 31 may be provided with a recess for mounting the light source device 1. By providing the light source device 1 in the recess of the base plate 31, the light source device 1 can be protected.

A plurality of light source devices 1 are mounted on the surface 31A of the base plate 31. The plurality of light source devices 1 are arranged in a matrix on the surface 31A of the base plate 31, for example (X direction and Y direction in FIG. 4). For example, a part of the light source device 1 arranged in a matrix may be omitted. This part of the light source device 1 is missing, for example, for the purpose of removing defective products or lowering the power density of a part of the surface. The arrangement of the light source device 1 may be another arrangement such as a substantially hexagonal shape or a staggered shape.

The distance between the plurality of light source devices 1 arranged in a matrix on the surface 31A of the base plate 31 is smaller in the θ // direction than in the θ⊥ direction, for example. Since the FFP (Far Field Pattern) half width in the θ // direction is narrower than the FFP half width in the θ⊥ direction, the distance between the light source devices 1 in the θ // direction can be reduced. This makes it possible to improve the light density. A plurality of light source devices 1 may be arranged in a row.

The lens holding member 32 provided between the base plate 31 and the array lens 33 has, for example, a frame-like shape surrounding a plurality of light source devices 1 mounted on the surface 31A of the base plate 31 (FIG. 4). ). That is, a plurality of light source devices 1 are provided inside the frame-shaped lens holding member 32. The planar shape of the lens holding member 32 is, for example, a quadrangular shape. The lens holding member 32 has, for example, a holding portion 321 having a quadrangular frame shape, and an expanding portion 322 extended inside and outside the holding portion 321. The expansion portion 322 is provided on, for example, two opposing sides of the quadrangular holding portion 321. The lens holding member 32 may not be provided over the entire circumference of the base plate 31, and may be provided on three sides of the rectangular base plate 31, for example. Alternatively, the lens holding member 32 may be provided on two opposite sides of the rectangular base plate 31.

The lens holding member 32 is fixed to the base plate 31 using, for example, screws or the like (not shown). The method of fixing the lens holding member 32 to the base plate 31 may be any method, and for example, the lens holding member 32 may be fixed to the base plate 31 using an adhesive. The adhesive is made of, for example, a resin material. Alternatively, the lens holding member 32 and the base plate 31 may be collectively molded by using an insert molding process or the like.

The thickness of the holding portion 321 (the size in the Z direction in FIG. 4) is larger than the thickness of the expansion portion 322, for example. The holding portion 321 is in contact with the base plate 31 and the array lens 33. Therefore, the size of the distance between each light source device 1 and the lens 331 is adjusted according to the thickness of the holding portion 321. The thickness of the holding portion 321 is preferably such that a space having a size that allows gas flow can be maintained between the package member 22 and the array lens 33 and between the base plate 31 and the array lens 33. .. The size at which gas can flow is, for example, 0.01 mm, which is a processing tolerance by a mechanism, or about 0.5 mm, which is a tolerance in resin molding. If the package member 22 and the array lens 33 are too close to each other, desorbed substances due to an adhesive or the like will stay between them. When this desorbed substance reacts with light and is adsorbed on the package member 22 or the array lens 33, the optical characteristics deteriorate. By providing a space having a size capable of gas flow between the package member 22 and the array lens 33, such a decrease in optical characteristics can be suppressed. The thickness of the holding portion 321 is, for example, about 1 mm to 30 mm. The thickness of the holding portion 321 may be adjusted according to, for example, the focal length of the lens 331, the optical path length in the light source device 1, and the like. The holding portion 321 is made of, for example, a resin material.

The expansion unit 322 is provided with, for example, a terminal unit 322E. The terminal portion 322E is for electrically connecting the light source device 1 (semiconductor laser element 11) and the outside via the wiring WA, for example, and is provided in plurality from the inside to the outside of the expansion portion 322. .. The terminal portion 322E is made of a conductive metal material such as aluminum (Al). The expansion portion 322 of the portion other than the terminal portion 322E is made of, for example, the same resin material as the holding portion 321. The expansion portion 322 and the holding portion 321 may be made of different resin materials.

The holding portion 321 and the expanding portion 322 may be individually fixed to the base plate 31. Further, in the holding portion 321 and the expanding portion 322, the holding portion 321 may be fixed to the expanding portion 322. For example, the holding portion 321 is made of resin or metal, and the expansion portion 322 and the terminal portion 322E are made of PCB (Printed Circuit Board), so that the holding portion 321 can be expanded to the base plate 31 or expanded by using UV adhesive or solder. It can be adhered to the portion 322. Further, the array lens 33 and the holding portion 321 may be collectively molded by using an insert molding method. The lens holding member 32 may be made of a metal material such as aluminum (Al), SUS (Steel Use Stainless), iron (Fe), and copper (Cu). Alternatively, the lens holding member 32 may be made of a ceramic material or the like. The shape of the lens holding member 32 may be formed by machining such as cutting, or may be formed by die casting or sintering. The lens holding member 32 including the terminal portion 322E is preferably composed of one component integrated by, for example, batch molding. This makes it possible to reduce costs.

The array lens 33 faces the base plate 31 with a plurality of light source devices 1 in between. The array lens 33 has, for example, an array portion 33A in a central portion and a frame portion 33F surrounding the array portion 33A. In the array unit 33A, a plurality of lenses 331 are provided at positions facing each light source device 1. Each lens 331 is arranged at a position overlapping the fluorescent member 12 in a plan view, for example. The lens 331 is composed of, for example, a convex lens. The lens 331 may be composed of a plano-convex lens, a biconvex lens, a meniscus lens, and the like. The light emitted from the upper surface of each fluorescent member 12 is collimated by passing through the lens 331. The array lens 33 may have different configurations on the lower surface (for example, the surface facing the base plate 31) side and the upper surface side. For example, one surface side of the array lens 33 may have an FAC (Fast Axis Collimator) function, and the other surface side may have a SAC (Slow Axis Collimator) function. At this time, the array lens 33 is composed of, for example, lenticular lenses arranged in a direction orthogonal to each other, for example, a biconvex single lens or two plano-convex lenses bonded together on a flat surface. .. Alternatively, the array lens 33 is configured by aligning the two plano-convex lenses so that the plane side faces the light source device 1 side, and holding and integrating the array lens 33 with the frame portion 33F of the array lens 33.

The frame portion 33F around the array portion 33A has, for example, a quadrangular planar shape, and the frame portion 33F is fixed to the holding portion 321 of the lens holding member 32 by, for example, an adhesive (not shown). Has been done. As this adhesive, a photocurable resin such as a UV (Ultra Violet) curable resin can be used. When the resin shrinks due to photocuring, the array lens 33 and the lens holding member 32 are likely to be displaced. Therefore, for example, it is preferable to use a resin material having a curing shrinkage amount of about several% or less, and 1% or less. It is more preferable to use a resin material having a curing shrinkage amount. The array lens 33 may be fixed to the lens holding member 32 by, for example, a screw or the like. Alternatively, the array lens 33 and the lens holding member 32 may be collectively molded by an insert molding process or the like. A space having a size capable of gas flow is provided between the array unit 33A and the base plate 31 and between the array unit 33A and the light source device 1. The array lens 33 is made of, for example, borosilicate glass or the like.

In the lighting device 100A, for example, light is extracted as follows. The light extracted from each light source device 1 mounted on the base plate 31 passes through a lens 331 at a position corresponding to the fluorescent member 12 of each light source device 1, and becomes collimated light. Therefore, the traveling directions of the light passing through each lens 331 are parallel to each other and are taken out from the illuminating device 100A.

(1-3. Action / effect)
In the light source device 1 of the present embodiment, the bottom surface of the fluorescent member 12 is joined to the substrate 21 in the package 20 that hermetically seals the semiconductor laser element 11 and the fluorescent member 12. As a result, the heat generated in the fluorescent member 12 due to the irradiation of the excitation light EL can be effectively exhausted via the substrate 21. Further, an opening 22H is provided on the upper surface of the package 20 (upper surface 22S1 of the package member 22) so that the upper surface of the fluorescent member 12 is exposed in the opening 22H. As a result, the light emitting point becomes smaller, and the light emitted from the light source device 1 can be easily combined with the external optical system (for example, the lens 331). This will be described below.

There are two types of laser-excited phosphor light sources, a transmission type and a reflection type. In the laser-excited phosphor light source, improvement of cooling efficiency is one of the problems in order to reduce the temperature quenching of the phosphor, but in the transmission type laser-excited phosphor light source, the heat dissipation path of the phosphor is secured. There is a problem that it is difficult. Further, when the semiconductor laser element which is an excitation light source is driven, the siloxane in the atmosphere reacts with light in the vicinity of the light emitting point, and the reactant is likely to be deposited on the end face of the semiconductor laser element. This reactant may cause a change in the end face reflectance, resulting in deterioration of optical characteristics and destruction of the semiconductor laser device. Therefore, as a technique for suppressing the occurrence of defects caused by siloxane in the atmosphere, a method of packaging a semiconductor laser device and airtightly sealing it is used. When the packaging of this semiconductor laser element is applied to a laser-excited phosphor light source, in the reflection type laser-excited phosphor light source, the light emitting point is inside the package, so that there is a problem that the coupling efficiency with the external optical system deteriorates. Occurs.

On the other hand, in the present embodiment, since the bottom surface of the fluorescent member 12 is bonded to the substrate 21, the heat dissipation path of the heat generated inside the fluorescent member 12 by the irradiation of the excitation light EL is secured. Therefore, the heat generated inside the fluorescent member 12 can be efficiently exhausted, and the temperature quenching of the phosphor due to the decrease in the internal quantum efficiency of the phosphor can be reduced.

As described above, in the light source device 1 of the present embodiment, the heat generated inside the fluorescent member 12 can be efficiently exhausted via the substrate 21, so that the phosphor due to the decrease in the internal quantum efficiency of the phosphor. Temperature quenching is reduced. That is, it is possible to improve the power-optical conversion efficiency. In addition, the wavelength conversion efficiency can be improved. Further, it is possible to improve the brightness of the white light extracted from the light source device 1.

Further, in the present embodiment, an opening 22H in which the upper surface of the fluorescent member 12 is exposed is formed on the upper surface of the package member 22 that covers the fluorescent member 12 together with the semiconductor laser element 11. As a result, the fluorescent FL emitted inside the fluorescent member 12 propagates upward of the fluorescent member 12 together with the excitation light EL that did not contribute to the excitation of the phosphor, and is emitted from the upper surface of the fluorescent member 12. Will be. That is, the upper surface of the fluorescent member 12 becomes a substantial light emitting point. Therefore, for example, it is possible to facilitate coupling to an external optical system such as a lens 331.

Further, in the present embodiment, the fluorescent FL emitted inside the fluorescent member 12 and the excitation light EL that did not contribute to the excitation of the phosphor are propagated upward of the fluorescent member 12 without using a start-up mirror or the like. Therefore, it is possible to reduce the component cost, the mounting cost, and the like.

Hereinafter, a modified example and an application example of the above-described embodiment will be described, but in the following description, the same components as those of the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted as appropriate.

<2. Modification example>
(2-1. Modification 1)
FIG. 5 schematically shows an example of the cross-sectional configuration of the light source device (light source device 1A) according to the first modification of the present disclosure. Note that FIG. 5 shows a cross section of the light source device 1A corresponding to the line II shown in FIG. 2, similarly to FIG. The light source device 1A is a packaged surface mount device (SMD) as in the above embodiment. In the light source device 1A of the present modification, for example, a mirror 15 that reflects the fluorescent FL and the excitation light EL is provided on the side surface of the fluorescent member 12 excluding the irradiation region irradiated with the excitation light EL. It is different from the form. This mirror 15 corresponds to a specific example of the "first reflective member" of the present disclosure.

In the light source device 1A, for example, the above-mentioned mirror 14 and the mirror 15 are provided on the side surface of the fluorescent member 12. Specifically, a mirror 14 is provided in the irradiation region where the excitation light EL is irradiated, and a mirror 15 is provided on the side surface excluding the irradiation region where the excitation light EL is irradiated. The mirror 15 can be formed, for example, by using a reflective film such as a dielectric multilayer film designed to efficiently reflect the excitation light EL and the fluorescent FL. In addition, it may be formed by using a metal film having light reflectivity.

In this way, since the mirror 15 that reflects the excitation light EL in addition to the fluorescence FL is provided on the side surface of the fluorescence member 12, the fluorescence FL and the excitation light EL can be confined in the fluorescence member 12. .. As a result, the reabsorption of the excitation light EL in the fluorescent member 12 is promoted. Therefore, in addition to the effects of the above-described embodiment, the wavelength conversion efficiency can be further improved.

(2-2. Modification 2)
FIG. 6 schematically shows an example of the cross-sectional configuration of the light source device (light source device 1B) according to the second modification of the present disclosure. Note that FIG. 6 shows a cross section of the light source device 1B corresponding to the line II shown in FIG. 2, similarly to FIG. The light source device 1B is a packaged surface mount device (SMD) as in the above embodiment. The light source device 1B of the present modification is different from the above-described embodiment in that a fluorescent member 42 having a rough surface on a part of the side surface is used.

The fluorescent member 42 has a rough surface shape on a part of the side surface, for example, the side surface excluding the irradiation region irradiated with the excitation light EL. This rough surface shape corresponds to the "first scattering mechanism" of the present disclosure. By forming the side surface of the fluorescent member 42 into a rough surface shape in this way, the fluorescent FL and the excitation light EL reaching the side surface from the inside of the fluorescent member 42 are scattered and returned to the inside of the fluorescent member 42.

The rough surface shape of the side surface of the fluorescent member 42 can obtain a more scattering effect by designing the surface roughness to be about the same as the light wavelength in the phosphor. Generally, a phosphor has a refractive index n higher than that of air. Assuming that the wavelength of light in air (refractive index 1) is λ, the wavelength of light inside the phosphor is λ / n. For example, when the refractive index of the phosphor is m = 2, light having a wavelength of 450 nm in the air becomes light having a wavelength of 450/2 = 225 nm inside the phosphor. In the present embodiment, it is assumed that blue light having a wavelength of 430 nm or more and 480 nm or less is used as excitation light to obtain fluorescence of 500 or more and 600 nm or less. Further, since the refractive index of the phosphor is about 1.5 to 2.0, specifically, the side surface of the fluorescent member 42 has a rough surface having an arithmetic mean roughness (Ra) of, for example, 200 nm or more and 400 nm or less. It is desirable to have a shape. The side surface of the fluorescent member 42 corresponding to the irradiation region irradiated with the excitation light EL is preferably a flat surface as in the above embodiment. Further, as shown in FIG. 6, a mirror 14 may be formed on the side surface of the fluorescent member 42 corresponding to the irradiation region irradiated with the excitation light EL.

As for the rough surface of the side surface of the fluorescent member 42, for example, the side surface of the fluorescent member 42 may be directly roughened by sandblasting or the like, or for example, the surface of the mirror 14 may be roughened and the side surface of the fluorescent member 42 may be indirectly roughened. It may be a rough surface.

By using the fluorescent member 42 having a rough side surface in this way, the fluorescent FL and the excitation light EL reaching the side surface from the inside of the fluorescent member 42 are scattered and returned to the inside of the fluorescent member 42. That is, the fluorescent FL and the excitation light EL leaking to the outside are reduced. As a result, the reabsorption of the excitation light EL in the fluorescent member 12 is promoted. Therefore, similarly to the above-mentioned modification 1, in addition to the effect of the above-described embodiment, the wavelength conversion efficiency can be further improved.

(2-3. Modification 3)
FIG. 7 schematically shows an example of the cross-sectional configuration of the light source device (light source device 1C) according to the third modification of the present disclosure. Note that FIG. 7 shows a cross section of the light source device 1C corresponding to the line II shown in FIG. 2, similarly to FIG. The light source device 1C is a packaged surface mount device (SMD) as in the above embodiment. The light source device 1C of the present modification is different from the above-described embodiment in that the mirror 16 is provided on the bottom surface of the fluorescent member 12. The mirror 16 corresponds to a specific example of the "second reflective member" of the present disclosure.

Similar to the mirror 14 in the above embodiment, the mirror 16 can be formed by using a reflective film such as a dielectric multilayer film designed to efficiently reflect the fluorescent FL. Further, similarly to the above-mentioned modification 1, for example, it may be formed by using a reflective film such as a dielectric multilayer film designed to efficiently reflect the excitation light EL and the fluorescent FL. In addition, it may be formed by using a metal film having light reflectivity.

Further, for example, similarly to the above-mentioned modification 2, for example, the surface of the mirror 16 may be a rough surface and the bottom surface of the fluorescent member 12 may be a rough surface.

In this way, by providing the mirror 16 on the bottom surface of the fluorescent member 12 or making the bottom surface a rough surface shape, in addition to the effects of the above-described embodiment, the light extraction efficiency from the upper surface of the fluorescent member 12 can be improved. Is possible. That is, it is possible to further improve the brightness of the white light extracted from the light source device 1.

(2-4. Modification 4)
FIG. 8 schematically shows an example of the cross-sectional configuration of the light source device (light source device 1D) according to the modified example 4 of the present disclosure. Note that FIG. 8 shows a cross section of the light source device 1D corresponding to the line II shown in FIG. 2, similarly to FIG. The light source device 1D is a packaged surface mount device (SMD) as in the above embodiment. The light source device 1D of the present modification is different from the above-described embodiment in that a fluorescent member 52 having an inclined surface 42S1 on a part of the side surface is used.

The fluorescent member 52 has an inclined surface 42S1 on a part of the side surface, specifically, the lower side surface on which the excitation light EL is irradiated. As a result, the excitation light EL incident on the inclined surface 42S1 of the fluorescent member 52 is refracted upward due to the difference in refractive index between the outside of the phosphor and the phosphor, so that the inside of the fluorescent member 52 is directed upward. It becomes easy to propagate.

By forming the lower side surface of the fluorescent member 52 as the inclined surface 42S1 in this way, the excitation light EL can easily propagate upward in the fluorescent member 52. Therefore, in addition to the effects of the above-described embodiment, it is possible to improve the wavelength conversion efficiency and the light extraction efficiency.

Further, the effect of this modification can also be obtained by forming the inclined surface 42S1 only on any side surface below the fluorescent member 52. For example, as shown in FIG. 9, when the excitation light EL is irradiated from one direction, only the side surface facing the side surface on which the excitation light EL is incident may be the inclined surface 42S1.

Further, the entire side surface of the fluorescent member 52 may be an inclined surface 42S1. This makes it possible to further improve the light extraction efficiency of the excitation light EL and the fluorescent FL.

(2-5. Modification 5)
FIG. 10 schematically shows an example of the cross-sectional configuration of the light source device (light source device 1E) according to the modified example 5 of the present disclosure. Note that FIG. 10 shows a cross section of the light source device 1E corresponding to the line II shown in FIG. 2, similarly to FIG. The light source device 1E is a packaged surface mount device (SMD) as in the above embodiment. The light source device 1E of the present modification is different from the above-described embodiment in that the fluorescent member 62 is made of, for example, a composite material of a single crystal phosphor and a ceramic phosphor.

The fluorescent member 62 is composed of, for example, a phosphor layer 62A made of a single crystal phosphor and a phosphor layer 62B made of a polycrystalline phosphor such as a ceramic phosphor. In the fluorescent member 62, for example, the phosphor layer 62A and the phosphor layer 62B are laminated in this order from the substrate 21 side. The phosphor layer 62A and the phosphor layer 62B are adhered to each other by, for example, an adhesive. Single crystal phosphors have high thermal conductivity and good temperature characteristics, but tend to transmit light easily and have low internal quantum efficiency. On the other hand, since the ceramic phosphor has a high scattering intensity at the interface, the internal quantum efficiency is higher than that of the single crystal phosphor. Therefore, by using the single crystal phosphor and the ceramic phosphor in combination, it is possible to improve the temperature characteristics and the internal quantum efficiency of the fluorescent member 62.

The fluorescent member 62 may be laminated in the order of the phosphor layer 62B and the phosphor layer 62A from the substrate 21 side, for example, the phosphor layer 62A / the phosphor layer 62B / the phosphor layer 62A and the fluorescence. A multi-layer structure having three or more layers may be used, such as the body layer 62B / phosphor layer 62A / phosphor layer 62B.

As described above, by forming the fluorescent member 62 using a composite material of a single crystal phosphor and a ceramic phosphor, it is possible to further improve the heat exhaust efficiency and the internal quantum efficiency.

(2-6. Modification 6)
FIG. 11 schematically shows an example of the cross-sectional configuration of the light source device (light source device 1F) according to the modified example 6 of the present disclosure. Note that FIG. 11 shows a cross section of the light source device 1E corresponding to the line II shown in FIG. 2, similarly to FIG. The light source device 1F is a packaged surface mount device (SMD) as in the above embodiment. In the light source device 1F of this modification, the light confinement member 17 is arranged between the semiconductor laser element 11 and the fluorescent member 52.

The light confinement member 17 is for suppressing the emission of the excitation light EL emitted from the semiconductor laser element 11. As the light confinement member 17, for example, a rod integrator can be used. In addition, the light confinement member 17 can be formed by using, for example, GaN or a material constituting a general waveguide, which has a small absorption rate of the excitation light EL and a large refractive index.

In the above modification 4, an example of using the fluorescent member 52 having the inclined surface 42S1 on a part of the side surface is shown, but since the laser light (excitation light EL) is diffused, the amount of incident light of the excitation light EL on the fluorescent member 52 is large. There is a risk of decrease.

On the other hand, in this modification, since the light confining member 17 is arranged between the semiconductor laser element 11 and the fluorescent member 52, the emission of the excitation light EL is reduced and the light is incident on the fluorescent member 52. It is possible to improve the light rate. Therefore, the light source device 1F of the present modification has an effect that the light utilization efficiency can be improved in addition to the effect of the modification 4.

(2-7. Modification 7)
12A to 12C schematically show the planar shape of the fluorescent member (for example, the fluorescent member 12) and the arrangement example of the semiconductor laser element 11 used in the above-described embodiment and the like. In the above embodiment, an example using the fluorescent member 12 having a rectangular cross section in the XY plane direction is shown, but the present invention is not limited to this, and the cross section shape of the fluorescent member 12 is a polygonal prism shape. Good.

The cross-sectional shape of the fluorescent member 12 may be a trapezoidal shape, for example, as shown in FIG. 12A. In this way, by designing the side surface facing the side surface (incident surface) on which the excitation light EL is incident at an angle not parallel to the incident surface, the excitation light EL reaching the opposite side surface is reflected inside the fluorescent member 12. It becomes easy to be done. That is, the excitation light EL can be easily confined inside the fluorescent member 12, and the internal quantum efficiency can be improved.

The cross-sectional shape of the fluorescent member 12 may be a polygonal shape such as a hexagon as shown in FIG. 12B, for example. Further, in the above embodiment, an example in which the mirror 14 covers the entire side surface of the fluorescent member 12 is shown. For example, as shown in FIG. 12B, the side surface facing the incident surface of the excitation light EL is incident. When it is parallel to the surface, the same effect can be obtained by forming the mirror 14 only on the opposite side surfaces. The same applies to the rough surface.

Furthermore, as shown in FIG. 12C, by making the cross-sectional shape of the fluorescent member 12 polygonal, more semiconductor laser elements 11 can be arranged according to the number of side surfaces thereof. This makes it possible to increase the amount of excitation light incident on the fluorescent member 12 and provide a light source device 1 having higher brightness.

(2-8. Modification 8)
FIG. 13 is a schematic exploded perspective view of a main part of the lighting device (lighting device 100B) according to the modified example 8 of the present disclosure. The lighting device 100B has a base plate 31, a light source device (for example, a light source device 1), and an array lens 33 in this order. That is, the lighting device 100B is not provided with a lens holding member (for example, the lens holding member 32 in FIG. 5). The base plate 31 of the lighting device 100B has, for example, a plate portion 311 and a holding portion 312 and a terminal portion 313E. Except for this point, the lighting device 100B of the present modification has the same configuration as the lighting device 100A of the above embodiment, and its action and effect are also the same.

The plate portion 311 of the base plate 31 is, for example, a plate-shaped member having a quadrangular planar shape. A plurality of light source devices 1 are placed on the plate portion 311 in a matrix, for example.

The holding portion 312 has a quadrangular frame-shaped planar shape surrounding a plurality of light source devices 1 arranged in the central portion of the plate portion 311. The holding portion 312 is in contact with the plate portion 311 and the array lens 33 (frame portion 33F), and the size of the distance between each light source device 1 and the lens 331 is adjusted by the size of the thickness of the holding part 312. It is supposed to be done.

The terminal portion 313E has, for example, a strip-shaped planar shape extending in one direction (Y direction in FIG. 13), and is provided on the plate portion 311. The terminal portion 313E extends from the inside to the outside of the holding portion 312. By electrically connecting the electrode extraction portions 14E1 and 14E2 of the light source device 1 to the terminal portion 313E, the semiconductor laser element 11 and the outside are electrically connected.

The plate portion 311 and the holding portion 312 and the terminal portion 313E are integrated, for example. The plate portion 311 is made of, for example, aluminum, the holding portion 312 is made of, for example, PEEK (polyetheretherketone), and the terminal portion 313E is made of a metal material. The plate portion 311 and the holding portion 312 are collectively molded by, for example, insert injection molding or the like. The plate portion 311 is made of, for example, aluminum (Al), copper (Cu), copper-tungsten (Cu-W), aluminum nitride (AlN), or the like, and the holding portion 312 is, for example, alumina, aluminum nitride, Kovar, or the like. It may be configured by. At this time, the plate portion 311 and the holding portion 312 and the terminal portion 313E are insulated by, for example, low melting point glass or the like.

<3. Application example>
The

lighting devices

100A and 100B described in the above embodiments and modifications can be applied to, for example, a projection type display device.

FIG. 14 is a diagram showing a configuration example of a projection type display device (projection type display device 200) to which the

lighting devices

100A and 100B are applied as a light source. The projection type display device 200 is, for example, a display device that projects an image on a screen. The projection type display device 200 is connected to an external image supply device such as a computer such as a PC or various image players via an I / F (interface), and is based on an image signal input to the I / F. The image is projected onto a screen or the like. The configuration of the projection type display device 200 described below is an example, and the projection type display device according to the present technology is not limited to such a configuration.

The projection type display device 200 includes a

lighting device

100A, 100B, a multi-lens array 212, a PBS array 213, a focus lens 214, a

mirror

215a, 215c to 215e, a

dichroic mirror

216, 217, a light modulation element 218a to 218c, and a dichroic prism 219. And a projection lens 220.

In the

lighting devices

100A and 100B, the light emitted from the semiconductor laser element 11 passes through the array lens 33 and is taken out as collimated light. This light is incident on the multi-lens array 212. The multi-lens array 212 has a structure in which a plurality of lens elements are provided in an array, and collects light emitted from the

illumination devices

100A and 100B. The PBS array 213 polarizes the light focused by the multi-lens array 212 into light in a predetermined polarization direction, for example, a P-polarized wave. The focus lens 214 collects the light converted into light in a predetermined polarization direction by the PBS array 213.

The dichroic mirror 216 transmits the red light R among the light incident through the focus lens 214 and the mirror 215e, and reflects the green light G and the blue light B. The red light R transmitted by the dichroic mirror 216 is guided to the light modulation element 218a via the mirror 215a.

The dichroic mirror 217 transmits the blue light B of the light reflected by the dichroic mirror 216 and reflects the green light G. The green light G reflected by the dichroic mirror 217 is guided to the light modulation element 218b. On the other hand, the blue light B transmitted by the dichroic mirror 217 is guided to the light modulation element 218c via the mirror 215d and the mirror 215c.

Each of the light modulation elements 218a to 218c photomodulates each incident color light, and each light-modulated color light is incident on the dichroic prism 219. The dichroic prism 219 synthesizes each color light that has been light-modulated and incident on one optical axis. Each of the combined colored lights is projected onto a screen or the like via the projection lens 220.

In the projection type display device 200, three light modulation elements 218a to 218c corresponding to the three primary colors of red, green, and blue are combined to display all colors. That is, the projection type display device 200 is a so-called three-plate type projection type display device.

Although the present technology has been described above with reference to the embodiments, modifications 1 to 8 and application examples, the present technology is not limited to the above-described embodiments and can be variously modified. For example, the substrate 21 and the package member 22 may be provided with, for example, a wiring structure for electrically connecting the semiconductor laser element 11 and the outside.

Further, the components, arrangements, numbers, etc. of the light source devices 1 (and the light source devices 1A to 1F) and the

lighting devices

100A and 100B illustrated in the above embodiments and the like are merely examples, and it is necessary to include all the components. It may also have other components.

Further, in the above application example, an example in which the light source device (for example, the light source device 1) described in the above-described embodiment and the like and the lighting device provided with the light source device (for example, the lighting device 100A) is applied to the projection type display device is shown. However, it is not limited to this. The light source device (for example, the light source device 1) described in the above-described embodiment can be used for, for example, in-vehicle lighting such as a headlight, a spotlight, an intelligent lighting, a searchlight, and the like.

It should be noted that the effects described in the present specification are merely examples and are not limited thereto, and other effects may be obtained.

The present technology can also have the following configurations. According to this technology having the following configuration, since the bottom surface of the fluorescent member is bonded to the substrate, the heat exhaust efficiency of the heat generated inside the fluorescent member by the irradiation of the excitation light is improved, and the power light conversion efficiency is improved. It becomes possible. Further, since the opening is provided on the upper surface of the package member so that the fluorescent member is exposed on the upper surface of the package member, the light emitting point becomes smaller and the fluorescent member can be easily coupled to the external optical system.
(1)
With the board
A fluorescent member whose bottom is bonded to the substrate,
A semiconductor light emitting device mounted on the substrate and irradiating the side surface of the fluorescent member with excitation light.
A light source device including a package member that seals the fluorescent member and the semiconductor light emitting element and has an opening on the upper surface from which the fluorescent member is exposed.
(2)
The light source device according to (1) above, wherein the fluorescent member has a columnar shape.
(3)
The light source device according to (1) or (2) above, further comprising a first reflecting member that reflects fluorescence on at least a part of a side surface of the fluorescent member.
(4)
The light source device according to (3) above, wherein the first reflecting member further reflects the excitation light.
(5)
The first reflective member is provided on the entire side surface of the fluorescent member.
The light source device according to (3) or (4), wherein the fluorescence and the excitation light are reflected in a region other than the irradiation region of the excitation light.
(6)
The light source device according to any one of (1) to (5) above, further comprising a first scattering mechanism for scattering fluorescence on at least a part of a side surface of the fluorescent member.
(7)
The light source device according to (6), wherein the first scattering mechanism is provided on the entire side surface of the fluorescent member excluding the irradiation region of the excitation light.
(8)
The fluorescent member has a polygonal prism shape and has a polygonal prism shape.
The light source device according to any one of (1) to (7) above, wherein the semiconductor light emitting device is arranged at a position facing at least one surface forming a side surface of the fluorescent member.
(9)
The invention according to any one of (1) to (8) above, further comprising a second reflecting member that reflects at least one of fluorescence and the excitation light between the bottom surface of the fluorescent member and the substrate. Light source device.
(10)
The invention according to any one of (1) to (9), further comprising a second scattering mechanism that scatters at least one of fluorescence and excitation light between the bottom surface of the fluorescent member and the substrate. Light source device.
(11)
The light source device according to any one of (1) to (10) above, wherein the fluorescent member has an inclined surface at least a part of a side surface.
(12)
The light source device according to (11), wherein the inclined surface is formed on a side surface of the fluorescent member facing an incident surface of the excitation light.
(13)
The light source device according to any one of (1) to (12) above, wherein the fluorescent member contains at least a part of a single crystal phosphor.
(14)
The light source device according to any one of (1) to (12) above, wherein the fluorescent member is made of a composite material of a single crystal and ceramic.
(15)
The light source device according to any one of (1) to (14), further comprising a light confining member between the semiconductor light emitting device and the fluorescent member.
(16)
The light source device according to any one of (1) to (15) above, wherein the semiconductor light emitting element is a semiconductor laser.
(17)
The light source device according to (16) above, wherein the semiconductor laser emits a wavelength of 430 nm or more and 480 nm or less.
(18)
The light source device according to any one of (1) to (17) above, wherein the substrate and the package member are hermetically sealed.
(19)
With the board
A fluorescent member whose bottom is bonded to the substrate,
A semiconductor light emitting device mounted on the substrate and irradiating the side surface of the fluorescent member with excitation light.
A lighting device including a light source device that seals the fluorescent member and the semiconductor light emitting element, and also has a package member having an opening on the upper surface where the fluorescent member is exposed.

This application claims priority based on Japanese Patent Application No. 2019-198482 filed on October 31, 2019 at the Japan Patent Office, and this application is made by referring to all the contents of this application. Invite to.

One of ordinary skill in the art can conceive of various modifications, combinations, sub-combinations, and changes, depending on design requirements and other factors, which are included in the appended claims and their equivalents. It is understood that it is something to be done.

Claims

With the board
A fluorescent member whose bottom is bonded to the substrate,
A semiconductor light emitting device mounted on the substrate and irradiating the side surface of the fluorescent member with excitation light.
A light source device including a package member that seals the fluorescent member and the semiconductor light emitting element and has an opening on the upper surface from which the fluorescent member is exposed.
The light source device according to claim 1, wherein the fluorescent member has a columnar shape.
The light source device according to claim 1, further comprising a first reflecting member that reflects fluorescence on at least a part of a side surface of the fluorescent member.
The light source device according to claim 3, wherein the first reflecting member further reflects the excitation light.
The first reflective member is provided on the entire side surface of the fluorescent member.
The light source device according to claim 3, wherein the fluorescence and the excitation light are reflected in a region other than the irradiation region of the excitation light.
The light source device according to claim 1, further comprising a first scattering mechanism for scattering fluorescence on at least a part of a side surface of the fluorescent member.
The light source device according to claim 6, wherein the first scattering mechanism is provided on the entire side surface of the fluorescent member excluding the irradiation region of the excitation light.
The fluorescent member has a polygonal prism shape and has a polygonal prism shape.
The light source device according to claim 1, wherein the semiconductor light emitting device is arranged at a position facing at least one surface forming a side surface of the fluorescent member.
The light source device according to claim 1, further comprising a second reflecting member that reflects at least one of fluorescence and the excitation light between the bottom surface of the fluorescent member and the substrate.
The light source device according to claim 1, further comprising a second scattering mechanism that scatters at least one of fluorescence and excitation light between the bottom surface of the fluorescent member and the substrate.
The light source device according to claim 1, wherein the fluorescent member has an inclined surface at least a part of a side surface.
The light source device according to claim 11, wherein the inclined surface is formed on a side surface of the fluorescent member facing an incident surface of the excitation light.
The light source device according to claim 1, wherein the fluorescent member contains at least a part of a single crystal phosphor.
The light source device according to claim 1, wherein the fluorescent member is made of a composite material of a single crystal and ceramic.
The light source device according to claim 1, further comprising a light confining member between the semiconductor light emitting element and the fluorescent member.
The light source device according to claim 1, wherein the semiconductor light emitting element is a semiconductor laser.
The light source device according to claim 16, wherein the semiconductor laser emits a wavelength of 430 nm or more and 480 nm or less.
The light source device according to claim 1, wherein the substrate and the package member are hermetically sealed.
With the board
A fluorescent member whose bottom is bonded to the substrate,
A semiconductor light emitting device mounted on the substrate and irradiating the side surface of the fluorescent member with excitation light.
A lighting device including a light source device that seals the fluorescent member and the semiconductor light emitting element, and also has a package member having an opening on the upper surface where the fluorescent member is exposed.