WO2021081904A1 - Microwave antenna structure, microwave rotating radar, and movable platform - Google Patents

Microwave antenna structure, microwave rotating radar, and movable platform Download PDF

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Publication number
WO2021081904A1
WO2021081904A1 PCT/CN2019/114762 CN2019114762W WO2021081904A1 WO 2021081904 A1 WO2021081904 A1 WO 2021081904A1 CN 2019114762 W CN2019114762 W CN 2019114762W WO 2021081904 A1 WO2021081904 A1 WO 2021081904A1
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WO
WIPO (PCT)
Prior art keywords
microwave
microstrip
antenna arrays
antenna
group
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Application number
PCT/CN2019/114762
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French (fr)
Chinese (zh)
Inventor
孙维忠
贺翔
唐照成
刘双
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to CN201980039407.6A priority Critical patent/CN112368590A/en
Priority to PCT/CN2019/114762 priority patent/WO2021081904A1/en
Publication of WO2021081904A1 publication Critical patent/WO2021081904A1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/024—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00 using polarisation effects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S3/00—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received
    • G01S3/02—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received using radio waves
    • G01S3/04—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S3/00—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received
    • G01S3/02—Direction-finders for determining the direction from which infrasonic, sonic, ultrasonic, or electromagnetic waves, or particle emission, not having a directional significance, are being received using radio waves
    • G01S3/14—Systems for determining direction or deviation from predetermined direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems

Definitions

  • the present invention generally relates to the technical field of antenna structures, and more specifically to a microwave antenna structure, a microwave rotating radar and a movable platform.
  • microwave radars can be miniaturized and integrated. With the same antenna diameter, microwave radars can obtain narrower antenna beams and higher antenna gains, which can improve the radar’s angular resolution and The angle measurement accuracy is good for resisting electronic interference, clutter interference and multipath reflection interference.
  • the existing microwave radar mainly has the following problems: the size of the high-precision angle measurement radar, especially the large size in the angle measurement direction, and the high cost of the radar.
  • the accuracy of radar angle measurement is closely related to the number of radar receiving channels. The higher the accuracy, the greater the number of radar receiving channels, the larger the radar size, and the higher the cost.
  • the VMIMO radar was developed. VMIMO radar adds a small number of transmission channels, controls the transmission channel to transmit quadrature signals through time division or phase modulation, and performs coherent signal processing on the received signals, and finally realizes the measurement equivalent to the conventional single-transmitting channel radar that doubles the receiving channels. Angular accuracy greatly reduces radar cost and radar size.
  • the equivalent effect of the VMIMO radar antenna is shown in Figure 1 below.
  • the current VMIMO radar has greatly reduced the radar cost and the size of the radar, because the VMIMO radar needs to realize the angle measurement, the receiving antenna or the transmitting antenna must be arranged equidistantly in the angle measurement plane, and the spacing of the transmitting antennas is generally equal to the spacing of the receiving antennas. (Depending on the number of receiving antennas, see Figure 1 that the distance between the transmitting antennas is 4 times the receiving antenna distance), which leads to small radars such as radars for vehicles or small drones, due to the small space size, even With the current VMIMO radar, the size of the radar is still relatively large, especially in the direction of angle measurement.
  • the present invention is proposed in order to solve at least one of the above-mentioned problems.
  • the invention provides a microwave antenna structure, a microwave rotating radar and a movable platform.
  • the antenna structure adopts multiple transmitting channels and multiple receiving channels, and by rationally arranging the transmitting antenna array and the receiving antenna array, a low-cost, compact, And a radar with high angle measurement accuracy.
  • the first aspect of the present invention provides a microwave antenna structure, including:
  • a substrate, a plurality of antenna arrays are formed on a first side surface of the substrate, and the plurality of antenna arrays include at least two transmitting antenna arrays and a plurality of receiving antenna arrays;
  • a plurality of the receiving antenna arrays extend along a first direction, and the plurality of the receiving antenna arrays are parallel to each other and arranged at intervals;
  • At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals;
  • At least two of the transmitting antenna arrays and a plurality of the receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
  • the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is an integer related to the number of receiving antenna arrays.
  • the first direction is the length direction or the width direction of the substrate.
  • a plurality of the antenna arrays adopt microstrip antennas, and each of the antenna arrays includes a group of microstrip patch units electrically connected to each other.
  • each of the microstrip patch units in each group of the microstrip patch units has the same size.
  • the area of each of the microstrip patch units in each group of the microstrip patch units decreases in order from the center of symmetry to both sides.
  • the shape of the microstrip patch unit is rectangle, circle, semicircle or ellipse.
  • each group of microstrip patching units includes more than 6 microstrip patching units.
  • the number of the receiving antenna array is 4 or more.
  • it further includes:
  • a feeder network is formed on the first side surface of the substrate, and the feeder network includes a plurality of microstrip lines respectively electrically connected to each group of the microstrip patch unit.
  • the microstrip line and each group of the microstrip patch unit are connected in a parallel feed mode.
  • the microstrip line is connected to each group of the microstrip patch unit through a serial feed.
  • it further includes: a radio frequency circuit electrically connected to the feeding network, the radio frequency circuit including at least one transmitting chip and two receiving chips, and a function of electrically connecting to the two receiving chips. Divider.
  • the radio frequency circuit is formed on the second side surface of the substrate.
  • a plurality of vias or feeding probes electrically connected to the microstrip lines of each group of the microstrip patch unit are formed on the substrate, and the feeding network passes through A plurality of the vias or feed probes are connected with the radio frequency circuit.
  • a plurality of microstrip lines are further formed on the second side surface of the substrate, and each of the vias or feed probes is connected to the radio frequency through the corresponding microstrip line. Circuit.
  • each group of the microstrip patch unit is electrically connected to the radio frequency circuit through a coupling feeding manner.
  • the radio frequency circuit is formed on the first side surface of the substrate.
  • each group of the microstrip patch unit is connected to the radio frequency circuit through a microstrip line, wherein the feed point is located on the microstrip line on one side or in the middle of the antenna array.
  • the microstrip line and each group of the microstrip patch unit are connected in a vertical manner or an oblique manner.
  • the substrate is a double-layer board, a three-layer board, a four-layer board, a five-layer board, or a six-layer board.
  • the substrate includes:
  • An antenna board, the antenna array is formed on the antenna board;
  • a ground plate located under the antenna plate, for electrical connection with the ground of the antenna array
  • a plurality of wiring boards are located below the ground plate and are used for electrical connection with the radio frequency circuit
  • the antenna board, the ground board and a plurality of the wiring boards are stacked in sequence.
  • the antenna array adopts a horizontal polarization mode or a vertical polarization mode.
  • the second aspect of the present invention provides a microwave rotating radar, which is characterized in that it includes:
  • the motor is installed on the fixed bracket;
  • a rotating bracket installed on the rotor of the motor and rotating with the rotor of the motor;
  • the microwave antenna structure according to the first aspect of the present invention is installed on the rotating bracket.
  • a third aspect of the present invention provides a movable platform, which is characterized in that it includes:
  • a power plant which is installed on the fuselage and provides moving power for the fuselage
  • the microwave rotating radar according to the second aspect of the present invention is installed on the fuselage.
  • the movable platform is an unmanned aerial vehicle, an autonomous vehicle or a ground remote control robot.
  • the invention provides a microwave antenna structure, a microwave rotating radar and a movable platform.
  • the antenna structure adopts a multi-transmit antenna array and a multi-receive antenna array to form a VMIMO antenna array.
  • the transmission channel is controlled by time division or phase modulation to transmit orthogonal signals. , And perform coherent signal processing on the received signal to realize the high-precision angle measurement ability equivalent to doubling the number of receiving antennas; and the transmitting antenna array and the receiving antenna array are arranged side by side, compared with the transmitting antenna array and the receiving antenna array being arranged on the same straight line , Greatly reducing the size of the radar in the angle measurement direction, so that the radar has a better fit.
  • Figure 1 is an equivalent schematic diagram of the antenna of the VMIMO radar
  • FIG. 2 is a schematic diagram of an antenna array of a microwave antenna structure according to an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the microwave antenna structure shown in FIG. 1;
  • FIG. 4 is a schematic diagram of the connection between the antenna and the radio frequency device of the microwave antenna structure shown in FIG. 1;
  • Fig. 5 is a schematic cross-sectional view of a microwave rotating radar applying the microwave antenna structure shown in Fig. 1;
  • Fig. 6 is a schematic structural diagram of a movable platform to which the microwave rotating radar shown in Fig. 5 is applied.
  • FIG. 2 is a schematic diagram of an antenna array of a microwave antenna structure according to an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of a microwave antenna structure according to an embodiment of the present invention
  • FIG. 4 is an antenna and a microwave antenna structure according to an embodiment of the present invention Schematic diagram of radio frequency device connection.
  • the microwave antenna structure 100 provided in the embodiment of the present invention includes a substrate 101, and a plurality of antenna arrays are formed on a first side (ie, front) of the substrate 101.
  • the array includes at least 2 transmitting antenna arrays (for example, transmitting antenna arrays 1 and 2) and multiple receiving antenna arrays (for example, receiving antenna arrays 3-10).
  • the plurality of receiving antenna arrays extend along a first direction, and the plurality of receiving antenna arrays are parallel to each other and arranged at intervals. Exemplarily, in this embodiment, there are 8 receiving antenna arrays, and receiving antenna arrays 3-10. Of course, in other embodiments, the number of receiving antenna arrays can also be other numbers as required, for example, 4 receiving antenna arrays or 16 receiving antenna arrays can be used. In this context, that the plurality of receiving antenna arrays extend along the first direction refers to that the plurality of receiving antenna arrays are arranged in sequence along the first direction.
  • At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals.
  • two transmitting antenna arrays, transmitting antenna arrays 1 and 2 are included.
  • the number of transmitting antenna arrays may also be other numbers as required, for example, 3 or 4 transmitting antenna arrays may be used.
  • that at least two of the transmitting antenna arrays extend along the first direction means that at least two of the transmitting antenna arrays are arranged in sequence along the first direction.
  • the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is an integer related to the number of receiving antenna arrays.
  • the distance between the transmitting antenna arrays 1 and 2 is equal to 8 times the distance D between adjacent receiving antenna arrays.
  • the distance D between adjacent receiving antenna arrays refers to the distance between the corresponding sides of the adjacent receiving antenna arrays or the distance between the centers of the adjacent receiving antenna arrays. Taking the microstrip antenna array used in Figure 2 as an example, the distance D between adjacent receiving antenna arrays refers to the distance between the corresponding sides of the microstrip patch of the adjacent receiving antenna array or the center of the microstrip patch distance.
  • the microwave antenna structure 100 of this embodiment uses multiple receiving antenna arrays and at least two transmitting antenna arrays to form a VMIMO antenna array. Therefore, it is possible to control the transmitting channel through time division or phase modulation, transmit orthogonal signals, and perform coherent signals on the received signals. Processing to achieve the high-precision angle measurement capability equivalent to twice the number of receiving antennas. Taking Figure 2 as an example, referring to the principle shown in Figure 1, it can achieve an angle measurement capability equivalent to 16 receiving antenna arrays.
  • the spacing between the transmitting antenna arrays is several times the spacing between the receiving antenna arrays, in order to reduce the size of the microwave antenna structure 100 in the angular measurement direction, in this embodiment, as shown in FIG. 2, at least The two transmitting antenna arrays and the multiple receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
  • the first direction is the length direction or the width direction of the substrate.
  • the first direction is the width direction or the longitudinal direction of the substrate 101.
  • the transmitting antenna array and the receiving antenna array are arranged side by side. Compared with the transmitting antenna array and the receiving antenna array are arranged on the same straight line, the size of the radar in the angle measurement direction is greatly reduced, so that the radar has better performance. Adaptability, can be installed in equipment with a smaller space.
  • the transmitting antenna array and the receiving antenna array adopt microstrip antennas.
  • other forms of antennas can also be used.
  • a microstrip antenna is taken as an example to describe the structure of the transmitting antenna array and the receiving antenna array.
  • each antenna array such as a receiving antenna array or a transmitting antenna array, includes a group of microstrip patch units 11 electrically connected to each other.
  • each group of the microstrip patching unit 11 includes 8 microstrip patching units 11. It should be understood that although in this embodiment, each group of the microstrip patch unit 11 includes 8 microstrip patch units 11, in other embodiments of the present invention, each group of the microstrip patch unit 11
  • the number of microstrip patch units 11 included is not limited to 8, and can be more than 8, such as 12, or less than 8, such as 6.
  • each patch unit 11 in each group of microstrip patch unit 11 has the same size and is rectangular.
  • the length A of the microstrip patch unit 11 is 3.1 mm
  • the width B is 4.3 mm, that is, the size of the microstrip patch unit 11 is 3.1*4.3 mm.
  • the distance C between two adjacent microstrip patch units 11 is 7.6 mm.
  • the distance C between two adjacent microstrip patch units 11 refers to the distance between two adjacent microstrip patch units 11 on the same side, for example, it is shown as the left side of two adjacent microstrip patch units 11 in FIG. 2 The distance between the edges.
  • the size of the microstrip patch unit 11 is related to the radiation energy, dielectric constant, etc. of the microstrip patch unit 11.
  • the dimensions disclosed in this embodiment are only exemplary. In other embodiments, the microstrip patch The unit 11 can take various other suitable sizes.
  • the distance D between two adjacent receiving antenna arrays 3-10 determines the angle measurement range of the antenna structure 100, and the distance between two adjacent receiving antenna arrays 3-10 The smaller the D, the larger the angle measurement range, but if the distance is too small, the coupling between the antennas will increase, the gain will decrease, and the pattern will deteriorate.
  • two adjacent receiving antenna arrays 3-10 The distance D between them is 6.0 mm to 15.0 mm.
  • the distance D is 6.2 mm to 12.5 mm. More preferably, the distance D is 6.6 mm.
  • the corresponding angle measurement range is plus or minus 90 degrees
  • the corresponding angle measurement range is plus or minus 70 degrees
  • the distance D is 12.5 mm
  • the corresponding angle measurement range is plus or minus 30 degrees.
  • the substrate 101 includes an antenna plate 102, a ground plate 103, and two wiring plates 104, and a dielectric plate 105 disposed between the antenna plate 102, the ground plate 103, and the multiple wiring plates 104.
  • the antenna board 102, the ground board 103, and a plurality of the wiring boards 104 are stacked in sequence.
  • the antenna array is formed on the antenna board 102, and the antenna board 102 may be formed by etching a conductor patch formed on the first dielectric board 105A.
  • the ground plate 103 is located below the antenna plate 102 and is used for electrical connection with the ground of the antenna array.
  • the ground plate 103 and the antenna plate 102 are separated by a first dielectric plate 105A.
  • the wiring board 104 is located under the ground board 103 and is used for electrical connection with the radio frequency circuit.
  • the wiring board 104 and the grounding plate 103 are separated by a second dielectric plate 105B, and the wiring board 104 is separated by a third dielectric plate 105C.
  • the radio frequency circuit is formed on the second side (ie, the back side) of the substrate 101, that is, on the side of the third dielectric plate 105C or the bottom wiring board in FIG. 2 104 on.
  • the length of the dielectric plate 105 is 92 mm, the width is 87 mm, and the thickness is 32 mils.
  • the dielectric constant of the dielectric plate 105 is 3.6.
  • the substrate 101 includes an antenna plate 102, a ground plate 103 and two wiring boards 104
  • the present invention is not limited to this.
  • the substrate 101 may include one
  • the wiring board 104 may also include more than three wiring boards 104, or may not include the wiring board 104.
  • the number of wiring boards 104 is determined according to the size of the dielectric board 105, the size of the antenna, the radio frequency circuit, and the connection. If the antenna board, radio frequency circuit and wiring can be accommodated on the surface of a dielectric board, the wiring board 104 does not need to be provided at this time. At this time, the radio frequency circuit is formed on the first side surface of the substrate.
  • the substrate 101 of the microwave antenna structure 100 may be a double-layer board (antenna board plus a grounding board), a three-layer board (antenna board, grounding board, and a wiring board). , Four-layer board (antenna board, grounding board and two wiring boards), five-layer board (antenna board, grounding board and three wiring boards) or six-layer board (antenna board, grounding board and four wiring boards) ) And other structures.
  • the microwave antenna structure 100 also includes a feeder network formed on the first side of the substrate 101, and the feeder network includes electrical connections to each group of the microstrip patch unit 11, respectively.
  • the microstrip line 12 is connected to each group of the microstrip patch unit 11 through a serial feed.
  • the feeding points of the receiving antenna array and the transmitting antenna array are located on one side or in the middle of the receiving antenna array or the transmitting antenna array.
  • a microstrip line located on one side or in the middle of the antenna array is connected to the radio frequency network. connection.
  • the receiving antenna array and the transmitting antenna array are directly fed through the microstrip line
  • the power may also be fed through a via hole or a feeding probe.
  • a plurality of vias or feeding probes electrically connected to the microstrip lines 12 of each group of the microstrip patch unit 11 may be formed on the substrate 101, and the feeding network may pass through the plurality of vias or The feeding probe is connected to the radio frequency circuit, or each group of the microstrip patch unit 11 is electrically connected to the radio frequency circuit through a coupling feeding manner.
  • a plurality of microstrip lines are also formed on the second side surface of the substrate, and each of the vias or feed probes is connected to the radio frequency circuit through the corresponding microstrip line.
  • each group of microstrip patch units adopts the serial feed mode
  • the parallel feed mode can also be adopted.
  • each microstrip patch unit in each group of the microstrip patch unit The units are leveled in parallel on a microstrip line, and the microstrip line is connected to each group of the microstrip patch unit in a vertical manner or an oblique manner.
  • the microwave antenna structure 100 provided by this embodiment further includes a radio frequency circuit electrically connected to the feed network.
  • the radio frequency circuit includes one transmitting chip 20 and two receiving chips 21, and two The receiving chip 21 is electrically connected to a power divider 22.
  • the transmitting chip 20 is electrically connected to the transmitting antennas TX1 and TX2, and the receiving chip 21 is electrically connected to the receiving antenna RX (RX1-8).
  • each receiving chip 21 is connected to four receiving antennas, that is, the first receiving chip 21 is connected to the receiving antennas RX1, RX2, RX3, and RX4, and the second receiving chip 21 is connected to the receiving antennas RX5, RX6, and RX7. Connect with RX8.
  • the power divider 22 is used for the receiving chip 21 to receive the radiant energy to synthesize one output. It should be understood that the number of transmitting chips 20, receiving chips 21, and power dividers 22 is related to the number of transmitting antennas and receiving antennas, and is not limited to the number shown in FIG. 3.
  • the transmitting chip 20, the receiving chip 21, and the power divider 22 may adopt various suitable chips.
  • the power divider 22 may adopt a Wilkinson power divider.
  • the microwave antenna structure 100 provided in this embodiment adopts a horizontal polarization mode, while other scenarios that pay more attention to vertical targets.
  • the microwave antenna structure 100 provided in this embodiment uses a vertical polarization mode.
  • the microwave antenna structure 100 provided in this embodiment adopts a microstrip array antenna, it occupies a small space, has a relatively simple structure, reduces costs, and can have a larger angle measurement range, higher angle measurement resolution, gain, and beam width. Both the side lobes can meet the actual needs of use.
  • microwave antenna structure of the present invention is only an exemplary description of the microwave antenna structure of the present invention, and the microwave antenna structure according to the present invention may also adopt various structures similar to the foregoing principles.
  • Fig. 5 is a schematic cross-sectional view of a microwave rotating radar according to an embodiment of the present invention.
  • the microwave rotating radar 200 includes a cover 201, a fixed bracket 202 is provided in the cover 201, and a motor is installed on the fixed bracket 202.
  • the motor includes a stator 203 and a rotor 204.
  • a rotating bracket 205 is installed on the rotor 204, and the rotating bracket 205 rotates with the rotor 204 of the motor; a microwave antenna structure 206 and an antenna controller 207 are installed on the rotating bracket 205.
  • the specific structure of the microwave antenna structure 206 is as before As described, the antenna controller 207 is used to control the microwave antenna structure 206 to transmit and receive microwave signals.
  • the microwave rotation radar 200 further includes an angle sensor 208, and the angle sensor 208 is used to detect the rotation angle of the rotor 204.
  • the angle sensor 208 may be one or more of a Hall sensor, a potentiometer, and an encoder. It can be understood that the angle sensor 208 detects the rotation angle of the rotor 204, that is, detects the rotation angle of the microwave rotating radar 200.
  • the device using the microwave rotating radar 200 can assist in determining the transmission direction of the microwave signal and the direction of the received microwave signal according to the rotation angle of the microwave rotating radar 200, and further determine the relative direction of the obstacle and the device using the microwave rotating radar 200 .
  • Fig. 6 is a schematic block diagram of a movable platform according to an embodiment of the present invention.
  • the movable platform 300 is depicted as an unmanned aerial vehicle, this depiction is not intended to be limiting, and any suitable type of movable object may be used.
  • the movable platform 300 may be a drone or an autonomous vehicle. Or ground remote control robot.
  • the movable platform 300 includes a fuselage 301 and a microwave rotating radar 200, and the microwave rotating radar 200 is installed on the fuselage 301.
  • the body 301 includes a frame 302 and a stand 303 installed on the frame 302.
  • the frame 302 can be used as an installation carrier for the flight control system, processor, video camera, camera, etc. of the movable platform 300.
  • the tripod 303 is installed under the frame 302, and the microwave rotary radar 200 is installed on the tripod 303.
  • the tripod 303 can be used to provide support for the movable platform 300 when it is landed.
  • the tripod 303 can also carry a water tank and be used to spray pesticides and fertilizers on plants through a nozzle.
  • the structure of the microwave rotating radar 200 is as described above, and will not be repeated here.
  • the movable platform 300 further includes an arm 304 extending from the fuselage 301, and the arm 304 can be used to carry a power device 305 to provide the movable platform 300 with flying power.
  • the powered device 305 may include one or more of a rotor, a propeller, a blade, an engine, a motor, a wheel, a axle, a magnet, or a nozzle.
  • the movable platform 300 may have one or more, two or more, three or more, or four or more powered devices 305 onboard.
  • the power devices 305 may all be of the same type. Alternatively, the one or more power devices 305 may be different types of power devices 305.
  • the power device 305 can be installed on the movable platform 300 using any suitable device.
  • the disclosed device and method may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another device, or some features can be ignored or not implemented.
  • the various component embodiments of the present invention may be implemented by hardware, or by software modules running on one or more processors, or by a combination of them.
  • a microprocessor or a digital signal processor (DSP) may be used in practice to implement some or all of the functions of some modules according to the embodiments of the present invention.
  • DSP digital signal processor
  • the present invention can also be implemented as a device program (for example, a computer program and a computer program product) for executing part or all of the methods described herein.
  • Such a program for realizing the present invention may be stored on a computer-readable medium, or may have the form of one or more signals.
  • Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
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Abstract

The present invention provides a microwave antenna structure (100), a microwave rotating radar (200), and a movable platform (300). The microwave antenna structure (100) comprises a base plate (101). Multiple antenna arrays are provided on a first side surface of the base plate (101), and comprise at least two transmitting antenna arrays (1, 2) and multiple receiving antenna arrays (3-9). The at least two transmitting antenna arrays (1, 2) and the multiple receiving antenna arrays (3-9) extend in a first direction, and are arranged in parallel in a second direction perpendicular to the first direction. The microwave antenna structure (100), the microwave rotating radar (200), and the movable platform (300) of the present invention allow the transmitting antenna arrays and the receiving antenna arrays to be arranged in a logical manner, so as to provide a low-cost, compact radar capable of high-precision angle measurement.

Description

微波天线结构、微波旋转雷达及可移动平台Microwave antenna structure, microwave rotating radar and movable platform
说明书Manual
技术领域Technical field
本发明总地涉及天线结构技术领域，更具体地涉及一种微波天线结构、微波旋转雷达及可移动平台。The present invention generally relates to the technical field of antenna structures, and more specifically to a microwave antenna structure, a microwave rotating radar and a movable platform.
背景技术Background technique
随着微波器件的发展，微波雷达可实现小型化、集成化，在天线口径相同的情况下，微波雷达可获得更窄的天线波束，更高的天线增益，可提高雷达的测角分辨率和测角精度，并且有利于抗电子干扰、杂波干扰和多径反射干扰。With the development of microwave devices, microwave radars can be miniaturized and integrated. With the same antenna diameter, microwave radars can obtain narrower antenna beams and higher antenna gains, which can improve the radar’s angular resolution and The angle measurement accuracy is good for resisting electronic interference, clutter interference and multipath reflection interference.
现有微波雷达主要存在以下问题：高精度测角雷达尺寸，尤其是测角方向尺寸较大，雷达成本高。这是因为：对于常规单发射通道雷达而言，雷达测角精度与雷达接收通道数量密切相关，精度越高，雷达接收通道数量越多，雷达尺寸越大，成本越高。为了降低雷达尺寸和成本，开发出了VMIMO雷达。VMIMO雷达通过增加少量的发射通道，通过时分或者相位调制方式控制发射通道发射正交信号，并对接收信号进行相干信号处理，最终实现等效于成倍增加接收通道的常规单发射通道雷达的测角精度，极大降低雷达成本和雷达尺寸。VMIMO雷达天线等效效果如下图1所示。The existing microwave radar mainly has the following problems: the size of the high-precision angle measurement radar, especially the large size in the angle measurement direction, and the high cost of the radar. This is because for conventional single-transmitting channel radars, the accuracy of radar angle measurement is closely related to the number of radar receiving channels. The higher the accuracy, the greater the number of radar receiving channels, the larger the radar size, and the higher the cost. In order to reduce the size and cost of the radar, the VMIMO radar was developed. VMIMO radar adds a small number of transmission channels, controls the transmission channel to transmit quadrature signals through time division or phase modulation, and performs coherent signal processing on the received signals, and finally realizes the measurement equivalent to the conventional single-transmitting channel radar that doubles the receiving channels. Angular accuracy greatly reduces radar cost and radar size. The equivalent effect of the VMIMO radar antenna is shown in Figure 1 below.
虽然目前的VMIMO雷达已经极大降低雷达成本和雷达尺寸，但是由于VMIMO雷达要实现测角，接收天线或者发射天线要在测角面内等距排布，而且发射天线的间距一般等于接收天线间距的数倍(取决于接收天线数量，参见图1中发射天线之间的距离为4倍接收天线距离)，这导致对小型雷达例如车载或小型无人机的雷达，由于空间尺寸较小，即使使用目前的VMIMO雷达，雷达尺寸仍然相对较大，尤其是在测角方向的尺寸较大。Although the current VMIMO radar has greatly reduced the radar cost and the size of the radar, because the VMIMO radar needs to realize the angle measurement, the receiving antenna or the transmitting antenna must be arranged equidistantly in the angle measurement plane, and the spacing of the transmitting antennas is generally equal to the spacing of the receiving antennas. (Depending on the number of receiving antennas, see Figure 1 that the distance between the transmitting antennas is 4 times the receiving antenna distance), which leads to small radars such as radars for vehicles or small drones, due to the small space size, even With the current VMIMO radar, the size of the radar is still relatively large, especially in the direction of angle measurement.
发明内容Summary of the invention
为了解决上述问题中的至少一个而提出了本发明。本发明提供一种微波天线结构、微波旋转雷达及可移动平台，该天线结构采用多发射通道和多接收通道，并通过对发射天线阵列和接收天线阵列合理布局，实现一种低成本紧凑型、且高测角精度的雷达。The present invention is proposed in order to solve at least one of the above-mentioned problems. The invention provides a microwave antenna structure, a microwave rotating radar and a movable platform. The antenna structure adopts multiple transmitting channels and multiple receiving channels, and by rationally arranging the transmitting antenna array and the receiving antenna array, a low-cost, compact, And a radar with high angle measurement accuracy.
具体地，本发明第一方面提供一种微波天线结构，包括：Specifically, the first aspect of the present invention provides a microwave antenna structure, including:
基板，在所述基板的第一侧面上形成有多个天线阵列，多个所述天线阵列包括至少2个发射天线阵列和多个接收天线阵列；A substrate, a plurality of antenna arrays are formed on a first side surface of the substrate, and the plurality of antenna arrays include at least two transmitting antenna arrays and a plurality of receiving antenna arrays;
多个所述接收天线阵列沿第一方向延伸，且多个所述接收天线阵列彼此平行且间隔布置；A plurality of the receiving antenna arrays extend along a first direction, and the plurality of the receiving antenna arrays are parallel to each other and arranged at intervals;
至少2个所述发射天线阵列沿第一方向延伸，且至少2个所述发射天线阵列彼此平行且间隔布置；At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals;
其中，至少2个所述发射天线阵列与多个所述接收天线阵列在第二方向上并行布置，所述第二方向与所述第一方向垂直。Wherein, at least two of the transmitting antenna arrays and a plurality of the receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
在本发明一个实施例中，相邻所述发射天线阵列之间的间距等于n倍相邻所述接收天线阵列之间的间距，其中n为与所述接收天线阵列数量相关的整数。In an embodiment of the present invention, the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is an integer related to the number of receiving antenna arrays.
在本发明一个实施例中，所述第一方向为所述基板的长度方向或宽度方向。In an embodiment of the present invention, the first direction is the length direction or the width direction of the substrate.
在本发明一个实施例中，多个所述天线阵列采用微带天线，每个所述天线阵列包括一组彼此电连接的微带贴片单元。In an embodiment of the present invention, a plurality of the antenna arrays adopt microstrip antennas, and each of the antenna arrays includes a group of microstrip patch units electrically connected to each other.
在本发明一个实施例中，每组所述微带贴片单元中的各个所述微带贴片单元大小彼此相同。In an embodiment of the present invention, each of the microstrip patch units in each group of the microstrip patch units has the same size.
在本发明一个实施例中，每组所述微带贴片单元中的各个所述微带贴片单元的面积自对称中心向两侧依次减小。In an embodiment of the present invention, the area of each of the microstrip patch units in each group of the microstrip patch units decreases in order from the center of symmetry to both sides.
在本发明一个实施例中，所述微带贴片单元的形状为矩形、圆形、半圆形或椭圆。In an embodiment of the present invention, the shape of the microstrip patch unit is rectangle, circle, semicircle or ellipse.
在本发明一个实施例中，每组微带贴片单元包括6个以上的微带贴片单元。In an embodiment of the present invention, each group of microstrip patching units includes more than 6 microstrip patching units.
在本发明一个实施例中，所述接收天线阵列的数量为4个以上。In an embodiment of the present invention, the number of the receiving antenna array is 4 or more.
在本发明一个实施例中，还包括：In an embodiment of the present invention, it further includes:
馈电网络，其形成在所述基板的第一侧面上，所述馈电网络包括分别与每组所述微带贴片单元电连接的多个微带线。A feeder network is formed on the first side surface of the substrate, and the feeder network includes a plurality of microstrip lines respectively electrically connected to each group of the microstrip patch unit.
在本发明一个实施例中，所述微带线与每组所述微带贴片单元通过并馈方式连接。In an embodiment of the present invention, the microstrip line and each group of the microstrip patch unit are connected in a parallel feed mode.
在本发明一个实施例中，所述微带线与每组所述微带贴片单元通过串馈方式连接。In an embodiment of the present invention, the microstrip line is connected to each group of the microstrip patch unit through a serial feed.
在本发明一个实施例中，还包括：与所述馈电网络电连接的射频电路，所述射频电路包括至少一个发射芯片和两个接收芯片，以及与两个所述接收芯片电连接的功分器。In an embodiment of the present invention, it further includes: a radio frequency circuit electrically connected to the feeding network, the radio frequency circuit including at least one transmitting chip and two receiving chips, and a function of electrically connecting to the two receiving chips. Divider.
在本发明一个实施例中，所述射频电路形成在所述基板的第二侧面上。In an embodiment of the present invention, the radio frequency circuit is formed on the second side surface of the substrate.
在本发明一个实施例中，在所述基板上还形成有分别与每组所述微带贴片单元的微带线电连接的多个过孔或馈电探针，所述馈电网络通过多个所述过孔或馈电探针与所述射频电路连接。In an embodiment of the present invention, a plurality of vias or feeding probes electrically connected to the microstrip lines of each group of the microstrip patch unit are formed on the substrate, and the feeding network passes through A plurality of the vias or feed probes are connected with the radio frequency circuit.
在本发明一个实施例中，在所述基板的第二侧面上还形成有多个微带线，每个所述过孔或馈电探针通过对应的所述微带线连接至所述射频电路。In an embodiment of the present invention, a plurality of microstrip lines are further formed on the second side surface of the substrate, and each of the vias or feed probes is connected to the radio frequency through the corresponding microstrip line. Circuit.
在本发明一个实施例中，每组所述微带贴片单元通过耦合馈电方式与所述射频电路电连接。In an embodiment of the present invention, each group of the microstrip patch unit is electrically connected to the radio frequency circuit through a coupling feeding manner.
在本发明一个实施例中，所述射频电路形成在所述基板的第一侧面上。In an embodiment of the present invention, the radio frequency circuit is formed on the first side surface of the substrate.
在本发明一个实施例中，每组所述微带贴片单元通过微带线连接至所述射频电路，其中馈电点位于所述天线阵列的一侧或中间的所述微带线上。In an embodiment of the present invention, each group of the microstrip patch unit is connected to the radio frequency circuit through a microstrip line, wherein the feed point is located on the microstrip line on one side or in the middle of the antenna array.
在本发明一个实施例中所述微带线与每组所述微带贴片单元以垂直方式或倾斜方式连接。In an embodiment of the present invention, the microstrip line and each group of the microstrip patch unit are connected in a vertical manner or an oblique manner.
在本发明一个实施例中，所述基板为双层板、三层板、四层板、五层板或六层板。In an embodiment of the present invention, the substrate is a double-layer board, a three-layer board, a four-layer board, a five-layer board, or a six-layer board.
在本发明一个实施例中，所述基板包括：In an embodiment of the present invention, the substrate includes:
天线板，所述天线阵列形成在所述天线板上；An antenna board, the antenna array is formed on the antenna board;
接地板，位于所述天线板的下方，用于与所述天线阵列的地电连接；以及A ground plate, located under the antenna plate, for electrical connection with the ground of the antenna array; and
多个走线板，位于所述接地板的下方，用于与射频电路电连接，A plurality of wiring boards are located below the ground plate and are used for electrical connection with the radio frequency circuit,
其中，所述天线板、所述接地板以及多个所述走线板依次层叠设置。Wherein, the antenna board, the ground board and a plurality of the wiring boards are stacked in sequence.
在本发明一个实施例中，所述天线阵列采用水平极化方式或垂直极化方式。In an embodiment of the present invention, the antenna array adopts a horizontal polarization mode or a vertical polarization mode.
本发明第二方面提供一种微波旋转雷达，其特征在于，包括：The second aspect of the present invention provides a microwave rotating radar, which is characterized in that it includes:
固定支架；Fixed bracket
电机，安装在所述固定支架上；The motor is installed on the fixed bracket;
旋转支架，安装在所述电机的转子上，并且随着所述电机的转子一起转动；以及A rotating bracket installed on the rotor of the motor and rotating with the rotor of the motor; and
根据本发明第一方面的所述的微波天线结构，安装在所述旋转支架上。The microwave antenna structure according to the first aspect of the present invention is installed on the rotating bracket.
本发明第三方面提供一种可移动平台，其特征在于，包括：A third aspect of the present invention provides a movable platform, which is characterized in that it includes:
机身；body;
动力装置，安装在所述机身上，并且为所述机身提供移动动力；以及A power plant, which is installed on the fuselage and provides moving power for the fuselage; and
根据本发明第二方面所述的微波旋转雷达，安装在所述机身上。The microwave rotating radar according to the second aspect of the present invention is installed on the fuselage.
在本发明一个实施例中所述可移动平台为无人机、自动驾驶汽车或地面遥控机器人。In one embodiment of the present invention, the movable platform is an unmanned aerial vehicle, an autonomous vehicle or a ground remote control robot.
本发明提供了一种微波天线结构、微波旋转雷达及可移动平台，该天线结构采用多发射天线阵列和多接收天线阵列构成VMIMO天线阵列，通过时分或者相位调制方式控制发射通道，发射正交信号，并对接收信号进行相干信号处理，实现等效加倍接收天线数量的高精度测角能力；并且发射天线阵列与接收天线阵列并排布置，与发射天线阵列和接收天线阵列布置在同一直线上相比，极大减小雷达在测角方向的尺寸，使雷达具有更好的适装性。The invention provides a microwave antenna structure, a microwave rotating radar and a movable platform. The antenna structure adopts a multi-transmit antenna array and a multi-receive antenna array to form a VMIMO antenna array. The transmission channel is controlled by time division or phase modulation to transmit orthogonal signals. , And perform coherent signal processing on the received signal to realize the high-precision angle measurement ability equivalent to doubling the number of receiving antennas; and the transmitting antenna array and the receiving antenna array are arranged side by side, compared with the transmitting antenna array and the receiving antenna array being arranged on the same straight line , Greatly reducing the size of the radar in the angle measurement direction, so that the radar has a better fit.
附图说明Description of the drawings
图1是VMIMO雷达的天线等效示意图；Figure 1 is an equivalent schematic diagram of the antenna of the VMIMO radar;
图2是本发明一实施例的微波天线结构的天线阵列示意图；2 is a schematic diagram of an antenna array of a microwave antenna structure according to an embodiment of the present invention;
图3是图1所示的的微波天线结构的剖视图；FIG. 3 is a cross-sectional view of the microwave antenna structure shown in FIG. 1;
图4是图1所示的的微波天线结构的天线与射频器件连接示意图；4 is a schematic diagram of the connection between the antenna and the radio frequency device of the microwave antenna structure shown in FIG. 1;
图5是应用图1所示微波天线结构的微波旋转雷达的示意性剖面图；Fig. 5 is a schematic cross-sectional view of a microwave rotating radar applying the microwave antenna structure shown in Fig. 1;
图6是应用图5所示微波旋转雷达的可移动平台的示意性结构图。Fig. 6 is a schematic structural diagram of a movable platform to which the microwave rotating radar shown in Fig. 5 is applied.
具体实施方式Detailed ways
为了使得本发明的目的、技术方案和优点更为明显，下面将参照附图详细描述根据本发明的示例实施例。显然，所描述的实施例仅仅是本发明的一部分实施例，而不是本发明的全部实施例，应理解，本发明不受这里描述的示例实施例的限制。基于本发明中描述的本发明实施例，本领域技术人员在没有付出创造性劳动的情况下所得到的所有其它实施例都应落入本发明的保护范围之内。In order to make the objectives, technical solutions, and advantages of the present invention more obvious, the exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments of the present invention, and it should be understood that the present invention is not limited by the exemplary embodiments described herein. Based on the embodiments of the present invention described in the present invention, all other embodiments obtained by those skilled in the art without creative work should fall within the protection scope of the present invention.
在下文的描述中，给出了大量具体的细节以便提供对本发明更为彻底的理解。然而，对于本领域技术人员而言显而易见的是，本发明可以无需一个或多个这些细节而得以实施。在其他的例子中，为了避免与本发明发生混淆，对于本领域公知的一些技术特征未进行描述。In the following description, a lot of specific details are given in order to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some technical features known in the art are not described.
应当理解的是，本发明能够以不同形式实施，而不应当解释为局限于这里提出的实施例。相反地，提供这些实施例将使公开彻底和完全，并且将本发明的范围完全地传递给本领域技术人员。It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments presented here. On the contrary, the provision of these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.
在此使用的术语的目的仅在于描述具体实施例并且不作为本发明的限制。在此使用时，单数形式的“一”、“一个”和“所述/该”也意图包括复数形式，除非上下文清楚指出另外的方式。还应明白术语“组成”和/或“包括”，当在该说明书中使用时，确定所述特征、整数、步骤、操作、元件和/或部件的存在，但不排除一个或更多其它的特征、整数、步骤、操作、元件、部件和/或组的存在或添加。在此使用时，术语“和/或”包括相关所列项目的任何及所有组合。The purpose of the terms used here is only to describe specific embodiments and not as a limitation of the present invention. When used herein, the singular forms "a", "an" and "the/the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "composition" and/or "including", when used in this specification, determine the existence of the described features, integers, steps, operations, elements and/or components, but do not exclude one or more other The existence or addition of features, integers, steps, operations, elements, components, and/or groups. As used herein, the term "and/or" includes any and all combinations of related listed items.
为了彻底理解本发明，将在下列的描述中提出详细的步骤以及详细的结构，以便阐释本发明提出的技术方案。本发明的较佳实施例详细描述如下，然而除了这些详细描述外，本发明还可以具有其他实施方式。In order to thoroughly understand the present invention, detailed steps and detailed structures will be proposed in the following description to explain the technical solution proposed by the present invention. The preferred embodiments of the present invention are described in detail as follows. However, in addition to these detailed descriptions, the present invention may also have other embodiments.
图2是根据本发明一实施例的微波天线结构的天线阵列示意图；图3是根据本发明一实施例的微波天线结构的剖视图；图4是根据本发明一实施例的微波天线结构的天线与射频器件连接示意图。2 is a schematic diagram of an antenna array of a microwave antenna structure according to an embodiment of the present invention; FIG. 3 is a cross-sectional view of a microwave antenna structure according to an embodiment of the present invention; FIG. 4 is an antenna and a microwave antenna structure according to an embodiment of the present invention Schematic diagram of radio frequency device connection.
请参阅图2至图4，在本发明实施例中提供的微波天线结构100包括基板101，在所述基板101的第一侧面(即正面)上形成有多个天线阵列，多个所述天线阵列包括至少2个发射天线阵列(例如发射天线阵列1和2)和多个接收天线阵列(例如接收天线阵列3-10)。Referring to FIGS. 2 to 4, the microwave antenna structure 100 provided in the embodiment of the present invention includes a substrate 101, and a plurality of antenna arrays are formed on a first side (ie, front) of the substrate 101. The array includes at least 2 transmitting antenna arrays (for example, transmitting antenna arrays 1 and 2) and multiple receiving antenna arrays (for example, receiving antenna arrays 3-10).
多个所述接收天线阵列沿第一方向延伸，且多个所述接收天线阵列彼此平行且间隔布置。示例性地，在本实施例中，包括8个接收天线阵列，接收天线阵列3-10。当然，在其它实施例中，接收天线阵列的数量也可以根据需要采用其它数量，例如可以为采用4个接收天线阵列，或者16个接收天线阵列。在本文中，多个所述接收天线阵列沿第一方向延伸指的是多个所述接收天线阵列沿第一方向依次布置。The plurality of receiving antenna arrays extend along a first direction, and the plurality of receiving antenna arrays are parallel to each other and arranged at intervals. Exemplarily, in this embodiment, there are 8 receiving antenna arrays, and receiving antenna arrays 3-10. Of course, in other embodiments, the number of receiving antenna arrays can also be other numbers as required, for example, 4 receiving antenna arrays or 16 receiving antenna arrays can be used. In this context, that the plurality of receiving antenna arrays extend along the first direction refers to that the plurality of receiving antenna arrays are arranged in sequence along the first direction.
至少2个所述发射天线阵列沿第一方向延伸，且至少2个所述发射天线阵列彼此平行且间隔布置。示例性地，在本实施例中，包括2个发射天线阵列，发射天线阵列1和2。然，在其它实施例中，发射天线阵列的数量也可以根据需要采用其它数量，例如可以为采用3或者4个发射天线阵列。在本文中，至少2个所述发射天线阵列沿第一方向延伸指的是多至少2个所述发射天线阵列沿第一方向依次布置。在本发明实施例中，相邻所述发射天线阵列之间的间距等于n倍相邻所述接收天线阵列之间的间距，其中n为与所述接收天线阵列数量相关的整数。示例性地，在本实施例中，发射天线阵列1和2之间的间距等于8倍的相邻接收天线阵列之间的间距D。相邻接收天线阵列之间的间距D指的是相邻接收天线阵列对应的边之间的距离或相邻接收天线阵列中心之间的距离。以图2所采用的微带天线阵列为例，相邻接收天线阵列之间的间距D指的是相邻接收天线阵列的微带贴片对应边之间的距离或微带贴片中心之间的距离。At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals. Exemplarily, in this embodiment, two transmitting antenna arrays, transmitting antenna arrays 1 and 2 are included. However, in other embodiments, the number of transmitting antenna arrays may also be other numbers as required, for example, 3 or 4 transmitting antenna arrays may be used. In this context, that at least two of the transmitting antenna arrays extend along the first direction means that at least two of the transmitting antenna arrays are arranged in sequence along the first direction. In the embodiment of the present invention, the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is an integer related to the number of receiving antenna arrays. Exemplarily, in this embodiment, the distance between the transmitting antenna arrays 1 and 2 is equal to 8 times the distance D between adjacent receiving antenna arrays. The distance D between adjacent receiving antenna arrays refers to the distance between the corresponding sides of the adjacent receiving antenna arrays or the distance between the centers of the adjacent receiving antenna arrays. Taking the microstrip antenna array used in Figure 2 as an example, the distance D between adjacent receiving antenna arrays refers to the distance between the corresponding sides of the microstrip patch of the adjacent receiving antenna array or the center of the microstrip patch distance.
本实施例的微波天线结构100采用多个接收天线阵列和至少两个发射天线阵列构成VMIMO天线阵列，因此可以通过时分或者相位调制方式控制发射通道，发射正交信号，并对接收信号进行相干信号处理，实现等效加倍接收天线数量的高精度测角能力，以图2所示为例，参见图1所示原理，其可以实现等效于16个接收天线阵列的测角能力。The microwave antenna structure 100 of this embodiment uses multiple receiving antenna arrays and at least two transmitting antenna arrays to form a VMIMO antenna array. Therefore, it is possible to control the transmitting channel through time division or phase modulation, transmit orthogonal signals, and perform coherent signals on the received signals. Processing to achieve the high-precision angle measurement capability equivalent to twice the number of receiving antennas. Taking Figure 2 as an example, referring to the principle shown in Figure 1, it can achieve an angle measurement capability equivalent to 16 receiving antenna arrays.
进一步地，由于发射天线阵列之间的间距数倍于接收天线阵列之间的间距，为了减小微波天线结构100在测角方向的尺寸，在本实施例中，如 图2所示，将至少2个所述发射天线阵列与多个所述接收天线阵列在第二方向上并行布置，所述第二方向与所述第一方向垂直。示例性地，在本发明实施例中，所述第一方向为所述基板的长度方向或宽度方向，以图2所示，第一方向为基板101的宽度方向或纵向。Further, since the spacing between the transmitting antenna arrays is several times the spacing between the receiving antenna arrays, in order to reduce the size of the microwave antenna structure 100 in the angular measurement direction, in this embodiment, as shown in FIG. 2, at least The two transmitting antenna arrays and the multiple receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction. Exemplarily, in the embodiment of the present invention, the first direction is the length direction or the width direction of the substrate. As shown in FIG. 2, the first direction is the width direction or the longitudinal direction of the substrate 101.
在本实施例中，发射天线阵列与接收天线阵列并排布置，与发射天线阵列和接收天线阵列布置在同一直线上相比，极大减小雷达在测角方向的尺寸，使雷达具有更好的适装性，可以安装在空间更小的设备中。In this embodiment, the transmitting antenna array and the receiving antenna array are arranged side by side. Compared with the transmitting antenna array and the receiving antenna array are arranged on the same straight line, the size of the radar in the angle measurement direction is greatly reduced, so that the radar has better performance. Adaptability, can be installed in equipment with a smaller space.
在本实施例中，发射天线阵列和接收天线阵列采用微带天线。当然，在其它实施例中，也可以采用其它形式的天线。在本文中，以微带天线为例对发射天线阵列和接收天线阵列的结构进行描述。In this embodiment, the transmitting antenna array and the receiving antenna array adopt microstrip antennas. Of course, in other embodiments, other forms of antennas can also be used. In this article, a microstrip antenna is taken as an example to describe the structure of the transmitting antenna array and the receiving antenna array.
如图2所示，每个天线阵列，例如接收天线阵列或发射天线阵列，包括一组彼此电连接的微带贴片单元11。示例性地，在本实施例中，每组所述微带贴片单元11包括8个微带贴片单元11。应当理解，虽然在本实施例中，每组所述微带贴片单元11包括8个微带贴片单元11，但是在本发明的其它实施例中，每组所述微带贴片单元11中包含的微带贴片单元11的数量不限于8个，可以多余8个，例如为12个，也可以少于8个，例如为6个。As shown in FIG. 2, each antenna array, such as a receiving antenna array or a transmitting antenna array, includes a group of microstrip patch units 11 electrically connected to each other. Exemplarily, in this embodiment, each group of the microstrip patching unit 11 includes 8 microstrip patching units 11. It should be understood that although in this embodiment, each group of the microstrip patch unit 11 includes 8 microstrip patch units 11, in other embodiments of the present invention, each group of the microstrip patch unit 11 The number of microstrip patch units 11 included is not limited to 8, and can be more than 8, such as 12, or less than 8, such as 6.
如图2所示，在本实施例中，每组微带贴片单元11中各个贴片单元11的大小相同，且均为矩形。示例性地，微带贴片单元11的长度A为3.1mm，宽度B为4.3mm，即微带贴片单元11的尺寸为3.1*4.3mm。相邻两个微带贴片单元11的间距C为7.6mm。相邻两个微带贴片单元11的间距C指的相邻两个微带贴片单元11同一边之间的距离，例如图2中表示为相邻两个微带贴片单元11左侧边之间的距离。As shown in FIG. 2, in this embodiment, each patch unit 11 in each group of microstrip patch unit 11 has the same size and is rectangular. Illustratively, the length A of the microstrip patch unit 11 is 3.1 mm, and the width B is 4.3 mm, that is, the size of the microstrip patch unit 11 is 3.1*4.3 mm. The distance C between two adjacent microstrip patch units 11 is 7.6 mm. The distance C between two adjacent microstrip patch units 11 refers to the distance between two adjacent microstrip patch units 11 on the same side, for example, it is shown as the left side of two adjacent microstrip patch units 11 in FIG. 2 The distance between the edges.
应当理解，微带贴片单元11的大小与微带贴片单元11的辐射能量、介电常数等相关，本实施例公开的尺寸仅是示例性的，在其它实施例中，微带贴片单元11可以采用各种其它合适的尺寸。It should be understood that the size of the microstrip patch unit 11 is related to the radiation energy, dielectric constant, etc. of the microstrip patch unit 11. The dimensions disclosed in this embodiment are only exemplary. In other embodiments, the microstrip patch The unit 11 can take various other suitable sizes.
进一步地，根据阵列天线理论相邻两个所述接收天线阵列3-10之间的间距D决定了天线结构100的测角范围，相邻两个所述接收天线阵列3-10之间的间距D越小，测角范围越大，但间距过小会造成天线间耦合增大、增益降低、方向图恶化，考虑实际应用在本实施例中，相邻两个所述接收 天线阵列3-10之间的间距D为6.0mm～15.0mm。优选地，间距D为6.2mm～12.5mm。更有选地，间距D为6.6mm。其中，当间距D为6.2mm时对应测角范围为正负90度，间距D为6.6mm时对应测角范围为正负70度，间距D为12.5mm时对应测角范围正负30度。其中，测角范围的角度θ＝arcsin(λ/2D)，λ＝C/f，其中C为光速，f＝24.15×10 9HZ。 Further, according to the array antenna theory, the distance D between two adjacent receiving antenna arrays 3-10 determines the angle measurement range of the antenna structure 100, and the distance between two adjacent receiving antenna arrays 3-10 The smaller the D, the larger the angle measurement range, but if the distance is too small, the coupling between the antennas will increase, the gain will decrease, and the pattern will deteriorate. Considering the practical application in this embodiment, two adjacent receiving antenna arrays 3-10 The distance D between them is 6.0 mm to 15.0 mm. Preferably, the distance D is 6.2 mm to 12.5 mm. More preferably, the distance D is 6.6 mm. Among them, when the distance D is 6.2 mm, the corresponding angle measurement range is plus or minus 90 degrees, when the distance D is 6.6 mm, the corresponding angle measurement range is plus or minus 70 degrees, and when the distance D is 12.5 mm, the corresponding angle measurement range is plus or minus 30 degrees. Among them, the angle of the angle measurement range θ=arcsin(λ/2D), λ=C/f, where C is the speed of light, f=24.15×10 9 HZ.
如图3所示，基板101包括天线板102、接地板103和两个走线板104，以及设置在天线板102、接地板103和多个走线板104彼此之间的介质板105。所述天线板102、所述接地板103以及多个所述走线板104依次层叠设置。天线阵列形成在天线板102上，天线板102可以通过蚀刻形成在第一介质板105A上的导体贴片形成。接地板103位于所述天线板102的下方，用于与所述天线阵列的地电连接。接地板103与天线板102之间通过第一介质板105A隔离。走线板104位于所述接地板103的下方，用于与射频电路电连接。走线板104与接地板103之间通过第二介质板105B隔离，走线板104之间通过第三介质板105C隔离。示例性地，在本实施例中，射频电路形成在所述基板101的第二侧面(即背面)上，也即形成在第三介质板105C的一侧或图2中最下方的走线板104上。As shown in FIG. 3, the substrate 101 includes an antenna plate 102, a ground plate 103, and two wiring plates 104, and a dielectric plate 105 disposed between the antenna plate 102, the ground plate 103, and the multiple wiring plates 104. The antenna board 102, the ground board 103, and a plurality of the wiring boards 104 are stacked in sequence. The antenna array is formed on the antenna board 102, and the antenna board 102 may be formed by etching a conductor patch formed on the first dielectric board 105A. The ground plate 103 is located below the antenna plate 102 and is used for electrical connection with the ground of the antenna array. The ground plate 103 and the antenna plate 102 are separated by a first dielectric plate 105A. The wiring board 104 is located under the ground board 103 and is used for electrical connection with the radio frequency circuit. The wiring board 104 and the grounding plate 103 are separated by a second dielectric plate 105B, and the wiring board 104 is separated by a third dielectric plate 105C. Exemplarily, in this embodiment, the radio frequency circuit is formed on the second side (ie, the back side) of the substrate 101, that is, on the side of the third dielectric plate 105C or the bottom wiring board in FIG. 2 104 on.
示例性地，在本实施例中，介质板105的长度为92mm，宽度为87mm，厚度为32mil。介质板105的介电常数为3.6。Exemplarily, in this embodiment, the length of the dielectric plate 105 is 92 mm, the width is 87 mm, and the thickness is 32 mils. The dielectric constant of the dielectric plate 105 is 3.6.
应当理解，虽然在本实施例中，基板101包括天线板102、接地板103和两个走线板104，但是本发明不限于此，根据本发明的微波天线结构100，其基板101可以包括一个走线板104，也可以包括三个以上的走线板104，或者还可以不包括走线板104，走线板104数量根据介质板105的大小以及天线和射频电路以及连线的大小确定，如果在一个介质板的表面上即可容纳天线板、射频电路和走线，此时便可不需要设置走线板104，此时，所述射频电路形成在所述基板的第一侧面上。即，在本发明一个实施例中，根据本发明的微波天线结构100，其基板101可以为双层板(天线板加接地板)、三层板(天线板、接地板和一个走线板)、四层板(天线板、接地板和两个走线板)、五层板(天线板、接地板和三个走线板)或六层板(天线板、接地板和四个走线板)等各种结构。It should be understood that although in this embodiment, the substrate 101 includes an antenna plate 102, a ground plate 103 and two wiring boards 104, the present invention is not limited to this. According to the microwave antenna structure 100 of the present invention, the substrate 101 may include one The wiring board 104 may also include more than three wiring boards 104, or may not include the wiring board 104. The number of wiring boards 104 is determined according to the size of the dielectric board 105, the size of the antenna, the radio frequency circuit, and the connection. If the antenna board, radio frequency circuit and wiring can be accommodated on the surface of a dielectric board, the wiring board 104 does not need to be provided at this time. At this time, the radio frequency circuit is formed on the first side surface of the substrate. That is, in an embodiment of the present invention, the substrate 101 of the microwave antenna structure 100 according to the present invention may be a double-layer board (antenna board plus a grounding board), a three-layer board (antenna board, grounding board, and a wiring board). , Four-layer board (antenna board, grounding board and two wiring boards), five-layer board (antenna board, grounding board and three wiring boards) or six-layer board (antenna board, grounding board and four wiring boards) ) And other structures.
请再次参考图2，微波天线结构100还包括馈电网络，其形成在所述 基板101的第一侧面上，所述馈电网络包括分别与每组所述微带贴片单元11电连接的多个微带线12。并且，在本实施例中，如图2所示，所述微带线12与每组所述微带贴片单元11通过串馈方式连接。在本实施例中，接收天线阵列和发射天线阵列的馈电点位于接收天线阵列或发射天线阵列的一侧或中间，例如位于天线阵列中位于一侧或中间的微带线与射频网络进行电连接。应当理解，虽然在本实施例中，接收天线阵列和发射天线阵列直接通过微带线馈电，但是在其它实施例中，也可以通过过孔或馈电探针进行馈电。例如，可以基板101上形成分别与每组所述微带贴片单元11的微带线12电连接的多个过孔或馈电探针，所述馈电网络通过多个所述过孔或馈电探针与射频电路连接，或者，每组所述微带贴片单元11通过耦合馈电方式与射频电路电连接。相应地，在所述基板的第二侧面上还形成有多个微带线，每个所述过孔或馈电探针通过对应的所述微带线连接至所述射频电路。Please refer to FIG. 2 again, the microwave antenna structure 100 also includes a feeder network formed on the first side of the substrate 101, and the feeder network includes electrical connections to each group of the microstrip patch unit 11, respectively. Multiple microstrip lines 12. Moreover, in this embodiment, as shown in FIG. 2, the microstrip line 12 is connected to each group of the microstrip patch unit 11 through a serial feed. In this embodiment, the feeding points of the receiving antenna array and the transmitting antenna array are located on one side or in the middle of the receiving antenna array or the transmitting antenna array. For example, a microstrip line located on one side or in the middle of the antenna array is connected to the radio frequency network. connection. It should be understood that although in this embodiment, the receiving antenna array and the transmitting antenna array are directly fed through the microstrip line, in other embodiments, the power may also be fed through a via hole or a feeding probe. For example, a plurality of vias or feeding probes electrically connected to the microstrip lines 12 of each group of the microstrip patch unit 11 may be formed on the substrate 101, and the feeding network may pass through the plurality of vias or The feeding probe is connected to the radio frequency circuit, or each group of the microstrip patch unit 11 is electrically connected to the radio frequency circuit through a coupling feeding manner. Correspondingly, a plurality of microstrip lines are also formed on the second side surface of the substrate, and each of the vias or feed probes is connected to the radio frequency circuit through the corresponding microstrip line.
虽然在本实施例中，每组微带贴片单元采用串馈方式，但是在其它实施例中，也可以采用并馈方式，此时每组所述微带贴片单元中各个微带贴片单元并联练级在微带线上，且所述微带线与每组所述微带贴片单元以垂直方式或倾斜方式连接。Although in this embodiment, each group of microstrip patch units adopts the serial feed mode, in other embodiments, the parallel feed mode can also be adopted. In this case, each microstrip patch unit in each group of the microstrip patch unit The units are leveled in parallel on a microstrip line, and the microstrip line is connected to each group of the microstrip patch unit in a vertical manner or an oblique manner.
如图4所示，本实施例提供的微波天线结构100还包括与所述馈电网络电连接的射频电路，所述射频电路包括1个发射芯片20和两个接收芯片21，以及与2个所述接收芯片21电连接的功分器22。发射芯片20与发射天线TX1和TX2电连接，接收芯片21与接收天线RX(RX1-8)电连接。在本实施例中，每个接收芯片21分别连接至4个接收天线，即第一接收芯片21与接收天线RX1、RX2、RX3和RX4连接，第二接收芯片21与接收天线RX5、RX6、RX7和RX8连接。功分器22用于接收芯片21接收辐射能量合成一路输出。应当理解，发射芯片20、接收芯片21和功分器22的数量与发射天线和接收天线的数量相关，而不限于图3所示的数量。发射芯片20、接收芯片21和功分器22可以采用各种合适的芯片，例如功分器22可以采用威尔金森功分器。As shown in FIG. 4, the microwave antenna structure 100 provided by this embodiment further includes a radio frequency circuit electrically connected to the feed network. The radio frequency circuit includes one transmitting chip 20 and two receiving chips 21, and two The receiving chip 21 is electrically connected to a power divider 22. The transmitting chip 20 is electrically connected to the transmitting antennas TX1 and TX2, and the receiving chip 21 is electrically connected to the receiving antenna RX (RX1-8). In this embodiment, each receiving chip 21 is connected to four receiving antennas, that is, the first receiving chip 21 is connected to the receiving antennas RX1, RX2, RX3, and RX4, and the second receiving chip 21 is connected to the receiving antennas RX5, RX6, and RX7. Connect with RX8. The power divider 22 is used for the receiving chip 21 to receive the radiant energy to synthesize one output. It should be understood that the number of transmitting chips 20, receiving chips 21, and power dividers 22 is related to the number of transmitting antennas and receiving antennas, and is not limited to the number shown in FIG. 3. The transmitting chip 20, the receiving chip 21, and the power divider 22 may adopt various suitable chips. For example, the power divider 22 may adopt a Wilkinson power divider.
进一步地，由于目标对雷达电磁波反射强弱与天线极化相关，考虑不同应用环境采取不同的天线极化方式，例如在农田作业环境里很细的横拉 电线对农业无人机的威胁更大，此时本实施例提供的微波天线结构100采用水平极化方式，而其他更关注垂直目标的情景本实施例提供的微波天线结构100使用垂直极化方式。Furthermore, since the target's electromagnetic wave reflection to the radar is related to the antenna polarization, different antenna polarization methods are taken into consideration for different application environments. For example, in the farmland operation environment, the thin horizontal wires are more threatening to agricultural drones. At this time, the microwave antenna structure 100 provided in this embodiment adopts a horizontal polarization mode, while other scenarios that pay more attention to vertical targets. The microwave antenna structure 100 provided in this embodiment uses a vertical polarization mode.
本实施例提供的微波天线结构100由于采用微带阵列天线，其占用空间较小，并且结构相对简单，成本降低，并且可以较大的测角范围、较高测角分辨率，增益、波束宽度、副瓣均能满足实际使用需求。Because the microwave antenna structure 100 provided in this embodiment adopts a microstrip array antenna, it occupies a small space, has a relatively simple structure, reduces costs, and can have a larger angle measurement range, higher angle measurement resolution, gain, and beam width. Both the side lobes can meet the actual needs of use.
应当理解，上述仅仅对本发明的微波天线结构进行示例性说明，根据本发明的微波天线结构还可以采用各种类似上述原理的结构。It should be understood that the foregoing is only an exemplary description of the microwave antenna structure of the present invention, and the microwave antenna structure according to the present invention may also adopt various structures similar to the foregoing principles.
图5是根据本发明一实施例的微波旋转雷达的示意性剖面图。如图5所示，在本发明实施例中，微波旋转雷达200包括罩体201，在罩体201中设置有固定支架202，在固定支架202上安装有电机，电机包括定子203和转子204，在转子204上安装有旋转支架205，旋转支架205随着所述电机的转子204一起转动；在旋转支架205上安装有微波天线结构206和天线控制器207，微波天线结构206的具体结构如前所述，天线控制器207用于控制微波天线结构206发射和接收微波信号。Fig. 5 is a schematic cross-sectional view of a microwave rotating radar according to an embodiment of the present invention. As shown in FIG. 5, in the embodiment of the present invention, the microwave rotating radar 200 includes a cover 201, a fixed bracket 202 is provided in the cover 201, and a motor is installed on the fixed bracket 202. The motor includes a stator 203 and a rotor 204. A rotating bracket 205 is installed on the rotor 204, and the rotating bracket 205 rotates with the rotor 204 of the motor; a microwave antenna structure 206 and an antenna controller 207 are installed on the rotating bracket 205. The specific structure of the microwave antenna structure 206 is as before As described, the antenna controller 207 is used to control the microwave antenna structure 206 to transmit and receive microwave signals.
进一步地，在某些实施方式中，微波旋转雷达200还包括角度传感器208，角度传感器208用于检测转子204的转动角度。角度传感器208可以是霍尔传感器、电位器和编码器中的一种或几种。可以理解，角度传感器208检测转子204的转动角度，也就是检测微波旋转雷达200的转动角度。使用微波旋转雷达200的装置可根据微波旋转雷达200的转动角度来辅助判断微波信号的发射方向和接收到的微波信号的方向，并进一步地判断障碍物与使用微波旋转雷达200的装置的相对方向。Further, in some embodiments, the microwave rotation radar 200 further includes an angle sensor 208, and the angle sensor 208 is used to detect the rotation angle of the rotor 204. The angle sensor 208 may be one or more of a Hall sensor, a potentiometer, and an encoder. It can be understood that the angle sensor 208 detects the rotation angle of the rotor 204, that is, detects the rotation angle of the microwave rotating radar 200. The device using the microwave rotating radar 200 can assist in determining the transmission direction of the microwave signal and the direction of the received microwave signal according to the rotation angle of the microwave rotating radar 200, and further determine the relative direction of the obstacle and the device using the microwave rotating radar 200 .
图6是根据本发明一实施例的可移动平台的示意性框图。虽然可移动平台300被描绘为无人飞行器，但这种描绘并不旨在是限制性的，其可以使用任何合适类型的可移动物体，例如可移动平台300可以为无人机、自动驾驶汽车或地面遥控机器人。Fig. 6 is a schematic block diagram of a movable platform according to an embodiment of the present invention. Although the movable platform 300 is depicted as an unmanned aerial vehicle, this depiction is not intended to be limiting, and any suitable type of movable object may be used. For example, the movable platform 300 may be a drone or an autonomous vehicle. Or ground remote control robot.
如图6所示，可移动平台300包括机身301和微波旋转雷达200，微波旋转雷达200安装在机身301上。具体地，机身301包括机架302和安装在机架302上的脚架303。机架302可作为可移动平台300的飞行控制系统、处理器、摄像机、照相机等的安装载体。脚架303安装在机架302的 下方，微波旋转雷达200安装在脚架303上。脚架303可用于为可移动平台300降落时提供支撑，在一个实施例中，脚架303还可以搭载水箱，并用于通过喷头对植物喷洒农药和肥料等。微波旋转雷达200的结构如前所述，在此不再赘述。As shown in FIG. 6, the movable platform 300 includes a fuselage 301 and a microwave rotating radar 200, and the microwave rotating radar 200 is installed on the fuselage 301. Specifically, the body 301 includes a frame 302 and a stand 303 installed on the frame 302. The frame 302 can be used as an installation carrier for the flight control system, processor, video camera, camera, etc. of the movable platform 300. The tripod 303 is installed under the frame 302, and the microwave rotary radar 200 is installed on the tripod 303. The tripod 303 can be used to provide support for the movable platform 300 when it is landed. In one embodiment, the tripod 303 can also carry a water tank and be used to spray pesticides and fertilizers on plants through a nozzle. The structure of the microwave rotating radar 200 is as described above, and will not be repeated here.
进一步地，可移动平台300还包括自机身301延伸的机臂304，机臂304可用于搭载动力装置305以为可移动平台300提供飞行的动力。搭载动力装置305可以包括旋翼、螺旋桨、桨叶、引擎、电机、轮子、轮轴、磁体或喷嘴中的一种或多种。可移动平台300可以具有一个或多个、两个或更多个、三个或更多个或者四个或更多个搭载动力装置305。动力装置305可以全都是同一类型。备选地，一个或多个动力装置305可以是不同类型的动力装置305。动力装置305可以使用任何合适的装置来安装在可移动平台300上。Further, the movable platform 300 further includes an arm 304 extending from the fuselage 301, and the arm 304 can be used to carry a power device 305 to provide the movable platform 300 with flying power. The powered device 305 may include one or more of a rotor, a propeller, a blade, an engine, a motor, a wheel, a axle, a magnet, or a nozzle. The movable platform 300 may have one or more, two or more, three or more, or four or more powered devices 305 onboard. The power devices 305 may all be of the same type. Alternatively, the one or more power devices 305 may be different types of power devices 305. The power device 305 can be installed on the movable platform 300 using any suitable device.
尽管这里已经参考附图描述了示例实施例，应理解上述示例实施例仅仅是示例性的，并且不意图将本发明的范围限制于此。本领域普通技术人员可以在其中进行各种改变和修改，而不偏离本发明的范围和精神。所有这些改变和修改意在被包括在所附权利要求所要求的本发明的范围之内。Although the exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above-described exemplary embodiments are merely exemplary, and are not intended to limit the scope of the present invention thereto. Those of ordinary skill in the art can make various changes and modifications therein without departing from the scope and spirit of the present invention. All these changes and modifications are intended to be included within the scope of the present invention as claimed in the appended claims.
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本发明的范围。A person of ordinary skill in the art may realize that the units and algorithm steps of the examples described in combination with the embodiments disclosed herein can be implemented by electronic hardware or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software depends on the specific application and design constraint conditions of the technical solution. Professionals and technicians can use different methods for each specific application to implement the described functions, but such implementation should not be considered as going beyond the scope of the present invention.
在本申请所提供的几个实施例中，应该理解到，所揭露的设备和方法，可以通过其它的方式实现。例如，以上所描述的设备实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个设备，或一些特征可以忽略，或不执行。In the several embodiments provided in this application, it should be understood that the disclosed device and method may be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components may be combined or It can be integrated into another device, or some features can be ignored or not implemented.
在此处所提供的说明书中，说明了大量具体细节。然而，能够理解，本发明的实施例可以在没有这些具体细节的情况下实践。在一些实例中，并未详细示出公知的方法、结构和技术，以便不模糊对本说明书的理解。In the instructions provided here, a lot of specific details are explained. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail, so as not to obscure the understanding of this specification.
类似地，应当理解，为了精简本发明并帮助理解各个发明方面中的一个或多个，在对本发明的示例性实施例的描述中，本发明的各个特征有时被一起分组到单个实施例、图、或者对其的描述中。然而，并不应将该本发明的方法解释成反映如下意图：即所要求保护的本发明要求比在每个权利要求中所明确记载的特征更多的特征。更确切地说，如相应的权利要求书所反映的那样，其发明点在于可以用少于某个公开的单个实施例的所有特征的特征来解决相应的技术问题。因此，遵循具体实施方式的权利要求书由此明确地并入该具体实施方式，其中每个权利要求本身都作为本发明的单独实施例。Similarly, it should be understood that in order to simplify the present invention and help understand one or more of the various aspects of the invention, in the description of the exemplary embodiments of the present invention, the various features of the present invention are sometimes grouped together into a single embodiment. , Or in its description. However, the method of the present invention should not be construed as reflecting the intention that the claimed invention requires more features than those explicitly stated in each claim. To be more precise, as reflected in the corresponding claims, the point of the invention is that the corresponding technical problems can be solved with features that are less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are thus explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present invention.
本领域的技术人员可以理解，除了特征之间相互排斥之外，可以采用任何组合对本说明书(包括伴随的权利要求、摘要和附图)中公开的所有特征以及如此公开的任何方法或者设备的所有过程或单元进行组合。除非另外明确陈述，本说明书(包括伴随的权利要求、摘要和附图)中公开的每个特征可以由提供相同、等同或相似目的替代特征来代替。Those skilled in the art can understand that in addition to mutual exclusion between the features, any combination of all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and any method or device disclosed in this manner can be used. Processes or units are combined. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract and drawings) may be replaced by an alternative feature providing the same, equivalent or similar purpose.
此外，本领域的技术人员能够理解，尽管在此所述的一些实施例包括其它实施例中所包括的某些特征而不是其它特征，但是不同实施例的特征的组合意味着处于本发明的范围之内并且形成不同的实施例。例如，在权利要求书中，所要求保护的实施例的任意之一都可以以任意的组合方式来使用。In addition, those skilled in the art can understand that although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments means that they are within the scope of the present invention. Within and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.
本发明的各个部件实施例可以以硬件实现，或者以在一个或者多个处理器上运行的软件模块实现，或者以它们的组合实现。本领域的技术人员应当理解，可以在实践中使用微处理器或者数字信号处理器(DSP)来实现根据本发明实施例的一些模块的一些或者全部功能。本发明还可以实现为用于执行这里所描述的方法的一部分或者全部的装置程序(例如，计算机程序和计算机程序产品)。这样的实现本发明的程序可以存储在计算机可读介质上，或者可以具有一个或者多个信号的形式。这样的信号可以从因特网网站上下载得到，或者在载体信号上提供，或者以任何其他形式提供。The various component embodiments of the present invention may be implemented by hardware, or by software modules running on one or more processors, or by a combination of them. Those skilled in the art should understand that a microprocessor or a digital signal processor (DSP) may be used in practice to implement some or all of the functions of some modules according to the embodiments of the present invention. The present invention can also be implemented as a device program (for example, a computer program and a computer program product) for executing part or all of the methods described herein. Such a program for realizing the present invention may be stored on a computer-readable medium, or may have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.
应该注意的是上述实施例对本发明进行说明而不是对本发明进行限制，并且本领域技术人员在不脱离所附权利要求的范围的情况下可设计出替换实施例。在权利要求中，不应将位于括号之间的任何参考符号构造成 对权利要求的限制。本发明可以借助于包括有若干不同元件的硬件以及借助于适当编程的计算机来实现。在列举了若干装置的单元权利要求中，这些装置中的若干个可以是通过同一个硬件项来具体体现。单词第一、第二、以及第三等的使用不表示任何顺序。可将这些单词解释为名称。It should be noted that the above-mentioned embodiments illustrate rather than limit the present invention, and those skilled in the art can design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be constructed to limit the claims. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims that list several devices, several of these devices may be embodied in the same hardware item. The use of the words first, second, and third, etc. do not indicate any order. These words can be interpreted as names.
以上所述，仅为本发明的具体实施方式或对具体实施方式的说明，本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。本发明的保护范围应以权利要求的保护范围为准。The above are only specific implementations or descriptions of specific implementations of the present invention. The protection scope of the present invention is not limited thereto. Any person skilled in the art can easily fall within the technical scope disclosed by the present invention. Any change or replacement should be included in the protection scope of the present invention. The protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (70)

  1. 一种微波天线结构，其特征在于，包括：A microwave antenna structure, characterized in that it comprises:
    基板，在所述基板的第一侧面上形成有多个天线阵列，多个所述天线阵列包括至少2个发射天线阵列和多个接收天线阵列；A substrate, a plurality of antenna arrays are formed on a first side surface of the substrate, and the plurality of antenna arrays include at least two transmitting antenna arrays and a plurality of receiving antenna arrays;
    多个所述接收天线阵列沿第一方向延伸，且多个所述接收天线阵列彼此平行且间隔布置；A plurality of the receiving antenna arrays extend along a first direction, and the plurality of the receiving antenna arrays are parallel to each other and arranged at intervals;
    至少2个所述发射天线阵列沿第一方向延伸，且至少2个所述发射天线阵列彼此平行且间隔布置；At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals;
    其中，至少2个所述发射天线阵列与多个所述接收天线阵列在第二方向上并行布置，所述第二方向与所述第一方向垂直。Wherein, at least two of the transmitting antenna arrays and a plurality of the receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
  2. 根据权利要求1所述的微波天线结构，其特征在于，相邻所述发射天线阵列之间的间距等于n倍相邻所述接收天线阵列之间的间距，其中n为与所述接收天线阵列数量相关的整数。The microwave antenna structure of claim 1, wherein the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is the same as the receiving antenna array. An integer related to the quantity.
  3. 根据权利要求1所述的微波天线结构，其特征在于，所述第一方向为所述基板的长度方向或宽度方向。The microwave antenna structure according to claim 1, wherein the first direction is a length direction or a width direction of the substrate.
  4. 根据权利要求1-3任意一项所述的微波天线结构，其特征在于，多个所述天线阵列采用微带天线，每个所述天线阵列包括一组彼此电连接的微带贴片单元。The microwave antenna structure according to any one of claims 1 to 3, wherein a plurality of the antenna arrays adopt microstrip antennas, and each of the antenna arrays includes a group of microstrip patch units electrically connected to each other.
  5. 根据权利要求4所述的微波天线结构，其特征在于，每组所述微带贴片单元中的各个所述微带贴片单元大小彼此相同。The microwave antenna structure according to claim 4, wherein the size of each of the microstrip patch units in each group of the microstrip patch units is the same as each other.
  6. 根据权利要求4所述的微波天线结构，其特征在于，每组所述微带贴片单元中的各个所述微带贴片单元的面积自对称中心向两侧依次减小。The microwave antenna structure according to claim 4, wherein the area of each of the microstrip patch units in each group of the microstrip patch units decreases in order from the center of symmetry to both sides.
  7. 根据权利要求4所述的微波天线结构，其特征在于，所述微带贴片单元的形状为矩形、圆形、半圆形或椭圆。The microwave antenna structure according to claim 4, wherein the shape of the microstrip patch unit is rectangle, circle, semicircle or ellipse.
  8. 根据权利要求4所述的微波天线结构，其特征在于，每组微带贴片单元包括6个以上的微带贴片单元。The microwave antenna structure according to claim 4, wherein each group of microstrip patch units includes more than 6 microstrip patch units.
  9. 根据权利要求1所述的微波天线结构，其特征在于，所述接收天 线阵列的数量为4个以上。The microwave antenna structure according to claim 1, wherein the number of the receiving antenna array is 4 or more.
  10. 根据权利要求4所述的微波天线结构，其特征在于，还包括：The microwave antenna structure of claim 4, further comprising:
    馈电网络，其形成在所述基板的第一侧面上，所述馈电网络包括分别与每组所述微带贴片单元电连接的多个微带线。A feeder network is formed on the first side surface of the substrate, and the feeder network includes a plurality of microstrip lines respectively electrically connected to each group of the microstrip patch unit.
  11. 根据权利要求10所述的微波天线结构，其特征在于，所述微带线与每组所述微带贴片单元通过并馈方式连接。The microwave antenna structure according to claim 10, wherein the microstrip line is connected to each group of the microstrip patch unit through a parallel feed.
  12. 根据权利要求10所述的微波天线结构，其特征在于，所述微带线与每组所述微带贴片单元通过串馈方式连接。The microwave antenna structure according to claim 10, wherein the microstrip line and each group of the microstrip patch unit are connected through a series feed.
  13. 根据权利要求10所述的微波天线结构，其特征在于，还包括：与所述馈电网络电连接的射频电路，所述射频电路包括至少一个发射芯片和两个接收芯片，以及与两个所述接收芯片电连接的功分器。The microwave antenna structure according to claim 10, further comprising: a radio frequency circuit electrically connected to the feeding network, the radio frequency circuit comprising at least one transmitting chip and two receiving chips, and the The power divider electrically connected to the receiving chip.
  14. 根据权利要求13所述的微波天线结构，其特征在于，所述射频电路形成在所述基板的第二侧面上。The microwave antenna structure of claim 13, wherein the radio frequency circuit is formed on the second side surface of the substrate.
  15. 根据权利要求14所述的微波天线结构，其特征在于，在所述基板上还形成有分别与每组所述微带贴片单元的微带线电连接的多个过孔或馈电探针，所述馈电网络通过多个所述过孔或馈电探针与所述射频电路连接。The microwave antenna structure according to claim 14, wherein a plurality of vias or feeder probes electrically connected to the microstrip lines of each group of the microstrip patch unit are formed on the substrate. , The feeding network is connected to the radio frequency circuit through a plurality of vias or feeding probes.
  16. 根据权利要求15所述的微波天线结构，其特征在于，在所述基板的第二侧面上还形成有多个微带线，每个所述过孔或馈电探针通过对应的所述微带线连接至所述射频电路。The microwave antenna structure according to claim 15, wherein a plurality of microstrip lines are further formed on the second side surface of the substrate, and each of the vias or feeding probes passes through the corresponding microstrip lines. The ribbon wire is connected to the radio frequency circuit.
  17. 根据权利要求14所述的微波天线结构，其特征在于，每组所述微带贴片单元通过耦合馈电方式与所述射频电路电连接。The microwave antenna structure according to claim 14, wherein each group of the microstrip patch unit is electrically connected to the radio frequency circuit through a coupling feeding method.
  18. 根据权利要求13所述的微波天线结构，其特征在于，所述射频电路形成在所述基板的第一侧面上。The microwave antenna structure of claim 13, wherein the radio frequency circuit is formed on the first side surface of the substrate.
  19. 根据权利要求17所述的微波天线结构，其特征在于，每组所述微带贴片单元通过微带线连接至所述射频电路，其中馈电点位于所述天线阵列的一侧或中间的所述微带线上。The microwave antenna structure according to claim 17, wherein each group of the microstrip patch unit is connected to the radio frequency circuit through a microstrip line, wherein the feeding point is located on one side or the middle of the antenna array The microstrip line.
  20. 根据权利要求11所述的微波天线结构，其特征在于，所述微带线与每组所述微带贴片单元以垂直方式或倾斜方式连接。The microwave antenna structure according to claim 11, wherein the microstrip line is connected to each group of the microstrip patch unit in a vertical manner or an oblique manner.
  21. 根据权利要求1所述的微波天线结构，其特征在于，所述基板为 双层板、三层板、四层板、五层板或六层板。The microwave antenna structure according to claim 1, wherein the substrate is a double-layer board, a three-layer board, a four-layer board, a five-layer board, or a six-layer board.
  22. 根据权利要求1所述的微波天线结构，其特征在于，所述基板包括：The microwave antenna structure according to claim 1, wherein the substrate comprises:
    天线板，所述天线阵列形成在所述天线板上；An antenna board, the antenna array is formed on the antenna board;
    接地板，位于所述天线板的下方，用于与所述天线阵列的地电连接；以及A ground plate, located under the antenna plate, for electrical connection with the ground of the antenna array; and
    多个走线板，位于所述接地板的下方，用于与射频电路电连接，A plurality of wiring boards are located below the ground plate and are used for electrical connection with the radio frequency circuit,
    其中，所述天线板、所述接地板以及多个所述走线板依次层叠设置。Wherein, the antenna board, the ground board and a plurality of the wiring boards are stacked in sequence.
  23. 根据权利要求1所述的微波天线结构，其特征在于，所述天线阵列采用水平极化方式或垂直极化方式。The microwave antenna structure according to claim 1, wherein the antenna array adopts a horizontal polarization mode or a vertical polarization mode.
  24. 一种微波旋转雷达，其特征在于，包括：A microwave rotating radar is characterized in that it comprises:
    固定支架；Fixed bracket
    电机，安装在所述固定支架上；The motor is installed on the fixed bracket;
    旋转支架，安装在所述电机的转子上，并且随着所述电机的转子一起转动；以及A rotating bracket installed on the rotor of the motor and rotating with the rotor of the motor; and
    安装在所述旋转支架上的微波天线结构，A microwave antenna structure mounted on the rotating support,
    所述微波天线结构包括：The microwave antenna structure includes:
    基板，在所述基板的第一侧面上形成有多个天线阵列，多个所述天线阵列包括至少2个发射天线阵列和多个接收天线阵列；A substrate, a plurality of antenna arrays are formed on a first side surface of the substrate, and the plurality of antenna arrays include at least two transmitting antenna arrays and a plurality of receiving antenna arrays;
    多个所述接收天线阵列沿第一方向延伸，且多个所述接收天线阵列彼此平行且间隔布置；A plurality of the receiving antenna arrays extend along a first direction, and the plurality of the receiving antenna arrays are parallel to each other and arranged at intervals;
    至少2个所述发射天线阵列沿第一方向延伸，且至少2个所述发射天线阵列彼此平行且间隔布置；At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals;
    其中，至少2个所述发射天线阵列与多个所述接收天线阵列在第二方向上并行布置，所述第二方向与所述第一方向垂直。Wherein, at least two of the transmitting antenna arrays and a plurality of the receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
  25. 根据权利要求24所述的微波旋转雷达，其特征在于，相邻所述发射天线阵列之间的间距等于n倍相邻所述接收天线阵列之间的间距，其中n为与所述接收天线阵列数量相关的整数。The microwave rotating radar according to claim 24, wherein the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is the same as the distance between adjacent receiving antenna arrays. An integer related to the quantity.
  26. 根据权利要求24所述的微波旋转雷达，其特征在于，所述第一方向为所述基板的长度方向或宽度方向。The microwave rotating radar according to claim 24, wherein the first direction is a length direction or a width direction of the substrate.
  27. 根据权利要求24-26任意一项所述的微波旋转雷达，其特征在于，多个所述天线阵列采用微带天线，每个所述天线阵列包括一组彼此电连接的微带贴片单元。The microwave rotating radar according to any one of claims 24-26, wherein a plurality of the antenna arrays adopt microstrip antennas, and each of the antenna arrays includes a group of microstrip patch units electrically connected to each other.
  28. 根据权利要求27所述的微波旋转雷达，其特征在于，每组所述微带贴片单元中的各个所述微带贴片单元大小彼此相同。The microwave rotating radar according to claim 27, wherein the size of each of the microstrip patch units in each group of the microstrip patch units is the same as each other.
  29. 根据权利要求27所述的微波旋转雷达，其特征在于，每组所述微带贴片单元中的各个所述微带贴片单元的面积自对称中心向两侧依次减小。28. The microwave rotating radar according to claim 27, wherein the area of each of the microstrip patch units in each group of the microstrip patch units decreases in order from the center of symmetry to both sides.
  30. 根据权利要求27所述的微波旋转雷达，其特征在于，所述微带贴片单元的形状为矩形、圆形、半圆形或椭圆。The microwave rotating radar according to claim 27, wherein the shape of the microstrip patch unit is rectangle, circle, semicircle or ellipse.
  31. 根据权利要求27所述的微波旋转雷达，其特征在于，每组微带贴片单元包括6个以上的微带贴片单元。The microwave rotating radar according to claim 27, wherein each group of microstrip patch units includes more than 6 microstrip patch units.
  32. 根据权利要求24所述的微波旋转雷达，其特征在于，所述接收天线阵列的数量为4个以上。The microwave rotating radar according to claim 24, wherein the number of the receiving antenna array is 4 or more.
  33. 根据权利要求27所述的微波旋转雷达，其特征在于，还包括：The microwave rotating radar according to claim 27, further comprising:
    馈电网络，其形成在所述基板的第一侧面上，所述馈电网络包括分别与每组所述微带贴片单元电连接的多个微带线。A feeder network is formed on the first side surface of the substrate, and the feeder network includes a plurality of microstrip lines respectively electrically connected to each group of the microstrip patch unit.
  34. 根据权利要求33所述的微波旋转雷达，其特征在于，所述微带线与每组所述微带贴片单元通过并馈方式连接。The microwave rotating radar according to claim 33, wherein the microstrip line is connected to each group of the microstrip patch unit in a parallel feed mode.
  35. 根据权利要求33所述的微波旋转雷达，其特征在于，所述微带线与每组所述微带贴片单元通过串馈方式连接。The microwave rotating radar according to claim 33, wherein the microstrip line and each group of the microstrip patch unit are connected through a series feed.
  36. 根据权利要求33所述的微波旋转雷达，其特征在于，还包括：与所述馈电网络电连接的射频电路，所述射频电路包括至少一个发射芯片和两个接收芯片，以及与两个所述接收芯片电连接的功分器。The microwave rotating radar according to claim 33, further comprising: a radio frequency circuit electrically connected to the feeding network, the radio frequency circuit comprising at least one transmitting chip and two receiving chips, and a radio frequency The power divider electrically connected to the receiving chip.
  37. 根据权利要求36所述的微波旋转雷达，其特征在于，所述射频电路形成在所述基板的第二侧面上。The microwave rotating radar of claim 36, wherein the radio frequency circuit is formed on the second side surface of the substrate.
  38. 根据权利要求37所述的微波旋转雷达，其特征在于，在所述基板上还形成有分别与每组所述微带贴片单元的微带线电连接的多个过孔或馈电探针，所述馈电网络通过多个所述过孔或馈电探针与所述射频电路连接。The microwave rotary radar according to claim 37, wherein a plurality of vias or feeder probes respectively electrically connected to the microstrip lines of each group of the microstrip patch unit are formed on the substrate. , The feeding network is connected to the radio frequency circuit through a plurality of vias or feeding probes.
  39. 根据权利要求38所述的微波旋转雷达，其特征在于，在所述基板的第二侧面上还形成有多个微带线，每个所述过孔或馈电探针通过对应的所述微带线连接至所述射频电路。The microwave rotating radar according to claim 38, wherein a plurality of microstrip lines are further formed on the second side surface of the substrate, and each of the vias or feed probes passes through the corresponding microstrip line. The ribbon wire is connected to the radio frequency circuit.
  40. 根据权利要求37所述的微波旋转雷达，其特征在于，每组所述微带贴片单元通过耦合馈电方式与所述射频电路电连接。The microwave rotating radar according to claim 37, wherein each group of the microstrip patch unit is electrically connected to the radio frequency circuit through a coupling feeding mode.
  41. 根据权利要求36所述的微波旋转雷达，其特征在于，所述射频电路形成在所述基板的第一侧面上。The microwave rotating radar of claim 36, wherein the radio frequency circuit is formed on the first side surface of the substrate.
  42. 根据权利要求40所述的微波旋转雷达，其特征在于，每组所述微带贴片单元通过微带线连接至所述射频电路，其中馈电点位于所述天线阵列的一侧或中间的所述微带线上。The microwave rotating radar according to claim 40, wherein each group of the microstrip patch unit is connected to the radio frequency circuit through a microstrip line, wherein the feeding point is located on one side or the middle of the antenna array The microstrip line.
  43. 根据权利要求34所述的微波旋转雷达，其特征在于，所述微带线与每组所述微带贴片单元以垂直方式或倾斜方式连接。The microwave rotating radar according to claim 34, wherein the microstrip line is connected to each group of the microstrip patch unit in a vertical manner or an oblique manner.
  44. 根据权利要求24所述的微波旋转雷达，其特征在于，所述基板为双层板、三层板、四层板、五层板或六层板。The microwave rotating radar according to claim 24, wherein the substrate is a double-layer board, a three-layer board, a four-layer board, a five-layer board, or a six-layer board.
  45. 根据权利要求24所述的微波旋转雷达，其特征在于，所述基板包括：The microwave rotating radar according to claim 24, wherein the substrate comprises:
    天线板，所述天线阵列形成在所述天线板上；An antenna board, the antenna array is formed on the antenna board;
    接地板，位于所述天线板的下方，用于与所述天线阵列的地电连接；以及A ground plate, located under the antenna plate, for electrical connection with the ground of the antenna array; and
    多个走线板，位于所述接地板的下方，用于与射频电路电连接，A plurality of wiring boards are located below the ground plate and are used for electrical connection with the radio frequency circuit,
    其中，所述天线板、所述接地板以及多个所述走线板依次层叠设置。Wherein, the antenna board, the ground board and a plurality of the wiring boards are stacked in sequence.
  46. 根据权利要求24所述的微波旋转雷达，其特征在于，所述天线阵列采用水平极化方式或垂直极化方式。The microwave rotating radar of claim 24, wherein the antenna array adopts a horizontal polarization mode or a vertical polarization mode.
  47. 一种可移动平台，其特征在于，包括：A movable platform, characterized in that it comprises:
    机身；body;
    动力装置，安装在所述机身上，并且为所述机身提供移动动力；以及A power plant, which is installed on the fuselage and provides moving power for the fuselage; and
    安装在所述机身上微波旋转雷达，Microwave rotating radar installed on the fuselage,
    所述微波旋转雷达包括：The microwave rotating radar includes:
    固定支架；Fixed bracket
    电机，安装在所述固定支架上；The motor is installed on the fixed bracket;
    旋转支架，安装在所述电机的转子上，并且随着所述电机的转子一起转动；以及A rotating bracket installed on the rotor of the motor and rotating with the rotor of the motor; and
    安装在所述旋转支架上的微波天线结构，A microwave antenna structure mounted on the rotating support,
    所述微波天线结构包括：The microwave antenna structure includes:
    基板，在所述基板的第一侧面上形成有多个天线阵列，多个所述天线阵列包括至少2个发射天线阵列和多个接收天线阵列；A substrate, a plurality of antenna arrays are formed on a first side surface of the substrate, and the plurality of antenna arrays include at least two transmitting antenna arrays and a plurality of receiving antenna arrays;
    多个所述接收天线阵列沿第一方向延伸，且多个所述接收天线阵列彼此平行且间隔布置；A plurality of the receiving antenna arrays extend along a first direction, and the plurality of the receiving antenna arrays are parallel to each other and arranged at intervals;
    至少2个所述发射天线阵列沿第一方向延伸，且至少2个所述发射天线阵列彼此平行且间隔布置；At least two of the transmitting antenna arrays extend along a first direction, and at least two of the transmitting antenna arrays are parallel to each other and arranged at intervals;
    其中，至少2个所述发射天线阵列与多个所述接收天线阵列在第二方向上并行布置，所述第二方向与所述第一方向垂直。Wherein, at least two of the transmitting antenna arrays and a plurality of the receiving antenna arrays are arranged in parallel in a second direction, and the second direction is perpendicular to the first direction.
  48. 根据权利要求47所述的可移动平台，其特征在于，相邻所述发射天线阵列之间的间距等于n倍相邻所述接收天线阵列之间的间距，其中n为与所述接收天线阵列数量相关的整数。The movable platform of claim 47, wherein the distance between adjacent transmitting antenna arrays is equal to n times the distance between adjacent receiving antenna arrays, where n is the same as the distance between the receiving antenna arrays and the receiving antenna arrays. An integer related to the quantity.
  49. 根据权利要求47所述的可移动平台，其特征在于，所述第一方向为所述基板的长度方向或宽度方向。The movable platform according to claim 47, wherein the first direction is a length direction or a width direction of the substrate.
  50. 根据权利要求47-49任意一项所述的可移动平台，其特征在于，多个所述天线阵列采用微带天线，每个所述天线阵列包括一组彼此电连接的微带贴片单元。The movable platform according to any one of claims 47-49, wherein a plurality of the antenna arrays adopt microstrip antennas, and each of the antenna arrays includes a group of microstrip patch units electrically connected to each other.
  51. 根据权利要求50所述的可移动平台，其特征在于，每组所述微带贴片单元中的各个所述微带贴片单元大小彼此相同。The movable platform according to claim 50, wherein the size of each of the microstrip patching units in each group of the microstrip patching unit is the same as each other.
  52. 根据权利要求50所述的可移动平台，其特征在于，每组所述微带贴片单元中的各个所述微带贴片单元的面积自对称中心向两侧依次减小。The movable platform according to claim 50, wherein the area of each of the microstrip patch units in each group of the microstrip patch units decreases sequentially from the center of symmetry to both sides.
  53. 根据权利要求50所述的可移动平台，其特征在于，所述微带贴片单元的形状为矩形、圆形、半圆形或椭圆。The movable platform of claim 50, wherein the shape of the microstrip patch unit is rectangle, circle, semicircle or ellipse.
  54. 根据权利要求50所述的可移动平台，其特征在于，每组微带贴片单元包括6个以上的微带贴片单元。The movable platform according to claim 50, wherein each group of microstrip patch units includes more than 6 microstrip patch units.
  55. 根据权利要求47所述的可移动平台，其特征在于，所述接收天 线阵列的数量为4个以上。The movable platform according to claim 47, wherein the number of the receiving antenna array is 4 or more.
  56. 根据权利要求50所述的可移动平台，其特征在于，还包括：The movable platform according to claim 50, further comprising:
    馈电网络，其形成在所述基板的第一侧面上，所述馈电网络包括分别与每组所述微带贴片单元电连接的多个微带线。A feeder network is formed on the first side surface of the substrate, and the feeder network includes a plurality of microstrip lines respectively electrically connected to each group of the microstrip patch unit.
  57. 根据权利要求56所述的可移动平台，其特征在于，所述微带线与每组所述微带贴片单元通过并馈方式连接。The movable platform according to claim 56, wherein the microstrip line is connected with each group of the microstrip patch unit in a parallel feed mode.
  58. 根据权利要求56所述的可移动平台，其特征在于，所述微带线与每组所述微带贴片单元通过串馈方式连接。The movable platform according to claim 56, wherein the microstrip line is connected to each group of the microstrip patch unit through a serial feed.
  59. 根据权利要求56所述的可移动平台，其特征在于，还包括：与所述馈电网络电连接的射频电路，所述射频电路包括至少一个发射芯片和两个接收芯片，以及与两个所述接收芯片电连接的功分器。The mobile platform according to claim 56, further comprising: a radio frequency circuit electrically connected to the feeding network, the radio frequency circuit comprising at least one transmitting chip and two receiving chips, and a radio frequency circuit electrically connected to the feeding network. The power divider electrically connected to the receiving chip.
  60. 根据权利要求59所述的可移动平台，其特征在于，所述射频电路形成在所述基板的第二侧面上。The movable platform of claim 59, wherein the radio frequency circuit is formed on the second side surface of the substrate.
  61. 根据权利要求60所述的可移动平台，其特征在于，在所述基板上还形成有分别与每组所述微带贴片单元的微带线电连接的多个过孔或馈电探针，所述馈电网络通过多个所述过孔或馈电探针与所述射频电路连接。The movable platform according to claim 60, wherein a plurality of vias or feeder probes electrically connected to the microstrip lines of each group of the microstrip patch unit are formed on the substrate. , The feeding network is connected to the radio frequency circuit through a plurality of vias or feeding probes.
  62. 根据权利要求61所述的可移动平台，其特征在于，在所述基板的第二侧面上还形成有多个微带线，每个所述过孔或馈电探针通过对应的所述微带线连接至所述射频电路。The movable platform according to claim 61, wherein a plurality of microstrip lines are further formed on the second side surface of the substrate, and each of the via holes or the feeding probes passes through the corresponding microstrip lines. The ribbon wire is connected to the radio frequency circuit.
  63. 根据权利要求60所述的可移动平台，其特征在于，每组所述微带贴片单元通过耦合馈电方式与所述射频电路电连接。The movable platform according to claim 60, wherein each group of the microstrip patch unit is electrically connected to the radio frequency circuit through a coupling feeding method.
  64. 根据权利要求59所述的可移动平台，其特征在于，所述射频电路形成在所述基板的第一侧面上。The movable platform of claim 59, wherein the radio frequency circuit is formed on the first side surface of the substrate.
  65. 根据权利要求63所述的可移动平台，其特征在于，每组所述微带贴片单元通过微带线连接至所述射频电路，其中馈电点位于所述天线阵列的一侧或中间的所述微带线上。The movable platform according to claim 63, wherein each group of the microstrip patch unit is connected to the radio frequency circuit through a microstrip line, wherein the feeding point is located on one side or the middle of the antenna array The microstrip line.
  66. 根据权利要求57所述的可移动平台，其特征在于，所述微带线与每组所述微带贴片单元以垂直方式或倾斜方式连接。The movable platform of claim 57, wherein the microstrip line is connected to each group of the microstrip patch unit in a vertical manner or an oblique manner.
  67. 根据权利要求47所述的可移动平台，其特征在于，所述基板为双层板、三层板、四层板、五层板或六层板。The movable platform according to claim 47, wherein the substrate is a double-layer board, a three-layer board, a four-layer board, a five-layer board, or a six-layer board.
  68. 根据权利要求47所述的可移动平台，其特征在于，所述基板包括：The movable platform of claim 47, wherein the substrate comprises:
    天线板，所述天线阵列形成在所述天线板上；An antenna board, the antenna array is formed on the antenna board;
    接地板，位于所述天线板的下方，用于与所述天线阵列的地电连接；以及A ground plate, located under the antenna plate, for electrical connection with the ground of the antenna array; and
    多个走线板，位于所述接地板的下方，用于与射频电路电连接，A plurality of wiring boards are located below the ground plate and are used for electrical connection with the radio frequency circuit,
    其中，所述天线板、所述接地板以及多个所述走线板依次层叠设置。Wherein, the antenna board, the ground board and a plurality of the wiring boards are stacked in sequence.
  69. 根据权利要求47所述的可移动平台，其特征在于，所述天线阵列采用水平极化方式或垂直极化方式。The movable platform according to claim 47, wherein the antenna array adopts a horizontal polarization mode or a vertical polarization mode.
  70. 根据权利要求47所述的可移动平台，其特征在于，所述可移动平台为无人机、自动驾驶汽车或地面遥控机器人。The movable platform according to claim 47, wherein the movable platform is an unmanned aerial vehicle, an autonomous driving car, or a ground remote control robot.
PCT/CN2019/114762 2019-10-31 2019-10-31 Microwave antenna structure, microwave rotating radar, and movable platform WO2021081904A1 (en)

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CN113777609A (en) * 2021-08-27 2021-12-10 深圳市道通智能汽车有限公司 Radar and unmanned aerial vehicle

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