WO2021071206A1 - Laminate, pattern laminate, decorative material, and method for producing same - Google Patents

Laminate, pattern laminate, decorative material, and method for producing same Download PDF

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Publication number
WO2021071206A1
WO2021071206A1 PCT/KR2020/013580 KR2020013580W WO2021071206A1 WO 2021071206 A1 WO2021071206 A1 WO 2021071206A1 KR 2020013580 W KR2020013580 W KR 2020013580W WO 2021071206 A1 WO2021071206 A1 WO 2021071206A1
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Prior art keywords
layer
cured layer
less
cured
laminate
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PCT/KR2020/013580
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French (fr)
Korean (ko)
Inventor
장애정
김헌조
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주식회사 엘지하우시스
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Publication of WO2021071206A1 publication Critical patent/WO2021071206A1/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters

Definitions

  • the present application relates to a decorative laminate and a pattern laminate. Specifically, the present application relates to a decorative material including the laminate or pattern laminate and having a texture similar to a natural material, and a method of manufacturing the same.
  • One object of the present application is to provide a decorative material having excellent surface realism so as to be close to natural texture.
  • Another object of the present application is to provide a decorative material excellent in durability and stain resistance.
  • Another object of the present application is to provide a laminate and a pattern laminate used to form a decorative material excellent in realism, durability and stain resistance.
  • Another object of the present application is to provide a flooring material having excellent realism as well as durability and stain resistance.
  • the present application relates to a patterned laminate.
  • the pattern of the laminate provides the user with a sense of realism close to the natural texture.At least on the surface side of the laminate, specifically, on one side of the layer close to the user's viewing side among two or more layers constituting the laminate. Can be formed.
  • the patterned laminate according to the present application may be manufactured while applying a pattern to the substrate layer and the cured layer having the configuration or characteristics described below through a predetermined method. Accordingly, compared with the prior art, the patterned laminate of the present application can provide a decorative material having excellent pattern reality. In addition, the patterned laminate may provide durability and stain resistance equivalent to or higher than those of the prior art.
  • a pattern that provides the user with a sense of realism similar to the natural texture is formed by concave parts and convex parts. That is, the pattern includes a concave portion and a convex portion. Unless otherwise defined, the pattern formed by the concave portion and the convex portion may be mixed with terms such as unevenness or embossing. According to the pattern design, the concave portion and the convex portion can be visually recognized by the user as having a predetermined width. Depending on the shape of the pattern and its height, the concave portion or the convex portion may be called relatively.
  • an emboss design is first formed on the substrate layer through a pressure roller, and thereafter, a method of performing a curing agent treatment to protect the emboss design (composition It was prepared by curing after application).
  • the surface texture is not luxurious because the curing agent coating the base layer embossing does not sufficiently reflect the embossing of the base layer, and there is a problem that the realism of natural similarity is not sufficiently delivered to the user.
  • the inventor of the present application invented the present application as a result of studying the problems of such conventional products.
  • the inventor of the present application first formed a cured layer on the base layer and then embossed the surface of the laminate (ie, a process for forming surface irregularities) to manufacture a laminate for decorative materials. It focused on the advantage of securing similar texture. Furthermore, in the case of a cured layer formed through curing treatment after the composition is applied on the substrate layer, the problem of being damaged during the pressing/heating process for forming irregularities due to an increase in hardness due to curing (e.g., cured layer Or cracking of the base layer), and the inventor of the present application has come to complete the present invention of the present application that can compensate for such problems.
  • a process for forming concave portions and convex portions is referred to as embossing.
  • the base layer and the cured layer before the embossing treatment is performed are referred to as a base layer (A') and a cured layer (B'), respectively, and a base layer and a cured layer having concave portions and convex portions by embossing are formed. They are referred to as a base layer (A) and a cured layer (B), respectively.
  • the laminate including the substrate layer (A) and the cured layer (B) in which concave portions and convex portions are formed through embossing is referred to as a pattern laminate, and the substrate layer (A') and When the cured layer (B') is included, it is referred to as a laminated body or a non-patterned laminated body.
  • the pattern laminate of the present application includes a base layer (A) in which concave portions and convex portions are formed; And a cured layer (B) positioned on the substrate layer and having a concave portion and a convex portion having the same shape as the substrate layer.
  • a cured layer (B') is first formed on the base layer (A'), and the laminate of the base layer (A') and the cured layer (B') is integrally embossed. Therefore, it is advantageous for the base layer (A) and the cured layer (B) to have concave portions and convex portions of the same shape.
  • the cured layer is the base layer in the thickness direction due to the thickness variation of the cured layer as shown in FIG. 1A.
  • the cured layer is formed thinly on the convex portion of the base layer, and the cured layer is easily formed thickly on the concave portion of the base layer. It is difficult for the user to feel the realism of the pattern due to the severe thickness deviation of the concave portion and the convex portion.
  • the cured layer when the laminate of the base layer (A') and the cured layer (B') is integrally embossed after forming the cured layer on the base layer, the cured layer is Since the thickness variation in the thickness direction is significantly reduced, the cured layer is also advantageous in having an emboss of the same shape as that of the base layer (see, for example, FIG. 1B). For reference, this difference can also be confirmed through the pattern surface image of Comparative Examples and Examples.
  • a feature in which the cured layer (B) and the base layer (A) have concave portions and convex portions having the same shape may be expressed as a value related to thickness variation.
  • the cured layer (B) having a concave portion and a convex portion may have a thickness variation within 2 ⁇ m.
  • the pattern stack of the present application includes a base layer (A) in which concave portions and convex portions are formed; And a cured layer located on the substrate layer, having a concave portion and a convex portion having the same shape as the substrate layer, and having a thickness deviation (or thickness deviation between the concave portion and the convex portion) of the concave portion and the convex portion within 2 ⁇ m.
  • It may be a pattern laminate including (B).
  • the thickness of the cured layer measured toward the user's viewing side from a certain point of the base layer or cured layer that forms the interface between the base layer (A) and the cured layer (B) is different in all areas forming the pattern. It may be within 2 ⁇ m.
  • the cured layer (B) may have a thickness variation within 2 ⁇ m in all areas of the cured layer including concave portions and convex portions.
  • the upper limit of the thickness deviation may be, for example, 1.5 ⁇ m or less or 1.0 ⁇ m or less. Specifically, the upper limit may be, for example, 0.9 ⁇ m or less, 0.8 ⁇ m or less, 0.7 ⁇ m or less, 0.6 ⁇ m or less, or 0.5 ⁇ m or less. Since the smaller the deviation of the cured layer thickness, the more excellent the realism of the natural texture by the pattern may be, so the lower limit of the thickness deviation is not particularly limited, but the deviation may be substantially 0 ⁇ m or closer, for example, It may be 0.01 ⁇ m or more or 0.1 ⁇ m or more.
  • the cured layer and the base layer have the same embossing, and the realism of the pattern cannot be improved.
  • the cured layer not only must the cured layer have a characteristic that is rigid enough to protect the pattern of the substrate layer, but in addition, the cured layer is flexible enough not to break even under high temperature and high pressure applied to the surface during embossing. Should have.
  • the cured layer (B, B') or a material forming it eg, curing agent
  • the cured layer (B, B') or the material (treatment agent) forming the same, having an appropriate level of flexibility and rigidity required for the embossing process according to the present application can be expressed through dynamic viscoelastic properties.
  • the viscoelastic properties may be achieved using a known dynamic mechanical analysis, for example, an Advanced Rheometric Expansion System (ARS) device.
  • the viscoelastic property is the viscoelasticity when dynamic viscoelasticity is measured from -25°C to 125°C at a temperature increase rate in the range of 5 to 10°C/min at a strain in the range of 0.1 to 100%, a frequency in the range of 0.01 to 100 rad/s. It can be a characteristic.
  • a plate of 8 to 25 mm ⁇ may be used when measuring rheological properties.
  • the hardened layers (B, B') may have a tan ⁇ peak value (or a maximum value) of 0.5 or more as determined by dynamic viscoelasticity measurement.
  • the tan ⁇ peak value may be 0.55 or more, 0.60 or more, or 0.65 or more, and the upper limit thereof may be, for example, 0.80 or less, 0.75 or less, or 0.70 or less. That is, the cured layer (B) and/or the cured layer (B') may satisfy the tan ⁇ peak value.
  • the tan ⁇ peak value means a value obtained by dividing a loss modulus (G") by a dynamic storage modulus (G').
  • G loss modulus
  • G' dynamic storage modulus
  • the hardened layer (B, B') has a tan ⁇ peak value (or maximum value) of 0.5 or more, as determined by dynamic viscoelasticity measurement, and a glass transition temperature (Tg) defined as a temperature for the peak value. It may be 10 °C or less.
  • the glass transition temperature (Tg) may be 5°C or less or 0°C or less, and its lower limit is, for example, -35°C or more, -20°C or more, -15°C or more, -10°C or more, or- It may be 5 °C or more. That is, the cured layer (B) and/or the cured layer (B′) may satisfy the tan ⁇ peak value and the glass transition temperature (Tg).
  • That the cured layer satisfies the glass transition temperature in the above range means that the treatment agent cured after application or the cured layer including the same satisfies the glass transition temperature in the above range. Compared with the case where the glass transition temperature is exceeded, according to the present application, even if the embossing process described below is performed, an elongation sufficient to clearly accommodate the emboss without breaking the laminate is secured, and the cured layer is used as the substrate. It can be advantageous to have a state of adhesion to the layer.
  • the cured layers (B, B') may have a storage modulus (G') value of 3.0 x 10 6 Pa or less measured at a temperature of 90 °C or higher. That is, the cured layer (B) and/or the cured layer (B') may satisfy the storage modulus (G') value.
  • the upper limit of the storage modulus (G') value may be 2.5 x 10 6 Pa or less, 2.0 x 10 6 Pa or less, or 1.5 x 10 6 Pa or less, and the lower limit is, for example, 1.0 x 10 5 Pa or more. , 5.0 x 10 5 Pa or more, 8.0 x 10 5 Pa or more, or 1.0 x 10 6 Pa or more.
  • the fact that the cured layer satisfies the storage modulus in the above range means that the treatment agent cured after application or the cured layer including the same can not only secure the tan ⁇ peak value in the above range, but also have an appropriate hardness at a predetermined temperature. it means.
  • the temperature at which the storage modulus (G') in the above range is measured may be, for example, in the range of 90° C. or more and 140° C. or less, which is in contact with the high-temperature roller on which the pattern is formed during the embossing process according to the present application described below. While the cured layer may have a surface temperature.
  • a cured layer is formed on the base layer as described above with reference to FIG. 1B, and then the base layer (A') and the cured layer (B') Even if embossing is performed as an integral part of the laminate having ), there is no cracking of the cured layer or the base layer, and the cured layer and the base layer may have the same embossing shape.
  • FIG. 2 With respect to the above-described viscoelastic properties, reference may be made to FIG. 2 regarding a result of measuring viscoelasticity according to a specific example of the present application.
  • Physical properties of the cured layer such as the viscoelastic properties described below may be physical properties after curing for the curing treatment agent of the present application described below, or of the cured layer (B and/or B′) cured after being applied on the substrate layer. It may be a physical property when obtained by collecting a part.
  • the expression “curing” used in connection with forming a cured layer using a curing agent in the present application refers to the treatment agent or composition for forming the cured layer (B') as the base layer (A '), and refers to a treatment of irradiating ultraviolet rays at a level of 250 to 350 mJ/cm 2 (eg, about 300 mJ/cm 2 ), or subsequently in the range of 90 to 110° C. for several minutes to several tens of minutes. It may mean a treatment including heating (for example, about 5 minutes at about 100°C).
  • Curing layers (B, B') may be formed while the curing treatment agent described below undergoes such a curing process.
  • the cured layers (B, B') may include or be a cured product of the curing agent as described above in physical properties after curing.
  • the base layer (A' and/or A) may have a thickness within a range of 200 to 1,000 ⁇ m.
  • the lower limit of the thickness of the base layer may be 250 ⁇ m or more, 300 ⁇ m or more, 350 ⁇ m or more, 450 ⁇ m or more, 500 ⁇ m or more, or 550 ⁇ m or more
  • the upper limit is, for example, 900 ⁇ m or less, 800 ⁇ m
  • it may be 700 ⁇ m or less, 600 ⁇ m or less, or 500 ⁇ m or less.
  • the thickness of the substrate layer is less than the above range, there is a problem in that the uneven pattern is not sufficiently engraved on the substrate layer.
  • the thickness exceeds the above range when a laminate manufactured for forming a decorative material is laminated with another configuration, a difference in hardness between the laminated layers may increase and warpage may occur.
  • the cured layer (B' and/or B) may have a thickness within a range of 5 to 50 ⁇ m.
  • the lower limit of the thickness of the cured layer is 6 ⁇ m or more, 7 ⁇ m or more, 8 ⁇ m or more, 9 ⁇ m or more, 10 ⁇ m or more, 11 ⁇ m or more, 12 ⁇ m or more, 13 ⁇ m or more, 14 ⁇ m or more, or 15 ⁇ m or more.
  • the upper limit may be, for example, 45 ⁇ m or less, 40 ⁇ m or less, 35 ⁇ m or less, 30 ⁇ m or less, 25 ⁇ m or less, 20 ⁇ m or less, or 15 ⁇ m or less.
  • the thickness of the cured layer is less than the above range, it is difficult for the cured layer and a laminate or decorative material including the cured layer to have sufficient mechanical strength. In addition, when the thickness exceeds the above, there is a problem that the price increases and hardening is difficult.
  • the embossing treatment for manufacturing the patterned laminate of the present application is performed integrally with the base layer (A') and the cured layer (B') at the same time.
  • the embossing treatment may be performed by pressing and heating a pattern including a concave portion and a convex portion by a mechanism (eg, a roller) formed on the surface thereof.
  • a substrate layer having a thickness of at least 200 ⁇ m or more, specifically 300 ⁇ m or more, 400 ⁇ m or more, or 500 ⁇ m or more is used so that the uneven pattern can be sufficiently deeply engraved on the base layer. It is desirable.
  • an embossing treatment at a high temperature is required.
  • the embossing treatment may be performed under a temperature condition of at least 150° C. or higher, specifically, using a roller having a surface temperature of 150° C. or higher.
  • a metal roller may be used for high-temperature embossing.
  • the metal roller may be a SUS roller known as stainless steel.
  • the embossing treatment can be performed at a higher temperature than when using a roller made of a rubber material.
  • embossing was performed at a temperature of about 150° C. or less, specifically about 120 to 150° C. using a rubber roller, but in the case of performing the embossing using a metal roller, a temperature of about 150° C. or higher, eg
  • high-temperature pressurization on the surface of the laminate may be performed at a temperature of 150 to 180°C. Accordingly, a clear pattern can be formed on the substrate layer.
  • the surface of the laminate in contact with the roller may have a temperature of 90° C. or higher.
  • the surface of the laminate in contact with the roller may have a temperature of, for example, 150° C. or less or 140° C. or less, and may have a temperature of about 90° C. or more, 95° C. or more, or 100° C. or more.
  • the laminate, in particular, the cured layer and the base layer forming the laminate should have a degree of flexibility to clearly accommodate the pattern of the roller without being broken even by the high-temperature pressure as described above.
  • the laminate may include a base layer and a cured layer having excellent elongation at a temperature of at least 90 °C.
  • the embossed laminate may include a cured layer (B') having an elongation of 20% or more at a temperature of 90° C. or more. That is, the patterned laminate may include a base layer (A'); And a cured layer (B') formed on the base layer and having an elongation of 20% or more at a temperature of 90° C. or higher.
  • the elongation of 20% or more means that, for example, when the hardened layer is stretched in a predetermined direction (if pulled), the hardened layer can be increased by at least 20% of its original size.
  • the elongation is when the lengthwise direction or the width direction and the tensile direction of the cured layer having a predetermined size (e.g., length X width) (however, the length is greater than the width) are matched in the normal direction to the surface of the laminate. It can be elongation.
  • the lower limit of the elongation may be, for example, 25% or 30%, and the upper limit may be, for example, 50% or less, 40% or less, or 30% or less.
  • the cured layer B′ may be broken during embossing.
  • the flexibility is too large, such as when the elongation exceeds 50%, the cured structure of the cured layer is not dense, and contamination resistance, chemical resistance, and durability may be poor.
  • the elongation is 100 mm/min for the substrate layer (A, A'), the cured layer (B, B'), the laminated body or the patterned laminate cut in a dogbone shape at a predetermined temperature as in the following experimental example. It may be measured while stretching at a speed. At this time, each thickness of the base layer and the cured layer may be in the same range as described above. In addition, the thickness of the laminate and the pattern laminate depends on the thickness of the base layer and the cured layer.
  • the base layer (A') may have a higher elongation at a temperature of 90° C. or higher than that of the cured layer (B').
  • the base layer (A') may have an elongation of 20% or more, 30% or more, 40% or more, 50% or more, and, for example, 100% or more at a temperature of 90°C or more.
  • the elongation of the base layer (A') may be 200% or more, 300% or more, 400% or more, 500% or more, 600% or more, 700% or more, 800% or more, 900% or more, or 1,000% or more, and , May be greater than or equal to 1,500%, or greater than or equal to 2,000%.
  • the lower limit of the elongation of the base layer (A') may be, for example, 3,000% or less, 2,500% or less, or 2,000% or less.
  • the cured layer (B′) formed on the base layer (A′) using the curing agent may satisfy 70% or less of the curing degree defined by the following [Equation 1]. That is, the formation of the cured layer (B'), specifically, curing of the curing agent may be performed at a level that satisfies the degree of curing specified by the following [Equation 1] of 70% or less.
  • Wi refers to the weight of the sample obtained by cutting the cured sample into a certain size before immersing it in the solvent
  • Wf is the sample left after immersing the sample in a solvent and leaving it for a certain period of time, followed by filtering using a strainer. Means the weight of.
  • the cured layer (B') may have a degree of curing calculated by Equation 1 of 70% or less, 65% or less, 60% or less, 55% or less, or 50% or less.
  • the degree of curing may be 45% or more, 50% or more, 55% or more, 60% or more, or 65% or more.
  • the solvent for measuring the degree of curing according to Formula 1 is not particularly limited, but may be, for example, an alkyl acetate solvent, a ketone solvent, an aromatic solvent, a halocarbon oil solvent, or the like.
  • the period in which the specimen is immersed in a solvent and left to stand is not particularly limited, and may be, for example, several hours or more, several days or more, or 1 day (24 hours) to 7 days.
  • embossing is performed after forming the cured layer (B') having excellent elongation properties.
  • the embossing treatment as described above increases the density of the cured layer (B') formed by curing.
  • a cured layer (B) in which a pattern having a physical/chemical crosslinking degree higher than that of the cured layer (B′) may be provided through high temperature/pressure embossing treatment on the cured layer (B′) already formed. Due to the hardened layer (B), which has a higher degree of density after embossing, the patterned laminate increases mechanical strength and durability, and reduces the possibility of contaminants penetrating into the hardened tissue. have.
  • the description of the patterned cured layer (B) in which the degree of physical/chemical crosslinking was higher than that of the cured layer (B′) through the embossing treatment was confirmed through Experimental Example 2 below.
  • the degree of curing that can be compared by the fluorescence intensity is lowered after the embossing treatment, and the elongation of the cured layer B'may also decrease by 5% or more or 10% or more.
  • the material for forming the base layer (A') and the cured layer (B') is not particularly limited as long as the above-described properties can be satisfied.
  • the base layer (A') is a polyvinylchloride (PVC) film, a polylactic acid (PLA) film, a styrene film, a stryen/butadiene/styrene (SBS) film, or a Styrene Ethylene/Butylene Styrene (SEBS) film.
  • PVC polyvinylchloride
  • PLA polylactic acid
  • SBS stryen/butadiene/styrene
  • SEBS Styrene Ethylene/Butylene Styrene
  • the cured layers (B, B') may be or may include a cured product of a curing agent containing a predetermined component.
  • the curing agent includes polyurethane (meth) acrylate and a reactive monomer.
  • polyurethane (meta) acrylate is referred to as polyurethane acrylate, and components of the curing agent are indicated by polyurethane acrylate component (A) and reactive monomer component (B), respectively.
  • Polyurethane acrylate component (A) is a component that contributes to the cured layer (B and/or B') having the aforementioned flexibility (e.g., elongation), and has a weight average molecular weight (Mw) of 10,000 or more.
  • Mw weight average molecular weight
  • the lower limit of the weight average molecular weight of the polyurethane acrylate may be, for example, 11,000 or more, 12,000 or more, 13,000 or more, 14,000 or more, 15,000 or more, 16,000 or more, 17,000 or more, 18,000 or more, 19,000 or more, or 20,000 or more. .
  • the upper limit of the weight average molecular weight of the polyurethane acrylate may be, for example, 30,000 or less, 29,000 or less, 28,000 or less, 27,000 or less, 26,000 or less, 25,000 or less, 24,000 or less, 23,000 or less, 22,000 or less, 21,000 or less, or 20,000 or less. have.
  • the weight average molecular weight is measured by GPC and may be a value converted by standard styrene.
  • the specific type or structure of the polyurethane acrylate component is not particularly limited.
  • the curing agent may include two or more polyurethane acrylates having different weight average molecular weights.
  • the polyurethane acrylate component (A) is a first polyurethane acrylate (A1) having a weight average molecular weight (Mw) of 10,000 or more and less than 15,000 and a second polyurethane having a weight average molecular weight (Mw) of 15,000 or more and 30,000 or less. It may contain acrylate (A2).
  • the weight average molecular weight (Mw) of the first polyurethane acrylate (A1) may be 14,000 or less, 13,500 or less, 13,000 or less, 12,500 or less, 12,000 or less, 11,500 or less, or 11,000 or less.
  • the weight average molecular weight (Mw) of the second polyurethane acrylate (A2) may be 16,000 or more, 17,000 or more, 18,000 or more, 19,000 or more, or 20,000 or more, and 25,000 or less, 24,000 or less, 23,000 or less, 22,000 or less, 21,000 or less , 20,000 or less, 19,000 or less, 18,000 or less, or 17,000 or less.
  • Mw weight average molecular weight
  • the content (weight ratio) between the first polyurethane acrylate (A1) and the second polyurethane acrylate (A2) may be appropriately adjusted to satisfy the characteristics of the cured layer described above. .
  • the content of the first polyurethane acrylate (A1) in the polyurethane acrylate component (A) may be equal to or greater than the content of the second polyurethane acrylate (A2).
  • the content of the first polyurethane acrylate (A1) in the polyurethane acrylate component (A) may be equal to or greater than the content of the second polyurethane acrylate (A2).
  • 50 to 90 parts by weight of the first polyurethane acrylate (A1) and 10 to 50 parts by weight of the second polyurethane acrylate (A2) Additional can be used.
  • the content of the first polyurethane acrylate (A1) within the above range is, for example, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 65 parts by weight or more, 70 parts by weight Or more, or 75 parts by weight or more, and may be 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, or 65 parts by weight or less.
  • the content of the second polyurethane acrylate (A2) may be appropriately adjusted according to the content of the first polyurethane acrylate (A1) to be used.
  • the content of the second polyurethane acrylate (A2) in the polyurethane acrylate component (A) may be equal to or greater than the content of the first polyurethane acrylate (A1).
  • the content of the second polyurethane acrylate (A2) in the polyurethane acrylate component (A) may be equal to or greater than the content of the first polyurethane acrylate (A1).
  • 50 to 90 parts by weight of the second polyurethane acrylate (A2) and 10 to 50 parts by weight of the first polyurethane acrylate (A1) Additional can be used.
  • the content of the second polyurethane acrylate (A2) within the above range is, for example, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 65 parts by weight or more, 70 parts by weight Or more, or 75 parts by weight or more, and may be 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, or 65 parts by weight or less.
  • the content of the first polyurethane acrylate (A2) may be appropriately adjusted according to the content of the second polyurethane acrylate (A1) to be used.
  • the reactive monomer component (B) refers to a monomer component containing a curable functional group, and its specific type is not particularly limited.
  • the reactive monomer component may be a monomer having a double bond between carbons as a polymerizable functional group.
  • the reactive monomer component (B) may be a monofunctional monomer having one curable functional group. In another example, the reactive monomer component (B) may be a functional monomer having two or more curable functional groups.
  • the reactive monomer component (B) may be a (meth)acrylate-based monomer.
  • the curing agent may include a reactive monomer component (B) in the range of 40 to 80 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A). If the above range is satisfied, flexibility and rigidity suitable for achieving the technical task of the present application can be secured.
  • the reactive monomer component (B) may include a reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer.
  • Reactive monomers with a glass transition temperature of 0 °C or less of the homopolymer impart flexibility to the cured layer (B') to more effectively prevent cracking of the base layer (A') or the cured layer (B') during the embossing process by high temperature pressurization. Can be prevented.
  • the glass transition temperature (Tg) at this time may be confirmed by a differential scanning calorimetry (DSC) method. For example, while the sample is heated at a heating rate of 10° C./min under a nitrogen atmosphere, it can be confirmed by checking the temperature at which the base line of the obtained DSC curve and the tangent line at the inflection point intersect.
  • DSC differential scanning calorimetry
  • the specific type of the reactive monomer component is not particularly limited.
  • An acrylate having a renoxide unit can be used.
  • the alkylene oxide may be, for example, ethylene oxide (EO, ethylene oxide) or propylene oxide (PO, propylene oxide), and as an acrylate having such an alkylene oxide unit, for example, PHEA-2 (phenol ( EO) 2 acrylate), PHEA-4(phenol (EO) 4 acrylate), NP(EO) 4 A(nonyl phenol (EO) 4 acrylate), NP(EO) 8 A(nonyl phenol (EO) 8 acrylate), EOEOEA (ethoxy ethoxy ethyl acrylate), or NP(PO) 2 A (nonyl phenol (PO) 2 acrylate) may be used.
  • PHEA-2 phenol ( EO) 2 acrylate
  • NP(EO) 8 A(nonyl phenol (EO) 8 acrylate) NP(
  • an acrylate having an aromatic ring may be used as the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer.
  • the reactive monomer (B1) having a glass transition temperature (Tg) of 0 °C or less of the homopolymer is at least PHEA-2 (phenol (EO) 2 acrylate), PHEA-4 (phenol (EO) 4 acrylate), NP ( EO) 4 A (nonyl phenol (EO) 4 acrylate), NP(EO) 8 A (nonyl phenol (EO) 8 acrylate), or NP(PO) 2 A (nonyl phenol (PO) 2 acrylate) have.
  • a monomer having an aromatic ring is used as one component of the reactive monomer, there is an advantage of suppressing an unpleasant odor that may occur in a product.
  • the content of the reactive monomer (B1) having a glass transition temperature (Tg) of 0 °C or less of the homopolymer is 10 parts by weight to 100 parts by weight. It can be a minor range. More specifically, the lower limit of the content of the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C.
  • or less within the above range is, for example, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, It may be 80 parts by weight or more, 85 parts by weight or more, or 90 parts by weight or more, and its upper limit is, for example, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 It may be less than or equal to 65 parts by weight, or less than or equal to 60 parts by weight.
  • the reactive monomer component (B) may further include a reactive monomer (B2) having a functional group such as a hydroxy group or an amide group.
  • the monomer (B2) having a functional group such as a hydroxy group or an amide group may be a (meth)acrylic monomer having a functional group such as a hydroxy group or an amide group.
  • the monomer (B2) may be a monofunctional (meta) acrylic monomer.
  • examples of the monofunctional (meth) acrylic monomer containing a hydroxy group include hydroxy ethyl (meth) acrylate, 2-hydroxy propyl (meth) acrylate, and hydroxy butyl (meth) acrylate. Roxyalkyl(meth)acrylate can be used.
  • the specific type of the monofunctional (meth) acrylic monomer containing an amide group is also not particularly limited, but, for example, (meth)acrylamide, alkyl (meth)acrylamide, dialkyl (meth)acrylamide, or hydroxyalkyl (meth) ) Acrylamide and the like may be used. Specifically, methacrylamide, dimethyl acrylamide, 2-hydroxy propyl methacrylamide, or N-isopropyl acrylamide may be used, but is not limited thereto.
  • the reactive monomer component (B) further contains a reactive monomer (B2) having a functional group such as a hydroxy group or an amide group in addition to the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer
  • the content of the monomer (B2) component having a functional group such as a hydroxy group or an amide group may be appropriately adjusted according to the content of the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer described above.
  • the content of the monomer (B2) component having a functional group such as a hydroxy group or an amide group may range from 0 to 90 parts by weight.
  • the curing treatment agent may include an initiator component (C).
  • the initiator may be appropriately selected from known materials or commercially available products, but when considering the change in the degree of curing through the measurement of fluorescence intensity measured in the following experimental examples, since it has an aromatic ring such as benzene or a unit derived from it, it may emit fluorescence after curing. Initiators that become capable of being used can be used.
  • the curing agent may include the initiator component (C) in a range of 1 to 20 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A).
  • the curing agent may include a curing agent component (D). Specifically, a curing agent component having a number of functional groups of 2 or more may be used so that the curing agent for securing flexibility can secure even strength.
  • a polyfunctional (meth)acrylate having a number of functional groups of 2 or more may be used as the curing agent component (D).
  • the curing agent component (D) may include at least trifunctional (meth)acrylate. It is advantageous for securing strength when using a curing agent component with three or more functionalities.
  • the curing agent component (D) may include 3 to 6 functionality, 3 to 5 functionality, or 3 to 4 functionality (meth)acrylate.
  • the curing agent may include a curing agent component (D) in the range of 10 to 45 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A).
  • a curing agent component (D) in the range of 10 to 45 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A).
  • the curing agent having the component may have a viscosity in the range of 300 to 800 cps.
  • coating processability is excellent.
  • the polyurethane acrylate component (A) has a higher molecular weight than other components forming the curing agent, the viscosity may be high.
  • components such as (B), (C) and (D) are appropriate.
  • the present application relates to a decorative material.
  • the decorative material includes a patterned laminate of the characteristics or configurations described above. Detailed description of the patterned laminate will be omitted.
  • the decorative material may be a film having a tuned pattern.
  • the decorative material may further include, on the lower surface of the substrate layer, a printed layer with a tuning pattern having the same or substantially similar shape as the main pattern formed by the concave portions and the convex portions of the pattern stack.
  • the lower surface of the base layer may mean one surface opposite to the surface of the base layer in contact with the cured layer (B') close to the user viewing side in the patterned laminate.
  • the printing layer may be a white sheet, specifically a white vinyl chloride resin sheet.
  • the printing method is not particularly limited, and, for example, gravure printing or transfer printing may be used.
  • the print layer may have a thickness of about 1 ⁇ m to about 10 ⁇ m, but is not limited thereto.
  • the decorative material may further include a transparent layer.
  • the transparent layer is a layer capable of protecting the print pattern of the printing layer.
  • the transparent layer may be a cured product such as a binder resin.
  • the decorative material may include a pattern laminate, a transparent layer, and a printing layer from the user viewing side.
  • the transparent layer may have a thickness of about 0.05mm to about 2.0mm, but is not limited thereto.
  • the decorative material may further include a dimension reinforcing layer.
  • the dimensional reinforcing layer may provide excellent dimensional stability by reducing the dimensional strain of the decorative material even under high temperature and high humidity conditions, and at the same time, increase the durability of the film by increasing adhesion with other layers to be laminated together.
  • the dimension reinforcing layer may be formed of a composite material in which a filler or the like is impregnated with a binder resin.
  • the kind of binder resin is not particularly limited.
  • the filler for example, TiO 2 , CaCO 3 , wood flour, mica, glass fiber, starch, natural fiber, rice husk, rosin or talc, etc. may be used, preferably glass Fibers can be used.
  • the dimensional reinforcing layer may be a layer formed by impregnating a glass fiber sheet prepared by appropriately mixing glass fiber and pulp with a binder with a vinyl chloride sol, followed by gelling.
  • the decorative material may include a pattern laminate, a printing layer, and a dimension reinforcing layer in an order close to the user's viewing side.
  • the thickness of the dimension reinforcing layer may range from about 0.1 mm to about 2.0 mm, but is not limited thereto.
  • the decorative material may further include a base layer.
  • the base layer may serve to support other layer configurations and absorb shocks from the top or bottom.
  • the base layer may include a binder resin.
  • the type of resin used to form the base layer is not particularly limited.
  • the decorative material may include a pattern laminate, a printing layer, and a base layer in an order close to the user's viewing side.
  • the thickness of the base layer may be about 1.0 mm to about 3.0 mm, but is not limited thereto.
  • the decorative material may further include a balance layer.
  • the balance layer is a part that is bonded to the floor surface during construction, and functions to protect the decorative material from the external environment.
  • the balance layer may be formed by curing a binder resin.
  • the kind of resin used to form the balance layer is not particularly limited.
  • the filler for example, TiO 2 , CaCO 3 , wood flour, mica, glass fiber, starch, natural fiber, rice husk, rosin or talc, and the like may be used.
  • the decorative material may include a pattern laminate, a printing layer, and a balance layer in an order close to the user's viewing side.
  • the balance layer may have a thickness of about 1.0mm to about 3.0mm, but is not limited thereto.
  • the decorative material of the above configuration may be used as a flooring material.
  • the present application relates to a laminate used to manufacture the pattern laminate or the decorative material.
  • the laminate includes a base layer (A') and a cured layer (B'). Specific properties and configurations of the laminate, the base layer (A'), and the cured layer (B') are as described above.
  • the present application relates to a curing agent that can be used to form the cured layer (B') of the laminate or the cured layer (B) of the patterned laminate.
  • Description of the components contained in the curing agent is the same as described above, and thus will be omitted.
  • the present application relates to a method of manufacturing a patterned laminate.
  • the method includes: preparing a laminate including a base layer (A') and a cured layer (B') in sequence; And forming concave portions and convex portions having the same shape in the base layer (A') and the cured layer (B') by pressing the surface of the cured layer (B') at a temperature of 150° C. or higher.
  • the configuration and characteristics of the base layer (A') and the cured layer (B') are the same as described above, and thus are omitted.
  • the pressing may be performed using a pattern forming apparatus having a temperature of 150° C. or higher.
  • the roller may be a metal roller.
  • the substrate layer (A') and the cured layer (B') having concave portions and convex portions by pressing may be referred to as a substrate layer (A) and a cured layer (B), respectively.
  • pressing of the pattern forming mechanism may be performed such that a difference in fluorescence intensity before and after pressing may be 50 or more.
  • Fluorescence intensity is a value measured by focusing on the change of a photopolymerization initiator into a substance that emits fluorescence while reacting with other components of the treatment agent, as described in the following experimental examples.
  • UV excitation light is irradiated to the cured product and then in the cured layer. Emission can be measured in a way that detects fluorescence. The measurement can be made using the UV curing sensor OL series (Sentech Co., Ltd.).
  • the difference in fluorescence intensity may be 150 or less or 100 or less.
  • the measurement of fluorescence intensity can be used as a means of comparing the degree of curing before and after pressing. It can be seen that the lower the fluorescence intensity, the higher the degree of curing.
  • the fluorescence intensity of the cured layer (B') in the range of 300 to 600 may be measured in the range of 250 to 550 through pressurization by the pattern forming mechanism. That is, the cured layer (B) may have a higher degree of curing through the embossing treatment by high temperature/high pressure.
  • the cured layer (B) having a dense structure by increasing the degree of curing after the embossing treatment may have higher durability, stain resistance and strength characteristics.
  • the method may further include forming a cured layer (B') on the base layer (A').
  • the cured layer may be formed by applying and curing the curing agent having the above-described configuration.
  • the degree of curing and curing conditions are also the same as described above.
  • a laminate having excellent surface reality and excellent durability and stain resistance, and a decorative material (eg, flooring) including the same.
  • FIG. 1 is a schematic diagram for comparing the uneven cross-section of the decorative material manufactured according to the prior art and the decorative material manufactured according to the present application.
  • FIG. 1 (a) is a schematic diagram of a cross-section of a pattern stacked body in which embossing is formed according to the prior art
  • FIG. 1 (b) is a schematic diagram of a cross-section of a pattern stacked body in which embossing is formed according to the present application.
  • Example 2 is a measurement of viscoelastic properties of the cured layer (B') of Example 1 according to a specific example of the present application.
  • FIG. 3 is a comparison of images taken with microscopes of 50 magnification and 100 magnification of the surface of the laminate manufactured according to Comparative Example 1 and Example 1.
  • FIG. 3 is a comparison of images taken with microscopes of 50 magnification and 100 magnification of the surface of the laminate manufactured according to Comparative Example 1 and Example 1.
  • Example 4 is a check of the thickness of the cured layer in the laminates prepared according to Comparative Example 1 and Example 1. Specifically, comparing 4a of Comparative Example 1 and FIG. 4B of Example 1, it can be seen that Example 1 significantly improved the large thickness deviation in the convex and concave portions that Comparative Example 1 shows. .
  • FIG. 5 schematically shows a laminated configuration of a decorative material according to an example of the present application.
  • Step 1 Formation of a cured layer
  • a curing system in which a length of 1 M in the moving direction is divided into one zone was used. Specifically, a curing agent of the following composition was applied on one side of the PVC substrate layer (A') having a thickness of about 500 ⁇ m located in a line moving at a speed of 6 M/min, and irradiated with UV light of 300 mj/cm 2 to increase the thickness.
  • a cured layer (B') of about 13 ⁇ m was formed.
  • the components of the curing agent are shown in Table 1.
  • Step 2 embossing : Thereafter, using a heating drum (SUS drum) having a predetermined pattern, one side opposite to the side of the cured layer (B') in contact with the base layer (A') is pressed, A patterned laminate was formed.
  • the high temperature pressurization conditions related to the embossing treatment were maintained at the levels shown in Table 2.
  • Example 2 The same curing system and the same pattern formation process as in Example 1 were used, and the same curing treatment agent and the same base layer (A') were used. However, in Comparative Example 1, the embossing treatment was first performed on the base layer (A'), and a cured layer was formed on the base layer (A) on which the pattern was formed.
  • Example 1 the visually recognized surface shape of the patterned laminate is as shown in FIG. 3. As can be seen from the drawings, it can be seen that more vivid irregularities were formed on the surface of the laminate of Example 1, and a significantly smaller thickness deviation was observed in the cured layer of Example 1.
  • the reference example shown in FIG. 2 is an image showing that the embossing process of step 2 is performed without forming a UV coating on the base layer (A') used in the examples and comparative examples. That is, the reference example in which the pattern is formed through direct embossing on the substrate and the example 1 having a small difference in appearance means that a desired pattern (design) can be realized with a sense of realism.
  • the embossing treatment after the formation of the cured layer (B') increases the strength of the cured layer (B) having concave portions and convex portions, and as a result, the surface properties of the patterned laminate, for example, mechanical strength. An experiment was conducted to confirm that it can be higher.
  • the fluorescence hardness and high-temperature elongation of the cured layer (B') were measured before step 2 (before embossing, that is, when the cured layer was formed through step 1). I did.
  • the fluorescence hardness and high-temperature elongation of the cured layer (B) were measured. The results are shown in Table 3. At this time, the thickness of the laminate or pattern laminate in which the corresponding experiment was performed was about 500 ⁇ m and about 300 ⁇ m, respectively.
  • Fluorescence intensity (Comparison of change in curing degree): When the treatment agent is cured, the photopolymerization initiator reacts with other components of the treatment agent and changes into a substance that emits fluorescence, and UV excitation light is irradiated to detect fluorescence emitted from the cured layer. In this way, the change in the degree of curing was confirmed.
  • a device sold under the name "UV curing sensor OL series (Sentech Co., Ltd.)" was used.
  • the operating principle of the device can be found in Japanese Patent Publication No. 2007-248244, and detailed information on the device can be found on the web page http://www.sentech.jp/seihin/seihin02.html or http://www. Available at .sentech.jp/images/uvkoukasennsa-katarogu2.pdf .
  • the lower the fluorescence intensity the more curing was performed.
  • the pattern laminate cut in the form of a dogbone was stored in a chamber at 90 °C, and measured while stretching at a rate of 100 mm/min. At this time, the total length of the dogbone shape was 10 cm, and the length and width of the elongation measurement excluding the handle were about 6 cm and 1 cm, respectively.
  • the surface of the cured layer (B') undergoes additional chemical crosslinking and/or physical crosslinking through high-temperature/pressurization embossing on the cured layer (B'), so that the cured layer (B) is a cured layer before embossing. (B') It means that it can have a finer surface property. This contributes to further enhancing the surface properties of the patterned laminate, such as durability and stain resistance.
  • a pattern laminate of Example 2 was manufactured through the same process as in Example 1 (steps 1 and 2), except that the components of the curing treatment agent were different as shown in Table 4 below. In the case of Comparative Examples 2 and 3, the components of the treatment agent were different from those of the Examples as shown in Table 4.
  • the method of measuring physical properties is as follows, and the results are shown in Table 5.
  • Comparative Examples 2 and 3 which do not satisfy the high-temperature elongation, are unsuitable for embossing by high-temperature pressurization.
  • A a base layer having a concave portion and a convex portion

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Abstract

The present application relates to a laminate for a decorative material, comprising: a base layer (A) having recessed portions and protruding portions; a cured layer (B) formed on the base layer and having recessed portions and protruding portions having the same shapes as those of the base layer. The laminate has excellent reality on the surface thereof, excellent durability, and fouling resistance.

Description

적층체, 패턴 적층체, 장식재, 및 그 제조방법Laminate, pattern laminate, decorative material, and manufacturing method thereof
본 출원은 장식재용 적층체 및 패턴 적층체에 관한 것이다. 구체적으로, 본 출원은 상기 적층체 또는 패턴 적층체를 포함하고, 천연재료 유사 질감을 갖는 장식재와 그 제조방법에 관한 것이다.The present application relates to a decorative laminate and a pattern laminate. Specifically, the present application relates to a decorative material including the laminate or pattern laminate and having a texture similar to a natural material, and a method of manufacturing the same.
입체적인 외관이 부여된 장식재, 특히 바닥 장식재에 대한 수요가 증가하고 있다. 그에 따라, 나무, 석재 또는 직물과 같은 천연 재료에 근접한 사실감(reality)이 구현된 장식재의 개발이 활발히 이루어지고 있다. 예를 들어, 장식재 표면의 요철과 장식재에 포함된 인쇄층의 주요 무늬를 일치시킨 소위 동조 엠보 특성의 제품이 출시되고 있다.Demand for decorative materials with a three-dimensional appearance, especially floor decorative materials, is increasing. Accordingly, the development of decorative materials in which reality close to natural materials such as wood, stone or fabric is implemented is being actively developed. For example, products with so-called tuning embossing characteristics in which the irregularities on the surface of the decorative material and the main pattern of the printing layer included in the decorative material are matched are being released.
종래 제품은, PVC(polyvinylchloride)와 같은 시트 상에 요철로 형성된 엠보를 부여하고, 엠보가 형성된 시트의 표면을 UV 경화 처리제로 마감하는 방식으로 제조되었다. 그러나, 엠보가 형성된 PVC 시트 만으로는 천연재료에 근접한 사실감을 구현하는데 한계가 있다.Conventional products have been manufactured in such a way that embossing formed in irregularities is applied to a sheet such as PVC (polyvinylchloride), and the surface of the embossed sheet is finished with a UV curing agent. However, there is a limit to realizing a sense of realism close to that of natural materials using only the embossed PVC sheet.
본 출원의 일 목적은, 천연 질감에 가깝도록 표면의 사실감(reality)이 우수한 장식재를 제공하는 것이다.One object of the present application is to provide a decorative material having excellent surface realism so as to be close to natural texture.
본 출원의 다른 목적은, 내구성 및 내오염성이 우수한 장식재를 제공하는 것이다.Another object of the present application is to provide a decorative material excellent in durability and stain resistance.
본 출원의 또 다른 목적은, 사실감, 내구성 및 내오염성이 우수한 장식재를 형성하는데 사용되는 적층체 및 패턴 적층체를 제공하는 것이다.Another object of the present application is to provide a laminate and a pattern laminate used to form a decorative material excellent in realism, durability and stain resistance.
본 출원의 또 다른 목적은 내구성 및 내오염성뿐 아니라 사실감이 우수한 바닥재를 제공하는 것이다.Another object of the present application is to provide a flooring material having excellent realism as well as durability and stain resistance.
본 출원의 상기 목적 및 기타 그 밖의 목적은 하기 상세히 설명되는 본 출원에 의해 모두 해결될 수 있다.All of the above and other objects of the present application can be solved by the present application described in detail below.
본 출원에 관한 일례에서, 본 출원은 패턴 적층체에 관한 것이다. 적층체의 패턴은 사용자에게 천연 질감에 가까운 사실감을 제공하는 것으로, 적어도 적층체의 표면 측, 구체적으로는 적층체를 형성하는 2 이상의 층(layer) 구성 중에서 사용자 시인측에 가까운 층의 일 면에 형성될 수 있다.In one example related to the present application, the present application relates to a patterned laminate. The pattern of the laminate provides the user with a sense of realism close to the natural texture.At least on the surface side of the laminate, specifically, on one side of the layer close to the user's viewing side among two or more layers constituting the laminate. Can be formed.
본 출원에 따른 패턴 적층체는, 하기 설명되는 구성 또는 특성을 갖는 기재층과 경화층에 대하여 소정의 방식을 통해 패턴이 부여되면서 제조될 수 있다. 그에 따라, 종래 기술과 비교할 때, 본 출원의 패턴 적층체는 패턴의 사실감(reality)이 우수한 장식재를 제공할 수 있다. 또한, 상기 패턴 적층체는 종래 기술과 동등 또는 그 이상의 내구성과 내오염성을 제공할 수 있다.The patterned laminate according to the present application may be manufactured while applying a pattern to the substrate layer and the cured layer having the configuration or characteristics described below through a predetermined method. Accordingly, compared with the prior art, the patterned laminate of the present application can provide a decorative material having excellent pattern reality. In addition, the patterned laminate may provide durability and stain resistance equivalent to or higher than those of the prior art.
사용자에게 천연질감에 유사한 사실감을 제공하는 패턴은 오목부(concave part)와 볼록부(convex part)에 의해 형성된다. 즉, 패턴은 오목부와 볼록부를 포함한다. 특별히 달리 정의되지 않는 이상, 오목부와 볼록부에 의해 형성되는 패턴은 요철 또는 엠보 등과 같은 용어와 혼용될 수 있다. 패턴 디자인에 따라서, 오목부와 볼록부는 소정의 너비를 갖는 것으로 사용자에게 시인될 수 있다. 패턴 형상과 그 높낮이에 따라, 오목부 또는 볼록부는 상대적으로 호칭될 수 있다.A pattern that provides the user with a sense of realism similar to the natural texture is formed by concave parts and convex parts. That is, the pattern includes a concave portion and a convex portion. Unless otherwise defined, the pattern formed by the concave portion and the convex portion may be mixed with terms such as unevenness or embossing. According to the pattern design, the concave portion and the convex portion can be visually recognized by the user as having a predetermined width. Depending on the shape of the pattern and its height, the concave portion or the convex portion may be called relatively.
패턴의 사실감과 관련하여, 천연 유사 질감을 구현하기 위해 제조된 종래 제품의 경우 가압 롤러 등을 통해 기재층에 엠보 디자인을 먼저 형성하고, 이후 엠보 디자인을 보호하기 위한 경화제 처리를 수행하는 방식(조성물 도포 후 경화)으로 제조되었다. 이렇게 제조된 제품의 경우 기재층 엠보를 코팅하는 경화제가 기재층의 엠보를 충분히 반영하지 못하기 때문에 표면 질감이 고급스럽지 못하고, 천연 유사의 사실감도 사용자에게 충분히 전달되지 못하는 문제가 있었다. 본 출원의 발명자는 이러한 종래 제품의 문제점을 예의 연구한 결과 본 출원을 발명하였다.Regarding the realism of the pattern, in the case of a conventional product manufactured to realize a natural-like texture, an emboss design is first formed on the substrate layer through a pressure roller, and thereafter, a method of performing a curing agent treatment to protect the emboss design (composition It was prepared by curing after application). In the case of the manufactured product, the surface texture is not luxurious because the curing agent coating the base layer embossing does not sufficiently reflect the embossing of the base layer, and there is a problem that the realism of natural similarity is not sufficiently delivered to the user. The inventor of the present application invented the present application as a result of studying the problems of such conventional products.
구체적으로, 본 출원의 발명자는 경화층을 먼저 기재층에 형성한 후 적층체 표면에 대한 엠보처리(즉, 표면 요철을 형성하기 위한 공정)를 수행하여 장식재용 적층체를 제조하는 것이, 천연 소재 유사 질감 확보에 유리하다는 것에 착안하였다. 이에 더 나아가, 기재층 상에 조성물이 도포된 후 경화 처리를 통해 형성되는 경화층의 경우 경화에 따른 하드니스(hardness) 증가로 요철 형성을 위한 가압/가열 과정에서 손상되는 문제점(예: 경화층이나 기재층의 깨짐)이 있음을 확인하고, 본 출원의 발명자는 이러한 문제점까지 보완할 수 있는 본 출원 발명을 완성하기에 이르렀다.Specifically, the inventor of the present application first formed a cured layer on the base layer and then embossed the surface of the laminate (ie, a process for forming surface irregularities) to manufacture a laminate for decorative materials. It focused on the advantage of securing similar texture. Furthermore, in the case of a cured layer formed through curing treatment after the composition is applied on the substrate layer, the problem of being damaged during the pressing/heating process for forming irregularities due to an increase in hardness due to curing (e.g., cured layer Or cracking of the base layer), and the inventor of the present application has come to complete the present invention of the present application that can compensate for such problems.
이하에서는 첨부된 도면을 참고하여 본 출원을 상세히 설명한다. 본 출원에 관한 설명의 편의를 위하여, 오목부와 볼록부 형성을 위한 공정을 엠보처리라고 호칭한다. 그리고, 상기 엠보처리가 이루어지기 전의 기재층과 경화층은 각각 기재층(A')과 경화층(B')으로 호칭하고, 엠보처리에 의해 오목부와 볼록부를 갖게 된 기재층과 경화층을 각각 기재층(A)과 경화층(B)으로 호칭한다. 또한, 엠보처리 이전과 이후를 구별하고자 엠보처리를 통해 오목부와 볼록부가 형성된 기재층(A)과 경화층(B)을 포함하는 적층체는 패턴 적층체로 호칭하고, 기재층(A')과 경화층(B')을 포함하는 경우는 적층체 또는 비패턴 적층체로 호칭한다.Hereinafter, the present application will be described in detail with reference to the accompanying drawings. For convenience of explanation of the present application, a process for forming concave portions and convex portions is referred to as embossing. In addition, the base layer and the cured layer before the embossing treatment is performed are referred to as a base layer (A') and a cured layer (B'), respectively, and a base layer and a cured layer having concave portions and convex portions by embossing are formed. They are referred to as a base layer (A) and a cured layer (B), respectively. In addition, in order to distinguish between before and after the embossing treatment, the laminate including the substrate layer (A) and the cured layer (B) in which concave portions and convex portions are formed through embossing is referred to as a pattern laminate, and the substrate layer (A') and When the cured layer (B') is included, it is referred to as a laminated body or a non-patterned laminated body.
본 출원의 패턴 적층체는 오목부와 볼록부가 형성된 기재층(A); 및 상기 기재층 상에 위치하고, 상기 기재층과 동일한 형상의 오목부와 볼록부를 갖는 경화층(B)을 포함한다. 구체적으로, 본 출원에서는 기재층(A') 상에 경화층(B')을 먼저 형성하고, 기재층(A')과 경화층(B')의 적층체에 대하여 일체로서 엠보 처리가 이루어지기 때문에, 기재층(A)과 경화층(B)이 동일한 형상의 오목부와 볼록부를 갖는데 유리하다.The pattern laminate of the present application includes a base layer (A) in which concave portions and convex portions are formed; And a cured layer (B) positioned on the substrate layer and having a concave portion and a convex portion having the same shape as the substrate layer. Specifically, in the present application, a cured layer (B') is first formed on the base layer (A'), and the laminate of the base layer (A') and the cured layer (B') is integrally embossed. Therefore, it is advantageous for the base layer (A) and the cured layer (B) to have concave portions and convex portions of the same shape.
예를 들어, '엠보가 형성된 기재층'의 표면에 경화 처리제(경화 조성물)을 도포한 후 경화처리를 하는 경우 도 1a와 같이 경화층의 두께 편차로 인해, 경화층이 그 두께 방향에서 기재층의 오목부 및 볼록부 형상을 충분히 반영하지 못하는 문제가 있다. 특히, 이러한 방식에 따라 제조된 적층체의 경우 기재층의 볼록부 상에는 경화층이 얇게 형성되고, 기재층의 오목부 상에는 경화층이 두껍게 형성되기 쉽다. 오목부와 볼록부의 심한 두께 편차로 인해 사용자는 패턴의 사실감을 느끼기 어렵다.For example, in the case of curing treatment after applying a curing agent (curing composition) to the surface of the'embossed base layer', the cured layer is the base layer in the thickness direction due to the thickness variation of the cured layer as shown in FIG. 1A. There is a problem that the shape of the concave portion and the convex portion is not sufficiently reflected. In particular, in the case of the laminate manufactured according to this method, the cured layer is formed thinly on the convex portion of the base layer, and the cured layer is easily formed thickly on the concave portion of the base layer. It is difficult for the user to feel the realism of the pattern due to the severe thickness deviation of the concave portion and the convex portion.
그러나, 본 출원의 구체예에 따라서, 경화층을 기재층 상에 형성한 후 기재층(A')과 경화층(B')의 적층체에 대하여 일체로서 엠보 처리가 이루어지는 경우에는, 경화층이 그 두께 방향에서 갖는 두께 편차가 현저히 줄기 때문에 경화층 역시 기재층과 동일한 형상의 엠보를 갖는데 유리하다(예를 들어 도 1b 참조). 참고로, 이러한 차이는 비교예와 실시예의 패턴 표면 이미지로를 통해서도 확인 가능하다.However, according to the specific example of the present application, when the laminate of the base layer (A') and the cured layer (B') is integrally embossed after forming the cured layer on the base layer, the cured layer is Since the thickness variation in the thickness direction is significantly reduced, the cured layer is also advantageous in having an emboss of the same shape as that of the base layer (see, for example, FIG. 1B). For reference, this difference can also be confirmed through the pattern surface image of Comparative Examples and Examples.
본 출원에 관한 일례에서, 경화층(B)과 기재층(A)이 동일한 형상의 오목부와 볼록부를 갖는 특징은 두께 편차와 관련된 수치로 표현될 수 있다. 예를 들어, 오목부와 볼록부를 갖는 상기 경화층(B)은 2 ㎛ 이내의 두께 편차를 가질 수 있다. 즉, 본 출원의 패턴 적층체는, 오목부와 볼록부가 형성된 기재층(A); 및 상기 기재층 상에 위치하고, 상기 기재층과 동일한 형상의 오목부와 볼록부를 가지며, 상기 오목부와 볼록부의 두께 편차(또는 상기 오목부와 볼록부에서의 두께 편차)가 2 ㎛ 이내인 경화층(B)을 포함하는 패턴 적층체일 수 있다.In an example related to the present application, a feature in which the cured layer (B) and the base layer (A) have concave portions and convex portions having the same shape may be expressed as a value related to thickness variation. For example, the cured layer (B) having a concave portion and a convex portion may have a thickness variation within 2 μm. That is, the pattern stack of the present application includes a base layer (A) in which concave portions and convex portions are formed; And a cured layer located on the substrate layer, having a concave portion and a convex portion having the same shape as the substrate layer, and having a thickness deviation (or thickness deviation between the concave portion and the convex portion) of the concave portion and the convex portion within 2 µm. It may be a pattern laminate including (B).
구체적으로, 기재층(A)과 경화층(B)의 계면을 형성하는 기재층 또는 경화층의 어느 지점으로부터 사용자 시인측을 향하여 측정된 경화층의 두께는 패턴을 형성하는 모든 영역에서 그 편차가 2 ㎛ 이내일 수 있다. 예를 들어, 상기 경화층(B)은 오목부 및 볼록부를 포함하는 모든 경화층 영역에서의 두께 편차가 2 ㎛ 이내일 수 있다.Specifically, the thickness of the cured layer measured toward the user's viewing side from a certain point of the base layer or cured layer that forms the interface between the base layer (A) and the cured layer (B) is different in all areas forming the pattern. It may be within 2 μm. For example, the cured layer (B) may have a thickness variation within 2 μm in all areas of the cured layer including concave portions and convex portions.
상기 두께 편차의 상한은 예를 들어, 1.5 ㎛ 이하 또는 1.0 ㎛ 이하일 수 있다. 구체적으로, 상기 상한은, 예를 들어, 0.9 ㎛ 이하, 0.8 ㎛ 이하, 0.7 ㎛ 이하, 0.6 ㎛ 이하 또는 0.5 ㎛ 이하일 수 있다. 경화층 두께의 편차가 작을수록 패턴에 의한 천연 질감의 사실감이 보다 우수해질 수 있기 때문에, 상기 두께 편차의 하한은 특별히 제한되지 않으나 실질적으로는 편차가 0 ㎛ 또는 그에 가까울 수 있고, 예를 들어, 0.01 ㎛ 이상 또는 0.1 ㎛ 이상일 수 있다.The upper limit of the thickness deviation may be, for example, 1.5 µm or less or 1.0 µm or less. Specifically, the upper limit may be, for example, 0.9 µm or less, 0.8 µm or less, 0.7 µm or less, 0.6 µm or less, or 0.5 µm or less. Since the smaller the deviation of the cured layer thickness, the more excellent the realism of the natural texture by the pattern may be, so the lower limit of the thickness deviation is not particularly limited, but the deviation may be substantially 0 μm or closer, for example, It may be 0.01 μm or more or 0.1 μm or more.
상기 설명된 기재층과(A)과 경화층(B)이 갖는 동일 형상의 패턴, 그리고 두께 편차에 관해서는, 본 출원의 구체예에 따른 도 4b를 참고할 수 있다.For the pattern of the same shape and thickness variation of the base layer (A) and the cured layer (B) described above, reference may be made to FIG. 4B according to a specific example of the present application.
한편, 경화층 형성후 엠보처리를 하는 것만으로 경화층과 기재층이 동일한 형상의 엠보를 갖게 되고, 패턴의 사실감이 개선될 수 있는 것은 아니다. 구체적으로, 경화층이 기재층의 패턴을 보호할 수 있을 만큼의 단단한 특성을 가져야하는 것은 물론이고, 그 외에도 경화층은 엠보처리시에 그 표면에 가해지는 고온 및 고압에도 부서지지 않을 만큼의 유연성을 가져야 한다. 즉, 패턴의 사실감이 개선되기 위해서는 기재층(A')과 경화층(B')에 대하여 일체로서 수행되는 엠보 형성 공정에 필요한 적정 수준의 유연성(softness)과 단단함(hardness)을 동시에 만족할 수 있는 경화층(B, B') 또는 이를 형성하는 재료(예: 경화 처리제)가 사용되어야 한다.On the other hand, just by performing the embossing treatment after forming the cured layer, the cured layer and the base layer have the same embossing, and the realism of the pattern cannot be improved. Specifically, not only must the cured layer have a characteristic that is rigid enough to protect the pattern of the substrate layer, but in addition, the cured layer is flexible enough not to break even under high temperature and high pressure applied to the surface during embossing. Should have. In other words, in order to improve the realism of the pattern, it is possible to simultaneously satisfy the appropriate level of softness and hardness required for the embossing process performed integrally with the base layer (A') and the cured layer (B'). The cured layer (B, B') or a material forming it (eg, curing agent) must be used.
경화층(B, B') 또는 이를 형성하는 재료(처리제)가, 본 출원에 따른 엠보 형성 공정에 필요한 적정 수준의 유연함과 단단함을 갖는 것은, 동적 점탄성 특성을 통해 표현될 수 있다. 점탄성 특성은 공지된 동적 물성 분석 장치(Dynamic Mechanical Analysis), 예를 들어 ARES(Advanced Rheometric Expansion System) 기기를 사용하여 이루어질 수 있다. 상기 점탄성 특성은, 0.1 내지 100 % 범위의 변형, 0.01 내지 100 rad/s 범위의 주파수에서, 5 내지 10 ℃/min 범위의 승온 속도로 -25 ℃ 에서 125 ℃ 까지 동적 점탄성을 측정한 경우의 점탄성 특성일 수 있다. 특별히 제한되지 않으나, 유변 물성 측정 시에는 8 내지 25 mmΦ 의 플레이트가 사용될 수 있다.The cured layer (B, B') or the material (treatment agent) forming the same, having an appropriate level of flexibility and rigidity required for the embossing process according to the present application can be expressed through dynamic viscoelastic properties. The viscoelastic properties may be achieved using a known dynamic mechanical analysis, for example, an Advanced Rheometric Expansion System (ARS) device. The viscoelastic property is the viscoelasticity when dynamic viscoelasticity is measured from -25°C to 125°C at a temperature increase rate in the range of 5 to 10°C/min at a strain in the range of 0.1 to 100%, a frequency in the range of 0.01 to 100 rad/s. It can be a characteristic. Although not particularly limited, a plate of 8 to 25 mmΦ may be used when measuring rheological properties.
하나의 예시에서, 상기 경화층(B, B')은 동적점탄성 측정에 의해 확인되는 tanδ 피크값(또는 극대값)이 0.5 이상일 수 있다.In one example, the hardened layers (B, B') may have a tanδ peak value (or a maximum value) of 0.5 or more as determined by dynamic viscoelasticity measurement.
예를 들어, 상기 tanδ 피크값은 0.55 이상, 0.60 이상, 또는 0.65 이상일 수 있고, 그 상한은 예를 들어, 0.80 이하, 0.75 이하 또는 0.70 이하일 수 있다. 즉, 경화층(B) 및/또는 경화층(B')은 상기 tanδ 피크값을 만족할 수 있다. 상기 tanδ 피크값은, 손실탄성률(loss modulus)(G”)을 저장탄성률(dynamic storage modulus)(G')로 나눈 값을 의미한다. 경화층이 상기 범위의 tanδ 피크값을 만족한다는 것은, 도포후 경화된 처리제나 이를 포함하는 경화층이 상기 범위의 tanδ 피크값을 만족하는 것으로, 상기 경화층은 적정 수준의 단단함과 함께 유연성을 갖는다.For example, the tanδ peak value may be 0.55 or more, 0.60 or more, or 0.65 or more, and the upper limit thereof may be, for example, 0.80 or less, 0.75 or less, or 0.70 or less. That is, the cured layer (B) and/or the cured layer (B') may satisfy the tanδ peak value. The tanδ peak value means a value obtained by dividing a loss modulus (G") by a dynamic storage modulus (G'). The fact that the cured layer satisfies the tanδ peak value in the above range means that the treatment agent cured after application or the cured layer including the same satisfies the tanδ peak value in the range, and the cured layer has an appropriate level of rigidity and flexibility. .
하나의 예시에서, 상기 경화층(B, B')은 동적점탄성 측정에 의해 확인되는 tanδ 피크값(또는 극대값)이 0.5 이상이고, 상기 피크값에 대한 온도로 정의되는 유리전이온도(Tg)가 10 ℃ 이하일 수 있다. 예를 들어, 상기 유리전이온도(Tg)는 5 ℃ 이하 또는 0 ℃ 이하일 수 있고, 그 하한은 예를 들어, - 35 ℃ 이상, - 20 ℃ 이상, - 15℃ 이상, - 10℃ 이상 또는 -5 ℃ 이상일 수 있다. 즉, 경화층(B) 및/또는 경화층(B')은 상기 tanδ 피크값과 유리전이온도(Tg)를 만족할 수 있다. 경화층이 상기 범위의 유리전이온도를 만족한다는 것은 도포후 경화된 처리제나 이를 포함하는 경화층이 상기 범위의 유리전이온도를 만족한다는 것을 의미한다. 상기 유리전이온도 범위를 초과하는 경우와 비교할 때, 본 출원에 따르면 하기 설명되는 엠보처리가 이루어지더라도 적층체가 깨지지 않으면서 엠보를 선명하게 수용할 수 있을 만큼의 신율이 확보되고, 경화층이 기재층에 대한 밀착 상태를 갖는데 유리할 수 있다.In one example, the hardened layer (B, B') has a tanδ peak value (or maximum value) of 0.5 or more, as determined by dynamic viscoelasticity measurement, and a glass transition temperature (Tg) defined as a temperature for the peak value. It may be 10 ℃ or less. For example, the glass transition temperature (Tg) may be 5°C or less or 0°C or less, and its lower limit is, for example, -35°C or more, -20°C or more, -15°C or more, -10°C or more, or- It may be 5 ℃ or more. That is, the cured layer (B) and/or the cured layer (B′) may satisfy the tanδ peak value and the glass transition temperature (Tg). That the cured layer satisfies the glass transition temperature in the above range means that the treatment agent cured after application or the cured layer including the same satisfies the glass transition temperature in the above range. Compared with the case where the glass transition temperature is exceeded, according to the present application, even if the embossing process described below is performed, an elongation sufficient to clearly accommodate the emboss without breaking the laminate is secured, and the cured layer is used as the substrate. It can be advantageous to have a state of adhesion to the layer.
하나의 예시에서, 상기 경화층(B, B')은 90 ℃ 이상인 온도에서 측정된 저장탄성률(G') 값이 3.0 x 10 6 Pa 이하일 수 있다. 즉, 경화층(B) 및/또는 경화층(B')은 상기 저장탄성률(G') 값을 만족할 수 있다. 구체적으로, 상기 저장탄성률(G') 값의 상한은 2.5 x 10 6 Pa 이하, 2.0 x 10 6 Pa 이하 또는 1.5 x 10 6 Pa 이하일 수 있고, 그 하한은 예를 들어, 1.0 x 10 5 Pa 이상, 5.0 x 10 5 Pa 이상, 8.0 x 10 5 Pa 이상 또는 1.0 x 10 6 Pa 이상일 수 있다. 경화층이 상기 범위의 저장탄성률을 만족한다는 것은, 도포후 경화된 처리제나 이를 포함하는 경화층이 상기 범위의 tanδ 피크값을 확보할 수 있을 뿐 아니라 소정 온도에서 적절한 단단함(hardness)을 갖는다는 것을 의미한다. 상기 범위의 저장탄성률(G')이 측정되는 온도는 예를 들어, 90 ℃ 이상 140 ℃ 이하 범위일 수 있는데, 이러한 온도는 하기 설명되는 본 출원에 따른 엠보처리시에 패턴이 형성된 고온 롤러와 접촉하면서 경화층이 갖게 되는 표면 온도일 수 있다.In one example, the cured layers (B, B') may have a storage modulus (G') value of 3.0 x 10 6 Pa or less measured at a temperature of 90 °C or higher. That is, the cured layer (B) and/or the cured layer (B') may satisfy the storage modulus (G') value. Specifically, the upper limit of the storage modulus (G') value may be 2.5 x 10 6 Pa or less, 2.0 x 10 6 Pa or less, or 1.5 x 10 6 Pa or less, and the lower limit is, for example, 1.0 x 10 5 Pa or more. , 5.0 x 10 5 Pa or more, 8.0 x 10 5 Pa or more, or 1.0 x 10 6 Pa or more. The fact that the cured layer satisfies the storage modulus in the above range means that the treatment agent cured after application or the cured layer including the same can not only secure the tanδ peak value in the above range, but also have an appropriate hardness at a predetermined temperature. it means. The temperature at which the storage modulus (G') in the above range is measured may be, for example, in the range of 90° C. or more and 140° C. or less, which is in contact with the high-temperature roller on which the pattern is formed during the embossing process according to the present application described below. While the cured layer may have a surface temperature.
상기와 같은 동적 점탄성 특성을 갖는 경화 처리제 또는 경화층을 사용하는 경우, 앞서 도 1b를 예시로 설명한 것과 같이, 경화층을 기재층 상에 형성한 후 기재층(A')과 경화층(B')을 갖는 적층체에 대하여 일체로서 엠보 처리가 이루어지더라도 경화층이나 기재층의 깨짐이 없고, 경화층과 기재층이 동일한 형상의 엠보를 가질 수 있다.In the case of using the curing agent or cured layer having dynamic viscoelastic properties as described above, a cured layer is formed on the base layer as described above with reference to FIG. 1B, and then the base layer (A') and the cured layer (B') Even if embossing is performed as an integral part of the laminate having ), there is no cracking of the cured layer or the base layer, and the cured layer and the base layer may have the same embossing shape.
상기 설명된 점탄성 특성에 관해서는, 본 출원의 구체예에 따른 점탄성 측정 결과에 관한 도 2를 참고할 수 있다. With respect to the above-described viscoelastic properties, reference may be made to FIG. 2 regarding a result of measuring viscoelasticity according to a specific example of the present application.
설명된 점탄성 특성과 같은 경화층의 물성은, 하기 설명되는 본 출원의 경화 처리제에 대한 경화 후 물성일 수 있고, 또는 기재층 상에 도포된 후 경화된 경화층(B 및/또는 B')의 일부를 채취하여 얻어진 경우의 물성일 수도 있다.Physical properties of the cured layer such as the viscoelastic properties described below may be physical properties after curing for the curing treatment agent of the present application described below, or of the cured layer (B and/or B′) cured after being applied on the substrate layer. It may be a physical property when obtained by collecting a part.
이와 관련하여, 특별히 달리 언급하지 않는 이상, 본 출원에서 경화 처리제를 사용한 경화층 형성과 관련하여 사용되는 「경화」라는 표현은, 경화층(B') 형성을 위한 처리제 또는 조성물을 기재층(A') 상에 도포하고, 250 내지 350 mJ/cm 2 (예: 약 300 mJ/cm 2) 수준으로 자외선을 조사하는 처리를 의미하거나, 또는 그에 이어서 90 내지 110 ℃ 범위에서 수분 내지 수십분 동안 추가로 가열(예: 약 100 ℃에서 5분 가량)하는 것까지 포함하는 처리를 의미할 수 있다. 하기 설명되는 경화 처리제가 이러한 경화 과정을 거치면서 경화층(B, B')이 형성될 수 있다. 바꾸어 말하면, 상기 경화층(B, B')은, 경화 후 물성이 앞서 설명한 것과 같은 경화 처리제의 경화물이거나 이를 포함할 수 있다.In this regard, unless specifically stated otherwise, the expression “curing” used in connection with forming a cured layer using a curing agent in the present application refers to the treatment agent or composition for forming the cured layer (B') as the base layer (A '), and refers to a treatment of irradiating ultraviolet rays at a level of 250 to 350 mJ/cm 2 (eg, about 300 mJ/cm 2 ), or subsequently in the range of 90 to 110° C. for several minutes to several tens of minutes. It may mean a treatment including heating (for example, about 5 minutes at about 100°C). Curing layers (B, B') may be formed while the curing treatment agent described below undergoes such a curing process. In other words, the cured layers (B, B') may include or be a cured product of the curing agent as described above in physical properties after curing.
하나의 예시에서, 상기 기재층(A' 및/또는 A)은 200 내지 1,000 ㎛ 범위 내의 두께를 가질 수 있다. 예를 들어, 상기 기재층의 두께 하한은 250 ㎛ 이상, 300 ㎛ 이상, 350 ㎛ 이상, 450 ㎛ 이상, 500 ㎛ 이상 또는 550 ㎛ 이상일 수 있고, 그 상한은 예를 들어, 900 ㎛ 이하, 800 ㎛ 이하, 700 ㎛ 이하, 600 ㎛ 이하 또는 500 ㎛ 이하일 수 있다. 기재층의 두께가 상기 범위 미만인 경우에는 기재층에 요철무늬가 충분히 새겨지지 못하는 문제가 있다. 또한, 그 두께가 상기 범위를 초과하는 경우에는 장식재 형성을 위해 제조된 적층체를 다른 구성과 합지하는 경우에, 합지되는 층간 하드니스 차이가 커지면서 휨이 발생할 수 있다.In one example, the base layer (A' and/or A) may have a thickness within a range of 200 to 1,000 μm. For example, the lower limit of the thickness of the base layer may be 250 µm or more, 300 µm or more, 350 µm or more, 450 µm or more, 500 µm or more, or 550 µm or more, and the upper limit is, for example, 900 µm or less, 800 µm Hereinafter, it may be 700 µm or less, 600 µm or less, or 500 µm or less. When the thickness of the substrate layer is less than the above range, there is a problem in that the uneven pattern is not sufficiently engraved on the substrate layer. In addition, when the thickness exceeds the above range, when a laminate manufactured for forming a decorative material is laminated with another configuration, a difference in hardness between the laminated layers may increase and warpage may occur.
하나의 예시에서, 상기 경화층(B' 및/또는 B)은 5 내지 50 ㎛ 범위 내의 두께를 가질 수 있다. 예를 들어, 상기 경화층의 두께 하한은 6 ㎛ 이상, 7 ㎛ 이상, 8 ㎛ 이상, 9 ㎛ 이상, 10 ㎛ 이상, 11 ㎛ 이상, 12 ㎛ 이상, 13 ㎛ 이상, 14 ㎛ 이상 또는 15 ㎛ 이상일 수 있다. 그리고, 그 상한은 예를 들어, 45 ㎛ 이하, 40 ㎛ 이하, 35 ㎛ 이하, 30 ㎛ 이하, 25 ㎛ 이하, 20 ㎛ 이하 또는 15 ㎛ 이하일 수 있다. 경화층의 두께가 상기 범위 미만인 경우에는 경화층 및 이를 포함하는 적층체나 장식재가 충분한 기계적 강도를 갖기 어렵다. 또한, 그 두께가 상기를 초과하는 경우에는 가격이 상승하고, 경화가 어려운 문제가 있다.In one example, the cured layer (B' and/or B) may have a thickness within a range of 5 to 50 μm. For example, the lower limit of the thickness of the cured layer is 6 µm or more, 7 µm or more, 8 µm or more, 9 µm or more, 10 µm or more, 11 µm or more, 12 µm or more, 13 µm or more, 14 µm or more, or 15 µm or more. I can. And, the upper limit may be, for example, 45 µm or less, 40 µm or less, 35 µm or less, 30 µm or less, 25 µm or less, 20 µm or less, or 15 µm or less. When the thickness of the cured layer is less than the above range, it is difficult for the cured layer and a laminate or decorative material including the cured layer to have sufficient mechanical strength. In addition, when the thickness exceeds the above, there is a problem that the price increases and hardening is difficult.
상기 설명한 바와 같이, 본 출원의 패턴 적층체를 제조하기 위한 엠보처리는 기재층(A') 및 경화층(B')에 대하여 동시에 일체로 행해진다. 예를 들어, 상기 엠보처리는 오목부와 볼록부를 포함하는 패턴이 그 표면에 형성된 기구(예: 롤러)에 의한 가압 및 가열을 통해 수행될 수 있다.As described above, the embossing treatment for manufacturing the patterned laminate of the present application is performed integrally with the base layer (A') and the cured layer (B') at the same time. For example, the embossing treatment may be performed by pressing and heating a pattern including a concave portion and a convex portion by a mechanism (eg, a roller) formed on the surface thereof.
이와 관련하여, 시인되는 패턴의 사실감을 높이기 위해서는, 기재층에 요철무늬가 충분히 깊게 새겨질 수 있도록 두께가 적어도 200 ㎛ 이상, 구체적으로는 300 ㎛ 이상, 400 ㎛ 이상 또는 500 ㎛ 이상인 기재층을 사용하는 것이 바람직하다. 그리고, 상기 두께 정도의 기재층에 패턴을 형성하기 위해서는 고온에서의 엠보처리가 필요하다. 예를 들어, 상기 엠보처리는 적어도 150 ℃ 이상의 온도 조건, 구체적으로는 그 표면의 온도가 150 ℃ 이상인 롤러를 이용하여 엠보처리가 이루어질 수 있다.In this regard, in order to increase the realism of the pattern to be recognized, a substrate layer having a thickness of at least 200 µm or more, specifically 300 µm or more, 400 µm or more, or 500 µm or more is used so that the uneven pattern can be sufficiently deeply engraved on the base layer. It is desirable. In addition, in order to form a pattern on the substrate layer having the thickness, an embossing treatment at a high temperature is required. For example, the embossing treatment may be performed under a temperature condition of at least 150° C. or higher, specifically, using a roller having a surface temperature of 150° C. or higher.
엠보처리를 위한 기구로서 롤러가 사용되는 경우, 고온 엠보처리를 위하여 금속 롤러가 사용될 수 있다. 예를 들어, 상기 금속 롤러는 스테인리스로 알려진 SUS 롤러일 수 있다. 그에 따라, 고무 재질의 롤러를 사용하는 경우 보다, 높은 온도에서 엠보처리가 이루어질 수 있다. 종래 기술에서는 고무 롤러를 사용하여 약 150 ℃ 이하의 온도, 구체적으로는 약 120 내지 150 ℃ 온도에서 엠보처리가 이루어졌으나, 금속 롤러를 사용하여 엠보처리를 수행하는 경우에는 약 150 ℃ 이상의 온도, 예를 들어 150 내지 180 ℃ 의 온도에서 적층체 표면에 대한 고온 가압이 이루어질 수 있다. 그에 따라, 기재층에 선명한 패턴을 형성할 수 있다.When a roller is used as a device for embossing, a metal roller may be used for high-temperature embossing. For example, the metal roller may be a SUS roller known as stainless steel. Accordingly, the embossing treatment can be performed at a higher temperature than when using a roller made of a rubber material. In the prior art, embossing was performed at a temperature of about 150° C. or less, specifically about 120 to 150° C. using a rubber roller, but in the case of performing the embossing using a metal roller, a temperature of about 150° C. or higher, eg For example, high-temperature pressurization on the surface of the laminate may be performed at a temperature of 150 to 180°C. Accordingly, a clear pattern can be formed on the substrate layer.
150 ℃ 이상의 온도에서 엠보처리가 이루어지는 경우, 롤러와 접하는 적층체의 표면은 90 ℃ 이상의 온도를 가질 수 있다. 구체적으로, 롤러와 접하는 적층체의 표면은 예를 들어, 150 ℃ 이하 또는 140 ℃ 이하의 온도로서, 약 90 ℃ 이상, 95 ℃ 이상 또는 100 ℃ 이상의 온도를 가질 수 있다. 그에 따라서, 적층체, 구체적으로 적층체를 형성하는 경화층 및 기재층은 상기와 같은 고온 가압에도 깨지지 않으면서 롤러의 패턴을 뚜렷하게 수용할 수 있을 정도의 유연성을 가져야 한다. 이와 관련하여, 상기 적층체는 적어도 90 ℃ 인 온도에서 우수한 신율을 갖는 기재층과 경화층을 포함할 수 있다.When the embossing is performed at a temperature of 150° C. or higher, the surface of the laminate in contact with the roller may have a temperature of 90° C. or higher. Specifically, the surface of the laminate in contact with the roller may have a temperature of, for example, 150° C. or less or 140° C. or less, and may have a temperature of about 90° C. or more, 95° C. or more, or 100° C. or more. Accordingly, the laminate, in particular, the cured layer and the base layer forming the laminate should have a degree of flexibility to clearly accommodate the pattern of the roller without being broken even by the high-temperature pressure as described above. In this regard, the laminate may include a base layer and a cured layer having excellent elongation at a temperature of at least 90 °C.
하나의 예시에서, 엠보처리가 이루어지는 적층체는 90 ℃이상인 온도에서의 신율이 20 % 이상인 경화층(B')을 포함할 수 있다. 즉, 상기 패턴 적층체는, 기재층(A'); 및 상기 기재층 상에 형성되고, 90 ℃이상인 온도에서의 신율이 20 % 이상인 경화층(B')을 갖는 적층체로부터 형성된 것일 수 있다. 본 출원에서 신율이 20% 이상이라는 것은, 예를 들어 경화층을 소정 방향으로 인장하는 경우에(당기는 경우에), 경화층이 적어도 본래 가진 크기의 20% 이상 늘어날 수 있는 것을 말한다. 이때, 상기 신율은 적층체 표면에 대한 법선 방향에서 소정의 크기(예: 길이 X 폭)(단, 길이는 폭 보다 크다)을 갖는 경화층의 길이 방향 또는 폭 방향과 인장 방향을 일치시킨 경우의 신율일 수 있다.In one example, the embossed laminate may include a cured layer (B') having an elongation of 20% or more at a temperature of 90° C. or more. That is, the patterned laminate may include a base layer (A'); And a cured layer (B') formed on the base layer and having an elongation of 20% or more at a temperature of 90° C. or higher. In the present application, the elongation of 20% or more means that, for example, when the hardened layer is stretched in a predetermined direction (if pulled), the hardened layer can be increased by at least 20% of its original size. At this time, the elongation is when the lengthwise direction or the width direction and the tensile direction of the cured layer having a predetermined size (e.g., length X width) (however, the length is greater than the width) are matched in the normal direction to the surface of the laminate. It can be elongation.
상기 신율의 하한은 예를 들어 25 % 또는 30 % 일 수 있고, 그 상한은 예를 들어, 50 % 이하, 40 % 이하 또는 30 % 이하일 수 있다. 경화층(B')의 신율이 상기 범위 미만인 경우 엠보처리시에 경화층(B')이 깨질 수 있다. 또한, 상기 신율이 50 %를 초과하는 것과 같이 유연성이 지나치게 큰 경우에는 경화층의 경화 조직이 치밀하지 못한 것으로, 내오염성, 내화학성 및 내구성이 좋지 못할 수 있다.The lower limit of the elongation may be, for example, 25% or 30%, and the upper limit may be, for example, 50% or less, 40% or less, or 30% or less. When the elongation of the cured layer B′ is less than the above range, the cured layer B′ may be broken during embossing. In addition, when the flexibility is too large, such as when the elongation exceeds 50%, the cured structure of the cured layer is not dense, and contamination resistance, chemical resistance, and durability may be poor.
본 출원에서 신율은 하기 실험례에서와 같이 소정 온도에서 도그본 형태로 재단된 기재층(A, A'), 경화층(B, B'), 적층체 또는 패턴 적층체를 100 mm/min의 속도로 인장하면서 측정된 것일 수 있다. 이때, 기재층과 경화층의 각 두께는 앞서 설명한 바와 동일한 범위일 수 있다. 그리고, 적층체 및 패턴 적층체의 두께는 기재층과 경화층의 두께에 의존한다.In the present application, the elongation is 100 mm/min for the substrate layer (A, A'), the cured layer (B, B'), the laminated body or the patterned laminate cut in a dogbone shape at a predetermined temperature as in the following experimental example. It may be measured while stretching at a speed. At this time, each thickness of the base layer and the cured layer may be in the same range as described above. In addition, the thickness of the laminate and the pattern laminate depends on the thickness of the base layer and the cured layer.
하나의 예시에서, 기재층(A')은 경화층(B') 보다 90 ℃이상인 온도에서의 신율이 높을 수 있다. 예를 들어, 기재층(A')은 90 ℃이상인 온도에서의 신율이 20% 이상, 30% 이상, 40 % 이상, 50 % 이상일 수 있고, 예를 들어 100 % 이상일 수 있다. 구체적으로, 기재층(A')의 상기 신율은 200 % 이상, 300% 이상, 400% 이상, 500% 이상, 600 % 이상, 700 % 이상, 800 % 이상, 900 % 이상 또는 1,000 % 이상일 수 있고, 더 크게는 1,500 % 이상, 또는 2,000 % 이상일 수 있다. 기재층(A')의 신율이 상기 범위 미만인 경우, 유연성이 부족하기 때문에 패턴 형성이 어려울 수 있다. 특별히 제한되지는 않으나, 기재층(A') 신율의 하한은 예를 들어, 3,000 % 이하, 2,500 % 이하 또는 2,000 % 이하일 수 있다.In one example, the base layer (A') may have a higher elongation at a temperature of 90° C. or higher than that of the cured layer (B'). For example, the base layer (A') may have an elongation of 20% or more, 30% or more, 40% or more, 50% or more, and, for example, 100% or more at a temperature of 90°C or more. Specifically, the elongation of the base layer (A') may be 200% or more, 300% or more, 400% or more, 500% or more, 600% or more, 700% or more, 800% or more, 900% or more, or 1,000% or more, and , May be greater than or equal to 1,500%, or greater than or equal to 2,000%. When the elongation of the base layer A'is less than the above range, it may be difficult to form a pattern due to insufficient flexibility. Although not particularly limited, the lower limit of the elongation of the base layer (A') may be, for example, 3,000% or less, 2,500% or less, or 2,000% or less.
하나의 예시에서, 상기 경화 처리제를 이용하여 기재층(A') 상에 형성된 경화층(B')은 하기 [식 1]에 의해 규정되는 경화도가 70 % 이하를 만족할 수 있다. 즉, 경화층(B')의 형성, 구체적으로는 경화 처리제에 대한 경화는 하기 [식 1]에 의해 규정되는 경화도가 70 % 이하를 만족하는 수준에서 이루어질 수 있다.In one example, the cured layer (B′) formed on the base layer (A′) using the curing agent may satisfy 70% or less of the curing degree defined by the following [Equation 1]. That is, the formation of the cured layer (B'), specifically, curing of the curing agent may be performed at a level that satisfies the degree of curing specified by the following [Equation 1] of 70% or less.
[식 1][Equation 1]
경화도(%) = {1-(Wi - Wf)/Wi} X 100Hardness (%) = {1-(Wi-Wf)/Wi} X 100
상기 식 1에서, Wi는 경화시킨 샘플을 일정 크기로 잘라 얻은 시편의 용제에 담그기 전 무게를 의미하고, Wf는 상기 시편을 용제에 담가 일정 기간 방치하고, 이어서 거름 장치를 이용하여 거른 후 남겨진 시편의 무게를 의미한다. In Equation 1, Wi refers to the weight of the sample obtained by cutting the cured sample into a certain size before immersing it in the solvent, and Wf is the sample left after immersing the sample in a solvent and leaving it for a certain period of time, followed by filtering using a strainer. Means the weight of.
예를 들어, 상기 경화층(B')은 식 1에 의해 계산되는 경화도가 70 % 이하, 65 % 이하 60 % 이하, 55 % 이하 또는 50 % 이하일 수 있다. 또한, 상기 경화도는 45% 이상, 50 % 이상, 55 % 이상, 60 % 이상 또는 65% 이상일 수 있다. 경화층(B')의 경화도가 상기 범위 보다 큰 경우에는 유연성을 확보하기 어렵고, 상기 범위 미만인 경우에는 단단함(hardness)이 부족하다.For example, the cured layer (B') may have a degree of curing calculated by Equation 1 of 70% or less, 65% or less, 60% or less, 55% or less, or 50% or less. In addition, the degree of curing may be 45% or more, 50% or more, 55% or more, 60% or more, or 65% or more. When the curing degree of the cured layer B'is larger than the above range, it is difficult to secure flexibility, and when it is less than the above range, the hardness is insufficient.
식 1에 관한 경화도 측정을 위한 용제는 특별히 제한되지 않으나, 예를 들어, 알킬 아세테이트류 용제, 케톤류 용제, 방향족 용제, 할로카본 오일 용제 등일 수 있다. 식 1에 관한 계산을 위하여 상기 시편을 용제에 담가 방치하는 기간은 특별히 제한되지 않으며, 예를 들어, 수시간 이상, 수일 이상, 또는 1일(24시간)에서 7일일 수 있다.The solvent for measuring the degree of curing according to Formula 1 is not particularly limited, but may be, for example, an alkyl acetate solvent, a ketone solvent, an aromatic solvent, a halocarbon oil solvent, or the like. For the calculation of Equation 1, the period in which the specimen is immersed in a solvent and left to stand is not particularly limited, and may be, for example, several hours or more, several days or more, or 1 day (24 hours) to 7 days.
상기와 같이 본 출원에서는 신율 특성이 우수한 경화층(B')을 형성한 후에 엠보처리가 이루어진다. 상기와 같은 엠보처리는, 이미 경화되어 형성된 경화층(B')의 치밀함을 증가시킨다. 구체적으로, 이미 형성된 경화층(B')에 대한 고온/가압 엠보처리를 통하여, 물리적/화학적 가교 정도가 경화층(B') 보다 높아진 패턴이 형성된 경화층(B)이 제공될 수 있다. 엠보처리 후에 치밀함 정도가 높아진 경화층(B)으로 인해 패턴 적층체는 기계적 강도나 내구성이 증가하고, 오염 물질이 경화 조직 내에 침투할 가능성이 줄어들면서 기존 제품 대비 동등 수준 이상의 내오염성을 가질 수 있다.As described above, in the present application, embossing is performed after forming the cured layer (B') having excellent elongation properties. The embossing treatment as described above increases the density of the cured layer (B') formed by curing. Specifically, a cured layer (B) in which a pattern having a physical/chemical crosslinking degree higher than that of the cured layer (B′) may be provided through high temperature/pressure embossing treatment on the cured layer (B′) already formed. Due to the hardened layer (B), which has a higher degree of density after embossing, the patterned laminate increases mechanical strength and durability, and reduces the possibility of contaminants penetrating into the hardened tissue. have.
엠보처리를 통해 물리적/화학적 가교 정도가 경화층(B') 보다 높아진 패턴 경화층(B)에 관한 설명은 하기 실험례 2를 통해 확인된다. 예를 들어, 형광강도에 의해 비교될 수 있는 경화 정도가 엠보처리 이후에 보다 낮아지고, 경화층(B')의 신율 역시 5 % 이상 또는 10 % 이상이 감소할 수 있다.The description of the patterned cured layer (B) in which the degree of physical/chemical crosslinking was higher than that of the cured layer (B′) through the embossing treatment was confirmed through Experimental Example 2 below. For example, the degree of curing that can be compared by the fluorescence intensity is lowered after the embossing treatment, and the elongation of the cured layer B'may also decrease by 5% or more or 10% or more.
상기 설명된 특성을 만족할 수 있다면, 기재층(A')과 경화층(B')의 형성 재료는 특별히 제한되지 않는다.The material for forming the base layer (A') and the cured layer (B') is not particularly limited as long as the above-described properties can be satisfied.
하나의 예시에서, 상기 기재층(A')은 PVC(polyvinylchloride) 필름, PLA(polylactic acid) 필름, 스티렌(styrene) 필름, SBS(stryen/butadiene/styrene) 필름, 또는 SEBS(Styrene Ethylene/Butylene Styrene) 필름을 포함할 수 있다.In one example, the base layer (A') is a polyvinylchloride (PVC) film, a polylactic acid (PLA) film, a styrene film, a stryen/butadiene/styrene (SBS) film, or a Styrene Ethylene/Butylene Styrene (SEBS) film. ) It may include a film.
상기 경화층(B, B')은 소정의 성분을 포함하는 경화 처리제의 경화물이거나 이를 포함할 수 있다. The cured layers (B, B') may be or may include a cured product of a curing agent containing a predetermined component.
하나의 예시에서, 상기 경화 처리제는 폴리 우레탄 (메타) 아크릴레이트 및 반응성 단량체를 포함한다. 편의상 폴리 우레탄 (메타) 아크릴레이트를 폴리 우레탄 아크릴레이트로 호칭하고, 경화 처리제의 성분을 폴리 우레탄 아크릴레이트 성분(A)과 반응성 단량체 성분(B)으로 각각 표시한다.In one example, the curing agent includes polyurethane (meth) acrylate and a reactive monomer. For convenience, polyurethane (meta) acrylate is referred to as polyurethane acrylate, and components of the curing agent are indicated by polyurethane acrylate component (A) and reactive monomer component (B), respectively.
폴리 우레탄 아크릴레이트 성분(A)은 경화층(B 및/또는 B')이 상기 설명된 유연성(예: 신율)을 갖는데 기여하는 성분으로서, 중량평균분자량(Mw: Weight average molecular weight)이 10,000 이상일 수 있다. 구체적으로, 상기 폴리 우레탄 아크릴레이트의 중량평균분자량의 하한은 예를 들어, 11,000 이상, 12,000 이상, 13,000 이상, 14,000 이상, 15,000 이상, 16,000 이상, 17,000 이상, 18,000 이상, 19,000 이상 또는 20,000 이상일 수 있다. 또한, 상기 폴리 우레탄 아크릴레이트의 중량평균분자량 상한은 예를 들어, 30,000 이하, 29,000 이하, 28,000 이하, 27,000 이하, 26,000 이하, 25,000 이하, 24,000 이하, 23,000 이하, 22,000 이하, 21,000 이하 또는 20,000 이하일 수 있다. 상기 중량평균분자량은 GPC에 의해 측정되고, 표준 스티렌에 의해 환산된 수치일 수 있다.Polyurethane acrylate component (A) is a component that contributes to the cured layer (B and/or B') having the aforementioned flexibility (e.g., elongation), and has a weight average molecular weight (Mw) of 10,000 or more. I can. Specifically, the lower limit of the weight average molecular weight of the polyurethane acrylate may be, for example, 11,000 or more, 12,000 or more, 13,000 or more, 14,000 or more, 15,000 or more, 16,000 or more, 17,000 or more, 18,000 or more, 19,000 or more, or 20,000 or more. . In addition, the upper limit of the weight average molecular weight of the polyurethane acrylate may be, for example, 30,000 or less, 29,000 or less, 28,000 or less, 27,000 or less, 26,000 or less, 25,000 or less, 24,000 or less, 23,000 or less, 22,000 or less, 21,000 or less, or 20,000 or less. have. The weight average molecular weight is measured by GPC and may be a value converted by standard styrene.
상기 중량평균분자량을 만족하는 이상, 폴리 우레탄 아크릴레이트 성분의 구체적인 종류나 구조는 특별히 제한되지 않는다.As long as the weight average molecular weight is satisfied, the specific type or structure of the polyurethane acrylate component is not particularly limited.
하나의 예시에서, 상기 경화 처리제는 중량평균분자량이 서로 상이한 2 이상의 폴리 우레탄 아크릴레이트를 포함할 수 있다. 예를 들어, 상기 폴리 우레탄 아크릴레이트 성분(A)은 중량평균분자량(Mw)이 10,000 이상 15,000 미만인 제 1 폴리 우레탄 아크릴레이트(A1) 및 중량평균분자량(Mw)이 15,000 이상 30,000 이하인 제 2 폴리 우레탄 아크릴레이트(A2)를 포함할 수 있다. 구체적으로, 제 1 폴리 우레탄 아크릴레이트(A1)의 중량평균분자량(Mw)은 14,000 이하, 13,500 이하, 13,000 이하, 12,500 이하, 12,000 이하, 11,500 이하 또는 11,000 이하 일 수 있다. 또한, 제 2 폴리 우레탄 아크릴레이트(A2)의 중량평균분자량(Mw)은 16,000 이상, 17,000 이상, 18,000 이상, 19,000 이상 또는 20,000 이상일 수 있고, 25,000 이하, 24,000 이하, 23,000 이하, 22,000 이하, 21,000 이하, 20,000 이하, 19,000 이하, 18,000 이하 또는 17,000 이하일 수 있다. 제 1 폴리 우레탄 아크릴레이트(A1)와 제 2 폴리 우레탄 아크릴레이트(A2)를 함께 사용하는 경우, 본 출원에 적합한 유연함과 단단함을 동시에 갖는 경화층을 제공하는데 유리하다.In one example, the curing agent may include two or more polyurethane acrylates having different weight average molecular weights. For example, the polyurethane acrylate component (A) is a first polyurethane acrylate (A1) having a weight average molecular weight (Mw) of 10,000 or more and less than 15,000 and a second polyurethane having a weight average molecular weight (Mw) of 15,000 or more and 30,000 or less. It may contain acrylate (A2). Specifically, the weight average molecular weight (Mw) of the first polyurethane acrylate (A1) may be 14,000 or less, 13,500 or less, 13,000 or less, 12,500 or less, 12,000 or less, 11,500 or less, or 11,000 or less. In addition, the weight average molecular weight (Mw) of the second polyurethane acrylate (A2) may be 16,000 or more, 17,000 or more, 18,000 or more, 19,000 or more, or 20,000 or more, and 25,000 or less, 24,000 or less, 23,000 or less, 22,000 or less, 21,000 or less , 20,000 or less, 19,000 or less, 18,000 or less, or 17,000 or less. When the first polyurethane acrylate (A1) and the second polyurethane acrylate (A2) are used together, it is advantageous to provide a cured layer having both flexibility and rigidity suitable for the present application.
폴리 우레탄 아크릴레이트 성분(A) 중에서 제 1 폴리 우레탄 아크릴레이트(A1)와 제 2 폴리 우레탄 아크릴레이트(A2) 간 함량(중량비)은 상기 설명된 경화층의 특성을 만족할 수 있도록 적절히 조절될 수 있다. In the polyurethane acrylate component (A), the content (weight ratio) between the first polyurethane acrylate (A1) and the second polyurethane acrylate (A2) may be appropriately adjusted to satisfy the characteristics of the cured layer described above. .
하나의 예시에서, 폴리 우레탄 아크릴레이트 성분(A) 중에서 제 1 폴리 우레탄 아크릴레이트(A1)의 함량은 제 2 폴리 우레탄 아크릴레이트(A2)의 함량 대비 동등 또는 그 이상일 수 있다. 예를 들어, 폴리 우레탄 아크릴레이트 성분(A) 전체 함량(100 중량부)을 기준으로 제 1 폴리 우레탄 아크릴레이트(A1) 50 내지 90 주량부 및 제 2 폴리 우레탄 아크릴레이트(A2) 10 내지 50 중량부가 사용될 수 있다. 구체적으로, 상기 범위 내에서 제 1 폴리 우레탄 아크릴레이트(A1)의 함량은 예를 들어 55 중량부 이상, 60 중량부 이상, 65 중량부 이상, 70 중량부 이상, 65 중량부 이상, 70 중량부 이상, 또는 75 중량부 이상일 수 있고, 그리고 85 중량부 이하, 80 중량부 이하, 75 중량부 이하, 70 중량부 이하 또는 65 중량부 이하일 수 있다. 제 2 폴리 우레탄 아크릴레이트(A2)의 함량은 사용되는 제 1 폴리 우레탄 아크릴레이트(A1)의 함량에 따라 적절히 조절될 수 있다.In one example, the content of the first polyurethane acrylate (A1) in the polyurethane acrylate component (A) may be equal to or greater than the content of the second polyurethane acrylate (A2). For example, based on the total content of the polyurethane acrylate component (A) (100 parts by weight), 50 to 90 parts by weight of the first polyurethane acrylate (A1) and 10 to 50 parts by weight of the second polyurethane acrylate (A2) Additional can be used. Specifically, the content of the first polyurethane acrylate (A1) within the above range is, for example, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 65 parts by weight or more, 70 parts by weight Or more, or 75 parts by weight or more, and may be 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, or 65 parts by weight or less. The content of the second polyurethane acrylate (A2) may be appropriately adjusted according to the content of the first polyurethane acrylate (A1) to be used.
또 하나의 예시에서, 폴리 우레탄 아크릴레이트 성분(A) 중에서 제 2 폴리 우레탄 아크릴레이트(A2)의 함량은 제 1 폴리 우레탄 아크릴레이트(A1)의 함량 대비 동등 또는 그 이상일 수 있다. 예를 들어, 폴리 우레탄 아크릴레이트 성분(A) 전체 함량(100 중량부)을 기준으로 제 2 폴리 우레탄 아크릴레이트(A2) 50 내지 90 주량부 및 제 1 폴리 우레탄 아크릴레이트(A1) 10 내지 50 중량부가 사용될 수 있다. 구체적으로, 상기 범위 내에서 제 2 폴리 우레탄 아크릴레이트(A2)의 함량은 예를 들어 55 중량부 이상, 60 중량부 이상, 65 중량부 이상, 70 중량부 이상, 65 중량부 이상, 70 중량부 이상, 또는 75 중량부 이상일 수 있고, 그리고 85 중량부 이하, 80 중량부 이하, 75 중량부 이하, 70 중량부 이하 또는 65 중량부 이하일 수 있다. 제 1 폴리 우레탄 아크릴레이트(A2)의 함량은 사용되는 제 2 폴리 우레탄 아크릴레이트(A1)의 함량에 따라 적절히 조절될 수 있다.In another example, the content of the second polyurethane acrylate (A2) in the polyurethane acrylate component (A) may be equal to or greater than the content of the first polyurethane acrylate (A1). For example, based on the total content of the polyurethane acrylate component (A) (100 parts by weight), 50 to 90 parts by weight of the second polyurethane acrylate (A2) and 10 to 50 parts by weight of the first polyurethane acrylate (A1) Additional can be used. Specifically, the content of the second polyurethane acrylate (A2) within the above range is, for example, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 65 parts by weight or more, 70 parts by weight Or more, or 75 parts by weight or more, and may be 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, or 65 parts by weight or less. The content of the first polyurethane acrylate (A2) may be appropriately adjusted according to the content of the second polyurethane acrylate (A1) to be used.
반응성 단량체 성분(B)은 경화성 관능기를 포함하는 단량체 성분을 의미하는 것으로, 그 구체적인 종류는 특별히 제한되지 않는다. 예를 들어, 반응성 단량체 성분은 중합성 관능기로서 탄소간 이중결합을 갖는 단량체일 수 있다.The reactive monomer component (B) refers to a monomer component containing a curable functional group, and its specific type is not particularly limited. For example, the reactive monomer component may be a monomer having a double bond between carbons as a polymerizable functional group.
하나의 예시에서, 상기 반응성 단량체 성분(B)은 경화성 관능기를 1개 갖는 단관능성 단량체일 수 있다. 또 하나의 예시에서, 상기 반응성 단량체 성분(B)은 경화성 관능기를 2 이상 갖는 관능성 단량체일 수 있다.In one example, the reactive monomer component (B) may be a monofunctional monomer having one curable functional group. In another example, the reactive monomer component (B) may be a functional monomer having two or more curable functional groups.
하나의 예시에서, 상기 반응성 단량체 성분(B)은 (메타)아크릴레이트계 단량체일 수 있다.In one example, the reactive monomer component (B) may be a (meth)acrylate-based monomer.
하나의 예시에서, 상기 경화 처리제는 폴리 우레탄 아크릴레이트 성분(A) 100 중량부를 기준으로, 반응성 단량체 성분(B)을 40 내지 80 중량부 범위로 포함할 수 있다. 상기 범위를 만족하는 경우, 본 출원의 기술 과제를 달성하는데 적합한 유연함과 단단함을 확보할 수 있다.In one example, the curing agent may include a reactive monomer component (B) in the range of 40 to 80 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A). If the above range is satisfied, flexibility and rigidity suitable for achieving the technical task of the present application can be secured.
하나의 예시에서, 상기 반응성 단량체 성분(B)은 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1)를 포함할 수 있다. 단독 중합체의 유리전이온도가 0 ℃이하인 반응성 단량체는 경화층(B')에 유연성을 부여하여 고온 가압에 의한 엠보처리 과정에서 기재층(A')이나 경화층(B')의 깨짐을 보다 효과적으로 방지할 수 있다. 이때의 유리전이온도(Tg)는 시차 주사 열량 측정(DSC)법으로 확인될 수 있다. 예를 들어, 시료를 질소 분위기하 승온 속도 10℃/min로 승온하면서, 수득된 DSC 곡선의 베이스 라인과 변곡점에서의 접선이 교차하는 온도를 확인하는 방식으로 확인될 수 있다.In one example, the reactive monomer component (B) may include a reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer. Reactive monomers with a glass transition temperature of 0 ℃ or less of the homopolymer impart flexibility to the cured layer (B') to more effectively prevent cracking of the base layer (A') or the cured layer (B') during the embossing process by high temperature pressurization. Can be prevented. The glass transition temperature (Tg) at this time may be confirmed by a differential scanning calorimetry (DSC) method. For example, while the sample is heated at a heating rate of 10° C./min under a nitrogen atmosphere, it can be confirmed by checking the temperature at which the base line of the obtained DSC curve and the tangent line at the inflection point intersect.
단독 중합체의 유리전이온도(Tg)가 0 ℃이하를 만족한다면, 반응성 단량체 성분의 구체적인 종류는 특별히 제한되지 않는다. 예를 들어, 카프로락톤 아크릴레이트(CA, caprolactone acrylate), 라우릴 아크릴레이트(LA, lauryl acrylate), 이소데실 아크릴레이트(IDA, isodecyl acrylate), 테트라하이드로퓨릴 아크릴레이트(THFA, tetrahydrofuryl acrylate) 또는 알킬렌옥사이드 단위를 갖는 아크릴레이트가 사용될 수 있다. 알킬렌옥사이드는 예를 들어, 에틸렌옥사이드(EO, ethylene oxide) 또는 프로필렌옥사이드(PO, propylene oxide)일 수 있고, 이러한 알킬렌옥사이드 단위를 갖는 아크릴레이트로는 예를 들어, PHEA-2(phenol (EO) 2 acrylate), PHEA-4(phenol (EO) 4 acrylate), NP(EO) 4A(nonyl phenol (EO) 4 acrylate), NP(EO) 8A(nonyl phenol (EO) 8 acrylate), EOEOEA(ethoxy ethoxy ethyl acrylate), 또는 NP(PO) 2A(nonyl phenol (PO) 2 acrylate) 등이 사용될 수 있다.As long as the glass transition temperature (Tg) of the homopolymer satisfies 0° C. or less, the specific type of the reactive monomer component is not particularly limited. For example, caprolactone acrylate (CA), lauryl acrylate (LA), isodecyl acrylate (IDA), tetrahydrofuryl acrylate (THFA), or alkyl An acrylate having a renoxide unit can be used. The alkylene oxide may be, for example, ethylene oxide (EO, ethylene oxide) or propylene oxide (PO, propylene oxide), and as an acrylate having such an alkylene oxide unit, for example, PHEA-2 (phenol ( EO) 2 acrylate), PHEA-4(phenol (EO) 4 acrylate), NP(EO) 4 A(nonyl phenol (EO) 4 acrylate), NP(EO) 8 A(nonyl phenol (EO) 8 acrylate), EOEOEA (ethoxy ethoxy ethyl acrylate), or NP(PO) 2 A (nonyl phenol (PO) 2 acrylate) may be used.
하나의 예시에서, 상기 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1)로는 방향족 고리를 갖는 아크릴레이트가 사용될 수 있다. 예를 들어, 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1)는 적어도 PHEA-2(phenol (EO) 2 acrylate), PHEA-4(phenol (EO) 4 acrylate), NP(EO) 4A(nonyl phenol (EO) 4 acrylate), NP(EO) 8A(nonyl phenol (EO) 8 acrylate), 또는 NP(PO) 2A(nonyl phenol (PO) 2 acrylate)를 포함할 수 있다. 상기 반응성 단량체의 일 성분으로서, 방향족 고리를 갖는 갖는 단량체가 사용되는 경우, 제품에서 발생할 수 있는 불쾌한 냄새를 억제할 수 있는 이점이 있다.In one example, an acrylate having an aromatic ring may be used as the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer. For example, the reactive monomer (B1) having a glass transition temperature (Tg) of 0 °C or less of the homopolymer is at least PHEA-2 (phenol (EO) 2 acrylate), PHEA-4 (phenol (EO) 4 acrylate), NP ( EO) 4 A (nonyl phenol (EO) 4 acrylate), NP(EO) 8 A (nonyl phenol (EO) 8 acrylate), or NP(PO) 2 A (nonyl phenol (PO) 2 acrylate) have. When a monomer having an aromatic ring is used as one component of the reactive monomer, there is an advantage of suppressing an unpleasant odor that may occur in a product.
하나의 예시에서, 상기 반응성 단량체 성분(B) 전체 함량(100 중량부)을 기준으로, 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1)의 함량은 10 중량부 내지 100 중량부 범위일 수 있다. 보다 구체적으로, 상기 범위 내에서 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1)의 함량의 하한은 예를 들어, 15 중량부 이상, 20 중량부 이상, 25 중량부 이상, 30 중량부 이상, 35 중량부 이상, 40 중량부 이상, 45 중량부 이상, 50 중량부 이상, 55 중량부 이상, 60 중량부 이상, 65 중량부 이상, 70 중량부 이상, 75 중량부 이상, 80 중량부 이상, 85 중량부 이상 또는 90 중량부 이상일 수 있고, 그 상한은 예를 들어, 95 중량부 이하, 90 중량부 이하, 85 중량부 이하, 80 중량부 이하, 75 중량부 이하, 70 중량부 이하, 65 중량부 이하 또는 60 중량부 이하 일 수 있다. 상기 함량 범위를 만족하는 경우, 본 출원의 기술 과제를 달성하는데 적절한 단단함과 유연함을 경화층에 부여하는데 유리하다.In one example, based on the total content (100 parts by weight) of the reactive monomer component (B), the content of the reactive monomer (B1) having a glass transition temperature (Tg) of 0 °C or less of the homopolymer is 10 parts by weight to 100 parts by weight. It can be a minor range. More specifically, the lower limit of the content of the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less within the above range is, for example, 15 parts by weight or more, 20 parts by weight or more, 25 parts by weight or more, 30 parts by weight or more, 35 parts by weight or more, 40 parts by weight or more, 45 parts by weight or more, 50 parts by weight or more, 55 parts by weight or more, 60 parts by weight or more, 65 parts by weight or more, 70 parts by weight or more, 75 parts by weight or more, It may be 80 parts by weight or more, 85 parts by weight or more, or 90 parts by weight or more, and its upper limit is, for example, 95 parts by weight or less, 90 parts by weight or less, 85 parts by weight or less, 80 parts by weight or less, 75 parts by weight or less, 70 It may be less than or equal to 65 parts by weight, or less than or equal to 60 parts by weight. When the content range is satisfied, it is advantageous in imparting to the cured layer the hardness and flexibility suitable for achieving the technical problem of the present application.
하나의 예시에서, 상기 반응성 단량체 성분(B)은 히드록시기 또는 아미드기와 같은 관능기를 갖는 반응성 단량체(B2)를 더 포함할 수 있다. 구체적으로, 상기 히드록시기 또는 아미드기와 같은 관능기를 갖는 단량체(B2)는, 히드록시기 또는 아미드기와 같은 관능기를 갖는 (메타)아크릴계 단량체일 수 있다.In one example, the reactive monomer component (B) may further include a reactive monomer (B2) having a functional group such as a hydroxy group or an amide group. Specifically, the monomer (B2) having a functional group such as a hydroxy group or an amide group may be a (meth)acrylic monomer having a functional group such as a hydroxy group or an amide group.
또 하나의 예시에서, 상기 단량체(B2)는 단관능성 (메타) 아크릴계 단량체일 수 있다.In another example, the monomer (B2) may be a monofunctional (meta) acrylic monomer.
특별히 제한되는 것은 아니나, 히드록시기 함유 단관능성 (메타) 아크릴계 단량체로는 2-히드록시 에틸(메타)아크릴레이트, 2- 히드록시 프로필 (메타)아크릴레이트, 히드록시 부틸(메타)아크릴레이트 등과 같은 히드록시 알킬(메타)아크릴레이트가 사용될 수 있다.Although not particularly limited, examples of the monofunctional (meth) acrylic monomer containing a hydroxy group include hydroxy ethyl (meth) acrylate, 2-hydroxy propyl (meth) acrylate, and hydroxy butyl (meth) acrylate. Roxyalkyl(meth)acrylate can be used.
아미드기 함유 단관능성 (메타) 아크릴계 단량체의 구체적인 종류 역시 특별히 제한되지 않으나, 예를 들어, (메타)아크릴아미드, 알킬 (메타)아크릴 아미드, 디알킬 (메타)아크릴아미드, 또는 히드록시 알킬 (메타)아크릴아미드 등이 사용될 수 있다. 구체적으로는, 메타크릴아마이드, 디메틸 아크릴아마이드, 2-히드록시 프로필 메타크릴아미드 또는 N-이소프로필 아크릴아미드 등이 사용될 수 있으나, 이들에 제한되는 것은 아니다.The specific type of the monofunctional (meth) acrylic monomer containing an amide group is also not particularly limited, but, for example, (meth)acrylamide, alkyl (meth)acrylamide, dialkyl (meth)acrylamide, or hydroxyalkyl (meth) ) Acrylamide and the like may be used. Specifically, methacrylamide, dimethyl acrylamide, 2-hydroxy propyl methacrylamide, or N-isopropyl acrylamide may be used, but is not limited thereto.
상기와 같이 반응성 단량체 성분(B)이, 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1) 외에, 히드록시기 또는 아미드기와 같은 관능기를 갖는 반응성 단량체(B2)를 더 포함하는 경우, 상기 히드록시기 또는 아미드기와 같은 관능기를 갖는 단량체(B2) 성분의 함량은 앞서 설명된 단독 중합체의 유리전이온도(Tg)가 0 ℃이하인 반응성 단량체(B1)의 함량에 따라 적절히 조절될 수 있다. 예를 들어, 반응성 단량체 성분(B) 전체 함량(100 중량부)을 기준으로, 히드록시기 또는 아미드기와 같은 관능기를 갖는 단량체(B2) 성분의 함량은 0 내지 90 중량부 범위일 수 있다.As described above, when the reactive monomer component (B) further contains a reactive monomer (B2) having a functional group such as a hydroxy group or an amide group in addition to the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer, The content of the monomer (B2) component having a functional group such as a hydroxy group or an amide group may be appropriately adjusted according to the content of the reactive monomer (B1) having a glass transition temperature (Tg) of 0° C. or less of the homopolymer described above. For example, based on the total content (100 parts by weight) of the reactive monomer component (B), the content of the monomer (B2) component having a functional group such as a hydroxy group or an amide group may range from 0 to 90 parts by weight.
상기 경화 처리제는 개시제 성분(C)을 포함할 수 있다. 개시제는 공지된 물질이나 시판품 중에서 적절히 선택될 수 있으나, 하기 실험례에서 측정되는 형광강도 측정을 통한 경화도 변화 확인을 고려할 경우 벤젠과 같은 방향족 고리 또는 그 유래의 단위를 갖기 때문에 경화 후에 형광을 발할 수 있게 되는 개시제가 사용될 수 있다.The curing treatment agent may include an initiator component (C). The initiator may be appropriately selected from known materials or commercially available products, but when considering the change in the degree of curing through the measurement of fluorescence intensity measured in the following experimental examples, since it has an aromatic ring such as benzene or a unit derived from it, it may emit fluorescence after curing. Initiators that become capable of being used can be used.
하나의 예시에서, 상기 경화 처리제는, 폴리 우레탄 아크릴레이트 성분(A) 100 중량부 기준으로, 상기 개시제 성분(C)을 1 내지 20 중량부 범위로 포함할 수 있다.In one example, the curing agent may include the initiator component (C) in a range of 1 to 20 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A).
상기 경화 처리제는 경화제 성분(D)를 포함할 수 있다. 구체적으로, 유연성 확보를 위한 경화 처리제가 강도까지 확보할 수 있도록 관능기 수가 2 이상인 경화제 성분이 사용될 수 있다.The curing agent may include a curing agent component (D). Specifically, a curing agent component having a number of functional groups of 2 or more may be used so that the curing agent for securing flexibility can secure even strength.
하나의 예시에서, 상기 경화제 성분(D)으로는 관능기의 개수가 2 이상인 다관능성 (메타)아크릴레이트가 사용될 수 있다. 그러한 경화제 성분(D)으로는 사이클로헥산 디메탄올 디(메타)아크릴레이트, 헥산디올 디(메타)아크릴레이트, 트리사이클로데칸 디메탄올 디(메타)아크릴레이트, 트리에틸렌 글리콜 디(메타)아크릴레이트, 테트라에틸렌 글리콜 디(메타)아크릴레이트, 부틸렌 글리콜 디(메타)아크릴레이트, 폴리에틸렌 글리콜 디(메타)아크릴레이트, 폴리프로필렌 글리콜 디(메타)아크릴레이트 등과 같은 2 관능성 (메타)아크릴레이트; 트리메틸올프로판 트리(메타)아크릴레이트, 글리세린 트리(메타)아크릴레이트, 펜타에리스리톨 트리(메타)아크릴레이트, 에톡시레이티드트리메틸올프로판 트리(메타)아크릴레이트, 프로필레이티드트리메틸올프로판 트리(메타)아크릴레이트, 글리세릴프로필레이티드 트리(메타)아크릴레이트, 트리스(2-하이드록시에틸)이소시아누레이트 트리(메타)아크릴레이트 등과 같은 3 관능성 (메타)아크릴레이트; 펜타에리스리톨 테트라(메타)아크릴레이트, 디트리메틸올프로판 테트라(메타)아크릴레이트 등과 같은 4 관능성 (메타)아크릴레이트; 디펜타에리스리톨 펜타(메타)아크릴레이트, 디펜타에리스리톨 히드록시펜타(메타)아크릴레이트 등과 같은 5 관능성 (메타)아크릴레이트; 디펜타에리스리톨 헥사(메타)아크릴레이트 등과 같은 6 관능성 (메타)아크릴레이트가 사용될 수 있다.In one example, as the curing agent component (D), a polyfunctional (meth)acrylate having a number of functional groups of 2 or more may be used. As such a curing agent component (D), cyclohexane dimethanol di(meth)acrylate, hexanediol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, triethylene glycol di(meth)acrylate, Bifunctional (meth)acrylates such as tetraethylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, and the like; Trimethylolpropane tri(meth)acrylate, glycerin tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propylated trimethylolpropane tri(meth) ) Trifunctional (meth)acrylates such as acrylate, glycerylpropylated tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, etc.; Tetrafunctional (meth)acrylates such as pentaerythritol tetra(meth)acrylate and ditrimethylolpropane tetra(meth)acrylate; 5-functional (meth)acrylates such as dipentaerythritol penta (meth)acrylate and dipentaerythritol hydroxypenta (meth)acrylate; 6-functional (meth)acrylates such as dipentaerythritol hexa(meth)acrylate may be used.
하나의 예시에서, 상기 경화제 성분(D)은 적어도 3 관능성인 (메타)아크릴레이트를 포함할 수 있다. 3 관능 이상의 경화제 성분을 사용하는 경우 강도 확보에 유리하다. 구체적으로, 상기 경화제 성분(D)은 3 내지 6 관능성, 3 내지 5 관능성, 또는 3 내지 4 관능성인 (메타)아크릴레이트를 포함할 수 있다.In one example, the curing agent component (D) may include at least trifunctional (meth)acrylate. It is advantageous for securing strength when using a curing agent component with three or more functionalities. Specifically, the curing agent component (D) may include 3 to 6 functionality, 3 to 5 functionality, or 3 to 4 functionality (meth)acrylate.
하나의 예시에서, 상기 경화 처리제는 폴리 우레탄 아크릴레이트 성분(A) 100 중량부를 기준으로, 경화제 성분(D)을 10 내지 45 중량부 범위로 포함할 수 있다. 상기 범위를 만족하는 경우, 본 출원의 기술 과제를 달성하는데 적절한 유연성을 해치지 않으면서 단단함을 확보하는데 유리하다.In one example, the curing agent may include a curing agent component (D) in the range of 10 to 45 parts by weight based on 100 parts by weight of the polyurethane acrylate component (A). When the above range is satisfied, it is advantageous in securing rigidity without compromising the flexibility appropriate for achieving the technical task of the present application.
하나의 예시에서, 상기 성분을 갖는 경화 처리제는 300 내지 800 cps 범위의 점도를 가질 수 있다. 상기 점도를 갖는 경우, 코팅 공정성이 우수하다. 구체적으로, 폴리 우레탄 아크릴레이트 성분(A)은 경화 처리제를 형성하는 다른 성분 대비 높은 분자량을 갖기 때문에 점도가 높을 수 있는데, 이를 고려하여 (B), (C) 및 (D) 등의 성분을 적정 함량으로 혼합하여 처리제의 점도를 낮추고, 코팅 공정성을 확보할 수 있다.In one example, the curing agent having the component may have a viscosity in the range of 300 to 800 cps. When it has the above viscosity, coating processability is excellent. Specifically, since the polyurethane acrylate component (A) has a higher molecular weight than other components forming the curing agent, the viscosity may be high.In consideration of this, components such as (B), (C) and (D) are appropriate. By mixing in an amount, the viscosity of the treatment agent can be lowered and coating processability can be secured.
본 출원에 관한 다른 일례에서, 본 출원은 장식재에 관한 것이다. 장식재는 상기 설명된 특성 또는 구성의 패턴 적층체를 포함한다. 패턴 적층체에 관한 자세한 설명은 생략한다.In another example related to the present application, the present application relates to a decorative material. The decorative material includes a patterned laminate of the characteristics or configurations described above. Detailed description of the patterned laminate will be omitted.
상기 장식재는 동조무늬를 갖는 필름일 수 있다. 구체적으로, 상기 장식재는 상기 패턴 적층체가 갖는 오목부 및 볼록부에 의해 형성된 주요 패턴과 동일하거나 상당히 유사한 형상의 동조 무늬가 인쇄된 인쇄층을 상기 기재층의 하면측에 더 포함할 수 있다. 이때, 기재층의 하면이란, 패턴 적층체 중에서 사용자 시인측에 가까운 경화층(B')과 접하는 기재층 면의 반대 일면을 의미할 수 있다.The decorative material may be a film having a tuned pattern. Specifically, the decorative material may further include, on the lower surface of the substrate layer, a printed layer with a tuning pattern having the same or substantially similar shape as the main pattern formed by the concave portions and the convex portions of the pattern stack. In this case, the lower surface of the base layer may mean one surface opposite to the surface of the base layer in contact with the cured layer (B') close to the user viewing side in the patterned laminate.
상기 인쇄층은 백색 시트일 수 있고, 구체적으로는 백색 염화비닐 수지시트일 수 있다. 인쇄 방식은 특별히 제한되지 않고, 예를 들어, 그라비아인쇄 또는 전사인쇄가 사용될 수 있다.The printing layer may be a white sheet, specifically a white vinyl chloride resin sheet. The printing method is not particularly limited, and, for example, gravure printing or transfer printing may be used.
상기 인쇄층은 약 1㎛ 내지 약 10㎛의 두께를 가질 수 있으나, 이에 제한되는 것은 아니다.The print layer may have a thickness of about 1 μm to about 10 μm, but is not limited thereto.
하나의 예시에서, 상기 장식재는 투명층을 더 포함할 수 있다. 투명층은 인쇄층의 인쇄 무늬를 보호할 수 있는 층이다. 투명층은 바인더 수지 등의 경화물일 수 있다. 투명층이 사용되는 경우, 장식재는 사용자 시인측으로부터 패턴 적층체, 투명층, 및 인쇄층을 포함할 수 있다.In one example, the decorative material may further include a transparent layer. The transparent layer is a layer capable of protecting the print pattern of the printing layer. The transparent layer may be a cured product such as a binder resin. When a transparent layer is used, the decorative material may include a pattern laminate, a transparent layer, and a printing layer from the user viewing side.
상기 투명층은 약 0.05mm 내지 약 2.0mm의 두께를 가질 수 있으나, 이에 제한되는 것은 아니다.The transparent layer may have a thickness of about 0.05mm to about 2.0mm, but is not limited thereto.
하나의 예시에서, 상기 장식재는 치수 보강층을 추가로 포함할 수 있다. 상기 치수 보강층은 고온 고습 조건에서도 장식재의 치수 변형률을 감소시켜 우수한 치수안정성을 부여하고, 동시에, 함께 적층되는 다른 층들과의 접착력을 높여 필름의 내구성을 높일 수 있다.In one example, the decorative material may further include a dimension reinforcing layer. The dimensional reinforcing layer may provide excellent dimensional stability by reducing the dimensional strain of the decorative material even under high temperature and high humidity conditions, and at the same time, increase the durability of the film by increasing adhesion with other layers to be laminated together.
상기 치수 보강층은 바인더 수지에 필러 등이 함침된 복합재로 형성될 수 있다. 바인더 수지의 종류는 특별히 제한되지 않는다. 필러로는 예를 들어, TiO 2, CaCO 3, 목분, 운모(Mica), 유리섬유(Glass Fiber), 전분, 천연섬유, 왕겨, 송진 또는 활석(Talc) 등이 사용될 수 있는데, 바람직하게는 유리 섬유가 사용될 수 있다. 특별히 제한되는 것은 아니지만, 상기 치수 보강층은 유리섬유와 펄프(Pulp)를 바인더(Binder)와 적정 배합하여 제조한 유리섬유시트를 염화비닐 졸(PVC Sol)로 함침시킨 후 겔링시켜 형성된 층일 수 있다. The dimension reinforcing layer may be formed of a composite material in which a filler or the like is impregnated with a binder resin. The kind of binder resin is not particularly limited. As the filler, for example, TiO 2 , CaCO 3 , wood flour, mica, glass fiber, starch, natural fiber, rice husk, rosin or talc, etc. may be used, preferably glass Fibers can be used. Although not particularly limited, the dimensional reinforcing layer may be a layer formed by impregnating a glass fiber sheet prepared by appropriately mixing glass fiber and pulp with a binder with a vinyl chloride sol, followed by gelling.
치수 보강층이 사용되는 경우, 장식재는 사용자 시인측에 가까운 순서대로 패턴 적층체, 인쇄층 및 치수 보강층을 포함할 수 있다.When the dimension reinforcing layer is used, the decorative material may include a pattern laminate, a printing layer, and a dimension reinforcing layer in an order close to the user's viewing side.
상기 치수 보강층의 두께는 약 0.1 mm 내지 약 2.0 mm 범위일 수 있으나, 이에 한정되는 것은 아니다.The thickness of the dimension reinforcing layer may range from about 0.1 mm to about 2.0 mm, but is not limited thereto.
하나의 예시에서, 상기 장식재는 베이스층을 더 포함할 수 있다. 베이스층은 다른 층 구성을 지지하고 상부나 하부의 충격을 흡수하는 역할을 할 수 있다. In one example, the decorative material may further include a base layer. The base layer may serve to support other layer configurations and absorb shocks from the top or bottom.
상기 베이스층은 바인더 수지를 포함할 수 있다. 베이스층을 형성하는데 사용되는 수지의 종류는 특별히 제한되지 않는다.The base layer may include a binder resin. The type of resin used to form the base layer is not particularly limited.
베이스층이 사용되는 경우, 상기 장식재는 사용자 시인측에 가까운 순서대로 패턴 적층체, 인쇄층, 및 베이스층을 포함할 수 있다.When the base layer is used, the decorative material may include a pattern laminate, a printing layer, and a base layer in an order close to the user's viewing side.
상기 베이스층의 두께는 약 1.0 mm 내지 약 3.0 mm일 수 있으나, 이에 제한되는 것은 아니다.The thickness of the base layer may be about 1.0 mm to about 3.0 mm, but is not limited thereto.
하나의 예시에서, 상기 장식재는 밸런스층을 추가로 포함할 수 있다. 밸런스층은 시공시에 바닥면과 접착이 이루어지는 부분으로서, 장식재를 외부 환경으로부터 보호하는 기능을 한다.In one example, the decorative material may further include a balance layer. The balance layer is a part that is bonded to the floor surface during construction, and functions to protect the decorative material from the external environment.
밸런스층은 바인더 수지를 경화시켜 형성될 수 있다. 밸런스층을 형성하는데 사용되는 수지의 종류는 특별히 제한되지 않는다. 필러로는 예를 들어, TiO 2, CaCO 3, 목분, 운모(Mica), 유리섬유(Glass Fiber), 전분, 천연섬유, 왕겨, 송진 또는 활석(Talc) 등이 사용될 수 있다. The balance layer may be formed by curing a binder resin. The kind of resin used to form the balance layer is not particularly limited. As the filler, for example, TiO 2 , CaCO 3 , wood flour, mica, glass fiber, starch, natural fiber, rice husk, rosin or talc, and the like may be used.
밸런스층이 사용되는 경우, 장식재는 사용자 시인측에 가까운 순서대로 패턴 적층체, 인쇄층, 및 밸런스층을 포함할 수 있다.When the balance layer is used, the decorative material may include a pattern laminate, a printing layer, and a balance layer in an order close to the user's viewing side.
상기 밸런스층은 약 1.0mm 내지 약 3.0mm의 두께를 가질 수 있으나, 이에 제한되는 것은 아니다.The balance layer may have a thickness of about 1.0mm to about 3.0mm, but is not limited thereto.
하나의 예시에서, 상기 구성의 장식재는 바닥재로서 사용될 수 있다.In one example, the decorative material of the above configuration may be used as a flooring material.
본 출원에 관한 또 다른 일례에서, 본 출원은 상기 패턴 적층체 또는 상기 장식재를 제조하는데 사용되는 적층체에 관한 것이다. 상기 적층체는 기재층(A') 및 경화층(B')을 포함한다. 적층체, 기재층(A'), 및 경화층(B')이 갖는 구체적인 특성이나 구성은 상술한 바와 같다.In another example related to the present application, the present application relates to a laminate used to manufacture the pattern laminate or the decorative material. The laminate includes a base layer (A') and a cured layer (B'). Specific properties and configurations of the laminate, the base layer (A'), and the cured layer (B') are as described above.
본 출원에 관한 또 다른 일례에서, 본 출원은 상기 적층체의 경화층(B') 또는 패턴 적층체의 경화층(B)을 형성하는데 사용될 수 있는 경화 처리제에 관한 것이다. 경화 처리제가 포함하는 성분에 관한 설명은 상술한 바와 동일하므로 생략한다.In another example of the present application, the present application relates to a curing agent that can be used to form the cured layer (B') of the laminate or the cured layer (B) of the patterned laminate. Description of the components contained in the curing agent is the same as described above, and thus will be omitted.
본 출원에 관한 또 다른 일례에서, 본 출원은 패턴 적층체를 제조하는 방법에 관한 것이다. In another example related to the present application, the present application relates to a method of manufacturing a patterned laminate.
하나의 예시에서, 상기 방법은, 기재층(A') 및 경화층(B')을 순차로 포함하는 적층체를 마련하는 단계; 및 상기 경화층(B')의 표면을 150 ℃ 이상의 온도에서 가압하여 동일한 형상의 오목부와 볼록부를 기재층(A')과 경화층(B')에 각각 형성하는 단계를 포함할 수 있다. 기재층(A') 및 경화층(B')의 구성이나 특성은 상술한 바와 같으므로 생략한다.In one example, the method includes: preparing a laminate including a base layer (A') and a cured layer (B') in sequence; And forming concave portions and convex portions having the same shape in the base layer (A') and the cured layer (B') by pressing the surface of the cured layer (B') at a temperature of 150° C. or higher. The configuration and characteristics of the base layer (A') and the cured layer (B') are the same as described above, and thus are omitted.
상기 가압은 150 ℃ 이상의 온도를 갖는 패턴 형성 기구를 사용하여 수행될 수 있다. 롤러는 앞서 설명한 바와 같이, 금속 롤러일 수 있다. 또한, 가압에 의해 오목부와 볼록부를 갖게된 기재층(A')과 경화층(B')은 각각 기재층(A) 및 경화층(B)으로 호칭될 수 있다.The pressing may be performed using a pattern forming apparatus having a temperature of 150° C. or higher. As described above, the roller may be a metal roller. Further, the substrate layer (A') and the cured layer (B') having concave portions and convex portions by pressing may be referred to as a substrate layer (A) and a cured layer (B), respectively.
하나의 예시에서, 상기 패턴 형성 기구의 가압은, 가압 전 후의 형광강도의 차이가 50 이상일 수 있도록 이루어질 수 있다. 형광강도란, 하기 실험례에서 설명되는 것과 같이, 광중합 개시제가 처리제의 다른 성분과 반응하면서 형광을 발하는 물질로 변화하는 것에 착안하여 측정되는 수치로, UV 여기광을 경화물에 조사하고 경화층에서 발하는 형광을 검출하는 방식으로 계측될 수 있다. 그 계측은 UV 경화 센서 OL 시리즈(주식회사 센테크)를 이용하여 이루어질 수 있다. 상기 형광강도의 차이는 150 이하 또는 100 이하 일 수 있다. In one example, pressing of the pattern forming mechanism may be performed such that a difference in fluorescence intensity before and after pressing may be 50 or more. Fluorescence intensity is a value measured by focusing on the change of a photopolymerization initiator into a substance that emits fluorescence while reacting with other components of the treatment agent, as described in the following experimental examples. UV excitation light is irradiated to the cured product and then in the cured layer. Emission can be measured in a way that detects fluorescence. The measurement can be made using the UV curing sensor OL series (Sentech Co., Ltd.). The difference in fluorescence intensity may be 150 or less or 100 or less.
형광강도의 측정은 가압 전 후의 경화 정도를 비교하는 수단으로 사용될 수 있다. 형광강도가 낮을수록 경화도가 증가한 것으로 볼 수 있다. 예를 들어, 패턴 형성 기구에 의한 가압을 통해 300 내지 600 범위인 경화층(B')의 형광강도는 250 내지 550 범위로 계측될 수 있다. 즉, 고온/고압에 의한 엠보처리를 통해 경화층(B)은 보다 높은 경화도를 가질 수 있는 것이다. 엠보처리 후 경화도가 증가하여 치밀한 구조를 갖는 경화층(B)은 보다 높은 내구성, 내오염성 및 강도 특성을 가질 수 있다.The measurement of fluorescence intensity can be used as a means of comparing the degree of curing before and after pressing. It can be seen that the lower the fluorescence intensity, the higher the degree of curing. For example, the fluorescence intensity of the cured layer (B') in the range of 300 to 600 may be measured in the range of 250 to 550 through pressurization by the pattern forming mechanism. That is, the cured layer (B) may have a higher degree of curing through the embossing treatment by high temperature/high pressure. The cured layer (B) having a dense structure by increasing the degree of curing after the embossing treatment may have higher durability, stain resistance and strength characteristics.
하나의 예시에서, 상기 방법은 기재층(A') 상에 경화층(B')을 형성하는 단계를 더 포함할 수 있다. 경화층은 상술한 구성의 경화 처리제를 도포 후 경화하여 형성될 수 있다. 경화의 정도나 경화 조건 역시 상술한 바와 같다.In one example, the method may further include forming a cured layer (B') on the base layer (A'). The cured layer may be formed by applying and curing the curing agent having the above-described configuration. The degree of curing and curing conditions are also the same as described above.
본 출원에 따르면, 표면의 사실감(reality)이 우수할 뿐 아니라, 내구성 및 내오염성이 우수한 적층체 및 이를 포함하는 장식재(예: 바닥재)가 제공된다.According to the present application, there is provided a laminate having excellent surface reality and excellent durability and stain resistance, and a decorative material (eg, flooring) including the same.
도 1은 종래 기술에 따라 제조된 장식재와 본 출원에 따라 제조된 장식재의 요철 단면을 비교하기 위한 개략도이다. 구체적으로, 도 1(a)는 종래 기술에 따라 엠보가 형성된 패턴 적층체 단면의 개략도이고, 도 1(b)는 본 출원에 따라 엠보가 형성된 패턴 적층체 단면의 개략도이다.1 is a schematic diagram for comparing the uneven cross-section of the decorative material manufactured according to the prior art and the decorative material manufactured according to the present application. Specifically, FIG. 1 (a) is a schematic diagram of a cross-section of a pattern stacked body in which embossing is formed according to the prior art, and FIG. 1 (b) is a schematic diagram of a cross-section of a pattern stacked body in which embossing is formed according to the present application.
도 2는 본 출원의 구체예에 따른 실시예 1 경화층(B')의 점탄성 특성을 측정한 것이다.2 is a measurement of viscoelastic properties of the cured layer (B') of Example 1 according to a specific example of the present application.
도 3은 비교예 1과 실시예 1에 따라 제조된 적층체의 표면을 50 배율 및 100 배율의 현미경으로 촬영한 이미지를 비교한 것이다.3 is a comparison of images taken with microscopes of 50 magnification and 100 magnification of the surface of the laminate manufactured according to Comparative Example 1 and Example 1. FIG.
도 4는 비교예 1과 실시예 1에 따라 제조된 적층체 중에서 경화층의 두께를 확인한 것이다. 구체적으로, 비교예 1에 관한 4 a와 실시예 1에 관한 도 4b를 비교해보면, 실시예 1은, 비교예 1이 보이는 볼록부와 오목부에서의 큰 두께 편차를 상당히 개선한 것임을 확인할 수 있다.4 is a check of the thickness of the cured layer in the laminates prepared according to Comparative Example 1 and Example 1. Specifically, comparing 4a of Comparative Example 1 and FIG. 4B of Example 1, it can be seen that Example 1 significantly improved the large thickness deviation in the convex and concave portions that Comparative Example 1 shows. .
도 5는 본 출원의 일례에 따른 장식재의 적층 구성을 개략적으로 도시한 것이다.5 schematically shows a laminated configuration of a decorative material according to an example of the present application.
이하, 실험례를 이용하여 본 출원을 상세히 설명한다. 그러나, 본 출원의 보호범위가 하기 설명되는 실험례에 의해 제한되는 것은 아니다.Hereinafter, the present application will be described in detail using an experimental example. However, the scope of protection of the present application is not limited by the experimental examples described below.
<실험례 1: 단면 형상의 비교><Experimental Example 1: Comparison of cross-sectional shape>
실시예 1Example 1
단계 1(경화층의 형성): 이동방향에서 1 M 길이가 한개의 영역(Zone)으로 구획된 경화 시스템을 이용하였다. 구체적으로, 6 M/min 속도로 이동하는 라인에 위치한 두께 약 500 ㎛ 인 PVC 기재층(A')의 일면 상에 하기 조성의 경화 처리제를 도포하고, 300 mj/㎠ UV 광을 조사하여 두께가 약 13 ㎛ 인 경화층(B')을 형성하였다. 경화 처리제의 성분은 표 1과 같다. Step 1 (Formation of a cured layer) : A curing system in which a length of 1 M in the moving direction is divided into one zone was used. Specifically, a curing agent of the following composition was applied on one side of the PVC substrate layer (A') having a thickness of about 500 µm located in a line moving at a speed of 6 M/min, and irradiated with UV light of 300 mj/cm 2 to increase the thickness. A cured layer (B') of about 13 μm was formed. The components of the curing agent are shown in Table 1.
단계 2( 엠보처리 ): 이후, 소정의 패턴을 갖는 히팅 드럼(heating drum)(SUS 드럼)를 이용하여, 기재층(A')와 접하는 경화층(B') 면의 반대 일면을 가압하여, 패턴 적층체를 형성하였다. 엠보처리와 관련된 고온 가압 조건은 표 2에 기재된 수준에서 유지되었다. Step 2 ( embossing ) : Thereafter, using a heating drum (SUS drum) having a predetermined pattern, one side opposite to the side of the cured layer (B') in contact with the base layer (A') is pressed, A patterned laminate was formed. The high temperature pressurization conditions related to the embossing treatment were maintained at the levels shown in Table 2.
비교예 1Comparative Example 1
실시예 1과 동일한 경화 시스템 및 동일한 패턴 형성 공정을 이용하고, 동일한 경화 처리제 및 동일한 기재층(A')을 사용하였다. 다만, 비교예 1은 기재층(A')에 대한 엠보처리를 먼저 수행하고, 패턴이 형성된 기재층(A) 상에 경화층을 형성하였다.The same curing system and the same pattern formation process as in Example 1 were used, and the same curing treatment agent and the same base layer (A') were used. However, in Comparative Example 1, the embossing treatment was first performed on the base layer (A'), and a cured layer was formed on the base layer (A) on which the pattern was formed.
[표 1][Table 1]
Figure PCTKR2020013580-appb-img-000001
Figure PCTKR2020013580-appb-img-000001
[표 2][Table 2]
Figure PCTKR2020013580-appb-img-000002
Figure PCTKR2020013580-appb-img-000002
실시예 1 및 비교예 1에서, 패턴 적층체의 시인되는 표면 형상은 도 3과 같다. 해당 도면을 통해 확인되듯이, 실시예 1 적층체의 표면에 보다 선명한 요철이 형성되었음을 알 수 있고, 실시예 1 경화층에서 현저히 작은 두께의 편차가 관찰됨을 알 수 있다.In Example 1 and Comparative Example 1, the visually recognized surface shape of the patterned laminate is as shown in FIG. 3. As can be seen from the drawings, it can be seen that more vivid irregularities were formed on the surface of the laminate of Example 1, and a significantly smaller thickness deviation was observed in the cured layer of Example 1.
참고로, 도 2에 표시된 참조예는 실시예와 비교예에 사용된 기재층(A')에 UV 코팅을 형성하지 않은 상태에서, 단계 2의 엠보처리를 수행한 것을 나타낸 이미지이다. 즉, 기재에 직접 엠보처리를 통해 패턴을 형성한 참조예와 외관 차이가 작은 실시예 1은 원하는 패턴(디자인)을 사실감있게 구현할 수 있다는 것을 의미한다.For reference, the reference example shown in FIG. 2 is an image showing that the embossing process of step 2 is performed without forming a UV coating on the base layer (A') used in the examples and comparative examples. That is, the reference example in which the pattern is formed through direct embossing on the substrate and the example 1 having a small difference in appearance means that a desired pattern (design) can be realized with a sense of realism.
<실험례 2: 강도 증가의 확인><Experimental Example 2: Confirmation of Strength Increase>
경화층(B') 형성(처리제 도포 후 UV 처리) 후의 엠보처리가, 오목부와 볼록부를 갖는 경화층(B)의 강도를 보다 높이고, 그 결과 패턴 적층체의 표면 특성, 예를 들어 기계적 강도를 보다 높일 수 있음을 확인하기 위한 실험을 수행하였다.The embossing treatment after the formation of the cured layer (B') (UV treatment after application of the treatment agent) increases the strength of the cured layer (B) having concave portions and convex portions, and as a result, the surface properties of the patterned laminate, for example, mechanical strength. An experiment was conducted to confirm that it can be higher.
구체적으로, 실시예 1의 적층체를 제조하는 과정에서, 단계 2 수행 전(엠보처리 전, 즉 단계 1을 거쳐 경화층이 형성된 시점)에 경화층(B')의 형광 경도와 고온신율을 측정하였다. 또한, 단계 2 수행 후(엠보처리 후) 경화층(B)의 형광 경도 및 고온신율을 측정하였다. 그 결과는 표 3과 같다. 이때, 해당 실험이 수행된 적층체 또는 패턴 적층체의 두께는 각각 약 500 ㎛ 및 약 300 ㎛ 로 하였다.Specifically, in the process of manufacturing the laminate of Example 1, the fluorescence hardness and high-temperature elongation of the cured layer (B') were measured before step 2 (before embossing, that is, when the cured layer was formed through step 1). I did. In addition, after performing step 2 (after embossing), the fluorescence hardness and high-temperature elongation of the cured layer (B) were measured. The results are shown in Table 3. At this time, the thickness of the laminate or pattern laminate in which the corresponding experiment was performed was about 500 µm and about 300 µm, respectively.
* 형광강도(경화도 변화 비교): 처리제가 경화되는 경우, 광중합 개시제가 처리제의 다른 성분과 반응하면서 형광을 발하는 물질로 변화하는 것에 착안하여, UV 여기광을 조사하여 경화층에서 발하는 형광을 검출하는 방식으로 경화도 변화를 확인하였다. 구체적으로는, “UV 경화 센서 OL 시리즈(주식회사 센테크)”란 이름으로 판매되고 있는 장치를 사용하였다. 해당 기기의 구동원리에 관해서는 일본특허공개 제2007-248244호에서 확인가능하고, 장치에 관한 자세한 사항은 웹페이지 http://www.sentech.jp/seihin/seihin02.html 또는 http://www.sentech.jp/images/uvkoukasennsa-katarogu2.pdf 에서 확인 가능하다. 참고로, 형광강도가 낮을수록 경화가 많이 이루어졌음을 의미한다.* Fluorescence intensity (Comparison of change in curing degree): When the treatment agent is cured, the photopolymerization initiator reacts with other components of the treatment agent and changes into a substance that emits fluorescence, and UV excitation light is irradiated to detect fluorescence emitted from the cured layer. In this way, the change in the degree of curing was confirmed. Specifically, a device sold under the name "UV curing sensor OL series (Sentech Co., Ltd.)" was used. The operating principle of the device can be found in Japanese Patent Publication No. 2007-248244, and detailed information on the device can be found on the web page http://www.sentech.jp/seihin/seihin02.html or http://www. Available at .sentech.jp/images/uvkoukasennsa-katarogu2.pdf . For reference, the lower the fluorescence intensity, the more curing was performed.
* 90 ℃ 신율: 도그본 형태로 재단된 패턴 적층체를 90 ℃ 챔버에서 보관하고, 100 mm/min의 속도로 인장하면서 측정하였다. 이때, 도그본 형태의 총 길이는 10 ㎝ 이고, 손잡이부분을 제외한 신율 측정 길이와 너비는 각각 약 6 ㎝와 1 ㎝ 으로 하였다.* 90 °C elongation: The pattern laminate cut in the form of a dogbone was stored in a chamber at 90 °C, and measured while stretching at a rate of 100 mm/min. At this time, the total length of the dogbone shape was 10 cm, and the length and width of the elongation measurement excluding the handle were about 6 cm and 1 cm, respectively.
[표 3][Table 3]
Figure PCTKR2020013580-appb-img-000003
Figure PCTKR2020013580-appb-img-000003
상기 표 3에서 확인되듯이, 단계 2를 수행한 후에 측정된 형광강도는 단계 2 수행 전의 그것 보다 낮아지고, 단계 2를 수행한 후에 측정된 신율 역시 단계 2 수행 전의 그것 보다 낮아짐을 알 수 있다.As shown in Table 3, it can be seen that the fluorescence intensity measured after step 2 is lower than that before step 2 is performed, and the elongation measured after step 2 is also lower than that before step 2 is performed.
이는, 경화층(B')에 대한 고온/가압 엠보처리를 통해 경화층(B')의 표면이 추가로 화학적 가교 및/또는 물리적 가교를 거치게 되면서, 경화층(B)이 엠보처리 전의 경화층(B') 보다 치밀한 표면 특성을 갖게 될 수 있음을 의미한다. 이는, 패턴 적층체의 표면 특성, 예를 들어 내구성 및 내오염성을 보다 강화시키는데 기여한다.This is because the surface of the cured layer (B') undergoes additional chemical crosslinking and/or physical crosslinking through high-temperature/pressurization embossing on the cured layer (B'), so that the cured layer (B) is a cured layer before embossing. (B') It means that it can have a finer surface property. This contributes to further enhancing the surface properties of the patterned laminate, such as durability and stain resistance.
<실험례 3: 패턴 적층체의 물성 비교><Experimental Example 3: Comparison of physical properties of patterned laminates>
경화 처리제의 성분을 아래 표 4와 같이 달리한 것을 제외하고, 앞서 실시예 1과 동일한 과정(단계 1 및 단계 2)을 거쳐 실시예 2의 패턴 적층체를 제조하였다. 비교예 2와 3의 경우에도 처리제의 성분을 표 4에서와 같이 실시예와 달리 하였다. 물성 측정 방법은 아래와 같고, 그 결과는 표 5에 기재하였다.A pattern laminate of Example 2 was manufactured through the same process as in Example 1 (steps 1 and 2), except that the components of the curing treatment agent were different as shown in Table 4 below. In the case of Comparative Examples 2 and 3, the components of the treatment agent were different from those of the Examples as shown in Table 4. The method of measuring physical properties is as follows, and the results are shown in Table 5.
* 고온신율: 실험례 2에서와 동일한 방법으로, 경화층(B')에 대하여 측정하였다.* High-temperature elongation: In the same manner as in Experimental Example 2, the cured layer (B') was measured.
* 갈끔이 기능: 경화층(B) 표면에 유성 매직으로 오염을 형성하고, 30 초 후 휴지로 제거한 후 아래 기준에 따라 육안으로 판정하였다. 3 점 이상이면 우수한 것으로 볼 수 있다.* Clear function: Contamination was formed on the surface of the hardened layer (B) with oily magic, removed with a tissue paper after 30 seconds, and then visually determined according to the following criteria. If it is 3 or more, it can be considered excellent.
1점: 제거암됨1 point: removed
2점: 흔적이남고 번짐2 points: traces and smears
3점: 번짐은 없으나 흔적이 남음3 points: No smearing, but traces remain
4점: 흔적이 약간 남음4 points: a few traces remain
5점: 완벽하게 제거됨5 points: completely removed
[표 4][Table 4]
Figure PCTKR2020013580-appb-img-000004
Figure PCTKR2020013580-appb-img-000004
[표 5][Table 5]
Figure PCTKR2020013580-appb-img-000005
Figure PCTKR2020013580-appb-img-000005
상기 표 5에서와 같이, 고온신율을 만족하지 못하는 비교예 2 및 3은 고온 가압에 의한 엠보처리에 부적합하다는 것을 알 수 있다.As shown in Table 5, it can be seen that Comparative Examples 2 and 3, which do not satisfy the high-temperature elongation, are unsuitable for embossing by high-temperature pressurization.
[부호의 설명][Explanation of code]
A: 오목부와 볼록부를 갖는 기재층A: a base layer having a concave portion and a convex portion
B: 오목부와 볼록부를 갖는 경화층B: Hardened layer having concave portions and convex portions
100, 100', 1000, 1000' : 바닥재100, 100', 1000, 1000': flooring
110, 1100: 패턴 적층체110, 1100: pattern laminate
120, 1200: 투명층120, 1200: transparent layer
130, 1300: 인쇄층130, 1300: printed layer
140, 1400: 베이스층140, 1400: base layer
150, 1500: 밸런스층150, 1500: balance layer
160, 1600: 치수안정층160, 1600: dimensionally stable layer

Claims (15)

  1. 오목부와 볼록부가 형성된 기재층(A); 및 A base layer (A) in which concave portions and convex portions are formed; And
    상기 기재층 상에 위치하고, 상기 기재층과 동일한 형상의 오목부와 볼록부를 가지며, 상기 오목부와 볼록부의 두께 편차가 2 ㎛ 이내인 경화층(B)을 포함하는 패턴 적층체.A pattern laminate comprising a cured layer (B) positioned on the substrate layer, having a concave portion and a convex portion having the same shape as that of the substrate layer, and having a thickness deviation of the concave portion and the convex portion within 2 μm.
  2. 제 1 항에 있어서, 기재층(A'); 및 상기 기재층(A') 상에 위치하는 경화층(B')을 포함하는 적층체에 대하여 150 ℃ 이상의 온도를 갖는 패턴 형성 기구를 가압하여 얻어지는, 패턴 적층체.The method of claim 1, further comprising: a base layer (A'); And a pattern forming mechanism having a temperature of 150° C. or higher to a laminate comprising a cured layer (B') positioned on the base layer (A').
  3. 제 2 항에 있어서, 상기 경화층(B')은 동적점탄성 측정에 의해 확인되는 tanδ의 피크값이 0.5 이상인, 패턴 적층체.The patterned laminate according to claim 2, wherein the cured layer (B') has a peak value of tan δ determined by dynamic viscoelasticity measurement of 0.5 or more.
  4. 제 3 항에 있어서, 상기 경화층(B')은 상기 피크값에 대한 온도로 정의되는 유리전이온도(Tg)가 5 ℃ 이하인, 패턴 적층체.The patterned laminate according to claim 3, wherein the cured layer (B') has a glass transition temperature (Tg) of 5° C. or less, defined as a temperature with respect to the peak value.
  5. 제 2 항에 있어서, 상기 경화층(B')은 90 ℃ 이상인 온도에서 측정된 저장탄성률(G') 값이 3 x 10 6 Pa 이하인, 패턴 적층체.The patterned laminate according to claim 2, wherein the cured layer (B') has a storage modulus (G') value of 3 x 10 6 Pa or less measured at a temperature of 90° C. or higher.
  6. 제 2 항에 있어서, 상기 경화층(B')은 90 ℃ 이상인 온도에서의 신율이 20 % 이상인, 패턴 적층체.The patterned laminate according to claim 2, wherein the cured layer (B') has an elongation of 20% or more at a temperature of 90°C or more.
  7. 제 2 항에 있어서, 상기 기재층(A')이 갖는 90 ℃ 이상인 온도에서의 신율은, 상기 경화층(B')이 갖는 90 ℃ 이상인 온도에서의 신율 이상인, 패턴 적층체.The patterned laminate according to claim 2, wherein the base layer (A') has an elongation at a temperature of 90°C or higher at a temperature of 90°C or higher that the cured layer (B') has.
  8. 제 2 항에 있어서, 상기 기재층(A')은 PVC(polyvinylchloride) 필름, PLA(polylactic acid) 필름, 스티렌(styrene) 필름, SBS(stryen/butadiene/styrene) 필름, 및 SEBS(Styrene Ethylene/Butylene Styrene) 필름 중에서 하나 이상을 포함하는, 패턴 적층체.The method of claim 2, wherein the base layer (A') is a polyvinylchloride (PVC) film, a polylactic acid (PLA) film, a styrene film, a stryen/butadiene/styrene (SBS) film, and a Styrene Ethylene/Butylene (SEBS) film. Styrene) comprising at least one of the film, a patterned laminate.
  9. 제 2 항에 있어서, 상기 기재층(A')은 200 내지 1,000 ㎛ 범위 내의 두께를 갖는, 패턴 적층체.The patterned laminate according to claim 2, wherein the base layer (A') has a thickness in the range of 200 to 1,000 μm.
  10. 제 2 항에 있어서, 상기 경화층(B')은 5 내지 50 ㎛ 범위 내의 두께를 갖는, 패턴 적층체.The patterned laminate according to claim 2, wherein the cured layer (B') has a thickness in the range of 5 to 50 μm.
  11. 제 1 항에 있어서, 상기 경화층(B)은 중량평균분자량(Mw)이 10,000 이상인 폴리 우레탄 아크릴레이트를 포함하는 경화 처리제의 경화물을 포함하는, 패턴 적층체.The patterned laminate according to claim 1, wherein the cured layer (B) comprises a cured product of a curing agent containing polyurethane acrylate having a weight average molecular weight (Mw) of 10,000 or more.
  12. 제 11 항에 있어서, 상기 경화 처리제는 단독 중합체의 유리전이온도(Tg)가 0 ℃ 이하인 반응성 단량체를 포함하는, 패턴 적층체.The patterned laminate according to claim 11, wherein the curing treatment agent contains a reactive monomer having a glass transition temperature (Tg) of 0° C. or less of the homopolymer.
  13. 제 11 항에 있어서, 상기 경화 처리제는 히드록시기 또는 아미드기 함유 반응성 단량체를 더 포함하는, 패턴 적층체.The patterned laminate according to claim 11, wherein the curing treatment agent further contains a reactive monomer containing a hydroxy group or an amide group.
  14. 제 1 항에 따른 패턴 적층체를 포함하는 장식재.A decorative material comprising the patterned laminate according to claim 1.
  15. 제 14 항에 있어서, 상기 패턴 적층체가 갖는 오목부 및 볼록부와 동일한 형상의 동조 무늬가 인쇄된 인쇄층을 상기 기재층의 하면측에 더 포함하는 장식재.15. The decorative material according to claim 14, further comprising a printed layer on the lower surface side of the substrate layer, on which a tuning pattern having the same shape as those of the concave portions and the convex portions of the pattern laminate is printed.
PCT/KR2020/013580 2019-10-08 2020-10-06 Laminate, pattern laminate, decorative material, and method for producing same WO2021071206A1 (en)

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Citations (7)

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KR20000074125A (en) * 1999-05-18 2000-12-05 김충세 A pvc floor with natural oil quality
KR20040088049A (en) * 2002-02-01 2004-10-15 나토코 가부시키가이샤 Composition Curable with Actinic Energy Ray and Use Thereof
KR200377319Y1 (en) * 2004-12-08 2005-03-10 주식회사 엘지화학 Plastic film with various colors and embossed patterns for lamination
KR20140074642A (en) * 2012-12-10 2014-06-18 (주)엘지하우시스 Films expressing metallic appearance using ultraviolet curable resin and method of manufacturing thereof
KR20150102553A (en) * 2014-02-28 2015-09-07 (주)엘지하우시스 Interior film having excellent metallic appearance and method of manufacturing the same
KR20180077462A (en) * 2016-12-29 2018-07-09 이준호 Flooring mat having improved non-slip property, durability and constructability and the manufacturing mrthod therof
KR20190052714A (en) * 2016-09-28 2019-05-16 다이니폰 인사츠 가부시키가이샤 Decorative sheet and veneer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000074125A (en) * 1999-05-18 2000-12-05 김충세 A pvc floor with natural oil quality
KR20040088049A (en) * 2002-02-01 2004-10-15 나토코 가부시키가이샤 Composition Curable with Actinic Energy Ray and Use Thereof
KR200377319Y1 (en) * 2004-12-08 2005-03-10 주식회사 엘지화학 Plastic film with various colors and embossed patterns for lamination
KR20140074642A (en) * 2012-12-10 2014-06-18 (주)엘지하우시스 Films expressing metallic appearance using ultraviolet curable resin and method of manufacturing thereof
KR20150102553A (en) * 2014-02-28 2015-09-07 (주)엘지하우시스 Interior film having excellent metallic appearance and method of manufacturing the same
KR20190052714A (en) * 2016-09-28 2019-05-16 다이니폰 인사츠 가부시키가이샤 Decorative sheet and veneer
KR20180077462A (en) * 2016-12-29 2018-07-09 이준호 Flooring mat having improved non-slip property, durability and constructability and the manufacturing mrthod therof

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