WO2021068437A1 - 5g天线一体化网络装置 - Google Patents

5g天线一体化网络装置 Download PDF

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Publication number
WO2021068437A1
WO2021068437A1 PCT/CN2020/071937 CN2020071937W WO2021068437A1 WO 2021068437 A1 WO2021068437 A1 WO 2021068437A1 CN 2020071937 W CN2020071937 W CN 2020071937W WO 2021068437 A1 WO2021068437 A1 WO 2021068437A1
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Prior art keywords
antenna integrated
line
multilayer board
network device
layer
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PCT/CN2020/071937
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English (en)
French (fr)
Inventor
董宝玲
袁帅
刘奕
廖东
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摩比天线技术（深圳）有限公司
摩比科技（深圳）有限公司
摩比通讯技术（吉安）有限公司
摩比科技(西安)有限公司
深圳市晟煜智慧科技网络有限公司
西安摩比天线技术工程有限公司
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Application filed by 摩比天线技术（深圳）有限公司, 摩比科技（深圳）有限公司, 摩比通讯技术（吉安）有限公司, 摩比科技(西安)有限公司, 深圳市晟煜智慧科技网络有限公司, 西安摩比天线技术工程有限公司 filed Critical 摩比天线技术（深圳）有限公司
Publication of WO2021068437A1 publication Critical patent/WO2021068437A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Definitions

  • the present invention relates to the field of communication technology, in particular to a 5G antenna integrated network device.
  • 5G farth generation mobile communication technology
  • MIMO Multiple-Input Multiple-Output, multiple-input multiple-output, multiple-input multiple-output technology
  • demand for large-scale antenna arrays is changing day by day, and the market for highly integrated and consistent 5G antennas is broad.
  • the purpose of the present invention is to provide a 5G antenna integrated network device, which can make the antenna port environment tend to be consistent, with high accuracy, better stability and consistency.
  • the present invention provides a 5G antenna integrated network device, including at least two PCB (circuit board) boards, the PCB boards are copper-plated on both sides, and the PCB boards are sequentially stacked and connected to form a multilayer
  • the inner layer of the multilayer board is provided with a calibration network circuit
  • the outer layer of the multilayer board is provided with a phase-shifting network circuit
  • the multilayer board is provided with a plurality of penetrating network circuits.
  • the metallized hole of the multi-layer board, the metallized hole connects the layers between the multi-layer boards.
  • the calibration network line and the phase-shifting network line are vertically misaligned between the multilayer boards.
  • upper and lower metal grounds are respectively provided on the upper and lower outer surface of the multilayer board, and the calibration network line and the upper and lower metal grounds form a belt. ⁇ Shape line structure.
  • a mid-metal ground is provided on the inner surface of the multilayer board, and the phase-shifting network line and the mid-metal ground form a microstrip line structure.
  • the PCB boards are bonded and connected by a prepreg.
  • a solder mask is provided on the outer side of the multilayer board, and an oil-coated protective layer is provided on the solder mask.
  • a plurality of the metallized holes on each layer of the multilayer board are arranged in close proximity to each other at the same or nearly the same distance along the alignment of the calibration network line.
  • the multilayer board is provided with at least one calibration port, at least one radio frequency port, balance resistance and ground resistance.
  • the phase-shifting network composed of the phase-shifting network line and the medium metal ground is provided with a DC grounding lightning protection sub-line.
  • the invention integrates the calibration network and the phase shifting network on the same multi-layer board, reduces the adapters, and avoids the electrical problems and structural risk points caused by the switching.
  • the effective use of the multilayer board realizes the conversion from stripline to microstrip line, and optimizes the impedance of the ground and the line at the conduction to solve the discontinuity problem, and the standing wave is good.
  • the 5G large-scale antenna array has many ports, and the present invention can make the antenna port environment tend to be consistent, with high precision, better stability and consistency.
  • FIG. 1 is the first layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention
  • 2 is a second layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention
  • 3 is a third layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention.
  • FIG. 4 is a fourth layer structure of the multilayer board of the 5G antenna integrated network device according to the preferred embodiment of the present invention.
  • This embodiment provides a 5G antenna integrated network device, which preferably includes two PCB boards, the PCB boards are copper-plated on both sides, and the PCB boards are sequentially stacked and connected to form a multi-layer board, and the PCB boards pass through
  • the prepreg is bonded and connected; it can also be a combination of two or more PCB boards to form a multilayer board; each layer of the multilayer board in this embodiment is shown in Figures 1 to 4, specifically including the first layer board Surface 100, second layer surface 200, third layer surface 300 and fourth layer surface 400, said first layer surface 100 and second layer surface 200 respectively correspond to the front and back of the first PCB board, The third-layer board surface 300 and the fourth-layer board surface 400 respectively correspond to the front and back of the second PCB board.
  • the inner board surface of the multilayer board is provided with a calibration network circuit 203, and the outer layer of the multilayer board
  • a phase-shifting network circuit 107 is provided on the board surface, the first-layer board surface 100 is located on the upper end surface of the multilayer board, and the phase-shifting network circuit 107 is provided on the first-layer board surface 100, the calibration network
  • the circuit 203 is arranged on the second layer surface 200 opposite to the first layer surface 100;
  • the multilayer board is provided with a plurality of metalized holes penetrating the multilayer board; the metalized holes connect the multilayer board
  • the layer conduction connection between the layers, a part of the circuit in the multi-layer board goes to the inner layer and the part of the circuit goes to the surface layer to realize the conversion from the strip line to the microstrip line.
  • the calibration network and the phase shifting network are integrated on the same multilayer board, which reduces the number of adapters and avoids electrical problems and structural risk points caused by switching.
  • the calibration network line 203 and the phase-shifting network line 107 are vertically misaligned between the multilayer boards.
  • the upper and lower outer layers of the multilayer board are respectively provided with upper and lower metal grounds, and the calibration network line 203 and the upper and lower metal grounds form a stripline structure; that is, the upper and lower metal grounds They are respectively arranged on the first layer 100 and the fourth layer 400, and their grounds are connected to other grounds through metallized holes; the inner layer of the multilayer board is provided with a medium metal ground, and it is moved
  • the phase network line 107 and the medium metal ground form a microstrip line structure.
  • the connection between the strip line and the microstrip line constitutes a discontinuity.
  • the ground that is, the copper-clad area of each layer, is reasonably optimized, and then the line impedance at the conduction is adjusted according to the simulation to improve the discontinuity and ensure the standing wave after the module is integrated.
  • the electrical indicators are good.
  • a solder mask area 404 is provided on the outer side of the multilayer board, and an oil-coated protective layer is provided on the solder mask area 404. As shown in FIG. 2, a number of metallized holes in each layer of the multilayer board are arranged in close proximity to each other at the same or nearly the same distance along the alignment of the calibration network line 203 to ensure equipotential distribution.
  • the multi-layer board (that is, the integrated network formed by the calibration network and the phase shifting network) is provided with at least one calibration port, at least one radio frequency port, balancing resistance and grounding resistance.
  • the phase-shifting network composed of the phase-shifting network line 107 and the medium metal ground is provided with a DC grounding lightning protection sub-line 110.
  • the copper clad layer is the ground corresponding to the circuit, and the copper foil filling area is determined according to the circuit characteristics of different modules; refer to Figure 1, the large copper clad area is the ground 101 on the side of the calibration network strip line (specifically, the upper metal ground);
  • the calibration network 203 includes a calibration network calibration port 103, a calibration network radio frequency port 104, a calibration network balance resistance 105; a calibration network ground resistance 106, a first metallized hole 102 on the first layer board; a microstrip phase shift network 107
  • the main port of the microstrip line phase-shifting network and the antenna port of the stripline calibration network are connected at 108; the phase-shifting network sub-port 109 is connected to the feed network of the antenna;
  • the first layer of the board surface 100 is integrated with a pad 111 and a solder mask
  • the protective layer 112 and the phase shift slider 113 corresponding to the phase shift network.
  • the surrounding copper-clad area needs to be adjusted locally; the main port line of the phase-shifting network line 107 Adjustments are also needed, especially the multi-level impedance adjustment of the microstrip line at the conduction 108 to improve the deviation of the Smith chart after the connection.
  • the large-area copper-clad area 201 of the second layer board 200 is the middle layer ground; the second metalized hole 202 on the second layer board surface; the metal ground 201 and the second metalized hole 202 are the same or nearly the same along the calibration network line 203 Distance arrangement to ensure equipotential distribution.
  • the distance between the main port 204 of the phase shift network and the antenna port of the stripline calibration network must be adjusted locally to improve the discontinuity.
  • the last-stage impedance of the stripline line 205 at the conduction becomes smaller to adjust the matching characteristics after connection.
  • the third metallized holes 301 on the third layer surface 300 penetrate through the metallized holes of other layers.
  • the large-area copper-clad area of the fourth layer surface 400 is the ground 401 on the other side of the calibration network strip line (specifically, the lower metal ground); and the fourth metallization hole 402, the pad 403, and the solder resist area 404.
  • the multi-layer board is not limited to the four-layer board; the number of radio frequency ports is not limited to 4 groups, and this embodiment only uses 4 groups as an illustration; the ground of the microstrip line phase-shifting network is not limited to being located in the middle layer as shown in the figure.
  • the line impedance can be equivalent to the change of the thickness of the dielectric substrate; the coupling calibration network and the phase shifting network are not limited to the wiring method shown in the figure; the phase shifting network is not limited to the full microstrip line form, and can be further used In the form of stripline to microstrip line, it can be equivalent if the transfer point is also matched and optimized.
  • the calibration network of the 5G antenna integrated network device of the present invention adopts a stripline scheme.
  • the calibration network line is located on the inner layer of the multilayer board, and the upper and lower layers are located on the outer layer.
  • the line is a large area of copper-clad area beyond a certain distance.
  • Conduction connection through metallized holes; phase shifter adopts microstrip line scheme, the phase shifting network line is located on the outer layer of the multilayer board, and the ground is located on the inner layer or another outer layer.
  • the position of the ground determines the thickness of the dielectric substrate and determines the shift Phase network line impedance, the ground is shared with the calibration network through a large-area metalized hole; the calibration network and the phase-shifting network are connected from the inner layer to the outer layer through the metalized hole, which causes discontinuity. Adjusting the ground at the connection point and optimizing the line impedance of the two modules at the connection point can improve the electrical indicators after the module is integrated, especially the standing wave. And it can make the antenna port environment tend to be consistent, with high accuracy, better stability and consistency.

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Abstract

本发明适用于通信技术领域，提供了一种5G天线一体化网络装置，包括有至少两个PCB板，所述PCB板双面镀铜且所述PCB板依次叠置连接以形成多层板，所述多层板的内层板面上设有校准网络线路，所述多层板的外层板面上设有移相网络线路，所述多层板上设有若干个贯通所述多层板的金属化孔，所述金属化孔将所述多层板之间的层面导通连接。借此，本发明能够使天线端口环境趋于一致，精度高、稳定性和一致性更好。

Description

5G天线一体化网络装置 技术领域
本发明涉及通信技术领域，尤其涉及一种5G天线一体化网络装置。
背景技术
随着5G网络快速建设，天线行业产品迭代越来越快。5G(第五代移动通信技术)MIMO(Multiple-Input Multiple-Output，多入多出技术)大规模天线阵的需求日新月异，高集成度高一致性的5G天线市场前景广泛。
现有办法通常使用多个组件进行转接，装配复杂，可靠性和一致性差，电性能实现难度较大，且成本偏高。那么，如何更好地设计5G天线，在密集阵小尺寸下更好地集成各个模块，在易于装配及可靠性良好的基础上，实现并提高电气指标一致性对于5G天线系列化产品具有举足轻重的作用。
综上可知，现有的方法在实际使用上，存在着较多的问题，所以有必要加以改进。
发明内容
针对上述的缺陷，本发明的目的在于提供一种5G天线一体化网络装置，能够使天线端口环境趋于一致，精度高、稳定性和一致性更好。
为了实现上述目的，本发明提供一种5G天线一体化网络装置，包括有至少两个PCB(线路板)板，所述PCB板双面镀铜且所述PCB板依次叠置连接以形成多层板，所述多层板的内层板面上设有校准网络线路，所述多层板的外层板面上设有移相网络线路，所述多层板上设有若干个贯通所述多层板的金属化孔，所述金属化孔将所述多层板之间的层面导通连接。
根据所述的5G天线一体化网络装置，所述校准网络线路与所述移相网络线路在所述多层板之间呈垂直错位分布。
根据所述的5G天线一体化网络装置，所述多层板的上外层板面和下外层板面上分别设有上下金属地，且所述校准网络线路与所述上下金属地构成带状线结构。
根据所述的5G天线一体化网络装置，所述多层板的所述内层板面上设有中 金属地，且所述移相网络线路与所述中金属地构成微带线结构。
根据所述的5G天线一体化网络装置，所述PCB板之间通过半固化片粘合连接。
根据所述的5G天线一体化网络装置，所述多层板的外侧设有阻焊区，且所述阻焊区上设有覆油保护层。
根据所述的5G天线一体化网络装置，所述多层板的每一层若干个所述金属化孔沿着所述校准网络线路的走线同等或近同等距离紧靠排布。
根据所述的5G天线一体化网络装置，所述多层板设有至少一校准端口、至少一射频端口、平衡电阻和接地电阻。
根据所述的5G天线一体化网络装置，所述移相网络线路和所述中金属地组成的移相网络设有直流接地雷电保护子线路。
本发明将校准网络与移相网络集成在同一个多层板上，减少了转接件、避免了转接引起的电气问题及结构风险点。多层板的有效利用实现了带状线到微带线的转换，对地和导通处线路阻抗进行优化解决了不连续性问题，驻波良好。5G大规模天线阵端口众多，本发明能够使天线端口环境趋于一致，精度高、稳定性和一致性更好。
附图说明
图1为本发明优选实施例所述5G天线一体化网络装置的所述多层板的第一层面结构；
图2为本发明优选实施例所述5G天线一体化网络装置的所述多层板的第二层面结构；
图3为本发明优选实施例所述5G天线一体化网络装置的所述多层板的第三层面结构；
图4为本发明优选实施例所述5G天线一体化网络装置的所述多层板的第四层面结构。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具体实施例仅 仅用以解释本发明，并不用于限定本发明。
本实施例提供了一种5G天线一体化网络装置，优选包括有两个PCB板，所述PCB板双面镀铜且PCB板依次叠置连接以形成多层板，所述PCB板之间通过半固化片粘合连接；也可以是2个以上的PCB板组合形成多层板；本实施例的所述多层板的每一层面分别如图1～图4所示，具体包括有第一层板面100、第二层板面200、第三层板面300以及第四层板面400，所述第一层板面100和第二层板面200分别对应为第一PCB板的正反面，第三层板面300和第四层板面400分别对应为第二PCB板的正反面，所述多层板的内层板面上设有校准网络线路203，所述多层板的外层板面上设有移相网络线路107，第一层板面100处于所述多层板的上端面，且所述移相网络线路107设于该第一层板面100上，所述校准网络线路203设于第一层板面100的反面第二层板面200上；所述多层板上设有若干个贯通所述多层板的金属化孔；所述金属化孔将多层板之间的层面导通连接，多层板中一部分线路走内层一部分线路走表层即实现了带状线到微带线的转换。本实施例将校准网络与移相网络集成在同一个多层板上，减少了转接件、避免了转接引起的电气问题及结构风险点。
如图，所述校准网络线路203与移相网络线路107在所述多层板之间呈垂直错位分布。所述多层板的上外层板面和下外层板面上分别设有上下金属地，且校准网络线路203与所述上下金属地构成带状线结构；即，其中所述上下金属地分别设于第一层板面100和第四层板面400上，其地通过金属化孔与其他地共地连接；所述多层板的内层板面上设有中金属地，且移相网络线路107与所述中金属地构成微带线结构。带状线与微带线连接处构成了不连续性，首先对地即各个层覆铜区域合理优化，其次根据仿真调整导通处线路阻抗以改善不连续性，确保模块一体化集成后驻波等电气指标良好。
所述多层板的外侧设有阻焊区404，且所述阻焊区404上设有覆油保护层。如图2，所述多层板的每一层若干个金属化孔沿着所述校准网络线路203的走线同等或近同等距离紧靠排布，确保等电位分布。
所述多层板(即所述校准网络和移相网络构成的一体化网络)设有至少一校准端口、至少一射频端口、平衡电阻和接地电阻。移相网络线路107和所述中金属地组成的移相网络设有直流接地雷电保护子线路110。覆铜层即为线路所对应的地，根据不同模块线路特性确定铜箔填充区域；参阅图1，大面积覆铜区 域为校准网络带状线一侧地101(具体为上金属地)；所述校准网络203包括有校准网络校准端口103、校准网络射频端口104、校准网络平衡电阻105；校准网络接地电阻106，第一层面板上的第一金属化孔102；微带线移相网络107的微带线移相网络主口与带状线校准网络天线口导通处108；移相网络分口109与天线的馈电网络连接；第一层板面100集成有焊盘111、阻焊保护层112以及移相网络对应的移相滑块113。由于带状线结构的校准网络线路203与微带线结构的移相网络线路107导通处108产生了不连续性，其周围覆铜区域需进行局部调整；移相网络线路107的主口线路也需进行调整，尤其是导通处108的微带线多级阻抗调整以改善连接后史密斯圆图的偏离。
第二层板200的大面积覆铜区域201为中间层地；第二层板面的第二金属化孔202；金属地201与第二金属化孔202沿着校准网络线路203同等或近同等距离排布，确保等电位分布。移相网络主口204与带状线校准网络天线口导通处的地，其与线路的距离需进行局部调整以改善不连续性。导通处带状线线路205的最后一级阻抗变小以调节连接后匹配特性。第三层板面300上的第三金属化孔301与其他层的所述金属化孔贯穿。第四层板面400的大面积覆铜区域为校准网络带状线另一侧地401(具体为下金属地)；以及第四金属化孔402、焊盘403以及阻焊区404。所述多层板不局限于四层板；射频端口数量不局限于4组,本实施例仅以4组作为示意；微带线移相网络的地不局限于位于图示中间层，也可以位于外层，对应介质基板厚度改变则线路阻抗改变即可等效；耦合校准网络和移相网络不局限于图示走线方式；移相网络不局限于采用全微带线形式、可以进一步采用带状线转微带线形式对转接处同样进行匹配优化即可等效等。
综上所述，本发明所述的5G天线一体化网络装置的校准网络采用带状线方案，校准网络线路位于多层板内层，上下地位于外层，线路一定距离以外大面积覆铜区域通过金属化孔导通连接；移相器采用微带线方案，移相网络线路位于多层板外层，地位于内层或另一外层，地的位置决定了介质基板厚度即决定了移相网络线路阻抗，地通过大面积金属化孔实现与校准网络共地；其中校准网络与移相网络从内层向外层通过金属化孔导通连接的过程中引起了不连续性，对导通连接处的地进行调整并对连接处两种模块的线路阻抗进行优化，能够使模块集成后电气指标改善，尤其是驻波。并且能够使天线端口环境趋于一致，精度高、稳定性和一致性更好。
当然，本发明还可有其它多种实施例，在不背离本发明精神及其实质的情况下，熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形，但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。

Claims (9)

  1. 一种5G天线一体化网络装置，其特征在于，包括有至少两个PCB板，所述PCB板双面镀铜且所述PCB板依次叠置连接以形成多层板，所述多层板的内层板面上设有校准网络线路，所述多层板的外层板面上设有移相网络线路，所述多层板上设有若干个贯通所述多层板的金属化孔，所述金属化孔将所述多层板之间的层面导通连接。
  2. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述校准网络线路与所述移相网络线路在所述多层板之间呈垂直错位分布。
  3. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述多层板的上外层板面和下外层板面上分别设有上下金属地，且所述校准网络线路与所述上下金属地构成带状线结构。
  4. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述多层板的所述内层板面上设有中金属地，且所述移相网络线路与所述中金属地构成微带线结构。
  5. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述PCB板之间通过半固化片粘合连接。
  6. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述多层板的外侧设有阻焊区，且所述阻焊区上设有覆油保护层。
  7. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述多层板的每一层若干个所述金属化孔沿着所述校准网络线路的走线同等或近同等距离紧靠排布。
  8. 根据权利要求1所述的5G天线一体化网络装置，其特征在于，所述多层板设有至少一校准端口、至少一射频端口、平衡电阻和接地电阻。
  9. 根据权利要求4所述的5G天线一体化网络装置，其特征在于，所述移相网络线路和所述中金属地组成的移相网络设有直流接地雷电保护子线路。
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