WO2021066336A1

WO2021066336A1 - Mold temperature control device

Info

Publication number: WO2021066336A1
Application number: PCT/KR2020/011839
Authority: WO
Inventors: 남성기; 이규철; 노종환
Original assignee: 삼성전자 주식회사
Priority date: 2019-10-02
Filing date: 2020-09-03
Publication date: 2021-04-08
Also published as: KR20210039653A

Abstract

Various embodiments of the present invention relate to a mold temperature control device comprising: a mold; a first temperature adjuster for supplying water having a first temperature to the mold; a second temperature adjuster for supplying water having a second temperature to the mold; a first pipe installed between the first temperature adjuster and the mold; a first valve installed in a predetermined position on the first pipe; a second pipe installed between the first temperature adjuster and the mold; a second valve installed in a predetermined position on the second pipe; a third pipe installed between the second temperature adjuster and the mold; a third valve installed in a predetermined position on the third pipe; a fourth pipe installed between the second temperature adjuster and the mold; a fourth valve installed in a predetermined position on the fourth pipe; a fifth pipe comprising a fifth valve, the fifth pipe being installed between the first pipe and the second pipe; a sixth pipe comprising a sixth valve, the sixth pipe being installed between the third pipe and the fourth pipe; and a processor operatively connected to the first temperature adjuster, the second temperature adjuster, and the first to sixth valves. The processor may be configured such that, when the mold is heated through the first temperature adjuster, the processor closes the fifth valve, opens the first valve so as to supply the mold with water heated to the first temperature, and opens the second valve so as to recollect water discharged from the mold to the first temperature adjuster. If the operation of the first temperature adjuster is completed, the processor may open the sixth valve so as to form a bypass path along which water having the second temperature is supplied to the mold through the second temperature adjuster. Various other embodiments are possible.

Description

Mold temperature control device

Various embodiments of the present invention relate to a mold temperature control apparatus capable of shortening the heating and cooling time of the mold.

In the injection mold, a plastic resin such as a thermosetting resin or a thermoplastic resin may be injected into the mold to manufacture various types of injection products.

The injection mold apparatus injects plastic resin into the cavity formed in the mold, and can manufacture a resin product in a shape corresponding to the cavity of the mold.

The structure of an injection mold is determined according to conditions such as molding machine specifications or molded product shape and material, and temperature control of the mold can act as an important factor in order to manufacture a high-quality molded product.

In an injection mold, the temperature of the mold must be properly controlled to improve the quality of the product to be molded.

Injection molding is possible even when the mold temperature is not controlled, but depending on the mold temperature, the appearance of the product, electrical characteristics, shrinkage rate, and cycle time may be affected.

Since resin, which is a raw material of the injection material, changes in viscosity depending on temperature, if the temperature of the mold is not properly controlled, burrs or cracks may occur in the injection product.

In various embodiments of the present invention, temperature control is quickly performed by bypassing a flow path of water (eg, heating water and/or cooling water) supplied to the mold from a temperature controller, and the temperature of the mold is controlled through at least one sensor. By monitoring, it is possible to provide a mold temperature control device capable of shortening the heating and cooling time of the mold.

Mold temperature control apparatus according to various embodiments of the present invention, the mold; A first temperature controller supplying water of a first temperature to the mold; A second temperature controller supplying water of a second temperature to the mold; A first pipe installed between the first temperature controller and the mold; A first valve installed at a predetermined position of the first pipe; A second pipe installed between the first temperature controller and the mold; A second valve installed at a predetermined position of the second pipe; A third pipe installed between the second temperature controller and the mold; A third valve installed at a predetermined position of the third pipe; A fourth pipe installed between the second temperature controller and the mold; A fourth valve installed at a predetermined position of the fourth pipe; A fifth pipe including a fifth valve and installed between the first pipe and the second pipe; A sixth pipe including a sixth valve and installed between the third pipe and the fourth pipe; And a processor operatively connected to the first temperature controller, the second temperature controller, and the first to sixth valves, and when the mold is heated through the first temperature controller, the processor, The fifth valve is closed, the first valve is opened to supply water heated to the first temperature to the mold, and the second valve is opened to transfer water discharged from the mold to the first temperature controller. And, when the operation of the first temperature controller is completed, the sixth valve may be opened to form a bypass path to supply water having the second temperature to the mold through the second temperature controller. have.

Various embodiments of the present invention, by bypassing the flow path of water supplied to the mold from the temperature controller to quickly perform temperature control, and by monitoring the temperature of the mold through at least one sensor, shortening the heating and cooling time of the mold I can make it.

1 is a view showing the configuration of a mold temperature control apparatus according to various embodiments of the present invention.

2 is a view for explaining the operation of the first temperature controller and the second temperature controller of the mold temperature control apparatus according to various embodiments of the present invention.

3 is a diagram illustrating an operation of heating a mold using a first temperature controller of a mold temperature control apparatus according to various embodiments of the present disclosure.

4 is a diagram illustrating an operation of cooling a mold using a second temperature controller of the mold temperature control apparatus according to various embodiments of the present disclosure.

5 is a diagram illustrating an operation of rapidly cooling a mold using a cooler of a mold temperature control apparatus according to various embodiments of the present disclosure.

6 is a diagram illustrating an operation when a part of a mold is cooled using a second temperature controller of a mold temperature control apparatus according to various embodiments of the present disclosure.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiment.

In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the above items unless clearly indicated otherwise in a related context.

In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of the phrases such as "at least one of, B, or C" may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the component from other Order) is not limited.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. .

1, a mold temperature control apparatus 100 according to various embodiments of the present invention includes a first temperature controller 110, a second temperature controller 120, a cooler 130, a mold 140, at least One pipe (111, 113, 115, 121, 123, 125, 131, 133, 135), at least one valve (①~⑨), at least one sensor (112, 114, 122, 124) and processor 150 ) Can be included.

According to various embodiments, the at least one valve (① to ⑨) may include a solenoid valve. At least one valve (① to ⑨) may be opened or closed according to the control of the processor 150, or the amount of opening and closing may be adjusted.

Each of the at least one

sensor

112, 114, 122, and 124 may include at least one of a temperature sensor, a pressure sensor, and a flow sensor. The temperature control functions of the first temperature controller 110 and the second temperature controller 120 may be changed from each other.

According to an embodiment, the first temperature controller 110 may heat the mold 140. The first temperature controller 110 may supply water (eg, heated water) heated to a first temperature (about 50°C to 99°C) to the mold 140. The first temperature controller 110 may include a water storage tank (not shown).

According to an embodiment, the second temperature controller 120 may cool the mold 140. The second temperature controller 120 may supply water (eg, cooling water) having a second temperature (about 5°C to 45°C) to the mold 140. The second temperature controller 120 may include a water recovery tank (not shown).

According to an embodiment, the cooler 130 may rapidly cool the mold 140. The cooler 130 may supply a refrigerant (eg, liquid nitrogen (LN2)) having a third temperature (about -196°C to 10°C) to the mold 140 by spraying. In addition to liquid nitrogen, the cooler 130 may include natural refrigerants (eg, CO2, air, O2, He, Ar) and refrigerant gases (eg, R22, R410, R134A). The cooler 130 may include another refrigerant material capable of rapidly cooling the mold 140. According to an exemplary embodiment, the mold temperature control apparatus 100 can rapidly cool the mold 140 through the cooler 130, thereby shortening a cycle time required for injection molding.

According to an embodiment, the mold 140 may increase or decrease the temperature as hot or cold water introduced through the first temperature controller 110 or the second temperature controller 120 is circulated. The circulated hot or cold water may be discharged to the outside of the mold 140. The mold 140 may transmit an injection signal or a mold temperature to the processor 150. The mold 140 may, for example, melt a plastic resin or a casting metal to produce a molten material into a product having a predetermined shape and dimensions.

According to an embodiment, the at least one

pipe

111, 113, 115, 121, 123, 125, 131, 133, 135 is a first temperature controller 110, a second temperature controller 120, and a cooler 130 ) And may be installed between the mold 140.

According to various embodiments, the first pipe 111 may be installed between the first temperature controller 110 and the mold 140. The first pipe 111 may form a conduit for supplying the heated water heated through the first temperature controller 110 to the mold 140.

According to an embodiment, a first valve ① may be installed at a predetermined position of the first pipe 111.

According to various embodiments, the second pipe 113 may be installed between the first temperature controller 110 and the mold 140. The second pipe 113 may form a conduit for recovering water discharged to the first temperature controller 110 through the mold 140.

According to an embodiment, a second valve ② may be installed at a predetermined position of the second pipe 113.

In various embodiments, the third pipe 121 may be installed between the second temperature controller 120 and the mold 140. The third pipe 121 may form a conduit for supplying the cooling water cooled through the second temperature controller 120 to the mold 140.

According to an embodiment, a third valve ③ may be installed at a predetermined position of the third pipe 121.

According to various embodiments, the fourth pipe 123 may be installed between the second temperature controller 120 and the mold 140. The fourth pipe 123 may form a conduit for recovering water discharged to the second temperature controller 120 through the mold 140.

According to an embodiment, a fourth valve ④ may be installed at a predetermined position of the fourth pipe 123.

According to various embodiments, the fifth pipe 115 may be installed between the first pipe 111 and the second pipe 113. The fifth pipe 115 may include a fifth valve ⑤. The fifth valve ⑤ may be installed at a front end of the first valve ① installed in the first pipe 111 and the second valve ② installed in the second pipe 113. The fifth pipe 115 may form a bypass pipe between the first pipe 111 and the second pipe 113.

According to various embodiments, the sixth pipe 115 may be installed between the third pipe 121 and the fourth pipe 123. The sixth pipe 125 may include a sixth valve (⑥). The sixth valve ⑥ may be installed at a front end of the third valve ③ installed in the third pipe 121 and the fourth valve ④ installed in the fourth pipe 123. The sixth pipe 125 may form a bypass conduit between the third pipe 121 and the fourth pipe 123.

According to various embodiments, the seventh pipe 131 may be installed between the first pipe 111 and the third pipe 121. The seventh pipe 131 may include a seventh valve (⑦). The seventh valve ⑦ may be installed at the rear end of the first valve ① installed in the first pipe 111 and the third valve ③ installed in the third pipe 121. The seventh pipe 131 may form a bypass pipe for supplying the coolant delivered through the second temperature controller 120 to a part of the mold 140 (eg, the first mold 141 in FIG. 6 ). .

According to various embodiments, the eighth pipe 133 may be installed between the second pipe 113 and the fourth pipe 123. The eighth pipe 133 may include an eighth valve (⑧). The eighth valve ⑧ may be installed at the rear end of the second valve ② installed in the second pipe 113 and the fourth valve ④ installed in the fourth pipe 123. The eighth pipe 133 may form a bypass pipe for recovering water discharged to the second temperature controller 120 through a portion of the mold 140 (eg, the first mold 141 in FIG. 6 ). .

According to various embodiments, the ninth pipe 135 may be installed between the cooler 130 and the mold 140. The ninth pipe 135 may form a conduit for supplying a refrigerant (eg, liquid nitrogen) transmitted through the cooler 130 to the mold 140. The ninth pipe 135 may include a ninth valve (⑨).

According to an embodiment, the at least one sensor (112, 114, 122, 124) is a predetermined value of the first pipe 111, the second pipe 113, the third pipe 121 and the fourth pipe 123. Can be installed on site.

According to various embodiments, the first sensor 112 may be installed on the first pipe 111. The first sensor 112 may detect at least one of a temperature, a pressure, and a flow rate of water supplied to the mold 140 through the first temperature controller 110. The detected signal may be transmitted to the processor 150. The first sensor 112 may be installed at the rear end of the first valve ① installed in the first pipe 111.

According to various embodiments, the second sensor 114 may be installed on the second pipe 113. The second sensor 114 may detect at least one of a temperature, a pressure, a flow rate, or an injection signal of water discharged to the first temperature controller 110 through the mold 140. The detected signal may be transmitted to the processor 150. The second sensor 114 may be installed at the rear end of the second valve ② installed in the second pipe 113.

According to various embodiments, the third sensor 122 may be installed on the third pipe 121. The third sensor 122 may detect at least one of a temperature, a pressure, and a flow rate of water supplied to the mold 140 through the second temperature controller 120. The detected signal may be transmitted to the processor 150. The third sensor 122 may be installed at the rear end of the third valve ③ installed in the third pipe 121.

According to various embodiments, the fourth sensor 124 may be installed on the fourth pipe 123. The fourth sensor 124 may detect at least one of a temperature, a pressure, a flow rate, or an injection signal of water discharged to the second temperature controller 120 through the mold 140. The detected signal may be transmitted to the processor 150. The fourth sensor 124 may be installed at the rear end of the fourth valve ④ installed in the fourth pipe 123.

According to an embodiment, the processor 150 includes a first temperature controller 110, a second temperature controller 120, a cooler 130, a mold 140, at least one valve (① to ⑨) and/or It may be operatively connected to at least one sensor (112, 114, 122, 124).

According to various embodiments, the processor 150 uses at least one of a flow rate, pressure, temperature, or injection signal of water transmitted from the at least one

sensor

112, 114, 122, 124, and the first temperature controller 110 ), the second temperature controller 120, the cooler 130, and/or at least one valve (① to ⑨) can be controlled. The processor 150 may control the flow rate of water by adjusting at least one of an open, closed, or open/closed amount of at least one valve (① to ⑨). The processor 150 may receive a signal for controlling internal components of the mold temperature control apparatus 100 through a touch screen (not shown). The processor 150 may quickly perform switching for heating the mold 140 using the first temperature controller 110 or cooling the mold 140 using the second temperature controller 120.

According to various embodiments, the processor 150 may perform a function of controlling an overall operation of the mold temperature control apparatus 100 and a signal flow between internal components, and processing data. The processor 150 may include, for example, at least one of a central processing unit (CPU), an application processor, and/or a communication processor. The processor 150 may be formed of a single core processor or a multi-core processor, and may be formed of a plurality of processors.

According to various embodiments, in the mold temperature control apparatus 100, the first temperature controller 110 and the second temperature controller 120 may operate, and the cooler 130 may not operate.

According to an embodiment, when the first temperature controller 110 is operated, water (eg, heated water) heated to about 50° C. to 99° C. may be supplied to the mold 140. The mold 140 may be heated through the supplied heating water. The mold 140 may transmit an injection signal to the processor 150.

According to an embodiment, when the first temperature controller 110 is operated, the processor 150 may open the first valve ① installed in the first pipe 111. The first sensor 112 may detect the temperature, pressure, and flow rate of water delivered to the mold 140 through the first valve ① and transmit it to the processor 150.

According to an embodiment, the mold 140 may discharge heated water supplied through the first temperature controller 110, the first pipe 111, and the first valve ①.

According to an embodiment, when water (eg, heated water) is discharged through the mold 140, the second sensor 114 detects the temperature, pressure, and flow rate of the water discharged through the mold 140, and the processor Can be delivered to 150.

According to an embodiment, the processor 150 may open the second valve ② installed in the second pipe 113 through a detection signal from the second sensor 114.

According to an embodiment, the first temperature controller 110 may recover water discharged through the mold 140, the second pipe 113, and the second valve ②.

According to various embodiments, when the second temperature controller 120 is operated, water (eg, cooling water) of about 5° C. to 45° C. may be supplied to the mold 140. The mold 140 may be cooled through the supplied cooling water. The mold 140 may transmit an injection signal to the processor 150.

According to an embodiment, when the second temperature controller 120 is operated, the processor 150 may open the third valve ③ installed in the third pipe 121. The third sensor 122 may detect the temperature, pressure, and flow rate of water delivered to the mold 140 through the third valve ③ and transmit it to the processor 150.

According to an embodiment, the mold 140 may discharge water supplied through the second temperature controller 120, the third pipe 121 and the third valve ③.

According to an embodiment, when water (eg, cooling water) is discharged through the mold 140, the fourth sensor 124 detects the temperature, pressure, and flow rate of the water discharged through the mold 140, and the processor ( 150).

According to an embodiment, the processor 150 may open the fourth valve ④ installed in the fourth pipe 123 through the detection signal of the fourth sensor 124.

According to an embodiment, the second temperature controller 120 may recover water discharged through the mold 140, the fourth pipe 123, and the fourth valve ④.

According to various embodiments, in order to control the temperature of the mold 140, when heating water or cooling water is supplied to the mold 140 through the first temperature controller 110 and/or the second temperature controller 120, the The 1 valve (①) to the fourth valve (④) are opened, and the 5th valve (⑤), the 6th valve (⑥), the 7th valve (⑦), the 8th valve (⑧) and the 9th valve (⑨) can be closed.

According to various embodiments, in the mold temperature control apparatus 100, the first temperature controller 110 is operated, the second temperature controller 120 waits as a bypass, and the cooler 130 may not operate. The first temperature controller 110 may heat the mold 140.

According to an embodiment, when the first temperature controller 110 is operated, water heated to about 50° C. to 99° C. (eg, heated water) may be supplied to the mold 140. The mold 140 may be heated through the supplied heating water. The mold 140 may transmit an injection signal to the processor 150.

According to an embodiment, the mold 140 is heated through the heated water supplied through the first temperature controller 110, the first pipe 111, and the first valve ①, and then discharges the heated water. can do.

According to various embodiments, while the processor 150 heats the mold 140 using the first temperature controller 110, the processor 150 uses the second temperature controller 120 to rapidly cool the mold 140. It is possible to form a path path.

According to an embodiment, the processor 150 may operate the second temperature controller 120 and open the sixth valve ⑥ when forming the bypass path for the cooling.

According to an embodiment, when heating of the mold 140 is completed using the first temperature controller 110, the processor 150 cools the temperature of the mold 140, the third valve (③) and Open the fourth valve (④), and the first valve (①), the second valve (②), the fifth valve (⑤), the sixth valve (⑥), the seventh valve (⑦), the eighth The valve (⑧) and the ninth valve (⑨) can be closed.

According to various embodiments, in the mold temperature control apparatus 100, the second temperature controller 120 is operated, the first temperature controller 110 waits as a bypass, and the cooler 130 may not operate. The second temperature controller 120 may cool the mold 140.

According to an embodiment, when the second temperature controller 120 is operated, water (eg, cooling water) of about 5° C. to 45° C. may be supplied to the mold 140. The mold 140 may be cooled through the supplied cooling water. The mold 140 may transmit an injection signal to the processor 150.

According to an embodiment, the mold 140 may be cooled through the cooling water supplied through the second temperature controller 120, the third pipe 121 and the third valve ③, and then discharge the cooling water. have.

According to various embodiments, while cooling the mold 140 by using the second temperature controller 120, the processor 150 is used to rapidly heat the mold 140 through the first temperature controller 110. It is possible to form a path path.

According to an embodiment, when forming the bypass path for heating, the processor 150 may operate the first temperature controller 110 and open the fifth valve ⑤.

According to an embodiment, when cooling of the mold 140 is completed using the second temperature controller 120, the processor 150 heats the temperature of the mold 140 by using the first valve ① and Open the second valve (②), the third valve (③), the fourth valve (④), the fifth valve (⑤), the sixth valve (⑥), the seventh valve (⑦), the eighth The valve (⑧) and the ninth valve (⑨) can be closed.

According to various embodiments, in the mold temperature control apparatus 100, the cooler 130 is operated, and the first temperature controller 110 and the second temperature controller 120 may wait as a bypass. The cooler 130 may rapidly cool the mold 140.

According to an embodiment, when the cooler 130 is operated, a refrigerant (eg, liquid nitrogen (LN2)) of about -196°C to 10°C may be supplied to the mold 140. The mold 140 may be rapidly cooled through the refrigerant supplied through the cooler 130. The mold 140 may transmit an injection signal to the processor 150.

According to an embodiment, when the cooler 130 is operated, the processor 150 may open the ninth valve ⑨ installed in the ninth pipe 135.

According to an embodiment, the mold 140 may be rapidly cooled through the coolant supplied through the cooler 130 and the ninth valve (⑨).

According to various embodiments, while cooling the mold 140 using the cooler 130, the processor 150 establishes a bypass path for rapidly heating the mold 140 through the first temperature controller 110. Can be formed. The processor 150 may form a bypass path for cooling the mold 140 to a second temperature through the second temperature controller 120 while cooling the mold 140 using the cooler 130. .

According to various embodiments, when rapid cooling of the mold 140 using the cooler 130 is completed, the processor 150 heats the temperature of the mold 140 by using the first valve (1) and the second valve. Open the valve (②), the third valve (③), the fourth valve (④), the fifth valve (⑤), the sixth valve (⑥), the seventh valve (⑦), the eighth valve ( ⑧) and the ninth valve (⑨) can be closed.

According to various embodiments, when rapid cooling of the mold 140 using the cooler 130 is completed, the processor 150 cools the temperature of the mold 140 to the second temperature, and the third valve (③) ) And the fourth valve (④), the first valve (①), the second valve (②), the fifth valve (⑤), the sixth valve (⑥), the seventh valve (⑦), The eighth valve (⑧) and the ninth valve (⑨) can be closed.

According to various embodiments, in the mold temperature control apparatus 100, the second temperature controller 120 is operated, the first temperature controller 110 waits as a bypass, and the cooler 130 may not operate. The second temperature controller 120 may selectively cool a portion of the mold 140 (eg, the first mold 141).

According to an embodiment, the mold 140 may include a first mold 141 and a second mold 142. The first mold 141 may be disposed above the mold 140. The second mold 142 may be disposed under the mold 140.

According to an embodiment, the second temperature controller 120 may selectively cool the first mold 141.

According to an embodiment, when the second temperature controller 120 is operated, water (eg, cooling water) of about 5° C. to 45° C. may be supplied to the first mold 141. The first mold 141 may be cooled through the supplied cooling water. The first mold 141 may transmit an injection signal to the processor 150.

According to an embodiment, when the second temperature controller 120 is operated, the processor 150 may open the third valve ③ installed in the third pipe 121. The processor 150 may open a seventh valve ⑦ installed between the first pipe 111 and the third pipe 121. The first sensor 112 may detect the temperature, pressure, and flow rate of water delivered to the first mold 141 through the third valve ③ and the seventh valve ⑦, and transmit it to the processor 150.

According to an embodiment, the first mold 141 is cooled by cooling water supplied through the second temperature controller 120, the third pipe 121, the third valve ③, and the seventh valve ⑦. After that, the cooling water can be discharged.

According to an embodiment, when water (eg, cooling water) is discharged through the first mold 141, the processor 150 may open the eighth valve ⑧.

According to an embodiment, the fourth sensor 124 may detect the temperature, pressure, and flow rate of water discharged through the first mold 141 and the eighth valve ⑧ and transmit it to the processor 150.

According to an embodiment, the second temperature controller 120 can recover water discharged through the first mold 141, the eighth valve (⑧), the fourth pipe 123, and the fourth valve (④). have.

According to various embodiments, the processor 150 rapidly heats the mold 140 through the first temperature controller 110 while cooling the first mold 140 using the second temperature controller 120. It is possible to form a bypass path for.

According to an embodiment, when cooling of the first mold 141 is completed using the second temperature controller 120, the processor 150 heats the temperature of the mold 140 by the first valve (①). ) And the second valve (②), the third valve (③), the fourth valve (④), the fifth valve (⑤), the sixth valve (⑥), the seventh valve (⑦), The eighth valve (⑧) and the ninth valve (⑨) can be closed.

According to various embodiments, in the description of FIG. 6 described above, the second temperature controller 120 of the mold temperature controller 100 is operated, the first temperature controller 110 waits as a bypass, and the cooler 130 ) Has been described, but the first temperature controller 110 is operated, the second temperature controller 110 waits as a bypass, and the cooler 130 is not operated, the first temperature The second mold 142 may be selectively heated using the regulator 110.

In the above, the present invention has been described according to various embodiments of the present invention, but changes and modifications within the scope not departing from the spirit of the present invention by those of ordinary skill in the art belong to the present invention. Of course.

Claims

In the mold temperature control device,

mold;

A first temperature controller supplying water of a first temperature to the mold;

A second temperature controller supplying water of a second temperature to the mold;

A first pipe installed between the first temperature controller and the mold;

A first valve installed at a predetermined position of the first pipe;

A second pipe installed between the first temperature controller and the mold;

A second valve installed at a predetermined position of the second pipe;

A third pipe installed between the second temperature controller and the mold;

A third valve installed at a predetermined position of the third pipe;

A fourth pipe installed between the second temperature controller and the mold;

A fourth valve installed at a predetermined position of the fourth pipe;

A fifth pipe including a fifth valve and installed between the first pipe and the second pipe;

A sixth pipe including a sixth valve and installed between the third pipe and the fourth pipe; And

A processor operatively connected to the first temperature controller, the second temperature controller, and the first to sixth valves,

When the mold is heated through the first temperature controller, the processor,

The fifth valve is closed, the first valve is opened to supply water heated to the first temperature to the mold, and the second valve is opened to transfer water discharged from the mold to the first temperature controller. Withdraw,

When the operation of the first temperature controller is completed, the sixth valve is opened to form a bypass path to supply water having the second temperature to the mold through the second temperature controller.
The method of claim 1,

When the mold is cooled through the second temperature controller, the processor,

The sixth valve is closed, the third valve is opened to supply water having the second temperature to the mold, and the fourth valve is opened to recover the water discharged from the mold to the second temperature controller and,

When the operation of the second temperature controller is completed, the fifth valve is opened to form a bypass path to supply water having the first temperature to the mold through the first temperature controller.
The method of claim 2,

A seventh pipe installed between the first pipe and the third pipe and including a seventh valve; And

The mold temperature control apparatus further comprises an eighth pipe installed between the second pipe and the fourth pipe and including an eighth valve.
The method of claim 3,

A cooler supplying a refrigerant having a third temperature to the mold; And

The mold temperature control apparatus further comprises a ninth pipe installed between the cooler and the mold and including a ninth valve.
The method of claim 4,

The processor,

When rapidly cooling the mold, the mold temperature control device is set to supply the coolant to the mold by opening the ninth valve.
The method of claim 5,

When the coolant is supplied to the mold through the cooler, the processor,

Opening the fifth valve to form a bypass path to supply water having the first temperature to the mold through the first temperature controller,

A mold temperature control device configured to form a bypass path to open the sixth valve to supply water having the second temperature to the mold through the second temperature controller.
The method of claim 2,

The first temperature is 50 ℃ ~ 99 ℃, the second temperature is 5 ℃ ~ 45 ℃ mold temperature control device.
The method of claim 4,

The third temperature is -196 ℃ ~ 10 ℃ mold temperature control device.
The method of claim 1,

The fifth valve is installed at a front end of the first valve and the second valve,

The sixth valve is a mold temperature control device installed in the transmission of the third valve and the fourth valve.
The method of claim 3,

The seventh valve is installed at the rear end of the first valve and the third valve,

The eighth valve is a mold temperature control device installed at the rear end of the second valve and the fourth valve.
The method of claim 2,

A first sensor installed in the first pipe and detecting at least one of a temperature, a pressure, or a flow rate of water supplied to the mold through the first temperature controller; And

A mold temperature control apparatus including a second sensor installed in the second pipe and detecting at least one of a temperature, pressure, or flow rate of water discharged to the first temperature controller through the mold.
The method of claim 2,

A third sensor installed in the third pipe and detecting at least one of a temperature, pressure, or flow rate of water supplied to the mold through the second temperature controller; And

A mold temperature control apparatus including a fourth sensor installed in the fourth pipe and detecting at least one of a temperature, pressure, or flow rate of water discharged to the second temperature controller through the mold.
The method of claim 10,

The mold includes a first mold disposed on the upper side and a second mold disposed on the lower side,

When the first mold is cooled through the second temperature controller, the processor,

The sixth valve is closed, the third valve and the seventh valve are opened to supply water having the second temperature to the first mold, and the eighth valve and the fourth valve are opened to the mold Mold temperature control device set to recover the water discharged from the second temperature controller.
The method of claim 13,

When the operation of the second temperature controller is completed, the process is a mold set to form a bypass path to supply water having the first temperature to the mold through the first temperature controller by opening the fifth valve. Temperature control device.
The method of claim 2,

The mold temperature control device for transmitting an injection signal or temperature to the processor.