WO2021062789A1 - 一种集成滤波功能的封装天线系统及通信设备 - Google Patents

一种集成滤波功能的封装天线系统及通信设备 Download PDF

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Publication number
WO2021062789A1
WO2021062789A1 PCT/CN2019/109713 CN2019109713W WO2021062789A1 WO 2021062789 A1 WO2021062789 A1 WO 2021062789A1 CN 2019109713 W CN2019109713 W CN 2019109713W WO 2021062789 A1 WO2021062789 A1 WO 2021062789A1
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WIPO (PCT)
Prior art keywords
patch
microstrip
feed
resonator
antenna
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PCT/CN2019/109713
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English (en)
French (fr)
Inventor
章秀银
杨圣杰
刘亮胜
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2019/109713 priority Critical patent/WO2021062789A1/zh
Priority to CN201980100645.3A priority patent/CN114450855A/zh
Publication of WO2021062789A1 publication Critical patent/WO2021062789A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart

Definitions

  • This application relates to the field of antenna technology, and in particular to a packaged antenna system and communication equipment.
  • the antenna is an important component required for communication between devices in wireless communication.
  • the basic composition of the antenna includes a reflector, a radiator, a feeder line (used to connect radio frequency signals to the antenna), and a director.
  • the main indicators of the antenna are bandwidth, gain, polarization, and so on. Among them, the wider the bandwidth means that the antenna can support more working frequency bands, thereby supporting higher channel capacity transmission.
  • the 28GHz, 39GHz, and 60GHz frequency bands will all become standard frequency bands for high-speed wireless communication networks.
  • the wavelength size of the signal is already smaller than the chip package size, so the antenna size can be made small, which makes it possible to design the antenna directly on the package.
  • AiP includes an independent Transceiver (transceiver) and the chip of the antenna array.
  • AiP's RF leads are shorter, so the feed loss will be smaller.
  • the antenna is directly designed on the package, the overall antenna will be more compact and the system integration will be higher.
  • the number of filters configured needs to be the same as the number of RF channels. Because when the filters are set on the circuit board where the RF channels are located, the corresponding package pins need to be configured for each filter. The number of RF channels is larger. For a long time, there are not enough package pins, and it is impossible to configure a filter for each time-frequency channel, which causes the performance of the radio frequency channel to decrease.
  • the larger the number of filters it is not conducive to the miniaturization of the equipment volume.
  • the most important point is that since the filter and the radio frequency channel need to be connected by a cable, the path loss between the radio frequency channel and the filter is very large, which reduces the communication performance.
  • the purpose of the embodiments of the present application is to provide a packaged antenna system and communication equipment to improve system performance.
  • a packaged antenna system including:
  • a radio frequency chip a power divider network connected to the radio frequency chip, a plurality of radio frequency channels connected to the power divider network, and a phased antenna array connected to the plurality of radio frequency channels;
  • the phased antenna array It includes a plurality of antenna units, and some or all of the antenna units include a filter antenna structure, and the filter antenna structure is used for frequency band filtering, and the frequency band includes a millimeter wave frequency band.
  • the radio frequency chip includes an up-converter and a down-converter
  • the power divider network includes one or more power dividers
  • each radio frequency channel of the plurality of radio frequency channels includes one or more radio frequency front-end devices .
  • a filter antenna structure for frequency band filtering is integrated in the phased antenna array, so that the antenna unit has a filtering function, so the RF channel coupled with the antenna unit no longer needs to be connected to the external filter.
  • the system integration can be improved, and the packaging volume required to design the filter separately for the radio frequency channel can be reduced.
  • the filter antenna structure can be used to radiate signals in the millimeter wave frequency band and receive signals in the millimeter wave frequency band; the filter antenna structure can also perform frequency band filtering on signals in the millimeter wave frequency band.
  • the filter antenna structure includes a high-pass filter structure and a low-pass filter structure.
  • the antenna unit includes a feed module and a feed patch
  • the feed module includes at least one layer of superimposed microstrip resonators, and the microstrip resonator includes at least two differential feed probes, a microstrip line, and at least one microstrip patch;
  • the microstrip line included in the microstrip resonator is connected to the at least one microstrip patch through the at least one differential feed probe;
  • the at least one microstrip patch included in the microstrip resonator is coupled with the feed patch to form a series capacitor, and the microstrip line and the series capacitor form the high-pass filter structure.
  • the microstrip resonator includes two differential feed probes connected perpendicularly to each other;
  • At least one of the two end points of the differential feed probe is connected to one of the at least one microstrip patch
  • the number of the at least one microstrip patch is greater than or equal to 1 and less than or equal to 4.
  • the feeding module includes a coupling feeding structure; the coupling feeding structure is coupled with the resonator module;
  • the coupling feed structure includes at least one layer of superimposed microstrip resonators, and the microstrip resonator includes two perpendicularly connected differential feed probes, a microstrip line, and at least one microstrip patch.
  • the two end points of the differential feed probe are respectively connected to one of the at least one microstrip patch, and the microstrip line is perpendicular to the junction of the two differential feed probes.
  • the frequency range of the millimeter wave frequency band includes 24.25 GHz to 29.5 GHz.
  • the frequency range of the millimeter wave frequency band includes 24.25 GHz to 26.5 GHz.
  • the frequency range of the millimeter wave frequency band includes 26.5 GHz to 29.5 GHz.
  • the frequency range of the millimeter wave frequency band includes 27.5 GHz to 28.35 GHz.
  • the frequency range of the millimeter wave frequency band includes 24.25 GHz to 27.5 GHz.
  • the frequency range of the millimeter wave frequency band includes 27.5 GHz to 29.5 GHz.
  • the operating frequency of the antenna unit is in the frequency range 2 of the technical specifications of the 3rd Generation Partnership Project 3GPP New Radio NR.
  • the antenna unit further includes a radiator and a resonator module coupled with the radiator, and the resonator is connected to the feed module;
  • the resonator module includes a parasitic ring resonator and a feed patch
  • the parasitic ring resonator is located between the radiator and the feeding patch, and is respectively coupled with the radiator and the feeding patch, or the feeding patch is located at the radiator Between the parasitic ring resonator and the radiator and the parasitic ring resonator.
  • the radiator is a metal patch with a symmetrical shape.
  • the resonator module includes a parasitic ring resonator and a feed patch
  • the parasitic ring resonator is located between the radiator and the feeding patch, and is respectively coupled with the radiator and the feeding patch, or the feeding patch is located at the radiator Between the parasitic ring resonator and the radiator and the parasitic ring resonator.
  • the parasitic ring resonator is a square ring-shaped metal patch, or a circular ring-shaped metal patch, or a double I-shaped metal patch.
  • the power feeding patch is a metal patch having a symmetrical shape
  • the middle of the power feeding patch includes a feeding opening having a symmetrical shape
  • the shape of the feed opening is a square, a circle, or a double I-shape.
  • the coupling feed structure has at least two layers of microstrip resonators
  • two adjacent layers of microstrip resonators in the at least two layers of superimposed microstrip resonators pass through at least one metal via provided in the microstrip patch. connection.
  • the shape of the microstrip patch is square, round, or prismatic.
  • the vacant positions in the middle and around the microstrip resonator include at least one parasitic ground hole.
  • the present application provides a communication device including: a baseband chip and any one of the above-mentioned packaged antenna systems.
  • the baseband chip and the packaged antenna system are included in the present application.
  • the communication device may further include a memory, and the baseband chip may be coupled with the memory.
  • the memory is used to store instructions
  • the baseband chip is used to execute instructions stored in the memory, and process signals obtained through the packaged antenna system, or send signals through the packaged antenna system.
  • the communication device may also include modules such as an application processor and a display screen.
  • the communication device may be a wireless communication device, or part of the devices in the wireless communication device, such as integrated circuit products such as a system chip or a communication chip.
  • the wireless communication device may be a computer device that supports wireless communication functions.
  • the wireless communication device may be a terminal such as a smart phone, or a wireless access network device such as a base station.
  • the system chip may also be called a system on chip (system on chip, SoC), or simply called an SoC chip.
  • the communication chip may include a baseband chip and a radio frequency processor.
  • the baseband chip is sometimes called a modem or baseband processor.
  • the radio frequency processor is sometimes called a radio frequency transceiver (transceiver) or radio frequency chip.
  • part or all of the chips in the communication chip can be integrated inside the SoC chip.
  • the baseband chip is integrated in the SoC chip, and the radio frequency processor is not integrated with the SoC chip.
  • FIG. 1 is a schematic structural diagram of a packaged antenna system provided by an embodiment of the application
  • FIG. 2 is a principle frame of an antenna unit provided by an embodiment of the application.
  • FIG. 3 is a schematic structural diagram of an antenna unit provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of a radiator provided by an embodiment of the application.
  • Fig. 5 is a schematic diagram of another radiator provided by an embodiment of the application.
  • Fig. 6 is a schematic diagram of another radiator provided by an embodiment of the application.
  • Fig. 7 is a schematic diagram of another radiator provided by an embodiment of the application.
  • FIG. 8 is a schematic diagram of a parasitic ring resonator provided by an embodiment of the application.
  • FIG. 9 is a schematic diagram of another parasitic ring resonator provided by an embodiment of the application.
  • FIG. 10 is a schematic diagram of another parasitic ring resonator provided by an embodiment of the application.
  • FIG. 11 is a schematic diagram of a power feeding patch provided by an embodiment of the application.
  • FIG. 12 is a schematic diagram of another power feeding patch provided by an embodiment of the application.
  • FIG. 13 is a schematic diagram of another power feeding patch provided by an embodiment of the application.
  • FIG. 14 is a schematic diagram of another power feeding patch provided by an embodiment of the application.
  • 15 is a schematic diagram of another power feeding patch provided by an embodiment of the application.
  • FIG. 16 is a schematic diagram of a coupling feed structure provided by an embodiment of this application.
  • FIG. 17 is a schematic diagram of another coupling feed structure provided by an embodiment of the application.
  • FIG. 18 is a schematic diagram of another coupling feed structure provided by an embodiment of the application.
  • FIG. 19 is a schematic diagram of another coupling feed structure provided by an embodiment of the application.
  • 20 is a schematic diagram of another coupling feed structure provided by an embodiment of the application.
  • FIG. 21 is a schematic diagram of a feeder network provided by an embodiment of this application.
  • FIG. 22 is a schematic diagram of performance simulation of an antenna unit provided by an embodiment of this application.
  • FIG. 23 is a schematic diagram of performance simulation of another antenna unit provided by an embodiment of this application.
  • FIG. 24 is a schematic diagram of performance simulation of another antenna unit provided by an embodiment of this application.
  • FIG. 25 is a schematic diagram of an AiP structure provided by an embodiment of this application.
  • the packaged antenna system provided in the embodiments of the present application can be applied to various communication devices, such as terminal devices, network devices, and so on.
  • the terminal device may be a device with a wireless transceiver function or a chip that can be installed in any device, and may also be called a user equipment (UE), an access terminal, a user unit, a user station, a mobile station, Mobile station, remote station, remote terminal, mobile device, user terminal, wireless communication device, user agent or user device.
  • UE user equipment
  • the terminal equipment in the embodiments of the present application may be a mobile phone (mobile phone), a tablet computer (Pad), a computer with wireless transceiver function, a virtual reality (VR) terminal, an augmented reality (AR) terminal, an industrial Wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical, wireless terminals in smart grid, transportation safety
  • Network equipment which can be wireless access equipment under various standards, such as evolved Node B (eNB), radio network controller (RNC) or Node B (NB), base station control Base station controller (BSC), base transceiver station (BTS), home base station (for example, home evolved NodeB, or home Node B, HNB), baseband unit (BBU), wireless fidelity (
  • the access point (AP), wireless relay node, wireless backhaul node, transmission and reception point (TRP or transmission point, TP) in the wireless fidelity system in the wireless fidelity system can also be 5G ( NR) gNB or transmission point (TRP or TP) in the system, one or a group of antenna panels (including multiple antenna panels) of the base station in the 5G system, or it can also be a network node that constitutes a gNB or transmission point, such as Baseband unit (BBU), or DU under a centralized unit-distributed (CU-DU) architecture, etc.
  • BBU Baseband unit
  • CU-DU centralized
  • FIG. 1 it is a schematic structural diagram of a packaged antenna system provided by an embodiment of this application.
  • the packaged antenna system shown in FIG. 1 includes a phased antenna array composed of at least one antenna unit 110.
  • Each antenna unit 110 is connected to a power divider network through a radio frequency channel, and the power divider network includes one or more power dividers. Device.
  • the radio frequency channel may also be called a transmit/receive (TX/RX) chain
  • the power splitter may also be called a splitter/combiners (S/C).
  • the antenna units include a filter antenna structure, and the filter antenna structure is used for frequency band filtering.
  • the embodiment of the application integrates the filter antenna structure and the antenna unit to design, so that the antenna unit has the function of frequency band filtering, so there is no need to add an external filter to the radio frequency channel to achieve improvement. System integration and reduce system loss.
  • the working frequency of the antenna unit provided in the embodiment of the present application may be a millimeter wave frequency band, where the frequency range of the millimeter wave frequency band may include one or more of the following: 24.25 to 29.5 GHz; 24.25 GHz to 26.5 GHz; 26.5GHz to 29.5GHz; 27.5GHz to 28.35GHz; 24.25GHz to 27.5GHz; 27.5GHz to 29.5GHz.
  • the antenna unit provided in the embodiment of the present application may also work at other frequencies, and the examples are not described here.
  • the radio frequency channel in FIG. 1 may include one or more radio frequency front-end devices, such as a switch ), power amplifier (PA), low noise amplifier (LNA), and phase shifter (PS), etc.
  • radio frequency front-end devices such as a switch ), power amplifier (PA), low noise amplifier (LNA), and phase shifter (PS), etc.
  • each radio frequency channel is connected to a radio frequency chip through a power splitter network.
  • the radio frequency chip may include a transmitter 140 and a receiver 150.
  • the radio frequency channel 120 is connected to the transmitter 140 and the receiver 150 through the power divider 130, the power divider 132, and the power divider 134 in the power divider network.
  • the transmitter 140 may include modules such as a digital to analog converter (DAC), an up-converter, and the like.
  • the transmitter 140 may be used to convert the acquired baseband signal into a radio frequency signal, and radiate outward through the antenna unit in the phased antenna array.
  • the baseband signal is converted into an analog signal by the DAC
  • the analog signal is converted into a radio frequency signal through the up-conversion processing of the up-converter.
  • the radio frequency signal is processed by PA signal amplification and other processing, and finally is selected by the antenna switch.
  • the selected antenna unit radiates outward.
  • the receiver 150 may include a down-converter, an analog-to-digital converter (analog to digital converter, ADC) and other modules.
  • the receiver 150 can convert the radio frequency signal received through the antenna unit in the phased antenna array into a baseband signal, and provide it to the baseband processor for processing. For example, after the receiver 150 receives the radio frequency signal input by the antenna unit in the phased antenna array, since the received radio frequency signal is usually very weak, it can be amplified by a low noise amplifier. The amplified signal is processed by the down-converter first, and then converted into a baseband signal by the ADC, which is then provided to the baseband processor for processing.
  • ADC analog to digital converter
  • the principle frame of the antenna unit including the filter antenna structure provided by the embodiment of the present application may be as shown in FIG. 2.
  • the antenna unit may include a radiator, a resonator module coupled to the radiator, and a feed module connected to the resonator; wherein, the feed module includes a filter antenna structure, so that Make the antenna unit have a frequency band filtering function.
  • the frequency band filtering can refer to a combination of high-pass filtering and low-pass filtering, or band-pass filtering.
  • a parasitic structure can be added between the resonator module and the radiator, which can improve the sideband suppression effect.
  • FIG. 3 it is a schematic structural diagram of an antenna unit provided by an embodiment of this application.
  • the antenna unit shown in FIG. 3 includes a radiator 301, a parasitic ring resonator 302, a feed patch 303, a metalized feed via 305, a coupling feed structure 304, a feed network 306, and so on.
  • the radiator in FIG. 2 may correspond to the radiator 301;
  • the resonator module in FIG. 2 may correspond to the parasitic ring resonator 302 and the feed patch 303, that is, the resonator module includes the parasitic ring resonator 302 and Feeder patch 303;
  • the feeder module in Figure 2 can correspond to the coupled feeder structure 304, the metalized feeder via 305, and the feeder network 306, that is, the feeder module includes a coupled feeder structure 304, a metalized feeder Electrical vias 305 and feeder network 306.
  • the feed module may include a high-pass filtering structure for realizing the high-pass filtering function, and a low-pass filtering structure for realizing the low-pass filtering function.
  • the antenna unit includes a feed module and a feed patch;
  • the feed module includes at least one layer of superimposed microstrip resonators, and the microstrip resonator includes at least Two differential feed probes, a microstrip line, and at least one microstrip patch;
  • the microstrip line included in the microstrip resonator is connected to the at least one microstrip patch through the at least one differential feed probe Chip connection;
  • the at least one microstrip patch included in the microstrip resonator is coupled with the feed patch to form a series capacitor.
  • the microstrip line part can be equivalent to a parallel inductor, so the series capacitor formed by the microstrip line and the at least one microstrip patch forms a high-pass filtering structure, so that the antenna unit has a high-pass filtering function.
  • the microstrip resonator includes two differential feed probes perpendicularly connected to each other; at least one of the two ends of the differential feed probe is connected to the at least one microstrip patch Therefore, the number of the at least one microstrip patch can be greater than or equal to 1, and less than or equal to 4.
  • both ends of the two differential feed probes of the microstrip resonator are connected to one microstrip patch.
  • the number of microstrip patches can be determined according to the actual situation.
  • the number of microstrip patches can affect the size of the capacitance formed with the feed patch, thereby affecting the filter bandwidth of the high-pass filter.
  • the feeding network 306 in the feeding module is electrically connected to the coupling feeding structure 304 through the metalized feeding via 305.
  • the feeder network 306 is a differential feeder network, it may include two polarized striplines, which are a first polarized stripline and a second polarized stripline, respectively.
  • the feeding network 306 is a single-ended feeding network, it may include a polarization strip line.
  • At least one open-circuit stub resonator may be loaded on the polarization strip line of the feed network 306, and the at least one open-circuit stub resonator forms a low-pass filtering structure, so that the antenna unit has a low-pass filtering function.
  • the coupling feed structure 304 in the feed module includes at least one microstrip patch and a microstrip line to form a structure with high-pass filtering characteristics, and the polarization band of the feed network 306 in the feed module
  • the shape line has a low-pass filtering structure, which enables the antenna unit to have a frequency band filtering function. Therefore, the antenna unit provided by the embodiment of the present application is different from the wireless package antenna system of the distributed filter structure of the traditional lumped filter structure, and integrates the filter and the antenna to design, improve the system integration, and reduce the system loss.
  • the feeding module also includes a coupling feeding structure 304, which can be coupled with the feeding patch 303.
  • FIG. 3 includes 4 cylindrical metallized power feed vias, the metallized power feed via is perpendicular to the substrate, and the point where the metallized power feed via 305 is connected to the coupling feed structure 304 can be called a metallized power feed. Via feed point.
  • the coupling feed structure 304 includes at least one layer of superimposed microstrip resonators, and the microstrip resonator includes two differential feed probes, a microstrip line, and four perpendicularly connected to each other. Two microstrip patches, the two end points of the differential feed probe are respectively connected to one of the four microstrip patches, and the microstrip line is perpendicular to the two differential feeds The connection point of the probe.
  • the four microstrip patches included in the microstrip resonator are coupled with the feed patch to form a series capacitor.
  • the microstrip line part of the microstrip resonator is arranged below the feed opening of the feed patch 303 to avoid coupling with the feed patch 303. Furthermore, due to the effect of differential excitation, the middle position of the microstrip line is equivalently short-circuited. Therefore, the microstrip line part can be equivalent to a parallel inductance, so the series capacitance formed by the microstrip line of the microstrip resonator and the microstrip patch of the microstrip resonator forms a high-pass filter structure, so that the antenna unit has a high-pass filter function .
  • the feeding network 306 is electrically connected to the coupling feeding structure 304 through the metalized feeding via 305.
  • the feeder network 306 is a differential feeder network, it may include two polarized striplines, which are a first polarized stripline and a second polarized stripline, respectively.
  • the feeding network 306 is a single-ended feeding network, it may include a polarization strip line.
  • at least one open-circuit branch-type resonator forming a low-pass filter structure is loaded on the polarization strip line of the feed network 306, so that the antenna unit has a low-pass filter function.
  • the filter antenna structure can also be implemented in other ways, which will not be illustrated one by one here.
  • connection relationship between the structures included in the antenna unit can be referred to as shown in FIG. 3.
  • the antenna unit shown in FIG. 3 has a multilayer substrate.
  • a 4-layer substrate is taken as an example for description.
  • the antenna unit shown in Fig. 3 may include five layers of substrates, from top to bottom, the first layer to the fifth layer, and the thicknesses are H1, H2, H3, H4, H5.
  • the embodiment of the present application does not limit the material of the substrate.
  • the dielectric constant of the substrate may be 3.19, and the dielectric tangent loss may be 0.003.
  • a radiator 301 is provided on the first substrate, and the radiator 301 can be used to radiate signals.
  • the radiator may also have other names, such as parasitic patches.
  • the embodiment of the present application does not limit the implementation of the radiator.
  • the radiator 301 includes four sub-patches, each of the four sub-patches has the same shape and size, and adjacent sub-patches The distance between patches is also the same.
  • the radiator 301 may be printed on the upper surface of the first layer substrate.
  • the parasitic ring resonator 302 and the feed patch 303 are arranged on the second substrate.
  • the parasitic ring resonator 302 may be a ring-shaped metal patch, or may be a metal patch of other shapes.
  • the feeding patch 303 may be a metal patch having a symmetrical shape.
  • the parasitic ring resonator 302 may be printed on the upper surface of the second-layer substrate, and the feed patch 303 may be printed on the lower surface of the second-layer substrate.
  • the parasitic ring resonator 302 is located between the radiator 301 and the feeding patch 303, and is coupled to the radiator 301 and the feeding patch 303, respectively.
  • the parasitic ring resonator 302 can also be printed on the lower surface of the second layer substrate, and correspondingly, the power feeding patch 303 is printed on the upper surface of the second layer substrate.
  • the feeding patch 303 is located between the radiator 301 and the parasitic ring resonator 302, and the feeding patch 303 is coupled to the radiator 301 and the parasitic ring resonator 302, respectively.
  • the parasitic ring resonator 302 has the function of enhancing the edge roll-off of filtering.
  • an additional radiation suppression zero point can be introduced, and the frequency selectivity of the passband edge can be enhanced.
  • a coupling feed structure 304 is provided on the third layer of the substrate, and the coupling feed structure may also have other names, such as a " ⁇ " type coupling feed structure, etc., which are not limited in the embodiment of the present application.
  • the coupling feed structure 304 is printed on the lower surface of the third-layer substrate, and is connected downward to the feed network 306 through at least one metalized feed via 305, and the coupling feed structure 304 is coupled with the feed patch 303 at the same time.
  • FIG. 3 includes 4 cylindrical metallized power feed vias, the metallized power feed via is perpendicular to the substrate, and the point where the metallized power feed via 305 is connected to the coupling feed structure 304 can be called a metallized power feed. Via feed point.
  • the coupling feed structure 304 includes at least one layer of superimposed microstrip resonators, and the four microstrip patches included in the microstrip resonator are coupled with the feed patch to form a series capacitor.
  • the microstrip line part of the microstrip resonator is arranged under the feeding opening of the feeding patch 303 to avoid coupling with the feeding patch 303.
  • a feeding network 306 is provided on the fourth-layer substrate, and the feeding network 306 is electrically connected to the coupling feeding structure 304 through the metalized feeding via 305.
  • the feeder network 306 is a differential feeder network, it may include two polarized striplines, which are a first polarized stripline and a second polarized stripline, respectively.
  • the feeding network 306 is a single-ended feeding network, it may include a polarization strip line.
  • At least one open stub resonator is loaded on the polarization strip line of the feed network 306, and the at least one open stub resonator forms a low-pass filtering structure, so that the filter antenna has a low-pass filtering function.
  • the fifth layer of the substrate may refer to the port connected to the feed network, etc.
  • the filter antenna provided by the embodiments of the present application includes a coupling feed structure with high-pass filtering characteristics, a parasitic ring resonator with enhanced filter edge roll-off, and a feed network with low-pass filtering characteristics, which can make
  • the filter antenna has a filtering function and realizes the band-pass filtering characteristics of high roll-off and wide stop band.
  • a radiator is set in the filter antenna to improve the sideband suppression effect. Therefore, the filter antenna provided by the embodiment of the present application is different from the traditional lumped filter structure of the distributed filter structure wireless transceiving system, and the filter and the antenna are integrated to design to improve the system integration and reduce the system loss.
  • the radiator 301 is a metal patch with a symmetrical shape, and the shape of the radiator 301 may be a symmetrical shape such as a square, a circle, or a prism.
  • FIG. 4 a schematic diagram of a radiator provided by an embodiment of this application.
  • the shape of the radiator in FIG. 4 is square.
  • Figure 4 is just an example, and other cases are not examples one by one.
  • the middle of the radiator 301 may further include an opening.
  • the radiator can introduce out-of-band radiation and suppress the zero point.
  • the shape of the opening may have symmetry.
  • a radiator 301 including an opening may be as shown in FIG. 5.
  • the shape of the radiator in FIG. 5 is a square, and the shape of the opening in the radiator is also a square.
  • FIG. 5 is only an example, and the shape of the opening of the radiator can also be a circle or the like, and the examples are not given here.
  • the four corners of the radiator 301 may also have gaps of the same shape.
  • the impedance bandwidth of the radiator can be improved.
  • the radiator 301 with four corners including notches may be as shown in FIG. 6.
  • Fig. 6 is only an example, and the shapes of the notches provided at the four corners of the radiator can also be other shapes, and the examples are not given here.
  • the radiator 301 may further include multiple sub-patches.
  • the radiator 301 includes four sub-patches, and the shape formed by the four sub-patches has symmetry.
  • Each of the four sub-patches has the same shape and size, and the distance between adjacent sub-patches is also the same.
  • the side length of the radiator 301 is W2
  • each sub-pattern included in the radiator 301 is square, and the side length is W1
  • the distance between adjacent sub-patches is WS, where WS, W1 and W2
  • the specific value can be determined according to the working frequency band of the antenna unit.
  • the radiator 301 may also be composed of 9 sub-patches with the same shape and size, or may be composed of 16 sub-patches with the same shape and size. The number is not limited, and will not be illustrated one by one here.
  • the parasitic ring resonator 302 in the antenna unit has the function of enhancing the edge roll-off of filtering.
  • the parasitic ring resonator 302 is coupled with the feed patch 303, an additional radiation suppression zero point can be introduced, and the frequency selectivity of the passband edge can be enhanced.
  • the shape of the parasitic ring resonator 302 shown in FIG. 3 is a square ring.
  • the shape of the parasitic ring resonator shown in FIG. 8 is a square ring, and the width of each side is WL.
  • the shape of the parasitic ring resonator 302 is not limited, and may be a ring structure of any shape.
  • the shape of the parasitic ring resonator shown in FIG. 9 is a circular ring.
  • the shape of the parasitic ring resonator shown in FIG. 10 is a double I-shape.
  • Figures 8 to 10 are just examples, and other shapes of the parasitic ring resonator will not be illustrated one by one.
  • the feeding patch 303 can control the frequency of the low-frequency radiation suppression zero point.
  • the feeding patch 303 is a metal patch with a symmetrical shape, and the middle of the feeding patch 303 includes a feeding opening with a symmetrical shape.
  • the shape of the power feeding opening in the power feeding patch 303 shown in FIG. 3 is a square.
  • FIG. 11 For clearer description, reference may be made to FIG. 11 for details.
  • the power feeding patch shown in FIG. 11 has the same shape as the power feeding patch in FIG. 3, and the shape of the power feeding opening in the power feeding patch shown in FIG. 11 is a square.
  • the feed patch 303 and the parasitic ring resonator 302 are attached to a layer of substrate, refer to FIG. 12.
  • the feed patch 303 and the parasitic ring resonator 302 are respectively located on the upper surface and the lower surface of a layer of substrate, and the four corners of the parasitic ring resonator 302 are respectively located in the middle of the four sides of the feed patch 303 .
  • the parasitic ring resonator 302 is a square ring, and the width of each side is WL.
  • the power feeding patch 303 is square, and the side length of the power feeding patch is W3, the power feeding opening in the power feeding patch is square, and the side length of the power feeding opening is W4.
  • the frequency of the radiation suppression zero point can be adjusted by changing the size of the feeding opening in the feeding patch and the size of the microstrip resonator in the coupling feeding structure.
  • the side length of the feeding opening is equal to one-eighth wavelength of the low-frequency zero-frequency signal
  • the microstrip resonator in the feeding structure is coupled at the same time.
  • the length of the strip line is equal to the side length of the feed opening.
  • the size of the microstrip patch in the microstrip resonator can be adjusted to further control the zero position and impedance matching.
  • the shape of the power feeding opening on the power feeding patch 303 may also be other symmetrical shapes, including but not limited to a square, a circle, a diamond, a double I-shape, and the like.
  • the power feeding patch 303 in FIG. 13 includes a circular power feeding opening.
  • the feeding patch 303 in FIG. 14 includes a prismatic feeding opening.
  • the feed patch 303 in FIG. 15 includes a double I-shaped feed opening.
  • the coupling feed structure 304 has a high-pass filter function, is coupled with the feed patch 303, and is electrically connected to the feed network 306 through the metalized feed via 305.
  • the coupling feed structure 304 shown in FIG. 16 includes a microstrip resonator.
  • the microstrip resonator includes two mutually perpendicular differential feed probes, a microstrip line and four microstrip patches, wherein the two end points of each differential feed probe are connected to the four One of the microstrip patches is connected.
  • the coupling feed structure 304 of this structure can realize a differential excitation function.
  • the intersection of two mutually perpendicular differential feed probes is connected to a microstrip line.
  • the microstrip line is a metal wire with a specific length, perpendicular to the two differential feed probes.
  • the length of the microstrip line can be equal to the side length of the feed opening in the feed patch.
  • the microstrip patch and the microstrip line at the two ends of a differential feed probe can form a stepped impedance resonator structure. Since the microstrip patch is placed under the metal part of the feed patch 303, capacitive coupling is formed and the component of series capacitance is introduced; the microstrip line is placed under the feed opening in the middle of the feed patch 303 to avoid contact with the feeder. The electrical patch 303 is coupled.
  • the middle position of the microstrip line is equivalently short-circuited, so the microstrip line part can be equivalent to a parallel inductance, which forms an equivalent high-pass filter circuit with the series capacitance provided by the previous microstrip patch, which can effectively suppress Radiation in the low frequency band of the antenna
  • the current flowing on the edge of the notch on the feed patch and the current distributed on the microstrip resonator form a loop, so that the current on the feed patch is concentrated in the middle area and not to the center.
  • Edge radiation so that the lower side of the gain curve operating frequency band introduces a radiation suppression zero point to improve the edge roll-off effect of filtering, and the size of the feed opening in the feed patch 303 and the size of the microstrip resonator structure can be changed. Adjust the frequency of the radiation suppression zero point.
  • each differential feed probe also include metallized feed via feed points.
  • the metallized feed via feed points are the metallized feed via 305 and the coupling feed.
  • the shape of the microstrip patch is square, and the shape of the microstrip patch can also be other symmetrical shapes, such as circular or prismatic shapes.
  • the shape of the microstrip patch is circular.
  • the shape of the microstrip patch is prismatic.
  • the vacant positions around the two mutually perpendicular differential feed probes include at least one parasitic ground hole, so that the quality factor of the microstrip resonator can be improved, and the edge of the gain curve can fall more steeply.
  • the parasitic ground holes can also be distributed around the differential feed probes in other ways, for example, as shown in FIG. 19.
  • the coupling feed structure 304 may also include a multilayer microstrip resonator. Two adjacent layers of microstrip resonators are connected through at least one metal via provided in the microstrip patch. With reference to FIG. 19, the metal vias may be located in the microstrip patch, and each microstrip patch may include a plurality of metal vias. As shown in FIG. 20, it is a 3D view of a coupling feed structure 304 including a 3-layer microstrip resonator.
  • the feed network 306 shown in FIG. 21 is a differential feed network and includes a first polarization strip line 3061 and a second polarization strip line 3062.
  • the feeding network 306 may also be a single-ended feeding network, which is not shown here.
  • each polarized strip line in the feed network 306 is connected to a differential feed probe of the coupling feed structure 304 through the metalized feed via 305, it is extended for a certain length and then connected to At the other end of the differential feed probe, the extended length is the half-wave length of the center frequency of the working frequency band of the antenna unit, that is, L13 in FIG. 21.
  • the connection point between the polarization strip line and the metalized feed via 305 may be referred to as the metalized feed via feed point.
  • the distance between the two metallization feed via feed points connected by the first polarization stripline 3061 is L11
  • the distance between the two metallization feed via feed points connected by the second polarization stripline 3062 The distance is L12.
  • the widths of the first polarization strip line 3061 and the second polarization strip line 3062 are WF.
  • At least one open stub resonator is loaded on the first polarization strip line 3061 and the second polarization strip line 3062.
  • each polarization stripline is loaded with 4 open-circuit stub resonators as an example.
  • the lengths of the four open-circuit stub resonators are L10, L8, L6, and L4, as shown in Fig. 21 ,
  • the distances of the 4 open-circuit branch-type resonators are respectively L9, L7 and L5.
  • the above WF and the specific values of L4 to L13 can be determined according to the working frequency band of the antenna unit.
  • At least one parasitic ground hole is included around the connection point of the polarized strip line and the metalized feed via 305.
  • the parasitic ground hole connects the upper and lower metal floors to enhance the isolation between the ports and reduce the metalization. Insertion loss caused by the feed via 305.
  • the working frequency band of the antenna unit provided by the embodiment of the present application is 24-30 GHz
  • the specific values of the dimensions marked in FIGS. 3 to 21 may be as follows:
  • the specific size of the antenna unit can be adjusted to adapt to the receiving and transmitting equipment of the wireless communication system of different frequency bands.
  • the simulation schematic diagram of the antenna performance can be as shown in Figure 22 to Figure 24.
  • FIG. 22 it is a graph of low-frequency sideband gains under different conditions compared with the embodiments of the present application.
  • Figure 22 shows the simulation results in 4 different situations.
  • the 4 situations are: 1.
  • the antenna unit is not loaded with a parasitic ring resonator, and the coupling feed structure of the antenna unit is not loaded with a parasitic ground hole; 2.
  • the antenna unit is loaded with a parasitic ring resonator, but the coupling feed structure of the antenna unit is not loaded with a parasitic ground hole; 3.
  • the antenna unit is not loaded with a parasitic ring resonator, but the antenna unit is loaded with a parasitic ground in the middle and around the free position of the coupling feed structure Hole; 4, the antenna unit is loaded with a parasitic ring resonator, and the parasitic ground hole is loaded in the middle and around the free position of the coupling feed structure of the antenna unit.
  • Fig. 22 when the antenna unit is loaded with a parasitic ring resonator, and when a parasitic ground hole is loaded in the middle and surrounding vacant positions of the coupling feed structure, the edge roll-off effect of the filter can be improved. At the same time, two ways to improve the edge roll-off can be used to increase the suppression capability at 22.5GHz by 14dB without introducing additional insertion loss.
  • FIG. 23 it is a simulation result diagram of the reflection coefficient of the antenna unit provided by the embodiment of the present application.
  • the working frequency band of the antenna unit is 24-30 GHz, good impedance matching can be achieved.
  • FIG. 24 it is a graph of the simulation result of the gain curve of the antenna unit provided by the embodiment of the application.
  • the antenna gain is stable, and both are above 5.8dBi, reaching 22% relative Bandwidth; both sides of the passband have high roll-off filtering characteristics, and achieve a filtering suppression exceeding 25dB from 0-22.5GHz, and a wide stopband filtering suppression exceeding 25dB from 34-60GHz.
  • the roll-off of the low-frequency sideband is significantly improved.
  • the embodiment of the present application also provides an AiP.
  • the AiP in Figure 25 integrates a 4x4 phased antenna array, which includes a total of 16 antenna elements.
  • each antenna element please refer to the previous description. It should be noted that the number of antenna elements included in the phased antenna array in the AiP in FIG. 25 is only an example, and other numbers of antenna elements may also be included.
  • the phased antenna array in AiP can be connected to the radio frequency chip.
  • the AiP in FIG. 25 also includes other structures.

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Abstract

一种集成滤波功能的封装天线系统及通信设备，包括：射频芯片，与所述射频芯片连接的功分器网络，与所述功分器网络连接的多个射频通道，以及与所述多个射频通道连接的相控天线阵列；所述相控天线阵列包括多个天线单元，所述天线单元中部分或全部天线单元包括滤波天线结构，所述滤波天线结构用于频带滤波，所述频带包括毫米波频带。本申请提供的封装天线系统中，在相控天线阵列中集成用于频带滤波功能的滤波天线结构，使得天线单元具有滤波功能，因此与天线单元耦合的射频通道不再需要在外部连接滤波器，从而能够提升系统集成度，减少为射频通道单独设计滤波器所需的封装体积。

Description

一种集成滤波功能的封装天线系统及通信设备 技术领域
本申请涉及天线技术领域，特别涉及一种封装天线系统及通信设备。
背景技术
天线是无线通信中设备之间的通信所需的重要部件，天线的基本构成有反射板、辐射体、馈电线(用来将射频信号接入天线)以及引向器等。天线的主要指标有带宽、增益、极化方式等。其中带宽越宽代表天线可以支持更多的工作频段，从而支持更高的信道容量传输。在5G毫米波通信中，28GHz频段、39GHz频段和60GHz频段都将成为高速无线通信网络的标准频段。在这些高频段，信号的波长尺寸已经小于芯片封装体尺寸，因此天线尺寸可以做到很小，这样具备了在封装体上直接设计天线的可行性。为了实现高频天线性能，同时多路收发的高集成度以及减小链路损耗，一种新的天线技术被推出，这便是封装天线(antenna in package，AiP)，AiP为包括一个独立的收发器(transceiver)以及天线阵列的芯片。
AiP的射频引线更短，因此馈电损耗会更小，同时由于天线直接设计在封装上，天线整体也会更紧凑，系统集成度会更高。然而，为了降低信号的杂散和提高抗阻塞性能，需要在AiP外部为每个射频通道配置一个选频滤波器。此时配置的滤波器的数量需要与射频通道的数量相同，由于在射频通道所处的电路板中设置滤波器时，需要为每个滤波器配置对应的封装管脚，在射频通道的数量较多时，没有足够的封装管脚，无法为每个时频通道配置一个滤波器，导致射频通道的性能下降。而且滤波器的数量越多，不利于设备体积的小型化。最重要的一点，由于滤波器与射频通道之间需要连接线连接，导致射频通道与滤波器之间的路径损耗非常大，降低了通信性能。
发明内容
本申请实施方式的目的在于提供一种封装天线系统及通信设备，以提高系统性能。
第一方面，提供了一种封装天线系统，包括：
射频芯片，与所述射频芯片连接的功分器网络，与所述功分器网络连接的多个射频通道，以及与所述多个射频通道连接的相控天线阵列；所述相控天线阵列包括多个天线单元，所述天线单元中部分或全部天线单元包括滤波天线结构，所述滤波天线结构用于频带滤波，所述频带包括毫米波频带。其中，所述射频芯片包括上变频器和下变频器，所述功分器网络包括一个或多个功分器，所述多个射频通道的每个射频通道均包括一个或多个射频前端器件。
本申请提供的封装天线系统中，在相控天线阵列中集成用于频带滤波功能的滤波天线结构，使得天线单元具有滤波功能，因此与天线单元耦合的射频通道不再需要在外部连接滤波器，从而能够提升系统集成度，减少为射频通道单独设计滤波器所需的封装体积。
一种可选的实现方式中，所述滤波天线结构可以用于辐射毫米波频带的信号，以及接收毫米波频带的信号；所述滤波天线结构还可以对毫米波频带的信号进行频带滤波。
一种可选的实现方式中，所述滤波天线结构包括高通滤波结构以及低通滤波结构。
一种可选的实现方式中，所述天线单元包括馈电模块以及馈电贴片；
所述馈电模块包括至少一层叠加的微带谐振器，所述微带谐振器包括至少两个差分馈电探针、微带线以及至少一个微带贴片；
所述微带谐振器包括的所述微带线通过所述至少一个差分馈电探针与所述至少一个微带贴片连接；
所述微带谐振器包括的所述至少一个微带贴片与所述馈电贴片耦合，构成串联电容，所述微带线与所述串联电容构成所述高通滤波结构。
一种可选的实现方式中，所述微带谐振器包括两根相互垂直相接的差分馈电探针；
所述差分馈电探针的两个端点中的至少一个端点与所述至少一个微带贴片中的一个微带贴片连接；
所述至少一个微带贴片的数量为大于或等于1，且小于或等于4。
一种可选的实现方式中，所述馈电模块包括耦合馈电结构；所述耦合馈电结构与所述谐振器模块耦合；
所述耦合馈电结构包括至少一层叠加的微带谐振器，所述微带谐振器包括两根相互垂直相接的差分馈电探针、微带线以及至少一个微带贴片，所述差分馈电探针的两个端点分别与所述至少一个微带贴片中的一个微带贴片连接，所述微带线垂直于所述两根差分馈电探针的连接处。
一种可选的实现方式中，所述毫米波频带的频率范围包括24.25GHz至29.5GHz。
一种可选的实现方式中，所述毫米波频带的频率范围包括24.25GHz至26.5GHz。
一种可选的实现方式中，所述毫米波频带的频率范围包括26.5GHz至29.5GHz。
一种可选的实现方式中，所述毫米波频带的频率范围包括27.5GHz至28.35GHz。
一种可选的实现方式中，所述毫米波频带的频率范围包括24.25GHz至27.5GHz。
一种可选的实现方式中，所述毫米波频带的频率范围包括27.5GHz至29.5GHz。
一种可选的实现方式中，所述天线单元工作的频率位于第三代合作伙伴计划3GPP新无线电NR的技术规范的频率范围2。
一种可选的实现方式中，所述天线单元还包括辐射体、与所述辐射体耦合的谐振器模块，且所述谐振器与所述馈电模块连接；
所述谐振器模块包括寄生环形谐振器以及馈电贴片；
所述寄生环形谐振器位于所述辐射体与所述馈电贴片之间，并分别与所述辐射体以及所述馈电贴片耦合，或者，所述馈电贴片位于所述辐射体与所述寄生环形谐振器之间，并分别与所述辐射体与所述寄生环形谐振器耦合。
一种可选的实现方式中，所述辐射体为具有对称形状的金属贴片。
一种可选的实现方式中，所述谐振器模块包括寄生环形谐振器以及馈电贴片；
所述寄生环形谐振器位于所述辐射体与所述馈电贴片之间，并分别与所述辐射体以及所述馈电贴片耦合，或者，所述馈电贴片位于所述辐射体与所述寄生环形谐振器之间，并分别与所述辐射体与所述寄生环形谐振器耦合。
一种可选的实现方式中，所述寄生环形谐振器为方环形的金属贴片，或者为圆环行的金属贴片，或者为双工字形的金属贴片。
一种可选的实现方式中，所述馈电贴片为具有对称形状的金属贴片，且所述馈电贴片的中间包括具有对称形状的馈电开口。
一种可选的实现方式中，所述馈电开口的形状为正方形或圆形或双工字形。
所述耦合馈电结构至少两层微带谐振器时，所述至少两层叠加的微带谐振器中相邻两层微带谐振器通过设置在微带贴片中的至少一个金属过孔相连接。
一种可选的实现方式中，所述微带贴片的形状为方形或圆形或棱形。
一种可选的实现方式中，所述微带谐振器的中间以及四周空余位置包括至少一个寄生接地孔。
第二方面，本申请提供一种通信设备，包括：基带芯片以及上述任一项封装天线系统。所述基带芯片与所述封装天线系统。
所述通信设备还可以包括存储器，基带芯片可以与所述存储器耦合。
所述存储器用于存储指令，所述基带芯片用于执行所述存储器存储的指令，并对通过封装天线系统获得的信号进行处理，或者通过所述封装天线系统发送信号。
所述通信设备还可以包括应用处理器、显示屏等模块。
应理解，本申请实施例提供的通信设备，可以是无线通信设备，也可以是无线通信设备中的部分器件，如系统芯片或通信芯片等集成电路产品。无线通信设备可以是支持无线通信功能的计算机设备。
具体地，无线通信设备可以是诸如智能手机这样的终端，也可以是诸如基站这样的无线接入网设备。系统芯片也可称为片上系统(system on chip，SoC)，或简称为SoC芯片。通信芯片可包括基带芯片和射频处理器。基带芯片有时也被称为调制解调器(modem)或基带处理器。射频处理器有时也被称为射频收发机(transceiver)或射频芯片。在物理实现中，通信芯片中的部分芯片或者全部芯片可集成在SoC芯片内部。例如，基带芯片集成在SoC芯片中，射频处理器不与SoC芯片集成。
附图说明
图1为本申请实施例提供的一种封装天线系统的结构示意图；
图2为本申请实施例提供的天线单元的原理框体；
图3为本申请实施例提供的一种天线单元的结构示意图；
图4为本申请实施例提供的一种辐射体示意图；
图5为本申请实施例提供的另一种辐射体示意图；
图6为本申请实施例提供的另一种辐射体示意图；
图7为本申请实施例提供的另一种辐射体示意图；
图8为本申请实施例提供的一种寄生环形谐振器示意图；
图9为本申请实施例提供的另一种寄生环形谐振器示意图；
图10为本申请实施例提供的另一种寄生环形谐振器示意图；
图11为本申请实施例提供的一种馈电贴片示意图；
图12为本申请实施例提供的另一种馈电贴片示意图；
图13为本申请实施例提供的另一种馈电贴片示意图；
图14为本申请实施例提供的另一种馈电贴片示意图；
图15为本申请实施例提供的另一种馈电贴片示意图；
图16为本申请实施例提供的一种耦合馈电结构示意图；
图17为本申请实施例提供的另一种耦合馈电结构的示意图；
图18为本申请实施例提供的另一种耦合馈电结构的示意图；
图19为本申请实施例提供的另一种耦合馈电结构的示意图；
图20为本申请实施例提供的另一种耦合馈电结构的示意图；
图21为本申请实施例提供的一种馈电网络示意图；
图22为本申请实施例提供的一种天线单元性能仿真示意图；
图23为本申请实施例提供的另一种天线单元性能仿真示意图；
图24为本申请实施例提供的另一种天线单元性能仿真示意图；
图25为本申请实施例提供的一种AiP结构示意图。
具体实施方式
下面将结合附图对本申请实施例作进一步地详细描述。
下面结合附图并举实施例，对本申请提供的技术方案作进一步说明。应理解，本申请实施例中提供的系统结构和业务场景主要是为了解释本申请的技术方案的一些可能的实施方式，不应被解读为对本申请的技术方案的唯一性限定。本领域普通技术人员可以知晓，随着系统的演进，以及更新的业务场景的出现，本申请提供的技术方案对于相同或类似的技术问题仍然可以适用。
应理解，本申请实施例提供的技术方案，在以下具体实施例的介绍中，某些重复之处可能不再赘述，但应视为这些具体实施例之间已有相互引用，可以相互结合。
本申请实施例提供的封装天线系统可以应用于各种通信设备中，例如终端设备、网络设备等。其中，终端设备，可以为具有无线收发功能的设备或可设置于任一设备中的芯片，也可以称为用户设备(user equipment，UE)、接入终端、用户单元、用户站、移动站、移动台、远方站、远程终端、移动设备、用户终端、无线通信设备、用户代理或用户装置。本申请实施例中的终端设备可以是手机(mobile phone)、平板电脑(Pad)、带无线收发功能的电脑、虚拟现实(virtual reality，VR)终端、增强现实(augmented reality，AR)终端、工业控制(industrial control)中的无线终端、无人驾驶(self driving)中的无线终端、远程医疗(remote medical)中的无线终端、智能电网(smart grid)中的无线终端、运输安全(transportation safety)中的无线终端、智慧城市(smart city)中的无线终端、智慧家庭(smart home)中的无线终端等等。
网络设备，可以为各种制式下无线接入设备，例如演进型节点B(evolved Node B，eNB)、无线网络控制器(radio network controller，RNC)或节点B(Node B，NB)、基站控制器(base station controller，BSC)、基站收发台(base transceiver station，BTS)、家庭基站(例如，home evolved NodeB，或home Node B，HNB)、基带单元(baseband unit，BBU)，无线保真(wireless fidelity，WIFI)系统中的接入点(access point，AP)、无线中继节点、无线回传节点、传输点(transmission and reception point，TRP或者transmission point，TP)等，还可以为5G(NR)系统中的gNB或传输点(TRP或TP)，5G系统中的基站的一个或一组(包括多个天线面板)天线面板，或者，还可以为构成gNB或传输点的网络节点，如基带单元(BBU)，或在集中式-分布式(central unit-distributed，CU-DU)架构下的DU等。
本申请实施例描述的网络架构以及业务场景是为了更加清楚的说明本申请实施例的技术方案，并不构成对于本申请实施例提供的技术方案的限定，本领域普通技术人员可知，随着网络架构的演变和新业务场景的出现，本申请实施例提供的技术方案对于类似的技术 问题，同样适用。
如图1所示，为本申请实施例提供的一种封装天线系统的结构示意图。图1中所示的封装天线系统包括由至少一个天线单元110构成的相控天线阵列，每个天线单元110通过一个射频通道与功分器网络连接，功分器网络包括一个或多个功分器。
其中，射频通道还可以称为发射/接收(transmit/receive，TX/RX)链(chain)，功分器还可以称为分路器/合路器(splitters/combiners，S/C)。
本申请实施例中，天线单元中部分或全部天线单元包括滤波天线结构，所述滤波天线结构用于频带滤波。区别于传统集总式滤波结构的无线封装天线系统，本申请实施例将滤波天线结构与天线单元集成设计，使得天线单元具有频带滤波的功能，从而不需要额外在射频通道外接滤波器，实现提升系统集成度，并降低系统损耗。
需要说明的是，本申请实施例提供的天线单元的工作频率可以为毫米波频带，其中，毫米波频带的频率范围可以包括以下一项或多项：24.25至29.5GHz；24.25GHz至26.5GHz；26.5GHz至29.5GHz；27.5GHz至28.35GHz；24.25GHz至27.5GHz；27.5GHz至29.5GHz。
当然，本申请实施例提供的天线单元还可以工作在其它频率，在此不再逐一举例说明。
需要说明的是，图1中的射频通道的具体结构，本申请实施例并不限定，例如，一种可能的实现方式中，射频通道可以包括一个或多个射频前端器件，例如切换开关(switch)，功率放大器(power amplifier，PA)，低噪声放大器(low noise amplifier，LNA)，以及移相器(phase shifter，PS)等。
图1中，每个射频通道经过功分器网络与射频芯片连接，射频芯片可以包括发射器140以及接收器150。例如，图1中，射频通道120经过功分器网络中的功分器130、功分器132以及功分器134与发射器140以及接收器150连接。
其中，发射器140，可以包括数模转换器(digital to analog converter，DAC)、上变频器等模块。发射器140可以用于将获取到的基带信号转换为射频信号，并通过相控天线阵列中的天线单元向外辐射。举例来说，基带信号经过DAC变为模拟信号后，该模拟信号经过上变频器的上变频处理变为射频信号，该射频信号经过PA的信号放大等处理，最终经过天线切换开关的选择，从选择的天线单元向外辐射。
基带信号在发射器140中，还可能存在其他处理过程，在此不再赘述。
接收器150，可以包括下变频器、模数转换器(analog to digital converter，ADC)等模块。接收器150可以将通过相控天线阵列中的天线单元接收到的射频信号，转换为基带信号，提供给基带处理器进行处理。举例来说，接收器150接收到相控天线阵列中的天线单元输入的射频信号后，由于接收的射频信号通常很微弱，可以通过低噪声放大器进行放大处理。放大后的信号先经过下变频器的下变频处理，再经过ADC转换为基带信号，提供给基带处理器进行处理。
以上只是示例，发射器140与接收器150的具体实现方式以及功能，本申请实施例并不限定，在此不再赘述。
本申请实施例提供的包括滤波天线结构的天线单元的原理框体可以如图2所示。本申请实施例中，天线单元可以包括辐射体、与所述辐射体耦合的谐振器模块，以及与所述谐振器连接的馈电模块；其中，所述馈电模块包括滤波天线结构，从而可以使得天线单元具有频带滤波功能。其中频带滤波可以是指高通滤波和低通滤波的组合，也可以是指带通滤波。进一步的，在谐振体模块和辐射体之间可以加入寄生结构，可以提升边带抑制效果。
结合图2，如图3所示，为本申请实施例提供的一种天线单元的结构示意图。图3所示的天线单元包括辐射体301、寄生环形谐振器302、馈电贴片303、金属化馈电过孔305、耦合馈电结构304、馈电网络306等。
其中，图2中的辐射体，可以对应于辐射体301；图2中的谐振器模块，可以对应于寄生环形谐振器302以及馈电贴片303，即谐振器模块包括寄生环形谐振器302以及馈电贴片303；图2中的馈电模块，可以对应于耦合馈电结构304、金属化馈电过孔305以及馈电网络306，即馈电模块包括耦合馈电结构304、金属化馈电过孔305以及馈电网络306。
本申请实施例中，馈电模块中可以包括用于实现高通滤波功能的高通滤波结构，以及用于实现低通滤波功能的低通滤波结构。
举例来说，一种可能的实现方式中，所述天线单元包括馈电模块以及馈电贴片；所述馈电模块包括至少一层叠加的微带谐振器，所述微带谐振器包括至少两个差分馈电探针、微带线以及至少一个微带贴片；所述微带谐振器包括的所述微带线通过所述至少一个差分馈电探针与所述至少一个微带贴片连接；所述微带谐振器包括的所述至少一个微带贴片与所述馈电贴片耦合，构成串联电容。微带线部分可等效为并联电感，因此微带线与所述至少一个微带贴片形成的串联电容构成高通滤波结构，从而使得天线单元具有高通滤波功能。
示例性的，所述微带谐振器包括两根相互垂直相接的差分馈电探针；所述差分馈电探针的两个端点中的至少一个端点与所述至少一个微带贴片中的一个微带贴片连接；因此，所述至少一个微带贴片的数量可以大于或等于1，且小于或等于4。
示例性的，所述微带谐振器的两个差分馈电探针的两个端点中均与一个微带贴片连接。
微带贴片的数量可以根据实际情况确定，微带贴片的数量可以影响与馈电贴片构成的电容的大小，从而影响高通滤波的滤波带宽。
进一步的，馈电模块中的馈电网络306通过金属化馈电过孔305与耦合馈电结构304电连接。馈电网络306为差分馈电网络时，可以包括两个极化带状线，分别为第一极化带状线和第二极化带状线。馈电网络306为单端馈电网络时，可以包括一个极化带状线。
馈电网络306的极化带状线上可以加载至少一根开路枝节型谐振器，所述至少一根开路枝节型谐振器构成低通滤波结构，使得天线单元具有低通滤波功能。
通过上面的描述可知，馈电模块中的耦合馈电结构304包括的至少一个微带贴片与微带线构成具有高通滤波特性的结构，同时馈电模块中的馈电网络306的极化带状线具有低通滤波结构，可以使得天线单元具有频带滤波功能。因此，本申请实施例提供的天线单元，区别于传统集总式滤波结构的分布式滤波结构无线封装天线系统，将滤波器与天线集成设计，提升系统集成度，并降低系统损耗。
馈电模块中还包括耦合馈电结构304，可以与馈电贴片303耦合。其中，图3中包括4个圆柱状金属化馈电过孔，金属化馈电过孔与基板垂直，金属化馈电过孔305与耦合馈电结构304连接的点可以称为金属化馈电过孔馈点。
进一步的，本申请实施例中，耦合馈电结构304包括至少一层叠加的微带谐振器，所述微带谐振器包括两根相互垂直相接的差分馈电探针、微带线以及四个微带贴片，所述差分馈电探针的两个端点分别与所述四个微带贴片中的一个微带贴片连接，所述微带线垂直于所述两根差分馈电探针的连接处。
所述微带谐振器包括的所述四个微带贴片与所述馈电贴片耦合，构成串联电容。微带 谐振器的微带线部分设置在馈电贴片303的馈电开口的下方，避免与馈电贴片303耦合，进一步的，由于差分激励的作用，微带线中间位置等效短路，因此微带线部分可等效为并联电感，因此微带谐振器的微带线与所述微带谐振器的微带贴片形成的串联电容构成高通滤波结构，从而使得天线单元具有高通滤波功能。
馈电网络306通过金属化馈电过孔305与耦合馈电结构304电连接。馈电网络306为差分馈电网络时，可以包括两个极化带状线，分别为第一极化带状线和第二极化带状线。馈电网络306为单端馈电网络时，可以包括一个极化带状线。如前所述，馈电网络306的极化带状线上加载至少一根构成低通滤波结构的开路枝节型谐振器，使得天线单元具有低通滤波功能。
以上只是示例，天线单元的馈电模块中，还可以通过其他方式实现滤波天线结构，在此不再逐一举例说明。
本申请实施例中，天线单元包括的结构之间的连接关系可以参见图3所示。图3所示的天线单元具有多层基板。图3中以4层基板为例进行描述，图3所示的天线单元可以包括五层基板，从上至下分别为第一层基板至第五层基板，厚度分别为H1、H2、H3、H4、H5。
需要说明的是，本申请实施例对基板的材料并不限定，示例性的，基板的介电常数可以为3.19，介质正切损耗可以为0.003。
第一层基板上设置辐射体301，辐射体301可以用来辐射信号。辐射体也可能存在其他名称，例如寄生贴片等。本申请实施例对辐射体的实现方式并不限定，例如，图1中，辐射体301包括四个子贴片，所述四个子贴片中每个子贴片的形状以及大小均相同，相邻子贴片之间的距离也相同。
示例性的，辐射体301可以印刷在第一层基板上表面。
第二层基板上设置寄生环形谐振器302与馈电贴片303。寄生环形谐振器302可以为环形的金属贴片，也可以为其它形状的金属贴片。馈电贴片303可以为具有对称形状的金属贴片。
示例性的，寄生环形谐振器302可以印刷在第二层基板上表面，馈电贴片303可以印刷在第二层基板下表面。在该情况下，寄生环形谐振器302位于辐射体301与馈电贴片303之间，并分别与辐射体301以及馈电贴片303耦合。
示例性的，寄生环形谐振器302还可以印刷在第二层基板下表面，相应的，馈电贴片303印刷在第二层基板上表面。在该情况下，馈电贴片303位于辐射体301与寄生环形谐振器302之间，馈电贴片303分别与辐射体301以及寄生环形谐振器302耦合。
本申请实施例中，寄生环形谐振器302具有增强滤波的边沿滚降的功能。当寄生环形谐振器302加载在馈电贴片303上方，与馈电贴片303耦合时，可以额外引入一个辐射抑制零点，并加强通带边沿频率选择性。
第三层基板上设置耦合馈电结构304，耦合馈电结构也可以存在其他名称，例如“π”型耦合馈电结构等，本申请实施例对此并不限定。耦合馈电结构304印刷在第三层基板下表面，通过至少一个金属化馈电过孔305向下连接馈电网络306，同时耦合馈电结构304与馈电贴片303耦合。其中，图3中包括4个圆柱状金属化馈电过孔，金属化馈电过孔与基板垂直，金属化馈电过孔305与耦合馈电结构304连接的点可以称为金属化馈电过孔馈点。
耦合馈电结构304包括至少一层叠加的微带谐振器，所述微带谐振器包括的所述四个微带贴片与所述馈电贴片耦合，构成串联电容。微带谐振器的微带线部分设置在馈电贴片303的馈电开口的下方，避免与馈电贴片303耦合。
第四层基板上设置馈电网络306，馈电网络306通过金属化馈电过孔305与耦合馈电结构304电连接。馈电网络306为差分馈电网络时，可以包括两个极化带状线，分别为第一极化带状线和第二极化带状线。馈电网络306为单端馈电网络时，可以包括一个极化带状线。
馈电网络306的极化带状线上加载至少一根开路枝节型谐振器，所述至少一根开路枝节型谐振器构成低通滤波结构，使得滤波天线具有低通滤波功能。
第五层基板上可以是指与馈电网络连接的端口等。
通过上面的描述可知，本申请实施例提供的滤波天线，包括具有高通滤波特性的耦合馈电结构、增强滤波的边沿滚降的寄生环形谐振器以及具有低通滤波特性的馈电网络，可以使得滤波天线具有滤波功能，并实现高滚降、宽阻带的带通滤波特性。同时在滤波天线中设置辐射体，可以提升边带抑制效果。因此，本申请实施例提供的滤波天线，区别于传统集总式滤波结构的分布式滤波结构无线收发系统，将滤波器与天线集成设计，提升系统集成度，并降低系统损耗。
进一步的，下面将详细描述天线单元的各个部件的可能的实现方式。
辐射体：
本申请实施例中，辐射体301为具有对称形状的金属贴片，辐射体301的形状可以为方形或者圆形或者棱形等对称形状。
举例来说，如图4所示，为本申请实施例提供的一种辐射体示意图。图4中的辐射体的形状为方形。图4只是示例，其他情况不在一一举例。
示例性的，本申请实施例中，辐射体301的中间还可以包括开口。通过在辐射体301中设置开口，可以使得辐射体引入带外辐射并抑制零点。
示例性的，辐射体301的中间包括开口时，开口的形状可以具有对称性。
举例来说，一种可能的实现方式中，包括开口的辐射体301可以如图5所示。图5中的辐射体的形状为方形，且辐射体中的开口的形状也为方形。当然图5只是示例，辐射体的开口的形状还可以为圆形等形状，在此不再一一举例。
示例性的，本申请实施例中，辐射体301的形状为方形时，辐射体301的四个角还可以存在相同形状的缺口。通过在辐射体301的四个角设置缺口，可以提升辐射体的阻抗带宽。
举例来说，一种可能的实现方式中，四个角包括缺口的辐射体301可以如图6所示。图6只是示例，辐射体的四个角设置的缺口的形状还可以为其他形状，在此不再一一举例。
示例性的，本申请实施例中，辐射体301还可以包括多个子贴片。举例来说，如图7所示，辐射体301包括四个子贴片，所述四个子贴片构成的形状具有对称性。所述四个子贴片中每个子贴片的形状以及大小均相同，相邻子贴片之间的距离也相同。
图7中，辐射体301的边长为W2，辐射体301包括的每个子贴片为正方形，且边长为W1，相邻子贴片之间的距离为WS，其中WS、W1以及W2的具体取值，可以根据天线单元的工作频段确定。
图7只是示例，辐射体301还可以由9个具有相同形状和大小的子贴片组成，还可以由16个具有相同形状和大小的子贴片组成等，本申请实施例对子贴片的数量并不限定，在此不再逐一举例说明。
寄生环形谐振器：
本申请实施例中，天线单元中的寄生环形谐振器302具有增强滤波的边沿滚降的功能。当寄生环形谐振器302与馈电贴片303耦合时，可以额外引入一个辐射抑制零点，并加强通带边沿频率选择性。
本申请实施例中，图3所示的寄生环形谐振器302的形状为方形环，为了描述更加清楚，具体可以参考图8所示。图8所示的寄生环形谐振器的形状为方形环，且每个边的宽度为WL。
以上只是示例，寄生环形谐振器302的形状并不限定，可以为任意形状的环形结构。
举例来说，如图9所示，图9所示的寄生环形谐振器的形状为圆形环。
再举例来说，如图10所示，图10所示的寄生环形谐振器的形状为双工字形。
图8至图10只是示例，寄生环形谐振器的其它形状不再逐一举例说明。
馈电贴片：
本申请实施例中，馈电贴片303可以控制低频辐射抑制零点的频率，馈电贴片303为具有对称形状的金属贴片，馈电贴片303的中间包括具有对称形状的馈电开口。本申请实施例中，图3所示的馈电贴片303中馈电开口的形状为方形，为了描述更加清楚，具体可以参考图11所示。图11所示的馈电贴片与图3中的馈电贴片的形状相同，图11所示的馈电贴片中馈电开口的形状为方形。
馈电贴片303与寄生环形谐振器302贴合在一层基板上时，可以参考图12所示。图12中，馈电贴片303与寄生环形谐振器302分别位于一层基板的上表面和下表面，寄生环形谐振器302的四个边角分别位于馈电贴片303四个边的中间位置。寄生环形谐振器302为方形环，且每个边的宽度为WL。图12中，馈电贴片303为正方形，且馈电贴片的边长为W3，馈电贴片中的馈电开口为正方形，且馈电开口的边长为W4。
需要说明的是，本申请实施例中，可以通过改变馈电贴片中馈电开口的大小以及耦合馈电结构中微带谐振器的尺寸调节辐射抑制零点的频率。举例来说，馈电贴片中馈电开口的形状为正方形时，所述馈电开口的边长等于低频零点频率信号的八分之一波长，同时耦合馈电结构中微带谐振器的微带线的长度与馈电开口的边长相等，此时可以通过调节微带谐振器中微带贴片的尺寸大小，可进一步控制零点位置和阻抗匹配。
本申请实施例中，馈电贴片303上的馈电开口的形状还可以是其它对称的形状，包括但不限于正方形、圆形、菱形、双工字形等。
举例来说，如图13所示，图13中的馈电贴片303包括圆形的馈电开口。
再举例来说，如图14所示，图14中的馈电贴片303包括棱形的馈电开口。
再举例来说，如图15所示，图15中的馈电贴片303包括双工字形的馈电开口。
图11至图15只是示例，其它情况不再逐一举例说明。
耦合馈电结构：
本申请实施例中，耦合馈电结构304具有高通滤波功能，与馈电贴片303耦合，并通过金属化馈电过孔305与馈电网络306电连接。
图16所示的耦合馈电结构304包括一个微带谐振器。图16中，微带谐振器包括两根相互垂直的差分馈电探针、微带线以及四个微带贴片，其中，每个差分馈电探针的两个端点分别与所述四个微带贴片中的一个微带贴片连接。这种结构的耦合馈电结构304，可以实现差分激励作用。
进一步地，图16中，两根相互垂直的差分馈电探针相交处与微带线连接，微带线是一根具有特定长度的金属线，垂直于所述两根差分馈电探针的连接处，微带线的长度可以等于馈电贴片中馈电开口的边长。
一个差分馈电探针的两个端点的微带贴片与微带线可以构成阶梯阻抗谐振器结构。由于微带贴片设置在馈电贴片303中金属部分的下方，从而形成电容耦合，引入串联电容的成分；微带线设置在馈电贴片303中间的馈电开口的下方，避免与馈电贴片303耦合。由于差分激励的作用，微带线中间位置等效短路，因此微带线部分可等效为并联电感，与前面微带贴片提供的串联电容共同构成等效的高通滤波电路，能有效地抑制天线低频段的辐射。此外，在微带谐振器的谐振频率处，馈电贴片上缺口边沿流动的电流与微带谐振器上分布的电流形成一个回路，使得馈电贴片上的电流集中在中间区域而不向边沿辐射，从而使得增益曲线工作频段的下侧引入一个辐射抑制零点，提高滤波的边沿滚降效果，并且通过改变馈电贴片303中馈电开口的大小以及微带谐振器结构的尺寸均可调节辐射抑制零点的频率。
图16中，每个差分馈电探针的两个端点还包括金属化馈电过孔馈点，如前所述，金属化馈电过孔馈点是金属化馈电过孔305与耦合馈电结构304的连接点。
图16中，微带贴片的形状为方形，微带贴片的形状还可以为其它具有对称性的形状，例如圆形或棱形等。
举例来说，如图17所示，图17中，微带贴片的形状为圆形。
再举例来说，如图18所示，图18中，微带贴片的形状为棱形。
可选的，图16中，两根相互垂直的差分馈电探针的四周空余位置包括至少一个寄生接地孔，从而可以提升微带谐振器的品质因数，使得增益曲线边沿下降更陡峭。
可选的，寄生接地孔也可以按照其他方式分布在差分馈电探针的四周，例如，可以如图19所示。
本申请实施例中，耦合馈电结构304也可以包括多层微带谐振器相邻两层微带谐振器通过设置在微带贴片中的至少一个金属过孔相连接。结合图19，金属过孔可以位于微带贴片中，每个微带贴片可以包括多个金属过孔。如图20所示，为包括3层微带谐振器的耦合馈电结构304的3D视图。
馈电网络：
图21中所示的馈电网络306为差分馈电网络，包括第一极化带状线3061和第二极化带状线3062。馈电网络306也可以为单端馈电网络，在此不再示出。
进一步地，馈电网络306中的每个极化带状线的一端通过金属化馈电过孔305连接耦合馈电结构304的一根差分馈电探针后，再延长一段长度后，连接至该差分馈电探针的另一端，所延长的长度为天线单元的工作频段的中心频率半波长度，即图21中的L13。极化 带状线与金属化馈电过孔305的连接点可以称为金属化馈电过孔馈点。第一极化带状线3061连接的两个金属化馈电过孔馈点之间的距离为L11，第二极化带状线3062连接的两个金属化馈电过孔馈点之间的距离为L12。
图21中，第一极化带状线3061和第二极化带状线3062的宽度为WF。第一极化带状线3061和第二极化带状线3062上还分别加载至少一根开路枝节型谐振器，通过在极化带状线上加载多根开路枝节型谐振器，使其具有宽阻带低通滤波效果，并且引入的插损较小。图21中，以每个极化带状线加载4根开路枝节型谐振器为例进行描述，这4根开路枝节型谐振器的长度分别为L10、L8、L6以及L4，如图21所示，这4根开路枝节型谐振器间距分别为L9、L7以及L5。上面的WF，以及L4至L13的具体取值，可以根据天线单元的工作频段确定。
可选的，极化带状线与金属化馈电过孔305的连接点的周围包括至少一个寄生接地孔，寄生接地孔连通上下两层金属地板，能增强端口间的隔离以及减小金属化馈电过孔305带来的插损。
进一步的，当本申请实施例提供的天线单元的工作频段为24-30GHz时，如图3至图21中标注的尺寸的具体取值可以如下：
W1＝10mm，W2＝3.53mm，W3＝2.35mm，W4＝0.8mm，W5＝0.31mm，W6＝0.31mm，WL＝2.0mm，L1＝0.42mm，L2＝0.42mm，L3＝0.86mm，L4＝1mm，L5＝0.5mm，L6＝1.2mm，L7＝0.5mm，L8＝0.85mm，L9＝0.4mm，L10＝0.7mm，L11＝L12＝0.96mm，L13＝0.8mm，H1＝0.69mm，H2＝0.05mm，H3＝0.25mm，H4＝0.2mm，H5＝0.2mm，WS＝0.17mm，WF＝0.1mm。
以上只是示例，天线单元的具体尺寸可以进行调整，从而适应不同的频带的无线通信系统的接收和发射设备中。
结合上面的尺寸，天线单元的工作频段为24-30GHz时，天线性能的仿真示意图可以如图22至图24所示。如图22所示，是本申请实施例对比在不同条件下低频边带增益曲线图。图22中给出了4种不同情况下的仿真结果图，这4种情况分别为：1，天线单元不加载寄生环形谐振器，且天线单元的耦合馈电结构不加载寄生接地孔；2，天线单元加载寄生环形谐振器，但天线单元的耦合馈电结构不加载寄生接地孔；3，天线单元不加载寄生环形谐振器，但天线单元的耦合馈电结构的中间以及四周空余位置加载寄生接地孔；4，天线单元加载寄生环形谐振器，天线单元的耦合馈电结构的中间以及四周空余位置加载寄生接地孔。
从图22可以看出，当天线单元加载寄生环形谐振器，以及耦合馈电结构的中间以及四周空余位置加载寄生接地孔时，均能提升滤波的边沿滚降效果。同时采取两种提升边沿滚降的方式，可在不引入额外插损的前提下将22.5GHz处的抑制能力提升14dB。
如图23所示，是本申请实施例提供的天线单元的反射系数仿真结果图，当天线单元的工作频段为24-30GHz时，能够实现良好的阻抗匹配。
如图24所示，是本申请实施例提供的天线单元的增益曲线仿真结果图，当天线单元的工作频段为24-30GHz内时，天线增益平稳，均有5.8dBi以上，达到了22％相对带宽；通带两侧具有高滚降滤波特性，且实现了从0-22.5GHz超过25dB的滤波抑制，以及从34-60GHz超过25dB的宽阻带滤波抑制。相较于天线单元不加载寄生环形谐振器，天线单元在加载寄生环形谐振器时，低频边带滚降明显提升。
如图25所示，本申请实施例还提供一种AiP。图25中的AiP中集成了一个4x4的相 控天线阵列，共包括16个天线单元，每个天线单元的具体实现方式可以参考前面的描述。需要说明的是，图25中的AiP中相控天线阵列包括的天线单元的数量只是示例，还可能包括其他数量的天线单元。
图25中，AiP中的相控天线阵列可以与射频芯片连接，具体可以参考前面的描述，在此不再赘述。图25中的AiP还包括其它结构，具体可以参考现有技术中关于AiP的描述，在此不再赘述。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。
显然，本领域的技术人员可以对本申请进行各种改动和变型而不脱离本申请的范围。这样，倘若本申请的这些修改和变型属于本申请权利要求及其等同技术的范围之内，则本申请也意图包含这些改动和变型在内。

Claims (12)

  1. 一种封装天线系统，其特征在于，包括：
    射频芯片，与所述射频芯片连接的功分器网络，与所述功分器网络连接的多个射频通道，以及与所述多个射频通道连接的相控天线阵列；
    其中，所述射频芯片包括上变频器和下变频器，所述功分器网络包括一个或多个功分器，所述多个射频通道的每个射频通道均包括一个或多个射频前端器件；
    所述相控天线阵列包括多个天线单元，所述天线单元中部分或全部天线单元包括滤波天线结构，所述滤波天线结构用于频带滤波，所述频带包括毫米波频带。
  2. 根据权利要求1所述的封装天线系统，其特征在于，所述滤波天线结构包括高通滤波结构以及低通滤波结构。
  3. 根据权利要求2所述的封装天线系统，其特征在于，所述天线单元包括馈电模块以及馈电贴片；
    所述馈电模块包括至少一层叠加的微带谐振器，所述微带谐振器包括至少两个差分馈电探针、微带线以及至少一个微带贴片；
    所述微带谐振器包括的所述微带线通过所述至少一个差分馈电探针与所述至少一个微带贴片连接；
    所述微带谐振器包括的所述至少一个微带贴片与所述馈电贴片耦合，构成串联电容，所述微带线与所述串联电容构成所述高通滤波结构。
  4. 根据权利要求3所述的封装天线系统，其特征在于，所述微带谐振器包括两根相互垂直相接的差分馈电探针；
    所述差分馈电探针的两个端点中的至少一个端点与所述至少一个微带贴片中的一个微带贴片连接；
    所述至少一个微带贴片的数量为大于或等于1，且小于或等于4。
  5. 根据权利要求2或3所述的封装天线系统，其特征在于，所述天线单元包括馈电网络；
    所述馈电网络的极化带状线上加载至少一根开路枝节型谐振器，所述至少一根开路枝节型谐振器构成所述低通滤波结构。
  6. 根据权利要求4所述的封装天线系统，其特征在于，所述微带谐振器包括的所述微带线垂直于所述微带谐振器包括的所述两根差分馈电探针的连接处。
  7. 根据权利要求1至6任一所述的封装天线系统，其特征在于，所述毫米波频带的频率范围包括24.25GHz至29.5GHz。
  8. 根据权利要求2至7任一所述的封装天线系统，其特征在于，所述天线单元还包括辐射体、与所述辐射体耦合的谐振器模块，且所述谐振器与所述馈电模块连接；
    所述谐振器模块包括寄生环形谐振器以及馈电贴片；
    所述寄生环形谐振器位于所述辐射体与所述馈电贴片之间，并分别与所述辐射体以及所述馈电贴片耦合，或者，所述馈电贴片位于所述辐射体与所述寄生环形谐振器之间，并分别与所述辐射体与所述寄生环形谐振器耦合。
  9. 根据权利要求8所述的封装天线系统，其特征在于，所述寄生环形谐振器为方环形的金属贴片，或者为圆环行的金属贴片，或者为双工字形的金属贴片。
  10. 根据权利要求8所述的封装天线系统，其特征在于，所述馈电贴片为具有对称形状的金属贴片，且所述馈电贴片的中间包括具有对称形状的馈电开口。
  11. 根据权利要求3所述的封装天线系统，其特征在于，所述微带谐振器的中间以及四周空余位置包括至少一个寄生接地孔。
  12. 一种通信设备，其特征在于，包括：基带芯片以及如权利要求1至11中任一项所述的封装天线系统。
PCT/CN2019/109713 2019-09-30 2019-09-30 一种集成滤波功能的封装天线系统及通信设备 WO2021062789A1 (zh)

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CN113594676A (zh) * 2021-07-07 2021-11-02 安徽大学 毫米波双频段双圆极化天线单元及其阵列、设计方法
CN113851845A (zh) * 2021-10-13 2021-12-28 中国信息通信研究院 一种抑制带内信号的集成滤波双工天线
CN114204256A (zh) * 2021-11-29 2022-03-18 广东工业大学 全双工应用的宽带高隔离贴片天线及无线通信设备
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CN114361782A (zh) * 2022-01-11 2022-04-15 西安电子科技大学 一种可重构低rcs圆极化天线阵列
CN114843729A (zh) * 2022-04-28 2022-08-02 南通大学 一种不平衡到平衡的毫米波基片集成波导滤波功分器
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CN113141708B (zh) * 2021-04-29 2022-09-27 成都天锐星通科技有限公司 一种多波束芯片集成模块及相控阵系统
CN113141708A (zh) * 2021-04-29 2021-07-20 成都天锐星通科技有限公司 一种多波束芯片集成模块及相控阵系统
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CN113594676A (zh) * 2021-07-07 2021-11-02 安徽大学 毫米波双频段双圆极化天线单元及其阵列、设计方法
CN113851845B (zh) * 2021-10-13 2024-01-26 中国信息通信研究院 一种抑制带内信号的集成滤波双工天线
CN113851845A (zh) * 2021-10-13 2021-12-28 中国信息通信研究院 一种抑制带内信号的集成滤波双工天线
WO2023093254A1 (zh) * 2021-11-25 2023-06-01 中兴通讯股份有限公司 天线模组及移动终端
CN114204256A (zh) * 2021-11-29 2022-03-18 广东工业大学 全双工应用的宽带高隔离贴片天线及无线通信设备
CN114256616A (zh) * 2021-12-30 2022-03-29 中国科学院微电子研究所 一种天线单元和天线阵列
CN114361782A (zh) * 2022-01-11 2022-04-15 西安电子科技大学 一种可重构低rcs圆极化天线阵列
CN114843729A (zh) * 2022-04-28 2022-08-02 南通大学 一种不平衡到平衡的毫米波基片集成波导滤波功分器
CN114843729B (zh) * 2022-04-28 2024-03-19 南通大学 一种不平衡到平衡的毫米波基片集成波导滤波功分器
WO2023231751A1 (zh) * 2022-05-30 2023-12-07 华为技术有限公司 天线阵列、天线和网络设备
CN115051154B (zh) * 2022-07-27 2023-07-18 重庆邮电大学 一种基于开口阶梯槽的差分宽带端射滤波天线
CN115051154A (zh) * 2022-07-27 2022-09-13 重庆邮电大学 一种基于开口阶梯槽的差分宽带端射滤波天线
CN115513627A (zh) * 2022-08-24 2022-12-23 声呐天空资讯顾问有限公司 分频器及天线阵列
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