WO2021056669A1 - Dispositif unifié de division et de balayage de faisceau et son procédé de fabrication - Google Patents

Dispositif unifié de division et de balayage de faisceau et son procédé de fabrication Download PDF

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Publication number
WO2021056669A1
WO2021056669A1 PCT/CN2019/113754 CN2019113754W WO2021056669A1 WO 2021056669 A1 WO2021056669 A1 WO 2021056669A1 CN 2019113754 W CN2019113754 W CN 2019113754W WO 2021056669 A1 WO2021056669 A1 WO 2021056669A1
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WIPO (PCT)
Prior art keywords
transparent substrate
light
beam splitting
light source
sub
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PCT/CN2019/113754
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English (en)
Chinese (zh)
Inventor
许星
关健
朱亮
闫敏
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深圳奥锐达科技有限公司
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Publication of WO2021056669A1 publication Critical patent/WO2021056669A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/46—Indirect determination of position data
    • G01S17/48—Active triangulation systems, i.e. using the transmission and reflection of electromagnetic waves other than radio waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/484—Transmitters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers

Definitions

  • This application relates to the field of computer technology, in particular to an integrated beam splitting scanning device and a manufacturing method thereof.
  • the distance measurement system has been widely used in consumer electronics, unmanned driving, AR/VR and other fields.
  • Distance measurement systems based on the time-of-flight principle and structured light principle generally include a beam emitter and collector.
  • the light source in the transmitter emits a light beam to the target space to provide illumination, and the collector receives the light beam reflected by the target.
  • the time-of-flight distance measurement system calculates the distance of the target object by calculating the time required for the beam to be reflected and received; while the structured light distance measurement system processes the reflected beam pattern and uses the triangulation method to calculate the distance of the target object. distance.
  • the measurement resolution is often affected by the light beam emitted by the transmitter.
  • the denser the emitted light beam the higher the resolution.
  • the dense beam has higher requirements for the arrangement density of the light source and the design requirements of related optical devices.
  • the dense beam It also means higher power consumption.
  • the power consumption problem is also affected by the transmitter. The higher the transmitter beam power and the higher the beam density, the higher the power consumption, which further limits the wider application of the measurement system to more fields.
  • the problem of volume is often caused by complex devices in the emitter or collector.
  • the emitter usually contains a light source and some optical elements such as refraction and diffraction, which results in a large volume and difficult integration.
  • the purpose of the present application is to provide an integrated beam splitting scanning device and a manufacturing method thereof to solve at least one of the above-mentioned background technical problems.
  • the embodiment of the present application provides an integrated beam splitting scanning device, including: a first transparent substrate and a second transparent substrate; a liquid crystal layer is disposed between the first transparent substrate and the second transparent substrate for incident The beam is deflected to realize scanning; the beam splitting unit is arranged on the first transparent substrate and/or the second transparent substrate, and is used to split the incident beam.
  • it further includes a positive and negative electrode layer, the positive and negative electrode layer is disposed between the first transparent substrate and the second transparent substrate, and the positive and negative electrode layer is disposed on the liquid crystal layer. On both sides.
  • it further includes a support disposed between the first transparent substrate and the second transparent substrate, and the support is installed around the liquid crystal layer.
  • the beam splitting unit includes a microstructure formed on the first transparent substrate and/or the second transparent substrate, and the microstructure includes one of a diffraction grating, a binary grating, and a super-surface structure. Species or combinations.
  • the microstructure is formed on the inner surface of the first transparent substrate and/or the second transparent substrate.
  • the embodiment of the present application also provides a method for manufacturing an integrated beam-splitting scanning device, which includes the steps:
  • the liquid crystal layer is installed between the first transparent substrate and the second transparent substrate.
  • the method further includes providing positive and negative electrode layers, the positive and negative electrode layers are disposed between the first transparent substrate and the second transparent substrate, and disposed on both sides of the liquid crystal layer.
  • it further includes providing a support, which is arranged between the first transparent substrate and the second transparent substrate, and installed around the liquid crystal layer.
  • the beam splitting unit includes microstructures formed on the first transparent substrate and/or the second transparent substrate, and the microstructures include diffraction gratings, binary gratings, and super-surface structures. One or a combination.
  • the microstructure is formed on the inner surface of the first transparent substrate and/or the second transparent substrate.
  • the embodiment of the present application provides an integrated beam splitting scanning device, including: a first transparent substrate and a second transparent substrate; a liquid crystal layer is disposed between the first transparent substrate and the second transparent substrate for incident The beam is deflected to realize scanning; the beam splitting unit is arranged on the first transparent substrate and/or the second transparent substrate, and is used to split the incident beam.
  • Fig. 1 is a schematic diagram of a time-of-flight distance measurement system according to an embodiment of the present application.
  • Fig. 2 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • Fig. 3 is a schematic diagram of a projection pattern according to an embodiment of the present application.
  • Fig. 4 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • Fig. 5 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • Fig. 6 is a schematic diagram of a projection pattern according to an embodiment of the present application.
  • Fig. 7 is a schematic diagram of an integrated beam splitting scanning device according to an embodiment of the present application.
  • Fig. 8 is a schematic diagram of an array light source and its sparse projection pattern according to an embodiment of the present application.
  • Fig. 9 is a schematic diagram of an array light source and its dense projection pattern according to an embodiment of the present application.
  • connection can be used for fixing or circuit connection.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, “multiple” means two or more than two, unless otherwise specifically defined.
  • the present application provides a time-of-flight distance measurement system, which has a higher resolution and/or a larger field of view.
  • Fig. 1 is a schematic diagram of a time-of-flight distance measurement system according to an embodiment of the present application.
  • the distance measurement system 10 includes a transmitter 11, a collector 12, and a processing circuit 13; the transmitter 11 provides a emitted light beam 30 to the target space to illuminate an object 20 in the space, wherein at least part of the emitted light beam 30 is formed after being reflected by the object 20 At least part of the optical signal (photons) of the reflected light beam 40 is collected by the collector 12.
  • the processing circuit 13 is respectively connected to the transmitter 11 and the collector 12, and synchronizes the trigger signals of the transmitter 11 and the collector 12 to calculate the time required for the light beam to be emitted by the transmitter 11 and received by the collector 12, that is, the emitted light beam 30 and the reflection
  • the flight time t between the beams 40, further, the distance D of the corresponding point on the object can be calculated by the following formula:
  • c is the speed of light.
  • the transmitter 11 includes a light source 111 and an optical element 112.
  • the light source 111 may be a light source such as a light emitting diode (LED), an edge emitting laser (EEL), a vertical cavity surface emitting laser (VCSEL), etc., or an array light source composed of multiple light sources.
  • the array light source 111 is a VCSEL array light source chip formed by generating multiple VCSEL light sources on a single semiconductor substrate.
  • the light beam emitted by the light source 111 may be visible light, infrared light, ultraviolet light, or the like.
  • the light source 111 emits a light beam outward under the control of the processing circuit 13.
  • the light source 111 emits a pulsed light beam at a certain frequency (pulse period) under the control of the processing circuit 13, which can be used in the direct time-of-flight method ( In Direct TOF measurement, the frequency is set according to the measurement distance, for example, it can be set to 1MHz-100MHz, and the measurement distance is several meters to several hundred meters. It is understandable that it may be a part of the processing circuit 13 or a sub-circuit independent of the processing circuit 13 to control the light source 111 to emit related light beams, such as a pulse signal generator.
  • the optical element 112 receives the pulsed beam from the light source 111, and optically modulates the pulsed beam, such as diffraction, refraction, reflection, etc., and then emits the modulated beam into space, such as a focused beam, a flood beam, and a structured light beam. Wait.
  • the optical element 112 may be one or more combinations of lenses, diffractive optical elements, metasurface optical elements, masks, mirrors, MEMS galvanometers, and the like.
  • the processing circuit 13 can be an independent dedicated circuit, such as a dedicated SOC chip, FPGA chip, ASIC chip, etc., or it can include a general-purpose processing circuit.
  • a dedicated SOC chip such as a dedicated SOC chip, FPGA chip, ASIC chip, etc.
  • a general-purpose processing circuit for example, when the depth camera is integrated into a smart terminal such as a mobile phone, a TV, a computer, etc.
  • the processing circuit in the terminal can be used as at least a part of the processing circuit 13.
  • the collector 12 includes a pixel unit 121 and an imaging lens unit 122.
  • the imaging lens unit 122 receives and guides at least part of the modulated light beam reflected back by the object to the pixel unit 121.
  • the pixel unit 121 is composed of a single photon avalanche photodiode (SPAD), or an array pixel unit composed of multiple SPAD pixels.
  • the array size of the array pixel unit represents the resolution of the depth camera, such as 320 ⁇ 240 etc.
  • SPAD can respond to the incident single photon to realize the detection of single photon. Because of its high sensitivity and fast response speed, it can realize long-distance and high-precision measurement.
  • SPAD can count single photons, such as the use of time-correlated single photon counting (TCSPC) to realize the collection of weak light signals and the calculation of flight time .
  • TCSPC time-correlated single photon counting
  • connected to the pixel unit 121 also includes a readout circuit composed of one or more of a signal amplifier, a time-to-digital converter (TDC), an analog-to-digital converter (ADC) and other devices (not shown in the figure).
  • TDC time-to-digital converter
  • ADC analog-to-digital converter
  • these circuits can be integrated with the pixels, and they can also be part of the processing circuit 13. For ease of description, the processing circuit 13 will be collectively regarded.
  • the distance measurement system 10 may also include a color camera, an infrared camera, an IMU, and other devices.
  • the combination of these devices can achieve richer functions, such as 3D texture modeling, infrared face recognition, SLAM, etc. .
  • the transmitter 11 and the collector 12 can also be arranged in a coaxial form, that is, the two are realized by optical devices with reflection and transmission functions, such as a half mirror.
  • the transmitter 11 is set to emit a flood beam with a certain field of view.
  • the advantage is that it covers the entire range of the target under test.
  • Each pixel in the collector 12 is The reflected light beam can be received at the same time.
  • the resolution of the depth image output by the measurement system is affected by the resolution of the pixel unit of the collector 12.
  • the disadvantage is that the power consumption of the transmitter 11 will be high, and it may also cause the collector 11 When there is interference between adjacent pixels during synchronous measurement. Therefore, in the present application, the emitter 11 is configured to emit structured light beams outwards, that is, only a part of the area is illuminated in space.
  • the advantage of using structured light beams is that the illumination is more concentrated and the signal-to-noise ratio is improved.
  • Fig. 2 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • the transmitter includes a light source unit, a beam splitting unit 204, and a scanning unit 205.
  • the light source unit is used to emit a first light beam
  • the beam splitting unit 204 is used to receive and split the first light beam to form a second light beam with a larger number of beams.
  • the scanning unit 205 is used to receive and deflect the second light beam at a certain angle and then emit a third light beam outward. After multiple deflections, multiple third light beams will be formed.
  • the multiple third light beams form a comprehensive projection pattern light beam It has a higher density and/or a larger field of view than the second beam.
  • the light source unit includes a substrate 201 and one or more sub-light sources 202 arranged on a single substrate 201 (or multiple substrates), and the sub-light sources 202 are arranged on the substrate in a certain pattern.
  • the substrate 201 may be a semiconductor substrate, a metal substrate, etc.
  • the sub-light source 202 may be a light emitting diode, a side-emitting laser transmitter, a vertical cavity surface laser transmitter (VCSEL), etc.
  • the light source unit includes a semiconductor substrate and is arranged on the semiconductor substrate An array of VCSEL chips composed of multiple VCSEL sub-light sources.
  • the sub-light source is used to emit light beams of any desired wavelength, such as visible light, infrared light, and ultraviolet light.
  • the light source unit emits light under the modulation drive of the driving circuit (which may be part of the processing circuit 13), such as amplitude modulation, phase modulation, frequency modulation, pulse modulation, and the like.
  • the sub-light sources 202 can also emit light in groups or as a whole under the control of the driving circuit.
  • the sub-light sources 202 include a first sub-light source array 201, a second sub-light source array 202, etc., and the first sub-light source array 201 is controlled by the first driving circuit.
  • the second sub-light source array 202 emits light under the control of the second driving circuit.
  • the arrangement pattern of the sub-light sources 202 can be a one-dimensional arrangement pattern or a two-dimensional arrangement pattern, and can be a regular arrangement pattern, an irregular arrangement pattern, or a combination of a regular pattern and an irregular pattern.
  • the sub-light source includes a 3 ⁇ 3 regular array of sub-light sources.
  • the light source unit further includes one or more of optical elements such as lenses (or lens groups), microlens arrays, etc.
  • optical elements such as lenses (or lens groups), microlens arrays, etc.
  • a lens 203 or lens group is provided between the sub-light source 202 and the beam splitting unit 204
  • the lens 203 is used to refract the light beam emitted by the sub-light source to produce focusing, collimation or divergence effects (forming a focused, collimated or divergent first light beam) to satisfy subsequent optical elements
  • the modulation needs.
  • the beam splitting unit 204 receives the first light beam emitted from the light source, and replicates and splits the first light beam to form a second light beam with a larger number of light beams. In some embodiments, the beam splitting unit 204 replicates and splits the first beam to form a second beam with a higher arrangement density (for the case of multiple sub-light sources); in some embodiments, the beam splitting unit 204 The first beam is copied and split to form a second beam with a larger field of view, such as the embodiment shown in FIG. 3; in some embodiments, the beam splitting unit 204 copies and splits the first beam to form an arrangement density A second beam with a higher and larger field of view.
  • the beam splitting unit 204 may be a diffractive optical element, a grating, an optical mask, a metasurface optical element, or any other optical device capable of beam splitting, or a combination of more than one.
  • the field of view of the second beam is ⁇
  • the angular offset of two adjacent sub-beams in the second beam is ⁇ .
  • both ⁇ and ⁇ include Components in two directions ( ⁇ x , ⁇ y ), ( ⁇ x , ⁇ y ).
  • the scanning unit 205 After the scanning unit 205 receives the second light beam from the beam splitting unit 204, it deflects and scans the second light beam and then emits a third light beam outward.
  • the scanning unit 205 can realize one-dimensional deflection or two-dimensional deflection for each sub-beam in the incident second light beam through diffraction, refraction, reflection, etc., such as deflection by a certain angle ⁇ ( ⁇ x , ⁇ y ) in at least one direction, Thus, a third beam is formed.
  • FIG. 2 schematically shows a schematic diagram of the scanning unit 205 sequentially deflecting the second light beam by two angles in one direction, where the first and third light beams 206 can be considered to be formed by deflection of 0 degrees; the second and third light beams 207 are The scanning unit 205 deflects the second beam by a small angle ⁇ , which is smaller than the angle between two adjacent sub-beams in the second beam, that is, ⁇ , which is formed after at least two scans.
  • the integrated projection pattern beam composed of at least two third beams has a higher density than the second beam without the scanning unit 205, thereby improving the measurement resolution of the measurement system. Refer to Figure 3 for specific description.
  • the scanning unit 205 can be one of a liquid crystal spatial light modulator, an acousto-optic modulator, a MEMS galvanometer, a rotating prism pair, a single prism + motor, a reflective two-dimensional OPA device, a liquid crystal metasurface device (LC-Metasurface) and other devices.
  • a liquid crystal spatial light modulator an acousto-optic modulator, a MEMS galvanometer, a rotating prism pair, a single prism + motor, a reflective two-dimensional OPA device, a liquid crystal metasurface device (LC-Metasurface) and other devices.
  • the deflection angle of the incident light beam can be controlled by adjusting the arrangement grating period of the liquid crystal molecules.
  • Fig. 3 is a schematic diagram of a projection pattern according to an embodiment of the present application.
  • the projection pattern formed by the third light beam emitted by the transmitter 11 to the target is as shown in FIG. 3.
  • the beam splitting unit 204 replicates and splits the first beam to form a second beam with a larger field of view.
  • the replication method is a 3 ⁇ 3 formation, that is, a 3 ⁇ 3 regularly arranged sub-light source is emitted.
  • the first light beam is replicated 3 ⁇ 3 times to form a second beam pattern 301 with a large field of view formed by 9 first beam patterns 302.
  • the figure is represented by a solid line and a hollow circle.
  • the first and third beam patterns formed are the array spot patterns formed by the solid hollow circles 303 in FIG. 3;
  • the two beams are deflected again, for example, in the vertical direction in FIG. 3, and the deflection angle is smaller than the angle between the two adjacent sub-beams in the second beam, and thus the second beam formed by the dashed space circle 304 in FIG. 3 can be generated. 2.
  • the third beam pattern is the third beam pattern.
  • the scanning direction can be in a single direction or in multiple directions.
  • the field of view is also increased, and the increased field of view is relative to the field of view of the second beam formed by the beam splitting unit 204
  • the angle is very small. It is understandable that the density and the angle of view of the projection pattern can be effectively adjusted through the reasonable setting of the deflection angle.
  • the deflection angle ⁇ can be sequentially set to Through n scans, the scan angle is gradually increased Thereby increasing the integrated projection pattern density by n times.
  • the deflection angle ⁇ can be sequentially set to Therefore, the density of the projection pattern and the angle of view can be increased at the same time, that is, the angle of view increases by N ⁇ , and the density of the superimposed area in the middle part increases by n times.
  • the deflection angle is set to exceed the angle of view of the second light beam as ⁇ , and at this time, only the angle of view of the projection pattern is increased. This situation is shown in FIG. 5.
  • Fig. 5 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • the main components of the emitter are similar to the embodiment shown in FIG. 2, including a light source unit composed of a substrate 501, a sub-light source 502 and a lens 503, as well as a beam splitting unit 504 and a scanning unit 505.
  • the scanning unit 505 deflects the incident second beam with a relatively large deflection angle, that is, ⁇ .
  • the first and third beam patterns formed by the first deflection of 0 degrees are 506.
  • the second and third beam patterns 507 are formed after being deflected by ⁇ in a certain direction for the second time.
  • the field angle of the integrated projection pattern formed by the first and second and third beam patterns is increased by 2 times along the deflection direction, and the projection pattern The density has not changed.
  • the scanning unit 505 may be deflected in multiple directions to form a projection pattern with a larger field of view.
  • FIG. 6 shows a schematic diagram of a projection pattern according to an embodiment of the present application.
  • the light source unit includes a regular array composed of 3 ⁇ 3 sub-light sources, and the beam splitting unit performs 3 ⁇ 3 times the replication and splitting of the regular array of sub-light sources to form a 9 ⁇ 9 second light beam.
  • the scanning unit Deflection is performed 3 times in the horizontal and vertical directions, each time the deflection angle is slightly larger than ⁇ (to avoid overlapping of the beams at the neighboring boundary), such as the deflection sequence shown by the arrow in Figure 6, and finally multiple third beams can be formed 602, 603, 604, and 605, a plurality of third light beams together form a projection pattern 601, and the field of view angle in both directions has been increased by a factor of 2 after multiple deflection. It is understandable that, according to actual needs, the number of deflection in each direction and the order of deflection can be set accordingly, which is not limited here.
  • Fig. 4 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • the transmitter includes a light source unit, a scanning unit 404, and a beam splitting unit 405.
  • the light source unit is used to emit a first light beam.
  • the scanning unit 404 is used to receive and deflect the first light beam and then emit a second light beam outward.
  • the beam splitting unit 405 is used to receive After splitting the second beam, a third beam with a larger number of beams is formed. After multiple deflections by the scanning unit 404, multiple second light beams are formed. Correspondingly, the multiple second light beams are split by the beam splitting unit to form corresponding multiple third light beams.
  • the projected pattern beam has a higher density and/or a larger field of view than the second beam.
  • the light source unit includes a substrate 401 and one or more sub-light sources 402 arranged on a single substrate 401 (or multiple substrates), and the sub-light sources 402 are arranged on the substrate in a certain pattern.
  • the substrate 401 may be a semiconductor substrate, a metal substrate, etc.
  • the sub-light source 402 may be a light emitting diode, a side-emitting laser transmitter, a vertical cavity surface laser transmitter (VCSEL), etc.
  • the light source unit includes a semiconductor substrate and is arranged on the semiconductor substrate An array of VCSEL chips composed of multiple VCSEL sub-light sources.
  • the sub-light source is used to emit light beams of any desired wavelength, such as visible light, infrared light, and ultraviolet light.
  • the light source unit emits light under the modulation drive of the driving circuit (which may be part of the processing circuit 13), such as continuous wave modulation, pulse modulation, and the like.
  • the sub-light source 402 can also emit light in groups or as a whole under the control of the driving circuit.
  • the sub-light source 402 includes a first sub-light source array 401, a second sub-light source array 402, etc., and the first sub-light source array 401 is controlled by the first driving circuit.
  • the second sub-light source array 402 emits light under the control of the second driving circuit.
  • the arrangement of the sub-light sources 402 can be a one-dimensional arrangement or a two-dimensional arrangement, and can be a regular arrangement or an irregular arrangement.
  • the light source unit further includes one or more of optical elements such as a lens (or lens group), a microlens array, etc., for example, a lens (or lens group) is provided between the sub-light source 402 and the scanning unit 404 403.
  • the lens 403 is used to refract the light beam emitted by the light source to produce a converging or focusing effect, so as to meet the modulation requirements of subsequent optical elements.
  • the scanning unit 404 receives the first light beam emitted from the light source, and performs deflection scanning on the first light beam to form a second light beam.
  • the scanning unit 404 may implement one-dimensional or two-dimensional deflection for each sub-beam of the incident second light beam through diffraction, refraction, reflection, etc., for example, to deflect a certain angle in at least one direction to form the second light beam.
  • the beam splitting unit 405 receives the second light beam emitted from the scanning unit 404, and replicates and splits the second light beam to form a third light beam with a larger number of beams. In some embodiments, the beam splitting unit 405 replicates and splits the second beam to form a third beam with a higher arrangement density; in some embodiments, the beam splitting unit 405 replicates and splits the second beam to form a visual A third beam with a larger field angle; in some embodiments, the beam splitting unit 405 replicates and splits the second beam to form a third beam with a higher arrangement density and a larger field of view.
  • the beam splitting unit 405 may be any optical device capable of splitting beams, such as a diffractive optical element, an optical mask, or a metasurface optical element.
  • a schematic diagram of the scanning unit 404 deflecting the first light beam by two angles in one direction is schematically given, where the first and second light beams can be considered to be formed by deflection of 0 degrees (scanning in the figure).
  • the solid line between the unit 404 and the beam splitting unit 405); the second second beam is formed by the scanning unit 404 deflecting the first beam by a small angle ⁇ (between the scanning unit 404 and the beam splitting unit 405 in the figure) Dotted line).
  • the angle ⁇ is smaller than the included angle ⁇ between two adjacent sub-beams in the third beam, so the comprehensive projection pattern composed of at least two third beams 406 and 407 formed after at least two scans is relatively
  • the projection pattern corresponding to the third light beam in the scanning unit 404 has a higher density, which can improve the measurement resolution of the measurement system.
  • the deflection angle ⁇ can be sequentially set to Through n scans, the scan angle is gradually increased Thereby increasing the integrated projection pattern density by n times.
  • the deflection angle ⁇ can be sequentially set to Therefore, the density of the projection pattern and the angle of view can be increased at the same time, that is, the angle of view increases by N ⁇ , and the density of the superimposed area in the middle part increases by n times.
  • the deflection angle is set to exceed the angle of view of the second light beam as ⁇ , at this time only the angle of view of the projection pattern is increased. This situation is also shown in Fig. 5, which is similar to the previous analysis.
  • 504 in FIG. 5 is a scanning unit and 505 is a beam splitting unit, so that the large field of view projection pattern as shown in FIG. 6 can also be formed.
  • the beam splitting unit and the scanning unit are provided in reverse settings to achieve similar functions.
  • the scanning unit can also be separated before and after the scanning unit.
  • the first beam splitting unit and the second beam splitting unit can be provided to achieve more complex functions, or the first scanning unit and the second scanning unit can be set before and after the beam splitting unit.
  • the splitting unit can be set reasonably according to actual needs. The number of beam units and scanning units and the relative position arrangement relationship. These schemes all fall into the protection scope of this application.
  • a high-density and/or large field of view projection can be formed by functionally configuring the beam splitting unit and the scanning unit rationally.
  • an embodiment of the present application also provides an integrated beam splitting scanning device.
  • Fig. 7 is a schematic diagram of an integrated beam splitting scanning device according to an embodiment of the present application.
  • the integrated beam splitting scanning device can be used in the transmitters in the embodiments shown in Figs. 1 to 6, and can also be used in any other required devices.
  • the integrated beam splitting scanning device is used to receive the first beam, split and scan the beam to form a third beam.
  • the integrated beam splitting scanning device includes a first transparent substrate 701, a second transparent substrate 702, a liquid crystal layer 703, and a beam splitting unit 704 arranged on the first transparent substrate and/or the second transparent substrate.
  • the liquid crystal layer 703 is used to deflect the incident light beam to achieve scanning, and the beam splitting unit 704 is used to split the incident light beam.
  • the first transparent substrate 701 and the second transparent substrate 702 may be arranged opposite to each other in parallel.
  • the liquid crystal layer 703 is installed between the first transparent substrate 701 and the second transparent substrate 702, and the substrate can protect the liquid crystal layer.
  • other functional layers can be added in addition to the liquid crystal layer between the two substrates according to needs, such as positive and negative electrode layers, which are arranged on both sides of the liquid crystal layer; polarized light can also be added on the outer or inner surface of the substrate Layers and so on.
  • the integrated beam splitting scanning device includes a support 705 disposed between the first transparent substrate 701 and the second transparent substrate 702, and the support 705 is disposed around the liquid crystal layer to protect the liquid crystal layer while supporting the first transparent substrate. 701 and the role of the second transparent substrate 702.
  • the support can be made of any material, such as semiconductor materials, adhesives, and so on.
  • the beam splitting unit 704 includes one or a combination of diffractive optical elements such as diffraction gratings, binary gratings, and metasurface optical elements, that is, generated on the surface of a transparent substrate by photolithography, etching, etc. Diffractive optical microstructure and super-surface structure, so as to realize the high integration of beam splitting unit and scanning unit.
  • the diffractive optical microstructure and the super-surface structure can be formed on a single surface or two surfaces of the first transparent substrate 701 and/or the second transparent substrate according to actual needs.
  • forming the diffractive optical microstructure on the inner surface of a single transparent substrate can effectively protect the diffractive optical microstructure.
  • This application also provides a method for manufacturing an integrated beam splitting scanning device, which includes the following steps:
  • the liquid crystal layer is installed between the first transparent substrate and the second transparent substrate.
  • the integrated beam-splitting scanning device including the support, it further includes the step of installing the support between the first transparent substrate and the second transparent substrate and at the periphery of the liquid crystal layer.
  • this application also provides a dynamic distance measurement system based on the transmitter of the grouped array light source.
  • the light source of the transmitter in this system includes an array light source, and the sub-light sources in the array light source are divided into multiple sub-light source arrays, and each sub-light source array can be independently grouped and controlled.
  • multiple sub-light source arrays can be arranged in zones, namely Each sub-light source array has an independent spatial partition, and multiple sub-light source arrays can also be arranged crosswise, that is, the sub-light sources in different sub-light source arrays are staggered in spatial arrangement.
  • the sub-light source array should include at least one sub-light source. It is understandable that when the sub-light source array is independently turned on, a corresponding projection pattern will be formed.
  • the density of the projection pattern is related to the density and number of the sub-light source array, and contains the density of the projection pattern corresponding to the more densely arranged sub-light source array. The greater the value, the greater the density of the projection pattern corresponding to the more number of sub-light source arrays turned on.
  • the processing circuit in the measurement system can implement the following dynamic distance measurement method, which specifically includes the following steps:
  • the scanning unit uses the scanning unit to form a first projection pattern with a first field of view; the first projection pattern is also called a sparse projection pattern.
  • FIG. 8 is a schematic diagram of an array light source and its sparse projection pattern according to an embodiment of the present application.
  • the light source in the transmitter includes a light source array 801, which includes a plurality of sub-light source arrays, such as a first sub-light source array (shown by a hollow circle in FIG. 8) and a second sub-light source array (shown by a solid circle in FIG. 8).
  • the beam splitting unit and the scanning unit in the transmitter respectively split and scan the light beam emitted by the first sub-light source array (or scan first and then split the beam).
  • the projection pattern 802 exits and enters the first field of view area containing the target 804.
  • the beam splitting unit performs 2 ⁇ 2 times the copy splitting of the incident beam
  • the scanning unit sequentially scans the incident beam 3 ⁇ 3 to expand the field of view by 3 times in the horizontal and vertical directions.
  • the collector collects the light signal reflected from the sparse projection pattern beam by the target, and is further calculated by the processing circuit to obtain the corresponding sparse projection pattern
  • the first depth image of the first resolution can theoretically obtain the depth value of each spot 803, so the depth value of the spot will constitute the first depth image.
  • the target in the field of view can be recognized, for example, the pixel area where the target is located can be recognized by any suitable method such as threshold segmentation method, edge detection method, feature recognition and so on.
  • the scanning unit uses the scanning unit to form a second projection pattern with a second view, and calculate a second depth image with a second resolution; the second projection pattern is also called a dense projection pattern. Since the target is identified in the previous step and the pixel area where the target is located, generally speaking, the movement of the target will not be too large, and the interval between two adjacent measurements is very short, which can be considered as the result of two adjacent measurements. The target position does not change within the time. Therefore, in this measurement, the scanning unit can only form the projection pattern of the second field of view that is smaller than the first field of view of the target area, and at the same time, it can turn on more sub-fields than in step S1.
  • the light source array is used to form a dense projection pattern with a greater density of the relative beam arrangement. Based on the dense projection pattern, the collector can obtain effective data containing more spots of the target to calculate a depth image with higher resolution to achieve only High-resolution measurement of the target area. It is understandable that the resolution mentioned here generally refers to the number of effective depth value pixels, and the larger the number of effective depth value pixels, the higher the resolution, so the second resolution is higher than the first resolution.
  • FIG. 9 shows a schematic diagram of an array light source and its dense projection pattern according to an embodiment of the present application. In this embodiment, the first array light source and the second array light source are turned on at the same time, that is, the first sub-light source array and the second sub-light source array are turned on simultaneously.
  • the projected pattern of the 2 ⁇ 2 field of view composed of sub-fields of view has a reduced field of view, but the density of the projected pattern is increased, which can achieve higher resolution with lower power consumption. Measurement. It is understandable that if the light source unit contains multiple sub-light source arrays with different arrangement densities, for example, the arrangement density of the first sub-light source array is less than the arrangement density of the second sub-light source array, and only the second sub-light source array can be turned on in this step.
  • the light source array can also achieve the effect of projecting dense projection patterns.
  • time-of-flight distance measurement system is taken as an example for description, but the related transmitter and dynamic distance measurement scheme can also be applied to other measurement systems such as structured light three-dimensional measurement systems.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
  • Mechanical Optical Scanning Systems (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un dispositif unifié de division et de balayage de faisceau, comprenant : un premier substrat transparent (701) et un second substrat transparent (702) ; une couche de cristaux liquides (703) disposée entre le premier substrat transparent (701) et le second substrat transparent (702), et utilisée pour dévier un faisceau de lumière incident pour mettre en œuvre un balayage ; et une unité de division de faisceau (704) disposée sur le premier substrat transparent (701) et/ou le second substrat transparent (702), et utilisée pour diviser le faisceau de lumière incidente. L'agencement raisonnable de l'unité de division de faisceau et de l'unité de balayage réduit le volume du dispositif et permet une unification élevée.
PCT/CN2019/113754 2019-09-27 2019-10-28 Dispositif unifié de division et de balayage de faisceau et son procédé de fabrication WO2021056669A1 (fr)

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CN110716190A (zh) * 2019-09-27 2020-01-21 深圳奥锐达科技有限公司 一种发射器及距离测量系统
CN113126061B (zh) * 2020-01-16 2023-03-10 上海耕岩智能科技有限公司 一种激光雷达及其扫描方法
CN116755107A (zh) * 2020-01-23 2023-09-15 华为技术有限公司 一种飞行时间tof传感模组及电子设备
CN111190164B (zh) * 2020-02-21 2022-03-29 奥比中光科技集团股份有限公司 一种扫描装置及扫描方法
CN113452441B (zh) * 2021-06-21 2022-05-13 武汉邮电科学研究院有限公司 一种多用户接入的空间光无线传输方法和装置

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