WO2021056667A1 - 一种发射器及距离测量系统 - Google Patents

一种发射器及距离测量系统 Download PDF

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Publication number
WO2021056667A1
WO2021056667A1 PCT/CN2019/113705 CN2019113705W WO2021056667A1 WO 2021056667 A1 WO2021056667 A1 WO 2021056667A1 CN 2019113705 W CN2019113705 W CN 2019113705W WO 2021056667 A1 WO2021056667 A1 WO 2021056667A1
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WIPO (PCT)
Prior art keywords
light
light beam
transmitter
light source
angle
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PCT/CN2019/113705
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English (en)
French (fr)
Inventor
朱亮
关健
徐松
闫敏
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深圳奥锐达科技有限公司
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Publication of WO2021056667A1 publication Critical patent/WO2021056667A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only

Definitions

  • This application relates to the field of computer technology, in particular to a transmitter and a distance measurement system.
  • the distance measurement system has been widely used in consumer electronics, unmanned driving, AR/VR and other fields.
  • Distance measurement systems based on the time-of-flight principle and structured light principle generally include a beam emitter and collector.
  • the light source in the transmitter emits a light beam to the target space to provide illumination, and the collector receives the light beam reflected by the target.
  • the time-of-flight distance measurement system calculates the distance of the target object by calculating the time required for the beam to be reflected and received; while the structured light distance measurement system processes the reflected beam pattern and uses the triangulation method to calculate the distance of the target object. distance.
  • the measurement resolution is often affected by the light beam emitted by the transmitter.
  • the denser the emitted light beam the higher the resolution.
  • the dense beam has higher requirements for the arrangement density of the light source and the design requirements of related optical devices.
  • the dense beam It also means higher power consumption.
  • the power consumption problem is also affected by the transmitter. The higher the transmitter beam power and the greater the beam density, the higher the power consumption, which further limits the wider application of the measurement system to more fields.
  • the problem of volume is often caused by complex devices in the emitter or collector.
  • the emitter usually contains a light source and some optical elements such as refraction and diffraction, which results in a large volume and difficult integration. Therefore, the transmitter is a key issue, and it is important to provide a good transmitter to solve the above problems.
  • the purpose of this application is to provide a transmitter and a distance measurement system to solve at least one of the above-mentioned background technical problems.
  • a transmitter includes: a light source unit for emitting a first light beam; a beam splitting unit for receiving the first light beam and splitting the first light beam to form a second light beam with a larger number of beams; and a scanning unit , For receiving the second light beam and deflecting the second light beam by a certain angle and then emitting a third light beam outward; after multiple times of the deflection, a plurality of the third light beams are formed, which are formed by the plurality of third light beams
  • the integrated projection pattern beam has a higher density and/or a larger field of view than the second beam.
  • the light source unit further includes a lens for refracting the light beam emitted by the light source to produce focusing, collimation or divergence effects.
  • the light source unit includes a substrate and at least one sub-light source disposed on the substrate, and the sub-light sources are arranged on the substrate in a certain pattern.
  • the pattern includes a two-dimensional pattern, and the two-dimensional pattern includes a regular pattern and/or an irregular pattern.
  • the light source unit includes a plurality of sub-light sources, and the plurality of sub-light sources can be grouped and independently controlled.
  • the beam splitting unit includes a diffractive optical element and/or a metasurface optical element.
  • the second light beam has a higher arrangement density than the first light beam, and/or the second light beam has a larger field of view than the first light beam.
  • the integrated projection pattern beam when the deflection angle of the scanning unit is smaller than the angle between two adjacent sub-beams in the second beam, the integrated projection pattern beam has a higher density than the second beam.
  • the integrated projection pattern light beam when the deflection angle of the scanning unit is not less than the field angle of the second light beam, the integrated projection pattern light beam has a larger field angle than the second light beam.
  • An embodiment of the present application also provides a distance measurement system, including a transmitter for emitting a light beam to a target object; the transmitter includes: a light source unit for emitting a first light beam; a beam splitting unit for receiving the The first beam and the first beam are split to form a second beam with a larger number of beams; the scanning unit is configured to receive the second beam and deflect the second beam to a certain angle and then emit a third beam outward; wherein, The integrated projection pattern light beam formed by the plurality of third light beams has a higher density and/or a larger field of view than the second light beam; a collector is used to collect the light reflected by the target object At least part of the emitted light beam forms an optical signal; a processing circuit is connected to the transmitter and the collector, and calculates the distance of the target object according to the optical signal.
  • the second light beam has a higher arrangement density than the first light beam, and/or the second light beam has a larger field of view than the first light beam.
  • the integrated projection pattern beam when the deflection angle of the scanning unit is smaller than the angle between two adjacent sub-beams in the second beam, the integrated projection pattern beam has a higher density than the second beam.
  • the integrated projection pattern light beam when the deflection angle of the scanning unit is not less than the field angle of the second light beam, the integrated projection pattern light beam has a larger field angle than the second light beam.
  • An embodiment of the present application provides a transmitter including: a light source unit for emitting a first light beam; a beam splitting unit for receiving the first light beam and splitting the first light beam to form a second light beam with a larger number of beams. Two light beams; scanning unit for receiving the second light beam and deflecting the second light beam to a certain angle and then emitting a third light beam outward; after multiple deflections, a plurality of the third beams are formed, and the plurality of third beams are formed by the plurality of The integrated projection pattern beam formed by the third beam has a higher density and/or a larger field of view than the second beam.
  • Fig. 1 is a schematic diagram of a time-of-flight distance measurement system according to an embodiment of the present application.
  • Fig. 2 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • Fig. 3 is a schematic diagram of a projection pattern according to an embodiment of the present application.
  • Fig. 4 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • Fig. 5 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • Fig. 6 is a schematic diagram of a projection pattern according to an embodiment of the present application.
  • Fig. 7 is a schematic diagram of an integrated beam splitting scanning unit according to an embodiment of the present application.
  • Fig. 8 is a schematic diagram of an array light source and its sparse projection pattern according to an embodiment of the present application.
  • Fig. 9 is a schematic diagram of an array light source and its dense projection pattern according to an embodiment of the present application.
  • connection can be used for fixing or circuit connection.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present application, “multiple” means two or more than two, unless otherwise specifically defined.
  • the present application provides a time-of-flight distance measurement system, which has a higher resolution and/or a larger field of view.
  • Fig. 1 is a schematic diagram of a time-of-flight distance measurement system according to an embodiment of the present application.
  • the distance measurement system 10 includes a transmitter 11, a collector 12, and a processing circuit 13.
  • the transmitter 11 provides a emitted light beam 30 to the target space to illuminate an object 20 in the space, wherein at least part of the emitted light beam 30 is formed after being reflected by the object 20 At least part of the optical signal (photons) of the reflected light beam 40 is collected by the collector 12.
  • the processing circuit 13 is respectively connected to the transmitter 11 and the collector 12, and synchronizes the trigger signals of the transmitter 11 and the collector 12 to calculate the time required for the light beam to be emitted by the transmitter 11 and received by the collector 12, that is, the emitted light beam 30 and the reflection
  • the flight time t between the beams 40, further, the distance D of the corresponding point on the object can be calculated by the following formula:
  • c is the speed of light.
  • the transmitter 11 includes a light source 111 and an optical element 112.
  • the light source 111 may be a light source such as a light emitting diode (LED), an edge emitting laser (EEL), a vertical cavity surface emitting laser (VCSEL), etc., or an array light source composed of multiple light sources.
  • the array light source 111 is a VCSEL array light source chip formed by generating multiple VCSEL light sources on a single semiconductor substrate.
  • the light beam emitted by the light source 111 may be visible light, infrared light, ultraviolet light, or the like.
  • the light source 111 emits a light beam outward under the control of the processing circuit 13.
  • the light source 111 emits a pulsed light beam at a certain frequency (pulse period) under the control of the processing circuit 13, which can be used in the direct time-of-flight method ( In Direct TOF measurement, the frequency is set according to the measurement distance, for example, it can be set to 1MHz-100MHz, and the measurement distance is several meters to several hundred meters. It can be understood that it may be a part of the processing circuit 13 or a sub-circuit independent of the processing circuit 13 to control the light source 111 to emit related light beams, such as a pulse signal generator.
  • the optical element 112 receives the pulsed beam from the light source 111, and optically modulates the pulsed beam, such as diffraction, refraction, reflection, etc., and then emits the modulated beam into space, such as a focused beam, a flood beam, and a structured light beam. Wait.
  • the optical element 112 may be one or more combinations of lenses, diffractive optical elements, metasurface optical elements, masks, mirrors, MEMS galvanometers, and the like.
  • the processing circuit 13 can be an independent dedicated circuit, such as a dedicated SOC chip, an FPGA chip, an ASIC chip, etc., or it can include a general processing circuit.
  • a dedicated SOC chip such as a dedicated SOC chip, an FPGA chip, an ASIC chip, etc.
  • the processing circuit in the terminal can be used as at least a part of the processing circuit 13.
  • the collector 12 includes a pixel unit 121 and an imaging lens unit 122.
  • the imaging lens unit 122 receives and guides at least part of the modulated light beam reflected back by the object to the pixel unit 121.
  • the pixel unit 121 is composed of a single photon avalanche photodiode (SPAD), or an array pixel unit composed of multiple SPAD pixels.
  • the array size of the array pixel unit represents the resolution of the depth camera, such as 320 ⁇ 240 etc.
  • SPAD can respond to the incident single photon to realize the detection of single photon. Because of its high sensitivity and fast response speed, it can realize long-distance and high-precision measurement.
  • SPAD can count single photons, such as the use of time-correlated single photon counting (TCSPC) to realize the collection of weak light signals and the calculation of flight time .
  • TCSPC time-correlated single photon counting
  • connected to the pixel unit 121 also includes a readout circuit composed of one or more of a signal amplifier, a time-to-digital converter (TDC), an analog-to-digital converter (ADC) and other devices (not shown in the figure).
  • TDC time-to-digital converter
  • ADC analog-to-digital converter
  • these circuits can be integrated with the pixels, and they can also be part of the processing circuit 13. For ease of description, the processing circuit 13 will be collectively regarded.
  • the distance measurement system 10 may also include a color camera, an infrared camera, an IMU, and other devices.
  • the combination of these devices can achieve richer functions, such as 3D texture modeling, infrared face recognition, SLAM, etc. .
  • the transmitter 11 and the collector 12 can also be arranged in a coaxial form, that is, the two are realized by optical devices with reflection and transmission functions, such as a half mirror.
  • the transmitter 11 is set to emit a flood beam with a certain field of view.
  • the advantage is that it covers the entire range of the target under test.
  • Each pixel in the collector 12 is The reflected light beam can be received at the same time.
  • the resolution of the depth image output by the measurement system is affected by the resolution of the pixel unit of the collector 12.
  • the disadvantage is that the power consumption of the transmitter 11 will be high, and it may also cause the collector 11 When there is interference between adjacent pixels during synchronous measurement. Therefore, in this application, the transmitter 11 is configured to emit structured light beams outwards, that is, only a part of the area is illuminated in space.
  • the advantage of using structured light beams is that the illumination is more concentrated and the signal-to-noise ratio is improved.
  • the disadvantage is that the resolution The rate is low, and in some cases, the shortcomings of insufficient field of view are also present.
  • Fig. 2 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • the transmitter includes a light source unit, a beam splitting unit 204, and a scanning unit 205.
  • the light source unit is used to emit a first light beam
  • the beam splitting unit 204 is used to receive and split the first light beam to form a second light beam with a larger number of beams.
  • the scanning unit 205 is used to receive and deflect the second light beam at a certain angle and then emit a third light beam outward. After multiple deflections, multiple third light beams will be formed.
  • the multiple third light beams form a comprehensive projection pattern light beam It has a higher density and/or a larger field of view than the second beam.
  • the light source unit includes a substrate 201 and one or more sub-light sources 202 arranged on a single substrate 201 (or multiple substrates), and the sub-light sources 202 are arranged on the substrate in a certain pattern.
  • the substrate 201 may be a semiconductor substrate, a metal substrate, etc.
  • the sub-light source 202 may be a light emitting diode, a side-emitting laser transmitter, a vertical cavity surface laser transmitter (VCSEL), etc.
  • the light source unit includes a semiconductor substrate and is arranged on the semiconductor substrate An array of VCSEL chips composed of multiple VCSEL sub-light sources.
  • the sub-light source is used to emit light beams of any desired wavelength, such as visible light, infrared light, and ultraviolet light.
  • the light source unit emits light under the modulation drive of the driving circuit (which may be part of the processing circuit 13), such as amplitude modulation, phase modulation, frequency modulation, pulse modulation, and the like.
  • the sub-light sources 202 can also emit light in groups or as a whole under the control of the driving circuit.
  • the sub-light sources 202 include a first sub-light source array 201, a second sub-light source array 202, etc., and the first sub-light source array 201 is controlled by the first driving circuit.
  • the second sub-light source array 202 emits light under the control of the second driving circuit.
  • the arrangement pattern of the sub-light sources 202 may be a one-dimensional arrangement pattern or a two-dimensional arrangement pattern, a regular arrangement pattern, an irregular arrangement pattern, or a combination of a regular pattern and an irregular pattern.
  • the sub-light source includes a 3 ⁇ 3 regular array of sub-light sources.
  • the light source unit further includes one or more of optical elements such as lenses (or lens groups) and microlens arrays.
  • a lens or lens group
  • the lens 203 is used to refract the light beam emitted by the sub-light source to produce a focusing, collimating or diverging effect (forming a focused, collimated or divergent first light beam) to meet the requirements of subsequent Modulation requirements for optical components.
  • the beam splitting unit 204 receives the first light beam emitted from the light source, and replicates and splits the first light beam to form a second light beam with a larger number of light beams. In some embodiments, the beam splitting unit 204 replicates and splits the first beam to form a second beam with a higher arrangement density (for the case of multiple sub-light sources); in some embodiments, the beam splitting unit 204 The first beam is copied and split to form a second beam with a larger field of view, such as the embodiment shown in FIG. 3; in some embodiments, the beam splitting unit 204 copies and splits the first beam to form an arrangement density A second beam with a higher and larger field of view.
  • the beam splitting unit 204 may be a diffractive optical element, a grating, an optical mask, a metasurface optical element, or any other optical device capable of beam splitting, or a combination of more than one.
  • the field of view of the second beam is ⁇
  • the angular offset of two adjacent sub-beams in the second beam is ⁇ .
  • both ⁇ and ⁇ include Components in two directions ( ⁇ x , ⁇ y ), ( ⁇ x , ⁇ y ).
  • the scanning unit 205 After the scanning unit 205 receives the second light beam from the beam splitting unit 204, it deflects and scans the second light beam and then emits a third light beam outward.
  • the scanning unit 205 can realize one-dimensional deflection or two-dimensional deflection for each sub-beam in the incident second light beam through diffraction, refraction, reflection, etc., such as deflection by a certain angle ⁇ ( ⁇ x , ⁇ y ) in at least one direction, Thus, a third beam is formed.
  • FIG. 2 schematically shows a schematic diagram of the scanning unit 205 sequentially deflecting the second light beam by two angles in one direction, where the first and third light beams 206 can be considered to be formed by deflection of 0 degrees; the second and third light beams 207 are The scanning unit 205 deflects the second beam by a small angle ⁇ , which is smaller than the angle between two adjacent sub-beams in the second beam, that is, ⁇ , which is formed after at least two scans.
  • the integrated projection pattern beam composed of at least two third beams has a higher density than the second beam without the scanning unit 205, thereby improving the measurement resolution of the measurement system. Refer to Figure 3 for specific description.
  • the scanning unit 205 can be one of a liquid crystal spatial light modulator, an acousto-optic modulator, a MEMS galvanometer, a rotating prism pair, a single prism + motor, a reflective two-dimensional OPA device, a liquid crystal metasurface device (LC-Metasurface) and other devices.
  • a liquid crystal spatial light modulator an acousto-optic modulator, a MEMS galvanometer, a rotating prism pair, a single prism + motor, a reflective two-dimensional OPA device, a liquid crystal metasurface device (LC-Metasurface) and other devices.
  • the deflection angle of the incident light beam can be controlled by adjusting the arrangement grating period of the liquid crystal molecules.
  • Fig. 3 is a schematic diagram of a projection pattern according to an embodiment of the present application.
  • the projection pattern formed by the third light beam emitted by the transmitter 11 to the target is as shown in FIG. 3.
  • the beam splitting unit 204 replicates and splits the first beam to form a second beam with a larger field of view.
  • the replication method is a 3 ⁇ 3 formation, that is, a 3 ⁇ 3 regularly arranged sub-light source is emitted.
  • the first light beam is replicated 3 ⁇ 3 times to form a second beam pattern 301 with a large field of view formed by 9 first beam patterns 302.
  • the figure is represented by a solid line and a hollow circle.
  • the first and third beam patterns formed are the array spot patterns formed by the solid hollow circles 303 in FIG. 3;
  • the two beams are deflected again, for example, in the vertical direction in FIG. 3, and the deflection angle is smaller than the angle between the two adjacent sub-beams in the second beam, and thus the second beam formed by the dashed space circle 304 in FIG. 3 can be generated. 2.
  • the third beam pattern is the third beam pattern.
  • the scanning direction can be in a single direction or in multiple directions.
  • the scanning unit 205 also increases the angle of view after deflecting the beam direction, and the increased angle of view is relative to the second beam formed by the beam splitting unit 204
  • the angle of view is very small. It is understandable that the density and the angle of view of the projection pattern can be effectively adjusted through the reasonable setting of the deflection angle.
  • the deflection angle ⁇ can be sequentially set to Through n scans, the scan angle is gradually increased Thereby increasing the integrated projection pattern density by n times.
  • the deflection angle ⁇ can be sequentially set to Therefore, the density of the projection pattern and the angle of view can be increased at the same time, that is, the angle of view increases by N ⁇ , and the density of the superimposed area in the middle part increases by n times.
  • the deflection angle is set to exceed the angle of view of the second light beam as ⁇ , and at this time, only the angle of view of the projection pattern is increased. This situation is shown in FIG. 5.
  • Fig. 5 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • the main components of the emitter are similar to the embodiment shown in FIG. 2, including a light source unit composed of a substrate 501, a sub-light source 502 and a lens 503, as well as a beam splitting unit 504 and a scanning unit 505.
  • the scanning unit 505 deflects the incident second beam with a relatively large deflection angle, that is, ⁇ .
  • the first and third beam patterns formed by the first deflection of 0 degrees are 506.
  • the second and third beam patterns 507 are formed after being deflected by ⁇ in a certain direction for the second time.
  • the field angle of the integrated projection pattern formed by the first and second and third beam patterns is increased by 2 times along the deflection direction, and the projection pattern The density has not changed.
  • the scanning unit 505 may be deflected in multiple directions to form a projection pattern with a larger field of view.
  • FIG. 6 shows a schematic diagram of a projection pattern according to an embodiment of the present application.
  • the light source unit includes a regular array composed of 3 ⁇ 3 sub-light sources, and the beam splitting unit performs 3 ⁇ 3 times the replication and splitting of the regular array of sub-light sources to form a 9 ⁇ 9 second light beam.
  • the scanning unit Deflection is performed 3 times in the horizontal and vertical directions, each time the deflection angle is slightly larger than ⁇ (to avoid overlapping of the beams at the neighboring boundary), such as the deflection sequence shown by the arrow in Figure 6, and finally multiple third beams can be formed 602, 603, 604, and 605, a plurality of third light beams together form a projection pattern 601, and the field of view angle in both directions has been increased by a factor of 2 after multiple deflection. It is understandable that, according to actual needs, the number of deflection in each direction and the order of deflection can be set accordingly, which is not limited here.
  • Fig. 4 is a schematic diagram of a transmitter according to an embodiment of the present application.
  • the transmitter includes a light source unit, a scanning unit 404, and a beam splitting unit 405.
  • the light source unit is used to emit a first light beam.
  • the scanning unit 404 is used to receive and deflect the first light beam and then emit a second light beam outward.
  • the beam splitting unit 405 is used to receive After splitting the second beam, a third beam with a larger number of beams is formed. After multiple deflections by the scanning unit 404, multiple second light beams are formed. Correspondingly, the multiple second light beams are split by the beam splitting unit to form corresponding multiple third light beams.
  • the projected pattern beam has a higher density and/or a larger field of view than the second beam.
  • the light source unit includes a substrate 401 and one or more sub-light sources 402 arranged on a single substrate 401 (or multiple substrates), and the sub-light sources 402 are arranged on the substrate in a certain pattern.
  • the substrate 401 may be a semiconductor substrate, a metal substrate, etc.
  • the sub-light source 402 may be a light emitting diode, a side-emitting laser transmitter, a vertical cavity surface laser transmitter (VCSEL), etc.
  • the light source unit includes a semiconductor substrate and is arranged on the semiconductor substrate An array of VCSEL chips composed of multiple VCSEL sub-light sources.
  • the sub-light source is used to emit light beams of any desired wavelength, such as visible light, infrared light, and ultraviolet light.
  • the light source unit emits light under the modulation drive of the driving circuit (which may be part of the processing circuit 13), such as continuous wave modulation, pulse modulation, and the like.
  • the sub-light source 402 can also emit light in groups or as a whole under the control of the driving circuit.
  • the sub-light source 402 includes a first sub-light source array 401, a second sub-light source array 402, etc., and the first sub-light source array 401 is controlled by the first driving circuit.
  • the second sub-light source array 402 emits light under the control of the second driving circuit.
  • the arrangement of the sub-light sources 402 can be a one-dimensional arrangement or a two-dimensional arrangement, and can be a regular arrangement or an irregular arrangement.
  • the light source unit further includes one or more of optical elements such as a lens (or lens group), a microlens array, etc., for example, a lens (or lens group) is provided between the sub-light source 402 and the scanning unit 404 403.
  • the lens 403 is used to refract the light beam emitted by the light source to produce a converging or focusing effect, so as to meet the modulation requirements of subsequent optical elements.
  • the scanning unit 404 receives the first light beam emitted from the light source, and performs deflection scanning on the first light beam to form a second light beam.
  • the scanning unit 404 may implement one-dimensional or two-dimensional deflection for each sub-beam of the incident second light beam through diffraction, refraction, reflection, etc., for example, to deflect a certain angle in at least one direction to form the second light beam.
  • the beam splitting unit 405 receives the second light beam emitted from the scanning unit 404, and replicates and splits the second light beam to form a third light beam with a larger number of beams. In some embodiments, the beam splitting unit 405 replicates and splits the second beam to form a third beam with a higher arrangement density; in some embodiments, the beam splitting unit 405 replicates and splits the second beam to form a visual A third beam with a larger field angle; in some embodiments, the beam splitting unit 405 replicates and splits the second beam to form a third beam with a higher arrangement density and a larger field of view.
  • the beam splitting unit 405 may be any optical device capable of splitting beams, such as a diffractive optical element, an optical mask, or a metasurface optical element.
  • a schematic diagram of the scanning unit 404 deflecting the first light beam by two angles in one direction is schematically given, where the first and second light beams can be considered to be formed by deflection of 0 degrees (scanning in the figure).
  • the solid line between the unit 404 and the beam splitting unit 405); the second second beam is formed by the scanning unit 404 deflecting the first beam by a small angle ⁇ (between the scanning unit 404 and the beam splitting unit 405 in the figure) Dotted line).
  • the angle ⁇ is smaller than the included angle ⁇ between two adjacent sub-beams in the third beam, so the comprehensive projection pattern composed of at least two third beams 406 and 407 formed after at least two scans is relatively
  • the projection pattern corresponding to the third light beam in the scanning unit 404 has a higher density, which can improve the measurement resolution of the measurement system.
  • the deflection angle ⁇ can be sequentially set to Through n scans, the scan angle is gradually increased Thereby increasing the integrated projection pattern density by n times.
  • the deflection angle ⁇ can be sequentially set to Therefore, the density of the projection pattern and the angle of view can be increased at the same time, that is, the angle of view increases by N ⁇ , and the density of the superimposed area in the middle part increases by n times.
  • the deflection angle is set to exceed the angle of view of the second light beam as ⁇ , at this time only the angle of view of the projection pattern is increased. This situation is also shown in Fig. 5, which is similar to the previous analysis.
  • 504 in FIG. 5 is a scanning unit and 505 is a beam splitting unit, so that the large field of view projection pattern as shown in FIG. 6 can also be formed.
  • the beam splitting unit and the scanning unit are arranged in reverse to achieve similar functions.
  • the scanning unit can also be separated before and after the scanning unit.
  • the first beam splitting unit and the second beam splitting unit can be provided to achieve more complex functions, or the first scanning unit and the second scanning unit can be set before and after the beam splitting unit.
  • the splitting unit can be set reasonably according to actual needs. The number of beam units and scanning units and the relative position arrangement relationship. These schemes all fall into the protection scope of this application.
  • a high-density and/or large field of view projection can be formed by functionally configuring the beam splitting unit and the scanning unit rationally.
  • the present application also provides an integrated beam splitting scanning device.
  • Fig. 7 is a schematic diagram of an integrated beam splitting scanning device according to an embodiment of the present application.
  • the integrated beam splitting scanning device can be used in the transmitters in the embodiments shown in FIGS. 1 to 6 and can also be used in any other required devices.
  • the integrated beam splitting scanning device is used to receive the first beam, split and scan the beam to form a third beam.
  • the integrated beam splitting scanning device includes a first transparent substrate 701, a second transparent substrate 702, a liquid crystal layer 703, and a beam splitting unit 704 arranged on the first transparent substrate and/or the second transparent substrate.
  • the liquid crystal layer 703 is used to deflect the incident light beam to achieve scanning, and the beam splitting unit 704 is used to split the incident light beam.
  • the first transparent substrate 701 and the second transparent substrate 702 may be arranged opposite to each other in parallel.
  • the liquid crystal layer 703 is installed between the first transparent substrate 701 and the second transparent substrate 702, and the substrate can protect the liquid crystal layer.
  • other functional layers can be added in addition to the liquid crystal layer between the two substrates according to needs, such as positive and negative electrode layers, which are arranged on both sides of the liquid crystal layer; polarized light can also be added on the outer or inner surface of the substrate Layers and so on.
  • the integrated beam splitting scanning device includes a support 705 disposed between the first transparent substrate 701 and the second transparent substrate 702, and the support 705 is disposed around the liquid crystal layer to protect the liquid crystal layer while supporting the first transparent substrate. 701 and the role of the second transparent substrate 702.
  • the support can be made of any material, such as semiconductor materials, adhesives, and so on.
  • the beam splitting unit 704 includes one or a combination of diffractive optical elements such as diffraction gratings, binary gratings, and metasurface optical elements, that is, generated on the surface of a transparent substrate by means of photolithography, etching, etc. Diffractive optical microstructure and super-surface structure, so as to realize the high integration of beam splitting unit and scanning unit.
  • the diffractive optical microstructure and the super-surface structure can be formed on a single surface or two surfaces of the first transparent substrate 701 and/or the second transparent substrate according to actual needs.
  • forming the diffractive optical microstructure on the inner surface of a single transparent substrate can effectively protect the diffractive optical microstructure.
  • This application also provides a method for manufacturing an integrated beam splitting scanning device, which includes the following steps:
  • the liquid crystal layer is installed between the first transparent substrate and the second transparent substrate.
  • the integrated beam-splitting scanning device including the support, it further includes the step of installing the support between the first transparent substrate and the second transparent substrate and at the periphery of the liquid crystal layer.
  • this application also provides a dynamic distance measurement system based on the transmitter of the grouped array light source.
  • the light source of the transmitter in this system includes an array light source, and the sub-light sources in the array light source are divided into multiple sub-light source arrays, and each sub-light source array can be independently grouped and controlled.
  • multiple sub-light source arrays can be arranged in zones, namely Each sub-light source array has an independent spatial partition, and multiple sub-light source arrays can also be arranged crosswise, that is, the sub-light sources in different sub-light source arrays are staggered in spatial arrangement.
  • the sub-light source array should include at least one sub-light source. It is understandable that when the sub-light source array is independently turned on, a corresponding projection pattern will be formed.
  • the density of the projection pattern is related to the density and number of the sub-light source array, and contains the density of the projection pattern corresponding to the more densely arranged sub-light source array. The greater the value, the greater the density of the projection pattern corresponding to the more number of sub-light source arrays turned on.
  • the processing circuit in the measurement system can implement the following dynamic distance measurement method, which specifically includes the following steps:
  • the scanning unit uses the scanning unit to form a first projection pattern with a first field of view; the first projection pattern is also called a sparse projection pattern.
  • FIG. 8 is a schematic diagram of an array light source and its sparse projection pattern according to an embodiment of the present application.
  • the light source in the transmitter includes a light source array 801, which includes a plurality of sub-light source arrays, such as a first sub-light source array (shown by a hollow circle in FIG. 8) and a second sub-light source array (shown by a solid circle in FIG. 8).
  • the beam splitting unit and the scanning unit in the transmitter respectively split and scan the light beam emitted by the first sub-light source array (or scan first and then split the beam).
  • the projection pattern 802 exits and enters the first field of view area containing the target 804.
  • the beam splitting unit performs 2 ⁇ 2 times the copy splitting of the incident beam
  • the scanning unit sequentially scans the incident beam 3 ⁇ 3 to expand the field of view by 3 times in the horizontal and vertical directions.
  • the collector collects the light signal reflected from the sparse projection pattern beam by the target, and is further calculated by the processing circuit to obtain the corresponding sparse projection pattern
  • the first depth image of the first resolution can theoretically obtain the depth value of each spot 803, so the depth value of the spot will constitute the first depth image.
  • the target in the field of view can be recognized, for example, the pixel area where the target is located can be recognized by any suitable method such as threshold segmentation method, edge detection method, feature recognition and so on.
  • the scanning unit uses the scanning unit to form a second projection pattern with a second field of view, and calculate a second depth image with a second resolution; the second projection pattern is also called a dense projection pattern. Since the target is identified in the previous step and the pixel area where the target is located, generally speaking, the movement of the target will not be too large, and the interval between two adjacent measurements is very short, which can be considered as the result of two adjacent measurements. The target position does not change within the time. Therefore, in this measurement, the scanning unit can only form the projection pattern of the second field of view that is smaller than the first field of view of the target area, and at the same time, it can turn on more sub-fields than in step S1.
  • the light source array is used to form a dense projection pattern with a greater density of the relative beam arrangement. Based on the dense projection pattern, the collector can obtain effective data containing more spots of the target to calculate a depth image with higher resolution to achieve only High-resolution measurement of the target area. It is understandable that the resolution mentioned here generally refers to the number of effective depth value pixels, and the larger the number of effective depth value pixels, the higher the resolution, so the second resolution is higher than the first resolution.
  • FIG. 9 shows a schematic diagram of an array light source and its dense projection pattern according to an embodiment of the present application. In this embodiment, the first array light source and the second array light source are turned on at the same time, that is, the first sub-light source array and the second sub-light source array are turned on simultaneously.
  • the projected pattern of the 2 ⁇ 2 field of view composed of sub-fields of view has a reduced field of view, but the density of the projected pattern is increased, which can achieve higher resolution with lower power consumption. Measurement. It is understandable that if the light source unit contains multiple sub-light source arrays with different arrangement densities, for example, the arrangement density of the first sub-light source array is less than the arrangement density of the second sub-light source array, and only the second sub-light source array can be turned on in this step.
  • the light source array can also achieve the effect of projecting dense projection patterns.
  • time-of-flight distance measurement system is taken as an example for description, but the related transmitter and dynamic distance measurement scheme can also be applied to other measurement systems such as structured light three-dimensional measurement systems.

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Abstract

一种发射器（11）及一种距离测量系统。发射器（11）包括：光源单元，用于发射第一光束；分束单元（204），用于接收第一光束并对第一光束进行分束后形成光束数量更多的第二光束；扫描单元（205），用于接收第二光束并偏转第二光束一定角度后向外发射第三光束，经过多次偏转之后形成多个第三光束，由多个第三光束所形成的综合投影图案光束比第二光束拥有更高的密度和/或更大的视场角。通过对分束单元以及扫描单元的合理配置实现了更高密度或者更大视场角的光束投影。

Description

一种发射器及距离测量系统
本申请要求于2019年9月27日提交中国专利局，申请号为201910927183.4，发明名称为“一种发射器及距离测量系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及计算机技术领域，尤其涉及一种发射器及距离测量系统。
背景技术
利用飞行时间原理(Time of Flight)、结构光原理可以对目标进行距离测量以获取包含目标深度值的深度图像，进一步基于该深度图像可以实现三维重建、人脸识别、人机交互等功能，相关的距离测量系统已被广泛应用于消费电子、无人架驶、AR/VR等领域。
基于飞行时间原理以及结构光原理的距离测量系统一般都包含有一个光束发射器以及采集器。发射器中的光源向目标空间发射光束以提供照明，采集器接收由目标反射回的光束。其中，飞行时间距离测量系统通过计算光束由发射到反射接收所需要的时间来计算目标物体的距离；而结构光距离测量系统则通过对反射回的光束图案进行处理并利用三角法计算目标物体的距离。
无论是哪一种原理方案的距离测量系统，目前均面临着一些难题亟需解决，最核心的是测量分辨率的难题、功耗的难题以及体积的难题。
其中，测量分辨率往往受到发射器所发射的光束的影响，所发射光束越密集，分辨率往往越高，但密集光束对光源排列密度要求以及相关光学器件的设计要求均较高，同时密集光束也意味着更高的功耗。而功耗的难题也受到发射器的影响，发射器发射光束功率越高、光束密度越大则功耗越高，进一步限制 了测量系统更广泛地应用于更多领域。其次，体积的难题往往由于发射器或者采集器中复杂的器件所导致的，比如发射器通常会包含光源以及一些折射、衍射等光学元件，这就导致体积较大不易集成。所以，发射器是一个关键问题，提供好的发射器对解决上述问题事关重要。
发明内容
本申请的目的在于提供一种发射器及距离测量系统，以解决上述背景技术问题中的至少一种。
为达到上述目的，本申请实施例的技术方案是这样实现的：
一种发射器，包括：光源单元，用于发射第一光束；分束单元，用于接收所述第一光束并对第一光束进行分束后形成光束数量更多的第二光束；扫描单元，用于接收所述第二光束并偏转第二光束一定角度后向外发射第三光束；经过多次所述偏转之后形成多个所述第三光束，由所述多个第三光束所形成的综合投影图案光束比所述第二光束拥有更高的密度和/或更大的视场角。
在一些实施例中，所述光源单元还包括透镜，所述透镜用于对光源发出的光束进行折射以产生聚焦、准直或发散效果。
在一些实施例中，所述光源单元包括基底以及设置在所述基底上的至少一个子光源，所述子光源以一定的图案形式排列在所述基底上。
在一些实施例中，所述图案包括二维图案，所述二维图案包括规则图案和/或不规则图案。
在一些实施例中，所述光源单元包括多个子光源，所述多个子光源可以被分组独立控制。
在一些实施例中，所述分束单元包括衍射光学元件和/或超表面光学元件。
在一些实施例中，所述第二光束比所述第一光束拥有更高的排列密度，和/或，所述第二光束比所述第一光束拥有更大的视场角。
在一些实施例中，当所述扫描单元偏转的角度小于所述第二光束中相邻两 个子光束的夹角时，所述综合投影图案光束比所述第二光束拥有更高的密度。
在一些实施例中，当所述扫描单元偏转的角度不小于所述第二光束的视场角时，所述综合投影图案光束比所述第二光束拥有更大的视场角。
本申请实施例还提供一种距离测量系统，包括发射器，以用于向目标物体发射光束；所述发射器包括：光源单元，用于发射第一光束；分束单元，用于接收所述第一光束并对第一光束进行分束后形成光束数量更多的第二光束；扫描单元，用于接收所述第二光束并偏转第二光束一定角度后向外发射第三光束；其中，由所述多个第三光束所形成的综合投影图案光束比所述第二光束拥有更高的密度和/或更大的视场角；采集器，用于采集被所述目标物体反射回的至少部分所述发射光束并形成光信号；处理电路，与所述发射器以及所述采集器连接，并根据所述光信号计算所述目标物体的距离。
在一些实施例中，所述第二光束比所述第一光束拥有更高的排列密度，和/或，所述第二光束比所述第一光束拥有更大的视场角。
在一些实施例中，当所述扫描单元偏转的角度小于所述第二光束中相邻两个子光束的夹角时，所述综合投影图案光束比所述第二光束拥有更高的密度。
在一些实施例中，当所述扫描单元偏转的角度不小于所述第二光束的视场角时，所述综合投影图案光束比所述第二光束拥有更大的视场角。
本申请实施例提供一种发射器，包括：光源单元，用于发射第一光束；分束单元，用于接收所述第一光束并对第一光束进行分束后形成光束数量更多的第二光束；扫描单元，用于接收所述第二光束并偏转第二光束一定角度后向外发射第三光束；经过多次所述偏转之后形成多个所述第三光束，由所述多个第三光束所形成的综合投影图案光束比所述第二光束拥有更高的密度和/或更大的视场角。通过对分束单元以及扫描单元的合理配置实现了更高密度或者更大视场角的光束投影，最终可以实现测量分辨率以及视场角的提升，解决了现有技术中测量分辨率低的问题。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动性的前提下，还可以根据这些附图获得其他的附图。
图1是根据本申请一个实施例的飞行时间距离测量系统示意图。
图2是根据本申请一个实施例的发射器示意图。
图3是根据本申请一个实施例的投影图案示意图。
图4是根据本申请一个实施例的发射器示意图。
图5是根据本申请一个实施例的发射器示意图。
图6是根据本申请一个实施例的投影图案示意图。
图7是根据本申请一个实施例的集成分束扫描单元示意图。
图8是根据本申请一个实施例的阵列光源及其稀疏投影图案示意图。
图9是根据本申请一个实施例的阵列光源及其密集投影图案示意图。
具体实施方式
为了使本申请实施例所要解决的技术问题、技术方案及有益效果更加清楚明白，以下结合附图及实施例，对本申请进行进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本申请，并不用于限定本申请。
需要说明的是，当元件被称为“固定于”或“设置于”另一个元件，它可以直接在另一个元件上或者间接在该另一个元件上。当一个元件被称为是“连接于”另一个元件，它可以是直接连接到另一个元件或间接连接至该另一个元件上。另外，连接即可以是用于固定作用也可以是用于电路连通作用。
需要理解的是，术语“长度”、“宽度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本 申请实施例和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多该特征。在本申请实施例的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
本申请提供了一种飞行时间距离测量系统，其具有更高的分辨率和/或更大的视场角。
图1所示是根据本申请一个实施例的飞行时间距离测量系统示意图。所述距离测量系统10包括发射器11、采集器12以及处理电路13；发射器11提供发射光束30至目标空间中以照明空间中的物体20，其中至少部分发射光束30经物体20反射后形成反射光束40，反射光束40的至少部分光信号(光子)被采集器12采集。处理电路13分别与发射器11以及采集器12连接，同步发射器11以及采集器12的触发信号以计算光束由发射器11发出并被采集器12接收所需要的时间，即发射光束30与反射光束40之间的飞行时间t，进一步的，物体上对应点的距离D可由下式计算出：
D＝c·t/2          (1)
其中，c为光速。
发射器11包括光源111、光学元件112。光源111可以是发光二极管(LED)、边发射激光器(EEL)、垂直腔面发射激光器(VCSEL)等光源，也可以是多个光源组成的阵列光源。可选地，阵列光源111是在单块半导体基底上生成多个VCSEL光源以形成的VCSEL阵列光源芯片。光源111所发射的光束可以是可见光、红外光、紫外光等。光源111在处理电路13的控制下向外发射光束，比如在一些实施例中，光源111在处理电路13的控制下以一定的频率(脉冲周期)发射脉冲光束，可以用于直接飞行时间法(Direct TOF)测量中,频率根据测量距离进行设定，比如可以设置成1MHz-100MHz，测量距离在几米至几百米。可以理解的是， 可以是处理电路13中的一部分或者独立于处理电路13存在的子电路来控制光源111发射相关的光束，比如脉冲信号发生器。
光学元件112接收来自光源111的脉冲光束，并将脉冲光束进行光学调制，比如衍射、折射、反射等调制，随后向空间中发射被调制后的光束，比如聚焦光束、泛光光束、结构光光束等。光学元件112可以是透镜、衍射光学元件、超表面(Metasurface)光学元件、掩膜板、反射镜、MEMS振镜等形式中的一种或多种组合。
处理电路13可以是独立的专用电路，比如专用SOC芯片、FPGA芯片、ASIC芯片等等，也可以包含通用处理电路，比如当该深度相机被集成到如手机、电视、电脑等智能终端中去，终端中的处理电路可以作为该处理电路13的至少一部分。
采集器12包括像素单元121、成像透镜单元122。其中，成像透镜单元122接收并将由物体反射回的至少部分调制光束引导到像素单元121上。在一些实施例中，像素单元121由单光子雪崩光电二极管(SPAD)组成，也可以由多个SPAD像素组成的阵列像素单元，阵列像素单元的阵列大小代表着该深度相机的分辨率，比如320×240等。SPAD可以对入射的单个光子进行响应从而实现对单光子的检测，由于其具备灵敏度高、响应速度快等优点，可以实现远距离、高精度地测量。与CCD/CMOS等组成的以光积分为原理的图像传感器相比，SPAD可以通过对单光子进行计数，比如利用时间相关单光子计数法(TCSPC)实现对微弱光信号的采集以及飞行时间的计算。通常地，与像素单元121连接的还包括由信号放大器、时数转换器(TDC)、模数转换器(ADC)等器件中的一种或多种组成的读出电路(图中未示出)。这些电路即可以与像素整合在一起，这也可以是处理电路13中的一部分，为了便于描述，将统一视作处理电路13。
在一些实施例中，距离测量系统10还可以包括有彩色相机、红外相机、IMU等器件，与这些器件的组合可以实现更加丰富的功能，比如3D纹理建模、红外人脸识别、SLAM等功能。
在一些实施例中，发射器11与采集器12也可以被设置成共轴形式，即二者之间通过具备反射及透射功能的光学器件来实现，比如半透半反镜等。
传统的距离测量系统中，发射器11被设置成向外发射具有一定视场角的泛光光束，其优点是对被测目标进行了全范围的照明覆盖，采集器12中的每个像素在同一时刻均可以接收到反射回的光束，测量系统输出的深度图像的分辨率受到采集器12的像素单元分辨率影响，缺点则是发射器11的功耗将高，另外也可能会导致采集器11相邻像素同步测量时相互之间有干扰的情形。因此在本申请中，发射器11被设置成向外发射结构光光束，即在空间上仅部分区域被照亮，采用结构光光束的优点是照明更加集中从而提升信噪比，缺点则是分辨率较低，另外在一些情形下也会呈现视场角不够的缺点。
图2是根据本申请一个实施例的发射器示意图。其中，发射器包括光源单元、分束单元204以及扫描单元205，光源单元用于发射第一光束，分束单元204用于接收并对第一光束进行分束后形成光束数量更多的第二光束，扫描单元205用于接收并偏转第二光束一定角度后向外发射第三光束，经过多次偏转之后将会形成多个第三光束，该多个第三光束所形成的综合投影图案光束比第二光束拥有更高的密度和/或更大的视场角。
光源单元包括基底201以及设置在单片基底201(或多片基底)上的一个或多个子光源202，子光源202以一定的图案形式排列在基底上。基底201可以是半导体基底、金属基底等，子光源202可以是发光二极管、边发射激光发射器、垂直腔面激光发射器(VCSEL)等，可选地，光源单元包括半导体基底以及设置在半导体基底上的多个VCSEL子光源所组成的阵列VCSEL芯片。子光源用于发射任意需要波长的光束，比如可见光、红外光、紫外光等。光源单元在驱动电路(可以是处理电路13的一部分)的调制驱动下进行发光，比如幅度调制、相位调制、频率调制、脉冲调制等。子光源202也可以在驱动电路的控制下分组发光或者整体发光，比如子光源202包含第一子光源阵列201、第二子光源阵列202等，第一子光源阵列201在第一驱动电路的控制下发光、第二子光源阵列202在第 二驱动电路的控制下发光。子光源202的排列图案可以是一维排列图案、也可以是二维排列图案，可以是规则排列图案、也可以是不规则排列图案，或者是规则图案和不规则图案的组合。为了便于分析，图2中仅示意性地给出一种示例，该示例中子光源包括3×3的规则阵列子光源。
在一些实施例中，光源单元还包括透镜(或透镜组)、微透镜阵列等光学元件中的一种或多种，比如在子光源202与分束单元204之间设置了透镜(或透镜组或透镜组与微透镜阵列的组合)203，透镜203用于对子光源发出的光束进行折射以产生聚焦、准直或发散效果(形成聚焦、准直或发散的第一光束)，以满足后续光学元件的调制需求。
分束单元204接收来自光源发出的第一光束，并对第一光束进行复制分束以形成光束数量更多的第二光束。在一些实施例中，分束单元204对第一光束进行复制分束以形成排列密度更高的第二光束(对于子光源为多个时的情形)；在一些实施例中，分束单元204对第一光束进行复制分束以形成视场角更大的第二光束，例如图3所示实施例；在一些实施例中，分束单元204对第一光束进行复制分束以形成排列密度更高及视场角更大的第二光束。分束单元204可以是衍射光学元件、光栅、光学掩膜板、超表面(Metasurface)光学元件等任意可以实现分束的光学器件中的一种或多种的组合。为了便于分析，假定第二光束的视场角为α，第二光束中相邻两个子光束的角偏移为β，需要说明的是，若第二光束是空间光束，则α、β均包含两个方向的分量(α x,α y)、(β x,β y)。
扫描单元205接收来自分束单元204的第二光束后，对第二光束进行偏转扫描后向外发射第三光束。扫描单元205可以对入射的第二光束中的各个子光束通过衍射、折射、反射等方式实现一维偏转或者二维偏转，比如沿至少一方向偏转一定的角度θ(θ x,θ y)，从而形成第三光束。图2中示意性给出扫描单元205对第二光束沿一个方向依次偏转了两个角度的示意图，其中第一第三光束206可以认为是偏转了0度所形成；第二第三光束207是扫描单元205对第二光束偏转了一个较小的角度θ所形成，该角度小于第二光束中相邻两个子光束之间 的夹角，即θ<β，由此通过至少两次扫描之后形成的至少两个第三光束所组成的综合投影图案光束相对于没有扫描单元205时的第二光束具有更高的密度，由此便可以提升测量系统的测量分辨率。具体描述参见图3。扫描单元205可以是液晶空间光调制器、声光调制器、MEMS振镜、旋转棱镜对、单个棱镜+电机、反射式二维OPA器件、液晶超表面器件(LC-Metasurface)等器件中的一种或多种的组合。比如当扫描单元205是液晶空间光调制器时，可以通过调控液晶分子的排列光栅周期来控制对入射光束的偏转角度。
图3是根据本申请一个实施例的投影图案示意图。基于图2所示的发射器11，在一些实施例中，发射器11向目标发射的第三光束所形成的投影图案如图3所示。在本实施例中，分束单元204对第一光束进行复制分束以形成视场角更大的第二光束，复制的方式是3×3的形成，即将3×3规则排列的子光源发出的第一光束进行3×3倍的复制以形成由9个第一光束图案302形成的大视场角的第二光束图案301，第二光束图案301中包含了9×9＝81个子光束303，图中用实线空心圆圈表示。假设扫描单元205对第二光束进行偏转，第一次偏转为0度，所形成的第一第三光束图案即图3中实线空心圆圈303所组成的阵列斑点图案；随后扫描单元205对第二光束进行再次偏转，比如沿图3中的竖直方向偏转，偏转角度小于第二光束中相邻两个子光束之间的夹角，由此可以产生图3中虚线空间圆圈304所组成的第二第三光束图案。由于偏转角度较小，本实施例中偏转角度正好是第二光束中相邻两个子光束的一半，即θ＝β/2，虚线空心圆圈304将会落在两个实线空心圆圈303之间，多次扫描之后由多个第三光束所形成的综合扫描图案将拥有更高的密度。扫描的方向可以沿单个方向，也可以沿多个方向。
实际上，图2及图3所示的实施例中，扫描单元205通过偏转光束方向后，同样也增加了视场角，所增加的视场角相对于分束单元204所形成的第二光束的视场角而言十分微小。可以理解的是，通过偏转角度的合理设置可以有效地调节投影图案的密度与视场角。在一些实施例中，偏转角度θ可以依次设置成
Figure PCTCN2019113705-appb-000001
通过n次扫描，扫描角度逐次增加
Figure PCTCN2019113705-appb-000002
从而将综合的投影图案密度增加n倍。在一些实施例中，偏转角度θ可以依次设置成
Figure PCTCN2019113705-appb-000003
Figure PCTCN2019113705-appb-000004
由此可以同时增加投影图案的密度与视场角，即视场角增加了Nβ，中间部分叠加区域的密度增加了n倍。在一些实施例中，偏转角度被设置成超过了第二光束的视场角为α，此时仅仅增加了投影图案的视场角，这一情形如图5所示。
图5是根据本申请一个实施例的发射器示意图。发射器的主要组成部分与图2所示实施例相似，包含由基底501、子光源502以及透镜503所组成的光源单元，以及分束单元504和扫描单元505。与图2所示实施例不同的是，扫描单元505对入射的第二光束进行偏转的偏转角度相对比较大，即θ≥α，比如首次偏转0度形成的第一第三光束图案为506，第二次沿某一方向偏转α后形成第二第三光束图案507，第一与第二第三光束图案所形成的综合投影图案的视场角沿偏转方向得到了2倍的提升，投影图案的密度没有变化。
在一些实施例中，扫描单元505可以沿多个方向进行偏转以形成更大视场角的投影图案，比如图6所示的是根据本申请一个实施例的投影图案示意图。在本实施例中，光源单元包括3×3个子光源组成的规则阵列，分束单元对子光源的规则阵列进行3×3倍的复制分束以形成9×9排列的第二光束，扫描单元分别沿水平、竖直方向进行偏转3次，每次的偏转角度略大于α(避免邻界处的光束重叠)，比如图6中的箭头所示的偏转顺序，最终可以形成多个第三光束602、603、604、605，多个第三光束共同组成投影图案601，通过多次偏转之后视场角沿两个方向均得到了2倍的提升。可以理解的是，根据实际需要，每个方向偏转的次数以及偏转的顺序可以进行相应的设定，在此不做限制。
图4是根据本申请一个实施例的发射器示意图。发射器包括光源单元、扫描单元404以及分束单元405，光源单元用于发射第一光束，扫描单元404用于接收并偏转第一光束后向外发射第二光束，分束单元405用于接收并对第二光 束进行分束后形成光束数量更多的第三光束。由扫描单元404经过多次偏转之后将形成多个第二光束，相应地，多个第二光束经分束单元分束后也形成对应的多个第三光束，这些第三光束所形成的综合投影图案光束比第二光束拥有更高的密度和/或更大的视场角。
光源单元包括基底401以及设置在单片基底401(或多片基底)上的一个或多个子光源402，子光源402以一定的图案形式排列在基底上。基底401可以是半导体基底、金属基底等，子光源402可以是发光二极管、边发射激光发射器、垂直腔面激光发射器(VCSEL)等，可选地，光源单元包括半导体基底以及设置在半导体基底上的多个VCSEL子光源所组成的阵列VCSEL芯片。子光源用于发射任意需要波长的光束，比如可见光、红外光、紫外光等。光源单元在驱动电路(可以是处理电路13的一部分)的调制驱动下进行发光，比如连续波调制、脉冲调制等。子光源402也可以在驱动电路的控制下分组发光或者整体发光，比如子光源402包含第一子光源阵列401、第二子光源阵列402等，第一子光源阵列401在第一驱动电路的控制下发光、第二子光源阵列402在第二驱动电路的控制下发光。子光源402的排列可以是一维排列、也可以是二维排列，可以是规则排列、也可以是不规则排列。
在一些实施例中，光源单元还包括透镜(或透镜组)、微透镜阵列等光学元件中的一种或多种，比如在子光源402与扫描单元404之间设置了透镜(或透镜组)403，透镜403用于对光源发出的光束进行折射以产生汇聚或聚焦效果，以满足后续光学元件的调制需求。
扫描单元404接收来自光源发出的第一光束，并对第一光束进行偏转扫描后形成第二光束。扫描单元404可以对入射的第二光束中的各个子光束通过衍射、折射、反射等方式实现一维偏转或者二维偏转，比如沿至少一方向偏转一定的角度，从而形成第二光束。
分束单元405接收来自扫描单元404发出的第二光束，并对第二光束进行复制分束以形成光束数量更多的第三光束。在一些实施例中，分束单元405对第 二光束进行复制分束以形成排列密度更高的第三光束；在一些实施例中，分束单元405对第二光束进行复制分束以形成视场角更大的第三光束；在一些实施例中，分束单元405对第二光束进行复制分束以形成排列密度更高及视场角更大的第三光束。分束单元405可以是衍射光学元件、光学掩膜板、超表面(Metasurface)光学元件等任意可以实现分束的光学器件。与图2所示实施例类似地，通过设置偏转角度θ与第三光束的视场角α、相邻子光束之间角偏移为β之间的关系，可以形成密度更高、视场角更大的综合投影图案。
在图4所示实施例中，示意性给出扫描单元404对第一光束沿一个方向偏转了两个角度的示意图，其中第一第二光束可以认为是偏转了0度所形成(图中扫描单元404与分束单元405之间的实线)；第二第二光束是扫描单元404对第一光束偏转了一个较小的角度θ所形成(图中扫描单元404与分束单元405之间的虚线)。该角度θ小于第三光束中相邻两个子光束之间的夹角θ<β，由此通过至少两次扫描之后形成的至少两个第三光束406及407所组成的综合投影图案相对于没有扫描单元404时的第三光束对应的投影图案具有更高的密度，由此便可以提升测量系统的测量分辨率。
在一些实施例中，偏转角度θ可以依次设置成
Figure PCTCN2019113705-appb-000005
通过n次扫描，扫描角度逐次增加
Figure PCTCN2019113705-appb-000006
从而将综合的投影图案密度增加n倍。在一些实施例中，偏转角度θ可以依次设置成
Figure PCTCN2019113705-appb-000007
由此可以同时增加投影图案的密度与视场角，即视场角增加了Nβ，中间部分叠加区域的密度增加了n倍。在一些实施例中，偏转角度被设置成超过了第二光束的视场角为α，此时仅仅增加了投影图案的视场角，这一情形同样如图5所示，与前面分析类似，此时图5中504为扫描单元、505为分束单元，由此同样可以形成如图6所示的大视场投影图案。
可以理解的是，在图2与图4所示的实施例中，分别给出了分束单元与扫描单元通过相反设置以实现类似的功能，在一些实施例中，也可以在扫描单元 前后分别设置第一分束单元以及第二分束单元以实现更加复杂的功能，或者可以在分束单元的前后分别设置第一扫描单元以及第二扫描单元，类似地，可以根据实际需要合理地设置分束单元、扫描单元的数量以及相对位置排布关系。这些方案均落入本申请的保护范围之内。
以上各实施例中，通过对分束单元与扫描单元在功能上进行合理的配置可以形成高密度和/或大视场的投影。然而由于需要将多种光学器件集成在单个发射器中，无疑给制造带来了较大的挑战。为了解决这一问题，本申请还提供一种集成的分束扫描装置。
图7是根据本申请一个实施例的集成分束扫描装置示意图。集成分束扫描装置可以被用于图1-图6所示各实施例中的发射器中，也可以被用于其他任意需要的器件中。集成分束扫描装置用于接收第一光束，并将光束进行分束及扫描后形成第三光束。集成分束扫描装置包括第一透明基底701、第二透明基底702、液晶层703以及设置在第一透明基底和/或第二透明基底上的分束单元704。液晶层703用于对入射的光束进行偏转以实现扫描，分束单元704用于对入射的光束进行分束。第一透明基底701、第二透明基底702可以平行相对设置。液晶层703被安装在第一透明基底701以及第二透明基底702之间，基底可以起到保护液晶层的作用。另外根据需要在两个基底之间的液晶层之外还可以增加其他功能层，比如正负电极层，该正负电极层设置在液晶层两侧；在基底外表面或内表面也可以增加偏光层等。
在一些实施例中，集成分束扫描装置包括设置在第一透明基底701与第二透明基底702之间的支撑705，支撑705设置在液晶层周围以保护液晶层同时起到支撑第一透明基底701以及第二透明基底702的作用。支撑可以是任意材料制成，比如半导体材料、粘合剂等。
在一些实施例中，分束单元704包括衍射光栅、二元光栅等衍射光学元件、超表面(Metasurface)光学元件中的一种或组合，即在透明基底的表面通过光刻、蚀刻等方式生成衍射光学微结构、超表面结构，从而实现分束单元与扫描 单元的高度集成。衍射光学微结构、超表面结构根据实际需要可以形成在第一透明基底701和/或第二透明基底的单个表面或者两个表面上。可选地，将衍射光学微结构形成在单个透明基底的内表面，可以有效地对衍射光学微结构进行保护。
本申请还提供了一种制造集成分束扫描装置的方法，包括以下步骤：
提供液晶层，用于对入射光束进行偏转以实现扫描；
提供第一透明基底以及第二透明基底，并在第一透明基底和/或第二透明基底的单个表面或者两个表面生成分束单元；
将液晶层安装在第一透明基底以及第二透明基底之间。
对于包含支撑的集成分束扫描装置而言，还包括将支撑安装在第一透明基底与第二透明基底之间以及在液晶层外围的步骤。
对于通过扫描单元对光束实施偏转以实现大视场投影的发射器而言(如图5所示，分束单元与扫描单元位置不做限定，即分束单元可以在扫描单元前面也可以在后面)，本申请还提供一种基于分组阵列光源的发射器的动态距离测量系统。该系统中发射器的光源包括阵列光源，且阵列光源中的子光源被分成多个子光源阵列，且各个子光源阵列可以被独立分组控制，在空间排布上，多个子光源阵列可以分区设置即每个子光源阵列拥有独立的空间分区，多个子光源阵列也可以交叉设置，即不同的子光源阵列中子光源在空间排布上有交错。子光源阵列中应包括至少一个子光源。可以理解的是，当子光源阵列被独立打开时，将形成对应的投影图案，投影图案的密度与子光源阵列的密度、数量有关系，含有更密集排列的子光源阵列所对应的投影图案密度越大，另外开启更多数量的子光源阵列所对应的投影图案的密度也越大。基于该分组阵列光源的大视场投影方案(图5所示)，测量系统中的处理电路可以实现如下的动态距离测量方法，具体包括如下步骤：
S1、开启至少一个第一子光源阵列，利用扫描单元形成具有第一视场的第一投影图案；第一投影图案也称为稀疏投影图案。
如图8所示的是根据本申请一个实施例的阵列光源及其稀疏投影图案示意图。发射器中的光源包括光源阵列801，其包括多个子光源阵列，比如第一子光源阵列(图8中空心圆圈所示)以及第二子光源阵列(图8中实心圆圈所示)。首先开启第一子光源阵列，发射器中的分束单元以及扫描单元分别对第一子光源阵列所射出的光束进行分束和扫描(或者先扫描再分束)最终以图8中右侧所示的投影图案802出射，并入射到包含目标804的第一视场区域中。这里示意性地给出分束单元对入射光束进行了2×2倍的复制分束，扫描单元则依次对入射光束进行了3×3的扫描将视场沿横、纵向分别扩大了3倍。
S2、获得第一分辨率的第一深度图像，并识别出目标所在区域；采集器采集由稀疏投影图案光束被目标反射回的光信号，并进一步由处理电路计算以获得与稀疏投影图案对应的第一分辨率的第一深度图像，理论上可以获取每个斑点803的深度值，所以斑点的深度值将组成第一深度图像。基于该深度图像可以对视场中的目标进行识别，比如通过阈值分割法、边缘检测法、特征识别等任意合适的方式识别出目标所在的像素区域。
S3、开启至少一个第二子光源阵列，利用扫描单元形成具有第二视场的第二投影图案，并计算第二分辨率的第二深度图像；第二投影图案也称为密集投影图案。由于通过上一步骤中对目标进行了识别并定位出目标所在的像素区域，一般而言目标的运动不会太大，同时相邻两次测量的间隔非常短，可以认为相邻两次测量的时间内目标位置不变，因此在本次测量时，则可以由扫描单元仅形成包含目标区域的小于第一视场的第二视场的投影图案，同时可以开启比S1步骤中更多的子光源阵列，以形成相对光束排列密度更大的密集投影图案，基于该密集投影图案，采集器可以获取包含目标的更多斑点的有效数据从而计算出分辨率更高的深度图像，以实现仅对目标区域的高分辨率测量。可以理解的是，这里所说的分辨率泛指的是有效深度值像素的数量，有效深度值像素数量多则分辨率越高，因此第二分辨率要高于第一分辨率。比如图9所示的是根据本申请一个实施例的阵列光源及其密集投影图案示意图。在本实施例中，第一 阵列光源与第二阵列光源被同时打开，即同步打开第一子光源阵列与第二子光源阵列，扫描单元仅形成包含目标的由902、903、904、905四个子视场所组成的2×2视场的投影图案，与图8所示实施例相比，视场减小，但投影图案密度增加，由此可以实现在较低功耗下实现更高分辨率的测量。可以理解的是，若光源单元中包含排列密度不同的多个子光源阵列时，比如第一子光源阵列的排列密度小于第二子光源阵列的排列密度，在本步骤中也可以仅开启第二子光源阵列，也可以实现投射密集投影图案的效果。
可以理解的是，以上各实施例中是以飞行时间距离测量系统为例进行说明了，但相关的发射器、动态距离测量方案同样可以应用在其他测量系统如结构光三维测量系统中。
可以理解的是，当将本申请的距离测距系统嵌入装置或硬件中时会作出相应的结构或部件变化以适应需求，其本质仍然采用本申请的距离测距系统，所以应当视为本申请的保护范围。以上内容是结合具体/优选的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，其还可以对这些已描述的实施方式做出若干替代或变型，而这些替代或变型方式都应当视为属于本申请的保护范围。在本说明书的描述中，参考术语“一种实施例”、“一些实施例”、“优选实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。
在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。尽管已经详细描述了本申请的实施例及其优点，但应当理解，在不脱离由所附权利要求限定的范围的情况下，可以在本文中进行各种改变、 替换和变更。
此外，本申请的范围不旨在限于说明书中所述的过程、机器、制造、物质组成、手段、方法和步骤的特定实施例。本领域普通技术人员将容易理解，可以利用执行与本文所述相应实施例基本相同功能或获得与本文所述实施例基本相同结果的目前存在的或稍后要开发的上述披露、过程、机器、制造、物质组成、手段、方法或步骤。因此，所附权利要求旨在将这些过程、机器、制造、物质组成、手段、方法或步骤包含在其范围内。

Claims (13)

  1. 一种发射器，其特征在于，包括：
    光源单元，用于发射第一光束；
    分束单元，用于接收所述第一光束并对第一光束进行分束后形成光束数量更多的第二光束；
    扫描单元，用于接收所述第二光束并偏转第二光束一定角度后向外发射第三光束；经过多次所述偏转之后形成多个所述第三光束，由所述多个第三光束所形成的综合投影图案光束比所述第二光束拥有更高的密度和/或更大的视场角。
  2. 如权利要求1所述的发射器，其特征在于，所述光源单元还包括透镜，所述透镜用于对光源发出的光束进行折射以产生聚焦、准直或发散效果。
  3. 如权利要求1所述的发射器，其特征在于，所述光源单元包括基底以及设置在所述基底上的至少一个子光源，所述子光源以一定的图案形式排列在所述基底上。
  4. 如权利要求3所述的发射器，其特征在于，所述图案包括二维图案，所述二维图案包括有规则图案和/或不规则图案。
  5. 如权利要求3所述的发射器，其特征在于，所述光源单元包括多个子光源，所述多个子光源可以被分组独立控制。
  6. 如权利要求1所述的发射器，其特征在于，所述分束单元包括衍射光学元件和/或超表面光学元件。
  7. 如权利要求1所述的发射器，其特征在于，所述第二光束比所述第一光束拥有更高的排列密度，和/或，所述第二光束比所述第一光束拥有更大的视场角。
  8. 如权利要求1所述的发射器，其特征在于，当所述扫描单元偏转的角度小于所述第二光束中相邻两个子光束的夹角时，所述综合投影图案光束比所述第二光束拥有更高的密度。
  9. 如权利要求1所述的发射器，其特征在于，当所述扫描单元偏转的角度不小于所述第二光束的视场角时，所述综合投影图案光束比所述第二光束拥有更大的视场角。
  10. 一种距离测量系统，其特征在于，包括：
    发射器，用于向目标物体发射光束；所述发射器包括：光源单元，用于发射第一光束；分束单元，用于接收所述第一光束并对第一光束进行分束后形成光束数量更多的第二光束；扫描单元，用于接收所述第二光束并偏转第二光束一定角度后向外发射第三光束；其中，由所述多个第三光束所形成的综合投影图案光束比所述第二光束拥有更高的密度和/或更大的视场角；
    采集器，用于采集被所述目标物体反射回的至少部分所述发射光束并形成光信号；
    处理电路，与所述发射器以及所述采集器连接，并根据所述光信号计算所述目标物体的距离。
  11. 如权利要求10所述的距离测量系统，其特征在于，所述第二光束比所述第一光束拥有更高的排列密度，和/或，所述第二光束比所述第一光束拥有更大的视场角。
  12. 如权利要求10所述的距离测量系统，其特征在于，当所述扫描单元偏转的角度小于所述第二光束中相邻两个子光束的夹角时，所述综合投影图案光束比所述第二光束拥有更高的密度。
  13. 如权利要求10所述的距离测量系统，其特征在于，当所述扫描单元偏转的角度不小于所述第二光束的视场角时，所述综合投影图案光束比所述第二光束拥有更大的视场角。
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