WO2021051248A1

WO2021051248A1 - Atomization device

Info

Publication number: WO2021051248A1
Application number: PCT/CN2019/106023
Authority: WO
Inventors: 冯舒婷; 付尧
Original assignee: 深圳雾芯科技有限公司
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2021-03-25
Also published as: EP4032421A4; EP4032421A1; US20220386695A1

Abstract

Provided is an atomization device (10), comprising a heating assembly top cover (3), a heating assembly base (6) and a heating assembly (5) provided between the heating assembly top cover (3) and the heating assembly base (6). The heating assembly (5) comprises a first portion and a second portion, the first portion comprises a first material, and the second portion comprises a second material, wherein the first material is different from the second material.

Description

Atomizing device

Technical field

The present disclosure generally relates to a vaporization device, and in particular, to an electronic device that provides an aerosol.

Background technique

An electronic cigarette is an electronic product that heats and atomizes an atomizable solution and generates an aerosol for users to inhale. In recent years, major manufacturers have begun to produce all kinds of electronic cigarette products. Generally speaking, an electronic cigarette product includes a housing, an oil storage chamber, an atomization chamber, a heating component, an air inlet, an air flow channel, an air outlet, a power supply device, a sensing device and a control device. The oil storage chamber is used for storing vaporizable solution, and the heating component is used for heating and atomizing the atomizable solution and generating aerosol. The air inlet and the atomizing chamber communicate with each other, and provide air to the heating assembly when the user inhales. The aerosol generated by the heating element is first generated in the atomization chamber, and then inhaled by the user through the air flow channel and the air outlet. The power supply device provides the power required by the heating element, and the control device controls the heating time of the heating element according to the user's inhalation action detected by the sensing device. The outer shell covers the above-mentioned components.

The heating components of the existing electronic cigarette products usually include a cotton core, and using the cotton core as the main part of the heating component has its advantages. For example, the production cost of the cotton core is low, and the amount of aerosol generated by heating is large. However, the use of cotton wick as a heating element also includes many disadvantages. For example, the debris of the cotton wick may be inhaled by the user through the air outlet channel of the electronic cigarette, which is harmful to the health of the user. In addition, the porosity of the cotton core is too large, and it is difficult to absorb the smoke oil well. Excessive porosity of the cotton core also causes the electronic cigarette to easily leak oil. Furthermore, by heating the cotton wick to atomize the e-liquid, the high-temperature e-liquid is often splashed. The high-temperature e-liquid sprayed from the air outlet of the electronic cigarette often causes burns to the user.

In addition, the existing electronic cigarette products do not consider the pressure balance of the oil storage chamber. In existing electronic cigarette products, the oil storage chamber is generally designed to be completely sealed to prevent the atomizable solution from overflowing. As users continue to use electronic cigarette products, the atomizable solution in the oil storage chamber is continuously consumed and reduced, so that the pressure in the oil storage chamber becomes smaller and a negative pressure is formed. The negative pressure makes it difficult for the atomizable solution in the oil storage chamber to evenly flow to the heating component, so that the heating component does not uniformly absorb the atomizable solution. At this time, when the temperature of the heating element rises, there will be a high probability of empty burning and a burnt smell, resulting in a bad user experience.

Therefore, an atomization device and a heating component thereof that can solve the above-mentioned problems are proposed.

Summary of the invention

An atomization device is proposed. The proposed atomization device includes a heating element top cover, a heating element base, and a heating element arranged between the heating element top cover and the heating element base. The heating element includes a first part and a second part, the first part includes a first material, and the second part includes a second material, wherein the first material is different from the second material.

An atomization device is proposed. The proposed atomization device includes a heating element top cover, a heating element base, and a heating element arranged between the heating element top cover and the heating element base. The heating component includes a heating circuit, a first part and a second part. The first part includes a first material, and the second part includes a second material, wherein the compressive strength of the first material is different from the compressive strength of the second material.

Description of the drawings

When read in conjunction with the accompanying drawings, it is easy to understand various aspects of the present disclosure from the following detailed description. It should be noted that various features may not be drawn to scale, and the size of various features may be arbitrarily increased or decreased for clarity of discussion.

FIG. 1 illustrates a schematic diagram of an atomization device assembly according to some embodiments of the present disclosure.

2A and 2B illustrate an exploded view of a part of an atomization device according to some embodiments of the present disclosure.

FIG. 2C illustrates an enlarged schematic diagram of a heating assembly according to some embodiments of the present disclosure.

3A and 3B illustrate temperature simulation diagrams of heating components according to some embodiments of the present disclosure.

4A and 4B illustrate three-dimensional schematic diagrams of heating elements according to some embodiments of the present disclosure.

5A and 5B illustrate three-dimensional schematic diagrams of heating elements according to some embodiments of the present disclosure.

6A, 6B, and 6C illustrate three-dimensional schematic diagrams of heating components according to some embodiments of the present disclosure.

7A and 7B illustrate perspective views of the upper cover of the heating element according to some embodiments of the present disclosure.

8A and 8B illustrate cross-sectional views of cigarette cartridges according to some embodiments of the present disclosure.

Common reference numerals are used throughout the drawings and detailed description to indicate the same or similar components. According to the following detailed description in conjunction with the accompanying drawings, the characteristics of the present disclosure will become clearer.

detailed description

The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below. Of course, these are only examples and are not intended to be limiting. In the present disclosure, the reference to the formation of the first feature on or on the second feature in the following description may include an embodiment in which the first feature is formed in direct contact with the second feature, and may also include that additional features may be formed on An embodiment between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in each example. This repetition is for the purpose of simplification and clarity, and does not in itself indicate the relationship between the various embodiments and/or configurations discussed.

The embodiments of the present disclosure are discussed in detail below. However, it should be understood that the present disclosure provides many applicable concepts that can be implemented in a variety of specific situations. The specific embodiments discussed are merely illustrative and do not limit the scope of the disclosure.

The atomizing device 10 may include a cartridge 10A and a main body 10B. In some embodiments, the cartridge 10A and the main body 10B can be designed as a whole. In some embodiments, the cartridge 10A and the main body 10B can be designed as two separate components. In some embodiments, the cartridge 10A may be designed to be removably combined with the main body 10B. In some embodiments, the cartridge 10A may be designed to be partially received in the main body 10B.

Various components may be contained in the main body 10B. Although not drawn in Figure 1, the main body 10B may include conductive spring pins, sensors, circuit boards, light guide components, buffer components, power components (such as but not limited to batteries or rechargeable batteries), power component brackets, motors, and chargers. The plate and the like can be used for components required for the operation of the atomization device 10. The main body 10B can provide power to the cartridge 10A. The power supplied by the main body 10B to the cartridge 10A can heat the atomizable material stored in the cartridge 10A. The atomizable material can be a liquid. The atomizable material can be a solution. In the subsequent paragraphs of this disclosure, the atomizable material may also be referred to as e-liquid. Smoke oil is edible.

2A and 2B illustrate exploded views of cigarette cartridges according to some embodiments of the present disclosure.

The cartridge 10A includes a housing 1, a seal member of an upper cover 2, an upper cover of a heating element 3, a sealing element of a heating element 4, a heating element 5 and a base 6 of the heating element. The surface of the heating component 5 may have a heating circuit 5c. In some embodiments, the heating circuit can also be arranged inside the heating element 5.

As shown in FIG. 2A, the upper cover sealing assembly 2 may have multiple openings. The upper cover 3 of the heating assembly may have a plurality of openings. In some embodiments, the number of openings of the upper cover sealing assembly 2 and the number of openings of the upper cover 3 of the heating assembly may be the same. In some embodiments, the number of openings of the upper cover sealing assembly 2 and the number of openings of the heating assembly upper cover 3 may be different. In some embodiments, the number of openings of the upper cover sealing assembly 2 is less than the number of openings of the upper cover 3 of the heating assembly. In some embodiments, the number of openings of the upper cover sealing assembly 2 is more than the number of openings of the upper cover 3 of the heating assembly.

In some embodiments, the upper cover sealing assembly 2 may have elasticity. In some embodiments, the upper cover sealing assembly 2 may have flexibility. In some embodiments, the upper cover sealing component 2 may include silica gel. In some embodiments, the upper cover sealing component 2 may be made of silica gel.

The upper cover 3 of the heating element may have buckle portions 3d1 and 3d2. The heating element base 6 may have buckle parts 6d1 and 6d2. The upper cover 3 of the heating element and the base 6 of the heating element can be coupled by the buckle parts 3d1, 3d2, 6d1 and 6d2. The upper cover 3 of the heating element and the base 6 of the heating element can be mechanically combined by the snap parts 3d1, 3d2, 6d1 and 6d2. The upper cover 3 of the heating element and the base 6 of the heating element can be removably combined by the snap parts 3d1, 3d2, 6d1 and 6d2.

When part or all of the components of the cartridge 10A are combined with each other, the upper cover sealing assembly 2 can cover a part of the upper cover 3 of the heating assembly. The upper cover sealing assembly 2 may surround a part of the upper cover 3 of the heating assembly. The upper cover sealing assembly 2 can expose a part of the upper cover 3 of the heating assembly.

When part or all of the components of the cartridge 10A are combined with each other, the heating component sealing component 4 may cover a part of the heating component 5. The heating assembly sealing assembly 4 may surround a part of the heating assembly 5. The heating assembly sealing assembly 4 can expose a part of the heating assembly 5.

In some embodiments, the heating assembly sealing assembly 4 may have elasticity. In some embodiments, the heating assembly sealing assembly 4 may have flexibility. In some embodiments, the heating assembly sealing assembly 4 may include silica gel. In some embodiments, the heating assembly sealing assembly 4 may be made of silica gel.

As shown in FIG. 2A, the heating assembly sealing assembly 4 has an opening 4h, and the heating assembly 5 has a groove 5c. When the heating assembly sealing assembly 4 and the heating assembly 5 are combined with each other, the opening 4h may expose at least a part of the groove 5c.

As shown in FIG. 2B, the upper cover sealing assembly 2 may have an extended portion 2t. When the upper cover sealing assembly 2 and the upper cover 3 of the heating assembly are combined with each other, the extension portion 2t extends into a channel in the upper cover 3 of the heating assembly.

As shown in FIG. 2B, the heating assembly 5 includes a heating circuit 5c. In some embodiments, the heating circuit 5c can be provided on the bottom surface of the heating element 5. In some embodiments, the heating circuit 5c may be exposed on the bottom surface of the heating element 5. In some embodiments, the heating circuit 5c may be provided inside the heating assembly 5. In some embodiments, the heating circuit 5c may be partially covered by the heating component 5. In some embodiments, the heating circuit 5c may be completely covered by the heating component 5.

As shown in FIG. 2C, the heating element 5 may have pores. In some embodiments, the shape of the pores may be square. In some embodiments, the shape of the pores may be cylindrical. In some embodiments, the shape of the aperture may be ring-shaped. In some embodiments, the shape of the pores may be a hexagonal column shape. In some embodiments, the pore shape may be a honeycomb structure.

The smoke oil can penetrate into the pores of the heating element 5. The pores of the heating element 5 can be soaked in the smoke oil. The pores of the heating component 5 can increase the contact area between the heating component 5 and the e-liquid. The pores of the heating element 5 can surround small molecules of e-liquid from all sides. During the heating process, the pores of the heating element 5 can heat the e-liquid more evenly. During the heating process, the pores of the heating element 5 can make the e-liquid reach the predetermined temperature faster. During the heating process, the pores of the heating element 5 can avoid the generation of burnt smell.

The pores of the heating element 5 may include open pores and closed pores. An open air hole is an opening that is not completely closed around, and smoke oil can enter the open air hole. A closed vent is a completely enclosed cavity, and smoke oil cannot enter the closed vent.

The e-liquid can penetrate to the vicinity of the heating circuit 5c through the open air holes. Adjusting the number of open air holes (or called open air porosity) in the heating assembly 5 can adjust the speed at which the smoke oil penetrates into the heating assembly 5. Adjusting the number of openings in the heating assembly 5 can adjust the volume of the e-liquid penetrating into the heating assembly 5.

The closed pores contain air. The air contained in the closed air hole can isolate the basic material of the heating element and the e-liquid. Because air has a relatively small thermal conductivity of 0.024W/(mK), adjusting the number of closed air holes (or called closed air porosity) in the heating element 5 can adjust the heating element base material/e-liquid/air three-phase composite Thermal Conductivity. Adjusting the closed air porosity in the heating assembly 5 can adjust the overall thermal conductivity of the heating assembly 5.

When the number of closed air holes in the heating assembly 5 is increased, the overall thermal conductivity of the heating assembly 5 will decrease. Reducing the thermal conductivity can make the heating element 5 more concentrated heat. Reducing the thermal conductivity can increase the heating efficiency of the heating assembly 5. Reducing the thermal conductivity can make the heating element 5 generate a larger amount of smoke.

The porosity of the heating element 5 is equal to the sum of the open porosity and the closed porosity. The porosity of the heating element 5 is related to the structural strength of the heating element 5. The porosity of the heating element 5 is related to the compressive strength of the heating element 5. Under the condition of maintaining the strength of the heating element 5, the desired smoke oil permeability and smoke generation can be achieved by adjusting the open porosity and closed porosity. In some embodiments, the porosity of the heating element 5 may be in the range of 35% to 95%. In some embodiments, the open porosity of the heating element 5 is in the range of 30% to 60% and the closed porosity is in the range of 5% to 35%.

FIG. 3A shows the cross-sectional temperature of the heating assembly 5. In the temperature simulation diagram shown in FIG. 3A, the overall thermal conductivity of the heating assembly 5 is 0.1. The temperature of the heating element 5 gradually becomes lower as the distance from the heating circuit 5c becomes larger. As shown in Figure 3A, the temperature T1 is approximately 543.44 degrees Celsius. The temperature T2 is about 356.75 degrees Celsius. The temperature T3 is approximately 280.80 degrees Celsius. The temperature T4 is about 173.18 degrees Celsius. The temperature T5 is about 115.03 degrees Celsius. The temperature T6 is approximately 35.78 degrees Celsius. The temperature T7 is approximately 25.56 degrees Celsius.

FIG. 3B shows the cross-sectional temperature of the heating assembly 5. In the temperature simulation diagram shown in FIG. 3B, the overall thermal conductivity of the heating assembly 5 is 2.0. The temperature of the heating element 5 gradually becomes lower as the distance from the heating circuit 5c becomes larger. As shown in Figure 3B, the temperature T1' is approximately 205.84 degrees Celsius. The temperature T2' is approximately 165.91 degrees Celsius. The temperature T3' is approximately 137.89 degrees Celsius. The temperature T4' is approximately 107.96 degrees Celsius. The temperature T5' is approximately 88.51 degrees Celsius. The temperature T6' is approximately 73.03 degrees Celsius. The temperature T7' is approximately 65.58 degrees Celsius.

Comparing the temperature simulation diagrams of FIGS. 3A and 3B, it can be seen that when the overall thermal conductivity of the heating element 5 is low, the thermal energy generated by the heating element 5 will be more concentrated near the heating circuit 5c. The concentration of heat energy at the heating circuit 5c can improve the heating efficiency. The heat energy is concentrated at the heating circuit 5c to reduce power dissipation. The concentration of heat energy at the heating circuit 5c can increase the smoke generation speed. The concentration of heat energy at the heating circuit 5c can increase the volume of smoke generated.

The heating component 5 can be made of different materials. The heating element 5 may include at least one of silicon oxide, aluminum oxide, and zirconium oxide. The heating element 5 may include a mixture of silicon oxide, aluminum oxide, and zirconium oxide. The heating element 5 may include a mixture of silicon oxide, aluminum oxide, and zirconium oxide.

Silicon oxide, aluminum oxide and zirconium oxide have different material properties.

Generally speaking, silicon oxide has the lowest thermal conductivity of the three, but silicon oxide has the lowest compressive strength of the three.

The thermal conductivity of silicon oxide is about 1W/(mK). The thermal conductivity of zirconia is about 3W/(mK). The thermal conductivity of alumina is about 27W/(mK). The compressive strength of silicon oxide is about 80Mpa (million Pascals). The compressive strength of zirconia is about 900Mpa. The compressive strength of alumina is about 300Mpa. The compressive strength of the material described in this disclosure can be measured with a strength testing machine. There are certain methods and conditions for measuring compressive strength, and it is recorded in accordance with established standards.

The material and porosity of the heating element 5 can be adjusted according to requirements to enable the atomization device 10 to generate the desired amount of smoke.

In the first embodiment, the heating element 5 uses a single silicon oxide material, and during the manufacturing process, the heating element 5 is controlled to have an open porosity of 60% and a closed porosity of 35%. The heating assembly 5 designed in this way has a compressive strength of 10Mpa. The overall thermal conductivity of the heating assembly 5 is 0.12 W/(mK). In this embodiment, a single inhalation action of the user can cause the heating element 5 to generate 9 milligrams (mg) of smoke.

In the second embodiment, the heating element 5 uses a mixed material of aluminum oxide and silicon oxide. The mass ratio of aluminum oxide to silicon oxide is 1:10. During the manufacturing process, the heating element 5 is controlled to have an open porosity rate of 40% and a closed porosity rate of 25%. The heating assembly 5 designed in this way has a compressive strength of 25Mpa. The overall thermal conductivity of the heating assembly 5 is 1.3 W/(mK). In this embodiment, a single inhalation action of the user can cause the heating element 5 to generate 6.5 milligrams (mg) of smoke.

In the third embodiment, the heating element 5 uses a mixed material of aluminum oxide and silicon oxide. The mass ratio of aluminum oxide to silicon oxide is 1:5. During the manufacturing process, the heating assembly 5 is controlled to have an open porosity of 50% and a closed porosity of 5%. The heating assembly 5 designed in this way has a compressive strength of 40Mpa. The overall thermal conductivity of the heating assembly 5 is 2.6 W/(mK). In this embodiment, a single inhalation action of the user can cause the heating element 5 to generate 4.5 milligrams (mg) of smoke.

The heating assembly 51 shown in FIG. 4A and the heating assembly 52 shown in FIG. 4B can be used as alternatives to the heating assembly 5 shown in FIGS. 2A and 2B. The upper cover 3 of the heating element, the sealing element 4 of the heating element, and the base 6 of the heating element shown in FIGS. 2A and 2B can be modified according to the appearance of the heating element 51 and the heating element 52 accordingly.

As mentioned in the previous paragraph, a lower thermal conductivity can increase the heating efficiency of the heating element 5. But lower compressive strength may cause problems. For example, the lower compressive strength may cause defects in the heating assembly 5 during the production process, thereby reducing the production yield of the heating assembly 5. In addition, during the use of the atomizing device 10, the heating assembly 5 with lower compressive strength may cause dust to fall. Falling dust may be inhaled by users and cause health hazards. Therefore, there is an urgent need for a heating element that has both heating efficiency and compressive strength.

The heating element 51 shown in FIG. 4A comprises a composite material. The heating assembly 51 shown in FIG. 4A includes a composite structure. The heating assembly 51 shown in Fig. 4A includes a main portion 51m1 formed of a first material, and a bottom portion 51m2 formed of a second material. In some embodiments, the compressive strength of the first material is greater than the compressive strength of the second material. In some embodiments, the thermal conductivity of the second material is less than the thermal conductivity of the first material. The heating element 51 may include a heating circuit 51c provided at the bottom. The heating circuit 51c may be provided on the surface of the bottom 51m2 formed of the second material.

Since the first material has a high compressive strength, the main part 51m1 formed of the first material can reduce the chance of damage during the production process of the heating assembly 51. In addition, the main part 51m1 formed by the first material can reduce the chance of dust falling during the use of the atomizing device 10.

Since the thermal conductivity of the second material is less than the thermal conductivity of the first material, the bottom 51 m 2 formed of the second material can increase the heat generation efficiency of the heating assembly 51. In addition, the bottom 51m2 formed of the second material can increase the amount of smoke generated by the heating assembly 51 and the speed of smoke generation.

In some embodiments, the main portion 51m1 may include zirconia. In some embodiments, the bottom 51m2 may include silicon oxide. In some embodiments, the main portion 51m1 may include a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the bottom 51m2 may include a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the main part 51m1 and the bottom part 51m2 comprise a mixture of zirconium oxide, silicon oxide, or aluminum oxide in different composition ratios.

The heating element 52 shown in FIG. 4B includes a composite material. The heating element 52 shown in FIG. 4B includes a composite structure. The heating element 52 shown in FIG. 4B includes a surface portion 52m1 formed of a first material, and a main portion 52m2 formed of a second material. The heating element 52 may include a heating circuit 52c (not shown in the figure) provided at the bottom.

As shown in FIG. 4B, the surface portion 52m1 can cover the first surface 52s1 and the second surface 52s2 of the main portion 52m2. In some embodiments, the surface portion 52m1 does not cover the bottom of the heating element 52. The surface portion 52m1 exposes the bottom of the heating assembly 52. In some embodiments, the surface portion 52m1 may cover the bottom of the heating assembly 52. In some embodiments, the surface portion 52m1 does not cover the inner walls 52r1 and 52r2 of the groove 52r. In some embodiments, the surface portion 52m1 may partially cover the inner wall 52r1 or 52r2 of the groove 52r. In some embodiments, the surface portion 52m1 may completely cover the inner walls 52r1 and 52r2 of the groove 52r.

In some embodiments, the thermal conductivity of the first material is greater than the thermal conductivity of the second material. In some embodiments, the compressive strength of the first material is greater than the compressive strength of the second material. In certain embodiments, the surface portion 52m1 may include zirconia. In some embodiments, the main portion 52m2 may include silicon oxide.

In certain embodiments, the surface portion 52m1 may include a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the main portion 52m2 may include a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the surface portion 52m1 and the main portion 52m2 comprise a mixture of zirconium oxide, silicon oxide, or aluminum oxide in different composition ratios.

Since the surface portion 52m1 has a relatively high compressive strength, the surface portion 52m1 can reduce the chance of damage to the heating element 52 during the production process. In addition, the surface portion 52m1 can reduce the chance of dust falling during the use of the atomizing device 10.

Since the thermal conductivity of the second material is less than the thermal conductivity of the first material, the main portion 52 m 2 can increase the heating efficiency of the heating element 52. In addition, the main portion 52m2 formed of the second material can increase the amount of smoke generated by the heating element 52 and the rate of smoke generation.

The heating assembly 53 shown in FIG. 5A and the heating assembly 54 shown in FIG. 5B can be used as alternatives to the heating assembly 5 shown in FIGS. 2A and 2B. The upper cover 3 of the heating component, the sealing component 4 of the heating component, and the base 6 of the heating component shown in FIGS. 2A and 2B can be modified according to the appearance of the heating component 53 and the heating component 54 accordingly.

The heating assembly 53 shown in FIG. 5A includes a single structure. In some embodiments, the heating component 53 includes a main part 53m1 and a heating circuit 53c. In some embodiments, the main portion 53m1 may comprise a single material. In certain embodiments, the main portion 53m1 may comprise a mixture. In some embodiments, the main portion 53m1 may comprise a single material of zirconia. In some embodiments, the main portion 53m1 may include a single material of silicon oxide. In some embodiments, the main portion 53m1 may comprise a single material of alumina. In some embodiments, the main portion 53m1 may include a mixture of zirconia, silicon oxide, or aluminum oxide.

In some embodiments, the main part 53m1 may have a cylindrical shape. In some embodiments, the main part 53m1 may have other appearances. The heating circuit 53c may be wound around the surface of the main part 53m1. The heating circuit 53c may include nickel metal, chromium metal, or iron-nickel alloy.

The heating element 54 shown in FIG. 5B includes a composite material. The heating assembly 54 shown in FIG. 5B includes a composite structure.

The heating assembly 54 shown in FIG. 5B includes a main portion 54m1 formed of a first material, and a surface portion 54m2 formed of a second material. In some embodiments, the thermal conductivity of the first material is less than the thermal conductivity of the second material. In some embodiments, the compressive strength of the second material is greater than the compressive strength of the first material.

The heating assembly 54 having a composite structure has many advantages.

Because the surface portion 54m2 has high compressive strength, the surface portion 54m2 can reduce the chance of damage during the production process of the heating assembly 54. In addition, the surface portion 54 m 2 can reduce the chance of dust falling during the use of the atomizing device 10.

Since the thermal conductivity of the first material is less than the thermal conductivity of the second material, the main part 54m1 can increase the heating efficiency of the heating assembly 54. In addition, the main part 54m1 formed of the first material can increase the amount of smoke generated by the heating assembly 54 and the speed of smoke generation.

In some embodiments, the surface portion 54m2 may include zirconia. In some embodiments, the main portion 54m1 may include silicon oxide. In some embodiments, the main portion 54m1 may comprise a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the surface portion 54m2 may include a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the main portion 54m1 and the surface portion 54m2 comprise a mixture of zirconium oxide, silicon oxide, or aluminum oxide in different composition ratios. The heating circuit 54c may be wound around the surface of the surface portion 54m2. The heating circuit 54c may include nickel metal, chromium metal, or iron-nickel alloy.

The heating assembly 55 shown in FIG. 6A, the heating assembly 56 shown in FIG. 6B, and the heating assembly 57 shown in FIG. 6C can be used as alternative components for the heating assembly 5 shown in FIGS. 2A and 2B. The upper cover 3 of the heating element, the sealing element 4 of the heating element, and the base 6 of the heating element shown in FIGS. 2A and 2B can be modified according to the appearance of the

heating elements

55, 56 and 57 accordingly.

The heating assembly 55 shown in FIG. 6A includes a single structure. In some embodiments, the heating element 55 includes a main part 55m1 and a heating circuit 55c. The heating circuit 55c may be disposed on the bottom surface 55s of the heating element 55. Although not shown in FIG. 6A, in some embodiments the heating element 55 may include a groove on the top surface.

In some embodiments, the main portion 55m1 may comprise a single material. In certain embodiments, the main portion 55ml may comprise a mixture. In some embodiments, the main portion 55m1 may comprise a single material of zirconia. In some embodiments, the main portion 55m1 may comprise a single material of silicon oxide. In some embodiments, the main portion 55m1 may comprise a single material of alumina. In some embodiments, the main portion 55m1 may include a mixture of zirconia, silicon oxide, or aluminum oxide. In some embodiments, the main part 55m1 may have a rectangular parallelepiped shape.

The main portion 55m1 may have a length 55L1, a width 55L2, and a thickness 55L3. In some embodiments, the length 55L1 may be greater than the width 55L2 and the thickness 55L3. In some embodiments, the width 55L2 may be substantially the same as the thickness 55L3. In some embodiments, the width 55L2 may be different from the thickness 55L3. In some embodiments, the main portion 55m1 may have other appearances.

The heating element 55 can be made by a foam casting method. In the embodiment where the main part 55m1 includes a single material of zirconia, the main part 55m1 may have the characteristics of a porosity of 78%, a compressive strength of 11Mpa, and a thermal conductivity of 0.14W/(mK). In the embodiment where the main part 55m1 includes a single material of zirconia, the main part 55m1 may have the characteristics of a porosity of 68%, a compressive strength of 23Mpa, and a thermal conductivity of 0.39W/(mK).

The heating element 56 shown in FIG. 6B includes a composite material. The heating assembly 56 shown in FIG. 6B includes a composite structure. The heating assembly 56 shown in FIG. 6B includes a main portion 56m1 formed of a first material, and a bottom portion 56m2 formed of a second material. In some embodiments, the compressive strength of the first material is greater than the compressive strength of the second material. In some embodiments, the thermal conductivity of the second material is less than the thermal conductivity of the first material. The heating element 56 may include a heating circuit 56c provided at the bottom. The heating circuit 56c may be provided on the surface of the bottom 56m2 formed of the second material. Although not shown in FIG. 6B, in some embodiments the heating element 56 may include a groove on the top surface.

Since the first material has a higher compressive strength, the main part 56m1 formed by the first material can reduce the chance of damage during the production process of the heating assembly 56. In addition, the main part 56m1 formed by the first material can reduce the chance of dust falling during the use of the atomizing device 10.

Since the thermal conductivity of the second material is less than the thermal conductivity of the first material, the bottom 56 m 2 formed of the second material can increase the heating efficiency of the heating element 56. In addition, the bottom 56 m 2 formed of the second material can increase the amount of smoke generated by the heating element 56 and the speed of smoke generation.

As shown in FIG. 6B, the main portion 56m1 may have a thickness of 56L1, and the bottom portion 56m2 may have a thickness of 56L2. By adjusting the ratio of the thickness 56L1 to the thickness 56L2, the overall thermal conductivity of the heating element 56 can be adjusted. By adjusting the ratio of the thickness 56L1 to the thickness 56L2, the amount of smoke and the smoke generation speed of the heating element 56 can be adjusted. In some embodiments, the thickness 56L1 may be greater than the thickness 56L2. In some embodiments, the thickness 56L1 may be equal to the thickness 56L2. In some embodiments, the thickness 56L1 may be less than the thickness 56L2.

In some embodiments, the thermal conductivity of the main portion 56m1 is in the range of 0.12 W/(mK) to 2.6 W/(mK). In some embodiments, the thermal conductivity of the main portion 56ml is in the range of 0.1W/(mK) to 5W/(mK). In some embodiments, the thermal conductivity of the main portion 56m1 is in the range of 0.1 W/(mK) to 10 W/(mK). In some embodiments, the compressive strength of the main part 56ml is greater than 10Mpa.

In some embodiments, the overall thermal conductivity of the heating element 56 is in the range of 0.12 W/(mK) to 2.6 W/(mK). In some embodiments, the overall thermal conductivity of the heating element 56 is in the range of 0.1 W/(mK) to 5 W/(mK). In some embodiments, the overall thermal conductivity of the heating element 56 is in the range of 0.1 W/(mK) to 10 W/(mK). In some embodiments, the overall compressive strength of the heating assembly 56 is greater than 10Mpa.

The heating element 57 shown in FIG. 6C comprises a composite material. The heating assembly 57 shown in FIG. 6C includes a composite structure. The heating assembly 57 shown in FIG. 6C includes a surface portion 57m1 formed of a first material, and a main portion 57m2 formed of a second material. The heating element 57 may include a heating circuit 57c provided at the bottom. Although not shown in FIG. 6C, in some embodiments the heating element 57 may include a groove on the top surface.

In some embodiments, the surface portion 57m1 may cover multiple surfaces of the heating assembly 57.

The heating assembly 57 shown in FIG. 6C has a rectangular parallelepiped shape. In some embodiments, the surface portion 57m1 may cover the three sides of the cuboid body. In some embodiments, the surface portion 57m1 may cover the four sides of the cuboid body. In some embodiments, the surface portion 57m1 may cover the five sides of the cuboid body.

In some embodiments, the surface portion 57m1 does not cover the bottom of the heating assembly 57. The surface portion 57m1 exposes the bottom of the heating assembly 57. In some embodiments, the surface portion 57m1 may cover the bottom of the heating assembly 57. As shown in FIG. 6C, the surface portion 57m1 formed of the first material, the main portion 57m2 may have a thickness 57L2. By adjusting the ratio of the thickness 57L1 to the thickness 57L2, the overall thermal conductivity of the heating element 57 can be adjusted. By adjusting the ratio of the thickness 57L1 to the thickness 57L2, the amount of smoke and the smoke generation speed of the heating element 57 can be adjusted. In some embodiments, the thickness 57L1 may be greater than the thickness 57L2. In some embodiments, the thickness 57L1 may be equal to the thickness 57L2. In some embodiments, the thickness 57L1 may be less than the thickness 57L2.

The upper cover 3 of the heating element has openings 3h1, 3h3, 3h4, and 3h5 on the surface 3s1. The opening 3h1 extends into the upper cover 3 of the heating assembly and forms a passage (for example, the passage 3c1 shown in FIG. 8A). The opening 3h3 extends into the upper cover 3 of the heating assembly and forms a passage (for example, the passage 3c2 shown in FIG. 8A). The opening 3h4 extends into the upper cover 3 of the heating assembly and forms a passage (for example, the passage 3c3 shown in FIG. 8A). The opening 3h5 extends into the upper cover 3 of the heating assembly and forms a passage (for example, the passage 3c4 shown in FIG. 8A). In some embodiments, the upper cover 3 of the heating assembly may have more channels. In some embodiments, the upper cover 3 of the heating assembly may have fewer passages.

The upper cover 3 of the heating assembly has columnar portions 3w1 and 3w2. A groove 3r1 is defined between the columnar portions 3w1 and 3w2. The groove 3r1 is in fluid communication with the opening 3h5. The groove 3r1 is in fluid communication with the channel 3c4 (see FIG. 8A) of the upper cover 3 of the heating assembly. The groove 3r1 is in fluid communication with the atomization chamber 6C (see FIG. 8A).

As shown in FIG. 7B, the upper cover 3 of the heating assembly has an opening 3h2 on the surface 3s2. The opening 3h1 penetrates the upper cover 3 of the heating element from the surface 3s1 to the opening 3h2 of the surface 3s2 to form a channel 3c1. In some embodiments, the opening 3h1 and the opening 3h2 may be aligned with each other in the vertical direction. In some embodiments, the opening 3h1 and the opening 3h2 may not be aligned in the vertical direction.

As shown in FIG. 8A, the housing 1 has an opening 1h and a tube 1t extending from the opening 1h to the upper cover sealing assembly 2. The pipe 1t, the upper cover sealing assembly 2 and the housing 1 define a liquid storage tank 20. The atomizable material can be stored in the liquid storage tank 20.

The tube 1t may have a part extending into the channel 3c4. The tube 1t may have an uneven outer diameter. As shown in FIG. 8A, a part of the tube 1t extending into the channel 3c4 has a smaller outer diameter. The tube 1t may have an uneven inner diameter. As shown in FIG. 8A, a part of the tube 1t extending into the channel 3c4 has a smaller inner diameter.

The tube 1t is coupled to the channel 3c4 through the opening 3h5 of the upper cover 3 of the heating assembly. The tube 1t is in fluid communication with the channel 3c4 through the opening 3h5 of the upper cover 3 of the heating assembly. The channel 3c4 is isolated from the liquid storage tank 20 by the pipe 1t.

As shown in FIG. 8A, the upper cover sealing assembly 2 can expose the openings 3h3, 3h4, and 3h5 of the upper cover 3 of the heating assembly. The upper cover sealing assembly 2 does not cover the openings 3h3, 3h4, and 3h5 of the upper cover 3 of the heating assembly. The upper cover sealing assembly 2 does not block the channels 3c2, 3c3, and 3c4.

The channel 3c2 is in fluid communication with the groove 5c of the heating assembly 5. The channel 3c3 is in fluid communication with the groove 5c of the heating assembly 5. The e-liquid stored in the liquid storage tank 20 can flow into the groove 5c through the channel 3c2. The e-liquid stored in the liquid storage tank 20 can flow into the groove 5c through the channel 3c3. The groove 5c of the heating assembly 5 is in fluid communication with the liquid storage tank 20. The e-liquid can fully contact the heating assembly 5 in the groove 5c. The heating circuit on the surface or inside of the heating assembly 5 can heat the e-liquid and generate aerosol.

An atomization chamber 6C is defined between the heating element base 6 and the heating element 5. The heating assembly 5 is partially exposed in the atomization chamber 6C. The aerosol generated by heating by the heating element 5 is formed in the atomizing chamber 6C. The aerosol generated by heating by the heating element 5 is ingested by the user through the tube 1t and the opening 1h. The tube 1t is in fluid communication with the atomization chamber 6C. The groove 3r1 is in fluid communication with the atomization chamber 6C.

The upper cover sealing assembly 2 can cover the opening 3h1 of the upper cover 3 of the heating assembly. The upper cover sealing assembly 2 can block the channel 3c1.

As shown in FIG. 8A, the upper cover 3 of the heating assembly has a blocking member 3p. The barrier 3p isolates the tube 1t from the groove 5c of the heating assembly 5. The barrier 3p isolates the channel 3c4 from the groove 5c of the heating assembly 5.

During the use of the atomizing device, when the condensed liquid remaining in the tube 1t reaches a certain volume, the condensed liquid may slip off the tube 1t. The blocking member 3p prevents the condensed liquid slipped from the tube 1t from contacting the heating element 5. The blocking member 3p can prevent the condensed liquid that slips from polluting the heating assembly 5. The blocking member 3p can prevent the slipped condensed liquid from changing the taste of the aerosol. The blocking member 3p can prevent the condensed liquid from slipping to the high-temperature heating element and causing liquid spatter. The blocking member 3p can prevent the splashed liquid from scalding the user.

FIG. 8B shows the air flow 6f from the atomization chamber 6C to the liquid storage tank 20. As shown in FIG.

When the atomization device is standing and not being sucked by the user, the opening 3h1 and the upper cover sealing assembly 2 are tightly combined, and the e-liquid in the liquid storage compartment 20 will not leak out from the channel 3c1.

As the user continues to use the atomizing device, the atomizable solution in the liquid storage tank 20 is continuously consumed and reduced, so that the pressure in the liquid storage tank 20 gradually decreases. When the pressure in the liquid storage tank 20 decreases, negative pressure may be generated. The decrease of the pressure in the liquid storage tank 20 may make it difficult for the volatile solution to flow to the groove 5c of the heating element 5 through the channels 3c2 and 3c3. When the groove 5c does not completely adsorb the volatile solution, the high-temperature heating element 5 may dry out and produce a burnt smell.

The above-mentioned problem can be improved by providing the channel 3c1 in the upper cover 3 of the heating element. The channel 3c1 provided in the upper cover 3 of the heating assembly can balance the pressure in the liquid storage tank 20. Since the atomization chamber 6C is in fluid communication with the tube 1t, the pressure in the atomization chamber 6C is approximately equal to one atmospheric pressure. When the atomizable solution in the liquid storage tank 20 is continuously reduced, the pressure in the liquid storage tank 20 is gradually less than one atmospheric pressure. The pressure difference between the atomization chamber 6C and the liquid storage tank 20 causes the airflow 6f from the atomization chamber 6C to reach the junction of the opening 3h1 and the upper cover sealing assembly 2 via the channel 3c1. The air flow 6f can partially push open the upper cover sealing assembly 2. The air flow 6f can cause partial deformation of the upper cover sealing assembly 2. The air flow 6f can enter the liquid storage tank 20 through the gap created by the deformation of the upper cover sealing assembly 2. The airflow 6f entering the liquid storage tank 20 can cause the pressure in the liquid storage tank 20 to rise. The air flow 6f entering the liquid storage compartment 20 can balance the pressure between the liquid storage compartment 20 and the atomization chamber 6C.

In some embodiments, the upper cover 3 of the heating assembly may be additionally provided with a channel with the same function as the channel 3c1. For example, the upper cover 3 of the heating element may also be provided with a ventilation channel near the opening 3h4.

As used herein, spatially relative terms, for example, "below", "below", "lower", "above", "upper", "lower", "left", "right" and the like can be The simplicity of description is used herein to describe the relationship between one component or feature and another component or feature as illustrated in the figure. In addition to the orientations depicted in the figures, the spatial relative terms are intended to cover different orientations of the device in use or operation. The device can be oriented in other ways (rotated by 90 degrees or in other orientations), and the spatial relative descriptors used herein can also be interpreted accordingly. It should be understood that when a component is referred to as being “connected to” or “coupled to” another component, it can be directly connected or coupled to the other component, or intervening components may be present.

As used herein, the terms "approximately", "substantially", "substantially" and "about" are used to describe and consider small variations. When used in conjunction with an event or situation, the term may refer to an example in which the event or situation occurs precisely and an example in which the event or situation occurs in close proximity. As used herein with respect to a given value or range, the term "about" generally means within ±10%, ±5%, ±1%, or ±0.5% of the given value or range. Ranges can be expressed herein as from one end point to another end point or between two end points. Unless otherwise specified, all ranges disclosed herein include endpoints. The term "substantially coplanar" may refer to two surfaces located within a few micrometers (μm) along the same plane, for example, within 10 μm, within 5 μm, within 1 μm, or within 0.5 μm located along the same plane. When referring to "substantially" the same value or characteristic, the term may refer to a value within ±10%, ±5%, ±1%, or ±0.5% of the average value of the stated value.

As used herein, the terms "approximately", "substantially", "substantially" and "about" are used to describe and explain small changes. When used in conjunction with an event or situation, the term may refer to an example in which the event or situation occurs precisely and an example in which the event or situation occurs in close proximity. For example, when used in combination with a value, the term can refer to a range of variation less than or equal to ±10% of the stated value, for example, less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3% , Less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the difference between two values is less than or equal to ±10% of the average value of the value (for example, less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than Or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%), then the two values can be considered "substantially" or " About" is the same. For example, "substantially" parallel can refer to a range of angular variation less than or equal to ±10° relative to 0°, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, Less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°. For example, "substantially" perpendicular may refer to an angular variation range of less than or equal to ±10° relative to 90°, for example, less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, Less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

For example, if the displacement between two surfaces is equal to or less than 5μm, equal to or less than 2μm, equal to or less than 1μm, or equal to or less than 0.5μm, then the two surfaces can be considered coplanar or substantially coplanar . If the displacement between any two points on the surface relative to the plane is equal to or less than 5μm, equal to or less than 2μm, equal to or less than 1μm, or equal to or less than 0.5μm, then the surface can be considered to be flat or substantially flat .

As used herein, the terms "conductive,""electricallyconductive," and "conductivity" refer to the ability to transfer current. Conductive materials generally indicate those materials that exhibit little or zero resistance to current flow. One measure of conductivity is Siemens/meter (S/m). Generally, the conductive material is a material with a conductivity greater than approximately 10 ⁴ S/m (for example, at least 10 ⁵ S/m or at least 10 ⁶ S/m). The conductivity of a material can sometimes change with temperature. Unless otherwise specified, the electrical conductivity of the material is measured at room temperature.

As used herein, unless the context clearly dictates otherwise, the singular terms "a/an" and "said" may include plural indicators. In the description of some embodiments, a component provided “on” or “above” another component may cover the case where the former component is directly on the latter component (for example, in physical contact with the latter component), and one or more A situation where an intermediate component is located between the previous component and the next component.

Unless otherwise specified, such as "above", "below", "above", "left", "right", "below", "top", "bottom", "vertical", "horizontal", "side", The spatial descriptions of "above", "below", "upper", "above", "below", "down", etc. are indicated relative to the orientation shown in the figure. It should be understood that the spatial description used herein is for illustrative purposes only, and the actual implementation of the structure described herein can be spatially arranged in any orientation or manner, provided that the advantages of the embodiments of the present disclosure are not There will be deviations due to this type of arrangement.

Although the disclosure has been described and illustrated with reference to the specific embodiments of the disclosure, these descriptions and illustrations do not limit the disclosure. Those skilled in the art can clearly understand that various changes can be made without departing from the true spirit and scope of the present disclosure as defined by the appended claims, and equivalent components can be substituted in the embodiments. The illustration may not be drawn to scale. Due to variables in the manufacturing process, etc., there may be differences between the artistic reproduction in this disclosure and the actual equipment. There may be other embodiments of the present disclosure that are not specifically described. This specification and drawings should be regarded as illustrative rather than restrictive. Modifications can be made to make specific situations, materials, material compositions, substances, methods, or processes suitable for the objectives, spirit, and scope of this disclosure. All such modifications are intended to be within the scope of the appended claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of the present disclosure. Therefore, unless specifically instructed herein, the order and grouping of operations are not limitations of the present disclosure.

The foregoing summarizes the features of several embodiments and details of the disclosure. The embodiments described in the present disclosure can be easily used as a basis for designing or modifying other processes and structures for performing the same or similar purposes and/or obtaining the same or similar advantages of the embodiments introduced herein. Such equivalent structures do not depart from the spirit and scope of the present disclosure, and various changes, substitutions and changes can be made without departing from the spirit and scope of the present disclosure.

Claims

An atomization device, which includes:

Top cover of heating component;

Heating element base; and

A heating element arranged between the top cover of the heating element and the base of the heating element;

The heating element includes a first part and a second part, the first part includes a first material, and the second part includes a second material, wherein the first material is different from the second material.
The atomization device according to claim 1, wherein the first material includes zirconia and the second material includes silicon oxide.
The atomization device according to claim 1, wherein the first material comprises a mixture of zirconium oxide, silicon oxide, or aluminum oxide.
The atomization device according to claim 1, wherein the compressive strength of the first material is greater than the compressive strength of the second material.
The atomization device according to claim 1, wherein the thermal conductivity of the first material is greater than the thermal conductivity of the second material.
The atomization device according to claim 1, wherein the heating component further comprises a heating circuit provided on the surface of the second part.
The atomization device according to claim 1, wherein the thickness of the first part is greater than the thickness of the second part.
The atomization device according to claim 1, wherein the first part covers the first surface, the second surface, and the third surface of the second part.
The atomization device according to claim 1, wherein the thermal conductivity of the heating element is in the range of 0.12 W/(mK) to 2.6 W/(mK).
The atomization device according to claim 1, wherein the compressive strength of the first part is greater than 10Mpa.
The atomizing device according to claim 1, wherein the heating component further comprises a heating circuit, and the heating circuit is wound around the heating component.
An atomization device, which includes:

Top cover of heating component;

Heating element base; and

A heating element arranged between the top cover of the heating element and the base of the heating element;

The heating element includes a heating circuit, a first part and a second part, the first part includes a first material, and the second part includes a second material, wherein the thermal conductivity of the first material is different from the thermal conductivity of the second material.
The atomizing device according to claim 12, the heating element further comprises a groove, wherein the first part covers the first surface and the second surface of the second part, and the first part exposes the groove The first surface and the second surface.
The atomization device according to claim 12, wherein the heating element includes a plurality of pores, and wherein the porosity of the heating element is in the range of 35% to 95%.
The atomization device according to claim 14, wherein the plurality of pores include open pores and closed pores, and the open porosity of the heating element is in the range of 30% to 60%, and the closed porosity is 5% to Within 35%.
11. The atomizing device according to claim 12, wherein the heating circuit is in direct contact with the second part, and the compressive strength of the second part is less than the compressive strength of the first part.
The atomization device according to claim 12, wherein the thermal conductivity of the heating element is in the range of 0.1 W/(mK) to 10 W/(mK).
The atomizing device according to claim 12, wherein the thickness of the first part is different from the thickness of the second part.
The atomization device according to claim 12, wherein the second material comprises a mixture of zirconium oxide, silicon oxide, or aluminum oxide.
The atomization device according to claim 12, wherein the first part covers the first surface, the second surface, and the third surface of the second part.