WO2021044962A1 - Heater device and optical assembly - Google Patents

Heater device and optical assembly Download PDF

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Publication number
WO2021044962A1
WO2021044962A1 PCT/JP2020/032563 JP2020032563W WO2021044962A1 WO 2021044962 A1 WO2021044962 A1 WO 2021044962A1 JP 2020032563 W JP2020032563 W JP 2020032563W WO 2021044962 A1 WO2021044962 A1 WO 2021044962A1
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WIPO (PCT)
Prior art keywords
heater
heater device
temperature sensor
flexible substrate
sensor
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PCT/JP2020/032563
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French (fr)
Japanese (ja)
Inventor
中塚　均
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オムロン株式会社
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Publication of WO2021044962A1 publication Critical patent/WO2021044962A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B15/00—Special procedures for taking photographs; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/34—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs

Definitions

  • the present invention relates to a heater device and an optical assembly.
  • an optical assembly that shoots with a 2D or 3D camera may be used for measurement.
  • it is required to correctly measure spatial features and feature positions.
  • the temperature of the optical assembly including the camera fluctuates, the length of each element of the optical system, particularly the length of the lens barrel, fluctuates, so that the focal position of the optical system shifts. If this happens, accurate shooting will not be possible, and eventually correct measurement will not be possible. Therefore, it is required to keep the temperature of the optical assembly constant. In order to keep the temperature constant, a part of the optical assembly is also actively heated by a heater.
  • a heater is installed to heat an object constituting an optical system.
  • the heater and the temperature sensor were configured separately. Therefore, the wiring becomes complicated, and the assembly work at the time of manufacturing the device becomes complicated.
  • the temperature sensor is placed on the heater, the heat generated by the heater is transmitted to the temperature sensor as it is without passing through the object, and as a result, the actual temperature of the object and the temperature detected by the temperature sensor become different. There was a problem that the temperature did not match and the temperature could not be measured accurately.
  • an object of the present invention is to provide a heater device and an optical assembly that can be easily wired and can measure an accurate temperature.
  • the heater device based on the present invention is disposed of a flexible substrate, a heater arranged on the surface or inside of the flexible substrate, and a position separated from the heater on the surface or inside of the flexible substrate. It is equipped with a temperature sensor. By adopting this configuration, wiring is simple and accurate temperature measurement is possible.
  • the flexible substrate has a first portion having a longitudinal shape in which the communication wiring of the temperature sensor and the power wiring of the heater are arranged, and a second portion in which the temperature sensor and the heater are arranged.
  • the temperature sensor and the communication wiring are electrically connected in the second part
  • the heater and the power wiring are electrically connected in the second part
  • the second part is The first portion and the second portion are integral substrates.
  • the distance between the temperature sensor and the heater is preferably 10 times or more the thickness of the flexible substrate.
  • a slit is provided around the temperature sensor.
  • the slit surrounds the temperature sensor in a U shape.
  • the sensor portion is bent with respect to a portion of the flexible substrate other than the sensor portion. Therefore, it is preferable that the flexible substrate is arranged at a position deviated in the thickness direction of the flexible substrate as compared with a portion other than the sensor portion. By adopting this configuration, the temperature sensor can be further moved away from the heater.
  • a metal member is arranged on the surface or inside of the flexible substrate in order to maintain the state in which the sensor portion is bent with respect to a portion other than the sensor portion.
  • the temperature sensor is preferably a thermistor or an I2C communication type one-chip temperature sensor.
  • a temperature sensor can be easily realized.
  • the communication wiring is preferably nickel-plated.
  • the resistivity of the communication wiring can be reduced.
  • the wettability of the solder can be improved.
  • the communication wiring is provided with a terminal portion at an end opposite to the temperature sensor, and the terminal portion is gold-plated.
  • the flexible substrate uses a polyimide resin as a main material.
  • insulation can be maintained even if it is thin. Further, by making the thickness thinner, the thermal resistance can be lowered, so that the heat from the heater can be efficiently conducted to the object.
  • the optical assembly based on the present invention includes any of the above heater devices and a lens barrel, and the heater device includes a portion wound around the lens barrel.
  • another aspect of the optical assembly according to the present invention includes any of the heater devices described above and a lens barrel, and at least a portion of the second portion of the heater device is described above. It is wrapped around the lens barrel. By adopting this configuration, the temperature can be measured more accurately.
  • FIG. 5 is a cross-sectional view taken along the line II-II in FIG.
  • FIG. 3 is a cross-sectional view taken along the line III-III in FIG. It is explanatory drawing of the positional relationship of each part of the heater device in Embodiment 1 based on this invention.
  • It is a top view of the heater device in Embodiment 2 based on this invention. It is a side view at the time of bending the sensor part in the heater device of Embodiment 2 based on this invention. It is a top view of the heater device in Embodiment 3 based on this invention.
  • FIG. 1 A plan view of the heater device 101 according to the present embodiment is shown in FIG.
  • a cross-sectional view taken along the line II-II in FIG. 1 is shown in FIG.
  • a cross-sectional view taken along the line III-III in FIG. 1 is shown in FIG.
  • FIG. 4 shows the positional relationship of each part of the heater device 101 shown in FIG.
  • the heater device 101 includes a flexible substrate 2, a heater 1a arranged on the surface or inside of the flexible substrate 2, and a temperature sensor 3 arranged on the surface or inside of the flexible substrate 2 at a position separated from the heater 1a.
  • the flexible substrate 2 uses, for example, a polyimide resin as a main material.
  • 1 to 3 show an example in which the heater 1a and the temperature sensor 3 are arranged on the surface of the flexible substrate 2.
  • the flexible substrate 2 includes a first portion 21 having a longitudinal shape in which the communication wiring 4 of the temperature sensor 3 and the power wiring 8 of the heater 1a are arranged, and a second portion in which the temperature sensor and the heater are arranged. 3 and the communication wiring 4 are electrically connected in the second portion 22, the heater 1a and the power wiring 8 are electrically connected in the second portion 22, and the second portion 22 is an object to be heated. It has a shape in which at least a part of the three-dimensional shape of is developed into a two-dimensional plane, and the first portion 21 and the second portion 22 are integral substrates.
  • the first portion 21 and the second portion 22 are schematically shown as rectangles in FIG. In FIG. 4, for convenience of explanation, a boundary line between the first portion 21 and the second portion 22 is displayed.
  • the first orientation 91 is the orientation perpendicular to the longitudinal direction 90 of the first portion 21, but this is just an example.
  • the first orientation 91 may have an angle other than 90 ° with respect to the longitudinal direction 90.
  • the second portion 22 includes a portion extending in the first orientation 91. Further, the second portion 22 includes a portion extending in the second orientation 92, which is the orientation opposite to the first orientation 91.
  • the heater 1b is also arranged in the second portion 22.
  • the heater 1a and the heater 1b are arranged symmetrically.
  • the power wiring 8 extends from each of the heaters 1a and 1b.
  • the power wiring 8 is arranged along the first portion 21.
  • the heater 1a and the temperature sensor 3 are arranged on the flexible substrate 2, wiring is simple and accurate temperature measurement can be performed.
  • the temperature sensor 3 is arranged at a position separated from the heater 1a, it is possible to avoid a situation in which the heat generated by the heater 1a is picked up by the temperature sensor 3 and the temperature measurement result becomes inaccurate as much as possible. Can be done.
  • the distance A between the temperature sensor 3 and the heater 1a is preferably 10 times or more the thickness T of the flexible substrate 2.
  • FIG. 1 A plan view of the heater device 102 according to the present embodiment is shown in FIG.
  • the configuration of the heater device 102 is basically the same as the configuration of the heater device 101 described in the first embodiment, but differs in the following points.
  • a slit 5 is provided around the temperature sensor 3.
  • the slit 5 is provided around the temperature sensor 3, it is possible to suppress the transfer of heat from the heater 1a or the like to the temperature sensor 3.
  • the slit 5 preferably surrounds the temperature sensor 3 in a U shape.
  • the sensor portion 31 is bent with respect to the portion 32 of the flexible substrate 2 other than the sensor portion 31. It is preferable that the flexible substrate 2 is arranged at a position deviated from the portion 32 of the flexible substrate 2 other than the sensor portion 31 in the thickness direction 95 of the flexible substrate 2.
  • FIG. 6 shows a side view of the bent state.
  • FIG. 3 A plan view of the heater device 103 according to the present embodiment is shown in FIG. An enlarged view of the central portion of FIG. 7 is shown in FIG.
  • the configuration of the heater device 103 is basically the same as the configuration of the heater device 102 described in the second embodiment, but differs in the following points. Assuming that the portion of the flexible substrate 2 including the temperature sensor 3 and surrounded by the slit 5 is the sensor portion 31, the sensor portion 31 is bent with respect to the portion 32 of the flexible substrate 2 other than the sensor portion 31. It is arranged at a position shifted in the thickness direction 95 of the flexible substrate 2 as compared with the portion 32 of the flexible substrate 2 other than the sensor portion 31. A view from the side in the bent state is shown in FIG.
  • metal members 15a and 15b are arranged on the surface or inside of the flexible substrate 2 in order to maintain the state in which the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31.
  • the metal members 15a and 15b may be, for example, a metal plate.
  • the metal members 15a and 15b are arranged on the surface or inside of the flexible substrate 2, when the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31, the metal member 15a , 15b is plastically deformed to maintain the bent state of the sensor unit 31. In this way, the state in which the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31 can be easily maintained.
  • the temperature sensor 3 is preferably a thermistor or an I2C communication type one-chip temperature sensor. By adopting this configuration, the temperature sensor 3 can be easily realized.
  • the communication wiring 4 is preferably nickel-plated. By adopting this configuration, the resistivity of the communication wiring can be reduced. Further, for example, if the original wiring is made of stainless steel and nickel-plated, the wettability of the solder can be improved.
  • the communication wiring 4 is provided with a terminal portion 7 at an end portion 26 on the opposite side of the temperature sensor 3, and the terminal portion 7 is gold-plated.
  • the flexible substrate 2 preferably uses a polyimide resin as a main material.
  • a polyimide resin as a main material.
  • FIG. 11 shows a state in which some parts of the optical assembly are assembled.
  • FIG. 12 shows a state in which the entire optical assembly is assembled.
  • the optical assembly 201 in the present embodiment includes any of the above-mentioned heater devices 101 and a lens barrel 51, and the heater device 101 includes a portion wound around the lens barrel 51.
  • the lens barrel 51 includes a lens 41 and a mount portion 42.
  • a CMOS sensor 55 is mounted on the CMOS substrate 54.
  • a holding portion 56 is attached to the lower side of the lens barrel 51.
  • the cover 53 is put on the mount portion 42.
  • the cover 53 is provided with an opening for passing the lens 41.
  • the optical assembly 201 in the present embodiment includes any of the heater devices 101 described above and the lens barrel 51, and at least a part of the second portion 22 of the heater device 101 is wound around the lens barrel 51. There is.
  • the heater device 101 since the heater device 101 is used in the optical assembly 201, the heater 1a and the temperature sensor 3 are arranged on the flexible substrate 2 in the heater device 101, so that the wiring is simple and accurate. Can measure temperature.
  • the temperature sensor 3 since the temperature sensor 3 is arranged at a position separated from the heater 1a, it is possible to avoid a situation in which the heat generated by the heater 1a is picked up by the temperature sensor 3 and the temperature measurement result becomes inaccurate as much as possible. Can be done. Therefore, even in the optical assembly 201, the object can be heated and controlled based on accurate temperature measurement, so that an error due to temperature fluctuation can be prevented.
  • the overall T-shaped heater device 101 is illustrated in the first embodiment, various shapes of the overall shape of the heater device can be considered. For example, it may be as shown in FIGS. 13 to 15.
  • one end 25 of the first portion 21 to the second portion 22 extend in the first direction 91.
  • the heater device 104 has a flagpole shape instead of a T shape as a whole.
  • the heater device may have such a configuration.
  • the first portion 21 is bent in the middle.
  • the first part 22 is cranked in the middle.
  • the heater device may have such a configuration.
  • the second portion 22 extending from one end of the first portion 21 in the first direction 91 is a parallelogram.
  • the heater device may have such a configuration. In this way, the temperature sensor 3 may be arranged at a position away from the first portion 22.
  • the vicinity of one end of the first portion 21 is bent by 90 °.
  • a second portion extends from one end of the first portion 21.
  • the second portion 22 has a shape close to a rectangle, but has a notch 27 on the side facing the side to which one end of the first portion 21 is connected.
  • the notch 27 is provided so that the first portion 21 and the end of the second portion 22 on the side far from the first portion 21 do not interfere with each other when the second portion is wound around the object.
  • the notch 27 is, for example, a semi-circular notch.
  • the flexible substrate includes a first portion having a longitudinal shape in which the communication wiring of the temperature sensor and the power wiring of the heater are arranged, and a second portion in which the temperature sensor and the heater are arranged.
  • the temperature sensor and the communication wiring are electrically connected in the second part.
  • the heater and the power wiring are electrically connected in the second portion.
  • the second part has a shape in which at least a part of the three-dimensional shape of the object to be heated is developed in a two-dimensional plane, and the first part and the second part are an integral substrate, according to Appendix 1. Heater device.
  • Appendix 3 The heater device according to Appendix 1 or 2, wherein the distance between the temperature sensor 3 and the heater 1a is 10 times or more the thickness of the flexible substrate 2.
  • Appendix 7 The description in Appendix 6, wherein the metal members 15a and 15b are arranged on the surface or inside of the flexible substrate 2 in order to maintain the state in which the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31. Heater device.
  • Appendix 8 The heater device according to any one of Appendix 1 to 7, wherein the temperature sensor 3 is a thermistor or an I2C communication type one-chip temperature sensor.
  • Appendix 10 The heater device according to Appendix 2, wherein the communication wiring 4 includes a terminal portion 7 at an end portion 26 opposite to the temperature sensor 3, and the terminal portion 7 is gold-plated.
  • the heater device 101 according to any one of the items 1 to 11 and the heater device 101. Including the lens barrel 51 The heater device 101 is an optical assembly including a portion wound around the lens barrel 51.

Abstract

A heater device (101) is provided with: a flexible substrate (2); a heater (1a) disposed on the surface of or inside the flexible substrate (2); and a temperature sensor (3) disposed at a position apart from the heater (1a) on the surface of or inside the flexible substrate (2).

Description

ヒータ装置および光学アセンブリHeater device and optical assembly
　本発明は、ヒータ装置および光学アセンブリに関するものである。 The present invention relates to a heater device and an optical assembly.
　たとえば工場の生産設備などで、計測のために、２Ｄまたは３Ｄのカメラを用いて撮影を行なう光学アセンブリが用いられる場合がある。このような光学アセンブリにおいては、空間的特徴および特徴位置を正しく計測することが求められる。しかし、カメラを含む光学アセンブリの温度が変動すると、光学系の各要素の長さ、特に鏡筒の長さが変動するので、光学系の焦点位置がずれてしまう。こうなると、正確な撮影ができなくなり、ひいては正しい計測が行なえなくなる。そこで光学アセンブリの温度を一定に保つことが求められる。温度を一定に保つためには光学アセンブリの一部をヒータで積極的に加熱することも行なわれる。 For example, in the production equipment of a factory, an optical assembly that shoots with a 2D or 3D camera may be used for measurement. In such an optical assembly, it is required to correctly measure spatial features and feature positions. However, when the temperature of the optical assembly including the camera fluctuates, the length of each element of the optical system, particularly the length of the lens barrel, fluctuates, so that the focal position of the optical system shifts. If this happens, accurate shooting will not be possible, and eventually correct measurement will not be possible. Therefore, it is required to keep the temperature of the optical assembly constant. In order to keep the temperature constant, a part of the optical assembly is also actively heated by a heater.
　たとえば米国特許出願公開ＵＳ２０１７／００９００７６（特許文献１）に記載されているように、光学系を構成する対象物を加熱するためにヒータが設置される。 For example, as described in US Patent Application Publication US2017 / 09000076 (Patent Document 1), a heater is installed to heat an object constituting an optical system.
米国特許出願公開ＵＳ２０１７／００９００７６U.S. Patent Application Publication US2017 / 09090076
　従来は、ヒータと温度センサとは別々に構成されていた。したがって、配線が複雑となり、機器を製造する際の組立作業が煩雑となっていた。ヒータ上に温度センサを配置すると、ヒータで発生した熱が対象物を経由せずにそのまま温度センサに伝わってしまい、その結果、対象物の実際の温度と、温度センサで検出される温度とが一致しない状態となり、正確な温度測定ができないという問題があった。 Conventionally, the heater and the temperature sensor were configured separately. Therefore, the wiring becomes complicated, and the assembly work at the time of manufacturing the device becomes complicated. When the temperature sensor is placed on the heater, the heat generated by the heater is transmitted to the temperature sensor as it is without passing through the object, and as a result, the actual temperature of the object and the temperature detected by the temperature sensor become different. There was a problem that the temperature did not match and the temperature could not be measured accurately.
　そこで、本発明は、配線が簡単で、正確な温度測定ができるヒータ装置および光学アセンブリを提供することを目的とする。 Therefore, an object of the present invention is to provide a heater device and an optical assembly that can be easily wired and can measure an accurate temperature.
　上記目的を達成するため、本発明に基づくヒータ装置は、フレキシブル基板と、前記フレキシブル基板の表面または内部に配置されたヒータと、前記フレキシブル基板の表面または内部で前記ヒータから離隔した位置に配置された温度センサとを備える。この構成を採用することにより、配線が簡単で、正確な温度測定ができる。 In order to achieve the above object, the heater device based on the present invention is disposed of a flexible substrate, a heater arranged on the surface or inside of the flexible substrate, and a position separated from the heater on the surface or inside of the flexible substrate. It is equipped with a temperature sensor. By adopting this configuration, wiring is simple and accurate temperature measurement is possible.
　上記発明において好ましくは、上記フレキシブル基板は、上記温度センサの通信配線および上記ヒータの電力配線が配置された長手形状の第１部分と、上記温度センサおよび上記ヒータが配置された第２部分とを含み、上記温度センサと上記通信配線とが上記第２部分において電気的に接続されており、上記ヒータと上記電力配線とが上記第２部分において電気的に接続されており、上記第２部分は、加熱対象物の立体形状の少なくとも一部を２次元平面に展開した形状を有し、上記第１部分および上記第２部分は一体的な基板である。この構成を採用することにより、配線が簡単で、正確な温度測定ができる。 In the above invention, preferably, the flexible substrate has a first portion having a longitudinal shape in which the communication wiring of the temperature sensor and the power wiring of the heater are arranged, and a second portion in which the temperature sensor and the heater are arranged. Including, the temperature sensor and the communication wiring are electrically connected in the second part, the heater and the power wiring are electrically connected in the second part, and the second part is The first portion and the second portion are integral substrates. By adopting this configuration, wiring is simple and accurate temperature measurement is possible.
　上記構成において、前記温度センサと前記ヒータとの間の距離は前記フレキシブル基板の厚みの１０倍以上であることが好ましい。この構成を採用することにより、ヒータからの熱が温度センサに伝わる度合いを軽減することができる。 In the above configuration, the distance between the temperature sensor and the heater is preferably 10 times or more the thickness of the flexible substrate. By adopting this configuration, the degree of heat transferred from the heater to the temperature sensor can be reduced.
　上記構成において、前記温度センサの周囲にスリットが設けられていることが好ましい。この構成を採用することにより、ヒータで発生した熱が温度センサに伝わることを抑制することができる。 In the above configuration, it is preferable that a slit is provided around the temperature sensor. By adopting this configuration, it is possible to suppress the heat generated by the heater from being transferred to the temperature sensor.
　上記構成において、前記スリットは、前記温度センサの周囲をＵ字形に囲んでいることが好ましい。この構成を採用することにより、ヒータで発生した熱が温度センサに伝わることを効率良く抑制することができる。 In the above configuration, it is preferable that the slit surrounds the temperature sensor in a U shape. By adopting this configuration, it is possible to efficiently suppress the heat generated by the heater from being transferred to the temperature sensor.
　上記構成において、前記フレキシブル基板のうち前記温度センサを含んで前記スリットに囲まれた部分をセンサ部とすると、前記センサ部は、前記フレキシブル基板のうち前記センサ部以外の部分に対して折り曲げられることによって、前記フレキシブル基板のうち前記センサ部以外の部分に比べて、前記フレキシブル基板の厚み方向にずれた位置に配置されていることが好ましい。この構成を採用することにより、温度センサをヒータからさらに遠ざけることができる。 In the above configuration, if the portion of the flexible substrate including the temperature sensor and surrounded by the slit is used as the sensor portion, the sensor portion is bent with respect to a portion of the flexible substrate other than the sensor portion. Therefore, it is preferable that the flexible substrate is arranged at a position deviated in the thickness direction of the flexible substrate as compared with a portion other than the sensor portion. By adopting this configuration, the temperature sensor can be further moved away from the heater.
　上記構成において、前記センサ部が前記センサ部以外の部分に対して折り曲げられた状態を維持するために、前記フレキシブル基板の表面または内部に金属部材が配置されていることが好ましい。この構成を採用することにより、センサ部がセンサ部以外の部分に対して折り曲げられた際には、金属部材が塑性変形することによって、センサ部の折り曲げ状態を容易に維持することができる。 In the above configuration, it is preferable that a metal member is arranged on the surface or inside of the flexible substrate in order to maintain the state in which the sensor portion is bent with respect to a portion other than the sensor portion. By adopting this configuration, when the sensor portion is bent with respect to a portion other than the sensor portion, the metal member is plastically deformed, so that the bent state of the sensor portion can be easily maintained.
　上記構成において、前記温度センサは、サーミスタであるか、または、Ｉ２Ｃ通信方式のワンチップ型温度センサであることが好ましい。この構成を採用することにより、温度センサを容易に実現することができる。 In the above configuration, the temperature sensor is preferably a thermistor or an I2C communication type one-chip temperature sensor. By adopting this configuration, a temperature sensor can be easily realized.
　上記構成において、前記通信配線は、ニッケルめっきされていることが好ましい。この構成を採用することにより、通信配線の抵抗率を下げることができる。また、はんだの濡れ性を改善することができる。 In the above configuration, the communication wiring is preferably nickel-plated. By adopting this configuration, the resistivity of the communication wiring can be reduced. In addition, the wettability of the solder can be improved.
　上記構成において、前記通信配線は、前記温度センサとは反対側の端部に端子部を備え、前記端子部は金めっきされていることが好ましい。この構成を採用することにより、コネクタ側の端子も金めっきしておけば、金同士が接触することとなり、端子部における異種金属同士の接触に伴う腐食を回避することができる。 In the above configuration, it is preferable that the communication wiring is provided with a terminal portion at an end opposite to the temperature sensor, and the terminal portion is gold-plated. By adopting this configuration, if the terminals on the connector side are also gold-plated, the gold will come into contact with each other, and corrosion due to the contact between dissimilar metals in the terminal portion can be avoided.
　上記構成において前記フレキシブル基板は、ポリイミド樹脂を主材料とすることが好ましい。この構成を採用することにより、薄くても絶縁性を保つことができる。また、薄くすることによって、熱抵抗を下げることができるので、対象物にヒータからの熱を効率良く伝導することができる。 In the above configuration, it is preferable that the flexible substrate uses a polyimide resin as a main material. By adopting this configuration, insulation can be maintained even if it is thin. Further, by making the thickness thinner, the thermal resistance can be lowered, so that the heat from the heater can be efficiently conducted to the object.
　上記目的を達成するため、本発明に基づく光学アセンブリは、上述のいずれかのヒータ装置と、レンズ鏡筒とを含み、前記ヒータ装置は、前記レンズ鏡筒に巻き付けられた部分を含む。この構成を採用することにより、対象物としてのレンズ鏡筒の温度をより正確に測定することができる。 In order to achieve the above object, the optical assembly based on the present invention includes any of the above heater devices and a lens barrel, and the heater device includes a portion wound around the lens barrel. By adopting this configuration, the temperature of the lens barrel as an object can be measured more accurately.
　上記目的を達成するため、本発明に基づく光学アセンブリの他の局面は、上述のいずれかのヒータ装置と、レンズ鏡筒とを含み、前記ヒータ装置の前記第２部分の少なくとも一部は、前記レンズ鏡筒に巻き付けられている。この構成を採用することにより、温度をより正確に測定することができる。 In order to achieve the above object, another aspect of the optical assembly according to the present invention includes any of the heater devices described above and a lens barrel, and at least a portion of the second portion of the heater device is described above. It is wrapped around the lens barrel. By adopting this configuration, the temperature can be measured more accurately.
本発明に基づく実施の形態１におけるヒータ装置の平面図である。It is a top view of the heater device in Embodiment 1 based on this invention. 図１におけるＩＩ－ＩＩ線に関する矢視断面図である。FIG. 5 is a cross-sectional view taken along the line II-II in FIG. 図１におけるＩＩＩ－ＩＩＩ線に関する矢視断面図である。FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 本発明に基づく実施の形態１におけるヒータ装置の各部分の位置関係の説明図である。It is explanatory drawing of the positional relationship of each part of the heater device in Embodiment 1 based on this invention. 本発明に基づく実施の形態２におけるヒータ装置の平面図である。It is a top view of the heater device in Embodiment 2 based on this invention. 本発明に基づく実施の形態２におけるヒータ装置で、センサ部を折り曲げた場合の側面図である。It is a side view at the time of bending the sensor part in the heater device of Embodiment 2 based on this invention. 本発明に基づく実施の形態３におけるヒータ装置の平面図である。It is a top view of the heater device in Embodiment 3 based on this invention. 本発明に基づく実施の形態３におけるヒータ装置のセンサ部近傍の拡大図である。It is an enlarged view of the vicinity of the sensor part of the heater device in Embodiment 3 based on this invention. 本発明に基づく実施の形態３におけるヒータ装置の側面図である。It is a side view of the heater device in Embodiment 3 based on this invention. 本発明に基づく実施の形態４における光学アセンブリの分解図である。It is an exploded view of the optical assembly in Embodiment 4 based on this invention. 本発明に基づく実施の形態４における光学アセンブリの一部の部品を組み立てた状態の斜視図である。It is a perspective view of the state which a part part of the optical assembly in Embodiment 4 based on this invention was assembled. 本発明に基づく実施の形態４における光学アセンブリの斜視図である。It is a perspective view of the optical assembly in Embodiment 4 based on this invention. 本発明に基づく実施の形態１におけるヒータ装置の第１の変形例の平面図である。It is a top view of the 1st modification of the heater device in Embodiment 1 based on this invention. 本発明に基づく実施の形態１におけるヒータ装置の第２の変形例の平面図である。It is a top view of the 2nd modification of the heater device in Embodiment 1 based on this invention. 本発明に基づく実施の形態１におけるヒータ装置の第３の変形例の平面図である。It is a top view of the 3rd modification of the heater device in Embodiment 1 based on this invention. 本発明に基づく実施の形態１におけるヒータ装置の第４の変形例の平面図である。It is a top view of the 4th modification of the heater device in Embodiment 1 based on this invention.
　（実施の形態１）
　図１～図４を参照して、本発明に基づく実施の形態１におけるヒータ装置について説明する。本実施の形態におけるヒータ装置１０１の平面図を図１に示す。図１におけるＩＩ－ＩＩ線に関する矢視断面図を図２に示す。図１におけるＩＩＩ－ＩＩＩ線に関する矢視断面図を図３に示す。図１に示したヒータ装置１０１の各部分の位置関係を図４に示す。 (Embodiment 1)
The heater device according to the first embodiment based on the present invention will be described with reference to FIGS. 1 to 4. A plan view of the heater device 101 according to the present embodiment is shown in FIG. A cross-sectional view taken along the line II-II in FIG. 1 is shown in FIG. A cross-sectional view taken along the line III-III in FIG. 1 is shown in FIG. FIG. 4 shows the positional relationship of each part of the heater device 101 shown in FIG.
　ヒータ装置１０１は、フレキシブル基板２、フレキシブル基板２の表面または内部に配置されたヒータ１ａと、フレキシブル基板２の表面または内部でヒータ１ａから離隔した位置に配置された温度センサ３とを備える。フレキシブル基板２は、たとえばポリイミド樹脂を主材料とする。図１～図３では、ヒータ１ａおよび温度センサ３がフレキシブル基板２の表面に配置されている例を示す。 The heater device 101 includes a flexible substrate 2, a heater 1a arranged on the surface or inside of the flexible substrate 2, and a temperature sensor 3 arranged on the surface or inside of the flexible substrate 2 at a position separated from the heater 1a. The flexible substrate 2 uses, for example, a polyimide resin as a main material. 1 to 3 show an example in which the heater 1a and the temperature sensor 3 are arranged on the surface of the flexible substrate 2.
　フレキシブル基板２は、温度センサ３の通信配線４およびヒータ１ａの電力配線８が配置された長手形状の第１部分２１と、温度センサおよび前記ヒータが配置された第２部分とを含み、温度センサ３と通信配線４とが第２部分２２において電気的に接続されており、ヒータ１ａと電力配線８とが第２部分２２において電気的に接続されており、第２部分２２は、加熱対象物の立体形状の少なくとも一部を２次元平面に展開した形状を有し、第１部分２１および第２部分２２は一体的な基板である。第１部分２１および第２部分２２は、図４において長方形で模式的に示されている。図４では、説明の便宜のために、第１部分２１と第２部分２２との間の境界線を表示している。 The flexible substrate 2 includes a first portion 21 having a longitudinal shape in which the communication wiring 4 of the temperature sensor 3 and the power wiring 8 of the heater 1a are arranged, and a second portion in which the temperature sensor and the heater are arranged. 3 and the communication wiring 4 are electrically connected in the second portion 22, the heater 1a and the power wiring 8 are electrically connected in the second portion 22, and the second portion 22 is an object to be heated. It has a shape in which at least a part of the three-dimensional shape of is developed into a two-dimensional plane, and the first portion 21 and the second portion 22 are integral substrates. The first portion 21 and the second portion 22 are schematically shown as rectangles in FIG. In FIG. 4, for convenience of explanation, a boundary line between the first portion 21 and the second portion 22 is displayed.
　本実施の形態では、第１の向き９１は、第１部分２１の長手方向９０に対して垂直な向きとなっているが、これはあくまで一例である。第１の向き９１は長手方向９０に対して９０°以外の角度をなす関係であってもよい。第２部分２２は、第１の向き９１に延在する部分を含む。さらに第２部分２２は、第１の向き９１とは反対の向きである第２の向き９２に延在する部分を含む。 In the present embodiment, the first orientation 91 is the orientation perpendicular to the longitudinal direction 90 of the first portion 21, but this is just an example. The first orientation 91 may have an angle other than 90 ° with respect to the longitudinal direction 90. The second portion 22 includes a portion extending in the first orientation 91. Further, the second portion 22 includes a portion extending in the second orientation 92, which is the orientation opposite to the first orientation 91.
　第２部分２２にはヒータ１ａの他にヒータ１ｂも配置されている。ヒータ装置１０１においては、ヒータ１ａとヒータ１ｂとは対称に配置されている。ヒータ１ａ，１ｂの各々からは電力配線８が延在している。電力配線８は、第１部分２１に沿って配置されている。 In addition to the heater 1a, the heater 1b is also arranged in the second portion 22. In the heater device 101, the heater 1a and the heater 1b are arranged symmetrically. The power wiring 8 extends from each of the heaters 1a and 1b. The power wiring 8 is arranged along the first portion 21.
　本実施の形態では、フレキシブル基板２にヒータ１ａおよび温度センサ３が配置されているので、配線が簡単で、正確な温度測定ができる。ヒータ装置１０１では、温度センサ３は、ヒータ１ａから離隔した位置に配置されているので、ヒータ１ａでの発熱が温度センサ３によって拾われて温度測定結果が不正確となるという事態をなるべく避けることができる。 In the present embodiment, since the heater 1a and the temperature sensor 3 are arranged on the flexible substrate 2, wiring is simple and accurate temperature measurement can be performed. In the heater device 101, since the temperature sensor 3 is arranged at a position separated from the heater 1a, it is possible to avoid a situation in which the heat generated by the heater 1a is picked up by the temperature sensor 3 and the temperature measurement result becomes inaccurate as much as possible. Can be done.
　温度センサ３とヒータ１ａとの間の距離Ａはフレキシブル基板２の厚みＴの１０倍以上であることが好ましい。この構成を採用することにより、ヒータ１ａからの熱が温度センサ３に伝わる度合いを軽減することができる。 The distance A between the temperature sensor 3 and the heater 1a is preferably 10 times or more the thickness T of the flexible substrate 2. By adopting this configuration, the degree of heat transferred from the heater 1a to the temperature sensor 3 can be reduced.
　（実施の形態２）
　図５を参照して、本発明に基づく実施の形態２におけるヒータ装置について説明する。本実施の形態におけるヒータ装置１０２の平面図を図５に示す。 (Embodiment 2)
The heater device according to the second embodiment based on the present invention will be described with reference to FIG. A plan view of the heater device 102 according to the present embodiment is shown in FIG.
　ヒータ装置１０２の構成は、基本的には、実施の形態１で説明したヒータ装置１０１の構成と共通するが、以下の点で異なる。ヒータ装置１０２では、温度センサ３の周囲にスリット５が設けられている。 The configuration of the heater device 102 is basically the same as the configuration of the heater device 101 described in the first embodiment, but differs in the following points. In the heater device 102, a slit 5 is provided around the temperature sensor 3.
　本実施の形態では、温度センサ３の周囲にスリット５が設けられているので、ヒータ１ａなどからの熱が温度センサ３に伝わることを抑制することができる。 In the present embodiment, since the slit 5 is provided around the temperature sensor 3, it is possible to suppress the transfer of heat from the heater 1a or the like to the temperature sensor 3.
　スリット５は、温度センサ３の周囲をＵ字形に囲んでいることが好ましい。この構成を採用することにより、ヒータ１ａなどからの熱が温度センサ３に伝わることを効率良く抑制することができる。 The slit 5 preferably surrounds the temperature sensor 3 in a U shape. By adopting this configuration, it is possible to efficiently suppress the transfer of heat from the heater 1a and the like to the temperature sensor 3.
　フレキシブル基板２のうち温度センサ３を含んでスリット５に囲まれた部分をセンサ部３１とすると、センサ部３１は、フレキシブル基板２のうちセンサ部３１以外の部分３２に対して折り曲げられることによって、フレキシブル基板２のうちセンサ部３１以外の部分３２に比べて、フレキシブル基板２の厚み方向９５にずれた位置に配置されていることが好ましい。このように折り曲げた状態で側方から見たところを図６に示す。この構成を採用することにより、温度センサ３をヒータ１ａからさらに遠ざけることができる。 Assuming that the portion of the flexible substrate 2 including the temperature sensor 3 and surrounded by the slit 5 is the sensor portion 31, the sensor portion 31 is bent with respect to the portion 32 of the flexible substrate 2 other than the sensor portion 31. It is preferable that the flexible substrate 2 is arranged at a position deviated from the portion 32 of the flexible substrate 2 other than the sensor portion 31 in the thickness direction 95 of the flexible substrate 2. FIG. 6 shows a side view of the bent state. By adopting this configuration, the temperature sensor 3 can be further moved away from the heater 1a.
　（実施の形態３）
　図７～図９を参照して、本発明に基づく実施の形態３におけるヒータ装置について説明する。本実施の形態におけるヒータ装置１０３の平面図を図７に示す。図７の中央部分の拡大図を図８に示す。 (Embodiment 3)
The heater device according to the third embodiment based on the present invention will be described with reference to FIGS. 7 to 9. A plan view of the heater device 103 according to the present embodiment is shown in FIG. An enlarged view of the central portion of FIG. 7 is shown in FIG.
　ヒータ装置１０３の構成は、基本的には、実施の形態２で説明したヒータ装置１０２の構成と共通するが、以下の点で異なる。フレキシブル基板２のうち温度センサ３を含んでスリット５に囲まれた部分をセンサ部３１とすると、センサ部３１は、フレキシブル基板２のうちセンサ部３１以外の部分３２に対して折り曲げられることによって、フレキシブル基板２のうちセンサ部３１以外の部分３２に比べて、フレキシブル基板２の厚み方向９５にずれた位置に配置されている。このように折り曲げた状態で側方から見たところを図９に示す。ヒータ装置１０３では、センサ部３１がセンサ部３１以外の部分３２に対して折り曲げられた状態を維持するために、フレキシブル基板２の表面または内部に金属部材１５ａ，１５ｂが配置されている。金属部材１５ａ，１５ｂはたとえば金属板であってよい。 The configuration of the heater device 103 is basically the same as the configuration of the heater device 102 described in the second embodiment, but differs in the following points. Assuming that the portion of the flexible substrate 2 including the temperature sensor 3 and surrounded by the slit 5 is the sensor portion 31, the sensor portion 31 is bent with respect to the portion 32 of the flexible substrate 2 other than the sensor portion 31. It is arranged at a position shifted in the thickness direction 95 of the flexible substrate 2 as compared with the portion 32 of the flexible substrate 2 other than the sensor portion 31. A view from the side in the bent state is shown in FIG. In the heater device 103, metal members 15a and 15b are arranged on the surface or inside of the flexible substrate 2 in order to maintain the state in which the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31. The metal members 15a and 15b may be, for example, a metal plate.
　本実施の形態では、フレキシブル基板２の表面または内部に金属部材１５ａ，１５ｂが配置されているので、センサ部３１がセンサ部３１以外の部分３２に対して折り曲げられた際には、金属部材１５ａ，１５ｂが塑性変形することによって、このセンサ部３１の折り曲げ状態が維持される。こうして、センサ部３１がセンサ部３１以外の部分３２に対して折り曲げられた状態を容易に維持することができる。 In the present embodiment, since the metal members 15a and 15b are arranged on the surface or inside of the flexible substrate 2, when the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31, the metal member 15a , 15b is plastically deformed to maintain the bent state of the sensor unit 31. In this way, the state in which the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31 can be easily maintained.
　なお、温度センサ３は、サーミスタであるか、または、Ｉ２Ｃ通信方式のワンチップ型温度センサであることが好ましい。この構成を採用することにより、温度センサ３を容易に実現することができる。 The temperature sensor 3 is preferably a thermistor or an I2C communication type one-chip temperature sensor. By adopting this configuration, the temperature sensor 3 can be easily realized.
　なお、通信配線４は、ニッケルめっきされていることが好ましい。この構成を採用することにより、通信配線の抵抗率を下げることができる。また、たとえば元の配線がステンレスである場合にニッケルめっきすることとすれば、はんだの濡れ性を改善することができる。 The communication wiring 4 is preferably nickel-plated. By adopting this configuration, the resistivity of the communication wiring can be reduced. Further, for example, if the original wiring is made of stainless steel and nickel-plated, the wettability of the solder can be improved.
　通信配線４は、温度センサ３とは反対側の端部２６に端子部７を備え、端子部７は金めっきされていることが好ましい。この構成を採用することにより、コネクタ側の端子も金めっきしておけば、金同士が接触することとなり、端子部における異種金属同士の接触に伴う腐食を回避することができる。 It is preferable that the communication wiring 4 is provided with a terminal portion 7 at an end portion 26 on the opposite side of the temperature sensor 3, and the terminal portion 7 is gold-plated. By adopting this configuration, if the terminals on the connector side are also gold-plated, the gold will come into contact with each other, and corrosion due to the contact between dissimilar metals in the terminal portion can be avoided.
　フレキシブル基板２は、ポリイミド樹脂を主材料とすることが好ましい。この構成を採用することにより、薄くても絶縁性を保つことができる。また、薄くすることによって、熱抵抗を下げることができるので、対象物にヒータからの熱を効率良く伝導することができる。 The flexible substrate 2 preferably uses a polyimide resin as a main material. By adopting this configuration, insulation can be maintained even if it is thin. Further, by making the thickness thinner, the thermal resistance can be lowered, so that the heat from the heater can be efficiently conducted to the object.
　（実施の形態４）
　図１０～図１２を参照して、本発明に基づく実施の形態４における光学アセンブリについて説明する。この光学アセンブリの分解図を図１０に示す。光学アセンブリの一部の部品を組み立てた状態を図１１に示す。光学アセンブリの全体を組み立てた状態を図１２に示す。 (Embodiment 4)
The optical assembly according to the fourth embodiment based on the present invention will be described with reference to FIGS. 10 to 12. An exploded view of this optical assembly is shown in FIG. FIG. 11 shows a state in which some parts of the optical assembly are assembled. FIG. 12 shows a state in which the entire optical assembly is assembled.
　本実施の形態における光学アセンブリ２０１は、上述のいずれかのヒータ装置１０１と、レンズ鏡筒５１とを含み、ヒータ装置１０１は、レンズ鏡筒５１に巻き付けられた部分を含む。レンズ鏡筒５１は、レンズ４１とマウント部４２とを含む。ＣＭＯＳ基板５４にはＣＭＯＳセンサ５５が実装されている。レンズ鏡筒５１の下側には保持部５６が取り付けられる。マウント部４２にはカバー５３が被せられる。カバー５３にはレンズ４１を通すための開口部が設けられている。 The optical assembly 201 in the present embodiment includes any of the above-mentioned heater devices 101 and a lens barrel 51, and the heater device 101 includes a portion wound around the lens barrel 51. The lens barrel 51 includes a lens 41 and a mount portion 42. A CMOS sensor 55 is mounted on the CMOS substrate 54. A holding portion 56 is attached to the lower side of the lens barrel 51. The cover 53 is put on the mount portion 42. The cover 53 is provided with an opening for passing the lens 41.
　本実施の形態における光学アセンブリ２０１は、上述のいずれかのヒータ装置１０１と、レンズ鏡筒５１とを含み、ヒータ装置１０１の第２部分２２の少なくとも一部は、レンズ鏡筒５１に巻き付けられている。 The optical assembly 201 in the present embodiment includes any of the heater devices 101 described above and the lens barrel 51, and at least a part of the second portion 22 of the heater device 101 is wound around the lens barrel 51. There is.
　本実施の形態では、光学アセンブリ２０１において、ヒータ装置１０１が用いられているので、ヒータ装置１０１内では、フレキシブル基板２にヒータ１ａおよび温度センサ３が配置されているので、配線が簡単で、正確な温度測定ができる。ヒータ装置１０１では、温度センサ３は、ヒータ１ａから離隔した位置に配置されているので、ヒータ１ａでの発熱が温度センサ３によって拾われて温度測定結果が不正確となるという事態をなるべく避けることができる。したがって、光学アセンブリ２０１としても、正確な温度測定に基づいて対象物を加熱制御することができるので、温度変動による誤差を防ぐことができる。 In the present embodiment, since the heater device 101 is used in the optical assembly 201, the heater 1a and the temperature sensor 3 are arranged on the flexible substrate 2 in the heater device 101, so that the wiring is simple and accurate. Can measure temperature. In the heater device 101, since the temperature sensor 3 is arranged at a position separated from the heater 1a, it is possible to avoid a situation in which the heat generated by the heater 1a is picked up by the temperature sensor 3 and the temperature measurement result becomes inaccurate as much as possible. Can be done. Therefore, even in the optical assembly 201, the object can be heated and controlled based on accurate temperature measurement, so that an error due to temperature fluctuation can be prevented.
　なお、実施の形態１では全体がＴ字形のヒータ装置１０１を例示したが、ヒータ装置の全体の形状としてはさまざまなものが考えられる。たとえば図１３～図１５に示すようなものであってもよい。 Although the overall T-shaped heater device 101 is illustrated in the first embodiment, various shapes of the overall shape of the heater device can be considered. For example, it may be as shown in FIGS. 13 to 15.
　（その他の変形例）
　ここでは、実施の形態１で示したヒータ装置のいくつかの変形例を示す。 (Other variants)
Here, some modifications of the heater device shown in the first embodiment are shown.
　図１３に示すヒータ装置１０４では、第１部分２１の一方の端部２５から第２部分２２が第１の向き９１に延在している。ヒータ装置１０４は、全体としてＴ字形ではなく旗竿形となっている。ヒータ装置は、このような構成であってもよい。 In the heater device 104 shown in FIG. 13, one end 25 of the first portion 21 to the second portion 22 extend in the first direction 91. The heater device 104 has a flagpole shape instead of a T shape as a whole. The heater device may have such a configuration.
　図１４に示すヒータ装置１０５では、第１部分２１が途中で曲がっている。第１部分２２は途中でクランクしている。ヒータ装置は、このような構成であってもよい。 In the heater device 105 shown in FIG. 14, the first portion 21 is bent in the middle. The first part 22 is cranked in the middle. The heater device may have such a configuration.
　図１５に示すヒータ装置１０６では、第１部分２１の一方の端部から第１の向き９１に延在する第２部分２２は平行四辺形となっている。ヒータ装置は、このような構成であってもよい。このように温度センサ３が第１部分２２から離れた位置に配置されていてもよい。 In the heater device 106 shown in FIG. 15, the second portion 22 extending from one end of the first portion 21 in the first direction 91 is a parallelogram. The heater device may have such a configuration. In this way, the temperature sensor 3 may be arranged at a position away from the first portion 22.
　図１６に示すヒータ装置１０７では、第１部分２１の一方の端部近傍が９０°曲がっている。第１部分２１の一方の端部から第２部分が延在している。第２部分２２は長方形に近い形状であるが、第１部分２１の一方の端部がつながっている側の辺に対向する辺において切欠き２７を有する。切欠き２７は、第２部分を対象物に巻き付けたときに、第１部分２１と、第２部分２２の第１部分２１から遠い側の端とが干渉しないように設けられたものである。切欠き２７は、たとえば半円形の切欠きである。 In the heater device 107 shown in FIG. 16, the vicinity of one end of the first portion 21 is bent by 90 °. A second portion extends from one end of the first portion 21. The second portion 22 has a shape close to a rectangle, but has a notch 27 on the side facing the side to which one end of the first portion 21 is connected. The notch 27 is provided so that the first portion 21 and the end of the second portion 22 on the side far from the first portion 21 do not interfere with each other when the second portion is wound around the object. The notch 27 is, for example, a semi-circular notch.
　なお、上記実施の形態のうち複数を適宜組み合わせて採用してもよい。
　なお、今回開示した上記実施の形態はすべての点で例示であって制限的なものではない。本発明の範囲は請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更を含むものである。 In addition, a plurality of the above-described embodiments may be appropriately combined and adopted.
It should be noted that the above-described embodiment disclosed this time is an example in all respects and is not restrictive. The scope of the present invention is indicated by the claims and includes all modifications within the meaning and scope equivalent to the claims.
　（付記１）
　フレキシブル基板２と、
　前記フレキシブル基板２の表面または内部に配置されたヒータ１ａと、
　前記フレキシブル基板２の表面または内部で前記ヒータ２から離隔した位置に配置された温度センサ３とを備える、ヒータ装置。 (Appendix 1)
Flexible substrate 2 and
A heater 1a arranged on the surface or inside of the flexible substrate 2 and
A heater device including a temperature sensor 3 arranged at a position separated from the heater 2 on the surface or inside of the flexible substrate 2.
　（付記２）
　前記フレキシブル基板は、前記温度センサの通信配線および前記ヒータの電力配線が配置された長手形状の第１部分と、前記温度センサおよび前記ヒータが配置された第２部分とを含み、
　前記温度センサと前記通信配線とが前記第２部分において電気的に接続されており、
　前記ヒータと前記電力配線とが前記第２部分において電気的に接続されており、
　前記第２部分は、加熱対象物の立体形状の少なくとも一部を２次元平面に展開した形状を有し、前記第１部分および前記第２部分は一体的な基板である、付記１に記載のヒータ装置。 (Appendix 2)
The flexible substrate includes a first portion having a longitudinal shape in which the communication wiring of the temperature sensor and the power wiring of the heater are arranged, and a second portion in which the temperature sensor and the heater are arranged.
The temperature sensor and the communication wiring are electrically connected in the second part.
The heater and the power wiring are electrically connected in the second portion.
The second part has a shape in which at least a part of the three-dimensional shape of the object to be heated is developed in a two-dimensional plane, and the first part and the second part are an integral substrate, according to Appendix 1. Heater device.
　（付記３）
　前記温度センサ３と前記ヒータ１ａとの間の距離は前記フレキシブル基板２の厚みの１０倍以上である、付記１または２に記載のヒータ装置。 (Appendix 3)
The heater device according to Appendix 1 or 2, wherein the distance between the temperature sensor 3 and the heater 1a is 10 times or more the thickness of the flexible substrate 2.
　（付記４）
　前記温度センサ３の周囲にスリット５が設けられている、付記１から３のいずれか１項に記載のヒータ装置。 (Appendix 4)
The heater device according to any one of Supplementary note 1 to 3, wherein a slit 5 is provided around the temperature sensor 3.
　（付記５）
　前記スリット５は、前記温度センサ３の周囲をＵ字形に囲んでいる。付記４に記載のヒータ装置。 (Appendix 5)
The slit 5 surrounds the temperature sensor 3 in a U shape. The heater device according to Appendix 4.
　（付記６）
　前記フレキシブル基板２のうち前記温度センサ３を含んで前記スリット５に囲まれた部分をセンサ部３１とすると、
　前記センサ部３１は、前記フレキシブル基板２のうち前記センサ部３１以外の部分に対して折り曲げられることによって、前記フレキシブル基板２のうち前記センサ部３１以外の部分３２に比べて、前記フレキシブル基板２の厚み方向にずれた位置に配置されている、付記４または５に記載のヒータ装置。 (Appendix 6)
Assuming that the portion of the flexible substrate 2 including the temperature sensor 3 and surrounded by the slit 5 is the sensor unit 31.
The sensor portion 31 is bent with respect to a portion of the flexible substrate 2 other than the sensor portion 31, so that the flexible substrate 2 has a flexible substrate 2 as compared with a portion 32 of the flexible substrate 2 other than the sensor portion 31. The heater device according to Appendix 4 or 5, which is arranged at a position deviated in the thickness direction.
　（付記７）
　前記センサ部３１が前記センサ部３１以外の部分３２に対して折り曲げられた状態を維持するために、前記フレキシブル基板２の表面または内部に金属部材１５ａ，１５ｂが配置されている、付記６に記載のヒータ装置。 (Appendix 7)
The description in Appendix 6, wherein the metal members 15a and 15b are arranged on the surface or inside of the flexible substrate 2 in order to maintain the state in which the sensor unit 31 is bent with respect to the portion 32 other than the sensor unit 31. Heater device.
　（付記８）
　前記温度センサ３は、サーミスタであるか、または、Ｉ２Ｃ通信方式のワンチップ型温度センサである、付記１から７のいずれか１項に記載のヒータ装置。 (Appendix 8)
The heater device according to any one of Appendix 1 to 7, wherein the temperature sensor 3 is a thermistor or an I2C communication type one-chip temperature sensor.
　（付記９）
　前記通信配線４は、ニッケルめっきされている、付記２に記載のヒータ装置。 (Appendix 9)
The heater device according to Appendix 2, wherein the communication wiring 4 is nickel-plated.
　（付記１０）
　前記通信配線４は、前記温度センサ３とは反対側の端部２６に端子部７を備え、前記端子部７は金めっきされている、付記２に記載のヒータ装置。 (Appendix 10)
The heater device according to Appendix 2, wherein the communication wiring 4 includes a terminal portion 7 at an end portion 26 opposite to the temperature sensor 3, and the terminal portion 7 is gold-plated.
　（付記１１）
　前記フレキシブル基板２は、ポリイミド樹脂を主材料とする、付記１から１０のいずれか１項に記載のヒータ装置。 (Appendix 11)
The heater device according to any one of Supplementary note 1 to 10, wherein the flexible substrate 2 uses a polyimide resin as a main material.
　（付記１２）
　付記１から１１のいずれか１項に記載のヒータ装置１０１と、
　レンズ鏡筒５１とを含み、
　前記ヒータ装置１０１は、前記レンズ鏡筒５１に巻き付けられた部分を含む、光学アセンブリ。 (Appendix 12)
The heater device 101 according to any one of the items 1 to 11 and the heater device 101.
Including the lens barrel 51
The heater device 101 is an optical assembly including a portion wound around the lens barrel 51.
　（付記１３）
　付記２、９、および１０のいずれか１項に記載のヒータ装置１０１と、
　レンズ鏡筒５１とを含み、
　前記ヒータ装置１０１の前記第２部分２２の少なくとも一部は、前記レンズ鏡筒５１に巻き付けられている、光学アセンブリ。 (Appendix 13)
The heater device 101 according to any one of Supplementary note 2, 9, and 10.
Including the lens barrel 51
An optical assembly in which at least a portion of the second portion 22 of the heater device 101 is wound around the lens barrel 51.
　１，１ａ，１ｂ，１ｃ，１ｄ　ヒータ、２　フレキシブル基板、３　温度センサ、４　通信配線、５　スリット、６　金属部材、７　端子部、８　電力配線、１５ａ，１５ｂ　金属部材、２１　第１部分、２２　第２部分、２５　（一方の）端部、２６　（温度センサとは反対側の）端部、２７　切欠き、３１　センサ部、３２　（センサ部以外の）部分、４１　レンズ、４２　マウント部、５１　レンズ鏡筒、５３　カバー、５４　ＣＭＯＳ基板、５５　ＣＭＯＳセンサ、５６　保持部、９０　長手方向、９１　第１の向き、９２　第２の向き、９５　厚み方向、１０１，１０２，１０３，１０４，１０５，１０６，１０７　ヒータ装置、２０１　光学アセンブリ。 1,1a, 1b, 1c, 1d heater, 2 flexible substrate, 3 temperature sensor, 4 communication wiring, 5 slit, 6 metal member, 7 terminal part, 8 power wiring, 15a, 15b metal member, 21 1st part, 22 2nd part, 25 (one) end, 26 (opposite to the temperature sensor) end, 27 notch, 31 sensor part, 32 (other than the sensor part) part, 41 lens, 42 mount part, 51 Lens barrel, 53 cover, 54 CMOS substrate, 55 CMOS sensor, 56 holding part, 90 longitudinal direction, 91 first orientation, 92 second orientation, 95 thickness direction, 101, 102, 103, 104, 105, 106 , 107 heater device, 201 optical assembly.

Claims (13)

  1. 　フレキシブル基板と、
    　前記フレキシブル基板の表面または内部に配置されたヒータと、
    　前記フレキシブル基板の表面または内部で前記ヒータから離隔した位置に配置された温度センサとを備える、ヒータ装置。     Flexible board and
    With a heater arranged on the surface or inside of the flexible substrate,
    A heater device including a temperature sensor arranged at a position separated from the heater on the surface or inside of the flexible substrate.
  2. 　前記フレキシブル基板は、前記温度センサの通信配線および前記ヒータの電力配線が配置された長手形状の第１部分と、前記温度センサおよび前記ヒータが配置された第２部分とを含み、
    　前記温度センサと前記通信配線とが前記第２部分において電気的に接続されており、
    　前記ヒータと前記電力配線とが前記第２部分において電気的に接続されており、
    　前記第２部分は、加熱対象物の立体形状の少なくとも一部を２次元平面に展開した形状を有し、前記第１部分および前記第２部分は一体的な基板である、請求項１に記載のヒータ装置。     The flexible substrate includes a first portion having a longitudinal shape in which the communication wiring of the temperature sensor and the power wiring of the heater are arranged, and a second portion in which the temperature sensor and the heater are arranged.
    The temperature sensor and the communication wiring are electrically connected in the second part.
    The heater and the power wiring are electrically connected in the second portion.
    The first portion according to claim 1, wherein the second portion has a shape in which at least a part of the three-dimensional shape of the object to be heated is developed in a two-dimensional plane, and the first portion and the second portion are an integral substrate. Heater device.
  3. 　前記温度センサと前記ヒータとの間の距離は前記フレキシブル基板の厚みの１０倍以上である、請求項１または２に記載のヒータ装置。 The heater device according to claim 1 or 2, wherein the distance between the temperature sensor and the heater is 10 times or more the thickness of the flexible substrate.
  4. 　前記温度センサの周囲にスリットが設けられている、請求項１から３のいずれか１項に記載のヒータ装置。 The heater device according to any one of claims 1 to 3, wherein a slit is provided around the temperature sensor.
  5. 　前記スリットは、前記温度センサの周囲をＵ字形に囲んでいる。請求項４に記載のヒータ装置。 The slit surrounds the temperature sensor in a U shape. The heater device according to claim 4.
  6. 　前記フレキシブル基板のうち前記温度センサを含んで前記スリットに囲まれた部分をセンサ部とすると、
    　前記センサ部は、前記フレキシブル基板のうち前記センサ部以外の部分に対して折り曲げられることによって、前記フレキシブル基板のうち前記センサ部以外の部分に比べて、前記フレキシブル基板の厚み方向にずれた位置に配置されている、請求項４または５に記載のヒータ装置。     When the portion of the flexible substrate including the temperature sensor and surrounded by the slit is used as the sensor portion.
    The sensor portion is bent with respect to a portion of the flexible substrate other than the sensor portion, so that the sensor portion is displaced from the flexible substrate in the thickness direction of the flexible substrate as compared with the portion of the flexible substrate other than the sensor portion. The heater device according to claim 4 or 5, which is arranged.
  7. 　前記センサ部が前記センサ部以外の部分に対して折り曲げられた状態を維持するために、前記フレキシブル基板の表面または内部に金属部材が配置されている、請求項６に記載のヒータ装置。 The heater device according to claim 6, wherein a metal member is arranged on the surface or inside of the flexible substrate in order to maintain the state in which the sensor portion is bent with respect to a portion other than the sensor portion.
  8. 　前記温度センサは、サーミスタであるか、または、Ｉ２Ｃ通信方式のワンチップ型温度センサである、請求項１から７のいずれか１項に記載のヒータ装置。 The heater device according to any one of claims 1 to 7, wherein the temperature sensor is a thermistor or an I2C communication type one-chip temperature sensor.
  9. 　前記通信配線は、ニッケルめっきされている、請求項２に記載のヒータ装置。 The heater device according to claim 2, wherein the communication wiring is nickel-plated.
  10. 　前記通信配線は、前記温度センサとは反対側の端部に端子部を備え、前記端子部は金めっきされている、請求項２に記載のヒータ装置。 The heater device according to claim 2, wherein the communication wiring is provided with a terminal portion at an end opposite to the temperature sensor, and the terminal portion is gold-plated.
  11. 　前記フレキシブル基板は、ポリイミド樹脂を主材料とする、請求項１から１０のいずれか１項に記載のヒータ装置。 The heater device according to any one of claims 1 to 10, wherein the flexible substrate is made of a polyimide resin as a main material.
  12. 　請求項１から１１のいずれか１項に記載のヒータ装置と、
    　レンズ鏡筒とを含み、
    　前記ヒータ装置は、前記レンズ鏡筒に巻き付けられた部分を含む、光学アセンブリ。     The heater device according to any one of claims 1 to 11.
    Including with lens barrel
    The heater device is an optical assembly that includes a portion wound around the lens barrel.
  13. 　請求項２、９、および１０のいずれか１項に記載のヒータ装置と、
    　レンズ鏡筒とを含み、
    　前記ヒータ装置の前記第２部分の少なくとも一部は、前記レンズ鏡筒に巻き付けられている、光学アセンブリ。     The heater device according to any one of claims 2, 9, and 10.
    Including with lens barrel
    An optical assembly in which at least a portion of the second portion of the heater device is wound around the lens barrel.
PCT/JP2020/032563 2019-09-05 2020-08-28 Heater device and optical assembly WO2021044962A1 (en)

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* Cited by examiner, † Cited by third party
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JP2003257826A (en) * 2002-02-28 2003-09-12 Nikon Corp Optical device and aligner
JP2012202971A (en) * 2011-03-28 2012-10-22 Tokyo Electron Ltd Flow sensor and resist coating device using the same
JP2012216574A (en) * 2011-03-31 2012-11-08 Brother Ind Ltd Electronic unit
WO2017046962A1 (en) * 2015-09-18 2017-03-23 オリンパス株式会社 Antifogging device, endoscope and method for producing antifogging device
JP2018151283A (en) * 2017-03-14 2018-09-27 三菱マテリアル株式会社 Humidity sensor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003257826A (en) * 2002-02-28 2003-09-12 Nikon Corp Optical device and aligner
JP2012202971A (en) * 2011-03-28 2012-10-22 Tokyo Electron Ltd Flow sensor and resist coating device using the same
JP2012216574A (en) * 2011-03-31 2012-11-08 Brother Ind Ltd Electronic unit
WO2017046962A1 (en) * 2015-09-18 2017-03-23 オリンパス株式会社 Antifogging device, endoscope and method for producing antifogging device
JP2018151283A (en) * 2017-03-14 2018-09-27 三菱マテリアル株式会社 Humidity sensor

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