WO2021044778A1 - Conductive unit - Google Patents

Conductive unit Download PDF

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Publication number
WO2021044778A1
WO2021044778A1 PCT/JP2020/029465 JP2020029465W WO2021044778A1 WO 2021044778 A1 WO2021044778 A1 WO 2021044778A1 JP 2020029465 W JP2020029465 W JP 2020029465W WO 2021044778 A1 WO2021044778 A1 WO 2021044778A1
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WO
WIPO (PCT)
Prior art keywords
conductive
region
solder
conductive unit
electrode
Prior art date
Application number
PCT/JP2020/029465
Other languages
French (fr)
Japanese (ja)
Inventor
雄一朗 佐藤
彰人 石原
功二 小林
Original Assignee
株式会社東海理化電機製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東海理化電機製作所 filed Critical 株式会社東海理化電機製作所
Publication of WO2021044778A1 publication Critical patent/WO2021044778A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/28—Clamped connections, spring connections
    • H01R4/48—Clamped connections, spring connections utilising a spring, clip, or other resilient member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted

Definitions

  • the present invention relates to a conductive unit.
  • a circuit device including a semiconductor substrate, a conductive bump provided on the semiconductor substrate, a circuit board, and a conductive spring provided on the circuit board and made of a hollow elastic body having an open tip is known. (See, for example, Patent Document 1.).
  • the conductive spring is attached to an electrode pad provided on the installation surface of the circuit board by using cream solder.
  • the cream solder may be peeled off or cracked due to the expansion and contraction of the conductive spring, resulting in poor contact. Therefore, for example, when the conductive spring is not arranged directly on the electrode pad but is arranged on the pedestal on the electrode pad, the flux of the solder becomes conductive when the pedestal is attached to the electrode pad with solder. There is a possibility that the solder will flow to the contact area between the spring and the cradle, causing poor continuity.
  • An object of the present invention is to provide a conductive unit capable of suppressing conduction failure due to adhesion of flux.
  • the conductive unit according to the embodiment of the present invention is interposed between the first conductive member that electrically connects the first connection target and the second connection target, and between the second connection target and the first conductive member.
  • the first connection target side has a first region where solder is hard to adhere
  • the second connection target side has a second conductive member which is divided into a second region where solder is easier to adhere than the first region.
  • FIG. 1 is an explosion diagram showing a switch device using the conductive unit according to the embodiment.
  • FIG. 2A is a block diagram of an operation knob unit having a conductive unit according to the embodiment.
  • FIG. 2B is a block diagram of a switch device having an operation knob unit.
  • FIG. 3A is a perspective view showing an operation direction of the operation knob in which the conductive unit according to the embodiment is arranged.
  • FIG. 3B is an explanatory view showing a door of a vehicle in which a switch device is arranged.
  • FIG. 4A is a top view showing a sub-board having an electrode pad to which the conductive unit according to the embodiment is connected.
  • FIG. 4B is an explanatory diagram for explaining the conductive unit according to the embodiment.
  • FIG. 1 is an explosion diagram showing a switch device using the conductive unit according to the embodiment.
  • FIG. 2A is a block diagram of an operation knob unit having a conductive unit according to the embodiment.
  • FIG. 2B is a block diagram of
  • FIG. 5A is an explanatory diagram showing an arrangement table according to a modified example.
  • FIG. 5B is an explanatory diagram showing an arrangement table according to a modified example.
  • FIG. 5C is an explanatory diagram showing an arrangement table according to a modified example.
  • FIG. 5D is an explanatory diagram showing an arrangement table according to a modified example.
  • FIG. 6A is a perspective view showing a state in which the operation knob on which the conductive unit according to the embodiment is arranged is viewed from the front direction.
  • FIG. 6B is an explanatory diagram for explaining the detection electrode and the conductive portion according to the embodiment.
  • FIG. 7A is an explanatory diagram for explaining the attachment of the cable in the switch device in which the conductive unit according to the embodiment is arranged.
  • FIG. 7B is a top view showing a main substrate in the switch device in which the conductive unit according to the embodiment is arranged.
  • the conductive unit according to the embodiment is interposed between the first conductive member that electrically connects the first connection target and the second connection target, and the second connection target and the first conductive member.
  • the first connection target side has a first region where solder is hard to adhere
  • the second connection target side has a second conductive member which is divided into a second region where solder is easy to adhere as compared with the first region.
  • the second connection target side of the second conductive member is more easily soldered than the first connection target side. Compared with the case where the first region and the second region are not divided, it is possible to suppress the flow of solder into the first conductive member side and suppress the conduction failure due to the adhesion of the flux.
  • FIG. 1 is an explosion diagram showing a switch device using a conductive unit.
  • FIG. 2A is a block diagram of the operation knob unit
  • FIG. 2B is a block diagram of the switch device.
  • FIG. 3A is a perspective view showing an operation direction of the operation knob
  • FIG. 3B is an explanatory view showing a door of a vehicle in which a switch device is arranged.
  • the ratio between the figures may differ from the actual ratio.
  • FIGS. 2A and 2B the main signal and information flow are indicated by arrows.
  • the conductive unit 1 of the present embodiment conducts electricity between the detection electrode portion 31 of the electrostatic sensor 39, which will be described later, and the electrode pads 341 and the electrode pads 344 provided on the sub-board 34. It is not limited, and can be widely used for the purpose of electrically connecting the first connection target and the second connection target.
  • the electrostatic sensor 39 is arranged in a switch device 7 that instructs the opening and closing of a vehicle window.
  • the switch device 7 includes an operation knob 30, a detection electrode unit 31 that detects proximity or contact with the operation knob 30, and a conductive unit 1 that is electrically connected to the detection electrode unit 31. Is electrically connected to the detection electrode unit 31 via the conductive unit 1, and the proximity or contact with the operation knob 30 is determined based on the first output signal S1 output from the detection electrode unit 31, and the determination result is obtained.
  • the has a first control unit 33 for outputting the second as the output signal S 2, attached to the operation knob 30, the sub-substrate 34 having a first control unit 33, an operation knob unit 3 and integrally.
  • the switch device 7 includes a main body 2 to which the operation knob unit 3 is attached, an operation detection unit 6 for detecting the operation of the operation knob 30, and a first control unit. 33 and electrically connected to the cable 70, to obtain a second output signal S 2 of the first controller 33 via the cable 70 is output, operation detecting unit 6 detects the operation and the second output
  • a second control unit 41 that outputs an instruction signal S 4 for instructing an operation target based on the signal S 2 and a second control unit 41 are arranged on the main body 2 and electrically via a sub-board 34 and a cable 70. It has a main board 4 which is connected to and in which a second control unit 41 is arranged.
  • the operation knob 30 is attached to the main body 2 so that it can be pulled up and pushed down with the shaft 23 as a rotating shaft.
  • the shaft 23 is inserted into the insertion opening 305 when the operation knob 30 is attached to the attachment portion 210 of the main body 2, and penetrates the attachment portion 210 and the operation knob 30.
  • the operation knob 30 rotates in the direction of arrow A and in the direction of arrow B, which is the opposite direction of the direction of arrow A.
  • the push-down operation is an operation in the direction of arrow A shown in FIG. 3A.
  • the pulling operation is an operation in the direction of arrow B.
  • the operation target of the present embodiment is the window opening / closing device 95 that opens / closes the window of the vehicle 9.
  • the switch device 7 is arranged on the armrest 93 provided on the door trim 92 of the door 90 on the right front side of the vehicle 9.
  • the vehicle 9 of the present embodiment has four doors, but is not limited to this, and may have two doors.
  • the operation knob 30 includes two detection electrodes.
  • FIG. 4A is a top view showing a sub-board
  • FIG. 4B is an explanatory view for explaining the conductive unit.
  • the conductive unit 1 is interposed between the first conductive member that electrically connects the first connection target and the second connection target, and the second connection target and the first conductive member, and is the first connection.
  • the target side has a first region where solder is hard to adhere
  • the second connection target side has a second conductive member which is divided into a second region where solder is easy to adhere as compared with the first region.
  • the first connection target is the detection electrode 31a to the detection electrode 31d of the detection electrode unit 31 shown in FIG.
  • the second connection target is, for example, the electrode pads 341 to the electrode pads 344 shown in FIG. 4A.
  • the first conductive member is an elastic body.
  • the first conductive member of the present embodiment is springs 14 to 17, which are coil springs.
  • the first conductive member is not limited to the coil spring, and may be an elastic leaf spring, a disc spring, a conductive rubber, or the like.
  • the second conductive member has a base having a surface with which the first conductive member comes into contact, and a bent portion that bends from the base to the first connection target side.
  • the bent portion is divided into a first region and a second region.
  • the bent portion is provided on a pair of opposite sides of the base portion.
  • the second conductive member of the present embodiment is the arrangement table 10 to the arrangement table 13 shown in FIG.
  • the base is the base 100 shown in FIG. 4B.
  • the bent portion is a bent portion 101 and a bent portion 102 that bend from the base portion 100 to the detection electrode 31a side.
  • the conductive unit 1 of the present embodiment includes springs 14 to 17 that electrically connect the detection electrodes 31a to the detection electrodes 31d and the electrode pads 341 to the electrode pads 344, and electrode pads 341 to the electrode pads 344 and the springs 14 to the springs.
  • a second region 105 which is interposed between the detection electrodes 31a to the detection electrode 31d side, where the solder 8 is difficult to adhere, and a second region 105, where the electrode pads 341 to the electrode pad 344 side are easier for the solder 8 to adhere to than the first region 105. It has an arrangement table 10 to an arrangement table 13 divided into regions 106.
  • the conductive unit 1 includes springs 14 to 17, and arrangement bases 10 to 13.
  • the springs 14 to 17 are formed by using a metal material such as carbon steel which has elasticity and conductivity.
  • the arrangement table 10 to the arrangement table 13 are formed by bending a metal plate such as brass having conductivity.
  • the spring 14 and the spring 15 have the same length as shown in FIG. Further, the spring 16 and the spring 17 have the same length.
  • the springs 14 and 15 arranged in front of the operation knob 30 are different in length from the springs 16 and 17 arranged in the rear, and are shorter.
  • the arrangement table 10 to the arrangement table 13 have the same basic configuration, the configuration of the arrangement table 10 will be mainly described below.
  • the arrangement table 11 to the arrangement table 13 are designated by the same reference numerals as those of the arrangement table 10.
  • the base 100 has a spring 14 arranged on the surface 100a.
  • the spring 14 and the arrangement base 10 are electrically connected.
  • the surface 100a where the springs 14 to 17 come into contact may be provided with a convex portion to be inserted into the center of the spring.
  • the base 100 of the arrangement table 10 to the arrangement table 13 is attached so that the electrode pads 341 to the electrode pads 344 provided on the arrangement surface 34a of the sub-board 34 and the back surface 100b are in contact with each other.
  • the arrangement table 10 to the arrangement table 13 and the electrode pads 341 to the electrode pads 344 are attached by the solder 8.
  • the solder 8 is an alloy containing lead and tin as main components, or lead-free solder.
  • the solder 8 contains a flux that improves the wettability of the solder 8 and removes the oxide film. This flux may absorb moisture over time and become an insulator, causing poor continuity. Therefore, it is preferable to prevent the flux from adhering to the surface 100a of the base 100.
  • the electrode pad 341 is electrically connected to the detection electrode 31a via the arrangement base 10 and the spring 14 which are the conductive units 1.
  • the electrode pad 342 is conductive with the detection electrode 31b via the arrangement base 11 and the spring 15 which are the conductive units 1.
  • the electrode pad 343 is electrically connected to the detection electrode 31c via the arrangement base 12 and the spring 16 which are the conductive units 1.
  • the electrode pad 344 is electrically connected to the detection electrode 31d via the arrangement base 13 and the spring 17, which are the conductive units 1.
  • the conductive unit 1 has the role of a cable that electrically connects the detection electrode 31a and the electrode pad 341, the detection electrode 31b and the electrode pad 342, the detection electrode 31c and the electrode pad 343, and the detection electrode 31d and the electrode pad 344. ing.
  • the bent portion 101 and the bent portion 102 face each other.
  • the bent portion 101 includes a bent portion 101a and an end portion 101b.
  • the bent portion 102 includes a bent portion 102a and an end portion 102b.
  • the bent portion may be provided on each of the four sides, the base may be provided on two or more sides as a polygon having five or more sides, or the base may be circular and surrounding the periphery. It may be provided.
  • the curved portion 101a and the curved portion 102a show a portion between the dotted lines shown in FIG. 4B.
  • the curved portion 101a and the curved portion 102a are a portion at the beginning of bending and a portion at the end of bending.
  • the end 101b and the end 102b are portions from the end of the bend to the tip.
  • the end portion 101b and the end portion 102b extend in the direction of the detection electrode 31a substantially perpendicular to the sub-board 34, and the solder 8 is difficult to adhere to. Further, the curved portion 101a and the curved portion 102a have an acute angle of gap with the sub-board 34, and the solder 8 easily enters the gap and adheres to the curved portion 101a and the curved portion 102a. Therefore, it is difficult for the solder 8 to flow beyond the upper surface 104a and the upper surface 104b of the bent portion 101 and the bent portion 102 into the surface 100a of the base portion 100.
  • the bent portion 101 and the bent portion 102 are the first region 105 in which the end portion 101b and the end portion 102b are difficult to attach the solder 8, and the bent portion 101a and the bent portion 102a are in the second region 106 in which the solder 8 is easily attached. is there.
  • the second region 106 is a region closer to the electrode pad 341 than the first region 105.
  • FIGS. 5A to 5D are examples of the modified example of the arrangement table.
  • the distance from the upper surface 104a and the upper surface 104b to the electrode pad 341 is short.
  • the upper surface 104a and the upper surface 104b as the first region 105 have a fracture surface 101c and a fracture surface 102c.
  • the bent portion 101 and the bent portion 102 are substantially the curved portion 101a and the curved portion 102a as the second region 106, but the upper surface 104a and the upper surface 104b have the fracture surface 101c and the fracture surface 102c. It has become.
  • the fracture surface 101c and the fracture surface 102c have lower wettability with respect to the solder 8 than the curved portion 101a and the curved portion 102a. Therefore, the arrangement table 10a suppresses the solder 8 from flowing into the spring 14 beyond the fracture surface 101c and the fracture surface 102c even if the bending portion 101 and the bending portion 102 are short.
  • the arrangement table 10b of the modified example shown in FIG. 5B is provided so that the end portion 101b and the end portion 102b are inclined from the vertical to the outside.
  • the first region 105 of the arrangement table 10b is, for example, the upper part of the end portions 101b and 102b including the upper surface 104a and the upper surface 104b.
  • the second region 106 is, for example, the lower part of the end portions 101b and 102b and the curved portion 101a and the curved portion 102a.
  • the arrangement base 10b has the same wettability of the solder 8 on the outer surface (the surface obtained by extending the back surface 100b), but has a shape that prevents the solder 8 from flowing into the spring 14 beyond the upper surface 104a and the upper surface 104b. Have. Further, as a modification, the upper surface 104a and the upper surface 104b of the arrangement table 10b may have fractured surfaces.
  • the arrangement table 10c of the modified example shown in FIG. 5C is provided with a protrusion 101d and a protrusion 102d protruding outward on the upper part of the curved portion 101a and the curved portion 102a.
  • the first region 105 is a protrusion 101d and a protrusion 102d.
  • the second region 106 is a curved portion 101a and a curved portion 102a.
  • the arrangement base 10c has a shape that prevents the solder 8 from flowing beyond the protrusions 101d and 102d to the spring 14. Further, as a modification, the protrusion 101d and the protrusion 102d may protrude inward, or a fracture surface may be formed on the outside or the upper portion of the protrusion 101d and the protrusion 102d.
  • the first region 105 is a region where the wettability of the solder 8 is lower than that of the second region 106.
  • the arrangement table 10d has a cylindrical shape, and its side surface is processed into a region where the wettability of the solder 8 is low and a region where the solder 8 has a high wettability.
  • the electrode pad 341 side of the arrangement table 10d is the second region 106 having high wettability, and the spring 14 side is the first region 105 having low wettability.
  • the main body 2 is composed of a lower case 20 and an upper case 21.
  • the upper case 21 has a box shape in which the lower surface 21b is open.
  • the lower case 20 is fitted on the lower surface 21b side so as to sandwich the main substrate 4, the rubber dome sheet 5, and the operation detection unit 6, and the lower case 20 and the upper case 21 are integrated with screws.
  • the lower case 20 has a box shape in which the upper surface 20a is open, and the inside of the box is the accommodating portion 200.
  • the accommodating portion 200 the main substrate 4 and the rubber dome sheet 5 are integrally accommodated.
  • a connector case 201 is provided on the lower surface 20b.
  • a connector 202 having a plurality of pins electrically connected to the electronic circuit of the main board 4 is inserted into the connector case 201.
  • the upper case 21 is provided with a mounting portion 210 behind the upper surface 21a and a guide portion 215 in the front.
  • the mounting portion 210 has a rectangular tubular shape. Further, an insertion hole 212 into which the shaft 23 is inserted is provided on a pair of opposite sides of the mounting portion 210 in the left-right direction.
  • the mounting portion 210 is provided with a guide hole 213 and a guide hole 214 having a tubular shape in the front-rear direction of the internal space 211.
  • a rod 61 and a rod 62 are inserted into the guide hole 213 and the guide hole 214.
  • An operation button 72 is attached to the guide portion 215 so as to be push-operable.
  • the operation button 72 is, for example, a button for switching between locking and unlocking the operation knob 30.
  • FIG. 6A is a perspective view showing a state in which the operation knob is viewed from the front direction
  • FIG. 6B is an explanatory view for explaining the detection electrode and the conductive portion.
  • FIG. 7A is an explanatory view for explaining the attachment of the cable
  • FIG. 7B is a top view showing the main board.
  • the lower surface 303 of the operation knob 30 is released to form an accommodating portion 306 inside.
  • the sub-board 34 and the conductive unit 1 are mainly housed in the housing section 306.
  • the operation knob 30 is provided with a recess 30b into which a user's finger can be inserted.
  • a recess 30a is provided at the tip of the operation knob 30.
  • the operation knob 30 has a protrusion 304a and a protrusion 304b in the accommodating portion 306.
  • the upper portion 610 of the rod 61 is in contact with the protrusion 304a.
  • the upper portion 620 of the rod 62 is in contact with the protrusion 304b.
  • the operation knob 30 is provided with a cover 35 for holding the sub-board 34 housed in the housing unit 306.
  • the cover 35 is integrated with the operation knob 30 by a screw 36.
  • the operation knob 30 is provided with a mounting opening 306a to a mounting opening 306d to which the detection electrodes 31a to 31d of the detection electrode portion 31 are mounted. Further, the operation knob 30 includes a cylinder portion 307a to a cylinder portion 307d into which the springs 14 to 17 are inserted corresponding to the mounting openings 306a to the mounting opening 306d, a lower claw portion 308a to a lower claw portion 308d, and an upper claw. A portion 309a to an upper claw portion 309d are provided.
  • the detection electrodes 31a to 31d are sandwiched between the lower claw portion 308a to the lower claw portion 308d and the upper claw portion 309a to the upper claw portion 309d and attached to the operation knob 30.
  • the detection electrode unit 31 is an electrode portion of a self-capacitance type electrostatic sensor 39 that detects a change in capacitance due to proximity or contact of a user's operating finger.
  • the electrostatic sensor 39 has a detection electrode unit 31, a conductive unit 1, and a first control unit 33.
  • the detection unit that detects the proximity or contact of the user's operating finger is not limited to the detection electrode unit 31, and may be a sensor portion such as a pressure sensor or a weight sensor that detects contact with the operation knob 30.
  • the detection electrode unit 31 includes detection electrodes 31a to 31d.
  • the detection electrodes 31a to 31d are formed by using a highly conductive metal material. Since the detection electrodes 31a to 31d have the same basic configuration, the configuration of the detection electrode 31a will be mainly described below.
  • the upper surface 310a, the tip 310b, and the front surface 310c of the detection electrode 31a are exposed from the operation knob 30.
  • the upper surface 310a is smoothly connected to the operation knob 30.
  • the tip 310b is between the upper surface 310a and the front surface 310c and has a rounded curved surface shape.
  • the front surface 310c has a curved surface shape that is rounded and recessed so as to fit the user's finger.
  • the mounting portion 311 is provided so as to project in the normal direction from the rear surface 310d of the base portion 310.
  • the mounting portion 311 has a flat upper surface 311a and is provided with a slope 311e inclined from the tip of the upper surface 311a.
  • the mounting portion 311 is provided with a recess 311b in the center of the upper surface 311a and the slope 311e.
  • the upper claw portion 309a to the upper claw portion 309d are inserted into the recess 311b.
  • the lower surface 310e of the base portion 310 and the lower surface 311c of the mounting portion 311 are smoothly connected to form one surface.
  • two recesses 311d are provided on the left and right sides of the lower surface 311c so as to face each other.
  • the lower claw portion 308a to the lower claw portion 308d are inserted into the recess 311d.
  • the springs 14 to 17 are in contact with the lower surface 311c between the two recesses 311b. By the contact between the springs 14 to 17, the spring and the detection electrode become conductive.
  • the lower surface 311c in which the springs 14 to 17 come into contact may be provided with a convex portion inserted into the center of the spring.
  • the RAM is used as a storage area for temporarily storing calculation results and the like.
  • the first control unit 33 has a means for generating a clock signal inside thereof, and operates based on the clock signal. This clock signal is synchronized with the second control unit 41.
  • the electrostatic sensor 39 has a detection electrode unit 31, a conductive unit 1, and a first control unit 33.
  • the electrostatic sensor 39 Since the electrostatic sensor 39 is a self-capacitance type, the capacitance increases when the user's operating finger comes close to or comes into contact with the detection electrode portion 31.
  • the first control unit 33 has an electrostatic threshold value 330 in the RAM or ROM, and when it detects an electrostatic capacity of the electrostatic threshold value 330 or more, it determines that there is proximity or contact with the user's operating finger. To do.
  • the electrostatic sensor 39 can detect the proximity even if the operation knob 30 is pushed down without touching the detection electrode. Therefore, the first control unit 33 can determine the detected electrode that has been operated.
  • the first output signal S1 acquired by the first control unit 33 via the detection electrode unit 31 and the conductive unit 1 is an analog signal.
  • the first control unit 33 determines whether a proximity or contact with each detection electrode 31a ⁇ detection electrodes 31d, and outputs the result as the second output signal S 2.
  • the second output signal S 2 is a digital signal.
  • the sub-board 34 is a printed wiring board. As shown in FIG. 4A, the sub-board 34 has a first control unit 33, electrode pads 341 to electrode pads 344, and a light emitting element 345 arranged on the arrangement surface 34a.
  • the first control unit 33 is electrically connected to the electrode pads 341 to the electrode pads 344.
  • the sub-board 34 has a connector 346 arranged on the back surface 34b.
  • a cable 70 is connected to this connector 346.
  • the cable 70 is a flat cable and is electrically connected to the connector 346 of the sub-board 34 and the connector 46 of the main board 4.
  • the springs 14 to 17 are compressed when the cover 35 is attached to the operation knob 30 by a screw 36. That is, since the springs 14 to 17 are attached to the operation knob 30 with a length shorter than the natural length, pressure due to elastic force is applied to the detection electrodes 31a to the detection electrodes 31d and the placement table 10 to the placement table 13. It is possible to maintain the contact state.
  • the main board 4 is a printed wiring board. As shown in FIGS. 7A and 7B, the main substrate 4 has a second control unit 41, an electrode pattern 42 to an electrode pattern 45, and an electrode pattern 47 arranged on the arrangement surface 4a. Further, in the main board 4, the connector 46 is arranged on the back surface 4b. The second control unit 41 is electrically connected to the electrode patterns 42 to 45.
  • the second control unit 41 is a microcomputer composed of a CPU, RAM, ROM, and the like.
  • the second control unit 41 as shown in Figure 2B, with determining the detection electrode detects the proximity or contact the second from the output signal S 2 acquired from the operation knob unit 3, obtained from the operation detecting unit 6 determining operation made from the third output signal S 3.
  • the second control unit 41 generates an instruction signal S 4 indicating the determination result is output to the window opening and closing device 95.
  • Window closing device 95 drives the window of the vehicle 9 based on the instruction signal S 4.
  • the switch device 7 has a manual mode and an auto mode.
  • the manual mode is a mode in which the designated window is driven while the operation knob 30 is being operated.
  • the auto mode is a mode in which when an operation is performed on the operation knob 30, the designated window is driven until it is fully opened or fully closed. There are two stages of pulling up operation and pushing down operation, the first stage is the manual mode, and the second stage to be operated further than the first stage is the auto mode.
  • the second control unit 41 determines whether it is the manual mode or the auto mode based on the third output signal S3 of the operation detection unit 6.
  • the electrode pattern 42 to the electrode pattern 45 and the electrode pattern 47 have, for example, a shape in which the center of the circular pattern is removed.
  • FIG. 7B as an example, an electrode pattern 47 having this shape is shown.
  • the rubber dome sheet 5 is formed in the form of a thin sheet using a soft resin material such as silicone.
  • the rubber dome sheet 5 is further provided with an accommodating portion 5c on the lower surface 5b side. By accommodating the main substrate 4 in the accommodating portion 5c, the rubber dome sheet 5 suppresses the intrusion of liquid into the main substrate 4, that is, is waterproof.
  • the rubber dome 51 to the rubber dome 54 have conductive contacts 510 to 540, and the contacts 510 to 540 come into contact with the electrode patterns 42 to 45, so that the electrode patterns 42 to 45 can be formed. Make it conductive.
  • the rubber dome sheet 5 further includes a rubber dome 56.
  • the rubber dome 56 has a conductive contact 560 and is arranged corresponding to the electrode pattern 47 of the main substrate 4.
  • the rubber dome 56 is deformed by a push operation with respect to the operation button 72, and the contact 560 and the electrode pattern 47 come into contact with each other to conduct the electrode pattern 47.
  • the protruding portions of the rubber dome 51 to the rubber dome 54 are in contact with the slider 63 and the slider 64.
  • the operation detection unit 6 includes a rod 61 and a rod 62, a slider 63 and a slider 64, a rubber dome 51 to a rubber dome 54, and an electrode pattern 42 to an electrode pattern 45.
  • the rod 61, the slider 63, the rubber dome 51, the rubber dome 52, the electrode pattern 42, and the electrode pattern 43 constitute two switches having different functions.
  • the rod 62, the slider 64, the rubber dome 53, the rubber dome 54, the electrode pattern 44, and the electrode pattern 45 constitute two switches having different functions.
  • the lower portion 611 of the rod 61 is movably inserted into the guide groove 630 of the slider 63.
  • the lower portion 621 of the rod 62 is movably inserted into the guide groove 640 of the slider 64.
  • the mode in which the rubber dome 51 is turned on becomes the manual mode in which the window is driven in the closing direction, and the mode in which the rubber dome 51 and the rubber dome 52 are turned on is until the window is fully closed. It becomes the auto mode to drive.
  • the mode in which the rubber dome 54 is turned on becomes the manual mode in which the window is driven in the opening direction, and the mode in which the rubber dome 53 and the rubber dome 54 are turned on is until the window is fully opened. It becomes the auto mode to drive.
  • the conductive unit 1 of the present embodiment can suppress conduction failure due to adhesion of flux.
  • the arrangement table 10 to the arrangement table 13 are divided into a first region 105 and a second area 106, and the solder 8 flows into the surface 100a of the base 100 of the arrangement table 10 to the arrangement table 13. Is suppressed. Therefore, the conductive unit 1 can suppress the conduction failure due to the adhesion of the flux, as compared with the case where the arrangement table is not divided into the first region and the second region. Further, since the switch device 7 includes the conductive unit 1, it is possible to suppress conduction failure due to adhesion of flux.
  • the conductive unit 1 uses the springs 14 to 17 for the electrical connection between the detection electrodes 31a to the detection electrodes 31d and the placement table 10 to the placement table 13, compared with the case where a conductive member having no elasticity is used. , Contact is easily maintained, and poor continuity can be suppressed.
  • the switch device 7 uses the conductive unit 1 for electrical connection between the detection electrode unit 31 and the electrode pads 341 to 344, the cost can be reduced as compared with the case where a cable is used. Also, flat cables are susceptible to noise when bent. However, since the switch device 7 uses the conductive unit 1, the influence of noise can be further suppressed as compared with the case where the flat cable is used.

Abstract

This conductive unit 1 comprises: springs 14-17 that electrically connect detection electrodes 31a-31d and electrode pads 341-344; and arrangement bases 10-13 that are interposed between the electrode pads 341-344 and the springs 14-17 and divided into first regions 105 in which solder 8 is unlikely to adhere to the detection electrode 31a-3d sides and second regions 106 in which the solder 8 adheres more easily to the electrode pad 341-344 sides compared to the first regions 105.

Description

導電ユニットConductive unit 関連出願の相互参照Cross-reference of related applications
本出願は、２０１９年９月５日に出願された日本国特許出願２０１９－１６２１９４号の優先権を主張するものであり、日本国特許出願２０１９－１６２１９４号の全内容を本出願に参照により援用する。 This application claims the priority of Japanese Patent Application No. 2019-162194 filed on September 5, 2019, and the entire contents of Japanese Patent Application No. 2019-162194 are incorporated by reference in this application. To do.
本発明は、導電ユニットに関する。 The present invention relates to a conductive unit.
半導体基板と、半導体基板に設けられた導電性バンプと、回路基板と、回路基板に設けられ、先端が開口した中空の弾性体からなる導電性スプリングと、を備えた回路装置が知られている（例えば、特許文献１参照。）。 A circuit device including a semiconductor substrate, a conductive bump provided on the semiconductor substrate, a circuit board, and a conductive spring provided on the circuit board and made of a hollow elastic body having an open tip is known. (See, for example, Patent Document 1.).
導電性スプリングは、回路基板の設置面に設けられた電極パッドにクリーム半田を用いて取り付けられている。 The conductive spring is attached to an electrode pad provided on the installation surface of the circuit board by using cream solder.
特開２００７－１５７７４５号公報JP-A-2007-157745
特許文献１に開示された回路装置は、導電性スプリングの伸縮によりクリーム半田が剥がれたり、割れたりして接触不良が生じる可能性がある。そこで、例えば、導電性スプリングが電極パッドに直接配置されるのではなく、電極パッド上の受け台に配置されるようにした場合、電極パッドに受け台をはんだで取り付ける際、はんだのフラックスが導電性スプリングと受け台の接触部分に流れて導通不良が生じる可能性がある。 In the circuit device disclosed in Patent Document 1, the cream solder may be peeled off or cracked due to the expansion and contraction of the conductive spring, resulting in poor contact. Therefore, for example, when the conductive spring is not arranged directly on the electrode pad but is arranged on the pedestal on the electrode pad, the flux of the solder becomes conductive when the pedestal is attached to the electrode pad with solder. There is a possibility that the solder will flow to the contact area between the spring and the cradle, causing poor continuity.
本発明の目的は、フラックスの付着による導通不良を抑制することができる導電ユニットを提供することにある。 An object of the present invention is to provide a conductive unit capable of suppressing conduction failure due to adhesion of flux.
本発明の一実施形態による導電ユニットは、第１の接続対象と第２の接続対象を電気的に接続する第１の導電部材と、第２の接続対象と第１の導電部材の間に介在し、第１の接続対象側がはんだが付き難い第１の領域、第２の接続対象側がはんだが第１の領域と比べて付き易い第２の領域に分かれる第２の導電部材と、を有する。 The conductive unit according to the embodiment of the present invention is interposed between the first conductive member that electrically connects the first connection target and the second connection target, and between the second connection target and the first conductive member. However, the first connection target side has a first region where solder is hard to adhere, and the second connection target side has a second conductive member which is divided into a second region where solder is easier to adhere than the first region.
本発明の一実施形態によれば、フラックスの付着による導通不良を抑制する導電ユニットを提供することができる。 According to one embodiment of the present invention, it is possible to provide a conductive unit that suppresses conduction failure due to adhesion of flux.
図１は、実施の形態に係る導電ユニットを用いたスイッチ装置を示す爆発図である。FIG. 1 is an explosion diagram showing a switch device using the conductive unit according to the embodiment. 図２Ａは、実施の形態に係る導電ユニットを有する操作ノブユニットのブロック図である。FIG. 2A is a block diagram of an operation knob unit having a conductive unit according to the embodiment. 図２Ｂは、操作ノブユニットを有するスイッチ装置のブロック図である。FIG. 2B is a block diagram of a switch device having an operation knob unit. 図３Ａは、実施の形態に係る導電ユニットが配置された操作ノブの操作方向を示す斜視図である。FIG. 3A is a perspective view showing an operation direction of the operation knob in which the conductive unit according to the embodiment is arranged. 図３Ｂは、スイッチ装置が配置される車両のドアを示す説明図である。FIG. 3B is an explanatory view showing a door of a vehicle in which a switch device is arranged. 図４Ａは、実施の形態に係る導電ユニットの接続対象である電極パッドを有するサブ基板を示す上面図である。FIG. 4A is a top view showing a sub-board having an electrode pad to which the conductive unit according to the embodiment is connected. 図４Ｂは、実施の形態に係る導電ユニットを説明するための説明図である。FIG. 4B is an explanatory diagram for explaining the conductive unit according to the embodiment. 図５Ａは、変形例に係る配置台を示す説明図である。FIG. 5A is an explanatory diagram showing an arrangement table according to a modified example. 図５Ｂは、変形例に係る配置台を示す説明図である。FIG. 5B is an explanatory diagram showing an arrangement table according to a modified example. 図５Ｃは、変形例に係る配置台を示す説明図である。FIG. 5C is an explanatory diagram showing an arrangement table according to a modified example. 図５Ｄは、変形例に係る配置台を示す説明図である。FIG. 5D is an explanatory diagram showing an arrangement table according to a modified example. 図６Ａは、実施の形態に係る導電ユニットが配置された操作ノブを前方向から見た状態を示す斜視図である。FIG. 6A is a perspective view showing a state in which the operation knob on which the conductive unit according to the embodiment is arranged is viewed from the front direction. 図６Ｂは、実施の形態に係る検出電極と導電部を説明するための説明図である。FIG. 6B is an explanatory diagram for explaining the detection electrode and the conductive portion according to the embodiment. 図７Ａは、実施の形態に係る導電ユニットが配置されたスイッチ装置におけるケーブルの取り付けを説明するための説明図である。FIG. 7A is an explanatory diagram for explaining the attachment of the cable in the switch device in which the conductive unit according to the embodiment is arranged. 図７Ｂは、実施の形態に係る導電ユニットが配置されたスイッチ装置におけるメイン基板を示す上面図である。FIG. 7B is a top view showing a main substrate in the switch device in which the conductive unit according to the embodiment is arranged.
（実施の形態の要約）
実施の形態に係る導電ユニットは、第１の接続対象と第２の接続対象を電気的に接続する第１の導電部材と、第２の接続対象と第１の導電部材の間に介在し、第１の接続対象側がはんだが付き難い第１の領域、第２の接続対象側がはんだが第１の領域と比べて付き易い第２の領域に分かれる第２の導電部材と、を有する。 (Summary of Embodiment)
The conductive unit according to the embodiment is interposed between the first conductive member that electrically connects the first connection target and the second connection target, and the second connection target and the first conductive member. The first connection target side has a first region where solder is hard to adhere, and the second connection target side has a second conductive member which is divided into a second region where solder is easy to adhere as compared with the first region.
この導電ユニットは、はんだを用いて第２の導電部材を第２の接続対象に取り付ける際、第２の導電部材の第２の接続対象側が第１の接続対象側よりもはんだが付き易いので、第１の領域及び第２の領域に分かれない場合と比べて、第１の導電部材側にはんだが流れ込むことを抑制し、フラックスの付着による導通不良を抑制することができる。 In this conductive unit, when the second conductive member is attached to the second connection target by using solder, the second connection target side of the second conductive member is more easily soldered than the first connection target side. Compared with the case where the first region and the second region are not divided, it is possible to suppress the flow of solder into the first conductive member side and suppress the conduction failure due to the adhesion of the flux.
[実施の形態]
（導電ユニット１の概要）
図１は、導電ユニットを用いたスイッチ装置を示す爆発図である。図２Ａは、操作ノブユニットのブロック図であり、図２Ｂは、スイッチ装置のブロック図である。図３Ａは、操作ノブの操作方向を示す斜視図であり、図３Ｂは、スイッチ装置が配置される車両のドアを示す説明図である。なお以下に記載する実施の形態に係る各図において、図形間の比率は、実際の比率とは異なる場合がある。また図２Ａ及び図２Ｂでは、主な信号や情報の流れを矢印で示している。 [Embodiment]
(Outline of Conductive Unit 1)
FIG. 1 is an explosion diagram showing a switch device using a conductive unit. FIG. 2A is a block diagram of the operation knob unit, and FIG. 2B is a block diagram of the switch device. FIG. 3A is a perspective view showing an operation direction of the operation knob, and FIG. 3B is an explanatory view showing a door of a vehicle in which a switch device is arranged. In each figure according to the embodiment described below, the ratio between the figures may differ from the actual ratio. Further, in FIGS. 2A and 2B, the main signal and information flow are indicated by arrows.
本実施の形態の導電ユニット１は、一例として、後述する静電センサ３９の検出電極部３１とサブ基板３４に設けられた電極パッド３４１～電極パッド３４４の間を導通させるものであるがこれに限定されず、広く第１の接続対象と第２の接続対象とを電気的に接続する用途に使用可能である。この静電センサ３９は、一例として、車両のウインドウの開閉を指示するスイッチ装置７に配置される。 As an example, the conductive unit 1 of the present embodiment conducts electricity between the detection electrode portion 31 of the electrostatic sensor 39, which will be described later, and the electrode pads 341 and the electrode pads 344 provided on the sub-board 34. It is not limited, and can be widely used for the purpose of electrically connecting the first connection target and the second connection target. As an example, the electrostatic sensor 39 is arranged in a switch device 7 that instructs the opening and closing of a vehicle window.
スイッチ装置７は、図１及び図２Ａに示すように、操作ノブ３０と、操作ノブ３０に対する近接又は接触を検出する検出電極部３１と、検出電極部３１と電気的に接続された導電ユニット１と、導電ユニット１を介して検出電極部３１と電気的に接続され、検出電極部３１から出力される第１の出力信号Ｓ１に基づいて操作ノブ３０に対する近接又は接触を判定し、判定結果を第２の出力信号Ｓ２として出力する第１の制御部３３と、操作ノブ３０に取り付けられ、第１の制御部３３を有するサブ基板３４と、を一体とした操作ノブユニット３を有する。 As shown in FIGS. 1 and 2A, the switch device 7 includes an operation knob 30, a detection electrode unit 31 that detects proximity or contact with the operation knob 30, and a conductive unit 1 that is electrically connected to the detection electrode unit 31. Is electrically connected to the detection electrode unit 31 via the conductive unit 1, and the proximity or contact with the operation knob 30 is determined based on the first output signal S1 output from the detection electrode unit 31, and the determination result is obtained. the has a first control unit 33 for outputting the second as the output signal S 2, attached to the operation knob 30, the sub-substrate 34 having a first control unit 33, an operation knob unit 3 and integrally.
さらにスイッチ装置７は、図１、図２Ａ及び図２Ｂに示すように、操作ノブユニット３が取り付けられた本体２と、操作ノブ３０の操作を検出する操作検出部６と、第１の制御部３３と電気的に接続されたケーブル７０と、ケーブル７０を介して第１の制御部３３が出力した第２の出力信号Ｓ２を取得し、操作検出部６が検出した操作と第２の出力信号Ｓ２とに基づいて操作対象に対して指示するための指示信号Ｓ４を出力する第２の制御部４１と、本体２に配置されると共に、サブ基板３４とケーブル７０を介して電気的に接続され、第２の制御部４１が配置されたメイン基板４と、を有する。 Further, as shown in FIGS. 1, 2A and 2B, the switch device 7 includes a main body 2 to which the operation knob unit 3 is attached, an operation detection unit 6 for detecting the operation of the operation knob 30, and a first control unit. 33 and electrically connected to the cable 70, to obtain a second output signal S 2 of the first controller 33 via the cable 70 is output, operation detecting unit 6 detects the operation and the second output A second control unit 41 that outputs an instruction signal S 4 for instructing an operation target based on the signal S 2 and a second control unit 41 are arranged on the main body 2 and electrically via a sub-board 34 and a cable 70. It has a main board 4 which is connected to and in which a second control unit 41 is arranged.
操作ノブ３０は、シャフト２３を回転軸とした引き上げ操作、及び押し下げ操作可能に本体２に取り付けられている。このシャフト２３は、本体２の取付部２１０に操作ノブ３０を取り付ける際に挿入開口３０５に挿入され、取付部２１０及び操作ノブ３０を貫通するものである。操作ノブ３０は、矢印Ａ方向、及び矢印Ａ方向の逆方向である矢印Ｂ方向に回転する。押し下げ操作は、図３Ａに示す矢印Ａ方向の操作である。引き上げ操作は、矢印Ｂ方向の操作である。 The operation knob 30 is attached to the main body 2 so that it can be pulled up and pushed down with the shaft 23 as a rotating shaft. The shaft 23 is inserted into the insertion opening 305 when the operation knob 30 is attached to the attachment portion 210 of the main body 2, and penetrates the attachment portion 210 and the operation knob 30. The operation knob 30 rotates in the direction of arrow A and in the direction of arrow B, which is the opposite direction of the direction of arrow A. The push-down operation is an operation in the direction of arrow A shown in FIG. 3A. The pulling operation is an operation in the direction of arrow B.
本実施の形態の操作対象は、図２Ｂに示すように、車両９のウインドウの開閉を行うウインドウ開閉装置９５である。スイッチ装置７は、図３Ｂに示すように、車両９の右前方のドア９０のドアトリム９２に設けられたアームレスト９３に配置されている。本実施の形態の車両９は、一例として、４つのドアを有しているがこれに限定されず、２つのドアを有するものであっても良い。その場合、操作ノブ３０は、２つの検出電極を備える。 As shown in FIG. 2B, the operation target of the present embodiment is the window opening / closing device 95 that opens / closes the window of the vehicle 9. As shown in FIG. 3B, the switch device 7 is arranged on the armrest 93 provided on the door trim 92 of the door 90 on the right front side of the vehicle 9. As an example, the vehicle 9 of the present embodiment has four doors, but is not limited to this, and may have two doors. In that case, the operation knob 30 includes two detection electrodes.
（導電ユニット１の構成）
図４Ａは、サブ基板を示す上面図であり、図４Ｂは、導電ユニットを説明するための説明図である。 (Structure of Conductive Unit 1)
FIG. 4A is a top view showing a sub-board, and FIG. 4B is an explanatory view for explaining the conductive unit.
導電ユニット１は、第１の接続対象と第２の接続対象を電気的に接続する第１の導電部材と、第２の接続対象と第１の導電部材の間に介在し、第１の接続対象側がはんだが付き難い第１の領域、第２の接続対象側がはんだが第１の領域と比べて付き易い第２の領域に分かれる第２の導電部材と、を有する。 The conductive unit 1 is interposed between the first conductive member that electrically connects the first connection target and the second connection target, and the second connection target and the first conductive member, and is the first connection. The target side has a first region where solder is hard to adhere, and the second connection target side has a second conductive member which is divided into a second region where solder is easy to adhere as compared with the first region.
第１の接続対象は、一例として、図１に示す検出電極部３１の検出電極３１ａ～検出電極３１ｄである。第２の接続対象は、一例として、図４Ａに示す電極パッド３４１～電極パッド３４４である。 As an example, the first connection target is the detection electrode 31a to the detection electrode 31d of the detection electrode unit 31 shown in FIG. The second connection target is, for example, the electrode pads 341 to the electrode pads 344 shown in FIG. 4A.
第１の導電部材は、弾性体である。本実施の形態の第１の導電部材は、コイルスプリングであるスプリング１４～スプリング１７である。なお変形例として、第１の導電部材は、コイルスプリングに限定されず、弾性を有する板バネ、皿バネや導電性ゴムなどであっても良い。 The first conductive member is an elastic body. The first conductive member of the present embodiment is springs 14 to 17, which are coil springs. As a modification, the first conductive member is not limited to the coil spring, and may be an elastic leaf spring, a disc spring, a conductive rubber, or the like.
第２の導電部材は、第１の導電部材が接触する表面を有する基部と、基部から第１の接続対象側に折れ曲がる曲げ部と、を有している。そして曲げ部は、第１の領域及び第２の領域に分かれている。そして曲げ部は、基部の対向する一対の辺に設けられている。 The second conductive member has a base having a surface with which the first conductive member comes into contact, and a bent portion that bends from the base to the first connection target side. The bent portion is divided into a first region and a second region. The bent portion is provided on a pair of opposite sides of the base portion.
本実施の形態の第２の導電部材は、図１に示す配置台１０～配置台１３である。基部とは、図４Ｂに示す基部１００である。また曲げ部とは、図４Ｂに示すように、基部１００から検出電極３１ａ側に曲がる曲げ部１０１及び曲げ部１０２である。 The second conductive member of the present embodiment is the arrangement table 10 to the arrangement table 13 shown in FIG. The base is the base 100 shown in FIG. 4B. Further, as shown in FIG. 4B, the bent portion is a bent portion 101 and a bent portion 102 that bend from the base portion 100 to the detection electrode 31a side.
本実施の形態の導電ユニット１は、検出電極３１ａ～検出電極３１ｄと電極パッド３４１～電極パッド３４４を電気的に接続するスプリング１４～スプリング１７と、電極パッド３４１～電極パッド３４４とスプリング１４～スプリング１７の間に介在し、検出電極３１ａ～検出電極３１ｄ側がはんだ８が付き難い第１の領域１０５、電極パッド３４１～電極パッド３４４側がはんだ８が第１の領域１０５と比べて付き易い第２の領域１０６に分かれる配置台１０～配置台１３と、を有する。 The conductive unit 1 of the present embodiment includes springs 14 to 17 that electrically connect the detection electrodes 31a to the detection electrodes 31d and the electrode pads 341 to the electrode pads 344, and electrode pads 341 to the electrode pads 344 and the springs 14 to the springs. A second region 105, which is interposed between the detection electrodes 31a to the detection electrode 31d side, where the solder 8 is difficult to adhere, and a second region 105, where the electrode pads 341 to the electrode pad 344 side are easier for the solder 8 to adhere to than the first region 105. It has an arrangement table 10 to an arrangement table 13 divided into regions 106.
つまり導電ユニット１は、スプリング１４～スプリング１７と、配置台１０～配置台１３と、を備えている。このスプリング１４～スプリング１７は、弾性を有すると共に、導電性を有する炭素鋼などの金属材料を用いて形成されている。また配置台１０～配置台１３は、導電性を有する黄銅などの金属板を折り曲げて形成されている。 That is, the conductive unit 1 includes springs 14 to 17, and arrangement bases 10 to 13. The springs 14 to 17 are formed by using a metal material such as carbon steel which has elasticity and conductivity. Further, the arrangement table 10 to the arrangement table 13 are formed by bending a metal plate such as brass having conductivity.
スプリング１４とスプリング１５は、図１に示すように、同じ長さである。またスプリング１６とスプリング１７は、同じ長さである。そして操作ノブ３０の前方に配置されるスプリング１４及びスプリング１５は、後方に配置されるスプリング１６及びスプリング１７と長さが異なり、短くなっている。 The spring 14 and the spring 15 have the same length as shown in FIG. Further, the spring 16 and the spring 17 have the same length. The springs 14 and 15 arranged in front of the operation knob 30 are different in length from the springs 16 and 17 arranged in the rear, and are shorter.
配置台１０～配置台１３は、基本的な構成は同じであるので、以下では、主に配置台１０の構成について説明する。なお配置台１１～配置台１３には、配置台１０と同じ符号を付している。 Since the arrangement table 10 to the arrangement table 13 have the same basic configuration, the configuration of the arrangement table 10 will be mainly described below. The arrangement table 11 to the arrangement table 13 are designated by the same reference numerals as those of the arrangement table 10.
基部１００は、図４Ｂに示すように、スプリング１４が表面１００ａに配置される。この配置により、スプリング１４と配置台１０とが導通する。なお変形例としてスプリング１４～スプリング１７が接触する表面１００ａには、スプリングの中心に挿入される凸部が設けられても良い。 As shown in FIG. 4B, the base 100 has a spring 14 arranged on the surface 100a. With this arrangement, the spring 14 and the arrangement base 10 are electrically connected. As a modification, the surface 100a where the springs 14 to 17 come into contact may be provided with a convex portion to be inserted into the center of the spring.
配置台１０～配置台１３の基部１００は、図４Ａに示すように、サブ基板３４の配置面３４ａに設けられた電極パッド３４１～電極パッド３４４と裏面１００ｂが接触するように取り付けられている。この配置台１０～配置台１３と電極パッド３４１～電極パッド３４４の取り付けは、はんだ８によって行われる。 As shown in FIG. 4A, the base 100 of the arrangement table 10 to the arrangement table 13 is attached so that the electrode pads 341 to the electrode pads 344 provided on the arrangement surface 34a of the sub-board 34 and the back surface 100b are in contact with each other. The arrangement table 10 to the arrangement table 13 and the electrode pads 341 to the electrode pads 344 are attached by the solder 8.
はんだ８は、鉛とスズを主成分とした合金、又は無鉛はんだである。このはんだ８には、はんだ８の濡れ性を向上させたり、酸化膜を除去したりするフラックスが含まれている。このフラックスは、時間の経過と共に水分を吸収して絶縁体化して導通不良の原因となる可能性がある。従ってフラックスが基部１００の表面１００ａに付着しないようにすることが好ましい。 The solder 8 is an alloy containing lead and tin as main components, or lead-free solder. The solder 8 contains a flux that improves the wettability of the solder 8 and removes the oxide film. This flux may absorb moisture over time and become an insulator, causing poor continuity. Therefore, it is preferable to prevent the flux from adhering to the surface 100a of the base 100.
電極パッド３４１は、導電ユニット１である配置台１０及びスプリング１４を介して検出電極３１ａと導通している。電極パッド３４２は、導電ユニット１である配置台１１及びスプリング１５を介して検出電極３１ｂと導通している。電極パッド３４３は、導電ユニット１である配置台１２及びスプリング１６を介して検出電極３１ｃと導通している。電極パッド３４４は、導電ユニット１である配置台１３及びスプリング１７を介して検出電極３１ｄと導通している。 The electrode pad 341 is electrically connected to the detection electrode 31a via the arrangement base 10 and the spring 14 which are the conductive units 1. The electrode pad 342 is conductive with the detection electrode 31b via the arrangement base 11 and the spring 15 which are the conductive units 1. The electrode pad 343 is electrically connected to the detection electrode 31c via the arrangement base 12 and the spring 16 which are the conductive units 1. The electrode pad 344 is electrically connected to the detection electrode 31d via the arrangement base 13 and the spring 17, which are the conductive units 1.
つまり導電ユニット１は、検出電極３１ａと電極パッド３４１、検出電極３１ｂと電極パッド３４２、検出電極３１ｃと電極パッド３４３、及び検出電極３１ｄと電極パッド３４４を電気的に接続するケーブルの役割を有している。 That is, the conductive unit 1 has the role of a cable that electrically connects the detection electrode 31a and the electrode pad 341, the detection electrode 31b and the electrode pad 342, the detection electrode 31c and the electrode pad 343, and the detection electrode 31d and the electrode pad 344. ing.
曲げ部１０１及び曲げ部１０２は、対向している。曲げ部１０１は、図４Ｂに示すように、曲部１０１ａと、端部１０１ｂと、を備えている。また曲げ部１０２は、曲部１０２ａと、端部１０２ｂと、を備えている。なお変形例として曲げ部は、４つの辺のそれぞれに設けられても良いし、基部を５以上の辺を有する多角形として２以上の辺に設けられても良いし、基部を円形として周囲に設けられても良い。 The bent portion 101 and the bent portion 102 face each other. As shown in FIG. 4B, the bent portion 101 includes a bent portion 101a and an end portion 101b. The bent portion 102 includes a bent portion 102a and an end portion 102b. As a modification, the bent portion may be provided on each of the four sides, the base may be provided on two or more sides as a polygon having five or more sides, or the base may be circular and surrounding the periphery. It may be provided.
曲部１０１ａ及び曲部１０２ａは、図４Ｂに示す点線の間の部分を示している。この曲部１０１ａ及び曲部１０２ａは、曲がり始めと曲がり終わりの部分である。端部１０１ｂ及び端部１０２ｂは、曲がり終わりから先端までの部分である。 The curved portion 101a and the curved portion 102a show a portion between the dotted lines shown in FIG. 4B. The curved portion 101a and the curved portion 102a are a portion at the beginning of bending and a portion at the end of bending. The end 101b and the end 102b are portions from the end of the bend to the tip.
端部１０１ｂ及び端部１０２ｂは、サブ基板３４に対して略垂直に検出電極３１ａの方向に伸びていてはんだ８が付き難い。また曲部１０１ａ及び曲部１０２ａは、サブ基板３４との隙間の角度が鋭角であり、はんだ８がこの隙間に入り込んで付き易い。従ってはんだ８は、曲げ部１０１及び曲げ部１０２の上面１０４ａ及び上面１０４ｂを超えて基部１００の表面１００ａに流れ込み難い。 The end portion 101b and the end portion 102b extend in the direction of the detection electrode 31a substantially perpendicular to the sub-board 34, and the solder 8 is difficult to adhere to. Further, the curved portion 101a and the curved portion 102a have an acute angle of gap with the sub-board 34, and the solder 8 easily enters the gap and adheres to the curved portion 101a and the curved portion 102a. Therefore, it is difficult for the solder 8 to flow beyond the upper surface 104a and the upper surface 104b of the bent portion 101 and the bent portion 102 into the surface 100a of the base portion 100.
つまり曲げ部１０１及び曲げ部１０２は、端部１０１ｂ及び端部１０２ｂがはんだ８が付き難い第１の領域１０５であり、曲部１０１ａ及び曲部１０２ａがはんだ８が付き易い第２の領域１０６である。また言い換えるなら第２の領域１０６は、第１の領域１０５よりも電極パッド３４１に近い領域となっている。以下では、配置台の変形例について説明する。 That is, the bent portion 101 and the bent portion 102 are the first region 105 in which the end portion 101b and the end portion 102b are difficult to attach the solder 8, and the bent portion 101a and the bent portion 102a are in the second region 106 in which the solder 8 is easily attached. is there. In other words, the second region 106 is a region closer to the electrode pad 341 than the first region 105. Hereinafter, a modified example of the arrangement table will be described.
・変形例について
図５Ａ～図５Ｄは、配置台の変形例の一例である。図５Ａに示す変形例の曲げ部１０１及び曲げ部１０２は、上面１０４ａ及び上面１０４ｂから電極パッド３４１までの距離が短くなっている。そして曲げ部１０１及び曲げ部１０２は、第１の領域１０５としての上面１０４ａ及び上面１０４ｂが破断面１０１ｃ及び破断面１０２ｃとなっている。 -About the modified example FIGS. 5A to 5D are examples of the modified example of the arrangement table. In the bent portion 101 and the bent portion 102 of the modified example shown in FIG. 5A, the distance from the upper surface 104a and the upper surface 104b to the electrode pad 341 is short. In the bent portion 101 and the bent portion 102, the upper surface 104a and the upper surface 104b as the first region 105 have a fracture surface 101c and a fracture surface 102c.
この変形例の配置台１０ａは、曲げ部１０１及び曲げ部１０２が第２の領域１０６としての曲部１０１ａ及び曲部１０２ａにほぼなっているが上面１０４ａ及び上面１０４ｂが破断面１０１ｃ及び破断面１０２ｃとなっている。 In the arrangement table 10a of this modified example, the bent portion 101 and the bent portion 102 are substantially the curved portion 101a and the curved portion 102a as the second region 106, but the upper surface 104a and the upper surface 104b have the fracture surface 101c and the fracture surface 102c. It has become.
破断面１０１ｃ及び破断面１０２ｃは、曲部１０１ａ及び曲部１０２ａに比べてはんだ８に対する濡れ性が低い。従って配置台１０ａは、曲げ部１０１及び曲げ部１０２が短くても、はんだ８が破断面１０１ｃ及び破断面１０２ｃを超えてスプリング１４まで流れ込むことを抑制する。 The fracture surface 101c and the fracture surface 102c have lower wettability with respect to the solder 8 than the curved portion 101a and the curved portion 102a. Therefore, the arrangement table 10a suppresses the solder 8 from flowing into the spring 14 beyond the fracture surface 101c and the fracture surface 102c even if the bending portion 101 and the bending portion 102 are short.
図５Ｂに示す変形例の配置台１０ｂは、端部１０１ｂ及び端部１０２ｂが垂直から外側に傾いて設けられている。この配置台１０ｂの第１の領域１０５は、例えば、上面１０４ａ及び上面１０４ｂを含む端部１０１ｂ及び１０２ｂの上部である。第２の領域１０６は、例えば、端部１０１ｂ及び１０２ｂの下部と曲部１０１ａ及び曲部１０２ａである。 The arrangement table 10b of the modified example shown in FIG. 5B is provided so that the end portion 101b and the end portion 102b are inclined from the vertical to the outside. The first region 105 of the arrangement table 10b is, for example, the upper part of the end portions 101b and 102b including the upper surface 104a and the upper surface 104b. The second region 106 is, for example, the lower part of the end portions 101b and 102b and the curved portion 101a and the curved portion 102a.
この配置台１０ｂは、外側の面（裏面１００ｂを拡張した面）のはんだ８の濡れ性は同じであるが、はんだ８が上面１０４ａ及び上面１０４ｂを超えてスプリング１４まで流れ込むことを抑制する形状を有している。さらに変形例として配置台１０ｂは、上面１０４ａ及び上面１０４ｂが破断面であっても良い。 The arrangement base 10b has the same wettability of the solder 8 on the outer surface (the surface obtained by extending the back surface 100b), but has a shape that prevents the solder 8 from flowing into the spring 14 beyond the upper surface 104a and the upper surface 104b. Have. Further, as a modification, the upper surface 104a and the upper surface 104b of the arrangement table 10b may have fractured surfaces.
図５Ｃに示す変形例の配置台１０ｃは、曲部１０１ａ及び曲部１０２ａの上部に、外側に突出する突起部１０１ｄ及び突起部１０２ｄを備えている。第１の領域１０５は、突起部１０１ｄ及び突起部１０２ｄである。第２の領域１０６は、曲部１０１ａ及び曲部１０２ａである。 The arrangement table 10c of the modified example shown in FIG. 5C is provided with a protrusion 101d and a protrusion 102d protruding outward on the upper part of the curved portion 101a and the curved portion 102a. The first region 105 is a protrusion 101d and a protrusion 102d. The second region 106 is a curved portion 101a and a curved portion 102a.
配置台１０ｃは、はんだ８が突起部１０１ｄ及び突起部１０２ｄを超えてスプリング１４まで流れ込むことを抑制する形状を有している。さらに変形例として突起部１０１ｄ及び突起部１０２ｄは、内側に向けて突出しても良いし、突起部１０１ｄ及び突起部１０２ｄの外側や上部に破断面が形成されても良い。 The arrangement base 10c has a shape that prevents the solder 8 from flowing beyond the protrusions 101d and 102d to the spring 14. Further, as a modification, the protrusion 101d and the protrusion 102d may protrude inward, or a fracture surface may be formed on the outside or the upper portion of the protrusion 101d and the protrusion 102d.
図５Ｄに示す変形例の配置台１０ｄは、第１の領域１０５が第２の領域１０６と比べてはんだ８の濡れ性が低い領域とされている。この配置台１０ｄは、円柱形状を有し、その側面がはんだ８の濡れ性が低い領域と高い領域とに加工されている。 In the arrangement table 10d of the modified example shown in FIG. 5D, the first region 105 is a region where the wettability of the solder 8 is lower than that of the second region 106. The arrangement table 10d has a cylindrical shape, and its side surface is processed into a region where the wettability of the solder 8 is low and a region where the solder 8 has a high wettability.
この配置台１０ｄは、図５Ｄに示すように、電極パッド３４１側が、濡れ性が高い第２の領域１０６であり、スプリング１４側が、濡れ性が低い第１の領域１０５となっている。 As shown in FIG. 5D, the electrode pad 341 side of the arrangement table 10d is the second region 106 having high wettability, and the spring 14 side is the first region 105 having low wettability.
（本体２の構成）
本体２は、図１に示すように、下ケース２０と、上ケース２１と、によって構成されている。上ケース２１は、下面２１ｂが解放された箱形状を有している。この下面２１ｂ側には、メイン基板４、ラバードームシート５、及び操作検出部６を挟むように下ケース２０がはめ込まれ、ネジで下ケース２０と上ケース２１とが一体とされている。 (Structure of main body 2)
As shown in FIG. 1, the main body 2 is composed of a lower case 20 and an upper case 21. The upper case 21 has a box shape in which the lower surface 21b is open. The lower case 20 is fitted on the lower surface 21b side so as to sandwich the main substrate 4, the rubber dome sheet 5, and the operation detection unit 6, and the lower case 20 and the upper case 21 are integrated with screws.
下ケース２０は、上面２０ａが解放された箱形状を有し、箱の内部が収容部２００となっている。この収容部２００は、メイン基板４とラバードームシート５とが一体となって収容される。下面２０ｂには、コネクタケース２０１が設けられている。このコネクタケース２０１には、メイン基板４の電子回路と電気的に接続された複数のピンを有するコネクタ２０２が挿入されている。 The lower case 20 has a box shape in which the upper surface 20a is open, and the inside of the box is the accommodating portion 200. In the accommodating portion 200, the main substrate 4 and the rubber dome sheet 5 are integrally accommodated. A connector case 201 is provided on the lower surface 20b. A connector 202 having a plurality of pins electrically connected to the electronic circuit of the main board 4 is inserted into the connector case 201.
上ケース２１は、図１に示すように、上面２１ａの後方に取付部２１０、前方にガイド部２１５が設けられている。取付部２１０は、矩形の筒形状を有している。また取付部２１０の対向する左右方向の一対の辺には、シャフト２３が挿入される挿入孔２１２が設けられている。 As shown in FIG. 1, the upper case 21 is provided with a mounting portion 210 behind the upper surface 21a and a guide portion 215 in the front. The mounting portion 210 has a rectangular tubular shape. Further, an insertion hole 212 into which the shaft 23 is inserted is provided on a pair of opposite sides of the mounting portion 210 in the left-right direction.
さらに取付部２１０は、図１に示すように、内部空間２１１の前後方向に、筒形状を有するガイド孔２１３及びガイド孔２１４が設けられている。このガイド孔２１３及びガイド孔２１４には、ロッド６１及びロッド６２が挿入される。 Further, as shown in FIG. 1, the mounting portion 210 is provided with a guide hole 213 and a guide hole 214 having a tubular shape in the front-rear direction of the internal space 211. A rod 61 and a rod 62 are inserted into the guide hole 213 and the guide hole 214.
ガイド部２１５には、操作ボタン７２がプッシュ操作可能に取り付けられる。この操作ボタン７２は、例えば、操作ノブ３０のロック、アンロックを切り替えるボタンである。 An operation button 72 is attached to the guide portion 215 so as to be push-operable. The operation button 72 is, for example, a button for switching between locking and unlocking the operation knob 30.
（操作ノブユニット３の構成）
図６Ａは、操作ノブを前方向から見た状態を示す斜視図であり、図６Ｂは、検出電極と導電部を説明するための説明図である。図７Ａは、ケーブルの取り付けを説明するための説明図であり、図７Ｂは、メイン基板を示す上面図である。 (Structure of operation knob unit 3)
FIG. 6A is a perspective view showing a state in which the operation knob is viewed from the front direction, and FIG. 6B is an explanatory view for explaining the detection electrode and the conductive portion. FIG. 7A is an explanatory view for explaining the attachment of the cable, and FIG. 7B is a top view showing the main board.
操作ノブ３０は、下面３０３が解放されて内部が収容部３０６となっている。この収容部３０６には、主にサブ基板３４と導電ユニット１が収容されている。 The lower surface 303 of the operation knob 30 is released to form an accommodating portion 306 inside. The sub-board 34 and the conductive unit 1 are mainly housed in the housing section 306.
操作ノブ３０は、ユーザの指が挿入可能な凹部３０ｂが設けられている。操作ノブ３０の先端には、凹部３０ａが設けられている。 The operation knob 30 is provided with a recess 30b into which a user's finger can be inserted. A recess 30a is provided at the tip of the operation knob 30.
操作ノブ３０は、図７Ａに示すように、突起３０４ａと、突起３０４ｂと、を収容部３０６に有している。突起３０４ａには、ロッド６１の上部６１０が接触している。また突起３０４ｂには、ロッド６２の上部６２０が接触している。 As shown in FIG. 7A, the operation knob 30 has a protrusion 304a and a protrusion 304b in the accommodating portion 306. The upper portion 610 of the rod 61 is in contact with the protrusion 304a. Further, the upper portion 620 of the rod 62 is in contact with the protrusion 304b.
操作ノブ３０は、収容部３０６に収容したサブ基板３４を保持するためのカバー３５が取り付けられている。このカバー３５は、ネジ３６により、操作ノブ３０と一体とされる。 The operation knob 30 is provided with a cover 35 for holding the sub-board 34 housed in the housing unit 306. The cover 35 is integrated with the operation knob 30 by a screw 36.
操作ノブ３０は、図６Ａに示すように、検出電極部３１の検出電極３１ａ～検出電極３１ｄが取り付けられる取付開口３０６ａ～取付開口３０６ｄが設けられている。また操作ノブ３０は、取付開口３０６ａ～取付開口３０６ｄに対応してスプリング１４～スプリング１７が挿入される筒部３０７ａ～筒部３０７ｄと、下側爪部３０８ａ～下側爪部３０８ｄと、上側爪部３０９ａ～上側爪部３０９ｄと、が設けられている。 As shown in FIG. 6A, the operation knob 30 is provided with a mounting opening 306a to a mounting opening 306d to which the detection electrodes 31a to 31d of the detection electrode portion 31 are mounted. Further, the operation knob 30 includes a cylinder portion 307a to a cylinder portion 307d into which the springs 14 to 17 are inserted corresponding to the mounting openings 306a to the mounting opening 306d, a lower claw portion 308a to a lower claw portion 308d, and an upper claw. A portion 309a to an upper claw portion 309d are provided.
検出電極３１ａ～検出電極３１ｄは、下側爪部３０８ａ～下側爪部３０８ｄと上側爪部３０９ａ～上側爪部３０９ｄの間に挟まれて操作ノブ３０に取り付けられる。 The detection electrodes 31a to 31d are sandwiched between the lower claw portion 308a to the lower claw portion 308d and the upper claw portion 309a to the upper claw portion 309d and attached to the operation knob 30.
・検出電極部３１の構成
検出電極部３１は、ユーザの操作指の近接又は接触による静電容量の変化を検出する自己容量方式の静電センサ３９の電極部分である。この静電センサ３９は、検出電極部３１、導電ユニット１、及び第１の制御部３３を有する。 Configuration of Detection Electrode Unit 31 The detection electrode unit 31 is an electrode portion of a self-capacitance type electrostatic sensor 39 that detects a change in capacitance due to proximity or contact of a user's operating finger. The electrostatic sensor 39 has a detection electrode unit 31, a conductive unit 1, and a first control unit 33.
なおユーザの操作指の近接又は接触を検出する検出部は、検出電極部３１に限定されず、操作ノブ３０に対する接触を検出する圧力センサや加重センサなどのセンサ部分であっても良い。 The detection unit that detects the proximity or contact of the user's operating finger is not limited to the detection electrode unit 31, and may be a sensor portion such as a pressure sensor or a weight sensor that detects contact with the operation knob 30.
検出電極部３１は、検出電極３１ａ～検出電極３１ｄを備えている。検出電極３１ａ～検出電極３１ｄは、導電性が高い金属材料を用いて形成されている。検出電極３１ａ～検出電極３１ｄは、基本的な構成は同じであるので、以下では、主に検出電極３１ａの構成について説明する。 The detection electrode unit 31 includes detection electrodes 31a to 31d. The detection electrodes 31a to 31d are formed by using a highly conductive metal material. Since the detection electrodes 31a to 31d have the same basic configuration, the configuration of the detection electrode 31a will be mainly described below.
検出電極３１ａは、図６Ｂに示すように、上面３１０ａ、先端３１０ｂ及び前面３１０ｃが操作ノブ３０から露出している。上面３１０ａは、操作ノブ３０となめらかに接続されている。先端３１０ｂは、上面３１０ａと前面３１０ｃとの間であり、丸みを帯びた曲面形状を有している。前面３１０ｃは、ユーザの指になじむように丸く凹んだ曲面形状を有している。 As shown in FIG. 6B, the upper surface 310a, the tip 310b, and the front surface 310c of the detection electrode 31a are exposed from the operation knob 30. The upper surface 310a is smoothly connected to the operation knob 30. The tip 310b is between the upper surface 310a and the front surface 310c and has a rounded curved surface shape. The front surface 310c has a curved surface shape that is rounded and recessed so as to fit the user's finger.
取付部３１１は、図６Ｂに示すように、基部３１０の後面３１０ｄから法線方向に突出するように設けられている。取付部３１１は、上面３１１ａが平坦であり、上面３１１ａの先端から傾斜する斜面３１１ｅが設けられている。取付部３１１は、上面３１１ａ及び斜面３１１ｅの中央に凹部３１１ｂが設けられている。この凹部３１１ｂには、上側爪部３０９ａ～上側爪部３０９ｄが挿入される。 As shown in FIG. 6B, the mounting portion 311 is provided so as to project in the normal direction from the rear surface 310d of the base portion 310. The mounting portion 311 has a flat upper surface 311a and is provided with a slope 311e inclined from the tip of the upper surface 311a. The mounting portion 311 is provided with a recess 311b in the center of the upper surface 311a and the slope 311e. The upper claw portion 309a to the upper claw portion 309d are inserted into the recess 311b.
取付部３１１は、基部３１０の下面３１０ｅと取付部３１１の下面３１１ｃとが滑らかに接続されて１つの面を形成している。下面３１１ｃの左右には、図６Ｂに示すように、２つの凹部３１１ｄが対向して設けられている。この凹部３１１ｄには、下側爪部３０８ａ～下側爪部３０８ｄが挿入される。操作ノブユニット３は、２つの凹部３１１ｂの間の下面３１１ｃにスプリング１４～スプリング１７が接触している。このスプリング１４～スプリング１７の接触により、スプリングと検出電極とは導通する。なお変形例としてスプリング１４～スプリング１７が接触する下面３１１ｃには、スプリングの中心に挿入される凸部が設けられても良い。 In the mounting portion 311, the lower surface 310e of the base portion 310 and the lower surface 311c of the mounting portion 311 are smoothly connected to form one surface. As shown in FIG. 6B, two recesses 311d are provided on the left and right sides of the lower surface 311c so as to face each other. The lower claw portion 308a to the lower claw portion 308d are inserted into the recess 311d. In the operation knob unit 3, the springs 14 to 17 are in contact with the lower surface 311c between the two recesses 311b. By the contact between the springs 14 to 17, the spring and the detection electrode become conductive. As a modification, the lower surface 311c in which the springs 14 to 17 come into contact may be provided with a convex portion inserted into the center of the spring.
・第１の制御部３３の構成
第１の制御部３３は、記憶されたプログラムに従って、取得したデータに演算、加工などを行うＣＰＵ（＝Central Processing Unit）、半導体メモリであるＲＡＭ（＝Random Access Memory）及びＲＯＭ（＝Read Only Memory）などから構成されるマイクロコンピュータである。このＲＯＭには、第１の制御部３３が動作するためのプログラムが格納されている。ＲＡＭは、一時的に演算結果などを格納する記憶領域として用いられる。また第１の制御部３３は、その内部にクロック信号を生成する手段を有し、このクロック信号に基づいて動作を行う。このクロック信号は、第２の制御部４１と同期されている。 Configuration of First Control Unit 33 The first control unit 33 is a CPU (= Central Processing Unit) that performs calculations and processing on acquired data according to a stored program, and a RAM (= Random Access) that is a semiconductor memory. It is a microcomputer composed of Memory) and ROM (= Read Only Memory). A program for operating the first control unit 33 is stored in this ROM. The RAM is used as a storage area for temporarily storing calculation results and the like. Further, the first control unit 33 has a means for generating a clock signal inside thereof, and operates based on the clock signal. This clock signal is synchronized with the second control unit 41.
第１の制御部３３は、例えば、静電センサＩＣ（＝Integrated Circuit）である。静電センサ３９は、検出電極部３１、導電ユニット１及び第１の制御部３３を有する。 The first control unit 33 is, for example, an electrostatic sensor IC (= Integrated Circuit). The electrostatic sensor 39 has a detection electrode unit 31, a conductive unit 1, and a first control unit 33.
静電センサ３９は、自己容量方式であるので、ユーザの操作指が検出電極部３１に近接又は接触すると、静電容量が増加する。第１の制御部３３は、静電しきい値３３０をＲＡＭ又はＲＯＭに有し、静電しきい値３３０以上の静電容量を検出した場合、ユーザの操作指の近接又は接触があったと判定する。 Since the electrostatic sensor 39 is a self-capacitance type, the capacitance increases when the user's operating finger comes close to or comes into contact with the detection electrode portion 31. The first control unit 33 has an electrostatic threshold value 330 in the RAM or ROM, and when it detects an electrostatic capacity of the electrostatic threshold value 330 or more, it determines that there is proximity or contact with the user's operating finger. To do.
ユーザが操作ノブ３０を押し下げる操作を行う際、検出電極に触らずに操作ノブ３０を押し下げたとしても静電センサ３９が近接を検出することができる。よって第１の制御部３３は、操作がなされた検出電極を判定することができる。 When the user pushes down the operation knob 30, the electrostatic sensor 39 can detect the proximity even if the operation knob 30 is pushed down without touching the detection electrode. Therefore, the first control unit 33 can determine the detected electrode that has been operated.
第１の制御部３３が検出電極部３１及び導電ユニット１を介して取得する第１の出力信号Ｓ１は、アナログ信号である。第１の制御部３３は、検出電極３１ａ～検出電極３１ｄごとに近接又は接触の有無を判定し、その結果を第２の出力信号Ｓ２として出力する。この第２の出力信号Ｓ２は、デジタル信号である。 The first output signal S1 acquired by the first control unit 33 via the detection electrode unit 31 and the conductive unit 1 is an analog signal. The first control unit 33 determines whether a proximity or contact with each detection electrode 31a ~ detection electrodes 31d, and outputs the result as the second output signal S 2. The second output signal S 2 is a digital signal.
・サブ基板３４の構成
サブ基板３４は、プリント配線基板である。このサブ基板３４は、図４Ａに示すように、第１の制御部３３と、電極パッド３４１～電極パッド３４４と、発光素子３４５と、が配置面３４ａに配置されている。第１の制御部３３は、電極パッド３４１～電極パッド３４４と電気的に接続されている。発光素子３４５は、ＬＥＤ（＝Light Emitting Diode）素子であって操作ノブ３０の照明を行う。 -Structure of Sub-Board 34 The sub-board 34 is a printed wiring board. As shown in FIG. 4A, the sub-board 34 has a first control unit 33, electrode pads 341 to electrode pads 344, and a light emitting element 345 arranged on the arrangement surface 34a. The first control unit 33 is electrically connected to the electrode pads 341 to the electrode pads 344. The light emitting element 345 is an LED (= Light Emitting Diode) element and illuminates the operation knob 30.
サブ基板３４は、コネクタ３４６が裏面３４ｂに配置されている。このコネクタ３４６には、ケーブル７０が接続される。このケーブル７０は、フラットケーブルであり、サブ基板３４のコネクタ３４６とメイン基板４のコネクタ４６とに電気的に接続されている。 The sub-board 34 has a connector 346 arranged on the back surface 34b. A cable 70 is connected to this connector 346. The cable 70 is a flat cable and is electrically connected to the connector 346 of the sub-board 34 and the connector 46 of the main board 4.
スプリング１４～スプリング１７は、カバー３５が操作ノブ３０にネジ３６によって取り付けられることにより、圧縮される。つまりスプリング１４～スプリング１７は、自然長より短い長さで操作ノブ３０に取り付けられるので、検出電極３１ａ～検出電極３１ｄ、及び配置台１０～配置台１３に対して弾性力による圧力を付加して接触状態を保つことが可能となる。 The springs 14 to 17 are compressed when the cover 35 is attached to the operation knob 30 by a screw 36. That is, since the springs 14 to 17 are attached to the operation knob 30 with a length shorter than the natural length, pressure due to elastic force is applied to the detection electrodes 31a to the detection electrodes 31d and the placement table 10 to the placement table 13. It is possible to maintain the contact state.
（メイン基板４の構成）
メイン基板４は、プリント配線基板である。このメイン基板４は、図７Ａ及び図７Ｂに示すように、第２の制御部４１と、電極パターン４２～電極パターン４５と、電極パターン４７と、が配置面４ａに配置されている。またメイン基板４は、コネクタ４６が裏面４ｂに配置されている。第２の制御部４１は、電極パターン４２～電極パターン４５と電気的に接続されている。 (Structure of main board 4)
The main board 4 is a printed wiring board. As shown in FIGS. 7A and 7B, the main substrate 4 has a second control unit 41, an electrode pattern 42 to an electrode pattern 45, and an electrode pattern 47 arranged on the arrangement surface 4a. Further, in the main board 4, the connector 46 is arranged on the back surface 4b. The second control unit 41 is electrically connected to the electrode patterns 42 to 45.
第２の制御部４１は、ＣＰＵ、ＲＡＭ及びＲＯＭなどから構成されるマイクロコンピュータである。第２の制御部４１は、図２Ｂに示すように、操作ノブユニット３から取得した第２の出力信号Ｓ２から近接又は接触を検出した検出電極を判定すると共に、操作検出部６から取得した第３の出力信号Ｓ３からなされた操作を判定する。第２の制御部４１は、判定結果を示す指示信号Ｓ４を生成してウインドウ開閉装置９５に出力する。ウインドウ開閉装置９５は、指示信号Ｓ４に基づいて車両９のウインドウを駆動する。 The second control unit 41 is a microcomputer composed of a CPU, RAM, ROM, and the like. The second control unit 41, as shown in Figure 2B, with determining the detection electrode detects the proximity or contact the second from the output signal S 2 acquired from the operation knob unit 3, obtained from the operation detecting unit 6 determining operation made from the third output signal S 3. The second control unit 41 generates an instruction signal S 4 indicating the determination result is output to the window opening and closing device 95. Window closing device 95 drives the window of the vehicle 9 based on the instruction signal S 4.
スイッチ装置７は、マニュアルモードとオートモードを備えている。マニュアルモードは、操作ノブ３０に対して操作がなされている間、指定されたウインドウを駆動するモードである。オートモードは、操作ノブ３０に対して操作がなされると、指定されたウインドウを全開又は全閉するまで駆動するモードである。引き上げ操作と押し下げ操作には、２段階あり、１段階目がマニュアルモードであり、１段目よりさらに操作する２段目がオートモードである。 The switch device 7 has a manual mode and an auto mode. The manual mode is a mode in which the designated window is driven while the operation knob 30 is being operated. The auto mode is a mode in which when an operation is performed on the operation knob 30, the designated window is driven until it is fully opened or fully closed. There are two stages of pulling up operation and pushing down operation, the first stage is the manual mode, and the second stage to be operated further than the first stage is the auto mode.
第２の制御部４１は、操作検出部６の第３の出力信号Ｓ３に基づいてマニュアルモードかオートモードかを判定する。 The second control unit 41 determines whether it is the manual mode or the auto mode based on the third output signal S3 of the operation detection unit 6.
電極パターン４２～電極パターン４５、及び電極パターン４７は、例えば、円形パターンの中央を除去した形状を有している。図７Ｂでは、一例として、この形状を有する電極パターン４７を図示している。 The electrode pattern 42 to the electrode pattern 45 and the electrode pattern 47 have, for example, a shape in which the center of the circular pattern is removed. In FIG. 7B, as an example, an electrode pattern 47 having this shape is shown.
ラバードームシート５は、シリコーンなどの柔らかい樹脂材料を用いて薄いシート状に形成されている。このラバードームシート５は、さらに下面５ｂ側に収容部５ｃが設けられている。ラバードームシート５は、メイン基板４を収容部５ｃに収容することにより、メイン基板４に対する液体の侵入を抑制、つまり防水している。 The rubber dome sheet 5 is formed in the form of a thin sheet using a soft resin material such as silicone. The rubber dome sheet 5 is further provided with an accommodating portion 5c on the lower surface 5b side. By accommodating the main substrate 4 in the accommodating portion 5c, the rubber dome sheet 5 suppresses the intrusion of liquid into the main substrate 4, that is, is waterproof.
ラバードーム５１～ラバードーム５４は、導電性を有するコンタクト５１０～コンタクト５４０を有し、このコンタクト５１０～コンタクト５４０が電極パターン４２～電極パターン４５と接触することより、電極パターン４２～電極パターン４５を導通させる。 The rubber dome 51 to the rubber dome 54 have conductive contacts 510 to 540, and the contacts 510 to 540 come into contact with the electrode patterns 42 to 45, so that the electrode patterns 42 to 45 can be formed. Make it conductive.
ラバードームシート５は、さらにラバードーム５６を備えている。このラバードーム５６は、導電性を有するコンタクト５６０を有し、メイン基板４の電極パターン４７に対応して配置されている。ラバードーム５６は、操作ボタン７２に対するプッシュ操作によって変形してコンタクト５６０と電極パターン４７が接触し、電極パターン４７を導通させる。 The rubber dome sheet 5 further includes a rubber dome 56. The rubber dome 56 has a conductive contact 560 and is arranged corresponding to the electrode pattern 47 of the main substrate 4. The rubber dome 56 is deformed by a push operation with respect to the operation button 72, and the contact 560 and the electrode pattern 47 come into contact with each other to conduct the electrode pattern 47.
ラバードーム５１～ラバードーム５４、及びラバードーム５６は、ラバードームシート５の表面５ａよりも先端が突出している。ラバードーム５１～ラバードーム５４は、この突出した部分がスライダ６３及びスライダ６４と接触している。 The tips of the rubber dome 51 to the rubber dome 54 and the rubber dome 56 protrude from the surface 5a of the rubber dome sheet 5. The protruding portions of the rubber dome 51 to the rubber dome 54 are in contact with the slider 63 and the slider 64.
（操作検出部６の構成）
操作検出部６は、図１に示すように、ロッド６１及びロッド６２と、スライダ６３及びスライダ６４と、ラバードーム５１～ラバードーム５４と、電極パターン４２～電極パターン４５と、を有する。 (Structure of operation detection unit 6)
As shown in FIG. 1, the operation detection unit 6 includes a rod 61 and a rod 62, a slider 63 and a slider 64, a rubber dome 51 to a rubber dome 54, and an electrode pattern 42 to an electrode pattern 45.
ロッド６１、スライダ６３、ラバードーム５１、ラバードーム５２、電極パターン４２及び電極パターン４３は、機能の異なる２つのスイッチを構成している。またロッド６２、スライダ６４、ラバードーム５３、ラバードーム５４、電極パターン４４及び電極パターン４５は、機能の異なる２つのスイッチを構成している。 The rod 61, the slider 63, the rubber dome 51, the rubber dome 52, the electrode pattern 42, and the electrode pattern 43 constitute two switches having different functions. The rod 62, the slider 64, the rubber dome 53, the rubber dome 54, the electrode pattern 44, and the electrode pattern 45 constitute two switches having different functions.
ロッド６１の下部６１１は、図７Ｂに示すように、スライダ６３のガイド溝６３０に移動可能に挿入されている。ロッド６２の下部６２１は、スライダ６４のガイド溝６４０に移動可能に挿入されている。 As shown in FIG. 7B, the lower portion 611 of the rod 61 is movably inserted into the guide groove 630 of the slider 63. The lower portion 621 of the rod 62 is movably inserted into the guide groove 640 of the slider 64.
操作ノブ３０が押し下げられた場合、ラバードーム５１がオン状態となるモードがウインドウを閉方向に駆動するマニュアルモードとなり、ラバードーム５１及びラバードーム５２がオン状態となるモードがウインドウを全閉するまで駆動するオートモードとなる。 When the operation knob 30 is pushed down, the mode in which the rubber dome 51 is turned on becomes the manual mode in which the window is driven in the closing direction, and the mode in which the rubber dome 51 and the rubber dome 52 are turned on is until the window is fully closed. It becomes the auto mode to drive.
また操作ノブ３０が引き上げられた場合、ラバードーム５４がオン状態となるモードがウインドウを開方向に駆動するマニュアルモードとなり、ラバードーム５３及びラバードーム５４がオン状態となるモードがウインドウを全開するまで駆動するオートモードとなる。 When the operation knob 30 is pulled up, the mode in which the rubber dome 54 is turned on becomes the manual mode in which the window is driven in the opening direction, and the mode in which the rubber dome 53 and the rubber dome 54 are turned on is until the window is fully opened. It becomes the auto mode to drive.
（実施の形態の効果）
本実施の形態の導電ユニット１は、フラックスの付着による導通不良を抑制することができる。具体的には、導電ユニット１は、配置台１０～配置台１３が第１の領域１０５及び第２の領域１０６に分かれ、配置台１０～配置台１３の基部１００の表面１００ａに対するはんだ８の流れ込みを抑制している。従って導電ユニット１は、配置台が第１の領域及び第２の領域に分かれない場合と比べて、フラックスの付着による導通不良を抑制することができる。またスイッチ装置７は、導電ユニット１を備えているので、フラックスの付着による導通不良を抑制することができる。 (Effect of embodiment)
The conductive unit 1 of the present embodiment can suppress conduction failure due to adhesion of flux. Specifically, in the conductive unit 1, the arrangement table 10 to the arrangement table 13 are divided into a first region 105 and a second area 106, and the solder 8 flows into the surface 100a of the base 100 of the arrangement table 10 to the arrangement table 13. Is suppressed. Therefore, the conductive unit 1 can suppress the conduction failure due to the adhesion of the flux, as compared with the case where the arrangement table is not divided into the first region and the second region. Further, since the switch device 7 includes the conductive unit 1, it is possible to suppress conduction failure due to adhesion of flux.
導電ユニット１は、検出電極３１ａ～検出電極３１ｄと配置台１０～配置台１３との電気的な接続にスプリング１４～スプリング１７を用いているので、弾性を持たない導電部材を用いる場合と比べて、接触が保たれ易く、導通不良を抑制することができる。 Since the conductive unit 1 uses the springs 14 to 17 for the electrical connection between the detection electrodes 31a to the detection electrodes 31d and the placement table 10 to the placement table 13, compared with the case where a conductive member having no elasticity is used. , Contact is easily maintained, and poor continuity can be suppressed.
スイッチ装置７は、検出電極部３１と電極パッド３４１～電極パッド３４４との電気的な接続に導電ユニット１を用いるので、ケーブルを用いる場合と比べて、コストを削減することができる。またフラットケーブルは、折れ曲がるとノイズの影響を受け易い。しかしスイッチ装置７は、導電ユニット１を用いるので、フラットケーブルを用いる場合と比べて、よりノイズの影響を抑制することができる。 Since the switch device 7 uses the conductive unit 1 for electrical connection between the detection electrode unit 31 and the electrode pads 341 to 344, the cost can be reduced as compared with the case where a cable is used. Also, flat cables are susceptible to noise when bent. However, since the switch device 7 uses the conductive unit 1, the influence of noise can be further suppressed as compared with the case where the flat cable is used.
以上、本発明のいくつかの実施の形態及び変形例を説明したが、これらの実施の形態及び変形例は、一例に過ぎず、請求の範囲に係る発明を限定するものではない。これら新規な実施の形態及び変形例は、その他の様々な形態で実施されることが可能であり、本発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更などを行うことができる。また、これら実施の形態及び変形例の中で説明した特徴の組合せの全てが発明の課題を解決するための手段に必須であるとは限らない。さらに、これら実施の形態及び変形例は、発明の範囲及び要旨に含まれると共に、請求の範囲に記載された発明とその均等の範囲に含まれる。 Although some embodiments and modifications of the present invention have been described above, these embodiments and modifications are merely examples and do not limit the invention according to the claims. These novel embodiments and modifications can be implemented in various other embodiments, and various omissions, replacements, changes, etc. can be made without departing from the gist of the present invention. Moreover, not all combinations of features described in these embodiments and modifications are essential as means for solving the problems of the invention. Further, these embodiments and modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof.
１ 導電ユニット
１０ａ～１０ｄ 配置台
１０～１３ 配置台
１４～１７ スプリング
３１ 検出電極部
３１ａ～３１ｄ 検出電極
３４ａ 配置面
３４ｂ 裏面
１００ 基部
１００ａ 表面
１００ｂ 裏面
１０１ 曲げ部
１０１ａ 曲部
１０１ｂ 端部
１０１ｃ 破断面
１０１ｄ 突起部
１０２ 曲げ部
１０２ａ 曲部
１０２ｂ 端部
１０２ｃ 破断面
１０２ｄ 突起部
１０４ａ，１０４ｂ 上面
１０５第１の領域
１０６ 第２の領域
３４１～３４４ 電極パッド 1 Conductive unit 10a to 10d Arrangement table 10 to 13 Arrangement table 14 to 17 Spring 31 Detection electrode part 31a to 31d Detection electrode 34a Placement surface 34b Back side 100 Base part 100a Front side 100b Back side 101 Bending part 101a Bending part 101b End part 101c Fracture surface 101d Projection 102 Bending 102a Bending 102b End 102c Fracture surface 102d Projection 104a, 104b Top surface 105 First area 106 Second area 341 to 344 Electrode pads

Claims (10)

  1. 第１の接続対象と第２の接続対象を電気的に接続する第１の導電部材と、
    前記第２の接続対象と前記第１の導電部材の間に介在し、前記第１の接続対象側がはんだが付き難い第１の領域、前記第２の接続対象側がはんだが前記第１の領域と比べて付き易い第２の領域に分かれる第２の導電部材と、
    を備えた導電ユニット。     A first conductive member that electrically connects the first connection target and the second connection target,
    It is interposed between the second connection target and the first conductive member, the first connection target side is a first region where solder is difficult to adhere, and the second connection target side is a solder in the first region. A second conductive member that is divided into a second area that is easier to attach to
    Conductive unit with.
  2. 前記第２の導電部材は、前記第１の導電部材が接触する表面を有する基部と、前記基部から前記第１の接続対象側に折れ曲がる曲げ部と、を有し、
    前記曲げ部は、前記第１の領域及び前記第２の領域に分かれた、
    請求項１に記載の導電ユニット。     The second conductive member has a base having a surface with which the first conductive member comes into contact, and a bent portion that bends from the base to the first connection target side.
    The bent portion is divided into the first region and the second region.
    The conductive unit according to claim 1.
  3. 前記曲げ部は、前記基部の対向する一対の辺に設けられる、
    請求項２に記載の導電ユニット。     The bent portion is provided on a pair of opposite sides of the base portion.
    The conductive unit according to claim 2.
  4. 前記曲げ部は、前記第２の接続対象に対して垂直方向に伸びる端部を有する、
    請求項２又は３に記載の導電ユニット。     The bend has an end that extends perpendicular to the second connection.
    The conductive unit according to claim 2 or 3.
  5. 前記曲げ部は、前記第１の領域としての上面が破断面である、
    請求項２又は３に記載の導電ユニット。     The upper surface of the bent portion as the first region is a fracture surface.
    The conductive unit according to claim 2 or 3.
  6. 前記曲げ部は、前記第２の接続対象に対して垂直から外側に傾いた方向に伸びる端部を有する、
    請求項２又は３に記載の導電ユニット。     The bent portion has an end portion extending in a direction inclined outward from the vertical with respect to the second connection object.
    The conductive unit according to claim 2 or 3.
  7. 前記曲げ部は、前記第２の領域である曲部の上部に、外側又は内側に向けて突出する突起部を有する、
    請求項２又は３に記載の導電ユニット。     The bent portion has a protrusion that protrudes outward or inward at the upper part of the curved portion that is the second region.
    The conductive unit according to claim 2 or 3.
  8. 前記第１の導電部材は、弾性体である、
    請求項１乃至７のいずれか１項に記載の導電ユニット。     The first conductive member is an elastic body.
    The conductive unit according to any one of claims 1 to 7.
  9. 前記第１の導電部材は、コイルスプリングである、
    請求項１乃至８のいずれか１項に記載の導電ユニット。     The first conductive member is a coil spring.
    The conductive unit according to any one of claims 1 to 8.
  10. 前記第１の領域は、前記第２の領域と比べてはんだの濡れ性が低い領域である、
    請求項１乃至９のいずれか１項に記載の導電ユニット。     The first region is a region where the wettability of the solder is lower than that of the second region.
    The conductive unit according to any one of claims 1 to 9.
PCT/JP2020/029465 2019-09-05 2020-07-31 Conductive unit WO2021044778A1 (en)

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JP2019-162194 2019-09-05
JP2019162194A JP2021039919A (en) 2019-09-05 2019-09-05 Conductive unit

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135663U (en) * 1988-03-10 1989-09-18
JP2010123693A (en) * 2008-11-18 2010-06-03 Fujitsu Ten Ltd Terminal structure
JP2015095454A (en) * 2013-11-14 2015-05-18 ジョインセット株式会社 Surface-mount type electric connecting terminal, and electronic module unit and circuit board including the electric connecting terminal
JP2016115549A (en) * 2014-12-15 2016-06-23 アルプス電気株式会社 Pressure contact connector
JP2018088377A (en) * 2016-11-30 2018-06-07 アルプス電気株式会社 Pressure welding connector and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01135663U (en) * 1988-03-10 1989-09-18
JP2010123693A (en) * 2008-11-18 2010-06-03 Fujitsu Ten Ltd Terminal structure
JP2015095454A (en) * 2013-11-14 2015-05-18 ジョインセット株式会社 Surface-mount type electric connecting terminal, and electronic module unit and circuit board including the electric connecting terminal
JP2016115549A (en) * 2014-12-15 2016-06-23 アルプス電気株式会社 Pressure contact connector
JP2018088377A (en) * 2016-11-30 2018-06-07 アルプス電気株式会社 Pressure welding connector and manufacturing method thereof

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