WO2021031110A1 - Configuration file generation method and device, and storage medium - Google Patents

Configuration file generation method and device, and storage medium Download PDF

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Publication number
WO2021031110A1
WO2021031110A1 PCT/CN2019/101533 CN2019101533W WO2021031110A1 WO 2021031110 A1 WO2021031110 A1 WO 2021031110A1 CN 2019101533 W CN2019101533 W CN 2019101533W WO 2021031110 A1 WO2021031110 A1 WO 2021031110A1
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file
core
description file
component
description
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PCT/CN2019/101533
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French (fr)
Chinese (zh)
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刘辉
董岚
刘冬冬
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深圳市大疆创新科技有限公司
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Priority to CN201980031341.6A priority Critical patent/CN112154413A/en
Priority to PCT/CN2019/101533 priority patent/WO2021031110A1/en
Publication of WO2021031110A1 publication Critical patent/WO2021031110A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F8/00Arrangements for software engineering
    • G06F8/70Software maintenance or management
    • G06F8/71Version control; Configuration management

Definitions

  • the present invention relates to the technical field of chip development, in particular to a method and device for generating configuration files, and a storage medium.
  • embedded chips such as DSP (digital signal processing) chips, ARM (Advanced RISC Machines, Advanced Reduced Instruction Set Processor) chips, SOC (system-on-chip), etc.
  • DSP digital signal processing
  • ARM Advanced RISC Machines, Advanced Reduced Instruction Set Processor
  • SOC system-on-chip
  • the development of the chip is usually realized by means of multiple development modules. Taking the DSP chip as an example, at least the software simulation module, the RTL code integration module and the EDA verification module are needed to implement software simulation, RTL code integration, EDA verification, etc., respectively.
  • the invention provides a configuration file generation method, device and storage medium, which can improve the efficiency of chip development.
  • the first aspect of the embodiments of the present invention provides a configuration file generation method, including:
  • a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
  • a configuration file generation device including: a processor and a memory;
  • the memory is used to store program code
  • the processor is used to call the program code, and when the program code is executed, it is used to perform the following operations:
  • a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
  • a third aspect of the embodiments of the present invention provides a computer-readable storage medium
  • the computer-readable storage medium stores computer instructions, and when the computer instructions are executed, the configuration file generation method described in the foregoing embodiment is implemented.
  • the configuration files of multiple chip development modules can be uniformly generated according to the obtained description file.
  • These chip development modules The target chip can be developed based on the configuration file. No matter how the requirements change during the development process, the configuration file that meets the demand can be quickly obtained, without the need to manually modify the configuration files of each chip development module, which improves the efficiency of chip development.
  • FIG. 1 is a schematic flowchart of a configuration file generation method according to an embodiment of the present invention
  • Figure 2 is a schematic diagram of a DSP chip development process according to an embodiment of the present invention.
  • FIG. 3 is a schematic flowchart of step S200 in FIG. 1 according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of generating a configuration file by executing step S200 according to an embodiment of the present invention
  • Figure 5 is a schematic diagram of a description file of an embodiment of the present invention.
  • Fig. 6 is a structural block diagram of an apparatus for generating a configuration file according to an embodiment of the present invention.
  • first, second, third, etc. may be used in the present invention to describe various information, the information should not be limited to these terms. These terms are used to distinguish the same type of information from each other.
  • first information may also be referred to as second information, and similarly, the second information may also be referred to as first information.
  • word "if” used can be interpreted as "when", or "when”, or "in response to certainty.”
  • a configuration file generation method may include the following steps:
  • S200 Generating configuration files of multiple chip development modules uniformly according to the description file, where the configuration files are used to enable the multiple chip development modules to develop the target chip.
  • the configuration file generation method of the embodiment of the present invention may be applied to an electronic device, and more specifically may be a processor of the electronic device.
  • the electronic device may be, for example, a computer device.
  • the specific type is not limited as long as it has a certain processing capability.
  • step S100 a description file related to the target chip is obtained.
  • the description file related to the target chip can be preset locally, and only the description file needs to be read locally.
  • the description file related to the target chip can also be obtained from an external device, or generated based on the input information of the developer.
  • the specific method of obtaining the description file is not limited, as long as the description file related to the target chip can be obtained.
  • the target chip is completely described through the one description file.
  • the target chip is described cooperatively through the obtained description files.
  • the description file can specifically describe the configuration of the core in the target chip, the configuration of the components in the core, the composition of the components, and so on. As long as the overall configuration of the target chip can be clarified according to the obtained description file.
  • step S200 a configuration file of multiple chip development modules is uniformly generated according to the description file, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
  • the target chip can be any kind of digital circuit chip, and more specifically can be a processor chip such as a DSP chip, an ARM chip, or a SOC chip.
  • a processor chip such as a DSP chip, an ARM chip, or a SOC chip.
  • the specific chip type is not limited, as long as it needs to go through multiple development processes, during which multiple chip development modules are used.
  • the development process of a DSP chip can include: a software simulation stage, an RTL top-level design stage, and a header file design stage.
  • a software simulation module is needed, such as the simulator shown in Figure 2, or more specifically, a Cmodel.
  • a DSP chip software simulator can be simulated. Can carry on the function simulation of DSP chip.
  • RTL Registered Transfer Level
  • RTL Integrate which can also be called RTL code integration module
  • EDA verification module as shown in Figure 2.
  • the header file design stage may include the ASM header file design stage, where the ASM Heaher file design shown in Figure 2 is performed; and the C header file design stage, the C Heaher file design shown in Figure 2 is performed.
  • the ASM header file and the C header file are the header files required by each chip development module for users.
  • the files supported by different chip development modules may be different, such as content representation, file format, and file language.
  • the specific configuration content is basically the same.
  • configuration files of multiple chip development modules can be uniformly generated according to the description file, and these chip development modules can develop the target chip based on the corresponding configuration files.
  • the generation method of the configuration file may include: code conversion, code assembly, etc.
  • the specific generation method is not limited, as long as the required configuration file can be obtained according to the description file.
  • the configuration files of multiple chip development modules can be uniformly generated based on the obtained description files.
  • These chip development modules can be based on the configuration files.
  • a description file set can be preset locally, and there are multiple description files in the description file set.
  • the description file set may include: at least one core description file, each core description file containing component information in a single core; and multiple component description files, each component description file containing composition information of a single component.
  • the component information in each core description file may include the configuration information, component identification and connection relationship of each component; the composition information in each component description file may include the configuration information of each component and the connection relationship of each component .
  • obtaining a description file related to the target chip may specifically include the following steps:
  • the chip description file at least contains the core identification of each core in the target chip
  • each selected core description file selects the component description file corresponding to each component identification from the description file set;
  • the obtained chip description file and the selected core description file and component description file are used as description files related to the target chip.
  • the above method of obtaining the description file is just an example. Of course, there are other methods. For example, when selecting the core description file and the component description file from the description file set, the selection can be made under the instruction of an external input instruction.
  • step S200 generating configuration files of multiple chip development modules according to the description file may include the following steps:
  • S202 uniformly determine configuration files of multiple chip development modules of the target chip according to the specification description file.
  • a specification description file can be generated based on the obtained description file, and the specification description file can be used to describe the specifications of the target chip.
  • the specification description file is obtained by loading and parsing the description file. It can be used as a complete DSP model (preferably the dsp.hsd file) to realize the overall configuration of the DSP chip development module.
  • the obtained description file format may all be an xml format file.
  • a program that supports xml format files and can implement step S200 can be pre-written.
  • the program that implements step S200 is a configurator through the python language. Calling the configurator can complete the loading and parsing of the xml format file, as well as the parsed
  • the information in the xml format file is used to generate the specification description file.
  • the configuration files of multiple chip development modules of the target chip can be determined according to the specification description file.
  • the information content related to the specifications in each configuration file is derived from the specification description file. The content is basically the same.
  • the acquired description files can be multiple description files, and different specification description files can be generated by replacing at least one of the description files. Therefore, in the development process, when the requirements change, a description file that matches the requirement can be found, and the corresponding specification description file can be generated. According to the specification description file, the configuration file that meets the requirement can be determined.
  • the embodiment of the present invention can support the configuration of chips of different specifications, and is more versatile.
  • the description file includes:
  • a chip description file of the target chip where the chip description file contains core information in the target chip
  • the core description file of each core in the target chip, and each core description file contains the component information in the corresponding core;
  • each component description file of each component in each core in the target chip contains the composition information of the corresponding component.
  • the chip description file, core description file, and component description file of the target chip can form a certain hierarchical structure.
  • the chip description file is the first-level file, which contains the core information required by the target chip.
  • the core information can include core identification, etc.;
  • the core description file is the second-level file, and each core description file corresponds to a core identification.
  • the component information can include component identification, component name, connection relationship between components, external connection relationship between components, etc.;
  • the component description file is a third-level file, and each component description file They all correspond to a component identifier and contain the composition information of the component parts required by the corresponding component.
  • the composition information may include the component component name, the connection relationship of the component component, and the external connection relationship of the component component.
  • the chip description file, core description file, and component description file may also contain other information.
  • the chip description file may also include the size of DDR (Double Rate Synchronous Dynamic Random Access Memory). DDR can be used as an external storage unit to store data and instructions during software simulation.
  • DDR Double Rate Synchronous Dynamic Random Access Memory
  • the file format of each file adopts xml (extensible markup language) format, that is, the file is written in xml language.
  • xml extensible markup language
  • the file can also be written in other scripting languages.
  • the program that implements the method of the embodiment of the present invention can be written in the python language, so that the portability of the program can be guaranteed.
  • the program that implements step S200 is called a configurator, and the configurator can be written in python language.
  • the program for implementing the method of the embodiment of the present invention can also be written in other languages.
  • the target chip as a DSP chip as an example, combining Figure 1 and Figure 4, input dsp.xml, cell0.xml, cell1.xml, Component_0.xml, Component_1.xml, Component_2.xml, and Component_3.xml into the configurator Then, the Dsp_0.hsd required by the simulator software simulation, the Dsp_0_top.v and the Asm header file required for the synthesis of the EDA Verification hardware simulation and RTL Integrate code can be generated uniformly asm_header.h, the header files required for the EDA Verification simulation. The header file crf_lst.vh, and the header file c_headers.h required for C header file design.
  • dsp.xml is the chip description file
  • dsp.xml contains the core information of the cell0 and cell1 cores, indicating that the DSP chip needs two cores
  • the description file input to the configurator is also Including cell0.xml and cell1.xml.
  • Cell0.xml contains the component information of Component_0 and Component_1, indicating that these two components are required in core cell0. Therefore, the description file input to the configurator also includes Component_0.xml and Component_1.xml.
  • Cell1.xml contains the component information of Component_2 and Component_3, indicating that these two components are required in core cell1. Therefore, the description file input to the configurator also includes Component_2.xml and Component_3.xml.
  • each core includes at least one of the following components: a control unit, a vector execution unit (for performing vector operations), a storage unit, a data transmission bus, and an accelerator.
  • Each component can be configured with corresponding components as needed.
  • the component can be configured with data interface, control register group, control register, bit field of the component register, external interface, and Storage sub-units, etc.
  • dsp.xml is the chip description file, as the first level file, which contains the core information of the two cores cell0 and cell1, corresponding to the two core description files, cell0.xml and cell1.
  • xml; cell0.xml and cell1.xml, as the second-level files, contain the component information of each component.
  • cell0.xml can include a simplified instruction set processor antibiotic, a storage unit vmem, and vectors for performing multiplication and addition Component information of the execution unit veu, the vector execution unit valu for performing shift operations, and the vector execution unit vfpu for performing floating-point operations;
  • Figure 5 only shows the third-level file corresponding to cell0.xml, including antibiotic.
  • xml, vmem.xml, veu.xml, valu.xml, vfpu.xml are used to describe the composition information of antibiotic, vmem, veu, valu, and vfpu, respectively.
  • step S201 generating the specification description file of the target chip according to the description file includes:
  • S2011 Generate a core assembly file according to at least one of the core description files and corresponding component description files;
  • the core description file in the description file and the corresponding component description file can be assembled first to generate a core assembly file corresponding to each core description file; then the chip description file and each core assembly file are assembled, To generate the specification description file of the target chip.
  • this embodiment is only an example of generating a specification description file, and of course, there may be other ways in practice. For example, first assemble the chip description file and the core description file to obtain the chip assembly file, and then assemble the component description file corresponding to each core description file to the corresponding position of the chip assembly file to obtain the specification description file.
  • Each core description file includes the corresponding core identification
  • step S2011 generating a core assembly file according to at least one of the core description file and the corresponding component description file includes:
  • S20111 According to the core identification corresponding to each core description file, check whether the core assembly file corresponding to the core identification currently exists;
  • the core description file of each core has the core identification of the core (the core identification can be used as the name of the core description file, and/or recorded in the core description file), in other words, each core description file includes the corresponding core identification.
  • the core assembly file is based on the core description file and the corresponding component description file, so the core assembly file will also contain the core identification in the core description file, that is, the core assembly file also corresponds to the core identification.
  • the nuclear assembly file corresponding to the nuclear identification does not currently exist, it means that the nuclear assembly file corresponding to the nuclear identification has not been assembled before, and the nuclear assembly file corresponding to the nuclear identification needs to be newly generated. Since all component description files are the component description files of the components contained in all cores, it is necessary to obtain the component description file corresponding to the core description file from all the component description files, and then generate the core according to the obtained component description file and the core description file.
  • the nuclear assembly file describing the file is the nuclear assembly file describing the file.
  • the method further includes:
  • the nuclear assembly file corresponding to the nuclear identification currently exists, it means that the nuclear assembly file corresponding to the nuclear identification has been assembled before and can be used directly without regenerating it. In other words, if the core assembly file corresponding to the core identifier is found in the storage space, then the found assembly file is determined as the core assembly file of the core description file.
  • the component information includes at least a component identification
  • step S20112 obtain component description files required by the core description file from all component description files, including:
  • the component information in the core description file may include the component identification.
  • the component information may also include other information.
  • a core description file can contain multiple component information, that is, multiple component identifiers. According to the component identifiers in the core description file, the component description file corresponding to the core description file can be found from the component description file.
  • An association relationship can be established between the component identifier of a component and the component description file, and thus the component description file that has an association relationship with the component identifier can be found according to the component identifier. In this way, all component description files corresponding to the core description file can be found.
  • the component identifiers contained in the core description file cell0.xml are antibiotic, vmem, veu, valu, and vfpu. Then, according to these component identifiers, antibiotic.xml, vmem.xml, veu.xml, valu.xml, vfpu can be found .xml these component description files.
  • the required component description file is obtained according to the component identification, and the obtaining method is simpler and faster.
  • Each component description file includes the corresponding component identification
  • Step S201121 According to the component identification in the core description file, obtain the component description file corresponding to the core description file from all the component description files, including:
  • the component description file corresponding to the component identifier is selected from all component description files, and the selected component description file is determined as the component description file corresponding to the core description file.
  • the component description file of each component has the component identification of the component (the component identification can be used as the name of the component description file, and/or recorded in the component description file), in other words, each component description file includes the corresponding component identification.
  • the component description file can be obtained more conveniently based on the component identification. As long as for each component identifier in the core description file, find the component description file containing the component identifier, and the found component description file is the component description file corresponding to the core description file.
  • the component information includes at least a component identification
  • Each component description file includes the corresponding component identification
  • step S20112 generating a core assembly file of the core description file according to the obtained component description file and the core description file, including:
  • S201122 Determine the component description file corresponding to each component identifier according to the component identifier in the core description file;
  • S201123 Assemble the component description file corresponding to each component identifier into the core description file to obtain the core assembly file of the core description file.
  • the component description file of each component has the component identification of the component (the component identification can be used as the name of the component description file, and/or recorded in the component description file), in other words, each component description file includes the corresponding component identification.
  • the component information in the core description file may include the component identification.
  • the component information may also include other information.
  • a core description file can contain multiple component information, that is, multiple component identifiers. According to the component identifiers in the core description file, the component description file corresponding to each component identifier can be determined; the component description file corresponding to each component identifier is assembled into the core description file to obtain the core assembly file of the core description file.
  • the component identifiers contained in cell0.xml are antibiotic, vmem, veu, valu, vfpu, then antibiotic.xml, vmem.xml, veu.xml, valu.xml, vfpu.xml can be assembled according to these component identifiers
  • antibiotic.xml can be assembled to the position corresponding to the component identifier antibiotic in cell0.xml
  • vmem.xml can be assembled to the position corresponding to the component identifier vmem in cell0.xml
  • veu.xml can be assembled to cell0.xml
  • the position corresponding to the middle component identifier veu, and so on, the similarities are not repeated here.
  • the core assembly file is a file that completes the component information of each component in the core.
  • step S201123 assembling the component description file corresponding to each component identifier into the core description file may include the following two methods:
  • A1 Replace the component information where each component identifier is located in the core description file with the content in the component description file corresponding to each component identifier;
  • A2 Insert all the component information in the component description file corresponding to each component identifier into the component information where each component identifier in the core description file is located.
  • the component information in the core description file does not need to be retained, but replaced with the content in the component description file corresponding to each component identifier, and the obtained core assembly file contains the content in the component description file corresponding to each component identifier.
  • the core identification and other necessary information in the core description file have not been replaced.
  • the component information in the core description file can be information used to help developers understand the component overview, but it is not the information required by the final specification description file, so it is sufficient to use alternative means.
  • the component identifiers contained in cell0.xml are antibiotic, vmem, veu, valu, vfpu.
  • the component information where antibiotic is located in cell0.xml is a code fragment, which can be used as antibiotic as a whole. Replace the code in xml, so that the core assembly file corresponding to cell0.xml integrates the code in antibiotic.xml, vmem.xml, veu.xml, valu.xml, and vfpu.xml.
  • the component information in the core description file still needs to be retained. All the component information in the component description file corresponding to each component identifier is inserted into the component information where each component identifier in the core description file is located.
  • the component description file It may also contain other information such as component identification, but because the component identification already exists in the core description file, this part of the repeated information does not need to be inserted into the core description file.
  • the component information in the core description file can not only help the developer understand the component overview, but also the information required by the final specification description file, so the insertion method is used.
  • the component identifiers contained in cell0.xml are antibiotics, vmem, veu, valu, vfpu.
  • the component information where antibiotic is located in cell0.xml is a code fragment
  • the composition information in antibiotic.xml can be Multiple code snippets, the multiple code snippets in antibiotic.xml can be inserted into the code snippet where antibiotic is located.
  • the specific insertion position can be marked in the core description file, so that the core assembly file corresponding to cell0.xml is not only integrated
  • the codes in risc.xml, vmem.xml, veu.xml, valu.xml, and vfpu.xml also retain the original component information of cell0.xml.
  • the nuclear information includes at least a nuclear identifier
  • Each core assembly file includes the corresponding core identification
  • step S2012 generating the specification description file according to the chip description file and each core assembly file includes:
  • S20121 Determine the core assembly file corresponding to each core identification according to the core identification in the chip description file;
  • the core information in the chip description file may include the core identification, of course, the core information may also include other information.
  • the chip description file may contain two core identifiers, cell0 and cell1, which respectively indicate the corresponding cores.
  • the core description file of each core has the core identification of the core (the core identification can be used as the name of the core description file, and/or recorded in the core description file), in other words, each core description file includes the corresponding core identification.
  • the core assembly file is based on the core description file and the corresponding component description file, so the core assembly file will also contain the core identification in the core description file, that is, the core assembly file also corresponds to the core identification.
  • a chip description file contains at least one core information, that is, at least one core identifier. According to the core identification in the chip description file, the core assembly file corresponding to each core identification can be determined; the core assembly file corresponding to each core identification is assembled into the chip description file to obtain the specification description file.
  • the chip description file contains only one core identification, it means that the target chip to be developed is a single-core chip; if the chip description file contains two core identifications, it means that the target chip to be developed is a dual-core chip, and so on.
  • the core identifiers contained in dsp.xml are cell0 and cell1
  • the core assembly files corresponding to cell0.xml and cell1.xml can be assembled into dsp.xml based on these core identifiers
  • cell0.xml can be assembled into the core identification
  • cell1.xml can be assembled to the location corresponding to the core identifier cell1.
  • the specification description file is a file that completes all the composition information of all components in all cores in the target chip.
  • step S20122 assembling the core assembly file corresponding to each core identifier into the chip description file may include the following two methods:
  • the core information in the chip description file does not need to be retained, but is replaced with the content in the core assembly file corresponding to each core identifier, and the obtained specification description file contains the content in the core assembly file corresponding to each core identifier.
  • the nuclear identification and other necessary information in the nuclear assembly file have not been replaced.
  • the core information in the chip description file can be information used to help developers understand the component overview, but it is not the information required by the final specification description file, so only replacement means can be used.
  • dsp.xml contains the core identifiers cell0 and cell1.
  • the core information of cell0 in dsp.xml is a code fragment, which can be used in the core assembly file corresponding to cell0.xml.
  • the code in cell0.xml and cell1.xml are integrated in the resulting specification description file.
  • the core information in the chip description file still needs to be retained. All the component information in the core assembly file corresponding to each core identification is inserted into the core information where each core identification in the chip description file is located. It may contain other information such as core identification, but since the core identification already exists in the chip description file, this part of the repeated information does not need to be inserted into the chip description file.
  • the core information in the chip description file can not only help developers understand the core overview, but also the information required by the final specification description file, so the insertion method is used.
  • dsp.xml contains core identifiers cell0 and cell1.
  • the core information of cell0 in dsp.xml is a code fragment
  • the component information in the core assembly file corresponding to cell0.xml can be multiple Code snippets, these multiple code snippets can be inserted into the code snippet where cell0 is located.
  • the specific insertion position can be marked in the chip description file, so that the specification description file not only integrates the codes in all core assembly files, but also retains the dsp .xml original nuclear information, DDR size, etc.
  • the target chip is a DSP chip.
  • the configuration files required by multiple chip development modules of the DSP chip in the development phase can be generated, so that when the specifications of the DSP chip to be developed need to be modified, only the description file needs to be modified to obtain a new description File, based on the new description file, you can get the configuration files of multiple chip development modules.
  • These configuration files can meet the needs. There is no need to modify the configuration files of multiple chip development modules one by one, which improves the development efficiency of DSP chips. .
  • the target chip in the embodiment of the present invention can also be other types of chips, such as ARM chips, SOC chips, etc., as long as it will go through multiple chip development modules during the development phase and these chip development modules are required The corresponding configuration file is fine.
  • the multiple chip development modules at least include: a software simulation module, an RTL code integration module, and an EDA verification module;
  • step S202 uniformly determining the configuration files of multiple chip development modules of the target chip according to the specification description file includes:
  • S2022 Determine the RTL top-level code file required by the RTL code integration module and the EDA verification module according to the specification description file.
  • the software simulation module can be used to realize the functional simulation of the DSP chip.
  • the RTL code integration module can be used to implement RTL code integration
  • the EDA verification module can be used to implement performance simulation of DSP chips.
  • the required configuration files will be different. Specifically, the software configuration file required by the software simulation module, the RTL top-level code file required by the RTL code integration module and the EDA verification module are different. The difference is mainly reflected in the different programming languages.
  • the software configuration file is written in a software programming language, and the specific language can be determined according to the language supported by the software simulation module.
  • the RTL top-level code files are written in hardware programming languages, such as Verilog, VHDL, etc. Of course, in the case of different languages, the code format will be different.
  • the information content related to the specification in the specification description file is also required by the software configuration file and the RTL top-level code file. Therefore, the software configuration file required by the software simulation module and the RTL top-level code file required by the RTL code integration module and the EDA verification module can be determined according to the specification description file.
  • the main difference between the specification description file, the software configuration file and the RTL top-level code file also lies in the programming language.
  • the specification description file can be written in XML format, and the specific writing language is not limited.
  • the specification description file can be directly determined as the software configuration file.
  • RTL top-level code files are similar.
  • step S2021 determining the software configuration file required by the software simulation module according to the specification description file includes:
  • S20211 Convert the specification description file to generate the software configuration file, so that the software configuration file can be applied to the software simulation module.
  • converting the specification description file to generate the software configuration file may include the following two methods:
  • C1 Prepare a template of the software configuration file in advance.
  • the template is complete except for the value of the required key information; find the value of the key information required by the template from the specification description file, and find the value Write it into the corresponding key information of the template to obtain the required software configuration file.
  • C2 The language conversion relationship between the specification description file and the code with the same meaning in the software configuration file can be established. In this way, the code in the specification description file can be converted from the current language to the software configuration file according to the language conversion relationship. Language, get the software configuration file.
  • step S202 uniformly determining the configuration files of multiple chip development modules of the target chip according to the specification description file, further including the following steps:
  • S2024 Generate the first header file required by the software simulation module, the RTL code integration module, and the EDA verification module according to the extracted configuration information.
  • the specification description file can contain a variety of configuration information, some of which need to be user-oriented, such as control register related information (such as address), etc., which need to be used to generate software simulation modules, RTL code integration modules and EDA verification
  • control register related information such as address
  • EDA verification The first header file used by users in modules, etc.
  • the user-oriented configuration information can be extracted from the specification description file, such as extracting all the relevant information of the control register.
  • the user-oriented configuration information is not limited to the register address, and can be determined according to needs. .
  • the first header files required by the software simulation module, the RTL code integration module and the EDA verification module can be generated based on the configuration information.
  • the header file template can be prepared in advance, and the configuration information can be filled in the corresponding position in the template to generate the corresponding header file.
  • the first header file includes: a C language header file and an ASM header file.
  • the first header file required by the DSP chip in the development stage may include a C language header file and an ASM header file.
  • C language header files and ASM header files can include DSP control registers, interrupt macro definitions, etc.
  • the first header file is not limited to this. As the development platform and DSP chip technology evolve, the required first header file may also change accordingly, such as a header file written in another language.
  • step S202 uniformly determining the configuration files of multiple chip development modules of the target chip according to the specification description file, and further includes the following steps:
  • S2026 Generate a second header file required by the EDA verification module according to the extracted register address.
  • the EDA verification module needs to rely on some registers (such as used to store data, instructions, etc.) when verifying, it is necessary to extract the register address required for EDA verification, and generate the EDA verification module required by the extracted register address The second header file.
  • the method of generating the second header file based on the register address is similar to the method of generating the first header file based on the configuration information, and will not be repeated here.
  • the present invention also provides a configuration file generating device.
  • the configuration file generating device 100 may include a processor 102 and a memory 101.
  • the memory is used to store program code
  • the processor is used to call the program code, and when the program code is executed, it is used to perform the following operations:
  • a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
  • the configuration files of multiple chip development modules of the target chip are uniformly determined according to the specification description file.
  • the description file includes:
  • a chip description file of the target chip where the chip description file contains core information in the target chip
  • the core description file of each core in the target chip, and each core description file contains the component information in the corresponding core;
  • each component description file of each component in each core in the target chip contains the composition information of the corresponding component.
  • the processor when the processor generates the specification description file of the target chip according to the description file, it is specifically used for:
  • the specification description file is generated according to the chip description file and each core assembly file.
  • Each core description file includes the corresponding core identification
  • the processor When the processor generates a core assembly file according to at least one of the core description file and the corresponding component description file, it is specifically configured to:
  • the processor is further configured to:
  • the core assembly file is determined as the core assembly file of the core description file.
  • the component information includes at least a component identification
  • the component description file corresponding to the core description file is obtained from all the component description files.
  • Each component description file includes the corresponding component identification
  • the processor obtains the component description file corresponding to the core description file from all the component description files according to the component identifier in the core description file, it is specifically used for:
  • the component description file corresponding to the component identifier is selected from all component description files, and the selected component description file is determined as the component description file corresponding to the core description file.
  • the component information includes at least a component identification
  • Each component description file includes the corresponding component identification
  • the processor When the processor generates the core assembly file of the core description file according to the obtained component description file and the core description file, it is specifically used for:
  • the component description file corresponding to each component identifier is assembled into the core description file to obtain the core assembly file of the core description file.
  • the processor When the processor assembles the component description file corresponding to each component identifier into the core description file, it is specifically used for:
  • All the component information in the component description file corresponding to each component identifier is inserted into the component information where each component identifier in the core description file is located.
  • the nuclear information includes at least a nuclear identifier
  • Each core assembly file includes the corresponding core identification
  • the core assembly file corresponding to each core identifier is assembled into the chip description file to obtain the specification description file.
  • the processor When the processor assembles the core assembly file corresponding to each core identifier into the chip description file, it is specifically used to:
  • the target chip is a DSP chip.
  • the multiple chip development modules include at least: a software simulation module, an RTL code integration module, and an EDA verification module;
  • the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is specifically used for:
  • the processor determines the software configuration file required by the software simulation module according to the specification description file, it is specifically used to:
  • the specification description file is converted to generate the software configuration file, so that the software configuration file can be applied to the software simulation module.
  • the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is further configured to:
  • the first header files required by the software simulation module, the RTL code integration module and the EDA verification module are generated.
  • the first header file includes: C language header file and ASM header file.
  • the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is further configured to:
  • the present invention also provides a computer-readable storage medium having computer instructions stored thereon, and when the computer instructions are executed, the configuration described in the foregoing embodiment is realized File generation method.
  • a typical implementation device is a computer.
  • the specific form of the computer can be a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email receiving and sending device, and a game control A console, a tablet computer, a wearable device, or a combination of any of these devices.
  • the embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may adopt the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.
  • computer-usable storage media including but not limited to disk storage, CD-ROM, optical storage, etc.
  • these computer program instructions can also be stored in a computer-readable memory that can guide a computer or other programmable data processing equipment to work in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture including the instruction device,
  • the instruction device realizes the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.
  • These computer program instructions can also be loaded into a computer or other programmable data processing equipment, so that a series of operation steps are executed on the computer or other programmable equipment to produce computer-implemented processing, thereby executing instructions on the computer or other programmable equipment Provides steps for realizing the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.

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Abstract

A configuration file generation method and device, and a storage medium. The configuration file generation method comprises: acquiring a description file associated with a target chip (S100); and uniformly generating configuration files for a plurality of chip development modules according to the description file, the configuration file enabling the plurality of chip development modules to develop the target chip (S200). The method may improve the chip development efficiency.

Description

配置文件生成方法及装置、存储介质Configuration file generation method, device and storage medium 技术领域Technical field
本发明涉及芯片开发技术领域,尤其是涉及一种配置文件生成方法及装置、存储介质。The present invention relates to the technical field of chip development, in particular to a method and device for generating configuration files, and a storage medium.
背景技术Background technique
由于嵌入式应用产品的快速发展,嵌入式芯片比如DSP(数字信号处理)芯片、ARM(Advanced RISC Machines,高级精简指令集处理器)芯片、SOC(系统级芯片)等,应用于许多不同的行业。例如,多媒体、无线通信、网络终端、医疗教育等行业,甚至最新的人工智能和深度学习等领域。面对不一样的应用场景,需要设计出满足不同需求的芯片。Due to the rapid development of embedded application products, embedded chips such as DSP (digital signal processing) chips, ARM (Advanced RISC Machines, Advanced Reduced Instruction Set Processor) chips, SOC (system-on-chip), etc., are used in many different industries . For example, industries such as multimedia, wireless communications, network terminals, medical education, and even the latest artificial intelligence and deep learning. Faced with different application scenarios, it is necessary to design chips that meet different needs.
芯片的开发通常要借助于多个开发模块来实现。以DSP芯片为例,至少需要借助于软件仿真模块、RTL代码集成模块和EDA验证模块来分别实现软件仿真、RTL代码集成、EDA验证等。The development of the chip is usually realized by means of multiple development modules. Taking the DSP chip as an example, at least the software simulation module, the RTL code integration module and the EDA verification module are needed to implement software simulation, RTL code integration, EDA verification, etc., respectively.
而开发过程中,一旦需求发生变更,芯片的规格参数需要及时修改,在所有的开发模块上都需要做出一致的修改,通常需要人工一一地进行修改,导致芯片开发效率较低。In the development process, once the requirements change, the chip specifications need to be modified in time, and all development modules need to be modified consistently, which usually requires manual modifications one by one, resulting in low chip development efficiency.
发明内容Summary of the invention
本发明提供一种配置文件生成方法及装置、存储介质,可提升芯片开发效率。The invention provides a configuration file generation method, device and storage medium, which can improve the efficiency of chip development.
本发明实施例第一方面,提供一种配置文件生成方法,包括:The first aspect of the embodiments of the present invention provides a configuration file generation method, including:
获取与目标芯片相关的描述文件;Obtain description files related to the target chip;
依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。According to the description file, a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
本发明实施例第二方面,提供一种配置文件生成装置,包括:处理器和存储器;In a second aspect of the embodiments of the present invention, a configuration file generation device is provided, including: a processor and a memory;
所述存储器,用于存储程序代码;The memory is used to store program code;
所述处理器,用于调用所述程序代码,当程序代码被执行时,用于执行以下操作:The processor is used to call the program code, and when the program code is executed, it is used to perform the following operations:
获取与目标芯片相关的描述文件;Obtain description files related to the target chip;
依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。According to the description file, a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
本发明实施例第三方面,提供一种计算机可读存储介质,A third aspect of the embodiments of the present invention provides a computer-readable storage medium,
所述计算机可读存储介质上存储有计算机指令,所述计算机指令被执行时,实现前述实施例所述的配置文件生成方法。The computer-readable storage medium stores computer instructions, and when the computer instructions are executed, the configuration file generation method described in the foregoing embodiment is implemented.
基于上述技术方案,本发明实施例中,在开发目标芯片时,只需获取与目标芯片相关的描述文件,依据获取的描述文件即可统一生成多个芯片开发模块的配置文件,这些芯片开发模块可以基于配置文件来对目标芯片进行开发,无论开发过程中需求如何变更,都可快速得到满足需求的配置文件,无需人工一一地修改各个芯片开发模块的配置文件,提升了芯片开发效率。Based on the above technical solution, in the embodiment of the present invention, when developing the target chip, only the description file related to the target chip needs to be obtained, and the configuration files of multiple chip development modules can be uniformly generated according to the obtained description file. These chip development modules The target chip can be developed based on the configuration file. No matter how the requirements change during the development process, the configuration file that meets the demand can be quickly obtained, without the need to manually modify the configuration files of each chip development module, which improves the efficiency of chip development.
附图说明Description of the drawings
为了更加清楚地说明本发明实施例中的技术方案,下面将对本发明实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明中记载的一些实施例,对于本领域普通技术人员来讲,还可以根据本发明实施例的这些附图获得其它的附图。In order to more clearly describe the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings needed in the embodiments of the present invention. Obviously, the drawings in the following description are only some implementations recorded in the present invention. For example, for those of ordinary skill in the art, other drawings can be obtained from these drawings of the embodiments of the present invention.
图1是本发明一实施例的配置文件生成方法的流程示意图;FIG. 1 is a schematic flowchart of a configuration file generation method according to an embodiment of the present invention;
图2是本发明一实施例的DSP芯片开发过程的示意图;Figure 2 is a schematic diagram of a DSP chip development process according to an embodiment of the present invention;
图3是本发明一实施例的图1中步骤S200的流程示意图;FIG. 3 is a schematic flowchart of step S200 in FIG. 1 according to an embodiment of the present invention;
图4是本发明一实施例的通过执行步骤S200生成配置文件的示意图;4 is a schematic diagram of generating a configuration file by executing step S200 according to an embodiment of the present invention;
图5是本发明一实施例的描述文件的示意图;Figure 5 is a schematic diagram of a description file of an embodiment of the present invention;
图6是本发明一实施例的配置文件生成装置的结构框图。Fig. 6 is a structural block diagram of an apparatus for generating a configuration file according to an embodiment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。另外,在不冲突的情况下,下述的实施例及实施例中的特征可以相互组合。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention. In addition, if there is no conflict, the following embodiments and the features in the embodiments can be combined with each other.
本发明使用的术语仅仅是出于描述特定实施例的目的,而非限制本发明。本发明和权利要求书所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式,除非上下文清楚地表示其它含义。应当理解的是,本文中使用的术语“和/或”是指包含一个或多个相关联的列出项目的任何或所有可能组合。The terms used in the present invention are only for the purpose of describing specific embodiments, rather than limiting the present invention. The singular forms of "a", "said" and "the" used in the present invention and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should be understood that the term "and/or" as used herein refers to any or all possible combinations of one or more associated listed items.
尽管在本发明可能采用术语第一、第二、第三等来描述各种信息,但这些信息不应限于这些术语。这些术语用来将同一类型的信息彼此区分开。例如,在不脱离本发明范围的情况下,第一信息也可以被称为第二信息,类似地,第二信息也可以被称为第一信息。取决于语境,此外,所使用的词语“如果”可以被解释成为“在……时”,或者,“当……时”,或者,“响应于确定”。Although the terms first, second, third, etc. may be used in the present invention to describe various information, the information should not be limited to these terms. These terms are used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, the first information may also be referred to as second information, and similarly, the second information may also be referred to as first information. Depending on the context, in addition, the word "if" used can be interpreted as "when", or "when", or "in response to certainty."
下面对本发明实施例的配置文件生成方法进行详细描述,但不应以此作为限制。The configuration file generation method of the embodiment of the present invention will be described in detail below, but this should not be used as a limitation.
在一个实施例中,参看图1,一种配置文件生成方法,可以包括以下步骤:In an embodiment, referring to FIG. 1, a configuration file generation method may include the following steps:
S100:获取与目标芯片相关的描述文件;S100: Obtain a description file related to the target chip;
S200:依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。S200: Generating configuration files of multiple chip development modules uniformly according to the description file, where the configuration files are used to enable the multiple chip development modules to develop the target chip.
本发明实施例的配置文件生成方法可以应用在电子设备,更具体可以是电子设备的处理器。该电子设备比如可以是计算机设备等,当然,具体类型 不限,只要具备一定的处理能力即可。The configuration file generation method of the embodiment of the present invention may be applied to an electronic device, and more specifically may be a processor of the electronic device. The electronic device may be, for example, a computer device. Of course, the specific type is not limited as long as it has a certain processing capability.
步骤S100中,获取与目标芯片相关的描述文件。In step S100, a description file related to the target chip is obtained.
与目标芯片相关的描述文件可以是本地预先设置好的,只需要从本地读取描述文件即可。或者,与目标芯片相关的描述文件也可以从外部设备中获取,或者基于开发人员的输入信息而生成。描述文件的具体获取方式不限,只要能够获取到与目标芯片相关的描述文件即可。The description file related to the target chip can be preset locally, and only the description file needs to be read locally. Alternatively, the description file related to the target chip can also be obtained from an external device, or generated based on the input information of the developer. The specific method of obtaining the description file is not limited, as long as the description file related to the target chip can be obtained.
获取的描述文件可以为一个或者多个。在获取的描述文件为一个时,通过该一个描述文件完整地描述目标芯片。在获取的描述文件为多个时,通过获取的描述文件协同描述目标芯片。There can be one or more description files. When there is one description file, the target chip is completely described through the one description file. When there are multiple description files, the target chip is described cooperatively through the obtained description files.
描述文件,具体可以描述目标芯片内的核配置情况,核内组件的配置情况,组件的组成情况等等。只要根据获取的描述文件,能够明确目标芯片的整体配置即可。The description file can specifically describe the configuration of the core in the target chip, the configuration of the components in the core, the composition of the components, and so on. As long as the overall configuration of the target chip can be clarified according to the obtained description file.
步骤S200中,依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。In step S200, a configuration file of multiple chip development modules is uniformly generated according to the description file, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
目标芯片可以为任何一种数字电路芯片,更具体可以为DSP芯片、ARM芯片、或SOC芯片等处理器芯片。当然,具体芯片类型不限,只要是其需要经历多个开发流程,期间要用到多个芯片开发模块即可。The target chip can be any kind of digital circuit chip, and more specifically can be a processor chip such as a DSP chip, an ARM chip, or a SOC chip. Of course, the specific chip type is not limited, as long as it needs to go through multiple development processes, during which multiple chip development modules are used.
以DSP芯片为例,参看图2,DSP芯片的开发过程可以包括:软件仿真阶段、RTL顶层设计阶段,同时还包括头文件设计阶段。Taking a DSP chip as an example, referring to Figure 2, the development process of a DSP chip can include: a software simulation stage, an RTL top-level design stage, and a header file design stage.
在软件仿真阶段,需要用到软件仿真模块,如图2示出的simulator,更具体可以是Cmodel,将相应配置文件应用到软件仿真模块上后,可模拟出一个DSP芯片软件仿真器,在上面可以进行DSP芯片的功能仿真。In the software simulation stage, a software simulation module is needed, such as the simulator shown in Figure 2, or more specifically, a Cmodel. After the corresponding configuration file is applied to the software simulation module, a DSP chip software simulator can be simulated. Can carry on the function simulation of DSP chip.
在RTL顶层设计阶段,需要用到RTL(寄存器转换级电路,Register Transfer Level)代码集成模块,如图2示出的RTL Integrate,也可以称RTL代码综合模块;以及EDA验证模块,如图2示出的EDA Verification。In the RTL top-level design stage, RTL (Register Transfer Level) code integration module is needed, as shown in Figure 2, RTL Integrate, which can also be called RTL code integration module; and EDA verification module, as shown in Figure 2. EDA Verification issued.
由于芯片的电路结构一般都比较复杂,所以用硬件语言编写各个功能模 块对应的代码,这些代码即是RTL代码集成模块和EDA验证模块的配置文件。将这些代码在RTL代码集成模块上进行RTL集成,可以呈现芯片的一个完整电路架构。将这些代码应用到EDA验证模块上,可以模拟出一个DSP芯片硬件仿真器,在上面可以进行DSP芯片的性能仿真。Since the circuit structure of the chip is generally more complicated, the code corresponding to each functional module is written in hardware language. These codes are the configuration files of the RTL code integration module and the EDA verification module. The RTL integration of these codes on the RTL code integration module can present a complete circuit architecture of the chip. Applying these codes to the EDA verification module, a DSP chip hardware emulator can be simulated, on which the performance of the DSP chip can be simulated.
头文件设计阶段,可以包括ASM头文件设计阶段,进行如图2示出的ASM Heaher file设计;以及C头文件设计阶段,进行如图2示出的C Heaher file设计。ASM头文件和C头文件是各个芯片开发模块面向用户所需的头文件。The header file design stage may include the ASM header file design stage, where the ASM Heaher file design shown in Figure 2 is performed; and the C header file design stage, the C Heaher file design shown in Figure 2 is performed. The ASM header file and the C header file are the header files required by each chip development module for users.
不同芯片开发模块支持的文件可能是不同的,可以是内容表示形式、文件的格式、文件的语言等方面的不同。但是,各芯片开发模块的配置文件中,具体的配置内容基本上是相同的。The files supported by different chip development modules may be different, such as content representation, file format, and file language. However, in the configuration files of each chip development module, the specific configuration content is basically the same.
因而,可以依据所述描述文件统一生成多个芯片开发模块的配置文件,这几个芯片开发模块可以基于相应配置文件进行目标芯片的开发。配置文件的生成方式可以包括:代码的转换、代码的组装等,具体生成方式不限,只要能够根据描述文件得到所需的配置文件即可。Therefore, configuration files of multiple chip development modules can be uniformly generated according to the description file, and these chip development modules can develop the target chip based on the corresponding configuration files. The generation method of the configuration file may include: code conversion, code assembly, etc. The specific generation method is not limited, as long as the required configuration file can be obtained according to the description file.
假设在开发一个芯片时,需求反复在变更,按照现有的方式,由人工编写出各个芯片开发模块的配置文件之后,每次需求变更时,为保证所有芯片开发模块配置的一致性,需要人工一一地修改各个芯片开发模块的配置文件,整个开发过程效率过低。Assuming that when developing a chip, the requirements are repeatedly changing. According to the existing method, after manually writing the configuration files of each chip development module, each time the requirements are changed, in order to ensure the consistency of the configuration of all chip development modules, manual labor is required. Modifying the configuration files of each chip development module one by one, the efficiency of the entire development process is too low.
本发明实施例中,在开发目标芯片时,只需获取与目标芯片相关的描述文件,依据获取的描述文件即可统一生成多个芯片开发模块的配置文件,这些芯片开发模块可以基于配置文件来对目标芯片进行开发,无论开发过程中需求如何变更,都可快速得到满足需求的配置文件,无需人工一一地修改各个芯片开发模块的配置文件,提升了芯片开发效率。In the embodiment of the present invention, when developing the target chip, only the description file related to the target chip needs to be obtained, and the configuration files of multiple chip development modules can be uniformly generated based on the obtained description files. These chip development modules can be based on the configuration files. To develop the target chip, no matter how the requirements change during the development process, the configuration file that meets the demand can be quickly obtained, without the need to manually modify the configuration files of each chip development module, which improves the efficiency of chip development.
在一个实施例中,In one embodiment,
本地可以预先设置有描述文件集,描述文件集中有多个描述文件。描述文件集可以包括:至少一个核描述文件,每一核描述文件包含单核内的组件信息;以及多个组件描述文件,每一组件描述文件包含单个组件的组成信息。A description file set can be preset locally, and there are multiple description files in the description file set. The description file set may include: at least one core description file, each core description file containing component information in a single core; and multiple component description files, each component description file containing composition information of a single component.
其中,每一核描述文件中的组件信息可以包括各组件的配置信息、组件标识以及连接关系;每一组件描述文件中的组成信息可以包括各组成部件的配置信息、及各组成部件的连接关系。当然,此处仅是这些描述文件中包含的信息的举例,并不作为限制。Among them, the component information in each core description file may include the configuration information, component identification and connection relationship of each component; the composition information in each component description file may include the configuration information of each component and the connection relationship of each component . Of course, this is only an example of the information contained in these description files, not as a limitation.
可选的,获取与目标芯片相关的描述文件,具体可以包括以下步骤:Optionally, obtaining a description file related to the target chip may specifically include the following steps:
获取外部输入的目标芯片的芯片描述文件,芯片描述文件至少包含目标芯片内各个核的核标识;Obtain the externally input chip description file of the target chip, the chip description file at least contains the core identification of each core in the target chip;
根据芯片描述文件中的核标识,从描述文件集中选择与各核标识对应的核描述文件;According to the core identification in the chip description file, select the core description file corresponding to each core identification from the description file set;
根据选择的每一核描述文件中的组件标识,从描述文件集中选择与各组件标识对应的组件描述文件;According to the component identification in each selected core description file, select the component description file corresponding to each component identification from the description file set;
将获取的芯片描述文件、及选择的核描述文件与组件描述文件作为与目标芯片相关的描述文件。The obtained chip description file and the selected core description file and component description file are used as description files related to the target chip.
上述获取描述文件的方式只是举例,当然还可以有其他方式,比如,从描述文件集中选择核描述文件与组件描述文件时,可以在外部输入指令的指示下进行选择。The above method of obtaining the description file is just an example. Of course, there are other methods. For example, when selecting the core description file and the component description file from the description file set, the selection can be made under the instruction of an external input instruction.
在一个实施例中,参看图3,在步骤S200中,依据所述描述文件统一生成多个芯片开发模块的配置文件,可以包括以下步骤:In an embodiment, referring to FIG. 3, in step S200, generating configuration files of multiple chip development modules according to the description file may include the following steps:
S201:依据所述描述文件生成所述目标芯片的规格描述文件;S201: Generate a specification description file of the target chip according to the description file;
S202:依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件。S202: uniformly determine configuration files of multiple chip development modules of the target chip according to the specification description file.
依据获取的描述文件可以生成一个规格描述文件,该规格描述文件可以用于描述目标芯片的规格。以目标芯片为DSP为例,该规格描述文件通过对描述文件进行载入和解析得到,其可以作为一个完整的DSP模型(优选为dsp.hsd文件),可实现DSP芯片开发模块的整体配置。A specification description file can be generated based on the obtained description file, and the specification description file can be used to describe the specifications of the target chip. Taking the target chip as DSP as an example, the specification description file is obtained by loading and parsing the description file. It can be used as a complete DSP model (preferably the dsp.hsd file) to realize the overall configuration of the DSP chip development module.
具体的,获取的描述文件格式可以均为xml格式文件。可以预先编写好支持xml格式文件并且能够实现步骤S200的程序,比如,实现步骤S200的 程序为通过python语言的configurator,调用该configurator可以完成对xml格式文件的载入与解析,以及根据解析出的xml格式文件中的信息来生成规格描述文件。Specifically, the obtained description file format may all be an xml format file. A program that supports xml format files and can implement step S200 can be pre-written. For example, the program that implements step S200 is a configurator through the python language. Calling the configurator can complete the loading and parsing of the xml format file, as well as the parsed The information in the xml format file is used to generate the specification description file.
在确定规格描述文件的情况下,可以依据规格描述文件确定所述目标芯片的多个芯片开发模块的配置文件,每个配置文件中与规格相关的信息内容都是源于规格描述文件,所以这些内容基本上是相同的。In the case of determining the specification description file, the configuration files of multiple chip development modules of the target chip can be determined according to the specification description file. The information content related to the specifications in each configuration file is derived from the specification description file. The content is basically the same.
获取的描述文件可以是多个描述文件,更换其中的至少一个描述文件,就可以生成不同的规格描述文件。所以,在开发过程中,当需求变更时,找到与需求匹配的描述文件,就可以生成相应的规格描述文件,依据该规格描述文件可确定满足需求的配置文件。The acquired description files can be multiple description files, and different specification description files can be generated by replacing at least one of the description files. Therefore, in the development process, when the requirements change, a description file that matches the requirement can be found, and the corresponding specification description file can be generated. According to the specification description file, the configuration file that meets the requirement can be determined.
因而,本发明实施例可以支持不同规格芯片的配置,通用性更强。Therefore, the embodiment of the present invention can support the configuration of chips of different specifications, and is more versatile.
在一个实施例中,所述描述文件包括:In one embodiment, the description file includes:
目标芯片的芯片描述文件,所述芯片描述文件包含所述目标芯片内的核信息;A chip description file of the target chip, where the chip description file contains core information in the target chip;
目标芯片内每一核的核描述文件,每一核描述文件包含相应核内的组件信息;The core description file of each core in the target chip, and each core description file contains the component information in the corresponding core;
以及,目标芯片内每一核内的每一组件的组件描述文件,每一组件描述文件包含相应组件的组成信息。And, the component description file of each component in each core in the target chip, and each component description file contains the composition information of the corresponding component.
目标芯片的芯片描述文件、核描述文件、组件描述文件可以构成一定的层级结构。比如,芯片描述文件为第一层级文件,包含了目标芯片所需核的核信息,核信息可以包括核标识等;核描述文件为第二层级文件,每个核描述文件都与一个核标识对应,包含了相应核所需组件的组件信息,组件信息可以包括组件标识、组件名称、组件之间的连接关系、组件对外的连接关系等;组件描述文件为第三层级文件,每个组件描述文件都与一个组件标识对应,包含了相应组件所需组成部件的组成信息,组成信息可以包含组成部件名称、组成部件的连接关系、组成部件对外的连接关系。The chip description file, core description file, and component description file of the target chip can form a certain hierarchical structure. For example, the chip description file is the first-level file, which contains the core information required by the target chip. The core information can include core identification, etc.; the core description file is the second-level file, and each core description file corresponds to a core identification. , Contains the component information of the components required by the corresponding core. The component information can include component identification, component name, connection relationship between components, external connection relationship between components, etc.; the component description file is a third-level file, and each component description file They all correspond to a component identifier and contain the composition information of the component parts required by the corresponding component. The composition information may include the component component name, the connection relationship of the component component, and the external connection relationship of the component component.
当然,芯片描述文件、核描述文件、组件描述文件中还可以包含其他信 息。比如,芯片描述文件中还可以包含DDR(双倍速率同步动态随机存储器)大小。DDR可以作为外部存储单元,用于存储软件仿真时的数据、指令等。Of course, the chip description file, core description file, and component description file may also contain other information. For example, the chip description file may also include the size of DDR (Double Rate Synchronous Dynamic Random Access Memory). DDR can be used as an external storage unit to store data and instructions during software simulation.
可选的,各文件的文件格式均采用xml(可扩展标记语言)格式,即文件是用xml语言编写的。当然并不限于此,文件还可以用其他脚本语言来编写。Optionally, the file format of each file adopts xml (extensible markup language) format, that is, the file is written in xml language. Of course, it is not limited to this, and the file can also be written in other scripting languages.
进一步的,实现本发明实施例方法的程序可以用python语言来编写,如此,可以保证程序的可移植性。比如,将实现步骤S200的程序称为configurator,configurator可以用python语言来编写。当然,实现本发明实施例方法的程序也可以用其他语言来编写。Further, the program that implements the method of the embodiment of the present invention can be written in the python language, so that the portability of the program can be guaranteed. For example, the program that implements step S200 is called a configurator, and the configurator can be written in python language. Of course, the program for implementing the method of the embodiment of the present invention can also be written in other languages.
以目标芯片为DSP芯片为例,结合图1和图4来看,将dsp.xml、cell0.xml、cell1.xml、Component_0.xml、Component_1.xml、Component_2.xml、Component_3.xml输入到configurator中后,可以统一生成simulator软件仿真所需的Dsp_0.hsd、EDA Verification硬件仿真与RTL Integrate代码综合所需的Dsp_0_top.v、Asm header file设计所需的头文件asm_header.h、EDA Verification仿真所需的头文件crf_lst.vh、以及C header file设计所需的头文件c_headers.h。Taking the target chip as a DSP chip as an example, combining Figure 1 and Figure 4, input dsp.xml, cell0.xml, cell1.xml, Component_0.xml, Component_1.xml, Component_2.xml, and Component_3.xml into the configurator Then, the Dsp_0.hsd required by the simulator software simulation, the Dsp_0_top.v and the Asm header file required for the synthesis of the EDA Verification hardware simulation and RTL Integrate code can be generated uniformly asm_header.h, the header files required for the EDA Verification simulation. The header file crf_lst.vh, and the header file c_headers.h required for C header file design.
其中,继续参看图4,dsp.xml为芯片描述文件,dsp.xml中包含cell0和cell1两个核的核信息,说明该DSP芯片中需要有两个核,所以,输入至configurator的描述文件还包括cell0.xml与cell1.xml。cell0.xml中包含Component_0和Component_1两个组件的组件信息,说明核cell0中需要有这两个组件,所以,输入至configurator的描述文件还包括Component_0.xml与Component_1.xml。cell1.xml中包含Component_2和Component_3两个组件的组件信息,说明核cell1中需要有这两个组件,所以,输入至configurator的描述文件还包括Component_2.xml与Component_3.xml。Among them, continue to refer to Figure 4, dsp.xml is the chip description file, dsp.xml contains the core information of the cell0 and cell1 cores, indicating that the DSP chip needs two cores, so the description file input to the configurator is also Including cell0.xml and cell1.xml. Cell0.xml contains the component information of Component_0 and Component_1, indicating that these two components are required in core cell0. Therefore, the description file input to the configurator also includes Component_0.xml and Component_1.xml. Cell1.xml contains the component information of Component_2 and Component_3, indicating that these two components are required in core cell1. Therefore, the description file input to the configurator also includes Component_2.xml and Component_3.xml.
当然,每个核中包含的具体组件不限,比如,每个核中包含以下至少一种组件:控制单元、向量执行单元(用于执行向量运算)、存储单元、数据传输总线,加速器。Of course, the specific components included in each core are not limited. For example, each core includes at least one of the following components: a control unit, a vector execution unit (for performing vector operations), a storage unit, a data transmission bus, and an accelerator.
每个组件中可以根据需要配置相应的组成部件,以控制单元这一组件为例,可以为该组件配置数据接口、控制寄存器组、控制寄存器、该组件寄存 器的比特域、外部接口、该组件的存储子单元等。Each component can be configured with corresponding components as needed. Taking the control unit as an example, the component can be configured with data interface, control register group, control register, bit field of the component register, external interface, and Storage sub-units, etc.
更具体的,参看图5,dsp.xml为芯片描述文件,作为第一层级文件,其中包含cell0和cell1两个核的核信息,对应于两个核描述文件,分别为cell0.xml和cell1.xml;cell0.xml和cell1.xml作为第二层级文件,包含各个组件的组件信息,以cell0.xml为例,可以包含精简指令集处理器risc、存储单元vmem、用于执行乘法与加法的向量执行单元veu、用于执行移位运算的向量执行单元valu、用于执行浮点运算的向量执行单元vfpu的组件信息;图5仅示出了cell0.xml对应的第三层级文件,包括risc.xml、vmem.xml、veu.xml、valu.xml、vfpu.xml,分别用来描述risc、vmem、veu、valu、vfpu的组成信息。More specifically, referring to Figure 5, dsp.xml is the chip description file, as the first level file, which contains the core information of the two cores cell0 and cell1, corresponding to the two core description files, cell0.xml and cell1. xml; cell0.xml and cell1.xml, as the second-level files, contain the component information of each component. Taking cell0.xml as an example, it can include a simplified instruction set processor risc, a storage unit vmem, and vectors for performing multiplication and addition Component information of the execution unit veu, the vector execution unit valu for performing shift operations, and the vector execution unit vfpu for performing floating-point operations; Figure 5 only shows the third-level file corresponding to cell0.xml, including risc. xml, vmem.xml, veu.xml, valu.xml, vfpu.xml are used to describe the composition information of risc, vmem, veu, valu, and vfpu, respectively.
可以理解,上述描述文件的具体内容仅是为了便于理解而举得例子,并不应作为限制。It can be understood that the specific content of the above description file is merely an example for ease of understanding and should not be taken as a limitation.
在一个实施例中,步骤S201中,依据所述描述文件生成所述目标芯片的规格描述文件,包括:In one embodiment, in step S201, generating the specification description file of the target chip according to the description file includes:
S2011:根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件;S2011: Generate a core assembly file according to at least one of the core description files and corresponding component description files;
S2012:根据所述芯片描述文件和各核组装文件生成所述规格描述文件。S2012: Generate the specification description file according to the chip description file and each core assembly file.
本实施例中,可以先将描述文件中的核描述文件与对应的组件描述文件进行组装,以生成每个核描述文件对应的核组装文件;再将芯片描述文件与各核组装文件进行组装,以生成目标芯片的规格描述文件。In this embodiment, the core description file in the description file and the corresponding component description file can be assembled first to generate a core assembly file corresponding to each core description file; then the chip description file and each core assembly file are assembled, To generate the specification description file of the target chip.
参看图5,先将risc.xml、vmem.xml、veu.xml、valu.xml、vfpu.xml组装到cell0.xml,cell1.xml也是同理,再将组装得到的cell0.xml和cell1.xml组装到dsp.xml中,得到一个包含目标芯片完整规格信息的规格描述文件。Refer to Figure 5, first assemble risc.xml, vmem.xml, veu.xml, valu.xml, and vfpu.xml into cell0.xml. The same is true for cell1.xml, and then the assembled cell0.xml and cell1.xml Assemble into dsp.xml to obtain a specification description file containing complete specification information of the target chip.
当然,本实施例只是生成规格描述文件的一种举例,实际当然还可以有其他方式。比如,先将芯片描述文件与核描述文件进行组装得到芯片组装文件,再将各个核描述文件对应的组件描述文件组装到芯片组装文件的对应位置处,得到规格描述文件。Of course, this embodiment is only an example of generating a specification description file, and of course, there may be other ways in practice. For example, first assemble the chip description file and the core description file to obtain the chip assembly file, and then assemble the component description file corresponding to each core description file to the corresponding position of the chip assembly file to obtain the specification description file.
在一个实施例中,In one embodiment,
每一核描述文件包括对应的核标识;Each core description file includes the corresponding core identification;
步骤S2011中,根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件,包括:In step S2011, generating a core assembly file according to at least one of the core description file and the corresponding component description file includes:
S20111:根据每一个核描述文件对应的核标识,检查当前是否存在该核标识对应的核组装文件;S20111: According to the core identification corresponding to each core description file, check whether the core assembly file corresponding to the core identification currently exists;
S20112:如果否,从所有组件描述文件中获取该核描述文件对应的组件描述文件,根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件。S20112: If not, obtain the component description file corresponding to the core description file from all component description files, and generate the core assembly file of the core description file according to the obtained component description file and the core description file.
每一核的核描述文件都有该核的核标识(核标识可以作为核描述文件的名称,和/或,记录在核描述文件中),换言之,每一核描述文件包括对应的核标识。核组装文件是根据核描述文件和对应的组件描述文件的,所以核组装文件也会包含核描述文件中的核标识,即核组装文件也与核标识对应。The core description file of each core has the core identification of the core (the core identification can be used as the name of the core description file, and/or recorded in the core description file), in other words, each core description file includes the corresponding core identification. The core assembly file is based on the core description file and the corresponding component description file, so the core assembly file will also contain the core identification in the core description file, that is, the core assembly file also corresponds to the core identification.
可以针对每一个核描述文件包含的核标识,检查当前是否存在该核标识对应的核组装文件。可以预先配置有用于存储核组装文件的存储空间,并且每次生成一个核组装文件就存储到该存储空间中,如此,在后续需要组装时,就可以从存储空间中查找是否存在需要的核组装文件。It is possible to check whether a core assembly file corresponding to the core identification currently exists for the core identification contained in each core description file. It can be pre-configured with storage space for storing nuclear assembly files, and each time a nuclear assembly file is generated, it is stored in the storage space. In this way, when subsequent assembly is required, the storage space can be used to find whether there is a required nuclear assembly file.
如果当前不存在该核标识对应的核组装文件,说明之前未组装过该核标识对应的核组装文件,需要新生成该核标识对应的核组装文件。由于所有组件描述文件是所有核包含的组件的组件描述文件,所以需要从所有组件描述文件中获取该核描述文件对应的组件描述文件,再根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件。If the nuclear assembly file corresponding to the nuclear identification does not currently exist, it means that the nuclear assembly file corresponding to the nuclear identification has not been assembled before, and the nuclear assembly file corresponding to the nuclear identification needs to be newly generated. Since all component description files are the component description files of the components contained in all cores, it is necessary to obtain the component description file corresponding to the core description file from all the component description files, and then generate the core according to the obtained component description file and the core description file. The nuclear assembly file describing the file.
在一个实施例中,该方法进一步包括:In one embodiment, the method further includes:
S20113:如果当前存在该核标识对应的核组装文件,将所述核组装文件确定为该核描述文件的核组装文件。S20113: If the core assembly file corresponding to the core identifier currently exists, determine the core assembly file as the core assembly file of the core description file.
如果当前存在该核标识对应的核组装文件,说明之前组装过该核标识对应的核组装文件,直接拿来用即可,无需重新生成。换言之,如果在存储空间中查找到该核标识对应的核组装文件,那么将该查找到的组装文件确定为 该核描述文件的核组装文件。If the nuclear assembly file corresponding to the nuclear identification currently exists, it means that the nuclear assembly file corresponding to the nuclear identification has been assembled before and can be used directly without regenerating it. In other words, if the core assembly file corresponding to the core identifier is found in the storage space, then the found assembly file is determined as the core assembly file of the core description file.
本实施例中,在需要核组装文件时,可以先检查一下当前是否已经存在需要的核组装文件,存在时可以直接获取,不存在时再进行生成,可以省去重新生成核组装文件的处理时间,加快处理速度,提升规格描述文件的生成效率。In this embodiment, when a nuclear assembly file is needed, you can first check whether the required nuclear assembly file already exists. If it exists, it can be obtained directly, and if it does not exist, it can be generated again, which can save the processing time of regenerating the nuclear assembly file. , Speed up the processing speed, improve the efficiency of generating specification description files.
在一个实施例中,In one embodiment,
所述组件信息至少包含组件标识;The component information includes at least a component identification;
步骤S20112中,从所有组件描述文件中获取该核描述文件所需的组件描述文件,包括:In step S20112, obtain component description files required by the core description file from all component description files, including:
S201121:根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件。S201121: According to the component identifier in the core description file, obtain the component description file corresponding to the core description file from all the component description files.
核描述文件中的组件信息可以包含组件标识,当然,组件信息还可以包括其他信息。The component information in the core description file may include the component identification. Of course, the component information may also include other information.
一个核描述文件中可以包含多个组件信息,即包含多个组件标识。根据核描述文件中的这些组件标识,可以从组件描述文件中找到该核描述文件对应的组件描述文件。A core description file can contain multiple component information, that is, multiple component identifiers. According to the component identifiers in the core description file, the component description file corresponding to the core description file can be found from the component description file.
一个组件的组件标识与组件描述文件之间可以建立有关联关系,因而可以根据组件标识找到与组件标识具有关联关系的组件描述文件,如此,可以找到该核描述文件对应的所有组件描述文件。An association relationship can be established between the component identifier of a component and the component description file, and thus the component description file that has an association relationship with the component identifier can be found according to the component identifier. In this way, all component description files corresponding to the core description file can be found.
比如,核描述文件cell0.xml中包含的组件标识有risc、vmem、veu、valu、vfpu,那么,根据这些组件标识,可以找到risc.xml、vmem.xml、veu.xml、valu.xml、vfpu.xml这些组件描述文件。For example, the component identifiers contained in the core description file cell0.xml are risc, vmem, veu, valu, and vfpu. Then, according to these component identifiers, risc.xml, vmem.xml, veu.xml, valu.xml, vfpu can be found .xml these component description files.
本实施例中,根据组件标识获取所需的组件描述文件,获取方式更简洁快速。In this embodiment, the required component description file is obtained according to the component identification, and the obtaining method is simpler and faster.
在一个实施例中,In one embodiment,
每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
步骤S201121中:根据该核描述文件中的组件标识,从所有组件描述文 件中获取该核描述文件对应的组件描述文件,包括:Step S201121: According to the component identification in the core description file, obtain the component description file corresponding to the core description file from all the component description files, including:
根据该核描述文件中的每一组件标识,从所有组件描述文件中选择出该组件标识对应的组件描述文件,将选择出的组件描述文件确定为该核描述文件对应的组件描述文件。According to each component identifier in the core description file, the component description file corresponding to the component identifier is selected from all component description files, and the selected component description file is determined as the component description file corresponding to the core description file.
每一组件的组件描述文件都有该组件的组件标识(组件标识可以作为组件描述文件的名称,和/或,记录在组件描述文件中),换言之,每一组件描述文件包括对应的组件标识。The component description file of each component has the component identification of the component (the component identification can be used as the name of the component description file, and/or recorded in the component description file), in other words, each component description file includes the corresponding component identification.
如此,可以更方便地根据组件标识获取组件描述文件。只要针对该核描述文件中的每一组件标识,找到包含该组件标识的组件描述文件即可,找到的组件描述文件即为该核描述文件对应的组件描述文件。In this way, the component description file can be obtained more conveniently based on the component identification. As long as for each component identifier in the core description file, find the component description file containing the component identifier, and the found component description file is the component description file corresponding to the core description file.
在一个实施例中,In one embodiment,
所述组件信息至少包含组件标识;The component information includes at least a component identification;
每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
步骤S20112中,根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件,包括:In step S20112, generating a core assembly file of the core description file according to the obtained component description file and the core description file, including:
S201122:依据该核描述文件中的组件标识确定各组件标识对应的组件描述文件;S201122: Determine the component description file corresponding to each component identifier according to the component identifier in the core description file;
S201123:将所述各组件标识对应的组件描述文件组装到该核描述文件中,得到该核描述文件的核组装文件。S201123: Assemble the component description file corresponding to each component identifier into the core description file to obtain the core assembly file of the core description file.
每一组件的组件描述文件都有该组件的组件标识(组件标识可以作为组件描述文件的名称,和/或,记录在组件描述文件中),换言之,每一组件描述文件包括对应的组件标识。The component description file of each component has the component identification of the component (the component identification can be used as the name of the component description file, and/or recorded in the component description file), in other words, each component description file includes the corresponding component identification.
核描述文件中的组件信息可以包含组件标识,当然,组件信息还可以包括其他信息。The component information in the core description file may include the component identification. Of course, the component information may also include other information.
一个核描述文件中可以包含多个组件信息,即包含多个组件标识。根据核描述文件中的这些组件标识,可以确定各组件标识对应的组件描述文件;将各组件标识对应的组件描述文件组装到该核描述文件中,可以得到该核描 述文件的核组装文件。A core description file can contain multiple component information, that is, multiple component identifiers. According to the component identifiers in the core description file, the component description file corresponding to each component identifier can be determined; the component description file corresponding to each component identifier is assembled into the core description file to obtain the core assembly file of the core description file.
比如,在cell0.xml中包含的组件标识有risc、vmem、veu、valu、vfpu,那么,根据这些组件标识可以将risc.xml、vmem.xml、veu.xml、valu.xml、vfpu.xml组装到cell0.xml,risc.xml可以组装到cell0.xml中组件标识risc对应的位置处,vmem.xml可以组装到cell0.xml中组件标识vmem对应的位置处,veu.xml可以组装到cell0.xml中组件标识veu对应的位置处,其他以此类推,相似之处在此不再赘述。For example, the component identifiers contained in cell0.xml are risc, vmem, veu, valu, vfpu, then risc.xml, vmem.xml, veu.xml, valu.xml, vfpu.xml can be assembled according to these component identifiers To cell0.xml, risc.xml can be assembled to the position corresponding to the component identifier risc in cell0.xml, vmem.xml can be assembled to the position corresponding to the component identifier vmem in cell0.xml, and veu.xml can be assembled to cell0.xml The position corresponding to the middle component identifier veu, and so on, the similarities are not repeated here.
如此,可以完成核描述文件与对应的组件描述文件的组装,得到各核描述文件对应的核组装文件,核组装文件是完善了核中各组件的组件信息的文件。In this way, the assembly of the core description file and the corresponding component description file can be completed, and the core assembly file corresponding to each core description file can be obtained. The core assembly file is a file that completes the component information of each component in the core.
在一个实施例中,步骤S201123中,将所述各组件标识对应的组件描述文件组装到该核描述文件中,可以包括以下两种方式:In one embodiment, in step S201123, assembling the component description file corresponding to each component identifier into the core description file may include the following two methods:
A1:将该核描述文件中各组件标识所在的组件信息分别替换为所述各组件标识对应的组件描述文件中的内容;A1: Replace the component information where each component identifier is located in the core description file with the content in the component description file corresponding to each component identifier;
A2:将所述各组件标识对应的组件描述文件中的所有组成信息分别插入到该核描述文件中各组件标识所在的组件信息中。A2: Insert all the component information in the component description file corresponding to each component identifier into the component information where each component identifier in the core description file is located.
方式A1中,核描述文件中的组件信息无需保留,而是用各组件标识对应的组件描述文件中的内容替换,得到的核组装文件中包含各组件标识对应的组件描述文件中的内容。当然,核描述文件中的核标识以及其他一些必要信息未被替换掉。In method A1, the component information in the core description file does not need to be retained, but replaced with the content in the component description file corresponding to each component identifier, and the obtained core assembly file contains the content in the component description file corresponding to each component identifier. Of course, the core identification and other necessary information in the core description file have not been replaced.
本方式中,核描述文件中的组件信息可以是用来帮助开发者了解组件概况的信息,但不是最终规格描述文件所需的信息,所以只要采用替换手段即可。In this method, the component information in the core description file can be information used to help developers understand the component overview, but it is not the information required by the final specification description file, so it is sufficient to use alternative means.
比如,在cell0.xml中包含的组件标识有risc、vmem、veu、valu、vfpu,以risc为例,cell0.xml中risc所在的组件信息为一个代码片段,可以将该代码片段整体用risc.xml中的代码替换,从而cell0.xml对应的核组装文件中整合了risc.xml、vmem.xml、veu.xml、valu.xml、vfpu.xml中的代码。For example, the component identifiers contained in cell0.xml are risc, vmem, veu, valu, vfpu. Taking risc as an example, the component information where risc is located in cell0.xml is a code fragment, which can be used as risc as a whole. Replace the code in xml, so that the core assembly file corresponding to cell0.xml integrates the code in risc.xml, vmem.xml, veu.xml, valu.xml, and vfpu.xml.
方式A2中,核描述文件中的组件信息仍需保留,将各组件标识对应的组件描述文件中的所有组成信息分别插入到该核描述文件中各组件标识所在的组件信息中,组件描述文件中还可能包含其他信息比如组件标识,但是由于核描述文件中已经有组件标识,所以这部分重复信息无需插入到核描述文件中。In method A2, the component information in the core description file still needs to be retained. All the component information in the component description file corresponding to each component identifier is inserted into the component information where each component identifier in the core description file is located. The component description file It may also contain other information such as component identification, but because the component identification already exists in the core description file, this part of the repeated information does not need to be inserted into the core description file.
本方式中,核描述文件中的组件信息不仅可以帮助开发者了解组件概况,也是最终规格描述文件需要的信息,所以采用的是插入手段。In this method, the component information in the core description file can not only help the developer understand the component overview, but also the information required by the final specification description file, so the insertion method is used.
比如,在cell0.xml中包含的组件标识有risc、vmem、veu、valu、vfpu,以risc为例,cell0.xml中risc所在的组件信息为一个代码片段,risc.xml中的组成信息可以为多个代码片段,可以将risc.xml中的这多个代码片段插入到risc所在的代码片段中,具体插入位置可以在核描述文件中标记,从而cell0.xml对应的核组装文件中不仅整合了risc.xml、vmem.xml、veu.xml、valu.xml、vfpu.xml中的代码,也保留了cell0.xml原有的组件信息。For example, the component identifiers contained in cell0.xml are risc, vmem, veu, valu, vfpu. Taking risc as an example, the component information where risc is located in cell0.xml is a code fragment, and the composition information in risc.xml can be Multiple code snippets, the multiple code snippets in risc.xml can be inserted into the code snippet where risc is located. The specific insertion position can be marked in the core description file, so that the core assembly file corresponding to cell0.xml is not only integrated The codes in risc.xml, vmem.xml, veu.xml, valu.xml, and vfpu.xml also retain the original component information of cell0.xml.
当然,上述两种方式只是将组件描述文件组装到该核描述文件的优选方式,但并不应以此作为限制,其他可以实现组装的方式也适用。Of course, the above two methods are only preferred methods for assembling the component description file to the core description file, but should not be used as a limitation, and other methods that can be assembled are also applicable.
在一个实施例中,In one embodiment,
所述核信息至少包含核标识;The nuclear information includes at least a nuclear identifier;
每一核组装文件包括对应的核标识;Each core assembly file includes the corresponding core identification;
步骤S2012中,根据所述芯片描述文件和各核组装文件生成所述规格描述文件,包括:In step S2012, generating the specification description file according to the chip description file and each core assembly file includes:
S20121:依据所述芯片描述文件中的核标识确定各核标识对应的核组装文件;S20121: Determine the core assembly file corresponding to each core identification according to the core identification in the chip description file;
S20122:将所述各核标识对应的核组装文件组装到所述芯片描述文件中,得到所述规格描述文件。S20122: Assemble the core assembly file corresponding to each core identifier into the chip description file to obtain the specification description file.
芯片描述文件中的核信息可以包含核标识,当然,核信息还可以包括其他信息。比如,芯片描述文件可以包含有cell0和cell1这两个核标识,分别表示相应的核。The core information in the chip description file may include the core identification, of course, the core information may also include other information. For example, the chip description file may contain two core identifiers, cell0 and cell1, which respectively indicate the corresponding cores.
每一核的核描述文件都有该核的核标识(核标识可以作为核描述文件的名称,和/或,记录在核描述文件中),换言之,每一核描述文件包括对应的核标识。核组装文件是根据核描述文件和对应的组件描述文件的,所以核组装文件也会包含核描述文件中的核标识,即核组装文件也与核标识对应。The core description file of each core has the core identification of the core (the core identification can be used as the name of the core description file, and/or recorded in the core description file), in other words, each core description file includes the corresponding core identification. The core assembly file is based on the core description file and the corresponding component description file, so the core assembly file will also contain the core identification in the core description file, that is, the core assembly file also corresponds to the core identification.
一个芯片描述文件中包含至少一个核信息,即至少一个核标识。依据所述芯片描述文件中的核标识,可以确定各核标识对应的核组装文件;将所述各核标识对应的核组装文件组装到所述芯片描述文件中,可以得到所述规格描述文件。A chip description file contains at least one core information, that is, at least one core identifier. According to the core identification in the chip description file, the core assembly file corresponding to each core identification can be determined; the core assembly file corresponding to each core identification is assembled into the chip description file to obtain the specification description file.
如果芯片描述文件中只包含一个核标识,说明需要开发的目标芯片是单核芯片;如果芯片描述文件中包含两个核标识,说明需要开发的目标芯片是双核芯片,其他以此类推。If the chip description file contains only one core identification, it means that the target chip to be developed is a single-core chip; if the chip description file contains two core identifications, it means that the target chip to be developed is a dual-core chip, and so on.
比如,在dsp.xml中包含的核标识有cell0和cell1,那么根据这些核标识可以将cell0.xml和cell1.xml对应的核组装文件组装到dsp.xml中,cell0.xml可以组装到核标识cell0对应的位置处,cell1.xml可以组装到核标识cell1对应的位置处。For example, the core identifiers contained in dsp.xml are cell0 and cell1, then the core assembly files corresponding to cell0.xml and cell1.xml can be assembled into dsp.xml based on these core identifiers, and cell0.xml can be assembled into the core identification At the location corresponding to cell0, cell1.xml can be assembled to the location corresponding to the core identifier cell1.
如此,可以完成芯片描述文件和对应的核组装文件的组装,得到规格描述文件,规格描述文件是在完善了目标芯片内所有核中所有组件的所有组成信息的文件。In this way, the assembly of the chip description file and the corresponding core assembly file can be completed to obtain the specification description file. The specification description file is a file that completes all the composition information of all components in all cores in the target chip.
在一个实施例中,In one embodiment,
步骤S20122中,将所述各核标识对应的核组装文件组装到所述芯片描述文件中,可以包括以下两种方式:In step S20122, assembling the core assembly file corresponding to each core identifier into the chip description file may include the following two methods:
B1:将所述芯片描述文件中各核标识所在的核信息替换为所述各核标识对应的核组装文件中的内容;B1: Replace the core information where each core identifier is located in the chip description file with the content in the core assembly file corresponding to each core identifier;
B2:将所述各核标识对应的核组装文件中的所有组件信息插入到所述芯片描述文件中各核标识所在的核信息中。B2: Insert all component information in the core assembly file corresponding to each core identifier into the core information where each core identifier is located in the chip description file.
方式B1中,芯片描述文件中的核信息无需保留,而是用各核标识对应的核组装文件中的内容替换,得到的规格描述文件中包含各核标识对应的核组 装文件中的内容。当然,核组装文件中的核标识以及其他一些必要信息未被替换掉。In method B1, the core information in the chip description file does not need to be retained, but is replaced with the content in the core assembly file corresponding to each core identifier, and the obtained specification description file contains the content in the core assembly file corresponding to each core identifier. Of course, the nuclear identification and other necessary information in the nuclear assembly file have not been replaced.
本方式中,芯片描述文件中的核信息可以是用来帮助开发者了解组件概况的信息,但不是最终规格描述文件所需的信息,所以只要采用替换手段即可。In this method, the core information in the chip description file can be information used to help developers understand the component overview, but it is not the information required by the final specification description file, so only replacement means can be used.
比如,在dsp.xml中包含核标识有cell0和cell1,以cell0为例,dsp.xml中cell0所在的核信息为一个代码片段,可以将该代码片段整体用cell0.xml对应的核组装文件中的代码替换,从而得到的规格描述文件中整合了cell0.xml和cell1.xml中的代码。For example, dsp.xml contains the core identifiers cell0 and cell1. Taking cell0 as an example, the core information of cell0 in dsp.xml is a code fragment, which can be used in the core assembly file corresponding to cell0.xml. The code in cell0.xml and cell1.xml are integrated in the resulting specification description file.
方式B2中,芯片描述文件中的核信息仍需保留,将各核标识对应的核组装文件中的所有组件信息分别插入到芯片描述文件中各核标识所在的核信息中,核组装文件中还可能包含其他信息比如核标识等,但是由于芯片描述文件中已经有核标识,所以这部分重复信息无需插入到芯片描述文件中。In method B2, the core information in the chip description file still needs to be retained. All the component information in the core assembly file corresponding to each core identification is inserted into the core information where each core identification in the chip description file is located. It may contain other information such as core identification, but since the core identification already exists in the chip description file, this part of the repeated information does not need to be inserted into the chip description file.
本方式中,芯片描述文件中的核信息不仅可以帮助开发者了解核概况,也是最终规格描述文件需要的信息,所以采用的是插入手段。In this method, the core information in the chip description file can not only help developers understand the core overview, but also the information required by the final specification description file, so the insertion method is used.
比如,在dsp.xml中包含核标识有cell0和cell1,以cell0为例,dsp.xml中cell0所在的核信息为一个代码片段,cell0.xml对应的核组装文件中的组件信息可以为多个代码片段,可以将这多个代码片段插入到cell0所在的代码片段中,具体插入位置可以在芯片描述文件中标记,从而规格描述文件中不仅整合了所有核组装文件中的代码,也保留了dsp.xml原有的核信息、DDR大小等。For example, dsp.xml contains core identifiers cell0 and cell1. Taking cell0 as an example, the core information of cell0 in dsp.xml is a code fragment, and the component information in the core assembly file corresponding to cell0.xml can be multiple Code snippets, these multiple code snippets can be inserted into the code snippet where cell0 is located. The specific insertion position can be marked in the chip description file, so that the specification description file not only integrates the codes in all core assembly files, but also retains the dsp .xml original nuclear information, DDR size, etc.
当然,上述两种方式只是将核组装文件组装到芯片描述文件的优选方式,但并不应以此作为限制,其他可以实现组装的方式也适用。Of course, the above two methods are only preferred methods for assembling the core assembly file into the chip description file, but should not be used as a limitation, and other methods that can be assembled are also applicable.
在一个实施例中,所述目标芯片为DSP芯片。In one embodiment, the target chip is a DSP chip.
本发明实施例中,可以生成DSP芯片在开发阶段多个芯片开发模块所需的配置文件,从而在需要修改所需开发的DSP芯片的规格时,只需对描述文件进行修改得到的新的描述文件,依据新的描述文件就可以得到多个芯片开 发模块的配置文件,这些配置文件能够满足需求,无需再对多个芯片开发模块的配置文件一一地进行修改,提升了DSP芯片的开发效率。In the embodiment of the present invention, the configuration files required by multiple chip development modules of the DSP chip in the development phase can be generated, so that when the specifications of the DSP chip to be developed need to be modified, only the description file needs to be modified to obtain a new description File, based on the new description file, you can get the configuration files of multiple chip development modules. These configuration files can meet the needs. There is no need to modify the configuration files of multiple chip development modules one by one, which improves the development efficiency of DSP chips. .
当然,本发明实施例中的目标芯片也可以是其他类型的芯片,比如还可以是ARM芯片、SOC芯片等等,只要是在开发阶段中会经历多个芯片开发模块并且这些芯片开发模块都需要相应的配置文件即可。Of course, the target chip in the embodiment of the present invention can also be other types of chips, such as ARM chips, SOC chips, etc., as long as it will go through multiple chip development modules during the development phase and these chip development modules are required The corresponding configuration file is fine.
在一个实施例中,所述多个芯片开发模块至少包括:软件仿真模块、RTL代码集成模块和EDA验证模块;In an embodiment, the multiple chip development modules at least include: a software simulation module, an RTL code integration module, and an EDA verification module;
步骤S202中,依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件,包括:In step S202, uniformly determining the configuration files of multiple chip development modules of the target chip according to the specification description file includes:
S2021:依据所述规格描述文件确定软件仿真模块所需的软件配置文件;S2021: Determine the software configuration file required by the software simulation module according to the specification description file;
S2022:依据所述规格描述文件确定RTL代码集成模块和EDA验证模块所需的RTL顶层代码文件。S2022: Determine the RTL top-level code file required by the RTL code integration module and the EDA verification module according to the specification description file.
软件仿真模块可以用来实现DSP芯片的功能仿真。RTL代码集成模块可以用来实现RTL代码集成,EDA验证模块可以用来实现DSP芯片的性能仿真。The software simulation module can be used to realize the functional simulation of the DSP chip. The RTL code integration module can be used to implement RTL code integration, and the EDA verification module can be used to implement performance simulation of DSP chips.
由于模块的不同,所需的配置文件也会有不同。具体来说,软件仿真模块所需的软件配置文件、与RTL代码集成模块和EDA验证模块所需的RTL顶层代码文件是不同的。不同之处主要体现在编写语言的不同。Due to different modules, the required configuration files will be different. Specifically, the software configuration file required by the software simulation module, the RTL top-level code file required by the RTL code integration module and the EDA verification module are different. The difference is mainly reflected in the different programming languages.
软件配置文件是软件编程语言编写的,具体语言可以根据软件仿真模块支持的语言而定。而RTL顶层代码文件是用硬件编程语言编写的,比如可以包括Verilog、VHDL等。当然,语言不同的情况下,代码格式等也会有所不同。The software configuration file is written in a software programming language, and the specific language can be determined according to the language supported by the software simulation module. The RTL top-level code files are written in hardware programming languages, such as Verilog, VHDL, etc. Of course, in the case of different languages, the code format will be different.
规格描述文件中与规格相关的信息内容也是软件配置文件和RTL顶层代码文件需要的。所以,可以依据规格描述文件确定软件仿真模块所需的软件配置文件、以及RTL代码集成模块和EDA验证模块所需的RTL顶层代码文件。The information content related to the specification in the specification description file is also required by the software configuration file and the RTL top-level code file. Therefore, the software configuration file required by the software simulation module and the RTL top-level code file required by the RTL code integration module and the EDA verification module can be determined according to the specification description file.
规格描述文件与软件配置文件和RTL顶层代码文件的主要不同也在于编 写语言。规格描述文件可以是用XML格式编写的,具体编写语言不限。The main difference between the specification description file, the software configuration file and the RTL top-level code file also lies in the programming language. The specification description file can be written in XML format, and the specific writing language is not limited.
当然,如果规格描述文件与软件配置文件的编写语言相同,则可以将规格描述文件直接确定为软件配置文件。RTL顶层代码文件也是类似。Of course, if the writing language of the specification description file and the software configuration file are the same, the specification description file can be directly determined as the software configuration file. RTL top-level code files are similar.
在一个实施例中,步骤S2021中,依据所述规格描述文件确定软件仿真模块所需的软件配置文件,包括:In one embodiment, in step S2021, determining the software configuration file required by the software simulation module according to the specification description file includes:
S20211:对所述规格描述文件进行转换生成所述软件配置文件,以使所述软件配置文件能够适用于所述软件仿真模块。S20211: Convert the specification description file to generate the software configuration file, so that the software configuration file can be applied to the software simulation module.
具体来说,对所述规格描述文件进行转换生成所述软件配置文件,可以包括以下两种方式:Specifically, converting the specification description file to generate the software configuration file may include the following two methods:
C1:预先准备好软件配置文件的模板,该模板中除了缺少需要的关键信息的值,其余都是完备的;从规格描述文件中找出模板所需的关键信息的值,并将找到的值写入到模板的对应关键信息中,得到所需的软件配置文件。C1: Prepare a template of the software configuration file in advance. The template is complete except for the value of the required key information; find the value of the key information required by the template from the specification description file, and find the value Write it into the corresponding key information of the template to obtain the required software configuration file.
C2:可以建立好规格描述文件与软件配置文件中相同含义的代码之间的语言转换关系,如此,可以按照该语言转换关系将规格描述文件中的代码从当前语言转换为软件配置文件所需的语言,得到软件配置文件。C2: The language conversion relationship between the specification description file and the code with the same meaning in the software configuration file can be established. In this way, the code in the specification description file can be converted from the current language to the software configuration file according to the language conversion relationship. Language, get the software configuration file.
当然,上述两种方式只是为了便于理解所举的例子,并不应以此作为限制,当然还可以有其他方式来确定所需的配置文件,比如还可以结合上述两种方式等。Of course, the above two methods are just examples for ease of understanding and should not be used as a limitation. Of course, there may be other methods to determine the required configuration file, for example, the above two methods can also be combined.
可以理解,依据规格描述文件确定RTL顶层代码文件的方式也可以采用上述方式,相似之处在此不再赘述。It can be understood that the method for determining the RTL top-level code file according to the specification description file may also adopt the above method, and the similarities are not repeated here.
在一个实施例中,步骤S202中,依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件,还进一步包括以下步骤:In one embodiment, in step S202, uniformly determining the configuration files of multiple chip development modules of the target chip according to the specification description file, further including the following steps:
S2023:从所述规格描述文件中提取出需面向用户的配置信息;S2023: Extract user-oriented configuration information from the specification description file;
S2024:依据提取出的配置信息生成软件仿真模块、RTL代码集成模块和EDA验证模块所需的第一头文件。S2024: Generate the first header file required by the software simulation module, the RTL code integration module, and the EDA verification module according to the extracted configuration information.
规格描述文件中可以包含多种配置信息,其中有些信息需要面向用户,比如控制寄存器的相关信息(比如地址)等,需要利用这些配置信息来生成 可以在软件仿真模块、RTL代码集成模块和EDA验证模块等中被用户利用的第一头文件。The specification description file can contain a variety of configuration information, some of which need to be user-oriented, such as control register related information (such as address), etc., which need to be used to generate software simulation modules, RTL code integration modules and EDA verification The first header file used by users in modules, etc.
因而,可以从规格描述文件中提取出需面向用户的配置信息,比如将所有的控制寄存器的相关信息都提取出来,当然,需面向用户的配置信息也不限于寄存器地址,具体可以视需要而定。Therefore, the user-oriented configuration information can be extracted from the specification description file, such as extracting all the relevant information of the control register. Of course, the user-oriented configuration information is not limited to the register address, and can be determined according to needs. .
提取出出需面向用户的配置信息后,可以依据这些配置信息生成软件仿真模块、RTL代码集成模块和EDA验证模块所需的第一头文件。可以预先准备好头文件模板,将配置信息填入到模板中对应的位置处,来生成相应的头文件。After extracting the user-oriented configuration information, the first header files required by the software simulation module, the RTL code integration module and the EDA verification module can be generated based on the configuration information. The header file template can be prepared in advance, and the configuration information can be filled in the corresponding position in the template to generate the corresponding header file.
在一个实施例中,所述第一头文件包括:C语言头文件和ASM头文件。In an embodiment, the first header file includes: a C language header file and an ASM header file.
DSP芯片在开发阶段中需要的第一头文件可以包括C语言头文件和ASM头文件。C语言头文件和ASM头文件中,可以包含DSP控制寄存器、中断的宏定义等。The first header file required by the DSP chip in the development stage may include a C language header file and an ASM header file. C language header files and ASM header files can include DSP control registers, interrupt macro definitions, etc.
当然,第一头文件并不限于此,随着开发平台、DSP芯片技术的演变,所需的第一头文件也可能会发生相应的变化,比如变成另外一种语言编写的头文件。Of course, the first header file is not limited to this. As the development platform and DSP chip technology evolve, the required first header file may also change accordingly, such as a header file written in another language.
在一个实施例中,In one embodiment,
步骤S202中,依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件,还进一步包括以下步骤:In step S202, uniformly determining the configuration files of multiple chip development modules of the target chip according to the specification description file, and further includes the following steps:
S2025:从所述规格描述文件中提取出用于EDA验证的寄存器地址;S2025: Extract the register address used for EDA verification from the specification description file;
S2026:依据提取出的寄存器地址生成EDA验证模块所需的第二头文件。S2026: Generate a second header file required by the EDA verification module according to the extracted register address.
由于EDA验证模块在验证时,还需要借助于一些寄存器(比如用来存储数据、指令等),所以,需要提取出EDA验证所需的寄存器地址,依据提取出的寄存器地址生成EDA验证模块所需的第二头文件。Since the EDA verification module needs to rely on some registers (such as used to store data, instructions, etc.) when verifying, it is necessary to extract the register address required for EDA verification, and generate the EDA verification module required by the extracted register address The second header file.
依据寄存器地址生成第二头文件的方式,与依据配置信息生成第一头文件的方式是类似的,在此不再赘述。The method of generating the second header file based on the register address is similar to the method of generating the first header file based on the configuration information, and will not be repeated here.
以上是本发明实施例中配置文件生成方法的相关描述内容,基于上述内 容,可以提升芯片开发的效率。The above is the relevant description content of the configuration file generation method in the embodiment of the present invention. Based on the above content, the efficiency of chip development can be improved.
基于与上述方法同样的发明构思,本发明还提供一种配置文件生成装置,参看图6,该配置文件生成装置100可以包括:处理器102和存储器101。Based on the same inventive concept as the above method, the present invention also provides a configuration file generating device. Referring to FIG. 6, the configuration file generating device 100 may include a processor 102 and a memory 101.
在一个实施例中,所述存储器,用于存储程序代码;In one embodiment, the memory is used to store program code;
所述处理器,用于调用所述程序代码,当程序代码被执行时,用于执行以下操作:The processor is used to call the program code, and when the program code is executed, it is used to perform the following operations:
获取与目标芯片相关的描述文件;Obtain description files related to the target chip;
依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。According to the description file, a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
在一个实施例中,In one embodiment,
所述处理器依据所述描述文件统一生成多个芯片开发模块的配置文件时,具体用于:When the processor uniformly generates configuration files of multiple chip development modules according to the description file, it is specifically used for:
依据所述描述文件生成所述目标芯片的规格描述文件;Generating a specification description file of the target chip according to the description file;
依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件。The configuration files of multiple chip development modules of the target chip are uniformly determined according to the specification description file.
在一个实施例中,所述描述文件包括:In one embodiment, the description file includes:
目标芯片的芯片描述文件,所述芯片描述文件包含所述目标芯片内的核信息;A chip description file of the target chip, where the chip description file contains core information in the target chip;
目标芯片内每一核的核描述文件,每一核描述文件包含相应核内的组件信息;The core description file of each core in the target chip, and each core description file contains the component information in the corresponding core;
以及,目标芯片内每一核内的每一组件的组件描述文件,每一组件描述文件包含相应组件的组成信息。And, the component description file of each component in each core in the target chip, and each component description file contains the composition information of the corresponding component.
在一个实施例中,所述处理器依据所述描述文件生成所述目标芯片的规格描述文件时,具体用于:In an embodiment, when the processor generates the specification description file of the target chip according to the description file, it is specifically used for:
根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件;Generating a core assembly file according to at least one of the core description files and corresponding component description files;
根据所述芯片描述文件和各核组装文件生成所述规格描述文件。The specification description file is generated according to the chip description file and each core assembly file.
在一个实施例中,In one embodiment,
每一核描述文件包括对应的核标识;Each core description file includes the corresponding core identification;
所述处理器根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件时,具体用于:When the processor generates a core assembly file according to at least one of the core description file and the corresponding component description file, it is specifically configured to:
根据每一个核描述文件对应的核标识,检查当前是否存在该核标识对应的核组装文件;According to the core identification corresponding to each core description file, check whether the core assembly file corresponding to the core identification currently exists;
如果否,从所有组件描述文件中获取该核描述文件对应的组件描述文件,根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件。If not, obtain the component description file corresponding to the core description file from all component description files, and generate the core assembly file of the core description file according to the obtained component description file and the core description file.
在一个实施例中,所述处理器进一步用于:In an embodiment, the processor is further configured to:
如果当前存在该核标识对应的核组装文件,将所述核组装文件确定为该核描述文件的核组装文件。If the core assembly file corresponding to the core identifier currently exists, the core assembly file is determined as the core assembly file of the core description file.
在一个实施例中,In one embodiment,
所述组件信息至少包含组件标识;The component information includes at least a component identification;
所述处理器从所有组件描述文件中获取该核描述文件所需的组件描述文件时,具体用于:When the processor obtains the component description file required by the core description file from all component description files, it is specifically used for:
根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件。According to the component identification in the core description file, the component description file corresponding to the core description file is obtained from all the component description files.
在一个实施例中,In one embodiment,
每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
所述处理器根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件时,具体用于:When the processor obtains the component description file corresponding to the core description file from all the component description files according to the component identifier in the core description file, it is specifically used for:
根据该核描述文件中的每一组件标识,从所有组件描述文件中选择出该组件标识对应的组件描述文件,将选择出的组件描述文件确定为该核描述文件对应的组件描述文件。According to each component identifier in the core description file, the component description file corresponding to the component identifier is selected from all component description files, and the selected component description file is determined as the component description file corresponding to the core description file.
在一个实施例中,In one embodiment,
所述组件信息至少包含组件标识;The component information includes at least a component identification;
每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
所述处理器根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件时,具体用于:When the processor generates the core assembly file of the core description file according to the obtained component description file and the core description file, it is specifically used for:
依据该核描述文件中的组件标识确定各组件标识对应的组件描述文件;Determine the component description file corresponding to each component identifier according to the component identifier in the core description file;
将所述各组件标识对应的组件描述文件组装到该核描述文件中,得到该核描述文件的核组装文件。The component description file corresponding to each component identifier is assembled into the core description file to obtain the core assembly file of the core description file.
在一个实施例中,In one embodiment,
所述处理器将所述各组件标识对应的组件描述文件组装到该核描述文件中时,具体用于:When the processor assembles the component description file corresponding to each component identifier into the core description file, it is specifically used for:
将该核描述文件中各组件标识所在的组件信息分别替换为所述各组件标识对应的组件描述文件中的内容;Replacing the component information where each component identifier is located in the core description file with the content in the component description file corresponding to each component identifier;
或者,or,
将所述各组件标识对应的组件描述文件中的所有组成信息分别插入到该核描述文件中各组件标识所在的组件信息中。All the component information in the component description file corresponding to each component identifier is inserted into the component information where each component identifier in the core description file is located.
在一个实施例中,In one embodiment,
所述核信息至少包含核标识;The nuclear information includes at least a nuclear identifier;
每一核组装文件包括对应的核标识;Each core assembly file includes the corresponding core identification;
所述处理器根据所述芯片描述文件和各核组装文件生成所述规格描述文件时,具体用于:When the processor generates the specification description file according to the chip description file and each core assembly file, it is specifically used for:
依据所述芯片描述文件中的核标识确定各核标识对应的核组装文件;Determining the core assembly file corresponding to each core identification according to the core identification in the chip description file;
将所述各核标识对应的核组装文件组装到所述芯片描述文件中,得到所述规格描述文件。The core assembly file corresponding to each core identifier is assembled into the chip description file to obtain the specification description file.
在一个实施例中,In one embodiment,
所述处理器将所述各核标识对应的核组装文件组装到所述芯片描述文件中时,具体用于:When the processor assembles the core assembly file corresponding to each core identifier into the chip description file, it is specifically used to:
将所述芯片描述文件中各核标识所在的核信息替换为所述各核标识对应的核组装文件中的内容;Replacing the core information where each core identifier is located in the chip description file with the content in the core assembly file corresponding to each core identifier;
或者,or,
将所述各核标识对应的核组装文件中的所有组件信息插入到所述芯片描述文件中各核标识所在的核信息中。Insert all component information in the core assembly file corresponding to each core identifier into the core information where each core identifier is located in the chip description file.
在一个实施例中,In one embodiment,
所述目标芯片为DSP芯片。The target chip is a DSP chip.
在一个实施例中,In one embodiment,
所述多个芯片开发模块至少包括:软件仿真模块、RTL代码集成模块和EDA验证模块;The multiple chip development modules include at least: a software simulation module, an RTL code integration module, and an EDA verification module;
所述处理器依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件时,具体用于:When the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is specifically used for:
依据所述规格描述文件确定软件仿真模块所需的软件配置文件;Determine the software configuration file required by the software simulation module according to the specification description file;
依据所述规格描述文件确定RTL代码集成模块和EDA验证模块所需的RTL顶层代码文件。Determine the RTL top-level code file required by the RTL code integration module and the EDA verification module according to the specification description file.
在一个实施例中,所述处理器依据所述规格描述文件确定软件仿真模块所需的软件配置文件时,具体用于:In one embodiment, when the processor determines the software configuration file required by the software simulation module according to the specification description file, it is specifically used to:
对所述规格描述文件进行转换生成所述软件配置文件,以使所述软件配置文件能够适用于所述软件仿真模块。The specification description file is converted to generate the software configuration file, so that the software configuration file can be applied to the software simulation module.
在一个实施例中,In one embodiment,
所述处理器依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件时,还进一步用于:When the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is further configured to:
从所述规格描述文件中提取出需面向用户的配置信息;Extract user-oriented configuration information from the specification description file;
依据提取出的配置信息生成软件仿真模块、RTL代码集成模块和EDA验证模块所需的第一头文件。According to the extracted configuration information, the first header files required by the software simulation module, the RTL code integration module and the EDA verification module are generated.
在一个实施例中,In one embodiment,
所述第一头文件包括:C语言头文件和ASM头文件。The first header file includes: C language header file and ASM header file.
在一个实施例中,In one embodiment,
所述处理器依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件时,还进一步用于:When the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is further configured to:
从所述规格描述文件中提取出用于EDA验证的寄存器地址;Extract the register address used for EDA verification from the specification description file;
依据提取出的寄存器地址生成EDA验证模块所需的第二头文件。Generate the second header file required by the EDA verification module according to the extracted register address.
基于与上述方法同样的发明构思,本发明还提供一种计算机可读存储介质,所述计算机可读存储介质上存储有计算机指令,所述计算机指令被执行时,实现前述实施例所述的配置文件生成方法。Based on the same inventive concept as the above method, the present invention also provides a computer-readable storage medium having computer instructions stored thereon, and when the computer instructions are executed, the configuration described in the foregoing embodiment is realized File generation method.
上述实施例阐明的系统、装置、模块或单元,可以由计算机芯片或实体实现,或者由具有某种功能的产品来实现。一种典型的实现设备为计算机,计算机的具体形式可以是个人计算机、膝上型计算机、蜂窝电话、相机电话、智能电话、个人数字助理、媒体播放器、导航设备、电子邮件收发设备、游戏控制台、平板计算机、可穿戴设备或者这些设备中的任意几种设备的组合。The systems, devices, modules or units explained in the above embodiments may be implemented by computer chips or entities, or implemented by products with certain functions. A typical implementation device is a computer. The specific form of the computer can be a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email receiving and sending device, and a game control A console, a tablet computer, a wearable device, or a combination of any of these devices.
为了描述的方便,描述以上装置时以功能分为各种单元分别描述。当然,在实施本发明时可以把各单元的功能在同一个或多个软件和/或硬件中实现。For the convenience of description, when describing the above device, the functions are divided into various units and described separately. Of course, when implementing the present invention, the functions of each unit can be implemented in the same one or more software and/or hardware.
本领域内的技术人员应明白,本发明实施例可提供为方法、系统、或计算机程序产品。因此,本发明可采用完全硬件实施例、完全软件实施例、或结合软件和硬件方面的实施例的形式。而且,本发明实施例可采用在一个或多个其中包含有计算机可用程序代码的计算机可用存储介质(包括但不限于磁盘存储器、CD-ROM、光学存储器等)上实施的计算机程序产品的形式。Those skilled in the art should understand that the embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may adopt the form of computer program products implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.
本发明是参照根据本发明实施例的方法、设备(系统)、和计算机程序产品的流程图和/或方框图来描述的。应理解可以由计算机程序指令实现流程图和/或方框图中的每一流程和/或方框、以及流程图和/或方框图中的流程和/或方框的结合。可提供这些计算机程序指令到通用计算机、专用计算机、嵌入式处理机或其它可编程数据处理设备的处理器以产生一个机器,使得通过计算机或其它可编程数据处理设备的处理器执行的指令产生用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的装置。The present invention is described with reference to flowcharts and/or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and/or block in the flowchart and/or block diagram, and the combination of processes and/or blocks in the flowchart and/or block diagram can be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing equipment to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing equipment are generated It is a device that realizes the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.
而且,这些计算机程序指令也可以存储在能引导计算机或其它可编程数 据处理设备以特定方式工作的计算机可读存储器中,使得存储在该计算机可读存储器中的指令产生包括指令装置的制造品,该指令装置实现在流程图一个流程或者多个流程和/或方框图一个方框或者多个方框中指定的功能。Moreover, these computer program instructions can also be stored in a computer-readable memory that can guide a computer or other programmable data processing equipment to work in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture including the instruction device, The instruction device realizes the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.
这些计算机程序指令也可装载到计算机或其它可编程数据处理设备,使得在计算机或者其它可编程设备上执行一系列操作步骤以产生计算机实现的处理,从而在计算机或其它可编程设备上执行的指令提供用于实现在流程图一个流程或多个流程和/或方框图一个方框或多个方框中指定的功能的步骤。These computer program instructions can also be loaded into a computer or other programmable data processing equipment, so that a series of operation steps are executed on the computer or other programmable equipment to produce computer-implemented processing, thereby executing instructions on the computer or other programmable equipment Provides steps for realizing the functions specified in one process or multiple processes in the flowchart and/or one block or multiple blocks in the block diagram.
以上所述仅为本发明实施例而已,并不用于限制本发明。对于本领域技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进,均应包含在本发明的权利要求范围之内。The above descriptions are only embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (37)

  1. 一种配置文件生成方法,其特征在于,包括:A method for generating a configuration file is characterized in that it comprises:
    获取与目标芯片相关的描述文件;Obtain description files related to the target chip;
    依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。According to the description file, a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
  2. 如权利要求1所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to claim 1, wherein:
    依据所述描述文件统一生成多个芯片开发模块的配置文件,包括:According to the description file, the configuration files of multiple chip development modules are uniformly generated, including:
    依据所述描述文件生成所述目标芯片的规格描述文件;Generating a specification description file of the target chip according to the description file;
    依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件。The configuration files of multiple chip development modules of the target chip are uniformly determined according to the specification description file.
  3. 如权利要求2所述的配置文件生成方法,其特征在于,所述描述文件包括:The configuration file generating method according to claim 2, wherein the description file comprises:
    目标芯片的芯片描述文件,所述芯片描述文件包含所述目标芯片内的核信息;A chip description file of the target chip, where the chip description file contains core information in the target chip;
    目标芯片内每一核的核描述文件,每一核描述文件包含相应核内的组件信息;The core description file of each core in the target chip, and each core description file contains the component information in the corresponding core;
    以及,目标芯片内每一核内的每一组件的组件描述文件,每一组件描述文件包含相应组件的组成信息。And, the component description file of each component in each core in the target chip, and each component description file contains the composition information of the corresponding component.
  4. 如权利要求3所述的配置文件生成方法,其特征在于,依据所述描述文件生成所述目标芯片的规格描述文件,包括:5. The configuration file generation method of claim 3, wherein generating the specification description file of the target chip according to the description file comprises:
    根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件;Generating a core assembly file according to at least one of the core description files and corresponding component description files;
    根据所述芯片描述文件和各核组装文件生成所述规格描述文件。The specification description file is generated according to the chip description file and each core assembly file.
  5. 如权利要求4所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to claim 4, wherein:
    每一核描述文件包括对应的核标识;Each core description file includes the corresponding core identification;
    根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件,包括:Generating a core assembly file according to at least one of the core description file and the corresponding component description file includes:
    根据每一个核描述文件对应的核标识,检查当前是否存在该核标识对应 的核组装文件;According to the core identification corresponding to each core description file, check whether the core assembly file corresponding to the core identification currently exists;
    如果否,从所有组件描述文件中获取该核描述文件对应的组件描述文件,根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件。If not, obtain the component description file corresponding to the core description file from all component description files, and generate the core assembly file of the core description file according to the obtained component description file and the core description file.
  6. 如权利要求5所述的配置文件生成方法,其特征在于,该方法进一步包括:8. The configuration file generation method of claim 5, wherein the method further comprises:
    如果当前存在该核标识对应的核组装文件,将所述核组装文件确定为该核描述文件的核组装文件。If the core assembly file corresponding to the core identifier currently exists, the core assembly file is determined as the core assembly file of the core description file.
  7. 如权利要求5所述的配置文件生成方法,其特征在于,The method for generating configuration files according to claim 5, wherein:
    所述组件信息至少包含组件标识;The component information includes at least a component identification;
    从所有组件描述文件中获取该核描述文件所需的组件描述文件,包括:Obtain the component description files required by the core description file from all component description files, including:
    根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件。According to the component identification in the core description file, the component description file corresponding to the core description file is obtained from all the component description files.
  8. 如权利要求7所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to claim 7, wherein:
    每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
    根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件,包括:According to the component identification in the core description file, obtain the component description file corresponding to the core description file from all the component description files, including:
    根据该核描述文件中的每一组件标识,从所有组件描述文件中选择出该组件标识对应的组件描述文件,将选择出的组件描述文件确定为该核描述文件对应的组件描述文件。According to each component identifier in the core description file, the component description file corresponding to the component identifier is selected from all component description files, and the selected component description file is determined as the component description file corresponding to the core description file.
  9. 如权利要求5所述的配置文件生成方法,其特征在于,The method for generating configuration files according to claim 5, wherein:
    所述组件信息至少包含组件标识;The component information includes at least a component identification;
    每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
    根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件,包括:According to the obtained component description file and the core description file, the core assembly file for generating the core description file includes:
    依据该核描述文件中的组件标识确定各组件标识对应的组件描述文件;Determine the component description file corresponding to each component identifier according to the component identifier in the core description file;
    将所述各组件标识对应的组件描述文件组装到该核描述文件中,得到该核描述文件的核组装文件。The component description file corresponding to each component identifier is assembled into the core description file to obtain the core assembly file of the core description file.
  10. 如权利要求9所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to claim 9, wherein:
    将所述各组件标识对应的组件描述文件组装到该核描述文件中,包括:Assembling the component description file corresponding to each component identifier into the core description file includes:
    将该核描述文件中各组件标识所在的组件信息分别替换为所述各组件标识对应的组件描述文件中的内容;Replacing the component information where each component identifier is located in the core description file with the content in the component description file corresponding to each component identifier;
    或者,or,
    将所述各组件标识对应的组件描述文件中的所有组成信息分别插入到该核描述文件中各组件标识所在的组件信息中。All the component information in the component description file corresponding to each component identifier is inserted into the component information where each component identifier in the core description file is located.
  11. 如权利要求4所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to claim 4, wherein:
    所述核信息至少包含核标识;The nuclear information includes at least a nuclear identifier;
    每一核组装文件包括对应的核标识;Each core assembly file includes the corresponding core identification;
    根据所述芯片描述文件和各核组装文件生成所述规格描述文件,包括:Generating the specification description file according to the chip description file and each core assembly file includes:
    依据所述芯片描述文件中的核标识确定各核标识对应的核组装文件;Determining the core assembly file corresponding to each core identification according to the core identification in the chip description file;
    将所述各核标识对应的核组装文件组装到所述芯片描述文件中,得到所述规格描述文件。The core assembly file corresponding to each core identifier is assembled into the chip description file to obtain the specification description file.
  12. 如权利要求11所述的配置文件生成方法,其特征在于,The configuration file generation method according to claim 11, wherein:
    将所述各核标识对应的核组装文件组装到所述芯片描述文件中,包括:Assembling the core assembly file corresponding to each core identifier into the chip description file includes:
    将所述芯片描述文件中各核标识所在的核信息替换为所述各核标识对应的核组装文件中的内容;Replacing the core information where each core identifier is located in the chip description file with the content in the core assembly file corresponding to each core identifier;
    或者,or,
    将所述各核标识对应的核组装文件中的所有组件信息插入到所述芯片描述文件中各核标识所在的核信息中。Insert all component information in the core assembly file corresponding to each core identifier into the core information where each core identifier is located in the chip description file.
  13. 如权利要求1-12中任一项所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to any one of claims 1-12, wherein:
    所述目标芯片为DSP芯片。The target chip is a DSP chip.
  14. 如权利要求13所述的配置文件生成方法,其特征在于,The method for generating a configuration file according to claim 13, wherein:
    所述多个芯片开发模块至少包括:软件仿真模块、RTL代码集成模块和EDA验证模块;The multiple chip development modules include at least: a software simulation module, an RTL code integration module, and an EDA verification module;
    依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配 置文件,包括:According to the specification description file, the configuration files of the multiple chip development modules of the target chip are uniformly determined, including:
    依据所述规格描述文件确定软件仿真模块所需的软件配置文件;Determine the software configuration file required by the software simulation module according to the specification description file;
    依据所述规格描述文件确定RTL代码集成模块和EDA验证模块所需的RTL顶层代码文件。Determine the RTL top-level code file required by the RTL code integration module and the EDA verification module according to the specification description file.
  15. 如权利要求14所述的配置文件生成方法,其特征在于,依据所述规格描述文件确定软件仿真模块所需的软件配置文件,包括:The method for generating a configuration file according to claim 14, wherein determining the software configuration file required by the software simulation module according to the specification description file comprises:
    对所述规格描述文件进行转换生成所述软件配置文件,以使所述软件配置文件能够适用于所述软件仿真模块。The specification description file is converted to generate the software configuration file, so that the software configuration file can be applied to the software simulation module.
  16. 如权利要求14所述的配置文件生成方法,其特征在于,The configuration file generating method according to claim 14, wherein:
    依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件,还进一步包括:Uniformly determining the configuration files of the multiple chip development modules of the target chip according to the specification description file further includes:
    从所述规格描述文件中提取出需面向用户的配置信息;Extract user-oriented configuration information from the specification description file;
    依据提取出的配置信息生成软件仿真模块、RTL代码集成模块和EDA验证模块所需的第一头文件。According to the extracted configuration information, the first header file required by the software simulation module, the RTL code integration module and the EDA verification module is generated.
  17. 如权利要求16所述的配置文件生成方法,其特征在于,The configuration file generation method according to claim 16, wherein:
    所述第一头文件包括:C语言头文件和ASM头文件。The first header file includes: C language header file and ASM header file.
  18. 如权利要求14所述的配置文件生成方法,其特征在于,The configuration file generating method according to claim 14, wherein:
    依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件,还进一步包括:Uniformly determining the configuration files of the multiple chip development modules of the target chip according to the specification description file further includes:
    从所述规格描述文件中提取出用于EDA验证的寄存器地址;Extract the register address used for EDA verification from the specification description file;
    依据提取出的寄存器地址生成EDA验证模块所需的第二头文件。Generate the second header file required by the EDA verification module according to the extracted register address.
  19. 一种配置文件生成装置,其特征在于,包括:处理器和存储器;A configuration file generating device, which is characterized by comprising: a processor and a memory;
    所述存储器,用于存储程序代码;The memory is used to store program code;
    所述处理器,用于调用所述程序代码,当程序代码被执行时,用于执行以下操作:The processor is used to call the program code, and when the program code is executed, it is used to perform the following operations:
    获取与目标芯片相关的描述文件;Obtain description files related to the target chip;
    依据所述描述文件统一生成多个芯片开发模块的配置文件,所述配置文 件用于使得所述多个芯片开发模块能够对所述目标芯片进行开发。According to the description file, a configuration file of multiple chip development modules is uniformly generated, and the configuration file is used to enable the multiple chip development modules to develop the target chip.
  20. 如权利要求19所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 19, wherein:
    所述处理器依据所述描述文件生成所述目标芯片的多个芯片开发模块的配置文件时,具体用于:When the processor generates configuration files of multiple chip development modules of the target chip according to the description file, it is specifically used for:
    依据所述描述文件生成所述目标芯片的规格描述文件;Generating a specification description file of the target chip according to the description file;
    依据所述规格描述文件确定所述目标芯片的多个芯片开发模块的配置文件。The configuration files of multiple chip development modules of the target chip are determined according to the specification description file.
  21. 如权利要求20所述的配置文件生成装置,其特征在于,所述描述文件包括:22. The configuration file generating device according to claim 20, wherein the description file comprises:
    目标芯片的芯片描述文件,所述芯片描述文件包含所述目标芯片内的核信息;A chip description file of the target chip, where the chip description file contains core information in the target chip;
    目标芯片内每一核的核描述文件,每一核描述文件包含相应核内的组件信息;The core description file of each core in the target chip, and each core description file contains the component information in the corresponding core;
    以及,目标芯片内每一核内的每一组件的组件描述文件,每一组件描述文件包含相应组件的组成信息。And, the component description file of each component in each core in the target chip, and each component description file contains the composition information of the corresponding component.
  22. 如权利要求21所述的配置文件生成装置,其特征在于,所述处理器依据所述描述文件生成所述目标芯片的规格描述文件时,具体用于:21. The configuration file generating device according to claim 21, wherein when the processor generates the specification description file of the target chip according to the description file, it is specifically configured to:
    根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件;Generating a core assembly file according to at least one of the core description files and corresponding component description files;
    根据所述芯片描述文件和各核组装文件生成所述规格描述文件。The specification description file is generated according to the chip description file and each core assembly file.
  23. 如权利要求22所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 22, wherein:
    每一核描述文件包括对应的核标识;Each core description file includes the corresponding core identification;
    所述处理器根据至少一个所述核描述文件和对应的组件描述文件生成核组装文件时,具体用于:When the processor generates a core assembly file according to at least one of the core description file and the corresponding component description file, it is specifically configured to:
    根据每一个核描述文件对应的核标识,检查当前是否存在该核标识对应的核组装文件;According to the core identification corresponding to each core description file, check whether the core assembly file corresponding to the core identification currently exists;
    如果否,从所有组件描述文件中获取该核描述文件对应的组件描述文件,根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件。If not, obtain the component description file corresponding to the core description file from all component description files, and generate the core assembly file of the core description file according to the obtained component description file and the core description file.
  24. 如权利要求23所述的配置文件生成装置,其特征在于,所述处理器进一步用于:The configuration file generating device according to claim 23, wherein the processor is further configured to:
    如果当前存在该核标识对应的核组装文件,将所述核组装文件确定为该核描述文件的核组装文件。If the core assembly file corresponding to the core identifier currently exists, the core assembly file is determined as the core assembly file of the core description file.
  25. 如权利要求23所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 23, wherein:
    所述组件信息至少包含组件标识;The component information includes at least a component identification;
    所述处理器从所有组件描述文件中获取该核描述文件所需的组件描述文件时,具体用于:When the processor obtains the component description file required by the core description file from all component description files, it is specifically used for:
    根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件。According to the component identification in the core description file, the component description file corresponding to the core description file is obtained from all the component description files.
  26. 如权利要求25所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 25, wherein:
    每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
    所述处理器根据该核描述文件中的组件标识,从所有组件描述文件中获取该核描述文件对应的组件描述文件时,具体用于:When the processor obtains the component description file corresponding to the core description file from all the component description files according to the component identifier in the core description file, it is specifically used for:
    根据该核描述文件中的每一组件标识,从所有组件描述文件中选择出该组件标识对应的组件描述文件,将选择出的组件描述文件确定为该核描述文件对应的组件描述文件。According to each component identifier in the core description file, the component description file corresponding to the component identifier is selected from all component description files, and the selected component description file is determined as the component description file corresponding to the core description file.
  27. 如权利要求23所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 23, wherein:
    所述组件信息至少包含组件标识;The component information includes at least a component identification;
    每一组件描述文件包括对应的组件标识;Each component description file includes the corresponding component identification;
    所述处理器根据获取的组件描述文件和该核描述文件生成该核描述文件的核组装文件时,具体用于:When the processor generates the core assembly file of the core description file according to the obtained component description file and the core description file, it is specifically used for:
    依据该核描述文件中的组件标识确定各组件标识对应的组件描述文件;Determine the component description file corresponding to each component identifier according to the component identifier in the core description file;
    将所述各组件标识对应的组件描述文件组装到该核描述文件中,得到该核描述文件的核组装文件。The component description file corresponding to each component identifier is assembled into the core description file to obtain the core assembly file of the core description file.
  28. 如权利要求27所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 27, wherein:
    所述处理器将所述各组件标识对应的组件描述文件组装到该核描述文件 中时,具体用于:When the processor assembles the component description file corresponding to each component identifier into the core description file, it is specifically used for:
    将该核描述文件中各组件标识所在的组件信息分别替换为所述各组件标识对应的组件描述文件中的内容;Replacing the component information where each component identifier is located in the core description file with the content in the component description file corresponding to each component identifier;
    或者,or,
    将所述各组件标识对应的组件描述文件中的所有组成信息分别插入到该核描述文件中各组件标识所在的组件信息中。All the component information in the component description file corresponding to each component identifier is inserted into the component information where each component identifier in the core description file is located.
  29. 如权利要求22所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 22, wherein:
    所述核信息至少包含核标识;The nuclear information includes at least a nuclear identifier;
    每一核组装文件包括对应的核标识;Each core assembly file includes the corresponding core identification;
    所述处理器根据所述芯片描述文件和各核组装文件生成所述规格描述文件时,具体用于:When the processor generates the specification description file according to the chip description file and each core assembly file, it is specifically used for:
    依据所述芯片描述文件中的核标识确定各核标识对应的核组装文件;Determining the core assembly file corresponding to each core identification according to the core identification in the chip description file;
    将所述各核标识对应的核组装文件组装到所述芯片描述文件中,得到所述规格描述文件。The core assembly file corresponding to each core identifier is assembled into the chip description file to obtain the specification description file.
  30. 如权利要求29所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 29, wherein:
    所述处理器将所述各核标识对应的核组装文件组装到所述芯片描述文件中时,具体用于:When the processor assembles the core assembly file corresponding to each core identifier into the chip description file, it is specifically used to:
    将所述芯片描述文件中各核标识所在的核信息替换为所述各核标识对应的核组装文件中的内容;Replacing the core information where each core identifier is located in the chip description file with the content in the core assembly file corresponding to each core identifier;
    或者,or,
    将所述各核标识对应的核组装文件中的所有组件信息插入到所述芯片描述文件中各核标识所在的核信息中。Insert all component information in the core assembly file corresponding to each core identifier into the core information where each core identifier is located in the chip description file.
  31. 如权利要求19-30中任一项所述的配置文件生成装置,其特征在于,The configuration file generating device according to any one of claims 19-30, wherein:
    所述目标芯片为DSP芯片。The target chip is a DSP chip.
  32. 如权利要求31所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 31, wherein:
    所述多个芯片开发模块至少包括:软件仿真模块、RTL代码集成模块和EDA验证模块;The multiple chip development modules include at least: a software simulation module, an RTL code integration module, and an EDA verification module;
    所述处理器依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件时,具体用于:When the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is specifically used for:
    依据所述规格描述文件确定软件仿真模块所需的软件配置文件;Determine the software configuration file required by the software simulation module according to the specification description file;
    依据所述规格描述文件确定RTL代码集成模块和EDA验证模块所需的RTL顶层代码文件。Determine the RTL top-level code file required by the RTL code integration module and the EDA verification module according to the specification description file.
  33. 如权利要求32所述的配置文件生成装置,其特征在于,所述处理器依据所述规格描述文件确定软件仿真模块所需的软件配置文件时,具体用于:The configuration file generating device according to claim 32, wherein when the processor determines the software configuration file required by the software simulation module according to the specification description file, it is specifically configured to:
    对所述规格描述文件进行转换生成所述软件配置文件,以使所述软件配置文件能够适用于所述软件仿真模块。The specification description file is converted to generate the software configuration file, so that the software configuration file can be applied to the software simulation module.
  34. 如权利要求32所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 32, wherein:
    所述处理器依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件时,还进一步用于:When the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is further configured to:
    从所述规格描述文件中提取出需面向用户的配置信息;Extract user-oriented configuration information from the specification description file;
    依据提取出的配置信息生成软件仿真模块、RTL代码集成模块和EDA验证模块所需的第一头文件。According to the extracted configuration information, the first header file required by the software simulation module, the RTL code integration module and the EDA verification module is generated.
  35. 如权利要求34所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 34, wherein:
    所述第一头文件包括:C语言头文件和ASM头文件。The first header file includes: C language header file and ASM header file.
  36. 如权利要求32所述的配置文件生成装置,其特征在于,The configuration file generating device according to claim 32, wherein:
    所述处理器依据所述规格描述文件统一确定所述目标芯片的多个芯片开发模块的配置文件时,还进一步用于:When the processor uniformly determines the configuration files of multiple chip development modules of the target chip according to the specification description file, it is further configured to:
    从所述规格描述文件中提取出用于EDA验证的寄存器地址;Extract the register address used for EDA verification from the specification description file;
    依据提取出的寄存器地址生成EDA验证模块所需的第二头文件。Generate the second header file required by the EDA verification module according to the extracted register address.
  37. 一种计算机可读存储介质,其特征在于,A computer-readable storage medium, characterized in that:
    所述计算机可读存储介质上存储有计算机指令,所述计算机指令被执行时,实现权利要求1-18任一项所述的配置文件生成方法。Computer instructions are stored on the computer-readable storage medium, and when the computer instructions are executed, the method for generating a configuration file according to any one of claims 1-18 is realized.
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