WO2021030383A1 - Cartes métalliques double interface et procédés de fabrication - Google Patents

Cartes métalliques double interface et procédés de fabrication Download PDF

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Publication number
WO2021030383A1
WO2021030383A1 PCT/US2020/045840 US2020045840W WO2021030383A1 WO 2021030383 A1 WO2021030383 A1 WO 2021030383A1 US 2020045840 W US2020045840 W US 2020045840W WO 2021030383 A1 WO2021030383 A1 WO 2021030383A1
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WO
WIPO (PCT)
Prior art keywords
metal
layer
slit
smartcard
card body
Prior art date
Application number
PCT/US2020/045840
Other languages
English (en)
Inventor
David Finn
Daniel PIERRARD
Original Assignee
Federal Card Services, LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Federal Card Services, LLC filed Critical Federal Card Services, LLC
Priority to EP20853008.9A priority Critical patent/EP4028946A1/fr
Publication of WO2021030383A1 publication Critical patent/WO2021030383A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07794—Antenna details the record carrier comprising a booster or auxiliary antenna in addition to the antenna connected directly to the integrated circuit

Definitions

  • This disclosure relates to RFID-enabled (or “contactless” capable) smartcards (“cards”), such as metal transaction cards and, more particularly, to metal cards using slit technology to facilitate contactless communication and taking measures to fill, seal and disguise the presence of the slit in the metal card body.
  • the disclosure may relate broadly to passive RFID-enabled metal transaction cards including "metal smartcards” such as encapsulated metal smartcards (aka encased metal cards), metal core smartcards (aka embedded metal or metal veneer smartcards - plastic front, edge to edge metal core, plastic back), metal face smartcards (aka metal hybrid cards - metal front, plastic back), full metal smartcards, and biometric metal smartcards, having an RFID chip (IC) capable of operating in a "contactless" mode (ISO 14443 or NFC/ISO 15693), including dual interface (DI) metal smartcards and metal payment objects (or “metal payment devices") which can also operate in "contact” mode (ISO 7816-2).
  • metal smartcards having only a contactless interface.
  • the disclosure(s) herein may further relate to biometric transaction cards and smartcards with a dynamic display.
  • Some of the disclosure(s) herein may relate to RFID-enabled metal transaction cards having only a contact interface, or having only a contactless interface, or having dual interface (DI; contact and contactless).
  • DI dual interface
  • Passive dual interface smartcards with a metal layer (ML) or metal card body (MCB) having a slit (S) and a module opening (MO) to accommodate a transponder chip module (TCM) or an inductive coupling chip module (ICM) (6 or 8 pin package) is known in the smartcard industry.
  • the metal layer (ML) or metal card body (MCB) with a slit (S) extending from a perimeter edge to a module opening (MO), so as to function as a coupling frame (CF), requires that the module antenna (MA) of the transponder chip module (TCM) overlaps at least a portion of the metal within the area of the module opening (MO).
  • the turns or windings of the module antenna (MA) on the face-down side or rear side of the transponder chip module (having contact pads on the face-up side) must overlap at very close range the metal layer in the module opening (MO) to enable contactless communication when the smartcard is in an electromagnetic field generated by a reader or point of sale terminal.
  • the transponder chip module comprises a module antenna (MA) with a certain number of turns or windings electrically connected on the module tape (MT) to the antenna bonding pads L A and L B of the RFID chip (IC).
  • the transponder chip module does not have contact pads, and the module antenna overlaps the slit or discontinuity which begins at a perimeter edge of the metal and extends across the metal housing forming an integral part of the wearable device.
  • a booster antenna BA
  • compensating loop CL
  • discontinuous metal frame DMF
  • coupling frame CF
  • the transponder chip module comprises an RFID chip connected to a module antenna on the same substrate.
  • the slit always extends from a perimeter edge to a module opening (MO), without considering that the slit may not need to extend to the module opening (MO) in order to operate as a coupling frame. Distribution of surface currents from different locations on a metal card body is not acknowledged by the prior art, and that such locations could individually drive an electronic component or several components.
  • FC flexible circuit
  • the prior art is also silent on measures to disguise or camouflage a discontinuity in a metal card body and how the discontinuity can become part of the artwork or graphic elements in the design of a metal transaction card.
  • the discontinuity as described herein may be optically visible from one or both surfaces of the card.
  • the discontinuity may not be visible from the back surface.
  • front decorative layers such as wood, leather, or certain ceramics, the discontinuity may also be hidden from the front.
  • US 20150021403 also describes filling and disguising the slit at FIG. 5B [0236, 0246, 0259], and reinforcing the slit at FIG. 8 [0260-0264, 0267-0268].
  • Eddy Currents are induced electrical currents that flow in a circular path. In other words, they are closed loops of induced current circulating in planes perpendicular to the magnetic flux. Eddy currents concentrate near the surface adjacent to the excitation coil of the contactless reader generating the electromagnetic field, and their strength decreases with distance from the transmitter coil. Eddy current density decreases exponentially with depth. This phenomenon is known as the skin effect. The depth that eddy currents penetrate into a metal object is affected by the frequency of the excitation current and the electrical conductivity and magnetic permeability of the metal.
  • Skin effect is the tendency of an alternating electric current (AC) to become distributed within a conductor such that the current density is largest near the surface of the conductor, and decreases with greater depths in the conductor.
  • the electric current flows mainly at the "skin" of the conductor, between the outer surface and a level called the skin depth.
  • the skin effect causes the effective resistance of the conductor to increase at higher frequencies where the skin depth is smaller, thus reducing the effective cross-section of the conductor.
  • the skin effect is due to opposing eddy currents induced by the changing magnetic field resulting from the alternating current.
  • a discontinuity interrupts or alters the amplitude and pattern of the eddy currents which result from the induced electromagnetic field generated by a contactless point of sale terminal.
  • the eddy current density is highest near the surface of the metal layer (ML) and decreases exponentially with depth.
  • a "coupling frame" - may be described in greater detail in US 9,475,086, US 9,798,968, and in some other patents that may be mentioned herein.
  • a coupling frame may be formed from a metal layer or metal card body having a slit, without having a module opening.
  • a typical slit may have a width of approximately 100 pm.
  • a "micro-slit” refers to a slit having a smaller width, such as approximately 50pm, or less.
  • RFID Slit Technology refers to modifying a metal layer (ML) or a metal card body (MCB) into a so-called “antenna circuit” by providing a discontinuity in the form of a slit, slot or gap in the metal layer (ML) or metal card body (MCB) which extends from a peripheral edge to an inner area or opening of the layer or card body.
  • the concentration of surface current at the inner area or opening can be picked up by another antenna (such as a module antenna) or antenna circuit by means of inductive coupling which can drive an electronic circuit such as an RFID chip attached directly or indirectly thereto.
  • the slit may be ultra-fine (typically less than 50 pm or less than 100 pm), cut entirely through the metal with a UV laser, with the debris from the plume removed by ultrasonic or plasma cleaning. Without a cleaning step after lasing, the contamination may lead to shorting across the slit.
  • the slit may be filled with a dielectric to avoid such shorting during flexing of the metal forming the transaction card.
  • the laser-cut slit may be further reinforced with the same filler such as a resin, epoxy, mold material, repair liquid or sealant applied and allowed to cure to a hardened state or flexible state.
  • the filler may be dispensed or injection molded.
  • the term "slit technology” may also refer to a "coupling frame" with the aforementioned slit, or to a smartcard embodying the slit technology or having a coupling frame incorporated therein.
  • the antenna structure (AS) is usually rectangular in shape with dimensions confined to the size of the module package having 6 or 8 contact pads on the face-up-side.
  • the termination ends of the antenna structure (AS) with multiple windings (13 to 15 turns) based on a frequency of interest (e.g. 13.56 MHz) are bonded to the connection pads (LA and LB) on the RFID chip.
  • the module antenna (MA) overlaps the coupling frame or metal layer(s) within the card body at the area of the module opening to accept the transponder chip module (TCM).
  • the windings or traces of the coupling loop antenna (CLA) may intertwine those windings of the module antenna (MA), or the windings or traces of the coupling loop antenna (CLA) may couple closely with the windings of the module antenna (MA) similar in function to a primary and secondary coil of a transformer.
  • the termination ends of a coupling loop antenna (CLA) may be connected to termination points (TPs) across a discontinuity in a metal layer (ML) or metal card body (MCB) acting as a coupling frame (CF).
  • a metal layer or metal card body with a discontinuity may be represented by card size planar antenna having a single turn, with the width of the antenna track significantly greater than the skin depth at the frequency of interest.
  • coils or antennas used to capture surface current by means of inductive coupling at the edge of a metal layer (ML) or metal card body (MCB) or around a discontinuity in a metal layer (ML) or metal card body (MCB) when such conductive surfaces are exposed to an electromagnetic field.
  • the coils or antennas may be wire wound, chemically etched or laser etched, and positioned at very close proximity to a discontinuity in a metal layer, at the interface between a conductive and non-conductive surface, or at the edge of a metal layer.
  • AS antenna structure
  • SeC sense coil
  • PA patch antenna
  • PuC pick-up coil
  • FC flexible circuit
  • a plurality of antenna cells (ACs) at different locations in a metal transaction card may be used to power several electronic components.
  • a pick-up antenna in the form of a micro-metal strip may be placed in the middle of a discontinuity to probe eddy current signals from the magnetic flux interaction with the metal layer acting as the coupling frame.
  • the metal layer also acts as the second electrode in the circuit.
  • the metal strip may be replaced by a sense coil with a very fine antenna structure to pick-up the surface currents from within the discontinuity.
  • a booster antenna (BA) in a smartcard comprises a card antenna (CA) component with multiple turns or windings extending around the periphery edge of the card body (CB), a coupler coil (CC) component at a location for a module antenna (MA) of a transponder chip module (TCM), and an extension antenna (EA) component contributing to the inductance and tuning of the booster antenna (BA).
  • a conventional booster antenna is a wire embedded antenna, ultrasonically scribed into a synthetic layer forming part of the stack-up construction of a dual interface smartcard.
  • the card antenna (CA) on the periphery of the card body (CB) inductively couples with the contactless reader while the coupler coil (CC) inductively couples with the module antenna (MA) driving the RFID chip.
  • US 20140091149 (2014-04- 03; Finn, et al.) provides an example of a booster antenna (BA) for a smart card.
  • FC flexible circuit
  • SeC sense Coil
  • PA patch antenna
  • PuC pick-up coil
  • the dimensional width of the windings (or width across multiple windings) of a sense coil (SeC), patch antenna (PA) or a pick-up coil (PuC) ought to overlap a metal edge (ME) by 50% to capture the surface currents.
  • the module antenna (MA) of a transponder chip module (TCM) implanted in a metal containing transaction card The dimensional width of the windings of the module antenna (MA) ought to overlap a metal ledge (PI) of a stepped cavity forming the module pocket in a card body by 50%.
  • PI metal ledge
  • surface currents are collected between very close metal edges.
  • the dimensional width of the windings may be replaced by the surface area or volume.
  • An electrolytic passivation process used to increase the thickness of the natural oxide layer on the surface of metal parts.
  • the process is called anodizing because the part to be treated forms the anode electrode of an electrolytic cell.
  • Anodic films are most commonly applied to protect aluminum alloys, although processes also exist for titanium, zinc, magnesium, niobium, zirconium, hafnium, and tantalum.
  • Anodizing changes the microscopic texture of the surface and the crystal structure of the metal near the surface. Thick coatings are normally porous, so a sealing process is often needed to achieve corrosion resistance. Anodized aluminum surfaces, for example, are harder than aluminum but have low to moderate wear resistance that can be improved with increasing thickness or by applying suitable sealing substances. Anodic films are generally much stronger and more adherent than most types of paint and metal plating, but also more brittle. This makes them less likely to crack and peel from aging and wear, but more susceptible to cracking from thermal stress.
  • the aluminum oxide layer has a thickness of 12 to 18 microns rendering the surface finish non- conductive.
  • the weight of a solid aluminum smartcard is approximately 10.5 grams.
  • the coloring of the pristine aluminum is through anodizing (electrochemical treatment in a sulphuric acid bath with a continuous rack conveying system) and through dye-sublimation printing.
  • Double-anodizing involves passing the aluminum layer (e.g. 15 mils thick) through the electrochemical process first with one color, followed by a photo resist (for graphics - image embedding) and aluminum oxide growth in the repeat process to provide the second color or greater intensity of the first.
  • the type of alloy determines the prep formula used to color the aluminum. 5000 series aluminum achieves a high gloss finish. Aluminum 1000, 3000 and 7000 series may also be used. Aluminum alloy temper designations apply to the respective series.
  • 2019/0291316 2019-09-26; Lowe; CompoSecure; now 10,583,594
  • 2019/0286961 2019-09-19; Lowe; CompoSecure
  • the invention may relate to innovations in or improvements to RFID-enabled ("contactless capable) metal smartcards or metal transaction cards with/having Metal inlay to Metal Card Body and various stack up constructions.
  • smartcards also known as transaction cards
  • metal transaction cards such as metal transaction cards
  • RFID-enabled smartcards which may be referred to herein simply as "cards”
  • smartcards having at least contactless capability, including dual interface (contactless and contact) smartcards, including cards having a metal layer in the stackup of their card body, and including cards having a card body which is substantially entirely formed of metal (i.e., a metal card body).
  • FC flexible circuit
  • AS antenna structures
  • Smartcards manufactured from a web of metal inlays (MI; FIGs. 12-14) with the coupling frame (CF) forming the metal card body (MCB) supported by metal stmts (stmts).
  • the slit may form part of graphic elements (FIGs. 10-12).
  • Printing and coating techniques may be used to camouflage the slit (FIGs. 9A-9D).
  • a flexible circuit may be connected to termination points (TP) across the slit (S), or may couple via a patch antenna (PA) with the slit (S).
  • the flexible circuit may couple, via an antenna structure (AS) with the module antenna (MA) of a transponder chip module (TCM).
  • a smartcard may comprise: a first, front face metal layer (ML, 902) with a module opening (MO) and slit (S); a primer layer (904) disposed on a front surface of the front face metal layer; a first ink layer (908) disposed on the primer layer; a protective varnish layer (912); a dielectric layer (920) with adhesive disposed on a rear surface of the first metal layer; a second, supporting metal layer (ML, 922) with a module opening (MO) and slit (S) disposed below the dielectric layer; an adhesive layer (924) disposed below the second metal layer; a synthetic layer with artwork (926) disposed below the adhesive layer; and a laser-engravable overlay (928) with a magnetic stripe and a signature panel disposed below the synthetic layer.
  • the smartcard may further comprise a personalization / laser engraving layer (914) disposed on the protective varnish layer, and a coating filling the slit. After the primer layer is applied, a coating may be introduced to fill the slit.
  • a concealing ink layer (906) may be disposed between the primer layer and the first ink layer. The first ink layer and concealing ink layer may be interchanged with one another, so that the first ink layer is disposed on the primer layer and the concealing ink layer is disposed on the first ink layer.
  • a second ink layer (910) may be disposed on the first ink layer; and the protective varnish layer may be disposed on the second ink layer. The second ink layer and the protective varnish layer are interchanged with one another, so that the protective varnish layer is disposed on the first ink layer and the second ink layer is disposed on the protective varnish layer.
  • a smartcard may comprise: (FIG. 9B) a first, front face metal layer (ML, 902) with a module opening (MO) and slit (S); a primer layer (904) disposed on a front surface of the front face metal layer; a first ink layer (908) disposed on the primer layer; a protective varnish layer (912) disposed on the first ink layer; a second ink layer with raised alphanumeric characters (910) disposed on the varnish layer; a personalization / laser engraving layer (914) disposed on the second ink layer; a dielectric layer (920) with adhesive disposed on a rear surface of the first metal layer; a second, supporting metal layer (ML, 922) with a module opening (MO) and slit (S) disposed below the dielectric layer; an adhesive layer (924) disposed below the second metal layer; a synthetic layer with artwork (926) disposed below the adhesive layer; a laser-engravable overlay (928) with a magnetic stripe and a signature panel disposed below
  • a coating may be introduced to fill the slit.
  • a smartcard may comprise: (FIG. 9C) a first, front face metal layer (ML, 902) with a module opening (MO) and slit (S); a primer layer (904) disposed on a front surface of the front face metal layer; a first ink layer (908) disposed on the primer layer; a second ink layer with raised alphanumeric characters (910) disposed on the first ink layer; a protective varnish layer (912) disposed on the second ink layer; a personalization / laser engraving layer (914) disposed on the protective varnish layer; a dielectric layer (920) with adhesive disposed on a rear surface of the first metal layer; a second, supporting metal layer (ML, 922) with a module opening (MO) and slit (S) disposed below the dielectric layer; an adhesive layer (924) disposed below the second metal layer; a synthetic layer with artwork (926) disposed below the adhesive layer; a laser-engravable overlay (928) with a magnetic stripe and a signature panel disposed
  • a coating may be introduced to fill the slit.
  • a smartcard may comprise: (FIG. 9D) a first, front face metal layer (ML, 902) with a module opening (MO) and slit (S); a primer layer (904) disposed on a front surface of the front face metal layer; a concealing ink layer (906) and a first ink layer (908) disposed on the primer layer; a second ink layer (910) with raised alphanumeric characters disposed on the concealing ink layer or the first ink layer; a protective varnish layer (912) disposed on the second ink layer; a personalization / laser engraving layer (914) disposed on the protective varnish layer; a dielectric layer (920) with adhesive disposed on a rear surface of the first metal layer; a second, supporting metal layer (ML, 922) with a module opening (MO) and slit (S) disposed below the dielectric layer; an adhesive layer (924) disposed below the second metal layer; a synthetic layer with artwork (926) disposed below the adhesive layer; a laser-engravurethan
  • a coating may be introduced to fill the slit.
  • a smartcard may comprise: a metal layer (ML, 902) with a module opening (MO) and a slit (S); a primer layer (903) over the metal layer; a coating or sealant (907) over the primer layer; an ink layer (908) over the coating or sealant; and a laser engravable top coat layer (909) over the ink layer.
  • the primer, coating or sealant, ink, and top coat layers may all be baked onto the metal layer.
  • Each of the primer layer, coating or sealant, baked-on ink layer, and top coat layer may also have a module opening extending therethrough.
  • a method of making a metal inlay (MI) for a smartcard (SC) having two metal layers (ML1, ML2) may comprise: providing a single metal substrate; forming two metal layer coupling frames in the substrate; and folding the substrate over so that the two metal layer coupling frames are disposed one atop the other.
  • a layer of insulating material may be provided between the two metal layer coupling frames.
  • Each of the metal layer coupling frames may have a module opening and a slit. In at least one of the metal layer coupling frames, the slit may extend from a peripheral edge of the coupling frame to the module opening in the coupling frame.
  • the metal inlay may be supported by struts (SRTs) connected to a metal frame (MF).
  • a smartcard may comprise: a card body (CB) having a module opening (MO) for receiving a transponder chip module (TCM) with a module antenna (MA), and a slit (S) extending from a peripheral edge of the card body towards an interior area of the card body; and a flexible circuit (FC) having a coupling loop structure (CLS) with an antenna structure (AS) disposed near the transponder chip module for coupling with the module antenna.
  • the card body may be a metal card body (MCB).
  • the flexible circuit (FC) may be connected to termination points (TP) near the slit (S).
  • a patch antenna (PA) may be disposed near or overlying the slit
  • the metal card body (CB) with slit (S), and optionally a module opening (MO), may function as a coupling frame (CF).
  • a smartcard may comprise: a card body (CB, 301); a coupling frame antenna (CFA, 302) comprising a single track extending almost entirely around a peripheral area of the card body (CB), and having two spaced-apart ends with termination end points (TP).
  • the track may be a single wide track (as opposed to a structure having many tracks), and the track may have width of approximately 3mm.
  • the termination end points may be connected with a flexible circuit (FC, FIG. 15 A) disposed with a coupling loop structure (CLS) including an antenna structure (AS) located under the module antenna (MA) of a transponder chip module (TCM).
  • a smartcard may comprise a front card body (FCB) comprising an anodized metal layer (ML, 602) with a slit (S, 604).
  • Contact pads (CP, 601) for effecting a contact interface may protrude through a plurality of individual openings (e.g., one per contact pad) in the metal layer.
  • the smartcard may further comprise a rear card body (RCB, 608) with a coupling loop structure (CLS, 607) for coupling with the slit and with a module antenna (MA) of a transponder chip module (TCM).
  • the coupling loop structure (CLS, 607) may comprise a flexible circuit (FC).
  • the rear card body may fit into a recess in a rear surface of the front card body.
  • the metal layer may comprise one or more alloying elements from the group consisting of: copper, magnesium, manganese, silicon, tin and zinc, and combinations thereof.
  • a smartcard may comprise a card body (CB) comprising a metal layer (ML) or metal card body (MCB) having a module opening (MO) and a slit extending from a peripheral edge of the card body to the module opening; wherein the slit is shaped to suggest at least a portion of a readily recognizable object, or logo.
  • the portion of the object of logo forming the slit may be an incomplete outline of the object or logo; and some remaining portions of the outline, making the saxophone more recognizable, may be engravings (or markings) which have only an aesthetic purpose, and no "functional" purpose.
  • a method of making a coupling frame for a smartcard may comprise: providing a metal layer (ML) or a metal card body (MCB) for a smartcard (SC); forming a slit (S) in the metal layer or metal card body so that the metal layer or metal card body will function as a coupling frame (CF); applying a light- curable, metallic ink to the metal layer or metal card body, wherein the ink fills the slit; and applying light radiation so that in a manner that the ink becomes conductive at areas other than the slit, and remains non-conductive in the slit.
  • ML metal layer
  • MBC metal card body
  • CF coupling frame
  • a smartcard may comprise: a metal layer (ML); and a module opening (MO) in the metal layer (TCM) for receiving a transponder chip module (TCM); and may be characterized by: a slit (S) or notch (N) extending into the metal layer (ML) for a short distance to a periphery of the metal layer (ML) but not extending to the module opening (MO) to maintain mechanical integrity of the smartcard (SC); wherein the metal layer (ML) comprises an open-loop coupling frame (CF) having termination end points (TPs) on each side of the slit (S) or notch (N) for connecting to a flexible circuit (FC) disposed with a coupling loop structure (CLS).
  • CF open-loop coupling frame
  • the smartcard may be characterized by: a coupling frame (CF) with termination end points (TPs) electrically connected to a flexible circuit (FC) disposed with a coupling loop structure (CLS); wherein the coupling loop structure (CLS) on the flexible circuit (FC) resides in close proximity to the antenna structure (AS) or module antenna (MA) of the transponder chip module (TCM); and a portion of the coupling loop structure (CLS) overlaps a portion of the antenna structure (AS) or module antenna (MA) in the transponder chip module (TCM). Alternatively, another portion of the CLS may overlap a slit in the coupling frame.
  • a smartcard may comprise: a non conducting anodized aluminum card body and a slit extending from a perimeter edge to a position close to a module pocket disposed in the card body.
  • the module pocket may be configured to receive at least one of: a contactless chip module or a dual interface chip module, and an antenna structure (AS) on a flexible circuit (FC) for inductive coupling with a module antenna (MA).
  • the anodized aluminum card body may comprise one or more alloying elements of the group consisting of: copper, magnesium, manganese, silicon, tin and zinc, and a combination thereof.
  • a smartcard may comprise: a metal layer (ML) or a metal card body (MCB) with a discontinuity (such as a slit S) to function as a coupling frame (CF), wherein: the discontinuity has a pattern of cut slits and engraved slits that represent a name such as a payment scheme or a character, to disguise or camouflage the presence of said discontinuity.
  • the discontinuity may be filled, deposited or inkjet printed with a flexible polymer resin and further camouflaged with a primer and ink.
  • a smartcard may comprise: a card body (CB) comprising a stack-up of at least two metal layers, each of the metal layers (ML) having a discontinuity in the form of a slit (S) extending through the layer from an outer edge of the layer to an interior position thereof; wherein at least one of the metal layers is suspended from a metal frame (MF) by means of supporting struts. At least one of the metal layers may extend from edge-to-edge on the card body. There may be two metal layers which are folded over on each other (along a line of perforations) to create a metal core.
  • a method of manufacturing a shrouded metal inlay for a smartcard may comprise: providing a metal core layer having a plurality of sites, with each site corresponding to an individual smartcard; disposing PVC layers on the front and back of the metal core layer; and digitally printing at least one of the PVC layers.
  • the sites or metal card bodies may be arranged in an array having rows and columns, wherein each site is supported by struts emanating from a metal frame.
  • the invention makes use of the surface eddy currents which flow along the perimeter edge of a conductive surface such as a metal card body (MCB) which has been exposed to electromagnetic waves generated by a contactless reader or terminal.
  • a conductive surface such as a metal card body (MCB) which has been exposed to electromagnetic waves generated by a contactless reader or terminal.
  • the intensity of such eddy currents at the frequency of interest is a maximum along the skin depth of the metal at its perimeter edge.
  • the skin depth of copper for example, at 13.56 MHz is approximately 18 pm.
  • the slit (S) or notch (N) passes entirely through the metal layer (ML, MCB).
  • Smartcards having (i) a metal card body (MCB) with a short slit (S) or notch (N) extending into the metal card body (MCB) acting as a coupling frame (CF) having a termination end point (TP) on each side of the slit (S) or notch (N), (ii) a flexible circuit (FC) disposed with a coupling loop structure (CLS) having termination end points (TPs) for electrical connection to the termination end points (TPs) on the coupling frame; (iii) a module opening (MO) in the metal card body (MCB) to accept a transponder chip module (TCM) having a module antenna (MA) connected to an RFID chip; (iv) the coupling loop structure (CLS) having a frame or spiral shape antenna structure (AS) on the flexible circuit (FC), assembled underneath the module antenna (MA) of the transponder chip module (TCM) so that a portion of the module antenna overlaps a portion of the antenna structure (AS) to allow for
  • One aspect of the invention comprises a transaction card having a non-conducting anodized aluminum card body may comprise one or more pockets or recesses, and at least one of a magnetic stripe, a laser signature panel, a hologram, and having an issuing bank and payment scheme logo laser etched or CNC milled into the card body.
  • the slit or slits (S) in the metal layers (ML, MCB) extend from a perimeter edge to an area close to the module pocket (MO), or the slit or slits (S) commence from an area within the metal layer (ML) to the opening of the module pocket (MO).
  • An antenna structure (AS) as part of a coupling loop structure (CLS) is closely coupled to the slit or slits.
  • the antenna structure (AS) may touch the non-conducting anodized aluminum layer.
  • Another antenna structure (AS) as part of the coupling loop structure (CLS) is closely coupled to the module antenna (MA) of the transponder chip module (TCM).
  • the antenna structure (AS) may be used to pick-up surface currents around a discontinuity in the anodized aluminum or stainless steel layer, and such antenna structure (AS) may ran perpendicular or parallel to the direction of the discontinuity.
  • the antenna structure (AS) may wrap around partially or entirely the discontinuity in the form of a slit (S) or the antenna structure (AS) may meander within the open area of the slit (S).
  • Another aspect of the invention includes a transaction card comprising of non-conducting anodized aluminum which may be used to house electronic components without the need to take measures to isolate/separate the electronics from the metal.
  • a flexible circuit (FC) with an antenna structure /AS) may be attached directly to the anodized aluminum and in particular to overlap a slit (S) and or opening (MO) for inductive coupling when the metal card body is exposed to an electromagnetic field generated by a reader.
  • the contact pads (CP) may protrude from openings in the non-conducting anodized card body, and may be located at the ISO positions (C1...C8) defined by ISO 7816.
  • the slit (S) may form a pattern of machined slits in the metal layer (ML) or metal card body (MCB) that represent a name, character or special shape. The slits may be cut entirely through the metal or are engraved on the surface of the metal.
  • the slit (S) may have the shape of a musical instrument such as a saxophone with the continuous slit mechanically engraved and or laser etched (cut) in a metal layer (ML) or metal card body (MCB) with the slit (S) passing entirely through the metal layer (ML) or metal card body (MCB).
  • the slit may be camouflaged by graphic elements in which the slit (S) is part of the artwork and said slit may be straight and terminate in an opening (MO) having a shape other than rectangular.
  • different layers applied to a metal surface may disguise the presence of a discontinuity in the metal layer of metal card body by using primer, polymer coatings (synthetic resin), and ink.
  • the finish may be gloss or matte.
  • the resin may be laser engravable.
  • an embedded metal smartcard operating in a contactless mode including dual interface (contact and contactless) smartcards may have a metal inlay (MI) composing of a coupling frame (CF) with a slit (S) to concentrate surface eddy current density around the antenna structure (AS) or module antenna (MA) of a transponder chip module (TCM).
  • the metal inlay (MI) may further compose of a metal frame (MF) supporting a coupling frame (CF).
  • the coupling frame (CF) may be a single metal layer or be composed of two metal layers separated by a dielectric layer and laminated together to form a pre laminated metal inlay.
  • the coupling frame (CF) represents the core metal layer or layers (pre-laminated) of a metal card body (MCB), in the form of a DI embedded metal smartcard (aka DI metal core smartcard & DI metal veneer smartcard), having a plastic front and plastic rear sandwiching the single metal layer or the pre-laminated metal layers.
  • the coupling frame (CF) or an array of coupling frames in a given inlay format is or are laser or water cut from a metal sheet or from a reel (web) of metal.
  • the metal sheet or metal reel comprising an array of metal inlay sites may accommodate a front and rear metal layer in a two-layer inlay construction having a perforated center allowing for the folding of the front metal layer over the rear metal layer separated by a dielectric.
  • the metal inlay may further comprise a metal frame (MF) which supports the coupling frame (CF) by means of stmts.
  • MF metal frame
  • CF coupling frame
  • a single metal layer, or two metal layers which are later folded over on each other may form the core of a metal card body (MCB).
  • the folded metal layers may be electrically separated from each other by a dielectric layer having an adhesive backing on each side.
  • the single metal layer or the folded metal layers (with dielectric layer) may be regarded as a metal inlay (MI) site composed of a metal frame (MF) supporting a coupling frame (CF) which later forms the metal card body (MCB).
  • the cutting process to produce a metal inlay (MI) is performed in such a way so that the coupling frame (CF) is suspended by stmts from the metal frame (MF).
  • the metal inlay may also be formed through chemical etching.
  • An object of the invention is to avoid CNC milling of the individual card body from a metal inlay site after plastic and adhesive layers (front and rear) have been laminated to the metal inlay (MI). CNC milling is a costly process in terms of manufacturing time.
  • the metal card body (MCB) is physically cut or punched from the metal frame (MF) supported by the stmts.
  • the supporting stmts can be on one metal layer in the case of the folded metal layers separated by a dielectric layer, or the struts may support a single metal layer.
  • the metal layers may have a thickness of 150 pm with an inner dielectric layer having a thickness of 25 or 50 pm, while a single metal layer may have a thickness of 350 pm.
  • the “edge to edge” metal provides weight and structure to the DI smartcard.
  • the slit (S) in a single metal layer or slits (S) in the laminated metal layers may extend from a perimeter edge to the module opening (MO), or the slit or slits may not extend to the module opening (MO).
  • the slit or slits may be straight, curved or meandering in form.
  • the edges of the coupling frame may be dulled to remove sharp edges.
  • the metal inlay with one card body site or a plurality of card body sites is laminated with front and rear white plastic layers (including adhesive layers) so that the metal inlay is completely shrouded with white plastic, in preparation for digital printing.
  • Alignment holes (ah) in the metal inlay may facilitate the precise cutting or punching of the individual card bodies from the pre-laminated sheet (shrouded) having a thickness of approximately 600 pm. Proper selection of adhesive in the card construction maintains the metal sound effect when tossed on a hard surface. Dual interface embedded metal transaction cards for processing in instant issuance machines are described in terms of their card construction and mechanical characteristics, leaning on the abovementioned embodiments.
  • the techniques described herein may equally be applicable to dual interface embedded metal cards produced using traditional offset printing. Equally, the techniques may be applicable in producing contactless smartcards without a contact interface.
  • the invention(s) described herein may relate to industrial and commercial industries, such RFID applications, payment smartcards (metal, plastic or a combination thereof), electronic credentials, identity cards, loyalty cards, access control cards, and the like.
  • FIGs The figures may generally be in the form of diagrams. Some elements in the figures may be stylized, simplified or exaggerated, others may be omitted, for illustrative clarity.
  • Some elements may be referred to with letters (“AS”, “CBR”, “CF”, “CLS”, “FC”, “MA”, “MT”, “TCM”, etc.) rather than or in addition to numerals.
  • Some similar (including substantially identical) elements in various embodiments may be similarly numbered, with a given numeral such as “310”, followed by different letters such as “A”, “B”, “C”, etc. (resulting in “310A”, “310B”, “3 IOC”), and may collectively (all of them at once) referred to simply by the numeral (“310”).
  • FIG. 1 (compare FIG. 3 of US 9,836,684) is a diagrammatic view of a front surface of a smartcard (SC) which may be a metal card, composite metal card, encapsulated metal card, metal core card or metal hybrid card having a slit (S) to function as a coupling frame (CF), according to the prior art.
  • SC smartcard
  • S slit
  • CF coupling frame
  • FIG. 2 (compare FIG. 2 of US 2018/0341847) is a diagram, of an exemplary coupling frame antenna with a track width of 3 mm, according to the prior art.
  • FIG. 3 (compare FIG. 3 of US 62889555) is a diagram of a single loop with a track width of 3 mm having termination points, according to the invention.
  • FIG. 4 is a diagrammatic view of a front surface of a smartcard (SC) which may be a metal card, composite metal card, encapsulated metal card, metal core card or metal face card having a slit (S) or notch (N) to function as a coupling frame (CF) with the slit (S) or notch (N) commencing at a perimeter edge and stopping short of the module opening (MO) with termination points located on both sides of said discontinuity, according to the invention.
  • SC smartcard
  • SC smartcard
  • S slit
  • N to function as a coupling frame
  • CF coupling frame
  • FIG. 5A (compare FIG. 5A of US 62891308) is a diagram (exploded, perspective view) of an assembly of a metal card body composed primarily of a metal layer (ML) acting as a coupling frame (CF) with a slit (S) and a back-panel referred to as a “rear card body” (RCB) for fitting into a recess area in the metal card body, also referred to as a “front card body” (FCB), according to the invention.
  • ML metal layer
  • CF coupling frame
  • S slit
  • RRCB back-panel
  • FCB front card body
  • FIG. 5B is a diagram (rear view) illustrating the shape and features of the rear card body (RCB) housing the magnetic stripe (MS) and signature panel (SP), according to the invention.
  • the rear card body may be made from a non conducting material such as fabric, plastic, carbon glass fiber, paper, film, ceramic, glass, wood, stone or any composite material.
  • the rear card body (RCB) may be made of metal featuring a slit or slits.
  • FIG. 6 is a diagram (exploded, perspective view) of an assembly of a metal card body comprising a front card body (FCB) which is a metal layer (ML) which has been anodized to be non-conductive (on its surfaces) and which has a slit (S), and contact pads protruding through the metal layer (ML, FCB), according to the invention.
  • a smaller rear card body (RCB) has a coupling loop structure (CLS) with two antenna structures (AS1, AS2), and fits into a recess in the rear surface of the front card body (FCB).
  • the antenna structures (AS) couple with the slit (S) and the module antenna (MA).
  • FIGs. 7A and 7B are diagrams - FIG. 7A is an exploded perspective view and FIG. 7B is an exploded cross-sectional view - of an exemplary transaction card construction comprising a non-conducting anodized aluminum layer on a stainless steel supporting layer, with no electrical connection between the metal layers, according to the invention.
  • the slit may have a non-linear shape, such as a curvy shape resembling the outline of a saxophone (see FIGs. 10A/B). Note that the ends of the various layers in of the card FIG. 7B are (in reality) square, not rounded (as shown).
  • FIGs. 8A and 8B are diagrams - FIG. 8A is an exploded perspective view and FIG. 8B is an exploded cross-sectional view - of an exemplary transaction card construction comprising a stainless steel supporting layer with slit, a first non-conducting anodized aluminum layer with slit and a second non-conducting anodized aluminum layer with slit, according to the invention.
  • the module pocket is configured to receive at least one of: a contactless chip module; a dual interface chip module.
  • an antenna structure is coupled to the slit (not shown). Note that the ends of the various layers in of the card FIG. 8B are (in reality) square, not rounded (as shown).
  • FIG. 9A is a diagram (exploded, perspective view) of a card stackup showing different layers applied to a metal surface (metal inlay) disguising the presence of a discontinuity by using primer, polymer coatings (synthetic resin), and ink, according to the invention.
  • FIGs. 9B, 9C and 9D are diagrams (exploded, perspective view) of a card stack-up showing different layers of the card, according to the invention.
  • FIGs. 9E, 9F and 9G are diagrams (plan view) of smartcards (or selected portions thereof), according to the invention.
  • FIG. 10A (compare FIG. 3A of US 62894976) is a sketch of a saxophone (neck, body, u- shaped bow and flared bell) in which a continuous slit passes through the instrument from the mouthpiece to the bell, accompanied by engravings to outline the structure of the instrument, according to the invention.
  • FIG. 10B (compare FIG. 3B of US 62894976) is a sketch of a saxophone with a continuous slit mechanically engraved and or laser etched in a metal card body with the slit passing entirely through a metal layer or metal card body, according to the invention.
  • FIG. 11A (compare FIG. 5A of US 62894976) is an icon representing the logo of the payment scheme "VISA" in which a continuous slit passes from the peak of the "V" to the bottom of the "A”, according to the invention.
  • FIG. 11B (compare FIG. 5B of US 62894976) is an icon representing the logo of the payment scheme "VISA” in which a continuous slit passes from the peak of the "V” to the top of the “I” and “S” and descending to the bottom of the "A", according to the invention.
  • FIG. llC (compare FIG. 5C of US 62894976) is an icon representing the logo of the payment scheme VISA with a continuous slit mechanically engraved and or laser etched in a metal card body with the slit passing entirely through a metal layer or metal card body, according to the invention.
  • FIG. 12 is a diagrammatic view of a perforated metal inlay (MI) site with a metal frame (MF) formed by laser cutting, water cutting or chemical etching, featuring what will become a front layer and rear metal layer, each having a slit (S) and module opening (MO) to act as a coupling frame (CF), and the metal frame (MF) being supported by struts (SRTs) connected to said metal frame (MF) as part of the metal inlay (MI), according to the invention.
  • MI perforated metal inlay
  • MF metal frame
  • MF metal frame
  • SRTs struts
  • FIG. 13 is a front view of a metal inlay (MI) in which the front and rear metal layers, comprising a metal frame (MF) supporting a coupling frame (CF), are folded over on each other at the point (along a line) of perforations (perfs) to create a two-layer metal sandwich, according to the invention.
  • MI metal inlay
  • MF metal frame
  • CF coupling frame
  • FIG. 14 (compare FIG. 6 of US 62979422) is a front view of a metal inlay (MI) site with a coupling frame (CF) which is suspended from a metal frame (MF) using supporting struts, according to the invention.
  • MI metal inlay
  • CF coupling frame
  • FIG. 15A is a diagram (cross-sectional view) of a smartcard (SC) with a coupling loop structure (CLS) connected with termination points (TP) of a coupling frame (CF), according to the invention.
  • FIG. 15B is a diagram (mostly cross-sectional view) of a smartcard (SC) with a coupling loop structure (CLS) having a patch antenna (PA) for coupling with the slit (S) of a coupling frame (CF), according to the invention.
  • SC smartcard
  • CLS coupling loop structure
  • PA patch antenna
  • RFID cards and electronic tags in the form of pure contactless cards, dual interface cards and electronic identity cards may be discussed as exemplary of various features and embodiments of the invention(s) disclosed herein.
  • many features and embodiments may be applicable to (readily incorporated in) other forms of smartcards, such as EMV payment cards, metal composite cards, encapsulated metal cards, solid metal cards, metal veneer cards, metal hybrid cards, metal foil cards, access control cards and secure credential cards.
  • any one of the terms “transponder”, “tag”, “smartcard”, “data carrier”, “wearable device” and the like may be interpreted to refer to any other of the devices similar thereto which operate under ISO 14443 or similar RFID standard.
  • This disclosure relates to the field of RFID-enabled metal transaction cards and, more particularly, metal transaction cards having an internal flexible circuit connected to termination points across a discontinuity in the metal card body or to termination points across a gap in a coupling frame antenna, and to direct the pick-up currents to an antenna structure in close proximity to the module antenna of a transponder chip module for inductive coupling.
  • FIG. 1 illustrates a smartcard (SC) which may be a metal card, composite metal card or encapsulated metal card having a slit (S) to function as a coupling frame (CF).
  • SC smartcard
  • S slit
  • CF coupling frame
  • FIG. 300 illustrates the front side of a smartcard (SC) 300 which may be a metal card having a metal layer (ML), which may constitute substantially the entire thickness of the card body (CB) 102.
  • the card body (CB) may have a module opening (MO) 108 wherein a transponder chip module (TCM) 110 may be disposed, and a slit (S) 130 extending from the module opening (MO) to the outer perimeter of the metal layer (ML) so that the metal card body (MCB) 102 may function as a coupling frame (CF) 120.
  • SC smartcard
  • MCM transponder chip module
  • S slit
  • the metal layer (ML) (or card body CB, or metal card body MCB) may comprise titanium, and is provided with a slit, slot or gap in the metal to create an open loop coupling frame closely adjacent to and substantially fully surrounding the transponder chip module (TCM).
  • the slit (S) may overlap a portion of the module antenna (MA) 112 of the transponder chip module (TCM).
  • FIG. 2 is a diagram of an exemplary coupling frame antenna (CFA) with a track width of approximately 3 mm.
  • the design shown illustrates a continuous closed loop single track coupling frame antenna (CFA) 202 placed within the perimeter defined by the card body (CB) 201.
  • CFA coupling frame antenna
  • the outer edges of the coupling frame antenna (CFA) 202 may extend to the periphery of the card body (CB) 201 or be offset from the edge of the smartcard by some distance to aid lamination or other assembly of the smartcard’ s additional layers.
  • the path defined by the coupling frame antenna (CFA) 201 extends inwards towards and around the module opening (MO) 204.
  • the length, width and track thickness of the coupling frame antenna (CFA) 202 in the vicinity of the module opening (MO) 204 may be set as to provide an optimum overlap with the module antenna (MA) of the transponder chip module (TCM).
  • the shape of the coupling frame antenna as it extends inwardly from the left (as viewed) side of the card body to the module opening area, results in two side-by-side portions of the coupling frame antenna (CFA) being closely adjacent each other, with a gap therebetween. This gap may be comparable to the slit (S) in a conventional coupling frame (CF)
  • a metal card body (MCB) with a discontinuity may be represented by a one turn antenna circuit.
  • the terminal ends of the antenna may be galvanically (physically electrically) connected to a coupling loop structure (CLS) on a flexible circuit (FC) to interface with the module antenna (MA) of a transponder chip module (TCM).
  • CLS coupling loop structure
  • FC flexible circuit
  • AS antenna structure
  • the discontinuity in the metal card body (MCB) may or may not extend to the module opening (MO).
  • FIG. 3 is a diagram of a coupling frame antenna (CFA) having a single (one) track extending almost entirely around a peripheral area of the card body (CB), and having two spaced-apart ends with termination end points (TP).
  • the coupling frame antenna is open loop, and may have a track width of approximately 3mm.
  • a separation (S) or gap 303 between the two ends of the coupling frame antenna is analogous with a discontinuity (slit) in a metal layer (ML).
  • the gap may be, for example, 1mm.
  • the coupling frame antenna (CFA) 302 shown in FIG. 3 does not have a portion surrounding a module opening.
  • the termination end points (TPs) 304 may be connected to corresponding termination end points (TPs) on a flexible circuit (FC, FIG. 15A) disposed with a coupling loop structure (CLS) including an antenna structure (AS) located under the module antenna (MA) of a transponder chip module (TCM).
  • FC flexible circuit
  • CLS coupling loop structure
  • AS antenna structure
  • MA module antenna
  • TCM transponder chip module
  • FIG. 4 is a diagrammatic view of a front surface of a smartcard (SC) which may be a metal card, composite metal card, encapsulated metal card, metal core card or a metal face card having a slit (S) or notch (N) to function as a coupling frame (CF), extending to a central area between the periphery edge of the metal card and an area for the module opening.
  • a smartcard which may be a metal card, composite metal card, encapsulated metal card, metal core card or a metal face card having a slit (S) or notch (N) to function as a coupling frame (CF), extending to a central area between the periphery edge of the metal card and an area for the module opening.
  • S slit
  • N notch
  • the termination end points (TPs) are connected to a flexible circuit (FC) (FIG. 15A) disposed with a coupling loop structure (CLS) which is closely positioned under the module antenna (MA) of the trans
  • ML metal layer of a card body (CB), or a metal card body (MCB)
  • a flexible circuit (FC) with coupling loop structure (CLS) connected to termination end points (TPs) on the coupling frame (CF) or conductive layer direct surface eddy currents from the perimeter edge of the conductive layer to the coupling loop structure (CLS) on the flexible circuit (FC) to inductively couple with the module antenna (MA), providing power to the RFID chip (IC) in the transponder chip module (TCM).
  • FC flexible circuit
  • CLS coupling loop structure
  • TPs termination end points
  • CF coupling frame
  • conductive layer direct surface eddy currents from the perimeter edge of the conductive layer to the coupling loop structure (CLS) on the flexible circuit (FC) to inductively couple with the module antenna (MA), providing power to the RFID chip (IC) in the transponder chip module (TCM).
  • the cross-sectional construction of an exemplary metal face transaction card may comprise a non-conducting anodized aluminum layer on a stainless steel supporting layer, with no electrical connection between the metal layers.
  • the slit on the front face metal layer may be curved, meandering, having the shape of a saxophone or made up of tangents emanating from the module opening.
  • This disclosure also relates to the field of RFID-enabled transaction cards and, more particularly, transaction cards having at least one metal layer coated to make the surface non- conductive.
  • FIG. 5A illustrates an exploded view of a metal card construction with a transponder chip module (TCM) 501, front card body (FCB) 502, a slit (S) 504 extending from a perimeter edge of the card body to an area close to the module opening (MO) 503 and an adhesive film (AF) not shown.
  • the rear card body (RCB) 508 may accommodate the magnetic stripe (MS) 510 and signature panel (SP) 511.
  • the rear card body (RCB) may comprise a metal layer with a slit or slits. The metal layer may be oxidized (or anodized) so that its surface is rendered non-conductive.
  • the transponder chip module may be a wire bonded module or a flip-chip module.
  • the metal layer may be made of two metal layers rolled together, such as aluminum and stainless steel.
  • the inner face of the rear card body (RCB) 508 may feature a flexible circuit with an antenna structure to overlap the slit (S) and the module antenna (MA) of the transponder chip module (TCM) 501, to direct induced eddy currents around the module antenna (MA) and permitting inductive coupling.
  • FIG. 5B shows the outer face of the rear card body (RCB) 508.
  • the RCB shown features a magnetic stripe and a signature panel with both elements integrated into the non-conductive material. Therefore, a recess may not be necessary to accommodate the elements.
  • the rear card body (RCB) does not feature a module opening (MO).
  • the slit (S) 504 may describe any shape, including spiral, curved, meandering, in order to optimize the overlap of the coupling frame with the antenna structure (AS) assembled to the rear card body (RCB).
  • the slit may be injected molded with a resin or fiber glass for reinforcement.
  • the rear card body may also accommodate the placement of a security hologram, logo or other feature.
  • logos may be CNC milled or diamond cut.
  • FIG. 6 shows a diagram (perspective view) illustrating an assembly of a metal card body having a front card body (FCB) consisting of a metal layer (ML) 602 with a slit (S) 604, and acting as a coupling frame (CF).
  • FCB front card body
  • ML metal layer
  • S slit
  • CF coupling frame
  • Contact pads (CP 601) for effecting a contact interface may protrude through a plurality of individual openings (e.g., one per contact pad) in the metal layer.
  • the contact pads (CP) 601 are shown protruding through the anodized metal layer there may be a plurality of openings for a corresponding plurality (typically six or eight) of contact pads, and each individual opening (for a given contact pad) may measure approximately 2mm x 2mm, for example.
  • a rear card body (RCB) 608 with an coupling loop structure (CLS) is mounted in a recess on the rear surface of the front card body.
  • the rear card body may be a layer of an insulating material.
  • the coupling loop structure has an antenna structure (AS1) coupling with the slit (S), and another antenna structure (AS2) coupling with a module antenna (MA) 605 of a transponder chip module (TCM, not shown), and may be formed from a flexible circuit (FC, a flexible substrate with conductive traces).
  • a magnetic stripe (MS) 610 and a signature panel (SP) 611 may be disposed on the rear surface of the rear card body.
  • FIGs. 5A/B and 6 may bear some resemblance to FIGs. 4,5,6 of US 20180341846 which show, for example:
  • FIG. 4A illustrates an exploded view of a solid metal smartcard comprising two metal layers (ML) attached together (joined with one another) by an adhesive film (AF) 405.
  • the front card body (FCB) 402 composed of a metal layer (ML) contains a first module opening (MOl) 403 that accepts a specially designed transponder chip module (TCM) 401.
  • the front card body (FCB) 402 may have thickness 760 pm to 800 pm
  • the rear card body (RCB) 408 fits into a pocket milled, etched, stamped or otherwise formed in the rear side of the front card body (FCB) 402.
  • the front card body (FCB) 402 comprises a first slit (SI) 404 that allows the front card body (FCB) 402 to perform as a coupling frame (CF).
  • the module antenna on the transponder chip module (TCM) 401 may have suitable overlap with the front card body (FCB) 402 to allow optimum performance of the device when operating in contactless communication with an external reader.
  • FCB/RCB construction disclosed herein, versus the FCB/RCB teachings of '846 is that whereas the RCB in '846 is a metal layer (ML) with a slit (i.e., a coupling frame), the RCB disclosed herein is a non-conductive material (e.g., plastic), not metal, and supports two antenna structures (AS), in a manner similar to that of a flexible circuit (FC) with contact loop structure (CLS; see FIG. 15).
  • ML metal layer
  • AS antenna structures
  • FIGs. 7A and 7B illustrate an exemplary construction for a transaction card or smartcard construction comprising two metal layers with slits (functioning as coupling frames): a non conducting anodized aluminum (metal face) layer on a stainless steel (supporting) layer, with no electrical connection between the metal layers. (An insulating adhesive layer is disposed between the two metal layers.)
  • the construction of the smartcard 700 may be, as follows, from front-to-rear (all dimensions approximate and exemplary):
  • slit S
  • micro-slit extending from a peripheral edge of the metal layer 704 to the module opening 706.
  • the shape of the slit may be curved (FIGs. 10A/B).
  • TCM transponder chip module
  • Adhesive Layer thermosetting epoxy: 50 pm 714 Supporting Metal Layer (Stainless): 250 pm
  • the slit (S) may be straight.
  • Plastic backing layer(s) (Laser-engravable Overlay Material) which may be the same color as the metal face 704, 50 pm, with and an inkjet-printed layer of 15 pm: 65 pm
  • a magnetic stripe and signature panel (not shown) may be disposed on the rear (exposed) surface of the rear overlay 722,
  • Total thickness less than 800pm (post lamination, depends on the shrinkage of the adhesive and synthetic layers)
  • the adhesive layers may be "free standing” (individual layers applied to an underlying or overlying surface), or they may be part of a “bonding layer", such as thermosetting epoxy applied on both sides of a PEN or PET carrier.
  • FIGs. 8A and 8B illustrate an exemplary construction for a transaction card or smartcard construction comprising three metal layers with slits (functioning as coupling frames): a stainless steel supporting layer with slit, a first non-conducting anodized aluminum layer with slit and a second non-conducting anodized aluminum layer with slit, as an alternative construction to that which was shown in FIG. 7.
  • the module pocket (or module opening) is configured to receive at least one of: a contactless chip module; a dual interface chip module.
  • a contactless chip module Internal to the card body construction an antenna structure is coupled to the slit (not shown).
  • US 9,836,684 shows some card body constructions having multiple (three) metal layers with slits. See FIGs. 9, 15B, 16A therein.
  • the construction of the smartcard 800 may be, as follows, from front-to-rear (all dimensions approximate and exemplary): - Metal Face with micro-slit, Aluminum layer: 215 mhi (Anodized with a 12 to 18 mhi oxidized surface) and protected with a scratch resistant UV hard coat.
  • non-conducting anodized aluminum layer is joined or attached to first side of the stainless steel layer.
  • non-conducting anodized aluminum layer is joined or attached to second side of the stainless steel supporting layer.
  • any sort of direct or indirect connection between first non-conducting anodized aluminum layer, second non-conducting anodized aluminum layer, and the respective sides of stainless steel layer (including through intermediary layers) will suffice.
  • connection methods e.g., adhesive spray coating on, press-fitting in, or adhering to the stainless steel supporting layer
  • connection methods e.g., adhesive spray coating on, press-fitting in, or adhering to the stainless steel supporting layer
  • Color may be introduced to transaction card by dye-sublimation, an overcoat or by adding pigments and/or dyes into the aluminum body.
  • Additional decorative features may be CNC machined or produced using inkjet, drop on demand printing, or laser ablation.
  • a signature panel may be produced by ablating/etching a portion of the non-conducting anodized aluminum body, thereby making that particular area of the card body receptive to ink or dye.
  • the user's signature can be digitized and then laser engraved onto the non conducting anodized aluminum card body.
  • Transaction card may be characterized by the nominal dimensions of a standard sized card (e.g., 3.37" x 2.125" x 0.03").
  • a standard sized card e.g., 3.37" x 2.125" x 0.03.
  • the metal core may be any suitable metal, such as stainless steel, bronze, copper, titanium, tungsten carbide, nickel, palladium, silver, gold, platinum, aluminum, or any alloy which gives the card most of its body (structure) and weight.
  • core layer may be one or a composite of any suitable polymeric (e.g., polycarbonate, polyester, PVC, PETG, PLA, and blends thereof) and inorganic (e.g., glass, ceramic, cellulosic) material. The invention is not limited, however, to any particular material.
  • core layer includes both a layer of metal connected to a second layer of polymeric or inorganic material.
  • core layer includes a plurality of bonded metal layers.
  • a pocket is provided in the layers for receiving a contactless chip module or dual interface module.
  • a slit may be defined to receive an antenna structure for use in connection with an RFID chip, which can be disposed below the aluminum or stainless steel layer.
  • the aluminum layer receives a surface finish.
  • Surface finishing can include any method suitable for the particle materials of the layer such as, e.g., bead blasting, tumbling, brushing, etc.
  • a laser-cut slit may be reinforced with filler such as a resin, epoxy, mold material, repair liquid or sealant applied and allowed to cure to a hardened state or flexible state.
  • the filler may be dispensed or injection molded.
  • This disclosure further relates to RFID-enabled transaction cards and, more particularly, transaction cards having at least one layer of metal with a slit. Techniques to camouflage the slit with graphic elements and methods to reinforce the slit in a metal layer are presented.
  • FIG. 9A is a perspective view of the different layers applied to a metal surface (metal inlay) disguising the presence of a discontinuity by using primer, polymer coatings (synthetic resin) and ink, according to the invention.
  • FIG. 9B is a perspective view of the different layers in the stack-up construction of a metal face smartcard with the front face metal layer having a shaped slit starting at a perimeter edge of the metal card body and ending at the module opening to form a coupling frame, with the front face metal layer coated with an adhesion promoter or primer, followed by the selective application of ink to print a filigree pattern and graphic elements on the coated metal surface, disguising the presence of the shaped slit behind the printed artwork, with the printed artwork protected by a coating of varnish, and on top thereof raised characters are digitally printed before personalization, according to the invention.
  • FIG. 9C shows a variation in the stack-up construction of FIG. 9B, interchanging the position of the ink layer bearing the embossed alphanumeric characters, with the protective varnish layer as the final outer layer in the smartcard assembly before personalization, according to the invention.
  • FIG. 9D shows a further variation in the stack-up construction of FIG. 9C with the addition of a concealing ink layer hiding the presence of the underlying slit.
  • the concealing ink layer is electromagnetic transparent and does not attenuate the field generated by the contactless POS terminal, according to the invention.
  • FIG. 9E is a front view of a metal face smartcard 900E with a shaped slit commencing at a top comer peripheral edge of the card body, disappearing under the printed border disguising its presence, with the slit descending downwards behind the border to a center position before crossing over to a module opening, according to the invention.
  • FIG. 9F is a detailed view of the shaped slit in the front face metal layer of the smartcard 900E and its disappearance under the printed border, according to the invention.
  • FIG. 9G is a detailed view of the non-exposed slit in the front face metal layer of the smartcard 900E after the selective deposition of a concealing ink layer to the surface of the metal, according to the invention.
  • FIG. 9A illustrates a front portion of a smartcard comprising: different layers applied to a metal surface (metal inlay) disguising the presence of a discontinuity (slit) in the metal layer by using primer, polymer coatings (synthetic resin), and ink.
  • a rear portion of the card may comprise (compare plastic backing layer(s) 722, FIG. 7A).
  • the stackup of the card 900 may be, from bottom (rear) to top (front):
  • MO - module opening (MO) in the metal layer for receiving a TCM (not shown)
  • S S - slit
  • CF coupling frame
  • Each of the layers 903, 907, 908, 909 may have a module opening aligned with the module opening (M) in the metal layer 902
  • the discontinuity (slit S) in the metal layer may be disguised or masked with baked-on ink and a plurality of coatings applied to the metal layer.
  • An adhesion promoter or primer may be first applied to the metal layer, followed by a coating (or sealant) and an ink layer which is baked-on to the coated surface, and further protected by a top-coat layer.
  • the coating and protective polymers may be a blend of polyurethane and polyester, or an acrylic base coating.
  • the gloss level (low or high) depends on the quality and smoothness of the metal surface, the color of the baked-on ink, the amount and type of coatings applied and the use of any dulling agents.
  • the primer and ink may be applied at a defined viscosity.
  • FIG. 9A is a perspective view of the different layers applied to a metal surface (metal inlay) disguising the presence of a discontinuity by using primer, polymer coatings (synthetic resin) and ink.
  • the assembly of the different layers to the metal surface (metal inlay) in FIG. 9A represents the top section in the stack- up construction of a dual interface metal smartcard (SC). Not shown are the layers which form the bottom section in the stack-up construction which include an adhesive layer, printed synthetic layer and an overlay layer with magnetic stripe.
  • SC dual interface metal smartcard
  • a UV hard coat layer on a release carrier layer may be further laminated to the top-coat layer (protective polymer coating).
  • the UV hard coat layer may be laser engravable.
  • the top-coat layer may be laser engravable.
  • the first coating or sealant (polymer coating) on the primer may be omitted.
  • the UV hard coat or diamond coat layer may be a clear, matte or have a mechanical brush effect.
  • ink layer (908) and top coated layer (909) are baked onto the metal inlay with an array of card body sites each with a slit
  • the metal inlay with baked-on-ink and a top coat for scratch protection can be further processed with digital printing of ink to the top coat layer and further protected by a layer of varnish.
  • the additional ink layer may be further divided into two printed ink layers separated by a clear ink layer (not shown).
  • baked-on ink has been emphasized, but equally any other form of ink and its deposition, coating or printing could equally be applicable.
  • FIGs. 9B,C,D illustrate an alternate construction for a smartcard (SC) wherein a second, underlying, supporting metal layer with a slit is provide.
  • the two metal layers i.e., a front face metal layer with a slit, and the underlying supporting metal layer with a slit
  • the slits in the two metal layers should be located at different positions and/or orientations than one another, such as suggested in US 9836684 ( attention is directed to FIG. 15B, therein).
  • FC flexible circuit
  • CLS coupling loop structure
  • TCM transponder chip module
  • FIG. 9B is a perspective view of the different layers in the stack-up construction of a metal face smartcard (SC) 900B with the front face metal layer having a shaped slit (S) starting at a perimeter edge of the metal card body (MCB) and ending at the module opening to function as a coupling frame (CF), with the front face metal layer coated with an adhesion promoter or primer, followed by the selective application of ink to print a filigree pattern and graphic elements on the coated metal surface, disguising the presence of the shaped slit behind the printed artwork, with the printed artwork protected by a coating of varnish, and on top thereof raised characters (embossed) above the surface of the card are digitally printed.
  • SC metal face smartcard
  • S shaped slit
  • MBC metal card body
  • CF coupling frame
  • the front face metal layer with a shaped slit is mechanically reinforced by an underlying supporting metal layer with a slit which is offset from the slit in the front face metal layer, and the supporting metal layer is electrically separated from the front face metal layer by a dielectric layer with double-sided adhesive to bond both of the (front face, supporting) metal layers together.
  • the shaped slit in the front face metal layer may be filled with an epoxy or resin prior to assembly with the supporting metal layer.
  • FIG. 9B shows the construction of a smartcard (SC) 900B, having the following stackup of layers.
  • the layers may be described starting with the front face metal layer with slit, and working both up (towards the front face of the card) and down (towards the rear face of the card) therefrom. Some details, which have already been described elsewhere, may be omitted from this description, for the sake of brevity.
  • each layer may have a front surface and a rear surface.
  • a coating may be introduced to fill the slit.
  • the layers 920-928, behind the front face metal layer 902 may be the same as shown in FIG. 9B, and may be added below the metal layer 902 in FIG. 9A.
  • the stack-up construction of a metal face smartcard may be as follows:
  • the slit may be filled with a UV curing epoxy or a two-component adhesive, dispensed as a microfluidic droplet for in situ bonding of the slit under pressure / vacuum control.
  • a primer may be first applied to the stainless steel layer followed by a digitally printed UV curing ink selectively deposited around the area of the slit to camouflage its presence, further discussed in detail below.
  • a digitally printed UV curing ink selectively deposited around the area of the slit to camouflage its presence, further discussed in detail below.
  • the features may be directly lasered into the metal.
  • the metal may also be coated with a baked-on ink layer.
  • the coated or silk screen printed UV protective varnish layer may be replaced by a UV hard coat layer.
  • the post lamination varnish may include the printing of graphic features and borders.
  • the shaped slit in the front face metal layer may be filled with an epoxy or resin, may be sealed with an adhesion promoter or primer, and camouflaged with ink or artwork
  • the surface of the metal inlay may be pretreated with a catalyzed screen ink and when cured forms a hard heat and chemical resistant film which can be produced in a gloss or matt finish depending on the hardener or additives used.
  • the hardener determines the viscosity of the ink and may fill and cover the slit after application.
  • FIG. 9C shows a variation in the stack-up construction of FIG. 9B, interchanging the position of the ink layer bearing the embossed alphanumeric characters, with the protective varnish layer as the final outer layer in the smartcard assembly before personalization.
  • FIG. 9C shows the construction of a smartcard (SC) 900C, having the following stackup of layers.
  • the layers may be described starting with the front face metal layer with slit, and working both up (towards the front face of the card) and down (towards the rear face of the card) therefrom. Some details, which have already been described elsewhere, may be omitted from this description, for the sake of brevity.
  • each layer may have a front surface and a rear surface.
  • ink layer 910 may be optional 912 protective varnish layer
  • the layers 920-928, behind the front face metal layer 902 may be the same as shown in FIG. 9B, and may be added below the metal layer 902 in FIG. 9A.
  • the first ink layer (908) disposed on the primer layer (904) may be divided into two printed ink layers, one carrying graphical artwork while the other carrying other features and information, separated by a clear ink layer (not shown).
  • a discontinuity in a metal layer may be camouflaged with (i) an epoxy or resin filling the slit; (ii) a primer and a coating layer applied to a micro slit ( ⁇ 50 pm) and overprinted with CMYK ink, and or (iii) applying a metal foil laminate to a metal layer or metal inlay with an array of card body sites.
  • a discontinuity in a metal layer can be optically disguised or concealed by a metallic ink layer, a pearl ink layer, a metallic brush effect, or mechanical brush effect in the design of the ink. This may be considered as a concealing ink layer.
  • Metallic ink is a varnish or vehicle containing metallic particles.
  • Common metals used to manufacture metallic ink include copper, aluminum, bronze or zinc. When metallic ink is printed and left to dry, the metallic particles rise to the surface, reflecting light and creating a metallic sheen.
  • Metallic inks create a similar, but less intense, effect than foil stamping because they are applied as paste or liquid ink, versus a thin sheet of metal foil applied directly on top of a substrate.
  • the metallic ink may be deposited on a metal surface or a pretreated/coated metal surface and selectively made conductive by exposure to light radiation (photo-sintering).
  • US 10,231,344 discloses a metallic ink forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.
  • Electrical resistance value of normal metallic inks is about 10 45 W, while the electrical resistance of non-conductive metallic ink is over 10 9 W.
  • metallic ink may be applied to a metal surface with a slit, covering the metal surface including filling the slit.
  • the ink is cured with intense light radiation which causes nanoparticles in the ink to become conductive, but at those areas (e.g., in the slit) where the intense light radiation is not applied, the ink cures in an atmospheric environment, and the area (e.g., the slit) remains non-conductive because the nanoparticles have not bonded.
  • Light-curable, metallic ink containing nanoparticles may also be blanked deposited on a metal surface, then selectively exposed to high intensity light to form conductive patterns, such as lines or traces, in a manner similar to forming patterns in photoresist for semiconductor or printed circuit board fabrication. This technique can be used to form some of the antenna structures described herein. Pearl Tnk
  • Pearlescent inks producing a shimmering pearl effect may be used as a replacement for a metallic ink.
  • US 6749123 discloses the printing of pearl ink in producing a transaction card.
  • the exemplary ink gradient for each card is printed using known printing inks suitably configured for printing on plastic, such as Pantone colors.
  • the ink used for the stippling is a silver pearl ink and is applied to the outside surface of each plastic sheet.
  • Ink gradient is printed on the surface of each of the sheets using a silk screen printing process which provides an opaque, heavier ink coverage or using offset printing process which provides halftone images in finer detail.
  • the words “American Express” are printed in Pantone 8482 using a similar silkscreen process.
  • Pearlescent pigments are often employed in printing inks to create impressionable and appealing smartcards, since they provide both natural pearl shine and the effect of goniochromism. With respect to their interaction with light, the pigments used in printing inks can be divided into absorption and effect pigments. The latter have become increasingly important in graphic arts industry because of their ability to create the range of optical effects - the effect of metals, shine, change of perceived color with the change of viewing angle or the angle of illumination (effect knows as goniochromism) etc. Pearlescent pigments belong to the special effect pigments due to their goniochromatic properties, as well as the possibility to produce the effect of pearl luster.
  • the metallic grain effect can be achieved in the graphic design settings such as the gradient direction for metallic texture, distribution, noise, motion blurriness, foreground color and brush opacity.
  • FIG. 9D shows a further variation in the stack-up construction of FIG. 9C with the addition of a concealing ink layer hiding the presence of the underlying slit.
  • the concealing ink layer is electromagnetic transparent and does not attenuate the field generated by the contactless POS terminal.
  • the concealing ink may be a metallic ink (non-conductive around the area of the slit), a pearl ink having poor electrical conductivity, or the concealing ink layer may be achieved by a mechanical brush effect accomplished by artwork design using drop on demand printing.
  • FIG. 9D shows the construction of a smartcard (SC) 900D, having the following stackup of layers.
  • the layers may be described starting with the front face metal layer with slit, and working both up (towards the front face of the card) and down (towards the rear face of the card) therefrom. Some details, which have already been described elsewhere, may be omitted from this description, for the sake of brevity.
  • each layer may have a front surface and a rear surface.
  • a coating may be introduced to fill the slit.
  • ink layer 910 may be optional 912 protective varnish layer
  • the concealing ink layer (906) and the first ink layer (908) disposed on the primer layer (904) may also be separated by a clear ink layer (not shown).
  • FIG. 9E is a front view of a metal face smartcard 900E with a shaped slit commencing at a top corner peripheral edge of the card body, disappearing under the printed border disguising its presence, with the slit descending downwards behind the border to a center position before crossing over to a module opening (MO).
  • the laser cut slit may be 50 pm wide and may be only visible from a certain angle.
  • the slit may be filled with a clear adhesion promoter or primer before ink printing, to further disguise its presence.
  • the decorative features may be post lamination varnish accomplished through digital printing of flexible and hard inks.
  • FIG. 9F is a detailed view of the shaped slit in the front face metal layer of the smartcard 900E, its disappearance under the printed border, and its exposure or visibility at the edge of the card body and at the area around the module opening (MO).
  • FIG. 9G is a detailed view of the non-exposed slit in the front face metal layer of the smartcard 900E after the deposition of a concealing ink layer to the surface of the metal
  • the strategy to camouflage or disguise a discontinuity in a front face metal inlay with an array of card bodies, in producing metal face smartcards is to: (i) fill the slit with an epoxy or resin at each card body site in the metal inlay for electrical isolation; (ii) reinforce the mechanical robustness by adhesively attaching a supporting metal inlay with offset positioned slits to the front face metal inlay; (iii) prime the metal inlay surface with an adhesion promoter or primer; (iv) hide the existence of the underlying slits with a concealing ink layer comprising of CMYK ink, metallic ink, pearl ink or with a fake design such as a mechanical brush effect.
  • thermosetting epoxy adhesive is used to join the metal layers, and to attach a metal layer to a synthetic layer.
  • FIG. 9A is illustrative of the following process steps (method): laser cut slits and openings in a front face metal layer for an antenna circuit at each card body site in an array forming a metal inlay; prime the surface of the front face metal inlay for coating adhesion; fill or seal the slits with a coating for electrical insulation while covering the entire area of the metal inlay; print ink on the coated front face metal inlay for color and graphics while simultaneously concealing the slits with design effects for camouflage; protect the printed artwork with a top coating for surface enhancement and longevity; optionally support the front face metal inlay with a second metal inlay having offset positioned slits using thermosetting epoxy on both sides of a dielectric for mechanical reinforcement; followed by lamination of the synthetic layers, mechanical engraving of logos to the front face metal inlay, and metal card body singulation; before personalizing with laser engraving of card holder data.
  • the ink and coating may be applied and baked on before the second metal inlay is attached or after it is attached.
  • the top coating can be further protected with a UV hard coat or diamond coat.
  • the top coating may be replaced by the UV hard coat.
  • the UV hard coat may be clear, matte, or have a mechanical brush effect.
  • FIGs. 9B and 9C are illustrative of the following process steps (method): laser cut slits and openings in a front face metal layer for an antenna circuit at each card body site in an array forming a metal inlay; fill or seal the slits with an epoxy, resin or coating for electrical insulation; support the front face metal inlay with a second metal inlay having offset positioned slits using thermosetting epoxy on both sides of a dielectric layer for mechanical reinforcement; prime the surface of the front face metal inlay for ink adhesion; print ink on the front face metal inlay for color and graphics as well as to disguise the presence of the slits; protect the printed artwork with a top coating for surface enhancement and longevity; followed by lamination of the synthetic layers and metal card body singulation; before personalizing with data of the intended card holder by means of laser engraving and or printing.
  • FIG. 9D is illustrative of the following process steps (method): laser cut slits and openings in a front face metal layer for an antenna circuit at each card body site in an array forming a metal inlay; fill or seal the slits with an epoxy, resin or coating for electrical insulation; support the front face metal inlay with a second metal inlay having offset positioned slits using thermosetting epoxy on both sides of a dielectric layer for mechanical reinforcement; prime the surface of the front face metal inlay for ink or coating adhesion; conceal the slits with ink and design effects for camouflage; print ink on the front face metal inlay for color and graphics; protect the printed artwork with a top coating for surface enhancement and longevity; followed by lamination of the synthetic layers and metal card body singulation; before personalizing with data of the intended card holder by means of laser engraving and or printing.
  • Embossed characters or graphics may be applied before or after the application of the protective varnish layer by the process of post lamination varnish.
  • the concealing ink layer may comprise of CMYK ink, metallic ink, pearl ink or with a fake design effect such as a mechanical brush.
  • a non- attenuating metal foil layer may be applied to the front face metal inlay surface to cover the slits.
  • a UV hard coat layer may be laminated to the protective varnish layer or may replace the protective varnish layer.
  • a narrow slit in a metal inlay can be filled with an epoxy or resin
  • a slit in a metal inlay can be primed and sealed with a non-conductive medium using a digital printing press to dispense a polymer coating
  • a slit in a metal inlay can be filled with an adhesive epoxy as a result of the lamination of the card assembly under pressure, temperature and dwell time, with the epoxy flowing into, filling and curing within the slit.
  • FIGs. 10A/B and 11A/B/C show some examples of smartcards having metal card bodies (MCB) with slits (S) enabling the metal card bodies to function as coupling frames (CF), wherein the slits are shaped to suggest (to a user) readily recognizable objects, or logos, or the like, such as a saxophone (FIGs. 10A/B) or the VISATM logo (FIGs. 11A/B/C).
  • MMB metal card bodies
  • S slits
  • CF coupling frames
  • FIG. 10A is a sketch of the outline (profile) of a non-linear, curvy, readily-recognizable object such as a saxophone (neck, body, u-shaped bow and flared bell).
  • a continuous slit (S, shown as a dark line) may be disposed along a portion of the outline of the saxophone, such as from the mouthpiece to the bell.
  • the slit (S) will be the slit in a metal layer or metal card body, enabling the metal layer or metal card body to function as a coupling frame.
  • Remaining portions of the outline, making the saxophone more recognizable may be engravings (or markings) which have only an aesthetic purpose, and no "functional" purpose.
  • the portion of the object (FIG. 10) or logo (FIG. 11) forming the slit (S) may be an incomplete outline of the object or logo (FIG. 11), and some remaining portions of the object or logo may be printed, or engravings, etc.
  • FIG. 10B shows a smartcard (SC) with the saxophone "image" of FIG. 10A with the slit (S) extending continuously from a peripheral edge of the card body (CB) to a module opening (MO) in the card body.
  • the slit may be mechanically engraved and or laser etched in a metal card body (MCB), with the slit (S) passing entirely through a metal layer or metal card body.
  • FIG. 11A shows an icon representing the logo of the payment scheme VISA in which a continuous slit passes from the peak of the V to the bottom of the A.
  • FIG. 11B shows an icon representing the logo of the payment scheme VISA in which a continuous slit (S) passes from the peak of the V to the top of the I and S and descending to the bottom of the A.
  • S continuous slit
  • FIG. llC shows a smartcard (SC) with an icon representing the logo of the payment scheme VISA with a continuous slit (S) mechanically engraved and or laser etched in a metal card body with the slit passing entirely through a metal layer (ML) or metal card body (MCB).
  • SC smartcard
  • S continuous slit
  • ML metal layer
  • MBC metal card body
  • This disclosure also relates to metal transaction cards, in particular the manufacturing process of producing metal inlays which form an integral part of a metal transaction card with contact and contactless functionality.
  • the metal inlays may be laser cut from an endless web of metal, with laser cut steps replacing timing consuming card milling steps.
  • FIG. 12 illustrates a perforated metal inlay (MI) site with a metal frame (MF) formed by laser cutting, water cutting or chemical etching, featuring a front and rear metal layer with a slit (S) and module opening (MO) to act as a coupling frame (CF), and the coupling frame (CF) supported by stmts (SRTs) connected to said metal frame (MF), with the metal frame (MF) having alignment holes (ah) for later precision punching or cutting, in facilitating the singulation of a metal card body (MCB) from a laminated metal inlay (MI) with front and rear plastic layers.
  • MI perforated metal inlay
  • the coupling frame (CF) is separated from the metal frame (MF) by a laser cut air gap (ag).
  • a laser cut air gap (ag).
  • a dielectric layer with an adhesive coating on each side which is positioned between the front and rear metal layers, prior to the front and rear metal layers being folded over on each other to form a metal core in a plastic-metal-plastic smartcard.
  • TCM transponder chip module
  • the shape and size of a transponder chip module (TCM) fits precisely the laser cut opening (MO) in the front and rear metal layers.
  • the openings may be stuffed (filled) with a plastic slug prior to lamination with upper and lower plastic layers.
  • FIG. 13 illustrates a metal inlay (MI) in which the front and rear metal layers, consisting of a metal frame (MF) supporting a coupling frame (CF), are folded over on each other at the point of perforations (perfs).
  • the coupling frame (CF) is supported in the metal frame (MF) by stmts (SRTs), resulting in an air gap (ag).
  • Alignment holes (ah) are used to precisely position the front and rear metal layers during the folding process.
  • a slit (S) is disposed in the front and rear metal layers forming the coupling frame (CF). Not shown is a dielectric layer placed between the folded metal layers.
  • the resulting metals layers are laminated together and in the same or in a second lamination step, front and rear plastic layers are laminated to the metal inlay (MI) so as to achieve an overall thickness of approximately 600 pm.
  • MI metal inlay
  • the metal inlay shrouded in plastic is treated with a primer in preparation for digital printing, and the addition of overlay layers to reach ISO thickness conformity.
  • FIG. 14 illustrates a metal inlay (MI) disposed with a metal frame (MF) supporting a coupling frame (CF) which is suspended from the metal frame (MF) using supporting struts.
  • the coupling frame (CF) has a slit which extends from the perimeter edge of the metal card body (MCB), but does not extend to the module opening (MO).
  • Alignment holes (ah) in the metal inlay (MI) may be later used for registration in precise cutting or punching of the individual metal card body (MCB) sites.
  • a method for forming (making) a metal inlay (MI) for a smartcard (SC) having two metal layers (ML1, ML2), each metal layer having a module opening (MO) and a slit (S) extending from a peripheral edge of the given metal layer to the module opening in the metal layer so that the metal layer may function as a coupling frame (CF).
  • the method generally involves: starting with (providing) a single metal substrate, forming the two metal layer coupling frames essentially side-by-side in the substrate, then folding the substrate over so that the two metal layer coupling frames are stacked (disposed) one atop the other, while providing a layer of insulating material between the two coupling frames.
  • the metal inlay may be laminated with upper and lower plastic and adhesive layers to produce a pre-laminated inlay which completely shrouds the metal with plastic. During corona treatment, no metal is exposed.
  • the card body sites are cut or punched from the pre-laminated inlay, without the need to CNC mill the card body sites from the pre-laminated inlay.
  • the card body edges may be beveled or chamfered using a simple grinding tool.
  • TCM Transponder chip module ah Alignment holes ag Air gap perfs Perforations stmts Support stmts
  • Dual interface embedded metal smartcards may be produced from a metal inlay laminated with plastic layers having an array of metal card body sites, without having to CNC mill the individual card bodies from the array.
  • the metal card bodies are extracted from the metal laminate by a technique of cutting or punching using alignment holes or metal inlay corners for registration.
  • the metal inlay comprises a metal frame having stmts to support a coupling frame in the form of a card body. The stmts simply hold the coupling frame(s)/card body in place, with an air gap existing between the metal frame and the coupling frame.
  • the metal inlay may comprise a single metal layer or two metal layers laminated together separated by a dielectric layer.
  • the two metal layers may be prepared on a single metal sheet having perforations to allow for bending of the single metal sheet so that the metal layers are folded over on each other.
  • the metal inlay (MI), comprising a metal frame (MF), supporting stmts, coupling frame (CF) with slit (S) and module opening (MO), perforations, alignment holes and air gap, may be formed by means of laser cutting, water cutting or chemical etching.
  • the metal inlays can be manufactured from metal sheets or the metal inlays can be manufactured from a reel of metal and processed step by step in a continuous production line.
  • FIG. 15A is a diagram (cross-sectional view) of a smartcard (SC) having a card body (CB), a module opening (MO) for receiving a transponder chip module (TCM) with a module antenna (MA), and a slit (S), and further having a flexible circuit (FC) with a contact loop structure (CLS) and an antenna structure (AS), according to the invention.
  • the flexible circuit (FC) is connected to termination points (TP) on the coupling frame, near the slit (S).
  • 15B is a diagram (mostly cross-sectional view) of a smartcard (SC) having a card body (CB), a module opening (MO) for receiving a transponder chip module (TCM) with a module antenna (MA), and a slit (S), and further having a flexible circuit (FC) with a contact loop structure (CLS) and an antenna structure (AS), according to the invention.
  • the flexible circuit (FC) has a patch antenna (PA) for coupling with the slit (S).
  • FIGs. 15A and 15B show two versions of a smartcard (SC) having a card body (CB), a module opening (MO) for receiving a transponder chip module (TCM) with a module antenna (MA).
  • the card body may be a metal card body (MCB).
  • a slit (S) is shown extending from a peripheral edge of the card body (CB), towards an interior area of the card body (CB), but does not extend to the module opening (MO).
  • the slit is shown "sideways" in the diagram. Alternatively, the slit (S) may extend to the module opening (MO).
  • the module opening (MO) may be a stepped recess (R) having a wider (PI) portion for receiving an upper, wider portion of the transponder chip module (TCM), and a narrower (P2) portion for receiving a lower, narrower portion of the transponder chip module (TCM).
  • the transponder chip module (TCM) is RFID-enabled, and capable of contactless communication.
  • the transponder chip module (TCM) may also have contact pads (CP) disposed on its front surface for effecting a contact interface, resulting in a dual-interface (contact and contactless) capability.
  • the flexible circuit has a contact loop structure (CLS) with an antenna structure (AS) disposed near the transponder chip module (TCM), for coupling with the module antenna (MA) in the transponder chip module (TCM).
  • CLS contact loop structure
  • AS antenna structure
  • MA module antenna
  • the slit (S) is shown having termination points (TP) near the slit (S), and the flexible circuit (FC) is connected to the termination points. In this manner, currents at the slit can be harvested by the flexible circuit (FC) and transported to the module antenna (MA), via the antenna structure (AS).
  • a patch antenna (PA) is shown, disposed near or overlying the slit. In this manner, currents at the slit can be harvested by the flexible circuit (FC) and transported to the module antenna (MA), via the antenna structure (AS), or a Sense Coil (SeC), or the like.
  • eddy currents can be captured from a slit and said currents can be "transported” to another location on the card, such as to a transponder chip module (TCM).
  • TCM transponder chip module
  • This is beneficial since it eliminates the need for the slit (S) to overlap the module antenna (MA) in the transponder chip module (TCM).
  • Such overlap is prevalent in the prior art (e.g., US 9475086 and US 9798968).
  • the position of the transponder chip module (TCM) is dictated by ISO 7816.
  • the slit can be relocated anywhere, and energy (currents) from multiple slits disposed at multiple locations around the card body can readily be harvested and utilized by the transponder chip module (TCM) and/or any other modules present in the card. This concept is also applicable to metal edges (ME) which produce eddy currents.
  • cards may be manufactured (laid up and laminated) in sheet form, each sheet having a plurality of cards, such as in a 5x5 array, and CNC (computer numerical control) machining may be used to singulate (separate) the finished cards from the sheet. Resulting burrs, particularly in the metal layers, may cause defects, such as electrical shorting of the slit.
  • CNC machining of metal core, metal face or solid metal smartcards may be performed using cryogenic milling, such as in an environment of frozen carbon dioxide or liquid nitrogen.
  • Some of the card embodiments disclosed herein may have two metal layers, separated by a dielectric coating or an insulating layer, rather than a single metal layer.
  • the two metal layers may comprise different materials and may have different thicknesses than one another.
  • one of the metal layer may be stainless steel while the other metal layer may be titanium.
  • the "drop acoustics" of the metal card body may be improved, in that the card, when dropped or tapped (edgewise) on a hard surface, sounds like a solid metal card (making a ringing or tinkling sound), rather than like a plastic card (making a "thud").
  • each of the one or more metal layers should have a slit, or micro-slit.
  • the slits in the metal layers should be offset from one another.
  • the card body may have dimensions similar to those of a credit card.
  • ID-1 of the ISO/IEC 7810 standard defines cards as generally rectangular, measuring nominally 85.60 by 53.98 millimeters (3.37 in x 2.13 in).
  • a chip module may be implanted in a recess (cavity, opening) in the card body.
  • the recess may be a stepped recess having a first (upper, PI portion) having a cavity depth of 250 pm, and a second (lower, P2 portion) having a cavity depth of (maximum) 600 pm.
  • a contact-only or dual interface chip module will have contact pads exposed at a front surface of the card body.
  • any dimensions set forth herein are approximate, and materials set forth herein are intended to be exemplary. Conventional abbreviations such as “cm” for centimeter”, “mm” for millimeter, “pm” for micron, and “nm” for nanometer may be used.
  • the concept of modifying a metal element of an RFID-enabled device such as a smartcard to have a slit (S) to function as a coupling frame (CF) may be applied to other products which may have an antenna module (AM) or transponder chip module (TCM) integrated therewith, such as watches, wearable devices, and the like.
  • S slit
  • TCM transponder chip module
  • RFID-enabled smartcards may be applicable to other RFID-enabled devices, such as smartcards having a different form factor (e.g., size), ID-000 ("mini-SIM" format of subscriber identity modules), keyfobs, payment objects, and non-secure NFC/RFID devices in any form factor
  • the RFID-enabled cards (and other devices) disclosed herein may be passive devices, not having a battery and harvesting power from an external contactless reader (ISO 14443).
  • ISO 14443 external contactless reader
  • some of the teachings presented herein may find applicability with cards having self-contained power sources, such as small batteries (lithium-ion batteries with high areal capacity electrodes) or supercapacitors.
  • the transponder chip modules (TCM) disclosed herein may be contactless only, or dual interface (contact and contactless) modules.
  • the invention(s) described herein may relate to payment smartcards (metal, plastic or a combination thereof), electronic credentials, identity cards, loyalty cards, access control cards, and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

La présente invention concerne (i) des cartes à puce (SC) fabriquées à partir d'une bande d'inserts métalliques (MI ; FIG. 12 à 14) ayant un cadre de couplage (CF) formant le corps de carte métallique (MCB) supporté par des entretoises métalliques (struts). Dans la production de cartes à puce ayant un cadre de couplage (CF) muni d'une fente (S), la fente peut former une partie d'éléments graphiques (FIG. 10 à 12). (ii) Des techniques d'impression et de revêtement peuvent être utilisées pour masquer la fente (FIG. 9A à 9D). (iii) Des courants de surface peuvent être collectés à partir d'un emplacement dans un corps de carte (CB) et transportés vers un autre emplacement (FIG. 15AB). Un circuit souple (FC) peut être connecté à des points de terminaison (TP) à travers la fente (S), ou peut être couplé par l'intermédiaire d'une antenne à plaque (PA) avec la fente (S). Le circuit souple peut être couplé, par l'intermédiaire d'une structure d'antenne (AS) à l'antenne de module (MA) d'un module de puce de transpondeur (TCM).
PCT/US2020/045840 2019-08-12 2020-08-12 Cartes métalliques double interface et procédés de fabrication WO2021030383A1 (fr)

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US201962891308P 2019-08-24 2019-08-24
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US201962894976P 2019-09-03 2019-09-03
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US202062960178P 2020-01-13 2020-01-13
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US202062969034P 2020-02-01 2020-02-01
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WO2018202774A1 (fr) * 2017-05-03 2018-11-08 Féinics Amatech Teoranta Cartes à puce avec couche(s) métallique(s) et procédés de fabrication
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US20170267013A1 (en) * 2014-08-22 2017-09-21 Ovd Kinegram Ag Transfer Film and Method for Producing a Transfer Film
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EP4091832A1 (fr) * 2021-05-19 2022-11-23 Thales DIS France SA Support de données doté d'un revêtement à double durcissement
WO2022243481A1 (fr) * 2021-05-19 2022-11-24 Thales Dis France Sas Support de données avec revêtement à double polymérisation

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