WO2021027183A1 - 一种转接板及服务器系统 - Google Patents

一种转接板及服务器系统 Download PDF

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Publication number
WO2021027183A1
WO2021027183A1 PCT/CN2019/121107 CN2019121107W WO2021027183A1 WO 2021027183 A1 WO2021027183 A1 WO 2021027183A1 CN 2019121107 W CN2019121107 W CN 2019121107W WO 2021027183 A1 WO2021027183 A1 WO 2021027183A1
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Prior art keywords
standard model
rack
adapter board
fan
main control
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PCT/CN2019/121107
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English (en)
French (fr)
Inventor
王玲燕
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Suzhou Wave Intelligent Technology Co Ltd
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Suzhou Wave Intelligent Technology Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38—Information transfer, e.g. on bus
    • G06F13/40—Bus structure
    • G06F13/4063—Device-to-bus coupling
    • G06F13/4068—Electrical coupling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F2213/0016—Inter-integrated circuit (I2C)

Definitions

  • This application relates to the field of servers, in particular to an adapter board and a server system.
  • the Rack standard server adopts a rack-mounted centralized heat dissipation strategy. Fans are specially allocated to the rack to form a fan wall. According to the temperature of each node, the heat dissipation control strategy is centralized. The OCP standard server dissipates heat for each node separately, the fan is installed inside the node, and the regulation strategy is controlled by the controller in the node.
  • the present application provides an adapter board that can assemble the Rack standard model mainboard to the OCP standard model rack.
  • this application provides an adapter board
  • the adapter board is used to connect the Rack standard model mainboard to the rack of the open computing project OCP standard model;
  • the adapter board includes: a main control chip and a power conversion connection board;
  • the main control chip is used to obtain the temperature and adjust the fan speed according to the set heat dissipation strategy, wherein the fan is located in the node of the OCP standard model;
  • the power conversion connection board is used to connect the power supply of the Rack standard model mainboard with the OCP standard model rack.
  • the Rack standard model motherboard includes: a temperature sensor
  • the temperature sensor is used to detect the temperature and send the detected temperature to the main control chip through the I2C bus.
  • the acquiring temperature and adjusting the fan speed according to a set heat dissipation strategy includes:
  • the main control chip is used to send a driving signal to the corresponding fan in a pulse width modulation PWM mode according to the received temperature, so that the fan adjusts the speed according to the driving signal.
  • the main control chip is further configured to determine the rotation speed of the fan according to the Tach signal received from the fan; wherein the Tach signal is returned by the fan after adjusting the rotation speed.
  • a network controller is further provided in the main control chip;
  • the network controller is used to connect the switch board to the switch through a network cable, and connect to an external host through the switch.
  • the network controller is configured to transmit node-related information including the Rack standard model motherboard to an external host.
  • the network controller, the network physical PHY chip and the network connector RJ45 constitute a network system.
  • the network physical PHY chip is configured to connect to the main control chip through the RGMII bus protocol
  • the network connector RJ45 is used to connect the network physical PHY chip with the external switch through the media related interface MDI.
  • the power conversion connection board is also used for converting voltage, and powering the fan and related devices on the adapter board from the converted voltage;
  • the related equipment includes: main control chip and other IC equipment.
  • the present application also provides a server system, including: a Rack standard model mainboard, an open computing project OCP standard model rack, and the adapter board described in any one of the above embodiments.
  • this application provides and discloses an adapter board, which is used to connect the Rack standard model mainboard to the rack of the open computing project OCP standard model; the adapter board Including: a main control chip and a power conversion connection board; the main control chip is used to obtain the temperature and adjust the fan speed according to a set heat dissipation strategy, wherein the fan is located in the node of the OCP standard model; the power conversion The connecting board is used to connect the power supply of the Rack standard model mainboard to the rack of the OCP standard model.
  • the adapter board can assemble the Rack standard model mainboard to the OCP standard model rack.
  • FIG. 1 is a schematic diagram of the design and connection of the adapter board architecture in an embodiment of the application
  • FIG. 2 is a schematic diagram of the fan heat dissipation design of the adapter board in the embodiment of the application;
  • Fig. 3 is a schematic diagram of a network system design of a switch board in an embodiment of the application
  • FIG. 4 is a schematic diagram of the design of the power conversion connection board of the adapter board in the embodiment of the application.
  • FIG. 1 is a schematic diagram of the design and connection of the transition board architecture in an embodiment of the present application. According to the schematic diagram,
  • the adapter board is used to connect the Rack standard model mainboard to the rack of the open computing project OCP standard model;
  • the adapter board includes: a main control chip and a power conversion connection board;
  • the main control chip is used to obtain the temperature and adjust the fan speed according to the set heat dissipation strategy, wherein the fan is located in the node of the OCP standard model;
  • the power conversion connection board is used to connect the power supply of the Rack standard model mainboard with the OCP standard model rack.
  • the core board is the motherboard, which may be a motherboard of a standard Rack model.
  • the motherboard has a built-in I2C connector.
  • the I2C connector connects the motherboard with the main control chip through an I2C cable.
  • the main control chip can be MCU (Micro Controller Unit, single-chip microcomputer) or BMC (Baseboard Management Controller). Control Manager).
  • the main control chip controls the speed of the fan through signal transmission.
  • the motherboard is also provided with a power connector, the power connector is connected to the Power connector through the P12V_AUX cable, and the Power connector is connected to the Power Bus Bar connector through P12V_AUX.
  • the Power Bus Bar connector performs voltage conversion through a voltage converter. It is used to supply power to PHY, main control chip and fan.
  • the Rack standard model motherboard includes: a temperature sensor
  • the temperature sensor is used to detect the temperature and send the detected temperature to the main control chip through the I2C bus.
  • the main control chip is configured to obtain the temperature and adjust the fan speed according to a set heat dissipation strategy, including:
  • the main control chip is used to send a driving signal to the corresponding fan in a pulse width modulation PWM mode according to the received temperature, so that the fan adjusts the speed according to the driving signal.
  • the fan is located in the node of the OCP standard model.
  • the main control chip is further configured to determine the rotation speed of the fan according to the Tach signal received from the fan; wherein the Tach signal is returned by the fan after adjusting the rotation speed.
  • FIG. 2 An exemplary embodiment is shown in Figure 2.
  • the main control chip in the adapter board adjusts the fan speed through the set heat dissipation strategy to meet the heat dissipation strategy of the rack of the OCP standard model; the specific implementation may be as follows:
  • the main control chip MCU or BMC in the adapter board can obtain the temperature and regulate the fan speed according to the set heat dissipation strategy for the function of heat dissipation.
  • the main control chip performs data transmission through the I2C bus and the core board (the motherboard, which can be the motherboard of the Rack standard model), and detects the temperature of each device through the built-in temperature sensor in the core board.
  • each device can be the central The temperature of the processor (CPU, Central Processing Unit), the temperature of the hard disk, etc., and the acquired temperature of each device is transmitted to the main control chip through the I2C bus.
  • the main control chip After the main control chip obtains the temperature, it controls the rotation speed of the fan through the PWM method, where the fan is located in the node of the OCP standard model. After the fan adjusts the speed, the Tach signal is returned to the main control chip, and the main control chip determines the current speed of the fan according to the Tach signal received from the fan.
  • the main control chip of the adapter board can use BMC, and the model of the BMC can be ASD1250. For example: Taking CPU as an example, the preset strategy can be:
  • the PWM is set to 50 (50%);
  • the PWM is adjusted to 75 (75%);
  • the PWM is adjusted to 100 (100%), that is, full speed.
  • the PWM is adjusted to 100 (100%), and the fan is controlled to perform at full speed.
  • a network controller is further provided in the main control chip;
  • the network controller is used to connect the switch board to the switch through a network cable, and connect to an external host through the switch.
  • the network controller is configured to transmit node-related information including the Rack standard model motherboard to an external host.
  • the network controller, the network physical PHY chip and the network connector RJ45 constitute a network system.
  • the network physical PHY chip is configured to connect to the main control chip through the RGMII bus protocol
  • the network connector RJ45 is used to connect the network physical PHY chip with the external switch through the media related interface MDI.
  • FIG. 3 is a schematic diagram of the network system design of the adapter board in an exemplary embodiment of the application.
  • the network system of the adapter board is composed of a network controller, a network physical PHY chip and a network connector RJ45 composition.
  • the NIC network controller is integrated in the BMC of this ASD1250 model.
  • the NIC (network controller) in the main control chip is connected to the network physical PHY chip through the RGMII bus protocol.
  • the network physical PHY chip is connected to the network connector RJ45 through the media-related interface MDI.
  • the network connector RJ45 is connected to the external switch through the external The switch is connected to an external host.
  • the adapter board is connected to the switch through a network cable, and is connected to an external host through the switch, and the external host can obtain node-related information through the network system.
  • the power conversion connection board is also used to convert the voltage, and the converted voltage is used to supply power to the fan and related devices on the adapter board; wherein, the related device Including: main control chip and other IC equipment.
  • FIG. 4 is a schematic diagram of the design of the power conversion connection board of the adapter board in an exemplary embodiment of the application.
  • the main board is also provided with a power connector, and the power connector is connected to Power through a P12V_AUX cable.
  • Connector the Power connector is connected to the Power Bus Bar connector through P12V_AUX, and the Power Bus Bar connector performs voltage conversion through a voltage converter to supply power to the network physical PHY chip, the main control chip, and the fan.
  • the mainboard is connected to the power supply interface of the Rack standard model mainboard and the rack power supply interface of the OCP standard model through the power conversion connection board.
  • the power interface of the Rack standard model motherboard is different from that of the OCP standard model.
  • the rack power interface of the OCP standard model is copper, and the power interface of the Rack standard model motherboard is multi-pin.
  • Power connector, the connector is generally 24pin, through the power conversion connection board, the power interface of the Rack standard model motherboard is connected to the copper interface of the rack power supply of the OCP standard model. .
  • the power conversion connection board performs voltage conversion to supply power to various devices on the adapter board, for example: the power required by the IC on the conversion board, for example: different network physical PHY chips use different voltages, and some require 1.2 V, and some are 1.8V, according to the voltage required by the selected IC chip for voltage conversion and power supply.
  • This application realizes an adapter board that is simple in design, low in cost, can be freely matched, facilitates the construction of hardware architecture, and has strong compatibility. It provides a common reference for subsequent projects on the same platform, and has strong commonality and reduced Development times of subsequent boards.
  • Embodiment 2 A server system, including: a Rack standard model mainboard, an open computing project OCP standard model rack, and the adapter board as described in any one of the foregoing embodiments.
  • the motherboard of the Rack standard model can be applied to the rack of the OCP standard model of the open computing project through the adapter board. According to the above-mentioned server system, it is no longer necessary to design motherboards separately for different models, thereby saving development resources, enriching product forms, and maximizing design benefits.
  • Such software may be distributed on a computer-readable medium
  • the computer-readable medium may include a computer storage medium (or non-transitory medium) and a communication medium (or transitory medium).
  • the term computer storage medium includes volatile and non-volatile memory implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data).
  • Computer storage media include but are not limited to RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassette, tape, magnetic disk storage or other magnetic storage device, or Any other medium used to store desired information and that can be accessed by a computer.
  • communication media usually contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as carrier waves or other transmission mechanisms, and may include any information delivery media .

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Abstract

一种转接板，用于将Rack标准机型主板连接到开放计算项目OCP标准机型的机架；所述转接板包括：主控芯片和电源转换连接板；所述主控芯片，用于获取温度并根据设定的散热策略调控风扇转速，其中，所述风扇位于OCP标准机型的节点内；所述电源转换连接板，用于将所述Rack标准机型主板的电源与所述OCP标准机型的机架相连。通过本申请的方案，该转接板能够将Rack标准机型主板装配到OCP标准机型的机架。

Description

一种转接板及服务器系统
本申请要求于2019年8月9日提交中国专利局、申请号为201910733072.X、名称为“一种转接板及服务器系统”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及服务器领域，尤指一种转接板及服务器系统。
背景技术
目前，在服务器领域，国内机架式以天蝎标准的Rack服务器架构为主导，而国外制定了OCP(Open Compute Project，开放计算项目)标准的服务器架构。Rack标准的服务器与OCP标准的架构服务器都是机架式，但是，两者最大的区别是散热控制方式不同。目前行业内针对这两种架构分别设计相对应的板卡。
在服务器领域，Rack标准的服务器采用机架式集中散热策略，风扇专配到机架上，形成风扇墙，根据各节点的温度，集中进行散热调控策略。OCP标准的服务器为各节点单独散热，风扇安装在节点内部，调控策略由节点内控制器来控制。
针对现有技术中针对Rack标准的服务器与OCP标准的架构服务器分别设计相对应的板卡，因此，亟需要设计一种转接板，经过该接板卡，将Rack标准机型主板装配到OCP标准机型的机架。
发明内容
为了解决上述技术问题，本申请提供了一种转接板，该转接板能够将Rack标准机型主板装配到OCP标准机型的机架。
为了达到本申请目的，本申请提供了一种转接板，
所述转接板，用于将Rack标准机型主板连接到开放计算项目OCP标准机型的机架；
所述转接板包括：主控芯片和电源转换连接板；
所述主控芯片，用于获取温度并根据设定的散热策略调控风扇转速，其中，所述风扇位于OCP标准机型的节点内；
所述电源转换连接板，用于将所述Rack标准机型主板的电源与所述OCP标准机型的机架相连。
一种示例性的实施例中，所述Rack标准机型主板，包括：温度传感器；
所述温度传感器，用于检测温度，并通过I2C总线将所检测的温度发送到主控芯片。
一种示例性的实施例中，所述获取温度并根据设定的散热策略调控风扇转速，包括：
所述主控芯片，用于根据接收到的温度，通过脉冲宽度调制PWM方式发送驱动信号到相对应的风扇，以用于风扇根据所述驱动信号调整转速。
一种示例性的实施例中，所述主控芯片，还用于根据从风扇接收到的Tach信号确定所述风扇的转速；其中，所述Tach信号是所述风扇调整转速后返回的。
一种示例性的实施例中，所述主控芯片内还设置有网络控制器；
所述网络控制器，用于通过网线将所述转接板连接到交换机，并通过所述交换机连接到外部主机。
一种示例性的实施例中，所述网络控制器，用于将包括Rack标准机型主板的节点相关信息传输到外部主机。
一种示例性的实施例中，所述网络控制器、网络物理PHY芯片和网络连接器RJ45组成网络系统。
一种示例性的实施例中，所述网络物理PHY芯片，用于通过RGMII总线协议连接主控芯片；
所述网络连接器RJ45，用于通过介质相关接口MDI将网络物理PHY芯片与外部交换机相连。
一种示例性的实施例中，所述电源转换连接板，还用于对电压进行转换，将转换后的电压对风扇和所述转接板上的相关设备进行供电；
其中，所述相关设备包括：主控芯片和其他IC设备。
为了解决上述问题，本申请还提供了一种服务器系统，包括：Rack标准机型主板、开放计算项目OCP标准机型的机架和上述实施例中任一项所述的转接板。
与现有技术相比，本申请提供公开了一种转接板，所述转接板，用于将Rack标准机型主板连接到开放计算项目OCP标准机型的机架；所述转接板包括：主控芯片和电源转换连接板；所述主控芯片，用于获取温度并根据设定的散热策略调控风扇转速，其中，所述风扇位于OCP标准机型的节点内；所述电源转换连接板，用于将所述Rack标准机型主板的电源与所述OCP标准机型的机架相连。通过本申请的方案，该转接板能够将Rack标准机型主板装配到OCP标准机型的机架。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1为本申请实施例中转接板架构设计连接示意图；
图2为本申请实施例中转接板的风扇散热设计的示意图；
图3为本申请实施例中转接板的网络系统设计的示意图；
图4为本申请实施例中转接板的电源转换连接板设计的示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚明白，下文中将结合附图对本申请的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
在附图的流程图示出的步骤可以在诸如一组计算机可执行指令的计算 机系统中执行。并且，虽然在流程图中示出了逻辑顺序，但是在某些情况下，可以以不同于此处的顺序执行所示出或描述的步骤。
实施例一
图1是本申请实施例中转接板架构设计连接示意图，根据该示意图，
所述转接板，用于将Rack标准机型主板连接到开放计算项目OCP标准机型的机架；
所述转接板，包括：主控芯片和电源转换连接板；
所述主控芯片，用于获取温度并根据设定的散热策略调控风扇转速，其中，所述风扇位于OCP标准机型的节点内；
所述电源转换连接板，用于将所述Rack标准机型主板的电源与所述OCP标准机型的机架相连。
在本实施例中，核心板卡即主板，可以是Rack标准机型的主板。
该主板中内置I2C连接器，该I2C连接器通过I2C线缆将主板与主控芯片进行连接，该主控芯片可以是MCU(Micro Controller Unit,单片微型计算机)或者BMC(Baseboard Management Controller，基板控制管理器)。
主控芯片通过信号传输进行控制风扇的转速。
该主板内还设置电源连接器，该电源连接器通过P12V_AUX线缆连接Power连接器，该Power连接器通过P12V_AUX连接Power Bus Bar连接器，该Power Bus Bar连接器通过电压转换器进行电压转换，以用于对PHY、主控芯片和风扇进行供电。
一种示例性的实施例中，所述Rack标准机型主板，包括：温度传感器；
所述温度传感器，用于检测温度，并通过I2C总线将所检测的温度发送到主控芯片。
一种示例性的实施例中，所述主控芯片，用于获取温度并根据设定的散热策略调控风扇转速，包括：
所述主控芯片，用于根据接收到的温度，通过脉冲宽度调制PWM方式发送驱动信号到相对应的风扇，以用于风扇根据所述驱动信号调整转速。其中，所述风扇位于OCP标准机型的节点内。
一种示例性的实施例中，所述主控芯片，还用于根据从风扇接收到的Tach信号确定所述风扇的转速；其中，所述Tach信号是所述风扇调整转速后返回的。
一种示例性的实施例如图2所示，转接板中的主控芯片通过设定的散热策略调控风扇转速，以满足OCP标准机型的机架的散热策略；具体的实现方式可以如下：
在转接板中的主控芯片MCU或者BMC，可根据设定的散热策略来获取温度和调控风扇转速，以用于进行散热的功能。
主控芯片通过I2C总线和核心板卡(主板，可以是Rack标准机型的主板)进行数据传输，通过核心板卡中的内置的温度传感器检测各设备的温度，其中，该各设备可以是中央处理器(CPU，Central Processing Unit)的温度，硬盘的温度等，并将所获取到的各设备温度通过I2C总线传输给主控芯片。该主控芯片获取温度后，通过PWM方式控制风扇的转速，其中，该风扇位于OCP标准机型的节点内。风扇调整转速后返回Tach信号给主控芯片，该主控芯片根据从风扇接收到的Tach信号确定所述风扇目前的转速。转接板的主控芯片，可使用BMC，该BMC的型号可以为ASD1250。例如：以CPU为例，预先设置的策略可以为：
当设备温度<40,PWM设为50(50％)；
当设备温度>＝40,PWM调为75(75％)；
当设备温度>＝60,PWM调为100(100％)，即转全速。
当检测到CPU温度为80度时，PWM调为100(100％)，控制风扇进行全速。
一种示例性的实施例中，所述主控芯片内还设置有网络控制器；
所述网络控制器，用于通过网线将所述转接板连接到交换机，并通过所述交换机连接到外部主机。
一种示例性的实施例中，所述网络控制器，用于将包括Rack标准机型主板的节点相关信息传输到外部主机。
一种示例性的实施例中，所述网络控制器、网络物理PHY芯片和网络连接器RJ45组成网络系统。
一种示例性的实施例中，所述网络物理PHY芯片，用于通过RGMII总线协议连接主控芯片；
所述网络连接器RJ45，用于通过介质相关接口MDI将网络物理PHY芯片与外部交换机相连。
图3为本申请一种示例性的实施例中转接板的网络系统设计的示意图，如图3所示，该转接板的网络系统是由网络控制器、网络物理PHY芯片和网络连接器RJ45组成。
当主控芯片采用BMC的ASD1250型号时，该ASD1250型号的BMC中内部集成了NIC网络控制器。
主控芯片中的NIC(网络控制器)通过RGMII总线协议连接网络物理PHY芯片，该网络物理PHY芯片通过介质相关接口MDI连接网络连接器RJ45，该网络连接器RJ45与外部交换机相连，通过该外部交换机与外部主机进行相连。
通过该网络系统，通过网线将所述转接板连接到交换机，并通过所述交换机连接到外部主机，该外部主机可通过此网络系统获取节点相关信息。
一种示例性的实施例中，所述电源转换连接板，还用于对电压进行转换，将转换后的电压对风扇和所述转接板上的相关设备进行供电；其中，所述相关设备包括：主控芯片和其他IC设备。
图4为本申请一种示例性的实施例中转接板的电源转换连接板设计的示意图，如图4所示，该主板内还设置电源连接器，该电源连接器通过P12V_AUX线缆连接Power连接器，该Power连接器通过P12V_AUX连接Power Bus Bar连接器，该Power Bus Bar连接器通过电压转换器进行电压转换，以用于对网络物理PHY芯片、主控芯片和风扇进行供电。
通过该电源转换连接板将主板与将所述Rack标准机型主板的电源与所述OCP标准机型的机架电源接口相连接。该Rack标准机型主板的电源接口和OCP标准机型的机架电源接口的接口方式不同，该OCP标准机型的机架电源接口是铜片，Rack标准机型主板的电源接口是多pin的电源连接器，该连接器一般为24pin，通过该电源转换连接板实现了将Rack标准机型主板的电源接口是多pin的电源连接器与OCP标准机型的机架电源的 铜片接口相连接。
该电源转换连接板进行电压转换，对转接板上各个设备进行供电，例如：转换板上用的IC所需要的电源，例如：不同的网络物理PHY芯片所应用的电压不同，有的需要1.2V，有的为1.8V，根据选用的IC芯片所需要的电压进行电压转换供电。
本申请实现了一种转接板，该设计简单，成本低，可以自由搭配，方便进行硬件架构的搭建，并且，兼容性强，为后续同一平台的项目提供共用参考，共用性强，减少了后续板卡的开发次数。
实施例二、一种服务器系统，包括：Rack标准机型主板、开放计算项目OCP标准机型的机架和如上述实施例中任一项所述的转接板。
本实施例中提出的一种服务器系统，可以通过转接板将Rack标准机型主板应用到开放计算项目OCP标准机型的机架。根据上述服务器系统，不再需要针对不同机型单独设计主板，进而节省开发资源，丰富产品形态，使设计效益最大化。
本领域普通技术人员可以理解，上文中所公开方法中的全部或某些步骤、系统、装置中的功能模块/单元可以被实施为软件、固件、硬件及其适当的组合。在硬件实施方式中，在以上描述中提及的功能模块/单元之间的划分不一定对应于物理组件的划分；例如，一个物理组件可以具有多个功能，或者一个功能或步骤可以由若干物理组件合作执行。某些组件或所有组件可以被实施为由处理器，如数字信号处理器或微处理器执行的软件，或者被实施为硬件，或者被实施为集成电路，如专用集成电路。这样的软件可以分布在计算机可读介质上，计算机可读介质可以包括计算机存储介质(或非暂时性介质)和通信介质(或暂时性介质)。如本领域普通技术人员公知的，术语计算机存储介质包括在用于存储信息(诸如计算机可读指令、数据结构、程序模块或其他数据)的任何方法或技术中实施的易失性和非易失性、可移除和不可移除介质。计算机存储介质包括但不限于RAM、ROM、EEPROM、闪存或其他存储器技术、CD-ROM、数字多功能盘(DVD)或其他光盘存储、磁盒、磁带、磁盘存储或其他磁存储装置、或者可以用于存储期望的信息并且可以被计算机访问的任何其他的介质。此外，本领 域普通技术人员公知的是，通信介质通常包含计算机可读指令、数据结构、程序模块或者诸如载波或其他传输机制之类的调制数据信号中的其他数据，并且可包括任何信息递送介质。

Claims (10)

  1. 一种转接板，其特征在于，
    所述转接板，用于将Rack标准机型主板连接到开放计算项目OCP标准机型的机架；
    所述转接板包括：主控芯片和电源转换连接板；
    所述主控芯片，用于获取温度并根据设定的散热策略调控风扇转速，其中，所述风扇位于OCP标准机型的节点内；
    所述电源转换连接板，用于将所述Rack标准机型主板的电源与所述OCP标准机型的机架相连。
  2. 根据权利要求1所述的转接板，其特征在于，
    所述Rack标准机型主板，包括：温度传感器；
    所述温度传感器，用于检测温度，并通过I2C总线将所检测的温度发送到主控芯片。
  3. 根据权利要求2所述的转接板，其特征在于，所述获取温度并根据设定的散热策略调控风扇转速，包括：
    所述主控芯片，用于根据接收到的温度，通过脉冲宽度调制PWM方式发送驱动信号到相对应的风扇，以用于风扇根据所述驱动信号调整转速。
  4. 根据权利要求3所述的转接板，其特征在于：
    所述主控芯片，还用于根据从风扇接收到的Tach信号确定所述风扇的转速；其中，所述Tach信号是所述风扇调整转速后返回的。
  5. 根据权利要求1所述的转接板，其特征在于，所述主控芯片内还设置有网络控制器；
    所述网络控制器，用于通过网线将所述转接板连接到交换机，并通过所述交换机连接到外部主机。
  6. 根据权利要求5所述的转接板，其特征在于，
    所述网络控制器，用于将包括Rack标准机型主板的节点相关信息传输到外部主机。
  7. 根据权利要求5所述的转接板，其特征在于，
    所述网络控制器、网络物理PHY芯片和网络连接器RJ45组成网络系 统。
  8. 根据权利要求7所述的转接板，其特征在于，
    所述网络物理PHY芯片，用于通过RGMII总线协议连接主控芯片；
    所述网络连接器RJ45，用于通过介质相关接口MDI将网络物理PHY芯片与外部交换机相连。
  9. 根据权利要求8所述的转接板，其特征在于，
    所述电源转换连接板，还用于对电压进行转换，将转换后的电压对风扇和所述转接板上的相关设备进行供电；
    其中，所述相关设备包括：主控芯片和其他IC设备。
  10. 一种服务器系统，包括：Rack标准机型主板、开放计算项目OCP标准机型的机架和如权利要求1-9中任一项所述的转接板。
PCT/CN2019/121107 2019-08-09 2019-11-27 一种转接板及服务器系统 Ceased WO2021027183A1 (zh)

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