WO2021025334A1

WO2021025334A1 - Electronic device comprising speaker device connection structure

Info

Publication number: WO2021025334A1
Application number: PCT/KR2020/009595
Authority: WO
Inventors: 한브라이언
Original assignee: 삼성전자 주식회사
Priority date: 2019-08-06
Filing date: 2020-07-21
Publication date: 2021-02-11
Also published as: KR20210017002A

Abstract

An electronic device, according to various embodiments of the present disclosure, comprises a housing which has at least one speaker device disposed in a first part and comprises a first plate disposed so as to face toward a first direction, a second plate disposed so as to face toward a second direction which is the opposite direction from the first direction, and a side member disposed so as to cover at least a portion of the space between the first and second plates, wherein the speaker device comprises: a first enclosure disposed in the first part; a second enclosure coupled to the first enclosure; a plurality of speaker modules disposed in the first enclosure; and at least one connection member disposed in the second enclosure, wherein, when the first and second enclosures are fused, the speaker modules may be electrically connected to each other by being connected to the connection member. Other various embodiments are possible.

Description

Electronic device including speaker device connection structure

Various embodiments of the present disclosure relate to a connection structure between a plurality of multi-arrangement speaker modules disposed in an electronic device.

At least one or more acoustic components mounted on an electronic device, for example, a speaker device may have a structure requiring one speaker module per enclosure.

In recent years, as a trend of emphasizing an audio function has arisen in electronic devices, a structure in which, for example, up to four speaker modules are mounted has appeared. In an electronic device such as a notebook computer, as the mounting space for using the speaker device decreases, the size of the speaker module must be reduced, but the size of the speaker module cannot be infinitely reduced.

Most of the at least one speaker device mounted in the housing of an electronic device such as a notebook computer, when configuring the speaker device, solders a speaker cable to the speaker connection terminal, and then leads to the outside through shaping inside the enclosure. If the number is more than one, the assembly work can vary a lot.

For example, if there are two speaker modules in one enclosure, the speaker modules are individually soldered and speaker cables are made into two, or each speaker wire is soldered with two wires for a total of four wires. It may be a structure that must be taken out of the enclosure.

In the conventional speaker device assembly method, it is troublesome for the operator to solder several times, and it is inconvenient to form and fix the cable due to the large number of internal cables.When connecting between speaker modules, if the minimum distance is not secured, the cable length is extended to solder. Because it is a structure, it may be a cause of deterioration of the assembly process.

According to various embodiments of the present disclosure, an electronic device includes a first plate disposed to face in a first direction and a second plate disposed to face in a second direction opposite to the first direction, and the second plate And a housing in which at least one speaker device is disposed between the first plate and the second plate, wherein the speaker device includes a first enclosure; A second enclosure; A plurality of speaker modules disposed in the first enclosure; And at least one connecting member disposed in the second enclosure, and when the first and second enclosures are fused, each of the speaker modules may be connected to the connecting member to be electrically connected.

Various embodiments of the present disclosure enable connection between speaker modules together with upper and lower enclosure fusion using at least one pre-installed connection member in a connection structure between a plurality of arranged speaker modules, so that assembly of a speaker module can be improved. .

1 is a perspective view illustrating an electronic device in a folded state according to various embodiments of the present disclosure.

2 is a perspective view illustrating an electronic device in an unfolded state according to various embodiments of the present disclosure.

3A is a plan view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.

3B is a side view illustrating a second housing of an electronic device according to various embodiments of the present disclosure.

4A to 4D are perspective views each illustrating a configuration of a speaker device disposed in an electronic device according to various embodiments of the present disclosure.

5 is a cross-sectional view illustrating a connection structure of a speaker device disposed in an electronic device according to various embodiments of the present disclosure.

6 is an enlarged perspective view illustrating a part of a connection structure between speaker modules disposed in an electronic device according to various embodiments of the present disclosure.

7A and 7B are partially cut-away perspective views each showing a state in a fusion process of a housing according to various embodiments of the present disclosure.

8 is a plan view illustrating a connection member according to various embodiments of the present disclosure.

9 is a partially cut-away perspective view illustrating a state in which a connection member is inserted into a second enclosure according to various embodiments of the present disclosure.

10 is a perspective view illustrating a state in which four speaker modules are electrically connected by a connecting member according to various embodiments of the present disclosure.

11 is a plan view illustrating a connection member according to various other embodiments of the present disclosure.

12A is a plan view illustrating a state in which a speaker module according to various embodiments of the present disclosure is electrically connected in series by a connection member.

12B is a block diagram illustrating a state in which a speaker module according to various embodiments of the present disclosure is electrically connected in series by a connection member.

13A is a plan view illustrating a state in which speaker modules according to various embodiments of the present disclosure are electrically connected in parallel by connection members.

13B is a block diagram illustrating a state in which a speaker module according to various embodiments of the present disclosure is electrically connected in parallel by a connection member.

14 is a cross-sectional view illustrating a connection structure of a speaker device disposed in an electronic device according to various other embodiments of the present disclosure.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. However, this is not intended to limit the present disclosure to a specific embodiment, and it should be understood to include various modifications, equivalents, and/or alternatives of the embodiments of the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar elements.

Electronic devices according to various embodiments of the present disclosure include, for example, a smart phone, a tablet personal computer, a mobile phone, a video phone, and an e-book reader (e- book reader), desktop personal computer (PC), laptop personal computer (laptop personal computer), netbook computer, workstation, server, personal digital assistant (PDA), portable multimedia player (PMP), MP3 Players, mobile medical devices, cameras, or wearable devices (e.g. smart glasses, head-mounted-devices (HMD)), electronic clothing, electronic bracelets, electronic necklaces, electronic apps It may include at least one of an accessory (appcessory), an electronic tattoo, a smart mirror, or a smart watch.

In some embodiments, the electronic device may be a smart home appliance. Smart home appliances include, for example, televisions, digital video disk (DVD) players, audio, refrigerators, air conditioners, vacuum cleaners, ovens, microwaves, washing machines, air cleaners, set-top boxes, and home automation. Control panel (home automation control panel), security control panel (security control panel), TV box (e.g. Samsung HomeSync ^TM , Apple TV ^TM or Google TV ^TM , game consoles (e.g. Xbox ^TM , PlayStation ^TM ), electronic dictionary, It may include at least one of an electronic key, a camcorder, and an electronic frame.

In another embodiment, the electronic device includes various medical devices (e.g., various portable medical measuring devices (blood glucose meter, heart rate meter, blood pressure meter, or body temperature meter), magnetic resonance angiography (MRA), magnetic resonance imaging (MRI), CT (computed tomography), imaging device, or ultrasound), navigation device, global positioning system receiver (GPS), event data recorder (EDR), flight data recorder (FDR), infotainment device for automobiles, ships Electronic equipment (e.g. marine navigation devices, gyro compasses, etc.), avionics, security equipment, vehicle head units, industrial or home robots, automatic teller's machines (ATMs) in financial institutions, POS in stores (point of sales) or Internet of things (e.g. light bulbs, sensors, electricity or gas meters, sprinkler devices, fire alarms, thermostats, street lights, toasters, exercise equipment, It may include at least one of a hot water tank, heater, boiler, etc.).

According to some embodiments, the electronic device is a piece of furniture or a building/structure, an electronic board, an electronic signature receiving device, a projector, or various measuring devices (e.g., It may include at least one of water, electricity, gas, or radio wave measuring equipment. In various embodiments, the electronic device may be a combination of one or more of the aforementioned various devices. The electronic device according to some embodiments may be a flexible electronic device. Further, an electronic device according to an embodiment of the present disclosure is not limited to the above-described devices, and may include a new electronic device according to technological advances.

1 is a perspective view illustrating an electronic device in a folded state according to various embodiments of the present disclosure. 2 is a perspective view illustrating an electronic device in an unfolded state according to various embodiments of the present disclosure.

Referring to FIGS. 1 and 2, the electronic device 10 according to an embodiment will be described using a notebook as an example. According to an embodiment, the electronic device 10 may include a first housing 11, a second housing 12, and a hinge device 13. According to one embodiment, the second housing 12 is rotatably connected to the first housing 11 by a hinge device 13, so that it can be folded or unfolded on the first housing 11. For example, the first and

second housings

11 and 12 may be made of a metal material, but are not limited thereto.

According to an embodiment, the first housing 11 is a data input device, and includes a plurality of keys 115 and a touch pad 116, a plurality of ports 117, a printed circuit board not shown, and a battery. It may include. According to an embodiment, the second housing 12 is a data output device, and a display module 120 and at least one acoustic component, such as a microphone module and a camera, may be disposed.

3A is a bottom view illustrating a first housing of an electronic device according to various embodiments of the present disclosure. 3B is a side view illustrating a first housing of an electronic device according to various embodiments of the present disclosure.

3A and 3B, the first housing 11 according to an embodiment has a first plate 111 disposed to face in a first direction (①) and opposite to the first direction (①). The second plate 112 is disposed to face in a second direction (②), which is a direction, and is disposed to surround at least a portion of the space on the first and

second plates

111 and 112, and is disposed in the first and second directions (①,②) It may include a side member 113 disposed to face in the third direction (③) perpendicular to the. According to an embodiment, the side members 113 may extend along the first and

second plates

111 and 112. For example, the side member 113 may be made of a metal material or a synthetic resin material. For example, the side member 113 is made of a metal material and has a segmented shape, so that it can operate as an antenna radiator.

According to various embodiments, the side member 113 may be combined with the first plate 111 or the second plate 112 or may be integrally formed.

In the first housing 11 according to an embodiment, at least one speaker device may be disposed in a space between the first plate 111 and the second plate 112. According to an embodiment, at least one speaker device disposed in the first housing 11 may be disposed at a position closest to the user, facing the user, and free from obstructions. For example, at least one speaker device may be disposed to face the second plate 112 of the first housing 11. According to an embodiment, the second plate 112 may have a plurality of

speaker holes

1121 and 1122 formed in both corner regions.

Hereinafter, a connection structure of a speaker device according to various embodiments of the present disclosure will be described with reference to the accompanying drawings.

4A to 4D are perspective views each illustrating a configuration of a speaker device disposed in an electronic device according to various embodiments of the present disclosure. 5 is a cross-sectional view illustrating a connection structure of a speaker device disposed in an electronic device according to various embodiments of the present disclosure. 6 is an enlarged perspective view illustrating a part of a connection structure between speaker modules disposed in an electronic device according to various embodiments of the present disclosure.

4A to 6, a plurality of speaker devices 20 according to an embodiment may be disposed along a first portion of a first housing (eg, the first housing 11 shown in FIG. 1 ). . For example, the first portion may be a portion of a front surface or a portion of a rear surface of the first housing, or at least a portion of a side member. According to an embodiment, the first portion is disposed at both front corners of the second plate (eg, the second plate 112 shown in FIG. 3A) to emit sound in a stereo type.

According to an embodiment, an electronic device (eg, the electronic device 10 illustrated in FIG. 1) may include at least one speaker device 20. For example, two, three, or four or more speaker devices 20 may be disposed in the first portion of the first housing of the electronic device (eg, the first housing 11 shown in FIG. 1 ). According to an embodiment, the speaker device 20 may include at least one or

more speaker modules

31 and 32 and at least one or more enclosures 23. According to an embodiment, the enclosure 23 is formed in a shape surrounding at least one

speaker module

31 and 32, and may serve as a kind of speaker sound resonator. According to an embodiment, one or more, for example, two or four

speaker modules

31 and 32 may be disposed in the enclosure 23. For example, a structure in which two

speaker modules

31 and 32 are disposed in the enclosure 23 will be described as an embodiment. Hereinafter, the speaker module will be referred to as the first and

second speaker modules

31 and 32. The first and

second speaker modules

31 and 32 disposed in the enclosure 23 do not overlap each other and may be arranged in a parallel state.

According to an embodiment, the enclosure 23 may include a first enclosure 21 and a second enclosure 22. According to one embodiment, the first enclosure 21 and the second enclosure 22 may be integrally manufactured through a fusing process. According to an embodiment, the inner space of the first and

second enclosures

21 and 22 may be sealed from the outside after fusion. According to an embodiment, the enclosure 23 may perform a fusing process after the first enclosure 21 and the second enclosure 22 are in close contact. According to an embodiment, the fusion direction of the enclosure 23 may be a vertical direction. For example, the vertical direction may include a first direction (①) or a second direction (②).

According to various embodiments, the fusion may include thermal fusion for bonding two components of an affinity material, friction fusion, ultrasonic fusion, electrofusion, and bonding using an adhesive for bonding components of a non-affinity material. I can.

According to an embodiment, at least one

speaker module

31 and 32 may be disposed in the first enclosure 21. However, the

speaker modules

31 and 32 need not be limited to being disposed in the first enclosure 21 and may be disposed in the second enclosure 22. According to an embodiment, the first enclosure 21 transmits sound emitted from the first and

second speaker modules

31 and 32 to the speaker holes of the second plate (eg, speaker holes 1121 and 1122 shown in FIG. 3A ). ) May include first and

second speaker openings

215 and 216 for transmission. According to an embodiment, the first and

second speaker modules

31 and 32 may be disposed in the first enclosure 21 at equal intervals. According to an embodiment, each of the first and

second speaker modules

31 and 32 may have at least one or

more connection terminals

310 and 320 electrically connected to each other. According to an embodiment, each of the

connection terminals

310 and 320 may be disposed in a recessed position in a corner region. According to an embodiment, each of the first and

second speaker modules

31 and 32 may be disposed in a state in which the corner portions are recessed and the

connection terminals

310 and 320 are exposed in the recessed portions, respectively. A part of the connection member 40 is connected to the leased

connection terminals

310 and 320 of the

speaker modules

31 and 32 in a state of being accommodated, so that the connection structure between the

speaker modules

31 and 32 and the connection member 40 The thickness can be reduced.

Since the connection member 40 is disposed between the

connection terminals

310 and 320, the

speaker modules

31 and 32 are electrically connected and the connection state can be maintained.

According to an embodiment, the first and

second speaker modules

31 and 32 electrically connected by at least one connection member 40 are printed circuit boards not shown by the first and second speaker cables c1 and c2. It can be electrically connected to the amplifier of

According to an embodiment, the enclosure 23 may include a damping member 212 supporting the mounted state. Two damping members 212 are disposed, and may elastically support the enclosure mounted on the first housing (eg, the first housing 11 shown in FIG. 1 ).

Referring to FIGS. 7A and 7B, according to an embodiment, the first and

second speaker modules

31 and 32 disposed in the enclosure 23 may be electrically connected to each other by at least one connection member 40. . According to an embodiment, the connection structure between the first and

second speaker modules

31 and 32 may be automatically implemented during the fusing process of the first and

second enclosures

21 and 22. According to one embodiment, after the first and

second speaker modules

31 and 32 are disposed in the first enclosure 21 and the connecting member 40 is disposed in the second enclosure 22, the first and second enclosures (21, 22) Electrical connection between the first and

second speaker modules

31 and 32 is simultaneously implemented by the connection member 40 during fusion, and the implemented connection state can be maintained. The reference relief 210 may be a partition that spatially isolates the first and

second speaker modules

31 and 32. For example, the fusion direction of the first and second enclosures is a vertical direction, and may be a direction in which the second enclosure 22 moves toward the first enclosure 21. According to such an enclosure fusion process, both ends of the connection member 40 can come into contact with the

connection terminals

310 and 320 of the first and second speakers, and maintain the contact state.

Referring to FIG. 8, the connection member 40 according to an embodiment includes a first speaker module (eg, a first speaker module 31 shown in 4a) and a second speaker module (eg, a second speaker shown in 4a). As an electrical connection member for electrically connecting the module 32, one or two may be used. According to an embodiment, the connection member 40 has an elastic shape, and both ends may have a protruding shape.

According to an embodiment, the connection member 40 may include a connection portion 43 and first and second free ends 41 and 42. According to one embodiment, the connection part 43 is a part that connects the first and second free ends 41 and 42, the first free end 41 is formed on one side, and the second free end 42 is on the other side. Can be formed. According to an embodiment, the connection portion 43 and the first and second free ends 41 and 42 are integrally formed and may be made of a metal material such as copper. According to an embodiment, the first free end 41 may include a first shape having elasticity, and the second free end 42 may include a second free end 42 having elasticity. According to an embodiment, the connection member 40 may have a shape in which the first and second free ends 41 and 42 face each other and are curved in a direction facing each other. For example, each of the first and second free ends 41 and 42 may have a letter C shape. According to one embodiment, after the first and second enclosures (e.g., the first and

second enclosures

21 and 22 shown in FIG. 4A) are fused and bonded, the connection member ( 40) can be maintained.

According to one embodiment, in the connection member 40, the first free end 41 is formed by bending one end of the connection part 43 at a first angle, and the second free end 42 is bent at the other end at a second angle. ) Can be formed. For example, the first and second angles may be approximately 90 degrees. According to one embodiment, each of the first and second free ends 41 and 42 may be a part that connects to each of the connection terminals (eg, connection terminals shown in Fig. 4A) of the speaker modules 31 and 32). have.

Referring to FIG. 9, the connection member 40 may be disposed on the second enclosure 22 in an insert injection method. According to one embodiment, after insert injection of the connecting member 40, the connecting portion 43 of the connecting member 40 is included in the second enclosure 22, and the first and second free ends 41 and 42 are Each of the two enclosures 22 may protrude.

Referring to FIG. 10, the speaker device 50 according to an exemplary embodiment may electrically connect four

speaker modules

31, 32, 33, and 34 using a plurality of connection members 40. According to an embodiment, a plurality of

speaker modules

31, 32, 33 and 34 may be arranged in parallel without overlapping each other along the first enclosure 21. For example, the first speaker module 31 may be electrically connected to the second speaker module 32 by the connecting member 40, and the second speaker module 32 may be a third speaker module by the connecting member 40. The third speaker module 33 may be electrically connected to the fourth speaker module 34 by the connection member 40. According to an embodiment, the fourth speaker module 34 may be electrically connected to the amplifier by speaker cables c1 and c2.

Referring to FIG. 11, a pogo pin may be utilized as the connection member 60 according to an embodiment. According to an embodiment, the connection member 60 may electrically connect the first and second speaker modules (eg, the first and

second speaker modules

31 and 32 shown in FIG. 4A) arranged in parallel without overlapping. have.

According to an embodiment, the connection member 60 may include a connection part 63, a first elastic pin 61, and a second elastic pin 62. According to an embodiment, the connection part 63 may physically and electrically connect the first elastic pin 61 and the second elastic pin 62. According to an embodiment, the first elastic pin 61 may be elastically supported at one end of the connection part 63, and the second elastic pin 62 may be elastically supported at the other end of the connection part 63. According to an embodiment, the first and second

elastic pins

61 and 62 may be supported by compression coil springs disposed inside the connection part 63, respectively. For example, the first and second

elastic pins

61 and 62 may always receive force in a direction away from the connection part 63 by the compression coil spring. According to an embodiment, the first and second

elastic pins

61 and 62 may maintain a connection state with the first and

second speaker modules

31 and 32 by the support structure of the compression coil spring.

12A is a plan view illustrating a state in which a speaker module according to various embodiments of the present disclosure is electrically connected in series by a connection member. 12B is a block diagram illustrating a state in which a speaker module according to various embodiments of the present disclosure is electrically connected in series by a connection member.

Referring to FIGS. 12A and 12B, the first and

second speaker modules

31 and 32 of the speaker device 20 according to an embodiment may be connected to each other in series with the amplifier 35 disposed on the printed circuit board. According to one embodiment, the first and

second speaker modules

31 and 32 are arranged in series with the amplifier 35 of the printed circuit board using one connecting member 40 and two speaker cables c1 and c2. Can be. According to one embodiment, the first and second speaker modules 31.32 can be connected using one connecting member 40 and two speaker cables c1 and c2, so that the assembly man-hour of the speaker module is In addition, the space occupied by the speaker cable is reduced, and the internal shaping work of the speaker cable is also reduced, so that the mass production yield of the speaker device 20 can be improved.

13A is a plan view illustrating a state in which a speaker module according to various embodiments of the present disclosure is electrically connected in parallel by a connecting member. FIG. 13B is a diagram illustrating a speaker module according to various embodiments of the present disclosure electrically connected in parallel by a connecting member. It is a block diagram showing the connected state.

13A and 13B, the first and

second speaker modules

31 and 32 according to an embodiment may be connected in parallel to an amplifier 35 disposed on a printed circuit board. According to one embodiment, the first and

second speaker modules

31 and 32 may be arranged in series with the amplifier 35 of the printed circuit board using two connection members 40 and speaker cables c3 and c4. have. According to one embodiment, the first and

second speaker modules

31 and 32 can be connected using two connecting members 40 and two speaker cables c3 and c4, so that the assembly of the speaker module compared to the prior art Man-hours are reduced, space occupied by cables is also reduced, and cable shaping work is also reduced, so that the mass production yield of the speaker device 20 can be improved.

14 is a cross-sectional view illustrating a connection structure of a speaker device 20 disposed in an electronic device according to various other embodiments of the present disclosure.

Referring to FIG. 14, in the speaker device 70 according to an embodiment, a connection member between the first and

second speaker modules

81 and 82 during the fusing process of the first enclosure 71 and the second enclosure 72 It is connected using (91, 92), but the connection structure may be formed in a horizontal direction. According to one embodiment, the connection structure includes first and

second connection members

91 and 92 disposed on the side surfaces of each of the first and

second speaker modules

81 and 82, and the first and second speaker modules 81, respectively. It is formed on the partition wall 710 that spatially isolates the mounting space of the ,82, and may include a conductive portion 712 connected to the first and second connecting

members

91 and 92. For example, each of the first and second connecting

members

91 and 92 may have an alphabet C shape at their free ends.

According to one embodiment, when one of the first and

second enclosures

71 and 72 is moved in a vertical direction in a direction closer to each other and then fused, each of the first and second connecting

members

91 and 92 is a conductive part ( 712) can be connected to and stay connected.

Various embodiments of the present disclosure disclosed in the present specification and drawings are merely provided with specific examples to easily describe the technical content of the present disclosure and to aid understanding of the present disclosure, and are not intended to limit the scope of the disclosure. Therefore, the scope of the present disclosure should be construed that all changes or modified forms derived based on the technical idea of the present disclosure in addition to the embodiments disclosed herein are included in the scope of the present disclosure.

Claims

In the electronic device,

At least one speaker device comprising a first plate disposed to face in a first direction and a second plate disposed to face in a second direction opposite to the first direction, and between the first plate and the second plate Includes a housing in which is disposed,

The speaker device

A first enclosure;

A second enclosure;

A plurality of speaker modules disposed in the first enclosure; And

Including at least one connection member disposed in the second enclosure,

When the first and second enclosures are fused, the respective speaker modules are connected to the connection member to be electrically connected.
The electronic device of claim 1, wherein the first and second enclosure fusion directions are vertical.
The electronic device of claim 2, wherein the fusion direction is the same as the first direction or the second direction.
The electronic device of claim 1, wherein both ends of the arranged connection member protrude in a direction in which the speaker module is arranged.
The electronic device of claim 1, wherein one or more connecting members are used to electrically connect the speaker modules to the amplifier in series or parallel.
The method of claim 1, wherein the connection member

A first free end having a first shape having elasticity;

A second free end having a second shape having elasticity; And

An electronic device comprising a connection unit connecting the first and second free ends.
The electronic device of claim 6, wherein the first and second free ends face each other.
The electronic device of claim 7, wherein each of the first and second free ends is curved in a direction facing each other.
The electronic device of claim 6, wherein each of the first and second free ends has a letter C shape.
The electronic device of claim 7, wherein the curved portions of each of the first and second free ends contact each of the speaker modules.
The electronic device of claim 10, wherein when viewed from above the speaker module, the first and second free ends are disposed to overlap with each of the connection terminals.
In the electronic device,

At least one speaker device comprising a first plate disposed facing a first direction and a second plate disposed facing a second direction opposite to the first direction, and between the first plate and the second plate A first housing is disposed; And

And a second housing that is folded or unfolded in the first housing,

The speaker device

A first enclosure;

A second enclosure;

A plurality of speaker modules disposed in the first enclosure; And

Including at least one or more connecting members disposed in the second enclosure,

When the first and second enclosures swell, each of the speaker modules is connected to the connection member to be electrically connected.
In the electronic device,

A first housing in which at least one speaker device is disposed; And

And a second housing that is folded or unfolded in the first housing,

The speaker device

A first enclosure;

A second enclosure;

A plurality of speaker modules disposed in the first enclosure or the second enclosure; And

Including at least one connection member disposed in the second enclosure,

When the first and second enclosures are fused, each of the speaker modules is connected to the connection member to be electrically connected.
The electronic device of claim 13, wherein the first portion is at both corners of the bottom surface of the first housing adjacent to the user.
15. The electronic device of claim 14, wherein the both corner portions are formed in a curved surface and, when mounted on the electronic device table, sound emitted from the speaker module is directed toward a user in front.