WO2021015013A1 - Method for manufacturing concentrating photovoltaic power generation module, method for manufacturing concentrating photovoltaic power generation device, and device for manufacturing concentrating photovoltaic power generation module - Google Patents

Abstract

A method for manufacturing a concentrating photovoltaic power generation module, wherein the method includes: a first step for holding a flexible printed wiring board (13) from the lower surface side; a second step for holding, from the upper surface side, the flexible printed wiring board (13) held from the lower surface side, so that the relative positions of a plurality of flexible substrates (131) are at a deployment position for when deployment is performed on the bottom surface of a casing; and a third step for fitting the flexible printed wiring board (13) held from the upper surface side onto the bottom surface. In the second step, a holding step, in which one of the flexible substrates (131) from among the plurality of flexible substrates (131) is held from the upper surface side, and a releasing step, in which the holding of the one of the flexible substrates (131) from the lower surface side is released after the holding step, are repeated for each of the plurality of flexible substrates (131) in the order in which the plurality of flexible substrates (131) are arranged.

Description

Manufacturing method of concentrating photovoltaic power generation module, manufacturing method of condensing photovoltaic power generation equipment, and manufacturing equipment of condensing photovoltaic power generation module

The present disclosure relates to a method for manufacturing a concentrating photovoltaic power generation module, a method for manufacturing a condensing photovoltaic power generation device, and a manufacturing apparatus for a condensing photovoltaic power generation module.
This application claims priority based on Japanese Application No. 2019-133704 filed on July 19, 2019, and incorporates all the contents described in the Japanese application.

A strip-shaped flexible substrate on which a cell or the like is mounted may be used as a module constituting the condensing type photovoltaic power generation device (see, for example, Patent Document 1).
Since the cell only needs to be in a position where sunlight collects, a strip-shaped substrate is more cost effective than a planar substrate. Further, the flexible substrate is a substrate using polyimide and is highly flexible. Therefore, the strip-shaped flexible substrate can be easily stretched around the bottom surface of a large housing such as a module.
A flexible printed wiring board having a plurality of such strip-shaped flexible substrates is manufactured in a form in which a plurality of flexible substrates are densely packed in order to improve the yield at the time of manufacture.

JP-A-2017-126777

A method for manufacturing a condensing solar power generation module according to an embodiment includes a housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, and the plurality of flexible substrates. A method for manufacturing a condensing solar power generation module including a plurality of cells mounted on the upper surface of a substrate and a printed circuit unit including an electric circuit related to the plurality of cells, wherein the flexible printed wiring board is provided. The flexible printed wiring board is held from the upper surface side so that the first step of holding the flexible substrate from the lower surface side and the relative position between the plurality of flexible substrates are the deployed positions when the flexible boards are deployed on the bottom surface. The second step includes a third step of mounting the flexible printed wiring board held from the upper surface side to the bottom surface, and in the second step, the flexible printed wiring board is held from the lower surface side in the first step. A holding step of holding one of the plurality of flexible substrates from the upper surface side, and a release step of releasing the holding of the one flexible substrate from the lower surface side after the holding step. The flexible printed wiring board is held from the upper surface side by repeating each of the plurality of flexible substrates according to the arrangement order of the plurality of flexible substrates.

Another method of manufacturing a condensing type solar power generation device is a housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, and the plurality of flexible printed wiring boards. A method for manufacturing a condensing solar power generation device including a plurality of cells mounted on an upper surface of a flexible substrate and a printed circuit unit including an electric circuit related to the plurality of cells, wherein the flexible printed wiring board is used. The flexible printed wiring board is mounted from the upper surface side so that the first step of holding the plurality of flexible substrates from the lower surface side and the relative positions of the plurality of flexible substrates are the deployed positions when the flexible substrates are deployed on the bottom surface. The second step of holding and the third step of mounting the flexible printed wiring board held from the upper surface side on the bottom surface are included. In the second step, the flexible printed wiring board is held from the lower surface side in the first step. A holding step of holding one of the plurality of flexible substrates from the upper surface side, and a release step of releasing the holding of the one flexible substrate from the lower surface side after the holding step. The flexible printed wiring board is held from the upper surface side by repeating each of the plurality of flexible substrates according to the arrangement order of the plurality of flexible substrates.

Yet another embodiment of the concentrating solar power generation module manufacturing apparatus includes a housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, and the plurality. A device for manufacturing a condensing solar power generation module including a plurality of cells mounted on the flexible substrate of the above and a printed circuit unit including an electric circuit relating to the plurality of cells, wherein the flexible printed wiring board is provided. The flexible printed wiring board is mounted from the upper surface side so that the first holding mechanism for holding the flexible substrate from the lower surface side and the relative positions of the plurality of flexible substrates are the deployed positions when the flexible boards are deployed on the bottom surface. A second holding mechanism for holding and mounting the held flexible printed wiring board on the bottom surface, and a control unit for controlling the first holding mechanism and the second holding mechanism are provided, and the control unit is the first. A holding step of holding one of the plurality of flexible substrates held by the holding mechanism by the second holding mechanism, and holding of the flexible substrate by the first holding mechanism with respect to the one flexible substrate after the holding step. The first holding mechanism and the second holding mechanism are controlled so as to repeat the release step of releasing the first holding mechanism and the second holding mechanism so as to repeat the release step for each of the plurality of flexible substrates according to the arrangement order of the plurality of flexible substrates. The flexible printed wiring board is held from the upper surface side.

FIG. 1 is a perspective view of an example of a condensing type photovoltaic power generation device as viewed from the light receiving surface side. FIG. 2 is a perspective view showing an example of the configuration of the concentrating photovoltaic power generation module. FIG. 3 is a cross-sectional view showing a configuration example of a light receiving portion of the condensing type photovoltaic power generation module. FIG. 4 is a cross-sectional view showing an example of a condensing photovoltaic power generation unit as a basic configuration of an optical system for concentrating power generation constituting a module. FIG. 5 is a diagram showing an example of a prototype of a flexible printed wiring board before unfolding. FIG. 6 is a perspective view of a part of the prototype of the flexible printed wiring board seen from diagonally above. FIG. 7 is a cross-sectional view taken along the line ZZ at a portion having a connecting band. FIG. 8 is a diagram schematically showing the configuration of the wiring board mounting device and its operation. FIG. 9 is a flowchart showing an example of a mounting operation process for mounting the flexible printed wiring board on the bottom surface of the module housing. FIG. 10A is a perspective view showing an example of a set table before holding the original form. FIG. 10B is a perspective view showing a state in which the prototype is held on the set table. FIG. 11 is a diagram showing a state in which the connecting band of the prototype is cut. FIG. 12A is a perspective view showing an example of the suction unit. FIG. 12B is a cross-sectional view showing a suction port portion of the suction block, showing a state in which the flexible substrate is sucked and held. FIG. 13 is a diagram for explaining a procedure for sucking the flexible substrate held on the set table by the suction unit. FIG. 14 is a view of a suction unit in a state where a plurality of suction blocks each suck one flexible substrate as viewed from below. FIG. 15 is a perspective view showing a part of the suction unit used in the method of mounting the flexible printed wiring board according to the second embodiment. FIG. 16 is a flowchart showing an example of a process of mounting the flexible printed wiring board according to the second embodiment. FIG. 17 is a partial cross-sectional view of a suction block used in the method of mounting the flexible printed wiring board according to the third embodiment, and shows a state in which the flexible substrate is sucked and held. FIG. 18 is a diagram showing an embodiment when the flexible substrate is mounted on the bottom surface of the housing by the suction block of the present embodiment. FIG. 19 is a graph showing the relationship between the pressing load when the pressing portion presses the package and the thermal resistance value between the package and the housing. FIG. 20 is a flowchart showing an example of a process of mounting the flexible printed wiring board according to the fourth embodiment. FIG. 21 is a diagram for explaining an aspect when acquiring the position of the light receiving portion on the substrate. FIG. 22 is a plan view showing an aspect of positioning the flexible substrate on the bottom surface.

[Issues to be solved by this disclosure]
The cell mounted on the flexible printed wiring board needs to be arranged at a position where sunlight is condensed by the condenser lens. Therefore, when the flexible printed wiring board is mounted on the bottom surface of the housing, it is necessary to accurately arrange each of the plurality of flexible substrates at a predetermined position on the bottom surface.

Here, the flexible substrate is a thin strip-shaped object, and the flexible printed wiring board is an aggregate of flexible substrates which are thin strip-shaped objects.
Therefore, it is not easy to handle, and it takes a lot of man-hours to develop a plurality of flexible substrates and accurately arrange them at predetermined positions on the bottom surface, which is a factor of increasing the manufacturing cost.

The present disclosure has been made in view of such circumstances, and an object of the present disclosure is to provide a technique capable of reducing the manufacturing cost of a concentrating photovoltaic power generation device.

[Effect of the present disclosure]
According to the present disclosure, it is possible to reduce the manufacturing cost of the concentrating photovoltaic power generation device.

[Explanation of Embodiments of the present disclosure]
First, the contents of the embodiments will be listed and described.
(1) The method for manufacturing a condensing type solar power generation module according to an embodiment includes a housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, and the above. A method for manufacturing a condensing solar power generation module including a plurality of cells mounted on the upper surface of a plurality of flexible substrates and a printed circuit unit including an electric circuit related to the plurality of cells, wherein the flexible printed wiring board is provided. The flexible printed wiring board is placed on the upper surface so that the first step of holding the flexible boards from the lower surface side and the relative positions of the plurality of flexible boards are the deployed positions when the flexible boards are deployed on the bottom surface. The second step includes a second step of holding from the side and a third step of mounting the flexible printed wiring board held from the upper surface side to the bottom surface, and in the second step, from the lower surface side in the first step. A holding step of holding one of the held flexible substrates from the upper surface side, and a release step of releasing the holding of the one flexible substrate from the lower surface side after the holding step. , Are repeated for each of the plurality of flexible substrates according to the arrangement order of the plurality of flexible substrates, thereby holding the flexible printed wiring board from the upper surface side.

According to the above configuration, if the flexible printed wiring board before deployment is held from the lower surface side of the plurality of flexible substrates, a plurality of flexible printed wiring boards can be held while maintaining either the upper surface side or the lower surface side of the plurality of flexible substrates. The flexible printed wiring board can be held from the upper surface side of a plurality of flexible boards so that the relative positions of the flexible boards are the unfolded positions.
As a result, it is possible to deploy the plurality of flexible substrates, which are thin strip-shaped objects, and to mount the deployed plurality of flexible substrates on the bottom surface with high accuracy and easily. As a result, the man-hours required for manufacturing can be reduced, and the manufacturing cost can be reduced.

(2) In the method for manufacturing a condensing type solar power generation module, in the first step, the flexible printing is performed by adsorbing the plurality of flexible substrates on a lower adsorption surface capable of adsorbing the plurality of flexible substrates. The flexible printed wiring board is held from the lower surface side, and in the second step, the flexible printed wiring board is attracted from the upper surface side by adsorbing the plurality of flexible substrates to the upper suction surface on which the plurality of flexible substrates can be adsorbed. It is preferable to hold it.
In this case, a plurality of strip-shaped flexible substrates can be appropriately held.

(3) Further, in the method for manufacturing the concentrating photovoltaic power generation module, the first step is performed in the crossing direction in a state where the plurality of flexible substrates are lined up close to the crossing direction where the plurality of flexible substrates intersect in the longitudinal direction of the band. By holding the prototype of the flexible printed wiring board in which the plurality of flexible boards are interconnected by a plurality of extending connection bands, and by cutting the plurality of connection bands to separate the plurality of flexible boards. It is preferable to include a step of using the prototype as the flexible printed wiring board.
In this case, if the original form is held, the flexible printed wiring board having a plurality of flexible substrates can be held, and the flexible printed wiring board can be easily held.

(4) Further, in the method for manufacturing the concentrating photovoltaic power generation module, the condensing photovoltaic power generation module is arranged so as to face the bottom surface of the housing, and the sunlight corresponds to the plurality of cells. The second step further includes a condensing unit having a plurality of lens elements that condense light, and the second step is a relative position between the plurality of flexible substrates based on the relative positions of the plurality of lens elements in the condensing unit. It is preferable to further include an adjustment step for adjusting.
In this case, by adjusting the relative positions of the plurality of flexible substrates, it is possible to adjust the relative positions of the plurality of cells on the flexible printed wiring board so as to match the relative positions of the plurality of lens elements.
As a result, when arranging the condensing unit in the housing, the misalignment error that occurs between the positions of the plurality of lens elements and the positions of the plurality of cells arranged on the bottom surface can be reduced.

(5) Further, in the method for manufacturing the condensing type solar power generation module, the condensing type solar power generation module further includes a plurality of packages for holding the plurality of cells on the upper surface of the plurality of flexible substrates. An adhesive layer for adhering the flexible printed wiring board to the bottom surface is provided on at least one of the bottom surface and the flexible printed wiring board, and in the third step, the flexible printed wiring board and the bottom surface are provided. It is preferable that the plurality of packages are selectively pressed toward the bottom surface with the adhesive layer interposed therebetween, and the flexible printed wiring board is mounted on the bottom surface.
In this case, of the flexible substrate, the mounting portion on which the package is mounted can be adhered in a higher adhesion state than other portions other than the mounting portion.
As a result, the thermal resistance value of the mounted portion of the flexible substrate with respect to the housing can be made smaller than that of the other portions.

(6) Further, in the method for manufacturing the concentrating photovoltaic power generation module, after the first step, the positions on the substrate for acquiring the positions on the substrates of the plurality of cells in the plurality of flexible substrates before being deployed. After the acquisition step and the position acquisition step on the substrate, it is determined whether or not to execute the second and subsequent steps based on the comparison result between the acquisition step and the position on the predetermined reference substrate. The pre-determination step and may be further included.
In this case, if the error of the position on the board with respect to the predetermined position on the reference board is out of the permissible range, the execution of the second and subsequent steps can be stopped, and the error of the position on the board is out of the permissible range. It is possible to prevent the flexible printed wiring board from being mounted.

(7) Further, in the method for manufacturing the concentrating photovoltaic power generation module, after the third step, the condensing photovoltaic power generation module is assembled using the housing to which the flexible printed wiring board is mounted. An assembly step, a deployment position acquisition step for acquiring the deployment positions of the plurality of cells after the plurality of flexible substrates are mounted on the bottom surface after the third step and before the assembly step, and After the unfolding position acquisition step, a post-deployment determination step of determining whether or not to execute the assembly step based on the comparison result between the unfolding position and a predetermined reference unfolding position may be further included. Good.
In this case, if the error of the unfolding position with respect to the predetermined reference unfolding position is out of the permissible range, the execution of the assembly step can be stopped, and the housing having the light receiving portion whose unfolding position error is out of the permissible range is provided. It can be used to prevent assembly of the concentrating photovoltaic module.

(8) Further, another method of manufacturing the condensing type solar power generation device according to the embodiment is a flexible printed wiring board having a housing and a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing. A method for manufacturing a condensing type solar power generation device, comprising a plurality of cells mounted on the upper surface of the plurality of flexible substrates and a printed circuit unit including an electric circuit related to the plurality of cells. The flexible printed wiring board is such that the first step of holding the printed wiring board from the lower surface side of the plurality of flexible boards and the relative position between the plurality of flexible boards are the deployed positions when the printed wiring boards are deployed on the bottom surface. Includes a second step of holding the flexible printed wiring board from the upper surface side and a third step of mounting the flexible printed wiring board held from the upper surface side on the bottom surface. In the second step, the first step is described. After the holding step of holding one of the plurality of flexible substrates held from the lower surface side from the upper surface side and the holding step, the holding of the one flexible substrate from the lower surface side is released. By repeating the release step for each of the plurality of flexible substrates according to the arrangement order of the plurality of flexible substrates, the flexible printed wiring board is held from the upper surface side.
According to the above configuration, it is possible to easily deploy a plurality of flexible substrates, which are thin strip-shaped objects, and mount the plurality of deployed flexible substrates at predetermined positions. As a result, the man-hours required for manufacturing can be reduced, and the manufacturing cost can be reduced.

(9) Further, the manufacturing apparatus of the condensing type solar power generation module according to another embodiment is a flexible printed wiring board having a housing and a plurality of strip-shaped flexible substrates deployed on the bottom surface of the housing. A flexible solar power generation module manufacturing apparatus comprising a plurality of cells mounted on the upper surface of the plurality of flexible substrates and a printed circuit unit including an electric circuit relating to the plurality of cells. The flexible printed wiring is such that the first holding mechanism for holding the printed wiring board from the lower surface side of the plurality of flexible substrates and the relative position between the plurality of flexible substrates are the deployed positions when the printed wiring boards are deployed on the bottom surface. A second holding mechanism for holding the plate from the upper surface side and mounting the held flexible printed wiring board on the bottom surface, and a control unit for controlling the first holding mechanism and the second holding mechanism are provided. The control unit has a holding operation in which the second holding mechanism holds one of the plurality of flexible substrates held by the first holding mechanism, and after the holding operation, the first holding mechanism performs the flexible substrate. The first holding mechanism and the second holding mechanism are controlled so that the releasing operation of releasing the holding on one flexible substrate is repeated according to the arrangement order of the plurality of flexible substrates for each of the plurality of flexible substrates. The second holding mechanism holds the flexible printed wiring board from the upper surface side.
According to the above configuration, it is possible to easily deploy a plurality of flexible substrates, which are thin strip-shaped objects, and mount the plurality of deployed flexible substrates at predetermined positions. As a result, the man-hours required for manufacturing can be reduced, and the manufacturing cost can be reduced.

[Details of Embodiment]
Hereinafter, preferred embodiments will be described with reference to the drawings.
In addition, at least a part of the embodiments described below may be arbitrarily combined.

[Structure of concentrating photovoltaic power generation device]
FIG. 1 is a perspective view of an example of a condensing type photovoltaic power generation device as viewed from the light receiving surface side.
In FIG. 1, the photovoltaic power generation device 100 includes an array (the entire photovoltaic power generation panel) 1 having a shape continuous on the upper side and divided into left and right on the lower side, and a support device 2 thereof. The array 1 is configured by arranging the modules 1M on a tracking mount (not shown) on the back side of the array 1. In the example of FIG. 1, the array 1 is an aggregate of 200 modules 1M in total, consisting of (96 (= 12 × 8) × 2) pieces constituting the left and right wings and 8 pieces in the central crossover portion. It is configured.

The support device 2 includes a support column 21, a foundation 22, a two-axis drive unit 23, and a horizontal axis 24 serving as a drive axis. The lower end of the support column 21 is fixed to the foundation 22, and the upper end is provided with a two-axis drive unit 23.
In FIG. 1, the foundation 22 is firmly buried in the ground so that only the upper surface can be seen. With the foundation 22 buried in the ground, the columns 21 are vertical and the horizontal axis 24 is horizontal.

The two-axis drive unit 23 can rotate the horizontal axis 24 in two directions, an azimuth angle (an angle centered on the support column 21) and an elevation angle (an angle centered on the horizontal axis 24).
The two-axis drive unit 23 rotates the horizontal axis 24 in the direction of the azimuth to rotate the array 1 in the direction of the azimuth, and rotates the horizontal axis 24 in the direction of the elevation angle to rotate the array 1. Can be rotated in the direction of elevation.
The two-axis drive unit 23 rotates the array 1 so that the light receiving surface of the array 1 always faces the sun during the daytime. As a result, the array 1 performs the tracking operation of the sun.

[Configuration example of condensing photovoltaic module]
FIG. 2 is a perspective view showing an example of the configuration of the concentrating photovoltaic power generation module 1M. However, only the flexible printed wiring board 13 is shown on the bottom surface 11b side, and other components are omitted here.
As a physical form in appearance, the module 1M includes, for example, a rectangular flat-bottomed container-shaped housing 11 made of metal or resin, and a condensing unit 12 attached on the housing 11 like a lid. There is. The light collecting unit 12 is configured by, for example, a resin primary lens (Fresnel lens) 12f attached to the back surface of one light-transmitting glass plate 12a. For example, each section of the illustrated square (14 × 10 in this example, but the quantity is only an example for explanation) is a primary lens 12f, which converges sunlight to the focal position. be able to.

On the bottom surface 11b of the housing 11, for example, in each of the left half and the right half of the housing 11, one elongated flexible printed wiring board 13 is arranged so as to be aligned while changing the direction as shown in the drawing. .. The flexible printed wiring board 13 has a relatively wide portion and a narrow portion. The cell (not shown) is mounted on a wide area. The cells are arranged at positions corresponding to the respective optical axes of the Fresnel lens 12f.

For example, a metal shielding plate 14 is attached between the flexible printed wiring board 13 and the light collecting unit 12. The shielding plate 14 is formed with a square opening 14a similar to the square of the primary lens 12f at a position corresponding to the center of each primary lens 12f. If the array 1 accurately tracks the sun and the angle of incidence of the sunlight on the module 1M is 0 degrees, the light focused by the primary lens 12f can pass through the aperture 14a. When the tracking is significantly deviated, the collected light is shielded by the shielding plate 14. However, if the tracking deviation is slight, the focused light passes through the opening 14a.

[Structure example of light receiving part]
FIG. 3 is a cross-sectional view showing a configuration example of the light receiving portion R of the condensing type photovoltaic power generation module. It should be noted that each part shown in FIG. 3 is enlarged as appropriate for the convenience of structural explanation, and is not necessarily a diagram proportional to the actual dimensions (the same applies to FIG. 4).

In FIG. 3, the light receiving portion R includes a secondary lens 30, a support portion 31, a package portion 38, a cell 33, a lead frame (P side) 34, a gold wire 35, a lead frame 36 (N side), and a sealing portion. It is equipped with 37. The light receiving portion R is mounted on the flexible printed wiring board 13. A bypass diode is connected to the cell 33 in parallel, but the illustration is omitted here.

The secondary lens 30 is, for example, a ball lens. The secondary lens 30 is supported by the inner peripheral edge 31e of the upper end portion of the support portion 31 so as to form a gap in the optical axis Ax direction with the cell 33. The support portion 31 is, for example, cylindrical and is made of resin or glass. The support portion 31 is fixed on the flat package portion 38. The package portion 38 is made of resin and holds the cell 33 together with the lead frames 34 and 36 thereof. The output of the cell 33 is drawn out to the lead frame 34 on the P side and to the lead frame 36 via the gold wire 35 on the N side. The sealing portion 37 is a light-transmitting silicone resin, and is provided so as to fill the space formed between the secondary lens 30 and the cell 33 inside the support portion 31.

In FIG. 3, the upper end portion of the support portion 31 has a form in which the end surface 31a is expanded to the outside of the secondary lens 30 with the optical axis Ax as the center. When the support portion 31 is made of resin, a washer-shaped metal protective plate may be placed on the end face 31a.
In the following description, the support unit 31 and the package unit 38 may be referred to as a package 32.

[Configuration example of concentrating photovoltaic power generation unit]
FIG. 4 is a cross-sectional view showing an example of a condensing photovoltaic power generation unit 1U as a basic configuration of an optical system for concentrating power generation constituting the module 1M.
In the figure, when the condensing type solar power generation unit 1U faces the sun and the incident angle of the sunlight is 0 degrees, the secondary lens 30 and the cell of the light receiving unit R are placed on the optical axis Ax of the primary lens 12f. There is 33, and the light collected by the primary lens 12f passes through the opening 14a of the shielding plate 14, is taken into the secondary lens 30 of the light receiving portion R, and is guided to the cell 33.

[Prototype of flexible printed wiring board]
Next, the flexible printed wiring board 13 shown in FIG. 2 will be described in detail. The flexible printed wiring board 13 shown in FIG. 2 is in a state of being unfolded and mounted on the bottom surface 11b of the housing 11.
On the other hand, FIG. 5 is a diagram showing an example of the prototype 13A of the flexible printed wiring board 13 before unfolding. In the figure, this prototype 13A includes 140 light receiving portions R, and when expanded, corresponds to the total number of primary lenses 12f (FIG. 2). The quantity is only an example, and in short, a flexible printed wiring board 13 on which the number of light receiving portions R corresponding to the total number of the primary lenses 12f is mounted is required.

Here, the three directions orthogonal to each other shown in FIG. 5 are the X direction, the Y direction, and the Z direction. In the prototype 13A, the light receiving portion R and the like have a constant height in the Z direction, but the overall shape is in the form of a single sheet on the XY plane. However, the electrical connection is separated between the upper half and the lower half in the Y direction, and is composed of the prototype 13A1 in the upper half and 13A2 in the lower half.

For example, the prototype 13A1 in the upper half is provided with ten strip-shaped flexible substrates 131 extending in the X direction and close to each other in the Y direction. The 10 pieces are electrically connected in series while changing direction so as to fold back at the left end and the right end as a whole. In each flexible substrate 131, a wide portion 131w having a relatively wide width in the Y direction is formed at a portion where the light receiving portion R is mounted, and the width is relatively wide between two light receiving portions R adjacent to each other in the X direction. It is a narrow narrow portion 131n.
The lower half prototype 13A2 is also configured in the same manner, and the entire prototype 13A includes 20 flexible substrates 131.

The two flexible substrates 131 adjacent to each other in the Y direction are displaced from each other in the position of the wide portion 131w in the X direction, whereby 20 flexible substrates 131 are densely packed as a whole, and manufacturing with good yield is achieved. It is possible. The folded portion 131c at the left end and the right end is folded with the same width as the narrow portion 131n, and by utilizing the thinness, it can be freely expanded in the Y direction and shifted in the X direction to form the prototype 13A (13A1). , 13A2) can be developed into a desired shape.

The six connection bands 131b extending in the Y direction connect the 20 flexible substrates 131 to each other in a state where they are lined up in close proximity to each other. As a result, the entire prototype 13A including the 20 flexible substrates 131 becomes a single sheet, which facilitates handling. The margins 131x at the left and right ends are attached due to manufacturing necessity, and are cut off before mounting the prototype 13A as a flexible printed wiring board.

FIG. 6 is a perspective view of a part of the prototype 13A of the flexible printed wiring board 13 seen from diagonally above. The connection band 131b is shown with diagonal lines. Based on the strip-shaped flexible substrate 131 extending in the X direction, the light receiving portion R mounted on the upper surface 131s of the flexible substrate 131 at equal intervals in the X direction, and the printed circuit portion 131p including the electric circuit related to the light receiving portion R. Is implemented. A bypass diode 39, which is also a part of the printed circuit unit 131p, is provided near the light receiving unit R. As described above, since the flexible substrate 131 is folded back at the end in the X direction, the polarities of the two adjacent flexible substrates 131 are opposite to each other.

FIG. 7 is a YY cross-sectional view at a portion of the connecting band 131b. X, Y, and Z in the three orthogonal directions are common to FIG. The narrow portion 131n of the flexible substrate 131 has, for example, a configuration in which a copper pattern 1311 on the back surface, an insulating base portion 1312 made of polyimide, a copper pattern 1313 on the front surface side, an adhesive layer 1314, and a coverlay 1315 made of polyimide are laminated. ing. The connection band 131b is configured by, for example, expanding the insulating base portion 1312, the adhesive layer 1314, and the coverlay 1315 as they are.

[About the first embodiment]
Next, a method of mounting the flexible printed wiring board according to the first embodiment will be described. The method of mounting the flexible printed wiring board is included in the method of manufacturing the module 1M (concentrating photovoltaic power generation device).

When the flexible printed wiring board 13 is mounted on the bottom surface 11b of the housing 11, a wiring board mounting device is used.
FIG. 8 is a diagram schematically showing the configuration of the wiring board mounting device and its operation.
As shown in FIG. 8A, the wiring board mounting device 40 deploys the set base 41 holding the flexible printed wiring board 13 and the flexible printed wiring board 13 held on the set base 41 to expand the housing 11. A suction unit 42 mounted on the bottom surface 11b of the above and a control device 43 for controlling these are provided.

The set base 41 has a function of holding the prototype 13A (flexible printed wiring board 13) on the upper surface side.
The suction unit 42 has a function of sucking and holding the flexible printed wiring board 13 held on the set base 41 on the lower surface side. Further, the suction unit 42 holds the flexible printed wiring board 13 so that the relative positions of the plurality of flexible substrates 131 are the deployed positions when the plurality of flexible substrates 131 are deployed on the bottom surface 11b of the housing 11.

As shown in FIG. 8A, when the direction along the longitudinal direction of the prototype 13A is the X direction, the direction along the width direction of the prototype 13A is the Y direction, and the vertical direction is the Z direction, the set base 41 The upper surface of the flexible printed wiring plate 13 and the lower surface of the suction unit 42 holding the flexible printed wiring plate 13 are in a horizontal state along the XY plane. Further, the set table 41 can be arbitrarily moved in each direction while maintaining the upper surface in a horizontal state.

The control device 43 is composed of a computer including a processor, a storage device, and the like. The function of the control device 43 is realized by the processor executing a program stored in the storage device, a recording medium, or the like.
The control device 43 has a function of controlling the set base 41 and the suction unit 42. By controlling the set base 41 and the suction unit 42, the control device 43 can execute the work of mounting the flexible printed wiring board 13 on the bottom surface 11b.

After the suction unit 42 holds the flexible printed wiring board 13, a housing 11 is arranged below the suction unit 42 in place of the set base 41 as shown in FIG. 8B. The control device 43 attaches the flexible printed wiring board 13 held by the suction unit 42 to the bottom surface 11b of the housing 11. An adhesive tape is previously attached to the bottom surface 11b corresponding to the position where the flexible substrate 131 is mounted. The flexible printed wiring board 13 is attached to the bottom surface 11b by this adhesive tape.

As described above, the suction unit 42 holds the flexible printed wiring board 13 so that the relative positions of the plurality of flexible substrates 131 are the deployed positions when the plurality of flexible substrates 131 are deployed on the bottom surface 11b of the housing 11. Therefore, the flexible printed wiring board 13 (a plurality of flexible substrates 131) mounted on the bottom surface 11b by the suction unit 42 is in an unfolded state as shown in FIG. 8C.

Next, the mounting work will be described in more detail.
FIG. 9 is a flowchart showing an example of a mounting operation process for mounting the flexible printed wiring board 13 on the bottom surface 11b of the housing 11 of the module 1M.
In the following description, a case where the control device 43 controls the set base 41 and the suction unit 42 to execute the mounting operation will be described.

The control device 43, which has started the mounting operation, first holds the prototype 13A by the set base 41 (step S1: first step in FIG. 9).
FIG. 10A is a perspective view showing an example of the set base 41 before holding the prototype 13A.
The set base 41 is a device (first holding mechanism) for holding the prototype 13A (flexible printed wiring board 13) from the lower surface 131t side of the flexible substrate 131.
In FIG. 10A, the direction along the longitudinal direction of the prototype 13A is the X direction, and the direction along the width direction of the prototype 13A is the Y direction.

The set base 41 is, for example, a member made of metal, and is formed in a rectangular shape so as to hold almost the entire area of the prototype 13A from below.
A recess 45 is provided on the upper surface of the set base 41. The recess 45 extends in the direction along the X direction, and positions the prototype 13A in the Y direction.
Further, the bottom surface 45a of the recess 45 is provided with a convex portion (not shown) along the outer shape (including the hole) of the prototype body 13A. This convex portion is used to position the prototype 13A in the X direction.
The prototype 13A is arranged on the upper surface side of the set base 41 so as to match the concave portion 45 and the convex portion. As a result, the prototype 13A is positioned in the X direction and the Y direction with respect to the set base 41.

Further, the bottom surface 45a is provided with a large number of suction ports 45b for sucking and holding the prototype 13A. The suction port 45b is connected to a suction pump or the like (not shown). The suction port 45b guides the suction force due to the negative pressure generated by the suction pump to the bottom surface 45a. The bottom surface 45a of the set base 41 attracts and holds the prototype 13A by the suction force of the suction port 45b.
The suction port 45b is provided corresponding to each of the plurality of flexible substrates 131 constituting the prototype 13A. Further, the suction port 45b can control whether or not suction is performed corresponding to each of the plurality of flexible substrates 131. Therefore, the set base 41 can individually hold and release the holding of the plurality of flexible substrates 131.
In this way, the set base 41 holds the flexible printed wiring board 13 by sucking the plurality of flexible substrates 131 on the bottom surface 45a (lower suction surface).
The holding by the set base 41 and the release of the holding are controlled by the control device 43.

In step S1 (FIG. 9), the operator first places the prototype 13A in the recess 45 of the set table 41.
Next, when the operator starts the mounting work on the control device 43, the set base 41 attracts the prototype body 13A by the bottom surface 45a based on the control by the control device 43, and the prototype body 13A is attached to the lower surface of the plurality of flexible substrates 131. Hold from the 131t side.

FIG. 10B is a perspective view showing a state in which the prototype 13A is held on the set table 41.
Also in FIG. 10B, the direction along the longitudinal direction of the prototype 13A is the X direction, and the direction along the width direction of the prototype 13A is the Y direction.
The folded-back portion 131c and the margin portion 131x of the prototype body 13A protrude from the end surface 41b of the set base 41 while being held by the set base 41.

After step S1 in FIG. 9, the control device 43 disconnects the connection band 131b (step S2 in FIG. 9). The wiring board mounting device 40 has a function of cutting the connection band 131b held by the set base 41, and the control device 43 cuts the connection band 131b by the cutting function.

FIG. 11 is a diagram showing a state in which the connection band 131b of the prototype body 13A is cut.
As shown in FIG. 11, the flexible substrates 131 are separated from each other by cutting the connection band 131b between two adjacent flexible substrates 131, for example, in the middle in the Y direction.

As a result, the prototype 13A to which each flexible substrate 131 is connected by the connection band 131b becomes a flexible printed wiring board 13 to which each flexible substrate 131 can be deployed.
At this time, each flexible substrate 131 is held by the bottom surface 45a of the set table 41. Therefore, even if each flexible substrate 131 is separated, each flexible substrate 131 maintains the state of being held by the set table 41 and does not move from the held position.
That is, the flexible printed wiring board 13 held on the set base 41 is arranged before deployment in which a plurality of flexible substrates 131 are close to each other.

As described above, in the present embodiment, the prototype 13A is held on the set base 41, and then the connection band 131b is cut to obtain the flexible printed wiring board 13 before deployment in the state held on the set base 41. be able to.
Here, the prototype 13A is easier to handle than the flexible printed wiring board 13 in which a plurality of flexible substrates 131 are separated. In the present embodiment, if the prototype 13A that is easy to handle is held, the flexible printed wiring board 13 having a plurality of flexible substrates 131 can be appropriately held. Therefore, the flexible printed wiring board can be easily held.

After step S2 in FIG. 9, the control device 43 cuts off the margin 131x (step S3 in FIG. 9). The wiring board mounting device 40 has a function of cutting the margin portion 131x held by the set table 41, and the control device 43 cuts the margin portion 131x by the cutting function.

As described above, the margin portion 131x protrudes from the end surface 41b of the set base 41 (FIG. 10B). Therefore, the margin 131x can be easily cut off while the flexible printed wiring board 13 is held on the set table 41.

After step S3 in FIG. 9, the control device 43 sucks and deploys the flexible printed wiring board 13 by the suction unit 42 (step S4 in FIG. 9: second step).
FIG. 12A is a perspective view showing an example of the suction unit 42. FIG. 12A shows a view of the suction unit 42 when viewed from below.

The suction unit 42 (second holding mechanism) includes a main body 51 and a plurality of suction blocks 50 attached to the main body 51. Each of the plurality of suction blocks 50 sucks and holds one flexible substrate 131. The suction unit 42 shown in FIG. 12A includes 10 suction blocks 50 and holds the flexible printed wiring board 13 obtained from the prototype 13A1 (13A2) including the 10 flexible substrates 131.
That is, the suction unit 42 shown in FIG. 12A holds one of the pair of flexible printed wiring boards 13 mounted on the right half and the left half of the housing 11 shown in FIG.

A plurality of suction ports 53 are provided on the lower surface 50a of the plurality of suction blocks 50. The suction port 53 is connected to a suction pump or the like (not shown). The suction port 53 guides the suction force due to the negative pressure generated by the suction pump to the lower surface 50a. The lower surfaces of the plurality of suction blocks 50 suck and hold the flexible substrate 131 by the suction force of the suction port 53.
The suction port 53 is provided corresponding to the wide portion 131w of the flexible substrate 131. Therefore, the suction block 50 shown in FIG. 12A is provided with seven suction ports 53.

FIG. 12B is a cross-sectional view showing a portion of the suction port 53 of the suction block 50, showing a state in which the flexible substrate 131 is sucked and held.
As shown in FIG. 12B, the suction port 53 is provided corresponding to the wide portion 131w, and accommodates the light receiving portion R mounted on the wide portion 131w.
As a result, the suction block 50 can suck the wide portion 131w while preventing the light receiving portion R protruding from the upper surface 131s of the flexible substrate 131 from coming into contact with the lower surface 50a.
In this way, the suction unit 42 holds the flexible printed wiring board 13 by sucking the plurality of flexible substrates 131 on the lower surfaces 50a (upper suction surfaces) of the plurality of suction blocks 50.

The portion of the suction block 50 other than the portion corresponding to the wide portion 131w is shaped so as to avoid interference with the flexible substrate 131 other than the flexible substrate 131 to which the suction block 50 is sucked. As a result, the suction block 50 can suck one flexible substrate 131 from a plurality of flexible substrates 131 close to each other.

The plurality of suction blocks 50 are arranged so that the relative positions of the plurality of held flexible substrates 131 are the deployed positions when the plurality of flexible substrates 131 are deployed on the bottom surface 11b.
As a result, the suction unit 42 can hold the flexible printed wiring board 13 from the upper surface 131s side of the plurality of flexible boards 131 so that the relative positions of the plurality of flexible boards 131 are the deployment positions.
That is, if the suction unit 42 holds the flexible printed wiring board 13, a plurality of flexible substrates 131 can be deployed.

Further, each of the plurality of suction blocks 50 is attached to the main body 51 via a linear actuator. The plurality of suction blocks 50 can be individually moved in the vertical direction (Z direction orthogonal to the X direction and the Y direction) by a linear actuator.
When holding the flexible printed wiring board 13, the suction unit 42 moves one of the plurality of suction blocks 50 downward and sucks one flexible substrate 131.

When the flexible printed wiring board 13 is sucked and deployed by the suction unit 42, the control device 43 moves the set base 41 holding the flexible substrate 131 below the suction unit 42, and the suction unit 43, as shown in FIG. 12A. The lower surface of the 42 (the lower surface 50a of the plurality of suction blocks 50) and the upper surface of the set table 41 face each other.

FIG. 13 is a diagram for explaining a procedure when the suction unit 42 sucks the flexible substrate 131 held on the set table 41. In FIG. 13, the direction along the longitudinal direction of the flexible printed wiring board 13 (set base 41) is the X direction, the direction along the width direction of the flexible printed wiring board 13 is the Y direction, and the directions orthogonal to the X direction and the Y direction are Z. The direction.
First, as shown in FIG. 13A, the set table 41 is moved below the suction unit 42, and is on the horizontal plane (XY plane) of the flexible substrate 131 at the right end of the paper surface among the plurality of flexible substrates 131. Align the position with the position for suction to the suction block 501 on the right edge of the paper surface.

Next, as shown in FIG. 13B, only the suction block 501 is moved downward to bring the lower surface 501a into contact with one flexible substrate 131, and one flexible substrate 131 is sucked onto the suction block 501. Let me.
As a result, the suction block 501 holds one flexible substrate 131 from the upper surface 131s side (holding step).
The one flexible substrate 131 held by the suction block 501 is also held by the set table 41 from the lower surface 131t side.

Next, the holding by the set base 41 on the one flexible substrate 131 held by the suction block 501 is released (release step), and as shown in (c) in FIG. 13, one flexible substrate 131 is sucked. The suction block 501 is raised to the original position.
At least one end of each flexible substrate 131 is connected to the adjacent flexible substrate 131 via the folded-back portion 131c. Therefore, when the suction unit 42 sucks the flexible substrate 131 of the set base 41, the distance between the suction unit 42 and the set base 41 is within the range of the length that the folded-back portion 131c connecting the adjacent flexible boards 131 can reach. Is set to.

When the suction block 501 sucks one flexible substrate 131 and rises to the original position, the set table 41 is moved in the horizontal direction, and the horizontal plane of the flexible substrate 131 arranged next to the flexible substrate 131 sucked by the suction block 501. The upper position is aligned with the position for suction to the suction block 502 arranged next to the suction block 501 ((d) in FIG. 13).

Hereinafter, similarly to the suction block 501, one flexible substrate 131 is sucked onto the suction block 502.
The above procedure is repeated for each of the plurality of flexible substrates 131 according to the arrangement order of the plurality of flexible substrates 131.
As a result, one flexible substrate 131 can be adsorbed to each of the plurality of adsorption blocks 50.

FIG. 14 is a view of the suction unit 42 in a state where the plurality of suction blocks 50 each suck one flexible substrate 131 as viewed from below.
As shown in FIG. 14, the suction unit 42 holds the flexible printed wiring board 13 so that the relative positions of the plurality of flexible substrates 131 are the deployment positions.
As described above, the control device 43 sucks and deploys the flexible printed wiring board 13 by the suction unit 42.

According to this configuration, after the flexible printed wiring board 13 before deployment is held from the lower surface 131t side of the plurality of flexible boards 131, either the upper surface 131s side or the lower surface 131t side of one flexible board 131 is held. While maintaining the state, the flexible printed wiring board 13 can be held from the upper surface 131s side of the plurality of flexible boards 131 so that the relative positions of the plurality of flexible boards 131 are the deployment positions.
As a result, the plurality of flexible substrates 131, which are thin strip-shaped objects, can be deployed and the plurality of deployed flexible substrates can be mounted on the bottom surface 11b with high accuracy and easily. As a result, the man-hours required for manufacturing the module 1M can be reduced, and the manufacturing cost can be reduced.

Further, in the above configuration, the set base 41 attracts a plurality of flexible substrates 131 to the bottom surface 45a to hold the flexible printed wiring board 13, and the suction unit 42 has a plurality of flexible substrates 50a to the bottom surface 50a of the suction block 50. Since the flexible printed wiring board 13 is held by adsorbing the substrate 131, it is possible to appropriately hold a plurality of flexible substrate 131 which are thin strip-shaped objects.

After step S4 in FIG. 9, the control device 43 attaches the flexible printed wiring board 13 to the bottom surface 11b of the housing 11 by the suction unit 42 (step S5 in FIG. 9: third step).

The attachment of the flexible printed wiring board 13 by the suction unit 42 is as described above. That is, the flexible printed wiring board 13 held by the suction unit 42 is brought into contact with the bottom surface 11b of the housing 11 and mounted. At this time, the positional relationship between the suction unit 42 and the housing 11 is controlled by the control device 43, and the flexible printed wiring board 13 is mounted at a predetermined position on the bottom surface 11b.
When the flexible printed wiring board 13 is mounted at a predetermined position on the bottom surface 11b, the control device 43 releases the holding of the flexible printed wiring board 13.

When the mounting of the flexible printed wiring board 13 is completed in the state where the plurality of flexible substrates 131 are deployed on the bottom surface 11b by step S5 in FIG. 9, the control device 43 uses the inspection function of the wiring board mounting device 40. Then, it is inspected whether or not the positions of the light receiving portions R of the plurality of flexible substrates 131 are appropriate positions (step S6 in FIG. 9), and the mounting operation is completed.

The housing 11 to which the flexible printed wiring board 13 is mounted is assembled as a module 1M by making necessary wiring in the process after the mounting work, attaching the shielding plate 14, the light collecting portion 12, and the like. The module 1M assembled in this way is incorporated as a component of the photovoltaic power generation device 100.

[About the second embodiment]
FIG. 15 is a perspective view showing a part of the suction unit 42 used in the method of mounting the flexible printed wiring board according to the second embodiment.
The plurality of suction blocks 50 included in the suction unit 42 of the present embodiment are provided so as to be movable in the X direction and in the Y direction in addition to being movable in the Z direction, and are held by the plurality of suction blocks 50. It differs from the first embodiment in that the relative positions of the plurality of flexible substrates 131 can be finely adjusted.

The suction unit 42 includes a linear actuator for moving each suction block 50 in the Z direction, a linear actuator 55 for translating each suction block 50 in the X direction, and parallel movement of each suction block 50 in the Y direction. A linear actuator 56 is provided for the operation.
The linear actuators 55 and 56 are provided in each of the suction blocks 50. The linear actuators 55 and 56 can move the suction block 50 by several millimeters to several centimeters.

Therefore, the relative positions of the plurality of suction blocks 50 can be adjusted by the linear actuators 55 and 56 while maintaining the basic arrangement. The linear actuators 55 and 56 are controlled by the control device 43.
The control device 43 stores the initial positions of the plurality of suction blocks 50 determined in advance by design values and the like, and at the time of starting the work, the linear actuators 55 and 56 so that the plurality of suction blocks 50 are in the initial positions. To control.

FIG. 16 is a flowchart showing an example of a process of mounting the flexible printed wiring board 13 according to the second embodiment.
The flowchart shown in FIG. 16 is the flowchart according to the first embodiment shown in FIG. 9 in that step S0 is provided before step S1 and that step S41 and step S42 are included in step S4. It's different. Since the other steps are the same as the flowchart according to the first embodiment, the description thereof will be omitted.

The flowchart of FIG. 16 shows the mounting work executed by the control device 43 of the wiring board mounting device 40, similarly to the flowchart of FIG.
First, the control device 43 that has started the mounting work first receives the lens position information (step S0 in FIG. 16).

The lens position information is information indicating the relative positions of a plurality of Fresnel lenses 12f (lens elements) possessed by the condensing unit 12 (see FIG. 2).
The relative positions of the plurality of Fresnel lenses 12f are acquired, for example, based on an image captured by a camera or the like of the condensing unit 12 on which the plurality of Fresnel lenses 12f are formed.
For example, from the captured image, a feature portion indicating the outer shape of the Fresnel lens 12f, such as the center point and outer contour of each of the plurality of Fresnel lenses 12f, is specified, and the relative positions of the plurality of Fresnel lenses 12f are acquired from the position of the feature portion. To.
The relative position of the plurality of Fresnel lenses 12f is represented by, for example, the coordinates when the position of one Fresnel lens 12f among the plurality of Fresnel lenses 12f is used as a reference. That is, the lens position information is the coordinates indicating the position of each Fresnel lens 12f.
The lens position information may include the coordinates of all of the plurality of Fresnel lenses 12f, or may include the coordinates of some of the Fresnel lenses 12f among the plurality of Fresnel lenses 12f.

In the present embodiment, the lens position information of the condensing unit 12 attached to the housing 11 is acquired in advance. The control device 43 receives the lens position information by input by an operator who operates the wiring board mounting device 40.
After that, the control device 43 that has executed steps S2 and S3 sucks and deploys the flexible printed wiring board 13 by the suction unit 42 (step S4 in FIG. 16).
As shown in FIG. 16, step S4 includes two steps of suction and deployment of the flexible printed wiring board 13 (step S41) and position adjustment of the plurality of suction blocks 50 (step S42: adjustment step).

In FIG. 16, step S41 performs the same process as step S4 in FIG.
Therefore, in step S41, the control device 43 sucks and deploys the flexible printed wiring board 13 by the suction unit 42.
Next, the control device 43 controls the linear actuators 55 and 56 while holding the flexible printed wiring board 13, and adjusts the positions of the plurality of suction blocks 50 (step S42 in FIG. 16).
At this time, the control device 43 adjusts the positions of the plurality of suction blocks 50 based on the lens position information (relative positions of the plurality of Fresnel lenses 12f).

The plurality of Fresnel lenses 12f included in the condensing unit 12 condense sunlight corresponding to the plurality of light receiving units R (cells 33). Therefore, it is necessary to position the condensing unit 12 and the housing 11 so that the positions of the plurality of Fresnel lenses 12f correspond to the positions of the plurality of light receiving units R.
Here, the plurality of Fresnel lenses 12f included in the condensing unit 12 may have variations in relative positions in the process of forming the plurality of Fresnel lenses 12f.

If the relative positions of the plurality of Fresnel lenses 12f vary, even if the condensing unit 12 and the housing 11 are positioned, the plurality of Fresnel lenses 12f are integrally provided as the condensing unit 12. , The plurality of Fresnel lenses 12f cannot be individually positioned, and there is a possibility that the positions of the plurality of Fresnel lenses 12f and the positions of the plurality of light receiving portions R cannot be properly aligned so as to correspond to each other. If the positions of the plurality of Fresnel lenses 12f and the positions of the plurality of light receiving parts R cannot be properly aligned, the sunlight collected by the Fresnel lens 12f cannot be properly guided to the light receiving parts R, and the power generation efficiency is lowered. Let me.

Therefore, in the present embodiment, the relative positions of the plurality of flexible boards 131 are adjusted by adjusting the positions of the plurality of suction blocks 50 that suck the plurality of flexible boards 131, and the flexible printed wiring board when deployed is used. The relative positions of the plurality of light receiving portions R on the 13 are adjusted so as to match the relative positions of the plurality of Fresnel lenses 12f.

The control device 43 stores the relative positions of the plurality of light receiving units R (cells 33) on the flexible printed wiring board 13 when the flexible printed wiring board 13 is deployed by the plurality of suction blocks 50 at the initial positions. ..
The control device 43 compares the relative positions of the Fresnel lenses 12f indicated by the lens position information with the relative positions of the light receiving units R developed at the initial positions, and compares the positions of the Fresnel lenses 12f corresponding to each other with the light receiving units R. The positions of the plurality of suction blocks 50 so as to minimize the misalignment error with the position of are obtained.

The control device 43 controls the linear actuators 55 and 56 and adjusts the positions of the plurality of suction blocks 50 so as to be obtained.
As a result, the relative positions of the plurality of flexible substrates 131 are relative to each other so that the relative positions of the plurality of light receiving portions R on the flexible printed wiring board 13 when deployed are aligned with the relative positions of the plurality of Fresnel lenses 12f indicated by the lens position information. The position can be adjusted.

As a result, when the condensing unit 12 and the housing 11 are positioned, a misalignment error occurs between the positions of the plurality of Fresnel lenses 12f and the positions of the plurality of light receiving units R arranged on the bottom surface 11b. Can be reduced, and the positions of the plurality of Fresnel lenses 12f and the positions of the plurality of light receiving portions R can be appropriately aligned.

After completing step S42 in FIG. 16, the control device 43 attaches the flexible printed wiring board 13 to the housing 11 by the suction unit 42 (step S5 in FIG. 16), and inspects the housing 11 (in FIG. 16). Step S6), the work is completed.

In the present embodiment, after the suction unit 42 sucks and deploys the flexible printed wiring board 13 (step S41 in FIG. 16), the positions of the plurality of suction blocks 50 are adjusted (step S42 in FIG. 16). However, step S42 may be performed at a timing before step S41.

[About the third embodiment]
FIG. 17 is a partial cross-sectional view of the suction block 50 used in the method of mounting the flexible printed wiring board according to the third embodiment, and shows a state in which the flexible substrate 131 is sucked and held. FIG. 17 shows a cross section of the suction block 50 along the longitudinal direction (X direction).
As shown in FIG. 17, the suction block 50 of the present embodiment is different from the suction block 50 of the first embodiment in that it includes a pressing portion 65 for pressing the light receiving portion R.

The suction block 50 includes a square columnar block body 60 and a plurality of pressing portions 65.
The block body 60 is provided with a plurality of cylindrical hole-shaped suction ports 53. The suction port 53 penetrates from the lower surface 60a of the block body 60 to the upper surface 60b. The lower surface 60a of the block body 60 constitutes the lower surface 50a of the suction block 50.

The pressing portion 65 is inserted into the suction port 53. The pressing portion 65 is a cylindrical rod-shaped member, and is provided so as to be movable in the Z direction with respect to the block main body 60. The pressing portion 65 is driven by the actuator 66. The actuator 66 is controlled by the control device 43.
When the suction block 50 sucks the flexible substrate 131, the pressing portion 65 is arranged so as to be above the lower surface 60a, and a space for accommodating the light receiving portion R inside the suction port 53 is secured. As a result, the suction block 50 can suck the flexible substrate 131 while accommodating the light receiving portion R inside the suction port 53, and can hold the flexible substrate 131 on the lower surface 50a.
Further, when the suction block 50 sucks the flexible substrate 131, the inside of the suction port 53 is made a negative pressure to suck the flexible substrate 131. Therefore, the pressing portion 65 is movable with and from the block main body 60 while maintaining airtightness.

The lower surface 65a of the pressing portion 65 is provided with a cylindrical hole portion 65b recessed in the axial direction from the lower surface 65a. Therefore, the lower surface 65a is composed of the hole 65b and the end surface 65c around the hole 65b.
The inner diameter of the hole 65b is larger than the outer diameter of the secondary lens 30 of the light receiving portion R.
As a result, it is possible to prevent the secondary lens 30 of the light receiving portion R housed inside the suction port 53 from coming into contact with the pressing portion 65.
Further, the inner diameter of the hole portion 65b is smaller than the outer diameter of the package 32 of the light receiving portion R. Therefore, the end surface 65c can be brought into contact with the upper surface end portion 32a of the package 32. Therefore, when the pressing portion 65 is moved downward, the package 32 can be pressed downward without pressing the secondary lens 30 of the light receiving portion R.

FIG. 18 is a diagram showing an embodiment when the flexible substrate 131 is mounted on the bottom surface 11b of the housing 11 by the suction block 50 of the present embodiment.
FIG. 18 shows the aspect of step S5 in FIG. 9 in this embodiment.
When the control device 43 sucks and deploys the flexible printed wiring board 13 (step S4 in FIG. 9), the control device 43 moves the suction unit 42 onto the bottom surface 11b of the housing 11 and XY with respect to the housing 11. It is arranged at a predetermined position on a plane (step S5 in FIG. 9).

FIG. 18A shows a state in which the suction block 50 (suction unit 42) holding the flexible printed wiring board 13 (flexible substrate 131) is arranged at a predetermined position on the bottom surface 11b of the housing 11. There is.
An adhesive layer 70 made of an adhesive tape, an adhesive, or the like having heat dissipation is provided on the bottom surface 11b of the housing 11. The adhesive layer 70 is provided to bond the flexible substrate 131 (flexible printed wiring board 13) to the bottom surface 11b.
Further, due to its heat dissipation property, the adhesive layer 70 can release the heat of the light receiving portion R whose temperature rises due to the irradiation of sunlight to the housing 11.

From the state (a) in FIG. 18, the control device 43 lowers the suction block 50 (suction unit 42) along the Z direction to bring the flexible substrate 131 into contact with the adhesive layer 70 on the bottom surface 11b. As a result, the adhesive layer 70 is interposed between the flexible substrate 131 and the bottom surface 11b.
After that, the control device 43 releases the holding of the flexible substrate 131 by making the inside of the suction port 53 a positive pressure.
Further, as shown in FIG. 18B, the control device 43 raises the block body 60 in a state where the end surface 65c of the pressing portion 65 is in contact with the upper surface end portion 32a of the package 32 of the light receiving portion R. Let me. As a result, the control device 43 separates the block main body 60 from the flexible substrate 131.

As shown in FIG. 18B, the control device 43 operates the pressing portion 65 in a state where the block main body 60 is separated from the flexible substrate 131, and presses the upper surface end portion 32a of the package 32 with a predetermined pressing load. Press.
As a result, the control device 43 selectively presses only the package 32 of the flexible substrate 131 (flexible printed wiring board 13) toward the bottom surface 11b.
The control device 43 selectively presses only the package 32 and presses the flexible substrate 131 against the adhesive layer 70. As a result, the flexible substrate 131 is adhered to the bottom surface 11b via the adhesive layer 70.
After that, as shown in (c) in FIG. 18, the control device 43 raises the suction block 50 and finishes mounting the flexible printed wiring board 13.

As described above, in the present embodiment, when the flexible substrate 131 (flexible printed wiring board 13) is mounted on the bottom surface 11b of the housing 11 (third step in FIG. 9), the flexible substrate 131 and the bottom surface 11b are attached to each other. The package 32 is selectively pressed with the adhesive layer 70 interposed therebetween, and the flexible substrate 131 is adhered to the bottom surface 11b.

As a result, of the flexible substrate 131, the wide portion 131w (mounting portion) on which the package 32 is mounted can be adhered in a higher adhesion state than other portions (narrow portion 131n) other than the wide portion 131w. Further, among the adhesive layers 70, the layer thickness of the adhesive layer 70 corresponding to the wide portion 131w can be made thinner than the layer thickness of the adhesive layer 70 corresponding to the narrow portion 131n.
As a result, the thermal resistance value between the wide portion 131w and the housing 11 can be made smaller than that between the narrow portion 131n and the housing 11.
Therefore, the heat dissipation of the wide portion 131w can be improved, and the heat of the light receiving portion R whose temperature rises due to the irradiation of sunlight can be efficiently dissipated to the housing 11.

Further, by selectively pressing the package 32, the wide portion 131w can be adhered more firmly than the narrow portion 131n, and a stress that pulls the wide portion 131w is generated in the narrow portion 131n. It can be suppressed.

In the present embodiment, the case where the adhesive layer 70 is provided on the bottom surface 11b of the housing 11 is illustrated, but the adhesive layer may be provided on the flexible substrate 131 side, or the adhesive layer may be provided on both the bottom surface 11b and the flexible substrate 131. It may be provided.

The pressing load when the pressing portion 65 presses one package 32 is preferably 2.5 kgf or more and 5.0 kgf or less.
FIG. 19 is a graph showing the relationship between the pressing load when the pressing portion 65 presses the package 32 and the thermal resistance value between the package 32 and the housing 11.
FIG. 19 shows the measured values obtained by measuring the thermal resistance values when the pressing load is approximately 0 kgf, 2.5 kgf, and 5 kgf. These measured values are the measured thermal resistance values when one package 32 is pressed by the pressing portion 65 and the flexible substrate 131 is adhered to the bottom surface 11b of the housing 11. The external dimensions of the package 32 are, for example, a rectangular shape of about 6 mm × about 6 mm.

As shown in FIG. 19, when the pressing load is 2.5 kgf and 5.0 kgf, the thermal resistance values are both 6 to 6.5 ° C./W.
On the other hand, when the pressing load was approximately 0 kgf, the thermal resistance value was about 7.7 ° C./W.
From this result, it can be seen that the thermal resistance value can be reduced if the pressing load is 2.5 kgf or more.
Further, if the pressing load is 10 kgf or more, the package 32 may be damaged. On the other hand, if the pressing load is set to be smaller than 10 kgf, the package 32 will not be damaged.

From the above results, the pressing load is preferably 2.5 kg or more and 5 kgf or less, and by setting in this way, the thermal resistance value can be made relatively small, and the package 32 is damaged when the package 32 is pressed. Can be suppressed.

[About the fourth embodiment]
FIG. 20 is a flowchart showing an example of a process of mounting the flexible printed wiring board 13 according to the fourth embodiment.
The flowchart shown in FIG. 20 shows that step S11 and step S12 are provided between step S1 and step S2, and that step S20 is provided after step S5, and that step S6 is replaced. It is different from the flowchart according to the first embodiment shown in FIG. 9 in that steps S21 and S22 are provided. Other than that, the same as the flowchart according to the first embodiment, and thus the description thereof will be omitted.

The flowchart of FIG. 20 shows the mounting work executed by the control device 43 of the wiring board mounting device 40, similarly to the flowchart of FIG.

The control device 43, which has started the mounting operation, first holds the prototype 13A by the set base 41 (step S1 in FIG. 9).
Next, the control device 43 acquires the positions on the substrate of the plurality of light receiving units R (cells 33) mounted on the prototype 13A (step S11: position acquisition step on the substrate).
The position on the substrate is a position in the wide portion 131w of the light receiving portion R (cell 33) mounted on the wide portion 131w in the prototype 13A (flexible printed wiring board 13 before deployment).

The position of the light receiving portion R on the substrate in the prototype 13A is acquired based on the captured image captured by the camera.
FIG. 21 is a diagram for explaining an aspect when acquiring the position of the light receiving portion R on the substrate.
As shown in FIG. 21, the camera 75 is installed on the set table 41 that holds the prototype 13A. The prototype 13A is imaged by the camera 75.

The control device 43 takes an image of the prototype 13A by the camera 75. Further, the control device 43 identifies a feature portion indicating the outer shape of the wide portion 131w and the light receiving portion R, such as the outer contour of the wide portion 131w and the outer contour of the secondary lens 30 of the light receiving portion R and the package 32, from the captured image. Then, the position of the light receiving portion R on the substrate on the wide portion 131w is acquired from the position of the feature portion.
The position of the light receiving portion R on the substrate is represented by, for example, the relative coordinates set in the wide portion 131w.

As shown in FIG. 20, when the position of the light receiving unit R on the substrate is acquired, the control device 43 determines the presence or absence of the light receiving unit R whose position error on the substrate is out of the permissible range among the plurality of light receiving units R. (In FIG. 20, step S12: pre-deployment determination step).
The control device 43 compares the position on the substrate of each light receiving unit R with a predetermined position on the reference substrate, and whether the error of the position of each light receiving unit R on the substrate with respect to the position on the reference substrate is within a preset allowable range. Judge whether or not. The predetermined position on the reference substrate is a design position of the light receiving portion R on the wide portion 131w.

When it is determined that there is a light receiving unit R whose position error on the substrate is out of the permissible range among the plurality of light receiving units R, the control device 43 stops the subsequent work. Therefore, it is possible to prevent such a prototype 13A from being attached to the housing 11.
On the other hand, when it is determined that there is no light receiving unit R whose position error on the substrate is out of the permissible range among the plurality of light receiving units R, the control device 43 proceeds to step S2.
As described above, in step S12, the control device 43 determines whether or not to execute the operations of the second and subsequent steps based on the comparison result between the position on the substrate of each light receiving unit R and the position on the predetermined reference substrate. decide.

When the prototype 13A having the light receiving portion R whose position error on the board is out of the allowable range is developed and mounted on the housing 11 as the flexible printed wiring board 13, the light receiving portion R after mounting the flexible printed wiring board 13 There is a risk of error in the position of.
On the other hand, in the present embodiment, when it is determined that there is a light receiving unit R whose position error on the substrate is out of the permissible range among the plurality of light receiving units R, the control device 43 stops the subsequent work. Therefore, it is possible to prevent the flexible printed wiring board 13 from being mounted by using the prototype 13A having the light receiving portion R whose position error on the substrate is out of the permissible range.
As a result, when the flexible printed wiring board 13 is mounted on the bottom surface 11b, the light receiving portion R can be accurately arranged on the bottom surface 11b.

After that, the process proceeds from step S2 to step S5, and when the mounting of the flexible printed wiring board 13 on the bottom surface 11b of the housing 11 is completed, the control device 43 is in the unfolded position of the light receiving portion R on the mounted flexible printed wiring board 13. (Step S20 in FIG. 20: Deployment position acquisition step).
The unfolded position is the position of the light receiving portion R (cell 33) on the bottom surface 11b after the flexible printed wiring board 13 is unfolded and mounted on the bottom surface 11b of the housing 11.

The unfolded position of the light receiving portion R of the flexible printed wiring board 13 mounted on the housing 11 is acquired based on the captured image captured by the camera, as in the case of acquiring the position on the substrate.
That is, the control device 43 arranges the camera above the housing 11 on which the flexible printed wiring board 13 has been mounted.
The control device 43 takes an image of the bottom surface 11b of the housing 11 with a camera, and from the captured image, identifies a feature portion indicating the outer shape of the light receiving portion R, such as the secondary lens 30 of the light receiving portion R and the outer contour of the package 32. From the position of the feature portion, the deployed position of the light receiving portion R on the bottom surface 11b can be obtained.
The unfolded position of the light receiving portion R on the bottom surface 11b is represented by, for example, the relative coordinates set on the bottom surface 11b.

Upon acquiring the unfolded position of the light receiving unit R, the control device 43 determines whether or not the light receiving unit R has an error in the unfolded position outside the permissible range among the plurality of light receiving units R (step S21: unfolded in FIG. 20). Post-judgment step).
The control device 43 compares the unfolded position of each light receiving unit R with a predetermined reference unfolded position, and determines whether or not the error of the unfolded position of each light receiving unit R with respect to the reference unfolded position is within a preset allowable range. To do. The predetermined reference deployment position is a design position of the light receiving portion R on the bottom surface 11b.

When it is determined that there is a light receiving unit R whose deployment position error is out of the permissible range among the plurality of light receiving units R, the control device 43 stops the subsequent work. Therefore, it is possible to prevent such a housing 11 from proceeding to a later process.
On the other hand, when it is determined that there is no light receiving unit R whose deployment position error is out of the permissible range among the plurality of light receiving units R, the control device 43 proceeds to step S22.
In step S22, as an assembly process of the module 1M, the light collecting unit 12 is attached to the housing 11 to which the flexible printed wiring board 13 is mounted.
As described above, in step S21, the control device 43 determines whether or not to execute step S22 based on the comparison result between the deployed position of the light receiving unit R and the predetermined reference deployed position.

When the module 1M is assembled using the housing 11 having the light receiving portion R whose deployment position error is out of the permissible range, the plurality of Fresnel lenses 12f included in the condensing unit 12 are aligned with the plurality of light receiving portions R. May not be performed properly.
On the other hand, in the present embodiment, when it is determined that there is a light receiving unit R whose deployment position error is out of the permissible range among the plurality of light receiving units R, the control device 43 stops the subsequent work. It is possible to prevent the module 1M from being assembled by using the housing 11 having the light receiving portion R whose deployment position error is out of the permissible range.
As a result, the housing 11 in which the light receiving portion R arranged on the bottom surface 11b is accurately arranged can be advanced to the subsequent steps.

In the present embodiment, in step S20 in FIG. 20, the external contour of the secondary lens 30 of the light receiving portion R and the package 32 are specified from the captured image, and the deployed position of the light receiving portion R on the bottom surface 11b is acquired. Although the case has been illustrated, the deployment position of the light receiving portion R may be indirectly acquired from the position of the flexible substrate 131 on the bottom surface 11b.

FIG. 22 is a plan view showing an aspect of positioning the flexible substrate 131 on the bottom surface 11b.
In FIG. 22, marking lines L1, L2, L3, L4, and L5 are provided in advance on the bottom surface 11b. Each marking line indicates the design position of the flexible printed wiring board 13 on the bottom surface 11b. Each of these marking lines indicates the position of the connection band 131b of the flexible substrate 131.
After mounting the flexible printed wiring board 13, the control device 43 takes an image of the bottom surface 11b of the housing 11 with a camera, and identifies the outer shape of the flexible substrate 131 and each marking line from the image taken. As a result, the control device 43 can specify the position of the flexible substrate 131 with reference to the marking line, and can indirectly acquire the position (deployment position) of the light receiving portion R from the position of the flexible substrate 131. ..

In this case, the control device 43 can determine whether or not the error with respect to each marking line of the outer shape of the specified flexible substrate 131 is out of the permissible range.
Further, when the error for each marking line is out of the permissible range, the control device 43 can determine that the unfolded position of the light receiving portion R mounted on the flexible substrate 131 is also out of the permissible range.

Further, in the present embodiment, when it is determined in step S12 in FIG. 20 that there is a light receiving unit R whose position error on the substrate is out of the permissible range among the plurality of light receiving units R, the subsequent work is stopped. However, for example, if the suction unit 42 can adjust the position of the suction block 50 as shown in the second embodiment, the position of the light receiving portion R whose position error on the substrate is out of the permissible range. Is corrected so as to be within the permissible range, and the position of the suction block 50 can be finely adjusted.
In this case, the flexible printed wiring board 13 can be mounted even when there is a light receiving portion R whose position error on the substrate is out of the allowable range among the plurality of light receiving portions R.

[Other]
It should be noted that the embodiments disclosed this time are examples in all respects and are not restrictive.
In the above embodiment, the case where the control device 43 controls the set base 41 and the suction unit 42 to execute the mounting operation has been illustrated, but the operator who operates the wiring board mounting device 40 gives a command to the control device 43. The operator can also perform the mounting operation.

Further, in the above embodiment, the case where the set table 41 and the suction unit 42 suck and hold a plurality of flexible substrates 131 by the suction force of a suction pump or the like is illustrated, but the plurality of flexible boards 131 are physically gripped and the like. , A plurality of flexible substrates 131 may be held by other methods.

The scope of the present invention is indicated by the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

1 Array 1M Condensing type solar power generation module 1U Condensing type solar power generation unit 2 Support device 11 Housing 11b Bottom surface 12 Condensing part 12a Glass plate 12f Frenel lens 13 Flexible printed wiring board 13A, 13A1, 13A2 Prototype 14 Shielding Plate 14a Opening 21 Strut 22 Foundation 23 2-axis drive unit 24 Horizontal axis 30 Secondary lens 31 Support part 31a End face 31e Upper end inner peripheral edge 32 Package 32a Top end 33 Cell 34 Lead frame 35 Gold wire 36 Lead frame 37 Sealing part 38 Package part 39 Bypass diode 40 Wire board mounting device 41 Set stand 41b End face 42 Suction unit 43 Control device 45 Recess 45a Bottom surface 45b Suction port 50 Suction block 50a Bottom surface 51 Main body part 53 Suction port 55 Linear actuator 56 Linear actuator 60 Block body 60a Bottom surface 60b Top surface 65 Pressing part 65a Bottom surface 65b Hole part 65c End surface 66 Actuator 70 Adhesive layer 75 Camera 100 Solar power generation device 131 Flexible substrate 131b Connection band 131c Folded part 131n Narrow part 131p Printed circuit part 131s Top surface 131t Bottom surface 131w Wide part 131x Margin 501 Suction block 501a Bottom surface 502 Suction block 1311 Copper pattern 1312 Insulation base 1313 Copper pattern 1314 Adhesive layer 1315 Coverlay Ax Optical axis L1, L2, L3, L4, L5 Injured wire R Light receiving part

Claims (9)

1. Electricity relating to a housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, a plurality of cells mounted on the upper surfaces of the plurality of flexible substrates, and the plurality of cells. It is a manufacturing method of a condensing type photovoltaic power generation module including a printed circuit part including a circuit.
   The first step of holding the flexible printed wiring board from the lower surface side of the plurality of flexible substrates, and
   A second step of holding the flexible printed wiring board from the upper surface side so that the relative positions of the plurality of flexible substrates are the unfolded positions when the flexible substrates are deployed on the bottom surface.
   Including a third step of mounting the flexible printed wiring board held from the upper surface side to the bottom surface.
   In the second step, in the first step, one of the plurality of flexible substrates held from the lower surface side is held from the upper surface side, and after the holding step, the one The flexible printed wiring board is held from the upper surface side by repeating the release step of releasing the holding of the flexible substrate from the lower surface side according to the arrangement order of the plurality of flexible boards for each of the plurality of flexible boards. A method for manufacturing a condensing solar power generation module.
2. In the first step, the flexible printed wiring board is held from the lower surface side by adsorbing the plurality of flexible substrates on a lower adsorption surface capable of adsorbing the plurality of flexible substrates.
   The light collection according to claim 1, wherein in the second step, the flexible printed wiring board is held from the upper surface side by adsorbing the plurality of flexible substrates on an upper suction surface capable of adsorbing the plurality of flexible substrates. Manufacturing method of type photovoltaic power generation module.
3. In the first step, the plurality of flexible substrates are connected to each other by a plurality of connecting bands extending in the intersecting direction in a state where the plurality of flexible substrates are arranged close to each other in the intersecting direction in the longitudinal direction of the strip. Steps to hold the original form of the flexible printed wiring board,
   The condensing solar according to claim 1 or 2, further comprising a step of making the original form into the flexible printed wiring board by cutting the plurality of connecting bands to separate the plurality of flexible substrates. Manufacturing method of photovoltaic module.
4. The condensing photovoltaic module is further provided with a condensing unit that is arranged to face the bottom surface of the housing and has a plurality of lens elements that condense sunlight corresponding to the plurality of cells.
   The second step is any of claims 1 to 3, further comprising an adjustment step of adjusting the relative positions of the plurality of flexible substrates based on the relative positions of the plurality of lens elements in the condensing unit. The method for manufacturing a concentrating photovoltaic module according to claim 1.
5. The concentrating photovoltaic module further comprises a plurality of packages for holding the plurality of cells on the upper surfaces of the plurality of flexible substrates.
   An adhesive layer for adhering the flexible printed wiring board to the bottom surface is provided on at least one of the bottom surface and the flexible printed wiring board.
   In the third step, the plurality of packages are selectively pressed toward the bottom surface with the adhesive layer interposed between the flexible printed wiring board and the bottom surface, and the flexible printed wiring board is pressed. The method for manufacturing a concentrating photovoltaic module according to any one of claims 1 to 4, which is mounted on the bottom surface.
6. After the first step, a substrate position acquisition step for acquiring the substrate positions of the plurality of cells in the plurality of flexible substrates before deployment, and a substrate position acquisition step.
   After the position acquisition step on the substrate, a pre-deployment determination step for determining whether or not to execute the second and subsequent steps based on the comparison result between the position on the substrate and the position on the predetermined reference substrate. The method for manufacturing a concentrating photovoltaic power generation module according to any one of claims 1 to 5, further comprising.
7. After the third step, an assembly step of assembling the concentrating photovoltaic power generation module using the housing to which the flexible printed wiring board is mounted, and
   A deployment position acquisition step for acquiring the deployment positions of the plurality of cells after the plurality of flexible substrates are mounted on the bottom surface after the third step and before the assembly step.
   Claim 1 further includes, after the deployment position acquisition step, a post-deployment determination step that determines whether or not to execute the assembly step based on a comparison result between the deployment position and a predetermined reference deployment position. The method for manufacturing a concentrating photovoltaic power generation module according to any one of claims 6.
8. A housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, a plurality of cells mounted on the upper surfaces of the plurality of flexible substrates, and electricity relating to the plurality of cells. It is a manufacturing method of a condensing type photovoltaic power generation device including a printed circuit part including a circuit.
   The first step of holding the flexible printed wiring board from the lower surface side of the plurality of flexible substrates, and
   A second step of holding the flexible printed wiring board from the upper surface side so that the relative positions of the plurality of flexible substrates are the unfolded positions when the flexible substrates are deployed on the bottom surface.
   Including a third step of mounting the flexible printed wiring board held from the upper surface side to the bottom surface.
   In the second step, in the first step, one of the plurality of flexible substrates held from the lower surface side is held from the upper surface side, and after the holding step, the one The flexible printed wiring board is held from the upper surface side by repeating the release step of releasing the holding of the flexible substrate from the lower surface side according to the arrangement order of the plurality of flexible boards for each of the plurality of flexible boards. A method for manufacturing a concentrating solar power generation device.
9. Electricity relating to a housing, a flexible printed wiring board having a plurality of strip-shaped flexible substrates provided on the bottom surface of the housing, a plurality of cells mounted on the upper surfaces of the plurality of flexible substrates, and the plurality of cells. It is a manufacturing device of a condensing type photovoltaic power generation module provided with a printed circuit part including a circuit.
   A first holding mechanism for holding the flexible printed wiring board from the lower surface side of the plurality of flexible substrates, and
   The flexible printed wiring board is held from the upper surface side and the held flexible printed wiring board is mounted on the bottom surface so that the relative positions of the plurality of flexible substrates are the deployed positions when the flexible substrates are deployed on the bottom surface. The second holding mechanism and
   A control unit that controls the first holding mechanism and the second holding mechanism is provided.
   The control unit
   After the holding operation in which the second holding mechanism holds the flexible substrate of one of the plurality of flexible substrates held by the first holding mechanism and the holding operation, the first holding mechanism is the one flexible substrate. The first holding mechanism and the second holding mechanism are controlled so as to repeat the release operation for releasing the holding with respect to the plurality of flexible substrates according to the arrangement order of the plurality of flexible substrates, and the second holding mechanism is used. A device for manufacturing a condensing type solar power generation module that holds the flexible printed wiring board from the upper surface side.

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