WO2021000726A1

WO2021000726A1 - Housing assembly and method for preparing same, antenna assembly, and electronic device

Info

Publication number: WO2021000726A1
Application number: PCT/CN2020/096370
Authority: WO
Inventors: 贾玉虎
Original assignee: Oppo广东移动通信有限公司
Priority date: 2019-06-30
Filing date: 2020-06-16
Publication date: 2021-01-07
Also published as: CN115084850A; CN112235438A

Abstract

Provided in the present application is a method for preparing a housing assembly. The method comprises: acquiring a first target parameter; preparing a first housing substrate according to the first target parameter; acquiring the first transmittance of the first housing substrate for a radio frequency signal of a preset frequency band; when the first transmittance is lower than preset transmittance, acquiring a second target parameter according to the first target parameter and the preset transmittance, wherein the first target parameter is a dielectric constant, and the second target parameter is a thickness, or the first target parameter is the thickness, and the second target parameter is the dielectric constant; according to the second target parameter, processing and shaping the first housing substrate to a second housing substrate, and enabling the transmittance of the second housing substrate for the radio frequency signal to be higher than the preset transmittance; and forming the second housing substrate into a housing assembly. Further provided in the present application are a housing assembly, an antenna assembly, and an electronic device. According to the disclosure of the present application, antenna signal transmission quality and data transmission rate can be improved.

Description

Shell assembly and preparation method thereof, antenna assembly and electronic equipment

Technical field

This application relates to the field of electronic technology, and in particular to a manufacturing method of a housing assembly, an antenna assembly, an electronic device and a housing assembly.

Background technique

With the development of mobile communication technology, people have higher and higher requirements for data transmission rate and antenna signal bandwidth. How to improve the antenna signal transmission quality and data transmission rate of electronic equipment has become a problem that needs to be solved.

Summary of the invention

The embodiments of the present application provide a method for manufacturing a housing assembly, an antenna assembly, an electronic device, and a housing assembly that improve antenna signal transmission quality and data transmission rate.

In the first aspect, a method for manufacturing a housing assembly provided by an embodiment of the present application includes:

Obtain the first target parameter;

Preparing a first shell substrate according to the first target parameter;

Acquiring a first transmittance of the first housing base material to a radio frequency signal of a preset frequency band;

When the first transmittance is less than the preset transmittance, a second target parameter is obtained according to the first target parameter and the preset transmittance; the first target parameter is the dielectric constant and the The second target parameter is thickness; or, the first target parameter is thickness and the second target parameter is dielectric constant;

Process the first shell substrate into a second shell substrate according to the second target parameter, so that the transmittance of the second shell substrate to the radio frequency signal is greater than the preset transmittance rate;

The second shell substrate is formed into a shell assembly.

In the second aspect, an embodiment of the present application provides a housing assembly, which is manufactured by the manufacturing method of the housing assembly.

In a third aspect, a housing assembly provided by an embodiment of the present application includes:

A housing base material, the housing base material has a first transmittance for radio frequency signals of a predetermined frequency band, and the first transmittance is less than the predetermined transmittance; and

A modified substrate, the dielectric constant of the modified substrate is less than or greater than the dielectric constant of the shell substrate, the modified substrate is provided on the shell substrate, and the shell substrate The area on which the modified substrate is provided has a second transmittance to the radio frequency signal of the predetermined frequency band, and the second transmittance is greater than the predetermined transmittance.

In a fourth aspect, an antenna assembly provided by an embodiment of the present application includes an antenna module and a housing assembly as described above. The antenna module is used to radiate radio frequency signals, and the modified substrate design of the housing assembly Within the radiation range of the radio frequency signal.

In a fifth aspect, an electronic device provided by an embodiment of the present application includes the antenna assembly described above.

An embodiment of the present application provides a method for preparing a housing assembly, by acquiring a first target parameter; preparing a first housing substrate according to the first target parameter; acquiring a preset frequency band of the first housing substrate The first transmittance of the radio frequency signal; when the first transmittance is less than the preset transmittance, a second target parameter is obtained according to the first target parameter and the preset transmittance; The first target parameter is the thickness and the second target parameter is the dielectric constant; according to the second target parameter, the first shell substrate is processed into a second shell substrate to adjust the shell to be formed The dielectric constant or thickness of the component so that the transmittance of the second housing substrate to the radio frequency signal is greater than the predetermined transmittance, so as to improve the signal radiation efficiency of the antenna module and the antenna module The signal gain, thereby improving the communication transmission rate and communication quality in electronic equipment.

The embodiment of the present application provides a housing assembly, by arranging a modified substrate on the housing substrate, so that the dielectric constant of the area where the modified substrate is provided on the housing assembly and the radiation port of the antenna module The spatial characteristic impedance matching of the housing component makes the transmittance of the radio frequency signal of the preset frequency band greater than the preset transmittance, so as to improve the signal radiation efficiency of the antenna module and the signal gain of the antenna module, thereby improving the electronics The communication transmission rate and communication quality in the device.

Description of the drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative work, other drawings can be obtained from these drawings.

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

2 is a schematic cross-sectional view of an electronic device provided in FIG. 1;

3 is a schematic cross-sectional view of a first antenna assembly provided by an embodiment of the present application;

4 is a schematic cross-sectional view of a second type of antenna assembly provided by an embodiment of the present application;

5 is a schematic cross-sectional view of a third antenna assembly provided by an embodiment of the present application;

6 is a schematic cross-sectional view of a fourth antenna assembly provided by an embodiment of the present application;

7 is a schematic cross-sectional view of a fifth antenna assembly provided by an embodiment of the present application;

FIG. 8 is a top view of the first antenna assembly provided by an embodiment of the present application;

Figure 9 is a cross-sectional view of Figure 8 along line A-A;

FIG. 10 is a top view of a second antenna assembly provided by an embodiment of the present application;

Figure 11 is a cross-sectional view of Figure 10 along the line B-B;

Fig. 12 is a top view of a third antenna assembly provided by an embodiment of the present application;

Figure 13 is a cross-sectional view of Figure 12 along line C-C;

FIG. 14 is a schematic flowchart of a method for manufacturing a housing assembly according to Embodiment 1 of the present application;

FIG. 15 is a schematic flowchart of a method for manufacturing a housing assembly according to Embodiment 2 of the present application;

FIG. 16 is a schematic cross-sectional view of a sixth antenna assembly provided by an embodiment of the present application.

Detailed ways

The technical solutions of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

Please refer to FIG. 1, which is a schematic diagram of the electronic device from a first perspective. The electronic device 100 may be a product with an antenna, such as a tablet computer, a mobile phone, a notebook computer, a vehicle-mounted device, and a wearable device. This application takes the electronic device 100 as a mobile phone as an example. For ease of description, the definition is made with reference to the first viewing angle of the electronic device 100. The width direction of the electronic device 100 is defined as the X-axis direction, and the length direction of the electronic device 100 is defined as the Y-axis. The direction, the thickness direction of the electronic device 100 is defined as the Z-axis direction.

Please refer to FIG. 2, the electronic device 100 provided in the embodiment of the present application includes an antenna assembly 10. Please refer to FIG. 3, the antenna assembly 10 includes a housing assembly 1 and an antenna module 2. The antenna module 2 is used to radiate or receive electromagnetic wave signals. For simplicity of description in this application, the electromagnetic wave signal radiated by the antenna module 2 into the air or the electromagnetic wave signal received from the air are both called radio frequency signals. In other words, the antenna module 2 is used to radiate or receive radio frequency signals.

The frequency bands of the radio frequency signal radiated by the antenna module 2 include millimeter wave frequency band, sub-millimeter wave frequency band, terahertz wave frequency band, and the like. Furthermore, taking the electronic device 100 as a mobile phone as an example for description, the frequency band of the radio frequency signal radiated by the antenna module 2 may be a millimeter wave frequency band. Millimeter waves are electromagnetic waves with a wavelength of 1 to 10 millimeters, and the frequency range of millimeter waves is 24.25 GHz to 52.6 GHz. The design of this embodiment can enable the mobile phone to communicate in the millimeter wave frequency band, and improve the data transmission rate and transmission quality of the mobile phone. In this embodiment, the housing assembly 1 includes a battery cover 11 and a middle frame 12. In other embodiments, the housing assembly 1 may also include a display screen. The antenna module 2 includes but is not limited to a phased array antenna.

When the antenna module 2 is installed in the electronic device 100, the radio frequency signal radiated by the antenna module 2 needs to be radiated to the outside space through the housing assembly 1. However, with regard to the housing assembly 1 currently used in the electronic device 100, when the dielectric constant of the housing assembly 1 does not match the transmission impedance of the radio frequency signal of the preset frequency band, the housing assembly 1 may be The reflection coefficient of the radio frequency signal is relatively large and the transmission coefficient is relatively small. In addition, the transmission rate of the housing assembly 1 to the radio frequency signal emitted by the antenna module 2 is low, which affects the communication quality of the antenna module 2.

Please refer to FIG. 3. FIG. 3 is a housing assembly 1 provided by an embodiment of the present application. The housing assembly 1 includes a housing base material 13 and a modified base material 14. The housing substrate 13 has a first transmittance to radio frequency signals of a predetermined frequency band. The first transmittance is less than the preset transmittance. The dielectric constant of the modified substrate 14 is smaller than or greater than the dielectric constant of the shell substrate 13. The modified substrate 14 is provided on the shell substrate 13. The area on the shell substrate 13 where the modified substrate 14 is provided has a second transmittance to the radio frequency signal of the preset frequency band. The second transmittance is greater than the preset transmittance.

When the thickness of the shell assembly 1 is between 0.1 and 1 mm, according to the transmission matrix analysis method of the medium, the transmittance of the shell assembly 1 for the radio frequency signal of the preset frequency band is greater than the preset transmittance and needs to meet the dielectric constant. Number one, for example, about 25. At this time, the dielectric constant one matches the spatial characteristic impedance of the radiation port of the antenna module 2. When the material of the shell substrate 13 is glass, the dielectric constant of the shell substrate 13 is 6-8. At this time, the transmittance of the housing substrate 13 to the radio frequency signal of the predetermined frequency band is much lower than the predetermined transmittance. The dielectric constant of the modified substrate 14 is determined according to the dielectric constant of the housing substrate 13 and the preset transmittance, so that the area where the housing assembly 1 is provided with the modified substrate 14 is less sensitive to the radio frequency signal of the preset frequency band. The transmittance is greater than the preset transmittance.

It can be understood that the thickness of the housing assembly 1 is the thickness between the outer surface 132 and the inner surface 133 of the housing substrate 13.

In a possible embodiment, the dielectric constant of the modified substrate 14 should be greater than the dielectric constant 1. For example, the dielectric constant of the modified substrate 14 is about 35, so that the housing assembly 1 is provided with The area dielectric constant of the modified base material 14 is adjusted to 25, so that the area where the modified base material 14 is provided in the housing assembly 1 has a greater transmittance for radio frequency signals of a preset frequency band, for example, greater than the preset transmittance The preset transmittance may be 70%. It should be noted that all the dielectric constants mentioned in this application are relative dielectric constants.

In another possible embodiment, the dielectric constant of the modified substrate 14 should be less than the dielectric constant of the housing substrate 13, for example, the dielectric constant of the modified substrate 14 is about 0.1-2, so that The dielectric constant of the region where the housing assembly 1 is provided with the modified base material 14 is adjusted to 0.1 to 4. By adjusting the dielectric constant of the region where the housing assembly 1 is provided with the modified base material 14 to a smaller number, it can be seen , When the dielectric constant is small and the thickness is small, the transmittance to the radio frequency signal of the preset frequency band is relatively large. Therefore, the dielectric constant of the housing assembly 1 is reduced to a small value by setting the modified substrate 14 , So that the transmittance of the housing assembly 1 to the radio frequency signal is greater, for example, greater than the preset transmittance, which may be 70%.

By disposing the modified substrate 14 on the housing substrate 13, the dielectric constant of the area where the modified substrate 14 is provided on the housing assembly 1 is matched with the spatial characteristic impedance of the radiation port of the antenna module 2. The transmittance of the housing assembly 1 to the radio frequency signal of the preset frequency band is greater than the preset transmittance, so as to improve the signal radiation efficiency of the antenna module 2 and the signal gain of the antenna module 2, thereby improving the electronic device 100 Communication transmission rate and communication quality.

It is understandable that the antenna assembly 10 with the housing substrate 13 has higher signal radiation efficiency and higher signal gain; the electronic device 100 with the antenna assembly 10 can improve the communication transmission rate and communication quality.

Specifically, taking the electronic device 100 as a mobile phone as an example for description, the housing assembly 1 includes a battery cover 11, also called a back cover, which is arranged on the back of the electronic device 100 and is used to cover the battery of the electronic device 100. The battery cover 11 may be integrally interconnected with the middle frame 12 of the electronic device 100 or may exist independently of the middle frame 12. It can be understood that the middle frame 12 is a part surrounding the side of the electronic device 100. When the battery cover 11 and the middle frame 12 are integrally interconnected, the housing assembly 1 is a part formed by the battery cover 11 and the middle frame 12 being integrally interconnected.

Specifically, the preset transmittance may be 70%, that is, the transmittance of the housing substrate 13 to the radio frequency signal of the preset frequency band is less than 70%. Among them, the preset frequency band can refer to the aforementioned explanation, which will not be described here. For ease of description, this application takes the preset frequency band as the millimeter wave frequency band as an example for description. It can be understood that due to the limitation of the dielectric constant of the housing base material 13, the transmittance of the housing base material 13 to radio frequency signals of a predetermined frequency band is relatively low.

The modified substrate 14 is used to adjust the dielectric constant of the housing assembly 1 so that the transmittance of the radio frequency signal through the housing assembly 1 is greater than or equal to the preset transmittance, thereby improving the transmission efficiency of the radio frequency signal. Specifically, the dielectric constant of the modified substrate 14 is different from the dielectric constant of the shell substrate 13. After the modified substrate 14 and the shell substrate 13 are combined, the radio frequency signal is subjected to the modified The base material 14 and the housing base material 13 are injected. The dielectric constant of the area where the modified substrate 14 is provided on the housing assembly 1 matches the spatial characteristic impedance of the radiation port of the antenna module 2, so that the area where the modified substrate 14 is provided on the housing assembly 1 is aligned It is assumed that the transmittance of the radio frequency signal in the frequency band is greater than the preset transmittance, so that the antenna radiation quality of the electronic device 100 is better.

It can be understood that, referring to FIG. 3, the modified substrate 14 may be provided in the first area 141 of the housing assembly 1, and the first area 141 is located within the radiation range of the radio frequency signal. The first area 141 may be the entire surface or a partial surface of the housing assembly 1. Further, the antenna module 2 can be arranged opposite to the first area 141 at a predetermined interval, so that the signal radiated by the antenna module 2 can be emitted from the electronic device 100 through the first area 141 more effectively, thereby increasing the antenna gain. Further, the orthographic projection of the antenna module 2 on the housing assembly 1 may be located within the range where the first area 141 is located, so that the radio frequency signal radiated by the antenna module 2 can pass through as much as possible The first area 141 is emitted to improve the antenna radiation efficiency.

It can be understood that the material of the housing substrate 13 is a non-metallic material to avoid interference or shielding of the radio frequency signal radiated by the antenna module 2. Specifically, the material of the housing substrate 13 includes but is not limited to at least one of glass, plastic, sapphire, ceramics, and the like. The specific form of the housing assembly 1 includes but is not limited to the following examples: metal middle frame 12+ceramic battery cover 11 (the battery cover 11 is separated from the middle frame 12), metal middle frame 12+sapphire battery cover 11, metal middle frame Frame 12+3D plastic battery cover 11, full 3D ceramic battery cover 11 (battery cover 11 and middle frame 12 are integrated), full 3D glass, full 3D plastic battery cover 11.

Specifically, the present application does not specifically limit the material of the modified substrate 14. The material of the modified substrate 14 includes but is not limited to at least one of glass, plastic, sapphire, ceramics, and the like.

It is understandable that the modified substrate 14 can be combined with the housing assembly 1 in any manner, as long as the modified substrate 14 is set within the range of the radiation signal of the antenna module 2. Among them, the specific method for combining the modified substrate 14 with the housing assembly 1 in the present application includes but is not limited to the following embodiments. It can be understood that, in the following embodiments, the modified substrate 14 can adjust the dielectric constant of the housing assembly 1 in two ways. One is to adjust the dielectric constant of the housing assembly 1 to a predetermined thickness. The dielectric constant one that satisfies the preset transmittance, and the other is to adjust the housing assembly 1 to a small value, such as 0.1-4. Both of these two methods can make the area of the housing assembly 1 provided with the modified substrate 14 have a transmittance greater than the preset transmittance for the radio frequency signal of the preset frequency band, so as to improve the radiation efficiency of the antenna module 2 and the electronic device 100 Quality of communication.

In a first possible implementation manner, the modified substrate 14 is mixed with the shell substrate 13 in powder form; or, the modified substrate 14 and the shell substrate 13 are melted by heat. Blended.

In the first case, please refer to FIG. 4, the modified substrate 14 can be mixed in the molten shell substrate 13 in the form of tiny powder, granules, flakes, or rods, so that the shell After the body assembly 1 is formed, the modified substrate 14 exists in the form of tiny powder, granules, flakes, or rods. It can be understood that the modified substrate 14 may be evenly distributed in the first region 141 of the housing substrate 13 to make the dielectric constant of the first region 141 uniform. Of course, in other embodiments, the modified substrate 14 may also be unevenly distributed in the first area 141, so that the dielectric constant of the first area 141 is gradually distributed, so as to flexibly control the radio frequency signal passing through the housing assembly. 1 the transmittance of the first region 141.

By doping the modified substrate 14 in the first region 141 of the housing substrate 13, the first region 141 has a higher transmittance to radio frequency signals. Since the modified substrate 14 is in the form of tiny particles, it can The modified substrate 14 is provided at any position of the first region 141, that is, the modified substrate 14 can improve the dielectric constant of any position of the first region 141, and improve the transmission efficiency of the first region 141 for radio frequency signals .

In the second case, referring to FIG. 5, the modified substrate 14 and the shell substrate 13 are mixed by hot melt. It is understandable that the modified substrate 14 in the molten state and the shell substrate 13 in the molten state are prepared, and the modified substrate 14 in the molten state and the shell substrate 13 in the molten state are mixed and cooled to form the shell assembly 1. At this time, the dielectric constant of the area where the housing assembly 1 is provided with the modified base material 14 reaches the preset dielectric constant, so that the area where the housing assembly 1 is provided with the modified base material 14 has higher transmission of radio frequency signals. Rate, for example, the transmittance is greater than 70%.

By doping the modified substrate 14 in the first region 141 of the housing substrate 13, the first region 141 has a higher transmittance for radio frequency signals. After hot melting and mixing, the shell assembly 1 formed by the modified substrate 14 and the shell substrate 13 by hot melting will not have granular and uniform material, especially when the shell substrate 13 is made of glass. The first area 141 of the rear housing assembly 1 has a better appearance.

In a second possible implementation manner, referring to FIG. 6, the housing base material 13 has at least one through hole 131. The modified substrate 14 is filled in the at least one through hole 131.

At least one through hole 131 is provided in the first region 141 of the housing substrate 13, and the modified substrate 14 may be filled in each through hole 131 in a powder or columnar manner, so that the modified substrate 14 is embedded on the housing base material 13 to modify the dielectric constant of the first area 141 on the housing base material 13 to make the dielectric constant of the first area 141 smaller, for example 0.1 to 4, or to match the dielectric constant of the first region 141 with the spatial characteristic impedance of the radiation port, so that the region where the modified substrate 14 of the housing assembly 1 is provided has a higher transmittance to radio frequency signals, For example, the transmittance is greater than 70%.

In a third possible implementation manner, referring to FIG. 7, the housing substrate 13 has a first surface 132 and a second surface 133 disposed opposite to each other. The modified substrate 14 is attached to the first surface 132; or, the modified substrate 14 is attached to the second surface 133; or, the modified substrate 14 is attached to the first surface 133. Between one side 132 and the second side 133.

Wherein, referring to FIG. 7, the first surface 132 may be the outer surface of the housing substrate 13, and the second surface 133 may be the inner surface of the housing substrate 13, wherein the inner surface of the housing substrate 13 faces the electronic device Electronic components within 100.

In the first case, the modified substrate 14 can be attached to the first surface 132, and the modified substrate 14 will not occupy the space in the electronic device 100, thereby reducing the thickness of the electronic device 100. It is understandable that the surface of the modified substrate 14 may be treated to make the surface of the modified substrate 14 consistent with the appearance of the first surface 132.

In the second case, referring to FIG. 7, the modified substrate 14 is attached to the second surface 133, so that the modified substrate 14 is installed in the electronic device 100, so that the modified substrate 14 is not easy to Abrasion or damage can also ensure the appearance consistency of the housing assembly 1.

In the third case, the modified substrate 14 may be sealed between the first surface 132 and the second surface 133. In other words, the modified base material 14 can be completely embedded in the housing base material 13 as a whole, so that the modified base material 14 and the housing base material 13 are integrated, and the modified base material 14 and the shell The bulk substrate 13 is superimposed in the Z-axis direction to reduce the thickness of the housing assembly 1. Of course, in other embodiments, the modified substrate 14 is partially embedded in the groove of the first surface 132 or the second surface 133 of the housing substrate 13 to reduce the thickness of the housing assembly 1.

Please refer to FIG. 8, the modified substrate 14 can be replaced by a resonant structure 15 to adjust the transmittance of the housing substrate 13 to radio frequency signals of a preset frequency band. Specifically, the size of each conductive patch 151 of the resonant structure 15 and the structure of the conductive patch 151 are adjusted according to the preset transmittance to satisfy that the transmittance of the portion of the housing assembly 1 where the resonant structure 15 is provided is greater than The preset transmittance is equivalent to adjusting the "equivalent dielectric constant" of the resonant structure 15 provided on the housing assembly 1 to dielectric constant one. Wherein, the position of the resonant structure 15 can refer to the position of the modified substrate 14, which will not be repeated here.

Please refer to FIG. 8, the resonant structure 15 includes at least one layer of conductive patches. The conductive patches 151 in each layer are periodically arranged in a grid structure or in an array of conductive patches 151.

Please refer to Figures 8 and 9, when the at least one layer of conductive patch 151 is a single layer, the resonant structure 15 is a periodically arranged grid structure, and specifically consists of a conductive layer and a The vias are formed on the layer and periodically arranged. The via includes, but is not limited to, cross-shaped, rectangular, rectangular ring, cross-shaped ring, circular ring, triangle, circle, polygon, etc. The via is equivalent to the capacitance of the resonant structure 15, and the conductive part between two adjacent vias is equivalent to the inductance of the resonant structure 15. The resonant structure 15 presents a full transmission characteristic to the incident radio frequency signal at the resonance frequency point, and presents a different degree of reflection characteristic to the incident radio frequency signal at other frequency points. When the frequency band of the radio frequency signal is a resonant frequency band, the radio frequency signal incident on the resonant structure 15 generates secondary radiation on the resonant structure 15 so that the resonant structure 15 has higher transmission performance for the radio frequency signal.

In addition, the via holes on the resonant structure 15 may also be arranged non-periodically. The shapes of the via holes on the resonant structure 15 may be the same or different.

Referring to FIGS. 10 and 11, when the at least one layer of conductive patches 151 is multilayered and spaced apart, the resonant structure 15 includes spaced apart multilayer conductive layers, and each conductive layer includes an array arrangement The shape of the conductive patch 151 between different conductive layers is the same or different.

Specifically, the resonant structure 15 is formed by a plurality of conductive layers arranged at intervals, and each conductive layer may be a patch-type structural unit or a hole-type structural unit. Specifically, the patch-type structural unit includes a plurality of conductive patches 151 arranged in an array and insulated from each other. The shape of the conductive patches 151 includes, but is not limited to, a cross, a rectangle, a rectangular ring, a cross-shaped ring, and a circular ring. , Triangle, circle, polygon, etc. The conductive patch 151 is equivalent to the inductance of the resonant structure 15, and the gap between two adjacent conductive patches 151 is equivalent to the capacitance of the resonant structure 15, which exhibits total reflection characteristics for incident radio frequency signals at the resonant frequency, and At other frequency points, the incident radio frequency signal exhibits different degrees of transmission characteristics. The grid structure unit includes a conductive layer and via holes arranged on the conductive layer and periodically arranged. The via includes, but is not limited to, cross-shaped, rectangular, rectangular ring, cross-shaped ring, circular ring, triangle, circle, polygon, etc.

Specifically, the conductive patches 151 of the conductive layer of each layer may be the same or different, and the types of the conductive layers of adjacent layers may be the same or different. For example, when the conductive layer is two layers, the two conductive layers can adopt patch type structural unit + hole type structure unit; adopt patch type structure unit + patch type structure unit; adopt hole type structure unit + hole type Structural unit; adopts hole type structural unit + patch type structural unit.

The resonant structure 15 is provided on the shell substrate 13 to reduce the reflection of the shell assembly 1 to radio frequency signals and improve the transmission ability of the shell assembly 1. When the antenna assembly 10 is applied to a mobile phone, the battery cover 11 can improve the radio frequency The transmittance of the signal.

It can be understood that the conductive patch 151 is made of metal. Of course, in other embodiments, the conductive patch 151 may also be made of a non-metal conductive material.

An antenna assembly 10 provided by an embodiment of the present application includes an antenna module 2 and the housing assembly 1 described in any one of the foregoing implementation manners.

Please refer to FIG. 12 and FIG. 13, the antenna module 2 includes a plurality of linearly arranged radiation units 21, radio frequency chips 22 and insulating substrates 23. The multiple radiation units 21 are arranged on the insulating substrate 23 and located on the side facing the housing assembly 1. The radio frequency chip 22 is used to generate an excitation signal (also called a radio frequency signal). The radio frequency chip 22 may be arranged on the main board of the electronic device 100, and the radio frequency chip 22 is located on a side of the insulating substrate 23 away from the radiation unit 21. The radio frequency chip 22 is electrically connected to a plurality of radiation units 21 through a transmission line embedded in the insulating substrate 23.

Further, referring to FIGS. 12 and 13, each radiating unit 21 includes at least one feeding point 24, and each feeding point 24 is electrically connected to the radio frequency chip 22 through the transmission line, and each of the The distance between the feeding point 24 and the center of the radiating unit 21 corresponding to the feeding point 24 is greater than a preset distance. Adjusting the position of the feeding point 24 can change the input impedance of the radiating unit 21. In this embodiment, the distance between each feeding point 24 and the center of the corresponding radiating unit 21 is set to be greater than a preset distance. Adjust the input impedance of the radiation unit 21. Adjust the input impedance of the radiation unit 21 so that the input impedance of the radiation unit 21 matches the output impedance of the radio frequency chip 22. When the radiation unit 21 matches the output impedance of the radio frequency chip 22, the excitation signal generated by the radio frequency signal The amount of reflection is minimal.

Understandably, the antenna module 2 may be at least one or a combination of a patch antenna, a laminated antenna, a dipole antenna, a magnetoelectric dipole antenna, and a quasi-Yagi antenna.

An electronic device 100 provided by an embodiment of the present application includes the antenna assembly 10 described in any one of the foregoing implementation manners.

In the electronic device 100 provided in the present application, the modified substrate 14 is provided on the housing substrate 13, so that the dielectric constant of the area where the modified substrate 14 is provided on the housing assembly 1 is consistent with the radiation of the antenna module 2 The spatial characteristic impedance of the port is matched, so that the transmittance of the housing assembly 1 to the radio frequency signal of the preset frequency band is greater than the preset transmittance, so as to improve the signal radiation efficiency of the antenna module 2 and the signal gain of the antenna module 2 , Thereby improving the communication transmission rate and communication quality in the electronic device 100.

Please refer to FIG. 14, which is a manufacturing method 300 of the housing assembly 1 according to the first embodiment of the present application. The housing assembly 1 that can be prepared by the preparation method 300 includes but is not limited to the above housing assembly 1. The preparation method 300 includes the following operations.

Operation 101: Acquire a first target parameter.

Specifically, the first target parameter may be the thickness or dielectric constant of the shell substrate 13 to be formed. In other words, first obtain the thickness or raw material of the shell substrate 13 to be molded, and the raw material corresponds to the dielectric constant.

Operation 102: Prepare a first shell substrate 13 according to the first target parameter.

In one embodiment, the first target parameter is thickness, for example 1 mm. Of course, the thickness of the first target parameter may be 0.1-1 mm. The raw material of the first shell substrate 13 is selected as glass, and the glass material is used to prepare the first shell substrate 13 with a thickness of 1 mm. Of course, the raw material of the first shell substrate 13 may also be other non-metallic materials, such as plastics, ceramics, and the like. When the material of the first shell substrate 13 is glass, the dielectric constant of the first shell substrate 13 is 6-8.

Operation 103: Obtain a first transmittance of the first housing substrate 13 to a radio frequency signal of a preset frequency band.

Specifically, the radio frequency signal of the preset frequency band is a radio frequency signal greater than 20 GHz. In this embodiment, the housing assembly 1 is applied to an electronic device 100, and a radio frequency signal of a preset frequency band is a radio frequency signal of a millimeter wave frequency band. Specifically, the main application frequency bands of the millimeter wave frequency band may be 26.5-29.5 GHz, 24.25-27.5 GHz, 27.5-28.35 GHz and 37-40 GHz.

In an implementation manner, a vector signal transmitter equipped with a power amplifier may be used as a transmission source to transmit a radio frequency signal of a preset frequency band, and the radio frequency signal is received through a spectrum analyzer. The transmitting and receiving antennas adopt the same model of radiating port antennas, all of which are vertical polarization, horizontal polarization or dual polarization. The first housing base material 13 is arranged between the transmitter and the receiver, wherein the first housing base material 13 is close to the transmitter and is separated from the transmitter by a preset distance, and the preset The spacing can be 0.1-2mm. The frequency spectrum distribution of the radio frequency signal penetrating the first housing substrate 13 is detected by a spectrum analyzer, and the transmittance of the radio frequency signal penetrating the first housing substrate 13 is obtained to obtain the first transmittance.

In another embodiment, the model is modeled by the dielectric transmission matrix analysis method, and the housing substrate 13 with the radio frequency signal frequency band of 24-40 GHz, the thickness of 1 mm, and the dielectric constant of 6-8 is modeled and simulated The housing substrate 13 with a thickness of 1 mm and a dielectric constant of 6-8 has a transmittance of 24-40 GHz for the radio frequency signal frequency band to obtain the first transmittance.

Through the above methods, the first transmittance of the first housing substrate 13 to the radio frequency signal of the preset frequency band can be obtained. In other embodiments, other methods may be used to obtain the first transmittance of the first housing substrate 13 to the radio frequency signal of the preset frequency band.

Operation 104: When the first transmittance is less than the preset transmittance, obtain a second target parameter according to the first target parameter and the preset transmittance. The first target parameter is the dielectric constant and the second target parameter is the thickness. Alternatively, the first target parameter is thickness and the second target parameter is dielectric constant.

Comparing the first transmittance with the preset transmittance, the preset transmittance may be 70%. 70% is a value at which the radio frequency signal penetration rate is relatively high when the housing assembly 1 is applied to an electronic device 100 such as a mobile phone. Of course, in other embodiments, the preset transmittance rate may also be 60% or 65%. , 75%, 80%, 85%, etc. The preset transmittance can be determined according to the actual application of the housing assembly 1. In this embodiment, the housing assembly 1 is applied to a mobile phone, and the preset transmittance is 70%.

The first transmittance is less than the preset transmittance, that is, the first transmittance is less than 70%, for example, the first transmittance is 20%, 30%, 40%, etc., at this time, the housing assembly 1 Applied in an electronic device 100, the housing assembly 1 has a large reflection of the radio frequency signal of the antenna module 2 and a small transmission, so that the signal radiation efficiency of the antenna module 2 is low.

In one embodiment, obtaining the second target parameter according to the first target parameter and the preset transmittance includes, but is not limited to: using a dielectric transmission matrix analysis method to calculate when the thickness of the housing assembly 1 is the first target Parameter, such as 1mm, and meets the requirements of the housing assembly 1 when the transmittance of the radio frequency signal of the preset frequency band (such as 24-40 GHz) is greater than or equal to the preset transmittance (such as 70%), the theoretical introduction of the housing assembly 1 The dielectric constant, the theoretical dielectric constant is the second target parameter.

In another embodiment, the second target parameter may be a relatively small dielectric constant, such as 0.1-4. Since the thickness of the shell assembly 1 is small, the dielectric constant of the shell assembly 1 is set to be small, so that the reflectance of the shell assembly 1 for the radio frequency signal of the preset frequency band is small, and the transmittance is large.

Of course, in other embodiments, the first target parameter is the dielectric constant and the second target parameter is the thickness.

It is understandable that when the first transmittance is greater than the preset transmittance, the first shell substrate 13 can be directly used to form the shell assembly 1.

Operation 105: Process the first housing base material 13 into a second housing base material 13 according to the second target parameter, so that the transmittance of the second housing base material 13 to the radio frequency signal is greater than The preset transmittance.

In one embodiment, according to the acquired second target parameter, which is also the theoretical dielectric constant of the housing assembly 1, such as ~39, the first housing base material 13 is processed into the second housing base material 13 so that the The dielectric constant of the entire area or partial area of the two-shell substrate 13 is 14-39. When the dielectric constant of the second housing substrate 13 is 14 to 39, obviously, the transmittance of the second housing substrate 13 to the radio frequency signal of the preset frequency band (for example, 24-40 GHz) is greater than or equal to the preset Transmittance (e.g. 70%). At this time, the housing assembly 1 is applied to the electronic device 100 to increase the transmittance of the housing assembly 1 to the antenna module 2 to improve the radiation efficiency of the antenna assembly 10 and the communication quality of the electronic device 100.

Operation 106, forming the second shell substrate 13 into the shell assembly 1.

The second shell substrate 13 is subjected to further process steps such as grinding, applying color paint, and forming a logo to form the shell assembly 1. It is understandable that the specific form of the housing assembly 1 includes but is not limited to the following examples: metal middle frame 12 + ceramic battery cover 11 (the battery cover 11 is separated from the middle frame 12), metal middle frame 12 + sapphire battery cover 11. Metal middle frame 12+3D plastic battery cover 11, full 3D ceramic battery cover 11 (battery cover 11 and middle frame 12 are integrated), full 3D glass, full 3D plastic battery cover 11.

The housing assembly 1 is applied to the electronic device 100 and forms a part of the housing of the electronic device 100.

The embodiment of the present application obtains the first target parameter; prepares the first housing substrate 13 according to the first target parameter; obtains the first transmittance of the first housing substrate 13 to the radio frequency signal of the preset frequency band; When the first transmittance is less than the preset transmittance, a second target parameter is obtained according to the first target parameter and the preset transmittance; the first target parameter is thickness and the first The second target parameter is the dielectric constant; according to the second target parameter, the first housing base material 13 is processed into a second housing base material 13 to adjust the dielectric constant of the housing assembly 1 to be molded to The transmittance of the second housing base material 13 to the radio frequency signal is greater than the predetermined transmittance; the second housing base material 13 is formed into the housing assembly 1. In order to match the dielectric constant of the housing assembly 1 with the spatial characteristic impedance of the radiation port of the antenna module 2, the transmittance of the housing assembly 1 to the radio frequency signal of the preset frequency band is greater than the preset transmittance to improve The signal radiation efficiency of the antenna module 2 and the signal gain of the antenna module 2 are improved, thereby improving the communication transmission rate and communication quality in the electronic device 100.

When the first target parameter may be the dielectric constant and the second target parameter is the thickness, corresponding to operations 101-106, the first target parameter is acquired, where the first target parameter is the dielectric constant. For example, the material of the first shell substrate 13 to be processed is glass, and the first target parameter is 6-8; the first shell substrate 13 with a thickness of 1 mm is prepared according to the first target parameter; and the first shell substrate 13 is obtained. The first transmittance of the housing substrate 13 to the radio frequency signal of the preset frequency band; when the first transmittance is less than the preset transmittance, the first target parameter and the preset The transmittance obtains a second target parameter. The second target parameter is the theoretical thickness of the housing assembly 1 that can reach the preset transmittance. The theoretical thickness may be greater than or less than 1 mm, which can be adjusted to the first housing substrate 13 The thickness of the local area of the second housing substrate 13 is the thickness of the second housing substrate 13. At this time, the thickness of the local area of the second housing substrate 13 is the theoretical thickness, so that the second housing substrate 13 is resistant to the radio frequency signal of the preset frequency band. The transmittance of is greater than the preset transmittance to improve the signal radiation efficiency of the antenna module 2 and the signal gain of the antenna module 2, thereby improving the communication transmission rate and communication quality in the electronic device 100.

Please refer to FIG. 15. FIG. 15 is a manufacturing method 400 of the housing assembly 1 according to the second embodiment of the present application. The housing assembly 1 that can be prepared by the preparation method 400 includes but is not limited to the above housing assembly 1. The preparation method 400 includes the following operations.

Operation 201: Acquire a first target parameter.

For the specific steps of this operation, please refer to operation 101, which will not be repeated here.

Operation 202: Prepare a first shell substrate 13 according to the first target parameter.

For the specific steps of this operation, please refer to operation 102, which will not be repeated here.

Operation 203: Obtain a first transmittance of the first housing substrate 13 to a radio frequency signal of a preset frequency band.

For the specific steps of this operation, please refer to operation 103, which will not be repeated here.

Operation 204: When the first transmittance is less than the preset transmittance, establish a preset mapping relationship between the first characteristic parameter, the second characteristic parameter and the transmittance.

Specifically, the establishing the preset mapping relationship between the first characteristic parameter, the second characteristic parameter and the transmittance includes, but is not limited to: establishing a first transmission matrix according to the radio frequency signal of the preset frequency band in the medium. The preset mapping relationship between the characteristic parameter, the second characteristic parameter and the transmittance.

Specifically, the transfer matrix method expands the grid point positions of the magnetic field in real space, and converts Maxwell's equations into a transfer matrix form, which becomes the eigenvalue solution. Specifically: using Maxwell's equations to solve the electric and magnetic fields on two adjacent layers, the transmission matrix can be obtained, and then the single-layer conclusion can be extended to the entire medium space, so that the transmission coefficient and reflection of the entire multilayer medium can be calculated coefficient. Establishing a preset mapping relationship between the first characteristic parameter, the second characteristic parameter and the transmittance is to establish a transmission matrix model.

Specifically, the transmission matrix Trans(m) of the m-th layer in the multi-layer dielectric layer for the radio frequency signal is:

Among them, δ _(m) is the phase thickness of the m-th layer of media; η _(m) is the equivalent wave impedance of the m-th layer of media. Among them, the expression of δ _(m) is:

Among them, D _k(m) is the dielectric constant of the m-th layer of medium; λ is the wavelength of the electromagnetic wave of the preset frequency band; d _(m) is the thickness of the m-th layer of medium; θ _(m) is the incident on the m-th layer The angle of incidence.

Among them, the refractive index relationship between adjacent dielectric layers:

Among them, θ _(m-1) is the incident angle of the (m-1)th layer of the medium; Dk _(m-1) is the dielectric constant of the (m-1)th layer of the medium.

For the radio frequency signal radiated by the vertically polarized antenna module 2, the equivalent wave impedance of the m-th layer is:

For the radio frequency signal radiated by the horizontally polarized antenna module 2, the equivalent wave impedance of the m-th layer is:

Therefore, for n dielectric layers, the total transmission matrix is the product of n transmission matrices:

The equivalent wave impedance Y of the n-layer dielectric layer is:

Among them, η ₀ =120π is the free space wave impedance.

The reflection coefficient r of the n-layer dielectric layer is:

The transmission coefficient t of the n-layer dielectric layer is:

The reflectivity R of the n-layer dielectric layer is:

R=r*conj(r) (10) The transmittance T of the n-layer dielectric layer is:

T=t*conj(t) (11) The reflectivity R and transmittance T of the n-layer dielectric layer satisfy the following relationship:

T+R = 1 (12)

Substituting relational expressions (1)-(5) into relational expression (6), the total transmission matrix is obtained. According to the total transmission matrix, the equivalent wave impedance Y and reflection coefficient r are obtained, the reflectance R is obtained according to the reflection coefficient r, and the transmission coefficient t is obtained according to the total transmission matrix, and then the transmittance T is obtained. When the sum of the rates T is 1, the R is the smallest and the T is the largest, and the predetermined mapping relationship between the dielectric constant, transmittance and thickness of the medium can be obtained for the radio frequency signal of the predetermined frequency band.

According to the preset mapping relationship, when the dielectric constant of the medium is determined, the range of the thickness of the medium can be obtained within the interval that the transmittance is greater than the preset transmittance; or, when the thickness of the medium is determined, The value range of the dielectric constant of the medium can be obtained in the interval satisfying the transmittance greater than the preset transmittance.

Operation 205: When the first target parameter is acquired in the first characteristic parameter, and the transmittance is greater than or equal to the preset transmittance, determine the second target parameter according to the preset mapping relationship. The value range of the characteristic parameter is determined as the first target range.

Specifically, the first target parameter is input into the transmission matrix model, and the value range of the second characteristic parameter can be obtained under the condition that the transmittance is greater than the preset transmittance. For example, if the first target parameter is 1mm, the transmission rate is set to be greater than 70%, and the value range for obtaining the second characteristic parameter is 14-39.

Operation 206: Acquire the second target parameter within the first target range.

Specifically, the acquiring the second target parameter within the first target range includes but is not limited to: acquiring the second characteristic parameter corresponding to the largest transmittance in the first target range, and determining Is the second target parameter.

According to the transmission matrix model, the first target parameter is input into the transmission matrix model, and the value range of the second characteristic parameter when the transmittance is maximum (for example, 100%) is obtained, and determined as the second target parameter.

Through the above method, the second target parameter at the maximum transmittance of the radio frequency signal of the preset frequency band can be obtained according to the first target parameter. The housing assembly 1 prepared according to the first target parameter and the second target parameter has the largest transmittance to the radio frequency signal of the preset frequency band, so as to maximize the antenna radiation efficiency of the antenna assembly 10 and improve the communication quality of the electronic device 100 .

Operation 207, processing the first housing base material 13 into a second housing base material 13 by the second target parameter.

This step will be explained from two aspects below. The first aspect is that the first target parameter is the thickness and the second target parameter is the dielectric constant. In this aspect, the dielectric constant of the back cover can be adjusted according to the thickness and transmittance of the back cover of the electronic device 100. At this time, the antenna module 2 Signals are radiated toward the back cover of the electronic device 100. The second aspect is that the first target parameter is the dielectric constant and the second target parameter is the thickness. This aspect can be based on the dielectric constant of the middle frame 12 of the electronic device 100, the dielectric constant of the injection molded substrate on the middle frame 12, and the thickness. The thickness of the frame 12 adjusts the thickness of the injection molded substrate on the middle frame 12. At this time, the antenna module 2 radiates signals toward the middle frame 12 of the electronic device 100.

In the first embodiment, the second target parameter processing the first housing base material 13 into the second housing base material 13 includes but is not limited to: when the second target parameter is the dielectric constant , Obtain the dielectric constant of the first shell substrate 13. The dielectric constant of the first housing substrate 13 is compared with the second target parameter. When the second target parameter is not equal to the dielectric constant of the first housing substrate 13, a third target parameter is obtained according to the second target parameter and the dielectric constant of the first housing substrate 13 , The type of the third target parameter is the dielectric constant. The modified substrate 14 is prepared according to the third target parameter. The modified substrate 14 is set on the first shell substrate 13 to form a second shell substrate 13. The dielectric constant of the second shell substrate 13 is the same as that of the first shell The dielectric constant of the base material 13 is different.

Specifically, when the second target parameter is the dielectric constant, the first housing substrate 13 is glass for example. Obtain the dielectric constant of the first shell substrate 13. The dielectric constant of the first housing substrate 13 is 6-8. The dielectric constant of the first housing substrate 13 is compared with the second target parameter. According to operation 104, it can be seen that in the two cases where the transmittance is greater than the preset transmittance, in the first case, the second target parameter is calculated according to the matrix transmission model. At this time, the second target parameter is about 14 to 39 ; In the second case, the second target parameter can also take a smaller value range, such as 0.1-4.

In the first case, when the second target parameter is greater than the dielectric constant of the first housing substrate 13, according to the second target parameter and the dielectric constant of the first housing substrate 13 The constant gets the third target parameter. The type of the third target parameter is dielectric constant. The modified substrate 14 is prepared according to the third target parameter. The dielectric constant of the modified substrate 14 is greater than the second target parameter. The modified substrate 14 is set on the first shell substrate 13 to form the second shell substrate 13 so that the dielectric constant of the second shell substrate 13 is the second target parameter .

For example, when the dielectric constant of the first shell substrate 13 is 6-8, and the second target parameter is about 14-39, the modified substrate 14 can be provided on the first shell substrate 13. The dielectric constant of the modified substrate 14 may be a high dielectric constant, for example, the dielectric constant is 45-60.

The first housing substrate 13 is modified by setting a modified substrate 14 with a high dielectric constant. It is understood that the modified substrate 14 can modify the entire area or a partial area of the first housing substrate 13 Sex. By arranging a modified substrate 14 with a high dielectric constant on the first housing substrate 13, the dielectric constant of the housing assembly 1 can satisfy the dielectric constant when the transmittance is greater than the preset transmittance, so that The dielectric constant of the housing component 1 is matched with the spatial characteristic impedance of the radiation port of the antenna module 2, so that the transmission of the housing component 1 to the radio frequency signal of the preset frequency band is greater than the preset transmittance, so as to improve the antenna mode. The signal radiation efficiency of the group 2 and the signal gain of the antenna module 2 are improved, thereby improving the communication transmission rate and communication quality in the electronic device 100.

In the second case, when the second target parameter is less than the dielectric constant of the first housing substrate 13, according to the second target parameter and the dielectric constant of the first housing substrate 13 The constant obtains the third target parameter, and the type of the third target parameter is the dielectric constant. The modified substrate 14 is prepared according to the third target parameter. The dielectric constant of the modified substrate 14 is less than the second target parameter. The modified substrate 14 is arranged on the first shell substrate 13 to form the second shell substrate 13, and the dielectric constant of the second shell substrate 13 is relatively small.

For example, when the dielectric constant of the first shell substrate 13 is 6-8, and the second target parameter is about 0.1-4, the modified substrate 14 can be provided on the first shell substrate 13. The dielectric constant of the modified substrate 14 may be a high dielectric constant, for example, 0.1-2.

It is understandable that the modified substrate 14 can modify the entire area or a partial area of the first shell substrate 13.

By disposing a modified substrate 14 with a low dielectric constant on the first housing substrate 13, the dielectric constant of the housing assembly 1 is made smaller, so that the dielectric constant of the housing assembly 1 meets the requirement that the transmittance is greater than The dielectric constant when the transmittance is preset, so that the transmittance of the housing assembly 1 to the radio frequency signal of the preset frequency band is greater than the preset transmittance, so as to improve the signal radiation efficiency of the antenna module 2 and the antenna module 2 signal gain, thereby improving the communication transmission rate and communication quality in the electronic device 100.

It is understandable that the present application does not specifically limit the material of the modified substrate 14, including but not limited to: plastics, ceramics, glass, organic materials, etc.

This application does not limit the specific form in which the modified substrate 14 is provided on the first shell substrate 13. The following embodiments describe the specific form in which the modified substrate 14 is provided on the first shell substrate 13. For example. Of course, the specific form in which the modified substrate 14 is provided on the first shell substrate 13 includes but is not limited to the following embodiments.

In the first case, please refer to FIG. 5 together. The operation of setting the modified substrate 14 on the first shell substrate 13 to form the second shell substrate 13 includes:

The modified substrate 14 and the first shell substrate 13 are mixed by hot melt to form a second shell substrate 13.

It is understandable that the modified substrate 14 in the molten state and the shell substrate 13 in the molten state are prepared, and the modified substrate 14 in the molten state and the shell substrate 13 in the molten state are mixed and cooled to form the shell assembly 1. At this time, the dielectric constant of the area where the housing assembly 1 is provided with the modified base material 14 reaches the preset dielectric constant, so that the area where the housing assembly 1 is provided with the modified base material 14 has higher transmission of radio frequency signals. Rate, for example, the transmittance is greater than 70%.

Alternatively, the modified substrate 14 may be mixed in the molten shell substrate 13 in the form of tiny powder, granules, flakes, or rods, so that the shell assembly 1 is formed after being molded. The modified substrate 14 exists in the form of fine powder, granules, flakes, or rods. It can be understood that the modified substrate 14 may be evenly distributed in the first region 141 of the housing substrate 13 to make the dielectric constant of the first region 141 uniform. Of course, in other embodiments, the modified substrate 14 may also be unevenly distributed in the first area 141, so that the dielectric constant of the first area 141 is gradually distributed, so as to flexibly control the radio frequency signal passing through the housing assembly. 1 the transmittance of the first region 141.

In the second case, please refer to FIG. 6 together. The setting of the modified substrate 14 on the first shell substrate 13 to form the second shell substrate 13 includes:

At least one through hole is formed on the first shell substrate 13;

The modified substrate 14 is filled in the at least one through hole to form the second shell substrate 13.

At least one through hole is provided in the first region 141 of the shell substrate 13, and the modified substrate 14 may be filled in each through hole in a powder or column shape, so that the modified substrate 14 is embedded The dielectric constant of the first region 141 on the housing substrate 13 is modified to make the dielectric constant of the first region 141 smaller, for example, 0.1~ 4. Or match the dielectric constant of the first area 141 with the spatial characteristic impedance of the radiation port, so that the area where the modified substrate 14 of the housing assembly 1 is provided has a higher transmittance to radio frequency signals, such as transparent The overrate is greater than 70%.

In the third case, please refer to FIG. 7 together. The preparation of the modified substrate 14 according to the third target parameter includes: preparing the modified substrate 14 in a sheet shape according to the third target parameter. . Then, molding the modified substrate 14 on the first shell substrate 13 includes: attaching the modified substrate 14 in a sheet shape to the first shell substrate 13.

Specifically, the shell substrate 13 has a first surface 132 and a second surface 133 opposite to each other. Wherein, the first surface 132 may be the outer surface of the housing substrate 13, and the second surface 133 may be the inner surface of the housing substrate 13, wherein the inner surface of the housing substrate 13 faces the electronic components in the electronic device 100 . The modified substrate 14 is attached to the first surface 132; or, the modified substrate 14 is attached to the second surface 133; or, the modified substrate 14 is attached to the first surface 133. Between one side 132 and the second side 133.

For example, the modified substrate 14 is a dielectric layer bonded to the shell substrate 13, the dielectric constant of the shell substrate 13 is greater than 2, and the thickness of the shell substrate 13 The range is 0.05 to 0.95 mm, the dielectric constant of the modified substrate 14 is greater than 6, and the thickness of the modified substrate 14 is 0.05 to 0.95 mm.

In the second embodiment, the second target parameter processes the first shell substrate 13 into the second shell substrate 13, including but not limited to: when the second target parameter is the dielectric constant When the dielectric constant of the first housing substrate 13 is obtained; the dielectric constant of the first housing substrate 13 is compared with the second target parameter; when the second target parameter is less than the first When the dielectric constant of a shell base material 13 is set, a plurality of hollow parts are formed on the first shell base material 13 to form the second shell base material 13.

By forming a plurality of hollow portions on the first housing base material 13, the medium in the first housing base material 13 is replaced by air, so that the dielectric constant of the first housing base material 13 is reduced to a small value The dielectric constant, for example 2. At this time, in the case of a small thickness (for example, 1 mm), the first housing substrate 13 with a small dielectric constant has low reflectivity and high transmittance for radio frequency signals, so that the first housing substrate 13 The transmittance of 13 is greater than the preset transmittance.

In a third embodiment, the preparing the first housing substrate 13 according to the first target parameter includes: when the first target parameter is the first dielectric constant and the second dielectric constant, based on The first dielectric constant forms a first substrate with a first thickness. A second substrate with a second thickness is formed on the first substrate based on the second dielectric constant to form the first housing substrate 13.

For example, the first substrate is the middle frame 12, and the first dielectric constant is the dielectric constant of the middle frame 12; the second substrate is the injection molded substrate on the middle frame 12, and the second dielectric constant is the injection molded substrate The dielectric constant. It can be understood that when the middle frame 12 is glass, the first dielectric constant is 6-8. When the injection molding substrate is plastic, the second dielectric constant is 2.5-5.

There are two situations below to obtain the second target parameter according to the first target parameter and the preset transmittance.

In the first case, "the acquiring of the second target parameter according to the first target parameter and the preset transmittance" includes: based on the first dielectric constant, the first thickness, and the second dielectric The constant and the preset transmittance obtain a third thickness, and the third thickness is a second target parameter.

Then "processing the first housing base material 13 into the second housing base material 13 according to the second target parameter" includes: processing the thickness of the second base material into the third thickness to The second shell substrate 13 is formed.

Specifically, referring to FIG. 16, an injection molding substrate 17 is provided on the inner surface of the middle frame 12. The injection molding substrate 17 is used to form a cavity for containing electronic devices, and the injection molding substrate 17 is made of plastic material. Based on the transmission matrix model, the thickness of the injection molded substrate 17 can be obtained according to the dielectric constant of the middle frame 12, the dielectric constant of the injection molded substrate 17, the thickness and the transmittance of the middle frame 12. The dielectric constant of the middle frame 12 is 6-8, the dielectric constant of the injection molding substrate 17 is 2.5-5, and the thickness of the middle frame 12 is 0.3-2mm. When the preset transmittance is greater than 70%, the injection molding substrate can be obtained The thickness of 17 is greater than 5mm.

Specifically, the thickness of the middle frame 12 is the thickness between the outer surface 121 of the middle frame and the inner surface 122 of the middle frame 12, and correspondingly, the thickness of the injection molded substrate 17 is the thickness of the middle frame 12 provided on a single side.

By setting the thickness of the injection molding substrate 17 facing the antenna module 2 to be greater than 5 mm, the efficiency of the radio frequency signal radiated by the antenna module 2 is maximized, the radiation efficiency of the antenna assembly 10 is improved, and the communication quality of the electronic device 100 is improved.

In the second case, the acquiring the second target parameter according to the first target parameter and the preset transmittance includes: based on the first dielectric constant, the second thickness, the second dielectric constant, and The preset transmittance obtains a third thickness, and the third thickness is a second target parameter.

Then "processing the first shell substrate 13 into the second shell substrate 13 according to the second target parameter" includes: processing the thickness of the first substrate into the third thickness to The second shell substrate 13 is formed.

The difference from the first case is that based on the transmission matrix model, the thickness of the middle frame 12 can be obtained according to the thickness of the injection molded substrate 17, the dielectric constant of the middle frame 12, and the dielectric constant and transmittance of the injection molded substrate 17 , So as to maximize the efficiency of the radio frequency signal radiated by the antenna module 2, improve the radiation efficiency of the antenna assembly 10, and improve the communication quality of the electronic device 100.

In other embodiments, the dielectric constant of the middle frame 12 can be obtained based on the transmission matrix model, according to the thickness of the injection molded substrate 17, the thickness of the middle frame 12, the dielectric constant and the transmittance of the injection molded substrate 17. Or according to the thickness of the injection molded substrate 17, the thickness of the middle frame 12, the dielectric constant and transmittance of the middle frame 12, the dielectric constant of the injection molded substrate 17 can be obtained.

Through the above design, the overall environment with the highest antenna radiation efficiency can be optimized and designed, and the communication quality of the electronic device 100 can be improved.

Operation 208, forming the second housing base material 13 into the housing assembly 1.

It is understandable that the preparation method of the italics component provided in this embodiment can not only design the dielectric constant or thickness of a single layer, but also design the dielectric constant or thickness of multiple layers, so that the multiple The combination of the media has the largest transmittance.

An embodiment of the present application provides a housing assembly 1. The housing assembly 1 is manufactured by the method for preparing the housing assembly 1 described in any of the above embodiments.

The above is part of the implementation of this application. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of this application, several improvements and modifications can be made, and these improvements and modifications are also considered The protection scope of this application.

Claims

A method for preparing a housing assembly, characterized in that it comprises:

Obtain the first target parameter;

Preparing a first shell substrate according to the first target parameter;

Acquiring a first transmittance of the first housing base material to a radio frequency signal of a preset frequency band;

When the first transmittance is less than the preset transmittance, a second target parameter is obtained according to the first target parameter and the preset transmittance; the first target parameter is the dielectric constant and the The second target parameter is thickness; or, the first target parameter is thickness and the second target parameter is dielectric constant;

Process the first shell substrate into a second shell substrate according to the second target parameter, so that the transmittance of the second shell substrate to the radio frequency signal is greater than the preset transmittance rate;

The second shell substrate is formed into a shell assembly.
The preparation method according to claim 1, wherein the obtaining the second target parameter according to the first target parameter and the preset transmittance comprises:

Establishing a preset mapping relationship between the first characteristic parameter, the second characteristic parameter and the transmittance;

When the first target parameter is acquired in the first characteristic parameter, and the transmittance is greater than or equal to the preset transmittance, determine the value of the second characteristic parameter according to the preset mapping relationship The value range is determined as the first target range;

Acquire the second target parameter within the first target range.
3. The preparation method of claim 2, wherein said obtaining said second target parameter within said first target range comprises:

The second characteristic parameter corresponding to the largest transmittance in the first target range is acquired and determined as the second target parameter.
3. The preparation method according to claim 2, wherein said establishing a preset mapping relationship between the first characteristic parameter, the second characteristic parameter and the transmittance comprises:

A preset mapping relationship between the first characteristic parameter, the second characteristic parameter and the transmittance is established according to the transmission matrix of the radio frequency signal of the preset frequency band in the medium.
8. The preparation method of claim 1, wherein the second target parameter processing the first shell substrate into a second shell substrate comprises:

When the second target parameter is the dielectric constant, obtaining the dielectric constant of the first housing substrate;

Comparing the dielectric constant of the first housing substrate with the second target parameter;

When the second target parameter is not equal to the dielectric constant of the first housing substrate, a third target parameter is obtained according to the second target parameter and the dielectric constant of the first housing substrate, so The type of the third target parameter is dielectric constant;

Preparing a modified substrate according to the third target parameter;

The modified substrate is set on the first shell substrate to form a second shell substrate. The dielectric constant of the second shell substrate is similar to the dielectric constant of the first shell substrate. The electrical constant is different.
The preparation method of claim 5, wherein when the second target parameter is greater than the dielectric constant of the first housing substrate, the dielectric constant of the modified substrate is greater than that of the first housing substrate. 2. Target parameters.
The preparation method of claim 5, wherein when the second target parameter is less than the dielectric constant of the first housing substrate, the dielectric constant of the modified substrate is less than the first 2. Target parameters.
7. The preparation method of claim 5, wherein the setting the modified substrate on the first shell substrate to shape the second shell substrate comprises:

The modified substrate and the first shell substrate are mixed by hot melt to form a second shell substrate.
7. The preparation method of claim 5, wherein the setting the modified substrate on the first shell substrate to shape the second shell substrate comprises:

At least one through hole is formed on the first shell substrate;

The modified substrate is filled in the at least one through hole to form a second shell substrate.
7. The preparation method of claim 5, wherein the preparing the modified substrate according to the third target parameter comprises:

Preparing a sheet-shaped modified substrate according to the third target parameter;

Then, molding the modified substrate on the first shell substrate includes:

The modified substrate in the form of a sheet is attached to the first shell substrate.
8. The preparation method of claim 1, wherein the second target parameter processing the first shell substrate into a second shell substrate comprises:

When the second target parameter is the dielectric constant, obtaining the dielectric constant of the first housing substrate;

Comparing the dielectric constant of the first housing substrate with the second target parameter;

When the second target parameter is less than the dielectric constant of the first housing base material, a plurality of hollow parts are formed on the first housing base material to form a second housing base material.
The preparation method according to claim 1, wherein the preparation of the first shell substrate according to the first target parameter comprises:

When the first target parameter is the first dielectric constant and the second dielectric constant, molding the first substrate with the first thickness based on the first dielectric constant;

A second substrate with a second thickness is formed on the first substrate based on the second dielectric constant to form the first housing substrate.
The preparation method according to claim 12, wherein the obtaining the second target parameter according to the first target parameter and the preset transmittance comprises: based on the first dielectric constant, the first Thickness, a second dielectric constant, and the preset transmittance to obtain a third thickness, where the third thickness is a second target parameter;

Then, processing the first housing base material into a second housing base material according to the second target parameter includes:

The thickness of the second base material is processed into the third thickness to form the second shell base material.
The preparation method according to claim 12, wherein the obtaining the second target parameter according to the first target parameter and the preset transmittance comprises: based on the first dielectric constant, the second Thickness, a second dielectric constant, and the preset transmittance to obtain a third thickness, where the third thickness is a second target parameter;

Then, processing the first housing base material into a second housing base material according to the second target parameter includes:

The thickness of the first base material is processed into the third thickness to form the second shell base material.
The preparation method according to any one of claims 1 to 14, wherein the preset frequency band of the radio frequency signal is greater than 20 GHz, and the preset transmittance is 70%.
A housing assembly, characterized in that the housing assembly is manufactured by the method for preparing the housing assembly according to any one of claims 1-15.
A housing assembly, characterized in that it comprises:

A housing base material, the housing base material has a first transmittance for radio frequency signals of a predetermined frequency band, and the first transmittance is less than the predetermined transmittance; and

A modified substrate, the dielectric constant of the modified substrate is less than or greater than the dielectric constant of the shell substrate, the modified substrate is provided on the shell substrate, and the shell substrate The area on which the modified substrate is provided has a second transmittance to the radio frequency signal of the predetermined frequency band, and the second transmittance is greater than the predetermined transmittance.
The housing assembly of claim 17, wherein the modified substrate is mixed with the housing substrate in powder form; or, the modified substrate and the housing substrate are heated Melted and mixed.
The housing assembly of claim 18, wherein the housing base material has at least one through hole, and the modified base material is filled in the at least one through hole.
The housing assembly according to claim 18, wherein the housing base material has a first surface and a second surface disposed opposite to each other, and the modified base material is attached to the first surface; or , The modified substrate is attached to the second surface; or, the modified substrate is provided between the first surface and the second surface.
An antenna assembly, comprising an antenna module and the housing assembly according to any one of claims 17 to 20, the antenna module is used to radiate radio frequency signals, and the modified base of the housing assembly The material is arranged within the radiation range of the radio frequency signal.
An electronic device, characterized by comprising the antenna assembly according to claim 21.