WO2021000591A1 - Electronic device fixing board, and structure for connecting circuit board and electronic device - Google Patents
Electronic device fixing board, and structure for connecting circuit board and electronic device Download PDFInfo
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- WO2021000591A1 WO2021000591A1 PCT/CN2020/078241 CN2020078241W WO2021000591A1 WO 2021000591 A1 WO2021000591 A1 WO 2021000591A1 CN 2020078241 W CN2020078241 W CN 2020078241W WO 2021000591 A1 WO2021000591 A1 WO 2021000591A1
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- electronic device
- fixing
- positioning
- contact surface
- protrusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
Definitions
- the invention relates to the technical field of electronic devices, in particular to an electronic device fixing board and a connection structure between a circuit board and an electronic device.
- the present invention is proposed to provide an electronic device fixing board and a connection structure between the circuit board and the electronic device that overcomes the above-mentioned problems or at least partially solves the above-mentioned problems, so that the size of multiple electronic device arrays can be achieved Smaller and more compact structure.
- the electronic device fixing board includes a substrate, a fixed mounting portion is provided on the bottom surface of the substrate, and a plurality of protrusions are provided on the fixed mounting portion. Distributed in rows, the bottom of each protrusion forms an electronic device contact surface, and each electronic device contact surface is provided with a plurality of positioning grooves and/or positioning protrusions.
- a reinforced fixing rib is provided on the protrusion at the middle position of the fixed installation part, and two ends of the reinforced fixing rib are provided with fixing holes.
- the outer sides of the protrusions on the left and right sides of the fixed installation portion are provided with fixing parts extending downward, and the bottom surfaces of the two fixing parts form a fixed contact surface.
- positioning pins and/or positioning holes are provided on the fixed contact surface.
- a reinforcing rib is provided on the top of the electronic device fixing plate.
- the substrate is provided with a circuit board mounting hole at a peripheral position of the fixed mounting portion.
- the electronic device fixing plate is an aluminum die-casting part, and the electronic device is a power device.
- the fixed contact surface and the bottom surface of the reinforcing fixed rib are on the same plane.
- Another aspect of the present invention provides a connection structure between a circuit board and an electronic device, including the electronic device fixing board described in any one of the above, the circuit board is connected to the top of the electronic device fixing board, and the electronic device A number of positioning protrusions and/or positioning grooves are provided on both sides, and the electronic device is crimped on the contact surface of the electronic device through the engagement of the positioning protrusions and/or positioning grooves.
- the electronic device fixing board in the technical solution of the present invention includes a substrate, a fixed mounting portion is provided on the bottom surface of the substrate, and a plurality of protrusions are provided on the fixed mounting portion, each of the protrusions being Evenly distributed in rows, the bottom of each protrusion forms an electronic device contact surface, and a plurality of positioning grooves and/or positioning protrusions are provided on each electronic device contact surface.
- This structure can crimp the electronic device to the electronic device fixing plate, and make the installation size of the electronic device compact, and has better strength, and ensures that multiple electronic devices are installed in a limited space, so that the overall structure volume can be made Smaller, the volume power density can be greater.
- Figure 1 shows a three-dimensional structural view of an electronic device fixing plate according to an embodiment of the present invention
- Figure 2 shows a front view of an electronic device fixing plate according to an embodiment of the present invention
- Fig. 3 shows a three-dimensional structure diagram of a power device according to an embodiment of the present invention
- Fig. 4 shows an exploded view of the connection structure between a circuit board and an electronic device according to an embodiment of the present invention
- Fig. 5 shows an assembly schematic diagram of an electronic device fixing plate and a power device according to an embodiment of the present invention.
- the present invention provides a board structure for fixing electronic devices and an application of the board structure.
- the main idea is to provide an electronic device fixing board, which can crimp multiple electronic devices on the bottom of the fixing board.
- the electronic device is connected to the circuit board by using the fixing plate, and the above-mentioned overall structure is connected to a certain casing.
- an electronic device fixing plate 9 is disclosed in an embodiment of the present invention, which can be used to fix a plurality of electronic devices 10 to the circuit board 11, wherein the electronic device fixing plate 9 includes a substrate 6.
- a fixed mounting portion is provided on the bottom surface of the substrate 6, and a number of protrusions are provided on the fixed mounting portion, each of the protrusions is arranged in a row, and the bottom of each of the protrusions forms an electronic device contact surface 1.
- a number of positioning grooves 5 and/or positioning protrusions are provided on each contact surface 1 of the electronic device.
- the substrate 6 in the above-mentioned electronic device fixing plate 9 plays a main supporting role, and a fixed mounting portion is provided at the middle position of the substrate 6 extending downward for fixing a plurality of electronic devices 10.
- a number of longitudinally arranged protrusions as shown in FIG. 1 are provided on the fixed installation part, and the bottom surfaces of the plurality of protrusions are used for bonding the electronic components.
- the two lateral sides of the device thus form the electronic device contact surface 1.
- a plurality of positioning grooves 5 can be provided on the electronic device contact surface 1.
- positioning protrusions should be provided on the side of the electronic device, see Figure 3 for details; or a plurality of positioning protrusions are provided on the contact surface 1 of the electronic device, and accordingly, a plurality of positioning grooves (in the figure Not shown); Of course, the position and shape of the positioning protrusion and the positioning groove may not be specifically limited.
- the positioning protrusion and the positioning groove cooperate with each other, so that the electronic device is crimped and clamped on the fixing plate, and the installation size is compact, and the strength is good, and the Multiple electronic devices are installed in the space, so that the overall structure volume can be made smaller, and the volume power density can be larger.
- a reinforcing fixing rib is provided on the protrusion at the middle position of the fixing mounting portion, and two ends of the reinforcing fixing rib are provided with fixing holes.
- the reinforcing fixing rib 7 can be arranged at the middle position of the protrusion to maintain the balance of the connection of the electronic device.
- the arrangement of the reinforcing fixing ribs increases the structural strength of the fixing plate, and by arranging the fixing holes 2 on the reinforcing fixing ribs 7, the fixing plate 9 can be connected and fixed to the shell at the bottom thereof.
- the fixing members extending downward are provided on the outer sides of the protrusions on the left and right sides of the fixing installation portion, and the bottom surfaces of the two fixing members form a fixed contact surface 3.
- a fixing member is provided at the end position of the substrate 6, which is mainly used to fix the electronic device fixing plate to the bottom housing.
- the fixing member can also be used to fix The board is fixed to other positions.
- the fixed contact surface 3 is provided with positioning pins 4 and/or positioning holes.
- the positioning pins 4 or positioning holes are mainly used to fix the electronic device fixing plate at its bottom; the fixing member 9 and the two outermost protrusions of the fixing mounting part can be connected together to form a step , Wherein the fixed contact surface of the fixing member is located at a lower end position than the contact surface of the electronic device, thereby facilitating the contact with the bottom shell.
- the fixing member may not be connected with the protrusion, but may be arranged separately.
- the top of the electronic device fixing plate is provided with reinforcing ribs, thereby further strengthening the strength of the electronic device fixing plate.
- the substrate is provided with circuit board mounting holes 8 at the peripheral position of the fixed mounting portion, and a bolt or other mounting method can be used between them, so as to realize the connection between the fixed board 9 and the circuit board 11.
- the electronic device fixing plate 9 is an aluminum die-casting part, and the electronic device is a power device.
- the aluminum die casting is easy to process, low in production cost, high in strength and light in weight, and can ensure the accuracy of processing.
- the power device is also one of the objects connected and installed in the present invention.
- the fixing member can also be made of other processes and materials, and the electronic device can also be of other device types.
- the fixed contact surface 3 and the bottom surface of the reinforcing fixed rib 7 are on the same plane.
- the bottom surface of the reinforced fixing rib is also fixed in contact with the shell.
- Another aspect of the present invention provides a connection structure between a circuit board 11 and an electronic device 10, including the electronic device fixing board 9 described in any one of the above, and the circuit board is connected to the top of the electronic device fixing board 9, and Positioning protrusions and/or positioning grooves are correspondingly provided on both sides of the electronic device 10, and the positioning protrusions and/or positioning grooves of the electronic device are engaged with the positioning grooves and/or the positioning grooves at the bottom of the electronic device fixing plate 9 Or on the positioning protrusion, and the upper surface thereof abuts against the contact surface of the electronic device.
- the connection of the electronic device, the electronic device fixing board and the circuit board is realized.
- the embodiment of the present invention discloses an electronic device fixing board, which includes a base plate.
- the bottom surface of the base plate is provided with a fixed mounting part, and the fixed mounting part is provided with a number of protrusions, and each protrusion is uniformly arranged.
- the bottom of each protrusion forms an electronic device contact surface, and a number of positioning grooves and/or positioning protrusions are provided on the contact surface of each electronic device.
- This structure can crimp the electronic device to the electronic device fixing plate, and make the installation size of the electronic device compact, and has better strength, and ensures that multiple electronic devices are installed in a limited space, so that the overall structure volume can be made Smaller, the volume power density can be greater.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Disclosed is an electronic device fixing board comprising a substrate. The bottom surface of the substrate is provided with a fixed mounting portion. The fixed mounting portion is provided with a plurality of protrusions uniformly arranged in a row. Bottom portions of the respective protrusions form electronic device contact surfaces. Each of the electronic device contact surfaces is provided with a plurality of positioning recesses and/or positioning protrusions. The structure enables an electronic device to be snap-fit on an electronic device fixing board, enables an electronic device to have a compact mounting size, enhances strength, and ensures that multiple electronic devices can be installed in a limited space, thereby reducing the total structural volume, and increasing the volumetric power density.
Description
本发明涉及电子器件技术领域,具体涉及一种电子器件固定板以及电路板与电子器件的连接结构。The invention relates to the technical field of electronic devices, in particular to an electronic device fixing board and a connection structure between a circuit board and an electronic device.
发明背景Background of the invention
近年来,随着电力电子不断的发展,既为满足市场需求也为技术突破,电子器件比如功率器件的封装体积也越来越小。越追求极致的体积就需要舍弃传统的固定方式,目前市场出现了通过压接固定这种非传统安装形式的电子器件,然而并没有设计出安装这种电子器件的固定板。因此,需要提供一种电子器件固定板,能够固定安装上述的电子器件,并且能够把电子器件阵列的尺寸做到最小,实现单位体积功率密度更大。In recent years, with the continuous development of power electronics, both to meet market demand and for technological breakthroughs, the packaging volume of electronic devices such as power devices has also become smaller and smaller. The more extreme volume is pursued, the traditional fixing method needs to be discarded. At present, electronic devices in the non-traditional form of mounting by crimping and fixing have appeared in the market. However, a fixing board for mounting such electronic devices has not been designed. Therefore, there is a need to provide an electronic device fixing board, which can fix and mount the above-mentioned electronic devices, and can minimize the size of the electronic device array, and achieve greater power density per unit volume.
发明内容Summary of the invention
鉴于上述问题,提出了本发明以便提供一种克服上述问题或者至少部分地解决上述问题的一种电子器件固定板以及电路板与电子器件的连接结构,从而可以将多个电子器件阵列尺寸做到更小,结构更加紧凑。In view of the above-mentioned problems, the present invention is proposed to provide an electronic device fixing board and a connection structure between the circuit board and the electronic device that overcomes the above-mentioned problems or at least partially solves the above-mentioned problems, so that the size of multiple electronic device arrays can be achieved Smaller and more compact structure.
本发明一方面提供了电子器件固定板,所述电子器件固定板包括基板,所述基板的底面上设置有固定安装部,所述固定安装部上设置有若干个凸起,各所述凸起呈排状分布,各所述凸起的底部形成电子器件接触面,各所述电子器件接触面上设置有若干个定位槽和/或定位凸起。One aspect of the present invention provides an electronic device fixing board. The electronic device fixing board includes a substrate, a fixed mounting portion is provided on the bottom surface of the substrate, and a plurality of protrusions are provided on the fixed mounting portion. Distributed in rows, the bottom of each protrusion forms an electronic device contact surface, and each electronic device contact surface is provided with a plurality of positioning grooves and/or positioning protrusions.
可选的,所述固定安装部中间位置的凸起上设置有加强固定筋,所述加强固定筋的两端设置有固定孔。Optionally, a reinforced fixing rib is provided on the protrusion at the middle position of the fixed installation part, and two ends of the reinforced fixing rib are provided with fixing holes.
可选的,所述固定安装部左右两侧凸起的外侧设置有向下延伸的固定件,所述两固定件的底面形成固定接触面。Optionally, the outer sides of the protrusions on the left and right sides of the fixed installation portion are provided with fixing parts extending downward, and the bottom surfaces of the two fixing parts form a fixed contact surface.
可选的,所述固定接触面上设置有定位销和/或定位孔。Optionally, positioning pins and/or positioning holes are provided on the fixed contact surface.
可选的,所述电子器件固定板顶部设置有加强筋。Optionally, a reinforcing rib is provided on the top of the electronic device fixing plate.
可选的,所述基板在所述固定安装部的周边位置上设置有电路板安装孔。Optionally, the substrate is provided with a circuit board mounting hole at a peripheral position of the fixed mounting portion.
可选的,所述电路板安装孔至少为四个,呈阵列分布。Optionally, there are at least four mounting holes for the circuit board, which are distributed in an array.
可选的,所述电子器件固定板为铝压铸件,所述电子器件为功率器件。Optionally, the electronic device fixing plate is an aluminum die-casting part, and the electronic device is a power device.
可选的,所述固定接触面和加强固定筋的底面在同一平面上。Optionally, the fixed contact surface and the bottom surface of the reinforcing fixed rib are on the same plane.
本发明另一方面提供了一种电路板与电子器件的连接结构,包括上述任一项所述的电子器件固定板,所述电路板连接在所述电子器件固定板的顶部,所述电子器件两侧边设置有若干个定位凸起和/或定位槽,通过各所述定位凸起和/或定位槽的卡合将所述电子器件压接在所述电子器件接触面上。Another aspect of the present invention provides a connection structure between a circuit board and an electronic device, including the electronic device fixing board described in any one of the above, the circuit board is connected to the top of the electronic device fixing board, and the electronic device A number of positioning protrusions and/or positioning grooves are provided on both sides, and the electronic device is crimped on the contact surface of the electronic device through the engagement of the positioning protrusions and/or positioning grooves.
由上述可知,本发明的技术方案中的电子器件固定板,包括基板,所述基板的底面上设置有固定安装部,所述固定安装部上设置有若干个凸起,各所述凸起呈排状均匀分布,各所述凸起的底部形成电子器件接触面,各所述电子器件接触面上设置有若干个定位槽和/或定位凸起。此结构可将电子器件压接到所述电子器件固定板上,且使得电子器件安装尺寸紧凑,且有较好的强度,保证了在有限空间安装多个电子器件,使整体结构体积可以做的更小,体积功率密度能够更大。It can be seen from the above that the electronic device fixing board in the technical solution of the present invention includes a substrate, a fixed mounting portion is provided on the bottom surface of the substrate, and a plurality of protrusions are provided on the fixed mounting portion, each of the protrusions being Evenly distributed in rows, the bottom of each protrusion forms an electronic device contact surface, and a plurality of positioning grooves and/or positioning protrusions are provided on each electronic device contact surface. This structure can crimp the electronic device to the electronic device fixing plate, and make the installation size of the electronic device compact, and has better strength, and ensures that multiple electronic devices are installed in a limited space, so that the overall structure volume can be made Smaller, the volume power density can be greater.
上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其它目的、特征和优点能够更明显易懂,以下特举本发明的具体实施方式。The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented in accordance with the content of the description, and in order to make the above and other objectives, features and advantages of the present invention more obvious and understandable. In the following, specific embodiments of the present invention are specifically cited.
附图简要说明Brief description of the drawings
图1示出了根据本发明一个实施例中电子器件固定板的立体结构图;Figure 1 shows a three-dimensional structural view of an electronic device fixing plate according to an embodiment of the present invention;
图2示出了根据本发明一个实施例中电子器件固定板的主视图;Figure 2 shows a front view of an electronic device fixing plate according to an embodiment of the present invention;
图3示出了根据本发明一个实施例中功率器件的立体结构图;Fig. 3 shows a three-dimensional structure diagram of a power device according to an embodiment of the present invention;
图4示出了根据本发明一个实施例中电路板与电子器件连接结构的爆炸图;Fig. 4 shows an exploded view of the connection structure between a circuit board and an electronic device according to an embodiment of the present invention;
图5示出了根据本发明一个实施例中电子器件固定板和功率器件的组装示意图。Fig. 5 shows an assembly schematic diagram of an electronic device fixing plate and a power device according to an embodiment of the present invention.
图中各附图标记如下:1、电子器件接触面,2、固定孔,3、固定接触面,4、定位销,5、定位槽,6、基板,7、加强固定筋,8、电路板安装孔,9、电子器件固定板,10、电子器件,11、电路板。The reference signs in the figure are as follows: 1. Electronic device contact surface, 2. Fixing hole, 3. Fixed contact surface, 4. Positioning pin, 5. Positioning groove, 6. Substrate, 7. Reinforced fixing rib, 8. Circuit board Mounting hole, 9, electronic device fixing plate, 10, electronic device, 11, circuit board.
实施本发明的方式Ways to implement the invention
为使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明实施方式作进一步地详细描述。In order to make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below in conjunction with the accompanying drawings.
本发明提供了一种用于固定电子器件的板结构以及该板结构的应用,主要构思在于,设置一种电子器件固定板,能够将多个电子器件压接在该固定板的底部。并且进一步地,利用该固定板将电子器件连接到电路板上,并且将上述整体结构连接到某一壳体上。The present invention provides a board structure for fixing electronic devices and an application of the board structure. The main idea is to provide an electronic device fixing board, which can crimp multiple electronic devices on the bottom of the fixing board. And further, the electronic device is connected to the circuit board by using the fixing plate, and the above-mentioned overall structure is connected to a certain casing.
如图1-3所示,在本发明的一个实施例中公开了一种电子器件固定板9,可用于将多个电子器件10固定连接到电路板11上,其中电子器件固定板9包括基板6,所述基板6的底面上设置有固定安装部,所述固定安装部上设置有若干个凸起,各所述凸起呈排状分布,各所述凸起的底部形成电子器件接触面1,各所述电子器件接触面1上设置有若干个定位槽5和/或定位凸起。As shown in FIGS. 1-3, an electronic device fixing plate 9 is disclosed in an embodiment of the present invention, which can be used to fix a plurality of electronic devices 10 to the circuit board 11, wherein the electronic device fixing plate 9 includes a substrate 6. A fixed mounting portion is provided on the bottom surface of the substrate 6, and a number of protrusions are provided on the fixed mounting portion, each of the protrusions is arranged in a row, and the bottom of each of the protrusions forms an electronic device contact surface 1. A number of positioning grooves 5 and/or positioning protrusions are provided on each contact surface 1 of the electronic device.
其中,上述电子器件固定板9中的基板6起到主要的支撑作用,基板6的中间位置向下延伸设置有一固定安装部,用于固定多个电子器件10。为了给电子器件10提供足够的安装空间,并且便于排热,在固定安装部上设置有若干个如图1所述的纵向排列的凸起,该多个凸起的底部表面用于贴合电子器件横向的两个侧边,因此形成了电子器件接触面1,为了实现上述凸起和电子器件的卡合连接(即压接),在电子器件接触面1上可以设置多个定位槽5,相应地,电子器件的侧边上应该设置定位凸起,具体参见图3;或者在电子器件接触面1上设置多个定位凸起,相应地,在电子器件上设置多个定位槽(图中未示出);当然,上述定位凸起和定位槽的位置和形状可以不作出具体的限定。Wherein, the substrate 6 in the above-mentioned electronic device fixing plate 9 plays a main supporting role, and a fixed mounting portion is provided at the middle position of the substrate 6 extending downward for fixing a plurality of electronic devices 10. In order to provide sufficient installation space for the electronic device 10 and facilitate heat removal, a number of longitudinally arranged protrusions as shown in FIG. 1 are provided on the fixed installation part, and the bottom surfaces of the plurality of protrusions are used for bonding the electronic components. The two lateral sides of the device thus form the electronic device contact surface 1. In order to realize the snap connection (ie crimping) between the above-mentioned protrusion and the electronic device, a plurality of positioning grooves 5 can be provided on the electronic device contact surface 1. Correspondingly, positioning protrusions should be provided on the side of the electronic device, see Figure 3 for details; or a plurality of positioning protrusions are provided on the contact surface 1 of the electronic device, and accordingly, a plurality of positioning grooves (in the figure Not shown); Of course, the position and shape of the positioning protrusion and the positioning groove may not be specifically limited.
因此,该实施例公开的技术方案,通过上述定位凸起和定位槽相互配合,使得电子器件压接卡合在固定板上,且使得安装尺寸紧凑,且有较好的强度,保证了在有限空间安装多个电子器件,使整体结构体积可以做的更小,体积功率密度能够更大。Therefore, in the technical solution disclosed in this embodiment, the positioning protrusion and the positioning groove cooperate with each other, so that the electronic device is crimped and clamped on the fixing plate, and the installation size is compact, and the strength is good, and the Multiple electronic devices are installed in the space, so that the overall structure volume can be made smaller, and the volume power density can be larger.
在一个实施例中,所述固定安装部中间位置的凸起上设置有加强固定筋,所述加强固定筋的两端设置有固定孔。在该实施例中,如图1所示出的,加强固定筋7可以设置于凸起的中间位置,保持了电子器件连接的均衡性。加强固定筋的设置增加了固定板的结构强度,并且通过在加强固定筋7上设置固定孔2,可以将固定板9连接固定到其底部的壳体上。In an embodiment, a reinforcing fixing rib is provided on the protrusion at the middle position of the fixing mounting portion, and two ends of the reinforcing fixing rib are provided with fixing holes. In this embodiment, as shown in FIG. 1, the reinforcing fixing rib 7 can be arranged at the middle position of the protrusion to maintain the balance of the connection of the electronic device. The arrangement of the reinforcing fixing ribs increases the structural strength of the fixing plate, and by arranging the fixing holes 2 on the reinforcing fixing ribs 7, the fixing plate 9 can be connected and fixed to the shell at the bottom thereof.
在一个实施例中,所述固定安装部左右两侧凸起的外侧设置有向下延伸的固定件,所述两固定件的底面形成固定接触面3。In an embodiment, the fixing members extending downward are provided on the outer sides of the protrusions on the left and right sides of the fixing installation portion, and the bottom surfaces of the two fixing members form a fixed contact surface 3.
在该实施例中,参见图1或2,即在基板6的端部位置设置有固定件,主要用 于将电子器件固定板固定到底部的壳体上,当然,也可以通过固定件将固定板固定到其他的位置。In this embodiment, referring to Figures 1 or 2, that is, a fixing member is provided at the end position of the substrate 6, which is mainly used to fix the electronic device fixing plate to the bottom housing. Of course, the fixing member can also be used to fix The board is fixed to other positions.
在一个实施例中,所述固定接触面3上设置有定位销4和/或定位孔。根据图1和图2,定位销4或定位孔的设置主要用于将电子器件固定板固定在其底部的;固定件9和固定安装部最外侧的两个凸起可以连接在一起形成台阶状,其中,固定件的固定接触面比电子器件接触面位于更下端的位置,从而方便与底部壳体的接触。当然,所述固定件也可以不与凸起连接,分离设置。In an embodiment, the fixed contact surface 3 is provided with positioning pins 4 and/or positioning holes. According to Figures 1 and 2, the positioning pins 4 or positioning holes are mainly used to fix the electronic device fixing plate at its bottom; the fixing member 9 and the two outermost protrusions of the fixing mounting part can be connected together to form a step , Wherein the fixed contact surface of the fixing member is located at a lower end position than the contact surface of the electronic device, thereby facilitating the contact with the bottom shell. Of course, the fixing member may not be connected with the protrusion, but may be arranged separately.
在一个实施例中,所述电子器件固定板顶部设置有加强筋,从而进一步加强了电子器件固定板的强度。In one embodiment, the top of the electronic device fixing plate is provided with reinforcing ribs, thereby further strengthening the strength of the electronic device fixing plate.
在一个实施例中,所述基板在所述固定安装部的周边位置上设置有电路板安装孔8,它们之间可以采用螺栓等安装方式,从而实现该固定板9与电路板11的连接。In an embodiment, the substrate is provided with circuit board mounting holes 8 at the peripheral position of the fixed mounting portion, and a bolt or other mounting method can be used between them, so as to realize the connection between the fixed board 9 and the circuit board 11.
作为一个优选的实施例,所述电路板安装孔8至少为四个,呈阵列分布,参见图1,示出了所述安装孔的个数为6个的方案,从而加强了固定板与电路板之间的连接强度。As a preferred embodiment, there are at least four mounting holes 8 for the circuit board, which are distributed in an array. See FIG. 1, which shows a solution with 6 mounting holes, thereby strengthening the fixing board and the circuit. The strength of the connection between the boards.
在一个实施例中,所述电子器件固定板9为铝压铸件,所述电子器件为功率器件。采用铝压铸件加工方便,制作成本低,强度高而重量轻,并且能够保证加工的精度。而功率器件也是本发明连接安装的对象之一。当然该固定件也可以由其他工艺和材料制作,电子器件也可以是其他器件类型。In one embodiment, the electronic device fixing plate 9 is an aluminum die-casting part, and the electronic device is a power device. The aluminum die casting is easy to process, low in production cost, high in strength and light in weight, and can ensure the accuracy of processing. The power device is also one of the objects connected and installed in the present invention. Of course, the fixing member can also be made of other processes and materials, and the electronic device can also be of other device types.
在一个实施例中,所述固定接触面3和加强固定筋7的底面在同一平面上。为了保证固定板与底部壳体之间的连接强度,在该实施例中特别地设置加强固定筋的底面也与壳体进行接触固定。In an embodiment, the fixed contact surface 3 and the bottom surface of the reinforcing fixed rib 7 are on the same plane. In order to ensure the strength of the connection between the fixing plate and the bottom shell, in this embodiment, the bottom surface of the reinforced fixing rib is also fixed in contact with the shell.
本发明另一方面提供了一种电路板11与电子器件10的连接结构,包括上述任一项所述的电子器件固定板9,所述电路板连接在所述电子器件固定板9的顶部,所述电子器件10两侧边上相应设置有定位凸起和/或定位槽,所述电子器件的定位凸起和/或定位槽卡合在所述电子器件固定板9底部的定位槽和/或定位凸起上,并且其上表面与电子器件接触面抵接。从而实现电子器件、电子器件固定板以及电路板的连接。Another aspect of the present invention provides a connection structure between a circuit board 11 and an electronic device 10, including the electronic device fixing board 9 described in any one of the above, and the circuit board is connected to the top of the electronic device fixing board 9, and Positioning protrusions and/or positioning grooves are correspondingly provided on both sides of the electronic device 10, and the positioning protrusions and/or positioning grooves of the electronic device are engaged with the positioning grooves and/or the positioning grooves at the bottom of the electronic device fixing plate 9 Or on the positioning protrusion, and the upper surface thereof abuts against the contact surface of the electronic device. Thus, the connection of the electronic device, the electronic device fixing board and the circuit board is realized.
综上所述,本发明的实施例公开了一种电子器件固定板,包括基板,基板的底面上设置有固定安装部,固定安装部上设置有若干个凸起,各凸起呈排状均匀分布,各凸起的底部形成电子器件接触面,各电子器件接触面上设置有若干个定位槽和/ 或定位凸起。此结构可将电子器件压接到所述电子器件固定板上,且使得电子器件安装尺寸紧凑,且有较好的强度,保证了在有限空间安装多个电子器件,使整体结构体积可以做的更小,体积功率密度能够更大。In summary, the embodiment of the present invention discloses an electronic device fixing board, which includes a base plate. The bottom surface of the base plate is provided with a fixed mounting part, and the fixed mounting part is provided with a number of protrusions, and each protrusion is uniformly arranged. Distributed, the bottom of each protrusion forms an electronic device contact surface, and a number of positioning grooves and/or positioning protrusions are provided on the contact surface of each electronic device. This structure can crimp the electronic device to the electronic device fixing plate, and make the installation size of the electronic device compact, and has better strength, and ensures that multiple electronic devices are installed in a limited space, so that the overall structure volume can be made Smaller, the volume power density can be greater.
以上仅为本发明的具体实施方式,在本发明的上述教导下,本领域技术人员可以在上述实施例的基础上进行其他的改进或变形。本领域技术人员应该明白,上述的具体描述只是更好的解释本发明的目的,本发明的保护范围应以权利要求的保护范围为准。The above are only specific embodiments of the present invention. Under the above teaching of the present invention, those skilled in the art can make other improvements or modifications on the basis of the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of the present invention, and the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (10)
- 一种电子器件固定板,其特征在于,所述电子器件固定板包括基板,所述基板的底面上设置有固定安装部,所述固定安装部上设置有若干个凸起,各所述凸起呈排状分布,各所述凸起的底部形成电子器件接触面,各所述电子器件接触面上设置有若干个定位槽和/或定位凸起。An electronic device fixing board, characterized in that the electronic device fixing board includes a base plate, a fixed mounting portion is provided on the bottom surface of the base plate, and a plurality of protrusions are provided on the fixed mounting portion. Distributed in rows, the bottom of each protrusion forms an electronic device contact surface, and each electronic device contact surface is provided with a plurality of positioning grooves and/or positioning protrusions.
- 根据权利要求1所述的电子器件固定板,其特征在于,所述固定安装部中间位置的凸起上设置有加强固定筋,所述加强固定筋的两端设置有固定孔。The electronic device fixing board according to claim 1, wherein a reinforcing fixing rib is provided on the protrusion in the middle position of the fixing mounting portion, and two ends of the reinforcing fixing rib are provided with fixing holes.
- 根据权利要求2所述的电子器件固定板,其特征在于,所述固定安装部左右两侧凸起的外侧设置有向下延伸的固定件,所述两个固定件的底面形成固定接触面。3. The electronic device fixing board according to claim 2, wherein the fixing members extending downward are provided on the outer sides of the protrusions on the left and right sides of the fixing mounting portion, and the bottom surfaces of the two fixing members form a fixed contact surface.
- 根据权利要求3所述的电子器件固定板,其特征在于,所述固定接触面上设置有定位销和/或定位孔。The electronic device fixing board according to claim 3, wherein the fixing contact surface is provided with positioning pins and/or positioning holes.
- 根据权利要求1所述的电子器件固定板,其特征在于,所述电子器件固定板顶部设置有加强筋。The electronic device fixing board according to claim 1, wherein the top of the electronic device fixing board is provided with reinforcing ribs.
- 根据权利要求1所述的电子器件固定板,其特征在于,所述基板在所述固定安装部的周边位置上设置有电路板安装孔。The electronic device fixing board according to claim 1, wherein the substrate is provided with a circuit board mounting hole at a peripheral position of the fixing mounting portion.
- 根据权利要求6所述的电子器件固定板,其特征在于,所述电路板安装孔至少为四个,呈阵列分布。The electronic device fixing board according to claim 6, wherein there are at least four mounting holes for the circuit board, distributed in an array.
- 根据权利要求1所述的电子器件固定板,其特征在于,所述电子器件固定板为铝压铸件,所述电子器件为功率器件。The electronic device fixing plate according to claim 1, wherein the electronic device fixing plate is an aluminum die-casting part, and the electronic device is a power device.
- 根据权利要求3所述的电子器件固定板,其特征在于,所述固定接触面和加强固定筋的底面在同一平面上。The electronic device fixing board according to claim 3, wherein the fixed contact surface and the bottom surface of the reinforcing fixing rib are on the same plane.
- 一种电路板与电子器件的连接结构,包括权利要求1-9任一项所述的电子器件固定板,其特征在于,所述电路板连接在所述电子器件固定板的顶部,所述电子器件的两侧边设置有若干个定位凸起和/或定位槽,通过各所述定位凸起和/或定位槽的卡合将所述电子器件压接在所述电子器件接触面上。A connection structure between a circuit board and an electronic device, comprising the electronic device fixing board according to any one of claims 1-9, wherein the circuit board is connected to the top of the electronic device fixing board, and the electronic device A number of positioning protrusions and/or positioning grooves are provided on both sides of the device, and the electronic device is crimped on the contact surface of the electronic device through the engagement of the positioning protrusions and/or positioning grooves.
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CN201921008210.XU CN210694486U (en) | 2019-07-01 | 2019-07-01 | Electronic device fixing plate and connection structure of circuit board and electronic device |
CN201921008210.X | 2019-07-01 |
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WO2021000591A1 true WO2021000591A1 (en) | 2021-01-07 |
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CN1407672A (en) * | 2001-08-30 | 2003-04-02 | 蒂科电子公司 | Integrated circuit receptacle assembly with integrated shield component |
CN2651955Y (en) * | 2003-07-24 | 2004-10-27 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
US20140002979A1 (en) * | 2012-06-29 | 2014-01-02 | Kevin B. Leigh | Multi-chip socket |
WO2016018296A1 (en) * | 2014-07-30 | 2016-02-04 | Hewlett-Packard Development Company, L.P. | Multi-bay apparatus |
CN205648290U (en) * | 2016-05-11 | 2016-10-12 | 张凯 | Circuit board components |
CN208242057U (en) * | 2018-06-14 | 2018-12-14 | 合肥微睿光电科技有限公司 | A kind of circuit board fixed pedestal with regulatory function |
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- 2019-07-01 CN CN201921008210.XU patent/CN210694486U/en active Active
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- 2020-03-06 WO PCT/CN2020/078241 patent/WO2021000591A1/en active Application Filing
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CN1407672A (en) * | 2001-08-30 | 2003-04-02 | 蒂科电子公司 | Integrated circuit receptacle assembly with integrated shield component |
CN2651955Y (en) * | 2003-07-24 | 2004-10-27 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
US20140002979A1 (en) * | 2012-06-29 | 2014-01-02 | Kevin B. Leigh | Multi-chip socket |
WO2016018296A1 (en) * | 2014-07-30 | 2016-02-04 | Hewlett-Packard Development Company, L.P. | Multi-bay apparatus |
CN205648290U (en) * | 2016-05-11 | 2016-10-12 | 张凯 | Circuit board components |
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