WO2020254639A1 - Procédé et dispositif pour l'usinage d'une pièce avec composition du faisceau d'usinage à partir d'au moins deux profils de faisceau - Google Patents
Procédé et dispositif pour l'usinage d'une pièce avec composition du faisceau d'usinage à partir d'au moins deux profils de faisceau Download PDFInfo
- Publication number
- WO2020254639A1 WO2020254639A1 PCT/EP2020/067209 EP2020067209W WO2020254639A1 WO 2020254639 A1 WO2020254639 A1 WO 2020254639A1 EP 2020067209 W EP2020067209 W EP 2020067209W WO 2020254639 A1 WO2020254639 A1 WO 2020254639A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- process zone
- workpiece
- profiles
- processing
- workpieces
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/26—Seam welding of rectilinear seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/32—Bonding taking account of the properties of the material involved
- B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B23/00—Re-forming shaped glass
- C03B23/20—Uniting glass pieces by fusing without substantial reshaping
- C03B23/203—Uniting glass sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Definitions
- the present invention relates to a method for processing at least one workpiece, preferably for welding two workpieces, by means of short laser pulses and in particular by means of an ultra-short pulse laser beam.
- the method can be used to carry out processing steps known per se in the processing of workpieces, for example for cutting or for welding or for local heating or for introducing others
- transparent or partially transparent material such as a workpiece made of glass.
- the processing laser beam is focused into the material of one of the workpieces, into both workpieces and / or into the area of an interface between the two adjacent workpieces by means of appropriate optics and the associated beam shaping, in order to then form the respective process zone in this area.
- Machining method is the shape and size of the local volume or
- the process zone is defined here by the area that is heated by the at least two beam profiles in the workpiece to such an extent that ultimately one in the process zone
- Feed device reacts.
- the movement of the feed device defines a Feed trajectory in the at least one workpiece that is to be traversed with the process zone.
- processing for example welding, on several interfaces of (partially) transparent materials can be achieved simultaneously in this way.
- gaps that are formed, for example, at an interface between two materials to be joined with one another can be better bridged by the proposed method, so that the overall quality of the joining is improved.
- the proposed method enables some connections in the first place
- transparent materials such as aluminosilicate glasses
- transparent materials such as aluminosilicate glasses
- transparent materials with high thermal expansion for example calcium fluoride
- transparent materials with high thermal expansion for example calcium fluoride
- An ultrashort pulse laser provides laser pulses in the picosecond range or femtosecond range.
- the method can also be carried out with a short pulse laser, which provides pulses in the nanosecond range.
- At least one of the beam profiles of the processing beam can be provided as a Gaussian beam profile, so that the beam profiles can be provided in a simple manner.
- the machining of at least one workpiece with a simple Gaussian beam profile is limited in terms of the focus position tolerance.
- the area in which the focus position can be varied is still a reliable one
- Non-diffractive rays must satisfy the Helmholtz equation:
- V 2 U (x, y, z) + k 2 U (x, y, z) 0 and a clear separability into a transverse and a longitudinal dependence of the shape
- transverse dimensions of local intensity maxima as the shortest distance from directly adjacent, opposite ones as the transverse focus diameter or as the diameter of the beam profile in the case of quasi non-diffractive beams d ND o
- the longitudinal expansion in the direction of beam propagation of these almost propagation-invariant intensity maxima indicates the characteristic length L of the quasi non-diffractive beam. This is defined by the intensity drop to 50%, starting from the local intensity maximum in the positive and negative z-direction, i.e. in the direction of propagation.
- quasi-Bessel rays or Bessel-like rays also called Bessel rays here.
- the transverse field distribution Ut (x, y) in the vicinity of the optical axis obeys a Bessel function of the first type of order n to a good approximation.
- the Bessel-Gaussian rays represent a further subset of this class of rays Generation are widespread.
- the illumination of an axicon in a refractive, diffractive or reflective design with a collimated Gaussian beam enables the Bessel-Gaussian beam to be formed.
- the associated transverse field distribution in the vicinity of the optical axis obeys to a good approximation a Bessel function of the first type of order 0, which is enveloped by a Gaussian distribution.
- a significantly greater focus position tolerance can be generated during welding. This reduces the influence of local waviness in the glass and the focus adjustment.
- the proposed method can thus be used in a further area of application - for example, even if the workpieces to be joined do not lie perfectly flat on one another in the area of the desired weld seam and there is accordingly a gap between the workpieces.
- the machining beam can also ensure that the local energy input is distributed over a larger volume of material, so that the modifications induced in the material become less dependent on the surrounding material areas that are not exposed to the laser beam, which can lead to the material stresses induced in the materials be reduced or redistributed and thereby the quality of the processing and the quality and / or strength of the workpiece is improved.
- the beam profiles are preferably present in the process zone at an angle to one another.
- aligning the beam profiles at an angle in the process zone better adaptation to the geometry of a workpiece interface to be machined can be achieved.
- aligning the beam profile at an angle it can be achieved that both a greater lateral exposure of the material volume with laser intensity is achieved and the beam profiles arranged at an angle can be aligned in such a way that overlapping is avoided and the energy input changes accordingly to a bigger one
- Laser beams are introduced into the process zone, the laser beams being aligned at an angle to the surface normal of the workpiece, preferably at an angle between 0 ° and 45 °, particularly preferably between 5 ° and 40 °, very particularly preferably between 10 ° and 35 ° to Surface normals of the workpiece. This can be used laterally and / or Generate longitudinally shifted beam profiles, which are correspondingly in the
- Process zone ensure that the connection cross-section and the focus position tolerance are increased.
- the beam profiles can be offset from one another in the feed direction, so that a point lying on the feed trajectory is swept at least twice in succession by the two laser beams arriving one after the other.
- the present beam profiles and / or the workpieces can also be rotated during the advance so that the rotation results in a symmetrization of the connection cross-section, in particular with respect to the advance direction.
- the beam cross-sections can be rotated by rotating a beam-shaping unit. For example, with a fixed beam profile and a curved feed trajectory, connection cross-sections of different widths can occur, similar to the effect of calligraphy. If the feed direction is, for example, perpendicular in the process plane to a narrow axis of the beam profile, then the connection cross-section is small. If the feed direction is, for example, perpendicular to a broad axis of the beam profile, then the connection cross-section is large.
- a lateral offset means an offset in the plane whose surface normal coincides with the surface normal.
- a longitudinal offset means an offset along the
- At least two beam profiles with a lateral offset to one another and / or with a longitudinal offset to one another are preferably provided in the process zone. It can thus be achieved that the volume of the process zone is increased in order to also improve the connection cross-section and the focal position tolerance of the method in this way.
- the laser beam in the form of a Gaussian beam or a quasi non-diffractive beam, in particular one can be used to adapt the beam shape to the respective geometrical configuration or requirements of the processing as well as to the material of the respective workpieces
- Bessel beam are provided and / or at least one beam profile as a Gaussian
- the lateral offset between two beam profiles is greater than the transverse extent of the respective beam profiles involved, that is to say, in particular, greater than the diameter of the respective beam profiles.
- the longitudinal offset between two beam profiles is greater than the characteristic lengths of the respective beam profiles involved.
- the characteristic length serves here as a measure for the longitudinal extent of the focus area or the focus zone of the respective beam profile in the direction of beam propagation.
- Process zone does not or hardly takes place, but an overlap of the melted area of the individual beam profiles in the process zone can take place. This ensures that the areas in which the energy of the pulsed machining beam is absorbed in the process zone are spatially separated from one another in the process zone.
- the resulting melt volume which is formed in the process zone, preferably includes all jet profiles.
- the energy input takes place locally distributed within the process zone in order to provide an enlarged process zone and thus also an enlarged connection cross-section, which leads to an improvement in the
- Machining process can lead.
- a larger connection cross-section can lead to greater strength.
- the pulse energy of the laser pulses is modulated over time.
- the local energy input in the respective beam profiles can be modulated via the temporal modulation of the pulse energy of the laser pulses in order to reduce or avoid an excessive local input of energy in order to simultaneously prevent excessive stresses from occurring in the material.
- At least two beam profiles can preferably be introduced into the process zone at the same time. It is particularly preferable for all beam profiles to be introduced into the process zone at the same time.
- the beam profiles can also be modulated alternately so that the spatial
- Energy input is modulated.
- This spatial modulation can also take place with a constant input power. Accordingly, it is not a sequential one Scanning the process zone through the individual beam profiles, but rather to provide a processing beam in the process zone, which is composed of (simultaneously) irradiated beam profiles.
- the same pulse energy is radiated into the process zone for each laser pulse as with an individually focused laser beam.
- this energy is distributed locally to different positions within the process zone in such a way that the absorption behavior of the material is better utilized and, on the other hand, it is prevented that an excessively high local energy input causes material changes or damage to the material lying outside the process zone.
- Processing beam can be introduced into the process zone at the same time. It can thus be achieved that differently pulsed for at least two different beam profiles
- Laser beams are used so that, for example, the frequency and the energy of the respective pulsed laser beam and the wavelength of the incident light can be adapted to the geometry and the material of the respective workpiece.
- a first laser beam for generating a first beam profile is preferably introduced into the process zone from a first direction with respect to a workpiece, and a second laser beam is introduced into the process zone from a second direction with respect to the workpiece to generate a second
- FIG. 6 shows a schematic comparison between Gaussian and quasi non-diffractive rays
- the beam profiles 30, 32 are also at an angle ⁇ 1 and ⁇ 2 with respect to the surface normal 110, so that here, at the same time as the lateral offset LA and the longitudinal offset LO, there is also an angular offset between the two beam profiles 30, 32 is present in order to achieve an advantageous introduction of energy into the process zone 4 in this way.
- the respective beam profile 30, 32 introduced into the process zone 4 can be adapted, for example, to the respective material properties of the workpiece 10, 12. Furthermore, it is easily possible in this way to provide the beam profiles 30, 32 with different energies.
- the device 1 comprises a beam source 200 for generating a laser beam 2, which is guided onto and into the workpieces 10, 12 via an optical system 5.
- the beam profiles 30, 32 are each shown in the two shown in FIG.
- the beam-shaping unit 52 can be actively controlled, for example in the form of an acousto-optical deflector (AOD), the position, alignment and intensity of the beam profiles 30, 32 in FIG the workpieces 10,12 are set dynamically or to the respective
- An axicon 56 can be provided in order to provide a quasi non-diffractive beam, for example a Bessel beam, by means of the optics 5.
- the present beam profiles and / or the workpieces can also be rotated during feed, so that the rotation results in a symmetrization of the connection cross section, in particular with regard to the feed direction.
- FIG. 4C shows the effects of the rotation of the beam profile during the advance.
- the short axis of the beam profile 30 is always kept perpendicular to the feed trajectory V. This results in a homogeneous connection cross-section.
- the extension of the connection cross-section orthogonal to the feed trajectory is always the same.
- Machining process shown in which the number of beam profiles in the process zone, which are introduced into the respective workpiece or the workpieces, are varied.
- FIG. 6 shows a comparison of the propagation behavior of a Gaussian beam in FIG. 6A and two quasi non-diffractive beams in FIGS. 6B, C.
- the self-drawn arrows mark the diameter or the length of the beam profile.
- characteristic length L which is defined by the intensity drop to 50%, starting from the local intensity maximum in the positive and negative z-direction.
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
La présente invention concerne un procédé pour l'usinage d'au moins une pièce (10, 12), de préférence pour le soudage de deux pièces (10, 12), qui comprend l'exposition d'une zone de processus (4) d'au moins une pièce (10, 12) à un faisceau d'usinage (3) fourni par un faisceau laser pulsé (2), de préférence par un faisceau laser à impulsions ultracourtes, le faisceau d'usinage (3) étant composé à partir d'au moins deux profils de faisceau (30, 32, 34) dans la zone de processus (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112020002981.6T DE112020002981A5 (de) | 2019-06-21 | 2020-06-19 | Verfahren zum Bearbeiten eines Werkstücks |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019116802 | 2019-06-21 | ||
DE102019116802.3 | 2019-06-21 |
Publications (1)
Publication Number | Publication Date |
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WO2020254639A1 true WO2020254639A1 (fr) | 2020-12-24 |
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PCT/EP2020/067209 WO2020254639A1 (fr) | 2019-06-21 | 2020-06-19 | Procédé et dispositif pour l'usinage d'une pièce avec composition du faisceau d'usinage à partir d'au moins deux profils de faisceau |
Country Status (2)
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DE (1) | DE112020002981A5 (fr) |
WO (1) | WO2020254639A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021102387A1 (de) | 2021-02-02 | 2022-08-04 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks |
DE102021118593A1 (de) | 2021-07-19 | 2023-01-19 | Trumpf Laser Gmbh | Verfahren zum Fügen mindestens zweier Fügepartner |
DE102022204685B3 (de) | 2022-05-13 | 2023-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Optik zur Erzeugung eines linearen Fokus, Vorrichtung und Verfahren zur Bearbeitung eines Werkstücks |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060091122A1 (en) * | 2002-05-24 | 2006-05-04 | Hoya Caneo Optronics Corporation | Method and device for processing inside of transparent material |
DE102010038554A1 (de) * | 2010-07-28 | 2012-02-02 | Osram Ag | Optoelektronisches Halbleiterbauelement und zugehöriges Herstellverfahren |
US20120258605A1 (en) * | 2009-12-09 | 2012-10-11 | Osram Opto Semiconductors Gmbh | Device for a laser lift-off method and laser lift-off method |
US20180062342A1 (en) * | 2016-08-30 | 2018-03-01 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
-
2020
- 2020-06-19 DE DE112020002981.6T patent/DE112020002981A5/de active Pending
- 2020-06-19 WO PCT/EP2020/067209 patent/WO2020254639A1/fr active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US20060091122A1 (en) * | 2002-05-24 | 2006-05-04 | Hoya Caneo Optronics Corporation | Method and device for processing inside of transparent material |
US20120258605A1 (en) * | 2009-12-09 | 2012-10-11 | Osram Opto Semiconductors Gmbh | Device for a laser lift-off method and laser lift-off method |
DE102010038554A1 (de) * | 2010-07-28 | 2012-02-02 | Osram Ag | Optoelektronisches Halbleiterbauelement und zugehöriges Herstellverfahren |
US20180062342A1 (en) * | 2016-08-30 | 2018-03-01 | Corning Incorporated | Laser cutting of materials with intensity mapping optical system |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021102387A1 (de) | 2021-02-02 | 2022-08-04 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zur Laserbearbeitung eines Werkstücks |
US11992897B2 (en) | 2021-02-02 | 2024-05-28 | Trumpf Laser-Und Systemtechnik Gmbh | Apparatus and method for laser machining a workpiece |
DE102021118593A1 (de) | 2021-07-19 | 2023-01-19 | Trumpf Laser Gmbh | Verfahren zum Fügen mindestens zweier Fügepartner |
DE102022204685B3 (de) | 2022-05-13 | 2023-10-05 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Optik zur Erzeugung eines linearen Fokus, Vorrichtung und Verfahren zur Bearbeitung eines Werkstücks |
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Publication number | Publication date |
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DE112020002981A5 (de) | 2022-03-03 |
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