WO2020251089A1 - Electronic device having transmission line - Google Patents

Abstract

Provided is an electronic device, according to the present invention, comprising a multilayer substrate and operating in a millimeter wave band for 5G communication. The electronic device comprises an antenna and the multilayer substrate including a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. The multilayer substrate includes a first graded ground, which is disposed below the antenna and has end portions connected to each other by means of a first via at a first point. In addition, the multilayer substrate includes a second graded ground, which is disposed below the first graded ground and has end portions connected to each other by means of a second via at a second point that is different from the first point, thereby enabling low-loss transmission characteristics to be obtained through the symmetrical graded grounds in the millimeter wave band.

Description

Electronic devices with transmission lines

The present invention relates to an electronic device having a transmission line. More specifically, it relates to an electronic device having a low-loss transmission line in a millimeter wave band.

Electronic devices can be divided into mobile/portable terminals and stationary terminals depending on whether or not they can move. Again, electronic devices can be divided into handheld terminals and vehicle mounted terminals depending on whether the user can directly carry them.

The functions of electronic devices are diversifying. For example, there are functions of data and voice communication, taking pictures and videos through a camera, recording voice, playing music files through a speaker system, and outputting images or videos to the display unit. Some terminals add an electronic game play function or perform a multimedia player function. In particular, recent mobile terminals can receive multicast signals providing visual content such as broadcasting and video or television programs.

As such electronic devices are diversified, they are implemented in the form of a multimedia player with complex functions such as, for example, taking photos or videos, playing music or video files, and receiving games and broadcasts. have.

In order to support and increase the function of the electronic device, it may be considered to improve the structural part and/or the software part of the terminal.

In addition to the above attempts, wireless communication systems using LTE communication technology have recently been commercialized in electronic devices, providing various services. In addition, in the future, wireless communication systems using 5G communication technology are expected to be commercialized and provide various services. Meanwhile, some of the LTE frequency bands may be allocated to provide 5G communication services.

In this regard, the mobile terminal may be configured to provide 5G communication services in various frequency bands. Recently, attempts have been made to provide a 5G communication service using a Sub6 band below 6GHz band. However, in the future, it is expected to provide 5G communication service using millimeter wave (mmWave) band in addition to Sub6 band for faster data rate.

Meanwhile, the frequency bands to be allocated for 5G communication services in the millimeter wave (mmWave) band are the 28 GHz band, 39 GHz and 64 GHz bands. In this regard, it is important to reduce electrical loss due to a transmission line between a plurality of array antennas and a transceiver circuit in a millimeter wave band.

Meanwhile, a circuit substrate on which a plurality of array antennas and a transceiver circuit are disposed may be implemented as a multi-layer substrate in order to optimize performance of various components and reduce the size of the substrate.

Meanwhile, in order to reduce electrical loss due to a transmission line between a plurality of array antennas and a transmission/reception unit circuit, a strip line type transmission line may be considered. However, in such a strip line transmission line, some of the grounds to be disposed on the same plane may be disposed on different layers. This asymmetric ground formation may be considered for optimizing characteristics of an antenna or a transceiver circuit disposed on the ground.

However, due to this asymmetric ground type, there is a problem that the electrical loss of the transmission line under the ground is greatly increased. In particular, when a transmission line under the asymmetric ground is implemented through vias or the like on a plurality of layers, there is a problem in that electrical loss is further increased.

It is an object of the present invention to solve the above and other problems. In addition, another object is to provide an electronic device including a multi-layer substrate having an optimized ground shape.

Another object of the present invention is to provide an electronic device having a low loss transmission line between a plurality of antennas and a transceiver circuit in a millimeter wave band.

Another object of the present invention is to provide an electronic device capable of reducing feed loss due to transmission lines while improving antenna characteristics in a multilayer substrate in a millimeter wave band.

In order to achieve the above or other objects, there is provided an electronic device including a multi-layer substrate according to the present invention. The electronic device may include an antenna; And a multilayer substrate including a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. Meanwhile, the multilayer substrate includes a first graded ground disposed under the antenna and having end portions connected to each other by a first via at a first point. In addition, the multilayer substrate includes a second grade ground disposed under the first grade ground and having ends connected to each other by a second via at a second point different from the first point, in a millimeter wave band. Low-loss transmission characteristics can be obtained through symmetrical grade ground.

In an embodiment, the multilayer substrate may further include a transceiver circuitry configured to transmit a signal to the antenna and to receive a signal from the antenna. Meanwhile, a graded transmission line disposed between a lower portion of the first grade ground and an upper portion of the second grade ground may be further included. Accordingly, low loss transmission characteristics can be obtained through a symmetrical grade ground and a grade transmission line in the millimeter wave band.

In an embodiment, the grade transmission lines may be connected to each other by a third via at a third point between the first point and the second point.

In an embodiment, the first grade ground includes: a first ground; And a second ground whose end is connected to the end of the first ground by the first via and is disposed below the first ground.

In an embodiment, the second grade ground may include a third ground; And a fourth ground whose end is connected to the end of the third ground by the second via and is disposed below the first ground.

Accordingly, there is an advantage in that a low loss transmission characteristic can be obtained between a plurality of antennas and transmission/reception unit circuits disposed above or below the multilayer substrate through the first grade ground, the second grade ground, and the grade transmission line. In addition, there is an advantage in that it is possible to obtain low loss transmission characteristics between a plurality of antennas disposed on the multilayer substrate and the transceiver circuit.

In an embodiment, the grade transmission line includes: a first transmission line disposed under the first ground; And a second transmission line disposed below the first transmission line.

In an embodiment, a distance (d3) between a first grade point of the first grade ground connected by the first via and a grade point of the grade transmission line connected by the third via is the first grade point And a distance d4 between the second grade point of the second grade ground connected by the second via and may be determined to be substantially 1/2 times the distance d4. Accordingly,

In an embodiment, the first transmission line may be connected to the transmission/reception unit circuit through a first signal via. In addition, the second transmission line may be connected to the antenna through a second signal via. Accordingly, signals may be transmitted between the antenna and the transceiver circuit through the first and second transmission lines. Accordingly, while improving antenna bandwidth characteristics and radiation efficiency characteristics, it is possible to obtain low loss transmission characteristics between a plurality of antennas and a transceiver circuit.

In an embodiment, the first transmission line may be connected to a first antenna through a first signal via. In addition, the second transmission line may be connected to a second antenna through a second signal via. In this regard, the first antenna and the second antenna may operate in different frequency bands. Accordingly, while improving antenna bandwidth characteristics and radiation efficiency characteristics, it is possible to obtain low loss transmission characteristics between a plurality of antennas and a transceiver circuit.

In an embodiment, a thickness d2 between the antenna and the second ground may be formed to be thicker than a thickness d1 between the transceiver circuit and the first ground. Accordingly, while improving antenna bandwidth characteristics and radiation efficiency characteristics, it is possible to obtain low loss transmission characteristics between a plurality of antennas and a transceiver circuit.

In an embodiment, a thickness d2 between the transceiver circuit and the second ground may be formed to be thicker than a thickness d1 between the antenna and the first ground. Accordingly, while improving antenna bandwidth characteristics and radiation efficiency characteristics, it is possible to obtain low loss transmission characteristics between a plurality of antennas and a transceiver circuit.

In an embodiment, a thickness d2 between the second antenna and the second ground may be thicker than a thickness d1 between the first antenna and the first ground. Accordingly, the first antenna may operate in a higher frequency band than the second antenna.

In an embodiment, the antenna and the transceiver circuit may be disposed on the front layer of the multilayer substrate. In this regard, the second signal via may be connected to a center area of the antenna. Specifically, the second signal via may be connected to a point on a region that is impedance-matched with the antenna. Accordingly, it is possible to connect the transmission line and the antenna without a separate impedance matching circuit.

In an embodiment, the first and second antennas may be disposed on the front layer of the multilayer substrate, and the transceiver circuit may be disposed on the rear layer of the multilayer substrate. Accordingly, the first transmission line and the second transmission line may be connected to the transmission/reception unit circuit through a third signal via and a fourth signal via.

An electronic device including a multi-layer substrate according to another aspect of the present invention is provided. The electronic device may include an antenna; A transceiver circuitry disposed on the multilayer substrate and configured to transmit a signal to the antenna and to receive a signal from the antenna; And a multilayer substrate including a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. Meanwhile, the multilayer substrate includes a first graded ground disposed under the antenna and having end portions connected to each other by a first via at a first point. In addition, the multilayer substrate may further include a grade transmission line disposed under the first grade ground.

In an embodiment, the multilayer substrate may include a second grade ground disposed under the grade transmission line and connected to each other by a second via at a second point different from the first point.

In an embodiment, the grade transmission lines may be connected to each other by a third via at a third point between the first point and the second point.

In an embodiment, a distance (d3) between a first grade point of the first grade ground connected by the first via and a grade point of the grade transmission line connected by the third via is the first grade point And a distance d4 between the second grade points of the second grade ground connected by the second via.

In an embodiment, the first grade ground includes: a first ground; And a second ground whose end is connected to the end of the first ground by the first via and is disposed below the first ground.

In an embodiment, the second grade ground may include a third ground; And a fourth ground whose end is connected to the end of the third ground by the second via and is disposed below the first ground.

In an embodiment, the grade transmission line may include: a first transmission line disposed under the first ground; And a second transmission line disposed below the first transmission line. In this regard, the first transmission line may be connected to the transceiver circuit through a first signal via, and the second transmission line may be connected to the antenna through a second signal via. In this regard, signals may be transmitted between the antenna and the transceiver circuit through the first and second transmission lines.

According to the present invention, there is an advantage that low loss transmission characteristics can be obtained through a symmetrical grade ground and a grade transmission line in a millimeter wave band.

In addition, according to the present invention, there is an advantage in that it is possible to obtain a low loss transmission characteristic between a plurality of antennas disposed on or below a multilayer substrate and a transmission/reception unit circuit.

In addition, according to the present invention, while improving antenna bandwidth characteristics and radiation efficiency characteristics, there is an advantage in that a low loss transmission characteristic between a plurality of antennas and a transceiver circuit can be obtained.

Further scope of applicability of the present invention will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the present invention can be clearly understood by those skilled in the art, specific embodiments such as the detailed description and preferred embodiments of the present invention should be understood as being given by way of example only.

1A is a block diagram illustrating an electronic device related to the present invention, and FIGS. 1B and 1C are conceptual views of an example of an electronic device related to the present disclosure viewed from different directions.

2 shows a configuration of a wireless communication unit of an electronic device capable of operating in a plurality of wireless communication systems according to the present invention.

3 shows an example of a configuration in which a plurality of antennas of an electronic device according to the present invention can be disposed.

4 illustrates a side structure of a multilayer substrate including an antenna and a transceiver circuit according to an embodiment of the present invention.

5 shows a front structure of a circuit board including an antenna and a transceiver circuit according to another embodiment of the present invention.

6 illustrates a multilayer substrate structure having an optimal ground structure according to an exemplary embodiment in an electronic device having an optimal ground structure according to the present invention.

7 illustrates a multilayer substrate structure having an optimal ground structure according to another exemplary embodiment in an electronic device having an optimal ground structure according to the present invention.

8 shows a configuration in which first and second antennas according to the present invention are implemented on a multilayer substrate.

9 shows a configuration in which first and second antennas according to the present invention are disposed on the front surface of the multilayer substrate, and the transceiver circuit is disposed on the rear surface of the multilayer substrate.

10 shows various transmission line structures in various ground structures according to the present invention.

11 shows insertion loss characteristics for each frequency according to various transmission line structures in various ground structures according to the present invention.

12 shows insertion loss characteristics for each frequency in Structure (C) of the present invention.

13 shows the insertion loss characteristics for each frequency in the structure (D) of the present invention.

Hereinafter, exemplary embodiments disclosed in the present specification will be described in detail with reference to the accompanying drawings, but identical or similar elements are denoted by the same reference numerals regardless of reference numerals, and redundant descriptions thereof will be omitted. The suffixes "module" and "unit" for components used in the following description are given or used interchangeably in consideration of only the ease of preparation of the specification, and do not have meanings or roles that are distinguished from each other by themselves. In addition, in describing the embodiments disclosed in the present specification, when it is determined that a detailed description of related known technologies may obscure the subject matter of the embodiments disclosed in the present specification, the detailed description thereof will be omitted. In addition, the accompanying drawings are for easy understanding of the embodiments disclosed in the present specification, and the technical idea disclosed in the present specification is not limited by the accompanying drawings, and all modifications included in the spirit and scope of the present invention It should be understood to include equivalents or substitutes.

Terms including ordinal numbers, such as first and second, may be used to describe various elements, but the elements are not limited by the terms. These terms are used only for the purpose of distinguishing one component from another component.

When a component is referred to as being "connected" or "connected" to another component, it is understood that it may be directly connected or connected to the other component, but other components may exist in the middle. Should be. On the other hand, when a component is referred to as being "directly connected" or "directly connected" to another component, it should be understood that there is no other component in the middle.

Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, terms such as "comprises" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

Electronic devices described herein include a mobile phone, a smart phone, a laptop computer, a digital broadcasting terminal, a personal digital assistants (PDA), a portable multimedia player (PMP), a navigation system, and a slate PC. , Tablet PC (tablet PC), ultrabook (ultrabook), wearable device (wearable device, for example, smartwatch, glass-type terminal (smart glass), HMD (head mounted display)), etc. may be included. have.

However, it will be readily apparent to those skilled in the art that the configuration according to the embodiment described in the present specification may also be applied to fixed terminals such as digital TVs, desktop computers, and digital signage, except when applicable only to mobile terminals. will be.

1A to 1C, FIG. 1A is a block diagram illustrating an electronic device related to the present invention, and FIGS. 1B and 1C are conceptual views of an example of an electronic device related to the present disclosure viewed from different directions.

The electronic device 100 includes a wireless communication unit 110, an input unit 120, a sensing unit 140, an output unit 150, an interface unit 160, a memory 170, a control unit 180, and a power supply unit 190. ), etc. The components shown in FIG. 1A are not essential for implementing an electronic device, and thus an electronic device described in the present specification may have more or fewer components than the components listed above.

More specifically, among the components, the wireless communication unit 110 may be configured between the electronic device 100 and the wireless communication system, between the electronic device 100 and other electronic devices 100, or between the electronic device 100 and an external server. It may include one or more modules that enable wireless communication between. In addition, the wireless communication unit 110 may include one or more modules that connect the electronic device 100 to one or more networks. Here, the one or more networks may be, for example, a 4G communication network and a 5G communication network.

The wireless communication unit 110 may include at least one of a 4G wireless communication module 111, a 5G wireless communication module 112, a short-range communication module 113, and a location information module 114.

The 4G wireless communication module 111 may transmit and receive 4G base stations and 4G signals through a 4G mobile communication network. At this time, the 4G wireless communication module 111 may transmit one or more 4G transmission signals to the 4G base station. In addition, the 4G wireless communication module 111 may receive one or more 4G reception signals from the 4G base station.

In this regard, an uplink (UL) multi-input multi-output (MIMO) may be performed by a plurality of 4G transmission signals transmitted to the 4G base station. In addition, a downlink (DL) multi-input multiple output (MIMO) may be performed by a plurality of 4G reception signals received from a 4G base station.

The 5G wireless communication module 112 may transmit and receive 5G base stations and 5G signals through a 5G mobile communication network. Here, the 4G base station and the 5G base station may have a non-stand-alone (NSA) structure. For example, the 4G base station and the 5G base station may have a co-located structure disposed at the same location within a cell. Alternatively, the 5G base station may be disposed in a separate location from the 4G base station in a stand-alone (SA) structure.

The 5G wireless communication module 112 may transmit and receive 5G base stations and 5G signals through a 5G mobile communication network. In this case, the 5G wireless communication module 112 may transmit one or more 5G transmission signals to the 5G base station. In addition, the 5G wireless communication module 112 may receive one or more 5G received signals from the 5G base station.

In this case, the 5G frequency band may use the same band as the 4G frequency band, and this may be referred to as LTE re-farming. On the other hand, as the 5G frequency band, the Sub6 band, which is a band below 6GHz, may be used.

On the other hand, a millimeter wave (mmWave) band may be used as a 5G frequency band to perform broadband high-speed communication. When a millimeter wave (mmWave) band is used, the electronic device 100 may perform beam forming to expand communication coverage with a base station.

Meanwhile, regardless of the 5G frequency band, in a 5G communication system, a greater number of multiple input multiple outputs (MIMO) may be supported to improve transmission speed. In this regard, uplink (UL) MIMO may be performed by a plurality of 5G transmission signals transmitted to the 5G base station. In addition, downlink (DL) MIMO may be performed by a plurality of 5G reception signals received from the 5G base station.

Meanwhile, the wireless communication unit 110 may be in a dual connectivity (DC) state with a 4G base station and a 5G base station through the 4G wireless communication module 111 and the 5G wireless communication module 112. In this way, the dual connection between the 4G base station and the 5G base station may be referred to as EN-DC (EUTRAN NR DC). Here, EUTRAN is an Evolved Universal Telecommunication Radio Access Network, which means 4G wireless communication system, and NR is New Radio, which means 5G wireless communication system.

On the other hand, if the 4G base station and the 5G base station have a co-located structure, it is possible to improve throughput through inter-CA (Carrier Aggregation). In the EN-DC state, a 4G reception signal and a 5G reception signal may be simultaneously received through the 4G wireless communication module 111 and the 5G wireless communication module 112.

The short range communication module 113 is for short range communication, and includes Bluetooth™, Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee, and NFC. Near field communication may be supported by using at least one of (Near Field Communication), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct, and Wireless USB (Wireless Universal Serial Bus) technologies. The short-range communication module 114 may be configured between the electronic device 100 and a wireless communication system, between the electronic device 100 and other electronic devices 100, or between the electronic device 100 and other electronic devices 100 through wireless area networks. ) And a network in which the other electronic device 100 or an external server is located may support wireless communication. The local area wireless communication network may be a wireless personal area network (Wireless Personal Area Networks).

Meanwhile, short-range communication between electronic devices may be performed using the 4G wireless communication module 111 and the 5G wireless communication module 112. In an embodiment, short-range communication may be performed between electronic devices through a device-to-device (D2D) method without passing through a base station.

Meanwhile, carrier aggregation (CA) using at least one of the 4G wireless communication module 111 and 5G wireless communication module 112 and the Wi-Fi communication module 113 for transmission speed improvement and communication system convergence (convergence) This can be done. In this regard, 4G + WiFi carrier aggregation (CA) may be performed using the 4G wireless communication module 111 and the Wi-Fi communication module 113. Alternatively, 5G + WiFi carrier aggregation (CA) may be performed using the 5G wireless communication module 112 and the Wi-Fi communication module 113.

The location information module 114 is a module for obtaining a location (or current location) of an electronic device, and a representative example thereof is a GPS (Global Positioning System) module or a WiFi (Wireless Fidelity) module. For example, if the electronic device utilizes a GPS module, the electronic device may acquire the location of the electronic device using a signal transmitted from a GPS satellite. As another example, when the electronic device utilizes the Wi-Fi module, the location of the electronic device may be obtained based on information of the Wi-Fi module and a wireless access point (AP) that transmits or receives a wireless signal. If necessary, the location information module 114 may perform any function among other modules of the wireless communication unit 110 in order to obtain data on the location of the electronic device as a substitute or additionally. The location information module 114 is a module used to obtain the location (or current location) of the electronic device, and is not limited to a module that directly calculates or obtains the location of the electronic device.

Specifically, if the electronic device utilizes the 5G wireless communication module 112, the electronic device may acquire the location of the electronic device based on information of the 5G wireless communication module and a 5G base station transmitting or receiving a wireless signal. In particular, since the 5G base station in the mmWave band is deployed in a small cell having a narrow coverage, it is advantageous to obtain the location of the electronic device.

The input unit 120 includes a camera 121 or an image input unit for inputting an image signal, a microphone 122 for inputting an audio signal, or an audio input unit, and a user input unit 123 for receiving information from a user, for example, , A touch key, a mechanical key, etc.). The voice data or image data collected by the input unit 120 may be analyzed and processed as a user's control command.

The sensing unit 140 may include one or more sensors for sensing at least one of information in the electronic device, information on surrounding environments surrounding the electronic device, and user information. For example, the sensing unit 140 includes a proximity sensor 141, an illumination sensor 142, a touch sensor, an acceleration sensor, a magnetic sensor, and gravity. G-sensor, gyroscope sensor, motion sensor, RGB sensor, infrared sensor (IR sensor), fingerprint sensor (finger scan sensor), ultrasonic sensor (ultrasonic sensor) , Optical sensor (for example, camera (see 121)), microphone (microphone, see 122), battery gauge, environmental sensor (for example, barometer, hygrometer, thermometer, radiation detection sensor, It may include at least one of a heat sensor, a gas sensor, etc.), and a chemical sensor (eg, an electronic nose, a healthcare sensor, a biometric sensor, etc.). Meanwhile, the electronic device disclosed in this specification may combine and utilize information sensed by at least two or more of these sensors.

The output unit 150 is for generating an output related to visual, auditory or tactile sense, and includes at least one of the display unit 151, the sound output unit 152, the hap tip module 153, and the light output unit 154 can do. The display unit 151 may implement a touch screen by forming a layer structure or integrally with the touch sensor. The touch screen may function as a user input unit 123 that provides an input interface between the electronic device 100 and a user, and may provide an output interface between the electronic device 100 and a user.

The interface unit 160 serves as a passage between various types of external devices connected to the electronic device 100. The interface unit 160 connects a wired/wireless headset port, an external charger port, a wired/wireless data port, a memory card port, and a device equipped with an identification module. It may include at least one of a port, an audio input/output (I/O) port, an input/output (video I/O) port, and an earphone port. The electronic device 100 may perform appropriate control related to the connected external device in response to the connection of the external device to the interface unit 160.

In addition, the memory 170 stores data supporting various functions of the electronic device 100. The memory 170 may store a plurality of application programs or applications driven by the electronic device 100, data for the operation of the electronic device 100, and commands. At least some of these application programs may be downloaded from an external server through wireless communication. In addition, at least some of these application programs may exist on the electronic device 100 from the time of delivery for basic functions of the electronic device 100 (eg, incoming calls, outgoing functions, message receiving, and outgoing functions). Meanwhile, the application program may be stored in the memory 170, installed on the electronic device 100, and driven by the controller 180 to perform an operation (or function) of the electronic device.

In addition to operations related to the application program, the controller 180 generally controls overall operations of the electronic device 100. The controller 180 may provide or process appropriate information or functions to a user by processing signals, data, information, etc. input or output through the above-described components or by driving an application program stored in the memory 170.

Also, in order to drive an application program stored in the memory 170, the controller 180 may control at least some of the components examined together with FIG. 1A. Furthermore, in order to drive the application program, the controller 180 may operate by combining at least two or more of the components included in the electronic device 100 with each other.

The power supply unit 190 receives external power and internal power under the control of the controller 180 and supplies power to each of the components included in the electronic device 100. The power supply unit 190 includes a battery, and the battery may be a built-in battery or a replaceable battery.

At least some of the respective components may operate in cooperation with each other to implement an operation, control, or control method of an electronic device according to various embodiments described below. In addition, the operation, control, or control method of the electronic device may be implemented on the electronic device by driving at least one application program stored in the memory 170.

1B and 1C, the disclosed electronic device 100 includes a bar-shaped terminal body. However, the present invention is not limited thereto, and may be applied to various structures such as a watch type, a clip type, a glass type, or a folder type in which two or more bodies are relatively movably coupled, a flip type, a slide type, a swing type, and a swivel type. . Although it will relate to a specific type of electronic device, a description of a specific type of electronic device may be generally applied to other types of electronic devices.

Here, the terminal body may be understood as a concept referring to the electronic device 100 as at least one aggregate.

The electronic device 100 includes a case (for example, a frame, a housing, a cover, etc.) forming an exterior. As shown, the electronic device 100 may include a front case 101 and a rear case 102. Various electronic components are disposed in an inner space formed by the combination of the front case 101 and the rear case 102. At least one middle case may be additionally disposed between the front case 101 and the rear case 102.

A display unit 151 is disposed on the front of the terminal body to output information. As illustrated, the window 151a of the display unit 151 may be mounted on the front case 101 to form the front surface of the terminal body together with the front case 101.

In some cases, electronic components may be mounted on the rear case 102 as well. Electronic components that can be mounted on the rear case 102 include a removable battery, an identification module, and a memory card. In this case, a rear cover 103 for covering the mounted electronic component may be detachably coupled to the rear case 102. Accordingly, when the rear cover 103 is separated from the rear case 102, the electronic components mounted on the rear case 102 are exposed to the outside. Meanwhile, a part of the side surface of the rear case 102 may be implemented to operate as a radiator.

As shown, when the rear cover 103 is coupled to the rear case 102, a part of the side surface of the rear case 102 may be exposed. In some cases, when the rear case 102 is combined, the rear case 102 may be completely covered by the rear cover 103. Meanwhile, the rear cover 103 may be provided with an opening for exposing the camera 121b or the sound output unit 152b to the outside.

The electronic device 100 includes a display unit 151, first and second sound output units 152a and 152b, a proximity sensor 141, an illuminance sensor 142, a light output unit 154, and first and second sound output units. Cameras 121a and 121b, first and second operation units 123a and 123b, microphone 122, interface unit 160, and the like may be provided.

The display unit 151 displays (outputs) information processed by the electronic device 100. For example, the display unit 151 may display execution screen information of an application program driven by the electronic device 100, or UI (User Interface) and GUI (Graphic User Interface) information according to such execution screen information. .

In addition, two or more display units 151 may exist depending on the implementation form of the electronic device 100. In this case, in the electronic device 100, a plurality of display units may be spaced apart or integrally disposed on one surface, or may be disposed on different surfaces, respectively.

The display unit 151 may include a touch sensor that senses a touch on the display unit 151 so as to receive a control command by a touch method. Using this, when a touch is made to the display unit 151, the touch sensor detects the touch, and the controller 180 may be configured to generate a control command corresponding to the touch based on this. Content input by the touch method may be letters or numbers, or menu items that can be indicated or designated in various modes.

As such, the display unit 151 may form a touch screen together with a touch sensor, and in this case, the touch screen may function as a user input unit 123 (see FIG. 1A). In some cases, the touch screen may replace at least some functions of the first manipulation unit 123a.

The first sound output unit 152a may be implemented as a receiver that transmits a call sound to the user's ear, and the second sound output unit 152b is a loud speaker that outputs various alarm sounds or multimedia reproduction sounds. ) Can be implemented.

The light output unit 154 is configured to output light for notifying when an event occurs. Examples of the event include message reception, call signal reception, missed call, alarm, schedule notification, e-mail reception, and information reception through an application. When the user's event confirmation is detected, the controller 180 may control the light output unit 154 to terminate the light output.

The first camera 121a processes an image frame of a still image or moving picture obtained by an image sensor in a photographing mode or a video call mode. The processed image frame may be displayed on the display unit 151 and may be stored in the memory 170.

The first and second manipulation units 123a and 123b are an example of a user input unit 123 that is operated to receive a command for controlling the operation of the electronic device 100, and may also be collectively referred to as a manipulating portion. have. The first and second operation units 123a and 123b may be employed in any manner as long as the user operates while receiving a tactile feeling such as touch, push, and scroll. In addition, the first and second manipulation units 123a and 123b may also be employed in a manner in which the first and second manipulation units 123a and 123b are operated without a user's tactile feeling through proximity touch, hovering touch, or the like.

Meanwhile, the electronic device 100 may be provided with a fingerprint recognition sensor for recognizing a user's fingerprint, and the controller 180 may use fingerprint information detected through the fingerprint recognition sensor as an authentication means. The fingerprint recognition sensor may be embedded in the display unit 151 or the user input unit 123.

The microphone 122 is configured to receive a user's voice and other sounds. The microphone 122 may be provided in a plurality of locations and configured to receive stereo sound.

The interface unit 160 becomes a passage through which the electronic device 100 can be connected to an external device. For example, the interface unit 160 is a connection terminal for connection with other devices (eg, earphones, external speakers), a port for short-range communication (eg, an infrared port (IrDA Port), a Bluetooth port (Bluetooth Port), a wireless LAN port, etc.], or at least one of a power supply terminal for supplying power to the electronic device 100. The interface unit 160 may be implemented in the form of a socket for accommodating an external card such as a subscriber identification module (SIM) or a user identity module (UIM), or a memory card for storing information.

A second camera 121b may be disposed on the rear surface of the terminal body. In this case, the second camera 121b has a photographing direction substantially opposite to that of the first camera 121a.

The second camera 121b may include a plurality of lenses arranged along at least one line. The plurality of lenses may be arranged in a matrix format. Such a camera may be referred to as an array camera. When the second camera 121b is configured as an array camera, an image may be photographed in various ways using a plurality of lenses, and an image of better quality may be obtained.

The flash 124 may be disposed adjacent to the second camera 121b. The flash 124 illuminates light toward the subject when photographing the subject with the second camera 121b.

A second sound output unit 152b may be additionally disposed on the terminal body. The second sound output unit 152b may implement a stereo function together with the first sound output unit 152a, and may be used to implement a speakerphone mode during a call.

At least one antenna for wireless communication may be provided in the terminal body. The antenna may be embedded in the terminal body or may be formed in a case. Meanwhile, a plurality of antennas connected to the 4G wireless communication module 111 and the 5G wireless communication module 112 may be disposed on the side of the terminal. Alternatively, the antenna may be formed in a film type and attached to the inner surface of the rear cover 103, or a case including a conductive material may be configured to function as an antenna.

Meanwhile, four or more antennas disposed on the side of the terminal may be implemented to support MIMO. In addition, when the 5G wireless communication module 112 operates in a millimeter wave (mmWave) band, since each of the plurality of antennas is implemented as an array antenna, a plurality of array antennas may be disposed in the electronic device.

The terminal body is provided with a power supply unit 190 (refer to FIG. 1A) for supplying power to the electronic device 100. The power supply unit 190 may include a battery 191 built in the terminal body or configured to be detachable from the outside of the terminal body.

Hereinafter, a structure of a multiplex transmission system according to the present invention and an electronic device having the same, in particular, a power amplifier in a heterogeneous radio system and embodiments related to an electronic device having the same will be described with reference to the accompanying drawings. It is obvious to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit and essential features of the present invention.

2 shows a configuration of a wireless communication unit of an electronic device capable of operating in a plurality of wireless communication systems according to the present invention. Referring to FIG. 2, the electronic device includes a first power amplifier 210, a second power amplifier 220, and an RFIC 250. In addition, the electronic device may further include a modem 400 and an application processor 500. Here, the modem 400 and the application processor AP 500 may be physically implemented on a single chip, and may be implemented in a logically and functionally separate form. However, the present invention is not limited thereto and may be implemented in the form of physically separated chips depending on the application.

Meanwhile, the electronic device includes a plurality of low noise amplifiers (LNAs) 410 to 440 in the receiver. Here, the first power amplifier 210, the second power amplifier 220, the controller 250, and the plurality of low noise amplifiers 310 to 340 are all operable in the first communication system and the second communication system. In this case, the first communication system and the second communication system may be a 4G communication system and a 5G communication system, respectively.

As shown in FIG. 2, the RFIC 250 may be configured as a 4G/5G integrated type, but is not limited thereto and may be configured as a 4G/5G separate type according to an application. When the RFIC 250 is configured as a 4G/5G integrated type, it is advantageous in terms of synchronization between 4G/5G circuits and has an advantage that control signaling by the modem 400 can be simplified.

Meanwhile, when the RFIC 250 is configured as a 4G/5G separate type, it may be referred to as a 4G RFIC and a 5G RFIC, respectively. In particular, when the 5G band and the 4G band have a large difference in bands, such as when the 5G band is configured as a millimeter wave band, the RFIC 250 may be configured as a 4G/5G separate type. In this way, when the RFIC 250 is configured as a 4G/5G separate type, there is an advantage that RF characteristics can be optimized for each of the 4G band and the 5G band.

Meanwhile, even when the RFIC 250 is configured as a 4G/5G separate type, the 4G RFIC and the 5G RFIC are logically and functionally separated, and physically, it is possible to be implemented in one chip.

Meanwhile, the application processor (AP) 500 is configured to control the operation of each component of the electronic device. Specifically, the application processor (AP) 500 may control the operation of each component of the electronic device through the modem 400.

For example, the modem 400 may be controlled through a power management IC (PMIC) for low power operation of an electronic device. Accordingly, the modem 400 may operate the power circuit of the transmitter and the receiver through the RFIC 250 in a low power mode.

In this regard, when it is determined that the electronic device is in the idle mode, the application processor AP 500 may control the RFIC 250 through the modem 300 as follows. For example, if the electronic device is in the idle mode, at least one of the first and second power amplifiers 110 and 120 operates in a low power mode or is turned off through the modem 300 through the RFIC. 250 can be controlled.

According to another embodiment, when the electronic device is in a low battery mode, the application processor (AP) 500 may control the modem 300 to provide wireless communication capable of low power communication. For example, when an electronic device is connected to a plurality of entities among a 4G base station, a 5G base station, and an access point, the application processor (AP) 500 may control the modem 400 to enable wireless communication with the lowest power. Accordingly, even though the throughput is slightly sacrificed, the application processor (AP) 500 may control the modem 400 and the RFIC 250 to perform short-range communication using only the short-range communication module 113.

According to another embodiment, when the remaining battery power of the electronic device is equal to or greater than a threshold, the modem 300 may be controlled to select an optimal wireless interface. For example, the application processor (AP, 500) may control the modem 400 to receive through both the 4G base station and the 5G base station according to the remaining battery capacity and available radio resource information. In this case, the application processor (AP, 500) may receive the remaining battery level information from the PMIC, and the available radio resource information from the modem 400. Accordingly, if the remaining battery capacity and available radio resources are sufficient, the application processor (AP, 500) may control the modem 400 and the RFIC 250 to receive reception through both the 4G base station and the 5G base station.

Meanwhile, in the multi-transceiving system of FIG. 2, the transmitting unit and the receiving unit of each radio system may be integrated into one transmitting and receiving unit. Accordingly, there is an advantage in that a circuit part integrating two types of system signals can be removed from the RF front-end.

In addition, since the front end parts can be controlled by the integrated transmission/reception unit, the front end parts can be integrated more efficiently than when the transmission/reception system is separated for each communication system.

In addition, when separated for each communication system, it is impossible to control other communication systems as necessary, or because a system delay is increased due to this, it is impossible to efficiently allocate resources. On the other hand, the multiple transmission/reception system as shown in FIG. 2 has the advantage of enabling efficient resource allocation since it is possible to control other communication systems as needed, and thereby minimize system delay.

Meanwhile, the first power amplifier 210 and the second power amplifier 220 may operate in at least one of the first and second communication systems. In this regard, when the 5G communication system operates in the 4G band or the Sub6 band, the first and second power amplifiers 220 can operate in both the first and second communication systems.

On the other hand, when the 5G communication system operates in the millimeter wave (mmWave) band, one of the first and second power amplifiers 210 and 220 may operate in the 4G band and the other may operate in the millimeter wave band. have.

Meanwhile, by integrating the transmitting and receiving unit and the receiving unit, it is possible to implement two different wireless communication systems with a single antenna using a transmitting and receiving antenna. At this time, 4x4 MIMO can be implemented using four antennas as shown in FIG. 2. In this case, 4x4 DL MIMO may be performed through downlink (DL).

Meanwhile, if the 5G band is the Sub6 band, the first to fourth antennas ANT1 to ANT4 may be configured to operate in both the 4G band and the 5G band. On the other hand, if the 5G band is a millimeter wave (mmWave) band, the first to fourth antennas ANT1 to ANT4 may be configured to operate in any one of the 4G band and the 5G band. In this case, if the 5G band is a millimeter wave (mmWave) band, each of a plurality of separate antennas may be configured as an array antenna in the millimeter wave band.

Meanwhile, 2x2 MIMO can be implemented using two antennas connected to the first power amplifier 210 and the second power amplifier 220 among the four antennas. In this case, 2x2 UL MIMO (2 Tx) may be performed through uplink (UL). Alternatively, it is not limited to 2x2 UL MIMO, and may be implemented with 1 Tx or 4 Tx. In this case, when the 5G communication system is implemented with 1 Tx, only one of the first and second power amplifiers 210 and 220 needs to operate in the 5G band. Meanwhile, when the 5G communication system is implemented with 4Tx, an additional power amplifier operating in the 5G band may be further provided. Alternatively, a transmission signal may be branched in each of one or two transmission paths, and the branched transmission signal may be connected to a plurality of antennas.

On the other hand, a switch-type splitter or power divider is built into the RFIC corresponding to the RFIC 250, so that separate parts do not need to be placed outside, thereby improving component mounting performance. I can. Specifically, it is possible to select the transmission unit (TX) of two different communication systems by using a single pole double throw (SPDT) type switch inside the RFIC corresponding to the control unit 250.

In addition, an electronic device capable of operating in a plurality of wireless communication systems according to the present invention may further include a duplexer 231, a filter 232, and a switch 233.

The duplexer 231 is configured to separate signals in the transmission band and the reception band from each other. In this case, the signal of the transmission band transmitted through the first and second power amplifiers 210 and 220 is applied to the antennas ANT1 and ANT4 through the first output port of the duplexer 231. On the other hand, signals in the reception band received through the antennas ANT1 and ANT4 are received by the low noise amplifiers 310 and 340 through the second output port of the duplexer 231.

The filter 232 may be configured to pass a signal in a transmission band or a reception band and block signals in the remaining bands. In this case, the filter 232 may include a transmission filter connected to the first output port of the duplexer 231 and a reception filter connected to the second output port of the duplexer 231. Alternatively, the filter 232 may be configured to pass only the signal of the transmission band or only the signal of the reception band according to the control signal.

The switch 233 is configured to transmit only either a transmission signal or a reception signal. In an embodiment of the present invention, the switch 233 may be configured in the form of a single pole double throw (SPDT) so as to separate a transmission signal and a reception signal in a time division multiplexing (TDD) scheme. In this case, the transmission signal and the reception signal are signals of the same frequency band, and accordingly, the duplexer 231 may be implemented in the form of a circulator.

Meanwhile, in another embodiment of the present invention, the switch 233 is applicable to a frequency division multiplexing (FDD) scheme. In this case, the switch 233 may be configured in the form of a Double Pole Double Throw (DPDT) so as to connect or block a transmission signal and a reception signal, respectively. On the other hand, since the transmission signal and the reception signal can be separated by the duplexer 231, the switch 233 is not necessarily required.

Meanwhile, the electronic device according to the present invention may further include a modem 400 corresponding to a control unit. In this case, the RFIC 250 and the modem 400 may be referred to as a first control unit (or a first processor) and a second control unit (a second processor), respectively. Meanwhile, the RFIC 250 and the modem 400 may be implemented as physically separate circuits. Alternatively, the RFIC 250 and the modem 400 may be physically divided into one circuit logically or functionally.

The modem 400 may perform control and signal processing for transmission and reception of signals through different communication systems through the RFIC 250. The modem 400 may be obtained through control information received from a 4G base station and/or a 5G base station. Here, the control information may be received through a physical downlink control channel (PDCCH), but is not limited thereto.

The modem 400 may control the RFIC 250 to transmit and/or receive signals through the first communication system and/or the second communication system at a specific time and frequency resource. Accordingly, the RFIC 250 may control transmission circuits including the first and second power amplifiers 210 and 220 to transmit a 4G signal or a 5G signal in a specific time period. Further, the RFIC 250 may control receiving circuits including the first to fourth low noise amplifiers 310 to 340 to receive a 4G signal or a 5G signal in a specific time period.

Meanwhile, specific operations and functions of an electronic device having array antennas operating in different bands according to the present invention equipped with a multiple transmission/reception system as shown in FIG. 2 will be described below.

In the 5G communication system according to the present invention, the 5G frequency band may be a higher frequency band than the Sub6 band. For example, the 5G frequency band may be a millimeter wave band, but is not limited thereto and may be changed according to an application.

3 shows an example of a configuration in which a plurality of antennas of an electronic device according to the present invention can be disposed. Referring to FIG. 3, a plurality of antennas 1110a to 1110d or 1150B may be disposed on the rear surface of the electronic device 100. Alternatively, a plurality of antennas 1110S1 and 1110S2 may be disposed on the side of the electronic device 100.

Meanwhile, referring to FIG. 2, a plurality of antennas ANT 1 to ANT 4 may be disposed on a side or rear surface of the electronic device 100. Here, each of the plurality of antennas ANT 1 to ANT may be configured as an array antenna to perform beamforming in a millimeter wave band. Each of a plurality of antennas (ANT 1 to ANT) composed of a single antenna and/or a phased array antenna for use of a wireless circuit such as the transceiver circuit 250 is mounted on the electronic device 100 Can be.

Meanwhile, referring to FIGS. 2 and 3, at least one signal may be transmitted or received through a plurality of antennas 1110a to 1110d corresponding to the plurality of antennas ANT 1 to ANT 4. In this regard, each of the plurality of antennas 1110a to 1110d may be configured as an array antenna. The electronic device can communicate with the base station through any one of the plurality of antennas 1110a to 1110d. Alternatively, the electronic device may perform multiple input/output (MIMO) communication with a base station through two or more of the plurality of antennas 1110a to 1110d.

Meanwhile, according to the present invention, at least one signal may be transmitted or received through a plurality of antennas 1110S1 and 1110S2 on the side of the electronic device 100. Unlike illustrated, at least one signal may be transmitted or received through the plurality of antennas 1110S1 to 1110S4 on the side of the electronic device 100. In this regard, each of the plurality of antennas 1110S1 to 1110S4 may be configured as an array antenna. The electronic device can communicate with the base station through any one of the plurality of antennas 1110S1 to 1110S4. Alternatively, the electronic device may perform multiple input/output (MIMO) communication with the base station through two or more of the plurality of antennas 1110S1 to 1110S4.

Meanwhile, the present invention may transmit or receive at least one signal through a plurality of antennas 1110a to 1110d, 1150B, 1110S1 to 1110S4 on the back and/or side of the electronic device 100. In this regard, each of the plurality of antennas 1110a to 1110d, 1150B, and 1110S1 to 1110S4 may be configured as an array antenna. The electronic device can communicate with the base station through any one of the plurality of antennas 1110a to 1110d, 1150B, and 1110S1 to 1110S4. Alternatively, the electronic device may perform multiple input/output (MIMO) communication with the base station through two or more of the plurality of antennas 1110a to 1110d, 1150B, and 1110S1 to 1110S4.

Hereinafter, an electronic device including a multi-layer substrate having an optimized ground shape according to the present invention will be described. In this regard, the optimized ground type means a ground type capable of optimizing the performance of the antenna and the transmitting and receiving unit circuits on the circuit board provided with the antenna and the transmitting and receiving unit circuit. In an example, when the antenna and the transceiver circuit are disposed on the same layer, the ground for the antenna and the ground for the transceiver circuit may be disposed on different planes. Specifically, a structure in which the ground for the antenna and the ground for the transceiver circuit are disposed on different planes may be referred to as a graded ground. This grade ground structure will be described in detail with reference to FIGS. 6 to 10.

Meanwhile, FIG. 4 shows a side structure of a multi-layer substrate including an antenna and a transceiver circuit according to an embodiment of the present invention. On the other hand, FIG. 5 shows a front structure of a circuit board including an antenna and a transceiver circuit according to another embodiment of the present invention.

Referring to FIG. 4, a plurality of antennas 1110 are disposed on a front surface of the multilayer substrate 1100. Also, a transceiver circuit 1250 is disposed on a rear surface of the multilayer circuit board 1100. Here, the transceiver circuit 1250 corresponds to the RFIC 1250 operating in the mmWave band.

The plurality of antennas 1110 may include first to fourth antennas 1110a to 1110d. In this regard, the number of the plurality of antennas 1110 is not limited to four array antennas, and an arbitrary number of array antennas, such as 2, 4, 6, 8, 16, etc., depending on the application Can be changed to Meanwhile, each of the first to fourth antennas 1110a to 1110d may include a plurality of antenna elements to ensure communication coverage in the mmWave band.

Each of the plurality of antennas 1110 and the transceiver circuit 1250 may form a vertical interconnection (1120a) with each other through the multilayer substrate 1100. In this regard, the vertical connection corresponds to a transmission line 1120a between each of the plurality of antennas 1110 and the transceiver circuit 1250. Further, a transmission line between each of the plurality of antennas 1110 and the transceiver circuit 1250 may be referred to as a feeding line 1120a.

Meanwhile, referring to FIGS. 2 and 4, a gain and phase controller 230, a power amplifier 210, a low noise amplifier 310, and the like may be disposed at each of the plurality of antennas 1110. Specifically, a gain and phase controller 230, a power amplifier 210, and a low noise amplifier 310 on different layers of the multilayer substrate 1110 between each of the plurality of antennas 1110 and the transceiver circuit 1250 ), etc. can be placed.

On the other hand, at least some of the gain and phase control unit 230, the power amplifier 210, and the low-noise amplifier 310 may be disposed inside the transceiver circuit 1250. In this regard, a gain and phase control unit 230, a power amplifier 210, a low-noise amplifier 310, and the like are disposed inside the transmission/reception unit circuit 1250, and they are It may be connected to each of the antennas 1110 of.

Meanwhile, referring to FIG. 5, a plurality of antennas 1110 are disposed on one plane of the multilayer substrate 1100. In this regard, a plurality of antennas 1110 may be disposed on the entire surface of the multilayer substrate 1100. Also, the transceiver circuit 1250 may be disposed on the same plane as the plurality of antennas 1110. Accordingly, the plurality of antennas 1110 and the transceiver circuit 1250 may all be disposed on the entire surface of the multilayer substrate 1100. Here, the transceiver circuit 1250 corresponds to the RFIC 1250 operating in the mmWave band.

The plurality of antennas 1110 may include first to fourth antennas 1110a to 1110d. In this regard, the number of the plurality of antennas 1110 is not limited to four array antennas, and an arbitrary number of array antennas, such as 2, 4, 6, 8, 16, etc., depending on the application Can be changed to Meanwhile, each of the first to fourth antennas 1110a to 1110d may include a plurality of antenna elements to ensure communication coverage in the mmWave band.

Each of the plurality of antennas 1110 and the transceiver circuit 1250 may form an electrical connection 1120b on the same plane of the multilayer substrate 1100. In this regard, the electrical connection corresponds to a transmission line 1120b between each of the plurality of antennas 1110 and the transceiver circuit 1250. Also, a transmission line between each of the plurality of antennas 1110 and the transceiver circuit 1250 may be referred to as a feeding line 1120b.

Meanwhile, referring to FIGS. 2 and 5, a gain and phase controller 230, a power amplifier 210, a low noise amplifier 310, and the like may be disposed on each of the plurality of antennas 1110. Specifically, a gain and phase controller 230, a power amplifier 210, a low noise amplifier 310, and the like may be disposed between each of the plurality of antennas 1110 and the transceiver circuit 1250.

On the other hand, at least some of the gain and phase control unit 230, the power amplifier 210, and the low-noise amplifier 310 may be disposed inside the transceiver circuit 1250. In this regard, a gain and phase control unit 230, a power amplifier 210, a low-noise amplifier 310, and the like are disposed inside the transmission/reception unit circuit 1250, and they are It may be connected to each of the antennas 1110 of.

On the other hand, at least some of the gain and phase control unit 230, the power amplifier 210, and the low-noise amplifier 310 may be disposed inside the transceiver circuit 1250. In this regard, a gain and phase control unit 230, a power amplifier 210, a low-noise amplifier 310, and the like are disposed inside the transmission/reception unit circuit 1250, and they are It may be connected to each of the antennas 1110 of.

Meanwhile, FIG. 6 shows a multilayer substrate structure having an optimum ground structure according to an exemplary embodiment in an electronic device having an optimum ground structure according to the present invention. Specifically, FIG. 6 shows a multilayer substrate structure having an optimum ground structure when a plurality of antennas 1110 and the transceiver circuit 1250 are disposed on the same plane.

On the other hand, FIG. 7 shows a multilayer substrate structure having an optimum ground structure according to another embodiment in an electronic device having an optimum ground structure according to the present invention. Specifically, FIG. 7 shows a multilayer substrate structure having an optimum ground structure when a plurality of antennas 1110 and the transceiver circuit 1250 are disposed on the same plane.

6 and 7, the electronic device includes a multilayer substrate 1100, an antenna 1110, and a transceiver circuit 1250. Here, the antenna 1110 includes a case in which a plurality of array antennas 1110 are disposed as shown in FIGS. 4 and 5.

The multilayer substrate 1100 is configured to include a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. Meanwhile, the multilayer substrate 1100 includes a first grade ground 1121 and a second grade ground 1122.

The first grade ground 1121 is disposed under the antenna 1110 and is configured to have end portions connected to each other by a first via 1121c at a first point. On the other hand, the second grade ground 1122 is disposed under the first grade ground 1121 and is configured such that ends are connected to each other by a second via 1122c at a second point different from the first point.

In this regard, the first grade ground 1121 may operate as an optimized ground for the antenna 1110 and the transceiver circuit 1250. In addition, the second grade ground 1122 can operate as an optimized ground for the grade transmission line 1123 under the first grade ground 1121.

Meanwhile, a transceiver circuitry 1250 is disposed on the multilayer substrate 1100 and is configured to transmit a signal to the antenna 1110 and receive a signal from the antenna 1110. Also, the grade transmission line 1123 is configured to be disposed between a lower portion of the first grade ground 1121 and an upper portion of the second grade ground 1122. Specifically, the grade transmission lines 1123 may be connected to each other by a third via 1123c at a third point between the first point and the second point.

Meanwhile, the first grade ground 1121 includes a first ground 1121a and a second ground 1121b. In this regard, the first ground 1121a is disposed above the second ground 1121b, and the end thereof is configured to be connected to the second ground 1121b by the first via 1121c. On the other hand, the second ground 1121b is configured such that its end is connected to the end of the first ground 1121a by the first via 1121c and is disposed below the first ground 1121a.

In addition, the second grade ground 1122 includes a third ground 1122a and a fourth ground 1122b. In this regard, the third ground 1122a is disposed above the fourth ground 1122b, and is configured to have an end connected to the fourth ground 1122b by the second via 1122c. On the other hand, the fourth ground 1122b is configured such that its end is connected to the end of the third ground 1122a by the first via 1121c and is disposed below the third ground 1122a.

Further, the grade transmission line 1123 includes a first transmission line 1123a and a second transmission line 1123b. In this regard, the first transmission line 1123a may be configured to be disposed under the first ground 1121a. In addition, the second transmission line 1123b may be configured such that an end thereof is connected to an end of the first transmission line 1123a by a third via 1123c and disposed below the first transmission line 1123a.

Meanwhile, in the present invention, there is an advantage that the first grade ground 1121 can be formed to have different thicknesses so that the electrical characteristics of the transceiver circuit 1250 and the antenna 1110 are optimized. In addition, in the present invention, the grade transmission line 1123 is provided under the first grade ground 1121, and the structure of the second grade ground 1123 for the grade transmission line 1122 can be optimized. Accordingly, there is an advantage in that it is possible to provide optimized first and second grade grounds 1121 and 1123 capable of minimizing power supply loss in the grade transmission line 1123.

Referring to FIG. 6, the distance between the transceiver circuit 1250 and the first ground 1121a is d1, and the distance between the antenna 1110 and the second ground 1121b is d2. In this regard, the distance d2 between the antenna 1110 and the second ground 1121b may be set larger than the distance d1 between the transceiver circuit 1250 and the first ground 1121a. Accordingly, the thickness d2 between the antenna 1110 and the second ground 1121b may be formed to be thicker than the thickness d1 between the transceiver circuit 1250 and the first ground 1121a.

In this regard, as the distance d2 between the antenna 1110 and the second ground 1121b is set larger, there is an advantage that the bandwidth characteristics of the antenna 1110 are improved. Accordingly, for wideband transmission/reception in the mmWave band, the distance d2 between the antenna 1110 and the second ground 1121b can be set to be large. Here, when the distance between the antenna 1110 and the second ground 1121b is set to d2, the antenna 1110 may be referred to as a first type antenna.

On the other hand, referring to FIG. 7, the distance between the antenna 1110 and the first ground 1121a is d1, and the distance between the transceiver circuit 1250 and the second ground 1121b is d2. In this regard, the distance d1 between the antenna 1110 and the first ground 1121a may be set smaller than the distance d2 between the transceiver circuit 1250 and the second ground 1121b. Accordingly, a thickness d2 between the transceiver circuit 1250 and the second ground 1121b may be formed to be thicker than a thickness d1 between the antenna 1110 and the first ground 1121a.

In this regard, as the distance d1 between the antenna 1110 and the first ground 1121a is set to be smaller, there is an advantage that the radiation efficiency of the antenna 1110 is improved. Therefore, for low loss transmission/reception in the mmWave band, the distance d1 between the antenna 1110 and the first ground 1121a can be set small. Here, when the distance between the antenna 1110 and the first ground 1121a is set to d1, the antenna 1110 may be referred to as a second type antenna.

Meanwhile, different structures of the antenna 1110 and the transceiver circuit 1250 of FIGS. 6 and 7 must be independently configured. For example, referring to FIGS. 2, 3, 6, and 7, some of the first to fourth antennas ANT1 to ANT4 are configured as a first type antenna, and the others are configured as a second type antenna. I can.

Meanwhile, in 5G NR (New Radio), the UE, which is a terminal, can support a wideband transmission/reception mode and a low latency transmission/reception mode. In this regard, when the UE operates in a broadband transmission/reception mode, it may operate as an eMBB (enhanced mobile broad band) UE. On the other hand, when the UE operates in a low delay transmission/reception mode, it may operate as an ultra-reliable low latency communication (uRLLC) UE.

Accordingly, when the electronic device operates as an eMBB UE in a wideband transmission/reception mode, signals may be transmitted and received through the first type antenna among the first to fourth antennas ANT1 to ANT4. Accordingly, there is an advantage of supporting broadband communication through a first type antenna in which the distance between the antenna 1110 and the second ground 1121b is set to d2 (d2> d1).

On the other hand, when the electronic device operates as a uRLLC UE in a low delay transmission/reception mode, signals may be transmitted and received through a second type antenna among the first to fourth antennas ANT1 to ANT4. On the other hand, there is an advantage in that low loss and low delay communication can be supported through a second type antenna in which a distance between the antenna 1110 and the first ground 1121a is set to d1 (d1 <d2).

Meanwhile, referring to FIGS. 6 and 7, a connection point of the grade transmission line 1123 may be formed between different connection points of the first and second grade grounds 1121 and 1122. Specifically, the third point of the grade transmission line 1123 as a connection point may be formed in the middle between the first point and the second point, which are different connection points of the first and second grade grounds 1121 and 1122.

Accordingly, the electric field of the signal transmitted through the first transmission line 1123a and the second transmission line 1123b of the grade transmission line 1123 is guided in the same ground form at both sides of the discontinuity point. I can. Here, the meaning of the same ground shape means that the electric field of the signal transmitted through the first transmission line 1123a and the second transmission line 1123b is a left-right symmetrical shape with a boundary at a third point, which is a discontinuous point.

Accordingly, there is an advantage in that electrical loss due to signals transmitted through the first transmission line 1123a and the second transmission line 1123b is reduced. Accordingly, in the present invention, while optimizing the electrical characteristics of the antenna 1110, loss of signals transmitted through the first and second transmission lines 1123a and 1123b can be reduced. In addition, in the present invention, it is possible to reduce loss of signals transmitted through the first and second transmission lines 1123a and 1123b while optimizing different characteristics of the antenna according to the UE communication type.

In this regard, the distance (d3) between the first grade point of the first grade ground 1121 connected by the first via 1121c and the grade point of the grade transmission line 1122 connected by the third via 1123c Is determined as follows. That is, the distance d3 may be determined as 1/2 times the distance d4 between the first grade point and the second grade point. Here, the first grade point is a point of the first grade ground 1121 connected by the first via 1121c, and corresponds to the aforementioned first point. In addition, the second grade point is a point of the second grade ground 11212 connected by the second via 1122c and corresponds to the aforementioned second point.

Meanwhile, in the present invention, the antenna 1110 and the transceiver circuit 1250 may be vertically connected to the grade transmission line 1123 by a signal via. In this regard, the antenna 1110 and the transceiver circuit 1250 may be connected to each other through a vertical connection in the multilayer substrate 1100 as shown in FIGS. 4, 6 and 7. On the other hand, the antenna 1110 and the transceiver circuit 1250 may be interconnected on the same layer of the multilayer substrate 1100 as shown in FIG. 5.

In this regard, an interconnection scheme as shown in FIG. 5 may be advantageous in terms of the shortest distance between the antenna 1110 and the transceiver circuit 1250. However, the interconnection scheme as shown in FIG. 5, that is, the same layer connection scheme, is difficult in terms of antenna impedance matching. Specifically, the impedance value at both ends of the antenna element has a high value. Therefore, when the antenna 1110 and the transceiver circuit 1250 are directly connected on the same plane, a separate impedance matching circuit is required. On the other hand, it is possible to directly connect to an internal point of the antenna 1110 without a separate impedance matching circuit through a vertical connection in the multilayer substrate 1100 as shown in FIGS. 4, 6 and 7.

In relation to this vertical connection structure, the antenna 1110 and the transceiver circuit 1250 may be disposed on the front layer of the multilayer substrate 1100. In this case, as described above, it is possible to directly connect to an internal point of the antenna 1110 without a separate impedance matching circuit through a vertical connection in the multilayer substrate 1100. Accordingly, the second signal via 1124b connected to the antenna 1110 may be connected to a center area of the antenna 1110. Here, the meaning of the central region of the antenna 1110 is not necessarily limited to the central point of the antenna 1110 physically. For example, the central region of the antenna 1110 may be a specific point inside the antenna 1100 where the antenna 1110 may be matched with a specific impedance, for example, 50 ohms.

In addition, referring to FIGS. 6 and 7, the grade transmission line 1123 disposed between the first and second grade grounds 1121 and 1122 has the advantage of presenting an optimized ground structure to minimize the feed loss due to the transmission line. There is this. Specifically, the grade transmission line 1123 has a strip line structure in which both upper and lower portions are ground, and has a lower feed loss than the microstrip line structure. In addition, the connection point of the grade transmission line 1123 is arranged in the middle of the connection point of the first and second grade grounds 1121 and 1122 to be implemented as a grade ground having a strip line structure in a symmetrical shape. Accordingly, there is an advantage that loss due to a fringing field of a signal transmitted through the grade transmission line 1123 can be minimized.

Meanwhile, referring to FIG. 6, in a vertical connection structure according to a signal via according to the present invention, a first transmission line 1123a may be connected to a transceiver circuit 1250 and a first signal via 1124a. . On the other hand, the second transmission line 1123b may be connected to the antenna 1110 and the second signal via 1124b. In this regard, the first and second signal vias 1124a and 1124b are respectively first and second transmission lines 1123a and 1123b through slots implemented in the first and second grounds 1121a and 1121b, respectively. Can be connected with.

In the above, a grade ground structure has been described in the transmission/reception unit circuit disposed on the same plane as the array antenna operating in one frequency band. Hereinafter, an array antenna operating in different frequency bands and a transmission/reception unit circuit disposed on the same plane will be described in terms of a grade ground structure.

In this regard, FIG. 8 shows a configuration in which the first and second antennas according to the present invention are implemented on a multilayer substrate. On the other hand, FIG. 9 shows a configuration in which the first and second antennas according to the present invention are disposed on the front surface of the multilayer substrate, and the transceiver circuit is disposed on the rear surface of the multilayer substrate.

Specifically, referring to FIGS. 8 and 9, the electronic device includes a first antenna 1111 and a second antenna 1112 disposed on the front surface of the multilayer substrate 1100. In addition, the electronic device further includes a first grade ground 1121 and a second grade ground 1122 and a grade transmission line 1123 implemented on the multilayer substrate 1100. Meanwhile, referring to FIG. 9, the transceiver circuit 1250 may be disposed on the rear surface of the multilayer substrate 1100. However, the present invention is not limited thereto, and the transceiver circuit 1250 may be disposed on the same plane as the antenna as shown in FIGS. 6 and 7. In this regard, when the first antenna 1111 and the second antenna 1112 are disposed on the same plane as the transmission/reception unit circuit 1250, some contents of FIGS. 6 and 7 may be applied. Accordingly, the contents of the first and second grade grounds 1121 and 1122 and the grade transmission line 1123 in FIGS. 6 and 7 may be applied.

Meanwhile, referring to FIGS. 8 and 9, first and second antennas 1111 and 1112 are disposed on the front surface of the multilayer substrate 1100. Also, a transceiver circuit 1250 may be disposed on a rear surface of the multilayer circuit board 1100. Here, the transceiver circuit 1250 corresponds to the RFIC 1250 operating in the mmWave band.

Specifically, the first and second antennas 1111 and 1112 may be disposed on the front layer of the multilayer substrate 1110. On the other hand, the transceiver circuit 1250 may be disposed on a rear layer of the multilayer substrate 1110. In this regard, the first transmission line 1123a and the second transmission line 1123b may be connected to the transceiver circuit 1250 by a third signal via 1124c and a fourth signal via 1124d.

Meanwhile, each of the first and second antennas 1111 and 1112 may be composed of array antennas including a plurality of antenna elements, as shown in FIGS. 2, 4 and 5. In addition, the first and second antennas 1111 and 1112 may be configured to operate in different frequency bands of the mmWave band. In this regard, the first and second antennas 1111 and 1112 may be configured to operate in any one of 28 GHz, 38.5 GHz and 64 GHz. However, it is not limited to such a band, and may operate in any band of the mmWave band.

In this regard, the first antenna 1111 may operate in a first frequency band, and the second antenna 1112 may operate in a second frequency band. Meanwhile, the first antenna 1111 may be composed of a plurality of array antennas. For example, the first antenna 1111 may be composed of four array antennas in which four antenna elements are each arranged.

Also, the second antenna 1112 may be configured with a plurality of array antennas. For example, the first antenna 1112 may be composed of four array antennas in which four antenna elements are each arranged. Meanwhile, the first and second antennas 1111 and 1112 may be disposed in an overlapped space on the same plane. For example, the first antenna 1111 may be a 2x2 antenna and disposed in a rectangular grid shape, and the second antenna 1112 may be disposed in a 2x2 antenna and disposed in a rectangular grid shape rotated 45 degrees. Specifically, the first antenna 1111 operating in a higher frequency band may be disposed in an inner space in which the second antenna 1112 is disposed.

In this regard, the number of the first and second antennas 1111 and 1112 is not limited to four array antennas, but an arbitrary number such as 2, 4, 6, 8, 16, etc. depending on the application Can be changed to array antennas of. In addition, each of the array antennas belonging to the first and second antennas 1111 and 1112 may be formed of a plurality of antenna elements to ensure communication coverage in the mmWave band.

Meanwhile, the multilayer substrate 1100 is configured to include a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers. Meanwhile, the multilayer substrate 1100 includes a first grade ground 1121 and a second grade ground 1122.

The first grade ground 1121 is disposed under the antenna 1110 and is configured to have end portions connected to each other by a first via 1121c at a first point. On the other hand, the second grade ground 1122 is disposed under the first grade ground 1121 and is configured such that ends are connected to each other by a second via 1122c at a second point different from the first point.

In this regard, the first grade ground 1121 may operate as an optimized ground for the antenna 1110 and the transceiver circuit 1250. In addition, the second grade ground 1122 can operate as an optimized ground for the grade transmission line 1123 under the first grade ground 1121.

Meanwhile, the transceiver circuit 1250 is disposed on the rear surface of the multilayer substrate 1100 and is configured to transmit a signal to the antenna 1110 and receive a signal from the antenna 1110. Also, the grade transmission line 1123 is configured to be disposed between a lower portion of the first grade ground 1121 and an upper portion of the second grade ground 1122.

Meanwhile, since the first and second antennas 1111 and 1112 operate independently in different frequency bands, interconnection between them is not required. Accordingly, the grade transmission line 1123 is configured not to be connected to each other unlike FIGS. 6 and 7.

Meanwhile, the first grade ground 1121 includes a first ground 1121a and a second ground 1121b. In this regard, the first ground 1121a is disposed above the second ground 1121b, and the end thereof is configured to be connected to the second ground 1121b by the first via 1121c. On the other hand, the second ground 1121b is configured such that its end is connected to the end of the first ground 1121a by the first via 1121c and is disposed below the first ground 1121a.

In addition, the second grade ground 1122 includes a third ground 1122a and a fourth ground 1122b. In this regard, the third ground 1122a is disposed above the fourth ground 1122b, and is configured to have an end connected to the fourth ground 1122b by the second via 1122c. On the other hand, the fourth ground 1122b is configured such that its end is connected to the end of the third ground 1122a by the first via 1121c and is disposed below the third ground 1122a.

Further, the grade transmission line 1123 includes a first transmission line 1123a and a second transmission line 1123b. In this regard, the first transmission line 1123a may be configured to be disposed under the first ground 1121a. Meanwhile, the end of the first transmission line 1123a and the end of the second transmission line 1123b are not directly connected to each other.

Meanwhile, referring to FIG. 9, the transmission/reception unit circuit 1250 disposed under the multilayer substrate 1100 may be configured such that both the first transmission line 1123a and the second transmission line 1123b are connected. Specifically, the transceiver circuit 1250 is connected to the first transmission line 1123a through the third signal via 1124c. Also, the transceiver circuit 1250 is connected to the second transmission line 1123b through the fourth signal via 1124d. In this regard, the third and fourth signal vias 1124c and 1124d are respectively first and second transmission lines 1123a and 1123b through slots implemented in the third and fourth grounds 1122a and 1122b, respectively. Can be connected with.

Further, referring to FIGS. 8 and 9, in the vertical connection structure according to the signal via according to the present invention, the first transmission line 1123a is formed by the transmission/reception unit circuit 1250 and the first signal via 1124a. Can be connected. On the other hand, the second transmission line 1123b may be connected to the antenna 1110 and the second signal via 1124b. In this regard, the first and second signal vias 1124a and 1124b are respectively first and second transmission lines 1123a and 1123b through slots implemented in the first and second grounds 1121a and 1121b, respectively. Can be connected with.

Meanwhile, in the present invention, there is an advantage that the first grade ground 1121 can be formed to have different thicknesses so that the electrical characteristics of the transceiver circuit 1250 and the antenna 1110 are optimized. In addition, in the present invention, the grade transmission line 1123 is provided under the first grade ground 1121, and the structure of the second grade ground 1123 for the grade transmission line 1122 can be optimized. Accordingly, there is an advantage in that it is possible to provide optimized first and second grade grounds 1121 and 1123 capable of minimizing power supply loss in the grade transmission line 1123.

In addition, referring to FIGS. 8 and 9, the thickness d2 between the second antenna 1112 and the second ground 1122a is greater than the thickness d1 between the first antenna 1111 and the first ground 1121a. It can be formed thick. In this regard, the first antenna 1111 may be configured to operate in a higher frequency band than the second antenna 1112. Accordingly, there is an advantage in that the dielectric height for the first antenna 1111 operating in a higher frequency band is set to a lower dielectric height for the second antenna 1112, thereby optimizing antenna performance for each frequency band. . In addition, there is an advantage in that it is possible to optimize antenna performance for each frequency band through the grade ground and at the same time minimize the insertion loss caused by the grade transmission line.

Meanwhile, in the present invention, the antenna 1110 and the transceiver circuit 1250 may be vertically connected to the grade transmission line 1123 by a signal via. In this regard, the first and second antennas 1111 and 11112 and the transceiver circuit 1250 may be connected to each other through vertical connection in the multilayer substrate 1100 as shown in FIGS. 4, 8 and 9.

In this regard, since the first and second antennas 1111 and 11112 and the transmitting/receiving circuit 1250 are disposed on different layers of the multilayer substrate 1100, vertical connection between them is required. In this regard, the first and second antennas 1111 and 11112 may be connected to the transceiver circuit 1250 through one vertical connection.

However, as illustrated in FIGS. 8 and 9, each of the first and second antennas 1111 and 11112 may be connected to the transmission/reception unit circuit 1250 through a plurality of vertical connection units and transmission lines. In this regard, the first antenna 1111 may be connected to the transceiver circuit 1250 through the first signal via 1124a, the first transmission line 1123a, and the third signal via 1124c. Here, at least one circuit configuration, for example, the phase control unit 230 of FIG. 2, the power amplifier 210, and the low noise amplifier 310 may be disposed on a layer on which the first transmission line 1123a is disposed.

Further, the second antenna 1112 may be connected to the transceiver circuit 1250 through the second signal via 1124b, the second transmission line 1123b, and the fourth signal via 1124d. Here, at least one circuit configuration, for example, the phase control unit 230 of FIG. 2, the power amplifier 210, and the low noise amplifier 310 may be disposed on a layer on which the second transmission line 1123b is disposed.

In this way, according to some circuit configurations disposed between the first and second antennas 1111 and 11112 and the transceiver circuit 1250, the first and second antennas 1111 and 11112 and the transceiver circuit 1250 ) We propose a configuration of multiple vertical connections. Accordingly, the present invention has an advantage of optimizing the performance of the first and second antennas 1111 and 11112 in each frequency band, while also optimizing the performance of the circuit unit implemented by the grade transmission line 1123. Specifically, there is an advantage in that electrical loss due to circuits implemented on the same layer as the grade transmission line 1123 and the grade transmission line 1123 can be minimized.

In relation to this vertical connection structure, the antenna 1110 and the transceiver circuit 1250 may be disposed on the front layer of the multilayer substrate 1100. In this case, as described above, it is possible to directly connect to an internal point of the antenna 1110 without a separate impedance matching circuit through a vertical connection in the multilayer substrate 1100. Accordingly, the second signal via 1124b connected to the antenna 1110 may be connected to a center area of the antenna 1110. Here, the meaning of the central region of the antenna 1110 is not necessarily limited to the central point of the antenna 1110 physically. For example, the central region of the antenna 1110 may be a specific point inside the antenna 1100 where the antenna 1110 may be matched with a specific impedance, for example, 50 ohms.

Meanwhile, technical features of an electronic device including a grade ground and a grade transmission line of FIGS. 6 to 9 according to the present invention are as follows.

1) Composed of mmWave RFIC, multi-layer, Via, Ground, Transmission Line, and Antenna Array.

2) Ground is divided into the ground of the circuit part and the ground of the antenna part.

3) Since the height of the ground of the circuit part and the ground of the antenna part are different, connect the circuit part and the antenna part with vertical vias of different heights.

4) d1 is the ground height of the circuit part and d2 is the ground height of the antenna part.

5) Signal transmitted from mmWave RFIC is transmitted to Transmission Line through Via.

6) Impedance Miss matching caused by Graded Ground in Transmission Line may occur. To prevent this, the circuit part and the antenna part are connected to the Graded Transmission Line through a vertical connection via.

7) d3 represents the separation distance between the via (1123c) of the Transmission Line and the via (1121c) used in the upper graded ground.

8) d4 represents the separation distance between the upper graded ground via (1121c) and the lower graded ground via (1122c).

Meanwhile, FIG. 10 shows various transmission line structures in various ground structures according to the present invention. In this regard, FIG. 10(a) shows a structure (structure (a)) in which grounds GND are disposed on both the front and rear surfaces of the substrate. In structure (a), a transmission line 1125 is disposed between the front and rear grounds of the substrate.

Meanwhile, FIG. 10(b) shows a structure (structure (b)) in which grade grounds GND1 and GND2 are disposed on the front and rear surfaces of a substrate. In structure (b), a transmission line 1126 is disposed between the grade grounds GND1 and GND2.

Meanwhile, FIG. 10(c) shows a structure (structure (c)) in which grade grounds GND1 and GND2 are disposed on the front and rear surfaces of a substrate. In the structure (c), the grade transmission lines 1123a and 1123b are disposed between the grade grounds GND1 and GND2. Specifically, first and second points connected by vertical vias in the grade grounds GND1 and GND2 may be substantially identically configured. Here, the offset position of the vertical via 1123d, which is a vertical connection configuration between the grade transmission lines 1123a and 1123b, may be indicated by d3. In this case, the offset position d3 represents the distance moved to the left or right compared to the vertical via connection point of the grade grounds GND1 and GND2.

Meanwhile, FIG. 10(d) shows a structure (structure (d)) in which grade grounds GND1 and GND2 optimally disposed on the front and rear surfaces of the substrate are disposed. In the structure (d), the grade transmission lines 1123a and 1123b are disposed between the grade grounds GND1 and GND2. In this regard, the optimal structure of FIG. 10(d) corresponds to the above-described grade ground structure of FIGS. 6 to 9.

Meanwhile, referring to FIGS. 6 to 9 and 10(d), first and second points connected by vertical vias in the grade grounds GND1 and GND2 are configured differently. Specifically, a distance between the first and second points connected by vertical vias in the grade grounds GND1 and GND2 may be denoted by d4. Also, the offset position of the vertical via 1123c, which is a vertical connection configuration between the grade transmission lines 1123a and 1123b, may be indicated by d3. As described above, the offset position d3 of the third via 1123c, which is a vertical via, may be optimized as an intermediate point of the distance d4 between the vertical vias at the grade grounds GND1 and GND2.

Meanwhile, FIG. 11 shows insertion loss characteristics for each frequency according to various transmission line structures in various ground structures according to the present invention. Here, each of the graphs indicated by (a) to (d) represents the insertion loss characteristics of structures (a) to (d) of FIG. 10.

In addition, Table 1 shows insertion loss characteristics for each frequency according to various transmission line structures in various ground structures according to the present invention. Specifically, it shows insertion loss characteristics per 1 mm of transmission line length at 10 GHz, 28 GHz and 38.5 GHz.

Line loss (dB/mm)	Structure (a), (d)	Structure (b)	Structure (c)
10GHz	-0.0225 dB	-0.0420 dB	-0.0264 dB
28GHz	-0.0448 dB	-0.1701 dB	-0.0641 dB
38.5GHz	-0.0575 dB	-0.2761 dB	-0.0845 dB

Specifically, it can be seen that the structure of FIG. 10(d) (ie, structure (d)) according to the present invention exhibits the same insertion loss characteristics as the ideal stripline structure (ie, structure (a)). That is, in the structure of Fig. 10 (d) (i.e., structure (d)) according to the present invention, (in the range of 10 GHz to 40 GHz), the Line Loss per 1 mm (S21) is an ideal strip line structure (ie, structure (a)) On the other hand, the optimized grade transmission line structure of structure (d) has an insertion loss characteristic of 15% @10GHz, 30% @28GHz, 32% @ by frequency compared to the grade transmission line structure of structure (c). It can be seen that it is improved by 38.5GHz.

Meanwhile, FIG. 12 shows insertion loss characteristics for each frequency in Structure (C) of the present invention. On the other hand, Figure 13 shows the insertion loss characteristics for each frequency in the structure (D) of the present invention.

10(c) and 12, when the connection points of the first and second grade grounds 1121 and 1123 are the same, even if the offset point according to the connection point of the grade transmission line 1122 is changed, reflection by frequency The coefficient characteristic change still occurs.

In FIG. 12, the meaning of'LINE_MOVE' indicates an offset distance according to the connection point of the grade transmission line 1122 compared to the connection point of the first and second grade grounds 1121 and 1123.

Specifically, in the case of structure (c), since the alignment between the vias of the graded ground is the same, an asymmetric section occurs in the height between the strip line and the ground. Accordingly, a change in the impedance value occurs, and in particular, the Real Impedance cannot be maintained at a value around 50 ohm and is lowered. An impedance mismatch occurs according to the change in the impedance value, and thus additional insertion loss may occur.

On the other hand, in the case of structure (d), the gap (thickness) between the strip line and the graded ground is maintained almost constant because the via connection point of the graded ground is different. Accordingly, the change in the impedance value is reduced, and the real impedance is maintained constant around 50 ohms. There is an advantage in that impedance matching characteristics are improved according to such a stable impedance value, and thus additional insertion loss can be minimized.

On the other hand, referring to FIGS. 10(d) and 13, when the connection points of the first and second grade grounds 1121 and 1123 are different, the offset point according to the connection point of the grade transmission line 1122 is optimized to Changes in star reflection coefficient characteristics can be minimized. In FIG. 13, the meaning of'LINE_MOVE' indicates an offset distance according to the connection point of the grade transmission line 1122 compared to the connection point of the first and second grade grounds 1121 and 1123. In addition, the meaning of'GND_MOVE' indicates the distance between the respective via connection points of the first and second grade grounds 1121 and 1123.

Referring to FIG. 13, through the optimized offset distance and the distance between via connection points, it can be seen that the impedance change curve according to the frequency changes from a downward curve to an almost horizontal curve. Accordingly, there is an advantage of minimizing the change in insertion loss characteristics for each frequency through the optimized grade transmission line structure as in structure (d). In addition, referring to FIG. 12, there is an advantage in that the level of insertion loss can be minimized through an optimized grade transmission line structure as shown in structure (d).

In the above, an electronic device having a grade ground and a grade transmission line according to an aspect of the present invention has been described. Hereinafter, an electronic device including a grade ground and a grade transmission line according to another aspect of the present invention will be described. In this regard, the contents described in FIGS. 4 to 12 may be applied to the description of this clause.

In this regard, referring to FIGS. 4 to 12, an electronic device including a multi-layer substrate according to the present invention is provided. The electronic device may be configured to include an antenna 1110, a transceiver circuit 1250, and a multilayer substrate 1100.

The transceiver circuit 1250 is disposed on the multilayer substrate 1100 and may be configured to transmit signals to the antenna 1110 and to receive signals from the antenna 1110. Meanwhile, the multilayer substrate 1100 has a first grade. It is configured to include a ground 1121 and a grade transmission line 1123.

Specifically, the first grade ground 1121 is disposed under the antenna 1100 and is configured such that end portions are connected to each other by the first via 1121c at a first point. On the other hand, the grade transmission line 1123 is configured to be disposed under the first grade ground 1121.

Meanwhile, the multilayer substrate 1100 is disposed under the grade transmission line 1123 and further includes a second grade ground 1122 whose ends are connected to each other by a second via 1122c at a second point different from the first point. Can include. In this regard, the grade transmission lines 1123 may be connected to each other by a third via 1123c at a third point between the first point and the second point.

Meanwhile, the distance d3 between the first grade point of the first grade ground 1121 connected by the first via 1121c and the grade point of the grade transmission line 1123 connected by the third via 1123c is: Can be optimized as In this regard, the distance d3 may be optimized to be 1/2 times the distance d4 between the first grade point and the second grade point. Here, the first grade point is a connection point of the first grade ground 1121 connected by the first via 1121c. Further, the second grade point is a connection point of the second grade ground 1122 connected by the second via 1122c.

Meanwhile, the first grade ground 1121 is configured to include a first ground 1121a and a second ground 1121b. In this regard, an end portion of the second ground 1121b may be connected to an end portion of the first ground 1121a by a first via 1121c, and may be disposed below the first ground 1121a.

In addition, the second grade ground 1122 is configured to include a third ground 1122a and a fourth ground 1122b. In this regard, the end of the fourth ground 1122b may be connected to the end of the third ground 1122a by the second via 1122c, and may be disposed below the third ground 1122a.

Meanwhile, the grade transmission line 1122 is configured to include a first transmission line 1122a and a second transmission line 1122b. Specifically, the first transmission line 1122a is configured to be disposed under the first ground 1121. In addition, the second transmission line 1122b is configured to be disposed below the first transmission line 1122a.

Meanwhile, the first and second transmission lines 1122a and 1122b may be connected to the transceiver circuit 1250 by different vias. Specifically, the first transmission line 1122a may be connected to the transceiver circuit 1250 and a first signal via 1124a. In addition, the second transmission line 1122b may be connected to the antenna 1110 and the second signal via 1124b. Accordingly, there is an advantage that a signal can be transmitted in an optimized form with a minimum insertion loss between the antenna 1110 and the transceiver circuit 1250 by the first and second transmission lines 1122a and 1122b.

In addition, there is an advantage that distances d1 and d2 from the antenna 1110 and the transceiver circuit 1250 to the lower ground can be optimized in terms of bandwidth and/or radiation efficiency according to a corresponding frequency band.

In the above, an electronic device having a grade ground and a grade transmission line according to the present invention has been described. The technical effects of an electronic device having such a grade ground and a grade transmission line will be described as follows.

According to the present invention, there is an advantage that low loss transmission characteristics can be obtained through a symmetrical grade ground and a grade transmission line in a millimeter wave band.

In addition, according to the present invention, there is an advantage in that it is possible to obtain a low loss transmission characteristic between a plurality of antennas disposed on or below a multilayer substrate and a transmission/reception unit circuit.

In addition, according to the present invention, while improving antenna bandwidth characteristics and radiation efficiency characteristics, there is an advantage in that a low loss transmission characteristic between a plurality of antennas and a transceiver circuit can be obtained.

Further scope of applicability of the present invention will become apparent from the detailed description below. However, since various changes and modifications within the spirit and scope of the present invention can be clearly understood by those skilled in the art, specific embodiments such as the detailed description and preferred embodiments of the present invention should be understood as being given by way of example only.

In connection with the above-described present invention, designing and driving of a transmitting unit including a power amplifier and a transceiver, a receiving unit including a low-noise amplifier, and an RFIC can be implemented as computer-readable codes on a medium on which a program is recorded. The computer-readable medium includes all types of recording devices storing data that can be read by a computer system. Examples of computer-readable media include HDD (Hard Disk Drive), SSD (Solid State Disk), SDD (Silicon Disk Drive), ROM, RAM, CD-ROM, magnetic tape, floppy disk, optical data storage device, etc. There is also a carrier wave (eg, transmission over the Internet). In addition, the computer may include the control unit 180 of the terminal. Therefore, the detailed description above should not be construed as restrictive in all respects and should be considered as illustrative. The scope of the present invention should be determined by rational interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention.

Claims (20)

1. In the electronic device having a multi-layer substrate (multi-layer substrate),

   antenna; And

   A multilayer substrate having a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers is provided, and

   The multilayer substrate,

   A first graded ground disposed under the antenna and having end portions connected to each other by a first via at a first point; And

   And a second grade ground disposed below the first grade ground and having ends connected to each other by a second via at a second point different from the first point.
2. The method of claim 1,

   A transceiver circuitry disposed on the multilayer substrate and configured to transmit a signal to the antenna and to receive a signal from the antenna; And

   The electronic device further comprises a grade transmission line disposed between a lower portion of the first grade ground and an upper portion of the second grade ground.
3. The method of claim 2,

   The grade transmission lines are connected to each other by a third via at a third point between the first point and the second point.
4. The method of claim 2,

   The first grade ground,

   First ground; And

   An electronic device comprising a second ground having an end connected to the end of the first ground by the first via and disposed below the first ground.
5. The method of claim 4,

   The second grade ground,

   Third ground; And

   An electronic device comprising: a fourth ground having an end connected to the end of the third ground by the second via and disposed below the first ground.
6. The method of claim 5,

   The grade transmission line,

   A first transmission line disposed under the first ground; And

   An electronic device comprising a second transmission line disposed below the first transmission line.
7. The method of claim 6,

   A distance d3 between a first grade point of the first grade ground connected by the first via and a grade point of the grade transmission line connected by the third via,

   The electronic device, characterized in that it is 1/2 times the distance (d4) between the first grade point and the second grade point of the second grade ground connected by the second via.
8. The method of claim 6,

   The first transmission line is connected to the transmission/reception unit circuit through a first signal via,

   The second transmission line is connected to the antenna by a second signal via,

   The electronic device, wherein a signal is transmitted between the antenna and the transceiver circuit through the first and second transmission lines.
9. The method of claim 6,

   The first transmission line is connected by a first antenna and a first signal via,

   The second transmission line is connected by a second antenna and a second signal via,

   The electronic device, wherein the first antenna and the second antenna operate in different frequency bands.
10. The method of claim 8,

    The electronic device, wherein a thickness (d2) between the antenna and the second ground is formed to be thicker than a thickness (d1) between the transceiver circuit and the first ground.
11. The method of claim 8,

    The electronic device, wherein the thickness (d2) between the transceiver circuit and the second ground is formed to be thicker than the thickness (d1) between the antenna and the first ground.
12. The method of claim 9,

    The thickness (d2) between the second antenna and the second ground is formed thicker than the thickness (d1) between the first antenna and the first ground,

    The electronic device, wherein the first antenna operates in a higher frequency band than the second antenna.
13. The method of claim 8,

    The antenna and the transceiver circuit are disposed on the front layer of the multilayer substrate,

    The electronic device, characterized in that the second signal via is connected to a center area of the antenna.
14. The method of claim 12,

    The first and second antennas are disposed on the front layer of the multilayer substrate,

    The transceiver circuit is disposed on the rear layer of the multilayer substrate,

    The first transmission line and the second transmission line are connected to the transmission/reception unit circuit by a third signal via and a fourth signal via.
15. In the electronic device having a multi-layer substrate (multi-layer substrate),

    antenna;

    A transceiver circuitry disposed on the multilayer substrate and configured to transmit a signal to the antenna and to receive a signal from the antenna; And

    A multilayer substrate having a front layer, a back layer, a plurality of middle layers, and a plurality of ground layers is provided, and

    The multilayer substrate,

    A first graded ground disposed under the antenna and having end portions connected to each other by a first via at a first point; And

    An electronic device comprising a grade transmission line disposed under the first grade ground.
16. The method of claim 15,

    The multilayer substrate,

    An electronic device comprising: a second grade ground disposed under the grade transmission line and having ends connected to each other by a second via at a second point different from the first point.
17. The method of claim 15,

    The grade transmission lines are connected to each other by a third via at a third point between the first point and the second point.
18. The method of claim 17,

    A distance d3 between a first grade point of the first grade ground connected by the first via and a grade point of the grade transmission line connected by the third via,

    The electronic device, characterized in that it is 1/2 times the distance (d4) between the first grade point and the second grade point of the second grade ground connected by the second via.
19. The method of claim 16,

    The first grade ground,

    First ground; And

    An end portion is connected to an end portion of the first ground by the first via, and includes a second ground disposed below the first ground,

    The second grade ground,

    Third ground; And

    An electronic device comprising: a fourth ground having an end connected to the end of the third ground by the second via and disposed below the first ground.
20. The method of claim 16,

    The grade transmission line,

    A first transmission line disposed under the first ground; And

    Including a second transmission line disposed below the first transmission line,

    The first transmission line is connected to the transmission/reception unit circuit through a first signal via,

    The second transmission line is connected to the antenna by a second signal via,

    The electronic device, wherein a signal is transmitted between the antenna and the transceiver circuit through the first and second transmission lines.

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