WO2020238480A1 - Light emitting unit and manufacturing method therefor, and display device - Google Patents

Light emitting unit and manufacturing method therefor, and display device Download PDF

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Publication number
WO2020238480A1
WO2020238480A1 PCT/CN2020/085710 CN2020085710W WO2020238480A1 WO 2020238480 A1 WO2020238480 A1 WO 2020238480A1 CN 2020085710 W CN2020085710 W CN 2020085710W WO 2020238480 A1 WO2020238480 A1 WO 2020238480A1
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WIPO (PCT)
Prior art keywords
light
layer
emitting unit
emitting
flat
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PCT/CN2020/085710
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French (fr)
Chinese (zh)
Inventor
孙海雁
张晓晋
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京东方科技集团股份有限公司
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Publication of WO2020238480A1 publication Critical patent/WO2020238480A1/en

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/841Self-supporting sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/854Arrangements for extracting light from the devices comprising scattering means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/856Arrangements for extracting light from the devices comprising reflective means
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/858Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a light-emitting unit, a manufacturing method thereof, and a display device.
  • An organic light-emitting diode (OLED) display device generally includes a base substrate, and an anode layer, a first organic layer, a light-emitting layer, a second organic layer, and a metal electrode layer sequentially disposed on the base substrate.
  • the first organic layer may include a hole injection layer and a hole transport layer
  • the second organic layer may include an electron transport layer and an electron injection layer.
  • the anode layer is connected with the positive pole of the external power source
  • the metal electrode layer is connected with the negative pole of the external power source.
  • the present disclosure provides a light emitting unit, a manufacturing method thereof, and a display device.
  • the technical solutions are as follows:
  • a light-emitting unit comprising: a stacked first electrode layer, a light-emitting layer, and a second electrode layer;
  • the light emitting unit further includes: a flat layer and a light adjusting structure
  • the flat layer is located between at least one of the first electrode layer and the second electrode layer and the light-emitting layer;
  • the light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure, and the light adjustment structure satisfies any one or a combination of the following: the light adjustment structure is located inside the flat layer, And, the light adjusting structure is located on a side of the flat layer away from the light emitting layer.
  • the flat layer includes any one or a combination of the following:
  • a first flat layer located between the first electrode layer and the light-emitting layer
  • a second flat layer located between the second electrode layer and the light-emitting layer.
  • the dielectric constant of the light adjustment structure is greater than or equal to the dielectric constant of the flat layer.
  • the light adjustment structure is a scattering particle, and the scattering particle is mixed in the flat layer.
  • the structure of the scattering particles mixed in the flat layer is any one or a combination of the following: a spherical structure, a prism structure, a prism structure, a truncated cone structure, a cylindrical structure, and a conical structure.
  • the material of the scattering particles mixed in the flat layer is any one or a combination of the following: resin, silicon dioxide, titanium dioxide and zirconium dioxide.
  • the light adjustment structure includes a light adjustment layer, and a side of the light adjustment layer close to the light-emitting layer has a plurality of convex structures.
  • the protrusion structure is located near the orthographic projection of the surface of the light-emitting layer on the light-emitting layer, and is located inside the orthographic projection of the surface of the protrusion structure away from the light-emitting layer on the light-emitting layer .
  • the structure of the convex structure distributed on the side of the light adjustment layer close to the light-emitting layer is any one or a combination of the following: a hemispherical structure, a prism structure, a prism structure, a truncated cone structure, and a cylinder Structure, pyramid structure and cone structure.
  • the light emitting unit further includes: an injection layer located between the flat layer and the light emitting layer, and the injection layer is used for injecting charged particles into the light emitting layer.
  • the first electrode layer is used to connect to the first pole of the AC power source
  • the second electrode layer is used to connect to the second pole of the AC power source
  • the material of the flat layer is an insulating material.
  • the material of the flat layer is any one or a combination of the following: polyvinylpyrrolidone, polyvinylidene fluoride, silicon dioxide, and hafnium dioxide.
  • the thickness of the flat layer is greater than or equal to 100 nanometers.
  • At least one of the material of the first electrode layer and the material of the second electrode layer is an organic material.
  • a method for manufacturing a light-emitting unit includes:
  • the flat layer is located between at least one of the first electrode layer and the second electrode layer and the light-emitting layer;
  • the light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure, and the light adjustment structure satisfies any one or a combination of the following: the light adjustment structure is located inside the flat layer, And, the light adjusting structure is located on a side of the flat layer away from the light emitting layer.
  • the forming a first electrode layer, a light emitting layer, a second electrode layer, a flat layer, and a light adjusting structure on the base substrate includes:
  • the second electrode layer is formed on the base substrate on which the second light adjustment layer is formed.
  • a display device in another aspect, includes the light-emitting unit according to any one of the first aspects.
  • the display device further includes: a transparent cover plate covering the surface of the light-emitting unit, the transparent cover plate is used to protect the light-emitting unit, and the transparent cover plate is away from the side of the light-emitting unit
  • the roughness of the surface is greater than the roughness of the surface of the transparent cover near the light-emitting unit.
  • the surface of the transparent cover plate on the side away from the light-emitting unit has multiple convex structures or multiple concave structures.
  • FIG. 1 is a schematic structural diagram of a light-emitting unit provided by an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 3 is a schematic structural diagram of another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 4 is a schematic structural diagram of still another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 5 is a schematic structural diagram of yet another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural diagram of still another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 7 is a schematic structural diagram of yet another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 8 is a schematic structural diagram of still another light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 9 is a flowchart of a method for manufacturing a light-emitting unit according to an embodiment of the present disclosure.
  • FIG. 10 is a flowchart of another method for manufacturing a light-emitting unit provided by an embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of a structure after forming a first light adjustment layer on a base substrate formed with a first electrode layer according to an embodiment of the present disclosure
  • FIG. 12 is a schematic diagram of a structure after forming a second flat layer on a base substrate with a second injection layer provided by an embodiment of the present disclosure
  • FIG. 13 is a flowchart of another method for manufacturing a light-emitting unit provided by an embodiment of the present disclosure.
  • An OLED display device generally includes an anode layer, a first organic layer, a light-emitting layer, a second organic layer, and a metal electrode layer sequentially stacked on a glass substrate.
  • the first organic layer may include a hole injection layer and a hole transport layer
  • the second organic layer may include an electron transport layer and an electron injection layer.
  • the anode layer is connected with the positive pole of the external power source
  • the metal electrode layer is connected with the negative pole of the external power source.
  • the electroluminescence process of the OLED display device is: the electrons in the external power supply are injected from the metal electrode layer and transmitted to the light-emitting layer through the first organic layer, and the holes in the external power supply are injected from the anode layer and pass through the second organic layer.
  • the layer is transported to the light-emitting layer, so that electrons and holes recombine in the light-emitting layer to form excitons, and the light-emitting layer generates photons under the excitation of the excitons, so that the light-emitting layer emits light.
  • the more excitons formed in the light-emitting layer, the more photons generated, and the more light emitted by the light-emitting layer are transported to the light-emitting layer, so that electrons and holes recombine in the light-emitting layer to form excitons, and the light-emitting layer generates photons under the excitation of the excitons, so that the light-emitting layer emits
  • the OELD display device usually has four light transmission modes, namely: a surface plasmon mode, a waveguide mode, a substrate mode, and a radiation mode.
  • the surface plasmon mode is a non-luminous mode formed by the resonance of photons and surface electrons of the metal electrode layer.
  • the waveguide mode is a non-luminous mode formed between the organic layer (such as the hole injection layer and the hole transport layer, etc.) and the anode layer due to total reflection. Because of the total reflection of the substrate mode, the light is consumed in the non-luminous mode formed by the glass substrate.
  • the radiation mode is the luminous mode in which light is radiated into the air.
  • the light radiated into the air through the radiation mode accounts for about 20% of the light emitted by the light-emitting layer, that is, only 20% of the light emitted by the light-emitting layer is radiated into the air by the OLED display device, and the remaining light is all It is consumed in the film layer in the display device, resulting in low light extraction efficiency of the OLED display device.
  • the light extraction efficiency is the proportion of the amount of light radiated into the air from the OLED display device in the total amount of light emitted by the light-emitting layer.
  • the light emitting unit 1 can improve the light extraction efficiency of the light emitting unit.
  • the light emitting unit 1 may include: a first electrode layer 11, a light emitting layer 12 and a second electrode layer 13 which are stacked.
  • the light emitting unit 1 may further include: a flat layer 14 and a light adjusting structure 15.
  • the flat layer 14 is located between at least one of the first electrode layer 11 and the second electrode layer 13 and the light-emitting layer 12. That is, the flat layer 14 includes any one or more of the following: a first flat layer 141 located between the first electrode layer 11 and the light-emitting layer 12; and, between the second electrode layer 13 and the light-emitting layer 12 The second flat layer 142.
  • the first flat layer 141 is used to increase the distance between the first electrode layer 11 and the light emitting layer 12.
  • the second flat layer 142 is used to increase the distance between the second electrode layer 13 and the light emitting layer 12.
  • 1 is a schematic diagram of a first flat layer 141 between the light-emitting layer 12 and the first electrode layer 11.
  • the light adjusting structure 15 is used to change the transmission direction of the light emitted to the surface of the light adjusting structure 15.
  • the light adjusting structure 15 satisfies any one or a combination of the following: the light adjusting structure 15 is located inside the flat layer 14, and the light adjusting structure 15 is located outside the flat layer 14 on a side away from the light emitting layer 12.
  • 1 is a schematic diagram of the light adjusting structure 15 located on the side of the first flat layer 141 away from the light emitting layer 12.
  • the light-emitting unit provided by the embodiments of the present disclosure includes a flat layer.
  • the distance between the light-emitting layer and the electrode layer on both sides of the flat layer is increased, and the distance between the light-emitting layer and the electrode layer is reduced.
  • the amount of photons in which the surface electrons resonate reduces the amount of light consumed through the surface plasma mode, increases the amount of light emitted from the light-emitting unit into the air, and thereby improves the light-emitting efficiency of the light-emitting unit.
  • the light-emitting unit further includes a light-regulating structure
  • the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
  • the dielectric constant of the light adjustment structure may be greater than or equal to the dielectric constant of the flat layer.
  • the dielectric constant of the flat layer mixed with the light regulation structure is increased relative to the dielectric constant of the flat layer.
  • the first electrode layer and the second electrode layer are connected to an external power source, an electric field will be generated between the first electrode layer and the second electrode layer. If the dielectric constant of the flat layer is large, the flat layer's effect on the first electrode layer can be reduced.
  • the influence of the field strength of the electric field generated by the second electrode layer makes the field strength of the electric field generated by the first electrode layer and the second electrode layer larger, which can accelerate the movement rate of electrons and holes injected into the light-emitting unit, so that More excitons can be generated in the light-emitting layer per unit time, so that the light-emitting layer can emit more light.
  • the position of the flat layer is different, and the embodiments of the present disclosure take the following several implementation ways as examples for description.
  • the flat layer includes the first flat layer 141. As shown in FIG. 1, the first flat layer 141 is located between the first electrode layer 11 and the light emitting layer 12. Moreover, FIG. 1 is a schematic diagram of the light adjusting structure 15 located on the side of the first flat layer 141 away from the light emitting layer.
  • the amount of photons that resonate with the surface electrons of the metal electrode is negatively related to the target distance, which is the distance between the light-emitting layer and the metal electrode.
  • the target distance which is the distance between the light-emitting layer and the metal electrode.
  • the reduction of the light-emitting layer reduces the amount of light consumed when the light emitted by the light-emitting layer is transmitted between the light-emitting layer and the first electrode layer, increases the amount of light injected into the air from the light-emitting unit, and improves the light-emitting efficiency of the light-emitting unit.
  • the flat layer includes the second flat layer 142. As shown in FIG. 2, the second flat layer 142 is located between the second electrode layer 13 and the light emitting layer 12. In addition, FIG. 2 is a schematic diagram of the light adjusting structure 15 located in the second flat layer 142.
  • the arrangement of the second flat layer 142 increases the distance between the second electrode layer 13 and the light-emitting layer 12, reduces the amount of photons that resonate with the surface electrons of the second electrode layer 13, that is, reduces the amount of light emitted by the light-emitting layer.
  • the amount of light consumed during transmission between the light-emitting layer and the second electrode layer increases the amount of light emitted from the light-emitting unit 1 into the air, thereby increasing the light-emitting efficiency of the light-emitting unit 1.
  • the flat layer includes a first flat layer 141 and a second flat layer 142.
  • the first flat layer 141 is located between the first electrode layer 11 and the light-emitting layer 12
  • the second flat layer 142 is located between the second electrode layer 13 and the light-emitting layer 12.
  • FIG. 2 is a schematic diagram of one light adjusting structure 15 located on the side of the first flat layer 141 away from the light emitting layer 12, and another light adjusting structure 15 located on the side of the second flat layer 142 away from the light emitting layer 12.
  • the distance between the first electrode layer 11 and the light-emitting layer 12 is increased, the amount of photons that resonate with the surface electrons of the first electrode layer 11 is reduced, and the second is increased.
  • the distance between the electrode layer 13 and the light-emitting layer 12 reduces the amount of photons that resonate with the surface electrons of the second electrode layer 13, so that the amount of light emitted from the light-emitting unit 1 into the air increases, thereby increasing the light-emitting unit 1.
  • the light output efficiency since the distance between the first electrode layer 11 and the light-emitting layer 12 is increased, the amount of photons that resonate with the surface electrons of the first electrode layer 11 is reduced, and the second is increased.
  • the light adjustment structure may have multiple setting manners.
  • the embodiments of the present disclosure take the following two cases as examples for description.
  • the light adjustment structure is a scattering particle, and the scattering particles are mixed in the flat layer 14.
  • the first flat layer 141 when the first flat layer 141 exists between the light-emitting layer 12 and the first electrode layer 11, the first flat layer 141 may be mixed with scattering particles.
  • the second flat layer 142 When there is a second flat layer 142 between the light emitting layer 12 and the second electrode layer 13, the second flat layer 142 may be mixed with scattering particles.
  • the first flat layer 141 Scattering particles 151 may be mixed in both and the second flat layer 142.
  • the other film layer may be a film layer adjacent to the flat layer mixed with the scattering particles.
  • the other film layer may be the first electrode layer 11.
  • the scattering particles 151 may be uniformly mixed in the flat layer 14. In this way, the scattering particles 151 located at different positions in the flat layer 14 can scatter the light emitted to the surface of the scattering particles 151, so that the incident angles of the light emitted from different positions of the flat layer to other layers are changed. , So that the amount of light incident on different positions of the other film layers are increased. In addition, the amount of light entering the air from different positions of the light-emitting unit can be approximately the same, which improves the uniformity of light emitted by the light-emitting unit.
  • the shape of the scattering particles 151 can be set according to actual needs.
  • the structure of the scattering particles 151 mixed in the flat layer 14 may be one or a combination of the following: spherical structure, prism structure, prismatic structure, truncated truncated structure, cylindrical structure, conical structure, and the like.
  • Fig. 4 is a schematic diagram of the shape of the scattering particles as a conical structure.
  • the material of the scattering particles 151 mixed in the flat layer 14 may be any one or a combination of the following: organic materials such as resin, inorganic materials such as silicon dioxide SiO2, titanium dioxide TiO2, and zirconium dioxide ZrO2.
  • organic materials such as resin
  • inorganic materials such as silicon dioxide SiO2, titanium dioxide TiO2, and zirconium dioxide ZrO2.
  • the size of the scattering particles can be set according to actual needs. For example, the size of the scattering particles can be on the order of nanometers.
  • the light-regulating structure is a light-regulating layer
  • the side of the light-regulating layer close to the light-emitting layer 12 has a plurality of convex structures
  • the light-regulating layer is located on the flat layer away from the light-emitting layer 12 One side.
  • the side of the first flat layer 141 away from the light-emitting layer 12 may be provided with a light adjustment layer (for easy distinction, it is called Is the first light adjustment layer).
  • the side of the second flat layer 142 away from the light-emitting layer 12 may be provided with a light adjustment layer (for easy distinction, it is called the second light Adjustment layer). As shown in FIG.
  • the light-regulating layer has a convex structure on the side close to the light-emitting layer 12
  • part of the light emitted to the surface of the convex structure can be refracted on the surface of the convex structure, so that when the light is irradiated to the film layer adjacent to the light-regulating layer
  • the incident angle of the light is changed, and after sequential or multiple refraction and/or reflection, the incident angle of the light irradiating the surface of the other film layer is smaller than the total reflection angle of the light, destroying the total reflection condition of the light, so that the light can pass
  • the refraction of light is emitted from the adjacent film layer, increasing the amount of light emitted from the adjacent film layer.
  • the arrangement of the light adjustment layer reduces the amount of light that undergoes total reflection, reduces the amount of light consumed through the waveguide mode, increases the amount of light emitted by the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
  • the orthographic projection of the surface of the raised structure close to the light-emitting layer 12 on the light-emitting layer 12 may be located inside the orthographic projection of the surface of the raised structure away from the light-emitting layer 12 on the light-emitting layer 12.
  • the orthographic projection of the surface of the raised structure close to the light-emitting layer 12 on the light-emitting layer 12 coincides with the orthographic projection of the surface of the raised structure far away from the light-emitting layer 12 on the light-emitting layer 12, which is not limited in the embodiment of the present disclosure. .
  • the convex structure on the first light adjustment layer 152 is close to the first flat layer 141 in the orthographic projection M of the first flat layer 141, and the convex structure is located on the surface away from the first flat layer 141.
  • the angle between the side surface of the convex structure on the first light adjustment layer 152 and the flat layer is less than 90 degrees, which increases the surface area of the convex structure for receiving light, so that more light can enter Into the convex structure and refract to the first electrode layer, the light emitted to the first electrode layer is further increased.
  • the surface of the convex structure on the second light adjustment layer 153 close to the second flat layer 142 is in the orthographic projection E of the second flat layer 142, and the surface of the convex structure away from the second flat layer 142 is located in the second flat layer.
  • the inside of the orthographic projection F on the layer 142 can also refract more light to the first electrode layer.
  • the structure of the convex structure distributed on the side of the light adjustment layer close to the light-emitting layer 12 may be any one or a combination of the following: hemispherical structure, prism structure, prism structure, truncated truncated structure, cylindrical structure, The pyramid structure and the conical structure, etc., are not limited in the embodiment of the present disclosure.
  • 5 is a schematic diagram of the convex structure being a truncated cone structure
  • FIG. 6 is a schematic diagram of the convex structure being a hemispherical structure
  • FIG. 7 is a schematic diagram of the convex structure being a conical structure.
  • the plurality of raised structures may be evenly distributed.
  • the uniformly distributed multiple convex structures can reflect and refract light in a more balanced manner, can further increase the amount of light entering the air, and further increase the light output efficiency of the light emitting unit.
  • the amount of light entering the air from different positions of the light-emitting unit can be approximately the same, which improves the uniformity of light emitted by the light-emitting unit.
  • the above three implementations of the flat layer can be arbitrarily combined with the two arrangements of the light adjustment structure to form light-emitting units with different structures.
  • the surface of the film layer in contact with the convex structure has a convex structure matching the convex structure on the light adjustment layer.
  • the side of the first flat layer 141 away from the light-emitting layer has a convex structure that matches the convex structure on the light adjustment layer
  • the side of the second flat layer 142 away from the light-emitting layer has a convex structure that matches the light-emitting layer.
  • the raised structure on the layer matches the raised structure.
  • the material of the first electrode layer and/or the material of the second electrode layer may be organic materials, that is, the materials of the first electrode layer and the second electrode layer may both be organic materials, or the first electrode
  • the material of any one of the layer and the second electrode layer may be an organic material.
  • the material of any electrode layer is an organic material, since there are no free electrons on the surface of the organic material, the photons transmitted to the surface of any electrode layer will not resonate with the electrons, which effectively reduces the plasmon mode passing through the surface. The amount of light consumed further increases the amount of light emitted by the light-emitting unit into the air.
  • the light emitting unit may further include: an injection layer.
  • the injection layer is located between the flat layer and the light-emitting layer, and the injection layer is used to inject charged particles into the light-emitting layer.
  • the charged particles can be electrons or holes.
  • FIG. 8 there is a first injection layer 161 between the first flat layer 141 and the light emitting layer 12, and a second injection layer 162 is provided between the second flat layer 142 and the light emitting layer 12.
  • the first injection layer 161 may be used to inject electrons into the light emitting layer 12, and the second injection layer 162 may be used to inject holes into the light emitting layer 12.
  • the first injection layer 161 may be used to inject holes into the light emitting layer 12, and the second injection layer 162 may be used to inject electrons into the light emitting layer 12.
  • the first injection layer 161 may be used to inject electrons and holes into the light-emitting layer 12, and the second injection layer 162 may be used to inject electrons and holes into the light-emitting layer 12.
  • the embodiment of the present disclosure does not limit this.
  • the injection layer can be used to inject charged particles into the light-emitting layer, instead of using an external power supply to inject charged particles into the light-emitting layer.
  • it can reduce the energy consumption caused by the use of an external power source, and on the other hand, it reduces the amount of charged particles.
  • the probability of staying in the electrode layer and flat layer passing by the light-emitting layer improves the utilization rate of charged particles.
  • the external power source when injecting charged particles into the light-emitting layer through an external power source, the external power source may be a DC power source or an AC power source. And when the light-emitting unit includes an injection layer, the external power source may be an AC power source. In this case, it is equivalent to using an AC driving method to drive the light-emitting unit.
  • the first electrode layer 11 may be connected to the first pole of the AC power source 2
  • the second electrode layer 13 may be connected to the second pole of the AC power source.
  • the material molecules of the film layer will be in an unstable charged state, making it prone to irreversible chemical changes, leading to the The material of the film layer is deteriorated (that is, the film layer is degraded), which in turn affects the service life of the film layer.
  • the light-emitting unit in the embodiment of the present disclosure adopts an AC drive mode.
  • the principle of AC driving to reduce the deterioration of the film will be described.
  • the direction of the electric field formed between the first electrode layer and the second electrode layer is directed from the second electrode layer to the first electrode layer, and under the action of the electric field, the electric field in the first injection layer.
  • the electrons move from the first injection layer to the light emitting layer, and the holes in the second injection layer move from the second injection layer to the light emitting layer, so that the electrons and holes can recombine in the light emitting layer to form excitons, so that the light emitting layer emits light.
  • the direction of the current of the AC power source changes, and the direction of the electric field formed between the first electrode layer and the second electrode layer is directed from the first electrode layer to the second electrode layer, and the Under the action, the electrons in the light-emitting layer that are not recombined with holes can move from the light-emitting layer to the first injection layer, and then return to the first injection layer.
  • the holes in the light-emitting layer that are not recombined with electrons are injected from the light-emitting layer to the second The layer moves and then returns to the second injection layer.
  • the first stage and the second stage of the AC drive continuously alternately cycle to drive the light-emitting unit to emit light. In this process, the direction of movement of electrons and holes exhibits periodic changes, thus reducing the probability of the accumulation of charged particles in the film, thereby reducing the probability of film degradation due to the accumulation of charged particles in the film .
  • the material of the flat layer may be an insulating material.
  • the flat layer can block charged particles from entering the electrode layer, so that as many charged particles as possible enter the light-emitting layer, ensuring the amount of charged particles provided by the injection layer to the light-emitting layer, thereby ensuring the luminous effect.
  • the material of the flat layer can be any one or a combination of the following: polyvinyl pyrrolidone (PVP), polyvinylidene fluoride (PVDF) and other organic materials, silicon dioxide SiO 2 and Hafnium dioxide HfO 2 and other inorganic materials.
  • PVP polyvinyl pyrrolidone
  • PVDF polyvinylidene fluoride
  • the thickness of the flat layer can be selected according to actual needs.
  • the thickness of the flat layer may be greater than or equal to 100 nanometers.
  • the light-emitting unit provided by the embodiments of the present disclosure includes a flat layer.
  • the distance between the light-emitting layer and the electrode layer on both sides of the flat layer is increased, and the distance between the light-emitting layer and the electrode layer is reduced.
  • the amount of photons in which the surface electrons resonate reduces the amount of light consumed through the surface plasma mode, increases the amount of light emitted from the light-emitting unit into the air, and thereby improves the light-emitting efficiency of the light-emitting unit.
  • the light-emitting unit further includes a light-regulating structure
  • the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
  • the embodiment of the present disclosure provides a method for manufacturing a light-emitting unit, which is used to manufacture the light-emitting unit in the above-mentioned embodiments. As shown in FIG. 9, the method for manufacturing the light-emitting unit includes:
  • FIG. 9 is a flowchart of a method for manufacturing a light-emitting unit according to an embodiment of the disclosure. As shown in FIG. 9, the manufacturing method of the light-emitting unit includes:
  • Step 1001 Provide a base substrate.
  • Step 1002 forming a first electrode layer on the base substrate.
  • Step 1003 using a flat layer material doped with a light adjusting material, and forming a first flat layer including a light adjusting structure on the base substrate on which the first electrode layer is formed.
  • the first flat layer is used to increase the distance between the first electrode layer and the light emitting layer
  • the light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure.
  • Step 1004 forming a light emitting layer on the base substrate on which the first flat layer is formed.
  • Step 1005 Using a flat layer material doped with a light-regulating material, a second flat layer including a light-regulating structure is formed on the base substrate on which the light-emitting layer is formed.
  • the second flat layer is used to increase the distance between the second electrode layer and the light-emitting layer.
  • Step 1006 forming a second electrode layer on the base substrate on which the second flat layer is formed.
  • the light-emitting unit manufacturing method includes a flat layer.
  • the gap between the light-emitting layer and the electrode layer on both sides of the flat layer is increased.
  • the distance reduces the amount of photons that resonate with the surface electrons of the electrode layer, that is, reduces the amount of light consumed through the surface plasma mode, increases the amount of light injected from the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
  • the light-emitting unit further includes a light-regulating structure
  • the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
  • the base substrate may be a transparent substrate, which specifically may be a substrate made of a transparent and non-metallic material with a certain hardness, such as glass, quartz, transparent resin, or the like.
  • step 1002 methods such as magnetron sputtering, thermal evaporation, or plasma enhanced chemical vapor deposition (PECVD) may be used to deposit a layer of first electrode material with a certain thickness on the base substrate, The first electrode thin film layer is obtained, and then the first electrode thin film layer is patterned through a patterning process to obtain the first electrode layer.
  • one patterning process may include: photoresist coating, exposure, development, etching and photoresist stripping.
  • the thickness of the first electrode material and the first electrode layer can be set according to actual needs.
  • the first electrode material may be indium tin oxide or silver.
  • the first electrode material may be an organic material.
  • the light adjustment material may be doped into the flat layer material first, and then magnetron sputtering, thermal evaporation or PECVD methods are used to deposit a layer with a certain degree on the base substrate on which the first electrode layer is formed.
  • the flat layer material is thick and doped with the light adjustment material to obtain a flat thin film layer, and then the flat thin film layer is patterned through a patterning process to obtain the first flat layer including the light adjustment structure.
  • the material of the first flat layer may be an insulating material.
  • it may be an organic material such as polyvinyl pyrrolidone (PVP) or polyvinylidene fluoride (PVDF).
  • the material of the first flat layer may be an inorganic material such as silicon dioxide SiO 2 or hafnium dioxide HfO 2 .
  • the thickness of the first flat layer can be adjusted according to actual needs. For example, the thickness of the first flat layer may be greater than or equal to 100 nanometers.
  • the light adjusting structure may be scattering particles, that is, the light adjusting material may be scattering particles.
  • the structure of the scattering particles mixed in the first flat layer can be any one or a combination of the following: spherical structure, prism structure, prism structure, truncated truncated structure, cylindrical structure and conical structure.
  • the light-regulating material may be any one or a combination of the following: organic materials such as resin, inorganic materials such as silicon dioxide SiO2, titanium dioxide TiO2, and zirconium dioxide ZrO2.
  • the dielectric constant of the light adjustment structure may be greater than or equal to the dielectric constant of the flat layer.
  • step 1004 methods such as magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of luminescent material with a certain thickness on the base substrate on which the first flat layer is formed to obtain a luminescent thin film layer, and then pass through a pattern The process performs patterning processing on the light-emitting thin film layer to obtain the light-emitting layer.
  • the thickness of the luminescent material and the luminescent layer can be set according to actual needs.
  • the luminescent material may be a quantum hydrazine material.
  • the quantum hydrazine material may be a mixed material of indium gallium nitride (InGaN) and gallium nitride (GaN).
  • the light-regulating material can be doped into the flat layer material first, and then a layer with a certain thickness can be deposited on the base substrate with the light-emitting layer by magnetron sputtering, thermal evaporation or PECVD, etc. And the flat layer material doped with the light adjustment material to obtain a flat thin film layer, and then the flat thin film layer is patterned through a patterning process to obtain a second flat layer including the light adjustment structure.
  • magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of a second electrode material with a certain thickness on the base substrate on which the second flat layer is formed to obtain the second electrode thin film layer, and then The second electrode film layer is patterned through a patterning process to obtain the second electrode layer.
  • the thickness of the second electrode material and the second electrode layer can be set according to actual needs.
  • the second electrode material may be indium tin oxide or silver.
  • the second electrode material may be an organic material.
  • FIG. 10 is a flowchart of another method for manufacturing a light-emitting unit according to an embodiment of the disclosure. As shown in FIG. 10, the manufacturing method of the light-emitting unit includes:
  • Step 1101 Provide a base substrate.
  • step 110 For the implementation manner of step 1101, reference may be made to the implementation manner of step 1001, and details are not described herein in the embodiment of the present disclosure.
  • Step 1102 forming a first electrode layer on the base substrate.
  • step 1102 For the implementation manner of step 1102, reference may be made to the implementation manner of step 1002, and details are not described herein in the embodiment of the present disclosure.
  • Step 1103 forming a first light adjustment layer on the base substrate on which the first electrode layer is formed, and the first light adjustment layer has a plurality of convex structures on the side away from the base substrate.
  • Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of light-regulating material with a certain thickness on the base substrate on which the first electrode layer is formed to obtain the first light-regulating thin film layer, and then through a patterning process The first light adjustment film layer is patterned to obtain the first light adjustment layer, so that the surface of the first light adjustment layer away from the base substrate has a convex structure.
  • the thickness of the light adjustment material and the first light adjustment layer can be set according to actual needs.
  • the light adjusting material may be an organic material such as resin; or, the light adjusting material may be an inorganic material such as silicon dioxide SiO2, titanium dioxide TiO2, or zirconium dioxide ZrO2.
  • the convex structure in the first light adjustment layer is used to change the transmission direction of the light emitted to the surface of the convex structure.
  • the orthographic projection of the surface of the convex structure close to the light-emitting layer on the light-emitting layer is located inside the orthographic projection of the surface of the convex structure away from the light-emitting layer on the light-emitting layer.
  • the convex structures are uniformly distributed on the side of the light adjustment layer close to the light emitting layer.
  • the shape of the convex structure distributed on the side of the light-regulating layer close to the light-emitting layer 12 may be any one or a combination of the following: hemispherical structure, prism structure, prism structure, truncated cone structure, cylindrical structure, pyramid structure And cone structure.
  • the convex structure in the first light adjustment layer 151 is a conical structure.
  • Step 1104 forming a first flat layer on the base substrate on which the first light adjustment layer is formed.
  • Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of flat layer material with a certain thickness on the base substrate on which the first light adjustment layer is formed to obtain the first flat thin film layer, and then through a patterning process The first flat film layer is patterned to obtain the first flat layer.
  • Step 1105 forming a light emitting layer on the base substrate on which the first flat layer is formed.
  • step 1105 For the implementation manner of step 1105, reference may be made to the implementation manner of step 1004, and details are not described herein in the embodiment of the present disclosure.
  • Step 1106 forming a second flat layer on the base substrate on which the light-emitting layer is formed.
  • Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of flat layer material with a certain thickness on the base substrate on which the light-emitting layer is formed to obtain a second flat thin film layer, and then perform a patterning process to the second The flat film layer is patterned to obtain a second flat layer.
  • the second flat layer 142 obtained after the patterning process may be as shown in FIG. 12, and the surface of the second flat layer 142 away from the base substrate has a convex structure.
  • Step 1107 forming a second light adjustment layer on the base substrate on which the second flat layer is formed, and the side of the second light adjustment layer close to the light emitting layer has a plurality of convex structures.
  • Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of light-regulating material with a certain thickness on the base substrate with the second flat layer to obtain the second light-regulating thin film layer, and then through a patterning process
  • the second light adjustment film layer is patterned to obtain a second light adjustment layer, so that the surface of the second light adjustment layer close to the base substrate has a convex structure, and the convex structure on the second light adjustment layer is similar to the second flat surface.
  • the raised structure of the layer surface matches.
  • the convex structure in the second light adjustment layer is used to change the transmission direction of the light emitted to the surface of the convex structure.
  • Step 1108 forming a second electrode layer on the base substrate on which the second light adjustment structure is formed.
  • step 1108 reference may be made to the implementation manner of step 1006, and details are not described herein in the embodiment of the present disclosure.
  • the first flat layer can be selected between the first electrode layer and the light-emitting layer or not according to actual needs. Moreover, when there is no need to provide a first flat layer between the first electrode layer and the light-emitting layer, the above steps 1003 and 1104 can be selected not to be performed, that is, it can be directly formed on the base substrate on which the first light adjustment layer is formed. Luminescent layer. Similarly, the second flat layer can be arranged or not arranged between the second electrode layer and the light-emitting layer according to actual needs.
  • the above steps 1005 and 1106 can be selected not to be performed, that is, the second light adjustment layer can be directly formed on the base substrate on which the light-emitting layer is formed. Floor.
  • the light-emitting unit manufacturing method includes a flat layer.
  • the gap between the light-emitting layer and the electrode layer on both sides of the flat layer is increased.
  • the distance reduces the amount of photons that resonate with the surface electrons of the electrode layer, that is, reduces the amount of light consumed through the surface plasma mode, increases the amount of light injected from the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
  • the light-emitting unit further includes a light-regulating structure
  • the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
  • an injection layer may be provided between the flat layer and the light-emitting layer.
  • the injection layer may include a first injection layer and a second injection layer.
  • the injection layer is used to inject charged particles into the light-emitting layer.
  • the manufacturing method of the light-emitting unit includes:
  • Step 1401 Provide a base substrate.
  • step 140 For the implementation manner of step 1401, reference may be made to the implementation manner of step 1101, and details are not described herein in the embodiment of the present disclosure.
  • Step 1402 forming a first electrode layer on the base substrate.
  • step 1402 For the implementation manner of step 1402, reference may be made to the implementation manner of step 1102, and details are not described in the embodiment of the present disclosure.
  • Step 1403 forming a first light adjustment layer on the base substrate on which the first electrode layer is formed.
  • step 1403 For the implementation manner of step 1403, reference may be made to the implementation manner of step 1103, and details are not described herein in the embodiment of the present disclosure.
  • Step 1404 forming a first flat layer on the base substrate on which the first light adjustment layer is formed.
  • step 1404 For the implementation manner of step 1404, reference may be made to the implementation manner of step 1104, and details are not described herein in the embodiment of the present disclosure.
  • Step 1405 forming a first injection layer on the base substrate on which the first flat layer is formed.
  • Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of the first injection layer material with a certain thickness on the base substrate with the first flat layer to obtain the first injection film layer, and then pass through a patterning process The first injection film layer is patterned to obtain the first injection layer.
  • the material of the first injection layer and the thickness of the first injection layer can be set according to actual needs.
  • the material of the first injection layer may be a P-doped material or an N-doped material.
  • Step 1406 forming a light-emitting layer on the base substrate on which the first injection layer is formed.
  • step 1406 reference may be made to the implementation manner of step 1105, and details are not described herein in the embodiment of the present disclosure.
  • Step 1407 forming a second injection layer on the base substrate on which the light-emitting layer is formed.
  • Magnetron sputtering, thermal evaporation, or PECVD can be used to deposit a layer of material for the second injection layer with a certain thickness on the base substrate with the light-emitting layer to obtain the second injection film layer, and then perform a patterning process on the second injection layer.
  • the second injection film layer is patterned to obtain the second injection layer.
  • the material of the second injection layer and the thickness of the second injection layer can be set according to actual needs.
  • the material of the second injection layer may be a P-doped material or an N-doped material.
  • Step 1408 forming a second flat layer on the base substrate on which the second injection layer is formed.
  • step 1408 For the implementation manner of step 1408, reference may be made to the implementation manner of step 1106, and details are not described herein in the embodiment of the present disclosure.
  • Step 1409 forming a second light adjustment layer on the base substrate on which the second flat layer is formed.
  • step 1409 For the implementation manner of step 1409, reference may be made to the implementation manner of step 1107, and details are not described herein in the embodiment of the present disclosure.
  • Step 1410 forming a second electrode layer on the base substrate on which the second light adjustment layer is formed.
  • step 1410 For the implementation manner of step 1410, reference may be made to the implementation manner of step 1006, and details are not described herein in the embodiment of the present disclosure.
  • step 1403 and step 1409 can be selected not to be performed, and in step 1404 and step 1408, a flat layer material doped with a light adjustment material is used Make a flat layer.
  • the first injection layer can be selected between the first flat layer and the light-emitting layer or not.
  • the above step 1405 can be selected not to be performed, that is, the light emitting layer can be directly formed on the base substrate on which the first flat layer is formed.
  • the second injection layer can be arranged or not arranged between the second flat layer and the light-emitting layer according to actual needs.
  • the above step 1407 can be selected not to be performed, that is, the second flat layer can be directly formed on the base substrate on which the light-emitting layer is formed.
  • the light-emitting unit manufacturing method includes a flat layer.
  • the gap between the light-emitting layer and the electrode layer on both sides of the flat layer is increased.
  • the distance reduces the amount of photons that resonate with the surface electrons of the electrode layer, that is, reduces the amount of light consumed through the surface plasma mode, increases the amount of light injected from the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
  • the light-emitting unit further includes a light-regulating structure
  • the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
  • the embodiments of the present disclosure provide a display device, and the display device includes: the light-emitting unit of any one of the foregoing embodiments.
  • the display device may further include: a transparent cover plate covering the surface of the light emitting unit.
  • the transparent cover is used to protect the light-emitting unit, and the roughness of the surface of the transparent cover on the side away from the light-emitting unit is greater than the roughness of the surface of the transparent cover on the side close to the light-emitting unit.
  • the surface of the transparent cover plate on the side away from the light-emitting unit may have multiple convex structures or concave structures.
  • the light irradiated to the surface of the transparent cover plate on the side away from the light-emitting unit can be The interface of the transparent cover plate away from the light-emitting unit is reflected and refracted, so that the incident angle of light from the transparent cover plate into the air changes, and when the incident angle is smaller than the total reflection angle of the light from the transparent cover plate into the air , The light can be emitted from the transparent cover, and more light can be emitted from the transparent cover, which reduces the amount of light consumed through the substrate mode and increases the amount of light emitted from the display device.
  • the display device may be: liquid crystal panel, electronic paper, organic light-emitting diode (English: Organic Light-Emitting Diode, OLED for short) panel, mobile phone, tablet computer, TV, monitor, notebook computer, digital photo frame, Any device or component with a display function, such as a navigator.
  • OLED Organic Light-Emitting Diode
  • the display device reduces the amount of light consumed through the surface plasma mode by providing a flat layer, and reduces the amount of light consumed through the waveguide mode by providing a light adjustment structure, and by improving the coverage on the light emission
  • the roughness of the transparent cover on the surface of the unit reduces the amount of light consumed through the substrate mode, increases the amount of light injected into the air from the light-emitting unit, and improves the light-emitting efficiency of the light-emitting unit.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
  • at least one refers to one or more than one unless specifically defined otherwise.
  • plurality refers to two or more, unless specifically defined otherwise.

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Abstract

Disclosed is a light emitting unit. A light emitting unit (1) comprises a first electrode layer (11), a light emitting layer (12), and a second electrode layer (13). The light emitting unit (1) further comprises a planarization layer (14) and a light regulating structure (15). The planarization layer (14) is located between at least one of the first electrode layer (11) and the second electrode layer (13) and the light emitting layer (12). The light regulating structure (15) is used for changing a transmission direction of light emitted to the surface of the light regulating structure (15). The light regulating structure (15) satisfies any one or a combination of the following: the light regulating structure (15) is located within the planarization layer (14) and the light regulating structure (15) is located on the side of exterior of the planarization layer (14) away from the light emitting layer (12).

Description

发光单元及其制造方法、显示装置Light emitting unit, manufacturing method thereof, and display device
本公开要求于2019年5月27日提交的申请号为201910448099.4、发明名称为“发光单元及其制造方法、显示装置”的中国专利申请的优先权,其全部内容通过引用结合在本公开中。The present disclosure claims the priority of a Chinese patent application filed on May 27, 2019 with an application number of 201910448099.4 and an invention title of "light emitting unit and its manufacturing method, and display device", the entire content of which is incorporated into the present disclosure by reference.
技术领域Technical field
本公开涉及显示技术领域,特别涉及一种发光单元及其制造方法、显示装置。The present disclosure relates to the field of display technology, and in particular to a light-emitting unit, a manufacturing method thereof, and a display device.
背景技术Background technique
有机电致发光(organic light-emitting diode,OLED)显示装置通常包括衬底基板,以及依次设置在衬底基板上的阳极层、第一有机层、发光层、第二有机层和金属电极层。第一有机层可以包括空穴注入层和空穴传输层,第二有机层可以包括电子传输层和电子注入层。阳极层与外接电源的正极连接,金属电极层与外接电源的负极连接。An organic light-emitting diode (OLED) display device generally includes a base substrate, and an anode layer, a first organic layer, a light-emitting layer, a second organic layer, and a metal electrode layer sequentially disposed on the base substrate. The first organic layer may include a hole injection layer and a hole transport layer, and the second organic layer may include an electron transport layer and an electron injection layer. The anode layer is connected with the positive pole of the external power source, and the metal electrode layer is connected with the negative pole of the external power source.
发明内容Summary of the invention
本公开提供了一种发光单元及其制造方法、显示装置,所述技术方案如下:The present disclosure provides a light emitting unit, a manufacturing method thereof, and a display device. The technical solutions are as follows:
一方面,提供了一种发光单元,所述发光单元包括:层叠的第一电极层、发光层和第二电极层;In one aspect, a light-emitting unit is provided, the light-emitting unit comprising: a stacked first electrode layer, a light-emitting layer, and a second electrode layer;
所述发光单元还包括:平坦层和光调节结构;The light emitting unit further includes: a flat layer and a light adjusting structure;
所述平坦层位于所述第一电极层和所述第二电极层中至少一个与所述发光层之间;The flat layer is located between at least one of the first electrode layer and the second electrode layer and the light-emitting layer;
所述光调节结构用于改变发射至所述光调节结构表面的光的传输方向,所述光调节结构满足以下任一个或多个的组合:所述光调节结构位于所述平坦层的内部,以及,所述光调节结构位于所述平坦层的外部远离所述发光层的一侧。The light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure, and the light adjustment structure satisfies any one or a combination of the following: the light adjustment structure is located inside the flat layer, And, the light adjusting structure is located on a side of the flat layer away from the light emitting layer.
可选的,所述平坦层包括以下任一个或多个的组合:Optionally, the flat layer includes any one or a combination of the following:
位于所述第一电极层与所述发光层之间的第一平坦层;A first flat layer located between the first electrode layer and the light-emitting layer;
以及,位于所述第二电极层与所述发光层之间的第二平坦层。And, a second flat layer located between the second electrode layer and the light-emitting layer.
可选的,所述光调节结构的介电常数大于或等于所述平坦层的介电常数。Optionally, the dielectric constant of the light adjustment structure is greater than or equal to the dielectric constant of the flat layer.
可选的,所述光调节结构为散射粒子,所述散射粒子混合在所述平坦层内。Optionally, the light adjustment structure is a scattering particle, and the scattering particle is mixed in the flat layer.
可选的,混合在所述平坦层内的散射粒子的结构为以下任一种或多种的组合:球状结构、棱台结构、棱柱结构、圆台结构、圆柱结构和圆锥结构。Optionally, the structure of the scattering particles mixed in the flat layer is any one or a combination of the following: a spherical structure, a prism structure, a prism structure, a truncated cone structure, a cylindrical structure, and a conical structure.
可选的,混合在所述平坦层内的散射粒子的材料为以下任一种或多种的组合:树脂、二氧化硅、二氧化钛和二氧化锆。Optionally, the material of the scattering particles mixed in the flat layer is any one or a combination of the following: resin, silicon dioxide, titanium dioxide and zirconium dioxide.
可选的,所述光调节结构包括光调节层,所述光调节层靠近所述发光层的一侧具有多个凸起结构。Optionally, the light adjustment structure includes a light adjustment layer, and a side of the light adjustment layer close to the light-emitting layer has a plurality of convex structures.
可选的,所述凸起结构靠近所述发光层的表面在所述发光层上的正投影,位于所述凸起结构远离所述发光层的表面在所述发光层上的正投影的内部。Optionally, the protrusion structure is located near the orthographic projection of the surface of the light-emitting layer on the light-emitting layer, and is located inside the orthographic projection of the surface of the protrusion structure away from the light-emitting layer on the light-emitting layer .
可选的,分布在所述光调节层靠近所述发光层的一侧的凸起结构的结构为以下任一种或多种的组合:半球结构、棱台结构、棱柱结构、圆台结构、圆柱结构、棱锥结构和圆锥结构。Optionally, the structure of the convex structure distributed on the side of the light adjustment layer close to the light-emitting layer is any one or a combination of the following: a hemispherical structure, a prism structure, a prism structure, a truncated cone structure, and a cylinder Structure, pyramid structure and cone structure.
可选的,所述发光单元还包括:注入层,所述注入层位于所述平坦层与所述发光层之间,所述注入层用于向所述发光层注入带电粒子。Optionally, the light emitting unit further includes: an injection layer located between the flat layer and the light emitting layer, and the injection layer is used for injecting charged particles into the light emitting layer.
可选的,所述第一电极层用于与交流电源的第一极连接,所述第二电极层用于与所述交流电源的第二极连接。Optionally, the first electrode layer is used to connect to the first pole of the AC power source, and the second electrode layer is used to connect to the second pole of the AC power source.
可选的,所述平坦层的材料为绝缘材料。Optionally, the material of the flat layer is an insulating material.
可选的,所述平坦层的材料为以下任一种或多种的组合:聚乙烯吡咯烷酮、聚偏氟乙烯、二氧化硅和二氧化铪。Optionally, the material of the flat layer is any one or a combination of the following: polyvinylpyrrolidone, polyvinylidene fluoride, silicon dioxide, and hafnium dioxide.
可选的,所述平坦层的厚度大于或等于100纳米。Optionally, the thickness of the flat layer is greater than or equal to 100 nanometers.
可选的,所述第一电极层的材料和所述第二电极层中至少一个的材料为有机材料。Optionally, at least one of the material of the first electrode layer and the material of the second electrode layer is an organic material.
另一方面,提供了一种发光单元的制造方法,所述方法包括:In another aspect, a method for manufacturing a light-emitting unit is provided, and the method includes:
提供一衬底基板;Provide a base substrate;
在所述衬底基板上形成第一电极层、发光层、第二电极层、平坦层和光调节结构,得到所述发光单元;Forming a first electrode layer, a light emitting layer, a second electrode layer, a flat layer and a light adjusting structure on the base substrate to obtain the light emitting unit;
其中,所述平坦层位于所述第一电极层和所述第二电极层中至少一个与所述发光层之间;Wherein, the flat layer is located between at least one of the first electrode layer and the second electrode layer and the light-emitting layer;
所述光调节结构用于改变发射至所述光调节结构表面的光的传输方向,所 述光调节结构满足以下任一个或多个的组合:所述光调节结构位于所述平坦层的内部,以及,所述光调节结构位于所述平坦层的外部远离所述发光层的一侧。The light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure, and the light adjustment structure satisfies any one or a combination of the following: the light adjustment structure is located inside the flat layer, And, the light adjusting structure is located on a side of the flat layer away from the light emitting layer.
可选的,所述在所述衬底基板上形成第一电极层、发光层、第二电极层、平坦层和光调节结构,包括:Optionally, the forming a first electrode layer, a light emitting layer, a second electrode layer, a flat layer, and a light adjusting structure on the base substrate includes:
在所述衬底基板上形成所述第一电极层;Forming the first electrode layer on the base substrate;
在形成有所述第一电极层的衬底基板上形成第一光调节层;Forming a first light adjustment layer on the base substrate on which the first electrode layer is formed;
在形成有所述第一光调节层的衬底基板上形成第一平坦层;Forming a first flat layer on the base substrate on which the first light adjustment layer is formed;
在形成有所述第一平坦层的衬底基板上形成所述发光层;Forming the light-emitting layer on a base substrate on which the first flat layer is formed;
在形成有所述发光层的衬底基板上形成第二平坦层,所述平坦层包括所述第一平坦层和所述第二平坦层;Forming a second flat layer on the base substrate on which the light-emitting layer is formed, the flat layer including the first flat layer and the second flat layer;
在形成有所述第二平坦层的衬底基板上形成第二光调节层,所述光调节结构包括所述第一光调节层和所述第二光调节层;Forming a second light adjustment layer on the base substrate on which the second flat layer is formed, and the light adjustment structure includes the first light adjustment layer and the second light adjustment layer;
在形成有所述第二光调节层的衬底基板上形成所述第二电极层。The second electrode layer is formed on the base substrate on which the second light adjustment layer is formed.
再一方面,提供了一种显示装置,所述显示装置包括:第一方面任一所述的发光单元。In another aspect, a display device is provided, and the display device includes the light-emitting unit according to any one of the first aspects.
可选的,所述显示装置还包括:覆盖在所述发光单元表面的透明盖板,所述透明盖板用于保护所述发光单元,且所述透明盖板远离所述发光单元一侧的表面的粗糙度大于所述透明盖板靠近所述发光单元一侧的表面的粗糙度。Optionally, the display device further includes: a transparent cover plate covering the surface of the light-emitting unit, the transparent cover plate is used to protect the light-emitting unit, and the transparent cover plate is away from the side of the light-emitting unit The roughness of the surface is greater than the roughness of the surface of the transparent cover near the light-emitting unit.
可选的,所述透明盖板远离所述发光单元一侧的表面具有多个凸起结构或多个凹陷结构。Optionally, the surface of the transparent cover plate on the side away from the light-emitting unit has multiple convex structures or multiple concave structures.
附图说明Description of the drawings
为了更清楚地说明本公开实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本公开的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly describe the technical solutions in the embodiments of the present disclosure, the following will briefly introduce the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained from these drawings without creative work.
图1是本公开实施例提供的一种发光单元的结构示意图;FIG. 1 is a schematic structural diagram of a light-emitting unit provided by an embodiment of the present disclosure;
图2是本公开实施例提供的另一种发光单元的结构示意图;FIG. 2 is a schematic structural diagram of another light-emitting unit provided by an embodiment of the present disclosure;
图3是本公开实施例提供的又一种发光单元的结构示意图;FIG. 3 is a schematic structural diagram of another light-emitting unit provided by an embodiment of the present disclosure;
图4是本公开实施例提供的再一种发光单元的结构示意图;4 is a schematic structural diagram of still another light-emitting unit provided by an embodiment of the present disclosure;
图5是本公开实施例提供的又一种发光单元的结构示意图;FIG. 5 is a schematic structural diagram of yet another light-emitting unit provided by an embodiment of the present disclosure;
图6是本公开实施例提供的再一种发光单元的结构示意图;FIG. 6 is a schematic structural diagram of still another light-emitting unit provided by an embodiment of the present disclosure;
图7是本公开实施例提供的又一种发光单元的结构示意图;FIG. 7 is a schematic structural diagram of yet another light-emitting unit provided by an embodiment of the present disclosure;
图8是本公开实施例提供的再一种发光单元的结构示意图;FIG. 8 is a schematic structural diagram of still another light-emitting unit provided by an embodiment of the present disclosure;
图9是本公开实施例提供的一种发光单元的制造方法流程图;FIG. 9 is a flowchart of a method for manufacturing a light-emitting unit according to an embodiment of the present disclosure;
图10是本公开实施例提供的另一种发光单元的制造方法流程图;FIG. 10 is a flowchart of another method for manufacturing a light-emitting unit provided by an embodiment of the present disclosure;
图11是本公开实施例提供的一种在形成有第一电极层的衬底基板上形成第一光调节层后的结构示意图;11 is a schematic diagram of a structure after forming a first light adjustment layer on a base substrate formed with a first electrode layer according to an embodiment of the present disclosure;
图12是本公开实施例提供的一种在形成有第二注入层的衬底基板上形成第二平坦层后的结构示意图;12 is a schematic diagram of a structure after forming a second flat layer on a base substrate with a second injection layer provided by an embodiment of the present disclosure;
图13是本公开实施例提供的又一种发光单元的制造方法流程图。FIG. 13 is a flowchart of another method for manufacturing a light-emitting unit provided by an embodiment of the present disclosure.
具体实施方式Detailed ways
为使本公开的目的、技术方案和优点更加清楚,下面将结合附图对本公开实施方式作进一步地详细描述。In order to make the objectives, technical solutions, and advantages of the present disclosure clearer, the following further describes the embodiments of the present disclosure in detail with reference to the accompanying drawings.
OLED显示装置通常包括:在玻璃基板上依次叠加的阳极层、第一有机层、发光层、第二有机层和金属电极层。第一有机层可以包括空穴注入层和空穴传输层,第二有机层可以包括电子传输层和电子注入层。阳极层与外接电源的正极连接,金属电极层与外接电源的负极连接。An OLED display device generally includes an anode layer, a first organic layer, a light-emitting layer, a second organic layer, and a metal electrode layer sequentially stacked on a glass substrate. The first organic layer may include a hole injection layer and a hole transport layer, and the second organic layer may include an electron transport layer and an electron injection layer. The anode layer is connected with the positive pole of the external power source, and the metal electrode layer is connected with the negative pole of the external power source.
其中,OLED显示装置电致发光的过程为:外接电源中的电子从金属电极层注入,并通过第一有机层传输至发光层,外接电源中的空穴从阳极层注入,并通过第二有机层传输至发光层,使得电子与空穴在发光层中复合形成激子,发光层在激子的激发下产生光子,使得发光层发光。并且,在发光层中形成的激子数量越多,产生的光子的数量也越多,发光层发出的光量就越多。Among them, the electroluminescence process of the OLED display device is: the electrons in the external power supply are injected from the metal electrode layer and transmitted to the light-emitting layer through the first organic layer, and the holes in the external power supply are injected from the anode layer and pass through the second organic layer. The layer is transported to the light-emitting layer, so that electrons and holes recombine in the light-emitting layer to form excitons, and the light-emitting layer generates photons under the excitation of the excitons, so that the light-emitting layer emits light. In addition, the more excitons formed in the light-emitting layer, the more photons generated, and the more light emitted by the light-emitting layer.
并且,OELD显示装置通常具有四种光传输模态,分别是:表面等离子模态、波导模态、衬底模态和辐射模态。其中,表面等离子模态是因光子与金属电极层表面电子共振形成的不发光模态。波导模态是因全反射使得光被限制在有机层(如空穴注入层和空穴传输层等)和阳极层之间形成的不发光模态。衬底模态因全反射使得光被消耗在玻璃基板形成的不发光模态。辐射模态是光被辐射至空气中的发光模态。Moreover, the OELD display device usually has four light transmission modes, namely: a surface plasmon mode, a waveguide mode, a substrate mode, and a radiation mode. Among them, the surface plasmon mode is a non-luminous mode formed by the resonance of photons and surface electrons of the metal electrode layer. The waveguide mode is a non-luminous mode formed between the organic layer (such as the hole injection layer and the hole transport layer, etc.) and the anode layer due to total reflection. Because of the total reflection of the substrate mode, the light is consumed in the non-luminous mode formed by the glass substrate. The radiation mode is the luminous mode in which light is radiated into the air.
目前,通过辐射模态辐射至空气中的光在发光层发出的光中的占比约为20%,即发光层发出的光中只有20%由OLED显示装置辐射到空气中,其余的光均消耗在显示装置中的膜层中,导致OLED显示装置的出光效率较低。其中,出光效率为从OLED显示器件辐射至空气中的光的光量在发光层发出总光量中的占比。At present, the light radiated into the air through the radiation mode accounts for about 20% of the light emitted by the light-emitting layer, that is, only 20% of the light emitted by the light-emitting layer is radiated into the air by the OLED display device, and the remaining light is all It is consumed in the film layer in the display device, resulting in low light extraction efficiency of the OLED display device. Wherein, the light extraction efficiency is the proportion of the amount of light radiated into the air from the OLED display device in the total amount of light emitted by the light-emitting layer.
本公开实施例提供的一种发光单元,可以提高发光单元的出光效率。如图1所示,发光单元1可以包括:层叠的第一电极层11、发光层12和第二电极层13。The light emitting unit provided by the embodiment of the present disclosure can improve the light extraction efficiency of the light emitting unit. As shown in FIG. 1, the light emitting unit 1 may include: a first electrode layer 11, a light emitting layer 12 and a second electrode layer 13 which are stacked.
请继续参考图1,发光单元1还可以包括:平坦层14和光调节结构15。其中,平坦层14位于第一电极层11和第二电极层13中至少一个与发光层12之间。也即是,平坦层14包括以下任一个或多个的组合:位于第一电极层11与发光层12之间的第一平坦层141;以及,位于第二电极层13与发光层12之间的第二平坦层142。该第一平坦层141用于增加第一电极层11与发光层12之间的距离。该第二平坦层142用于增加第二电极层13与发光层12之间的距离。其中,图1是发光层12与第一电极层11之间存在第一平坦层141的示意图。Please continue to refer to FIG. 1, the light emitting unit 1 may further include: a flat layer 14 and a light adjusting structure 15. Wherein, the flat layer 14 is located between at least one of the first electrode layer 11 and the second electrode layer 13 and the light-emitting layer 12. That is, the flat layer 14 includes any one or more of the following: a first flat layer 141 located between the first electrode layer 11 and the light-emitting layer 12; and, between the second electrode layer 13 and the light-emitting layer 12 The second flat layer 142. The first flat layer 141 is used to increase the distance between the first electrode layer 11 and the light emitting layer 12. The second flat layer 142 is used to increase the distance between the second electrode layer 13 and the light emitting layer 12. 1 is a schematic diagram of a first flat layer 141 between the light-emitting layer 12 and the first electrode layer 11.
光调节结构15用于改变发射至光调节结构15表面的光的传输方向。该光调节结构15满足以下任一个或多个的组合:光调节结构15位于平坦层14的内部,以及,光调节结构15位于平坦层14的外部远离发光层12的一侧。其中,图1是光调节结构15位于第一平坦层141的外部远离发光层12一侧的示意图。The light adjusting structure 15 is used to change the transmission direction of the light emitted to the surface of the light adjusting structure 15. The light adjusting structure 15 satisfies any one or a combination of the following: the light adjusting structure 15 is located inside the flat layer 14, and the light adjusting structure 15 is located outside the flat layer 14 on a side away from the light emitting layer 12. 1 is a schematic diagram of the light adjusting structure 15 located on the side of the first flat layer 141 away from the light emitting layer 12.
综上所述,本公开实施例提供的发光单元,发光单元包括平坦层,相较于相关技术,增大了位于平坦层两侧的发光层与电极层之间的距离,减少了与电极层表面电子产生共振的光子的量,即减少了通过表面等离子模态消耗的光量,增加了从发光单元射入到空气中的光量,进而提高了发光单元的出光效率。In summary, the light-emitting unit provided by the embodiments of the present disclosure includes a flat layer. Compared with related technologies, the distance between the light-emitting layer and the electrode layer on both sides of the flat layer is increased, and the distance between the light-emitting layer and the electrode layer is reduced. The amount of photons in which the surface electrons resonate reduces the amount of light consumed through the surface plasma mode, increases the amount of light emitted from the light-emitting unit into the air, and thereby improves the light-emitting efficiency of the light-emitting unit.
并且,由于发光单元还包括光调节结构,该光调节结构能够改变发射至光调节结构表面的光的传输方向,使得光从光调节结构照射至其他膜层时的入射角度发生改变,且当光的入射角度小于光的全反射角时,光能够通过光的折射从该其他膜层射出,减少了发生全反射的光量,即减少了通过波导模态消耗的光量,增加了射入到空气中的光量,进一步提高了发光单元的出光效率。Moreover, since the light-emitting unit further includes a light-regulating structure, the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
可选地,光调节结构的介电常数可以大于或等于平坦层的介电常数。当光 调节结构位于平坦层内,且光调节结构的介电常数大于平坦层的介电常数时,混合有光调节结构的平坦层的介电常数相对于平坦层的介电常数得到增大。当第一电极层与第二电极层与外接电源连接时,第一电极层与第二电极层之间会产生电场,若平坦层的介电常数较大,能够降低平坦层对第一电极层和第二电极层产生的电场的场强的影响,使得第一电极层与第二电极层产生的电场的场强较大,能够加快注入到发光单元中的电子和空穴的运动速率,使得在单位时间内能够在发光层中产生较多的激子,使发光层能够发出更多的光。Optionally, the dielectric constant of the light adjustment structure may be greater than or equal to the dielectric constant of the flat layer. When the light regulation structure is located in the flat layer and the dielectric constant of the light regulation structure is greater than the dielectric constant of the flat layer, the dielectric constant of the flat layer mixed with the light regulation structure is increased relative to the dielectric constant of the flat layer. When the first electrode layer and the second electrode layer are connected to an external power source, an electric field will be generated between the first electrode layer and the second electrode layer. If the dielectric constant of the flat layer is large, the flat layer's effect on the first electrode layer can be reduced. And the influence of the field strength of the electric field generated by the second electrode layer makes the field strength of the electric field generated by the first electrode layer and the second electrode layer larger, which can accelerate the movement rate of electrons and holes injected into the light-emitting unit, so that More excitons can be generated in the light-emitting layer per unit time, so that the light-emitting layer can emit more light.
并且,根据平坦层的不同情况,平坦层的设置位置不同,本公开实施例以以下几种可实现方式为例进行说明。In addition, according to different situations of the flat layer, the position of the flat layer is different, and the embodiments of the present disclosure take the following several implementation ways as examples for description.
在第一种可实现方式中,平坦层包括第一平坦层141。如图1所示,该第一平坦层141位于第一电极层11与发光层12之间。并且,图1是光调节结构15位于第一平坦层141远离发光层一侧的示意图。In the first possible implementation, the flat layer includes the first flat layer 141. As shown in FIG. 1, the first flat layer 141 is located between the first electrode layer 11 and the light emitting layer 12. Moreover, FIG. 1 is a schematic diagram of the light adjusting structure 15 located on the side of the first flat layer 141 away from the light emitting layer.
通常的,在发光层发出的光中,与金属电极的表面电子产生共振的光子的量与目标距离负相关,该目标距离为发光层与金属电极之间的距离。当第一电极层11与发光层12之间具有第一平坦层141时,增加了第一电极层11与发光层12之间的距离,使得与第一电极层11的表面电子产生共振的光子的量减少,即减少了发光层发出的光在发光层与第一电极层之间传输时消耗的光量,增加了从发光单元射入到空气中的光量,进而提高了发光单元的出光效率。Generally, in the light emitted by the light-emitting layer, the amount of photons that resonate with the surface electrons of the metal electrode is negatively related to the target distance, which is the distance between the light-emitting layer and the metal electrode. When there is a first flat layer 141 between the first electrode layer 11 and the light emitting layer 12, the distance between the first electrode layer 11 and the light emitting layer 12 is increased, so that photons that resonate with the surface electrons of the first electrode layer 11 are generated. The reduction of the light-emitting layer reduces the amount of light consumed when the light emitted by the light-emitting layer is transmitted between the light-emitting layer and the first electrode layer, increases the amount of light injected into the air from the light-emitting unit, and improves the light-emitting efficiency of the light-emitting unit.
在第二种可实现方式中,平坦层包括第二平坦层142。如图2所示,第二平坦层142位于第二电极层13与发光层12之间。并且,图2是光调节结构15位于第二平坦层142内的示意图。In the second achievable manner, the flat layer includes the second flat layer 142. As shown in FIG. 2, the second flat layer 142 is located between the second electrode layer 13 and the light emitting layer 12. In addition, FIG. 2 is a schematic diagram of the light adjusting structure 15 located in the second flat layer 142.
该第二平坦层142的设置增加了第二电极层13与发光层12之间的距离,减少了与第二电极层13表面电子产生共振的光子的量,即减少了发光层发出的光在发光层与第二电极层之间传输时消耗的光量,增加了从发光单元1射入到空气中的光量,进而提高了发光单元1的出光效率。The arrangement of the second flat layer 142 increases the distance between the second electrode layer 13 and the light-emitting layer 12, reduces the amount of photons that resonate with the surface electrons of the second electrode layer 13, that is, reduces the amount of light emitted by the light-emitting layer. The amount of light consumed during transmission between the light-emitting layer and the second electrode layer increases the amount of light emitted from the light-emitting unit 1 into the air, thereby increasing the light-emitting efficiency of the light-emitting unit 1.
在第三种可实现方式中,平坦层包括第一平坦层141和第二平坦层142。如图3所示,第一平坦层141位于第一电极层11与发光层12之间,第二平坦层142位于第二电极层13与发光层12之间。并且,图2是一个光调节结构15位于第一平坦层141远离发光层12的一侧,另一个光调节结构15位于第二平坦层142远离发光层12的一侧的示意图。In the third achievable manner, the flat layer includes a first flat layer 141 and a second flat layer 142. As shown in FIG. 3, the first flat layer 141 is located between the first electrode layer 11 and the light-emitting layer 12, and the second flat layer 142 is located between the second electrode layer 13 and the light-emitting layer 12. In addition, FIG. 2 is a schematic diagram of one light adjusting structure 15 located on the side of the first flat layer 141 away from the light emitting layer 12, and another light adjusting structure 15 located on the side of the second flat layer 142 away from the light emitting layer 12.
在该第三种可实现方式中,由于增加了第一电极层11与发光层12之间的距离,减少了与第一电极层11的表面电子产生共振的光子的量,且增加了第二电极层13与发光层12之间的距离,减少了与第二电极层13的表面电子产生共振的光子的量,使得从发光单元1射入到空气中的光量增加,进而提高了发光单元1的出光效率。In the third achievable manner, since the distance between the first electrode layer 11 and the light-emitting layer 12 is increased, the amount of photons that resonate with the surface electrons of the first electrode layer 11 is reduced, and the second is increased. The distance between the electrode layer 13 and the light-emitting layer 12 reduces the amount of photons that resonate with the surface electrons of the second electrode layer 13, so that the amount of light emitted from the light-emitting unit 1 into the air increases, thereby increasing the light-emitting unit 1. The light output efficiency.
可选地,在平坦层的上述三种可实现方式的基础上,光调节结构可以具有多种设置方式,本公开实施例以以下两种情况为例进行说明。Optionally, on the basis of the above-mentioned three achievable manners of the flat layer, the light adjustment structure may have multiple setting manners. The embodiments of the present disclosure take the following two cases as examples for description.
在光调节结构的第一种设置方式中:光调节结构为散射粒子,且散射粒子混合在平坦层14内。In the first arrangement of the light adjustment structure: the light adjustment structure is a scattering particle, and the scattering particles are mixed in the flat layer 14.
也即是,当发光层12与第一电极层11之间存在第一平坦层141时,该第一平坦层141中可以混合有散射粒子。当发光层12与第二电极层13之间存在第二平坦层142时,该第二平坦层142中可以混合有散射粒子。如图4所示,当发光层12与第一电极层11之间存在第一平坦层141,且发光层12与第二电极层13之间存在第二平坦层142时,第一平坦层141和第二平坦层142内可以均可以混合有散射粒子151。That is, when the first flat layer 141 exists between the light-emitting layer 12 and the first electrode layer 11, the first flat layer 141 may be mixed with scattering particles. When there is a second flat layer 142 between the light emitting layer 12 and the second electrode layer 13, the second flat layer 142 may be mixed with scattering particles. As shown in FIG. 4, when a first flat layer 141 exists between the light-emitting layer 12 and the first electrode layer 11, and a second flat layer 142 exists between the light-emitting layer 12 and the second electrode layer 13, the first flat layer 141 Scattering particles 151 may be mixed in both and the second flat layer 142.
由于散射粒子151能够使照射至散射粒子151表面的光发生散射,且通过光的散射,能够改变光从散射粒子151表面照射至其他膜层时的入射角度,且当光的入射角度小于光的全反射角时,光能够从其他膜层射出,这样一来,减少了光从内部混合有该散射例子151的平坦层进入其他膜层时发生全反射的光量,进而增加了射入到空气中的光量,提高了发光单元的出光效率。在一种可实现方式中,该其他膜层可以为与混合有该散射粒子的平坦层相邻的膜层。例如,当第一平坦层141内混合有散射粒子151时,该其他膜层可以为第一电极层11。Because the scattering particles 151 can scatter the light irradiated to the surface of the scattering particles 151, and through the scattering of the light, the incident angle of light from the surface of the scattering particles 151 to other layers can be changed, and when the incident angle of the light is smaller than that of the light At the total reflection angle, light can be emitted from other coatings. This reduces the amount of light that is totally reflected when the flat layer mixed with the scattering example 151 enters other coatings, thereby increasing the amount of light entering the air The light quantity improves the light-emitting efficiency of the light-emitting unit. In an implementation manner, the other film layer may be a film layer adjacent to the flat layer mixed with the scattering particles. For example, when the scattering particles 151 are mixed in the first flat layer 141, the other film layer may be the first electrode layer 11.
进一步地,散射粒子151可以均匀地混合在平坦层14内。这样一来,位于平坦层14内不同位置处的散射粒子151均能够使发射至散射粒子151表面的光发生散射,使得从平坦层的不同位置发射至其他膜层的光的入射角度均得到改变,使得射入该其他膜层不同位置处的光量均增加。并且,还能够使从发光单元不同位置射入到空气中的光量近似相同,提高了发光单元发出光的均匀度。Further, the scattering particles 151 may be uniformly mixed in the flat layer 14. In this way, the scattering particles 151 located at different positions in the flat layer 14 can scatter the light emitted to the surface of the scattering particles 151, so that the incident angles of the light emitted from different positions of the flat layer to other layers are changed. , So that the amount of light incident on different positions of the other film layers are increased. In addition, the amount of light entering the air from different positions of the light-emitting unit can be approximately the same, which improves the uniformity of light emitted by the light-emitting unit.
散射粒子151的形状可以根据实际需要设置。例如,混合在平坦层14内的散射粒子151的结构可以为以下一种或多种的组合:球状结构、棱台结构、棱 柱结构、圆台结构、圆柱结构和圆锥结构等。图4是散射粒子的形状为圆锥结构的示意图。The shape of the scattering particles 151 can be set according to actual needs. For example, the structure of the scattering particles 151 mixed in the flat layer 14 may be one or a combination of the following: spherical structure, prism structure, prismatic structure, truncated truncated structure, cylindrical structure, conical structure, and the like. Fig. 4 is a schematic diagram of the shape of the scattering particles as a conical structure.
可选地,混合在平坦层14内的散射粒子151的材料可以为以下任一种或多种的组合:树脂等有机材料、二氧化硅SiO2、二氧化钛TiO2和二氧化锆ZrO2等无机材料。并且,散射粒子的尺寸可以根据实际需要进行设置,示例地,散射粒子的尺寸的数量级可以为纳米数量级。Optionally, the material of the scattering particles 151 mixed in the flat layer 14 may be any one or a combination of the following: organic materials such as resin, inorganic materials such as silicon dioxide SiO2, titanium dioxide TiO2, and zirconium dioxide ZrO2. In addition, the size of the scattering particles can be set according to actual needs. For example, the size of the scattering particles can be on the order of nanometers.
在光调节结构的第二种设置方式中:光调节结构为光调节层,该光调节层靠近发光层12的一侧具有多个凸起结构,且光调节层位于平坦层远离发光层12的一侧。In the second arrangement of the light-regulating structure: the light-regulating structure is a light-regulating layer, the side of the light-regulating layer close to the light-emitting layer 12 has a plurality of convex structures, and the light-regulating layer is located on the flat layer away from the light-emitting layer 12 One side.
也即是,当发光层12与第一电极层11之间存在第一平坦层141时,该第一平坦层141远离发光层12的一侧可以设置有光调节层(为便于区分,称其为第一光调节层)。当发光层12与第二电极层13之间存在第二平坦层142时,该第二平坦层142远离发光层12的一侧可以设置有光调节层(为便于区分,称其为第二光调节层)。如图5所示,当发光层12与第一电极层11之间存在第一平坦层141,且发光层12与第二电极层13之间存在第二平坦层142时,第一平坦层141与第一电极层11之间具有第一光调节层152,第二平坦层142与第二电极层13之间具有第二光调节层153。That is, when there is a first flat layer 141 between the light-emitting layer 12 and the first electrode layer 11, the side of the first flat layer 141 away from the light-emitting layer 12 may be provided with a light adjustment layer (for easy distinction, it is called Is the first light adjustment layer). When there is a second flat layer 142 between the light-emitting layer 12 and the second electrode layer 13, the side of the second flat layer 142 away from the light-emitting layer 12 may be provided with a light adjustment layer (for easy distinction, it is called the second light Adjustment layer). As shown in FIG. 5, when a first flat layer 141 exists between the light-emitting layer 12 and the first electrode layer 11, and a second flat layer 142 exists between the light-emitting layer 12 and the second electrode layer 13, the first flat layer 141 A first light adjustment layer 152 is located between the first electrode layer 11 and a second light adjustment layer 153 is located between the second flat layer 142 and the second electrode layer 13.
当光调节层靠近发光层12的一侧具有凸起结构时,发射至凸起结构表面的一部分光能够在凸起结构表面发生折射,使得光照射至与该光调节层相邻的膜层时的入射角度发生改变,并在经过依次或多次折射和/或反射后,使得光照射至其他膜层表面的入射角度小于光的全反射角,破坏了光的全反射条件,使得光能够通过光的折射从该相邻的膜层射出,增加了从该相邻的膜层射出的光量。因此,光调节层的设置减少了发生全反射的光量,减少了通过波导模态消耗的光量,增加了发光单元射入到空气中的光量,提高了发光单元的出光效率。When the light-regulating layer has a convex structure on the side close to the light-emitting layer 12, part of the light emitted to the surface of the convex structure can be refracted on the surface of the convex structure, so that when the light is irradiated to the film layer adjacent to the light-regulating layer The incident angle of the light is changed, and after sequential or multiple refraction and/or reflection, the incident angle of the light irradiating the surface of the other film layer is smaller than the total reflection angle of the light, destroying the total reflection condition of the light, so that the light can pass The refraction of light is emitted from the adjacent film layer, increasing the amount of light emitted from the adjacent film layer. Therefore, the arrangement of the light adjustment layer reduces the amount of light that undergoes total reflection, reduces the amount of light consumed through the waveguide mode, increases the amount of light emitted by the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
进一步地,凸起结构靠近发光层12的表面在发光层12上的正投影,可以位于凸起结构远离发光层12的表面在发光层12上的正投影的内部。或者,凸起结构靠近发光层12的表面在发光层12上的正投影,与凸起结构远离发光层12的表面在发光层12上的正投影的重合,本公开实施例对此不做限定。Further, the orthographic projection of the surface of the raised structure close to the light-emitting layer 12 on the light-emitting layer 12 may be located inside the orthographic projection of the surface of the raised structure away from the light-emitting layer 12 on the light-emitting layer 12. Or, the orthographic projection of the surface of the raised structure close to the light-emitting layer 12 on the light-emitting layer 12 coincides with the orthographic projection of the surface of the raised structure far away from the light-emitting layer 12 on the light-emitting layer 12, which is not limited in the embodiment of the present disclosure. .
请继续参考图5,第一光调节层152上的凸起结构靠近第一平坦层141的表面在第一平坦层141的正投影M,位于该凸起结构远离第一平坦层141的表面 在第一平坦层141上的正投影N的内部。这样一来,第一光调节层152上的凸起结构的侧表面与平坦层之间的夹角小于90度,增加了凸起结构中用于接收光的表面积,使得较多光能够射入至凸起结构中并折射至第一电极层,进一步增加了发射至第一电极层的光。类似的,第二光调节层153上的凸起结构靠近第二平坦层142的表面在第二平坦层142的正投影E,位于该凸起结构远离第二平坦层142的表面在第二平坦层142上的正投影F的内部,也能够将更多的光折射到第一电极层。Please continue to refer to FIG. 5, the convex structure on the first light adjustment layer 152 is close to the first flat layer 141 in the orthographic projection M of the first flat layer 141, and the convex structure is located on the surface away from the first flat layer 141. The inside of the orthographic projection N on the first flat layer 141. In this way, the angle between the side surface of the convex structure on the first light adjustment layer 152 and the flat layer is less than 90 degrees, which increases the surface area of the convex structure for receiving light, so that more light can enter Into the convex structure and refract to the first electrode layer, the light emitted to the first electrode layer is further increased. Similarly, the surface of the convex structure on the second light adjustment layer 153 close to the second flat layer 142 is in the orthographic projection E of the second flat layer 142, and the surface of the convex structure away from the second flat layer 142 is located in the second flat layer. The inside of the orthographic projection F on the layer 142 can also refract more light to the first electrode layer.
可选地,分布在光调节层靠近发光层12的一侧的凸起结构的结构可以为以下任一种或多种的组合:半球结构、棱台结构、棱柱结构、圆台结构、圆柱结构、棱锥结构和圆锥结构等,本公开实施例对此不做限定。其中,图5是凸起结构为圆台结构的示意图,图6是凸起结构为半球结构的示意图,图7是凸起结构为圆锥结构的示意图。Optionally, the structure of the convex structure distributed on the side of the light adjustment layer close to the light-emitting layer 12 may be any one or a combination of the following: hemispherical structure, prism structure, prism structure, truncated truncated structure, cylindrical structure, The pyramid structure and the conical structure, etc., are not limited in the embodiment of the present disclosure. 5 is a schematic diagram of the convex structure being a truncated cone structure, FIG. 6 is a schematic diagram of the convex structure being a hemispherical structure, and FIG. 7 is a schematic diagram of the convex structure being a conical structure.
并且,当光调节层具有多个凸起结构时,该多个凸起结构可以均匀分布。该均匀分布的多个凸起结构能够较均衡地对光进行反射和折射,能够进一步增加进入到空气中的光的量,进一步增大发光单元的出光效率。并且,还能够使从发光单元不同位置射入到空气中的光量近似相同,提高了发光单元发出光的均匀度。Moreover, when the light adjustment layer has a plurality of raised structures, the plurality of raised structures may be evenly distributed. The uniformly distributed multiple convex structures can reflect and refract light in a more balanced manner, can further increase the amount of light entering the air, and further increase the light output efficiency of the light emitting unit. In addition, the amount of light entering the air from different positions of the light-emitting unit can be approximately the same, which improves the uniformity of light emitted by the light-emitting unit.
需要说明的是,上述平坦层的三种实现方式可以与光调节结构的两种设置方式可以进行任意组合,以形成具有不同结构的发光单元。并且,当光调整层靠近发光层12的一侧具有凸起结构时,与该凸起结构接触的膜层表面具有与光调整层上的凸起结构匹配的凸起结构。例如,如图5所示,第一平坦层141远离发光层的一侧具有与光调整层上的凸起结构匹配的凸起结构,第二平坦层142远离发光层的一侧具有与光调整层上的凸起结构匹配的凸起结构。It should be noted that the above three implementations of the flat layer can be arbitrarily combined with the two arrangements of the light adjustment structure to form light-emitting units with different structures. Moreover, when the light adjustment layer has a convex structure on the side close to the light emitting layer 12, the surface of the film layer in contact with the convex structure has a convex structure matching the convex structure on the light adjustment layer. For example, as shown in FIG. 5, the side of the first flat layer 141 away from the light-emitting layer has a convex structure that matches the convex structure on the light adjustment layer, and the side of the second flat layer 142 away from the light-emitting layer has a convex structure that matches the light-emitting layer. The raised structure on the layer matches the raised structure.
可选的,第一电极层的材料和/或第二电极层的材料可以为有机材料,也即是,第一电极层和第二电极层的材料可以均为有机材料,或者,第一电极层和第二电极层中的任一个的材料可以为有机材料。当任一电极层的材料为有机材料时,由于有机材料的表面不存在自由电子,因此传输至该任一电极层表面的光子不会与电子发生共振,有效地减小了通过表面等离子模态消耗的光量,进一步增加了发光单元射入到空气中的光量。Optionally, the material of the first electrode layer and/or the material of the second electrode layer may be organic materials, that is, the materials of the first electrode layer and the second electrode layer may both be organic materials, or the first electrode The material of any one of the layer and the second electrode layer may be an organic material. When the material of any electrode layer is an organic material, since there are no free electrons on the surface of the organic material, the photons transmitted to the surface of any electrode layer will not resonate with the electrons, which effectively reduces the plasmon mode passing through the surface. The amount of light consumed further increases the amount of light emitted by the light-emitting unit into the air.
可选地,发光单元还可以包括:注入层。注入层位于平坦层与发光层之间, 且注入层用于向发光层注入带电粒子。其中,带电粒子可以为电子或空穴。示例地,如图8所示,第一平坦层141与发光层12之间具有第一注入层161,第二平坦层142与发光层12之间具有第二注入层162。第一注入层161可以用于向发光层12注入电子,第二注入层162可以用于向发光层12注入空穴。或者,第一注入层161可以用于向发光层12注入空穴,第二注入层162可以用于向发光层12注入电子。再或者,第一注入层161可以用于向发光层12注入电子和空穴,第二注入层162可以用于向发光层12注入电子和空穴。本公开实施例对此不做限定。Optionally, the light emitting unit may further include: an injection layer. The injection layer is located between the flat layer and the light-emitting layer, and the injection layer is used to inject charged particles into the light-emitting layer. Among them, the charged particles can be electrons or holes. Illustratively, as shown in FIG. 8, there is a first injection layer 161 between the first flat layer 141 and the light emitting layer 12, and a second injection layer 162 is provided between the second flat layer 142 and the light emitting layer 12. The first injection layer 161 may be used to inject electrons into the light emitting layer 12, and the second injection layer 162 may be used to inject holes into the light emitting layer 12. Alternatively, the first injection layer 161 may be used to inject holes into the light emitting layer 12, and the second injection layer 162 may be used to inject electrons into the light emitting layer 12. Alternatively, the first injection layer 161 may be used to inject electrons and holes into the light-emitting layer 12, and the second injection layer 162 may be used to inject electrons and holes into the light-emitting layer 12. The embodiment of the present disclosure does not limit this.
这样一来,可以利用注入层向发光层注入带电粒子,而无需利用外接电源为发光层注入带电粒子,一方面能够减小因使用外接电源产生的能耗,另一方面,降低了带电粒子在向发光层传输的过程中停留在其经过的电极层和平坦层中的概率,提高了带电粒子的利用率。In this way, the injection layer can be used to inject charged particles into the light-emitting layer, instead of using an external power supply to inject charged particles into the light-emitting layer. On the one hand, it can reduce the energy consumption caused by the use of an external power source, and on the other hand, it reduces the amount of charged particles. The probability of staying in the electrode layer and flat layer passing by the light-emitting layer improves the utilization rate of charged particles.
进一步地,当通过外接电源向发光层注入带电粒子时,该外接电源可以为直流电源或交流电源。且当发光单元包括注入层时,外接电源可以为交流电源,此时,相当于采用交流驱动的方式对发光单元进行驱动。可选地,如图8所示,第一电极层11可以与交流电源2的第一极连接,第二电极层13可以与交流电源的第二极连接。Further, when injecting charged particles into the light-emitting layer through an external power source, the external power source may be a DC power source or an AC power source. And when the light-emitting unit includes an injection layer, the external power source may be an AC power source. In this case, it is equivalent to using an AC driving method to drive the light-emitting unit. Optionally, as shown in FIG. 8, the first electrode layer 11 may be connected to the first pole of the AC power source 2, and the second electrode layer 13 may be connected to the second pole of the AC power source.
当带电粒子在发光单元的膜层(例如平坦层)中积累的数量较多时,会导致该膜层的材料分子处于一种不稳定的带电荷状态,使其容易发生不可逆的化学变化,导致该膜层的材料变质(即膜层劣化),进而导致该膜层的使用寿命受到影响。而本公开实施例中的发光单元采用交流驱动的方式,由于第一电极层和第二电极层之间的电场的方向周期性变化,使得空穴和电子的运动方向呈现周期性变化,降低了因带电粒子在发光单元的膜层中积累而造成膜层劣化的概率,提高了发光单元中膜层的使用寿命,进而提高了发光单元的使用寿命。When the number of charged particles accumulated in the film layer (such as the flat layer) of the light-emitting unit is large, the material molecules of the film layer will be in an unstable charged state, making it prone to irreversible chemical changes, leading to the The material of the film layer is deteriorated (that is, the film layer is degraded), which in turn affects the service life of the film layer. However, the light-emitting unit in the embodiment of the present disclosure adopts an AC drive mode. Because the direction of the electric field between the first electrode layer and the second electrode layer changes periodically, the movement direction of holes and electrons is changed periodically, which reduces The probability of film deterioration caused by the accumulation of charged particles in the film layer of the light-emitting unit increases the service life of the film layer in the light-emitting unit, thereby increasing the service life of the light-emitting unit.
下面以第一注入层用于向发光层注入电子,第二注入层用于向发光层注入空穴为例,对交流驱动降低膜层劣化的原理进行说明。在交流驱动的第一阶段中,在第一电极层与第二电极层之间形成的电场方向由第二电极层指向第一电极层,并在该电场的作用下,第一注入层中的电子由第一注入层向发光层运动,第二注入层中的空穴由第二注入层向发光层运动,使得电子和空穴能够在发光层中复合形成激子,以使发光层发光。在交流驱动的第二阶段中,交流电源的 电流的方向发生变化,在第一电极层与第二电极层之间形成的电场方向由第一电极层指向第二电极层,并在该电场的作用下,发光层中未与空穴复合的电子可以由发光层向第一注入层运动,进而回到第一注入层中,发光层中未与电子复合的空穴由发光层向第二注入层运动,进而回到第二注入层中。交流驱动的第一阶段和第二阶段不断交替循环,以驱动发光单元发光。由于在该过程中,电子和空穴的运动方向呈现周期性变化,因此,降低了带电粒子在膜层中积累的概率,进而降低了因带电粒子在膜层中积累而造成膜层劣化的概率。Taking the first injection layer for injecting electrons into the light-emitting layer and the second injection layer for injecting holes into the light-emitting layer as an example, the principle of AC driving to reduce the deterioration of the film will be described. In the first stage of AC driving, the direction of the electric field formed between the first electrode layer and the second electrode layer is directed from the second electrode layer to the first electrode layer, and under the action of the electric field, the electric field in the first injection layer The electrons move from the first injection layer to the light emitting layer, and the holes in the second injection layer move from the second injection layer to the light emitting layer, so that the electrons and holes can recombine in the light emitting layer to form excitons, so that the light emitting layer emits light. In the second stage of the AC drive, the direction of the current of the AC power source changes, and the direction of the electric field formed between the first electrode layer and the second electrode layer is directed from the first electrode layer to the second electrode layer, and the Under the action, the electrons in the light-emitting layer that are not recombined with holes can move from the light-emitting layer to the first injection layer, and then return to the first injection layer. The holes in the light-emitting layer that are not recombined with electrons are injected from the light-emitting layer to the second The layer moves and then returns to the second injection layer. The first stage and the second stage of the AC drive continuously alternately cycle to drive the light-emitting unit to emit light. In this process, the direction of movement of electrons and holes exhibits periodic changes, thus reducing the probability of the accumulation of charged particles in the film, thereby reducing the probability of film degradation due to the accumulation of charged particles in the film .
进一步地,当发光单元包括注入层,和/或,发光单元采用交流驱动的情况下,平坦层的材料可以为绝缘材料。此时,平坦层能够阻挡带电粒子进入电极层,使尽量多地带电粒子进入发光层,保证了注入层向发光层提供的带电粒子的量,进而保证了发光效果。Further, when the light-emitting unit includes an injection layer, and/or the light-emitting unit is driven by AC, the material of the flat layer may be an insulating material. At this time, the flat layer can block charged particles from entering the electrode layer, so that as many charged particles as possible enter the light-emitting layer, ensuring the amount of charged particles provided by the injection layer to the light-emitting layer, thereby ensuring the luminous effect.
可选地,平坦层的材料可以为以下任一种或多种的组合:聚乙烯吡咯烷酮(polyvinyl pyrrolidone;PVP)、聚偏氟乙烯(polyvinylidene fluoride;PVDF)等有机材料、二氧化硅SiO 2和二氧化铪HfO 2等无机材料。另外,平坦层的厚度可以根据实际需要选取。示例地,平坦层的厚度可以大于或等于100纳米。 Optionally, the material of the flat layer can be any one or a combination of the following: polyvinyl pyrrolidone (PVP), polyvinylidene fluoride (PVDF) and other organic materials, silicon dioxide SiO 2 and Hafnium dioxide HfO 2 and other inorganic materials. In addition, the thickness of the flat layer can be selected according to actual needs. For example, the thickness of the flat layer may be greater than or equal to 100 nanometers.
综上所述,本公开实施例提供的发光单元,发光单元包括平坦层,相较于相关技术,增大了位于平坦层两侧的发光层与电极层之间的距离,减少了与电极层表面电子产生共振的光子的量,即减少了通过表面等离子模态消耗的光量,增加了从发光单元射入到空气中的光量,进而提高了发光单元的出光效率。In summary, the light-emitting unit provided by the embodiments of the present disclosure includes a flat layer. Compared with related technologies, the distance between the light-emitting layer and the electrode layer on both sides of the flat layer is increased, and the distance between the light-emitting layer and the electrode layer is reduced. The amount of photons in which the surface electrons resonate reduces the amount of light consumed through the surface plasma mode, increases the amount of light emitted from the light-emitting unit into the air, and thereby improves the light-emitting efficiency of the light-emitting unit.
并且,由于发光单元还包括光调节结构,该光调节结构能够改变发射至光调节结构表面的光的传输方向,使得光从光调节结构照射至其他膜层时的入射角度发生改变,且当光的入射角度小于光的全反射角时,光能够通过光的折射从该其他膜层射出,减少了发生全反射的光量,即减少了通过波导模态消耗的光量,增加了射入到空气中的光量,进一步提高了发光单元的出光效率。Moreover, since the light-emitting unit further includes a light-regulating structure, the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
本公开实施例提供了一种发光单元的制造方法,用于制造上述实施例中的发光单元,如图9所示,该发光单元的制造方法包括:The embodiment of the present disclosure provides a method for manufacturing a light-emitting unit, which is used to manufacture the light-emitting unit in the above-mentioned embodiments. As shown in FIG. 9, the method for manufacturing the light-emitting unit includes:
图9为本公开实施例提供的一种发光单元的制造方法流程图。如图9所示,该发光单元的制造方法包括:FIG. 9 is a flowchart of a method for manufacturing a light-emitting unit according to an embodiment of the disclosure. As shown in FIG. 9, the manufacturing method of the light-emitting unit includes:
步骤1001、提供一衬底基板。Step 1001: Provide a base substrate.
步骤1002、在衬底基板上形成第一电极层。 Step 1002, forming a first electrode layer on the base substrate.
步骤1003、采用掺杂有光调节材料的平坦层材料,在形成有第一电极层的衬底基板上形成包括有光调节结构的第一平坦层。 Step 1003, using a flat layer material doped with a light adjusting material, and forming a first flat layer including a light adjusting structure on the base substrate on which the first electrode layer is formed.
其中,该第一平坦层用于增加第一电极层与发光层之间的距离,光调节结构用于改变发射至光调节结构表面的光的传输方向。Wherein, the first flat layer is used to increase the distance between the first electrode layer and the light emitting layer, and the light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure.
步骤1004、在形成有第一平坦层的衬底基板上形成发光层。 Step 1004, forming a light emitting layer on the base substrate on which the first flat layer is formed.
步骤1005、采用掺杂有光调节材料的平坦层材料,在形成有发光层的衬底基板上形成包括有光调节结构的第二平坦层。Step 1005: Using a flat layer material doped with a light-regulating material, a second flat layer including a light-regulating structure is formed on the base substrate on which the light-emitting layer is formed.
其中,该第二平坦层用于增加第二电极层与发光层之间的距离。Wherein, the second flat layer is used to increase the distance between the second electrode layer and the light-emitting layer.
步骤1006、在形成有第二平坦层的衬底基板上形成第二电极层。 Step 1006, forming a second electrode layer on the base substrate on which the second flat layer is formed.
综上所述,本公开实施例提供的发光单元的制造方法,该方法制造的发光单元包括平坦层,相较于相关技术,增大了位于平坦层两侧的发光层与电极层之间的距离,减少了与电极层表面电子产生共振的光子的量,即减少了通过表面等离子模态消耗的光量,增加了从发光单元射入到空气中的光量,进而提高了发光单元的出光效率。In summary, the light-emitting unit manufacturing method provided by the embodiments of the present disclosure includes a flat layer. Compared with related technologies, the gap between the light-emitting layer and the electrode layer on both sides of the flat layer is increased. The distance reduces the amount of photons that resonate with the surface electrons of the electrode layer, that is, reduces the amount of light consumed through the surface plasma mode, increases the amount of light injected from the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
并且,由于发光单元还包括光调节结构,该光调节结构能够改变发射至光调节结构表面的光的传输方向,使得光从光调节结构照射至其他膜层时的入射角度发生改变,且当光的入射角度小于光的全反射角时,光能够通过光的折射从该其他膜层射出,减少了发生全反射的光量,即减少了通过波导模态消耗的光量,增加了射入到空气中的光量,进一步提高了发光单元的出光效率。Moreover, since the light-emitting unit further includes a light-regulating structure, the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
可选地,衬底基板可以为透明基板,其具体可以是采用玻璃、石英、透明树脂等具有一定硬度的透光且非金属材料制成的基板。Optionally, the base substrate may be a transparent substrate, which specifically may be a substrate made of a transparent and non-metallic material with a certain hardness, such as glass, quartz, transparent resin, or the like.
在步骤1002中,可以采用磁控溅射、热蒸发或者等离子体增强化学气相沉积法(plasma enhanced chemical vapor deposition;PECVD)等方法在衬底基板上沉积一层具有一定厚度的第一电极材料,得到第一电极薄膜层,然后通过一次构图工艺对第一电极薄膜层进行图形化处理得到第一电极层。其中,一次构图工艺可以包括:光刻胶涂覆、曝光、显影、刻蚀和光刻胶剥离。可选地,该第一电极材料和该第一电极层的厚度可以根据实际需要进行设置。示例的,该第一电极材料可以为氧化铟锡或银等材料。或者,该第一电极材料可以为有机材料。In step 1002, methods such as magnetron sputtering, thermal evaporation, or plasma enhanced chemical vapor deposition (PECVD) may be used to deposit a layer of first electrode material with a certain thickness on the base substrate, The first electrode thin film layer is obtained, and then the first electrode thin film layer is patterned through a patterning process to obtain the first electrode layer. Among them, one patterning process may include: photoresist coating, exposure, development, etching and photoresist stripping. Optionally, the thickness of the first electrode material and the first electrode layer can be set according to actual needs. For example, the first electrode material may be indium tin oxide or silver. Alternatively, the first electrode material may be an organic material.
在步骤1003中,可以先将光调节材料掺杂在平坦层材料中,然后采用磁控溅射、热蒸发或者PECVD等方法,在形成有第一电极层的衬底基板上沉积一层具有一定厚度,且掺杂有光调节材料的平坦层材料,得到平坦薄膜层,然后通过一次构图工艺对平坦薄膜层进行图形化处理,得到包括有光调节结构的第一平坦层。In step 1003, the light adjustment material may be doped into the flat layer material first, and then magnetron sputtering, thermal evaporation or PECVD methods are used to deposit a layer with a certain degree on the base substrate on which the first electrode layer is formed. The flat layer material is thick and doped with the light adjustment material to obtain a flat thin film layer, and then the flat thin film layer is patterned through a patterning process to obtain the first flat layer including the light adjustment structure.
可选地,第一平坦层的材料可以为绝缘材料。例如可以为聚乙烯吡咯烷酮(polyvinyl pyrrolidone;PVP)或聚偏氟乙烯(polyvinylidene fluoride;PVDF)等有机材料。或者,第一平坦层的材料可以为二氧化硅SiO 2或二氧化铪HfO 2等无机材料。且该第一平坦层的厚度可以根据实际需要进行调整。例如,该第一平坦层的厚度可以大于或等于100纳米。 Optionally, the material of the first flat layer may be an insulating material. For example, it may be an organic material such as polyvinyl pyrrolidone (PVP) or polyvinylidene fluoride (PVDF). Alternatively, the material of the first flat layer may be an inorganic material such as silicon dioxide SiO 2 or hafnium dioxide HfO 2 . And the thickness of the first flat layer can be adjusted according to actual needs. For example, the thickness of the first flat layer may be greater than or equal to 100 nanometers.
并且,该光调节结构可以为散射粒子,即光调节材料可以为散射粒子。混合在第一平坦层内的散射粒子的结构可以为以下任一种或多种的组合:球状结构、棱台结构、棱柱结构、圆台结构、圆柱结构和圆锥结构。光调节材料可以为以下任一种或多种的组合:树脂等有机材料、二氧化硅SiO2、二氧化钛TiO2和二氧化锆ZrO2等无机材料。进一步的,光调节结构的介电常数可以大于或等于平坦层的介电常数。Moreover, the light adjusting structure may be scattering particles, that is, the light adjusting material may be scattering particles. The structure of the scattering particles mixed in the first flat layer can be any one or a combination of the following: spherical structure, prism structure, prism structure, truncated truncated structure, cylindrical structure and conical structure. The light-regulating material may be any one or a combination of the following: organic materials such as resin, inorganic materials such as silicon dioxide SiO2, titanium dioxide TiO2, and zirconium dioxide ZrO2. Further, the dielectric constant of the light adjustment structure may be greater than or equal to the dielectric constant of the flat layer.
在步骤1004中,可以采用磁控溅射、热蒸发或者PECVD等方法,在形成有第一平坦层的衬底基板上沉积一层具有一定厚度的发光材料,得到发光薄膜层,然后通过一次构图工艺对发光薄膜层进行图形化处理得到发光层。可选地,该发光材料和该发光层的厚度可以根据实际需要进行设置。示例的,该发光材料可以为量子肼材料。例如,该量子肼材料可以为铟氮化镓(InGaN)和氮化镓(GaN)的混合材料。In step 1004, methods such as magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of luminescent material with a certain thickness on the base substrate on which the first flat layer is formed to obtain a luminescent thin film layer, and then pass through a pattern The process performs patterning processing on the light-emitting thin film layer to obtain the light-emitting layer. Optionally, the thickness of the luminescent material and the luminescent layer can be set according to actual needs. For example, the luminescent material may be a quantum hydrazine material. For example, the quantum hydrazine material may be a mixed material of indium gallium nitride (InGaN) and gallium nitride (GaN).
在步骤1005中,可以先将光调节材料掺杂在平坦层材料中,然后可以采用磁控溅射、热蒸发或者PECVD等方法在形成有发光层的衬底基板上沉积一层具有一定厚度,且掺杂有光调节材料的平坦层材料,得到平坦薄膜层,然后通过一次构图工艺对平坦薄膜层进行图形化处理,得到包括有光调节结构的第二平坦层。In step 1005, the light-regulating material can be doped into the flat layer material first, and then a layer with a certain thickness can be deposited on the base substrate with the light-emitting layer by magnetron sputtering, thermal evaporation or PECVD, etc. And the flat layer material doped with the light adjustment material to obtain a flat thin film layer, and then the flat thin film layer is patterned through a patterning process to obtain a second flat layer including the light adjustment structure.
在步骤1006中,可以采用磁控溅射、热蒸发或者PECVD等方法在形成有第二平坦层的衬底基板上沉积一层具有一定厚度的第二电极材料,得到第二电极薄膜层,然后通过一次构图工艺对第二电极薄膜层进行图形化处理得到第二 电极层。可选地,该第二电极材料和该第二电极层的厚度可以根据实际需要进行设置。示例的,该第二电极材料可以为氧化铟锡或银等材料。或者,该第二电极材料可以为有机材料。In step 1006, magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of a second electrode material with a certain thickness on the base substrate on which the second flat layer is formed to obtain the second electrode thin film layer, and then The second electrode film layer is patterned through a patterning process to obtain the second electrode layer. Optionally, the thickness of the second electrode material and the second electrode layer can be set according to actual needs. For example, the second electrode material may be indium tin oxide or silver. Alternatively, the second electrode material may be an organic material.
图10为本公开实施例提供的另一种发光单元的制造方法流程图。如图10所示,该发光单元的制造方法包括:FIG. 10 is a flowchart of another method for manufacturing a light-emitting unit according to an embodiment of the disclosure. As shown in FIG. 10, the manufacturing method of the light-emitting unit includes:
步骤1101、提供一衬底基板。Step 1101: Provide a base substrate.
步骤1101的实现方式可以参考步骤1001的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1101, reference may be made to the implementation manner of step 1001, and details are not described herein in the embodiment of the present disclosure.
步骤1102、在衬底基板上形成第一电极层。Step 1102, forming a first electrode layer on the base substrate.
步骤1102的实现方式可以参考步骤1002的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1102, reference may be made to the implementation manner of step 1002, and details are not described herein in the embodiment of the present disclosure.
步骤1103、在形成有第一电极层的衬底基板上形成第一光调节层,该第一光调节层远离衬底基板的一侧具有多个凸起结构。 Step 1103, forming a first light adjustment layer on the base substrate on which the first electrode layer is formed, and the first light adjustment layer has a plurality of convex structures on the side away from the base substrate.
可以采用磁控溅射、热蒸发或者PECVD等方法在形成有第一电极层的衬底基板上沉积一层具有一定厚度的光调节材料,得到第一光调节薄膜层,然后通过一次构图工艺对该第一光调节薄膜层进行图形化处理,得到第一光调节层,使得第一光调节层远离衬底基板的表面具有凸起结构。Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of light-regulating material with a certain thickness on the base substrate on which the first electrode layer is formed to obtain the first light-regulating thin film layer, and then through a patterning process The first light adjustment film layer is patterned to obtain the first light adjustment layer, so that the surface of the first light adjustment layer away from the base substrate has a convex structure.
其中,该光调节材料和该第一光调节层的厚度可以根据实际需要进行设置。示例的,光调节材料可以为树脂等有机材料;或者,光调节材料可以为二氧化硅SiO2、二氧化钛TiO2或二氧化锆ZrO2等无机材料。Wherein, the thickness of the light adjustment material and the first light adjustment layer can be set according to actual needs. For example, the light adjusting material may be an organic material such as resin; or, the light adjusting material may be an inorganic material such as silicon dioxide SiO2, titanium dioxide TiO2, or zirconium dioxide ZrO2.
其中,第一光调节层中的凸起结构用于改变发射至该凸起结构表面的光的传输方向。可选的,凸起结构靠近发光层的表面在发光层上的正投影,位于凸起结构远离发光层的表面在发光层上的正投影的内部。并且,凸起结构均匀分布在光调节层靠近发光层的一侧。另外,分布在光调节层靠近发光层12的一侧的凸起结构的形状可以为以下任一种或多种的组合:半球结构、棱台结构、棱柱结构、圆台结构、圆柱结构、棱锥结构和圆锥结构。示例地,如图11所示,第一光调节层151中的凸起结构为圆锥结构。Wherein, the convex structure in the first light adjustment layer is used to change the transmission direction of the light emitted to the surface of the convex structure. Optionally, the orthographic projection of the surface of the convex structure close to the light-emitting layer on the light-emitting layer is located inside the orthographic projection of the surface of the convex structure away from the light-emitting layer on the light-emitting layer. Moreover, the convex structures are uniformly distributed on the side of the light adjustment layer close to the light emitting layer. In addition, the shape of the convex structure distributed on the side of the light-regulating layer close to the light-emitting layer 12 may be any one or a combination of the following: hemispherical structure, prism structure, prism structure, truncated cone structure, cylindrical structure, pyramid structure And cone structure. Illustratively, as shown in FIG. 11, the convex structure in the first light adjustment layer 151 is a conical structure.
步骤1104、在形成有第一光调节层的衬底基板上形成第一平坦层。 Step 1104, forming a first flat layer on the base substrate on which the first light adjustment layer is formed.
可以采用磁控溅射、热蒸发或者PECVD等方法在形成有第一光调节层的衬底基板上沉积一层具有一定厚度的平坦层材料,得到第一平坦薄膜层,然后通 过一次构图工艺对第一平坦薄膜层进行图形化处理得到第一平坦层。Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of flat layer material with a certain thickness on the base substrate on which the first light adjustment layer is formed to obtain the first flat thin film layer, and then through a patterning process The first flat film layer is patterned to obtain the first flat layer.
步骤1105、在形成有第一平坦层的衬底基板上形成发光层。 Step 1105, forming a light emitting layer on the base substrate on which the first flat layer is formed.
步骤1105的实现方式可以参考步骤1004的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1105, reference may be made to the implementation manner of step 1004, and details are not described herein in the embodiment of the present disclosure.
步骤1106、在形成有发光层的衬底基板上形成第二平坦层。Step 1106, forming a second flat layer on the base substrate on which the light-emitting layer is formed.
可以采用磁控溅射、热蒸发或者PECVD等方法,在形成有发光层的衬底基板上沉积一层具有一定厚度的平坦层材料,得到第二平坦薄膜层,然后通过一次构图工艺对第二平坦薄膜层进行图形化处理得到第二平坦层。示例地,经过图案化处理后得到的第二平坦层142可以如图12所示,该第二平坦层142远离衬底基板的表面具有凸起结构。Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of flat layer material with a certain thickness on the base substrate on which the light-emitting layer is formed to obtain a second flat thin film layer, and then perform a patterning process to the second The flat film layer is patterned to obtain a second flat layer. For example, the second flat layer 142 obtained after the patterning process may be as shown in FIG. 12, and the surface of the second flat layer 142 away from the base substrate has a convex structure.
步骤1107、在形成有第二平坦层的衬底基板上形成第二光调节层,该第二光调节层靠近发光层的一侧具有多个凸起结构。 Step 1107, forming a second light adjustment layer on the base substrate on which the second flat layer is formed, and the side of the second light adjustment layer close to the light emitting layer has a plurality of convex structures.
可以采用磁控溅射、热蒸发或者PECVD等方法在形成有第二平坦层的衬底基板上沉积一层具有一定厚度的光调节材料,得到第二光调节薄膜层,然后通过一次构图工艺对该第二光调节薄膜层进行图形化处理得到第二光调节层,使得第二光调节层靠近衬底基板的表面具有凸起结构,该第二光调节层上的凸起结构与第二平坦层表面的凸起结构匹配。其中,第二光调节层中的凸起结构用于改变发射至该凸起结构表面的光的传输方向。Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of light-regulating material with a certain thickness on the base substrate with the second flat layer to obtain the second light-regulating thin film layer, and then through a patterning process The second light adjustment film layer is patterned to obtain a second light adjustment layer, so that the surface of the second light adjustment layer close to the base substrate has a convex structure, and the convex structure on the second light adjustment layer is similar to the second flat surface. The raised structure of the layer surface matches. Wherein, the convex structure in the second light adjustment layer is used to change the transmission direction of the light emitted to the surface of the convex structure.
步骤1108、在形成有第二光调节结构的衬底基板上形成第二电极层。Step 1108, forming a second electrode layer on the base substrate on which the second light adjustment structure is formed.
步骤1108的实现方式可以参考步骤1006的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1108, reference may be made to the implementation manner of step 1006, and details are not described herein in the embodiment of the present disclosure.
需要说的是,可以根据实际需要选择在第一电极层和发光层之间设置或者不设置第一平坦层。并且,当无需在第一电极层和发光层之间设置第一平坦层时,可以选择不执行上述步骤1003和步骤1104,即可以直接在在形成有第一光调节层的衬底基板上形成发光层。类似的,可以根据实际需要选在在第二电极层和发光层之间设置或者不设置第二平坦层。并且,当无需在第二电极层和发光层之间设置第二平坦层时,可以选择不执行上述步骤1005和步骤1106,即可以直接在形成有发光层的衬底基板上形成第二光调节层。It needs to be said that the first flat layer can be selected between the first electrode layer and the light-emitting layer or not according to actual needs. Moreover, when there is no need to provide a first flat layer between the first electrode layer and the light-emitting layer, the above steps 1003 and 1104 can be selected not to be performed, that is, it can be directly formed on the base substrate on which the first light adjustment layer is formed. Luminescent layer. Similarly, the second flat layer can be arranged or not arranged between the second electrode layer and the light-emitting layer according to actual needs. Moreover, when there is no need to provide a second flat layer between the second electrode layer and the light-emitting layer, the above steps 1005 and 1106 can be selected not to be performed, that is, the second light adjustment layer can be directly formed on the base substrate on which the light-emitting layer is formed. Floor.
综上所述,本公开实施例提供的发光单元的制造方法,该方法制造的发光单元包括平坦层,相较于相关技术,增大了位于平坦层两侧的发光层与电极层 之间的距离,减少了与电极层表面电子产生共振的光子的量,即减少了通过表面等离子模态消耗的光量,增加了从发光单元射入到空气中的光量,进而提高了发光单元的出光效率。In summary, the light-emitting unit manufacturing method provided by the embodiments of the present disclosure includes a flat layer. Compared with related technologies, the gap between the light-emitting layer and the electrode layer on both sides of the flat layer is increased. The distance reduces the amount of photons that resonate with the surface electrons of the electrode layer, that is, reduces the amount of light consumed through the surface plasma mode, increases the amount of light injected from the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
并且,由于发光单元还包括光调节结构,该光调节结构能够改变发射至光调节结构表面的光的传输方向,使得光从光调节结构照射至其他膜层时的入射角度发生改变,且当光的入射角度小于光的全反射角时,光能够通过光的折射从该其他膜层射出,减少了发生全反射的光量,即减少了通过波导模态消耗的光量,增加了射入到空气中的光量,进一步提高了发光单元的出光效率。Moreover, since the light-emitting unit further includes a light-regulating structure, the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
可选地,平坦层和发光层之间还可以设置有注入层,例如注入层可以包括第一注入层和第二注入层。该注入层用于向发光层注入带电粒子。下面以在图10所示的发光单元的制造方法的基础上,在第一平坦层和发光层之间形成第一注入层,在第二平坦层和发光层之间形成第二注入层为例,对发光单元的制造方法进行说明。Optionally, an injection layer may be provided between the flat layer and the light-emitting layer. For example, the injection layer may include a first injection layer and a second injection layer. The injection layer is used to inject charged particles into the light-emitting layer. Next, based on the method of manufacturing the light-emitting unit shown in FIG. 10, a first injection layer is formed between the first flat layer and the light-emitting layer, and a second injection layer is formed between the second flat layer and the light-emitting layer as an example , The manufacturing method of the light-emitting unit will be described.
如图13所示,该发光单元的制造方法包括:As shown in FIG. 13, the manufacturing method of the light-emitting unit includes:
步骤1401、提供一衬底基板。Step 1401: Provide a base substrate.
步骤1401的实现方式可以参考步骤1101的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1401, reference may be made to the implementation manner of step 1101, and details are not described herein in the embodiment of the present disclosure.
步骤1402、在衬底基板上形成第一电极层。 Step 1402, forming a first electrode layer on the base substrate.
步骤1402的实现方式可以参考步骤1102的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1402, reference may be made to the implementation manner of step 1102, and details are not described in the embodiment of the present disclosure.
步骤1403、在形成有第一电极层的衬底基板上形成第一光调节层。 Step 1403, forming a first light adjustment layer on the base substrate on which the first electrode layer is formed.
步骤1403的实现方式可以参考步骤1103的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1403, reference may be made to the implementation manner of step 1103, and details are not described herein in the embodiment of the present disclosure.
步骤1404、在形成有第一光调节层的衬底基板上形成第一平坦层。 Step 1404, forming a first flat layer on the base substrate on which the first light adjustment layer is formed.
步骤1404的实现方式可以参考步骤1104的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1404, reference may be made to the implementation manner of step 1104, and details are not described herein in the embodiment of the present disclosure.
步骤1405、在形成有第一平坦层的衬底基板上形成第一注入层。 Step 1405, forming a first injection layer on the base substrate on which the first flat layer is formed.
可以采用磁控溅射、热蒸发或者PECVD等方法在形成有第一平坦层的衬底基板上沉积一层具有一定厚度的第一注入层材料,得到第一注入薄膜层,然后通过一次构图工艺对第一注入薄膜层进行图形化处理得到第一注入层。可选地, 该第一注入层材料和该第一注入层的厚度可以根据实际需要进行设置。示例的,该第一注入层材料可以为P掺杂型材料或N掺杂型材料。Magnetron sputtering, thermal evaporation or PECVD can be used to deposit a layer of the first injection layer material with a certain thickness on the base substrate with the first flat layer to obtain the first injection film layer, and then pass through a patterning process The first injection film layer is patterned to obtain the first injection layer. Optionally, the material of the first injection layer and the thickness of the first injection layer can be set according to actual needs. For example, the material of the first injection layer may be a P-doped material or an N-doped material.
步骤1406、在形成有第一注入层的衬底基板上形成发光层。 Step 1406, forming a light-emitting layer on the base substrate on which the first injection layer is formed.
步骤1406的实现方式可以参考步骤1105的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1406, reference may be made to the implementation manner of step 1105, and details are not described herein in the embodiment of the present disclosure.
步骤1407、在形成有发光层的衬底基板上形成第二注入层。 Step 1407, forming a second injection layer on the base substrate on which the light-emitting layer is formed.
可以采用磁控溅射、热蒸发或者PECVD等方法在形成有发光层的衬底基板上沉积一层具有一定厚度的第二注入层材料,得到第二注入薄膜层,然后通过一次构图工艺对第二注入薄膜层进行图形化处理得到第二注入层。可选地,该第二注入层材料和该第二注入层的厚度可以根据实际需要进行设置。示例的,该第二注入层材料可以为P掺杂型材料或N掺杂型材料。Magnetron sputtering, thermal evaporation, or PECVD can be used to deposit a layer of material for the second injection layer with a certain thickness on the base substrate with the light-emitting layer to obtain the second injection film layer, and then perform a patterning process on the second injection layer. The second injection film layer is patterned to obtain the second injection layer. Optionally, the material of the second injection layer and the thickness of the second injection layer can be set according to actual needs. For example, the material of the second injection layer may be a P-doped material or an N-doped material.
步骤1408、在形成有第二注入层的衬底基板上形成第二平坦层。 Step 1408, forming a second flat layer on the base substrate on which the second injection layer is formed.
步骤1408的实现方式可以参考步骤1106的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1408, reference may be made to the implementation manner of step 1106, and details are not described herein in the embodiment of the present disclosure.
步骤1409、在形成有第二平坦层的衬底基板上形成第二光调节层。 Step 1409, forming a second light adjustment layer on the base substrate on which the second flat layer is formed.
步骤1409的实现方式可以参考步骤1107的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1409, reference may be made to the implementation manner of step 1107, and details are not described herein in the embodiment of the present disclosure.
步骤1410、在形成有第二光调节层的衬底基板上形成第二电极层。 Step 1410, forming a second electrode layer on the base substrate on which the second light adjustment layer is formed.
步骤1410的实现方式可以参考步骤1006的实现方式,本公开实施例在此不做赘述。For the implementation manner of step 1410, reference may be made to the implementation manner of step 1006, and details are not described herein in the embodiment of the present disclosure.
需要说明的是,当平坦层掺杂有光调节结构时,可以选择不执行步骤1403和步骤1409,并在步骤1404中和步骤1408的执行过程中,采用掺杂有光调节材料的平坦层材料制造平坦层。It should be noted that when the flat layer is doped with a light adjustment structure, step 1403 and step 1409 can be selected not to be performed, and in step 1404 and step 1408, a flat layer material doped with a light adjustment material is used Make a flat layer.
需要说明的是,可以根据实际需要选择在第一平坦层和发光层之间设置或者不设置第一注入层。并且,当无需在第一平坦层和发光层之间设置第一注入层时,可以选择不执行上述步骤1405,即可以直接在在形成有第一平坦层的衬底基板上形成发光层。类似的,可以根据实际需要选在在第二平坦层和发光层之间设置或者不设置第二注入层。并且,当无需在第二平坦层和发光层之间设置第二注入层时,可以选择不执行上述步骤1407,即可以直接在形成有发光层的衬底基板上形成第二平坦层。It should be noted that, according to actual needs, the first injection layer can be selected between the first flat layer and the light-emitting layer or not. Moreover, when there is no need to provide the first injection layer between the first flat layer and the light emitting layer, the above step 1405 can be selected not to be performed, that is, the light emitting layer can be directly formed on the base substrate on which the first flat layer is formed. Similarly, the second injection layer can be arranged or not arranged between the second flat layer and the light-emitting layer according to actual needs. Moreover, when there is no need to provide a second injection layer between the second flat layer and the light-emitting layer, the above step 1407 can be selected not to be performed, that is, the second flat layer can be directly formed on the base substrate on which the light-emitting layer is formed.
综上所述,本公开实施例提供的发光单元的制造方法,该方法制造的发光单元包括平坦层,相较于相关技术,增大了位于平坦层两侧的发光层与电极层之间的距离,减少了与电极层表面电子产生共振的光子的量,即减少了通过表面等离子模态消耗的光量,增加了从发光单元射入到空气中的光量,进而提高了发光单元的出光效率。In summary, the light-emitting unit manufacturing method provided by the embodiments of the present disclosure includes a flat layer. Compared with related technologies, the gap between the light-emitting layer and the electrode layer on both sides of the flat layer is increased. The distance reduces the amount of photons that resonate with the surface electrons of the electrode layer, that is, reduces the amount of light consumed through the surface plasma mode, increases the amount of light injected from the light-emitting unit into the air, and improves the light-emitting efficiency of the light-emitting unit.
并且,由于发光单元还包括光调节结构,该光调节结构能够改变发射至光调节结构表面的光的传输方向,使得光从光调节结构照射至其他膜层时的入射角度发生改变,且当光的入射角度小于光的全反射角时,光能够通过光的折射从该其他膜层射出,减少了发生全反射的光量,即减少了通过波导模态消耗的光量,增加了射入到空气中的光量,进一步提高了发光单元的出光效率。Moreover, since the light-emitting unit further includes a light-regulating structure, the light-regulating structure can change the transmission direction of the light emitted to the surface of the light-regulating structure, so that the incident angle of the light from the light-regulating structure to other film layers is changed, and when the light When the incident angle is less than the total reflection angle of light, light can be emitted from the other film through the refraction of light, reducing the amount of light that undergoes total reflection, that is, reducing the amount of light consumed through the waveguide mode, and increasing the amount of light entering the air The amount of light further improves the light-emitting efficiency of the light-emitting unit.
需要说明的是,本公开实施例提供的发光单元的制造方法步骤的先后顺序可以进行适当调整,步骤也可以根据情况进行相应增减,任何熟悉本技术领域的技术人员在本公开揭露的技术范围内,可轻易想到变化的方法,都应涵盖在本公开的保护范围之内,因此不再赘述。It should be noted that the sequence of the steps in the method for manufacturing the light-emitting unit provided by the embodiments of the present disclosure can be adjusted appropriately, and the steps can also be increased or decreased according to the situation. Anyone skilled in the art in the technical scope disclosed in the present disclosure Within the scope, the methods that can be easily conceived of changes should be covered by the scope of protection of the present disclosure, and therefore will not be repeated.
本公开实施例提供了一种显示装置,显示装置包括:上述实施例中任一的发光单元。The embodiments of the present disclosure provide a display device, and the display device includes: the light-emitting unit of any one of the foregoing embodiments.
进一步地,显示装置还可以包括:覆盖在发光单元表面的透明盖板。该透明盖板用于保护发光单元,且透明盖板远离发光单元一侧的表面的粗糙度大于透明盖板靠近发光单元一侧的表面的粗糙度。例如,透明盖板远离发光单元一侧表面可以具有多个的凸起结构或凹陷结构。Further, the display device may further include: a transparent cover plate covering the surface of the light emitting unit. The transparent cover is used to protect the light-emitting unit, and the roughness of the surface of the transparent cover on the side away from the light-emitting unit is greater than the roughness of the surface of the transparent cover on the side close to the light-emitting unit. For example, the surface of the transparent cover plate on the side away from the light-emitting unit may have multiple convex structures or concave structures.
当透明盖板远离发光单元的一侧的表面粗糙度较大时,在光由透明盖板发射至空气中的过程中,照射至透明盖板远离发光单元的一侧的表面的光,能够在透明盖板远离发光单元的界面发生反射和折射,使得光由透明盖板射入到空气中的入射角发生改变,且当该入射角小于光由透明盖板射入空气时的全反射角时,光能够从透明盖板中射出,进而能够使更多的光从透明盖板中射出,减少了通过衬底模态消耗的光量,增加了从显示装置中射出的光量。When the surface roughness of the side of the transparent cover plate away from the light-emitting unit is large, the light irradiated to the surface of the transparent cover plate on the side away from the light-emitting unit can be The interface of the transparent cover plate away from the light-emitting unit is reflected and refracted, so that the incident angle of light from the transparent cover plate into the air changes, and when the incident angle is smaller than the total reflection angle of the light from the transparent cover plate into the air , The light can be emitted from the transparent cover, and more light can be emitted from the transparent cover, which reduces the amount of light consumed through the substrate mode and increases the amount of light emitted from the display device.
可选地,该显示装置可以为:液晶面板、电子纸、有机发光二极管(英文:Organic Light-Emitting Diode,简称:OLED)面板、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的装置或部件。Optionally, the display device may be: liquid crystal panel, electronic paper, organic light-emitting diode (English: Organic Light-Emitting Diode, OLED for short) panel, mobile phone, tablet computer, TV, monitor, notebook computer, digital photo frame, Any device or component with a display function, such as a navigator.
由上可知,本公开实施例提供的显示装置,通过设置平坦层,减少了通过表面等离子模态消耗的光量,通过设置光调节结构,减少了通过波导模态消耗的光量,通过改善覆盖在发光单元表面的透明盖板的粗糙度,减少了通过衬底模态消耗的光量,增加了从发光单元射入到空气中的光量,提高了发光单元的出光效率。It can be seen from the above that the display device provided by the embodiment of the present disclosure reduces the amount of light consumed through the surface plasma mode by providing a flat layer, and reduces the amount of light consumed through the waveguide mode by providing a light adjustment structure, and by improving the coverage on the light emission The roughness of the transparent cover on the surface of the unit reduces the amount of light consumed through the substrate mode, increases the amount of light injected into the air from the light-emitting unit, and improves the light-emitting efficiency of the light-emitting unit.
需要指出的是,在附图中,为了图示的清晰可能夸大了层和区域的尺寸。而且可以理解,当元件或层被称为在另一元件或层“上”时,它可以直接在其他元件上,或者可以存在中间的层。另外,可以理解,当元件或层被称为在另一元件或层“下”时,它可以直接在其他元件下,或者可以存在一个以上的中间的层或元件。另外,还可以理解,当层或元件被称为在两层或两个元件“之间”时,它可以为两层或两个元件之间惟一的层,或还可以存在一个以上的中间层或元件。通篇相似的参考标记指示相似的元件。It should be noted that in the drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element or intervening layers may be present. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it can be directly under the other element, or there may be more than one intervening layer or element. In addition, it can also be understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or elements, or more than one intervening layer may also be present. Or components. Similar reference numerals indicate similar elements throughout.
本公开中术语“和/或”,仅仅是一种描述关联对象的关联关系,表示可以存在三种关系,例如,A和/或B,可以表示:单独存在A,同时存在A和B,单独存在B这三种情况。另外,本文中字符“/”,一般表示前后关联对象是一种“或”的关系。The term "and/or" in the present disclosure is only an association relationship describing the associated objects, which means that there can be three relationships, for example, A and/or B, which can mean: A alone exists, and both A and B exist. There are three cases of B. In addition, the character "/" in this text generally indicates that the associated objects before and after are in an "or" relationship.
在本公开中,术语“第一”和“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性。术语“至少一个”指一个或一个以上,除非另有明确的限定。术语“多个”指两个或两个以上,除非另有明确的限定。In the present disclosure, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance. The term "at least one" refers to one or more than one unless specifically defined otherwise. The term "plurality" refers to two or more, unless specifically defined otherwise.
以上仅为本公开的可选实施例,并不用以限制本公开,凡在本公开的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本公开的保护范围之内。The above are only optional embodiments of the present disclosure and are not intended to limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present disclosure shall be included in the protection scope of the present disclosure. Inside.

Claims (20)

  1. 一种发光单元(1),所述发光单元(1)包括:第一电极层(11)、发光层(12)和第二电极层(13);A light emitting unit (1), the light emitting unit (1) comprising: a first electrode layer (11), a light emitting layer (12) and a second electrode layer (13);
    所述发光单元(1)还包括:平坦层(14)和光调节结构(15);The light emitting unit (1) further includes: a flat layer (14) and a light adjusting structure (15);
    所述平坦层(14)位于所述第一电极层(11)和所述第二电极层(13)中至少一个与所述发光层(12)之间;The flat layer (14) is located between at least one of the first electrode layer (11) and the second electrode layer (13) and the light-emitting layer (12);
    所述光调节结构(15)用于改变发射至所述光调节结构(15)表面的光的传输方向,所述光调节结构(15)满足以下任一个或多个的组合:所述光调节结构(15)位于所述平坦层(14)的内部,以及,所述光调节结构(15)位于所述平坦层(14)的外部远离所述发光层(12)的一侧。The light adjustment structure (15) is used to change the transmission direction of the light emitted to the surface of the light adjustment structure (15), and the light adjustment structure (15) satisfies any one or a combination of the following: The structure (15) is located inside the flat layer (14), and the light adjustment structure (15) is located outside the flat layer (14) on a side away from the light-emitting layer (12).
  2. 根据权利要求1所述的发光单元(1),The light-emitting unit (1) according to claim 1,
    所述平坦层(14)包括以下任一个或多个的组合:The flat layer (14) includes any one or more of the following combinations:
    位于所述第一电极层(11)与所述发光层(12)之间的第一平坦层(141);A first flat layer (141) located between the first electrode layer (11) and the light-emitting layer (12);
    以及,位于所述第二电极层(13)与所述发光层(12)之间的第二平坦层(142)。And, a second flat layer (142) located between the second electrode layer (13) and the light-emitting layer (12).
  3. 根据权利要求1或2所述的发光单元(1),所述光调节结构(15)的介电常数大于或等于所述平坦层(14)的介电常数。The light-emitting unit (1) according to claim 1 or 2, the dielectric constant of the light adjustment structure (15) is greater than or equal to the dielectric constant of the flat layer (14).
  4. 根据权利要求1至3任一所述的发光单元(1),所述光调节结构(15)包括散射粒子(151),所述散射粒子(151)混合在所述平坦层(14)内。The light emitting unit (1) according to any one of claims 1 to 3, the light adjusting structure (15) comprises scattering particles (151), and the scattering particles (151) are mixed in the flat layer (14).
  5. 根据权利要求4所述的发光单元(1),混合在所述平坦层(14)内的散射粒子(151)的结构为以下任一种或多种的组合:球状结构、棱台结构、棱柱结构、圆台结构、圆柱结构和圆锥结构。The light-emitting unit (1) according to claim 4, the structure of the scattering particles (151) mixed in the flat layer (14) is any one or a combination of the following: spherical structure, prism structure, prism Structure, truncated cone structure, cylindrical structure and conical structure.
  6. 根据权利要求4所述的发光单元(1),混合在所述平坦层(14)内的散射粒子(151)的材料为以下任一种或多种的组合:树脂、二氧化硅、二氧化钛和二氧化锆。The light-emitting unit (1) according to claim 4, wherein the material of the scattering particles (151) mixed in the flat layer (14) is any one or a combination of the following: resin, silicon dioxide, titanium dioxide and zirconium dioxide.
  7. 根据权利要求1至6任一所述的发光单元(1),所述光调节结构(15)包括光调节层,所述光调节层靠近所述发光层(12)的一侧具有多个凸起结构。The light-emitting unit (1) according to any one of claims 1 to 6, the light-adjusting structure (15) comprises a light-adjusting layer, and a side of the light-adjusting layer close to the light-emitting layer (12) has a plurality of protrusions.起结构。 From the structure.
  8. 根据权利要求7所述的发光单元(1),所述凸起结构靠近所述发光层(12)的表面在所述发光层(12)上的正投影,位于所述凸起结构远离所述发光层(12)的表面在所述发光层(12)上的正投影的内部。The light-emitting unit (1) according to claim 7, wherein the convex structure is close to the orthographic projection of the surface of the light-emitting layer (12) on the light-emitting layer (12), and is located far away from the convex structure. The surface of the light emitting layer (12) is inside the orthographic projection on the light emitting layer (12).
  9. 根据权利要求7所述的发光单元(1),分布在所述光调节层靠近所述发光层(12)的一侧的凸起结构的结构为以下任一种或多种的组合:半球结构、棱台结构、棱柱结构、圆台结构、圆柱结构、棱锥结构和圆锥结构。The light-emitting unit (1) according to claim 7, wherein the structure of the convex structure distributed on the side of the light-regulating layer close to the light-emitting layer (12) is any one or a combination of the following: a hemispherical structure , Prismatic structure, prismatic structure, truncated cone structure, cylindrical structure, pyramid structure and conical structure.
  10. 根据权利要求1至9任一所述的发光单元(1),所述发光单元(1)还包括:注入层,所述注入层位于所述平坦层(14)与所述发光层(12)之间,所述注入层用于向所述发光层(12)注入带电粒子。The light-emitting unit (1) according to any one of claims 1 to 9, the light-emitting unit (1) further comprising: an injection layer, the injection layer being located between the flat layer (14) and the light-emitting layer (12) In between, the injection layer is used to inject charged particles into the light-emitting layer (12).
  11. 根据权利要求10所述的发光单元(1),所述第一电极层(11)用于与交流电源(2)的第一极连接,所述第二电极层(13)用于与所述交流电源(2)的第二极连接。The light-emitting unit (1) according to claim 10, the first electrode layer (11) is used to connect with the first pole of the AC power supply (2), and the second electrode layer (13) is used to connect with the The second pole of the AC power supply (2) is connected.
  12. 根据权利要求10或11所述的发光单元(1),所述平坦层(14)的材料为绝缘材料。The light-emitting unit (1) according to claim 10 or 11, wherein the material of the flat layer (14) is an insulating material.
  13. 根据权利要求12所述的发光单元(1),所述平坦层(14)的材料为以下任一种或多种的组合:聚乙烯吡咯烷酮、聚偏氟乙烯、二氧化硅和二氧化铪。The light-emitting unit (1) according to claim 12, wherein the material of the flat layer (14) is any one or a combination of the following: polyvinylpyrrolidone, polyvinylidene fluoride, silicon dioxide and hafnium dioxide.
  14. 根据权利要求1至13任一所述的发光单元(1),所述平坦层(14)的厚度大于或等于100纳米。According to the light-emitting unit (1) according to any one of claims 1 to 13, the thickness of the flat layer (14) is greater than or equal to 100 nanometers.
  15. 根据权利要求1至14任一所述的发光单元(1),所述第一电极层(11)的材料和所述第二电极层(13)中至少一个的材料为有机材料。The light-emitting unit (1) according to any one of claims 1 to 14, wherein at least one of the material of the first electrode layer (11) and the material of the second electrode layer (13) is an organic material.
  16. 一种发光单元的制造方法,所述方法包括:A method for manufacturing a light-emitting unit, the method comprising:
    提供一衬底基板;Provide a base substrate;
    在所述衬底基板上形成第一电极层、发光层、第二电极层、平坦层和光调节结构,得到所述发光单元;Forming a first electrode layer, a light emitting layer, a second electrode layer, a flat layer and a light adjusting structure on the base substrate to obtain the light emitting unit;
    其中,所述平坦层位于所述第一电极层和所述第二电极层中至少一个与所述发光层之间;Wherein, the flat layer is located between at least one of the first electrode layer and the second electrode layer and the light-emitting layer;
    所述光调节结构用于改变发射至所述光调节结构表面的光的传输方向,所述光调节结构满足以下任一个或多个的组合:所述光调节结构位于所述平坦层的内部,以及,所述光调节结构位于所述平坦层的外部远离所述发光层的一侧。The light adjustment structure is used to change the transmission direction of the light emitted to the surface of the light adjustment structure, and the light adjustment structure satisfies any one or a combination of the following: the light adjustment structure is located inside the flat layer, And, the light adjusting structure is located on a side of the flat layer away from the light emitting layer.
  17. 根据权利要求16所述的方法,所述在所述衬底基板上形成第一电极层、发光层、第二电极层、平坦层和光调节结构,包括:The method according to claim 16, said forming a first electrode layer, a light emitting layer, a second electrode layer, a flat layer and a light adjusting structure on the base substrate, comprising:
    在所述衬底基板上形成所述第一电极层;Forming the first electrode layer on the base substrate;
    在形成有所述第一电极层的衬底基板上形成第一光调节层;Forming a first light adjustment layer on the base substrate on which the first electrode layer is formed;
    在形成有所述第一光调节层的衬底基板上形成第一平坦层;Forming a first flat layer on the base substrate on which the first light adjustment layer is formed;
    在形成有所述第一平坦层的衬底基板上形成所述发光层;Forming the light-emitting layer on a base substrate on which the first flat layer is formed;
    在形成有所述发光层的衬底基板上形成第二平坦层,所述平坦层包括所述第一平坦层和所述第二平坦层;Forming a second flat layer on the base substrate on which the light-emitting layer is formed, the flat layer including the first flat layer and the second flat layer;
    在形成有所述第二平坦层的衬底基板上形成第二光调节层,所述光调节结构包括所述第一光调节层和所述第二光调节层;Forming a second light adjustment layer on the base substrate on which the second flat layer is formed, and the light adjustment structure includes the first light adjustment layer and the second light adjustment layer;
    在形成有所述第二光调节层的衬底基板上形成所述第二电极层。The second electrode layer is formed on the base substrate on which the second light adjustment layer is formed.
  18. 一种显示装置,所述显示装置包括:权利要求1至15任一所述的发光单元。A display device comprising: the light-emitting unit according to any one of claims 1 to 15.
  19. 根据权利要求18所述的显示装置,所述显示装置还包括:覆盖在所述发光单元表面的透明盖板,所述透明盖板用于保护所述发光单元,且所述透明 盖板远离所述发光单元一侧的表面的粗糙度大于所述透明盖板靠近所述发光单元一侧的表面的粗糙度。The display device according to claim 18, further comprising: a transparent cover plate covering the surface of the light-emitting unit, the transparent cover plate is used to protect the light-emitting unit, and the transparent cover plate is away from all The roughness of the surface on one side of the light emitting unit is greater than the roughness of the surface on the side of the transparent cover close to the light emitting unit.
  20. 根据权利要求19所述的显示装置,所述透明盖板远离所述发光单元一侧的表面具有多个凸起结构或多个凹陷结构。18. The display device according to claim 19, wherein a surface of the transparent cover on a side away from the light emitting unit has a plurality of convex structures or a plurality of concave structures.
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CN113554938B (en) * 2021-07-21 2023-08-22 南通惟怡新材料科技有限公司 Light-emitting improved functional film and display panel

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