WO2020235848A1 - Electronic device including light emitting device - Google Patents

Electronic device including light emitting device Download PDF

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Publication number
WO2020235848A1
WO2020235848A1 PCT/KR2020/006222 KR2020006222W WO2020235848A1 WO 2020235848 A1 WO2020235848 A1 WO 2020235848A1 KR 2020006222 W KR2020006222 W KR 2020006222W WO 2020235848 A1 WO2020235848 A1 WO 2020235848A1
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WO
WIPO (PCT)
Prior art keywords
light
housing
reflective structure
electronic device
reflected
Prior art date
Application number
PCT/KR2020/006222
Other languages
French (fr)
Korean (ko)
Inventor
김태수
김시홍
김영석
이효웅
전희수
Original Assignee
삼성전자 주식회사
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Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2020235848A1 publication Critical patent/WO2020235848A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68Details of reflectors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69Details of refractors forming part of the light source
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements

Definitions

  • Various embodiments of the present disclosure relate to an electronic device including a light emitting device.
  • Electronic devices may output stored information as sound or image.
  • various functions may be installed in one electronic device such as a mobile communication terminal.
  • entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions of schedule management and electronic wallets are being integrated into one electronic device.
  • the electronic device includes a light-emitting device that emits light when implementing the various functions, and the light-emitting device may include a light emission diode (hereinafter referred to as an LED).
  • the light-emitting device may include a light emission diode (hereinafter referred to as an LED).
  • a light-emitting device capable of superimposing, reflecting, and/or diffusing light from a plurality of light-emitting elements provided in an electronic device in first and second directions (eg, X-axis direction or Y-axis direction)
  • An electronic device including a can be provided.
  • an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements that emit light in a first direction (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing; A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing; A first reflective structure disposed in the housing and receiving at least a portion of the first diffused light diffused from the first diffuser and reflecting it in the second direction; A second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the at least part of the first diffused light and the first reflected light reflected from the first reflecting structure and reflecting it in the second direction ; And a second diffusion member disposed between the housing and the second reflective structure, receiving second reflected light reflected
  • an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements emitting light in a first direction (eg, a Z-axis direction) of the housing; Arranged in the housing, the at least part of the light is directed in a second direction (eg, X-axis direction or Y-axis direction) toward the inside of the housing and a third direction (eg, X-axis direction or Y-axis direction) toward the outside of the housing.
  • a first direction eg, a Z-axis direction
  • a third direction eg, X-axis direction or Y-axis direction
  • an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements that emit light in a first direction (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing; A first reflective structure disposed in parallel with the plurality of light-emitting elements, receiving the light and reflecting it in a second direction (eg, an X-axis direction or a Y-axis direction) from the inside of the housing to the outside; A second reflective structure disposed in the housing to be spaced apart from the first reflective structure, receiving the first reflected light reflected from the first reflective structure and reflecting it in the second direction; A third reflective structure disposed on the circuit board to be spaced apart from the second reflective structure, receiving second reflected light reflected from the second reflective structure and reflecting it in the second direction; And a diffusing member disposed between the housing and the third reflective structure, receiving third reflected light reflected from the third reflective
  • an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements that emit light in a first direction (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing; A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing; A first reflective structure disposed in the housing and reflecting the light in the second direction; And a second reflective structure disposed on the circuit board and reflecting the light in the second direction. And a second diffusion member receiving the light of the second reflective structure and diffusing it to the outside of the housing.
  • a first direction eg, an X-axis direction or a Y-axis direction
  • a first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction (eg
  • light from a plurality of light emitting devices provided in the electronic device according to an embodiment of the present disclosure is directed in the first and second directions (eg, in the X-axis direction or the Y-axis direction). ), by configuring at least one diffusing member and a reflective structure in the electronic device so as to be superimposed, reflective and/or diffused in a manner such that the light is directed in the first and second directions (eg; It is possible to improve the overlapping efficiency, reflection efficiency, and/or diffusion efficiency in the X-axis direction or the Y-axis direction), thereby preventing hot spots occurring in conventional electronic devices.
  • the light-emitting device can uniformly diffuse the light and improve the visibility of the product.
  • the size of the light emitting device can be reduced.
  • An electronic device including a light emitting device can be made smaller or slimmer.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.
  • FIG. 2 is an exploded three-dimensional view showing a configuration of an electronic device including a light emitting device according to various embodiments of the present disclosure.
  • FIG. 3 is a three-dimensional view illustrating an electronic device including a light emitting device according to various embodiments of the present disclosure.
  • FIG. 4 is a cross-sectional side view taken along line AA′ of FIG. 3 and illustrating an operating state of an electronic device including a light emitting device.
  • FIG. 5 is an enlarged three-dimensional view illustrating a second reflective structure coupled to a circuit board among the configurations of an electronic device including a light emitting device according to various embodiments of the present disclosure.
  • FIG. 6 is an enlarged three-dimensional view illustrating another embodiment of a second reflective structure coupled to a circuit board among the configurations of an electronic device including a light emitting device according to various embodiments of the present disclosure.
  • FIG. 7 is a cross-sectional side view taken along line AA′ of FIG. 3, and is a side cross-sectional view illustrating an operating state of another embodiment of an electronic device including a light emitting device.
  • FIG. 8 is a cross-sectional side view taken along line AA′ of FIG. 3, and is a side cross-sectional view illustrating an operating state of another embodiment of an electronic device including a light emitting device.
  • FIG. 1 a block diagram of an electronic device 101 in a network environment 100 is illustrated.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199, for example, : It is possible to communicate with the electronic device 104 or the server 108 through a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 for example, a short-range wireless communication network
  • a second network 199 for example, : It is possible to communicate with the electronic device 104 or the server 108 through a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included.
  • a sensor module 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197
  • at least one of these components may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components may be implemented as one integrated circuit.
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the display device 160 eg, a display.
  • the processor 120 for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 may store commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132. The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134.
  • software eg, a program 140
  • the processor 120 may store commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132.
  • the command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134.
  • the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg: a graphic processing unit, an image signal processor, and a sensor) that can be operated independently or together.
  • a hub processor, or a communication processor e.g., the coprocessor 123 may be set to use less power than the main processor 121 or to be specialized for a designated function.
  • the secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.
  • the coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as a part of other functionally related components (eg, the camera module 180 or the communication module 190). .
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176).
  • the data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto.
  • the memory 130 may include a volatile memory 132 or a nonvolatile memory 134.
  • the program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.
  • the input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from an outside (eg, a user) of the electronic device 101.
  • the input device 150 may include, for example, a microphone, a mouse, or a keyboard.
  • the sound output device 155 may output an sound signal to the outside of the electronic device 101.
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.
  • the audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102) (for example, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used for the electronic device 101 to connect directly or wirelessly with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture a still image and a video.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101.
  • the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel.
  • the communication module 190 operates independently of the processor 120 (eg, an application processor) and may include one or more communication processors that support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194, eg, LAN.
  • GNSS global navigation satellite system
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199, e.g., a cellular network, the Internet, or a computer network. It can communicate with external electronic devices through a telecommunication network (such as a LAN or WAN).
  • a telecommunication network such as a LAN or WAN.
  • the wireless communication module 192 uses subscriber information stored in the subscriber identification module 196 (eg, International Mobile Subscriber Identifier (IMSI)) within a communication network such as the first network 198 or the second network 199.
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 can be checked and authenticated.
  • the antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside.
  • the antenna module 197 may include one or more antennas, from which at least one suitable for a communication method used in a communication network such as the first network 198 or the second network 199 An antenna of, for example, may be selected by the communication module 190.
  • the signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.
  • a communication method e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101.
  • all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101.
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, or client-server computing technology may be used.
  • Electronic devices may be devices of various types.
  • the electronic device is, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance device, a speaker device, an artificial intelligence (AI) speaker or an artificial intelligence (AI) device. intelligence) may include a robot.
  • a portable communication device e.g., a smartphone
  • a computer device e.g., a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance device, a speaker device, an artificial intelligence (AI) speaker or an artificial intelligence (AI) device.
  • AI artificial intelligence
  • the electronic device according to the embodiment of the present document is not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish the component from other corresponding components, and the components may be referred to in other aspects (eg, importance or Order) is not limited.
  • Some (eg, a first) component is referred to as “coupled” or “connected” to another (eg, a second) component, with or without the terms “functionally” or “communicatively”.
  • a first component is referred to as “coupled” or “connected” to another (eg, a second) component, with or without the terms “functionally” or “communicatively”.
  • any of the above components may be connected to the other components directly (eg by wire), wirelessly, or via a third component.
  • module used in this document may include a unit implemented by hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits.
  • the module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (for example, the program 140).
  • the processor eg, the processor 120 of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • non-transitory only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and temporary. It does not distinguish the case where it is stored as.
  • a signal e.g., electromagnetic wave
  • the method according to various embodiments of the present disclosure may be provided by being included in a computer program product.
  • Computer program products can be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store TM ) or two user devices ( It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones).
  • a device e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play Store TM
  • two user devices It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones).
  • at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.
  • each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are sequentially, parallel, repeatedly, or heuristically executed, or one or more of the above operations are executed in a different order or omitted. Or one or more other actions may be added.
  • FIG. 2 is an exploded three-dimensional view showing the configuration of an electronic device (eg, the electronic device 101 of FIG. 1) including a light emitting device 200 according to various embodiments of the present disclosure
  • FIG. 3 is an exploded view illustrating various implementations of the present disclosure.
  • it is a three-dimensional view showing an electronic device including the light emitting device 200 (for example, the electronic device 101 of FIG. 1)
  • FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3, and the light emitting device 200
  • It is a side cross-sectional view showing an operating state of an electronic device (eg, the electronic device 101 of FIG. 1) including.
  • an electronic device including the light emitting device 200 according to various embodiments includes a portable communication device, a smart phone, a computer device, a portable multimedia device, It may include at least one of a portable medical device, a camera, a wearable device, a home appliance device, a home device, a speaker device, an artificial intelligence (AI) speaker, or an artificial intelligence (AI) robot.
  • the electronic device 101 may include at least one of a speaker mounted on a floor or an artificial intelligence (AI) speaker.
  • the electronic device 101 will be described using a speaker as an example.
  • the electronic device 101 may be included in the housing 210, and the housing 210 may include at least one decor member 211 and 212.
  • the housing 210 may include a plurality of light-emitting elements 221 that illuminate the at least one decor member 211 and 212.
  • the light L1 of the light emitting device 221 may be radiated to the outside of the housing 210 through the at least one decor member 211 and 212.
  • the at least one decor member 211 and 212 may not only implement various visual effects by using the emission color, blinking period or pattern of the light L1, but also display state information of the electronic device 101. I can. for example.
  • the electronic device 101 is used as a speaker, the sound output of the speaker may be displayed through the emission color of the light L1.
  • the light L1 of the light emitting element 221 may be flashed and the user may recognize it. In this way, the electronic device 101 may display a visual effect or simple information by using the light L1 of the light emitting element 221.
  • the light emitting device 200 includes a housing 210, a circuit board 220, first and second diffusion members 230 and 260, and first and second reflective structures 240 and 250.
  • the housing 210 may include at least one decor member, and the at least one decor member may include first and second decor members 211 and 212.
  • the first decor member 211 is coupled to the center of the upper surface of the second decor member 212
  • the first surface 212a of the second decor member 212 is the first decor member 211
  • It is possible to form a decor groove (212c) coupled to, and the second surface (212b) opposite to the first surface (212a) of the second decor member 212 may arrange the first reflective structure (240). have.
  • the second decor member 212 may be disposed around a side surface of the housing 210.
  • the first decor member 211 may be formed of a disc-shaped decor member, and the second decor member 212 may be formed in a decor ring shape.
  • the first reflective structure 240 disposed on the second surface of the second decorating member 212 may be disposed to be spaced apart from the circuit board 220, and the circuit board 220 may be disposed inside the housing 210.
  • a plurality of light-emitting elements 221 may be provided to emit light in the first direction A1 (eg, in the X-axis direction or the Y-axis direction) toward.
  • the light L1 of the plurality of light emitting devices 221 is not emitted in a vertical direction (eg, Z-axis direction) of the housing 210, but a first direction A1 toward the inside of the housing 210 ) (E.g., X-axis direction or Y-axis direction).
  • the first diffusion member 230 may be disposed between the housing 210 and the circuit board 220 to receive and diffuse the light L1.
  • the first diffusion member 230 may be disposed to be spaced apart from the light emitting device 221, and may be disposed more inside the housing 210 than the light emitting device 221. Accordingly, the first diffusion member 230 emits light L1 of the light emitting element 221 toward the inside of the housing 210 in a first direction A1 (eg, an X-axis direction or a Y-axis direction). In this case, the emitted light L1 may be received and diffused.
  • the first diffusion member 230 may also be formed of a reflective member that reflects the light L1.
  • the first reflective structure 240 directs at least a portion of the first diffused light B1 diffused from the first diffuser 230 toward the outside of the housing 210 in a second direction ( It can be reflected in A2) (e.g., X-axis direction or Y-axis direction).
  • the first reflective structure 240 may be disposed to be spaced apart from the top of the light emitting element 221 and at the same time be disposed on the second surface 212b of the second decor member 212 of the housing 210. have.
  • the first reflective structure 240 reflects the at least part of the first diffused light B1 in the second direction A2 (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing 210 can do.
  • the second reflective structure 250 may be disposed on the circuit board 220 and may be disposed to be spaced apart from the first reflective structure 240.
  • the second reflective structure 250 transfers the at least part of the first diffused light B1 and the first reflected light C1 reflected from the first reflective structure 240 in the second direction A2 (eg ; Can be reflected in the X-axis direction or Y-axis direction).
  • the second reflective structure 250 may reflect the at least a portion of the first diffused light B1 and the second reflective light C2 and transmit it to the second diffuser 260 to be described later.
  • the second reflected light C2 may be reflected diagonally.
  • the second diffusion member 260 may be disposed between the housing 210 and the second reflective structure 250.
  • the second diffusion member 260 may be disposed inside the second decor member 212.
  • the second diffusion member 260 may receive the second reflected light C2 reflected from the second reflective structure 250 and diffuse to the outside of the housing 210.
  • the second diffused light B2 diffused from the second diffuser 260 may pass through the second decorating member 212 and radiate to the outside of the housing 210.
  • the second diffused light B2 may be diffused diagonally.
  • the second decorating member 212 may include at least one of a transparent decorating member or a translucent decorating member that transmits the second diffused light B2 diffused from the second diffusion member 260. have. In this embodiment, if the second decorating member 212 is configured to transmit the second diffused light B2, various decorating members other than the transparent decorating member or the translucent decorating member may be applied.
  • the light emitting device 200 included in the electronic device 101 includes the housing 210, the circuit board 220, the first, It may include two diffusion members 230 and 260 and first and second reflective structures 240 and 250.
  • the circuit board 220 having a plurality of light emitting devices 221 is provided in the housing 210, and the second reflective structure 250 is coupled to the upper surface of the circuit board 220 I can make it.
  • the first and second reflective structures 240 and 250 and the first and second diffusion members 230 and 260 may be disposed in a plane between the housing 210 and the second decorating member 212.
  • the first and second diffusion members 230 and 260 and the first and second reflective structures 240 and 250 direct the light L1 of the plurality of light emitting devices 221 in the first and second directions A1 and A2 Can be superimposed, reflected and/or diffused.
  • FIG. 5 is an enlarged three-dimensional view illustrating a second reflective structure coupled to a circuit board among the configurations of an electronic device including a light emitting device according to various embodiments of the present disclosure.
  • a plurality of coupling holes 251 for coupling the plurality of light emitting devices 221 may be formed in the second reflective structure 250.
  • the plurality of light emitting devices 221 are provided on the circuit board 220, and in this state, the second reflective structure 250 is coupled to the upper surface of the circuit board 220 and the second The plurality of light emitting devices 221 may be coupled to the plurality of coupling holes 251 of the reflective structure 250.
  • the second reflective structure 250 forms a plurality of coupling holes 251 for coupling the plurality of light emitting devices 221, so that the second reflective structure 250 and the plurality of light emitting devices 221 In addition to improving the coupling force of the second reflective structure 250 and the plurality of light emitting devices 221 can be easily combined.
  • the guide part 252 guides the inside of the housing 210 to facilitate delivery of the light L1 to the first diffusion member 230 provided inside the housing 210.
  • FIG. 6 is an enlarged three-dimensional view showing another embodiment of a second reflective structure 250 coupled to a circuit board 220 among the configurations of an electronic device 101 including a light emitting device 200 according to various embodiments of the present disclosure. Is also.
  • a plurality of coupling holes 253 formed in the second reflective structure 250 may be formed in a closed loop shape.
  • the plurality of coupling holes 253 formed in a closed loop shape are combined with the plurality of light emitting elements 221 provided on the circuit board 220, the plurality of light emitting elements 221 It can be combined by wrapping it all around.
  • the first diffusion member 230 is more inside the housing 210 than the plurality of light-emitting elements 221 And may be disposed on the upper surface of the circuit board 220. In this way, the circuit board 220 including the first diffusion member 230, the plurality of light emitting devices 221 and the second reflective structure 250 may be mounted inside the housing 210.
  • the housing 210 may include first and second decor members 211 and 212, and at the center of the upper surface of the second decor member 212
  • the first decor member 211 may be disposed, and the first reflective structure 240 may be disposed on a lower surface of the second decor member 212.
  • the second diffusion member 260 may be disposed inside the second decor member 212.
  • the second decor member 212 arranged in this way may be coupled to the upper portion of the housing 210 and may be mounted on the upper portion of the circuit board 220 at the same time.
  • the first reflective structure 240 disposed on the second surface 212b of the second decorating member 212 is disposed on the circuit board 220 and simultaneously with the second reflective structure 250 They can be arranged spaced apart.
  • the first diffused light B1 of the first diffusion member 230 and the first and second reflective structures 240 and 250 are 2
  • An overlapping space (eg, overlapping distance) overlapping the reflected light C1 and C2 in the first and second directions A1 and A2 (eg, the X-axis direction or the Y-axis direction) may be formed.
  • the first diffused light B1 of the first diffusion member 230 and the first and second reflective structures 240 and 250 are 2 A reflection space A2 for reflecting the reflected light C1 and C2 in the first and second directions A1 and A2 (eg, in the X-axis direction or the Y-axis direction) may be formed.
  • a diffusion space A3 for diffusing the second diffusion light B2 diffused from the second diffusion member 260 may be formed inside the second decor member 212.
  • the second diffused light B2 may pass through the diffusion space A3 and pass through the second decorating member 212 to radiate outward of the second decorating member 212.
  • first and second reflective structures 240 and 250 and the first and second diffusing members 230 and 260 are disposed in a plane between the housing 210 and the second decor member 212, so that the light ( L1) can be emitted in the first and second directions (A1, A2) (eg, the X-axis direction or the Y-axis direction), as well as the first and second reflective structures 240 and 250 and the first and second reflective structures.
  • the overlapping efficiency, reflection efficiency, and/or diffusion efficiency may be improved by the diffusion members 230 and 260.
  • a processor e.g., a processor (e.g.:) to enable the plurality of light emitting elements 221 to emit or flash light L1 according to a preset condition, for example, a user's description
  • the processor 120 of FIG. 1 may be activated.
  • the processor 120 may compare and determine whether the generated event corresponds to one of mirror-set conditions.
  • the term'preset condition' may mean a condition in which the plurality of light-emitting elements 221 are turned on or the plurality of light-emitting elements 221 are flashed.
  • the preset condition may include a state of use as a speaker and reception of a call or message from a designated phone number.
  • the processor 120 may turn on or flash the plurality of light emitting devices 221 in a light emitting mode according to the satisfied condition.
  • Emission modes of the plurality of light emitting devices 221 may be set in various ways. For example, when the plurality of light-emitting elements 221 emit light L1 by various light-emitting modes, the light L1 is in a first direction A1 toward the inside of the housing 210 (eg, X).
  • the light (L1) may be emitted in the axial direction or in the Y-axis direction) and emitted in the first direction (A1) (eg, in the X-axis direction or Y-axis direction). 1 It may be transmitted to the diffusion member 230.
  • the first diffusion member 230 may receive the light L1 and diffuse it in a second direction A2 (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing.
  • At least a portion of the first diffused light B1 diffused from the first diffuser 230 may be transmitted to the first and second reflective structures 240 and 250.
  • the first reflective structure 240 may receive the at least part of the first diffused light B1 and reflect it to the second reflective structure 250.
  • the second reflective structure 250 may receive at least a portion of the first diffused light B1 diffused from the first diffuser 230, and the second reflective structure 250 reflected from the first reflective structure 240. 1 Can receive the reflected light (C1).
  • the second reflective structure 250 may reflect the first diffused light B1 and the second reflected light C2 received in this manner and transmit the reflected light to the second diffuser 260.
  • the second diffusion member 260 may receive and diffuse the second reflected light C2 reflected from the second reflective structure 250.
  • the second diffused light B2 diffused from the second diffuser 260 may be transmitted to the second decorating member 212 of the housing 210 and diffused.
  • the second diffused light B2 may pass through the second decor member 212 and radiate outward of the second decor member 212.
  • the second diffused light B2 emitted from the outside of the second decorating member 212 may implement various light emission modes by using color and flashing frequency.
  • the sound output of the speaker may be displayed through the emission color and blinking pattern of the second diffused light B2.
  • the light L1 of the light emitting element 221 between the circuit board 220 and the second decorating member 212 is directed in the first and second directions (A1, A2) (eg, in the X-axis direction or
  • the first and second reflective structures 240 and 250 and the first and second diffusing members 230 and 260 are configured to overlap, reflect, and/or diffuse in the Y-axis direction), so that the light of the light emitting device 221 (L1) is emitted in the first and second directions (A1, A2) (e.g., horizontal direction, X-axis direction, or Y-axis direction) to prevent the occurrence of a hot spot that has already occurred.
  • the diffusion of the light L1 can be made uniform and the visibility of the product can be improved.
  • the first and second reflective structures 240 and 250 and the first and second diffuser members 230 and 260 are disposed in a plane between the housing 210 and the second decor member 212, so that the housing 210 ), since there is no need for a vertical space for overlapping, reflecting, and/or diffusing existing light in a vertical direction (eg, in the Z-axis direction), the size of the light-emitting device 200 can be reduced, and thus the light-emitting device
  • the electronic device including 200 may be miniaturized or slimmed.
  • FIG. 7 is a cross-sectional side view taken along line AA′ of FIG. 3 and is a side cross-sectional view illustrating an operation state of an electronic device including the light emitting device 300 (eg, the electronic device 101 of FIG. 1) according to another embodiment.
  • the light emitting device 300 eg, the electronic device 101 of FIG. 1
  • the light emitting device 300 included in the electronic device 101 includes a housing 310, a circuit board 320, first and second reflective structures 340 and 350, and first and second diffusion members ( 330, 360).
  • a circuit board 320 including the plurality of light-emitting elements 321 is provided in the housing 310, and the plurality of light-emitting elements 321 are in a first direction of the housing 310 (eg ; Light (L1) can be emitted in the Z-axis direction).
  • the second reflective structure 350 may be disposed on the upper surface of the circuit board 320.
  • the first diffusion member 330 may be disposed more inside the housing 310 than the plurality of light emitting devices 321, may be disposed on the upper surface of the circuit board 320, and the plurality of light emitting devices ( 321) and may be placed in parallel. In this way, the circuit board 320 including the first diffusion member 330, the plurality of light emitting devices 321, and the second reflective structure 350 may be mounted inside the housing 310.
  • the housing 310 may include first and second decor members 311 and 312, and a first decor member 311 is disposed at the center of the upper surface of the second decor member 312 And the first reflective structure 340 may be disposed on the lower surface of the second decor member 312.
  • the second diffusion member 360 may be disposed inside the second decor member 312.
  • the second decor member 312 arranged in this way may be coupled to the upper portion of the housing 310 and mounted on the upper portion of the circuit board 320.
  • the first reflective structure 340 of the second decorating member 312 may be disposed above the circuit board 320 and may be disposed to be spaced apart from the second reflective structure 350.
  • the first reflective structure 340 receives light L1 from the plurality of light emitting devices 321 in a first direction (eg, a Z-axis direction), and a second direction A1 toward the inside of the housing It can reflect in (eg, in the X-axis direction or in the Y-axis direction) and in the third direction (A2) toward the outside of the housing (eg, in the X-axis direction or Y-axis direction).
  • the first reflective structure 340 has a second direction (A1) toward the inside of the housing (eg, X-axis direction or Y-axis direction) and a second direction toward the outside of the housing (eg, X-axis direction). Or it can reflect in the Y-axis direction).
  • the first reflected light C1 reflected from the first reflective structure 340 may be transmitted to the first diffusion member 330 and the second reflective structure 350.
  • the first diffused light B1 diffused from the first diffuser 330 may be transmitted to the second reflective structure 350.
  • the second reflective structure 350 may receive and reflect the first reflected light C1 and the first diffused light B1.
  • the second reflected light C2 reflected from the second reflective structure 350 may be transmitted to and diffused by the second diffusion member 360.
  • the second diffused light B2 diffused from the second diffuser 360 may diffuse to the second decorating member 312 of the housing 310 and transmit the second decorating member 312 at the same time. Accordingly, the second diffused light B2 may transmit through the second decor member 312 and radiate to the outside of the second decor member 312.
  • the first diffused light B1 of the first diffusion member 330 and the first and second reflective structures 340 and 350 may be formed between the first and second reflective structures 340 and 350.
  • An overlapping space eg, overlapping distance
  • overlapping the first and second reflected lights C1 and C2 of in the second and third directions A1 and A2 may be formed.
  • the first diffused light B1 of the first diffusion member 330, the first and second reflective structures 340 and 350, 2 A reflection space A2 that reflects the reflected light C1 and C2 in the second and third directions A1 and A2 (eg, the X-axis direction or the Y-axis direction) may be formed.
  • a diffusion space A3 for diffusing the second diffusion light B2 diffused from the second diffusion member 360 may be formed inside the second decor member 312. The second diffused light B2 may pass through the diffusion space A3 and pass through the second decorating member 312 and radiate outward of the second decorating member 312.
  • first and second reflective structures 340 and 350 and the first and second diffusing members 330 and 360 are disposed in a plane between the housing 310 and the second decor member 312, so that the light ( L1) may be overlapped, reflected, and/or diffused in the second and third directions (eg, the X-axis direction or the Y-axis direction).
  • the plurality of light-emitting elements 321 may emit light L1 in various light-emitting modes.
  • the light L1 may be emitted to the inside of the housing 310 in a first direction (eg, Z-axis direction), and the light L1 emitted in the first direction (eg, Z-axis direction) is It may be transmitted to the first reflective structure 340 disposed on the light emitting device 321.
  • the first reflective structure 340 directs the light L1 toward the inside of the housing 310 in the first direction (eg, Z-axis direction).
  • Axial direction) and a third direction A2 eg, an X-axis direction or a Y-axis direction
  • At least a portion of the first reflected light C1 reflected from the first reflective structure 340 may be transmitted to the first diffusion member 330 provided inside the housing 310, and the first At least a portion of the first reflected light C1 reflected from the first reflective structure 340 may be transmitted to the second reflective structure 350.
  • the first diffusion member 330 diffuses the received first reflected light C1 in the third direction A2 (eg, in the X-axis direction or the Y-axis direction), and further, the The second reflective structure 350 may reflect the received first reflected light C1 in the third direction A2 (eg, an X-axis direction or a Y-axis direction).
  • the first diffused light B1 diffused from the first diffuser 330 may be transmitted to the second reflective structure 350.
  • the second reflective structure 350 may receive the at least part of the first diffused light B1 and reflect it to the second diffuser 360.
  • the second reflective structure 350 may reflect the received first reflected light C1 and transmit it to the second diffusion member 360.
  • the second reflective structure 350 may reflect the first diffused light B1 and the first reflected light C1 at the same time as being transmitted.
  • the second reflected light C2 reflected from the second reflective structure 350 may be transmitted to and diffused by the second diffusion member 360.
  • the second diffusion member 360 may receive and diffuse the second reflected light C2.
  • the second diffused light B2 diffused from the second diffuser 360 may diffuse to the second decorating member 312 of the housing 310.
  • the second diffused light B2 may pass through the second decorating member 312 and radiate outward of the second decorating member 312.
  • At least one of the components of an electronic device including the light emitting device 300 is an electronic device including the light emitting device 200 of FIG. 101
  • the second diffused light B2 emitted from the outside of the second decorating member 312 may implement various light emission modes by using color and flashing frequency.
  • the sound output of the speaker may be displayed through the emission color and blinking pattern of the second diffused light B2.
  • the light L1 of the light emitting element 321 between the circuit board 320 and the second decor member 312 of the housing 310 is transferred to the second, Changes in three directions (A1, A2) (e.g., X-axis direction or Y-axis direction), and changes the light (L1) in the second and third directions (A1, A2) (e.g., X-axis direction or Y-axis direction)
  • A1, A2 e.g., X-axis direction or Y-axis direction
  • the first and second reflective structures 340 and 350 and the first and second diffusing members 330 and 360 so that they can be overlapped, reflected, and/or diffused
  • the light L1 of the light emitting element 321 is It is possible to more easily change from the first direction (eg, the Z-axis direction) to the second and third directions (eg, the X-axis or Y-axis direction), and as a result, a hot spot that has already occurred
  • FIG. 8 is a cross-sectional side view taken along line AA′ of FIG. 3, and is a side cross-sectional view illustrating an operation state of another embodiment of an electronic device including the light emitting device 400 (eg, the electronic device 101 of FIG. 1 ).
  • the light emitting device 400 included in the electronic device 101 includes a housing 410, a circuit board 420, first to third reflective structures 430, 440, 450, and a diffusion member 460. It may include.
  • a circuit board 420 including the plurality of light-emitting elements 421 is provided in the housing 410, and the plurality of light-emitting elements 421 are in a first direction (A1) of the housing 410 ) Can emit light (L1).
  • the first and third reflective structures 430 and 450 may be disposed on the upper surface of the circuit board 420.
  • the first reflective structure 430 is disposed more inside the housing 410 than the plurality of light emitting devices 421, and parallel to the plurality of light emitting devices 421 on the upper surface of the circuit board 420 Can be placed.
  • the circuit board 420 to which the plurality of light emitting devices 421 and the first and third reflective structures 430 and 450 are combined may be mounted inside the housing 410.
  • the housing 410 may include first and second decor members 411 and 412, and a first decor member 411 is disposed at the center of the upper surface of the second decor member 412. Is disposed, and the second reflective structure 440 may be disposed on a lower surface of the second decor member 412.
  • the diffusion member 460 may be disposed inside the second decor member 412.
  • the second decor member 412 disposed in this way may be coupled to the upper portion of the housing 410 and may be mounted on the upper portion of the circuit board 420.
  • the third reflective structure 450 may be disposed above the circuit board 420 and may be disposed to be spaced apart from the second reflective structure 440.
  • the plurality of light emitting devices 421 may emit light L1 in a first direction A1 (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing 410.
  • the emitted light L1 may be transmitted to the first reflective structure 430 disposed to be spaced apart from the plurality of light emitting devices 421.
  • the first reflective structure 430 has a second direction A2 (eg, an X-axis direction or a Y-axis direction) from the inside of the housing 410 toward the light L1 of the plurality of light-emitting elements 421 outward. ) Can be reflected.
  • the first reflected light C1 reflected from the first reflective structure 430 may be transmitted to the second reflective structure 440.
  • the second reflected light C2 reflected from the second reflective structure 440 may be transmitted to the third reflective structure 450 and reflected.
  • the third reflected light C3 reflected from the third reflective structure 450 may be transmitted to and diffused by the diffusion member 460.
  • the diffused light B1 diffused from the diffusion member 460 may diffuse to the second decor member 412 of the housing 410 and pass through the second decor member 412 at the same time. Accordingly, the diffused light B1 may pass through the second decorating member 412 and radiate outward of the second decorating member 412 at the same time.
  • the first to third reflected lights 430, 440, 450 of the first to third reflecting structures 430, 440, and 450 are disposed between the first to third reflecting structures 430, 440, and 450.
  • an overlapping space eg, overlapping distance
  • overlapping the diffusion light B1 of the diffusion member 460 in the first and second directions (A1, A2) eg, X-axis direction or Y-axis direction.
  • the first to third reflected lights C1, C2, C3 of the first to third reflective structures 430, 440, 450 and a diffusion member A reflection space A2 that reflects the diffused light B1 of 460 in the first and second directions A1 and A2 (eg, in the X-axis direction or the Y-axis direction) may be formed.
  • a diffusion space A3 for diffusing the diffusion light B1 may be formed inside the second decor member 412. The diffused light B1 may pass through the diffusion space A3 and pass through the second decorating member 412 and radiate to the outside of the second decorating member 412.
  • first to third reflective structures 430, 440, and 450 and the diffusion member 460 may be disposed in a plane between the housing 410 and the second decor member 412.
  • At least one of the components of the electronic device including the light emitting device 400 is the components of the electronic device 101 including the light emitting device 200 of FIG. 4 It may be the same as or similar to at least one of them, and redundant descriptions will be omitted below.
  • the plurality of light-emitting elements 421 may emit light L1 in various light-emitting modes.
  • the light L1 may be emitted in a first direction A1 (eg, X-axis direction or Y-axis direction) toward the inside of the housing 410, and the first direction A1 (eg, X-axis direction)
  • the light L1 emitted in the direction or Y-axis direction) may be transmitted to the first reflective structure 430.
  • the first reflective structure 430 may reflect the light L1 in a second direction A2 (eg, an X-axis direction or a Y-axis direction) from the inside of the housing 410 to the outside.
  • the first reflected light C1 reflected from the first reflective structure 430 may be transmitted to and reflected by the second reflective structure 440 disposed on the second decor member 412.
  • the second reflected light C2 reflected from the second reflective structure 440 may be transmitted to and reflected from the third reflective structure 450.
  • the third reflected light C3 reflected from the third reflective structure 450 may be transmitted to and diffused by the diffusion member 460.
  • the diffused light B1 diffused from the diffuser 460 may diffuse to the second decorating member 412 of the housing 410.
  • the diffused light B1 may pass through the second decor member 412 and radiate to the outside of the second decor member 412.
  • the diffused light B1 emitted from the outside of the second decorating member 412 may implement various light emission modes using a color and a frequency of blinking.
  • the sound output of the speaker may be displayed through the emission color and flashing pattern of the diffused light B1.
  • the light (L1) of the light emitting element 421 between the circuit board 420 and the second decor member 412 of the housing 410 is directed in the first and second directions (A1, A2) (eg, X)
  • A1, A2 e.g., X
  • the first to third reflective structures 430, 440, 450 and the diffusion member 460 to overlap, reflect, and/or diffuse in the axial direction or the Y-axis direction
  • the light of the light emitting element 421 ( L1) is emitted in the first and second directions (A1, A2) (e.g., in the X-axis or Y-axis direction) to further prevent the occurrence of a hot spot that has already occurred.
  • the visibility of the product can be further improved.
  • the first to third reflective structures 430, 440, 450 and the diffusion member 460 are disposed in a plane between the housing 410 and the second decor member 412, thereby preventing the light L1. It can overlap, reflect, and/or diffuse in the first and second directions (A1, A2) (eg, X-axis direction or Y-axis direction), and, in addition, existing inside the housing 410 of the electronic device 101 Since there is no need for a separate vertical space for overlapping, reflecting, and/or diffusing light in a vertical direction (eg, in the Z-axis direction), the size of the light emitting device 400 can be reduced. Accordingly, the electronic device 101 including the light emitting device 400 can be further downsized or slimmed.
  • A1, A2 eg, X-axis direction or Y-axis direction
  • an electronic device including a light emitting device (eg, the light emitting device 200 of FIG. 4) includes a housing (eg, the housing of FIG. 4 ). (210)); A plurality of light-emitting elements (example: light (L1) in FIG. 4) that are disposed in the housing and emit light in a first direction (eg, the first direction (A1) in FIG. 4) toward the inside of the housing.
  • a circuit board eg, the circuit board 220 of FIG. 4) including;
  • a first diffusion member eg, FIG.
  • the first diffusion member 230 A first reflective structure disposed in the housing and receiving at least a portion of the first diffused light (for example, diffused light B1 in FIG. 4) diffused from the first diffuser member and reflecting it in the second direction (for example;
  • a second reflective structure eg, the second reflective structure 250 of FIG. 4 for receiving and reflecting in the second direction; And a second reflective light disposed between the housing and the second reflective structure, receiving second reflective light (eg, second reflective light C2 in FIG. 4) reflected from the second reflective structure and diffuses it to the outside of the housing.
  • 2 diffusion member eg, the second diffusion member 260 of FIG. 4; may be included.
  • the housing further includes at least one decor member, and the at least one decor member includes first and second decor members (eg, the first and second decor members 211 in FIG. 4 ). 212)), wherein the first decor member is coupled to the center of the second decor member, and the first surface of the second decor member (eg, the first surface 212a of FIG. 4) is the first A deco groove (e.g., a deco groove 212c of Fig. 4) is formed to be coupled to the deco member, and a second surface opposite to the first surface (e.g., the second surface 212b of Fig. 4) is the first reflection Structure can be placed.
  • first and second decor members eg, the first and second decor members 211 in FIG. 4 ). 212)
  • the second decorating member may include at least one of a transparent decorating member or a translucent decorating member that transmits the second diffused light diffused from the second diffuser.
  • an overlapping space may be formed between the first and second reflective structures to overlap the first diffused light and the first and second reflected lights in the first and second directions.
  • a reflection space for reflecting the first diffused light and the first and second reflected lights in the first and second directions may be formed between the first and second reflective structures.
  • the first direction may include an inner direction of the housing
  • the second direction may include an outer direction of the housing
  • a plurality of coupling holes (eg, a plurality of coupling holes 251 of FIG. 5) coupled to the plurality of light emitting devices may be formed in the second reflective structure.
  • At least a portion of the plurality of coupling holes may form a guide portion (for example, the guide portion 252 of FIG. 5) for guiding the light of the light emitting device to the inside of the housing. .
  • the plurality of coupling holes may be formed in a closed loop shape surrounding the circumference of the plurality of light emitting devices. .
  • the electronic device includes a portable communication device, a smart phone, a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance device, a home device, a speaker device, and an artificial intelligence (AI) device. It may include at least one of a speaker or an artificial intelligence (AI) robot.
  • an electronic device including a light emitting device (eg, the light emitting device 300 of FIG. 7) includes a housing (eg, the housing of FIG. 7 ). (310)); A circuit board (eg, circuit board 320 of FIG. 7) disposed in the housing and including a plurality of light emitting devices that emit light in a first direction (eg, Z-axis direction) of the housing; It is disposed in the housing, and a second direction toward the inside of the housing (eg, the second direction (A1) in FIG. 7) and a third direction toward the outside of the housing (eg, in FIG. 7 ).
  • a first reflective structure eg, the first reflective structure 340 of FIG.
  • a first diffusion member e.g., the first diffusion member of FIG. 7 is disposed in parallel with the plurality of light emitting devices and receives at least a portion of the first reflected light reflected from the first reflective structure and diffuses it in the third direction. 330));
  • a second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the first diffused light diffused from the first diffuser member and the at least part of the first reflected light and reflecting it in the third direction (Example: the second reflective structure 350 of FIG.
  • a second diffusion member disposed between the housing and the second reflective structure, receiving the second reflected light reflected from the second reflective structure, and diffusing it to the outside of the housing (eg, the second diffusion member of FIG. 7 ). (360)); may include.
  • the first direction may include a Z-axis direction
  • the second direction may include an inner direction of the housing
  • the third direction is an outer direction of the housing.
  • an overlapping space may be formed between the first and second reflective structures to overlap the first diffused light and the first and second reflected light in the second and third directions.
  • a reflective space may be formed between the first and second reflective structures to reflect the second and third directions with the first diffused light and the first and second reflected light.
  • an electronic device including a light emitting device (eg, the light emitting device 400 of FIG. 8) includes a housing (eg, the housing of FIG. 8 ). (410)); A circuit board disposed in the housing and including a plurality of light-emitting elements emitting light in a first direction (eg, a first direction A1 in FIG. 8) toward the inside of the housing; A first reflective structure (eg; a first reflective structure disposed in parallel with the plurality of light emitting devices) and reflecting the light in a second direction (eg, the second direction A2 in FIG. 8) from the inside of the housing to the outside.
  • Structure 450); And a diffusing member disposed between the housing and the third reflective structure, receiving third reflected light reflected from the third reflective structure and diffusing it to the outside of the housing (eg, diffusing member 460 of FIG. 8). May include;
  • an overlapping space for overlapping the first to third reflected light in the first and second directions may be formed between the first to third reflective structures.
  • a reflection space for reflecting the first to third reflected light in the first and second directions may be formed between the first to third reflective structures.
  • an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light emitting devices for emitting light in a first direction toward the inside of the housing; A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction toward the outside of the housing; A first reflective structure disposed in the housing and reflecting the light in the second direction toward the outside of the housing; And a second reflective structure disposed on the circuit board and reflecting the light in the second direction. And a second diffusion member receiving the light of the second reflective structure and diffusing it to the outside of the housing.
  • the electronic device including the light emitting device of the various embodiments of the present disclosure described above is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. It will be apparent to those of ordinary skill in the art to which it belongs.

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Abstract

Various embodiments related to an electronic device including a light emitting device are described, and the electronic device according to one embodiment comprises: a housing; a circuit board which is arranged inside the housing and which includes a plurality of light emitting elements for emitting light in a first direction inside the housing; a first diffusion member which is arranged in parallel to the plurality of light emitting elements and which receives the light so as to diffuse same in a second direction toward the outside of the housing; a first reflection structure which is arranged in the housing and which receives at least a part of the first diffused light diffused from the first diffusion member so as to reflect same in the second direction; a second reflection structure which is arranged to be spaced from the first reflection structure on the circuit board, and which receives at least a part of the first diffused light and the first reflected light, having been reflected from the first reflection structure, so as to reflect same in the second direction; and a second diffusion member which is arranged between the housing and the second reflection structure, and which receives the second reflected light, having been reflected from the second reflection structure, so as to diffuse same to the outside of the housing, and additional various other embodiments are possible.

Description

발광 장치를 포함하는 전자 장치Electronic device including light emitting device
본 개시의 다양한 실시예들은 발광 장치를 포함하는 전자 장치에 관한 것이다.Various embodiments of the present disclosure relate to an electronic device including a light emitting device.
전자 장치들은 저장된 정보를 음향이나 영상으로 출력할 수 있다. 전자 장치의 집적도가 높아지고, 초고속, 대용량 무선통신이 보편화되면서, 최근에는, 이동통신 단말기와 같은 하나의 전자 장치에 다양한 기능이 탑재될 수 있다. 예를 들면, 통신 기능뿐만 아니라, 게임과 같은 엔터테인먼트 기능, 음악/동영상 재생과 같은 멀티미디어 기능, 모바일 뱅킹 같은 위한 통신 및 보안 기능, 일정 관리나 전자 지갑의 기능이 하나의 전자 장치에 집약되고 있다.Electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases, and ultra-high-speed, large-capacity wireless communication is common, in recent years, various functions may be installed in one electronic device such as a mobile communication terminal. For example, not only communication functions but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions of schedule management and electronic wallets are being integrated into one electronic device.
상기 전자 장치는 이러한 상기 다양한 기능을 구현시 광을 발산하는 발광 장치를 포함하고, 이러한 상기 발광 장치는 발광 소자(light emission diode, 이하 LED라 한다)를 포함할 수 있다.The electronic device includes a light-emitting device that emits light when implementing the various functions, and the light-emitting device may include a light emission diode (hereinafter referred to as an LED).
전자 장치내에 구비된 발광 소자의 광이 균일성 및 시인성 확보를 위해 상기 전자 장치내에 상당한 중첩 공간(예; 중첩 거리) 및 반사 공간이 필요하고, 이로인해 상기 전자 장치의 크기가 증가하여 제품의 소형화 및 슬림화를 저해하였다. 또한, 상기 전자 장치내에 상기 광의 중첩 공간(예; 중첩 거리) 및 상기 광의 반사 공간이 없을 경우, 상기 전자 장치에 핫스판(hot spot)이 발생되었고, 이로인해 상기 광의 균일성이 저하될 수 있다.In order to ensure uniformity and visibility of light from the light emitting device provided in the electronic device, a considerable overlapping space (eg, overlapping distance) and reflection space are required in the electronic device, and thus the size of the electronic device increases, resulting in product miniaturization. And inhibited slimming. In addition, when there is no overlapping space (e.g., overlapping distance) and reflection space of the light in the electronic device, a hot spot is generated in the electronic device, which may reduce the uniformity of the light .
본 개시의 일 실시예에 따르면, 전자 장치내에 구비된 복수의 발광 소자의 광을 제1, 2 방향(예; X축방향 또는 Y축방향)으로 중첩, 반사 및/또는 확산할 수 있는 발광 장치를 포함하는 전자 장치를 제공할 수 있다.According to an embodiment of the present disclosure, a light-emitting device capable of superimposing, reflecting, and/or diffusing light from a plurality of light-emitting elements provided in an electronic device in first and second directions (eg, X-axis direction or Y-axis direction) An electronic device including a can be provided.
본 개시의 다양한 실시예에 따르면, 발광 장치를 포함하는 전자 장치는, 하우징; 상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향(예; X축방향 또는 Y축방향)으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판; 상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달받아 상기 하우징의 외측을 향하는 제2 방향(예; X축방향 또는 Y축방향)으로 확산하는 제1 확산 부재; 상기 하우징에 배치되고, 상기 제1 확산 부재로부터 확산된 적어도 일부의 제1 확산광을 전달 받아 상기 제2 방향으로 반사하는 제1 반사 구조; 상기 회로 기판상에 상기 제1 반사 구조와 이격되게 배치되고, 상기 적어도 일부의 제1 확산광 및 상기 제1 반사 구조로부터 반사된 제1 반사광을 전달 받아 상기 제2 방향으로 반사하는 제2 반사 구조; 및 상기 하우징과 상기 제2 반사 구조의 사이에 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재;를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements that emit light in a first direction (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing; A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing; A first reflective structure disposed in the housing and receiving at least a portion of the first diffused light diffused from the first diffuser and reflecting it in the second direction; A second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the at least part of the first diffused light and the first reflected light reflected from the first reflecting structure and reflecting it in the second direction ; And a second diffusion member disposed between the housing and the second reflective structure, receiving second reflected light reflected from the second reflective structure, and diffusing to the outside of the housing.
본 개시의 다양한 실시예에 따르면, 발광 장치를 포함하는 전자 장치는, 하우징; 상기 하우징내에 배치되고, 상기 하우징의 제1 방향(예; Z축방향)으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판; 상기 하우징내에 배치되고, 상기 적어도 일부의 광을 상기 하우징의 내측을 향하는 제2 방향(예; X축방향 또는 Y축방향) 및 상기 하우징의 외측을 향하는 제3 방향(예; X축방향 또는 Y축방향)으로 반사하는 제1 반사 구조; 상기 복수의 발광 소자와 나란하게 배치되며, 상기 제1 반사 구조로부터 반사된 적어도 일부의 제1 반사광을 전달 받아 상기 제3 방향으로 확산하는 제1 확산 부재; 상기 회로 기판상에 상기 제1 반사 구조와 이격되게 배치되고, 상기 제1 확산 부재로부터 확산된 제1 확산광 및 상기 적어도 일부의 제1 반사광을 전달 받아 상기 제3 방향으로 반사하는 제2 반사 구조; 및 상기 하우징과 상기 제2 반사 구조의 사이에 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재;를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements emitting light in a first direction (eg, a Z-axis direction) of the housing; Arranged in the housing, the at least part of the light is directed in a second direction (eg, X-axis direction or Y-axis direction) toward the inside of the housing and a third direction (eg, X-axis direction or Y-axis direction) toward the outside of the housing. A first reflective structure reflecting in the axial direction); A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving at least a portion of the first reflected light reflected from the first reflective structure, and diffusing in the third direction; A second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the first diffused light diffused from the first diffuser member and the at least part of the first reflected light and reflecting it in the third direction ; And a second diffusion member disposed between the housing and the second reflective structure, receiving second reflected light reflected from the second reflective structure, and diffusing to the outside of the housing.
본 개시의 다양한 실시예에 따르면, 발광 장치를 포함하는 전자 장치는, 하우징; 상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향(예; X축방향 또는 Y축방향)으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판; 상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달 받아 상기 하우징의 내측에서 외측을 향하는 제2 방향(예; X축방향 또는 Y축방향)으로 반사하는 제1 반사 구조; 상기 하우징내에 상기 제1 반사 구조와 이격되게 배치되고, 상기 제1 반사 구조로부터 반사된 상기 제1 반사광을 전달 받아 상기 제2 방향으로 반사하는 제2 반사 구조; 상기 회로 기판상에 상기 제2 반사 구조와 이격되게 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달 받아 상기 제2 방향으로 반사하는 제3 반사 구조; 및 상기 하우징과 상기 제3 반사 구조의 사이에 배치되고, 상기 제3 반사 구조로부터 반사된 제3 반사광을 전달받아 상기 하우징의 외측으로 확산하는 확산 부재;를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements that emit light in a first direction (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing; A first reflective structure disposed in parallel with the plurality of light-emitting elements, receiving the light and reflecting it in a second direction (eg, an X-axis direction or a Y-axis direction) from the inside of the housing to the outside; A second reflective structure disposed in the housing to be spaced apart from the first reflective structure, receiving the first reflected light reflected from the first reflective structure and reflecting it in the second direction; A third reflective structure disposed on the circuit board to be spaced apart from the second reflective structure, receiving second reflected light reflected from the second reflective structure and reflecting it in the second direction; And a diffusing member disposed between the housing and the third reflective structure, receiving third reflected light reflected from the third reflective structure and diffusing it to the outside of the housing.
본 개시의 다양한 실시예에 따르면, 발광 장치를 포함하는 전자 장치는, 하우징; 상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향(예; X축방향 또는 Y축방향)으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판; 상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달받아 상기 하우징의 외측을 향하는 제2 방향(예; X축방향 또는 Y축방향)으로 확산하는 제1 확산 부재; 상기 하우징내에 배치되고, 상기 광을 상기 제2 방향으로 반사하는 제1 반사 구조; 및 상기 회로 기판상에 배치되고, 상기 광을 상기 제2 방향으로 반사하는 제2 반사 구조; 및 상기 제2 반사 구조의 상기 광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재;를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light-emitting elements that emit light in a first direction (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing; A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing; A first reflective structure disposed in the housing and reflecting the light in the second direction; And a second reflective structure disposed on the circuit board and reflecting the light in the second direction. And a second diffusion member receiving the light of the second reflective structure and diffusing it to the outside of the housing.
전술한 본 개시의 과제 해결 수단 중 적어도 어느 하나에 의하면, 본 개시의 일 실시예에 따른 전자 장치내에 구비된 복수의 발광 소자의 광을 제1, 2 방향(예; X축방향 또는 Y축방향)으로 중첩, 반사 및/또는 확산할 수 있도록 상기 전자 장치내에 적어도 하나의 확산 부재 및 반사 구조를 구성함으로써, 상기 광은 적어도 하나의 확산 부재 및 반사 구조에 의해 상기 제1, 2방향(예; X축방향 또는 Y축방향)으로 서로 중첩 효율, 반사효율 및/또는 확산 효율을 향상시킬 수 있고, 이로인해 기존의 전자 장치에서 발생되던 핫스판(hot spot)을 방지할 수 있다. 따라서, 상기 발광 장치는 상기 광의 확산을 균일하게 함은 물론 제품의 시인성을 향상시킬 수 있다. 또한, 전자 장치의 하우징의 내부에서 기존의 광을 수직 방향(예: Z축방향)으로 중첩, 반사 및/또는 확산하기 위한 수직 공간이 필요 없으므로, 발광 장치의 크기를 줄일 수 있고, 이로인해 상기 발광 장치를 포함하는 전자 장치를 소형화 또는 슬림화할 수 있다.According to at least one of the above-described problem solving means of the present disclosure, light from a plurality of light emitting devices provided in the electronic device according to an embodiment of the present disclosure is directed in the first and second directions (eg, in the X-axis direction or the Y-axis direction). ), by configuring at least one diffusing member and a reflective structure in the electronic device so as to be superimposed, reflective and/or diffused in a manner such that the light is directed in the first and second directions (eg; It is possible to improve the overlapping efficiency, reflection efficiency, and/or diffusion efficiency in the X-axis direction or the Y-axis direction), thereby preventing hot spots occurring in conventional electronic devices. Accordingly, the light-emitting device can uniformly diffuse the light and improve the visibility of the product. In addition, since there is no need for a vertical space for overlapping, reflecting, and/or diffusing existing light in a vertical direction (eg, Z-axis direction) inside the housing of the electronic device, the size of the light emitting device can be reduced. An electronic device including a light emitting device can be made smaller or slimmer.
도 1은 다양한 실시예들에 따른, 네트워크 환경 내의 전자 장치의 블럭도이다.1 is a block diagram of an electronic device in a network environment according to various embodiments.
도 2는 본 발명의 다양한 실시예에 따른, 발광 장치를 포함한 전자 장치의 구성을 나타내는 분해 입체도 이다.2 is an exploded three-dimensional view showing a configuration of an electronic device including a light emitting device according to various embodiments of the present disclosure.
도 3은 본 발명의 다양한 실시예에 따른, 발광 장치를 포함한 전자 장치를 나타내는 입체도 이다.3 is a three-dimensional view illustrating an electronic device including a light emitting device according to various embodiments of the present disclosure.
도 4는 도 3의 A-A'선단면도로서, 발광 장치를 포함한 전자 장치의 작동 상태를 나타내는 측단면도 이다.FIG. 4 is a cross-sectional side view taken along line AA′ of FIG. 3 and illustrating an operating state of an electronic device including a light emitting device.
도 5는 본 발명의 다양한 실시예에 따른, 발광 장치를 포함한 전자 장치의 구성 중 회로 기판에 결합된 제2 반사 구조를 나타내는 확대 입체도 이다.5 is an enlarged three-dimensional view illustrating a second reflective structure coupled to a circuit board among the configurations of an electronic device including a light emitting device according to various embodiments of the present disclosure.
도 6은 본 발명의 다양한 실시예에 따른, 발광 장치를 포함한 전자 장치의 구성 중 회로 기판에 결합된 제2 반사 구조의 다른 실시예를 나타내는 확대 입체도 이다.6 is an enlarged three-dimensional view illustrating another embodiment of a second reflective structure coupled to a circuit board among the configurations of an electronic device including a light emitting device according to various embodiments of the present disclosure.
도 7은 도 3의 A-A'선단면도로서, 발광 장치를 포함한 전자 장치의 다른 실시예의 작동 상태를 나타내는 측단면도 이다.FIG. 7 is a cross-sectional side view taken along line AA′ of FIG. 3, and is a side cross-sectional view illustrating an operating state of another embodiment of an electronic device including a light emitting device.
도 8는 도 3의 A-A'선단면도로서, 발광 장치를 포함한 전자 장치의 또 다른 실시예의 작동 상태를 나타내는 측단면도 이다.FIG. 8 is a cross-sectional side view taken along line AA′ of FIG. 3, and is a side cross-sectional view illustrating an operating state of another embodiment of an electronic device including a light emitting device.
도 1의 다양한 실시예들에 따르면, 네트워크 환경(100) 내의 전자 장치(101)의 블럭도이다.According to various embodiments of FIG. 1, a block diagram of an electronic device 101 in a network environment 100 is illustrated.
도 1을 참조하면, 네트워크 환경(100)에서 전자 장치(101)는 제1 네트워크(198, 예: 근거리 무선 통신 네트워크)를 통하여 전자 장치(102)와 통신하거나, 또는 제2 네트워크(199, 예: 원거리 무선 통신 네트워크)를 통하여 전자 장치(104) 또는 서버(108)와 통신할 수 있다. 일실시예에 따르면, 전자 장치(101)는 서버(108)를 통하여 전자 장치(104)와 통신할 수 있다. 일실시예에 따르면, 전자 장치(101)는 프로세서(120), 메모리(130), 입력 장치(150), 음향 출력 장치(155), 표시 장치(160), 오디오 모듈(170), 센서 모듈(176), 인터페이스(177), 햅틱 모듈(179), 카메라 모듈(180), 전력 관리 모듈(188), 배터리(189), 통신 모듈(190), 가입자 식별 모듈(196), 또는 안테나 모듈(197)을 포함할 수 있다. 어떤 실시예에서는, 전자 장치(101)에는, 이 구성요소들 중 적어도 하나(예: 표시 장치(160) 또는 카메라 모듈(180))가 생략되거나, 하나 이상의 다른 구성 요소가 추가될 수 있다. 어떤 실시예에서는, 이 구성요소들 중 일부들은 하나의 통합된 회로로 구현될 수 있다. 예를 들면, 센서 모듈(176, 예: 지문 센서, 홍채 센서, 또는 조도 센서)은 표시 장치(160, 예: 디스플레이)에 임베디드된 채 구현될 수 있다Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199, for example, : It is possible to communicate with the electronic device 104 or the server 108 through a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (eg, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as one integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
프로세서(120)는, 예를 들면, 소프트웨어(예: 프로그램(140))를 실행하여 프로세서(120)에 연결된 전자 장치(101)의 적어도 하나의 다른 구성요소(예: 하드웨어 또는 소프트웨어 구성요소)을 제어할 수 있고, 다양한 데이터 처리 또는 연산을 수행할 수 있다. 일실시예에 따르면, 데이터 처리 또는 연산의 적어도 일부로서, 프로세서(120)는 다른 구성요소(예: 센서 모듈(176) 또는 통신 모듈(190))로부터 수신된 명령 또는 데이터를 휘발성 메모리(132)에 로드하고, 휘발성 메모리(132)에 저장된 명령 또는 데이터를 처리하고, 결과 데이터를 비휘발성 메모리(134)에 저장할 수 있다. 일실시예에 따르면, 프로세서(120)는 메인 프로세서(121, 예: 중앙 처리 장치 또는 어플리케이션 프로세서), 및 이와는 독립적으로 또는 함께 운영 가능한 보조 프로세서(123, 예: 그래픽 처리 장치, 이미지 시그널 프로세서, 센서 허브 프로세서, 또는 커뮤니케이션 프로세서)를 포함할 수 있다. 추가적으로 또는 대체적으로, 보조 프로세서(123)은 메인 프로세서(121)보다 저전력을 사용하거나, 또는 지정된 기능에 특화되도록 설정될 수 있다. 보조 프로세서(123)는 메인 프로세서(121)와 별개로, 또는 그 일부로서 구현될 수 있다.The processor 120, for example, executes software (eg, a program 140) to implement at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 may store commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132. The command or data stored in the volatile memory 132 may be processed, and result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor), and a secondary processor 123 (eg: a graphic processing unit, an image signal processor, and a sensor) that can be operated independently or together. A hub processor, or a communication processor). Additionally or alternatively, the coprocessor 123 may be set to use less power than the main processor 121 or to be specialized for a designated function. The secondary processor 123 may be implemented separately from the main processor 121 or as a part thereof.
보조 프로세서(123)는, 예를 들면, 메인 프로세서(121)가 인액티브(예: 슬립) 상태에 있는 동안 메인 프로세서(121)를 대신하여, 또는 메인 프로세서(121)가 액티브(예: 어플리케이션 실행) 상태에 있는 동안 메인 프로세서(121)와 함께, 전자 장치(101)의 구성요소들 중 적어도 하나의 구성요소(예: 표시 장치(160), 센서 모듈(176), 또는 통신 모듈(190))와 관련된 기능 또는 상태들의 적어도 일부를 제어할 수 있다. 일실시예에 따르면, 보조 프로세서(123, 예: 이미지 시그널 프로세서 또는 커뮤니케이션 프로세서)는 기능적으로 관련 있는 다른 구성 요소(예: 카메라 모듈(180) 또는 통신 모듈(190))의 일부로서 구현될 수 있다. The coprocessor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, an application is executed). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states related to. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as a part of other functionally related components (eg, the camera module 180 or the communication module 190). .
메모리(130)는, 전자 장치(101)의 적어도 하나의 구성요소(예: 프로세서(120) 또는 센서모듈(176))에 의해 사용되는 다양한 데이터를 저장할 수 있다. 데이터는, 예를 들어, 소프트웨어(예: 프로그램(140)) 및, 이와 관련된 명령에 대한 입력 데이터 또는 출력 데이터를 포함할 수 있다. 메모리(130)는, 휘발성 메모리(132) 또는 비휘발성 메모리(134)를 포함할 수 있다. The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.
프로그램(140)은 메모리(130)에 소프트웨어로서 저장될 수 있으며, 예를 들면, 운영 체제(142), 미들 웨어(144) 또는 어플리케이션(146)을 포함할 수 있다. The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.
입력 장치(150)는, 전자 장치(101)의 구성요소(예: 프로세서(120))에 사용될 명령 또는 데이터를 전자 장치(101)의 외부(예: 사용자)로부터 수신할 수 있다. 입력 장치(150)은, 예를 들면, 마이크, 마우스, 또는 키보드를 포함할 수 있다. The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from an outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, or a keyboard.
음향 출력 장치(155)는 음향 신호를 전자 장치(101)의 외부로 출력할 수 있다. 음향 출력 장치(155)는, 예를 들면, 스피커 또는 리시버를 포함할 수 있다. 스피커는 멀티미디어 재생 또는 녹음 재생과 같이 일반적인 용도로 사용될 수 있고, 리시버는 착신 전화를 수신하기 위해 사용될 수 있다. 일실시예에 따르면, 리시버는 스피커와 별개로, 또는 그 일부로서 구현될 수 있다.The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
표시 장치(160)는 전자 장치(101)의 외부(예: 사용자)로 정보를 시각적으로 제공할 수 있다. 표시 장치(160)은, 예를 들면, 디스플레이, 홀로그램 장치, 또는 프로젝터 및 해당 장치를 제어하기 위한 제어 회로를 포함할 수 있다. 일실시예에 따르면, 표시 장치(160)는 터치를 감지하도록 설정된 터치 회로(touch circuitry), 또는 상기 터치에 의해 발생되는 힘의 세기를 측정하도록 설정된 센서 회로(예: 압력 센서)를 포함할 수 있다. The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. have.
오디오 모듈(170)은 소리를 전기 신호로 변환시키거나, 반대로 전기 신호를 소리로 변환시킬 수 있다. 일실시예에 따르면, 오디오 모듈(170)은, 입력 장치(150)를 통해 소리를 획득하거나, 음향 출력 장치(155), 또는 전자 장치(101)와 직접 또는 무선으로 연결된 외부 전자 장치(예: 전자 장치(102)) (예: 스피커 또는 헤드폰))를 통해 소리를 출력할 수 있다.The audio module 170 may convert sound into an electric signal or, conversely, convert an electric signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102) (for example, a speaker or headphones).
센서 모듈(176)은 전자 장치(101)의 작동 상태(예: 전력 또는 온도), 또는 외부의 환경 상태(예: 사용자 상태)를 감지하고, 감지된 상태에 대응하는 전기 신호 또는 데이터 값을 생성할 수 있다. 일실시예에 따르면, 센서 모듈(176)은, 예를 들면, 제스처 센서, 자이로 센서, 기압 센서, 마그네틱 센서, 가속도 센서, 그립 센서, 근접 센서, 컬러 센서, IR(infrared) 센서, 생체 센서, 온도 센서, 습도 센서, 또는 조도 센서를 포함할 수 있다. The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
인터페이스(177)는 전자 장치(101)이 외부 전자 장치(예: 전자 장치(102))와 직접 또는 무선으로 연결되기 위해 사용될 수 있는 하나 이상의 지정된 프로토콜들을 지원할 수 있다. 일실시예에 따르면, 인터페이스(177)는, 예를 들면, HDMI(high definition multimedia interface), USB(universal serial bus) 인터페이스, SD카드 인터페이스, 또는 오디오 인터페이스를 포함할 수 있다.The interface 177 may support one or more designated protocols that may be used for the electronic device 101 to connect directly or wirelessly with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
연결 단자(178)는, 그를 통해서 전자 장치(101)가 외부 전자 장치(예: 전자 장치(102))와 물리적으로 연결될 수 있는 커넥터를 포함할 수 있다. 일실시예에 따르면, 연결 단자(178)은, 예를 들면, HDMI 커넥터, USB 커넥터, SD 카드 커넥터, 또는 오디오 커넥터(예: 헤드폰 커넥터)를 포함할 수 있다.The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
햅틱 모듈(179)은 전기적 신호를 사용자가 촉각 또는 운동 감각을 통해서 인지할 수 있는 기계적인 자극(예: 진동 또는 움직임) 또는 전기적인 자극으로 변환할 수 있다. 일실시예에 따르면, 햅틱 모듈(179)은, 예를 들면, 모터, 압전 소자, 또는 전기 자극 장치를 포함할 수 있다.The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through a tactile or motor sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
카메라 모듈(180)은 정지 영상 및 동영상을 촬영할 수 있다. 일실시예에 따르면, 카메라 모듈(180)은 하나 이상의 렌즈들, 이미지 센서들, 이미지 시그널 프로세서들, 또는 플래시들을 포함할 수 있다.The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
전력 관리 모듈(188)은 전자 장치(101)에 공급되는 전력을 관리할 수 있다. 일실시예에 따르면, 전력 관리 모듈(388)은, 예를 들면, PMIC(power management integrated circuit)의 적어도 일부로서 구현될 수 있다.The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 388 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
배터리(189)는 전자 장치(101)의 적어도 하나의 구성 요소에 전력을 공급할 수 있다. 일실시예에 따르면, 배터리(189)는, 예를 들면, 재충전 불가능한 1차 전지, 재충전 가능한 2차 전지 또는 연료 전지를 포함할 수 있다.The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
통신 모듈(190)은 전자 장치(101)와 외부 전자 장치(예: 전자 장치(102), 전자 장치(104), 또는 서버(108))간의 직접(예: 유선) 통신 채널 또는 무선 통신 채널의 수립, 및 수립된 통신 채널을 통한 통신 수행을 지원할 수 있다. 통신 모듈(190)은 프로세서(120, 예: 어플리케이션 프로세서)와 독립적으로 운영되고, 직접(예: 유선) 통신 또는 무선 통신을 지원하는 하나 이상의 커뮤니케이션 프로세서를 포함할 수 있다. 일실시예에 따르면, 통신 모듈(190)은 무선 통신 모듈(192, 예: 셀룰러 통신 모듈, 근거리 무선 통신 모듈, 또는 GNSS(global navigation satellite system) 통신 모듈) 또는 유선 통신 모듈(194, 예: LAN(local area network) 통신 모듈, 또는 전력선 통신 모듈)을 포함할 수 있다. 이들 통신 모듈 중 해당하는 통신 모듈은 제1 네트워크(198, 예: 블루투스, WiFi direct 또는 IrDA(infrared data association) 같은 근거리 통신 네트워크) 또는 제2 네트워크(199, 예: 셀룰러 네트워크, 인터넷, 또는 컴퓨터 네트워크(예: LAN 또는 WAN)와 같은 원거리 통신 네트워크)를 통하여 외부 전자 장치와 통신할 수 있다. 이런 여러 종류의 통신 모듈들은 하나의 구성 요소(예: 단일 칩)으로 통합되거나, 또는 서로 별도의 복수의 구성 요소들(예: 복수 칩들)로 구현될 수 있다. 무선 통신 모듈(192)은 가입자 식별 모듈(196)에 저장된 가입자 정보(예: 국제 모바일 가입자 식별자(IMSI))를 이용하여 제1 네트워크(198) 또는 제2 네트워크(199)와 같은 통신 네트워크 내에서 전자 장치(101)를 확인 및 인증할 수 있다. The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, electronic device 102, electronic device 104, or server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an application processor) and may include one or more communication processors that support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194, eg, LAN. (local area network) communication module, or a power line communication module) may be included. Among these communication modules, the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi direct, or IrDA (infrared data association)) or a second network 199, e.g., a cellular network, the Internet, or a computer network. It can communicate with external electronic devices through a telecommunication network (such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information stored in the subscriber identification module 196 (eg, International Mobile Subscriber Identifier (IMSI)) within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.
안테나 모듈(197)은 신호 또는 전력을 외부(예: 외부 전자 장치)로 송신하거나 외부로부터 수신할 수 있다. 일실시예에 따르면, 안테나 모듈(197)은 하나 이상의 안테나들을 포함할 수 있고, 이로부터, 제1 네트워크(198) 또는 제2 네트워크(199)와 같은 통신 네트워크에서 사용되는 통신 방식에 적합한 적어도 하나의 안테나가, 예를 들면, 통신 모듈(190)에 의하여 선택될 수 있다. 신호 또는 전력은 상기 선택된 적어도 하나의 안테나를 통하여 통신 모듈(190)과 외부 전자 장치 간에 송신되거나 수신될 수 있다.The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module 197 may include one or more antennas, from which at least one suitable for a communication method used in a communication network such as the first network 198 or the second network 199 An antenna of, for example, may be selected by the communication module 190. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
상기 구성요소들 중 적어도 일부는 주변 기기들간 통신 방식(예: 버스, GPIO(general purpose input and output), SPI(serial peripheral interface), 또는 MIPI(mobile industry processor interface))를 통해 서로 연결되고 신호(예: 명령 또는 데이터)를 상호간에 교환할 수 있다.At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and signals ( E.g. commands or data) can be exchanged with each other.
일실시예에 따르면, 명령 또는 데이터는 제2 네트워크(199)에 연결된 서버(108)를 통해서 전자 장치(101)와 외부의 전자 장치(104)간에 송신 또는 수신될 수 있다. 전자 장치(102, 104) 각각은 전자 장치(101)와 동일한 또는 다른 종류의 장치일 수 있다. 일실시예에 따르면, 전자 장치(101)에서 실행되는 동작들의 전부 또는 일부는 외부 전자 장치들(102, 104, or 108) 중 하나 이상의 외부 장치들에서 실행될 수 있다. 예를 들면, 전자 장치(101)가 어떤 기능이나 서비스를 자동으로, 또는 사용자 또는 다른 장치로부터의 요청에 반응하여 수행해야 할 경우에, 전자 장치(101)는 기능 또는 서비스를 자체적으로 실행시키는 대신에 또는 추가적으로, 하나 이상의 외부 전자 장치들에게 그 기능 또는 그 서비스의 적어도 일부를 수행하라고 요청할 수 있다. 상기 요청을 수신한 하나 이상의 외부 전자 장치들은 요청된 기능 또는 서비스의 적어도 일부, 또는 상기 요청과 관련된 추가 기능 또는 서비스를 실행하고, 그 실행의 결과를 전자 장치(101)로 전달할 수 있다. 전자 장치(101)는 상기 결과를, 그대로 또는 추가적으로 처리하여, 상기 요청에 대한 응답의 적어도 일부로서 제공할 수 있다. 이를 위하여, 예를 들면, 클라우드 컴퓨팅, 분산 컴퓨팅, 또는 클라이언트-서버 컴퓨팅 기술이 이용될 수 있다.According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 does not execute the function or service by itself. In addition or in addition, it is possible to request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the execution result to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. To this end, for example, cloud computing, distributed computing, or client-server computing technology may be used.
본 문서에 발명된 다양한 실시예들에 따른 전자 장치는 다양한 형태의 장치가 될 수 있다. 전자 장치는, 예를 들면, 휴대용 통신 장치 (예: 스마트폰), 컴퓨터 장치, 휴대용 멀티미디어 장치, 휴대용 의료 기기, 카메라, 웨어러블 장치, 가전 장치, 스피커 장치, AI(artificial intelligence)스피커 또는 AI(artificial intelligence)로봇을 포함할 수 있다. 본 문서의 실시예에 따른 전자 장치는 전술한 기기들에 한정되지 않는다.Electronic devices according to various embodiments of the present disclosure may be devices of various types. The electronic device is, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance device, a speaker device, an artificial intelligence (AI) speaker or an artificial intelligence (AI) device. intelligence) may include a robot. The electronic device according to the embodiment of the present document is not limited to the above-described devices.
본 문서의 다양한 실시예들 및 이에 사용된 용어들은 본 문서에 기재된 기술적 특징들을 특정한 실시예들로 한정하려는 것이 아니며, 해당 실시예의 다양한 변경, 균등물, 또는 대체물을 포함하는 것으로 이해되어야 한다. 도면의 설명과 관련하여, 유사한 또는 관련된 구성요소에 대해서는 유사한 참조 부호가 사용될 수 있다. 아이템에 대응하는 명사의 단수 형은 관련된 문맥상 명백하게 다르게 지시하지 않는 한, 상기 아이템 한 개 또는 복수 개를 포함할 수 있다. 본 문서에서, "A 또는 B", "A 및 B 중 적어도 하나", "A 또는 B 중 적어도 하나,""A, B 또는 C," "A, B 및 C 중 적어도 하나,"및 "A, B, 또는 C 중 적어도 하나"와 같은 문구들 각각은 그 문구들 중 해당하는 문구에 함께 나열된 항목들의 모든 가능한 조합을 포함할 수 있다. "제1", "제2", 또는 "첫째" 또는 "둘째"와 같은 용어들은 단순히 해당 구성요소를 다른 해당 구성요소와 구분하기 위해 사용될 수 있으며, 해당 구성요소들을 다른 측면(예: 중요성 또는 순서)에서 한정하지 않는다. 어떤(예: 제1) 구성요소가 다른(예: 제2) 구성요소에, "기능적으로" 또는 "통신적으로"라는 용어와 함께 또는 이런 용어 없이, "커플드" 또는 "커넥티드"라고 언급된 경우, 그것은 상기 어떤 구성요소가 상기 다른 구성요소에 직접적으로(예: 유선으로), 무선으로, 또는 제3 구성요소를 통하여 연결될 수 있다는 것을 의미한다.Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or a plurality of the items unless clearly indicated otherwise in a related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “A Each of the phrases such as "at least one of B, or C" may include all possible combinations of items listed together in the corresponding phrase among the phrases. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the component from other corresponding components, and the components may be referred to in other aspects (eg, importance or Order) is not limited. Some (eg, a first) component is referred to as “coupled” or “connected” to another (eg, a second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that any of the above components may be connected to the other components directly (eg by wire), wirelessly, or via a third component.
본 문서에서 사용된 용어 "모듈"은 하드웨어, 소프트웨어 또는 펌웨어로 구현된 유닛을 포함할 수 있으며, 예를 들면, 로직, 논리 블록, 부품, 또는 회로 같은 용어와 상호 호환적으로 사용될 수 있다. 모듈은, 일체로 구성된 부품 또는 하나 또는 그 이상의 기능을 수행하는, 상기 부품의 최소 단위 또는 그 일부가 될 수 있다. 예를 들면, 일실시예에 따르면, 모듈은 ASIC(application-specific integrated circuit)의 형태로 구현될 수 있다. The term "module" used in this document may include a unit implemented by hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
본 문서의 다양한 실시예들은 기기(machine, 예: 전자 장치(101)) 의해 읽을 수 있는 저장 매체(storage medium, 예: 내장 메모리(136) 또는 외장 메모리(138))에 저장된 하나 이상의 명령어들을 포함하는 소프트웨어(예: 프로그램(140))로서 구현될 수 있다. 예를 들면, 기기(예: 전자 장치(101))의 프로세서(예: 프로세서(120))는, 저장 매체로부터 저장된 하나 이상의 명령어들 중 적어도 하나의 명령을 호출하고, 그것을 실행할 수 있다. 이것은 기기가 상기 호출된 적어도 하나의 명령어에 따라 적어도 하나의 기능을 수행하도록 운영되는 것을 가능하게 한다. 상기 하나 이상의 명령어들은 컴파일러에 의해 생성된 코드 또는 인터프리터에 의해 실행될 수 있는 코드를 포함할 수 있다. 기기로 읽을 수 있는 저장매체 는, 비일시적(non-transitory) 저장매체의 형태로 제공될 수 있다. 여기서, '비일시적'은 저장매체가 실재(tangible)하는 장치이고, 신호(signal, 예: 전자기파)를 포함하지 않는다는 것을 의미할 뿐이며, 이 용어는 데이터가 저장매체에 반영구적으로 저장되는 경우와 임시적으로 저장되는 경우를 구분하지 않는다.Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (for example, the program 140). For example, the processor (eg, the processor 120) of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This makes it possible for the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. A storage medium that can be read by a device may be provided in the form of a non-transitory storage medium. Here,'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and temporary. It does not distinguish the case where it is stored as.
일실시예에 따르면, 본 문서에 발명된 다양한 실시예들에 따른 방법은 컴퓨터 프로그램 제품(computer program product)에 포함되어 제공될 수 있다. 컴퓨터 프로그램 제품은 상품으로서 판매자 및 구매자 간에 거래될 수 있다. 컴퓨터 프로그램 제품은 기기로 읽을 수 있는 저장 매체(예: compact disc read only memory (CD-ROM))의 형태로 배포되거나, 또는 어플리케이션 스토어(예: 플레이 스토어TM)를 통해 또는 두개의 사용자 장치들(예: 스마트폰들) 간에 직접, 온라인으로 배포(예: 다운로드 또는 업로드)될 수 있다. 온라인 배포의 경우에, 컴퓨터 프로그램 제품의 적어도 일부는 제조사의 서버, 어플리케이션 스토어의 서버, 또는 중계 서버의 메모리와 같은 기기로 읽을 수 있는 저장 매체에 적어도 일시 저장되거나, 임시적으로 생성될 수 있다.According to an embodiment, the method according to various embodiments of the present disclosure may be provided by being included in a computer program product. Computer program products can be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store TM ) or two user devices ( It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.
다양한 실시예들에 따르면, 상기 기술한 구성요소들의 각각의 구성요소(예: 모듈 또는 프로그램)는 단수 또는 복수의 개체를 포함할 수 있다. 다양한 실시예들에 따르면, 전술한 해당 구성요소들 중 하나 이상의 구성요소들 또는 동작들이 생략되거나, 또는 하나 이상의 다른 구성요소들 또는 동작들이 추가될 수 있다. 대체적으로 또는 추가적으로, 복수의 구성요소들(예: 모듈 또는 프로그램)은 하나의 구성요소로 통합될 수 있다. 이런 경우, 통합된 구성요소는 상기 복수의 구성요소들 각각의 구성요소의 하나 이상의 기능들을 상기 통합 이전에 상기 복수의 구성요소들 중 해당 구성요소에 의해 수행되는 것과 동일 또는 유사하게 수행할 수 있다. 다양한 실시예들에 따르면, 모듈, 프로그램 또는 다른 구성요소에 의해 수행되는 동작들은 순차적으로, 병렬적으로, 반복적으로, 또는 휴리스틱하게 실행되거나, 상기 동작들 중 하나 이상이 다른 순서로 실행되거나, 생략되거나, 또는 하나 이상의 다른 동작들이 추가될 수 있다. According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in the same or similar to that performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are sequentially, parallel, repeatedly, or heuristically executed, or one or more of the above operations are executed in a different order or omitted. Or one or more other actions may be added.
도 2는 본 발명의 다양한 실시예에 따른, 발광 장치(200)를 포함한 전자 장치(예: 도 1의 전자 장치(101))의 구성을 나타내는 분해 입체도 이고, 도 3은 본 발명의 다양한 실시예에 따른, 발광 장치(200)를 포함한 전자 장치(예: 도 1의 전자 장치(101))를 나타내는 입체도 이며, 도 4는 도 3의 A-A'선단면도로서, 발광 장치(200)를 포함한 전자 장치(예: 도 1의 전자 장치(101))의 작동 상태를 나타내는 측단면도 이다.FIG. 2 is an exploded three-dimensional view showing the configuration of an electronic device (eg, the electronic device 101 of FIG. 1) including a light emitting device 200 according to various embodiments of the present disclosure, and FIG. 3 is an exploded view illustrating various implementations of the present disclosure. According to an example, it is a three-dimensional view showing an electronic device including the light emitting device 200 (for example, the electronic device 101 of FIG. 1), and FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3, and the light emitting device 200 It is a side cross-sectional view showing an operating state of an electronic device (eg, the electronic device 101 of FIG. 1) including.
도 2 내지 도 4를 참조하면, 다양한 실시예에 따른 발광 장치(200)를 포함한 전자 장치(예: 도 1의 전자 장치(101))는 휴대용 통신 장치, 스마트폰, 컴퓨터 장치, 휴대용 멀티미디어 장치, 휴대용 의료 기기, 카메라, 웨어러블 장치, 가전 장치, 홈 디바이스, 스피커 장치, AI(artificial intelligence)스피커 또는 AI(artificial intelligence)로봇 중 적어도 하나를 포함할 수 있다. 예를 들어, 상기 전자 장치(101)는 바닥에 거치하는 스피커 또는 인공지능(AI) 스피커 중 적어도 하나를 포함할 수 있다. 본 실시예에서의 전자 장치(101)는 스피커를 예를 들어 설명하기로 한다.2 to 4, an electronic device (eg, the electronic device 101 of FIG. 1) including the light emitting device 200 according to various embodiments includes a portable communication device, a smart phone, a computer device, a portable multimedia device, It may include at least one of a portable medical device, a camera, a wearable device, a home appliance device, a home device, a speaker device, an artificial intelligence (AI) speaker, or an artificial intelligence (AI) robot. For example, the electronic device 101 may include at least one of a speaker mounted on a floor or an artificial intelligence (AI) speaker. In the present embodiment, the electronic device 101 will be described using a speaker as an example.
다양한 실시예에 따르면, 상기 전자 장치(101)는 하우징(210)에 포함하고, 상기 하우징(210)은 적어도 하나의 데코 부재(211, 212)를 포함할 수 있다. 예컨대, 상기 하우징(210)내에는 상기 적어도 하나의 데코 부재(211, 212)를 조명하는 복수의 발광 소자(221)를 포함할 수 있다. 상기 발광 소자(221)의 광(L1)이 상기 적어도 하나의 데코 부재(211, 212)를 통해 하우징(210)의 외부로 발산될 수 있다. 상기 적어도 하나의 데코 부재(211, 212)는 상기 광(L1)의 발광 색상, 점멸 주기나 패턴을 이용하여 다양한 시각적 효과를 구현할 수 있을 뿐만 아니라, 상기 전자 장치(101)의 상태 정보를 표시할 수 있다. 예컨대. 상기 전자 장치(101)를 스피커로 사용할 경우, 상기 광(L1)의 발광 색상을 통해 스피커의 음향 출력을 표시할 수 있다. 또한, 상기 전자 장치(101)를 통해 전화나 메시지가 수신되면, 상기 발광 소자(221)의 광(L1)을 점멸시켜 이를 사용자에게 인지시킬 수 있다. 이와 같이, 상기 전자 장치(101)는 상기 발광 소자(221)의 광(L1)을 이용하여 시각적 효과나 간단한 정보를 표시할 수 있다.According to various embodiments, the electronic device 101 may be included in the housing 210, and the housing 210 may include at least one decor member 211 and 212. For example, the housing 210 may include a plurality of light-emitting elements 221 that illuminate the at least one decor member 211 and 212. The light L1 of the light emitting device 221 may be radiated to the outside of the housing 210 through the at least one decor member 211 and 212. The at least one decor member 211 and 212 may not only implement various visual effects by using the emission color, blinking period or pattern of the light L1, but also display state information of the electronic device 101. I can. for example. When the electronic device 101 is used as a speaker, the sound output of the speaker may be displayed through the emission color of the light L1. In addition, when a phone call or a message is received through the electronic device 101, the light L1 of the light emitting element 221 may be flashed and the user may recognize it. In this way, the electronic device 101 may display a visual effect or simple information by using the light L1 of the light emitting element 221.
다양한 실시예에 따르면, 이러한 상기 발광 장치(200)는 하우징(210), 회로 기판(220), 제1, 2 확산 부재(230, 260) 및 제1, 2 반사 구조(240, 250)를 포함할 수 있다. 예를 들어, 상기 하우징(210)은 적어도 하나의 데코 부재를 포함할 수 있고, 상기 적어도 하나의 데코 부재는 제1, 2 데코 부재(211, 212)를 포함할 수 있다. 예컨대, 상기 제1 데코 부재(211)는 상기 제2 데코 부재(212)의 상면 중심부에 결합되고, 상기 제2 데코 부재(212)의 제1 면(212a)은 상기 제1 데코 부재(211)와 결합되는 데코홈(212c)을 형성할 수 있고, 상기 제2 데코 부재(212)의 제1 면(212a)의 반대편 제2 면(212b)은 상기 제1 반사 구조(240)를 배치할 수 있다. 예컨대, 상기 제2 데코 부재(212)는 상기 하우징(210)의 측면 둘레에 배치될 수 있다. 상기 제1 데코 부재(211)는 원반형의 데코 부재로 이루어질 수 있고, 상기 제2 데코 부재(212)는 데코 링 형상으로 이루어질 수 있다. 상기 제2 데코 부재(212)의 제2 면에 배치된 제1 반사 구조(240)는 회로 기판(220)과 이격되게 배치될 수 있고, 상기 회로 기판(220)은 상기 하우징(210)의 내측을 향하는 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 광을 출사하는 복수의 발광 소자(221)를 구비할 수 있다. 예컨대, 상기 복수의 발광 소자(221)의 광(L1)은 상기 하우징(210)의 수직 방향(예; Z축 방향)으로 출사하는 것이 아니라 상기 하우징(210)의 내측을 향하는 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 출사할 수 있다.According to various embodiments, the light emitting device 200 includes a housing 210, a circuit board 220, first and second diffusion members 230 and 260, and first and second reflective structures 240 and 250. can do. For example, the housing 210 may include at least one decor member, and the at least one decor member may include first and second decor members 211 and 212. For example, the first decor member 211 is coupled to the center of the upper surface of the second decor member 212, and the first surface 212a of the second decor member 212 is the first decor member 211 It is possible to form a decor groove (212c) coupled to, and the second surface (212b) opposite to the first surface (212a) of the second decor member 212 may arrange the first reflective structure (240). have. For example, the second decor member 212 may be disposed around a side surface of the housing 210. The first decor member 211 may be formed of a disc-shaped decor member, and the second decor member 212 may be formed in a decor ring shape. The first reflective structure 240 disposed on the second surface of the second decorating member 212 may be disposed to be spaced apart from the circuit board 220, and the circuit board 220 may be disposed inside the housing 210. A plurality of light-emitting elements 221 may be provided to emit light in the first direction A1 (eg, in the X-axis direction or the Y-axis direction) toward. For example, the light L1 of the plurality of light emitting devices 221 is not emitted in a vertical direction (eg, Z-axis direction) of the housing 210, but a first direction A1 toward the inside of the housing 210 ) (E.g., X-axis direction or Y-axis direction).
다양한 실시예에 따르면, 상기 제1 확산 부재(230)는 상기 광(L1)을 전달받아 확산하도록 상기 하우징(210)과 상기 회로 기판(220)의 사이에 배치될 수 있다. 예컨대, 상기 제1 확산 부재(230)는 상기 발광 소자(221)와 이격되게 배치될 수 있고, 상기 발광 소자(221)보다 더 상기 하우징(210)의 내측에 배치될 수 있다. 따라서, 상기 제1 확산 부재(230)는 상기 발광 소자(221)의 광(L1)이 상기 하우징(210)의 내측으로 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 출사할 경우, 상기 출사된 광(L1)을 전달받아 확산시킬 수 있다. 다른 예를 들어, 상기 제1 확산 부재(230)는 상기 광(L1)을 반사하는 반사 부재로도 이루어질 수 있다.According to various embodiments, the first diffusion member 230 may be disposed between the housing 210 and the circuit board 220 to receive and diffuse the light L1. For example, the first diffusion member 230 may be disposed to be spaced apart from the light emitting device 221, and may be disposed more inside the housing 210 than the light emitting device 221. Accordingly, the first diffusion member 230 emits light L1 of the light emitting element 221 toward the inside of the housing 210 in a first direction A1 (eg, an X-axis direction or a Y-axis direction). In this case, the emitted light L1 may be received and diffused. For another example, the first diffusion member 230 may also be formed of a reflective member that reflects the light L1.
다양한 실시예에 따르면, 상기 제1 반사 구조(240)는 상기 제1 확산 부재(230)로부터 확산된 적어도 일부의 제1 확산광(B1)을 상기 하우징(210)의 외측을 향하는 제2 방향(A2)(예; X축 방향 또는 Y축 방향)으로 반사시킬 수 있다. 예컨대, 상기 제1 반사 구조(240)는 상기 발광 소자(221)의 상부에 이격되게 배치됨과 동시에 상기 하우징(210)의 제2 데코 부재(212)의 상기 제2 면(212b)에 배치될 수 있다. 상기 제1 반사 구조(240)는 상기 적어도 일부의 제1 확산광(B1)을 상기 하우징(210)의 외측을 향하는 상기 제2 방향(A2)(예; X축 방향 또는 Y축 방향)으로 반사할 수 있다.According to various embodiments, the first reflective structure 240 directs at least a portion of the first diffused light B1 diffused from the first diffuser 230 toward the outside of the housing 210 in a second direction ( It can be reflected in A2) (e.g., X-axis direction or Y-axis direction). For example, the first reflective structure 240 may be disposed to be spaced apart from the top of the light emitting element 221 and at the same time be disposed on the second surface 212b of the second decor member 212 of the housing 210. have. The first reflective structure 240 reflects the at least part of the first diffused light B1 in the second direction A2 (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing 210 can do.
다양한 실시예에 따르면, 상기 제2 반사 구조(250)는 상기 회로 기판(220)상에 배치되고, 상기 제1 반사 구조(240)와 이격되게 배치될 수 있다. 예컨대, 상기 제2 반사 구조(250)는 상기 적어도 일부의 제1 확산광(B1) 및 상기 제1 반사 구조(240)로부터 반사된 제1 반사광(C1)을 상기 제2 방향(A2)(예; X축 방향 또는 Y축 방향)으로 반사할 수 있다. 예컨대, 상기 제2 반사 구조(250)는 상기 적어도 일부의 제1 확산광(B1) 및 상기 제2 반사광(C2)을 반사하여 후술하는 상기 제2 확산 부재(260)에 전달할 수 있다. 상기 제2 반사광(C2)은 사선으로 반사될 수 있다.According to various embodiments, the second reflective structure 250 may be disposed on the circuit board 220 and may be disposed to be spaced apart from the first reflective structure 240. For example, the second reflective structure 250 transfers the at least part of the first diffused light B1 and the first reflected light C1 reflected from the first reflective structure 240 in the second direction A2 (eg ; Can be reflected in the X-axis direction or Y-axis direction). For example, the second reflective structure 250 may reflect the at least a portion of the first diffused light B1 and the second reflective light C2 and transmit it to the second diffuser 260 to be described later. The second reflected light C2 may be reflected diagonally.
다양한 실시예에 따르면, 상기 제2 확산 부재(260)는 상기 하우징(210)과 상기 제2 반사 구조(250)의 사이에 배치될 수 있다. 예컨대, 상기 제2 확산 부재(260)는 상기 제2 데코 부재(212)의 내측에 배치될 수 있다. 이 상태에서, 상기 제2 확산 부재(260)는 상기 제2 반사 구조(250)로부터 반사된 제2 반사광(C2)을 전달받아 상기 하우징(210)의 외측으로 확산할 수 있다. 예컨대, 상기 제2 확산 부재(260)로부터 확산된 제2 확산광(B2)은 상기 제2 데코 부재(212)를 투과하여 상기 하우징(210)의 외부로 발산될 수 있다. 상기 제2 확산광(B2)은 사선으로 확산될 수 있다.According to various embodiments, the second diffusion member 260 may be disposed between the housing 210 and the second reflective structure 250. For example, the second diffusion member 260 may be disposed inside the second decor member 212. In this state, the second diffusion member 260 may receive the second reflected light C2 reflected from the second reflective structure 250 and diffuse to the outside of the housing 210. For example, the second diffused light B2 diffused from the second diffuser 260 may pass through the second decorating member 212 and radiate to the outside of the housing 210. The second diffused light B2 may be diffused diagonally.
다양한 실시예에 따르면, 상기 제2 데코 부재(212)는 상기 제2 확산 부재(260)로부터 확산된 제2 확산광(B2)을 투과하는 투명 데코 부재 또는 반투명 데코 부재 중 적어도 하나를 포함할 수 있다. 본 실시예에서, 상기 제2 데코 부재(212)는 상기 제2 확산광(B2)을 투과하는 구성이라면, 상기 투명 데코 부재 또는 상기 반투명 데코 부재이외에 다른 데코 부재로도 다양하게 적용될 수 있다.According to various embodiments, the second decorating member 212 may include at least one of a transparent decorating member or a translucent decorating member that transmits the second diffused light B2 diffused from the second diffusion member 260. have. In this embodiment, if the second decorating member 212 is configured to transmit the second diffused light B2, various decorating members other than the transparent decorating member or the translucent decorating member may be applied.
다양한 실시예에 따르면, 앞서 언급한 도 4를 참조하면, 상기 전자 장치(101)에 구비된 발광 장치(200)는 전자 장치(101)의 하우징(210), 회로 기판(220), 제1, 2 확산 부재(230, 260) 및 제1, 2 반사 구조(240, 250)를 포함할 수 있다. 예를 들어, 상기 하우징(210)내에는 복수의 발광 소자(221)를 구비한 상기 회로 기판(220)이 구비되고, 상기 회로 기판(220)의 상면에는 상기 제2 반사 구조(250)를 결합시킬 수 있다. 예컨대, 상기 제1, 2 반사 구조(240, 250) 및 제1, 2 확산 부재(230, 260)는 하우징(210)과 제2 데코 부재(212)의 사이에서 평면으로 배치될 수 있다. 따라서, 제1, 2 확산 부재(230, 260) 및 제1, 2 반사 구조(240, 250)는 복수의 발광 소자(221)의 광(L1)을 상기 제1, 2 방향(A1, A2)으로 중첩, 반사 및/또는 확산시킬 수 있다.According to various embodiments, referring to FIG. 4 mentioned above, the light emitting device 200 included in the electronic device 101 includes the housing 210, the circuit board 220, the first, It may include two diffusion members 230 and 260 and first and second reflective structures 240 and 250. For example, the circuit board 220 having a plurality of light emitting devices 221 is provided in the housing 210, and the second reflective structure 250 is coupled to the upper surface of the circuit board 220 I can make it. For example, the first and second reflective structures 240 and 250 and the first and second diffusion members 230 and 260 may be disposed in a plane between the housing 210 and the second decorating member 212. Accordingly, the first and second diffusion members 230 and 260 and the first and second reflective structures 240 and 250 direct the light L1 of the plurality of light emitting devices 221 in the first and second directions A1 and A2 Can be superimposed, reflected and/or diffused.
도 5는 본 발명의 다양한 실시예에 따른, 발광 장치를 포함한 전자 장치의 구성 중 회로 기판에 결합된 제2 반사 구조를 나타내는 확대 입체도 이다.5 is an enlarged three-dimensional view illustrating a second reflective structure coupled to a circuit board among the configurations of an electronic device including a light emitting device according to various embodiments of the present disclosure.
도 5을 참조하면, 상기 제2 반사 구조(250)에는 상기 복수의 발광 소자(221)를 결합하는 복수의 결합홀(251)이 형성될 수 있다. 예컨대, 상기 복수의 발광 소자(221)는 상기 회로 기판(220)에 구비되고, 이 상태에서, 상기 회로 기판(220)의 상면에 상기 제2 반사 구조(250)를 결합시킴과 동시에 상기 제2 반사 구조(250)의 복수의 결합홀(251)에 상기 복수의 발광 소자(221)를 결합시킬 수 있다. Referring to FIG. 5, a plurality of coupling holes 251 for coupling the plurality of light emitting devices 221 may be formed in the second reflective structure 250. For example, the plurality of light emitting devices 221 are provided on the circuit board 220, and in this state, the second reflective structure 250 is coupled to the upper surface of the circuit board 220 and the second The plurality of light emitting devices 221 may be coupled to the plurality of coupling holes 251 of the reflective structure 250.
따라서, 상기 제2 반사 구조(250)는 상기 복수의 발광 소자(221)를 결합하는 복수의 결합홀(251)을 형성함으로써, 상기 제2 반사 구조(250)와 상기 복수의 발광 소자(221)의 결합력을 향상시킬 수 있을 뿐만 아니라 상기 제2 반사 구조(250)와 상기 복수의 발광 소자(221)의 결합을 용이하게 할 수 있다.Accordingly, the second reflective structure 250 forms a plurality of coupling holes 251 for coupling the plurality of light emitting devices 221, so that the second reflective structure 250 and the plurality of light emitting devices 221 In addition to improving the coupling force of the second reflective structure 250 and the plurality of light emitting devices 221 can be easily combined.
한 실시예에 따르면, 상기 복수의 결합홀(251)의 적어도 일부는 상기 발광 소자(221)의 광(L1)을 상기 하우징(210)의 내측으로 가이드 하는 가이드부(252)를 형성함으로써, 상기 광(L1)은 상기 가이드부(252)에 의해 상기 하우징(210)의 내측으로 용이하게 가이드될 수 있다. 예컨대, 상기 발광 소자(221)는 상기 제2 반사 구조(250)의 복수의 결합홀(251)과 결합된 상태에서, 상기 발광 소자(221)의 광(L1)은 상기 복수의 결합홀(251)의 가이드부(252)를 통해 상기 하우징(210)의 내측으로 가이드될 수 있다. 따라서, 상기 가이드부(252)는 상기 하우징(210)의 내측으로 가이드하여 상기 광(L1)을 상기 하우징(210)의 내측에 구비된 상기 제1 확산 부재(230)로 전달을 용이하게 할 수 있다.According to an embodiment, at least a portion of the plurality of coupling holes 251 forms a guide part 252 for guiding the light L1 of the light emitting element 221 to the inside of the housing 210, The light L1 may be easily guided into the housing 210 by the guide part 252. For example, in a state in which the light emitting device 221 is coupled with the plurality of coupling holes 251 of the second reflective structure 250, the light L1 of the light emitting device 221 is transmitted to the plurality of coupling holes 251 ) May be guided to the inside of the housing 210 through the guide part 252. Therefore, the guide part 252 guides the inside of the housing 210 to facilitate delivery of the light L1 to the first diffusion member 230 provided inside the housing 210. have.
도 6은 본 발명의 다양한 실시예에 따른, 발광 장치(200)를 포함한 전자 장치(101)의 구성 중 회로 기판(220)에 결합된 제2 반사 구조(250)의 다른 실시예를 나타내는 확대 입체도 이다.6 is an enlarged three-dimensional view showing another embodiment of a second reflective structure 250 coupled to a circuit board 220 among the configurations of an electronic device 101 including a light emitting device 200 according to various embodiments of the present disclosure. Is also.
도 6을 참조하면, 상기 제2 반사 구조(250)에 형성된 복수의 결합홀(253)은 폐루프 형상(closed loop)으로 형성될 수 있다. 예컨대, 폐루프 형상(closed loop)으로 형성된 상기 복수의 결합홀(253)은 상기 회로 기판(220)에 구비된 복수의 발광 소자(221)와 결합될 경우, 상기 복수의 발광 소자(221)의 둘레를 모두 감싸면서 결합될 수 있다. Referring to FIG. 6, a plurality of coupling holes 253 formed in the second reflective structure 250 may be formed in a closed loop shape. For example, when the plurality of coupling holes 253 formed in a closed loop shape are combined with the plurality of light emitting elements 221 provided on the circuit board 220, the plurality of light emitting elements 221 It can be combined by wrapping it all around.
이렇게 상기 제2 반사 구조(250)와 상기 복수의 발광 소자(221)를 결합시킨 상태에서, 상기 제1 확산 부재(230)는 상기 복수의 발광 소자(221)보다 더 상기 하우징(210)의 내측에 배치되고, 상기 회로 기판(220)의 상면에 배치될 수 있다. 이렇게 상기 제1 확산 부재(230), 상기 복수의 발광 소자(221) 및 상기 제2 반사 구조(250)를 구비한 상기 회로 기판(220)은 상기 하우징(210)의 내부에 안착될 수 있다.In a state in which the second reflective structure 250 and the plurality of light-emitting elements 221 are combined, the first diffusion member 230 is more inside the housing 210 than the plurality of light-emitting elements 221 And may be disposed on the upper surface of the circuit board 220. In this way, the circuit board 220 including the first diffusion member 230, the plurality of light emitting devices 221 and the second reflective structure 250 may be mounted inside the housing 210.
다양한 실시예에 따르면, 앞서 언급한 도 4와 같이, 상기 하우징(210)은 제1, 2 데코 부재(211, 212)를 포함할 수 있고, 상기 제2 데코 부재(212)의 상면의 중심부에는 제1 데코 부재(211)가 배치되고, 상기 제2 데코 부재(212)의 하면에는 상기 제1 반사 구조(240)가 배치될 수 있다. 상기 제2 데코 부재(212)의 내측에는 상기 제2 확산 부재(260)가 배치될 수 있다. 이렇게 배치된 상기 제2 데코 부재(212)는 상기 하우징(210)의 상부에 결합됨과 동시에 상기 회로 기판(220)의 상부에 안착될 수 있다. 이때, 상기 제2 데코 부재(212)의 상기 제2 면(212b)에 배치된 제1 반사 구조(240)는 상기 회로 기판(220)의 상부에 배치됨과 동시에 상기 제2 반사 구조(250)와 이격되게 배치될 수 있다. 예컨대, 상기 제1, 2 반사 구조(240, 250)의 사이에는 상기 제1 확산 부재(230)의 제1 확산광(B1) 및 상기 제1, 2 반사 구조(240, 250)의 제1, 2 반사광(C1, C2)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중첩하는 중첩 공간(예; 중첩 거리)이 형성될 수 있다. 또한, 상기 제1, 2 반사 구조(240, 250)의 사이에는 상기 제1 확산 부재(230)의 제1 확산광(B1) 및 상기 제1, 2 반사 구조(240, 250)의 제1, 2 반사광(C1, C2)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 반사하는 반사 공간(A2)이 형성될 수 있다. 또한, 상기 제2 데코 부재(212)의 내측에는 상기 제2 확산 부재(260)로부터 확산된 제2 확산광(B2)을 확산시키는 확산 공간(A3)이 형성될 수 있다. 상기 제2 확산광(B2)은 상기 확산 공간(A3)을 지나 상기 제2 데코 부재(212)를 투과하여 상기 제2 데코 부재(212)의 외측으로 발산할 수 있다.According to various embodiments, as shown in FIG. 4 mentioned above, the housing 210 may include first and second decor members 211 and 212, and at the center of the upper surface of the second decor member 212 The first decor member 211 may be disposed, and the first reflective structure 240 may be disposed on a lower surface of the second decor member 212. The second diffusion member 260 may be disposed inside the second decor member 212. The second decor member 212 arranged in this way may be coupled to the upper portion of the housing 210 and may be mounted on the upper portion of the circuit board 220 at the same time. At this time, the first reflective structure 240 disposed on the second surface 212b of the second decorating member 212 is disposed on the circuit board 220 and simultaneously with the second reflective structure 250 They can be arranged spaced apart. For example, between the first and second reflective structures 240 and 250, the first diffused light B1 of the first diffusion member 230 and the first and second reflective structures 240 and 250 are 2 An overlapping space (eg, overlapping distance) overlapping the reflected light C1 and C2 in the first and second directions A1 and A2 (eg, the X-axis direction or the Y-axis direction) may be formed. In addition, between the first and second reflective structures 240 and 250, the first diffused light B1 of the first diffusion member 230 and the first and second reflective structures 240 and 250 are 2 A reflection space A2 for reflecting the reflected light C1 and C2 in the first and second directions A1 and A2 (eg, in the X-axis direction or the Y-axis direction) may be formed. In addition, a diffusion space A3 for diffusing the second diffusion light B2 diffused from the second diffusion member 260 may be formed inside the second decor member 212. The second diffused light B2 may pass through the diffusion space A3 and pass through the second decorating member 212 to radiate outward of the second decorating member 212.
예컨대, 상기 제1, 2 반사 구조(240, 250) 및 제1, 2 확산 부재(230, 260)는 하우징(210)과 제2 데코 부재(212)의 사이에 평면으로 배치됨으로써, 상기 광(L1)은 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 출사시킬 수 있을 뿐만 아니라, 상기 제1, 2 반사 구조(240, 250) 및 제1, 2 확산 부재(230, 260)에 의해 중첩 효율, 반사 효율 및/또는 확산 효율을 향상시킬 수 있다.For example, the first and second reflective structures 240 and 250 and the first and second diffusing members 230 and 260 are disposed in a plane between the housing 210 and the second decor member 212, so that the light ( L1) can be emitted in the first and second directions (A1, A2) (eg, the X-axis direction or the Y-axis direction), as well as the first and second reflective structures 240 and 250 and the first and second reflective structures. The overlapping efficiency, reflection efficiency, and/or diffusion efficiency may be improved by the diffusion members 230 and 260.
이 상태에서, 상기 전자 장치(101)를 구동하면, 미리 설정된 조건, 예컨대, 사용자의 설명에 따라 상기 복수의 발광 소자(221)로 하여금 광(L1)을 출사하거나 점멸할 수 있도록 프로세서(예: 도 1의 프로세서(120))가 활성화될 수 있다. 상기 프로세서(120)는 발생된 이벤트가 미러 설정된 조건 중 하나에 해당하는 여부를 비교 판단할 수 있다. 예컨대, '미리 설정된 조건' 이라함은 상기 복수의 발광 소자(221)의 점등하는 또는 상기 복수의 발광 소자(221)를 점멸시키는 조건을 의미할 수 있다. 예를 들어 상기 미리 설정된 조건은 스피커로 사용 상태, 지정된 전화 번호로부터의 전화나 메시지 수신을 포함할 수 있다. 이러한 상기 미리 설정된 조건에 해당하는 이벤트가 발생될 경우, 상기 프로세서(120)는 만족하는 조건에 따른 발광 모드로 상기 복수의 발광 소자(221)를 점등 또는 점멸시킬 수 있다. 상기 복수의 발광 소자(221)의 발광 모드는 다양하게 설정될 수 있다. 예컨대, 상기 복수의 발광 소자(221)는 다양한 발광 모드에 의해 광(L1)을 출사할 경우, 상기 광(L1)은 상기 하우징(210)의 내측을 향하는 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 출사할 수 있고, 상기 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 출사된 광(L1)은 상기 하우징(210)의 내측에 구비된 제1 확산 부재(230)로 전달될 수 있다. 상기 제1 확산 부재(230)는 상기 광(L1)을 전달받아 상기 하우징의 외측을 향하는 제2 방향(A2)(예; X축 방향 또는 Y축 방향)으로 확산할 수 있다. In this state, when the electronic device 101 is driven, a processor (e.g., a processor (e.g.:) to enable the plurality of light emitting elements 221 to emit or flash light L1 according to a preset condition, for example, a user's description The processor 120 of FIG. 1 may be activated. The processor 120 may compare and determine whether the generated event corresponds to one of mirror-set conditions. For example, the term'preset condition' may mean a condition in which the plurality of light-emitting elements 221 are turned on or the plurality of light-emitting elements 221 are flashed. For example, the preset condition may include a state of use as a speaker and reception of a call or message from a designated phone number. When an event corresponding to the preset condition occurs, the processor 120 may turn on or flash the plurality of light emitting devices 221 in a light emitting mode according to the satisfied condition. Emission modes of the plurality of light emitting devices 221 may be set in various ways. For example, when the plurality of light-emitting elements 221 emit light L1 by various light-emitting modes, the light L1 is in a first direction A1 toward the inside of the housing 210 (eg, X). The light (L1) may be emitted in the axial direction or in the Y-axis direction) and emitted in the first direction (A1) (eg, in the X-axis direction or Y-axis direction). 1 It may be transmitted to the diffusion member 230. The first diffusion member 230 may receive the light L1 and diffuse it in a second direction A2 (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing.
다양한 실시예에 따르면, 상기 제1 확산 부재(230)로부터 확산된 적어도 일부의 제1 확산광(B1)은 상기 제1, 2 반사 구조(240, 250)에 전달될 수 있다. 상기 제1 반사 구조(240)는 상기 적어도 일부의 상기 제1 확산광(B1)을 전달받아 상기 제2 반사 구조(250)로 반사할 수 있다. 예컨대, 상기 제2 반사 구조(250)는 상기 제1 확산 부재(230)로부터 확산된 적어도 일부의 제1 확산광(B1)을 전달 받을 수 있고, 상기 제1 반사 구조(240)로부터 반사된 제1 반사광(C1)을 전달 받을 수 있다.According to various embodiments, at least a portion of the first diffused light B1 diffused from the first diffuser 230 may be transmitted to the first and second reflective structures 240 and 250. The first reflective structure 240 may receive the at least part of the first diffused light B1 and reflect it to the second reflective structure 250. For example, the second reflective structure 250 may receive at least a portion of the first diffused light B1 diffused from the first diffuser 230, and the second reflective structure 250 reflected from the first reflective structure 240. 1 Can receive the reflected light (C1).
다양한 실시예에 따르면, 상기 제2 반사 구조(250)는 이렇게 전달 받은 상기 제1 확산광(B1) 및 상기 제2 반사광(C2)을 반사하여 상기 제2 확산 부재(260)로 전달할 수 있다. 상기 제2 확산 부재(260)는 상기 제2 반사 구조(250)로부터 반사된 제2 반사광(C2)을 전달 받아 확산시킬 수 있다. 상기 제2 확산 부재(260)로부터 확산된 제2 확산광(B2)은 상기 하우징(210)의 제2 데코 부재(212)로 전달하여 확산될 수 있다. According to various embodiments, the second reflective structure 250 may reflect the first diffused light B1 and the second reflected light C2 received in this manner and transmit the reflected light to the second diffuser 260. The second diffusion member 260 may receive and diffuse the second reflected light C2 reflected from the second reflective structure 250. The second diffused light B2 diffused from the second diffuser 260 may be transmitted to the second decorating member 212 of the housing 210 and diffused.
상기 제2 확산광(B2)은 상기 제2 데코 부재(212)를 투과하여 상기 제2 데코 부재(212)의 외측으로 발산할 수 있다.The second diffused light B2 may pass through the second decor member 212 and radiate outward of the second decor member 212.
이렇게 상기 제2 데코 부재(212)의 외측으로부터 발산된 상기 제2 확산광(B2)은 색상과 점멸 빈도를 이용하여 다양한 발광 모드를 구현할 수 있다.In this way, the second diffused light B2 emitted from the outside of the second decorating member 212 may implement various light emission modes by using color and flashing frequency.
예를 들어, 상기 전자 장치(101)를 스피커로 사용할 경우, 상기 제2 확산광(B2)의 발광 색상과 점멸 패턴을 통해 스피커의 음향 출력을 표시할 수 있다.For example, when the electronic device 101 is used as a speaker, the sound output of the speaker may be displayed through the emission color and blinking pattern of the second diffused light B2.
이와 같이, 상기 회로 기판(220)과 상기 제2 데코 부재(212)의 사이에 발광 소자(221)의 광(L1)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중첩, 반사 및/또는 확산할 수 있도록 제1, 2 반사 구조(240, 250) 및 제1, 2 확산 부재(230, 260)를 구성함으로써, 상기 발광 소자(221)의 광(L1)을 상기 제1, 2 방향(A1, A2)(예; 수평방항, X축 방향 또는 Y축 방향)으로 출사시켜 기존에 발생되던 핫스판(hot spot)의 발생을 방지할 수 있고, 이로인해 상기 광(L1)의 확산을 균일하게 함은 물론 제품의 시인성을 향상시킬 수 있다. 또한, 상기 제1, 2 반사 구조(240, 250) 및 제1, 2 확산 부재(230, 260)는 하우징(210)과 제2 데코 부재(212)의 사이에 평면으로 배치됨으로써, 하우징(210)의 내부에서 기존의 광을 수직 방향(예: Z축방향)으로 중첩, 반사 및/또는 확산하기 위한 수직 공간이 필요 없으므로, 발광 장치(200)의 크기를 줄일 수 있고, 이로인해 상기 발광 장치(200)를 포함하는 전자 장치를 소형화 또는 슬림화할 수 있다.In this way, the light L1 of the light emitting element 221 between the circuit board 220 and the second decorating member 212 is directed in the first and second directions (A1, A2) (eg, in the X-axis direction or The first and second reflective structures 240 and 250 and the first and second diffusing members 230 and 260 are configured to overlap, reflect, and/or diffuse in the Y-axis direction), so that the light of the light emitting device 221 (L1) is emitted in the first and second directions (A1, A2) (e.g., horizontal direction, X-axis direction, or Y-axis direction) to prevent the occurrence of a hot spot that has already occurred. , Due to this, the diffusion of the light L1 can be made uniform and the visibility of the product can be improved. In addition, the first and second reflective structures 240 and 250 and the first and second diffuser members 230 and 260 are disposed in a plane between the housing 210 and the second decor member 212, so that the housing 210 ), since there is no need for a vertical space for overlapping, reflecting, and/or diffusing existing light in a vertical direction (eg, in the Z-axis direction), the size of the light-emitting device 200 can be reduced, and thus the light-emitting device The electronic device including 200 may be miniaturized or slimmed.
도 7은 도 3의 A-A'선단면도로서, 발광 장치(300)를 포함한 전자 장치(예: 도 1의 전자 장치(101))의 다른 실시예의 작동 상태를 나타내는 측단면도 이다.FIG. 7 is a cross-sectional side view taken along line AA′ of FIG. 3 and is a side cross-sectional view illustrating an operation state of an electronic device including the light emitting device 300 (eg, the electronic device 101 of FIG. 1) according to another embodiment.
도 7을 참조하면, 전자 장치(101)에 포함된 발광 장치(300)는 하우징(310), 회로 기판(320), 제1, 2 반사구조(340, 350) 및 제1, 2 확산 부재(330, 360)를 포함할 수 있다. 예를 들어, 상기 하우징(310)내에는 상기 복수의 발광 소자(321)를 포함한 회로 기판(320)이 구비되고, 상기 복수의 발광 소자(321)는 상기 하우징(310)의 제1 방향(예; Z축방향)으로 광(L1)을 출사할 수 있다. 상기 회로 기판(320)의 상면에는 상기 제2 반사 구조(350)를 배치시킬 수 있다. 상기 제1 확산 부재(330)는 상기 복수의 발광 소자(321)보다 더 상기 하우징(310)의 내측에 배치되고, 상기 회로 기판(320)의 상면에 배치될 수 있고, 상기 복수의 발광 소자(321)와 나란하게 배치될 수 있다. 이렇게 상기 제1 확산 부재(330), 상기 복수의 발광 소자(321) 및 상기 제2 반사 구조(350)를 구비한 상기 회로 기판(320)은 상기 하우징(310)의 내부에 안착될 수 있다.Referring to FIG. 7, the light emitting device 300 included in the electronic device 101 includes a housing 310, a circuit board 320, first and second reflective structures 340 and 350, and first and second diffusion members ( 330, 360). For example, a circuit board 320 including the plurality of light-emitting elements 321 is provided in the housing 310, and the plurality of light-emitting elements 321 are in a first direction of the housing 310 (eg ; Light (L1) can be emitted in the Z-axis direction). The second reflective structure 350 may be disposed on the upper surface of the circuit board 320. The first diffusion member 330 may be disposed more inside the housing 310 than the plurality of light emitting devices 321, may be disposed on the upper surface of the circuit board 320, and the plurality of light emitting devices ( 321) and may be placed in parallel. In this way, the circuit board 320 including the first diffusion member 330, the plurality of light emitting devices 321, and the second reflective structure 350 may be mounted inside the housing 310.
다양한 실시예에 따르면, 상기 하우징(310)은 제1, 2 데코 부재(311, 312)를 포함할 수 있고, 상기 제2 데코 부재(312)의 상면의 중심부에는 제1 데코 부재(311)가 배치되고, 상기 제2 데코 부재(312)의 하면에는 상기 제1 반사 구조(340)가 배치될 수 있다. 상기 제2 데코 부재(312)의 내측에는 상기 제2 확산 부재(360)가 배치될 수 있다. 이렇게 배치된 상기 제2 데코 부재(312)는 상기 하우징(310)의 상부에 결합됨과 동시에 상기 회로 기판(320)의 상부에 안착될 수 있다. 이때, 상기 제2 데코 부재(312)의 제1 반사 구조(340)는 상기 회로 기판(320)의 상부에 배치됨과 동시에 상기 제2 반사 구조(350)와 이격되게 배치될 수 있다. According to various embodiments, the housing 310 may include first and second decor members 311 and 312, and a first decor member 311 is disposed at the center of the upper surface of the second decor member 312 And the first reflective structure 340 may be disposed on the lower surface of the second decor member 312. The second diffusion member 360 may be disposed inside the second decor member 312. The second decor member 312 arranged in this way may be coupled to the upper portion of the housing 310 and mounted on the upper portion of the circuit board 320. In this case, the first reflective structure 340 of the second decorating member 312 may be disposed above the circuit board 320 and may be disposed to be spaced apart from the second reflective structure 350.
예컨대, 상기 제1 반사 구조(340)는 상기 복수의 발광 소자(321)의 광(L1)을 제1 방향(예; Z축방향)으로 전달받아 상기 하우징의 내측을 향하는 제2 방향(A1)(예; X축방향 또는 Y축방향) 및 상기 하우징의 외측을 향하는 제3 방향(A2)(예; X축방향 또는 Y축방향)으로 반사할 수 있다. 예컨대, 상기 제1 반사 구조(340)는 상기 하우징의 내측을 향하는 제2 방향(A1)(예; X축방향 또는 Y축방향) 및 상기 하우징의 외측을 향하는 제2 방향(예; X축방향 또는 Y축방향)으로 반사할 수 있다. 상기 제1 반사 구조(340)로부터 반사된 제1 반사광(C1)은 상기 제1 확산 부재(330) 및 상기 제2 반사 구조(350)로 전달할 수 있다. 상기 제1 확산 부재(330)로부터 확산된 제1 확산광(B1)은 상기 제2 반사 구조(350)로 전달될 수 있다. 상기 제2 반사 구조(350)는 상기 제1 반사광(C1) 및 상기 제1 확산광(B1)을 전달 받아 반사할 수 있다. 상기 제2 반사 구조(350)로부터 반사된 제2 반사광(C2)은 상기 제2 확산 부재(360)에 전달되어 확산될 수 있다. 상기 제2 확산 부재(360)로부터 확산된 제2 확산광(B2)은 상기 하우징(310)의 제2 데코 부재(312)로 확산됨과 동시에 상기 제2 데코 부재(312)를 투과할 수 있다. 따라서, 상기 제2 확산광(B2)은 상기 제2 데코 부재(312)를 투과함과 동시에 상기 제2 데코 부재(312)의 외측으로 발산될 수 있다.For example, the first reflective structure 340 receives light L1 from the plurality of light emitting devices 321 in a first direction (eg, a Z-axis direction), and a second direction A1 toward the inside of the housing It can reflect in (eg, in the X-axis direction or in the Y-axis direction) and in the third direction (A2) toward the outside of the housing (eg, in the X-axis direction or Y-axis direction). For example, the first reflective structure 340 has a second direction (A1) toward the inside of the housing (eg, X-axis direction or Y-axis direction) and a second direction toward the outside of the housing (eg, X-axis direction). Or it can reflect in the Y-axis direction). The first reflected light C1 reflected from the first reflective structure 340 may be transmitted to the first diffusion member 330 and the second reflective structure 350. The first diffused light B1 diffused from the first diffuser 330 may be transmitted to the second reflective structure 350. The second reflective structure 350 may receive and reflect the first reflected light C1 and the first diffused light B1. The second reflected light C2 reflected from the second reflective structure 350 may be transmitted to and diffused by the second diffusion member 360. The second diffused light B2 diffused from the second diffuser 360 may diffuse to the second decorating member 312 of the housing 310 and transmit the second decorating member 312 at the same time. Accordingly, the second diffused light B2 may transmit through the second decor member 312 and radiate to the outside of the second decor member 312.
다양한 실시예에 따르면, 상기 제1, 2 반사 구조(340, 350)의 사이에는 상기 제1 확산 부재(330)의 제1 확산광(B1), 상기 제1, 2 반사 구조(340, 350)의 제1, 2 반사광(C1, C2)을 제2, 3 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중첩하는 중첩 공간(예; 중첩 거리)이 형성될 수 있다. 또한, 상기 제1, 2 반사 구조(340, 350)의 사이에는 상기 제1 확산 부재(330)의 제1 확산광(B1), 상기 제1, 2 반사 구조(340, 350)의 제1, 2 반사광(C1, C2)을 제2, 3 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 반사하는 반사 공간(A2)이 형성될 수 있다. 또한, 상기 제2 데코 부재(312)의 내측에는 상기 제2 확산 부재(360)로부터 확산된 제2 확산광(B2)을 확산시키는 확산 공간(A3)이 형성될 수 있다. 상기 제2 확산광(B2)은 상기 확산 공간(A3)을 지나 상기 제2 데코 부재(312)를 투과하여 상기 제2 데코 부재(312)의 외측으로 발산할 수 있다.According to various embodiments, between the first and second reflective structures 340 and 350, the first diffused light B1 of the first diffusion member 330 and the first and second reflective structures 340 and 350 An overlapping space (eg, overlapping distance) overlapping the first and second reflected lights C1 and C2 of in the second and third directions A1 and A2 (eg, in the X-axis direction or the Y-axis direction) may be formed. In addition, between the first and second reflective structures 340 and 350, the first diffused light B1 of the first diffusion member 330, the first and second reflective structures 340 and 350, 2 A reflection space A2 that reflects the reflected light C1 and C2 in the second and third directions A1 and A2 (eg, the X-axis direction or the Y-axis direction) may be formed. In addition, a diffusion space A3 for diffusing the second diffusion light B2 diffused from the second diffusion member 360 may be formed inside the second decor member 312. The second diffused light B2 may pass through the diffusion space A3 and pass through the second decorating member 312 and radiate outward of the second decorating member 312.
예컨대, 상기 제1, 2 반사 구조(340, 350) 및 제1, 2 확산 부재(330, 360)는 하우징(310)과 제2 데코 부재(312)의 사이에 평면으로 배치됨으로써, 상기 광(L1)을 상기 제2, 3방향(예; X축 방향 또는 Y축 방향)으로 중접, 반사 및/또는 확산시킬 수 있다. For example, the first and second reflective structures 340 and 350 and the first and second diffusing members 330 and 360 are disposed in a plane between the housing 310 and the second decor member 312, so that the light ( L1) may be overlapped, reflected, and/or diffused in the second and third directions (eg, the X-axis direction or the Y-axis direction).
이 상태에서, 상기 전자 장치(101)를 구동하면, 상기 복수의 발광 소자(321)는 다양한 발광 모드에 의해 광(L1)을 출사할 수 있다. 상기 광(L1)은 상기 하우징(310)의 내측으로 제1 방향(예; Z축 방향)으로 출사할 수 있고, 상기 제1 방향(예; Z축 방향)으로 출사된 광(L1)은 상기 발광 소자(321)의 상부에 배치된 제1 반사 구조(340)에 전달될 수 있다. 상기 제1 반사 구조(340)는 상기 광(L1)을 상기 제1 방향(예; Z축 방향)에서 상기 하우징(310)의 내측을 향하는 제2 방향(A1)(예; X축 방향 또는 Y축 방향) 및 상기 하우징(310)의 외측을 향하는 제3 방향(A2)(예; X축 방향 또는 Y축 방향)으로 반사할 수 있다.In this state, when the electronic device 101 is driven, the plurality of light-emitting elements 321 may emit light L1 in various light-emitting modes. The light L1 may be emitted to the inside of the housing 310 in a first direction (eg, Z-axis direction), and the light L1 emitted in the first direction (eg, Z-axis direction) is It may be transmitted to the first reflective structure 340 disposed on the light emitting device 321. The first reflective structure 340 directs the light L1 toward the inside of the housing 310 in the first direction (eg, Z-axis direction). Axial direction) and a third direction A2 (eg, an X-axis direction or a Y-axis direction) toward the outside of the housing 310.
따라서, 상기 제1 반사 구조(340)로부터 반사된 적어도 일부의 제1 반사광(C1)은 상기 하우징(310)의 내측에 구비된 제1 확산 부재(330)로 전달될 수 있고, 또한, 상기 제1 반사 구조(340)로부터 반사된 적어도 일부의 제1 반사광(C1)은 상기 제2 반사 구조(350)로 전달될 수 있다.Accordingly, at least a portion of the first reflected light C1 reflected from the first reflective structure 340 may be transmitted to the first diffusion member 330 provided inside the housing 310, and the first At least a portion of the first reflected light C1 reflected from the first reflective structure 340 may be transmitted to the second reflective structure 350.
다양한 실시예에 따르면, 상기 제1 확산 부재(330)는 전달 받은 상기 제1 반사광(C1)을 상기 제3 방향(A2)(예; X축 방향 또는 Y축 방향)으로 확산하고, 또한, 상기 제2 반사 구조(350)는 전달 받은 상기 제1 반사광(C1)은 상기 제3 방향(A2)(예; X축 방향 또는 Y축 방향)으로 반사할 수 있다.According to various embodiments, the first diffusion member 330 diffuses the received first reflected light C1 in the third direction A2 (eg, in the X-axis direction or the Y-axis direction), and further, the The second reflective structure 350 may reflect the received first reflected light C1 in the third direction A2 (eg, an X-axis direction or a Y-axis direction).
다양한 실시예에 따르면, 상기 제1 확산 부재(330)로부터 확산된 적어도 일부의 제1 확산광(B1)은 상기 제2 반사 구조(350)에 전달될 수 있다. 상기 제2 반사 구조(350)는 상기 적어도 일부의 상기 제1 확산광(B1)을 전달받아 상기 제2 확산 부재(360)로 반사할 수 있다. 또한, 상기 제2 반사 구조(350)는 전달 받은 상기 제1 반사광(C1)을 반사하여 상기 제2 확산 부재(360)에 전달할 수 있다. 예컨대, 상기 제2 반사 구조(350)는 상기 제1 확산광(B1) 및 상기 제1 반사광(C1)을 전달 받음과 동시에 반사할 수 있다. 상기 제2 반사 구조(350)로부터 반사된 제2 반사광(C2)은 상기 제2 확산 부재(360)에 전달되어 확산될 수 있다.According to various embodiments, at least a portion of the first diffused light B1 diffused from the first diffuser 330 may be transmitted to the second reflective structure 350. The second reflective structure 350 may receive the at least part of the first diffused light B1 and reflect it to the second diffuser 360. In addition, the second reflective structure 350 may reflect the received first reflected light C1 and transmit it to the second diffusion member 360. For example, the second reflective structure 350 may reflect the first diffused light B1 and the first reflected light C1 at the same time as being transmitted. The second reflected light C2 reflected from the second reflective structure 350 may be transmitted to and diffused by the second diffusion member 360.
다양한 실시예에 따르면, 상기 제2 확산 부재(360)는 상기 제2 반사광(C2)을 전달 받아 확산시킬 수 있다. 상기 제2 확산 부재(360)로부터 확산된 제2 확산광(B2)은 상기 하우징(310)의 제2 데코 부재(312)로 확산될 수 있다. 상기 제2 확산광(B2)은 상기 제2 데코 부재(312)를 투과하여 상기 제2 데코 부재(312)의 외측으로 발산할 수 있다.According to various embodiments, the second diffusion member 360 may receive and diffuse the second reflected light C2. The second diffused light B2 diffused from the second diffuser 360 may diffuse to the second decorating member 312 of the housing 310. The second diffused light B2 may pass through the second decorating member 312 and radiate outward of the second decorating member 312.
다양한 실시예에 따르면, 상기 발광 장치(300)를 포함한 전자 장치(예; 도 1의 전자 장치(101))의 구성요소들 중 적어도 하나는, 도 4의 발광 장치(200)를 포함한 전자 장치(101)의 구성요소들 중 적어도 하나와 동일, 또는 유사할 수 있으며, 중복되는 설명은 이하 생략한다.According to various embodiments, at least one of the components of an electronic device including the light emitting device 300 (eg, the electronic device 101 of FIG. 1) is an electronic device including the light emitting device 200 of FIG. 101) may be the same as or similar to at least one of the components, and redundant descriptions will be omitted below.
이렇게 상기 제2 데코 부재(312)의 외측으로부터 발산된 상기 제2 확산광(B2)은 색상과 점멸 빈도를 이용하여 다양한 발광 모드를 구현할 수 있다. 예를 들어, 상기 전자 장치(101)를 스피커로 사용할 경우, 상기 제2 확산광(B2)의 발광 색상과 점멸 패턴을 통해 스피커의 음향 출력을 표시할 수 있다.In this way, the second diffused light B2 emitted from the outside of the second decorating member 312 may implement various light emission modes by using color and flashing frequency. For example, when the electronic device 101 is used as a speaker, the sound output of the speaker may be displayed through the emission color and blinking pattern of the second diffused light B2.
이와 같이, 회로 기판(320)과 하우징(310)의 제2 데코 부재(312)의 사이에 발광 소자(321)의 광(L1)을 제1 방향(예; Z축 방향)에서 상기 제2, 3 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 변경시키고, 변경된 광(L1)을 상기 제2, 3 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중첩, 반사 및/또는 확산할 수 있도록 제1, 2 반사 구조(340, 350) 및 제1, 2 확산 부재(330, 360)를 구성함으로써, 상기 발광 소자(321)의 광(L1)을 제1 방향(예; Z축 방향)에서 상기 제2, 3 방향(예; X축 방향 또는 Y축 방향)으로 변경을 더욱 용이하게 할 수 있고, 이로인해 기존에 발생되던 핫스판(hot spot)의 발생을 더욱 방지할 수 있고, 더불어 상기 광(L1)의 확산을 균일하게 함은 물론 제품의 시인성을 한층 더 향상시킬 수 있다.In this way, the light L1 of the light emitting element 321 between the circuit board 320 and the second decor member 312 of the housing 310 is transferred to the second, Changes in three directions (A1, A2) (e.g., X-axis direction or Y-axis direction), and changes the light (L1) in the second and third directions (A1, A2) (e.g., X-axis direction or Y-axis direction) By configuring the first and second reflective structures 340 and 350 and the first and second diffusing members 330 and 360 so that they can be overlapped, reflected, and/or diffused, the light L1 of the light emitting element 321 is It is possible to more easily change from the first direction (eg, the Z-axis direction) to the second and third directions (eg, the X-axis or Y-axis direction), and as a result, a hot spot that has already occurred In addition, it is possible to further prevent the occurrence of the light, and uniformly diffuse the light L1, as well as further improving the visibility of the product.
도 8는 도 3의 A-A'선단면도로서, 발광 장치(400)를 포함한 전자 장치(예: 도 1의 전자 장치(101))의 또 다른 실시예의 작동 상태를 나타내는 측단면도 이다.FIG. 8 is a cross-sectional side view taken along line AA′ of FIG. 3, and is a side cross-sectional view illustrating an operation state of another embodiment of an electronic device including the light emitting device 400 (eg, the electronic device 101 of FIG. 1 ).
도 8을 참조하면, 전자 장치(101)에 포함된 발광 장치(400)는 하우징(410), 회로 기판(420), 제1 내지 3 반사구조(430, 440, 450) 및 확산 부재(460)를 포함할 수 있다. 예를 들어, 상기 하우징(410)내에는 상기 복수의 발광 소자(421)를 포함한 회로 기판(420)이 구비되고, 상기 복수의 발광 소자(421)는 상기 하우징(410)의 제1 방향(A1)으로 광(L1)을 출사할 수 있다. 상기 회로 기판(420)의 상면에는 상기 제1, 3 반사 구조(430, 450)를 배치시킬 수 있다. 상기 제1 반사 구조(430)는 상기 복수의 발광 소자(421)보다 더 상기 하우징(410)의 내측에 배치되고, 상기 회로 기판(420)의 상면에 상기 복수의 발광 소자(421)와 나란하게 배치될 수 있다. 이렇게 상기 복수의 발광 소자(421) 및 상기 제1, 3 반사 구조(430, 450)가 결합된 상기 회로 기판(420)은 상기 하우징(410)의 내부에 안착될 수 있다.Referring to FIG. 8, the light emitting device 400 included in the electronic device 101 includes a housing 410, a circuit board 420, first to third reflective structures 430, 440, 450, and a diffusion member 460. It may include. For example, a circuit board 420 including the plurality of light-emitting elements 421 is provided in the housing 410, and the plurality of light-emitting elements 421 are in a first direction (A1) of the housing 410 ) Can emit light (L1). The first and third reflective structures 430 and 450 may be disposed on the upper surface of the circuit board 420. The first reflective structure 430 is disposed more inside the housing 410 than the plurality of light emitting devices 421, and parallel to the plurality of light emitting devices 421 on the upper surface of the circuit board 420 Can be placed. The circuit board 420 to which the plurality of light emitting devices 421 and the first and third reflective structures 430 and 450 are combined may be mounted inside the housing 410.
다양한 실시예에 따르면, 상기 하우징(410)은 제1, 2 데코 부재(411, 412)를 포함할 수 있고, 상기 제2 데코 부재(412)의 상면의 중심부에는 제1 데코 부재(411)가 배치되고, 상기 제2 데코 부재(412)의 하면에는 상기 제2 반사 구조(440)가 배치될 수 있다. 상기 제2 데코 부재(412)의 내측에는 상기 확산 부재(460)가 배치될 수 있다. 이렇게 배치된 상기 제2 데코 부재(412)는 상기 하우징(410)의 상부에 결합됨과 동시에 상기 회로 기판(420)의 상부에 안착될 수 있다. 이때, 상기 제3 반사 구조(450)는 상기 회로 기판(420)의 상부에 배치됨과 동시에 상기 제2 반사 구조(440)와 이격되게 배치될 수 있다. According to various embodiments, the housing 410 may include first and second decor members 411 and 412, and a first decor member 411 is disposed at the center of the upper surface of the second decor member 412. Is disposed, and the second reflective structure 440 may be disposed on a lower surface of the second decor member 412. The diffusion member 460 may be disposed inside the second decor member 412. The second decor member 412 disposed in this way may be coupled to the upper portion of the housing 410 and may be mounted on the upper portion of the circuit board 420. In this case, the third reflective structure 450 may be disposed above the circuit board 420 and may be disposed to be spaced apart from the second reflective structure 440.
예컨대, 상기 복수의 발광 소자(421)는 상기 하우징(410)의 내측을 향하는 제1 방향(A1)(예; X축방향 또는 Y축방향)으로 광(L1)을 출사할 수 있다. 출사된 광(L1)은 상기 복수의 발광 소자(421)와 이격되게 배치된 상기 제1 반사 구조(430)에 전달될 수 있다. 상기 제1 반사 구조(430)는 상기 복수의 발광 소자(421)의 광(L1)을 상기 하우징(410)의 내측에서 외측을 향하는 제2 방향(A2)(예; X축방향 또는 Y축방향)으로 반사할 수 있다. 상기 제1 반사 구조(430)로부터 반사된 제1 반사광(C1)은 상기 제2 반사 구조(440)로 전달할 수 있다. 상기 제2 반사 구조(440)로부터 반사된 제2 반사광(C2)은 상기 제3 반사 구조(450)로 전달받아 반사될 수 있다. 상기 제3 반사 구조(450)로부터 반사된 제3 반사광(C3)은 상기 확산 부재(460)에 전달되어 확산될 수 있다. 상기 확산 부재(460)로부터 확산된 확산광(B1)은 상기 하우징(410)의 제2 데코 부재(412)로 확산됨과 동시에 상기 제2 데코 부재(412)를 투과할 수 있다. 따라서, 상기 확산광(B1)은 상기 제2 데코 부재(412)를 투과함과 동시에 상기 제2 데코 부재(412)의 외측으로 발산될 수 있다.For example, the plurality of light emitting devices 421 may emit light L1 in a first direction A1 (eg, an X-axis direction or a Y-axis direction) toward the inside of the housing 410. The emitted light L1 may be transmitted to the first reflective structure 430 disposed to be spaced apart from the plurality of light emitting devices 421. The first reflective structure 430 has a second direction A2 (eg, an X-axis direction or a Y-axis direction) from the inside of the housing 410 toward the light L1 of the plurality of light-emitting elements 421 outward. ) Can be reflected. The first reflected light C1 reflected from the first reflective structure 430 may be transmitted to the second reflective structure 440. The second reflected light C2 reflected from the second reflective structure 440 may be transmitted to the third reflective structure 450 and reflected. The third reflected light C3 reflected from the third reflective structure 450 may be transmitted to and diffused by the diffusion member 460. The diffused light B1 diffused from the diffusion member 460 may diffuse to the second decor member 412 of the housing 410 and pass through the second decor member 412 at the same time. Accordingly, the diffused light B1 may pass through the second decorating member 412 and radiate outward of the second decorating member 412 at the same time.
다양한 실시예에 따르면, 상기 제1 내지 3 반사 구조(430, 440, 450)의 사이에는 상기 제1 내지 3 반사 구조(430, 440, 450)의 제1 내지 3 반사광(430, 440, 450) 및 확산 부재(460)의 확산광(B1)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중첩하는 중첩 공간(예; 중첩 거리)이 형성될 수 있다. 또한, 상기 제1 내지 3 반사 구조(430, 440, 450)의 사이에는 상기 제1 내지 3 반사 구조(430, 440, 450)의 제1 내지 3 반사광(C1, C2, C3) 및 확산 부재(460)의 확산광(B1)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 반사하는 반사 공간(A2)이 형성될 수 있다. 또한, 상기 제2 데코 부재(412)의 내측에는 상기 확산광(B1)을 확산시키는 확산 공간(A3)이 형성될 수 있다. 상기 확산광(B1)은 상기 확산 공간(A3)을 지나 상기 제2 데코 부재(412)를 투과하여 상기 제2 데코 부재(412)의 외측으로 발산할 수 있다.According to various embodiments, the first to third reflected lights 430, 440, 450 of the first to third reflecting structures 430, 440, and 450 are disposed between the first to third reflecting structures 430, 440, and 450. And an overlapping space (eg, overlapping distance) overlapping the diffusion light B1 of the diffusion member 460 in the first and second directions (A1, A2) (eg, X-axis direction or Y-axis direction). have. In addition, between the first to third reflective structures 430, 440, 450, the first to third reflected lights C1, C2, C3 of the first to third reflective structures 430, 440, 450 and a diffusion member ( A reflection space A2 that reflects the diffused light B1 of 460 in the first and second directions A1 and A2 (eg, in the X-axis direction or the Y-axis direction) may be formed. In addition, a diffusion space A3 for diffusing the diffusion light B1 may be formed inside the second decor member 412. The diffused light B1 may pass through the diffusion space A3 and pass through the second decorating member 412 and radiate to the outside of the second decorating member 412.
예컨대, 상기 제1 내지 3 반사 구조(430, 440, 450) 및 확산 부재(460)는 하우징(410)과 제2 데코 부재(412)의 사이에 평면으로 배치될 수 있다.For example, the first to third reflective structures 430, 440, and 450 and the diffusion member 460 may be disposed in a plane between the housing 410 and the second decor member 412.
상기 발광 장치(400)를 포함한 전자 장치(예; 도 1의 전자 장치(101))의 구성요소들 중 적어도 하나는, 도 4의 발광 장치(200)를 포함한 전자 장치(101)의 구성요소들 중 적어도 하나와 동일, 또는 유사할 수 있으며, 중복되는 설명은 이하 생략한다.At least one of the components of the electronic device including the light emitting device 400 (eg, the electronic device 101 of FIG. 1) is the components of the electronic device 101 including the light emitting device 200 of FIG. 4 It may be the same as or similar to at least one of them, and redundant descriptions will be omitted below.
이 상태에서, 상기 전자 장치(101)를 구동하면, 상기 복수의 발광 소자(421)는 다양한 발광 모드에 의해 광(L1)을 출사할 수 있다. 상기 광(L1)은 상기 하우징(410)의 내측을 향하는 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 출사할 수 있고, 상기 제1 방향(A1)(예; X축 방향 또는 Y축 방향)으로 출사된 광(L1)은 상기 제1 반사 구조(430)에 전달될 수 있다. 상기 제1 반사 구조(430)는 상기 광(L1)을 상기 하우징(410)의 내측에서 외측을 향하는 제2 방향(A2)(예; X축 방향 또는 Y축 방향)으로 반사할 수 있다.In this state, when the electronic device 101 is driven, the plurality of light-emitting elements 421 may emit light L1 in various light-emitting modes. The light L1 may be emitted in a first direction A1 (eg, X-axis direction or Y-axis direction) toward the inside of the housing 410, and the first direction A1 (eg, X-axis direction) The light L1 emitted in the direction or Y-axis direction) may be transmitted to the first reflective structure 430. The first reflective structure 430 may reflect the light L1 in a second direction A2 (eg, an X-axis direction or a Y-axis direction) from the inside of the housing 410 to the outside.
따라서, 상기 제1 반사 구조(430)로부터 반사된 제1 반사광(C1)은 상기 제2 데코 부재(412)에 배치된 제2 반사 구조(440)에 전달되어 반사될 수 있다. 상기 제2 반사 구조(440)로부터 반사된 제2 반사광(C2)은 상기 제3 반사 구조(450)로 전달되어 반사될 수 있다.Accordingly, the first reflected light C1 reflected from the first reflective structure 430 may be transmitted to and reflected by the second reflective structure 440 disposed on the second decor member 412. The second reflected light C2 reflected from the second reflective structure 440 may be transmitted to and reflected from the third reflective structure 450.
다양한 실시예에 따르면, 상기 제3 반사 구조(450)로부터 반사된 제3 반사광(C3)은 확산 부재(460)에 전달되어 확산될 수 있다. 상기 확산 부재(460)로부터 확산된 확산광(B1)은 상기 하우징(410)의 제2 데코 부재(412)로 확산될 수 있다. 상기 확산광(B1)은 상기 제2 데코 부재(412)를 투과하여 상기 제2 데코 부재(412)의 외측으로 발산할 수 있다.According to various embodiments, the third reflected light C3 reflected from the third reflective structure 450 may be transmitted to and diffused by the diffusion member 460. The diffused light B1 diffused from the diffuser 460 may diffuse to the second decorating member 412 of the housing 410. The diffused light B1 may pass through the second decor member 412 and radiate to the outside of the second decor member 412.
이렇게 상기 제2 데코 부재(412)의 외측으로부터 발산된 상기 확산광(B1)은 색상과 점멸 빈도를 이용하여 다양한 발광 모드를 구현할 수 있다.In this way, the diffused light B1 emitted from the outside of the second decorating member 412 may implement various light emission modes using a color and a frequency of blinking.
예를 들어, 상기 전자 장치(101)를 스피커로 사용할 경우, 상기 확산광(B1)의 발광 색상과 점멸 패턴을 통해 스피커의 음향 출력을 표시할 수 있다.For example, when the electronic device 101 is used as a speaker, the sound output of the speaker may be displayed through the emission color and flashing pattern of the diffused light B1.
이와 같이, 회로 기판(420)과 하우징(410)의 제2 데코 부재(412)의 사이에 발광 소자(421)의 광(L1)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중첩, 반사 및/또는 확산할 수 있도록 제1 내지 3 반사 구조(430, 440, 450) 및 확산 부재(460)를 구성함으로써, 상기 발광 소자(421)의 광(L1)을 상기 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 출사시켜 기존에 발생되던 핫스판(hot spot)의 발생을 더욱 방지할 수 있고, 이로인해 상기 광(L1)의 확산을 더욱 균일하게 함은 물론 제품의 시인성도 더욱 향상시킬 수 있다. In this way, the light (L1) of the light emitting element 421 between the circuit board 420 and the second decor member 412 of the housing 410 is directed in the first and second directions (A1, A2) (eg, X) By configuring the first to third reflective structures 430, 440, 450 and the diffusion member 460 to overlap, reflect, and/or diffuse in the axial direction or the Y-axis direction), the light of the light emitting element 421 ( L1) is emitted in the first and second directions (A1, A2) (e.g., in the X-axis or Y-axis direction) to further prevent the occurrence of a hot spot that has already occurred. In addition to making the diffusion of the light (L1) more uniform, the visibility of the product can be further improved.
예컨대, 상기 제1 내지 3 반사 구조(430, 440, 450) 및 상기 확산 부재(460)는 하우징(410)과 제2 데코 부재(412)의 사이에 평면으로 배치됨으로써, 상기 광(L1)을 제1, 2 방향(A1, A2)(예; X축 방향 또는 Y축 방향)으로 중접, 반사 및/또는 확산시킬 수 있고, 더불어, 전자 장치(101)의 하우징(410)의 내부에서 기존의 광을 수직 방향(예: Z축방향)으로 중첩, 반사 및/또는 확산하기 위한 별도의 수직 공간이 필요 없으므로, 발광 장치(400)의 크기를 줄일 수 있다. 따라서, 상기 발광 장치(400)를 포함하는 전자 장치(101)는 더 소형화 또는 슬림화할 수 있다.For example, the first to third reflective structures 430, 440, 450 and the diffusion member 460 are disposed in a plane between the housing 410 and the second decor member 412, thereby preventing the light L1. It can overlap, reflect, and/or diffuse in the first and second directions (A1, A2) (eg, X-axis direction or Y-axis direction), and, in addition, existing inside the housing 410 of the electronic device 101 Since there is no need for a separate vertical space for overlapping, reflecting, and/or diffusing light in a vertical direction (eg, in the Z-axis direction), the size of the light emitting device 400 can be reduced. Accordingly, the electronic device 101 including the light emitting device 400 can be further downsized or slimmed.
본 개시의 다양한 실시예에 따르면, 발광 장치(예; 도 4의 발광 장치(200))를 포함하는 전자 장치(예; 도 1의 전자 장치(101))는, 하우징(예; 도 4의 하우징(210)); 상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향(예; 도 4의 제1 방향(A1))으로 광(예; 도 4의 광(L1))을 출사하는 복수의 발광 소자(예; 도 4의 발광 소자(221));를 포함한 회로 기판(예; 도 4의 회로 기판(220)); 상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달 받아 상기 하우징의 외측을 향하는 제2 방향(예; 도 4의 제2 방향(A2))으로 확산하는 제1 확산 부재(예; 도 4의 제1 확산 부재(230)); 상기 하우징에 배치되고, 상기 제1 확산 부재로부터 확산된 적어도 일부의 제1 확산광(예; 도 4의 확산광(B1))을 전달 받아 상기 제2 방향으로 반사하는 제1 반사 구조(예; 도 4의 제1 반사 구조(240)); 상기 회로 기판상에 상기 제1 반사 구조와 이격되게 배치되고, 상기 적어도 일부의 제1 확산광 및 상기 제1 반사 구조로부터 반사된 제1 반사광(예; 도 4의 제1 반사광(C1))을 전달 받아 상기 제2 방향으로 반사하는 제2 반사 구조(예; 도 4의 제2 반사 구조(250)); 및 상기 하우징과 상기 제2 반사 구조의 사이에 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광(예; 도 4의 제2 반사광(C2))을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재(예; 도 4의 제2 확산 부재(260));를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 1) including a light emitting device (eg, the light emitting device 200 of FIG. 4) includes a housing (eg, the housing of FIG. 4 ). (210)); A plurality of light-emitting elements (example: light (L1) in FIG. 4) that are disposed in the housing and emit light in a first direction (eg, the first direction (A1) in FIG. 4) toward the inside of the housing. A circuit board (eg, the circuit board 220 of FIG. 4) including; A first diffusion member (eg, FIG. 4) that is disposed in parallel with the plurality of light emitting devices and diffuses in a second direction (eg, the second direction (A2) in FIG. 4) toward the outside of the housing by receiving the light. The first diffusion member 230; A first reflective structure disposed in the housing and receiving at least a portion of the first diffused light (for example, diffused light B1 in FIG. 4) diffused from the first diffuser member and reflecting it in the second direction (for example; The first reflective structure 240 of FIG. 4; It is disposed on the circuit board to be spaced apart from the first reflective structure, the at least part of the first diffused light and the first reflected light reflected from the first reflective structure (eg, the first reflected light C1 of FIG. 4) A second reflective structure (eg, the second reflective structure 250 of FIG. 4) for receiving and reflecting in the second direction; And a second reflective light disposed between the housing and the second reflective structure, receiving second reflective light (eg, second reflective light C2 in FIG. 4) reflected from the second reflective structure and diffuses it to the outside of the housing. 2 diffusion member (eg, the second diffusion member 260 of FIG. 4); may be included.
본 개시의 다양한 실시예에 따르면, 상기 하우징은 적어도 하나의 데코 부재를 더 포함하고, 상기 적어도 하나의 데코 부재는 제1, 2 데코 부재(예; 도 4의 제1, 2 데코 부재(211, 212))를 포함하며, 상기 제1 데코 부재는 상기 제2 데코 부재의 중심부에 결합되고, 상기 제2 데코 부재의 제1 면(예; 도 4의 제1 면(212a))은 상기 제1 데코 부재와 결합되는 데코홈(예; 도 4의 데코홈(212c))을 형성하고, 상기 제1 면의 반대편 제2 면(예; 도 4의 제2 면(212b))은 상기 제1 반사 구조을 배치할 수 있다.According to various embodiments of the present disclosure, the housing further includes at least one decor member, and the at least one decor member includes first and second decor members (eg, the first and second decor members 211 in FIG. 4 ). 212)), wherein the first decor member is coupled to the center of the second decor member, and the first surface of the second decor member (eg, the first surface 212a of FIG. 4) is the first A deco groove (e.g., a deco groove 212c of Fig. 4) is formed to be coupled to the deco member, and a second surface opposite to the first surface (e.g., the second surface 212b of Fig. 4) is the first reflection Structure can be placed.
본 개시의 다양한 실시예에 따르면, 상기 제2 데코 부재는 상기 제2 확산 부재로부터 확산된 제2 확산광을 투과하는 투명 데코 부재 또는 반투명 데코 부재 중 적어도 하나를 포함할 수 있다.According to various embodiments of the present disclosure, the second decorating member may include at least one of a transparent decorating member or a translucent decorating member that transmits the second diffused light diffused from the second diffuser.
본 개시의 다양한 실시예에 따르면, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광 및 상기 제1, 2 반사광을 상기 제1, 2 방향으로 중첩하는 중첩 공간이 형성될 수 있다.According to various embodiments of the present disclosure, an overlapping space may be formed between the first and second reflective structures to overlap the first diffused light and the first and second reflected lights in the first and second directions.
본 개시의 다양한 실시예에 따르면, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광 및 상기 제1, 2 반사광을 상기 제1, 2 방향으로 반사하는 반사 공간이 형성될 수 있다.According to various embodiments of the present disclosure, a reflection space for reflecting the first diffused light and the first and second reflected lights in the first and second directions may be formed between the first and second reflective structures.
본 개시의 다양한 실시예에 따르면, 상기 제1 방향은 상기 하우징의 내측방향을 포함할 수 있고, 상기 제2 방향은 상기 하우징의 외측방향을 포함할 수 있다.According to various embodiments of the present disclosure, the first direction may include an inner direction of the housing, and the second direction may include an outer direction of the housing.
본 개시의 다양한 실시예에 따르면, 상기 제2 반사 구조에는 상기 복수의 발광 소자와 결합되는 복수의 결합홀(예; 도 5의 복수의 결합홀(251))이 형성될 수 있다. According to various embodiments of the present disclosure, a plurality of coupling holes (eg, a plurality of coupling holes 251 of FIG. 5) coupled to the plurality of light emitting devices may be formed in the second reflective structure.
본 개시의 다양한 실시예에 따르면, 상기 복수의 결합홀의 적어도 일부는 상기 발광 소자의 상기 광을 상기 하우징의 내측으로 가이드 하는 가이드부(예; 도 5의 가이드부(252))를 형성할 수 있다.According to various embodiments of the present disclosure, at least a portion of the plurality of coupling holes may form a guide portion (for example, the guide portion 252 of FIG. 5) for guiding the light of the light emitting device to the inside of the housing. .
본 개시의 다양한 실시예에 따르면, 상기 복수의 결합홀(예; 도 6의 복수의 결합홀(253))은 상기 복수의 발광 소자의 둘레를 감싸는 폐루프 형상(closed loop)으로 형성될 수 있다.According to various embodiments of the present disclosure, the plurality of coupling holes (eg, the plurality of coupling holes 253 of FIG. 6) may be formed in a closed loop shape surrounding the circumference of the plurality of light emitting devices. .
본 개시의 다양한 실시예에 따르면, 상기 전자 장치는 휴대용 통신 장치, 스마트폰, 컴퓨터 장치, 휴대용 멀티미디어 장치, 휴대용 의료 기기, 카메라, 웨어러블 장치, 가전 장치, 홈 디바이스, 스피커 장치, AI(artificial intelligence)스피커 또는 AI(artificial intelligence)로봇 중 적어도 하나를 포함할 수 있다.According to various embodiments of the present disclosure, the electronic device includes a portable communication device, a smart phone, a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance device, a home device, a speaker device, and an artificial intelligence (AI) device. It may include at least one of a speaker or an artificial intelligence (AI) robot.
본 개시의 다양한 실시예에 따르면, 발광 장치(예; 도 7의 발광 장치(300))를 포함하는 전자 장치(예; 도 1의 전자 장치(101))는, 하우징(예; 도 7의 하우징(310)); 상기 하우징내에 배치되고, 상기 하우징의 제1 방향(예; Z축방향))으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판(예; 도 7의 회로 기판(320)); 상기 하우징내에 배치되고, 상기 적어도 일부의 광을 상기 하우징의 내측을 향하는 제2 방향(예; 도 7의 제2 방향(A1)) 및 상기 하우징의 외측을 향하는 제3 방향(예; 도 7의 제3 방향(A2))으로 반사하는 제1 반사 구조(예; 도 7의 제1 반사 구조(340)); 상기 복수의 발광 소자와 나란하게 배치되며, 상기 제1 반사 구조로부터 반사된 적어도 일부의 제1 반사광을 전달 받아 상기 제3 방향으로 확산하는 제1 확산 부재(예; 도 7의 제1 확산 부재(330)); 상기 회로 기판상에 상기 제1 반사 구조와 이격되게 배치되고, 상기 제1 확산 부재로부터 확산된 제1 확산광 및 상기 적어도 일부의 제1 반사광을 전달 받아 상기 제3 방향으로 반사하는 제2 반사 구조(예; 도 7의 제2 반사 구조(350)); 및 상기 하우징과 상기 제2 반사 구조의 사이에 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재(예; 도 7의 제2 확산 부재(360));를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 1) including a light emitting device (eg, the light emitting device 300 of FIG. 7) includes a housing (eg, the housing of FIG. 7 ). (310)); A circuit board (eg, circuit board 320 of FIG. 7) disposed in the housing and including a plurality of light emitting devices that emit light in a first direction (eg, Z-axis direction) of the housing; It is disposed in the housing, and a second direction toward the inside of the housing (eg, the second direction (A1) in FIG. 7) and a third direction toward the outside of the housing (eg, in FIG. 7 ). A first reflective structure (eg, the first reflective structure 340 of FIG. 7) reflecting in a third direction (A2); A first diffusion member (e.g., the first diffusion member of FIG. 7) is disposed in parallel with the plurality of light emitting devices and receives at least a portion of the first reflected light reflected from the first reflective structure and diffuses it in the third direction. 330)); A second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the first diffused light diffused from the first diffuser member and the at least part of the first reflected light and reflecting it in the third direction (Example: the second reflective structure 350 of FIG. 7); And a second diffusion member disposed between the housing and the second reflective structure, receiving the second reflected light reflected from the second reflective structure, and diffusing it to the outside of the housing (eg, the second diffusion member of FIG. 7 ). (360)); may include.
본 개시의 다양한 실시예에 따르면, 상기 제1 방향은 Z축방향을 포함할 수 있고, 상기 제2 방향은 상기 하우징의 내측 방향을 포함할 수 있으며, 상기 제3 방향은 상기 하우징의 외측 방향을 포함할 수 있다.According to various embodiments of the present disclosure, the first direction may include a Z-axis direction, the second direction may include an inner direction of the housing, and the third direction is an outer direction of the housing. Can include.
본 개시의 다양한 실시예에 따르면, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광, 상기 제1, 2 반사광을 상기 제2, 3 방향으로 중첩하는 중첩 공간이 형성될 수 있다.According to various embodiments of the present disclosure, an overlapping space may be formed between the first and second reflective structures to overlap the first diffused light and the first and second reflected light in the second and third directions.
본 개시의 다양한 실시예에 따르면, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광, 상기 제1, 2 반사광으로 상기 제2, 3 방향을 반사하는 반사 공간이 형성될 수 있다.According to various embodiments of the present disclosure, a reflective space may be formed between the first and second reflective structures to reflect the second and third directions with the first diffused light and the first and second reflected light.
본 개시의 다양한 실시예에 따르면, 발광 장치(예; 도 8의 발광 장치(400))를 포함하는 전자 장치(예; 도 1의 전자 장치(101))는, 하우징(예; 도 8의 하우징(410)); 상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향(예; 도 8의 제1 방향(A1))으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판; 상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달 받아 상기 하우징의 내측에서 외측을 향하는 제2 방향(예; 도 8의 제2 방향(A2)) 으로 반사하는 제1 반사 구조(예; 도 8의 제1 반사 구조(430)); 상기 하우징내에 상기 제1 반사 구조와 이격되게 배치되고, 상기 제1 반사 구조로부터 반사된 상기 제1 반사광을 전달 받아 상기 제2 방향으로 반사하는 제2 반사 구조(예; 도 8의 제2 반사 구조(440)); 상기 회로 기판상에 상기 제2 반사 구조와 이격되게 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달 받아 상기 제2 방향으로 반사하는 제3 반사 구조(예; 도 8의 제3 반사 구조(450)); 및 상기 하우징과 상기 제3 반사 구조의 사이에 배치되고, 상기 제3 반사 구조로부터 반사된 제3 반사광을 전달받아 상기 하우징의 외측으로 확산하는 확산 부재(예; 도 8의 확산 부재(460));를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIG. 1) including a light emitting device (eg, the light emitting device 400 of FIG. 8) includes a housing (eg, the housing of FIG. 8 ). (410)); A circuit board disposed in the housing and including a plurality of light-emitting elements emitting light in a first direction (eg, a first direction A1 in FIG. 8) toward the inside of the housing; A first reflective structure (eg; a first reflective structure disposed in parallel with the plurality of light emitting devices) and reflecting the light in a second direction (eg, the second direction A2 in FIG. 8) from the inside of the housing to the outside. The first reflective structure 430 of FIG. 8); A second reflective structure disposed in the housing to be spaced apart from the first reflective structure, receiving the first reflected light reflected from the first reflective structure and reflecting it in the second direction (eg, the second reflective structure of FIG. 8) (440)); A third reflective structure that is disposed on the circuit board to be spaced apart from the second reflective structure, receives the second reflective light reflected from the second reflective structure and reflects it in the second direction (eg, the third reflective structure of FIG. 8 ). Structure 450); And a diffusing member disposed between the housing and the third reflective structure, receiving third reflected light reflected from the third reflective structure and diffusing it to the outside of the housing (eg, diffusing member 460 of FIG. 8). May include;
본 개시의 다양한 실시예에 따르면, 상기 제1 내지 3 반사 구조 사이에는 상기 제1 내지 3 반사광을 상기 제1, 2 방향으로 중첩하는 중첩 공간이 형성될 수 있다.According to various embodiments of the present disclosure, an overlapping space for overlapping the first to third reflected light in the first and second directions may be formed between the first to third reflective structures.
본 개시의 다양한 실시예에 따르면, 상기 제1 내지 3 반사 구조 사이에는 상기 제1 내지 3 반사광을 상기 제1, 2 방향으로 반사하는 반사 공간이 형성될 수 있다.According to various embodiments of the present disclosure, a reflection space for reflecting the first to third reflected light in the first and second directions may be formed between the first to third reflective structures.
본 개시의 다양한 실시예에 따르면, 발광 장치를 포함하는 전자 장치는, 하우징; 상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판; 상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달받아 상기 하우징의 외측을 향하는 제2 방향으로 확산하는 제1 확산 부재; 상기 하우징내에 배치되고, 상기 광을 상기 하우징의 외측을 향하는 상기 제2 방향으로 반사하는 제1 반사 구조; 및 상기 회로 기판상에 배치되고, 상기 광을 상기 제2 방향으로 반사하는 제2 반사 구조; 및 상기 제2 반사 구조의 상기 광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재;를 포함할 수 있다.According to various embodiments of the present disclosure, an electronic device including a light emitting device may include a housing; A circuit board disposed in the housing and including a plurality of light emitting devices for emitting light in a first direction toward the inside of the housing; A first diffusion member disposed in parallel with the plurality of light emitting devices, receiving the light and diffusing in a second direction toward the outside of the housing; A first reflective structure disposed in the housing and reflecting the light in the second direction toward the outside of the housing; And a second reflective structure disposed on the circuit board and reflecting the light in the second direction. And a second diffusion member receiving the light of the second reflective structure and diffusing it to the outside of the housing.
이상에서 설명한 본 개시의 다양한 실시예의 발광 장치를 포함하는 전자 장치는 전술한 실시 예 및 도면에 의해 한정되는 것은 아니고, 본 개시의 기술적 범위 내에서 여러 가지 치환, 변형 및 변경이 가능함은 본 개시가 속하는 기술분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The electronic device including the light emitting device of the various embodiments of the present disclosure described above is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. It will be apparent to those of ordinary skill in the art to which it belongs.

Claims (15)

  1. 발광 장치를 포함하는 전자 장치에 있어서,In an electronic device comprising a light emitting device,
    하우징;housing;
    상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판;A circuit board disposed in the housing and including a plurality of light emitting devices for emitting light in a first direction toward the inside of the housing;
    상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달 받아 상기 하우징의 외측을 향하는 제2 방향으로 확산하는 제1 확산 부재;A first diffusion member disposed in parallel with the plurality of light-emitting elements, receiving the light and diffusing in a second direction toward the outside of the housing;
    상기 하우징에 배치되고, 상기 제1 확산 부재로부터 확산된 적어도 일부의 제1 확산광을 전달 받아 상기 제2 방향으로 반사하는 제1 반사 구조;A first reflective structure disposed in the housing and receiving at least a portion of the first diffused light diffused from the first diffuser and reflecting it in the second direction;
    상기 회로 기판상에 상기 제1 반사 구조와 이격되게 배치되고, 상기 적어도 일부의 제1 확산광 및 상기 제1 반사 구조로부터 반사된 제1 반사광을 전달 받아 상기 제2 방향으로 반사하는 제2 반사 구조; 및 A second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the at least part of the first diffused light and the first reflected light reflected from the first reflecting structure and reflecting it in the second direction ; And
    상기 하우징과 상기 제2 반사 구조의 사이에 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재;를 포함한 전자 장치.And a second diffusion member disposed between the housing and the second reflective structure, receiving second reflected light reflected from the second reflective structure, and diffusing to the outside of the housing.
  2. 제1 항에 있어서, 상기 하우징은 적어도 하나의 데코 부재를 더 포함하고,The method of claim 1, wherein the housing further comprises at least one decor member,
    상기 적어도 하나의 데코 부재는 제1, 2 데코 부재를 포함하며,The at least one decor member includes first and second decor members,
    상기 제1 데코 부재는 상기 제2 데코 부재의 중심부에 결합되고,The first decor member is coupled to the center of the second decor member,
    상기 제2 데코 부재의 제1 면은 상기 제1 데코 부재와 결합되는 데코홈을 형성하고, 상기 제1 면의 반대편 제2 면은 상기 제1 반사 구조를 배치하며, A first surface of the second decor member forms a decor groove coupled with the first decor member, and a second surface opposite to the first surface arranges the first reflective structure,
    상기 제2 데코 부재는 상기 제2 확산 부재로부터 확산된 제2 확산광을 투과하는 투명 데코 부재 또는 반투명 데코 부재 중 적어도 하나를 포함하는 전자 장치.The second decorating member includes at least one of a transparent decorating member and a translucent decorating member that transmits second diffused light diffused from the second diffuser.
  3. 제1 항에 있어서, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광 및 상기 제1, 2 반사광을 상기 제1, 2 방향으로 중첩하는 중첩 공간이 형성된 전자 장치.The electronic device of claim 1, wherein an overlapping space is formed between the first and second reflective structures to overlap the first diffused light and the first and second reflected lights in the first and second directions.
  4. 제1 항에 있어서, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광 및 상기 제1, 2 반사광을 상기 제1, 2 방향으로 반사하는 반사 공간이 형성된 전자 장치.The electronic device of claim 1, wherein a reflection space for reflecting the first diffused light and the first and second reflected lights in the first and second directions is formed between the first and second reflective structures.
  5. 제1 항에 있어서, 상기 제1 방향은 상기 하우징의 내측방향을 포함하고, 상기 제2 방향은 상기 하우징의 외측방향을 포함하는 전자 장치.The electronic device of claim 1, wherein the first direction includes an inner direction of the housing, and the second direction includes an outer direction of the housing.
  6. 제1 항에 있어서, 상기 제2 반사 구조에는 상기 복수의 발광 소자와 결합되는 복수의 결합홀이 형성된 전자 장치.The electronic device of claim 1, wherein a plurality of coupling holes coupled to the plurality of light emitting devices are formed in the second reflective structure.
  7. 제 6 항에 있어서, 상기 복수의 결합홀의 적어도 일부는 상기 발광 소자의 상기 광을 상기 하우징의 내측으로 가이드 하는 가이드부를 형성하고, The method of claim 6, wherein at least a portion of the plurality of coupling holes forms a guide portion for guiding the light from the light emitting element to the inside of the housing,
    상기 복수의 결합홀은 상기 복수의 발광 소자의 둘레를 감싸는 폐루프 형상(closed loop)으로 형성된 전자 장치.The plurality of coupling holes are formed in a closed loop shape surrounding the plurality of light emitting devices.
  8. 제1 항에 있어서, 상기 전자 장치는 휴대용 통신 장치, 스마트폰, 컴퓨터 장치, 휴대용 멀티미디어 장치, 휴대용 의료 기기, 카메라, 웨어러블 장치, 가전 장치, 홈 디바이스, 스피커 장치, AI(artificial intelligence)스피커 또는 AI(artificial intelligence)로봇 중 적어도 하나를 포함하는 전자 장치.According to claim 1, The electronic device is a portable communication device, a smartphone, a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance, a home device, a speaker device, an artificial intelligence (AI) speaker or (artificial intelligence) An electronic device comprising at least one of a robot.
  9. 발광 장치를 포함하는 전자 장치에 있어서,In an electronic device comprising a light emitting device,
    하우징;housing;
    상기 하우징내에 배치되고, 상기 하우징의 제1 방향으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판;A circuit board disposed in the housing and including a plurality of light emitting elements for emitting light in a first direction of the housing;
    상기 하우징내에 배치되고, 상기 적어도 일부의 상기 광을 상기 하우징의 내측을 향하는 제2 방향 및 상기 하우징의 외측을 향하는 제3 방향으로 반사하는 제1 반사 구조;A first reflective structure disposed in the housing and reflecting the at least a portion of the light in a second direction toward the inside of the housing and a third direction toward the outside of the housing;
    상기 발광 소자와 나란하게 배치되며, 상기 제1 반사 구조로부터 반사된 적어도 일부의 제1 반사광을 전달 받아 상기 제3 방향으로 확산하는 제1 확산 부재;A first diffusion member disposed in parallel with the light emitting device and receiving at least a portion of the first reflected light reflected from the first reflective structure and diffusing in the third direction;
    상기 회로 기판상에 상기 제1 반사 구조와 이격되게 배치되고, 상기 제1 확산 부재로부터 확산된 제1 확산광 및 상기 적어도 일부의 제1 반사광을 전달 받아 상기 제3 방향으로 반사하는 제2 반사 구조; 및 A second reflective structure disposed on the circuit board to be spaced apart from the first reflective structure, receiving the first diffused light diffused from the first diffuser member and the at least part of the first reflected light and reflecting it in the third direction ; And
    상기 하우징과 상기 제2 반사 구조의 사이에 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달받아 상기 하우징의 외측으로 확산하는 제2 확산 부재;를 포함하는 전자 장치.And a second diffusion member disposed between the housing and the second reflective structure, receiving second reflected light reflected from the second reflective structure, and diffusing it to an outside of the housing.
  10. 제9 항에 있어서, 상기 제1 방향은 Z축방향을 포함하고, 상기 제2 방향은 상기 하우징의 내측방향을 포함하며, 상기 제3 방향은 상기 하우징의 외측방향을 포함하는 전자 장치.The electronic device of claim 9, wherein the first direction includes a Z-axis direction, the second direction includes an inner direction of the housing, and the third direction includes an outer direction of the housing.
  11. 제9 항에 있어서, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광, 상기 제1, 2 반사광을 상기 제2, 3 방향으로 중첩하는 중첩 공간이 형성된 전자 장치.The electronic device of claim 9, wherein an overlapping space is formed between the first and second reflective structures to overlap the first diffused light and the first and second reflected light in the second and third directions.
  12. 제9 항에 있어서, 상기 제1, 2 반사 구조의 사이에는 상기 제1 확산광, 상기 제1, 2 반사광으로 상기 제2, 3 방향을 반사하는 반사 공간이 형성된 전자 장치.The electronic device of claim 9, wherein a reflection space is formed between the first and second reflection structures to reflect the second and third directions by the first diffused light and the first and second reflected light.
  13. 발광 장치를 포함하는 전자 장치에 있어서,In an electronic device comprising a light emitting device,
    하우징;housing;
    상기 하우징내에 배치되고, 상기 하우징의 내측을 향하는 제1 방향으로 광을 출사하는 복수의 발광 소자를 포함한 회로 기판;A circuit board disposed in the housing and including a plurality of light emitting devices for emitting light in a first direction toward the inside of the housing;
    상기 복수의 발광 소자와 나란하게 배치되며, 상기 광을 전달 받아 상기 하우징의 내측에서 외측을 향하는 제2 방향으로 반사하는 제1 반사 구조;A first reflective structure disposed in parallel with the plurality of light emitting devices, receiving the light and reflecting it in a second direction from the inside of the housing toward the outside;
    상기 하우징내에 상기 제1 반사 구조와 이격되게 배치되고, 상기 제1 반사 구조로부터 반사된 상기 제1 반사광을 전달 받아 상기 제2 방향으로 반사하는 제2 반사 구조;A second reflective structure disposed in the housing to be spaced apart from the first reflective structure, receiving the first reflected light reflected from the first reflective structure and reflecting it in the second direction;
    상기 회로 기판상에 상기 제2 반사 구조와 이격되게 배치되고, 상기 제2 반사 구조로부터 반사된 제2 반사광을 전달 받아 상기 제2 방향으로 반사하는 제3 반사 구조; 및 A third reflective structure disposed on the circuit board to be spaced apart from the second reflective structure, receiving second reflected light reflected from the second reflective structure and reflecting it in the second direction; And
    상기 하우징과 상기 제3 반사 구조의 사이에 배치되고, 상기 제3 반사 구조로부터 반사된 제3 반사광을 전달받아 상기 하우징의 외측으로 확산하는 확산 부재;를 포함하는 전자 장치.And a diffusion member disposed between the housing and the third reflective structure, receiving third reflected light reflected from the third reflective structure, and diffusing the third reflected light to the outside of the housing.
  14. 제13 항에 있어서, 상기 제1 내지 3 반사 구조 사이에는 상기 제1 내지 3 반사광을 상기 제1, 2 방향으로 중첩하는 중첩 공간이 형성된 전자 장치.The electronic device of claim 13, wherein an overlapping space is formed between the first to third reflective structures to overlap the first to third reflected lights in the first and second directions.
  15. 제13 항에 있어서, 상기 제1 내지 3 반사 구조 사이에는 상기 제1 내지 3 반사광을 상기 제1, 2 방향으로 반사하는 반사 공간이 형성된 전자 장치.14. The electronic device of claim 13, wherein a reflection space for reflecting the first to third reflected light in the first and second directions is formed between the first to third reflective structures.
PCT/KR2020/006222 2019-05-17 2020-05-12 Electronic device including light emitting device WO2020235848A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101039035B1 (en) * 2010-01-06 2011-06-03 (주) 코콤 Led lighting device
KR20130032110A (en) * 2011-09-22 2013-04-01 삼성전자주식회사 Lighting device
US9453361B2 (en) * 2010-02-01 2016-09-27 Saint-Gobain Glass France Luminous multiple glazing unit comprising light-emitting diodes
KR20170037740A (en) * 2015-09-25 2017-04-05 서울바이오시스 주식회사 An UV LED Applied Insect Trap
KR101861664B1 (en) * 2011-07-01 2018-05-28 엘지전자 주식회사 Display device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101039035B1 (en) * 2010-01-06 2011-06-03 (주) 코콤 Led lighting device
US9453361B2 (en) * 2010-02-01 2016-09-27 Saint-Gobain Glass France Luminous multiple glazing unit comprising light-emitting diodes
KR101861664B1 (en) * 2011-07-01 2018-05-28 엘지전자 주식회사 Display device
KR20130032110A (en) * 2011-09-22 2013-04-01 삼성전자주식회사 Lighting device
KR20170037740A (en) * 2015-09-25 2017-04-05 서울바이오시스 주식회사 An UV LED Applied Insect Trap

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