WO2020224389A1 - Array substrate, display panel and display device - Google Patents

Array substrate, display panel and display device Download PDF

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Publication number
WO2020224389A1
WO2020224389A1 PCT/CN2020/084544 CN2020084544W WO2020224389A1 WO 2020224389 A1 WO2020224389 A1 WO 2020224389A1 CN 2020084544 W CN2020084544 W CN 2020084544W WO 2020224389 A1 WO2020224389 A1 WO 2020224389A1
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WIPO (PCT)
Prior art keywords
signal line
electrically connected
base substrate
line
array substrate
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PCT/CN2020/084544
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French (fr)
Chinese (zh)
Inventor
郝学光
吴新银
乔勇
Original Assignee
京东方科技集团股份有限公司
北京京东方技术开发有限公司
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Publication of WO2020224389A1 publication Critical patent/WO2020224389A1/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • G09G3/3233Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix with pixel circuitry controlling the current through the light-emitting element
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G09G3/3208Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED]
    • G09G3/3225Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED] organic, e.g. using organic light-emitting diodes [OLED] using an active matrix
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body

Definitions

  • the present disclosure relates to the field of flexible display technology, and in particular to an array substrate, a display panel and a display device.
  • OLED Organic Light Emitting Diode
  • QLED Quantum Dot Light Emitting Diodes
  • other electroluminescent diodes have the advantages of self-luminescence, low energy consumption, etc., which are the most important in the application research field of electroluminescent display panels.
  • One of the hot spots has received widespread attention.
  • a plurality of sub-pixels are arranged in an array on the base substrate, and at least one of the plurality of sub-pixels includes: a pixel circuit;
  • a plurality of scan lines, the pixel circuits in a row of the sub-pixels are electrically connected to at least one of the scan lines, and the scan lines extend along the row direction of the sub-pixels and are arranged along the column direction of the sub-pixels;
  • a plurality of transmission signal lines are electrically connected to the pixel circuit, and the plurality of transmission signal lines extend in the column direction and are arranged in the row direction;
  • At least one of the plurality of transmission signal lines has a multilayer wiring structure electrically connected to each other.
  • the array substrate further includes:
  • a plurality of power signal lines are located in a gap between two adjacent sub-pixel columns, and the power signal lines are electrically connected to the pixel circuit;
  • the detection signal line is located in the gap between two adjacent sub-pixel columns, and the detection signal line is insulated from the power signal line, and the detection signal line is electrically connected to the pixel circuit connection;
  • the transmission signal line includes: at least one of the plurality of detection signal lines and the plurality of power signal lines.
  • the array substrate further includes a plurality of first connection wires and a plurality of second connection wires; the first connection wires and the second connection wires are insulated; wherein, the first connection wires The extension direction of the power signal line crosses the extension direction of the power signal line, and the extension direction of the second connection line crosses the extension direction of the detection signal line;
  • Some of the pixel circuits are electrically connected to one of the power signal lines through a first connection line, and some of the pixel circuits are electrically connected to one of the detection signal lines through a second connection line;
  • At least one of the plurality of first connecting lines and the plurality of second connecting lines has a multilayer wiring structure electrically connected to each other.
  • the array substrate further includes:
  • the light-shielding metal layer is located on the base substrate;
  • the first insulating layer is located on the side of the light-shielding metal layer away from the base substrate;
  • a second insulating layer located on the side of the semiconductor layer away from the base substrate;
  • a third insulating layer located on the side of the gate conductive layer away from the base substrate;
  • the source-drain conductive layer is located on the side of the third insulating layer away from the base substrate, and the source-drain conductive layer includes the plurality of power signal lines and the plurality of detection signal lines;
  • the multilayer wiring structure includes at least any two layers of the light-shielding conductive layer, the gate conductive layer, and the source-drain conductive layer; and the same multilayer wiring structure passes through the multilayer wiring structure.
  • the multiple via holes of the insulating layer between the wire structures are electrically connected.
  • the gate conductive layer further includes a plurality of first auxiliary portions, and the first auxiliary portions are insulated from the scan line; wherein, one of the power signal lines passes through a plurality of first vias Electrically connected to at least one of the first auxiliary parts, and the first via hole penetrates the third insulating layer;
  • the power signal line and the first auxiliary part that are electrically connected to each other form a multilayer wiring structure of the power signal line.
  • the orthographic projection of the power signal line on the base substrate covers the orthographic projection of the first auxiliary part of the electrical connection on the base substrate.
  • the power signal line has a gap at the edge of the orthographic projection of the base substrate and the electrically connected first auxiliary part at the edge of the orthographic projection of the base substrate, and the power signal line
  • the cross section perpendicular to the extension direction of the power signal line is in the shape of a "several".
  • the gate conductive layer further includes a plurality of second auxiliary portions, and the second auxiliary portions are insulated from the scan line; wherein, one detection signal line passes through a plurality of second via holes Electrically connected to at least one of the second auxiliary portions, and the second via hole penetrates the third insulating layer;
  • the detection signal line and the second auxiliary part electrically connected to each other form a multilayer wiring structure of the detection signal line.
  • the orthographic projection of the detection signal line on the base substrate covers the orthographic projection of the second auxiliary part of the electrical connection on the base substrate.
  • the detection signal line has a gap at the edge of the orthographic projection of the base substrate and the second auxiliary part electrically connected to the edge of the orthographic projection of the base substrate, and the detection signal line
  • the cross section perpendicular to the extending direction of the detection signal line is in the shape of a "several".
  • the gate conductive layer further includes a plurality of third auxiliary parts, and the third auxiliary parts are insulated from the scan line; wherein, one of the first connecting lines passes through a plurality of third passing parts.
  • the hole is electrically connected to at least one of the third auxiliary parts, and the third via hole penetrates the third insulating layer;
  • the first connection line and the third auxiliary part electrically connected to each other form a multilayer wiring structure of the first connection line.
  • the orthographic projection of the first connecting line on the base substrate covers the orthographic projection of the third auxiliary part of the electrical connection on the base substrate.
  • the gate conductive layer further includes a plurality of fourth auxiliary parts, and the fourth auxiliary parts are insulated from the scan line; wherein, one of the second connecting lines passes through a plurality of fourth passing parts.
  • the hole is electrically connected to at least one of the fourth auxiliary parts, and the fourth via hole penetrates the third insulating layer;
  • the second connecting line and the fourth auxiliary part electrically connected to each other form a multilayer wiring structure of the second connecting line.
  • the orthographic projection of the second connecting line on the base substrate covers the orthographic projection of the fourth auxiliary part of the electrical connection on the base substrate.
  • the gap between two adjacent sub-pixel columns where the power signal line and the detection signal line are located is different.
  • the display panel provided by the embodiment of the present disclosure includes the above-mentioned array substrate.
  • the display device provided by the embodiment of the present disclosure includes the above-mentioned display panel.
  • FIG. 1 is a schematic structural diagram of some array substrates provided by embodiments of the disclosure.
  • FIG. 2 is a schematic structural diagram of a pixel circuit provided by an embodiment of the disclosure.
  • FIG. 3 is a schematic diagram of specific structures of some array substrates provided by embodiments of the disclosure.
  • FIG. 4 is a schematic diagram of a cross-sectional structure of the array substrate shown in FIG. 3 along the AA' direction;
  • FIG. 5 is a schematic cross-sectional structure diagram of the array substrate shown in FIG. 3 along the BB' direction;
  • 6a is a schematic diagram of specific structures of still other array substrates provided by the embodiments of the disclosure.
  • FIG. 6b is a schematic cross-sectional structure view of the array substrate shown in FIG. 6a along the AA' direction;
  • FIG. 7a is a schematic diagram of specific structures of still other array substrates provided by the embodiments of the disclosure.
  • FIG. 7b is a schematic cross-sectional structure diagram of the array substrate shown in FIG. 7a along the AA' direction;
  • FIG. 8 is a schematic diagram of specific structures of still other array substrates provided by the embodiments of the disclosure.
  • the wiring area in the display panel becomes smaller and smaller.
  • signal lines are provided in the display panel to transmit signals.
  • signal lines are gradually becoming thinner and more refined, this will cause the resistance of the signal lines to become larger and larger, especially for some important signal lines (such as power signal lines, detection signal lines).
  • the power consumption of the display panel has increased significantly.
  • it can be solved in the following two ways: (1) Widen the width of the signal line.
  • the contribution of this method to reducing the power consumption of the display panel is limited.
  • Thicken the signal line is limited by the exposure ability. When the thickness of the signal line reaches more than 8000 angstroms, it is easy to cause residual photoresist and cause poor display.
  • the embodiments of the present disclosure provide some array substrates.
  • the resistance of the signal line is reduced, so that the power consumption of the display panel where the array substrate is located can be reduced, which satisfies the customer's requirements for low power consumption.
  • the array substrate provided by the embodiments of the present disclosure can also reduce the wiring space of the signal lines, and can avoid the problem of photoresist residue caused by increasing the thickness of the signal lines and causing poor display.
  • the array substrate may include: a base substrate 10 and a plurality of pixel units PX.
  • the pixel unit PX may include multiple sub-pixels spx. These sub-pixel spx arrays are arranged on the base substrate 10.
  • At least one sub-pixel spx in the plurality of sub-pixels may include: a pixel circuit and an electroluminescent diode L.
  • the pixel circuit has a transistor and a capacitor, and generates an electrical signal through the interaction of the transistor and the capacitor, and the generated electrical signal is input to the anode of the electroluminescent diode.
  • a corresponding voltage is applied to the cathode of the electroluminescent diode to drive the electroluminescent diode to emit light.
  • the pixel circuit may include a driving transistor T1, a switching transistor T2, a sensing transistor T3, and a storage capacitor Cst.
  • the gate of the switching transistor T2 is electrically connected to the scan line GA
  • the first electrode (for example, the source) of the switching transistor T2 is electrically connected to the data line DA
  • the second electrode (for example, the drain) of the switching transistor T2 is electrically connected to the driving transistor T1.
  • the grid is electrically connected.
  • the first electrode (for example, the source) of the driving transistor T1 is electrically connected to the power signal line Vdd
  • the second electrode (for example, the drain) of the driving transistor T1 is electrically connected to the anode of the electroluminescent diode L, and the cathode of the electroluminescent diode L It is electrically connected to the low-voltage signal line VSS.
  • the gate of the sensing transistor T3 is electrically connected to the scan line GA
  • the first electrode (such as the source) of the sensing transistor T3 is electrically connected to the second electrode (such as the drain) of the driving transistor T1
  • the second electrode of the sensing transistor T3 is electrically connected.
  • the pole (for example, the drain) is electrically connected to the detection signal line SL.
  • the first electrode of the storage capacitor Cst is electrically connected to the gate of the driving transistor T1
  • the second electrode of the storage capacitor Cst is electrically connected to the second electrode (for example, the drain) of the driving transistor T1.
  • the switching transistor T2 is controlled to be turned on by the signal transmitted on the scan line GA to write the data voltage transmitted on the data line DA into the gate of the driving transistor T1, and the driving transistor T1 is controlled to generate a working current to drive the electroluminescent diode L to emit light.
  • the sensing transistor T3 is controlled to turn on by the signal transmitted on the scan line GA, so as to output the operating current generated by the driving transistor T1 to the detection signal line SL to charge the detection signal line SL. After that, the voltage on each detection signal line SL is detected, and compensation calculation is performed according to the detected voltage to obtain the data voltage corresponding to each sub-pixel in the row for display.
  • the power signal line Vdd may transmit a constant first voltage, which is a positive voltage; and the low voltage signal line VSS may transmit a constant second voltage, which is a negative voltage.
  • the low voltage signal line VSS may also be grounded.
  • the pixel circuit may be a structure including other numbers of transistors and capacitors in addition to the structure shown in FIG. 2, which is not limited in the embodiment of the present disclosure.
  • the display panel may further include: a plurality of scan lines GA, a plurality of detection signal lines SL, a plurality of data lines DA, and a power signal line Vdd.
  • the scan line GA, the detection signal line SL, the data line DA, and the power signal line Vdd are insulated from each other.
  • the pixel circuit in a column of sub-pixels is electrically connected to a data line DA.
  • the pixel circuits in a row of sub-pixels are electrically connected to at least one scan line.
  • the pixel circuits in a row of sub-pixels are electrically connected to one scan line.
  • the scan lines extend along the row direction F2 of the sub-pixels and are arranged along the column direction F1 of the sub-pixels.
  • the data lines DA extend along the column direction F1 and are arranged along the row direction F2
  • the power signal lines Vdd extend along the column direction F1 and are arranged along the row direction F2
  • the detection signal lines SL extend along the column direction F1 and are arranged along the row direction F2.
  • the power signal line Vdd is located in the gap between two adjacent sub-pixel columns, and the power signal line Vdd is electrically connected to the driving transistor T1 in the pixel circuit.
  • the detection signal line SL is located in the gap between two adjacent sub-pixel columns, and the detection signal line SL is electrically connected to the sensing transistor T3 in the pixel circuit.
  • the gap between two adjacent sub-pixel columns where the power signal line Vdd and the detection signal line SL are located is different.
  • the array substrate has a plurality of transmission signal lines electrically connected to the pixel circuit.
  • at least one of the multiple transmission signal lines has a multilayer wiring structure electrically connected to each other.
  • each transmission signal line may have a multilayer wiring structure electrically connected to each other. This can reduce the resistance of the transmission signal line, reduce the signal delay, and improve the display effect.
  • the transmission signal line may include at least one of a plurality of detection signal lines SL and a plurality of power signal lines Vdd.
  • the transmission signal line may include a plurality of detection signal lines SL.
  • the detection signal line SL can be composed of signal lines located on at least two different conductive layers, stacked and connected to each other, which is equivalent to that the detection signal line SL is composed of at least two signal lines in parallel. Since the equivalent resistance of the two signal lines of the detection signal line SL in parallel is smaller than the resistance of any one of the signal lines, the resistance of the detection signal line SL can be effectively reduced, thereby reducing the power consumption of the display panel where the array substrate is located.
  • the transmission signal line may also include multiple power signal lines Vdd.
  • the power signal line Vdd can be composed of at least two different conductive layers, stacked and connected with each other, which is equivalent to that the power signal line Vdd is composed of at least two signal lines in parallel. Since the equivalent resistance of the two signal lines of the power signal line Vdd in parallel is smaller than the resistance of any one of the signal lines, the resistance of the power signal line Vdd can be effectively reduced, thereby reducing the power consumption of the display panel where the array substrate is located. It satisfies the requirements of customers for low power consumption.
  • adopting the design disclosed in the embodiment of the present disclosure not only reduces the wiring space of the power signal line Vdd, but also avoids the problem of photoresist residue caused by increasing the thickness of the power signal line Vdd and causing poor display.
  • one electroluminescent diode and one pixel circuit may be provided in each sub-pixel.
  • the pixel unit may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, so that red, green and blue can be mixed to achieve color display.
  • the pixel unit may also include red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels. In this way, red, green, blue and white can be mixed to achieve color display.
  • the light-emitting colors of the sub-pixels in the pixel unit can be designed and determined according to the actual application environment, which is not limited here.
  • the pixel unit includes red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels as an example.
  • the red sub-pixel may include a pixel circuit R
  • the green sub-pixel may include a pixel circuit G
  • the blue sub-pixel may include a pixel circuit B
  • the white sub-pixel may include a pixel circuit W.
  • a plurality of pixel circuits R, G, B, W
  • R, G, B, W may be arranged on the base substrate 10 in an array. It should be noted that the reference signs R, G, B, and W in FIG.
  • Vdd indicates the power signal line Vdd electrically connected to the pixel circuit (R, G, B, W)
  • SL represents the detection signal line SL electrically connected to the pixel circuit (R, G, B, W) (in Figure 3, a detection signal line SL is taken as an example for description) .
  • the array substrate may further include: a light-shielding metal layer on the base substrate 10; and a side of the light-shielding metal layer away from the base substrate 10.
  • the first insulating layer 210; the semiconductor layer 60 on the side of the first insulating layer 210 away from the base substrate 10; the second insulating layer 220 on the side of the semiconductor layer 60 away from the base substrate 10; the second insulating layer 220 away from the liner The gate conductive layer 30 on the side of the base substrate 10; the third insulating layer 230 on the side of the gate conductive layer 30 away from the base substrate 10; the source-drain conductive layer 40 on the side of the third insulating layer 230 away from the base substrate 10.
  • the light-shielding metal layer includes a plurality of first connecting wires 110 and a plurality of second connecting wires 120 arranged in an insulated manner.
  • the semiconductor layer 60 includes an active layer having a channel region and a conductive region of the aforementioned transistor.
  • the gate conductive layer 30 includes a plurality of scan lines and the gates of the aforementioned transistors.
  • the source-drain conductive layer 40 includes a plurality of power signal lines Vdd and a plurality of detection signal lines SL, and the source and drain of the above-mentioned transistors.
  • the multilayer wiring structure may include at least any two layers of the light-shielding metal layer, the gate conductive layer 30, and the source-drain conductive layer 40; and the same multilayer wiring structure may pass through the multilayer wiring The multiple vias of the insulating layer between the structures are electrically connected.
  • the gate conductive layer 30 may further include a plurality of first auxiliary parts 310, and the first auxiliary parts 310 are insulated from the scan lines; among them, one power signal line Vdd
  • the plurality of first vias 01 are electrically connected to at least one first auxiliary portion 310, and the first via 01 penetrates the third insulating layer 230.
  • the power signal line Vdd and the first auxiliary part 310 electrically connected to each other form a multilayer wiring structure of the power signal line Vdd.
  • each power signal line Vdd and the first auxiliary part 310 that are electrically connected to each other form a double-layer wiring structure. This is equivalent to making each power signal line Vdd be composed of two different conductive layers, stacked and connected to each other.
  • the first auxiliary part 310 has a gap between the orthographic projection of the base substrate 10 and the orthographic projection of the scan line on the base substrate 10. This can prevent the first auxiliary part 310 from occupying an additional area.
  • each power signal line Vdd may be electrically connected to a plurality of first auxiliary parts 310 through a plurality of first vias 01. This can further reduce the resistance of the power signal line Vdd.
  • the orthographic projection of the power signal line Vdd on the base substrate 10 may cover the orthographic projection of the electrically connected first auxiliary part 310 on the base substrate 10. Further, the power signal line Vdd may have a gap at the edge of the orthographic projection of the base substrate 10 and the electrically connected first auxiliary portion 310 at the edge of the orthographic projection of the base substrate 10, and the power signal line Vdd may be perpendicular to the power source.
  • the cross section in the extending direction of the signal line Vdd is in the shape of "several".
  • the slope angle of the source-drain conductive layer 40 can be reduced, and the subsequent formation
  • the passivation layer 90 is not easy to break at the slope angle, causing other film layers in the subsequent process to break, affecting signal transmission and other problems.
  • the gate conductive layer 30 may further include a plurality of second auxiliary parts 320, and the second auxiliary parts 320 are insulated from the scan lines; among them, one detection signal line SL
  • the plurality of second via holes 02 is electrically connected to at least one second auxiliary portion 320, and the second via holes 02 penetrate the third insulating layer 230.
  • the detection signal line SL and the second auxiliary portion 320 electrically connected to each other form a multilayer wiring structure of the detection signal line SL. It can also be said that the detection signal line SL and the second auxiliary portion 320 electrically connected to each other form a double-layer wiring structure. This is equivalent to making each detection signal line SL consist of signal lines located on two different conductive layers, stacked and connected to each other.
  • the second auxiliary part 320 has a gap between the orthographic projection of the base substrate 10 and the orthographic projection of the scan line on the base substrate 10. This can prevent the second auxiliary part 320 from occupying an additional area.
  • each detection signal line SL may be electrically connected to a plurality of second auxiliary parts 320 through a plurality of second via holes 02. This can further reduce the resistance of the detection signal line SL.
  • the orthographic projection of the detection signal line SL on the base substrate 10 may cover the orthographic projection of the electrically connected second auxiliary part 320 on the base substrate 10. Further, the detection signal line SL may have a gap between the edge of the orthographic projection of the base substrate 10 and the electrically connected second auxiliary part 320 on the edge of the orthographic projection of the base substrate 10, and the detection signal line SL may be perpendicular to the detection
  • the cross section in the extending direction of the signal line SL has a "several" shape.
  • the slope angle of the source-drain conductive layer 40 can be reduced, and the subsequent formation
  • the passivation layer 90 is not easy to break at the slope angle, causing other film layers in the subsequent process to break, affecting signal transmission and other problems.
  • the extension direction of the first connection line 110 crosses the extension direction of the power signal line Vdd, and part of the pixel circuit passes through a first connection line. 110 is electrically connected to a power signal line Vdd.
  • a power signal line Vdd Exemplarily, in FIG. 3, two power signal lines Vdd are respectively located on both sides of the pixel circuit R and the pixel circuit B.
  • the pixel circuit R and the pixel circuit B can be electrically connected to the corresponding power signal line Vdd, and the pixel circuit G and the pixel circuit W cannot be directly electrically connected to the corresponding power signal line Vdd, which requires a first connection line 110 electrically connected to the corresponding power signal line Vdd, so that the pixel circuit G and the pixel circuit W pass through the first connection line 110 is electrically connected to the corresponding power signal line Vdd.
  • the first connection line 110 may be configured as a single-layer wiring structure.
  • the first connection line 110 may also have a multilayer wiring structure electrically connected to each other to reduce the resistance of the first connection line 110.
  • the gate conductive layer 30 may further include a plurality of third auxiliary portions 330, and the third auxiliary portions 330 are insulated from the scan line; wherein, one first connection line 110 passes through The plurality of third via holes 03 are electrically connected to at least one third auxiliary portion 330, and the third via holes 03 penetrate the third insulating layer 230.
  • first connecting line 110 and the third auxiliary part 330 electrically connected to each other form a multilayer wiring structure of the first connecting line 110. It can also be said that the first connecting line 110 and the third auxiliary part 330 electrically connected to each other form a double-layer wiring structure. This is equivalent to making each first connection line 110 consist of two different conductive layers, stacked and mutually connected signal lines. That is to say, the first connection line 110 is composed of two signal lines and signal lines in parallel.
  • the equivalent resistance of the two signal lines and signal lines of the first connection line 110 in parallel is less than the resistance of any one of the signal lines, so it can be effective Reducing the resistance of the first connecting line 110 can further reduce the power consumption of the display panel where the array substrate is located, and better meet the requirements of customers for low power consumption.
  • the orthographic projection of the first connection line 110 on the base substrate 10 can cover the third auxiliary part 330 of the electrical connection on the liner.
  • the extension direction of the second connection line 120 crosses the extension direction of the detection signal line SL, and part of the pixel circuit passes through a second connection line. 120 is electrically connected to a detection signal line SL.
  • the extension direction of the second connection line 120 crosses the extension direction of the detection signal line SL, and part of the pixel circuit passes through a second connection line. 120 is electrically connected to a detection signal line SL.
  • a detection signal line SL is located between the pixel circuit G and the pixel circuit W, the pixel circuit G and the pixel circuit W may be electrically connected to the detection signal line SL, and the pixel circuit R and the pixel circuit B It cannot be directly electrically connected to the detection signal line SL, which requires a second connection line 120 electrically connected to the detection signal line SL, so that the pixel circuit R and the pixel circuit B are electrically connected to the detection signal line SL through the second connection line 120.
  • the second connection line 120 may be configured as a single-layer wiring structure.
  • the second connecting line 120 may also have a multilayer wiring structure electrically connected to each other to reduce the resistance of the second connecting line 120.
  • the gate conductive layer 30 further includes a plurality of fourth auxiliary portions 340, and the fourth auxiliary portion 340 is insulated from the scan line; wherein, one second connecting line 120 passes through the multiple The fourth via 04 is electrically connected to at least one fourth auxiliary portion 340, and the fourth via 04 penetrates the third insulating layer 230.
  • the second connecting line 120 and the fourth auxiliary part 340 electrically connected to each other form a multilayer wiring structure of the second connecting line 120. It can also be said that the second connection line 120 and the fourth auxiliary part 340 that are electrically connected to each other form a double-layer wiring structure. This is equivalent to making each second connection line 120 be composed of two different conductive layers, stacked and mutually connected signal lines. That is to say, the second connecting line 120 is composed of two signal lines and signal lines in parallel.
  • the equivalent resistance of the two signal lines and signal lines of the second connecting line 120 in parallel is less than the resistance of any signal line, so it can be effective Reducing the resistance of the second connecting wire 120 can further reduce the power consumption of the display panel where the array substrate is located, and better meet the customer's requirements for low power consumption.
  • the orthographic projection of the second connection line 120 on the base substrate 10 can cover the fourth auxiliary part 340 of the electrical connection on the backing The orthographic projection of the base substrate 10. This can prevent the fourth auxiliary part 340 from occupying an extra area.
  • each power signal line Vdd, each detection signal line SL, each first connection line 110, and each second connection line 120 may have a multilayer wiring structure.
  • each power signal line Vdd, each detection signal line SL, each first connection line 110, and each second connection line 120 may have the above-mentioned double-layer wiring structure. Since the power signal line Vdd, the first connection line 110, the detection signal line SL, and the second connection line 120 are relatively important signal lines in the array substrate, if the resistance of the four signal lines is large, the power consumption of the display panel will increase. Therefore, the embodiments of the present disclosure reduce the resistance of the four signal lines, so as to minimize the power consumption of the display panel as much as possible.
  • the first auxiliary layer may also be located on the light-shielding metal layer, which is not limited herein.
  • the second auxiliary layer may also be located on the light-shielding metal layer, which is not limited herein.
  • the third auxiliary layer may also be located in the source-drain conductive layer 40, which is not limited herein.
  • the fourth auxiliary layer may also be located in the source-drain conductive layer 40, which is not limited herein.
  • the materials of the light-shielding metal layer, the gate conductive layer 30 and the source-drain conductive layer 40 may be metal materials.
  • metal materials For example, gold, silver, copper, aluminum, molybdenum, etc. In actual applications, it can be designed and determined according to actual application requirements, which is not limited here.
  • the first connection line 110 may be electrically connected to the power signal line Vdd through a plurality of fifth via holes 05.
  • the second connection line 120 may be electrically connected to the detection signal line SL through a plurality of sixth via holes 06.
  • the fifth via 05 and the sixth via 06 penetrate the first insulating layer 210, the second insulating layer 220, and the third insulating layer 230, respectively.
  • the first via 01 and the second via 02 respectively penetrate the third insulating layer 230.
  • the third via 03 and the fourth via 04 penetrate the first insulating layer 210 and the second insulating layer 220, respectively.
  • each of the signal lines located in the gate conductive layer 30 is insulated from the scan lines.
  • the signal lines that need to be insulated and the signal lines that need to be insulated and the scanning lines can be spaced apart by the patterning process.
  • the signal lines in the source and drain conductive layer 40 are insulated from the data lines.
  • the patterning process can be used to separate the signal lines that need to be insulated and between the signal lines and the data lines that need to be insulated.
  • the patterning process belongs to a technology well-known to those skilled in the art and will not be detailed here. Narrated.
  • the extension directions of the power signal line Vdd and the detection signal line SL are the same, and the power signal line Vdd and the detection signal line SL extend in the same direction.
  • the extending direction of the signal line SL is the same as the extending direction of the data line DA.
  • the power signal line Vdd and the detection signal line SL are located between different adjacent columns of pixel circuits. This can prevent signal crosstalk between the power signal line Vdd and the detection signal line SL.
  • embodiments of the present disclosure also provide a display panel, including any of the aforementioned array substrates provided by the embodiments of the present disclosure.
  • the problem-solving principle of the display panel is similar to that of the aforementioned array substrate. Therefore, the implementation of the display panel can refer to the implementation of the aforementioned array substrate, and the repetitive parts will not be repeated here.
  • an embodiment of the present disclosure also provides a display device, including the above-mentioned display panel provided by the embodiment of the present disclosure.
  • the principle of solving the problems of the display device is similar to that of the aforementioned array substrate. Therefore, the implementation of the display device can refer to the implementation of the aforementioned array substrate, and the repetitive points will not be repeated here.
  • the display device can also be any product or component with a display function, such as a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • the other indispensable components of the display device are understood by those of ordinary skill in the art, and will not be repeated here, nor should they be used as a limitation to the present disclosure.
  • the signal lines are arranged in a multilayer wiring structure electrically connected to each other, which is equivalent to making the signal lines consist of at least two signal lines in parallel, which can be arranged as
  • the resistance of the signal line of the multilayer wiring structure is reduced, thereby reducing the power consumption of the display panel where the array substrate is located, which satisfies the customer's low power requirements.
  • the embodiments of the present disclosure can also reduce the wiring space of the signal line, and can avoid the problem of photoresist residue caused by the increase of the thickness of the signal line, which causes poor display.

Abstract

Disclosed are an array substrate, a display panel and a display device. The array substrate comprises: a base substrate 10; a plurality of sub-pixels arranged in an array on the base substrate 10, wherein at least one of the plurality of sub-pixels comprises: a pixel circuit; a plurality of scanning lines, wherein pixel circuits in a row of sub-pixels are electrically connected to at least one scanning line, and the scanning lines extend in the row direction of the sub-pixels and are arranged in the column direction of the sub-pixels; and a plurality of transmission signal lines electrically connected to the pixel circuits, wherein the plurality of transmission signal lines extend in the column direction and are arranged in the row direction, and at least one of the plurality of transmission signal lines has a multilayer wiring structure where layers are electrically connected to one another.

Description

阵列基板、显示面板及显示装置Array substrate, display panel and display device
相关申请的交叉引用Cross references to related applications
本申请要求在2019年05月05日提交中国专利局、申请号为201920631110.6、申请名称为“一种阵列基板、显示面板及显示装置”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of a Chinese patent application filed with the Chinese Patent Office, the application number is 201920631110.6, and the application name is "an array substrate, display panel and display device" on May 05, 2019, the entire content of which is incorporated by reference In this application.
技术领域Technical field
本公开涉及柔性显示技术领域,特别涉及一种阵列基板、显示面板及显示装置。The present disclosure relates to the field of flexible display technology, and in particular to an array substrate, a display panel and a display device.
背景技术Background technique
有机发光二极管(Organic Light Emitting Diode,OLED)、量子点发光二极管(Quantum Dot Light Emitting Diodes,QLED)等电致发光二极管具有自发光、低能耗等优点,是当今电致发光显示面板应用研究领域的热点之一,受到了广泛关注。Organic Light Emitting Diode (OLED), Quantum Dot Light Emitting Diodes (QLED) and other electroluminescent diodes have the advantages of self-luminescence, low energy consumption, etc., which are the most important in the application research field of electroluminescent display panels. One of the hot spots has received widespread attention.
发明内容Summary of the invention
本公开实施例提供的阵列基板,包括:The array substrate provided by the embodiment of the present disclosure includes:
衬底基板;Base substrate
多个子像素,阵列排布于所述衬底基板上,且所述多个子像素中的至少一个包括:像素电路;A plurality of sub-pixels are arranged in an array on the base substrate, and at least one of the plurality of sub-pixels includes: a pixel circuit;
多条扫描线,一行所述子像素中的像素电路与至少一条所述扫描线电连接,以及所述扫描线沿所述子像素的行方向延伸且沿所述子像素的列方向排列;A plurality of scan lines, the pixel circuits in a row of the sub-pixels are electrically connected to at least one of the scan lines, and the scan lines extend along the row direction of the sub-pixels and are arranged along the column direction of the sub-pixels;
多条传输信号线,与所述像素电路电连接,且所述多条传输信号线沿所述列方向延伸且沿所述行方向排列;A plurality of transmission signal lines are electrically connected to the pixel circuit, and the plurality of transmission signal lines extend in the column direction and are arranged in the row direction;
其中,所述多条传输信号线中的至少一条传输信号线具有相互电连接的多层走线结构。Wherein, at least one of the plurality of transmission signal lines has a multilayer wiring structure electrically connected to each other.
在一些实施方式中,所述阵列基板还包括:In some embodiments, the array substrate further includes:
多条电源信号线,所述电源信号线位于相邻两个子像素列之间的间隙中,且所述电源信号线与所述像素电路电连接;A plurality of power signal lines, the power signal lines are located in a gap between two adjacent sub-pixel columns, and the power signal lines are electrically connected to the pixel circuit;
多条检测信号线,所述检测信号线位于相邻两个子像素列之间的间隙中,且所述检测信号线与所述电源信号线绝缘设置,所述检测信号线与所述像素电路电连接;A plurality of detection signal lines, the detection signal line is located in the gap between two adjacent sub-pixel columns, and the detection signal line is insulated from the power signal line, and the detection signal line is electrically connected to the pixel circuit connection;
所述传输信号线包括:所述多条检测信号线以及所述多条电源信号线中的至少一条。The transmission signal line includes: at least one of the plurality of detection signal lines and the plurality of power signal lines.
在一些实施方式中,所述阵列基板还包括多条第一连接线和多条第二连接线;所述第一连接线和所述第二连接线绝缘设置;其中,所述第一连接线的延伸方向与所述电源信号线的延伸方向交叉,所述第二连接线的延伸方向与所述检测信号线的延伸方向交叉;In some embodiments, the array substrate further includes a plurality of first connection wires and a plurality of second connection wires; the first connection wires and the second connection wires are insulated; wherein, the first connection wires The extension direction of the power signal line crosses the extension direction of the power signal line, and the extension direction of the second connection line crosses the extension direction of the detection signal line;
部分所述像素电路通过一条所述第一连接线与一条所述电源信号线电连接,部分所述像素电路通过一条所述第二连接线与一条所述检测信号线电连接的;Some of the pixel circuits are electrically connected to one of the power signal lines through a first connection line, and some of the pixel circuits are electrically connected to one of the detection signal lines through a second connection line;
所述多条第一连接线和所述多条第二连接线中的至少一条具有相互电连接的多层走线结构。At least one of the plurality of first connecting lines and the plurality of second connecting lines has a multilayer wiring structure electrically connected to each other.
在一些实施方式中,所述阵列基板还包括:In some embodiments, the array substrate further includes:
遮光金属层,位于所述衬底基板上;The light-shielding metal layer is located on the base substrate;
第一绝缘层,位于所述遮光金属层背离所述衬底基板一侧;The first insulating layer is located on the side of the light-shielding metal layer away from the base substrate;
半导体层,位于所述第一绝缘层背离所述衬底基板一侧;A semiconductor layer located on the side of the first insulating layer away from the base substrate;
第二绝缘层,位于所述半导体层背离所述衬底基板一侧;A second insulating layer located on the side of the semiconductor layer away from the base substrate;
栅导电层,位于所述第二绝缘层背离所述衬底基板一侧,且所述栅导电层包括所述多条扫描线;A gate conductive layer located on a side of the second insulating layer away from the base substrate, and the gate conductive layer includes the plurality of scan lines;
第三绝缘层,位于所述栅导电层背离所述衬底基板一侧;A third insulating layer located on the side of the gate conductive layer away from the base substrate;
源漏导电层,位于所述第三绝缘层背离所述衬底基板一侧,且所述源漏导电层包括所述多条电源信号线和所述多条检测信号线;The source-drain conductive layer is located on the side of the third insulating layer away from the base substrate, and the source-drain conductive layer includes the plurality of power signal lines and the plurality of detection signal lines;
所述多层走线结构包括所述遮光导电层、所述栅导电层和所述源漏导电层中的至少任意两层;且同一所述多层走线结构通过贯穿位于所述多层走线结构之间的绝缘层的多个过孔电连接。The multilayer wiring structure includes at least any two layers of the light-shielding conductive layer, the gate conductive layer, and the source-drain conductive layer; and the same multilayer wiring structure passes through the multilayer wiring structure. The multiple via holes of the insulating layer between the wire structures are electrically connected.
在一些实施方式中,所述栅导电层还包括多个第一辅助部,且所述第一辅助部与所述扫描线绝缘设置;其中,一条所述电源信号线通过多个第一过孔与至少一个所述第一辅助部电连接,所述第一过孔贯穿所述第三绝缘层;In some embodiments, the gate conductive layer further includes a plurality of first auxiliary portions, and the first auxiliary portions are insulated from the scan line; wherein, one of the power signal lines passes through a plurality of first vias Electrically connected to at least one of the first auxiliary parts, and the first via hole penetrates the third insulating layer;
相互电连接的所述电源信号线和所述第一辅助部形成所述电源信号线的多层走线结构。The power signal line and the first auxiliary part that are electrically connected to each other form a multilayer wiring structure of the power signal line.
在一些实施方式中,所述电源信号线在所述衬底基板的正投影覆盖电连接的第一辅助部在所述衬底基板的正投影。In some embodiments, the orthographic projection of the power signal line on the base substrate covers the orthographic projection of the first auxiliary part of the electrical connection on the base substrate.
在一些实施方式中,所述电源信号线在所述衬底基板的正投影的边缘与电连接的第一辅助部在所述衬底基板的正投影的边缘具有间隙,且所述电源信号线在垂直于所述电源信号线的延伸方向上的截面呈“几”字形。In some embodiments, the power signal line has a gap at the edge of the orthographic projection of the base substrate and the electrically connected first auxiliary part at the edge of the orthographic projection of the base substrate, and the power signal line The cross section perpendicular to the extension direction of the power signal line is in the shape of a "several".
在一些实施方式中,所述栅导电层还包括多个第二辅助部,且所述第二辅助部与所述扫描线绝缘设置;其中,一条所述检测信号线通过多个第二过孔与至少一个所述第二辅助部电连接,所述第二过孔贯穿所述第三绝缘层;In some embodiments, the gate conductive layer further includes a plurality of second auxiliary portions, and the second auxiliary portions are insulated from the scan line; wherein, one detection signal line passes through a plurality of second via holes Electrically connected to at least one of the second auxiliary portions, and the second via hole penetrates the third insulating layer;
相互电连接的所述检测信号线和所述第二辅助部形成所述检测信号线的多层走线结构。The detection signal line and the second auxiliary part electrically connected to each other form a multilayer wiring structure of the detection signal line.
在一些实施方式中,所述检测信号线在所述衬底基板的正投影覆盖电连接的第二辅助部在所述衬底基板的正投影。In some embodiments, the orthographic projection of the detection signal line on the base substrate covers the orthographic projection of the second auxiliary part of the electrical connection on the base substrate.
在一些实施方式中,所述检测信号线在所述衬底基板的正投影的边缘与电连接的第二辅助部在所述衬底基板的正投影的边缘具有间隙,且所述检测信号线在垂直于所述检测信号线的延伸方向上的截面呈“几”字形。In some embodiments, the detection signal line has a gap at the edge of the orthographic projection of the base substrate and the second auxiliary part electrically connected to the edge of the orthographic projection of the base substrate, and the detection signal line The cross section perpendicular to the extending direction of the detection signal line is in the shape of a "several".
在一些实施方式中,所述栅导电层还包括多个第三辅助部,且所述第三辅助部与所述扫描线绝缘设置;其中,一条所述第一连接线通过多个第三过 孔与至少一个所述第三辅助部电连接,所述第三过孔贯穿所述第三绝缘层;In some embodiments, the gate conductive layer further includes a plurality of third auxiliary parts, and the third auxiliary parts are insulated from the scan line; wherein, one of the first connecting lines passes through a plurality of third passing parts. The hole is electrically connected to at least one of the third auxiliary parts, and the third via hole penetrates the third insulating layer;
相互电连接的所述第一连接线和所述第三辅助部形成所述第一连接线的多层走线结构。The first connection line and the third auxiliary part electrically connected to each other form a multilayer wiring structure of the first connection line.
在一些实施方式中,所述第一连接线在所述衬底基板的正投影覆盖电连接的第三辅助部在所述衬底基板的正投影。In some embodiments, the orthographic projection of the first connecting line on the base substrate covers the orthographic projection of the third auxiliary part of the electrical connection on the base substrate.
在一些实施方式中,所述栅导电层还包括多个第四辅助部,且所述第四辅助部与所述扫描线绝缘设置;其中,一条所述第二连接线通过多个第四过孔与至少一个所述第四辅助部电连接,所述第四过孔贯穿所述第三绝缘层;In some embodiments, the gate conductive layer further includes a plurality of fourth auxiliary parts, and the fourth auxiliary parts are insulated from the scan line; wherein, one of the second connecting lines passes through a plurality of fourth passing parts. The hole is electrically connected to at least one of the fourth auxiliary parts, and the fourth via hole penetrates the third insulating layer;
相互电连接的所述第二连接线和所述第四辅助部形成所述第二连接线的多层走线结构。The second connecting line and the fourth auxiliary part electrically connected to each other form a multilayer wiring structure of the second connecting line.
在一些实施方式中,所述第二连接线在所述衬底基板的正投影覆盖电连接的第四辅助部在所述衬底基板的正投影。In some embodiments, the orthographic projection of the second connecting line on the base substrate covers the orthographic projection of the fourth auxiliary part of the electrical connection on the base substrate.
在一些实施方式中,所述电源信号线和所述检测信号线位于的相邻两个子像素列之间的间隙不同。In some embodiments, the gap between two adjacent sub-pixel columns where the power signal line and the detection signal line are located is different.
本公开实施例提供的显示面板,包括上述阵列基板。The display panel provided by the embodiment of the present disclosure includes the above-mentioned array substrate.
本公开实施例提供的显示装置,包括上述显示面板。The display device provided by the embodiment of the present disclosure includes the above-mentioned display panel.
附图说明Description of the drawings
图1为本公开实施例提供的一些阵列基板的结构示意图;FIG. 1 is a schematic structural diagram of some array substrates provided by embodiments of the disclosure;
图2为本公开实施例提供的像素电路的结构示意图;2 is a schematic structural diagram of a pixel circuit provided by an embodiment of the disclosure;
图3为本公开实施例提供的一些阵列基板的具体结构示意图;3 is a schematic diagram of specific structures of some array substrates provided by embodiments of the disclosure;
图4为图3所示的阵列基板沿AA’方向的剖面结构示意图;4 is a schematic diagram of a cross-sectional structure of the array substrate shown in FIG. 3 along the AA' direction;
图5为图3所示的阵列基板沿BB’方向的剖面结构示意图;5 is a schematic cross-sectional structure diagram of the array substrate shown in FIG. 3 along the BB' direction;
图6a为本公开实施例提供的又一些阵列基板的具体结构示意图;6a is a schematic diagram of specific structures of still other array substrates provided by the embodiments of the disclosure;
图6b为图6a所示的阵列基板沿AA’方向的剖面结构示意图;6b is a schematic cross-sectional structure view of the array substrate shown in FIG. 6a along the AA' direction;
图7a为本公开实施例提供的又一些阵列基板的具体结构示意图;FIG. 7a is a schematic diagram of specific structures of still other array substrates provided by the embodiments of the disclosure;
图7b为图7a所示的阵列基板沿AA’方向的剖面结构示意图;FIG. 7b is a schematic cross-sectional structure diagram of the array substrate shown in FIG. 7a along the AA' direction;
图8为本公开实施例提供的又一些阵列基板的具体结构示意图。FIG. 8 is a schematic diagram of specific structures of still other array substrates provided by the embodiments of the disclosure.
具体实施方式Detailed ways
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例的附图,对本公开实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本公开的一部分实施例,而不是全部的实施例。并且在不冲突的情况下,本公开中的实施例及实施例中的特征可以相互组合。基于所描述的本公开的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本公开保护的范围。In order to make the objectives, technical solutions, and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. And in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the protection scope of the present disclosure.
除非另外定义,本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those with ordinary skills in the field to which this disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity, or importance, but are only used to distinguish different components. "Include" or "include" and other similar words mean that the element or item appearing before the word encompasses the element or item listed after the word and its equivalents, but does not exclude other elements or items. Similar words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
需要注意的是,附图中各图形的尺寸和形状不反映真实比例,目的只是示意说明本公开内容。并且自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。It should be noted that the size and shape of each figure in the drawings do not reflect the true proportions, and are only intended to illustrate the present disclosure. And the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions.
随着显示面板的像素分辨率越来越高,显示面板内布线区域越来越小。通常显示面板中设置多种信号线以传输信号。由于信号线逐步向细线化和精细化方向发展,这将会导致信号线的电阻越来越大,尤其对于一些重要信号线(例如电源信号线、检测信号线)的电阻增加,将会导致显示面板的功耗大幅上升。然而,为了降低信号线的电阻,可以通过下述两种方式解决:(1)加宽信号线的宽度。然而,由于布线空间有限,采用这种方法,对降低显示面板的功耗的贡献是有限的。(2)将信号线加厚。然而,由于工艺因素的限制,采用这种方法,受限于曝光能力,信号线的厚度达到8000埃以上时,很 容易导致光刻胶的残留,导致显示不良。As the pixel resolution of the display panel becomes higher and higher, the wiring area in the display panel becomes smaller and smaller. Generally, a variety of signal lines are provided in the display panel to transmit signals. As signal lines are gradually becoming thinner and more refined, this will cause the resistance of the signal lines to become larger and larger, especially for some important signal lines (such as power signal lines, detection signal lines). The power consumption of the display panel has increased significantly. However, in order to reduce the resistance of the signal line, it can be solved in the following two ways: (1) Widen the width of the signal line. However, due to the limited wiring space, the contribution of this method to reducing the power consumption of the display panel is limited. (2) Thicken the signal line. However, due to the limitation of process factors, the use of this method is limited by the exposure ability. When the thickness of the signal line reaches more than 8000 angstroms, it is easy to cause residual photoresist and cause poor display.
本公开实施例提供了一些阵列基板,通过使信号线设置为相互电连接的多层走线结构,相当于使信号线可以至少由两条信号线并联构成,可以使设置成多层走线结构的信号线的电阻降低,从而可以降低阵列基板所在的显示面板的功耗,很好的满足了客户低功耗的要求。The embodiments of the present disclosure provide some array substrates. By setting the signal lines in a multilayer wiring structure that is electrically connected to each other, it is equivalent to making the signal lines consist of at least two signal lines in parallel, which can be arranged in a multilayer wiring structure. The resistance of the signal line is reduced, so that the power consumption of the display panel where the array substrate is located can be reduced, which satisfies the customer's requirements for low power consumption.
并且,本公开实施例提供的阵列基板,还可以缩减信号线的布线空间,又可以避免由增加信号线的厚度而导致光刻胶残留,造成显示不良的问题。In addition, the array substrate provided by the embodiments of the present disclosure can also reduce the wiring space of the signal lines, and can avoid the problem of photoresist residue caused by increasing the thickness of the signal lines and causing poor display.
在具体实施时,在本公开实施例中,如图1所示,阵列基板可以包括:衬底基板10,多个像素单元PX。其中,像素单元PX可以包括多个子像素spx。这些子像素spx阵列排布于衬底基板10上。In specific implementation, in the embodiment of the present disclosure, as shown in FIG. 1, the array substrate may include: a base substrate 10 and a plurality of pixel units PX. The pixel unit PX may include multiple sub-pixels spx. These sub-pixel spx arrays are arranged on the base substrate 10.
示例性地,结合图1与图2所示,多个子像素中的至少一个子像素spx可以包括:像素电路和电致发光二极管L。其中,像素电路具有晶体管和电容,并通过晶体管和电容的相互作用产生电信号,产生的电信号输入到电致发光二极管的阳极中。并且对电致发光二极管的阴极加载相应的电压,可以驱动电致发光二极管发光。Exemplarily, as shown in FIG. 1 and FIG. 2, at least one sub-pixel spx in the plurality of sub-pixels may include: a pixel circuit and an electroluminescent diode L. Among them, the pixel circuit has a transistor and a capacitor, and generates an electrical signal through the interaction of the transistor and the capacitor, and the generated electrical signal is input to the anode of the electroluminescent diode. In addition, a corresponding voltage is applied to the cathode of the electroluminescent diode to drive the electroluminescent diode to emit light.
示例性地,如图2所示,像素电路可以包括:驱动晶体管T1、开关晶体管T2、感测晶体管T3以及存储电容Cst。其中,开关晶体管T2的栅极与扫描线GA电连接,开关晶体管T2的第一极(例如源极)与数据线DA电连接,开关晶体管T2的第二极(例如漏极)与驱动晶体管T1的栅极电连接。驱动晶体管T1的第一极(例如源极)与电源信号线Vdd电连接,驱动晶体管T1的第二极(例如漏极)与电致发光二极管L的阳极电连接,电致发光二极管L的阴极与低电压信号线VSS电连接。感测晶体管T3的栅极与扫描线GA电连接,感测晶体管T3的第一极(例如源极)与驱动晶体管T1的第二极(例如漏极)电连接,感测晶体管T3的第二极(例如漏极)与检测信号线SL电连接。存储电容Cst的第一极与驱动晶体管T1的栅极电连接,存储电容Cst的第二极与驱动晶体管T1的第二极(例如漏极)电连接。Exemplarily, as shown in FIG. 2, the pixel circuit may include a driving transistor T1, a switching transistor T2, a sensing transistor T3, and a storage capacitor Cst. Wherein, the gate of the switching transistor T2 is electrically connected to the scan line GA, the first electrode (for example, the source) of the switching transistor T2 is electrically connected to the data line DA, and the second electrode (for example, the drain) of the switching transistor T2 is electrically connected to the driving transistor T1. The grid is electrically connected. The first electrode (for example, the source) of the driving transistor T1 is electrically connected to the power signal line Vdd, the second electrode (for example, the drain) of the driving transistor T1 is electrically connected to the anode of the electroluminescent diode L, and the cathode of the electroluminescent diode L It is electrically connected to the low-voltage signal line VSS. The gate of the sensing transistor T3 is electrically connected to the scan line GA, the first electrode (such as the source) of the sensing transistor T3 is electrically connected to the second electrode (such as the drain) of the driving transistor T1, and the second electrode of the sensing transistor T3 is electrically connected. The pole (for example, the drain) is electrically connected to the detection signal line SL. The first electrode of the storage capacitor Cst is electrically connected to the gate of the driving transistor T1, and the second electrode of the storage capacitor Cst is electrically connected to the second electrode (for example, the drain) of the driving transistor T1.
其中,通过扫描线GA上传输的信号控制开关晶体管T2打开,以将数据 线DA上传输的数据电压写入驱动晶体管T1的栅极,控制驱动晶体管T1产生工作电流以驱动电致发光二极管L发光。以及通过扫描线GA上传输的信号控制感测晶体管T3打开,以将驱动晶体管T1产生的工作电流输出给检测信号线SL,对检测信号线SL充电。之后,再通过检测每个检测信号线SL上的电压,并根据检测到的电压进行补偿计算,以得到该行各子像素对应的用于显示的数据电压。The switching transistor T2 is controlled to be turned on by the signal transmitted on the scan line GA to write the data voltage transmitted on the data line DA into the gate of the driving transistor T1, and the driving transistor T1 is controlled to generate a working current to drive the electroluminescent diode L to emit light. . And the sensing transistor T3 is controlled to turn on by the signal transmitted on the scan line GA, so as to output the operating current generated by the driving transistor T1 to the detection signal line SL to charge the detection signal line SL. After that, the voltage on each detection signal line SL is detected, and compensation calculation is performed according to the detected voltage to obtain the data voltage corresponding to each sub-pixel in the row for display.
示例性地,电源信号线Vdd可以传输恒定的第一电压,第一电压为正电压;而低电压信号线VSS可以传输恒定的第二电压,第二电压为负电压。或者,在一些示例中,低电压信号线VSS也可以接地。Exemplarily, the power signal line Vdd may transmit a constant first voltage, which is a positive voltage; and the low voltage signal line VSS may transmit a constant second voltage, which is a negative voltage. Alternatively, in some examples, the low voltage signal line VSS may also be grounded.
需要说明的是,在本公开实施例中,像素电路除了可以为图2所示的结构之外,还可以为包括其他数量的晶体管和电容的结构,本公开实施例对此不作限定。It should be noted that, in the embodiment of the present disclosure, the pixel circuit may be a structure including other numbers of transistors and capacitors in addition to the structure shown in FIG. 2, which is not limited in the embodiment of the present disclosure.
在具体实施时,在本公开实施例中,如图1所示,显示面板还可以包括:多条扫描线GA、多条检测信号线SL、多条数据线DA以及电源信号线Vdd。其中,扫描线GA、检测信号线SL、数据线DA以及电源信号线Vdd相互绝缘设置。其中,一列子像素中的像素电路与一条数据线DA电连接。一列像素单元中的像素电路与一条检测信号线SL。一行子像素中的像素电路与至少一条扫描线电连接。例如,一行子像素中的像素电路与一条扫描线电连接。In specific implementation, in the embodiment of the present disclosure, as shown in FIG. 1, the display panel may further include: a plurality of scan lines GA, a plurality of detection signal lines SL, a plurality of data lines DA, and a power signal line Vdd. Among them, the scan line GA, the detection signal line SL, the data line DA, and the power signal line Vdd are insulated from each other. Among them, the pixel circuit in a column of sub-pixels is electrically connected to a data line DA. Pixel circuits in one column of pixel units and one detection signal line SL. The pixel circuits in a row of sub-pixels are electrically connected to at least one scan line. For example, the pixel circuits in a row of sub-pixels are electrically connected to one scan line.
示例性地,扫描线沿子像素的行方向F2延伸且沿子像素的列方向F1排列。数据线DA沿列方向F1延伸且沿行方向F2排列,电源信号线Vdd沿列方向F1延伸且沿行方向F2排列,检测信号线SL沿列方向F1延伸且沿行方向F2排列。并且,电源信号线Vdd位于相邻两个子像素列之间的间隙中,且电源信号线Vdd与像素电路中的驱动晶体管T1电连接。检测信号线SL位于相邻两个子像素列之间的间隙中,且检测信号线SL与像素电路中的感测晶体管T3电连接。实例性地,电源信号线Vdd和检测信号线SL位于的相邻两个子像素列之间的间隙不同。Exemplarily, the scan lines extend along the row direction F2 of the sub-pixels and are arranged along the column direction F1 of the sub-pixels. The data lines DA extend along the column direction F1 and are arranged along the row direction F2, the power signal lines Vdd extend along the column direction F1 and are arranged along the row direction F2, and the detection signal lines SL extend along the column direction F1 and are arranged along the row direction F2. In addition, the power signal line Vdd is located in the gap between two adjacent sub-pixel columns, and the power signal line Vdd is electrically connected to the driving transistor T1 in the pixel circuit. The detection signal line SL is located in the gap between two adjacent sub-pixel columns, and the detection signal line SL is electrically connected to the sensing transistor T3 in the pixel circuit. Exemplarily, the gap between two adjacent sub-pixel columns where the power signal line Vdd and the detection signal line SL are located is different.
在具体实施时,在本公开实施例中,阵列基板具有与像素电路电连接的 多条传输信号线。其中,多条传输信号线中的至少一条传输信号线具有相互电连接的多层走线结构。示例性地,可以使每一条传输信号线具有相互电连接的多层走线结构。这样可以降低传输信号线的电阻,降低信号延迟,提高显示效果。In specific implementation, in the embodiment of the present disclosure, the array substrate has a plurality of transmission signal lines electrically connected to the pixel circuit. Wherein, at least one of the multiple transmission signal lines has a multilayer wiring structure electrically connected to each other. Exemplarily, each transmission signal line may have a multilayer wiring structure electrically connected to each other. This can reduce the resistance of the transmission signal line, reduce the signal delay, and improve the display effect.
在具体实施时,可以使传输信号线包括多条检测信号线SL以及多条电源信号线Vdd中的至少一条。例如,如图3和图4所示,可以使传输信号线包括多条检测信号线SL。这样可以使检测信号线SL由位于至少两个不同导电层、层叠设置且相互导通的信号线构成,这样相当于检测信号线SL由至少两条信号线并联构成。由于检测信号线SL的两条信号线并联后的等效电阻小于其中任一条信号线的电阻,因此可以有效降低检测信号线SL的电阻,从而可以降低阵列基板所在的显示面板的功耗,很好的满足了客户低功耗的要求。另外,采用本公开实施例公开的设计既缩减了检测信号线SL的布线空间,又避免了增加检测信号线SL的厚度而导致光刻胶残留,造成显示不良的问题。In specific implementation, the transmission signal line may include at least one of a plurality of detection signal lines SL and a plurality of power signal lines Vdd. For example, as shown in FIGS. 3 and 4, the transmission signal line may include a plurality of detection signal lines SL. In this way, the detection signal line SL can be composed of signal lines located on at least two different conductive layers, stacked and connected to each other, which is equivalent to that the detection signal line SL is composed of at least two signal lines in parallel. Since the equivalent resistance of the two signal lines of the detection signal line SL in parallel is smaller than the resistance of any one of the signal lines, the resistance of the detection signal line SL can be effectively reduced, thereby reducing the power consumption of the display panel where the array substrate is located. It satisfies the requirements of customers for low power consumption. In addition, adopting the design disclosed in the embodiment of the present disclosure not only reduces the wiring space of the detection signal line SL, but also avoids the problem of photoresist residue caused by increasing the thickness of the detection signal line SL, resulting in poor display.
在具体实施时,如图3和图4所示,也可以使传输信号线包括多条电源信号线Vdd。这样可以使电源信号线Vdd由位于至少两个不同导电层、层叠设置且相互导通的信号线构成,这样相当于电源信号线Vdd由至少两条信号线并联构成。由于电源信号线Vdd的两条信号线并联后的等效电阻小于其中任一条信号线的电阻,因此可以有效降低电源信号线Vdd的电阻,从而可以降低阵列基板所在的显示面板的功耗,很好的满足了客户低功耗的要求。另外,采用本公开实施例公开的设计既缩减了电源信号线Vdd的布线空间,又避免了增加电源信号线Vdd的厚度而导致光刻胶残留,造成显示不良的问题。In specific implementation, as shown in FIGS. 3 and 4, the transmission signal line may also include multiple power signal lines Vdd. In this way, the power signal line Vdd can be composed of at least two different conductive layers, stacked and connected with each other, which is equivalent to that the power signal line Vdd is composed of at least two signal lines in parallel. Since the equivalent resistance of the two signal lines of the power signal line Vdd in parallel is smaller than the resistance of any one of the signal lines, the resistance of the power signal line Vdd can be effectively reduced, thereby reducing the power consumption of the display panel where the array substrate is located. It satisfies the requirements of customers for low power consumption. In addition, adopting the design disclosed in the embodiment of the present disclosure not only reduces the wiring space of the power signal line Vdd, but also avoids the problem of photoresist residue caused by increasing the thickness of the power signal line Vdd and causing poor display.
示例性地,每个子像素中可以设置一个电致发光二极管和一个像素电路。示例性地,像素单元可以包括红色子像素,绿色子像素以及蓝色子像素,这样可以通过红绿蓝进行混色,以实现彩色显示。或者,像素单元也可以包括红色子像素,绿色子像素、蓝色子像素以及白色子像素,这样可以通过红绿蓝白进行混色,以实现彩色显示。当然,在实际应用中,像素单元中的子像素的发光颜色可以根据实际应用环境来设计确定,在此不作限定。Exemplarily, one electroluminescent diode and one pixel circuit may be provided in each sub-pixel. Exemplarily, the pixel unit may include a red sub-pixel, a green sub-pixel, and a blue sub-pixel, so that red, green and blue can be mixed to achieve color display. Alternatively, the pixel unit may also include red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels. In this way, red, green, blue and white can be mixed to achieve color display. Of course, in actual applications, the light-emitting colors of the sub-pixels in the pixel unit can be designed and determined according to the actual application environment, which is not limited here.
下面以像素单元包括红色子像素,绿色子像素、蓝色子像素以及白色子像素为例进行说明。如图3所示,红色子像素可以包括像素电路R,绿色子像素可以包括像素电路G,蓝色子像素可以包括像素电路B,白色子像素可以包括像素电路W。示例性地,多个像素电路(R、G、B、W)可以呈阵列排布于衬底基板10上。需要说明的是,图3中以标号R、G、B、W表示各子像素中的像素电路,Vdd表示与像素电路(R、G、B、W)电连接的电源信号线Vdd(图3中以两条电源信号线Vdd为例进行说明),SL表示与像素电路(R、G、B、W)电连接的检测信号线SL(图3中以一条检测信号线SL为例进行说明)。In the following, the pixel unit includes red sub-pixels, green sub-pixels, blue sub-pixels, and white sub-pixels as an example. As shown in FIG. 3, the red sub-pixel may include a pixel circuit R, the green sub-pixel may include a pixel circuit G, the blue sub-pixel may include a pixel circuit B, and the white sub-pixel may include a pixel circuit W. Exemplarily, a plurality of pixel circuits (R, G, B, W) may be arranged on the base substrate 10 in an array. It should be noted that the reference signs R, G, B, and W in FIG. 3 indicate the pixel circuit in each sub-pixel, and Vdd indicates the power signal line Vdd electrically connected to the pixel circuit (R, G, B, W) (FIG. 3 Two power signal lines Vdd are taken as an example for description), SL represents the detection signal line SL electrically connected to the pixel circuit (R, G, B, W) (in Figure 3, a detection signal line SL is taken as an example for description) .
在具体实施时,在本公开实施例中,如图3至图5所示,阵列基板还可以包括:位于衬底基板10上的遮光金属层;位于遮光金属层背离衬底基板10一侧的第一绝缘层210;位于第一绝缘层210背离衬底基板10一侧的半导体层60;位于半导体层60背离衬底基板10一侧的第二绝缘层220;位于第二绝缘层220背离衬底基板10一侧的栅导电层30;位于栅导电层30背离衬底基板10一侧的第三绝缘层230;位于第三绝缘层230背离衬底基板10一侧的源漏导电层40。其中,遮光金属层包括绝缘设置的多条第一连接线110和多条第二连接线120。半导体层60包括上述晶体管的具有沟道区和导体化区的有源层。栅导电层30包括多条扫描线以及上述晶体管的栅极。源漏导电层40包括多条电源信号线Vdd和多条检测信号线SL以及上述晶体管的源极和漏极。在一些实施例中,可以使多层走线结构包括遮光金属层、栅导电层30和源漏导电层40中的至少任意两层;且同一多层走线结构通过贯穿位于多层走线结构之间的绝缘层的多个过孔电连接。In specific implementation, in the embodiments of the present disclosure, as shown in FIGS. 3 to 5, the array substrate may further include: a light-shielding metal layer on the base substrate 10; and a side of the light-shielding metal layer away from the base substrate 10. The first insulating layer 210; the semiconductor layer 60 on the side of the first insulating layer 210 away from the base substrate 10; the second insulating layer 220 on the side of the semiconductor layer 60 away from the base substrate 10; the second insulating layer 220 away from the liner The gate conductive layer 30 on the side of the base substrate 10; the third insulating layer 230 on the side of the gate conductive layer 30 away from the base substrate 10; the source-drain conductive layer 40 on the side of the third insulating layer 230 away from the base substrate 10. Wherein, the light-shielding metal layer includes a plurality of first connecting wires 110 and a plurality of second connecting wires 120 arranged in an insulated manner. The semiconductor layer 60 includes an active layer having a channel region and a conductive region of the aforementioned transistor. The gate conductive layer 30 includes a plurality of scan lines and the gates of the aforementioned transistors. The source-drain conductive layer 40 includes a plurality of power signal lines Vdd and a plurality of detection signal lines SL, and the source and drain of the above-mentioned transistors. In some embodiments, the multilayer wiring structure may include at least any two layers of the light-shielding metal layer, the gate conductive layer 30, and the source-drain conductive layer 40; and the same multilayer wiring structure may pass through the multilayer wiring The multiple vias of the insulating layer between the structures are electrically connected.
在具体实施时,以每一电源信号线Vdd为例。在本公开实施例中,如图3至图5所示,栅导电层30还可以包括多个第一辅助部310,且第一辅助部310与扫描线绝缘设置;其中,一条电源信号线Vdd通过多个第一过孔01与至少一个第一辅助部310电连接,第一过孔01贯穿第三绝缘层230。相互电连接的电源信号线Vdd和第一辅助部310形成电源信号线Vdd的多层走线结 构。也可以说,相互电连接的电源信号线Vdd和第一辅助部310形成了双层走线结构。这相当于使每一电源信号线Vdd由位于两个不同导电层、层叠设置且相互导通的信号线构成。In specific implementation, take each power signal line Vdd as an example. In the embodiment of the present disclosure, as shown in FIGS. 3 to 5, the gate conductive layer 30 may further include a plurality of first auxiliary parts 310, and the first auxiliary parts 310 are insulated from the scan lines; among them, one power signal line Vdd The plurality of first vias 01 are electrically connected to at least one first auxiliary portion 310, and the first via 01 penetrates the third insulating layer 230. The power signal line Vdd and the first auxiliary part 310 electrically connected to each other form a multilayer wiring structure of the power signal line Vdd. It can also be said that the power signal line Vdd and the first auxiliary part 310 that are electrically connected to each other form a double-layer wiring structure. This is equivalent to making each power signal line Vdd be composed of two different conductive layers, stacked and connected to each other.
示例性地,如图3所示,第一辅助部310在衬底基板10的正投影与扫描线在衬底基板10的正投影之间具有间隙。这样可以避免第一辅助部310占用额外的区域。Exemplarily, as shown in FIG. 3, the first auxiliary part 310 has a gap between the orthographic projection of the base substrate 10 and the orthographic projection of the scan line on the base substrate 10. This can prevent the first auxiliary part 310 from occupying an additional area.
示例性地,如图3所示,可以使每一条电源信号线Vdd通过多个第一过孔01与多个第一辅助部310电连接。这样可以进一步降低电源信号线Vdd的电阻。Exemplarily, as shown in FIG. 3, each power signal line Vdd may be electrically connected to a plurality of first auxiliary parts 310 through a plurality of first vias 01. This can further reduce the resistance of the power signal line Vdd.
示例性地,如图3至图5所示,可以使电源信号线Vdd在衬底基板10的正投影覆盖电连接的第一辅助部310在衬底基板10的正投影。进一步地,可以使电源信号线Vdd在衬底基板10的正投影的边缘与电连接的第一辅助部310在衬底基板10的正投影的边缘具有间隙,且电源信号线Vdd在垂直于电源信号线Vdd的延伸方向上的截面呈“几”字形。通过将位于源漏导电层40的电源信号线Vdd设置成在垂直于电源信号线Vdd的延伸方向上的截面呈“几”字形,这样可以降低源漏导电层40的坡度角,从而在后续形成钝化层90时不易在该坡度角处断裂,造成后续工艺中其它膜层的断裂,影响信号传输等问题。Exemplarily, as shown in FIGS. 3 to 5, the orthographic projection of the power signal line Vdd on the base substrate 10 may cover the orthographic projection of the electrically connected first auxiliary part 310 on the base substrate 10. Further, the power signal line Vdd may have a gap at the edge of the orthographic projection of the base substrate 10 and the electrically connected first auxiliary portion 310 at the edge of the orthographic projection of the base substrate 10, and the power signal line Vdd may be perpendicular to the power source. The cross section in the extending direction of the signal line Vdd is in the shape of "several". By arranging the power signal line Vdd located in the source-drain conductive layer 40 to have a cross section perpendicular to the extension direction of the power signal line Vdd in the shape of a "several", the slope angle of the source-drain conductive layer 40 can be reduced, and the subsequent formation The passivation layer 90 is not easy to break at the slope angle, causing other film layers in the subsequent process to break, affecting signal transmission and other problems.
在具体实施时,以每一检测信号线SL为例。在本公开实施例中,如图3至图5所示,栅导电层30还可以包括多个第二辅助部320,且第二辅助部320与扫描线绝缘设置;其中,一条检测信号线SL通过多个第二过孔02与至少一个第二辅助部320电连接,第二过孔02贯穿第三绝缘层230。并且,相互电连接的检测信号线SL和第二辅助部320形成检测信号线SL的多层走线结构。也可以说,相互电连接的检测信号线SL和第二辅助部320形成了双层走线结构。这相当于使每一检测信号线SL由位于两个不同导电层、层叠设置且相互导通的信号线构成。In specific implementation, take each detection signal line SL as an example. In the embodiment of the present disclosure, as shown in FIGS. 3 to 5, the gate conductive layer 30 may further include a plurality of second auxiliary parts 320, and the second auxiliary parts 320 are insulated from the scan lines; among them, one detection signal line SL The plurality of second via holes 02 is electrically connected to at least one second auxiliary portion 320, and the second via holes 02 penetrate the third insulating layer 230. In addition, the detection signal line SL and the second auxiliary portion 320 electrically connected to each other form a multilayer wiring structure of the detection signal line SL. It can also be said that the detection signal line SL and the second auxiliary portion 320 electrically connected to each other form a double-layer wiring structure. This is equivalent to making each detection signal line SL consist of signal lines located on two different conductive layers, stacked and connected to each other.
示例性地,如图3所示,第二辅助部320在衬底基板10的正投影与扫描 线在衬底基板10的正投影之间具有间隙。这样可以避免第二辅助部320占用额外的区域。Exemplarily, as shown in FIG. 3, the second auxiliary part 320 has a gap between the orthographic projection of the base substrate 10 and the orthographic projection of the scan line on the base substrate 10. This can prevent the second auxiliary part 320 from occupying an additional area.
示例性地,如图3所示,可以使每一条检测信号线SL通过多个第二过孔02与多个第二辅助部320电连接。这样可以进一步降低检测信号线SL的电阻。Exemplarily, as shown in FIG. 3, each detection signal line SL may be electrically connected to a plurality of second auxiliary parts 320 through a plurality of second via holes 02. This can further reduce the resistance of the detection signal line SL.
示例性地,如图3至图5所示,可以使检测信号线SL在衬底基板10的正投影覆盖电连接的第二辅助部320在衬底基板10的正投影。进一步地,可以使检测信号线SL在衬底基板10的正投影的边缘与电连接的第二辅助部320在衬底基板10的正投影的边缘具有间隙,且检测信号线SL在垂直于检测信号线SL的延伸方向上的截面呈“几”字形。通过将位于源漏导电层40的检测信号线SL设置成在垂直于检测信号线SL的延伸方向上的截面呈“几”字形,这样可以降低源漏导电层40的坡度角,从而在后续形成钝化层90时不易在该坡度角处断裂,造成后续工艺中其它膜层的断裂,影响信号传输等问题。Exemplarily, as shown in FIGS. 3 to 5, the orthographic projection of the detection signal line SL on the base substrate 10 may cover the orthographic projection of the electrically connected second auxiliary part 320 on the base substrate 10. Further, the detection signal line SL may have a gap between the edge of the orthographic projection of the base substrate 10 and the electrically connected second auxiliary part 320 on the edge of the orthographic projection of the base substrate 10, and the detection signal line SL may be perpendicular to the detection The cross section in the extending direction of the signal line SL has a "several" shape. By arranging the detection signal line SL located in the source-drain conductive layer 40 to have a cross section perpendicular to the extension direction of the detection signal line SL in a "several" shape, the slope angle of the source-drain conductive layer 40 can be reduced, and the subsequent formation The passivation layer 90 is not easy to break at the slope angle, causing other film layers in the subsequent process to break, affecting signal transmission and other problems.
在具体实施时,在本公开实施例中,如图3至图5所示,第一连接线110的延伸方向与电源信号线Vdd的延伸方向交叉,并且,部分像素电路通过一条第一连接线110与一条电源信号线Vdd电连接。示例性地,图3中是以两条电源信号线Vdd分别位于像素电路R和像素电路B两侧的,像素电路R和像素电路B可以分别与对应的电源信号线Vdd电连接,而像素电路G和像素电路W无法直接与对应的电源信号线Vdd电连接,这就需要设置与对应的电源信号线Vdd电连接的第一连接线110,使像素电路G和像素电路W通过第一连接线110与对应的电源信号线Vdd电连接。In specific implementation, in the embodiment of the present disclosure, as shown in FIGS. 3 to 5, the extension direction of the first connection line 110 crosses the extension direction of the power signal line Vdd, and part of the pixel circuit passes through a first connection line. 110 is electrically connected to a power signal line Vdd. Exemplarily, in FIG. 3, two power signal lines Vdd are respectively located on both sides of the pixel circuit R and the pixel circuit B. The pixel circuit R and the pixel circuit B can be electrically connected to the corresponding power signal line Vdd, and the pixel circuit G and the pixel circuit W cannot be directly electrically connected to the corresponding power signal line Vdd, which requires a first connection line 110 electrically connected to the corresponding power signal line Vdd, so that the pixel circuit G and the pixel circuit W pass through the first connection line 110 is electrically connected to the corresponding power signal line Vdd.
示例性地,可以使第一连接线110设置为单层走线结构。或者,也可以使第一连接线110具有相互电连接的多层走线结构,以降低第一连接线110的电阻。例如,结合图6a、图6b以及图8所示,栅导电层30还可以包括多个第三辅助部330,且第三辅助部330与扫描线绝缘设置;其中,一条第一连接线110通过多个第三过孔03与至少一个第三辅助部330电连接,第三过孔 03贯穿第三绝缘层230。并且,相互电连接的第一连接线110和第三辅助部330形成第一连接线110的多层走线结构。也可以说,相互电连接的第一连接线110和第三辅助部330形成了双层走线结构。这相当于使每一第一连接线110由位于两个不同导电层、层叠设置且相互导通的信号线构成。即相当于第一连接线110由两条信号线和信号线并联构成,第一连接线110的两条信号线和信号线并联后的等效电阻小于其中任一条信号线的电阻,因此可以有效降低第一连接线110的电阻,从而可以进一步降低阵列基板所在的显示面板的功耗,更很好的满足了客户低功耗的要求。Exemplarily, the first connection line 110 may be configured as a single-layer wiring structure. Alternatively, the first connection line 110 may also have a multilayer wiring structure electrically connected to each other to reduce the resistance of the first connection line 110. For example, as shown in FIG. 6a, FIG. 6b, and FIG. 8, the gate conductive layer 30 may further include a plurality of third auxiliary portions 330, and the third auxiliary portions 330 are insulated from the scan line; wherein, one first connection line 110 passes through The plurality of third via holes 03 are electrically connected to at least one third auxiliary portion 330, and the third via holes 03 penetrate the third insulating layer 230. In addition, the first connecting line 110 and the third auxiliary part 330 electrically connected to each other form a multilayer wiring structure of the first connecting line 110. It can also be said that the first connecting line 110 and the third auxiliary part 330 electrically connected to each other form a double-layer wiring structure. This is equivalent to making each first connection line 110 consist of two different conductive layers, stacked and mutually connected signal lines. That is to say, the first connection line 110 is composed of two signal lines and signal lines in parallel. The equivalent resistance of the two signal lines and signal lines of the first connection line 110 in parallel is less than the resistance of any one of the signal lines, so it can be effective Reducing the resistance of the first connecting line 110 can further reduce the power consumption of the display panel where the array substrate is located, and better meet the requirements of customers for low power consumption.
在具体实施时,在本公开实施例中,结合图6a、图6b以及图8所示,可以使第一连接线110在衬底基板10的正投影覆盖电连接的第三辅助部330在衬底基板10的正投影。这样可以避免第三辅助部330占用额外的区域。In the specific implementation, in the embodiment of the present disclosure, in conjunction with FIG. 6a, FIG. 6b and FIG. 8, the orthographic projection of the first connection line 110 on the base substrate 10 can cover the third auxiliary part 330 of the electrical connection on the liner. The orthographic projection of the base substrate 10. This can prevent the third auxiliary part 330 from occupying additional area.
在具体实施时,在本公开实施例中,如图3至图5所示,第二连接线120的延伸方向与检测信号线SL的延伸方向交叉,并且,部分像素电路通过一条第二连接线120与一条检测信号线SL电连接的。示例性地,图3中是以一条检测信号线SL位于像素电路G和像素电路W之间,像素电路G和像素电路W可以分别与检测信号线SL电连接,而像素电路R和像素电路B无法直接与检测信号线SL电连接,这就需要设置与检测信号线SL电连接的第二连接线120,使像素电路R和像素电路B通过第二连接线120与检测信号线SL电连接。In specific implementation, in the embodiment of the present disclosure, as shown in FIGS. 3 to 5, the extension direction of the second connection line 120 crosses the extension direction of the detection signal line SL, and part of the pixel circuit passes through a second connection line. 120 is electrically connected to a detection signal line SL. Exemplarily, in FIG. 3, a detection signal line SL is located between the pixel circuit G and the pixel circuit W, the pixel circuit G and the pixel circuit W may be electrically connected to the detection signal line SL, and the pixel circuit R and the pixel circuit B It cannot be directly electrically connected to the detection signal line SL, which requires a second connection line 120 electrically connected to the detection signal line SL, so that the pixel circuit R and the pixel circuit B are electrically connected to the detection signal line SL through the second connection line 120.
示例性地,可以使第二连接线120设置为单层走线结构。或者,也可以使第二连接线120具有相互电连接的多层走线结构,以降低第二连接线120的电阻。例如,结合图7a、图7b以及图8所示,栅导电层30还包括多个第四辅助部340,且第四辅助部340与扫描线绝缘设置;其中,一条第二连接线120通过多个第四过孔04与至少一个第四辅助部340电连接,第四过孔04贯穿第三绝缘层230。并且,相互电连接的第二连接线120和第四辅助部340形成第二连接线120的多层走线结构。也可以说,相互电连接的第二连接线120和第四辅助部340形成了双层走线结构。这相当于使每一第二连接线120由 位于两个不同导电层、层叠设置且相互导通的信号线构成。即相当于第二连接线120由两条信号线和信号线并联构成,第二连接线120的两条信号线和信号线并联后的等效电阻小于其中任一条信号线的电阻,因此可以有效降低第二连接线120的电阻,从而可以更进一步降低阵列基板所在的显示面板的功耗,更很好的满足了客户低功耗的要求。Exemplarily, the second connection line 120 may be configured as a single-layer wiring structure. Alternatively, the second connecting line 120 may also have a multilayer wiring structure electrically connected to each other to reduce the resistance of the second connecting line 120. For example, as shown in FIG. 7a, FIG. 7b, and FIG. 8, the gate conductive layer 30 further includes a plurality of fourth auxiliary portions 340, and the fourth auxiliary portion 340 is insulated from the scan line; wherein, one second connecting line 120 passes through the multiple The fourth via 04 is electrically connected to at least one fourth auxiliary portion 340, and the fourth via 04 penetrates the third insulating layer 230. In addition, the second connecting line 120 and the fourth auxiliary part 340 electrically connected to each other form a multilayer wiring structure of the second connecting line 120. It can also be said that the second connection line 120 and the fourth auxiliary part 340 that are electrically connected to each other form a double-layer wiring structure. This is equivalent to making each second connection line 120 be composed of two different conductive layers, stacked and mutually connected signal lines. That is to say, the second connecting line 120 is composed of two signal lines and signal lines in parallel. The equivalent resistance of the two signal lines and signal lines of the second connecting line 120 in parallel is less than the resistance of any signal line, so it can be effective Reducing the resistance of the second connecting wire 120 can further reduce the power consumption of the display panel where the array substrate is located, and better meet the customer's requirements for low power consumption.
在具体实施时,在本公开实施例中,结合图7a、图7b以及图8所示,可以使第二连接线120在衬底基板10的正投影覆盖电连接的第四辅助部340在衬底基板10的正投影。这样可以避免第四辅助部340占用额外的区域。In specific implementation, in the embodiment of the present disclosure, in conjunction with FIG. 7a, FIG. 7b, and FIG. 8, the orthographic projection of the second connection line 120 on the base substrate 10 can cover the fourth auxiliary part 340 of the electrical connection on the backing The orthographic projection of the base substrate 10. This can prevent the fourth auxiliary part 340 from occupying an extra area.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,为了使该阵列基板所在的显示面板的功耗尽可能的降到最低,如图8所示,每一电源信号线Vdd、每一检测信号线SL、每一第一连接线110以及每一第二连接线120均可以具有多层走线结构。例如,每一电源信号线Vdd、每一检测信号线SL、每一第一连接线110以及每一第二连接线120均可以具有上述双层走线结构。由于电源信号线Vdd、第一连接线110、检测信号线SL和第二连接线120为阵列基板中比较重要的信号线,如果该四条信号线的电阻较大,则会增加显示面板的功耗,因此本公开实施例通过降低这四条信号线的电阻,从而尽可能的使显示面板的功耗降到最低。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, in order to minimize the power consumption of the display panel on which the array substrate is located, as shown in FIG. 8, each power signal line Vdd, each detection signal line SL, each first connection line 110, and each second connection line 120 may have a multilayer wiring structure. For example, each power signal line Vdd, each detection signal line SL, each first connection line 110, and each second connection line 120 may have the above-mentioned double-layer wiring structure. Since the power signal line Vdd, the first connection line 110, the detection signal line SL, and the second connection line 120 are relatively important signal lines in the array substrate, if the resistance of the four signal lines is large, the power consumption of the display panel will increase. Therefore, the embodiments of the present disclosure reduce the resistance of the four signal lines, so as to minimize the power consumption of the display panel as much as possible.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,也可以使第一辅助层位于遮光金属层,在此不作限定。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, the first auxiliary layer may also be located on the light-shielding metal layer, which is not limited herein.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,也可以使第二辅助层位于遮光金属层,在此不作限定。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, the second auxiliary layer may also be located on the light-shielding metal layer, which is not limited herein.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,也可以使第三辅助层位于源漏导电层40,在此不作限定。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, the third auxiliary layer may also be located in the source-drain conductive layer 40, which is not limited herein.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,也可以使第四辅助层位于源漏导电层40,在此不作限定。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, the fourth auxiliary layer may also be located in the source-drain conductive layer 40, which is not limited herein.
需要说明的是,遮光金属层、栅导电层30以及源漏导电层40的材料可以为金属材料。例如,金、银、铜、铝、钼等。在实际应用中,可以根据实 际应用的需求进行设计确定,在此不作限定。It should be noted that the materials of the light-shielding metal layer, the gate conductive layer 30 and the source-drain conductive layer 40 may be metal materials. For example, gold, silver, copper, aluminum, molybdenum, etc. In actual applications, it can be designed and determined according to actual application requirements, which is not limited here.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,位于两个不同导电层且层叠设置的信号线之间具有绝缘层;层叠设置的信号线之间通过贯穿绝缘层的呈阵列排布的多个过孔电连接。具体地,如图3与图4所示,第一连接线110可以通过多个第五过孔05与电源信号线Vdd电连接。第二连接线120可以通过多个第六过孔06与检测信号线SL电连接。其中,第五过孔05和第六过孔06分别贯穿第一绝缘层210、第二绝缘层220以及第三绝缘层230。并且,第一过孔01和第二过孔02分别贯穿第三绝缘层230。第三过孔03和第四过孔04分别贯穿第一绝缘层210和第二绝缘层220。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, there is an insulating layer between two different conductive layers and stacked signal lines; the stacked signal lines pass through the insulating layer. A plurality of vias arranged in an array are electrically connected. Specifically, as shown in FIGS. 3 and 4, the first connection line 110 may be electrically connected to the power signal line Vdd through a plurality of fifth via holes 05. The second connection line 120 may be electrically connected to the detection signal line SL through a plurality of sixth via holes 06. The fifth via 05 and the sixth via 06 penetrate the first insulating layer 210, the second insulating layer 220, and the third insulating layer 230, respectively. In addition, the first via 01 and the second via 02 respectively penetrate the third insulating layer 230. The third via 03 and the fourth via 04 penetrate the first insulating layer 210 and the second insulating layer 220, respectively.
具体地,如图3至图8所示,由于阵列基板上包括交叉设置的扫描线GA和数据线DA,上述信号线中位于栅导电层30的各信号线与扫描线之间绝缘设置,在具体制作工艺中,可以通过构图工艺使需要绝缘的信号线之间以及需要绝缘的信号线与扫描线之间隔开,上述信号线中位于源漏导电层40的各信号线与数据线之间绝缘设置,在具体制作工艺中,可以通过构图工艺使需要绝缘的信号线之间以及需要绝缘的信号线与数据线之间隔开,该构图工艺属于本领域技术人员公知的技术,在此不做详述。Specifically, as shown in FIGS. 3 to 8, since the array substrate includes scan lines GA and data lines DA that are arranged crosswise, among the above signal lines, each of the signal lines located in the gate conductive layer 30 is insulated from the scan lines. In the specific manufacturing process, the signal lines that need to be insulated and the signal lines that need to be insulated and the scanning lines can be spaced apart by the patterning process. In the above-mentioned signal lines, the signal lines in the source and drain conductive layer 40 are insulated from the data lines. In the specific manufacturing process, the patterning process can be used to separate the signal lines that need to be insulated and between the signal lines and the data lines that need to be insulated. The patterning process belongs to a technology well-known to those skilled in the art and will not be detailed here. Narrated.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,如图3至图8所示,电源信号线Vdd和检测信号线SL的延伸方向相同,并且电源信号线Vdd和检测信号线SL的延伸方向均与数据线DA的延伸方向相同。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, as shown in FIGS. 3 to 8, the extension directions of the power signal line Vdd and the detection signal line SL are the same, and the power signal line Vdd and the detection signal line SL extend in the same direction. The extending direction of the signal line SL is the same as the extending direction of the data line DA.
进一步地,在具体实施时,在本公开实施例提供的上述阵列基板中,如图3至图8所示,电源信号线Vdd和检测信号线SL位于不同的相邻两列像素电路之间。这样可以防止电源信号线Vdd和检测信号线SL之间发生信号串扰的问题。Further, in specific implementation, in the above-mentioned array substrate provided by the embodiment of the present disclosure, as shown in FIGS. 3 to 8, the power signal line Vdd and the detection signal line SL are located between different adjacent columns of pixel circuits. This can prevent signal crosstalk between the power signal line Vdd and the detection signal line SL.
基于同一发明构思,本公开实施例还提供了一种显示面板,包括本公开实施例提供的上述任一种阵列基板。该显示面板解决问题的原理与前述阵列基板相似,因此该显示面板的实施可以参见前述阵列基板的实施,重复之处在此不再赘述。Based on the same inventive concept, embodiments of the present disclosure also provide a display panel, including any of the aforementioned array substrates provided by the embodiments of the present disclosure. The problem-solving principle of the display panel is similar to that of the aforementioned array substrate. Therefore, the implementation of the display panel can refer to the implementation of the aforementioned array substrate, and the repetitive parts will not be repeated here.
基于同一发明构思,本公开实施例还提供了一种显示装置,包括本公开实施例提供的上述显示面板。该显示装置解决问题的原理与前述阵列基板相似,因此该显示装置的实施可以参见前述阵列基板的实施,重复之处在此不再赘述。该显示装置也可以为平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的,在此不做赘述,也不应作为对本公开的限制。Based on the same inventive concept, an embodiment of the present disclosure also provides a display device, including the above-mentioned display panel provided by the embodiment of the present disclosure. The principle of solving the problems of the display device is similar to that of the aforementioned array substrate. Therefore, the implementation of the display device can refer to the implementation of the aforementioned array substrate, and the repetitive points will not be repeated here. The display device can also be any product or component with a display function, such as a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc. The other indispensable components of the display device are understood by those of ordinary skill in the art, and will not be repeated here, nor should they be used as a limitation to the present disclosure.
本公开实施例提供的阵列基板、显示面板及显示装置,通过使信号线设置为相互电连接的多层走线结构,相当于使信号线可以至少由两条信号线并联构成,可以使设置成多层走线结构的信号线的电阻降低,从而可以降低阵列基板所在的显示面板的功耗,很好的满足了客户低功耗的要求。并且,本公开实施例,还可以缩减信号线的布线空间,又可以避免由增加信号线的厚度而导致光刻胶残留,造成显示不良的问题。In the array substrate, display panel and display device provided by the embodiments of the present disclosure, the signal lines are arranged in a multilayer wiring structure electrically connected to each other, which is equivalent to making the signal lines consist of at least two signal lines in parallel, which can be arranged as The resistance of the signal line of the multilayer wiring structure is reduced, thereby reducing the power consumption of the display panel where the array substrate is located, which satisfies the customer's low power requirements. In addition, the embodiments of the present disclosure can also reduce the wiring space of the signal line, and can avoid the problem of photoresist residue caused by the increase of the thickness of the signal line, which causes poor display.
显然,本领域的技术人员可以对本公开进行各种改动和变型而不脱离本公开的精神和范围。这样,倘若本公开的这些修改和变型属于本公开权利要求及其等同技术的范围之内,则本公开也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the present disclosure without departing from the spirit and scope of the present disclosure. In this way, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure is also intended to include these modifications and variations.

Claims (17)

  1. 一种阵列基板,其中,包括:An array substrate, which includes:
    衬底基板;Base substrate
    多个子像素,阵列排布于所述衬底基板上,且所述多个子像素中的至少一个包括:像素电路;A plurality of sub-pixels are arranged in an array on the base substrate, and at least one of the plurality of sub-pixels includes: a pixel circuit;
    多条扫描线,一行所述子像素中的像素电路与至少一条所述扫描线电连接,以及所述扫描线沿所述子像素的行方向延伸且沿所述子像素的列方向排列;A plurality of scan lines, the pixel circuits in a row of the sub-pixels are electrically connected to at least one of the scan lines, and the scan lines extend along the row direction of the sub-pixels and are arranged along the column direction of the sub-pixels;
    多条传输信号线,与所述像素电路电连接,且所述多条传输信号线沿所述列方向延伸且沿所述行方向排列;A plurality of transmission signal lines are electrically connected to the pixel circuit, and the plurality of transmission signal lines extend in the column direction and are arranged in the row direction;
    其中,所述多条传输信号线中的至少一条传输信号线具有相互电连接的多层走线结构。Wherein, at least one of the plurality of transmission signal lines has a multilayer wiring structure electrically connected to each other.
  2. 如权利要求1所述的阵列基板,其中,所述阵列基板还包括:5. The array substrate of claim 1, wherein the array substrate further comprises:
    多条电源信号线,所述电源信号线位于相邻两个子像素列之间的间隙中,且所述电源信号线与所述像素电路电连接;A plurality of power signal lines, the power signal lines are located in a gap between two adjacent sub-pixel columns, and the power signal lines are electrically connected to the pixel circuit;
    多条检测信号线,所述检测信号线位于相邻两个子像素列之间的间隙中,且所述检测信号线与所述电源信号线绝缘设置,所述检测信号线与所述像素电路电连接;A plurality of detection signal lines, the detection signal line is located in the gap between two adjacent sub-pixel columns, and the detection signal line is insulated from the power signal line, and the detection signal line is electrically connected to the pixel circuit connection;
    所述传输信号线包括:所述多条检测信号线以及所述多条电源信号线中的至少一条。The transmission signal line includes: at least one of the plurality of detection signal lines and the plurality of power signal lines.
  3. 如权利要求2所述的阵列基板,其中,所述阵列基板还包括多条第一连接线和多条第二连接线;所述第一连接线和所述第二连接线绝缘设置;其中,所述第一连接线的延伸方向与所述电源信号线的延伸方向交叉,所述第二连接线的延伸方向与所述检测信号线的延伸方向交叉;3. The array substrate according to claim 2, wherein the array substrate further comprises a plurality of first connection lines and a plurality of second connection lines; the first connection lines and the second connection lines are insulated; wherein, The extension direction of the first connection line crosses the extension direction of the power signal line, and the extension direction of the second connection line crosses the extension direction of the detection signal line;
    部分所述像素电路通过一条所述第一连接线与一条所述电源信号线电连接,部分所述像素电路通过一条所述第二连接线与一条所述检测信号线电连 接的;Some of the pixel circuits are electrically connected to one of the power signal lines through a first connection line, and some of the pixel circuits are electrically connected to one of the detection signal lines through a second connection line;
    所述多条第一连接线和所述多条第二连接线中的至少一条具有相互电连接的多层走线结构。At least one of the plurality of first connecting lines and the plurality of second connecting lines has a multilayer wiring structure electrically connected to each other.
  4. 如权利要求2或3所述的阵列基板,其中,所述阵列基板还包括:5. The array substrate of claim 2 or 3, wherein the array substrate further comprises:
    遮光金属层,位于所述衬底基板上;The light-shielding metal layer is located on the base substrate;
    第一绝缘层,位于所述遮光金属层背离所述衬底基板一侧;The first insulating layer is located on the side of the light-shielding metal layer away from the base substrate;
    半导体层,位于所述第一绝缘层背离所述衬底基板一侧;A semiconductor layer located on the side of the first insulating layer away from the base substrate;
    第二绝缘层,位于所述半导体层背离所述衬底基板一侧;A second insulating layer located on the side of the semiconductor layer away from the base substrate;
    栅导电层,位于所述第二绝缘层背离所述衬底基板一侧,且所述栅导电层包括所述多条扫描线;A gate conductive layer located on a side of the second insulating layer away from the base substrate, and the gate conductive layer includes the plurality of scan lines;
    第三绝缘层,位于所述栅导电层背离所述衬底基板一侧;A third insulating layer located on the side of the gate conductive layer away from the base substrate;
    源漏导电层,位于所述第三绝缘层背离所述衬底基板一侧,且所述源漏导电层包括所述多条电源信号线和所述多条检测信号线;The source-drain conductive layer is located on the side of the third insulating layer away from the base substrate, and the source-drain conductive layer includes the plurality of power signal lines and the plurality of detection signal lines;
    所述多层走线结构包括所述遮光导电层、所述栅导电层和所述源漏导电层中的至少任意两层;且同一所述多层走线结构通过贯穿位于所述多层走线结构之间的绝缘层的多个过孔电连接。The multilayer wiring structure includes at least any two layers of the light-shielding conductive layer, the gate conductive layer, and the source-drain conductive layer; and the same multilayer wiring structure passes through the multilayer wiring structure. The multiple via holes of the insulating layer between the wire structures are electrically connected.
  5. 如权利要求4所述的阵列基板,其中,所述栅导电层还包括多个第一辅助部,且所述第一辅助部与所述扫描线绝缘设置;其中,一条所述电源信号线通过多个第一过孔与至少一个所述第一辅助部电连接,所述第一过孔贯穿所述第三绝缘层;The array substrate of claim 4, wherein the gate conductive layer further comprises a plurality of first auxiliary parts, and the first auxiliary parts are insulated from the scan line; wherein one of the power signal lines passes through A plurality of first via holes are electrically connected to at least one of the first auxiliary portions, and the first via holes penetrate the third insulating layer;
    相互电连接的所述电源信号线和所述第一辅助部形成所述电源信号线的多层走线结构。The power signal line and the first auxiliary part that are electrically connected to each other form a multilayer wiring structure of the power signal line.
  6. 如权利要求5所述的阵列基板,其中,所述电源信号线在所述衬底基板的正投影覆盖电连接的第一辅助部在所述衬底基板的正投影。5. The array substrate of claim 5, wherein the orthographic projection of the power signal line on the base substrate covers the orthographic projection of the first auxiliary portion of the electrical connection on the base substrate.
  7. 如权利要求6所述的阵列基板,其中,所述电源信号线在所述衬底基板的正投影的边缘与电连接的第一辅助部在所述衬底基板的正投影的边缘具有间隙,且所述电源信号线在垂直于所述电源信号线的延伸方向上的截面呈 “几”字形。7. The array substrate according to claim 6, wherein the power signal line has a gap at the edge of the orthographic projection of the base substrate and the first auxiliary part electrically connected to the edge of the orthographic projection of the base substrate, And the cross section of the power signal line perpendicular to the extension direction of the power signal line is in the shape of a "several".
  8. 如权利要求4-7任一项所述的阵列基板,其中,所述栅导电层还包括多个第二辅助部,且所述第二辅助部与所述扫描线绝缘设置;其中,一条所述检测信号线通过多个第二过孔与至少一个所述第二辅助部电连接,所述第二过孔贯穿所述第三绝缘层;7. The array substrate according to any one of claims 4-7, wherein the gate conductive layer further comprises a plurality of second auxiliary parts, and the second auxiliary parts are insulated from the scan line; The detection signal line is electrically connected to at least one of the second auxiliary parts through a plurality of second via holes, and the second via hole penetrates the third insulating layer;
    相互电连接的所述检测信号线和所述第二辅助部形成所述检测信号线的多层走线结构。The detection signal line and the second auxiliary part electrically connected to each other form a multilayer wiring structure of the detection signal line.
  9. 如权利要求8所述的阵列基板,其中,所述检测信号线在所述衬底基板的正投影覆盖电连接的第二辅助部在所述衬底基板的正投影。8. The array substrate according to claim 8, wherein the orthographic projection of the detection signal line on the base substrate covers the orthographic projection of the second auxiliary part of the electrical connection on the base substrate.
  10. 如权利要求9所述的阵列基板,其中,所述检测信号线在所述衬底基板的正投影的边缘与电连接的第二辅助部在所述衬底基板的正投影的边缘具有间隙,且所述检测信号线在垂直于所述检测信号线的延伸方向上的截面呈“几”字形。9. The array substrate according to claim 9, wherein the detection signal line has a gap at the edge of the orthographic projection of the base substrate and the second auxiliary part electrically connected to the edge of the orthographic projection of the base substrate, In addition, the cross section of the detection signal line perpendicular to the extension direction of the detection signal line is in the shape of a "several".
  11. 如权利要求4-10任一项所述的阵列基板,其中,所述栅导电层还包括多个第三辅助部,且所述第三辅助部与所述扫描线绝缘设置;其中,一条所述第一连接线通过多个第三过孔与至少一个所述第三辅助部电连接,所述第三过孔贯穿所述第三绝缘层;7. The array substrate according to any one of claims 4-10, wherein the gate conductive layer further comprises a plurality of third auxiliary parts, and the third auxiliary parts are insulated from the scan line; The first connection line is electrically connected to at least one of the third auxiliary parts through a plurality of third via holes, and the third via hole penetrates the third insulating layer;
    相互电连接的所述第一连接线和所述第三辅助部形成所述第一连接线的多层走线结构。The first connection line and the third auxiliary part electrically connected to each other form a multilayer wiring structure of the first connection line.
  12. 如权利要求11所述的阵列基板,其中,所述第一连接线在所述衬底基板的正投影覆盖电连接的第三辅助部在所述衬底基板的正投影。11. The array substrate according to claim 11, wherein the orthographic projection of the first connection line on the base substrate covers the orthographic projection of the third auxiliary part of the electrical connection on the base substrate.
  13. 如权利要求4-12任一项所述的阵列基板,其中,所述栅导电层还包括多个第四辅助部,且所述第四辅助部与所述扫描线绝缘设置;其中,一条所述第二连接线通过多个第四过孔与至少一个所述第四辅助部电连接,所述第四过孔贯穿所述第三绝缘层;The array substrate according to any one of claims 4-12, wherein the gate conductive layer further comprises a plurality of fourth auxiliary parts, and the fourth auxiliary parts are insulated from the scan line; The second connection line is electrically connected to at least one of the fourth auxiliary parts through a plurality of fourth via holes, and the fourth via hole penetrates the third insulating layer;
    相互电连接的所述第二连接线和所述第四辅助部形成所述第二连接线的多层走线结构。The second connecting line and the fourth auxiliary part electrically connected to each other form a multilayer wiring structure of the second connecting line.
  14. 如权利要求13所述的阵列基板,其中,所述第二连接线在所述衬底基板的正投影覆盖电连接的第四辅助部在所述衬底基板的正投影。13. The array substrate of claim 13, wherein the orthographic projection of the second connecting line on the base substrate covers the orthographic projection of the fourth auxiliary part of the electrical connection on the base substrate.
  15. 如权利要求2-14任一项所述的阵列基板,其中,所述电源信号线和所述检测信号线位于的相邻两个子像素列之间的间隙不同。14. The array substrate according to any one of claims 2-14, wherein the gap between two adjacent sub-pixel columns where the power signal line and the detection signal line are located is different.
  16. 一种显示面板,其中,包括如权利要求1-15任一项所述的阵列基板。A display panel, which comprises the array substrate according to any one of claims 1-15.
  17. 一种显示装置,其中,包括如权利要求16所述的显示面板。A display device comprising the display panel according to claim 16.
PCT/CN2020/084544 2019-05-05 2020-04-13 Array substrate, display panel and display device WO2020224389A1 (en)

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