WO2020219060A1

WO2020219060A1 - Electronic device housings with metal foam structures

Info

Publication number: WO2020219060A1
Application number: PCT/US2019/029247
Authority: WO
Inventors: Chalam Kashyap; Kuan-Ting Wu; Hung Sung Pan
Original assignee: Hewlett-Packard Development Company, L.P.
Priority date: 2019-04-26
Filing date: 2019-04-26
Publication date: 2020-10-29
Also published as: TW202041121A

Abstract

In one example, an electronic device may include a keyboard and a base housing to house the keyboard. The base housing may include a metal substrate, a non-metal layer, and a metal foam layer disposed between the metal substrate and the non-metal layer.

Description

ELECTRONIC DEVICE HOUSINGS WITH METAL FOAM STRUCTURES

BACKGROUND

[0001] In recent years, metal housings with lightweight and high rigidity properties have become popular since the portable electronic products are developed to be lighter and smaller. In such requirements, foe technology of composite material that combines metal housings with plastic members or carbon fiber members has become a focus in the industry. Composite materials may refer to materials made from two or more constituent materials with different physical properties.

BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Examples are described in the following detailed description and in reference to the drawings, in which;

[0003] FIG. 1 A is an exploded view of an example electronic device, depicting an example base housing including a metal foam layer;

[0004] FIG. 1 B is an exploded view of the example electronic device of FIG. 1 A, depicting additional features;

[0005] FIG. 2 is an exploded view of an example electronic device, depicting a keyboard housing including a metal foam layer;

[0006] FIG. 3 is a cross-sectional side view of an illustrative sandwich structure for the keyboard housing of FIG. 2;

[000h FIG. 4A is a schematic view of an example electronic device housing, depicting a metal foam structure disposed at a corner area of a metal substrate; [0008] FIG. 48 is a cross-sectional side view of a portion of the example electronic device housing of FIG. 4A, depicting a metal foam layer and an adhesive;

[0009] FIG. 4C is an example schematic view of the portion of the example electronic device housing of FIG. 4A, depicting the metal foam structure secured to a plastic layer at the comer area of the metal substrate; and

[0010] FIG. 4D is another example schematic view of the portion of the example electronic device housing of FIG. 4A, depicting the metal foam structure secured to a surface of the metal substrate.

DETAILED DESCRIPTION

[0011] Electronic devices, e.g., laptops, personal digital assistants, and the like, may be provided with keyboards, displays, internal electronic components, and the like. The keyboards may be mounted in base housings and the displays may be mounted in display housings that are rotatably, detachably, or twistably connected to the base housings. These housings may also protect the internal electrical components of the electronic devices. Further, the housings may include composite material such as metal-plastic composite or metal-carbon fiber composite. For example, a housing may include a plastic layer and a metal layer assembled together as a whole to achieve both good communication and mechanical strength. In this example, an outer layer of the housing may be formed by a metal layer, which may be supported by an inner plastic layer. The outer metal layer may provide a wear resistant, robust, and aesthetic appearance to the housing.

[0012] Such housings for keyboards may be formed using different materials and assembly techniques. Housings may be formed of metal and plastic bonding to save cost and to keep the devices lighter. In some electronic devices, housings may be formed of metal and plastic bonding to allow transmission/reception of wireless antenna signals. Because of the light-weight requirement of the housings, the thickness of the housings (e.g., a top cover or a bottom cover of the keyboard housing) may be reduced, which may weaken the stiffness of the housings. Also, the comer structure strength of such housings may be limited by manufacturing process. In such cases, the comers of the electronic device housings can be susceptible to damage from impacts, such as drops.

[0013] Examples described herein may provide an electronic device housing including a metal substrate (e.g., Aluminum substrate), a non-metal layer (e.g., a plastic layer), and a metal foam layer adhered between the metal substrate and the non-metal layer. The electronic device housing formed with the metal foam layer integrated therein can result in reduced weight and thickness, while enhancing the strength of the electronic device housing. Further, examples described herein may dispose metal foam structures at corners of the electronic device housing to enhance corner strength.

[0014] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present techniques. It will be apparent, however, to one skilled in the art that the present apparatus, devices, and systems may be practiced without these specific details. Reference in the specification to“an example" or similar language means that a particular feature, structure, or characteristic described is included in at least that one example, but not necessarily in other examples.

[0015] Turning now to the figures, FIG. 1A is an exploded view of an example electronic device 100, depicting an example base housing 104 including a metal foam layer 110. Example electronic device 100 may include a portable laptop (or notebook) computer, a personal digital assistant, a tablet-type computer, a convertible device, or any other electronic device having a keyboard. Example convertible device may refer to a device that can be“converted" from a laptop mode to a tablet mode. [0016] Electronic device 100 may include a keyboard 102. Example keyboard 102 may include a plurality of keys to provide input to electronic device 100. Further, electronic device 100 may include base housing 104 to house keyboard 102. As shown in FIG. 1A, base housing 104 may include a metal substrate 106. Example metal substrate 106 may include aluminum, magnesium, lithium, zinc, titanium, aluminum alloy, magnesium alloy, lithium alloy, zinc alloy, titanium alloy, or any combination thereof. Further, base housing 104 may include a non-metal layer 108. Example non-metal layer 108 may include plastic, carbon-fiber composite, or a combination thereof.

[0017] Furthermore, base housing 104 may include metal foam layer 1 10 disposed between metal substrate 106 and non-metal layer 108. In one example, metal foam layer 1 10 may include closed-cell metallic foam, such as closed-cell aluminum foam. Example characteristics of closed-cell aluminum foam may include efficient energy absorption, high stiffness-to-weight ratio, fire resistant, shock wave attenuation, sound and vibration damping and absorption, and recycling potential. In other examples, metal foam layer 1 10 may also include magnesium foam, titanium foam, or the like.

[0018] In some examples, metal foam layer 110 may be incorporated into base housing 104 during molding operations. Components such as internal electrical components on printed circuits, mechanical components such as screws, components for facilitating the formation of electrical paths such as hollow tubing, wires, and other structures may be embedded within metal foam layer 1 10 and housed within gaps between layers of base housing 104.

[0019] FIG, 1 B is an exploded view of example electronic device 100 of FIG.

1A, depicting additional features. For example, similarly named elements of FIG.

1 B may be similar in structure and/or fundion to elements described with respect to FIG. 1A. As shown in FIG. 18, base housing 104 may include a top cover 152 and a bottom cover 154. Top cover 152 may interface with bottom cover 154 to form a sealed enclosure for electronic components such as an integrated circuit, a battery, and the like. Further, keyboard 102 may be mounted on top cover 152. For example, keyboard 102 may be disposed in base housing 104 with a plurality of keys extending through apertures of top cover 152.

[0020] In the example shown in FIG. 1 B, metal foam layer 1 10 may be disposed between metal substrate 106 and non-metal layer 108 of bottom cover 154. However, examples described herein can also be implemented in top cover 152 such that top cover 152 may include a metal substrate, a non-metal layer, and a metal foam layer disposed between the metal substrate and the non-metal layer. Thus, metal foam layer 1 10 described herein can be implemented as a part of top cover 152, bottom cover 154, or a combination thereof.

[0021] In some examples, fabrication techniques such as machining, stamping, cutting, molding, injection molding, laminating, and other fabrication techniques may be used in forming base housing 104 using layers (e.g., metal foam layer 1 10, metal substrate 106, and non-metal layer 108). In this example, sandwich structures can be formed in which the layers are attached to one another to form base housing 104 (e.g., top cover 152 or bottom cover 154).

[0022] Thus, examples described herein may provide thin, stiff, and lightweight structures of the type that can be used to support flat housings. By forming sandwiches of composite materials including metal foam layer 110, thickness and weight can be minimized, stiffness can be enhanced, and internal structures such as embedded components can be accommodated.

[0023] FIG. 2 is an exploded view of an example electronic device 200, depicting a keyboard housing 206 including a metal foam layer 212. Electronic device 200 may include a display housing 202 to house a display 204. Example display 204 may be a liquid crystal display, an organic light-emitting diode display, a plasma display, an electrophoretic display, a display that is insensitive to touch, a touch sensitive display, or may be any other type of suitable display. Further, electronic device 200 may include keyboard housing 206 coupled to display housing 202. Example keyboard housing 206 may include components such as keyboard, mousepad, and the like. In one example, keyboard housing 206 may be rotatably, detachably, or twistably connected to display housing 202.

[0024] In one example, keyboard housing 206 may include a metal substrate 208 and a plastic layer 210. Further, keyboard housing 206 may include metal foam layer 212 having a first surface and a second surface opposite to the first surface. Furthermore, keyboard housing 206 may include a first adhesive layer 214 to secure the first surface of metal foam layer 212 to metal substrate 208 and a second adhesive layer 216 to secure the second surface of metal foam layer 212 to plastic layer 210. An example keyboard housing 206 with metal foam layer 212 sandwiched between metal substrate 208 and plastic layer 210 is shown in FIG. 3.

[0025] FIG. 3 is a cross-sectional side view of an illustrative sandwich structure for keyboard housing 206 of FIG. 2. For example, similarly named elements of FIG. 3 may be similar in structure and/or function to elements described with respect to FIG. 2. As shown in FIG. 3, keyboard housing 206 may include metal foam layer 212 sandwiched between metal substrate 208 and plastic layer 210 using respective one of first adhesive layer 214 and second adhesive layer 216. Example first adhesive layer 214 and second adhesive layer 216 may include pressure sensitive adhesive, liquid adhesive, or the like. In other examples, metal foam layer 212, metal substrate 208, plastic layer 210 may also be attached to one another using fasteners such as screws, engagement features (e.g., clips and springs, etc.), magnets, or other suitable attachment mechanisms.

[0026] In the example shown in FIG. 3, an outer layer of keyboard housing 206 may be formed by metal substrate 208, which can be supported by inner plastic layer 210 and intermediate metal foam layer 212. Metal substrate 208 may have a thickness in a range of about 0.3 - 1.2 mm. Plastic layer 210 may have a thickness in a range of about 0.5 - 1.0 mm. Metal foam layer 212 may have a thickness in a range of about 0.2 - 0.5 mm. Further, first adhesive layer 214 may have a thickness in a range of about 0.03 - 0.05 mm and second adhesive layer 216 may have a thickness in a range of about 0.05 - 0.1 mm. In one example, the housings having metal-plastic composite material in combination with the metal foam layer described herein can reduce thickness and weight and enhance the strength of electronic device housing compared to electronic device housings with metal-plastic composite material.

[0027] FIG. 4A is a schematic view of an example electronic device housing 400, depicting a metal foam structure 408 disposed at a corner area 410 of a metal substrate 404. For example, electronic device housing 400 may be a housing for an electronic device such as an electronic book reader, cellular telephone, personal digital assistant (PDA), portable media player, laptop computer, tablet computer, netbooks, or the like. Examples described in FIG. 4 A can be implemented as a part of display housing that houses a display, a base housing that houses a keyboard, or any other housing that houses and protects a number of internal electronic components.

[0028] Electronic device housing 400 may include a composite structure 402. In one example, composite structure 402 may include metal substrate 404 including comer area 410 defined by two adjacent side walls 414 and 416 of metal substrate 404. Example corner area 410 may have sharp or rounded comers. Further, composite structure 402 may include a plastic layer 406 disposed on metal substrate 404. In one example, metal substrate 404 may be an outer layer of electronic device housing 400 and plastic layer 406 may be an inner layer of electronic device housing 400. In one example, plastic layer 406 may cover at least a portion of an inner surface of metal substrate 404.

[0029] Further, metal substrate 404 may serve as a heat sink and ground plane for electronic device housing 400 (e.g., a display housing). Non-metal layer (e.g., plastic layer 406) in electronic device housing 400 may be formed from molded composite material and may have integral features such as recesses. The recesses may be configured to receive electrical components and other device structures. The use of composite structure 402 for electronic device housing 400 may facilitate electronic device housing 400 with stiffness, strength, and ability to provide recesses, and other features of desired shapes.

[0030] Further, electronic device housing 400 may include metal foam structure 408 disposed at comer area 410 of metal substrate 404. In one example, metal foam structure 408 may be adhered to metal substrate 404 or plastic layer 406 at an interior of electronic device housing 400 such that metal foam structure 408 may physically contact two adjacent side walls 414 and 416 at comer area 410. In other examples, four metal foam structures can be disposed at four comer areas of metal substrate 404.

[0031] FIG. 4B is a cross-sectional side view of a portion 412 of example electronic device housing 400 (e.g., along X-X as shown in FIG. 4A), depicting a metal foam layer 452 and an adhesive 454, As shown in FIG. 4B, composite structure 402 may include metal foam layer 452 disposed between metal substrate 404 and plastic layer 406. In other examples, composite structure 402 may be formed of metal substrate 404 and plastic layer 406 directly adhered to an interior surface of metal substrate 404.

[0032] Further, electronic device housing 400 may include adhesive 454 to secure metal foam structure 408 to metal substrate 404 such that metal foam structure 408 may physically contact two adjacent side walls 414 and 416 at comer area 410. Metal foam structure 408 may have a thickness less than equal to a height of side wall 414 or 416. In some examples, mechanical structures such as screws, screw bosses, other mechanical fasteners, mounting brackets, or the like can be provided within metal foam structure 408.

[0033] FIG. 4C is an example schematic view of portion 412 of example electronic device housing 400 of FIG. 4A, depicting metal foam structure 408 secured to plastic layer 406 at comer area 410 of metal substrate 404. FIG. 4D is another example schematic view of portion 412 of example electronic device housing 400 of FIG. 4A, depicting metal foam structure 408 secured to a surface of metal substrate 404. In this example, plastic layer 406 may include an open slot 456 (i.e., uncovered region) at comer area 410 such that metal foam structure 408 may be secured to the surface of metal substrate 404 through open slot 456.

[0034] In this manner, the present application discloses a metal-plastic composite housing or metal-carbon fiber composite housing, in which a metal foam layer can be adhered there between to reduce weight and thickness, and enhance the strength of the housing. Also, the present application discloses a metal-plastic composite housing or metal-carbon fiber composite housing, in which metal foam structures can be mounted at comers of the housing to enhance the comer strength.

[0035] The foregoing describes metal-plastic composite housing or metal- carbon fiber composite housing having metallic luster feeling at peripheral edge surfaces. While the above application has been shown and described with reference to the foregoing examples, it should be understood that other forms, details, and implementations may be made without departing from the spirit and scope of this application.

Claims

WHAT IS CLAIMED IS:

1. An electronic device comprising:

a keyboard; and

a base housing to house the keyboard, wherein the base housing comprises:

a metal substrate;

a non-metal layer; and

a metal foam layer disposed between the metal substrate and the non-metal layer.

2. The electronic device of claim 1 , wherein the metal substrate comprises aluminum, magnesium, lithium, zinc, titanium, aluminum alloy, magnesium alloy, lithium alloy, zinc alloy, titanium alloy, or any combination thereof.

3. The electronic device of claim 1 , wherein the non-metal layer comprises plastic, carbon-fiber composite, or a combination thereof.

4. The electronic device of claim 1 , wherein the metal foam layer comprises closed-cell aluminum foam.

5. An electronic device comprising:

a display housing to house a display; and

a keyboard housing coupled to the display housing, wherein the keyboard housing comprises:

a metal substrate;

a plastic layer;

a metal foam layer having a first surface and a second surface opposite to the first surface;

a first adhesive layer to secure the first surface of the metal foam layer to the metal substrate; and a second adhesive layer to secure the second surface of the metal foam layer to the plastic layer.

6. The electronic device of claim 5, wherein the metal substrate has a thickness in a range of 0.3 - 1.2 mm.

7. The electronic device of claim 5, wherein the plastic layer has a thickness in a range of 0.5 - 1.0 mm.

8. The electronic device of claim 5, wherein the metal foam layer has a thickness in a range of 0.2 - 0.5 mm.

9. The electronic device of claim 5, wherein the first adhesive layer has a thickness in a range of 0.03 - 0.05 mm.

10. The electronic device of claim 5, wherein the second adhesive layer has a thickness in a range of 0.05 - 0.1 mm.

11. An electronic device housing comprising:

a composite structure, wherein the composite structure comprises:

a metal substrate including a comer area defined by two adjacent side walls of the metal substrate; and

a plastic layer disposed on the metal substrate; and

a metal foam structure disposed at the corner area of the metal substrate.

12. The electronic device housing of claim 11 , further comprising:

an adhesive to secure the metal foam structure to the metal substrate such that the metal foam structure physically contacts the two adjacent side walls at the comer area.

13. The electronic device housing of claim 11 , wherein the metal foam structure is secured to the plastic layer at the comer area.

14. The electronic device housing of claim 1 1 , wherein the plastic layer comprises an open slot at the corner area such that the metal foam structure is secured to a surface of the metal substrate through the open slot.

15. The electronic device housing of claim 1 1 , wherein the composite structure further comprises:

a metal foam layer disposed between the metal substrate and the plastic layer.